PCB mounting stage and PCB processing apparatus
JP2026167461APending Publication Date: 2026-10-14TOKYO ELECTRON LTD
-1 Cites -1 Cited by
Patent Information
- Application Number
- JP2026013518
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-31
- Filing Date
- 2026-01-29
- Publication Date
- 2026-10-14
Smart Images

Figure 2026167461000001_ABST
Abstract
The present invention provides a substrate mounting platform and a substrate processing apparatus for cooling the mounting platform. [Solution] A substrate mounting stand comprising a mounting stand on which a substrate is placed, a mounting stand support mechanism for supporting the mounting stand, and a cooling mechanism for cooling the mounting stand, wherein the mounting stand has a contact surface on its back side that is radially outward from the support portion of the mounting stand supported by the mounting stand support mechanism, and the cooling mechanism comprises a cold drink, a cooling device for cooling the cold drink, and a heat transfer plate provided between the contact surface of the mounting stand and the cold drink.
Need to check novelty before this filing date? Find Prior Art