Auxiliary device for measuring thermal performance and method for measuring thermal performance
Patent Information
- Application Number
- JP2026048966
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-31
- Filing Date
- 2026-03-24
- Publication Date
- 2026-10-14
AI Technical Summary
【0010】 前記態様の熱性能計測補助装置及び熱性能計測方法によれば、箱体の内部の空気の流れを最小限に抑えることができるので、熱流計の測定誤差を小さくすることができ、これにより、区画構造物の熱性能を更に正確に計測することができる。
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Figure 2026167560000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to an apparatus used for measuring the thermal performance of partition structures of existing buildings and a measurement method using the apparatus.
Background Art
[0002] Patent Document 1 discloses a thermal performance evaluation apparatus. This apparatus covers a part of the indoor side surface of a wall material with a partitioning means, supplies warm air by an air blowing means into a first space partitioned by the wall material and the partitioning means to maintain the inside of the first space at a high temperature state, and evaluates the thermal performance of the wall material based on the temperatures measured by a first measurement means, a second measurement means, and a third measurement means.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Non-Patent Documents
[0004]
Non-Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] The thermal performance evaluation apparatus of Patent Document 1 supplies warm air into the first space by the air blowing means to maintain the inside of the first space at a high temperature state, and secures a temperature difference between both sides of the wall material, thereby improving the accuracy of evaluation.
[0006] However, if one attempts to evaluate the thermal performance of partition structures such as wall materials using a method similar to the heat flow meter method described in Non-Patent Literature 1, supplying warm air by a blower creates airflow within the first space, which may cause errors in the measurement results of the heat flow meter.
[0007] This disclosure aims to solve problems such as the following, for example. [Means for solving the problem]
[0008] A thermal performance measurement auxiliary device according to one aspect of this disclosure is: A hollow box-shaped body with one side open, A heating device is positioned inside the box, facing the opening of the box, and heats the air inside the box. It is equipped with.
[0009] A thermal performance measurement method according to one aspect of this disclosure is: A measuring device for measuring the thermal performance of a partition structure is attached to the surface of a partition structure of an existing building that is the subject of measurement. The thermal performance measurement auxiliary device according to the above embodiment is mounted such that the measuring device attached to the surface of the partition structure is inside the box, while the open surface of the box is closed on the surface of the partition structure. The heating device is operated to heat the air inside the box, Based on the measurement results from the aforementioned measuring device, the thermal performance of the partitioned structure is measured. [Effects of the Invention]
[0010] According to the thermal performance measurement auxiliary device and thermal performance measurement method of the above embodiment, the airflow inside the box can be minimized, thereby reducing the measurement error of the heat flow meter, and thus enabling more accurate measurement of the thermal performance of the partitioned structure. [Brief explanation of the drawing]
[0011] [Figure 1] A front view showing an example of a thermal performance measurement support device. [Figure 2] A II-II cross-sectional view showing the thermal performance measurement assisting device. [Figure 3] A flowchart showing an example of thermal performance measurement processing. [Figure 4] A side cross-sectional view showing an example of the heat flux meter installation step. [Figure 5] A front view showing the heat flux meter installation step. [Figure 6] A side cross-sectional view showing an example of the assisting device installation step. [Figure 7] A front view showing the assisting device installation step. [Figure 8] A side cross-sectional view showing an example of the assisting device installation step and the thermometer placement step. [Figure 9] A front view showing the assisting device installation step and the thermometer placement step. [Figure 10] A flowchart showing the heating step. [Figure 11] A block diagram showing a modified example of the thermal performance measurement assisting device according to one aspect of the present disclosure. [Figure 12] A flowchart illustrating an example of thermal performance determination processing executed by the control device 18 of the thermal performance measurement assisting device of Fig. 11. [Mode for Carrying Out the Invention]
[0012] Hereinafter, an example of the present disclosure will be described with reference to the accompanying drawings. The following description is essentially merely exemplary, and does not limit the present disclosure, applications of the present disclosure, or uses of the present disclosure. The accompanying drawings are schematic diagrams, and the dimensional ratios and the like may differ between the illustrated configurations and actual implemented products. In the following description, terms such as "about" or "approximately" mean that the values or shapes following these terms include a range of allowable errors determined by a person skilled in the art.
[0013] The thermal performance measurement assisting device 10 according to one aspect of the present disclosure will be described with reference to Fig. 1 and Fig. 2.
[0014] The thermal performance measurement assisting device 10 is used to assist the measurement of the thermal performance of partition structures that partition spaces such as walls in existing buildings such as residences.
[0015] The thermal performance measurement auxiliary device 10 comprises a box 12 and a heating device 14. In this embodiment, the thermal performance measurement auxiliary device 10 includes, for example, a box 12, an insulating material 13, a heating device 14, a thermal conduction long-wavelength radiating member 15, a perforated plate 16, a thermometer 17, and a control device 18 (not shown).
[0016] The box 12 has a hollow shape, such as a roughly rectangular box, with one side (e.g., the -Y side) completely open. The box 12 is made of a lightweight material with low thermal conductivity and excellent impact resistance, such as acrylic, but is not limited to this. The height of the box 12 (e.g., length in the ±Z direction) is, for example, 200 mm (millimeters) or less, but is not limited to this. The width of the box 12 (e.g., length in the ±X direction) is, for example, twice the height or less, but is not limited to this. The depth of the box 12 (e.g., length in the ±Y direction) is, for example, twice the height or less and between 1 and 2 times the width, but is not limited to this. The sum of the height, width, and depth of the box 12 is, for example, 1000 mm or less, but is not limited to this. This makes it possible to miniaturize the thermal performance measurement auxiliary device 10.
[0017] The box body 12 may also have other hollow shapes, such as a roughly trapezoidal box shape.
[0018] The heating device 14 is placed inside the box 12 and heats the air inside the box 12.
[0019] The heating device 14 includes a heating surface 41 that generates heat, such as an electric heating element. The heating surface 41 is positioned opposite the opening of the box 12. That is, the heating surface 41 is positioned substantially parallel to the opening of the box 12. Furthermore, the heating surface 41 extends across the entire surface of a cross-section of the internal space of the box 12 cut along a plane parallel to the opening.
[0020] The heating device 14 is flat and positioned in contact with the surface of the box 12 facing the opening. This allows the thickness of the box 12 (for example, the length in the ±Y direction) to be reduced, and the thermal performance measurement auxiliary device 10 to be made smaller and lighter.
[0021] Furthermore, the heating device 14 is covered with a heat-resistant insulator such as silicone rubber, but is not limited to this.
[0022] The thermally conductive long-wavelength radiating member 15 is a plate-shaped member formed from a material with high thermal conductivity and high long-wavelength emissivity, such as a matte black coated copper plate. The thermally conductive long-wavelength radiating member 15 has the same area as the heating surface 41 of the heating device 14, adheres to the heating surface 41 without any gaps, and is positioned to cover the entire heating surface 41. This makes the surface temperature distribution of the heating surface 41 uniform. The heat generated on the heating surface 41 of the heating device 14 is converted into infrared rays by the thermally conductive long-wavelength radiating member 15 and radiated from the surface of the thermally conductive long-wavelength radiating member 15 into the interior of the box 12.
[0023] Furthermore, if the heating surface 41 of the heating device 14 itself has high thermal conductivity and high long-wavelength emissivity, the thermally conductive long-wavelength radiating member 15 may not be necessary.
[0024] The insulation material 13 encloses the internal space of the box 12, preventing heat from escaping from the inside of the box 12 to the outside. The insulation material 13 is, for example, Styrofoam (registered trademark). The insulation material 13 has, for example, an edge portion 31 and an inner wall portion 32.
[0025] The edge portion 31 is, for example, a roughly rectangular frame plate and is positioned along the edge surrounding the opening of the box body 12, and is located between the object to be measured and the box body 12 when the thermal performance measurement auxiliary device 10 is used (see Figure 8). The width of the edge portion 31 (for example, the length in the direction perpendicular to the ±Y direction) is greater than the thickness of each face of the box body 12.
[0026] The inner wall portion 32 is positioned on the inside of the box body 12, surrounding the internal space of the box body 12, adhering to each surface of the box body 12 without any gaps, extending from the opening of the box body 12 to the thermal conduction long wavelength radiating member 15, and is in contact with the thermal conduction long wavelength radiating member 15.
[0027] Furthermore, if the box body 12 itself has high thermal insulation properties, the insulation material 13 may not be necessary.
[0028] The perforated plate 16 is a plate-like member having numerous through holes, such as perforated metal. The perforated plate 16 is formed from a material with high thermal conductivity, such as aluminum.
[0029] The perforated plate 16 is positioned substantially parallel to the opening of the box body 12 and the heating surface 41 of the heating device 14, dividing the internal space of the box body 12 into a space on the side of the opening of the box body 12 and a space on the side of the heating device 14. The width (e.g., length in the ±Y direction) of the space on the opening side of the box body 12 separated by the perforated plate 16 is, for example, 100 mm or more, but is not limited thereto. The width (e.g., length in the ±Y direction) of the space on the heating device 14 side separated by the perforated plate 16 is, for example, 5 mm or more, but is not limited thereto.
[0030] The perforated plate 16 diffuses the convective airflow generated by heating by the heating device 14, thereby reducing turbulence in the airflow.
[0031] The thermometer 17 (an example of a first temperature detection device) is a temperature sensor such as a thermocouple, which detects the temperature inside the box 12 and outputs a signal representing the detected temperature. The thermometer 17 is placed inside the box 12, for example, on top of the insulation material 13 on the lower side (for example, the -Z side).
[0032] The thermometer 17 is positioned near the opening of the box 12, but is not limited to that position. The thermometer 17 is positioned so as not to come into contact with the object being measured, but is not limited to that position. Furthermore, the thermometer 17 is positioned off-center (i.e., away from the lateral center in the lateral direction) of the box 12, rather than in the center (for example, in the ±X direction), but is not limited to that position.
[0033] Note that there may be more than one thermometer 17. If the thermal performance measurement auxiliary device 10 has multiple thermometers 17, each thermometer 17 will be placed in a different position inside the box 12. For example, a second thermometer 17 may be placed on the heating surface 41 of the heating device 14 to detect the temperature of the heating surface 41.
[0034] The control device 18 (see Figure 11) receives the signal output by the thermometer 17 and controls the heating device 14 based on the temperature detected by the thermometer 17. For example, the control device 18 controls the operation of the heating device 14 so that the temperature inside the box 12 reaches a predetermined target value.
[0035] The thermal performance measurement auxiliary device 10 may further include a temperature logger that records the temperature detected by the thermometer 17.
[0036] Referring to Figure 3, the thermal performance measurement process 90 will be explained.
[0037] The thermal performance measurement process 90 (an example of the thermal performance measurement method of this disclosure) measures the thermal performance of partition structures that divide spaces in existing buildings such as houses, such as walls, windows, ceilings, and floors.
[0038] The thermal performance measurement process 90 includes, for example, a heat flow meter installation step 91, an auxiliary device installation step 92, a thermometer installation step 93, a heating step 94, and a thermal performance calculation step 95.
[0039] The heat flow meter installation process 91 will be described with reference to Figures 4 and 5.
[0040] In the heat flow meter installation process 91 (also called the first measuring device installation process), a first measuring device such as a heat flow meter 86 is attached to the surface of the object to be measured, such as a wall 20.
[0041] For example, a roughly rectangular adhesive sheet 81 is attached to one surface 21 of the wall 20 (for example, the interior side). The shape of the adhesive sheet 81 is not limited to a roughly rectangular shape; it may be a circular shape or other shape. For example, the adhesive sheet 81 is made of a material with high thermal conductivity and is constructed to be as thin as possible. Grease or oil compound may be used instead of the adhesive sheet 81.
[0042] Then, the heat flow meter 86 is attached to the wall 20 by attaching it to an adhesive sheet 81 that has been attached to the surface 21 of the wall 20.
[0043] Alternatively, the heat flow meter 86 may be attached to the wall 20 using means other than the adhesive sheet 81. Using the adhesive sheet 81 eliminates the gap between the wall 20 and the heat flow meter 86, thus reducing the measurement error of the heat flow meter 86.
[0044] The auxiliary device installation process 92 will be described with reference to Figures 6 and 7.
[0045] In the auxiliary device installation step 92, the thermal performance measurement auxiliary device 10 is attached to the object to be measured so as to cover the measuring device (e.g., heat flow meter 86) that was attached to the surface of the object to be measured in the heat flow meter installation step 91.
[0046] For example, a rectangular frame-shaped adhesive sheet 82 is attached to the surface 21 of the wall 20 so as to surround the heat flow meter 86 that was installed in the heat flow meter installation process 91.
[0047] Refer to Figures 8 and 9 to continue the explanation of the auxiliary device installation process 92.
[0048] Subsequently, the edge 31 of the insulation material 13 of the thermal performance measurement auxiliary device 10 is attached to the adhesive sheet 82 attached to the surface 21 of the wall 20, thereby closing the opening of the box 12 of the thermal performance measurement auxiliary device 10 with the wall 20, and the thermal performance measurement auxiliary device 10 is installed so that the heat flow meter 86 is placed inside the space enclosed by the thermal performance measurement auxiliary device 10 and the wall 20.
[0049] Alternatively, the thermal performance measurement auxiliary device 10 may be attached to the wall 20 using other means (for example, a support material) instead of the adhesive sheet 82. Using the adhesive sheet 82 prevents a gap from forming between the wall 20 and the thermal performance measurement auxiliary device 10, thus preventing heat from leaking out of the box 12 through the gap.
[0050] The thermal performance measurement auxiliary device 10 may have a through-hole (not shown) for routing wiring from the heat flow meter 86 to the outside of the box 12. The through-hole is provided, for example, in the lower edge 31 of the insulation material 13. This prevents the air inside the box 12, which is warmer than the air outside the box 12, from leaking out of the box 12.
[0051] Alternatively, the wiring may be passed through the through-hole in advance and then the through-hole may be sealed. The wiring may be connected to the heat flow meter 86 in advance. The wiring passed through the through-hole may be connected to the heat flow meter 86 immediately before attaching the thermal performance measurement auxiliary device 10 to the wall 20. For sealing the through-hole, a material equivalent to the insulation material 13 may be used, or a sealant based on resin or synthetic adhesive such as pipe putty may be used.
[0052] Furthermore, if the adhesive force of the adhesive sheet 82 alone is insufficient to hold the thermal performance measurement auxiliary device 10, a support structure for supporting the thermal performance measurement auxiliary device 10 may be placed below the thermal performance measurement auxiliary device 10. The support structure may be, for example, a support rod or support stand, and may have a structure that allows its height to be changed to match the height at which the thermal performance measurement auxiliary device 10 is installed, like a tension rod.
[0053] Similarly, the thermometer placement step 93 will be described with reference to Figures 8 and 9.
[0054] In the thermometer installation process 93 (also called the second measuring device installation process), a second measuring device, such as a thermometer 87, is placed in a location other than inside the housing 12 of the thermal performance measurement auxiliary device 10 that was installed in the auxiliary device installation process 92.
[0055] For example, a thermometer 87 is placed on the opposite side of the wall 20 (for example, the space on the side facing the surface 22 opposite to the surface 21 to which the heat flow meter 86 or thermal performance measurement auxiliary device 10 is attached, such as the outdoor side).
[0056] The thermometer 87 may be placed in a location that is not affected (or is less affected) by external factors. Locations not affected by external factors include, for example, locations not affected by direct sunlight or reflected sunlight from the surroundings, locations not affected by heat-generating elements (electronic equipment, lighting, human body, etc.), and locations away from thermal bridges or corners such as window frames (i.e., parts where heat easily escapes). The thermometer 87 may also be placed in a location that does not come into contact with the surface 22 of the wall 20. Furthermore, the thermometer 87 may be placed in a position symmetrical to the thermometer 17 with respect to the wall 20.
[0057] The heating process 94 will be described with reference to Figure 10.
[0058] In heating step 94, the heating device 14 is operated to warm the air inside the box 12.
[0059] The heating process 94 includes, for example, a heating device operation process 941, a temperature comparison process 942, a heating device shutdown process 943, and a temperature comparison process 944.
[0060] In the heating device operation step 941, the control device 18 operates the heating device 14. After that, the process proceeds to the temperature comparison step 942.
[0061] In the temperature comparison step 942, the control device 18 receives the temperature detected by the thermometer 87 and calculates a target temperature for the air inside the box 12. The target temperature for the air inside the box 12 is set to be at least 10 degrees higher than the temperature detected by the thermometer 87. For example, the target value may be calculated by adding 10 degrees to the temperature detected by the thermometer 87. The target value is set to be, for example, 60 degrees Celsius or lower (for example, 50 to 60 degrees Celsius).
[0062] Next, the control device 18 receives the temperature detected by the thermometer 17 as input and compares it with the target value.
[0063] If the temperature detected by the thermometer 17 is below the target value, the process returns to heating device operation step 941.
[0064] If the temperature detected by the thermometer 17 is above the target value, the process proceeds to the heating device stop step 943.
[0065] In the heating device stop step 943, the control device 18 stops the heating device 14. Then, the process proceeds to the temperature comparison step 944.
[0066] In the temperature comparison step 944, the control device 18 receives the temperature detected by the thermometer 87 and calculates a target temperature for the air inside the box 12. As described above, the target temperature for the air inside the box 12 is set to 10 degrees higher than the temperature detected by the thermometer 87. For example, the target value is calculated by adding 10 degrees to the temperature detected by the thermometer 87. If the temperature detected by the thermometer 87 is 10 degrees or more lower than the target value calculated in the temperature comparison step 942, the target value may be used as is without updating it.
[0067] Next, the control device 18 receives the temperature detected by the thermometer 17 as input and compares it with the target value.
[0068] If the temperature detected by the thermometer 17 is below the target value, the process returns to heating device operation step 941.
[0069] If the temperature detected by the thermometer 17 is above the target value, the process returns to the heating device stop process 943.
[0070] In this way, after the air inside the box 12 has been warmed, the process proceeds to the thermal performance calculation step 95 when the temperature of the air inside the box 12 detected by the thermometer 17 reaches the target value, and the temperature on the other side of the wall 20 detected by the thermometer 87 becomes nearly stable (for example, when the change in heat flux density q measured by the heat flow meter 86 is within ±10%).
[0071] Furthermore, if the heating device 14 can not only be switched on and off but also its output when switched on can be adjusted, the control device 18 may adjust the output of the heating device 14 so that the temperature of the air inside the box 12 stabilizes at approximately the target value.
[0072] In the thermal performance calculation process 95, the thermal performance of the object to be measured is calculated.
[0073] For example, the control device 18 calculates the heat transfer coefficient U of the wall 20 based on the temperature T1 detected by the thermometer 17, the temperature T2 detected by the thermometer 87, and the heat flux density q measured by the heat flux meter 86, and outputs the calculated result.
[0074] Furthermore, if the object of measurement is a partition structure that separates the indoors from the outdoors, such as the exterior wall of a building, the thermal performance measurement process 90 may be carried out under conditions where the outdoor temperature is stable, such as on a cloudy night.
[0075] By measuring the thermal performance of the object in this manner, a temperature difference can be ensured between both sides of the object, allowing for accurate measurement of its thermal performance. Furthermore, the airflow inside the box 12 can be minimized, reducing its influence on the measurement results of the heat flow meter 86, thus enabling even more accurate measurement of the thermal performance of the object.
[0076] The embodiments described above are examples intended to facilitate understanding of the present invention. The present invention is not limited thereto and includes various modifications, changes, additions, or deletions without departing from the scope defined by the appended claims. This will be readily apparent to those skilled in the art from the above description.
[0077] The evaluation of the thermal performance (e.g., thermal transmittance (U-value)) of wall materials, windows, and ceiling materials in buildings (e.g., general residences and office buildings) is based on the assumption of a steady state (e.g., a state where the indoor and outdoor air temperatures and the amount of heat passing between materials remain constant and unchanging). When conducting measurements on-site, it is necessary to do so in an environment close to a steady state. As for outdoor conditions, nighttime, when the influence of sunlight is small and temperature fluctuations are minimal, is a suitable target. However, indoors, it is necessary to use air conditioning or heating equipment to keep the room temperature constant, which poses a problem as it restricts the daily activities of the occupants. Furthermore, since it is desirable to maintain an indoor-outdoor temperature difference of 10K (Kelvin) or more to ensure measurement accuracy, it is difficult to conduct highly accurate thermal performance measurements in a natural thermal environment where the aforementioned temperature control is not performed.
[0078] The objective is to provide a thermal performance measurement support device that can improve the accuracy of evaluating the thermal performance of buildings through on-site measurements.
[0079] There is a demand to measure whether the thermal performance of building materials such as walls and windows is being achieved as planned during the design phase, or to measure unknown thermal performance, without restricting the daily activities of building occupants (for example, restrictions on heating or cooling).
[0080] The thermal performance measurement auxiliary device 10 is used when measuring the on-site thermal performance of building components (walls, windows, floors, etc.).
[0081] By installing a chamber (e.g., a box 12) on one side of the component to be measured to partition a narrow area, and heating only the inside of the chamber, it is not necessary to control the temperature of the entire room, and highly accurate thermal performance measurements can be performed on-site.
[0082] The thermal performance of the target component after installation is measured, evaluated, and studied on-site. According to the hot box method defined in Japanese Industrial Standard A1420:1999, the size of the opening facing the heating section inside the test apparatus must be 900mm x 900mm or larger. Due to the large size and weight of the apparatus, transportation and mounting of the measurement target surface are difficult.
[0083] • Chamber configuration For measuring the thermal performance of a component that partitions a space, the system incorporates a structure that forms a partitioned area (hereinafter referred to as the partitioned area, including the area inside the box 12) on the indoor side of the component to be measured, and a means for heating the partitioned area (hereinafter referred to as the heating means, including the heating device 14).
[0084] By covering the surface of the built-in heating device 14 (hereinafter referred to as the heating surface) with a material that has high long-wavelength emissivity and thermal conductivity, the surface temperature distribution of the heating surface 41 is made uniform, and heat is uniformly transferred to the air within the section.
[0085] A perforated plate can be provided between the heating surface 41 and the surface of the component to be measured. This diffuses the convective airflow generated by heating, reducing turbulence in the airflow near the surface of the component to be measured.
[0086] ·Operation By heating the air within the partitioned area using a heating means, a temperature difference is created between the outside and inside the partitioned area, forming a temperature gradient within the partitioned member, amplifying the amount of heat passing between the inside and outside, and assisting in the measurement of thermal performance.
[0087] To reduce weight and thickness, a planar heating element may be incorporated as a heating means.
[0088] The air temperature within the compartment may be controlled to a predetermined temperature by starting or stopping the heating means.
[0089] Because the indoor air is heated locally by the chamber rather than the entire room, a temperature difference between the indoor and outdoor air can be created without restricting the daily activities of the building's inhabitants, and measurement accuracy can be maintained in buildings under actual operation.
[0090] A planar heating element may be used as the heating element. This allows for a lighter and thinner device, making it easier to transport and attach to the surface being measured for thermal performance.
[0091] While methods for evaluating thermal insulation performance, such as the heat flow meter method, protective heat plate method, heat box method, and thermal imaging method, are well-established, on-site measurements require that the room be air-conditioned, that the indoor thermal environment be in a steady state, and that there is a sufficient temperature difference between the inside and outside.
[0092] However, in actual operating buildings, it is difficult to request 24-hour continuous air conditioning operation for measurement purposes, making it impossible to evaluate in an ideal environment.
[0093] When measuring the thermal performance of a partitioned structure under normal temperature conditions (i.e., without using air conditioning), the lack of a temperature difference between the inside and outside can lead to unstable measurements and low measurement accuracy.
[0094] By attaching a small chamber to the surface of the component to be measured, the heated area is localized more effectively, allowing for easy on-site measurement of the thermal performance of the component (e.g., a wall component).
[0095] The air temperature near the component being measured may be heated only.
[0096] By combining a small chamber with a planar heating element (including a thermostat), the thermal performance measurement auxiliary device 10 can be made lighter.
[0097] Thermal performance is a numerical value that evaluates how much heat passes through for every 1°C difference in temperature between the inside and outside, and is calculated as heat transfer rate (W / m2) ÷ temperature difference between inside and outside (°C).
[0098] The measurement error for temperature is generally ±0.5 to 1°C, while the measurement error for heat flow meters is ±2%. Therefore, if the temperature difference between the inside and outside is too small and equal to the error, accuracy may not be ensured.
[0099] Heat flows from areas of higher temperature to areas of lower temperature. A small temperature difference means a small amount of heat, so it may not be possible to accurately assess the heat flow.
[0100] The thermal performance measurement auxiliary device 10 has a structure (for example, a box 12) that forms a partitioned area that divides the interior side surface of the member, and a heating means (for example, a heating device 14) that heats the inside of the partitioned area, for evaluating and measuring the thermal performance of the member that partitions a space.
[0101] By covering the heating surface 41 of the built-in heating device 14 with a material that has high long-wavelength emissivity and thermal conductivity, the surface temperature distribution of the heating surface 41 is made uniform, and heat can be uniformly transferred to the air within the section.
[0102] By providing a perforated plate between the heating surface 41 and the surface of the component, the convective airflow generated by heating can be diffused, and turbulence in the airflow near the surface of the component can be reduced.
[0103] The thermal performance measurement support device 10 heats the air within the partitioned area using a heating means, creates an air temperature difference between the outside and inside the partitioned area, forms a temperature gradient within the partitioned member, amplifies the amount of heat passing between the inside and outside, and assists in measuring thermal performance.
[0104] The thermal performance measurement auxiliary device 10 may have a heating means using a planar heating element in order to reduce weight and thickness.
[0105] The thermal performance measurement auxiliary device 10 may control the air temperature within the compartment to a predetermined temperature by starting and stopping (on / off) the heating means.
[0106] The thermal performance measurement auxiliary device 10 may be a box-shaped structure with an open side facing the member to be measured (wall surface).
[0107] For example, the sum of the lengths of the three sides (width, depth, and height) of the thermal performance measurement auxiliary device 10 shall be within 1000 mm. For example, the height of the thermal performance measurement auxiliary device 10 shall be within 200 mm, the ratio of the height to the width of the thermal performance measurement auxiliary device 10 shall be within 1:2, and / or the ratio of the height to the depth of the thermal performance measurement auxiliary device 10 shall be within 1:2, and / or the ratio of the width to the depth of the thermal performance measurement auxiliary device 10 shall be between 1:2 and 1:1.
[0108] The thermal performance measurement auxiliary device 10 may be made of a lightweight material with low thermal conductivity and excellent impact resistance (for example, an acrylic plate).
[0109] To prevent heat from escaping from the partitioned area (i.e., the area inside the box 12) to the outside of the thermal performance measurement auxiliary device 10, the inside of the box 12 may be covered with an insulating material (e.g., Styrofoam®) from the inside of the box 12 to the contact surface which is the surface of the member to be measured (e.g., the wall).
[0110] Holes may be provided in the thermal insulation material of the ground surface for wiring measuring instruments and for wiring sensors (described later) for monitoring the temperature within the partitioned area.
[0111] The holes drilled as described above are sealed with, for example, a material equivalent to the insulation material, or a filler (for example, a sealant based on resin and synthetic adhesive, pipe putty, etc.).
[0112] The thermal performance measurement auxiliary device 10 and the member to be measured (for example, a wall) are fixed together, for example, using adhesive tape. If the surface of the wall is rough, or if the adhesive tape is not strong enough to fix or adhere the thermal performance measurement auxiliary device 10 to the wall, it may be fixed together using a support material (for example, a tension rod).
[0113] To prevent any gaps between the thermal performance measurement support device 10 and the component to be measured (for example, a wall), an adhesive sheet may be attached to the entire surface on which the insulation material is installed.
[0114] The heating device 14 (for example, a planar heating element) is fixed to the bottom surface of the box 12, for example.
[0115] The heating surface 41 of the heating device 14 is covered with a material that has high long-wavelength emissivity and thermal conductivity (for example, a matte black copper plate).
[0116] The perforated plate 16 is installed, for example, between the heating surface 41 of the heating device 14 and the wall surface.
[0117] The perforated plate 16 is made of, for example, a material with high thermal conductivity (e.g., aluminum).
[0118] The installation position of the perforated plate 16 shall be, for example, at a distance of 5 mm or more from the heating surface 41 of the heating device 14 and at least 100 mm from the member to be measured (for example, a wall).
[0119] For example, a planar heating element (an example of a heating device 14) built into the thermal performance measurement auxiliary device 10 heats the air within a partitioned area (for example, inside the box 12).
[0120] The planar heating element may be one in which both sides are covered with a heat-resistant insulator (for example, silicone rubber).
[0121] The planar heating element may be one that heats intermittently by supplying power (for example, an electric heating wire type), and whose heating operation stops when the power supply is stopped.
[0122] The heating control means (for example, the control device 18) consists of, for example, a temperature regulator that adjusts the temperature of the planar heating element and a temperature sensor (for example, a thermometer 17) installed within the heating area (for example, inside the box 12).
[0123] The temperature sensor measures the air temperature within a partitioned area. The measurement locations of the temperature sensor include, for example, at least one location capable of measuring the air temperature near the object to be measured (e.g., a wall) and at least one location capable of measuring the surface temperature of a planar heating element.
[0124] The heating control means is configured to implement, for example, the temperature control flow shown in Figures 3 and 10.
[0125] The thermal performance measurement auxiliary device 10 may include a monitor that allows confirmation of the heating status within the thermal performance measurement auxiliary device 10. The monitor consists of, for example, a temperature logger (e.g., the memory 182 of the control device 18) and a sensor for monitoring the temperature within a partitioned area (e.g., a thermometer 17).
[0126] The heating control means can be connected to a sensor for monitoring the temperature within the partitioned area, and can be configured to output the air temperature within the partitioned area to a device other than a temperature logger (for example, a display device 19 (see Figure 11)) for verification. In this case, a part of the heating control means constitutes a part of the monitor.
[0127] Figure 11 shows an example of a thermal performance measurement auxiliary device 10 equipped with two thermometers 17. Hereafter, the two thermometers 17 will be referred to as the first thermometer 171 and the second thermometer 172. In the example in Figure 11, the first thermometer 171 is located near the opening inside the box 12 (i.e., the object to be measured). The second thermometer 172 is located on the heating surface 41 of the heating device 14 and detects the temperature of the heating surface 41. The second thermometer 172 is an example of a "temperature sensor that detects the temperature of a heating surface".
[0128] The control device 18 is configured to control the heating device 14 so that the temperature of the heating surface 41 detected by the second thermometer 172 falls below a threshold. The control device 18 monitors, for example, the temperature of the air inside the box 12 detected by the first thermometer 171 and the temperature of the heating surface 41 detected by the second thermometer 172, and starts measuring the thermal performance after the fluctuations in these temperatures fall within a predetermined range (for example, within 5% of the average value according to ISO 9869-1). In this embodiment, the control device 18 is configured to monitor the heat flux density q measured by the heat flux meter 86.
[0129] In this embodiment, the control device 18 includes a processor 181, a memory 182, and a communication unit 183.
[0130] The processor 181 includes, for example, a CPU, vCPU, MPU, GPU, DSP, FPGA, or ASIC. The memory 182 consists of, for example, an internal recording medium or an external recording medium and is configured to store programs necessary for thermal performance measurement. The internal recording medium includes non-volatile memory, etc. The external recording medium includes a hard disk drive (HDD), solid-state drive (SSD), or optical disc drive, etc. The communication unit 183 includes, for example, a communication circuit or communication module for sending and receiving data with external devices including the server device 3 and the camera 4.
[0131] Referring to Figure 12, an example of the thermal performance determination process performed by the control device 18 will be explained. The process in Figure 12 is performed, for example, by the processor 181 executing a predetermined program.
[0132] As shown in Figure 12, when the control device 18 drives the heating device 14 (step S1), the control device 18 determines whether the temperature detected by the second thermometer 172 has reached a threshold (step S2). If it is determined that the temperature detected by the second thermometer 172 has not reached a threshold, the process returns to step S1 and the heating device 14 continues to run.
[0133] When the temperature detected by the second thermometer 172 is determined to have reached a threshold, the control device 18 stops the heating device 14 (step S3) and determines whether the temperature detected by the second thermometer 172 has fallen below the threshold (step S4). If the temperature detected by the second thermometer 172 is not determined to have fallen below the threshold, the process returns to step S3 and the heating device 14 remains stopped.
[0134] When the temperature detected by the second thermometer 172 is determined to be below the threshold, the process returns to step S1 and the heating device 14 is activated. The control device 18 terminates the thermal performance determination process at any time, for example, when the measurement of the thermal performance of the partitioned structure is completed. By monitoring the temperature of the heating surface 41 of the heating device 14 in this way and controlling it so that it does not exceed the threshold, infrared radiation from the heating surface 41 can be suppressed. Therefore, by suppressing heat transfer due to infrared radiation, the influence of infrared radiation on the heat flow meter measurement (i.e., the influence of infrared radiation on heat flow) can be reduced.
[0135] The thermal performance measurement auxiliary device 10 may be equipped with a reduction member that reduces infrared radiation emitted from the heat-generating surface 41. By configuring it in this way, heat transfer due to infrared radiation from the heat-generating surface 41 can be suppressed, thereby reducing the influence on the heat flow meter measurement value (e.g., measurement error) caused by the inside of the box 12 becoming too hot.
[0136] The reduction member can be configured, for example, in the following manner. The reduction member is made of aluminum foil or the like and is located in front of the heat-generating surface 41 (for example, near an opening that is further from the heat-generating surface 41 than the heat-conducting long-wavelength radiating member 15). The porous plate 16 also serves as a reduction member. In this case, the porous plate 16 is made of, for example, a low-activation material. The thermally conductive long-wavelength radiating member 15 also serves as a reduction member. In this case, for example, a portion of the thermally conductive long-wavelength radiating member 15 is made of a low-activation material.
[0137] A thermal performance measurement auxiliary device according to a first aspect of this disclosure is A hollow box-shaped body with one side open, A heating device is positioned inside the box, facing the opening of the box, and heats the air inside the box. It is equipped with.
[0138] A thermal performance measurement assistance device according to a second aspect of this disclosure is, in addition to the thermal performance measurement assistance device according to a first aspect, The heating device is provided with a thermally conductive long-wavelength radiating member that covers the heating surface of the heating device and has higher thermal conductivity and long-wavelength emissivity than the heating surface of the heating device.
[0139] A third aspect of the thermal performance measurement auxiliary device of this disclosure is a thermal performance measurement auxiliary device of the first or second aspect, The box is provided with a perforated plate that has numerous through holes and divides the internal space of the box into a space on the heating device side and a space on the opening side.
[0140] The fourth aspect of the present disclosure is a thermal performance measurement auxiliary device, which is a thermal performance measurement auxiliary device according to any of the first to third aspects. A temperature detection device is positioned near the opening of the box and detects the temperature of the air inside the box. A control device controls the heating device so that the temperature detected by the temperature detection device reaches a predetermined temperature. It is equipped with.
[0141] A fifth aspect of the present disclosure is a thermal performance measurement auxiliary device, which is a thermal performance measurement auxiliary device according to any of the first to fourth aspects. The heating device is planar in shape.
[0142] The thermal performance measurement auxiliary device of the sixth aspect of this disclosure is a thermal performance measurement auxiliary device of any of the first to fifth aspects, A temperature sensor located on the heating surface of the heating device for detecting the temperature of the heating surface, A control device that controls the heating device so that the temperature of the heating surface detected by the temperature sensor falls below a threshold. It is equipped with.
[0143] The thermal performance measurement auxiliary device of the seventh aspect of this disclosure is a thermal performance measurement auxiliary device of any of the first to sixth aspects, The system includes a reducing member that reduces infrared radiation emitted from the heat-generating surface.
[0144] The thermal performance measurement method according to the eighth aspect of this disclosure is: A measuring device for measuring the thermal performance of a partition structure is attached to the surface of a partition structure of an existing building that is the subject of measurement. A thermal performance measurement auxiliary device according to any of the first to seventh embodiments is mounted on the surface of the partition structure so as to cover the open surface of the box body, and the measuring device attached to the surface of the partition structure is located inside the box body. The heating device is operated to heat the air inside the box, Based on the measurement results from the aforementioned measuring device, the thermal performance of the partitioned structure is measured.
[0145] The thermal performance measurement method of the ninth aspect of this disclosure is, in the thermal performance measurement method of the eighth aspect, A second measuring device for measuring the thermal performance of the partition structure is placed on the opposite side of the partition structure. The thermal performance of the partitioned structure is measured based on the measurement results from the aforementioned measuring device and the measurement results from the second measuring device.
[0146] The thermal performance measurement method of the tenth aspect of this disclosure is, in the thermal performance measurement method of the eighth or ninth aspect, The heating device is controlled so that the temperature of the heating surface of the heating device falls below a threshold.
[0147] The thermal performance measurement method of the 11th aspect of this disclosure is a thermal performance measurement method of any of the 8th to 10th aspects, A reduction member is provided to reduce the infrared radiation emitted from the heat-generating surface.
[0148] The embodiments and modifications of this disclosure can be combined with each other, or with each other, or with each other. Features included in the embodiments and modifications of this disclosure can also be combined with each other. The contents of this disclosure are subject to change in configuration details, and changes in combination and order of elements in each embodiment can be realized without departing from the claimed scope and spirit of this disclosure. [Explanation of Symbols]
[0149] 10. Thermal performance measurement support device 12 Box body 13. Insulation 14 Heating device 15 Thermal Conduction Long Wavelength Radiation Member 16 Perforated plate 17, 87 thermometer 18 Control device 20 Wall 21, 22 surface 31 Edge 32 Inner wall section 41 Heating surface 81, 82 Adhesive sheets 86 Heat flow meter 90 Thermal performance measurement process 91 Heat flow meter installation process 92 Auxiliary equipment installation process 93 Thermometer installation process 94 Heating process 95 Thermal performance calculation process 941 Heating device operation process 942, 944 Temperature comparison process 943 Heating device stop process 171 1st thermometer 172 2nd thermometer 181 processors 182 memory 183 Communications Department
Claims
1. A hollow box-shaped body with one side open, A heating device is positioned inside the box, facing the opening of the box, and heats the air inside the box. Equipped with, A thermal performance measurement auxiliary device used to measure the thermal performance of partitioned structures in existing buildings.
2. The heating device is provided with a thermally conductive long-wavelength radiating member that covers the heating surface and has higher thermal conductivity and long-wavelength emissivity than the heating surface of the heating device. A thermal performance measurement auxiliary device according to claim 1.
3. It is a plate-like structure with numerous through holes, and comprises a perforated plate that divides the internal space of the box into a space on the heating device side and a space on the opening side. A thermal performance measurement auxiliary device according to claim 1 or 2.
4. A temperature detection device is positioned near the opening of the box and detects the temperature of the air inside the box. A control device controls the heating device so that the temperature detected by the temperature detection device reaches a predetermined temperature. Equipped with, A thermal performance measurement auxiliary device according to claim 1 or 2.
5. The heating device is planar, A thermal performance measurement auxiliary device according to claim 1 or 2.
6. A temperature sensor located on the heating surface of the heating device for detecting the temperature of the heating surface, A control device that controls the heating device so that the temperature of the heating surface detected by the temperature sensor falls below a threshold. Equipped with, A thermal performance measurement auxiliary device according to claim 1 or 2.
7. The device includes a reducing member that reduces infrared radiation emitted from the heat-generating surface. A thermal performance measurement auxiliary device according to claim 1 or 2.
8. A measuring device for measuring the thermal performance of a partition structure is attached to the surface of a partition structure of an existing building that is the subject of measurement. The thermal performance measurement auxiliary device according to claim 1 or 2 is mounted such that the measuring device attached to the surface of the partition structure is inside the box, while the open surface of the box is closed on the surface of the partition structure. The heating device is operated to heat the air inside the box, Based on the measurement results from the aforementioned measuring device, the thermal performance of the partitioned structure is measured. Method for measuring thermal performance.
9. A second measuring device for measuring the thermal performance of the partition structure is placed on the opposite side of the partition structure. Based on the measurement results from the aforementioned measuring device and the measurement results from the second measuring device, the thermal performance of the partitioned structure is measured. The thermal performance measurement method according to claim 8.
10. The heating device is controlled so that the temperature of the heating surface of the heating device falls below a threshold. The thermal performance measurement method according to claim 8.
11. A reducing member is provided to reduce the infrared radiation emitted from the heat-generating surface. The thermal performance measurement method according to claim 8.
Citation Information
Patent Citations
Thermal performance evaluation device and thermal performance evaluation method
JP2021103096A
JPA1412-2