PCB mounting stage and PCB processing apparatus

JP2026167461APending Publication Date: 2026-10-14TOKYO ELECTRON LTD
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Patent Information

Application Number
JP2026013518
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-31
Filing Date
2026-01-29
Publication Date
2026-10-14

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Abstract

The present invention provides a substrate mounting platform and a substrate processing apparatus for cooling the mounting platform. [Solution] A substrate mounting stand comprising a mounting stand on which a substrate is placed, a mounting stand support mechanism for supporting the mounting stand, and a cooling mechanism for cooling the mounting stand, wherein the mounting stand has a contact surface on its back side that is radially outward from the support portion of the mounting stand supported by the mounting stand support mechanism, and the cooling mechanism comprises a cold drink, a cooling device for cooling the cold drink, and a heat transfer plate provided between the contact surface of the mounting stand and the cold drink.
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