Rotating device, substrate processing system, and method for manufacturing articles

Abstract

This provides a technique that is advantageous for reducing the effect of rotating the substrate on the liquid material on the substrate. [Solution] The rotating device for rotating the substrate comprises a substrate holding portion that holds the substrate, an opposing member that faces the substrate holding portion via the substrate, a first rotation mechanism for rotating the substrate holding portion, and a second rotation mechanism for rotating the opposing member.

Description

TECHNICAL FIELD

[0001] The present invention relates to a rotating apparatus, a substrate processing system, and an article manufacturing method. BACKGROUND ART

[0002] When manufacturing articles such as OLED panels having OLEDs (Organic Light Emitting Diodes), a method is known in which a solution is applied to a desired location on a substrate using an inkjet coating apparatus to dispose a solution film on the substrate. The solution film is a film composed of a solution (ink) containing a solute and a solvent. By drying the solution film disposed on the substrate, a solid functional film is formed on the substrate. A reduced-pressure drying apparatus can be used for drying the solution film.

[0003] In order to stably form a functional film from the solution film applied on the substrate, it is preferable to dry the solution film in a short time while consistently managing the respective process times, environments, and the like of the inkjet coating step, the transport step, and the drying step. In the drying step, in order to enhance productivity, a reduced-pressure drying method can be adopted in which the drying chamber is depressurized to accelerate drying. In addition, since OLEDs manufactured by stacking functional films require uniform performance of each individual film, the drying step of the solution film is required not only to reduce time but also to achieve drying with uniform film quality (film thickness, flatness). However, as a result of examining the film quality of the solution film, it has been found that not only the drying step but also drying unevenness and the like that occur in the transport process preceding the drying step have an effect. If local unevenness occurs in the dried state of the coated surface (panel) before the drying step, a functional film with uniform film quality (film thickness, flatness) cannot be obtained no matter how much contrivance is made to the processing conditions (such as the depressurization profile) of the drying step (reduced-pressure drying). That is, in order to stably form a uniform functional film from the solution film over the entire area of the panel, it is desirable to suppress local drying unevenness even in the transport process before the drying step.

[0004] Various approaches have been taken to suppress uneven drying that occurs during the transport process. Patent Document 1 addresses the issue of natural drying in an inkjet coating apparatus, where the solution film gradually dries out as it comes into contact with the outside air during transport between the coating unit and the drying unit. To solve this problem, Patent Document 1 proposes a substrate transport mechanism that suppresses natural drying by covering the solution film with a rectangular cover, thereby preventing contact with the outside air and maintaining the solvent atmosphere. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2006-159035 [Overview of the project] [Problems that the invention aims to solve]

[0006] The present invention aims to provide a technique advantageous for reducing the effect of rotating a substrate on a liquid material on the substrate. [Means for solving the problem]

[0007] One aspect of the present invention relates to a rotating device for rotating a substrate, the rotating device comprising a substrate holding portion for holding the substrate, an opposing member facing the substrate holding portion via the substrate, a first rotating mechanism for rotating the substrate holding portion, and a second rotating mechanism for rotating the opposing member. [Effects of the Invention]

[0008] According to the present invention, an advantageous technique is provided for reducing the effect of rotating a substrate on the liquid material on the substrate. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic diagram showing the configuration of a substrate processing system according to one embodiment. [Figure 2]A schematic diagram showing the configuration of a coating apparatus. [Figure 3] A schematic diagram showing the configuration of a drying apparatus. [Figure 4] A schematic perspective view showing the configuration of a rotating device according to one embodiment. [Figure 5] A schematic cross-sectional view showing the configuration of a rotating device according to one embodiment. [Figure 6] A schematic cross-sectional view showing the configuration of a modified example of a rotating device according to one embodiment. [Figure 7] A schematic cross-sectional view showing the configuration of another modified example of the rotating device of one embodiment. [Figure 8] A schematic cross-sectional view showing the configuration of yet another modified example of the rotating device of one embodiment. [Figure 9] This diagram illustrates the operation of holding a substrate in the substrate holder and the operation of retrieving the substrate from the substrate holder. [Modes for carrying out the invention]

[0010] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0011] In the following explanation, directions are indicated by the XYZ coordinate system. In the XYZ coordinate system, the direction parallel to the XY plane is the horizontal direction, and the negative direction of the Z axis can be the vertical direction (direction of gravity).

[0012] In recent years, in order to improve the productivity of displays, a manufacturing method has been considered for inkjet coating equipment used to manufacture organic EL panels in which multiple panels are formed on a single glass substrate. For example, in manufacturing equipment for liquid crystal panels, mass production is achieved by forming multiple panels on glass substrates with sides exceeding 3m. Therefore, the ability to handle large substrates is also being considered for inkjet coating equipment. In this consideration, it has been found that as the size of the substrate increases, the uneven drying caused by the rotation of the substrate becomes more pronounced in the transport process when the substrate is transported from the inkjet coating equipment to the drying equipment.

[0013] Figure 1 schematically shows the configuration of a substrate processing system SPS according to one embodiment. The substrate processing system SPS may comprise a plurality of processing units CU, TU, RU, VCD, UL, DU, LL, BU, IJU for processing substrates S, and a transport mechanism RB for transporting substrates S between the plurality of processing units CUTU, RU, VCD, UL, DU, LL, BU, IJU. In the substrate processing system SPS, the plurality of processing units CU, TU, RU, VCD, UL, DU, LL, BU, IJU may be arranged to surround the transport mechanism RB. The transport mechanism RB can hold a substrate S placed in any of the plurality of processing units CU, TU, RU, VCD, UL, DU, LL, BU, IJU with a transport hand RH and transport it to any of the plurality of processing units CU, TU, RU, VCD, UL, DU, LL, BU, IJU.

[0014] Processing device CU may be a cleaning device for cleaning the substrate S. Processing device TU may be a temperature control device for adjusting the temperature of the substrate S. Processing device RU may be a rotating device for rotating the substrate S. The rotation angle of the substrate S by the rotating device may be less than 360 degrees, but may be 360 ​​degrees or more. Processing device VCD may be a drying device, such as a vacuum drying device, for drying the liquid material (ink) applied to the substrate S to form a dry film. Processing device UL may be an unloading device for unloading the substrate S. Processing device DU may be a dehumidifying device. Processing device LL may be a loading device for loading the substrate S. Processing device BU may be a firing device for firing the dry film on the substrate S. Processing device IJU may be a coating device for applying liquid material (ink) onto the substrate S. However, each of the multiple processing devices CU, RU, VCD, UL, DU, LL, BU, IJU, and CU is not limited to the specific processing devices exemplified.

[0015] A processing apparatus IJU configured as a coating apparatus (hereinafter referred to as the coating apparatus IJU) may be equipped with a discharge head DH for discharging a liquid material L to form a solution film, as illustrated in Figure 2. In the coating apparatus IJU, the liquid material L can be coated at a target position on the substrate S by discharging the liquid material L from the discharge head DH while scanning the discharge head DH relative to the substrate S in the scanning direction DS. The substrate S may have a pattern with directionality, such as a line bank. Therefore, it is necessary to adjust the orientation of the substrate S with respect to the scanning direction DS, taking into account the directionality of this pattern. In one example, if the substrate S has a line bank, the orientation of the substrate S may be adjusted so that the direction DB of the line bank and the scanning direction DS are orthogonal.

[0016] A processing apparatus VCD configured as a drying apparatus (hereinafter referred to as drying apparatus VCD) can include, as illustrated in FIG. 3, a substrate table ST that holds a substrate S, and a flow straightening box B arranged above the substrate S held by the substrate table ST. The flow straightening box B is designed with an arrangement of a plurality of openings OP that control the airflow so that the liquid material L on the substrate S dries uniformly, on the premise that the substrate S is placed on the substrate table ST of the drying apparatus VCD such that its orientation matches a specific orientation. Therefore, the substrate S must be placed on the substrate table ST of the drying apparatus VCD such that its orientation matches the specific orientation.

[0017] A processing apparatus RU configured as a drying apparatus (hereinafter referred to as rotation apparatus RU) can be used to adjust the orientation of the substrate S to be conveyed to the coating apparatus IJU and the drying apparatus VCD. That is, the rotation apparatus RU can rotate the substrate S such that the substrate S is conveyed to the coating apparatus IJU by the conveyance mechanism RB in the orientation required by the coating apparatus IJU. More specifically, the conveyance mechanism RB can convey the substrate S to the rotation apparatus RU, and after the substrate S is rotated by the rotation apparatus RU, convey the substrate S to the coating apparatus IJU. Further, the rotation apparatus RU can rotate the substrate S such that the substrate S is conveyed to the drying apparatus VCD by the conveyance mechanism RB in the orientation required by the drying apparatus VCD (the orientation compatible with the flow straightening box B). More specifically, the conveyance mechanism RB can convey the substrate S to the rotation apparatus RU, and after the substrate S is rotated by the rotation apparatus RU, convey the substrate S to the drying apparatus VCD.

[0018] When the substrate S is rotated by a conventional rotation apparatus, the liquid material L on the substrate S is exposed to wind at a wind speed corresponding to the rotation speed and the distance from the rotation center, due to relative motion with stationary air. The wind speed is proportional to the rotation speed, and also proportional to the distance from the rotation center. In addition, the drying rate of the liquid material L is proportional to the wind speed. For example, in the case of a 2.5 m substrate, the drying rate of the liquid material L at the outer periphery of the substrate can differ by a factor of about 4.5 relative to the center of the substrate.

[0019] Figures 4 and 5 are schematic perspective and cross-sectional views showing the configuration of a rotating device RU according to one embodiment. The rotating device RU may be configured to rotate a substrate S around the Z-axis, that is, around an axis parallel to the vertical direction. The rotating device RU may include a substrate holding part 110 that holds the substrate S, an opposing member 120 that faces the substrate holding part 110 via the substrate S, a first rotation mechanism 130 that rotates the substrate holding part 110, and a second rotation mechanism 140 that rotates the opposing member 120. The opposing member 120 faces the substrate S held by the substrate holding part 110, and in this state, the first rotation mechanism 130 and the second rotation mechanism 140 can rotate the substrate holding part 110 and the opposing member 120, respectively. Such a configuration is advantageous for uniformly drying a liquid material (not shown) placed on the surface of the substrate S over the entire surface of the substrate S. This is because, with the opposing member 120 facing the substrate S held by the substrate holding portion 110, the opposing member 120 rotates together with the substrate S, causing the air between the substrate S and the opposing member 120 to rotate as well, thus reducing the relative velocity between the substrate S and the air.

[0020] The distance between the substrate S and the opposing member 120 when the substrate holder 110 rotates the substrate S can be set to 10 times or less, 9 times or less, 8 times or less, 7 times or less, 6 times or less, or 5 times or less the thickness of the substrate S. In other respects, the distance between the substrate S and the opposing member 120 when the substrate holder 110 rotates the substrate S can be set to 10 mm or less, 9 mm or less, 8 mm or less, 7 mm or less, 6 mm or less, or 5 mm or less. A small distance between the substrate S and the opposing member 120 when the substrate S is rotating is advantageous in order to bring the drying speed of the liquid material (not shown) on the surface of the substrate S closer to that when the substrate S is not rotating. The eccentricity of the rotation axis of the opposing member 120 with respect to the rotation axis of the substrate holder 110 can be 1 / 10 or less, 1 / 20 or less, 1 / 30 or less, 1 / 40 or less, or 1 / 50 or less of the maximum dimension of the substrate S.

[0021] The rotating device RU may further include an adjustment mechanism 150 for adjusting the distance between the substrate holder 110 and the opposing member 120. The adjustment mechanism 150 can increase the distance between the substrate holder 110 and the opposing member 120 when the transport mechanism RB transfers the substrate S to the substrate holder 110 of the rotating device RU, and when the transport mechanism RB receives the substrate S from the substrate holder 110 of the rotating device RU. The adjustment mechanism 150 can also decrease the distance between the substrate holder 110 and the opposing member 120 before rotating the substrate S. The rotating device RU may also include a control unit CNT that synchronizes the rotational drive of the substrate holder 110 by the first rotation mechanism 130 and the rotational drive of the opposing member 120 by the second rotation mechanism 140. The control unit CNT may control the adjustment mechanism 150 so that the distance between the substrate holder 110 and the opposing member 120 is adjusted.

[0022] The substrate holder 110 may include a support portion 111 that supports the back surface of the substrate S and a peripheral portion 112 that surrounds the periphery of the substrate S. The peripheral portion 112 is advantageous for maintaining a high partial pressure of the solvent in the space between the substrate holder 110 and the opposing member 120 when the substrate S is rotated, thereby suppressing drying of the liquid material. The peripheral portion 112 may also function to suppress the formation of turbulent airflow between the substrate holder 110 and the opposing member 120. Instead of providing the peripheral portion 112 on the substrate holder 110, the peripheral portion 122 may be provided on the opposing member 120, as schematically shown in Figure 6. The peripheral portion 122 may also be positioned so as to surround the sides of the substrate S when the substrate holder 110 is rotated. The peripheral portion 122 is advantageous for maintaining a high partial pressure of the solvent in the space between the substrate holder 110 and the opposing member 120 when the substrate S is rotated, thereby suppressing drying of the liquid material. The substrate holding portion 110 and the opposing member 120 preferably have cylindrical side surfaces. Such a shape is advantageous in suppressing the formation of turbulence around the substrate holding portion 110 and the opposing member 120, thereby suppressing the formation of air turbulence between the substrate holding portion 110 and the opposing member 120. The difference between the diameter of the substrate holding portion 110 and the diameter of the opposing member 120 may be 1 / 10 or less, 1 / 20 or less, 1 / 30 or less, 1 / 40 or less, or 1 / 50 or less of the diameter of the substrate holding portion 110.

[0023] As illustrated in Figures 5, 6, and 7, the opposing member 120 may have a through hole 121. The through hole 121 may function to expel the air in the space between the substrate S and the opposing member 120 into the space above the opposing member 120 when the substrate S is held by the substrate holding portion 110 and the opposing member 120 is brought closer to the substrate S. As illustrated in Figure 8, the opposing member 120 may have grooves 124 on the surface facing the substrate holding portion 110. The grooves 124 may be arranged radially, for example. The grooves 124 may function to expel the air in the space between the substrate S and the opposing member 120 into the space to the side of the opposing member 120 when the substrate S is held by the substrate holding portion 110 and the opposing member 120 is brought closer to the substrate S. The opposing member 120 may be provided with both a through hole 121 and grooves 124.

[0024] As illustrated in Figure 7, the opposing member 120 may have a porous body 123 on the surface facing the substrate holding portion 110. In one example, the porous body 123 may be supplied with a liquid similar to the solvent contained in the liquid material applied to the substrate S by the coating apparatus IJU. The liquid supplied to the porous body 123 functions to suppress the evaporation of the solvent from the liquid material on the substrate S when the opposing member 120 is positioned to face the substrate S, which can contribute to the uniform drying of the liquid material on the substrate S.

[0025] The following describes, with reference to Figure 9, the operation of holding the substrate S in the substrate holding part 110 and the operation of retrieving the substrate S from the substrate holding part 110 in an illustrative manner. The substrate holding part 110 may be provided with through holes 113 through which a plurality of support pins 162 of the support mechanism 160 that supports the substrate S pass.

[0026] When the substrate holding portion 110 holds the substrate S, the support mechanism 160 may operate such that the height of the tips of the multiple support pins 162 is higher than the height of the substrate holding surface (surface of the support portion 111) of the substrate holding portion 110, as schematically shown in Figure 9(a). Alternatively, instead of this operation, the substrate holding portion 110 may be lowered. In the state shown in Figure 9(a), the transport mechanism RB may place the substrate S held by the transport hand RH on the multiple support pins 162.

[0027] Next, as schematically shown in Figure 9(b), the support mechanism 160 may operate so that the height of the tips of the multiple support pins 162 becomes lower than the height of the substrate holding surface of the substrate holding portion 110 (the surface of the support portion 111). Alternatively, instead of this operation, the substrate holding portion 110 may rise.

[0028] Next, as schematically shown in Figure 9(c), the adjustment mechanism 150 can lower the opposing member 120 so that it is closer to the substrate S (substrate holding part 110). Subsequently, the first rotation mechanism 130 and the second rotation mechanism 140 can rotate the substrate holding part 110 and the opposing member 120, respectively. As a result, the substrate S rotates.

[0029] The subsequent operation of retrieving the substrate S from the substrate holding part 110 is the reverse of the above. First, as schematically shown in Figure 9(b), the adjustment mechanism 150 can raise the opposing member 120 so as to move the opposing member 120 away from the substrate S (substrate holding part 110).

[0030] Next, as schematically shown in Figure 9(a), the support mechanism 160 can operate so that the height of the tips of the multiple support pins 162 becomes higher than the height of the substrate holding surface (the surface of the support part 111) of the substrate holding part 110. Alternatively, instead of this operation, the substrate holding part 110 may be lowered. Furthermore, the transport mechanism RB can receive the substrate S supported by the multiple support pins 162 with the transport hand RH and retrieve the substrate S from the substrate holding part 110.

[0031] The following describes a method for manufacturing articles from a substrate S by processing the substrate S with a substrate processing system SPS. The article manufacturing method may include a first processing step in which the substrate S is processed by a first processing device among a plurality of processing devices, and a first transport step in which the substrate S that has undergone the first processing step is transported from the first processing device to a rotating device RU by a transport mechanism RB. The article processing device may also include a rotation step in which the substrate S transported to the rotating device RU is rotated by the rotating device RU. The article manufacturing method may also include a second transport step in which the substrate S that has undergone the rotation step is transported from the rotating device RU to a second processing device among a plurality of processing devices by a transport mechanism RB, and a second processing step in which the substrate S is processed by the second processing device. In the first processing step, a liquid material may be applied to the substrate S by a coating device IJU, which is the first processing device. In the second processing step, the substrate S to which the liquid material was applied in the first processing step may be dried by a drying device VCD, which is the second processing device. In the rotation process, the substrate S may be rotated so that in the subsequent second transport process, the substrate S is transported to the drying apparatus VCD in an orientation that conforms to the rectifier box B.

[0032] The substrate processing system (SPS) can perform processes for manufacturing OLED panels. An organic EL panel includes multiple pixels, each pixel containing an OLED. An OLED has a structure in which multiple functional films are stacked. These multiple functional films may include, for example, a hole injection layer, a hole transport layer, an emissive layer, an electron transport layer, and an electron injection layer.

[0033] Liquid materials (inks) used to form functional films for OLEDs may contain multiple components, including low molecular weight, high molecular weight, ionic substances, substances poorly soluble in solvents, chelating compounds, inorganic compounds, organic solvents, and water. These multiple components of the liquid material can be classified into solutes (functional materials) that realize the functionality of the OLED and solvent components that improve coating and drying quality. Each of the solute and solvent components is not limited to a single material, but may consist of multiple materials. Examples of solvents include cyclohexanol, cyclohexanone, ethylene glycol, ethylene glycol diglycidyl ether, 1,3-octylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tripylene glycol, 1,3-butanediol, 2,3-butanediol, 1,4-butanediol, propylene glycol, hexylene glycol, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diacetone alcohol, γ-butyrolactone, ethyl lactate, n-hexyl acetate, ethyl cellosolve acetate, and diethylene glycol monomethyl ether.

[0034] The solvent is selected based on factors such as its compatibility with the ejection head (viscosity, surface tension), drying characteristics (drying speed, uniformity), and film quality after drying (film quality, film thickness, film shape), and this, including the mixing ratio, can be reflected in the ink formulation design.

[0035] Here, we will explain each step in the manufacturing process of an OLED panel. A pre-process may be performed before the coating process, in which a liquid material (ink) is applied to the substrate. The pre-process may be a process to remove moisture and foreign matter from the substrate. A post-process is performed after the coating process, in which the liquid material is applied to the substrate. The post-process may include a drying process, in which the solvent is evaporated from the liquid material applied to the substrate to form a solid film, and a firing process, in which heating promotes crosslinking between molecules to stabilize the film quality.

[0036] The substrate processing system PSP may include multiple processing units for carrying out pre-processing and post-processing. Processing units for pre-processing may include, for example, a dehumidifier DU that removes excess moisture by heating the substrate S, a cleaning unit CU that removes foreign matter on the substrate by ultraviolet irradiation or ozone cleaning, and a temperature control unit TU that adjusts the temperature of the substrate S before coating. Processing units for post-processing may include, for example, a vacuum dryer VCD that removes solvent components of liquid materials in a short time under reduced pressure, and a firing unit BU that promotes crosslinking of solute components (functional polymers) by heating and stabilizes the film.

[0037] For the manufacture of OLED panels, substrates such as alkali-free glass or silicon substrates can be used. The surface of the substrate may be designed to improve the coating quality of the liquid material (ink). If the liquid material leaks outside the desired area (pixel area) on the substrate, it can cause defects such as insufficient film thickness or short circuits with adjacent pixels. Therefore, for example, a fine, bank-like partition structure (bank) can be formed on the substrate to surround the pixel area, and the liquid material can be coated within the area enclosed by the bank. The bank can be made of a highly liquid-repellent material (e.g., a fluorine-containing resin) and formed on the substrate through a photolithography process. Bank patterns can be classified into, for example, pixel banks, where a bank is provided for each pixel, and line banks, which surround pixels in a row or column direction on the substrate. In pixel banks, each pixel area is independent, and there is no exchange of liquid material (ink) between pixels. On the other hand, in line banks, liquid material (ink) exchanges between connected pixels. Therefore, line banks can suppress uneven film deposition caused by individual differences in the ejection head. Therefore, Linebank is also known as an inkjet coating technology.

[0038] A porous body 123, schematically shown in Figure 7, can be coated with a porous fluorine film, for example, an amorphous fluororesin solution having the structure of formula (1) (Somaflon B1, manufactured by Somar Co., Ltd.) by a spin-coating method. Afterward, it is placed in a drying oven and heated at 150°C for 30 minutes, followed by a vacuum chamber with a pressure of 1.0 × 10⁻⁶. 10 It can be dried at Pa for 60 minutes.

[0039] There are no particular restrictions on the fluororesin, but for example, polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), and tetrafluoroethylene-hexafluoropropylene copolymer (FEP) are preferred. Crystalline fluororesins such as polychlorotetrafluoroethylene (PCTFE), tetrafluoroethylene-ethylene copolymer (ETFE), chlorotrifluoroethylene-ethylene copolymer (ECTFE), polyvinylidene fluoride (PVDF), and polyvinyl fluoride (PVF) are also preferred. Amorphous fluororesins having a cyclic perfluoropolyether structure are also preferred.

[0040] Of these, amorphous fluororesins having a cyclic perfluoropolyether structure (cyclic perfluoropolyether resins) are preferred. When amorphous fluororesins having a cyclic perfluoropolyether structure are formed into a film, a porous body with fine pore sizes is obtained.

[0041] We believe that this is because, during the process of solvent evaporation from the solution state, phase separation between the resin component and the solvent is likely to occur, resulting in the formation of pores.

[0042] Specific examples of amorphous fluororesins having a cyclic perfluoropolyether structure include, but are not limited to, the structures shown in the following formulas (1) to (3).

[0043] [ka]

[0044] [ka]

[0045] [ka]

[0046] This specification and accompanying drawings include the following disclosures: (Item 1) A rotating device for rotating a circuit board, A substrate holding portion for holding the substrate, A facing member that faces the substrate holding portion via the substrate, A first rotation mechanism for rotating the substrate holding portion, A second rotation mechanism for rotating the opposing member, A rotating device characterized by being equipped with (Item 2) The system further includes an adjustment mechanism for adjusting the distance between the substrate holding portion and the opposing member. The rotating device described in item 1, characterized by the features described herein. (Item 3) The distance between the substrate and the opposing member when the substrate holder rotates the substrate is 10 times or less the thickness of the substrate. The rotating device according to item 2, characterized in that it is a rotating device. (Item 4) The system further includes a control unit that synchronizes the rotational drive of the substrate holding portion by the first rotation mechanism with the rotational drive of the opposing member by the second rotation mechanism. A rotating device according to any one of items 1 to 3, characterized in that it is a rotating device. (Item 5) The eccentricity of the rotation axis of the opposing member with respect to the rotation axis of the substrate holder is 1 / 10 or less of the maximum dimension of the substrate. A rotating device according to any one of items 1 to 4, characterized by the features described herein. (Item 6) The substrate holding portion includes a support portion that supports the back surface of the substrate and a peripheral portion that is arranged to surround the periphery of the substrate. A rotating device according to any one of items 1 to 5, characterized in that it is a rotating device. (Item 7) The opposing member includes the peripheral portion that surrounds the side surface of the substrate when the substrate holding portion rotates the substrate. A rotating device according to any one of items 1 to 5, characterized in that it is a rotating device. (Item 8) The substrate holding portion and the opposing member have cylindrical side surfaces. A rotating device according to any one of items 1 to 7, characterized by the above. (Item 9) The opposing member has a through hole, A rotating device according to any one of items 1 to 8, characterized in that it is a rotating device. (Item 10) The opposing member has a groove on the surface facing the substrate holding portion. A rotating device according to any one of items 1 to 9, characterized in that it is a rotating device. (Item 11) The opposing member has a porous body on the surface facing the substrate holding portion. A rotating device according to any one of items 1 to 10, characterized in that it is a rotating device. (Item 12) The substrate holding portion has through holes through which support pins that support the substrate pass. A rotating device according to any one of items 1 to 11, characterized by the features described herein. (Item 13) A substrate processing system comprising a plurality of processing devices for processing substrates and a transport mechanism for transporting substrates between the plurality of processing devices, The plurality of processing devices include a rotating device as described in any one of items 1 to 12, A substrate processing system characterized by the following features. (Item 14) The plurality of processing devices include a coating device for applying a liquid material to the substrate. A substrate processing system according to item 13, characterized by the features described herein. (Item 15) The plurality of processing apparatuses include a drying apparatus for drying the substrate on which the liquid material has been applied by the coating apparatus. A substrate processing system according to item 14, characterized by the features described herein. (Item 16) The drying apparatus includes a substrate table for holding the substrate and a rectifier box placed on the substrate held by the substrate table. A substrate processing system as described in item 15, characterized by the features described herein. (Item 17) The transport mechanism transports the substrate to which the liquid material has been applied by the coating device from the coating device to the rotating device. The rotating device rotates the substrate, The transport mechanism transports the substrate from the rotating device to the drying device. A substrate processing system according to item 16, characterized by the features described herein. (Item 18) A method for manufacturing articles, comprising manufacturing an article from a substrate by processing the substrate using a substrate processing system described in any one of items 13 to 17, A first processing step in which the substrate is processed by the first processing device among the plurality of processing devices, A first transport step involves transporting the substrate that has undergone the first processing step from the first processing device to the rotating device using the transport mechanism, A rotation step in which the substrate conveyed to the rotating device is rotated by the rotating device, A second transport step involves transporting the substrate that has undergone the rotation step from the rotating device to a second processing device among the plurality of processing devices by the transport mechanism, A second processing step involves processing the substrate using the second processing apparatus, A method for manufacturing articles, characterized by including the following: (Item 19) In the first processing step, a liquid material is applied to the substrate by a coating apparatus which is the first processing apparatus. In the second processing step, the substrate to which the liquid material was applied in the first processing step is dried using a drying apparatus, which is the second processing apparatus. A method for manufacturing an article as described in item 18, characterized by the features described herein. (Item 20) The drying apparatus includes a substrate table for holding the substrate and a rectifier box placed on the substrate held by the substrate table, In the rotation step, the substrate is rotated so that in the second transport step, the substrate is transported to the drying apparatus in an orientation that fits the rectifier box. A method for manufacturing an article as described in item 19, characterized by the features described herein.

[0047] (others) The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0048] S: Substrate, RU: Rotating device, 110: Substrate holder, 112: Peripheral part, 120: Opposing member, 130: First rotation mechanism, 140: Second rotation mechanism, 150: Adjustment mechanism, CNT: Control unit

Claims

1. A rotating device for rotating a circuit board, A substrate holding portion for holding the substrate, A facing member that faces the substrate holding portion via the substrate, A first rotation mechanism for rotating the substrate holding portion, A second rotation mechanism for rotating the opposing member, A rotating device characterized by being equipped with

2. The system further includes an adjustment mechanism for adjusting the distance between the substrate holding portion and the opposing member. The rotating device according to feature 1.

3. The distance between the substrate and the opposing member when the substrate holder rotates the substrate is 10 times or less the thickness of the substrate. The rotating device according to feature 2.

4. The system further includes a control unit that synchronizes the rotational drive of the substrate holding portion by the first rotation mechanism with the rotational drive of the opposing member by the second rotation mechanism. The rotating device according to feature 1.

5. The eccentricity of the rotation axis of the opposing member with respect to the rotation axis of the substrate holder is 1 / 10 or less of the maximum dimension of the substrate. The rotating device according to feature 1.

6. The substrate holding portion includes a support portion that supports the back surface of the substrate and a peripheral portion that is arranged to surround the periphery of the substrate. The rotating device according to feature 1.

7. The opposing member includes the peripheral portion that surrounds the side surface of the substrate when the substrate holding portion rotates the substrate. The rotating device according to feature 1.

8. The substrate holding portion and the opposing member have cylindrical side surfaces. The rotating device according to feature 1.

9. The opposing member has a through hole, The rotating device according to feature 1.

10. The opposing member has a groove on the surface facing the substrate holding portion. The rotating device according to feature 1.

11. The opposing member has a porous body on the surface facing the substrate holding portion. The rotating device according to feature 1.

12. The substrate holding portion has through holes through which support pins that support the substrate pass. The rotating device according to feature 1.

13. A substrate processing system comprising a plurality of processing devices for processing substrates and a transport mechanism for transporting substrates between the plurality of processing devices, The plurality of processing devices include the rotating device described in any one of claims 1 to 12. A substrate processing system characterized by the following features.

14. The plurality of processing devices include a coating device for applying a liquid material to the substrate. The substrate processing system according to feature 13.

15. The plurality of processing apparatuses include a drying apparatus for drying the substrate on which the liquid material has been applied by the coating apparatus. The substrate processing system according to feature 14.

16. The drying apparatus includes a substrate table for holding the substrate and a rectifier box placed on the substrate held by the substrate table. The substrate processing system according to claim 15, characterized by the features described above.

17. The transport mechanism transports the substrate to which the liquid material has been applied by the coating device from the coating device to the rotating device. The rotating device rotates the substrate, The transport mechanism transports the substrate from the rotating device to the drying device. The substrate processing system according to claim 16.

18. A method for manufacturing an article, comprising manufacturing an article from a substrate by processing the substrate using the substrate processing system described in claim 13, A first processing step in which the substrate is processed by the first processing device among the plurality of processing devices, A first transport step involves transporting the substrate that has undergone the first processing step from the first processing device to the rotating device using the transport mechanism, A rotation step in which the substrate conveyed to the rotating device is rotated by the rotating device, A second transport step involves transporting the substrate that has undergone the rotation step from the rotating device to a second processing device among the plurality of processing devices by the transport mechanism, A second processing step involves processing the substrate using the second processing apparatus, A method for manufacturing articles, characterized by including the following:

19. In the first processing step, a liquid material is applied to the substrate by a coating apparatus which is the first processing apparatus. In the second processing step, the substrate to which the liquid material was applied in the first processing step is dried using a drying apparatus, which is the second processing apparatus. The method for manufacturing an article according to feature 18.

20. The drying apparatus includes a substrate table for holding the substrate and a rectifier box placed on the substrate held by the substrate table, In the rotation step, the substrate is rotated so that in the second transport step, the substrate is transported to the drying apparatus in an orientation that fits the rectifier box. The method for manufacturing an article according to feature 19.

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