Circuit boards, functional component modules, and electronic devices

Abstract

This provides a functional component module with an adjustable distance from the circuit board. [Solution] The present invention relates to a circuit board, a functional component module, and an electronic device. The circuit board includes a substrate and support components. Support components suitable for mounting functional components include a base plate and a plurality of elastic elements, the elastic elements being placed between the base plate and the substrate to provide support force to the base plate.

Description

Technical Field

[0001] The present invention relates to a circuit board, a functional component module, and an electronic device, and particularly relates to a versatile circuit board, a functional component module, and an electronic device.

Background Art

[0002] In the prior art, for a heat dissipation device of a Solid State Drive (SSD) module, a separate base plate is usually used to improve the heat conduction effect, and a heat conductive adhesive is generally applied between the base plate and the SSD module to increase the physical contact area so as to achieve a good heat conduction effect.

[0003] However, not only is the overall dimension limited by the selection of the product (e.g., the SSD module), but when the design of the SSD module product is a double-sided (front side + back side) mounting specification, it is necessary to adjust the thickness dimensions of the heat conductive adhesive and / or the base plate to achieve good contact and further achieve the expected heat conduction effect. At the same time, when changing to the design of an SSD module product of a single-sided (front side) mounting specification, it is necessary to adjust the thickness of the heat conductive adhesive or the base plate again.

[0004] Therefore, the above-mentioned prior art has the following problems.

[0005] First, the design of the heat dissipation base plate is easily restricted by the design of the SSD module product, and it is necessary to use base plates and heat conductive adhesives of different thickness dimensions for different SSD modules.

[0006] Second, when replacing the SSD module, it is necessary to check whether the thickness dimensions of the used base plate and heat conductive adhesive can ensure a good contact area. If the dimensions do not match and the contact area becomes poor, it is necessary to separately replace them with a suitable base plate and heat conductive adhesive, which not only increases the risk of disassembly and component replacement, but also easily causes the risk of damage caused by screw attachment and detachment during the disassembly process. [Overview of the project] [Problems that the invention aims to solve]

[0007] The present invention provides a circuit board that can adapt to the thickness and weight of different functional component modules installed thereon.

[0008] The present invention provides a functional component module whose distance from the circuit board can be adjusted.

[0009] The present invention provides a versatile electronic device. [Means for solving the problem]

[0010] The circuit board of the present invention includes a substrate and support components. The support components, suitable for mounting functional components, include a base plate and a plurality of elastic elements, the elastic elements being placed between the base plate and the substrate to provide support force to the base plate.

[0011] The functional component module of the present invention includes a functional component and a support component on which the functional component is mounted. The support component includes a base plate and a plurality of elastic elements, the elastic elements being installed on the side of the base plate that is relatively away from the functional component.

[0012] The electronic device of the present invention includes a circuit board, functional components, and support components. The circuit board includes a substrate, the functional components are mounted on the substrate, and the support components on which the functional components are mounted include a base plate and an elastic element, the elastic element being mounted between the base plate and the substrate.

[0013] In one embodiment of the present invention, the aforementioned support component further includes a plurality of guide columns, the guide columns are mounted on the surface of one of the substrate and base plate facing the other, and the guide columns are located in the corresponding elastic element.

[0014] In one embodiment of the present invention, each of the aforementioned elastic elements has a positioning hole, and the guide column is suitable for being positioned in the corresponding positioning hole.

[0015] In one embodiment of the present invention, when the aforementioned guide column is installed on the surface of the base plate facing the substrate, the substrate further has a plurality of through holes for inserting the guide column.

[0016] In one embodiment of the present invention, the aforementioned elastic element is a sponge.

[0017] In one embodiment of the present invention, the hardness range of the elastic element is 10 to 30 degrees.

[0018] In one embodiment of the present invention, the tensile strength range of the aforementioned elastic element is 0.25 to 0.4 MPa.

[0019] In one embodiment of the present invention, the density range of the elastic element is 0.1 to 0.2 g / cm³. 3 That is the case.

[0020] In one embodiment of the present invention, multiple electronic components are installed on one side of the aforementioned functional component, or multiple electronic components are installed on opposite sides of the functional component.

[0021] In one embodiment of the present invention, the aforementioned electronic device further includes a heat dissipation element installed on a side relatively away from the base plate of the functional component.

[0022] In one embodiment of the present invention, the aforementioned electronic device further includes a heat transfer pad installed between a functional component and a heat dissipation element. [Effects of the Invention]

[0023] Based on the above, by installing support components, the circuit board can adapt to functional components of different thicknesses and weights that are installed on it, and the distance between the functional components and the circuit board can be adjusted steplessly. This gives the electronic device the convenience of being able to universally accommodate functional components of different thicknesses and weights. [Brief explanation of the drawing]

[0024] [Figure 1A] This is a schematic exploded view of an electronic device. [Figure 1B] This is a schematic assembled view of Figure 1A. [Figure 2A] This is a schematic view of the support component in Figure 1. [Figure 2B] This is a schematic view of Figure 2A from another viewing angle. [Figure 3A] This is a schematic view of the support component assembled onto the substrate in advance. [Figure 3B] This is a schematic view of the support component assembled with the functional component in advance to form a functional component module. [Figure 4] This is a schematic exploded view of a circuit board according to the second embodiment of the present invention. [Figure 5] This is a schematic view of the guide post protruding from the bottom surface of the substrate. [Mode for Carrying Out the Invention]

[0025] Figure 1A is a schematic exploded view of an electronic device, and Figure 1B is a schematic assembled view of Figure 1A. Figure 2A is a schematic view of the support component in Figure 1, and Figure 2B is a schematic view of Figure 2A from another viewing angle.

[0026] First, referring to Figure 1A and Figure 1B together, the electronic device 100 of the present embodiment may be a computer or a server, and the electronic device 100 at least includes a circuit board 110, a functional component 120, and a support component 130.

[0027] Next, referring to Figure 1A, Figure 2A and Figure 2B simultaneously.

[0028] The circuit board 110 includes a substrate 112. The functional component 120 is mounted on the substrate 112.

[0029] Furthermore, while the functional component 120 in this embodiment is an SSD module, it is not limited to this. Specifically, the functional component 120 may be one of two types of SSD modules, one of which is an SSD module with multiple electronic components mounted on one side (i.e., single-sided mounting), and the other is an SSD module with multiple electronic components mounted on both opposing sides (i.e., double-sided mounting). The user selects the appropriate SSD module according to their actual needs and mounts it on the support component 130.

[0030] The support component 130 is for supporting the functional component 120, and includes a base plate 132 and an elastic element 134 installed between the base plate 132 and the substrate 112. The elastic element 134 installed between the base plate 132 and the substrate 112 is used to support the base plate 132 and the functional component 120 placed on the base plate 132.

[0031] In this embodiment, the elastic element 134 can be made of sponge, foam, or the like, and the elastic element 134 can be installed between the base plate 132 and the substrate 112 by adhesive bonding. The advantage of selecting sponge as the elastic element 134 and fixing it to the base plate 132 and / or substrate 112 by adhesive bonding is that the position of the elastic element 134 corresponding to the base plate 132 or substrate 112 is less restricted, providing a greater degree of choice.

[0032] Specifically, if a conventional elastic element 134 is selected as a spring, the spring needs to be positioned on the base plate 132 or substrate 112 by fastening. Therefore, it is necessary to form an opening in the base plate 132 or substrate 112 that corresponds to the fastening. Consequently, the installation position of the elastic element 134, which is a spring in the conventional technology, is fixed and cannot be arbitrarily determined by the user.

[0033] In contrast, in the present invention, a sponge is selected as the elastic element 134, and the elastic element 134 is fixed to the base plate 132 and / or substrate 112 by an adhesive method. Therefore, even if the elastic element 134 is removed in order to replace different functional components 120, the elastic element 134 can be reattached to the required corresponding location on the substrate 112 or base plate 132 as needed.

[0034] The physical properties of the aforementioned elastic element 134 can, but are not limited to, the following conditions: a hardness range of 10 to 30 degrees, a tensile strength range of 0.25 to 0.4 MPa, and a density range of 0.1 to 0.2 g / cm³. 3 The elastic element 134, which conforms to the aforementioned physical characteristic range, has sufficient strength to support the base plate 132 and the functional component 120 placed on the base plate 132, and at the same time has sufficient deformability to compress according to the weight of the component placed above it. Therefore, the distance of the functional component 120 from the substrate 112 can be adjusted steplessly by the deformation of the elastic element 134, and functional components 120 of different specifications can be applied to the electronic device 100 of this embodiment.

[0035] Furthermore, the support component 130 further includes a plurality of guide columns 136. In this embodiment, the elastic element 134 and the guide columns 136 are installed together on the surface of the substrate 112 facing the base plate 132. Each elastic element 134 has a positioning hole 134a, and the guide columns 136 are positioned within the positioning holes 134a of the corresponding elastic element 134. The combination of the guide columns 136 and the positioning holes 134a prevents displacement of the elastic element 134 during installation. In this embodiment, the thickness T of the elastic element 134 is greater than the height H of the guide column 136. The installation of the guide columns 136 maintains a minimum distance (i.e., the height H of the guide column 136) between the base plate 132 and the substrate 112, preventing excessive compression of the elastic element 134 from causing the base plate 132 to collide with the substrate 112 or with electronic components installed on the substrate 112 and close to the base plate 132.

[0036] To explain in more detail, if the pressure applied to the elastic element 134 by excessive biasing force from the user of a component mounted on the base plate 132 becomes excessive, the elastic element 134 may be excessively compressed. In this case, the height H of the guide column 136, which does not have deformation capability, is greater than the thickness T of the excessively compressed elastic element 134, and the guide column 136 provides a force to support the base plate 132. As a result, there is a minimum distance between the base plate 132 and the substrate 112 that is at least the same as the height H of the guide column 136, preventing the base plate 132 from colliding with the substrate 112 or with other electronic components installed close to the base plate 132 on the substrate 112.

[0037] To improve the overall heat dissipation effect of the electronic device 100, the electronic device 100 may further include a heat dissipation element 160 installed on the side of the functional component 120 that is relatively far from the base plate 132, and this heat dissipation element 160 may be a combination of a heat sink and heat sink fins. In other embodiments, the heat dissipation element 160 may also be a heat sink, heat sink fins, a fan, or any two or more combinations of a heat sink, heat sink fins, and a fan. The actual heat dissipation element 160 is selected and installed as needed.

[0038] Furthermore, the electronic device 100 may further include a heat transfer pad 140, which can be installed between the functional component 120 and the heat dissipation element 160 and / or between the functional component 120 and the base plate 132, depending on the situation. The use of the heat transfer pad 140 can increase the contact area between the functional component 120 and the heat dissipation element 160 and / or between the functional component 120 and the base plate 132, thereby improving the heat conduction effect.

[0039] The aforementioned heat transfer pad 140 can be formed from a thermal conductive adhesive, or the heat transfer pad 140 can be replaced with a heat sink, which can be selected as needed.

[0040] Referring simultaneously to Figures 1A, 1B, and 2B, after the functional component 120, support component 130, heat dissipation element 160, and heat transfer pad 140 are assembled on the circuit board 110 to form the electronic device 100, the combined weight of the heat dissipation element 160 and the functional component 120 applies a downward force to the support component 130.

[0041] In conventional technology, after the heat dissipation element 160 is assembled above the functional component 120, the weight of the heat dissipation element 160 causes the circuit board 110 to warp, which in turn causes solder cracks in the electronic components on the circuit board 110, making it impossible to continue effective operation.

[0042] In contrast, in this embodiment, when the functional component 120 and the heat dissipation element 160 assembled above the functional component 120 apply a downward force to the elastic element 134, the force is distributed to the elastic element 134, causing it to compress and deform downwards. At the same time, the elastic element 134 provides an upward elastic restoring force, pushing up the base plate 132, thus counteracting the downward pushing force applied to the upper part of the circuit board 110 by the weight of the functional component 120 and the heat dissipation element 160. In this way, warping of the circuit board 110 can be effectively prevented, and solder cracks can be avoided.

[0043] Furthermore, by installing the elastic element 134, the distance between the base plate 132 and the circuit board 110 can be adjusted according to the thickness and weight of the functional component 120 placed thereon. Therefore, the electronic device 100 of this embodiment can be used universally for functional components 120 of different specifications.

[0044] Specifically, the functional component 120 is one of two types selected from single-sided SSD modules and double-sided SSD modules, and the thickness of the double-sided SSD module is greater than that of the single-sided SSD module. The difference in thickness between the double-sided SSD module and the single-sided SSD module can be resolved by the degree of compression of the elastic element 134.

[0045] In detail, when a double-sided SSD module is assembled on the base plate 132, the elastic element 134 exhibits a more compressed state, while when a single-sided SSD module is assembled on the base plate 132, the elastic element 134 exhibits a more stretched state. The deformation distance of the elastic element 134 from stretched to compressed is approximately 0.5 mm to 2.5 mm, preferably 1.5 mm.

[0046] Figure 3A is a schematic diagram showing that the support components are assembled onto the substrate first, and Figure 3B is a schematic diagram showing that the support components are assembled with the functional components first to form a functional component module.

[0047] In this embodiment, the support component 130 can be pre-assembled on the substrate 112 of the circuit board 110, facilitating the subsequent assembly of the functional component 120 onto the base plate 132 of the support component 130, as shown in Figure 3A. Alternatively, the support component 130 can be pre-assembled with the functional component 120 to form a functional component module 150, facilitating the subsequent assembly of the functional component module 150 onto the circuit board 110, as shown in Figure 3B.

[0048] Second Example

[0049] Figure 4 is an exploded schematic diagram of a circuit board according to a second embodiment of the present invention. Referring to Figures 1A and 4, this embodiment is generally similar to the previously described embodiment, and the difference between this embodiment and the previously described embodiment is that in the electronic device 100' of this embodiment, the guide column 136' penetrates the base plate 132 from the surface of the base plate 132 facing the functional component 120 and is inserted into a plurality of through-holes 113 installed on the substrate 112 for inserting the guide column 136'.

[0050] This is a schematic diagram showing the guide column protruding from the bottom surface of the substrate. Referring to Figures 4 and 5 simultaneously, when the elastic element 134 is compressed and deformed by the weight of the functional component 120 and the heat dissipation element 160 placed on the base plate 132, the base plate 132 moves toward the substrate 112, and at this time the guide column 136' is driven by the base plate 132 to penetrate deeper into the through-hole 113 of the substrate 112, and protrudes further from the bottom surface of the substrate 112, relatively farther away from the elastic element 134.

[0051] In this embodiment, the elastic element 134 is installed corresponding to the position of the through-hole 113, and since its positioning hole 134a and the through-hole 113 overlap to at least a partial extent, the guide column 136' is inserted into the through-hole 113 by passing through the positioning hole 134a of the elastic element 134.

[0052] In another implementation (not shown), the elastic element 134 can be installed offset from the through-hole 113, and the guide column 136' does not need to penetrate the elastic element 134, while the guide column 136' directly penetrates the through-hole 113.

[0053] As described above, in such an installation structure in which the guide column 136' penetrates the base plate 132 from the surface of the base plate 132 facing the functional component 120 and is inserted into the through-hole 113, the difference in thickness between double-sided SSD modules and single-sided SSD modules is resolved by the guide column 136' protruding further from the bottom surface of the substrate 112, thus providing more selectivity for the installation position of the elastic element 134 that provides an upward elastic restoring force to the base plate 132.

[0054] As described above, in the circuit board, functional component module, and electronic device of the present invention, the support component not only provides a good support effect, but also allows the circuit board to be adapted to functional components of different thicknesses and weights installed thereon, and enables stepless adjustment of the distance between the functional components and the circuit board. As a result, the electronic device has the convenience of being able to universally accommodate functional components of different thicknesses and weights.

[0055] Furthermore, the use of heat transfer pads can increase the contact area between the base plate and the functional component and / or between the functional component and the heat dissipation element, thereby effectively improving the overall heat conduction efficiency of the electronic device. [Industrial applicability]

[0056] The circuit board, functional component module, and electronic device of the present invention allow the circuit board to be adapted to functional components of different thicknesses and weights placed on it by installing support components, and the distance between the functional components and the circuit board can be adjusted steplessly, thereby enabling the electronic device to universally accommodate functional components of different thicknesses and weights. [Explanation of Symbols]

[0057] 100, 100': Electronic equipment 110: Circuit board 112: Circuit board 113: Through-hole 120: Functional parts 130: Support parts 132: Base Plate 134: Elastic element 134a: Positioning hole 136, 136': Guide posts 140: Heat transfer pad 150: Functional component module 160: Heat dissipation element T: Thickness H: Height

Claims

1. circuit board and A circuit board suitable for mounting functional components, comprising a base plate and a plurality of elastic elements, wherein the plurality of elastic elements are positioned between the base plate and the substrate to provide support to the base plate.

2. The circuit board according to claim 1, wherein the support component further includes a plurality of guide columns positioned in the corresponding plurality of elastic elements, which are mounted on the surface of one of the substrate and the base plate facing the other.

3. The circuit board according to claim 2, wherein each of the elastic elements has a positioning hole, and the plurality of guide columns are suitable for positioning in the corresponding positioning holes.

4. The circuit board according to claim 2, wherein when the guide columns are installed on the surface of the base plate facing the substrate, the substrate further has a plurality of through holes for inserting the plurality of guide columns.

5. The circuit board according to claim 1, wherein the plurality of elastic elements are sponges.

6. The circuit board according to claim 1, wherein the hardness range of the plurality of elastic elements is 10 to 30 degrees.

7. The circuit board according to claim 1, wherein the tensile strength range of the plurality of elastic elements is 0.25 to 0.4 MPa.

8. The density range of the aforementioned plurality of elastic elements is 0.1 to 0.2 g / cm³. ３ The circuit board according to claim 1.

9. Functional components, A functional component module comprising a base plate and a support component that includes a plurality of elastic elements, wherein the plurality of elastic elements are installed on the side of the base plate that is relatively away from the functional component, on which the functional component is mounted.

10. The functional component module according to claim 9, wherein the plurality of elastic elements are sponges.

11. The functional component module according to claim 9, wherein the hardness range of the plurality of elastic elements is 10 to 30 degrees.

12. The functional component module according to claim 9, wherein the tensile strength range of the plurality of elastic elements is 0.25 to 0.4 MPa.

13. The density range of the aforementioned plurality of elastic elements is 0.1 to 0.2 g / cm³. ３ The functional component module according to claim 9.

14. The functional component module according to claim 9, wherein a plurality of electronic components are installed on one side of the functional component, or a plurality of electronic components are installed on opposite sides of the functional component.

15. Circuit boards including the substrate, Functional components installed on the aforementioned substrate, An electronic device comprising a base plate and a plurality of elastic elements, wherein the plurality of elastic elements are supported by a support component installed between the base plate and the substrate, on which the functional components are mounted.

16. The electronic device according to claim 15, wherein the support component further includes a plurality of guide columns positioned in the corresponding plurality of elastic elements, which are mounted on the surface of one of the substrate and the base plate facing the other.

17. The electronic device according to claim 16, wherein each of the elastic elements has a positioning hole, and the plurality of guide columns are suitable for positioning in the corresponding positioning holes.

18. The electronic device according to claim 16, wherein, when the guide columns are installed on the surface of the base plate facing the substrate, the substrate further has a plurality of through holes for inserting the plurality of guide columns.

19. The electronic device according to claim 15, wherein the plurality of elastic elements are sponges.

20. The electronic device according to claim 15, wherein the hardness range of the plurality of elastic elements is 10 to 30 degrees.

21. The electronic device according to claim 15, wherein the tensile strength range of the plurality of elastic elements is 0.25 to 0.4 MPa.

22. The density range of the aforementioned plurality of elastic elements is 0.1 to 0.2 g / cm³. ３ The electronic device according to claim 15.

23. The electronic device according to claim 15, wherein a plurality of electronic components are installed on one side of the functional component, or a plurality of electronic components are installed on opposite sides of the functional component.

24. The electronic device according to claim 15, further comprising a heat dissipation element installed on the side of the functional component that is relatively far from the base plate.

25. The electronic device according to claim 24, further comprising a heat transfer pad installed between the functional component and the heat dissipation element.

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