Storage container for individual adhesive films

Abstract

When storing individual adhesive film pieces in recesses of the carrier tape and winding them onto a reel, deformation of the individual adhesive film pieces within the recesses is suppressed, ensuring reliable pickup by the chip mounter. [Solution] A storage unit 1A for individual adhesive films in which individual adhesive films 10 are stored in recesses 41 of a carrier tape 40, wherein the surface of the individual adhesive film 10 that is in contact with the bottom surface of the recess 41 is given tackiness, and the bottom surface inside the recess 41 is treated with a release agent.

Description

[Technical Field]

[0001] The present invention relates to a housing for individual adhesive films, in which individual adhesive films used for connecting electronic components are housed in recesses of a carrier tape at predetermined intervals. [Background technology]

[0002] There is a product (Patent Document 1) in which individual adhesive films used for connecting electronic components such as ACF (Anisotropic Conductive Film) and NCF (Non-Conductive Film) are attached to a strip-shaped base film at predetermined intervals and wound onto a reel.

[0003] When mounting electronic components onto a substrate using adhesive film, the adhesive film is first temporarily attached to the electronic component, and then the electronic component is mounted on the substrate. Conventionally, a bonding tool is used when temporarily attaching the adhesive film to the electronic component (Patent Document 1).

[0004] In recent years, it has been proposed to pick up individual adhesive films, which are arranged at predetermined intervals on a base film wound on a reel, using a chip mounter to pick them up and temporarily attach them to electronic components, and then mount those electronic components onto a substrate (Patent Document 2). Since the chip mounter used for mounting electronic components onto a substrate can be used, it becomes possible to eliminate the temporary attachment process that uses bonding tools.

[0005] Incidentally, adhesive films, which have an adhesive layer laminated onto a base material, are usually shipped as wound packages wound onto a core. As a result, in these wound packages of adhesive films, the adhesive layer can protrude from the base material, causing blocking. In contrast, in a wound package where a base film with individual adhesive film segments arranged at predetermined intervals is wound onto a reel, blocking is less likely to occur. However, there is a concern that the individual adhesive film segments may deform due to the tight winding, preventing them from maintaining their original shape.

[0006] On the other hand, as a storage form for non-film-like electronic components, there is a configuration in which electronic components are stored in recesses of a carrier tape, covered with a cover tape, and wound around a reel (Patent Document 3, Patent Document 4). [Prior Art Documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2020-198422 [Patent Document 2] WO2023 / 162666 Publication [Patent Document 3] Japanese Unexamined Patent Application Publication No. 10-329866 [Patent Document 4] Japanese Unexamined Patent Application Publication No. 2020-001825 [Summary of the Invention] [Problem to be Solved by the Invention]

[0008] To address the above-described deformation problem caused by winding tightening, it is conceivable to store the individual piece-like adhesive films in the recesses of a carrier tape as described in Patent Documents 3 and 4 and wind them around a reel.

[0009] However, the individual piece-like adhesive films have lower rigidity than the electronic components conventionally stored in carrier tapes. Therefore, when the individual piece-like adhesive films are stored in the recesses of a carrier tape, wound around a reel and transported, there is a concern that the individual piece-like adhesive films may deform by bending or twisting within the recesses, making it impossible for a chip mounter to accurately pick up the individual piece-like adhesive films. This is because even minor deformation of an individual piece-like adhesive film can make pickup difficult.

[0010] In view of this, an object of the present invention relates to suppressing deformation of the individual piece-like adhesive films within the recesses when the individual piece-like adhesive films are stored in the recesses of a carrier tape and wound around a reel, so that pickup by a chip mounter can be performed reliably. [Means for solving the problem]

[0011] The inventors have discovered that when storing individual adhesive films in recesses of a carrier tape, if at least the surface of the individual adhesive films that is in contact with the bottom surface of the recess is given tackiness, and if a release treatment is applied to the bottom surface of the recess, deformation of the individual adhesive films within the recess can be suppressed, and the individual adhesive films can be stably picked up using a chip mounter, and have completed the present invention.

[0012] In other words, the present invention provides a storage body for individual adhesive films, in which individual adhesive films are stored in recesses of a carrier tape, wherein the surface of the individual adhesive film that is in contact with the bottom surface of the recess has tack properties, and the bottom surface of the recess is subjected to a release treatment. [Effects of the Invention]

[0013] According to the present invention, since the individual adhesive films are stored in the recesses of the carrier tape, even when the carrier tape is wound onto a reel, the individual adhesive films will not deform due to winding tightness, nor will blocking occur due to excess adhesive. Therefore, it is possible to increase the length of tape wound onto the reel.

[0014] Furthermore, since at least the surface of the individual adhesive film pieces that contacts the bottom surface of the recess in the carrier tape has tack properties, and the bottom surface within the recess is treated with a release agent, the individual adhesive film pieces do not deform within the recess, and the individual adhesive film pieces are easily peeled off from the carrier tape by being picked up by the pickup device. Therefore, the individual adhesive film pieces stored in the recess can be used as electronic components.

[0015] Furthermore, the recesses of the carrier tape can accommodate individual adhesive films of various specifications. Therefore, according to the present invention, it becomes possible to use a wide variety of individual adhesive films for mounting electronic components. [Brief explanation of the drawing]

[0016] [Figure 1] Figure 1 is a perspective view of the storage container 1A for the individual adhesive films of the embodiment. [Figure 2] Figure 2 is a side view of the winding mechanism of the storage body 1A for individual adhesive films. [Figure 3A] Figure 3A is a cross-sectional view of AA, the housing for the individual adhesive film 1A shown in Figure 1. [Figure 3B] Figure 3B is a top view of the housing for the individual adhesive film 1A shown in Figure 3A. [Figure 4A] Figure 4A is an explanatory diagram of the layer structure of individual adhesive films, showing (a) an adhesive film formed of a single adhesive layer, (b) an adhesive film formed of a single adhesive layer containing conductive particles, and (c) an adhesive film formed by laminating an adhesive layer containing conductive particles and an adhesive layer not containing conductive particles. [Figure 4B] Figure 4B is an explanatory diagram of the layer structure of individual adhesive films, showing (a) an adhesive film formed by an adhesive layer in contact with the release layer of the carrier tape and a base film, with their planar shapes aligned; (b) an adhesive film formed by an adhesive layer in contact with the release layer of the carrier tape and a base film, with the planar shape of the base film being larger than the planar shape of the adhesive layer; and (c) an adhesive film formed by a base film in contact with the release layer of the carrier tape and an adhesive layer, with their planar shapes aligned. [Figure 4C] Figure 4C is an explanatory diagram of the layer structure of an adhesive film, showing a film in which a base film, an adhesive layer, and a protective layer are laminated together. [Figure 4D] Figure 4D is an explanatory diagram of the layer structure of individual adhesive films to which electronic components such as semiconductor elements are attached. [Figure 4E] Figure 4E is an explanatory diagram of the layer structure of individual adhesive films to which film-like electronic components are attached. [Figure 4F] Figure 4F is an explanatory diagram of the layer structure of individual adhesive films to which film-like electronic components are attached. [Figure 5A] Figure 5A is an explanatory diagram of the minimum circumscribing rectangle of the adhesive film. [Figure 5B] Figure 5B is an explanatory diagram of the minimum circumscribing rectangle of the adhesive film. [Figure 5C] Figure 5C is an explanatory diagram of the minimum circumscribing rectangle of the adhesive film. [Figure 6] Figure 6 is a longitudinal (MD) cross-sectional view of a housing of individual adhesive films, in which a release layer is formed only in the recesses of the carrier tape. [Figure 7] Figure 7 is a cross-sectional view of the storage unit in the MD direction, showing that the recessed portion of the carrier tape is covered with a protective film. [Figure 8] Figure 8 is an explanatory diagram of a method for manufacturing a container for individual adhesive films. [Modes for carrying out the invention]

[0017] The present invention will be described in detail below with reference to the drawings. In each figure, the same reference numerals represent the same or equivalent components.

[0018] (Overall structure) Figure 1 is a perspective view of a storage body 1A for individual adhesive films according to one embodiment of the present invention, and Figure 2 is a side view of a winding body 30 formed by winding the storage body 1A onto a reel 31. Figure 3A is a cross-sectional view AA of the storage body 1A, and Figure 3B is a top view thereof.

[0019] The adhesive film housing 1A is characterized in that individual pieces of adhesive film 10 are housed in recesses 41 of a film carrier tape 40 which serves as the outer material, and at least the surface 10a of the individual pieces of adhesive film 10 that is in contact with the bottom surface of the recess 41 of the carrier tape 40 has tackiness, and the bottom surface 41a within the recess 41 is treated with a release agent. More specifically, in the housing 1A of this embodiment, the carrier tape 40 has a release agent layer 47 on one side. The usable portion of the individual pieces of adhesive film 10 (i.e., the adhesive layer that is removed from the carrier tape 40 and attached to the object to be connected) has almost the same composition as conventional adhesives (i.e., the adhesive layer of an adhesive layer laminated with a base film), so the rigidity of the adhesive layer of the adhesive film 10 is lower than that of the electronic component to be connected.

[0020] Even if the adhesive layer of the individual adhesive film 10 is prone to bending or twisting, the individual adhesive film 10 is less likely to deform within the recess 41 due to its rigidity and tackiness. Furthermore, because the bottom surface 41a of the recess 41 of the carrier tape 40 is treated for mold release, when the individual adhesive film 10 is picked up by adsorption, it becomes possible to pick up the individual adhesive film 10 from the recess 41 effectively.

[0021] (Individual adhesive film pieces) In the present invention, the individual adhesive film 10 refers to a sheet-like film used for bonding a first component to a second component. This bonding includes, for example, bonding a first or second electronic component to a substrate, bonding a first electronic component to a second electronic component, bonding a first substrate to a second substrate, etc. Therefore, the adhesive film includes conductive films containing conductive particles such as solder particles, anisotropic conductive films (ACF), non-conductive adhesive films (NCF), etc. The individual adhesive film 10 may also include adhesive films used as thermal conductive sheets. Here, "bonding" can be read as "connection".

[0022] (Tackiness of individual adhesive films) The tackiness of the surface 10a of the individual adhesive film 10 can be set to a degree that allows for temporary adhesion of the individual adhesive film 10 to the electronic component.

[0023] Tackiness can be measured in accordance with JIS Z 0237, or it can be measured as tack force by the probe method in accordance with JIS Z 3284-3 or ASTM D 2979-01. In this invention, a preferred tack force by the probe method is, for example, when measured with a probe pressing speed of 30 mm / min, a pressing force of 196.25 gf, a pressing time of 1.0 sec, a peeling speed of 120 mm / min, and a measurement temperature of 23°C ± 5°C, at least one of the front and back surfaces is 1.0 kPa (0.1 N / cm²). 2 It can be set to 1.5 kPa (0.15 N / cm²) or higher. 2 It is preferable to set it to 3.0 kPa (0.3 N / cm²) or higher, and 2 It is more preferable that the value is higher than ). In this case, the tack force of the other side may be measured by attaching one side of the adhesive film to plain glass. Alternatively, the measurement may be taken by attaching it to a flexible thermoplastic resin film (for example, an unreleased PET film with a thickness of 20 μm or less, silicone rubber, etc.) instead of plain glass.

[0024] The tackiness of the individual adhesive film pieces can also be determined in accordance with the adhesive strength test described in Japanese Patent Publication No. 2017-48358. In this adhesive strength test, for example, if individual adhesive film pieces are sandwiched between two glass plates, one glass plate is fixed, and the other glass plate is peeled off at a speed of 10 mm / min and a test temperature of 50°C, by strengthening the adhesion between the fixed glass plate and the individual adhesive film pieces, it becomes possible to measure the adhesive strength between the glass plate being peeled off and the surface of the individual adhesive film pieces bonded to that glass plate. Preferably, the adhesive strength measured in this way is 1 N / cm². 2 (10 kPa) or more, more preferably 10 N / cm 2 It can be set to (100kPa) or higher.

[0025] In addition, the tackiness of individual adhesive films can also be determined by a test in which one end of a test piece is aligned and bonded together, and the other end is pulled up to peel the test piece apart. The adhesive strength measured by this test method is equivalent to that of the adhesive strength test described above (1 N / cm²). 2 The result may be (10 kPa or higher). When the adhesive strength obtained from the above adhesive strength test is sufficiently large (for example, 10 N / cm²), the result may be (10 kPa or higher). 2 (100kPa or higher) The adhesive strength obtained using this test method can be 10% or more of the adhesive strength obtained using the adhesive strength test described above.

[0026] By having at least the surface 10a of the individual adhesive film 10 that contacts the bottom surface 41a of the recess 41 of the carrier tape 40 have the aforementioned tackiness, deformation due to rattling of the individual adhesive film 10 within the recess 41 can be prevented.

[0027] Tackiness can be imparted to the individual adhesive film 10 by appropriately adjusting the resin composition that constitutes the individual adhesive film 10 or by improving the surface smoothness of the film.

[0028] (Layer structure of individual adhesive films) There are no particular restrictions on the layer structure of the individual adhesive film 10; it may be a single layer or a laminated film of two or more layers. That is, as shown in Figure 4A, the adhesive film may consist only of an adhesive layer 15 that is interposed between the first and second parts to bond them together. In that case, the adhesive layer 15 may be a single layer 15a of adhesive (Figure 4A(a)), a conductive particle-containing layer 15b in which conductive particles 12 are dispersed in the adhesive 16 (Figure 4A(b)), or a laminate of the conductive particle-containing layer 15b and an adhesive layer 15c that does not contain conductive particles (Figure 4A(c)). As shown in Figure 4B, the adhesive layer 15 may be laminated with a base film 20. The base film 20 can also be called a substrate film. The presence of the base film 20 provides the adhesive film 10 with the rigidity necessary to pick up the adhesive film 10 housed in the recess 41 of the carrier tape 40.

[0029] The binder forming the adhesive layer 15 may be thermosetting or thermoplastic, but when bonding the first electronic component and the second electronic component by reflow soldering, a thermosetting binder is preferred because it melts during reflow soldering and then hardens.

[0030] There are no particular restrictions on the adhesive film, and examples include anisotropic conductive film (ACF), conductive film containing conductive particles in the adhesive, non-conductive film (NCF), and solder-containing film containing solder particles. There are also no particular restrictions on the curing type of the binder in the adhesive film, and examples include thermosetting, photocuring, and photothermal combined curing. For example, the polymerization initiator may be a known anionic curing agent or a cationic curing agent. Furthermore, the curable resin may be an epoxy resin, for example. In this invention, the adhesive layer differs from a layer made of a general adhesive, and is preferably of this curing type so that it can be used for heat-bonding between parts. A hot-melt type using a thermoplastic resin may also be used, as long as it is suitable for heat-bonding between parts.

[0031] Examples of thermosetting binders include a thermo-radical polymerized resin composition containing a (meth)acrylate compound and a thermo-radical polymerization initiator as described in Patent Document 2, a thermo-cationic polymerized resin composition containing an epoxy compound and a thermo-cationic polymerization initiator, a thermo-anionic polymerized resin composition containing an epoxy compound and a thermo-anionic polymerization initiator, and a photo-radical polymerized resin composition containing an acrylate compound and a photo-radical polymerization initiator.

[0032] In addition, the thermosetting binder can contain various film-forming resins and silane coupling agents. Examples of film-forming resins include phenoxy resins, epoxy resins, unsaturated polyester resins, saturated polyester resins, urethane resins, butadiene resins, polyimide resins, polyamide resins, and polyolefin resins. Two or more film-forming resins can be used in combination. Among these, phenoxy resin is preferably used from the viewpoint of film-forming properties, processability, and connection reliability. Examples of silane coupling agents include epoxy-based silane coupling agents and acrylic-based silane coupling agents. These silane coupling agents are mainly alkoxysilane derivatives.

[0033] Furthermore, a known adhesive composition may be used as the binder for the adhesive film. Note that (meth)acrylic monomer includes both acrylic monomer and methacrylic monomer.

[0034] The thickness of the adhesive layer 15 can be determined according to the application of the individual adhesive film 10. For example, in applications such as thermal conductive sheets, the total thickness of each layer constituting the individual adhesive film 10 may be 100 μm or more.

[0035] As shown in Figure 4B, the layer structure of the individual adhesive film 10B may include a base film 20 that is peeled off from the adhesive layer 15 during the bonding process between the first and second components. That is, when the adhesive layer 15 of the individual adhesive film 10B is a conductive film containing conductive particles, an anisotropic conductive film, an adhesive film consisting only of a curable adhesive layer, etc., the thickness of the adhesive layer 15 is usually 50 μm or less, so it is preferable to provide a base film 20. Furthermore, in the present invention, since the adhesive layer is installed in the recess 41 of the carrier tape 40, a cover film can be made unnecessary, and overall reductions in resources and costs can be expected.

[0036] In this case, as shown in Figures 4B(a) and (b), it is preferable that the base film 20 is on the opening surface 44 side of the recess 41 and the adhesive layer 15 is on the bottom surface side of the recess 41. This makes it possible to easily pick up individual pieces of adhesive film 10B using a chip mounter.

[0037] Alternatively, as shown in Figure 4B(c), the base film 20 may be placed in contact with the bottom surface 41a of the recess 41, and the adhesive layer 15 may be positioned on the opening surface 44 side of the recess 41. In this case, the surface 20a of the base film 20 that is in contact with the bottom surface 41a of the recess 41 is given the aforementioned tackiness. Alternatively, the individual adhesive film 10B may be pushed up from the bottom of the recess 41 to provide the adhesive layer 15 for bonding the article. For example, it is thought that picking up can be easily done by ensuring that the adhesive layer 15 peels off from the base film 20 when pushed up, or by ensuring that the base film 20 peels off from the bottom surface 41a.

[0038] As shown in Figure 4B(a), the planar shapes of the adhesive layer 15 and the base film 20 may be aligned, or as shown in Figure 4B(b), the adhesive layer 15 may be formed within the plane of the base film 20. The adhesive layer 15 provided on the base film 20 may be divided into multiple regions depending on the shape and arrangement of the articles to be bonded. In other words, in a piece-shaped adhesive film, there may be one or more adhesive layers 15 provided on the base film 20, and two or more adhesive layers 15 may be formed spaced apart. The planar shape of one or more adhesive layers 15 can be, for example, a rectangle, but is not limited to a rectangle, and can be any polygon, a shape including curves, a shape with a mixture of straight and curved lines, and a shape in which the corners are chamfered. Furthermore, these shapes may have cutouts (shapes in which a part of the adhesive layer 15 is removed). More specifically, as in the unit region of the film structure described in Patent Document 1, two adhesive layers 15 may be formed spaced apart from each other on the base film 20, or two rectangular adhesive layers may be formed spaced apart from each other. In the case of individual adhesive films, there may be one base film 20 or multiple base films 20. If there is one base film 20, picking is easy, and if there are multiple base films 20, a variety of shapes can be accommodated. The shape and size of the adhesive layer can be selected according to the application. Furthermore, depending on the shape and arrangement of the terminal areas of electronic components such as semiconductor elements, IC chips, IC modules, and FPCs to be connected by the adhesive film, a single adhesive layer 15 (i.e., there are no spaced-apart adhesive layers 15, and the entire area of ​​the adhesive layer 15 is continuous) may be formed on the base film 20, or multiple adhesive layers 15 may be formed spaced apart from each other, as in the adhesive film 10 described in Figure 5C later.

[0039] The thickness of the adhesive layer 15 in multiple regions may be the same or different. It is preferable for them to be the same in terms of bonding. If they are different, it may be easier to accommodate a variety of parts, and thus the effects of the present invention may be more readily apparent. The adhesive layer 15 may be a protruding portion in the individual adhesive film 10B. Since the individual adhesive film 10B is housed in the recess 41 of the carrier tape 40, even if the adhesive layer 15 is a protruding portion in the individual adhesive film 10B, the protruding portion will not collapse or lose its shape when it is wound into a rolled body.

[0040] As the base film 20, the substrate of the individualized adhesive film described in Patent Document 2 can be used, and examples include PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), and PTFE (Polytetrafluoroethylene). Furthermore, it is preferable to use a film in which at least the surface facing the adhesive layer 15 has been peeled off with, for example, a silicone resin.

[0041] The thickness of the base film 20 is preferably 10 μm or more in order to ensure that the adhesive layer 15 can be reliably picked up by the chip mounter, and is even thicker in order to prevent deformation due to bending of the adhesive layer 15, for example, it can be 50 μm or more, or 75 μm or more. On the other hand, if the thickness of the base film 20 is too large, it can cause deformation of the adhesive layer 15 when peeling it off, so it is preferably 200 μm or less, and more preferably 100 μm or less.

[0042] As shown in Figure 4C, the individual adhesive film 10C may have a protective layer 25 laminated on the side of the adhesive layer 15 opposite to the side on which the base film 20 is laminated. If the raw material of the individual adhesive film 10C has the adhesive layer 15 formed in a predetermined area on one side of the base film 20, the protective layer 25 is provided as needed to protect the adhesive layer 15. The protective layer 25, like the base film 20, is removed during the bonding process between the first and second parts.

[0043] The material of the protective layer 25 can be the same as that of the base film 20. The surface 25a of the protective layer 25 that contacts the bottom surface 41a of the recess 41 of the carrier tape 40 is provided with the aforementioned tackiness. The thickness of the protective layer 25 is preferably thinner than that of the base film 20.

[0044] In the present invention, one or more electronic components may be attached to the individual adhesive film. For example, the individual adhesive film 10D shown in Figure 4D has an adhesive layer 15 on a base film 20 attached to a first electronic component 60 such as a semiconductor element. This individual adhesive film 10D is picked up from the carrier tape 40, the base film 20 is peeled off, and the first electronic component 60 is connected to the second electronic component by the adhesive layer 15. In this way, by providing the adhesive film 10 to the electronic component 60 in advance, the attachment step in the conventional connection process can be omitted. In the individual adhesive film, the effects of the present invention are realized whether there is one or two or more adhesive layers provided on the electronic component such as a semiconductor element. From the viewpoint of reducing the difficulty of handling in the connection process, it is preferable to have two or more adhesive layers.

[0045] As shown in Figure 4E, the individual adhesive film 10E may be formed by attaching an adhesive layer 15 to a film-like electronic component 61, such as a film-like substrate. In this case, as shown in the same figure, the adhesive layer 15 may be placed on the bottom surface of the recess 41 of the carrier tape 40, or, as shown in Figure 4F, the individual adhesive film 10F may be formed by placing an electronic component 61 made of a film-like substrate on the bottom surface of the recess 41 of the carrier tape. In either case, by attaching the adhesive layer to the film-like electronic component in advance, the attachment step in the conventional connection process can be omitted. The effects of the present invention are achieved whether there is one or two or more adhesive layers 15 provided on the film-like electronic component. From the viewpoint of reducing the difficulty of handling in the connection process, it is preferable to have two or more adhesive layers 15.

[0046] (The rigidity of the individual adhesive films) The rigidity of the individual adhesive film pieces 10 (including 10A, 10B, 10C, 10D, 10E, and 10F) within the recess 41 can be appropriately determined to prevent twisting or bending of the adhesive film 10. For example, it may be set to the same tensile modulus as the base film 20 and the carrier tape 40, or to the same tensile modulus as the sheet used in the carrier tape described in Japanese Patent Application Publication No. 11-147567.

[0047] The tensile modulus of the carrier tape 40 and the base film 20 may be approximated. This makes it less likely for the pickup to be affected even if slight twisting or bending occurs in the carrier tape 40, as the base film 20 will follow along with this twisting or bending.

[0048] On the other hand, depending on the depth, dimensions, and length of the recess 41, the carrier tape 40 may be intentionally designed to have a higher tensile modulus than the base film 20, or it may be designed to have a lower tensile modulus than the base film 20.

[0049] By creating a difference in rigidity between the adhesive layer 15 and the base film 20, or between the adhesive layer 15 and the protective layer 25, the adhesive layer 15 can be easily peeled off the base film 20 or the protective layer 25.

[0050] (Planar shape of the individual piece-shaped adhesive film) The planar shape of the individual piece-shaped adhesive film 10 is not particularly limited, and may adopt various shapes according to the article to be bonded, and examples thereof may include a rectangular shape, a shape having a curve, a circular shape, a polygonal shape such as a hexagon, an octagon, and a dodecagon, a U-shape in a square bracket form, a U-shape composed of curves, a C-shape, a cylindrical shape, and the like. The polygonal shape may be a regular polygon. Further, the individual piece may be a combination of different shapes. The shape of the individual piece-shaped adhesive film 10 may have a mixture of straight lines and curves. The corners of these shapes may be chamfered. In addition, these shapes may have a hollow portion (a shape in which a part of the adhesive film 10 is cut out). Further, the shape of the individual piece-shaped adhesive film 10 may be the same as the shape of the mounting surface of the electronic component for which the individual piece-shaped adhesive film 10 is used.

[0051] In addition, a product obtained by cutting the connection film described in Patent Document 1 into unit regions, and the individualized adhesive film described in Patent Document 2 can be included in the individual piece-shaped adhesive film 10 of the present invention. By forming the individual piece-shaped adhesive film 10 as a resin film containing solder particles, the individual piece-shaped adhesive film 10 can be used for reflow mounting of electronic components.

[0052] (Clearance in the recessed portion) As shown in FIG. 3B, in the present invention, the clearance in the recessed portion 41 of the carrier tape 40 accommodating the individual piece-shaped adhesive film 10 refers to the distance L in the longitudinal direction (MD) between each vertex of the minimum circumscribed rectangle 11 of the individual piece-shaped adhesive film 10 and the inner wall of the recessed portion in a top view of the recessed portion 41 (that is, the field of view when the recessed portion 41 is viewed from the opening surface 44 side of the recessed portion 41) MD1 , L MD2 , L MD3 , L MD4 is preferably 200 μm or less, more preferably 75 μm or more and 125 μm or less, respectively, and the distance L in the lateral direction (CD) between each of the vertices P1 to P4 and the inner wall of the recessed portion CD1 , L CD2 , L CD3 , LCD4 However, the thickness is preferably 200 μm or less, and more preferably 75 μm to 125 μm.

[0053] As shown in Figure 3A, the distance L between the individual adhesive film 10 and the opening surface 44 of the recess 41 D The particle size is preferably 2000 μm or less, and more preferably 200 μm to 500 μm.

[0054] By limiting the clearance in this way, the individual adhesive films 10 are stored in the recesses 41, and when vibrations are applied to the carrier tape 40 wound on the reel during transport, it is possible to more reliably suppress twisting or bending of the individual adhesive films 10 within the recesses 41.

[0055] As shown in Figure 5A, when the top view of the individual adhesive film 10 is U-shaped, the minimum circumscribing rectangle 11 is the rectangle shown in the figure, and the distance L in the vertical direction (MD) between each vertex P1 to P4 and the inner wall of the recess MD1 , L MD2 , L MD3 , L MD4 and the distance L in the lateral direction (CD). CD1 , L CD2 , L CD3 , L CD4 The above-mentioned range shall be defined as follows.

[0056] As shown in Figure 5B, when the top view of the individual adhesive film 10 is an approximately octagonal concave polygon, the smallest circumscribing rectangle 11 is the rectangle shown in the figure, and the distance L in the vertical direction (MD) between each vertex P1 to P4 and the inner wall of the concave is also shown. MD1 , L MD2 , L MD3 , L MD4 and the distance L in the lateral direction (CD). CD1 , L CD2 , L CD3 , L CD4 The above-mentioned range shall be defined as follows.

[0057] However, the shape of the individual adhesive film 10 is not limited to these.

[0058] As shown in Figure 5C, when individual adhesive films 10 are formed from a rectangular base film 20 and an adhesive layer 15 laminated on a predetermined portion of the base film 20, the smallest circumscribing rectangle 11 in a top view coincides with the outer shape of the rectangular base film 20.

[0059] Furthermore, when the individual adhesive film 10 is formed from a base film 20 and an adhesive layer 15 laminated on the base film 20, the distance L between the individual adhesive film 10 and the opening surface 44 of the recess 41 D As shown in Figures 4B(a) and (b), when the base film 20 is on the side of the opening surface 44, the distance L between the base film 20 and the opening surface 44 is... D1 As shown in Figure 4B(c), when the adhesive layer 15 is on the side of the opening surface 44, the distance L between the adhesive layer 15 and the opening surface 44 D2 This is the case. Also, as shown in Figure 4C, when the individual adhesive film 10 is a laminate of the protective layer 25, the adhesive layer 15, and the base film 20, the distance L between the base film 20 or protective layer 25 on the opening surface 44 side and the opening surface 44 D3 The distance L mentioned above D In this invention, these distances L D1 , L D2 , L D3 Each of them is the distance L mentioned above. D Ensure that the range is satisfied.

[0060] (Carrier tape)

[0061] In the carrier tape 40, the recess 41 may be formed by embossing the film as described in Patent Document 3, or the recess 41 may be formed by laminating a carrier tape having through holes and a base film that forms the bottom surface of the through holes as described in Patent Document 4.

[0062] In either case, the carrier tape 40 can have a release layer 47 applied to the entire surface of the bottom surface 41a of the recess 41. As shown in Figure 6, the release layer 47 may also be applied only to the bottom surface 41a of the recess 41 of the carrier tape 40.

[0063] The release layer 47 can be formed from a silicone resin or the like. By providing the release layer 47 on the bottom surface 41a, the individual adhesive film pieces 10 can be easily picked up from the storage body 1A, even though the surface 10a of the individual adhesive film pieces 10 in contact with the bottom surface 41a is tacky.

[0064] Furthermore, it is preferable to provide sprocket holes 45 in the carrier tape 40 for transport (Figure 1).

[0065] The material of the carrier tape 40 can be polystyrene, polycarbonate, polyethylene terephthalate, etc., similar to embossed carrier tapes commonly used as packaging materials for electronic components.

[0066] The planar shape, size, and depth of the recess 41 of the carrier tape 40 are determined according to the individual adhesive film 10 to be housed in the recess 41, but typically the length L of the opening surface in the vertical direction (MD) is... HMD The diameter is 1 mm to 27 mm (Figure 3A), and the length L of the opening surface in the lateral direction (CD) is... HCD The depth is 1 mm to 27 mm (Figure 3B), and the pitch P of the recess 41 in the vertical direction (MD) is MD The range is 1 mm to 28 mm (Figure 3B).

[0067] Furthermore, it is preferable that the carrier tape 40 be made of a plastic material with a tensile modulus of 1.5 GPa or higher, in order to prevent the recess 41 from being crushed even when it is wound up.

[0068] (Storage method of the recessed part of the carrier tape)

[0069] As an embodiment of storing individual adhesive films 10 in the recesses 41 of the carrier tape 40, as shown in Figure 3A, the carrier tape 40 may be wound onto the reel 31 with the opening surface 44 of the recesses 41 open, forming a winding body as shown in Figure 2. Alternatively, as shown in Figure 7, a protective film 46 that serves as a lid for the recesses 41 may be laminated onto the carrier tape 40. By providing the protective film 46, it is possible to prevent foreign matter from entering the recesses 41.

[0070] For the protective film 46, the same type used as the cover tape for embossed carrier tape can be used.

[0071] (Method for manufacturing a storage container for individual adhesive films) As an example of a method for manufacturing a container for individual adhesive films, first, a tape-shaped adhesive film winding body 50 is prepared by winding a tape-shaped adhesive film onto a reel (Figure 8). This winding body 50 may be one in which an adhesive layer is formed on a base film, as described in Patent Documents 1 and 2.

[0072] Various printing methods can be used to form the adhesive layer on the base film. Coating and shaping may also be done using known methods.

[0073] At this stage, the winding 50 is an intermediate in the production of individual adhesive films. In this winding 50, in order to prevent problems with the tape-shaped adhesive film becoming tightly wound, the length of the tape-shaped adhesive film is preferably 1000m or less, more preferably 500m or less, and even more preferably 300m or less. There is no particular lower limit, but if it is too short, the manufacturing efficiency will decrease and disadvantages in terms of cost will likely arise, so as an example, it is preferably 20m or more, more preferably 50m or more, and even more preferably 100m or more.

[0074] As shown in Figure 8, multiple rolls of tape-shaped adhesive film 50 are arranged in parallel, a predetermined amount of tape-shaped adhesive film 51 is fed out from each roll 50, and the adhesive film 51 from multiple rolls 50 is cut at the cut line 32 at once to form individual pieces of adhesive film 10. Methods for cutting the film into individual pieces include slitting, half-cutting, punching, and punch press processing.

[0075] On the other hand, a roll 48 of carrier tape 40 is prepared, on which recesses 41 are formed by embossing. The carrier tape 40 has a release layer 47 on the surface on which the recesses 41 are formed. This carrier tape 40 can be obtained by forming the recesses 41 by embossing on a carrier tape that has a release layer 47 applied to it in advance.

[0076] A predetermined amount of carrier tape 40 is pulled out from the roll 48 using the sprocket hole 45, and the adhesive film 10, cut into individual pieces, is transferred to the release layer 47 of the recess 41 of the pulled-out carrier tape 40 using the suction head 33.

[0077] Once the transfer of the carrier tape 40 is complete, a protective film 46 (Figure 7) is placed over the portion as needed, and the tape is wound onto the reel 31. Subsequently, the process of pulling out the tape-shaped adhesive film 51 from the tape-shaped adhesive film winding body 30, cutting it into individual pieces of adhesive film 10, transferring the individual pieces of adhesive film 10 into the recesses 41, and winding the carrier tape 40 onto the reel 31 is repeated.

[0078] If the protective film 46 is not provided, it is preferable to wind the cable so that the opening surface 44 of the recess 41 faces the center of the reel 31.

[0079] In this way, a winding body 30 can be obtained in which the storage body of individual adhesive films 10 is wound around a reel 31. In this winding body 30, since the individual adhesive films 10 are stored in the recesses 41 of the carrier tape 40, deformation and blocking of the adhesive films are less likely to occur. Therefore, the storage body of the present invention makes it possible to make the winding body longer. For example, the length of the carrier tape 40 in the winding body 30 can be 10m or more, 100m or more, and even more than 1000m, and the number of individual adhesive films 10 stored in the winding body 30 can be 100 or more, preferably 1000 or more.

[0080] In a revolving body in which adhesive layers similar in shape to the adhesive layers of individual adhesive films 10 are formed on the base film at predetermined intervals, the individual adhesive layers are more likely to deform from their original shape closer to the center of the revolving body due to winding tension, and blocking is also more likely to occur. Therefore, the length of the base film in this revolving body is usually set to 1000m or less.

[0081] (How to use individual adhesive films) The individual adhesive film containers are pulled out from the winding body 30 wound on the reel 31, the individual adhesive film 10 in the recess 41 is picked up by the chip mounter and placed on a first component such as a circuit board, the second component is picked up and placed on top of the first component, and a joint between the first component and the second component can be obtained by heat-pressing them together.

[0082] If the individual adhesive film is a laminate of a base film and an adhesive layer, the individual adhesive film is temporarily attached to the first component by placing it on the first component with a chip mounter and heat-pressing it. Then, the base film is adsorbed and peeled off with the chip mounter to expose the adhesive layer of the individual adhesive film, and the second component is placed on the adhesive layer and heat-pressed to obtain a joint between the first and second components.

[0083] These bonding methods do not require special heat-sealing tools, and conventional chip mounters can be used to pick up the adhesive film and components.

[0084] In this case, the adhesive film may contain solder particles, as described in Japanese Patent Publication No. 2023-125888, and the method of using the individual adhesive films can be the same as described in the same publication and Japanese Patent Publication No. 2020-198442.

[0085] There are no particular restrictions on the first and second electronic components connected by individual adhesive films. For example, the first electronic component may include semiconductor elements utilizing PN junctions (power generation elements such as solar cells, image sensors such as CCDs, light-emitting elements such as μLEDs, Peltier elements), various other semiconductor elements, IC chips, IC modules, and FPCs. The second electronic component may include, in addition to the components exemplified as the first electronic component, FPCs, glass substrates, plastic substrates, rigid substrates, and ceramic substrates. Furthermore, there are no particular restrictions on the shape, size, and application of the first and second electronic components, as long as they do not impair the effects of the present invention. These electronic components may be small and have narrow terminal sizes, and high-precision alignment may be required for mounting the electronic components. For example, the bump area may be several tens of micrometers. 2 ~several thousand μm 2 Miniaturized electronic components can also be connected. In this invention, the first or second electronic component to be connected by the adhesive film is suitable if it requires good conductivity, but is not limited to that. In various photoelectric fusion devices on which electronic components such as photodiodes, image sensors, and LEDs (light-emitting diodes) are mounted as the first or second electronic component, it is preferable to apply the individual adhesive film of the present invention because extremely good adhesion and high work efficiency are required.

[0086] The present invention also includes a method for manufacturing a connecting structure that connects a first electronic component and a second electronic component via a piece-shaped adhesive film. In this case, the method for connecting the first electronic component and the second electronic component may be a method in which piece-shaped adhesive films are placed on the terminals or terminal rows of the first and second electronic components and heated and pressed with a crimping tool, or it may be a reflow method. Known methods such as temporary bonding may be used to attach the piece-shaped adhesive film to the first or second electronic component. [Explanation of symbols]

[0087] 1A Adhesive film storage unit 10, 10A, 10B, 10C, 10D, 10E, 10F Individual adhesive films 10a The surface of the individual adhesive film that is in contact with the bottom surface of the recess of the carrier tape. 11 Minimum circumscribing rectangle of a piece-shaped adhesive film 12 Conductive particles 15 Adhesive layer 15a Single layer of adhesive 15b Conductive particle containing layer 15c Adhesive layer that does not contain conductive particles 16 Adhesives 20 base film 20a The surface of the base film that is in contact with the bottom surface of the recess of the carrier tape. 25 Protective layer 25a Surface of the protective layer that is in contact with the bottom surface of the recess of the carrier tape A reel containing 30 individual adhesive film segments housed in recesses within the carrier tape. 31 Reels 32 cut lines 33 Suction heads 40 Carrier Tapes 41 Recess 41a Bottom surface of the recess 44 Opening surface 45 sprocket holes 46 protective films 47 Release layer 48. Roll of carrier tape 50. Roll of tape-shaped adhesive film 51 Tape-shaped adhesive film 60 Electronic components such as semiconductor devices 61 Film-like electronic components L MD1 , L MD2 , L MD3 , L MD4 The longitudinal (MD) distance between the vertex of the smallest circumscribing rectangle of the adhesive film and the inner wall of the recess. L CD1 , L CD2 , L CD3 , L CD4 The lateral distance (CD) between the vertex of the smallest circumscribing rectangle of the adhesive film and the inner wall of the recess. L D , L D1 , L D2 , L D3 Distance between the adhesive film and the opening surface of the recess

Claims

1. A storage body for individual adhesive films, wherein individual adhesive films are stored within recesses of a carrier tape, the surface of each individual adhesive film that contacts the bottom surface of the recess has tack properties, and the bottom surface of the recess is treated for release.

2. The storage body according to claim 1, wherein the individual adhesive film is an adhesive layer containing conductive particles.

3. The storage body according to claim 2, wherein the individual adhesive films are anisotropic conductive films.

4. A storage body according to any one of claims 1 to 3, which is wound around a reel.

5. The storage body according to any one of claims 1 to 3, wherein the adhesive layer of the individual adhesive film pieces is formed of a curable resin.

6. The storage body according to any one of claims 1 to 3, wherein, in a top view of the recess, the distance in the vertical direction (MD) between each vertex of the minimum circumscribing rectangle of the individual adhesive film and the inner wall of the recess is 200 μm or less, and the distance in the horizontal direction (CD) is 200 μm or less.

7. The storage body according to any one of claims 1 to 3, wherein the distance between the individual adhesive film pieces and the opening surface of the recess is 2000 μm or less.

8. A method for manufacturing a connecting structure, comprising connecting a first electronic component and a second electronic component via a piece-shaped adhesive film as described in any one of claims 1 to 3.

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