Next device

Abstract

The object of the present invention is to provide an adhesive device that can effectively discharge thickened material and cured material to the outside of the device during forced pressure discharge operation. [Solution] The bonding device comprises a nozzle 11, a supply mechanism 40, a transport mechanism, and a CPU. The supply mechanism 40 has a pressurizing unit 45, a downstream channel 47, and a temperature control unit. When the CPU performs a bonding operation, it sets the temperature of the downstream channel heater 133 of the temperature control unit to 120°C. The CPU uses the pressurizing unit 45 to set the viscosity of the adhesive Z inside the downstream channel 47 to 18,000 mPa·s. When the CPU performs a purging operation, it sets the temperature of the downstream channel heater 133 to 80°C. The CPU uses the pressurizing unit 45 to set the viscosity of the adhesive Z inside the downstream channel 47 to 150,000 mPa·s. The ratio of the viscosity of the adhesive Z inside the downstream channel 47 during the purging operation to the viscosity of the adhesive Z inside the downstream channel 47 during the bonding operation is 1.5 or more and 123.1 or less.

Description

Technical Field

[0001] The present invention relates to a bonding apparatus.

Background Art

[0002] The droplet jet coating apparatus described in Patent Document 1 includes an ink chamber, a piezoelectric element, a nozzle, and a cooling unit. The ink chamber contains ink which is a liquid. A part of the wall of the ink chamber is a diaphragm. The piezoelectric element is arranged in contact with the diaphragm. The nozzle discharges the ink contained in the ink chamber. The cooling unit is capable of cooling the ink chamber. The droplet jet coating apparatus deforms the piezoelectric element by applying a voltage to the piezoelectric element and releasing the application of the voltage. The diaphragm deforms in response to the deformation of the piezoelectric element, and the nozzle discharges the ink. The droplet jet coating apparatus performs purging to prevent air bubbles from being trapped in the nozzle. When performing purging, the droplet jet coating apparatus vigorously flushes the ink in the ink chamber out from the nozzle while the ink in the ink chamber is cooled, thereby forcibly discharging the air bubbles together with the ink to the outside.

[0003] The bonding apparatus described in Patent Document 2 includes a nozzle and a supply mechanism. The nozzle discharges an adhesive. The supply mechanism supplies the adhesive to the nozzle. The bonding apparatus discharges the adhesive onto a lower fabric, and conveys the lower fabric and the upper fabric while sandwiching them, thereby bonding the lower fabric and the upper fabric.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of Invention

Problems to be Solved by the Invention

[0005] In the bonding apparatus described in Patent Document 2, the adhesive may react in the flow path from the supply mechanism to the nozzle. This reaction can result in the adhesive becoming either a thickened substance with increased viscosity or a completely cured substance. In the bonding apparatus, purging by the supply mechanism, as in the droplet spray coating apparatus described in Patent Document 1, is conceivable to prevent the thickened substance or cured substance from remaining in the flow path. However, because the thickened substance and cured substance have very high viscosity, purging may not adequately discharge them.

[0006] The object of the present invention is to provide an adhesive device that can effectively discharge thickened material and cured material to the outside of the device during forced pressure discharge operation. [Means for solving the problem]

[0007] The adhesive apparatus according to the present invention comprises a nozzle for dispensing adhesive, a supply mechanism for supplying the adhesive to the nozzle, a lower conveying section for supporting a lower sheet, an upper conveying section that sandwiches the lower sheet and the upper sheet between itself and the lower conveying section, and a conveying mechanism that, downstream of the nozzle in the conveying direction for transporting the lower sheet and the upper sheet, sandwiches and transports the lower sheet and the upper sheet in cooperation with the lower conveying section and the upper conveying section, and a control unit that performs an adhesive operation in which the upper sheet and the lower sheet are bonded together while being transported downstream in the conveying direction with the adhesive dispensed by the nozzle in between, wherein the supply mechanism comprises a pressurizing section for dispensing the adhesive through the nozzle, and a pressurizing section for dispensing the adhesive from the nozzle The adhesive flow path comprises a flow path that is pressurized by a pressurizing unit and a temperature control unit capable of adjusting the temperature of the adhesive in the bonding device, wherein when the bonding operation is performed, the control unit controls the temperature control unit and the pressurizing unit to bring the adhesive in the flow path to a first temperature and the viscosity of the adhesive to a first value, and when the forced pressurized discharge operation is performed to forcibly discharge the adhesive remaining in the flow path, the control unit controls the temperature control unit and the pressurizing unit to bring the adhesive in the flow path to a second temperature and the viscosity of the adhesive to a second value, wherein the ratio of the second value to the first value is 1.5 or more and 123.1 or less.

[0008] The bonding device controls the temperature control unit and the pressurizing unit to set the temperature in the flow path to a first temperature and the viscosity of the adhesive in the flow path to a first value when performing bonding operations. The bonding device controls the temperature control unit and the pressurizing unit to set the temperature in the flow path to a second temperature and the viscosity of the adhesive in the flow path to a second value when performing forced pressurized discharge operations. Since the ratio of the second value to the first value is between 1.5 and 123.1, the viscosity of the adhesive during forced pressurized discharge operations is higher than the viscosity of the adhesive during bonding operations, within the range that can be discharged from the nozzle. Therefore, the adhesive is more easily discharged from the nozzle during forced pressurized discharge operations, along with the thickened material and cured material. Thus, the bonding device can effectively discharge the thickened material and cured material to the outside of the device during forced pressurized discharge operations.

[0009] In the present invention, the first value may be 3,000 mPa·s or more and 40,000 mPa·s or less, and the second value may be 4,500 mPa·s or more and 800,000 mPa·s or less. In the bonding apparatus, the adhesive is more easily discharged from the nozzle with the thickening agent and cured material encased in it during the forced pressure discharge operation. Therefore, the bonding apparatus can effectively discharge the thickening agent and cured material to the outside of the apparatus during the forced pressure discharge operation.

[0010] In the present invention, when the bonding operation is performed, the control unit controls the temperature control unit and the pressurizing unit to raise the adhesive in the flow path to the first temperature and the pressure in the flow path to the first pressure. When the forced pressurizing discharge operation is performed, the control unit controls the temperature control unit and the pressurizing unit to raise the adhesive in the flow path to the second temperature and the pressure in the flow path to the second pressure. The ratio of the second pressure to the first pressure may be 1.4 or more and 45 or less. The bonding device raises the pressure in the flow path to the first pressure during the bonding operation and to the second pressure during the forced pressurizing discharge operation. Since the ratio of the second pressure to the first pressure is 1.4 or more and 45 or less, the pressure in the flow path during the forced pressurizing discharge operation is higher than the pressure in the flow path during the bonding operation, within the range where discharge from the nozzle is possible. Therefore, the adhesive is more easily discharged from the nozzle during the forced pressurizing discharge operation, along with the thickener and cured material. Thus, the bonding device can effectively discharge the thickener and cured material to the outside of the device during the forced pressurizing discharge operation.

[0011] In the present invention, the ratio of the second value to the first value in the bonding device is such that the first pressure is 0.2 MPa or more and 1.2 MPa or less, and the second pressure is 0.3 MPa or more and 9 MPa or less. In the bonding device, the adhesive is more easily discharged from the nozzle with the thickening agent and cured material encased in it during the forced pressurized discharge operation. Therefore, the bonding device can effectively discharge the thickening agent and cured material to the outside of the device during the forced pressurized discharge operation.

[0012] In the present invention, the supply mechanism has a tank section for storing the adhesive, the temperature control section includes a first heater for heating the adhesive in the flow path and a second heater for heating the adhesive in the tank section, and when the bonding operation is performed, the control section may use the temperature control section to set the temperature of the adhesive in the flow path to the first temperature and the temperature of the adhesive in the tank section to a third temperature lower than the first temperature, and when the forced pressurized discharge operation is performed, the temperature control section may use the temperature control section to set the temperature of the adhesive in the flow path to a second temperature lower than the first temperature and the temperature of the adhesive in the tank section to a fourth temperature lower than the first temperature. When the bonding device performs the bonding operation, the temperature of the adhesive in the flow path is higher than the temperature of the adhesive in the tank section, so the adhesive can be efficiently discharged from the nozzle. When the bonding device performs the forced pressurized discharge operation, the temperature of the adhesive in the flow path is higher than the temperature of the adhesive in the tank section, so the adhesive can be efficiently discharged from the nozzle. Furthermore, the temperature of the adhesive in the flow path during the forced pressurized discharge operation is lower than the temperature of the adhesive in the flow path during the bonding operation. Therefore, the viscosity of the adhesive during the forced pressure discharge operation is higher than the viscosity of the adhesive during the bonding operation. Consequently, the adhesive is more easily discharged from the nozzle during the forced pressure discharge operation, entraining the thickened material and cured material. Thus, the bonding device can effectively discharge the thickened material and cured material to the outside of the device during the forced pressure discharge operation.

[0013] In the present invention, the third temperature and the fourth temperature may be the same. The bonding device can effectively and easily discharge the thickened material and cured material to the outside of the device during the forced pressure discharge operation.

[0014] In the present invention, the temperature control unit further comprises a third heater for heating the adhesive in the pressurizing unit, and the control unit may, when performing the bonding operation, set the temperature of the adhesive in the pressurizing unit to a fifth temperature lower than the first temperature by the temperature control unit, and when performing the forced pressurizing discharge operation, set the temperature of the adhesive in the pressurizing unit to a sixth temperature that is lower than or equal to the fifth temperature and higher than the second temperature by the temperature control unit. When the bonding device performs the bonding operation, the temperature of the adhesive in the pressurizing unit is lower than the temperature of the adhesive in the flow path, so the time the adhesive is exposed to a high-temperature environment is reduced, and the deterioration of the adhesive can be reduced. When the bonding device performs the forced pressurizing discharge operation, the temperature of the adhesive in the pressurizing unit is higher than the temperature of the adhesive in the flow path, so the viscosity of the adhesive in the pressurizing unit is reduced, the load on the pressurizing unit can be reduced, and the adhesive can be efficiently discharged from the nozzle. Also, since the temperature of the adhesive in the pressurizing unit is lower than or equal to the temperature at the time of bonding, the time the adhesive is exposed to a high-temperature environment is reduced, and the deterioration of the adhesive can be reduced. Therefore, the bonding device can efficiently discharge the adhesive while reducing deterioration during bonding and forced pressurizing discharge operations. [Brief explanation of the drawing]

[0015] [Figure 1] Perspective view of bonding device 1. [Figure 2] Left side view of bonding device 1. [Figure 3] Perspective view of the lower transport mechanism 50. [Figure 4] A close-up view of the nozzle 11, lower conveyor roller 64, nozzle lower roller 65, and upper conveyor roller 12. [Figure 5] Conceptual diagram of supply mechanism 40. [Figure 6] Electrical block diagram of bonding device 1. [Figure 7] A graph showing the correlation between the temperature of the downstream channel heater 133 and the viscosity of the adhesive Z inside the downstream channel 47. [Figure 8] A flowchart illustrating the bonding process. [Figure 9] A flowchart illustrating the purging process. [Figure 10]A chart showing the temperature of the temperature adjustment unit in each of the bonding operation and the purge operation. [Figure 11] A chart showing experimental results of eliminating clogging in the downstream flow path 47 when the control of the purge operation is changed in a typical usage environment for adhesive Z of typical viscosity. [Figure 12] A chart showing experimental results of eliminating clogging in the downstream flow path 47 when the control of the purge operation is changed in another usage environment for adhesive Z of typical viscosity. [Figure 13] A chart showing experimental results of eliminating clogging in the downstream flow path 47 when the control of the purge operation is changed in a typical usage environment for high-viscosity adhesive Z. [Figure 14] A chart showing experimental results of eliminating clogging in the downstream flow path 47 when the control of the purge operation is changed in another usage environment for high-viscosity adhesive Z. [Figure 15] A chart showing experimental results of eliminating clogging in the downstream flow path 47 when the control of the purge operation is changed in a typical usage environment for low-viscosity adhesive Z. [Figure 16] A chart showing experimental results of eliminating clogging in the downstream flow path 47 when the control of the purge operation is changed in another usage environment for low-viscosity adhesive Z. [Mode for Carrying Out the Invention]

[0016] Hereinafter, one embodiment of the present invention will be described with reference to the drawings. The referenced drawings are used to describe the technical features that the present invention can adopt. The configuration of the apparatus described in the drawings is not intended to be limiting thereto, and is merely an illustrative example. In the following, the upper left, lower right, lower left, upper right, lower side, and upper side of FIG. 1 are respectively defined as the left side, right side, front side, rear side, lower side, and upper side of the bonding apparatus 1.

[0017] The configuration of the bonding apparatus 1 will be described with reference to FIG. 1 to FIG. 5. The bonding apparatus 1 bonds the upper sheet 6 and the lower sheet 8 with the adhesive Z shown in FIG. 5. The adhesive Z has thermoplasticity, liquefies at its softening point, and solidifies at a temperature lower than the softening point.

[0018] The upper sheet 6 overlaps the lower sheet 8 from above. The upper sheet 6 and the lower sheet 8 are, for example, made of a flexible cloth. In this embodiment, the right end of the sheet 200 shown in Figure 3 is the upper sheet 6, and the left end of the sheet 200 is the lower sheet 8. The sheet 200 is rolled up into a cylindrical shape so that the upper sheet 6 overlaps the lower sheet 8 from above. The part of the upper sheet 6 that overlaps with the lower sheet 8 is called the upper specific end 6A, and the part of the lower sheet 8 that overlaps with the upper sheet 6 is called the lower specific end 8A.

[0019] As shown in Figures 1 and 2, the bonding device 1 comprises a base 2, leg columns 3, arms 4, a head 5, and a transport mechanism 20. The base 2 is rectangular in shape and is fixed to the workbench. A support plate 51 is positioned at the left end of the base 2.

[0020] The support plate 51 extends in the front-rear direction. The front end of the support plate 51 is located in front of the front end of the base portion 2. A support plate 512 is positioned at the lower end of the support plate 51. The support plate 512 extends to the left from the lower end of the support plate 51.

[0021] The leg column 3 extends upward from the upper end of the base 2. The arm 4 extends to the left from the left end of the upper end of the leg column 3. The left end of the arm 4 is the head 5. The tank 41 is positioned at the upper end of the head 5.

[0022] An operating unit 19 is located at the front end of the arm 4. The operating unit 19 includes switches that receive various operations from the operator. The operator operates the operating unit 19 when giving instructions to the bonding device 1. An upper clamping mechanism 30, which will be described later, is located at the lower end of the arm 4.

[0023] The transport mechanism 20 includes a lower transport mechanism 50 and an upper transport mechanism 70. The lower transport mechanism 50 is located on the support plate 51. The upper transport mechanism 70 is located on the head 5. The upper transport mechanism 70 will be described later.

[0024] As shown in Figures 3 and 4, the lower transport mechanism 50 has a frame 55 and a lower transport operating unit 60. The frame 55 is box-shaped and extends in the front-rear direction. The frame 55 houses the lower transport operating unit 60 and the lower clamping mechanism 80. The upper end of the frame 55 is a support plate 57. The support plate 57 supports the lower sheet 8 from below.

[0025] A shaft portion 316 is positioned at the right rear end of the support plate 57. The shaft portion 316 extends upward from the upper end of the support plate 57. The shaft portion 316 supports the upper support portion 314. The upper support portion 314 is plate-shaped with thickness in the vertical direction. The upper support portion 314 includes an upper surface 315 and a lower surface 317.

[0026] The lower transport mechanism 60 comprises a support frame 61, a lower transport roller 64, a nozzle lower roller 65, and a lower transport motor 63 as shown in Figure 6. The support frame 61 is box-shaped and extends in the front-rear direction. The upper end of the support frame 61 is a plate 59.

[0027] The lower conveyor roller 64 is fixed to the shaft portion 641. The shaft portion 641 extends in a left-right direction perpendicular to the vertical direction and is rotatably supported at its rear end inside the support frame 61. The upper end of the lower conveyor roller 64 protrudes above the plate 59.

[0028] The nozzle lower roller 65 is fixed to the shaft portion 651. The shaft portion 651 extends in a left-right direction perpendicular to the vertical direction, is located inside the support frame 61 and in front of the shaft portion 641, and is rotatably supported by the support frame 61. The upper end of the nozzle lower roller 65 protrudes above the plate 59. The lower conveyor roller 64 and the nozzle lower roller 65 support the lower sheet 8 from below.

[0029] The lower conveying motor 63 is located at the front end of the support frame 61. An endless belt (not shown) is stretched over the drive shaft, shaft portion 641, and shaft portion 651 of the lower conveying motor 63. Therefore, when the lower conveying motor 63 is driven, the lower conveying roller 64 and the nozzle lower roller 65 rotate with the left-right direction as the axial direction. Consequently, when the lower conveying roller 64 and the nozzle lower roller 65 rotate, the lower sheet 8 is conveyed in the front-rear direction. In this embodiment, the front-rear direction is the conveying direction, the front is the upstream direction of conveying, and the rear is the downstream direction of conveying.

[0030] The lower clamping mechanism 80 comprises a lower clamping roller 76, a shaft portion 75, and a lower clamping motor 72 shown in Figure 6. The lower clamping roller 76 is positioned in front of the nozzle lower roller 65. The upper end of the lower clamping roller 76 protrudes above the plate 59. The lower clamping roller 76 is located below the upper support portion 314. The lower clamping roller 76 can clamp the lower sheet 8 between itself and the lower surface 317 of the upper support portion 314. The axis of the lower clamping roller 76 extends in the front-rear direction.

[0031] The shaft portion 75 is fixed to the front end of the lower clamping roller 76. The shaft portion 75 extends in a front-to-back direction parallel to the conveying direction and is aligned with the axis of the lower clamping roller 76 in the front-to-back direction. The shaft portion 75 is rotatable integrally with the lower clamping roller 76 with the front-to-back direction as its axial direction.

[0032] The lower clamping motor 72 is located at the front end of the support frame 61. The lower clamping motor 72 is connected to the front end of the shaft portion 75. When the lower clamping motor 72 is driven, the lower clamping roller 76 rotates in the front-rear direction as its axis. As the lower clamping roller 76 rotates while clamping the lower sheet 8 between itself and the lower surface 317, the lower clamping mechanism 80 can move the lower sheet 8 in the left-right direction.

[0033] As shown in Figures 2 and 4, the upper conveying mechanism 70 of the conveying mechanism 20 comprises an arm 16, an upper conveying roller 12, and an upper conveying motor 112 as shown in Figure 6. The arm 16 is box-shaped and extends forward and downward from the lower end of the head 5.

[0034] The arm portion 16 has a tip portion 160 at its front lower end. The tip portion 160 rotatably supports the shaft portion 121. The shaft portion 121 extends in a left-right direction perpendicular to the vertical direction. An upper conveyor roller 12 is fixed to the shaft portion 121. The upper conveyor roller 12 clamps the lower sheet 8 and the upper sheet 6 between itself and the lower conveyor roller 64. In Figure 4, point P indicates the position where the upper conveyor roller 12 and the lower conveyor roller 64 clamp the lower sheet 8 and the upper sheet 6.

[0035] The upper conveyor motor 112 is located to the left rear of the arm section 16. The drive shaft of the upper conveyor motor 112 is connected to the shaft section 121. When the upper conveyor motor 112 is driven, the upper conveyor roller 12 rotates with the left-right direction as its axis. As the upper conveyor roller 12 and the lower conveyor roller 64 rotate, the lower sheet 8 and the upper sheet 6 are conveyed to the rear.

[0036] As shown in Figure 4, the upper clamping mechanism 30 will be described. The upper clamping mechanism 30 comprises a support part 34, an arm part 31, a shaft part 33, an upper clamping roller 32, an upper clamping motor 38, a transmission mechanism, a spring 37, and an air cylinder 26. The arm part 31 is box-shaped and extends from the right side of the lower surface of the arm part 4 downward to the left. The arm part 31 has a tip part 310 at its lower left end.

[0037] The tip portion 310 rotatably supports the shaft portion 33. The shaft portion 33 extends in a front-rear direction parallel to the conveying direction and fixes the upper clamping roller 32. The upper clamping roller 32 is located above the lower clamping roller 76 with the upper support portion 314 in between. The upper clamping roller 32 is located in front of the upper conveying roller 12. The upper clamping roller 32 can clamp the upper sheet 6 between itself and the upper surface 315 of the upper support portion 314.

[0038] The drive shaft of the upper clamping motor 38 is connected to the shaft portion 33. When the upper clamping motor 38 is driven, the upper clamping roller 32 rotates with the front-rear direction as its axial direction, clamping the upper sheet 6 between itself and the upper surface 315. As the upper clamping roller 32 rotates, the upper clamping mechanism 30 can move the upper sheet 6 in the left-right direction.

[0039] Referring to Figure 5, the supply mechanism 40 will be described. The supply mechanism 40 comprises a tank section 41, a tank heater 131, an upstream channel 44, a pressurizing section 45, a pressurizing section heater 132, a downstream channel 47, and a downstream channel heater 133. As shown in Figure 1, the tank section 41 is a box shape extending in the vertical direction. The tank section 41 is fitted with a cartridge 42. The cartridge 42 contains the adhesive Z. By fitting the cartridge 42 into the tank section 41, the adhesive Z is stored.

[0040] The tank section 41 houses the tank heater 131. The tank heater 131 heats the cartridge 42, thereby heating the adhesive Z inside the cartridge 42. The adhesive Z inside the cartridge 42 is liquefied by the tank heater 131.

[0041] The upstream channel 44 is housed in the head unit 5. The upstream end of the upstream channel 44 is connected to the cartridge 42. The internal pressure of the cartridge 42 becomes positive due to the operation of the compressor 89 shown in Figure 6. The adhesive Z flows from the cartridge 42 into the upstream channel 44.

[0042] The pressurizing section 45 is box-shaped and includes a gear pump 46 and a pump motor 114. The gear pump 46 is, for example, an external gear pump in which two gears mesh. The upstream end of the gear pump 46 is connected to the downstream end of the upstream flow path 44. The downstream end of the gear pump 46 is connected to the upstream end of the downstream flow path 47.

[0043] The pump motor 114 rotates the two gears of the gear pump 46. When the pump motor 114 is driven, the gear pump 46 sucks the adhesive Z from the cartridge 42 and sends the sucked adhesive Z to the downstream channel 47.

[0044] The pressurizing section 45 houses the pressurizing section heater 132. The pressurizing section heater 132 heats the pressurizing section 45, thereby heating the adhesive Z inside the pressurizing section 45. The viscosity of the adhesive Z delivered by the gear pump 46 is determined by the rotational speed of the pump motor 114 per unit time and the temperature of the pressurizing section heater 132.

[0045] The downstream channel 47 is housed in the head 5, nozzle lever 18, and nozzle 11. The nozzle lever 18 is box-shaped and extends vertically. The upper end of the nozzle lever 18 is housed in the head 5. The lower end of the nozzle lever 18 protrudes below the lower end of the head 5. The nozzle 11 is positioned at the lower end of the nozzle lever 18.

[0046] The nozzle 11 comprises an extension portion 116 and a discharge portion 117. The extension portion 116 is box-shaped and extends downward and rearward from the lower end of the nozzle lever 18. The discharge portion 117 is box-shaped and extends to the right from the lower end of the extension portion 116.

[0047] The lower surface of the discharge section 117 is a nozzle surface 119 that extends horizontally. The nozzle surface 119 has a plurality of discharge ports 13. The plurality of discharge ports 13 are arranged in the left-right direction. The plurality of discharge ports 13 are connected to the downstream end of the downstream flow path 47. The adhesive Z sent out by the gear pump 46 flows through the downstream flow path 47 and is discharged downward from the plurality of discharge ports 13.

[0048] A pressure sensor 49 is located at the upstream end of the downstream channel 47. The pressure sensor 49 detects the pressure of the adhesive Z flowing through the downstream channel 47.

[0049] The nozzle lever 18 houses the downstream channel heater 133, the nozzle valve 181, and the air cylinder 29 shown in Figure 6. The downstream channel heater 133 heats the downstream channel 47, thereby heating the adhesive Z inside the downstream channel 47. The viscosity of the adhesive Z flowing through the downstream channel 47 is determined by the pressure detected by the pressure sensor 49 and the temperature of the downstream channel heater 133.

[0050] The nozzle valve 181 is located inside the nozzle lever 18, downstream of the downstream flow path heater 133 in the direction in which the adhesive Z flows. The nozzle valve 181 can open and close the downstream flow path 47.

[0051] The output shaft of the air cylinder 29 is connected to the nozzle valve 181. The nozzle valve 181 is opened and closed by the drive of the air cylinder 29. When the nozzle valve 181 is open, the nozzle 11 discharges the adhesive Z. When the nozzle valve 181 is closed, the nozzle 11 stops discharging the adhesive Z. The amount of adhesive Z discharged from the nozzle 11 per unit time changes according to the speed of the pump motor 114.

[0052] Referring to Figure 6, the electrical configuration of the bonding apparatus 1 will be explained. The control device 90 includes a CPU 91, ROM 92, RAM 93, storage device 94, potentiometer 95, and drive circuits 96 and 97.

[0053] The CPU 91 provides overall control over the operation of the bonding device 1. The CPU 91 is connected to the ROM 92, RAM 93, storage device 94, operating unit 19, potentiometer 95, pressure sensor 49, RTC (real time clock) 98, drive circuits 96 and 97, compressor 89, and display unit 260.

[0054] ROM92 stores various programs executed by CPU91. These programs include an adhesive program for performing the bonding process shown in Figure 8, and a purge program for performing the purging process shown in Figure 9. RAM93 temporarily stores various information and flags. Storage device94 stores various parameters necessary when executing the various programs.

[0055] The control unit 19 receives various operations from the operator and outputs a signal corresponding to the received operation to the CPU 91. The potentiometer 95 detects the position of the footplate 7. The footplate 7 can be rotated by the operator's foot and moved to the stepping position or the return position. When the footplate 7 is in the stepping position, the potentiometer 95 outputs a start command to the CPU 91. The start command is an instruction to start the bonding operation by the bonding device 1. When the footplate 7 is in the return position, the potentiometer 95 outputs an end command to the CPU 91. The end command is an instruction to end the bonding operation by the bonding device 1.

[0056] The pressure sensor 49 detects the pressure of the adhesive Z flowing through the downstream channel 47 and outputs a signal corresponding to the detected pressure to the CPU 91. The RTC 98 outputs a signal indicating the current time to the CPU 91.

[0057] The CPU 91 controls the drive circuit 96 to drive the lower transport motor 63, upper transport motor 112, pump motor 114, lower clamping motor 72, and upper clamping motor 38, respectively. In this embodiment, the lower transport motor 63, upper transport motor 112, pump motor 114, lower clamping motor 72, and upper clamping motor 38 are stepping motors.

[0058] The CPU 91 controls the temperature of the tank heater 131, the pressurizing section heater 132, and the downstream channel heater 133 by controlling the drive circuit 97. In this embodiment, the temperature of the tank heater 131 is the same as the temperature of the adhesive Z contained in the cartridge 42. The temperature of the pressurizing section heater 132 is the same as the temperature of the adhesive Z inside the pressurizing section 45. The temperature of the downstream channel heater 133 is the same as the temperature of the adhesive Z inside the downstream channel 47.

[0059] The air cylinder 29 opens and closes the nozzle valve 181 in response to a control signal from the CPU 91. The compressor 89 increases the internal pressure of the cartridge 42 in response to a control signal from the CPU 91. The display unit 260 is located on the workbench. The display unit 260 displays various information in response to a control signal from the CPU 91.

[0060] Referring to Figures 8 and 10, the bonding process performed by the CPU 91 will be explained. In the bonding process, the upper sheet 6 and the lower sheet 8 are bonded together by the bonding operation.

[0061] Before the bonding operation by the bonding device 1 begins, the lower conveyor roller 64 and the nozzle lower roller 65 support the lower sheet 8 from below. The upper conveyor roller 12 contacts the upper sheet 6 from above, clamping the lower sheet 8 between itself and the lower conveyor roller 64. The temperature of the tank heater 131 is 90°C, and the temperature of the pressurizing section heater 132 is 110°C. The temperature of the downstream flow path heater 133 is, for example, 120°C.

[0062] The operator instructs the CPU 91 to perform the bonding process via the control unit 19. The CPU 91 reads the bonding program from the ROM 92 in response to the instruction and starts the bonding process. Once the CPU 91 starts the bonding process, it determines whether or not it has received a start instruction (S11). The operator operates the footplate 7 with their foot to position the footplate 7 in the stepping position. The potentiometer 95 outputs a start instruction to the control device 90.

[0063] The CPU 91 waits until it receives a start command (S11: NO). When the CPU 91 receives a start command (S11: YES), it starts transporting the lower sheet 8 and the upper sheet 6 (S13). In S13, the CPU 91 drives the lower transport motor 63 and the upper transport motor 112. The lower transport motor 63 drives the lower transport roller 64 and the nozzle lower roller 65, and the lower sheet 8 is transported backward. The upper transport motor 112 drives the upper transport roller 12, and the upper sheet 6 is transported backward.

[0064] The CPU 91 starts dispensing adhesive Z to the lower sheet 8 (S15). In S15, the CPU 91 drives the pump motor 114 to supply adhesive Z from the cartridge 42 to the nozzle valve 181 in the downstream passage 47. The CPU 91 drives the air cylinder 29, opening the downstream passage 47 via the nozzle valve 181. The adhesive Z is then dispensed from the discharge port 13 of the nozzle 11 onto the lower sheet 8.

[0065] The bonding device 1 conveys the lower sheet 8 and the upper sheet 6 while applying adhesive Z to the lower sheet 8. The lower sheet 8, with adhesive Z applied, is pressed against the upper sheet 6 between the lower conveying roller 64 and the upper conveying roller 12, and the lower sheet 8 and the upper sheet 6 are bonded together.

[0066] The CPU 91 determines whether or not it has received a termination instruction (S21). The operator operates the footboard 7 with their foot and places the footboard 7 in the return position. The potentiometer 95 outputs a termination instruction to the control device 90.

[0067] The CPU 91 waits until it receives a termination instruction (S21: NO). Upon receiving the termination instruction (S21: YES), the CPU 91 terminates the discharge of adhesive Z to the lower sheet 8 (S23). In S23, the CPU 91 stops driving the pump motor 114. The CPU 91 drives the air cylinder 29 and closes the downstream passage 47 with the nozzle valve 181.

[0068] The CPU 91 finishes transporting the lower sheet 8 and the upper sheet 6 (S25). In S25, the CPU 91 stops driving the lower transport motor 63 and the upper transport motor 112, and ends the transport of the lower sheet 8 and the upper sheet 6. The CPU 91 ends the bonding process.

[0069] After the discharge of adhesive Z is complete, the adhesive Z may react in the downstream channel 47. This reaction may result in either a thickened product with increased viscosity or a completely cured product. Hereinafter, these thickened or cured products will be referred to as reactants. If the reactants remain in the downstream channel 47, it may become clogged.

[0070] The bonding apparatus 1 uses a supply mechanism 40 to purge the adhesive Z so that no reactants remain in the downstream channel 47. The purging operation involves forcefully sending out the adhesive Z using a pressurizing unit 45, thereby entraining the reactants in the laminar flow of the adhesive Z and discharging the adhesive Z together with the reactants from the nozzle 11.

[0071] Since the reactants are produced by the reaction of adhesive Z, the viscosity of the reactants is even higher than that of adhesive Z. Therefore, even if adhesive Z is dispensed with force, the laminar flow of adhesive Z may not be able to entrain the reactants that have adhered to the inner wall of, for example, the downstream channel 47.

[0072] The bonding device 1 increases the viscosity of the adhesive Z during the purging operation to a higher level than the viscosity of the adhesive Z during the bonding operation. Therefore, the laminar flow of the adhesive Z makes it easier to entrain reactants during the purging operation, and makes it easier to discharge the reactants from the nozzle 11. As shown in Figure 7, there is a correlation between the temperature of the downstream channel heater 133 and the viscosity of the adhesive Z inside the downstream channel 47. The viscosity of the adhesive Z inside the downstream channel 47 is derived from the pressure detected by the pressure sensor 49.

[0073] In Figure 7, curve L1 shows the correlation for adhesives Z with typical viscosities. Curve L2 shows the correlation for high-viscosity adhesives Z. Curve L3 shows the correlation for low-viscosity adhesives Z.

[0074] Boundary B1 indicates the upper limit of the viscosity of the adhesive Z, which increases with the drive of the pump motor 114. That is, when the pump motor 114 outputs maximum torque, the viscosity of the adhesive Z is the value of boundary B1. Boundary B2 indicates the upper limit of the temperature of the adhesive Z that can be applied to the sheet 200. If adhesive Z at a temperature exceeding the temperature indicated by boundary B2 is dispensed, the sheet 200 may be damaged. Boundary B3 indicates the lower limit of the temperature of the adhesive Z. Temperatures below the temperature indicated by boundary B3 are significantly lower than the temperature of the downstream channel heater 133 (120°C) during the bonding operation, so the downstream channel heater 133 requires a long time to control the temperature.

[0075] Boundary B4 is the upper limit of the viscosity of adhesive Z during bonding. Depending on the material of sheet 200, if it is higher than this, there is a risk that the adhesive Z will not penetrate sheet 200 sufficiently when applied, resulting in a smaller bonding width. Boundary B5 is the lower limit of the viscosity of adhesive Z during bonding. Depending on the material of sheet 200, if it is lower than this, there is a risk that the adhesive Z will soak into sheet 200 excessively when applied, resulting in insufficient adhesion when bonding. As described above, the bonding device 1 makes the viscosity of adhesive Z during the purging operation higher than the viscosity of adhesive Z during the bonding operation. That is, the bonding device 1 performs the bonding operation with the viscosity and temperature of adhesive Z in the range enclosed by curves L2, L3 and boundaries B2, B4, and B5. The bonding device 1 performs the purging operation with the viscosity and temperature of adhesive Z in the range enclosed by curves L2, L3 and boundaries B1, B2, B3, B4, and B5, such that the viscosity is higher by a predetermined ratio than the viscosity of adhesive Z in the operating environment set for the bonding operation.

[0076] Referring to Figures 9 and 10, the purging process performed by the CPU 91 will be explained. During the purging process, the adhesive Z inside the downstream channel 47 is forcibly discharged under pressure by the purging operation. Hereinafter, the tank heater 131, the pressurizing section heater 132, and the downstream channel heater 133 will be collectively referred to as the temperature control section 130.

[0077] The temperature of the temperature control unit 130 before the purging operation by the bonding device 1 is started is the same as the temperature of the temperature control unit 130 in the bonding process shown in Figure 10. That is, the temperature of the tank heater 131 is 90°C, and the temperature of the pressurizing unit heater 132 is 110°C. The temperature of the downstream flow channel heater 133 is, for example, 120°C.

[0078] The purge process is initiated once a day at a predetermined time. In this embodiment, the purge process is initiated at 9:00 every day. If the time indicated by the RTC98 is 9:00, the CPU91 reads the purge program from the ROM92 and starts the purge process.

[0079] When the CPU 91 starts the purging process, it starts controlling the temperature of the temperature control unit 130 (S31). In S31, the CPU 91 adjusts the temperature of the temperature control unit 130 to the temperature of the temperature control unit 130 in the purging process shown in Figure 10. Specifically, the temperature of the tank heater 131 is set to 90°C, and the temperature of the pressurization unit heater 132 is set to 100°C. The temperature of the downstream flow channel heater 133 is set to 80°C as an example.

[0080] The CPU 91 determines whether the temperature control of the temperature control unit 130, which was started in S31, has been completed (S33). The CPU 91 waits until the temperature control of the temperature control unit 130 is completed (S33: NO).

[0081] When the temperature control unit 130 is completed (S33:YES), the CPU 91 starts the purge operation (S35). In S35, the CPU 91 drives the pump motor 114 to supply adhesive Z from the cartridge 42 to the nozzle valve 181 in the downstream passage 47. The CPU 91 drives the air cylinder 29 to open the downstream passage 47 via the nozzle valve 181. The adhesive Z is discharged from the discharge port 13 of the nozzle 11. The pressure of the adhesive Z detected by the pressure sensor 49 in S35 is greater than the pressure of the adhesive Z detected by the pressure sensor 49 in S15 shown in Figure 8. That is, the viscosity of the adhesive Z during the purge operation is greater than the viscosity of the adhesive Z during the bonding operation.

[0082] The CPU 91 determines whether a predetermined time has elapsed since the start of the purge operation (S37). The predetermined time is stored in the memory device 94 beforehand. The CPU 91 waits until the predetermined time has elapsed since the start of the purge operation (S37: NO).

[0083] When a predetermined time has elapsed since the start of the purge operation (S37: YES), the CPU 91 terminates the purge operation (S41). In S41, the CPU 91 stops driving the pump motor 114. The CPU 91 drives the air cylinder 29 and closes the downstream passage 47 with the nozzle valve 181.

[0084] The CPU 91 starts temperature control of the temperature control unit 130 (S43). In S43, the CPU 91 adjusts the temperature of the temperature control unit 130 to the temperature of the temperature control unit 130 in the bonding process shown in Figure 10. Specifically, the temperature of the tank heater 131 is set to 90°C, the temperature of the pressurizing unit heater 132 is set to 110°C, and the temperature of the downstream flow channel heater 133 is set to 120°C as an example.

[0085] The CPU 91 determines in S43 whether the temperature control of the temperature control unit 130, which was started in S43, has been completed (S45). The CPU 91 waits until the temperature control of the temperature control unit 130 is completed (S45: NO). Once the temperature control of the temperature control unit 130 is completed (S45: YES), the CPU 91 terminates the purge process. From the time the temperature control is completed in S45 until the temperature control is started in S31 of the next purge process, the temperature control unit 130 remains at the temperature it was controlled to in S45.

[0086] Figures 11 to 16 show the results of experiments to determine whether the blockage in the downstream channel 47 is resolved when the type of adhesive Z and the control of the purging operation are changed. The purging operation is performed once a day, at 9:00 AM every day. In each embodiment, the bonding operation is performed after the purging operation. The bonding operation uses adhesive Z from one cartridge 42. The control conditions for the bonding operation will be described later.

[0087] In the "Pressurization Pump Operation" test, it is considered OK if the pump motor 114 drives the gear pump 46 and delivers the adhesive Z, and NG if it fails to deliver the adhesive Z. In the "Downstream Flow Blockage Removal Effect" test, the purging and bonding operations are continued for 6 months, and it is considered OK if there is no blockage in the downstream flow path 47, and NG if there is a blockage in the downstream flow path 47.

[0088] In Figure 11, Examples (1-1) to (1-4) and Comparative Example (1-5) show experimental results for typical usage environments of adhesive Z with typical viscosities. Example (1-1) shows experimental results when only the bonding operation is performed without purging. Examples (1-2) to (1-4) and Comparative Example (1-5) show experimental results when a purging operation is performed in addition to the bonding operation shown in Example (1-1).

[0089] In Example (1-1), the temperature of the downstream channel heater 133 is 120°C. In Example (1-1), the pump motor 114 is driven at 40 revolutions per minute. In Example (1-1), the pressure of the adhesive Z inside the downstream channel 47 is 0.9 MPa. In Example (1-1), the viscosity of the adhesive Z inside the downstream channel 47 is 18000 mPa·s. In the experimental results of Example (1-1), the "pressurized section pump operation" was OK, but the "downstream channel blockage removal effect" was NG.

[0090] In Example (1-2), the temperature of the downstream channel heater 133 is 50°C. In Example (1-2), the pump motor 114 is driven at 5 revolutions per minute. In Example (1-2), the internal pressure of the downstream channel 47 is 9 MPa. In Example (1-2), the viscosity of the adhesive Z inside the downstream channel 47 is 800,000 mPa·s. The experimental results of Example (1-2) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0091] In Example (1-3), the temperature of the downstream channel heater 133 is 80°C. In Example (1-3), the pump motor 114 is driven at 40 revolutions per minute. In Example (1-3), the internal pressure of the downstream channel 47 is 4.5 MPa. In Example (1-3), the viscosity of the adhesive Z inside the downstream channel 47 is 150,000 mPa·s. In the experimental results of Example (1-3), the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0092] In Example (1-4), the temperature of the downstream channel heater 133 is 110°C. In Example (1-4), the pump motor 114 is driven at 40 revolutions per minute. In Example (1-4), the internal pressure of the downstream channel 47 is 1.5 MPa. In Example (1-4), the viscosity of the adhesive Z inside the downstream channel 47 is 30,000 mPa·s. In the experimental results of Example (1-4), the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0093] In Comparative Example (1-5), the temperature of the downstream channel heater 133 is 115°C. In Comparative Example (1-5), the pump motor 114 is driven at 40 revolutions per minute. In Comparative Example (1-5), the internal pressure of the downstream channel 47 is 1.1 MPa. In Comparative Example (1-5), the viscosity of the adhesive Z inside the downstream channel 47 is 20,000 mPa·s. In the experimental results of Comparative Example (1-5), the "pressurized section pump operation" was OK, but the "downstream channel blockage removal effect" was NG.

[0094] Examples (1-1) to (1-4) demonstrate that the bonding device 1 can eliminate clogging in the downstream channel 47 by performing the purging operation with the viscosity of the adhesive Z during the purging operation greater than the viscosity of the adhesive Z during the bonding operation. The ratio of the internal pressure of the downstream channel 47 in Examples (1-2) to (1-4) to the internal pressure of the downstream channel 47 in Example (1-1) is within the range of 1.67 to 10 times. The ratio of the viscosity of the adhesive Z in the downstream channel 47 in Examples (1-2) to (1-4) to the viscosity of the adhesive Z in the downstream channel 47 in Example (1-1) is within the range of 1.67 to 44.4 times.

[0095] In Figure 12, Examples (2-1) to (2-5) and Comparative Example (2-6) show experimental results for adhesive Z with a typical viscosity under different usage environments than those described above. Example (2-1) shows experimental results when only the bonding operation is performed without purging. Examples (2-2) to (2-5) and Comparative Example (2-6) show experimental results when a purging operation is performed in addition to the bonding operation shown in Example (2-1).

[0096] In Example (2-1), the temperature of the downstream channel heater 133 is 140°C. In Example (2-1), the pump motor 114 is driven at 40 revolutions per minute. In Example (2-1), the pressure of the adhesive Z inside the downstream channel 47 is 0.35 MPa. In Example (2-1), the viscosity of the adhesive Z inside the downstream channel 47 is 6500 mPa·s. In the experimental results of Example (2-1), the "pressurized section pump operation" was OK, but the "downstream channel blockage removal effect" was NG.

[0097] In Example (2-2), the temperature of the downstream channel heater 133 is 50°C. In Example (2-2), the pump motor 114 is driven at 5 revolutions per minute. In Example (2-2), the internal pressure of the downstream channel 47 is 9 MPa. In Example (2-2), the viscosity of the adhesive Z inside the downstream channel 47 is 800,000 mPa·s. The experimental results of Example (2-2) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0098] In Example (2-3), the temperature of the downstream channel heater 133 is 80°C. In Example (2-3), the pump motor 114 is driven at 40 revolutions per minute. In Example (2-3), the internal pressure of the downstream channel 47 is 4.5 MPa. In Example (2-3), the viscosity of the adhesive Z inside the downstream channel 47 is 150,000 mPa·s. The experimental results of Example (2-3) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0099] In Example (2-4), the temperature of the downstream channel heater 133 is 110°C. In Example (2-4), the pump motor 114 is driven at 40 revolutions per minute. In Example (2-4), the internal pressure of the downstream channel 47 is 1.5 MPa. In Example (2-4), the viscosity of the adhesive Z inside the downstream channel 47 is 30,000 mPa·s. The experimental results of Example (2-4) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0100] In Example (2-5), the temperature of the downstream channel heater 133 is 130°C. In Example (2-5), the pump motor 114 is driven at 40 revolutions per minute. In Example (2-5), the internal pressure of the downstream channel 47 is 0.49 MPa. In Example (2-5), the viscosity of the adhesive Z inside the downstream channel 47 is 10000 mPa·s. The experimental results of Example (2-5) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0101] In Comparative Example (2-6), the temperature of the downstream channel heater 133 is 135°C. In Comparative Example (2-5), the pump motor 114 is driven at 40 revolutions per minute. In Comparative Example (2-6), the internal pressure of the downstream channel 47 is 0.45 MPa. In Comparative Example (2-6), the viscosity of the adhesive Z inside the downstream channel 47 is 7500 mPa·s. In the experimental results of Comparative Example (2-6), the "pressurized section pump operation" was OK, but the "downstream channel blockage removal effect" was NG.

[0102] Examples (2-1) to (2-5) demonstrate that the bonding device 1 can eliminate clogging in the downstream channel 47 by performing the purging operation with the viscosity of the adhesive Z during the purging operation greater than the viscosity of the adhesive Z during the bonding operation. The ratio of the internal pressure of the downstream channel 47 in Examples (2-2) to (2-5) relative to the internal pressure of the downstream channel 47 in Example (2-1) is in the range of 1.4 to 25.7 times. The ratio of the viscosity of the adhesive Z in the downstream channel 47 in Examples (2-2) to (2-5) relative to the viscosity of the adhesive Z in the downstream channel 47 in Example (2-1) is in the range of 1.54 to 123.1 times.

[0103] In Figure 13, Examples (3-1), (3-3) to (3-5) and Comparative Examples (3-2) and (3-6) show experimental results for typical usage environments of the high-viscosity adhesive Z. Example (3-1) shows the experimental results when only the bonding operation is performed without a purging operation. Examples (3-3) to (3-5) and Comparative Examples (3-2) and (3-6) show the experimental results when a purging operation is performed in addition to the bonding operation shown in Example (3-1).

[0104] In Example (3-1), the temperature of the downstream channel heater 133 is 135°C. In Example (3-1), the pump motor 114 is driven at 40 revolutions per minute. In Example (3-1), the internal pressure of the downstream channel 47 is 1.2 MPa. In Example (3-1), the viscosity of the adhesive Z inside the downstream channel 47 is 27,000 mPa·s. In the experimental results of Example (3-1), the "pressurized section pump operation" was OK, but the "downstream channel blockage removal effect" was NG.

[0105] In Comparative Example (3-2), the temperature of the downstream channel heater 133 is 70°C. In Comparative Example (3-2), the pump motor 114 is driven at 5 revolutions per minute. In Comparative Example (3-2), the internal pressure of the downstream channel 47 is 11 MPa. In Comparative Example (3-2), the viscosity of the adhesive Z inside the downstream channel 47 is 1,100,000 mPa·s. In the experimental results of Comparative Example (3-2), the "pressurized section pump operation" was NG and the "effect of clearing blockages in the downstream channel" was NG.

[0106] In Example (3-3), the temperature of the downstream channel heater 133 is 75°C. In Example (3-3), the pump motor 114 is driven at 5 revolutions per minute. In Example (3-3), the internal pressure of the downstream channel 47 is 9 MPa. In Example (3-3), the viscosity of the adhesive Z inside the downstream channel 47 is 800,000 mPa·s. The experimental results of Example (3-3) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0107] In Example (3-4), the temperature of the downstream channel heater 133 is 100°C. In Example (3-4), the pump motor 114 is driven at 40 revolutions per minute. In Example (3-4), the internal pressure of the downstream channel 47 is 4.5 MPa. In Example (3-4), the viscosity of the adhesive Z inside the downstream channel 47 is 170,000 mPa·s. The experimental results of Example (3-4) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0108] In Example (3-5), the temperature of the downstream channel heater 133 is 125°C. In Example (3-5), the pump motor 114 is driven at 40 revolutions per minute. In Example (3-5), the internal pressure of the downstream channel 47 is 1.8 MPa. In Example (3-5), the viscosity of the adhesive Z inside the downstream channel 47 is 41,000 mPa·s. The experimental results of Example (3-5) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0109] In Comparative Example (3-6), the temperature of the downstream channel heater 133 is 130°C. In Comparative Example (3-6), the pump motor 114 is driven at 40 revolutions per minute. In Comparative Example (3-6), the internal pressure of the downstream channel 47 is 1.5 MPa. In Comparative Example (3-6), the viscosity of the adhesive Z inside the downstream channel 47 is 32000 mPa·s. In the experimental results of Comparative Example (3-6), the "pressurized section pump operation" was OK, but the "effect of clearing blockages in the downstream channel" was NG.

[0110] Examples (3-1), (3-3) to (3-5) demonstrate that the bonding device 1 can eliminate clogging in the downstream channel 47 by performing the purging operation with the viscosity of the adhesive Z during the purging operation greater than the viscosity of the adhesive Z during the bonding operation. The ratio of the internal pressure of the downstream channel 47 in Examples (3-3) to (3-5) to the internal pressure of the downstream channel 47 in Example (3-1) is in the range of 1.5 to 7.5 times. The ratio of the viscosity of the adhesive Z in the downstream channel 47 in Examples (3-3) to (3-5) to the viscosity of the adhesive Z in the downstream channel 47 in Example (3-1) is in the range of 1.52 to 29.6 times.

[0111] In Figure 14, Examples (4-1), (4-3) to (4-5) and Comparative Examples (4-2) and (4-6) show experimental results of high-viscosity adhesive Z under different usage environments than those described above. Example (4-1) shows experimental results when only the bonding operation is performed without purging. Examples (4-3) to (4-5) and Comparative Examples (4-2) and (4-6) show experimental results when a purging operation is performed in addition to the bonding operation shown in Example (4-1).

[0112] In Example (4-1), the temperature of the downstream channel heater 133 is 127°C. In Example (4-1), the pump motor 114 is driven at 5 revolutions per minute. In Example (4-1), the pressure of the adhesive Z inside the downstream channel 47 is 0.2 MPa. In Example (4-1), the viscosity of the adhesive Z inside the downstream channel 47 is 40,000 mPa·s. In the experimental results of Example (4-1), the "pressurized section pump operation" was OK, but the "downstream channel blockage removal effect" was NG.

[0113] In Comparative Example (4-2), the temperature of the downstream channel heater 133 is 70°C. In Comparative Example (4-2), the pump motor 114 is driven at 5 revolutions per minute. In Comparative Example (4-2), the internal pressure of the downstream channel 47 is 11 MPa. In Comparative Example (4-2), the viscosity of the adhesive Z inside the downstream channel 47 is 1,100,000 mPa·s. In the experimental results of Comparative Example (4-2), the "pressurized section pump operation" was NG and the "effect of clearing blockages in the downstream channel" was NG.

[0114] In Example (4-3), the temperature of the downstream channel heater 133 is 75°C. In Example (4-3), the pump motor 114 is driven at 5 revolutions per minute. In Example (4-3), the internal pressure of the downstream channel 47 is 9 MPa. In Example (4-3), the viscosity of the adhesive Z inside the downstream channel 47 is 800,000 mPa·s. The experimental results of Example (4-3) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0115] In Example (4-4), the temperature of the downstream channel heater 133 is 100°C. In Example (4-4), the pump motor 114 is driven at 5 revolutions per minute. In Example (4-4), the internal pressure of the downstream channel 47 is 0.6 MPa. In Example (4-4), the viscosity of the adhesive Z inside the downstream channel 47 is 170,000 mPa·s. The experimental results of Example (4-4) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0116] In Example (4-5), the temperature of the downstream channel heater 133 is 125°C. In Example (4-5), the pump motor 114 is driven at 5 revolutions per minute. In Example (4-5), the internal pressure of the downstream channel 47 is 0.3 MPa. In Example (4-5), the viscosity of the adhesive Z inside the downstream channel 47 is 41000 mPa·s. The experimental results of Example (4-5) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0117] In Comparative Example (4-6), the temperature of the downstream channel heater 133 is 130°C. In Comparative Example (4-6), the pump motor 114 is driven at 5 revolutions per minute. In Comparative Example (4-6), the internal pressure of the downstream channel 47 is 0.15 MPa. In Comparative Example (4-6), the viscosity of the adhesive Z inside the downstream channel 47 is 32000 mPa·s. In the experimental results of Comparative Example (4-6), the "pressurized section pump operation" was OK, but the "downstream channel blockage removal effect" was NG.

[0118] Examples (4-1), (4-3) to (4-5) demonstrate that the bonding device 1 can eliminate clogging in the downstream channel 47 by performing the purging operation with the viscosity of the adhesive Z during the purging operation greater than the viscosity of the adhesive Z during the bonding operation. The ratio of the internal pressure of the downstream channel 47 in Examples (4-3) to (4-5) relative to the internal pressure of the downstream channel 47 in Example (4-1) is within the range of 1.5 to 45 times. The ratio of the viscosity of the adhesive Z in the downstream channel 47 in Examples (4-3) to (4-5) relative to the viscosity of the adhesive Z in the downstream channel 47 in Example (4-1) is within the range of 1.5 to 20 times.

[0119] In Figure 15, Examples (5-1) to (5-4) and Comparative Example (5-5) show the experimental results for low-viscosity adhesive Z. Example (5-1) shows the experimental results when only the bonding operation is performed, without the purging operation. Examples (5-2) to (5-4) and Comparative Example (5-5) show the experimental results when the purging operation is performed in addition to the bonding operation shown in Example (5-1).

[0120] In Example (5-1), the temperature of the downstream channel heater 133 is 90°C. In Example (5-1), the pump motor 114 is driven at 40 revolutions per minute. In Example (5-1), the internal pressure of the downstream channel 47 is 1 MPa. In Example (5-1), the viscosity of the adhesive Z inside the downstream channel 47 is 19000 mPa·s. In the experimental results of Example (5-1), the "pressurized section pump operation" was OK, but the "downstream channel blockage removal effect" was NG.

[0121] In Example (5-2), the temperature of the downstream channel heater 133 is 50°C. In Example (5-2), the pump motor 114 is driven at 40 revolutions per minute. In Example (5-2), the internal pressure of the downstream channel 47 is 4.5 MPa. In Example (5-2), the viscosity of the adhesive Z inside the downstream channel 47 is 160,000 mPa·s. The experimental results of Example (5-2) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0122] In Example (5-3), the temperature of the downstream channel heater 133 is 70°C. In Example (5-3), the pump motor 114 is driven at 40 revolutions per minute. In Example (5-3), the internal pressure of the downstream channel 47 is 2.5 MPa. In Example (5-3), the viscosity of the adhesive Z inside the downstream channel 47 is 55,000 mPa·s. The experimental results of Example (5-3) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0123] In Example (5-4), the temperature of the downstream channel heater 133 is 80°C. In Example (5-4), the pump motor 114 is driven at 40 revolutions per minute. In Example (5-4), the internal pressure of the downstream channel 47 is 1.5 MPa. In Example (5-4), the viscosity of the adhesive Z inside the downstream channel 47 is 31,000 mPa·s. The experimental results of Example (5-4) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0124] In Comparative Example (5-5), the temperature of the downstream channel heater 133 is 85°C. In Comparative Example (5-5), the pump motor 114 is driven at 40 revolutions per minute. In Comparative Example (5-5), the internal pressure of the downstream channel 47 is 1.3 MPa. In Comparative Example (5-5), the viscosity of the adhesive Z inside the downstream channel 47 is 23,000 mPa·s. In the experimental results of Comparative Example (5-5), the "pressurized section pump operation" was OK, but the "effect of clearing blockages in the downstream channel" was NG.

[0125] Examples (5-1) to (5-4) demonstrate that the bonding device 1 can eliminate clogging in the downstream channel 47 by performing the purging operation with the viscosity of the adhesive Z during the purging operation greater than the viscosity of the adhesive Z during the bonding operation. The ratio of the internal pressure of the downstream channel 47 in Examples (5-2) to (5-4) to the internal pressure of the downstream channel 47 in Example (5-1) is within the range of 1.5 to 4.5 times. The ratio of the viscosity of the adhesive Z in the downstream channel 47 in Examples (5-2) to (5-4) to the viscosity of the adhesive Z in the downstream channel 47 in Example (5-1) is within the range of 1.63 to 8.4 times.

[0126] In Figure 16, Examples (6-1) to (6-5) and Comparative Example (6-6) show experimental results of low-viscosity adhesive Z under different usage environments than those described above. Example (6-1) shows experimental results when only the bonding operation is performed without purging. Examples (6-2) to (6-5) and Comparative Example (6-6) show experimental results when a purging operation is performed in addition to the bonding operation shown in Example (6-1).

[0127] In Example (6-1), the temperature of the downstream channel heater 133 is 120°C. In Example (6-1), the pump motor 114 is driven at 40 revolutions per minute. In Example (6-1), the pressure of the adhesive Z inside the downstream channel 47 is 0.2 MPa. In Example (6-1), the viscosity of the adhesive Z inside the downstream channel 47 is 3000 mPa·s. In the experimental results of Example (6-1), the "pressurized section pump operation" was OK, but the "downstream channel blockage removal effect" was NG.

[0128] In Example (6-2), the temperature of the downstream channel heater 133 is 50°C. In Example (6-2), the pump motor 114 is driven at 40 revolutions per minute. In Example (6-2), the internal pressure of the downstream channel 47 is 4.5 MPa. In Example (6-2), the viscosity of the adhesive Z inside the downstream channel 47 is 160,000 mPa·s. The experimental results of Example (6-2) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0129] In Example (6-3), the temperature of the downstream channel heater 133 is 70°C. In Example (6-3), the pump motor 114 is driven at 40 revolutions per minute. In Example (6-3), the internal pressure of the downstream channel 47 is 2.5 MPa. In Example (6-3), the viscosity of the adhesive Z inside the downstream channel 47 is 55,000 mPa·s. The experimental results of Example (6-3) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0130] In Example (6-4), the temperature of the downstream channel heater 133 is 90°C. In Example (6-4), the pump motor 114 is driven at 40 revolutions per minute. In Example (6-4), the internal pressure of the downstream channel 47 is 0.9 MPa. In Example (6-4), the viscosity of the adhesive Z inside the downstream channel 47 is 18000 mPa·s. The experimental results of Example (6-4) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0131] In Example (6-5), the temperature of the downstream channel heater 133 is 113°C. In Example (6-5), the pump motor 114 is driven at 40 revolutions per minute. In Example (6-5), the internal pressure of the downstream channel 47 is 0.3 MPa. In Example (6-5), the viscosity of the adhesive Z inside the downstream channel 47 is 4500 mPa·s. The experimental results of Example (6-5) showed that the "pressurized section pump operation" was OK and the "downstream channel blockage removal effect" was OK.

[0132] In Comparative Example (6-6), the temperature of the downstream channel heater 133 is 118°C. In Comparative Example (6-6), the pump motor 114 is driven at 40 revolutions per minute. In Comparative Example (6-6), the internal pressure of the downstream channel 47 is 0.25 MPa. In Comparative Example (6-6), the viscosity of the adhesive Z inside the downstream channel 47 is 3500 mPa·s. In the experimental results of Comparative Example (6-6), the "pressurized section pump operation" was OK, but the "effect of clearing blockages in the downstream channel" was NG.

[0133] Examples (6-1) to (6-5) demonstrate that the bonding device 1 can eliminate clogging in the downstream channel 47 by performing the purging operation with the viscosity of the adhesive Z during the purging operation greater than the viscosity of the adhesive Z during the bonding operation. The ratio of the internal pressure of the downstream channel 47 in Examples (6-2) to (6-5) relative to the internal pressure of the downstream channel 47 in Example (6-1) is within the range of 1.5 to 22.5 times. The ratio of the viscosity of the adhesive Z in the downstream channel 47 in Examples (6-2) to (6-5) relative to the viscosity of the adhesive Z in the downstream channel 47 in Example (6-1) is within the range of 1.5 to 53.3 times.

[0134] As described above, the bonding apparatus 1 comprises a nozzle 11, a supply mechanism 40, a transport mechanism 20, and a CPU 91. The supply mechanism 40 has a pressurizing unit 45, a downstream channel 47, and a temperature control unit 130. In the embodiment shown in Figure 11 as an example of the present invention, when the CPU 91 performs a bonding operation, it sets the temperature of the downstream channel heater 133 of the temperature control unit 130 to 120°C. The CPU 91 uses the pressurizing unit 45 to set the viscosity of the adhesive Z inside the downstream channel 47 to 18,000 mPa·s. When the CPU 91 performs a purging operation, it sets the temperature of the downstream channel heater 133 to 80°C. The CPU 91 uses the pressurizing unit 45 to set the viscosity of the adhesive Z inside the downstream channel 47 to 150,000 mPa·s. The ratio of the viscosity of the adhesive Z inside the downstream channel 47 during the purging operation to the viscosity of the adhesive Z inside the downstream channel 47 during the bonding operation is 1.5 or more and 123.1 or less. According to the bonding device 1, the viscosity of the adhesive Z during the purging operation is higher than the viscosity of the adhesive Z during the bonding operation, within the range that can be discharged from the nozzle 11. Therefore, during the purging operation, the adhesive Z is more easily discharged from the nozzle 11 while entrained with the reactants. Thus, the bonding device 1 can effectively discharge the reactants to the outside of the bonding device 1 during the purging operation.

[0135] In the bonding apparatus 1, the viscosity of the adhesive Z inside the downstream channel 47 during the bonding operation is 3,000 mPa·s or more and 40,000 mPa·s or less. During the purging operation, the viscosity of the adhesive Z inside the downstream channel 47 is 4,500 mPa·s or more and 800,000 mPa·s or less. According to the bonding apparatus 1, the adhesive Z is more easily discharged from the nozzle 11 while entrained with the reactants during the purging operation. Therefore, the bonding apparatus 1 can effectively discharge the reactants to the outside of the bonding apparatus 1 during the purging operation.

[0136] In the bonding apparatus 1, the CPU 91 controls the viscosity of the adhesive Z inside the downstream channel 47 using the temperature control unit 130 and the pressurization unit 45. In the embodiment shown in Figure 11 as an example of the present invention, when the CPU 91 performs a bonding operation, the internal pressure of the downstream channel 47 is set to 0.9 MPa. When the CPU 91 performs a purging operation, the internal pressure of the downstream channel 47 is set to 4.5 MPa. The ratio of the internal pressure of the downstream channel 47 during the purging operation to the internal pressure of the downstream channel 47 during the bonding operation is between 1.4 and 45. According to the bonding apparatus 1, the pressure in the channel during the purging operation is higher than the pressure in the channel during the bonding operation, within the range that can be discharged from the nozzle 11. Therefore, the adhesive Z is more easily discharged from the nozzle 11 with the reactants entrained during the purging operation. Thus, the bonding apparatus 1 can effectively discharge the reactants to the outside of the bonding apparatus 1 during the purging operation.

[0137] In the bonding apparatus 1, the internal pressure of the downstream channel 47 during bonding is between 0.2 MPa and 1.2 MPa. During purging, the internal pressure of the downstream channel 47 is between 0.3 MPa and 9 MPa. According to the bonding apparatus 1, the adhesive Z is more easily discharged from the nozzle 11 with the reactants entrained during purging. Therefore, the bonding apparatus 1 can effectively discharge the reactants to the outside of the bonding apparatus 1 during purging.

[0138] In the bonding apparatus 1, the supply mechanism 40 has a tank section 41. The tank section 41 stores adhesive Z by mounting a cartridge 42. The temperature control section 130 includes a downstream channel heater 133 and a tank heater 131. As an example of the present invention, during bonding operation, the CPU 91 sets the temperature of the downstream channel heater 133 to 120°C and the temperature of the tank heater 131 to 90°C. During purging operation, the CPU 91 sets the temperature of the downstream channel heater 133 to 80°C and the temperature of the tank heater 131 to 90°C. According to the bonding apparatus 1, during bonding operation, the temperature of the adhesive Z inside the downstream channel 47 is higher than the temperature of the adhesive Z inside the tank section 41. Therefore, the bonding apparatus 1 can efficiently discharge adhesive Z from the nozzle 11 during bonding operation. In the bonding apparatus 1, during purging operation, the temperature of the adhesive Z inside the downstream channel 47 is lower than the temperature of the adhesive Z inside the downstream channel 47 during bonding operation. Therefore, the viscosity of adhesive Z during the purging operation is higher than the viscosity of adhesive Z during the bonding operation. Consequently, adhesive Z is more easily discharged from the nozzle 11 with the reactants entrained during the purging operation. Thus, the bonding device 1 can effectively discharge the reactants to the outside of the bonding device 1 during the purging operation.

[0139] In the bonding apparatus 1, the temperature of the tank heater 131 during the bonding operation is the same as the temperature of the tank heater 131 during the bonding operation. The bonding apparatus 1 can effectively and easily discharge the reactants to the outside of the bonding apparatus 1 during the purging operation.

[0140] In the bonding apparatus 1, the temperature control unit 130 includes a pressurizing heater 132. As an example of the present invention, the CPU 91 sets the temperature of the pressurizing heater 132 to 110°C during bonding. The CPU 91 sets the temperature of the pressurizing heater 132 to 100°C during purging. According to the bonding apparatus 1, during bonding, the temperature of the adhesive Z inside the pressurizing unit 45 is lower than the temperature of the adhesive Z inside the downstream channel 47. Therefore, the bonding apparatus 1 reduces the time the adhesive is exposed to a high-temperature environment during bonding, thereby reducing the deterioration of the adhesive due to reaction. In the purging operation of the bonding apparatus 1, the temperature of the adhesive Z in the pressurizing unit 45 is lower than the temperature of the adhesive Z in the pressurizing unit 45 during bonding and higher than the temperature of the adhesive Z in the downstream channel 47 during purging. Therefore, in the purging operation of the bonding apparatus 1, the viscosity of the adhesive in the pressurizing unit is reduced, the load on the pressurizing unit can be reduced, and the adhesive Z can be efficiently discharged from the nozzle 11. Furthermore, the time the adhesive is exposed to high-temperature environments is reduced, thereby minimizing deterioration of the adhesive due to reactions. Therefore, the bonding device 1 can efficiently dispense the adhesive Z while reducing deterioration during bonding and purging operations.

[0141] The present invention can be modified in various ways from the above embodiments. The various modifications described below can be combined in any way as long as they do not create contradictions. In the following description, components that have functions common to the above embodiments are denoted by the same reference numerals and their descriptions are omitted, while different components are described.

[0142] The lower conveying mechanism 50 does not necessarily have to include a nozzle lower roller 65. In this case, the gap adjustment section 77 may move the plate 59 supporting the lower sheet 8 in the vertical direction.

[0143] The configuration of the conveying mechanism 20 may be changed as appropriate. The lower conveying mechanism 50 may be equipped with a belt instead of the lower conveying roller 64. The lower conveying mechanism 50 may be equipped with a belt instead of the nozzle lower roller 65. The belt supports the lower sheet 8 from below and conveys the lower sheet 8 downward. The lower conveying mechanism 50 does not need to be equipped with a lower conveying motor 63. In this case, the lower conveying roller 64 rotates in accordance with the rotation of the upper conveying roller 12. The nozzle lower roller 65 does not need to rotate due to the drive of the lower conveying motor 63. The CPU 91 may control the rotation of the lower conveying roller 64 and the nozzle lower roller 65, respectively.

[0144] The upper conveying mechanism 70 may be equipped with a belt instead of the upper conveying roller 12. The belt sandwiches the lower sheet 8 and the upper sheet 6 between itself and the lower conveying roller 64, and conveys the upper sheet 6 downward. The upper conveying mechanism 70 does not need to be equipped with an upper conveying motor 112. In this case, the upper conveying roller 12 rotates in accordance with the rotation of the lower conveying roller 64.

[0145] The bonding device 1 does not necessarily have to include the lower clamping mechanism 80. The configuration of the lower clamping mechanism 80 may be changed as appropriate. The lower clamping mechanism 80 may include a belt instead of the lower clamping roller 76. The belt clamps the lower sheet 8 between itself and the lower surface 317 of the upper support portion 314, moving the lower sheet 8 in the left-right direction. The lower clamping roller 76 does not necessarily have to clamp the lower sheet 8 between itself and the lower surface 317.

[0146] The bonding device 1 does not necessarily have to include the upper clamping mechanism 30. The configuration of the upper clamping mechanism 30 may be changed as appropriate. The upper clamping mechanism 30 may include a belt instead of the upper clamping roller 32. The belt clamps the upper sheet 6 between itself and the upper surface 315 of the upper support portion 314, and conveys the upper sheet 6 in the left-right direction. The upper clamping roller 32 does not necessarily have to clamp the upper sheet 6 between itself and the upper surface 315. The upper clamping roller 32 does not necessarily have to be aligned vertically with the lower clamping roller 76.

[0147] The configuration of the supply mechanism 40 may be changed as appropriate. The supply mechanism 40 may supply adhesive Z to the nozzle 11 by driving a screw pump instead of a gear pump 46. The supply mechanism 40 may supply adhesive Z to the nozzle 11 by driving a piston pump instead of a gear pump 46.

[0148] The arrangement of the pressure sensors 49 may be changed as appropriate. The pressure sensors 49 may be placed, for example, on the nozzle 11. The number of pressure sensors 49 may be changed as appropriate. The supply mechanism 40 may include a second pressure sensor for detecting the pressure of the adhesive Z inside the upstream flow path 44.

[0149] The ratio of the viscosity of the adhesive Z in the downstream channel 47 during the purging operation to the viscosity of the adhesive Z in the downstream channel 47 during the bonding operation may be appropriately changed within the range of 1.5 to 123.1. Within that range, the viscosity of the adhesive Z in the downstream channel 47 during the bonding operation may be less than 3000 mPa·s or greater than 40000 mPa·s. Similarly, the viscosity of the adhesive Z in the downstream channel 47 during the purging operation may be less than 4500 mPa·s or greater than 800000 mPa·s.

[0150] The ratio of the internal pressure of the downstream channel 47 during the purging operation to the internal pressure of the downstream channel 47 during the bonding operation may be appropriately changed within the range of 1.4 to 45. Within that range, the internal pressure of the adhesive Z in the downstream channel 47 during the bonding operation may be less than 0.2 MPa or greater than 1.2 MPa. Similarly, the internal pressure of the downstream channel 47 during the purging operation may be less than 0.3 MPa or greater than 9 MPa.

[0151] The temperature control unit 130 does not necessarily include the tank heater 131. The temperature control unit 130 does not necessarily include the pressurizing unit heater 132. The temperature control unit 130 may include a heater that adjusts the adhesive Z inside the upstream flow path 44.

[0152] In the above embodiment, the temperature of the adhesive Z contained in the tank section 41 is equal to the temperature of the tank heater 131. The temperature of the adhesive Z inside the pressurizing section 45 is equal to the temperature of the pressurizing section heater 132. The temperature of the adhesive Z inside the downstream flow path 47 is equal to the temperature of the downstream flow path heater 133. Therefore, the temperature of the adhesive Z was treated as the temperature of the temperature control section 130. In contrast, even if the temperature of the adhesive Z and the temperature of the temperature control section 130 are not the same, if there is a correlation between the temperature of the adhesive Z and the temperature of the temperature control section 130, the temperature of the adhesive Z may be controlled based on that correlation.

[0153] The supply mechanism 40 may include a first temperature sensor for detecting the temperature of the adhesive Z contained in the cartridge 42. The CPU 91 may control the tank heater 131 based on the temperature of the adhesive Z detected by the first temperature sensor. The supply mechanism 40 may include a second temperature sensor for detecting the temperature of the adhesive Z inside the pressurizing section 45. The CPU 91 may control the pressurizing section heater 132 based on the temperature of the adhesive Z detected by the second temperature sensor. The supply mechanism 40 may include a third temperature sensor for detecting the temperature of the adhesive Z inside the downstream channel 47. The CPU 91 may control the downstream channel heater 133 based on the temperature of the adhesive Z detected by the third temperature sensor.

[0154] The temperatures of the tank heater 131, pressurized section heater 132, and downstream channel heater 133 during the bonding operation may be changed as appropriate. During the bonding operation, the temperature of the tank heater 131 may be the same as or higher than the temperature of the downstream channel heater 133. During the purging operation, the temperature of the tank heater 131 may be the same as or higher than the temperature of the downstream channel heater 133 during the bonding operation. The temperature of the tank heater 131 during the bonding operation and the temperature of the tank heater 131 during the purging operation may be different.

[0155] In the bonding operation, the temperature of the pressurized heater 132 may be greater than or equal to the temperature of the downstream channel heater 133. In the bonding operation, the temperature of the pressurized heater 132 may be less than the temperature of the downstream channel heater 133. In the purging operation, the temperature of the pressurized heater 132 may be less than or equal to the temperature of the downstream channel heater 133. In the purging operation, the temperature of the pressurized heater 132 may be greater than or equal to the temperature of the pressurized heater 132 in the bonding operation.

[0156] The bonding device 1 does not necessarily have to include a nozzle valve 181 for opening and closing the downstream flow path 47. The nozzle valve 181 may open and close the downstream flow path 47 by driving an electric cylinder instead of an air cylinder 29. The bonding device 1 may further include a nozzle valve for opening and closing the upstream flow path 44.

[0157] The bonding program for performing the bonding process and the purging program for performing the purging process only need to be stored in the storage device 94 until the CPU 91 executes the programs. Therefore, the method of acquiring the programs, the acquisition path, and the devices that store the programs may be changed as appropriate. The programs may be received from other devices via cables or wireless communication. Other storage devices, such as non-volatile memory, may store the programs. Other storage devices include, for example, servers connected via a network.

[0158] The bonding and purging steps are not limited to those performed by the CPU 91. Some or all of the bonding and purging steps may be performed by other electronic devices, such as ASICs. Each step may be distributed among multiple electronic devices. The order of the steps can be changed, steps can be omitted, and steps can be added as needed. The present invention also includes a configuration in which an operating system (OS) or the like running on the control device 90 performs some or all of the processing in response to instructions from the CPU 91.

[0159] The lower transport mechanism 50 is an example of the "lower transport section" of the present invention. The upper transport mechanism 70 is an example of the "upper transport section" of the present invention. The forward and backward direction is an example of the "transport direction" of the present invention. The CPU 91 is an example of the "control section" of the present invention. The downstream flow path 47 is an example of the "flow path" of the present invention. The temperature of the downstream flow path heater 133 during the bonding operation is an example of the "first temperature" of the present invention. The internal pressure of the downstream flow path 47 during the bonding operation is an example of the "first pressure" of the present invention. The purging operation is an example of the "forced pressurized discharge operation" of the present invention. The temperature of the downstream flow path heater 133 during the purging operation is an example of the "second temperature" of the present invention. The internal pressure of the downstream flow path 47 during the purging operation is an example of the "second pressure" of the present invention. The viscosity of the adhesive Z inside the downstream flow path 47 during the bonding operation is an example of the "first value" of the present invention. The viscosity of the adhesive Z inside the downstream flow path 47 during the purging operation is an example of the "second value" of the present invention. The downstream flow path heater 133 is an example of the "first heater" of the present invention. The tank heater 131 is an example of the "second heater" of the present invention. The temperature of the tank heater 131 during the bonding operation is an example of the "third temperature" of the present invention. The temperature of the tank heater 131 during the purging operation is an example of the "fourth temperature" of the present invention. The pressurizing heater 132 is an example of the "third heater" of the present invention. The temperature of the pressurizing heater 132 during the bonding operation is an example of the "fifth temperature" of the present invention. The temperature of the pressurizing heater 132 during the purging operation is an example of the "sixth temperature" of the present invention. [Explanation of symbols]

[0160] 1 Gluing device 11 nozzles 20 Conveying mechanism 40 Supply mechanism 41 Tank section 45 Pressurized section 47 Downstream channel 91 CPU 130 Temperature control section 131 Tank Heater 132 Pressurized section heater 133 Downstream channel heater

Claims

1. A nozzle for dispensing adhesive, A supply mechanism for supplying the adhesive to the nozzle, A conveying mechanism comprising a lower conveying section that supports the lower sheet, and an upper conveying section that sandwiches the lower sheet and the upper sheet between the lower conveying section and the upper conveying section, wherein the lower conveying section and the upper conveying section cooperate to sandwich and convey the lower sheet and the upper sheet downstream of the nozzle in the conveying direction, A control unit that performs an bonding operation, which involves bonding the upper sheet and the lower sheet together while transporting them downstream in the transport direction with the adhesive discharged by the nozzle in between. In an adhesive device equipped with, The aforementioned supply mechanism is A pressurizing unit for dispensing the adhesive through the nozzle, The flow path of the adhesive from the pressurizing section to the nozzle, the flow path being pressurized inside by the pressurizing section, A temperature control unit capable of adjusting the temperature of the adhesive within the bonding device It has, The control unit, When performing the bonding operation, the temperature control unit and the pressurizing unit are controlled to bring the adhesive in the flow path to a first temperature and to make the viscosity of the adhesive a first value. When performing a forced pressurized discharge operation to forcibly discharge the adhesive remaining in the flow path, the temperature control unit and the pressurizing unit are controlled to bring the adhesive in the flow path to a second temperature so that the viscosity of the adhesive becomes a second value. An adhesive device characterized in that the ratio of the second value to the first value is 1.5 or more and 123.1 or less.

2. The first value is 3000 mPa·s or more and 40000 mPa·s or less. The second value is between 4,500 mPa·s and 800,000 mPa·s. The bonding apparatus according to feature 1.

3. The control unit, When performing the bonding operation, the temperature control unit and the pressurizing unit are controlled to raise the adhesive in the flow path to the first temperature and the pressure in the flow path to the first pressure; When performing the forced pressurized discharge operation, the temperature control unit and the pressurizing unit are controlled to raise the adhesive in the flow path to the second temperature and the pressure in the flow path to the second pressure; The ratio of the second pressure to the first pressure is 1.4 or more and 45 or less. The bonding apparatus according to claim 1, characterized by the following:

4. The first pressure is 0.2 MPa or more and 1.2 MPa or less. The second pressure is between 0.3 MPa and 9 MPa. The bonding apparatus according to claim 3, characterized by the following:

5. The supply mechanism has a tank section for storing the adhesive, The temperature control unit includes a first heater for heating the adhesive in the flow path and a second heater for heating the adhesive in the tank section. The control unit, When performing the bonding operation, the temperature control unit sets the temperature of the adhesive in the flow path to the first temperature and the temperature of the adhesive in the tank to a third temperature lower than the first temperature. The bonding apparatus according to claim 1, characterized in that when the forced pressurized discharge operation is performed, the temperature control unit sets the temperature of the adhesive in the flow path to a second temperature lower than the first temperature, and the temperature of the adhesive in the tank to a fourth temperature lower than the first temperature.

6. The bonding apparatus according to claim 5, characterized in that the third temperature and the fourth temperature are the same temperature.

7. The temperature control unit further comprises a third heater for heating the adhesive in the pressurized unit, and the control unit is When performing the bonding operation, the temperature control unit sets the temperature of the adhesive in the pressurized section to a fifth temperature lower than the first temperature. The bonding apparatus according to claim 5, characterized in that when the forced pressurization discharge operation is performed, the temperature control unit sets the temperature of the adhesive in the pressurization unit to a sixth temperature that is lower than or equal to the fifth temperature and higher than the second temperature.

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