A substrate processing apparatus, a method for removing foreign matter, and a method for manufacturing articles.

Abstract

The present invention provides a substrate processing apparatus that is advantageous for removing foreign matter adhering to a substrate holding portion having uneven surfaces. [Solution] In a substrate processing apparatus comprising a substrate holding portion having a holding surface on which a plurality of protrusions that contact the substrate are arranged, A supply unit for selectively supplying a curable material to a portion of the holding surface, A drive mechanism for driving the substrate holding portion or the substrate so as to shorten or widen the distance between the holding surface and the substrate, A curing section for curing the curable material supplied to the holding surface, A control unit controls the drive mechanism to bring the curable material supplied to the holding surface and the substrate close together and into contact, and to peel off the curable material, which has been cured by the curing unit while in contact with the substrate, from the holding surface together with the substrate. It is characterized by being equipped with [the following features].

Description

TECHNICAL FIELD

[0001] The present invention relates to a substrate processing apparatus, a foreign matter removal method, and an article manufacturing method.

BACKGROUND ART

[0002] Imprint apparatuses that form a pattern of an imprint material on a substrate using a mold on which an uneven pattern is formed are attracting attention as one of lithography apparatuses for mass production of semiconductor devices and the like.

[0003] In an imprint apparatus, if the mold is brought into contact with the imprint material on the substrate while foreign matter is adhering to the substrate, not only can a structure of a desired shape not be formed, but also the mold and the substrate may be damaged. Therefore, it is necessary to perform the imprint process after removing the foreign matter adhering to the substrate.

[0004] Patent Document 1 describes a method for removing foreign matter on a substrate. This method includes a step of measuring the coordinates and size of particles on the substrate, then controlling and arranging the amount of a composition so that all foreign matter is covered with the composition, a step of bringing a mold coated with an adhesive material into contact with the substrate, and a step of curing the composition and releasing the mold from the substrate to remove the composition on the substrate and thereby remove the foreign matter. Further, Patent Document 2 describes a method for removing foreign matter on a mold, and it is described that the step of removing particles includes a step of pressing the mold against an adhesive member that has higher adhesion to the mold than to the surface of a transfer target substrate, and a step of separating the mold from the adhesive member.

[0005] On the other hand, in imprint machines, high substrate flatness is required in order to accurately transfer the mold pattern onto the imprint material on the wafer. However, if the flatness of the substrate holding surface of the substrate holding part decreases, the flatness of the substrate held by the substrate holding part also decreases. One cause of decreased flatness of the holding surface of the substrate holding part is the adhesion of particles to the holding surface of the substrate holding part. Patent document 3 describes a cleaning method in which an abrasive material is slid over the substrate holding part, and the generated particles are sucked up to remove particles adhering to the substrate holding part. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Patent No. 5121549 [Patent Document 2] Patent No. 7089420 [Patent Document 3] Patent No. 7551694 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] Patent Document 3 describes a cleaning method in which an abrasive material is slid across the substrate holder, and the generated particles are sucked up to remove particles adhering to the substrate holder. However, there is a problem that depending on the size and location of the particles generated during sliding, some may not be sucked up and remain. In addition, if the suction force is increased to reduce the amount of particles left behind, an airflow is generated within the device, and this airflow may stir up the particles and cause them to re-adhere to the surface of the substrate holder.

[0008] Therefore, the present invention aims to efficiently remove foreign matter adhering to the substrate holding part without generating airflow within the device that could lead to the re-adhesion of particles. [Means for solving the problem]

[0009] To achieve the above objective, one aspect of the present invention is: In a substrate processing apparatus comprising a substrate holding portion having a holding surface on which a plurality of protrusions that contact the substrate are arranged, A supply unit for selectively supplying a curable material to a portion of the holding surface, A drive mechanism for driving the substrate holding portion or the substrate so as to shorten or widen the distance between the holding surface and the substrate, A curing section for curing the curable material supplied to the holding surface, The present invention is characterized by comprising: a control unit that controls the drive mechanism to bring the curable material supplied to the holding surface and the substrate close together and into contact, and to peel off the curable material, which has been cured by the curing unit while in contact with the substrate, from the holding surface together with the substrate.

[0010] Further objects or other aspects of the present invention will be revealed by embodiments described below with reference to the accompanying drawings. [Effects of the Invention]

[0011] According to the present invention, a method for removing foreign matter from a substrate holding section, regardless of particle size, without generating airflow within the apparatus, can be provided. [Brief explanation of the drawing]

[0012] [Figure 1] A diagram showing the configuration of the imprint device in the embodiment. [Figure 2] A cross-sectional view showing the configuration of the substrate holding portion in the embodiment. [Figure 3] A diagram showing the application of a curable material during foreign matter removal in Embodiment 1. [Figure 4] A diagram showing the foreign matter removal flow in Embodiment 1. [Figure 5] A diagram showing the application of a curable material during foreign matter removal in Embodiment 2. [Figure 6] A diagram showing the foreign matter removal flow in Embodiment 2. [Figure 7] A diagram illustrating application of a curable material during foreign matter removal in Embodiment 3. [Figure 8] A diagram showing the foreign matter removal flow in Embodiment 3. [Figure 9] A diagram illustrating application of a curable material during foreign matter removal in Embodiment 4. [Figure 10] A diagram showing the foreign matter removal flow in Embodiment 4. [Figure 11] A diagram illustrating application of a curable material during foreign matter removal in Embodiment 5. [Figure 12] A diagram showing the foreign matter removal flow in Embodiment 5. [Figure 13] A diagram illustrating an example of an article manufacturing method. [Figure 14] A diagram illustrating another example of an article manufacturing method. [Modes for Carrying Out the Invention]

[0013] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are necessarily essential to the invention, and the plurality of features may be arbitrarily combined. Furthermore, in the accompanying drawings, the same or similar components are denoted by the same reference numerals, and redundant descriptions are omitted.

[0014] <First Embodiment> The present invention applies to substrate processing apparatus. Typical substrate processing apparatuses include lithography apparatuses (imprint apparatuses, exposure apparatuses, charged particle beam lithography apparatuses, etc.) that transfer or form patterns from a master plate onto a substrate. Other substrate processing apparatuses include processing apparatuses, inspection apparatuses, and microscopes. An imprint apparatus forms a pattern on a substrate by curing an imprint material, such as a curable material, supplied onto the substrate while the mold, which serves as the master plate, is in contact with the imprint material. An exposure apparatus forms a latent image on a photoresist supplied onto a substrate by exposing it to the photoresist through a photomask, which serves as the master plate. A charged particle beam lithography apparatus forms a latent image on a photoresist by drawing a pattern on the photoresist supplied onto the substrate using a charged particle beam. Below, an example of the present invention being applied to an imprint apparatus, which is one type of lithography apparatus, will be described. An imprint apparatus is an apparatus that forms a pattern on a cured material in which the relief pattern of the mold is transferred by bringing an imprint material supplied onto a substrate into contact with a mold and applying curing energy to the imprint material. For example, the imprint apparatus of this embodiment supplies imprint material onto a substrate and hardens the imprint material while a mold with a raised and recessed pattern is in contact with the imprint material on the substrate. Then, the gap between the mold and the substrate is widened and the mold is peeled off (released) from the hardened imprint material, thereby forming the pattern of the imprint material on the substrate. This series of processes performed by the imprint apparatus is sometimes generally called "imprint processing".

[0015] Imprint materials use a curable composition (sometimes called an uncured curable material) that hardens when curing energy is applied. The curing energy can be electromagnetic waves, heat, etc. Electromagnetic waves include, for example, infrared light, visible light, and ultraviolet light, with wavelengths selected from the range of 10 nm to 1 mm.

[0016] The imprint material may be the same as the curable material supplied to the substrate holding section described later, or it may be composed of different materials, and this embodiment includes both configurations.

[0017] [Configuration of the imprint device] Figure 1 is a schematic diagram showing an example configuration of the imprint device 100.

[0018] The imprint apparatus 100 includes, for example, a measuring mechanism 101, a mold holding unit 102, a curing unit 106, a substrate holding unit 109, and a control unit 112. The control unit 112 is composed of, for example, a computer having a CPU and memory, and controls the imprint process (controls each part of the imprint apparatus 100). It also has a stage platen 110 for movably supporting the substrate holding unit 109. Here, in Figure 1, two different axes (for example, two axes that are orthogonal to each other) in a plane parallel to the surface of the first substrate 105 are defined as the X axis and the Y axis, and the axis perpendicular to the X axis and the Y axis is defined as the Z axis.

[0019] The mold 103 is, for example, a mold in which a three-dimensional pattern of relief, such as a circuit pattern of a device, is formed, and is made using a material such as quartz that can transmit ultraviolet light. The first substrate 105 can be made of glass, ceramics, metal, semiconductor, curable material, etc., and if necessary, a component made of a material other than the first substrate 105 may be formed on its surface.

[0020] The first substrate 105 may, if necessary, be provided with an adhesion layer before supplying the imprint material 104 to improve the affinity between the imprint material 104 and the first substrate 105.

[0021] The curing unit 106 cures the imprint material 104 (curable material, resist) on the first substrate 105 by irradiating it with light (e.g., ultraviolet light) via the mold 103. In this embodiment, the imprint material 104 is an ultraviolet-curable material that has the property of curing when irradiated with ultraviolet light. The curing unit 106 includes, for example, a light source such as a mercury lamp that emits curing light (e.g., i-line, g-line) for curing the imprint material 104, an elliptical mirror that focuses the curing light emitted from the light source, a lens for shaping the curing light so that the curing light is irradiated onto the imprint material 104 on the shot area, an aperture, etc. The aperture is used for controlling the field of view to irradiate only the shot area to be imprinted, and for controlling the outer edge of the light to limit the curing light from irradiating outside the shot area of ​​the first substrate 105. The curing unit 106 may also include an optical integrator for uniformly illuminating the mold 103. Light emitted from the curing section 106 is incident on the imprint material 104 on the first substrate 105 via the mold 103.

[0022] The mold holding unit 102, also called the imprint head, includes a positioning mechanism that controls the position of the mold 103 in six axes, and a mechanism for pressing the mold 103 onto the first substrate 105 or the imprint material 104 thereon, and for separating the mold 103 from the cured imprint material 104. Here, the six axes may include the X, Y, and Z axes, as well as rotation around each of those axes.

[0023] The substrate holder 109 is configured to hold the first substrate 105 and move on the stage platen 110. The substrate holder 109 includes a positioning mechanism that controls the position of the first substrate 105, for example, by controlling the position of the first substrate 105 with respect to the aforementioned six axes.

[0024] The measurement mechanism 101 can be any mechanism that has a function related to measurement, but one example is one that measures the height of the substrate surface by scanning the substrate on the substrate chuck 109 with light. The flatness can also be confirmed from the measurement result of measuring the height of the substrate surface.

[0025] The imprint material supply unit 107 supplies (applies) imprint material 104 onto the first substrate 105. The imprint material supply unit 107 includes, for example, a tank for containing the imprint material 104, a plurality of discharge ports for discharging the imprint material 104 supplied from the tank through a supply path onto the first substrate 105, piezoelectric elements provided in the supply path communicating with each discharge port, and a supply amount control unit. The supply amount control unit can control the amount of imprint material 104 discharged as droplets from one discharge port by, for example, adjusting the signal value supplied to the piezoelectric element.

[0026] [Configuration of the substrate holder] Figure 2 is a schematic diagram showing an example of the configuration of a substrate chuck 109 as a substrate holding part.

[0027] The substrate chuck 109 is a substrate chuck mechanism that attracts and holds a substrate by vacuum suction force or electrostatic force. The substrate chuck 109 is mounted on the stage platen 110, and the holding surface that contacts the substrate has irregularities, with the apex of the protrusions 111 contacting the substrate. If a push pin mechanism is provided as a drive mechanism for raising and lowering the substrate, through holes for positioning the pins are provided. If a vacuum suction mechanism is also present, in addition to the through holes 113, a raised edge 400 is also provided. Not limited to the above mechanisms, irregularities and through holes may be provided for any other necessary mechanisms besides the protrusions 111 for holding the substrate. The stage platen 110 is movable in the XY plane. By adjusting the position of the stage platen 110 when bringing the mold 103 into contact with the imprint material on the first substrate 105, the position of the mold 103 and the position of the first substrate 105 are aligned with each other. Actuators applicable to the stage platen 110 include, for example, a linear motor and an air cylinder. Furthermore, the stage platen 110 may be configured to allow movement of the substrate not only in the X-axis and Y-axis directions, but also in the Z-axis direction. In the imprinting apparatus, the pressing and release of the mold 103 is achieved by moving the mold 103 in the Z-axis direction using the mold holding unit 102. However, this may also be achieved by moving the substrate in the Z-axis direction using the stage platen 110. Alternatively, pressing and release may be achieved by moving both the mold 103 and the substrate relatively in the Z-axis direction. Moreover, the stage platen 110 may be configured to have a tilt function for adjusting the position of the substrate in the θ (rotation around the Z-axis) direction and the inclination of the first substrate 105.

[0028] [Composition of curable materials] The curable material 200 is preferably a composition that polymerizes and hardens upon heat input or light irradiation. The curable material 200 is a curable composition containing at least a polymerizable compound and a polymerization initiator, and is particularly preferably a photocurable composition containing a photopolymerization initiator. It may optionally contain a non-polymerizable compound or a solvent. The non-polymerizable compound is at least one selected from the group consisting of internal release agents, surfactants, antioxidants, polymer components, etc. The polymerizable compound contains at least one (meth)acrylate. The viscosity of the curable material (viscosity at 25°C) is, for example, 1 mPa·s or more and 10,000 mPa·s or less. The aforementioned imprint material 104 may be used in common as the curable material supplied to the substrate holding part of this embodiment.

[0029] [Supply unit for curable materials] The curable material supply unit 108 includes a tank for containing the curable material 200, one or more discharge ports for discharging the curable material 200 supplied from the tank through a supply path to the substrate chuck 109, piezoelectric elements provided in the supply path communicating with each discharge port, and a supply amount control unit.

[0030] The supply amount control unit controls the amount of curable material 200 discharged as droplets from at least one discharge port, for example, by adjusting the signal value supplied to the piezoelectric element.

[0031] The supply unit 108 is preferably a dispenser and includes a tank for containing the curable material 200, one or more outlets for discharging the curable material 200 supplied from the tank through a supply path, a pressurizing element provided in the supply path communicating with each outlet, and a supply amount control unit, and is capable of supplying the curable material 200 to the substrate chuck when no substrate is placed on it.

[0032] The supply amount control unit is a syringe type that controls the amount of curable material 200 discharged as droplets from a single discharge port by, for example, adjusting the signal value supplied to the pressurizing element.

[0033] The dispenser-type supply unit can be used for coating small areas due to its low discharge volume, while the syringe-type supply unit can shorten working time when coating large areas due to its high discharge volume.

[0034] Alternatively, the imprint material may be supplied as a curable material from the imprint material supply unit 107. When the imprint material is used as a curable material, no additional mechanism is required, and the configuration can be simplified.

[0035] [Configuration of the cleaning substrate used to remove foreign matter from the substrate holding section] The second substrate 300 used for removing foreign matter from the substrate holding section is made from a material such as quartz or a curable material that can transmit ultraviolet light. The surface in contact with the substrate chuck 109 may have a three-dimensional pattern formed to match the irregularities of the holding surface of the substrate chuck 109. Furthermore, by forming an affinity layer (adhesion layer) that improves adhesion with the curable material 200, cleaning can be performed without problems even under conditions where the force required for peeling (peeling force) is strong, such as when the curable material is applied to cover multiple irregularities. The affinity layer may be a surface treatment layer made of a silane coupling material or a curable material layer containing a silane coupling material.

[0036] [Method for removing foreign matter from the retaining surface] Figure 3 shows an example of applying the curable material 200 to the substrate chuck 109, and Figure 4 shows an example of the cleaning flow. The vertices of the protrusions 111 of the substrate chuck 109 are designated as the application area, and the curable material 200 is selectively applied to all of these vertices in an amount sufficient to cover the particles 159. A dispenser is used for supplying the curable material 108. By adjusting the components of the polymerizable compound of the curable material, specifically by adjusting the polar group content and non-polar group content, and adjusting the contact angle on the substrate holding surface, if the contact angle of the curable material 200 to the substrate chuck 109 is 5 degrees or more, the curable material will remain on the protrusions 111 and further cover the particles 159. As in this embodiment, by setting the contact angle of the curable material on the material to be cleaned to 5 degrees or more, the upper surface of the protrusions can be cleaned without the curable material spreading to areas other than the protrusions of the substrate holding part.

[0037] Next, the entire area to be coated with the curable material 200 is covered with a second quartz substrate 300, and the curable material 200 is polymerized and cured by irradiation with ultraviolet light. Finally, the second substrate 300, to which the cured curable material 200 with embedded particles is attached, is peeled off the substrate chuck 109 using a drive mechanism, thereby removing the particles 159 from the substrate holding portion protrusion 111.

[0038] [Drive mechanism for contact and separation] A drive mechanism for bringing the curable material 200 supplied to the holding surface into contact with the substrate and for peeling the curable material 200, which has hardened together with the substrate, from the holding surface can be any mechanism that shortens or widens the distance between the holding surface and the substrate, such as the aforementioned push-pin mechanism.

[0039] With the tips of multiple pins positioned in multiple through-holes in the substrate holder positioned higher than the holding surface, the substrate is placed on the pins by the substrate transport mechanism, and by simultaneously lowering the multiple pins, the substrate can be driven in a direction that brings it into contact with the curable material 200 supplied to the holding surface. Subsequently, by simultaneously raising the multiple pins, the substrate can be pushed up and driven away from the substrate holder.

[0040] Multiple pins and the height of the circuit board may be fixed, and a drive mechanism may be provided to raise and lower the circuit board holder.

[0041] The substrate holding section or the drive mechanism for driving the substrate is not limited to these configurations. For example, the mold holding section of an imprint machine can be configured to also hold the substrate and can be used as a drive mechanism for contact and peeling. Furthermore, a mechanism that grips the outer periphery of the substrate and moves it up and down can also be used as a mechanism for contact and peeling.

[0042] <Second Embodiment> A substrate processing apparatus according to a second embodiment of the present invention will now be described. The substrate processing apparatus of the second embodiment basically inherits the imprint apparatus 100 of the first embodiment, but the cleaning method differs from that of the first embodiment. Figure 5 shows an example of applying the curable material 200 to the substrate chuck 109, and Figure 6 shows an example of the cleaning flow.

[0043] In accordance with the arrangement of the protrusions 111, the curable material 200 is applied to cover all of the protrusions of the substrate holding portion, except for the portion that penetrates the substrate holding portion, so that the amount of material applied at the apex of the protrusions is less than that at the recesses. At this time, the amount of curable material 200 applied is sufficient to cover the particles 159 and 160, and is such that no unfilled areas occur in the applied area when the second substrate 300 is brought into contact with it. The curable material supply unit 108 uses a syringe.

[0044] Next, the entire area to be coated with the curable material 200 is covered with the second substrate 300, and the curable material 200 is polymerized and cured by irradiation with ultraviolet light. Finally, using a drive mechanism, the second substrate 300, to which the cured curable material 200 with the particles embedded is attached, is peeled off the substrate chuck 109, thereby removing foreign matter from the substrate chuck 109. Not only the particles 159 on the protrusions 111, but also the particles 160 in the recesses can be removed.

[0045] In this case, by forming a layer compatible with the curable material 200 on the contact surface of the second quartz substrate 300 with the curable material 200, cleaning can be performed without problems even under conditions where the peeling force is strong, such as conditions where the peeling speed is fast. As in this embodiment, by forming a layer compatible with the curable material 200 on the contact surface of the second quartz substrate 300 with the curable material 200, the curable material 200 becomes less likely to peel off the second substrate, and the time required for peeling can be shortened.

[0046] <Third Embodiment> A third embodiment of the substrate processing apparatus according to the present invention will now be described. The substrate processing apparatus of the third embodiment basically inherits the imprint apparatus 100 of the first embodiment, but the cleaning procedure differs from that of the first embodiment. Figure 7 shows an example of applying the curable material 200 to the substrate chuck 109, and Figure 8 shows an example of the cleaning flow.

[0047] The first substrate 105 is placed on the substrate chuck 109, and the flatness of the first substrate 105 is measured by the measuring mechanism 101 to obtain a surface topography map of the first substrate 105. Next, in the area of ​​the topography map that includes the protrusions, a sufficient amount of curable material 200 is applied to the vertices of the protrusions 111, in accordance with the arrangement of the protrusions 111, to cover the particles 159. The curable material supply unit 108 uses a dispenser. Next, the entire area to which the curable material 200 has been applied is covered with a second substrate 300 made of quartz, and the curable material 200 is polymerized and cured by irradiation with ultraviolet light. Finally, the second substrate 300, to which the cured curable material 200 with the particles 159 embedded is attached, is peeled off the substrate chuck 109, thereby removing the particles 159 from the protrusions 111 of the substrate holding unit. According to this embodiment, since the curable material is used in accordance with the presence of particles, particles can be removed more efficiently compared to Example 1, and the amount of curable material 200 used can be reduced.

[0048] <Fourth Embodiment> A substrate processing apparatus according to a fourth embodiment of the present invention will now be described. The substrate processing apparatus of the fourth embodiment basically inherits the imprint apparatus 100 of the first embodiment, but the cleaning method differs from that of the second embodiment. Figure 9 shows an example of applying the curable material 200 to the substrate chuck 109, and Figure 10 shows an example of the cleaning flow.

[0049] The first substrate 105 is placed on the substrate chuck 109, and the flatness of the substrate is measured using the measuring mechanism 101 to obtain a surface topography map of the first substrate 105. Next, the curable material 200 is applied to the area of ​​the substrate chuck 109 including the recesses and the area of ​​the surface topography map including the convex parts, excluding the through holes 113, so that the amount of material applied at the apex of the convex parts 111 is less than that at the recesses, in accordance with the arrangement of the convex parts 111. At this time, the amount of curable material 200 applied is sufficient to cover the particles 159, and is such that no unfilled areas occur in the applied area when the second substrate 300 is brought into contact with it. The curable material supply unit 108 uses a syringe.

[0050] Next, the entire area to be coated with the curable material 200 is covered with a second quartz substrate 300, and the curable material 200 is polymerized and cured by irradiation with ultraviolet light. Finally, the substrate chuck 109 is cleaned of foreign matter by peeling the second substrate 300, to which the cured curable material 200 with the particles 159 embedded is attached, from the substrate chuck 109. According to this embodiment, not only the particles 159 on the protrusions 111 but also the particles 160 in the recesses can be removed. Since particles in the recesses can also be removed, the risk of particles landing on the pins during use of the device can be reduced. Compared to Example 2, the amount of curable material 200 used can be reduced.

[0051] <Fifth Embodiment> A substrate processing apparatus according to a fifth embodiment of the present invention will now be described. The substrate processing apparatus of the fifth embodiment basically inherits the imprint apparatus 100 of the first embodiment, but the cleaning method differs from that of the fourth embodiment. Figure 11 shows an example of applying the curable material 200 to the substrate chuck 109, and Figure 12 shows an example of the cleaning flow.

[0052] The first substrate 105 is placed on the substrate chuck 109, and the flatness of the substrate is measured using the measuring mechanism 101 to obtain a topographic map of the first substrate 105. Next, based on the results of the obtained topographic map, a portion of the area and amount of curable material 200 supplied by the supply unit is determined, excluding the through holes 113, so that the amount of material applied at the apex of the convex portion 111 is less than that at the concave portion of the topographic map, in accordance with the arrangement of the convex portion 111. At this time, considering the shape of the dam 400 for the vacuum chuck, a sufficient amount of curable material 200 is applied to cover the particles 159. The curable material supply unit 108 uses a syringe.

[0053] Next, the entire area to be coated with the curable material 200 is covered with a second quartz substrate 300, and the curable material 200 is polymerized and cured by irradiation with ultraviolet light. Finally, the substrate holding part is cleaned of foreign matter by peeling the second substrate 300, to which the cured curable material 200 with the particles 159 embedded is attached, from the substrate chuck 109. According to this embodiment, not only the particles 159 on the protrusions 111 but also the particles 160 in the recesses can be removed as foreign matter. Since particles in the recesses can also be removed, the risk of particles landing on the pins during use of the device can be reduced. Compared to Example 2, the amount of curable material 200 used can be reduced. In addition, by adjusting the amount of curable material applied to the dam 400 for the vacuum chuck on the chuck 109 so that the curable material does not enter the through-hole 113, blockage of the through-hole 113 by excessive curable material 200 and contamination can be prevented. As in this embodiment, by applying the curable material not only to the protrusions 111, the ridges 400 for the vacuum chuck, and the through-holes 113, but also to the uneven shape of the chuck, it is possible to prevent blockage and contamination of the through-holes 113 by excess curable material 200, and to efficiently remove particles.

[0054] (Article manufacturing method) The following describes a method for manufacturing articles using the imprint apparatus 1 or imprint method described above. According to the imprint apparatus 1 or imprint method, imprint processing can be performed with high alignment accuracy on the second shot area. This is advantageous for manufacturing high-quality articles. The article manufacturing method may include a pattern formation step of forming a pattern on a substrate using the imprint apparatus 1 or imprint method described above, and a processing step of obtaining an article by processing the substrate on which the pattern has been formed. The processing step may include, for example, an etching step, a dicing step, a sealing step, etc.

[0055] The patterns of cured materials formed using an imprint apparatus are used permanently on at least a portion of various articles, or temporarily during the manufacturing of various articles. Articles include electrical circuit elements, optical elements, MEMS, recording elements, sensors, or molds. Examples of electrical circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, as well as semiconductor elements such as LSI, CCD, image sensors, and FPGAs. Examples of molds include molds for imprinting.

[0056] The pattern of the cured material is either used as is as a component of at least some of the above-mentioned articles, or temporarily used as a resist mask. After etching or ion implantation is performed during the substrate processing process, the resist mask is removed.

[0057] Next, we will describe a method for manufacturing articles, which involves forming a pattern on a substrate using an imprint device, processing the substrate on which the pattern has been formed, and manufacturing an article from the processed substrate. As shown in Figure 13(a), a substrate 1z such as a silicon wafer is prepared on which a workpiece 2z such as an insulator has been formed on its surface, and then an imprint material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, we show how multiple droplet-shaped imprint material 3z have been applied to the substrate.

[0058] As shown in Figure 13(b), the mold 4z for imprinting is positioned opposite the imprint material 3z on the substrate, with the side where the uneven pattern is formed facing it. As shown in Figure 13(c), the substrate 1z to which the imprint material 3z is applied is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z fills the gap between the mold 4z and the workpiece 2z. In this state, when light is shone through the mold 4z as curing energy, the imprint material 3z hardens.

[0059] As shown in Figure 13(d), after the imprint material 3z has hardened, when the mold 4z and substrate 1z are separated, a pattern of the hardened imprint material 3z is formed on the substrate 1z. In this pattern, the recesses of the mold correspond to the protrusions of the hardened material, and the protrusions of the mold correspond to the recesses of the hardened material. In other words, the uneven pattern of the mold 4z has been transferred to the imprint material 3z.

[0060] As shown in Figure 13(e), when etching is performed using the cured material pattern as an etching-resistant mask, the parts of the workpiece 2z surface that are free of or have a thin remaining cured material are removed, forming grooves 5z. As shown in Figure 13(f), when the cured material pattern is removed, an article with grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the cured material pattern was removed, but it may also be used without removal after processing, for example, as an interlayer insulating film included in semiconductor devices, i.e., as a component of the article.

[0061] Next, an alternative method for manufacturing the article will be described. As shown in Figure 14(a), a substrate 1y such as quartz glass is prepared, and then an imprint material 3y is applied to the surface of the substrate 1y by an inkjet method or the like. If necessary, a layer of another material such as metal or a metal compound may be provided on the surface of the substrate 1y.

[0062] As shown in Figure 14(b), the mold 4y for imprinting is positioned opposite the imprint material 3y on the substrate, with the side where the uneven pattern is formed facing it. As shown in Figure 14(c), the substrate 1y to which the imprint material 3y has been applied is brought into contact with the mold 4y, and pressure is applied. The imprint material 3y fills the gap between the mold 4y and the substrate 1y. When light is shone through the mold 4y in this state, the imprint material 3 hardens.

[0063] As shown in Figure 14(d), after the imprint material 3y has hardened, when the mold 4y and substrate 1y are separated, a pattern of the hardened imprint material 3y is formed on the substrate 1y. In this way, an article having the pattern of the hardened material as a component is obtained. Furthermore, if the substrate 1y is etched using the pattern of the hardened material as a mask in the state shown in Figure 14(d), an article in which the recesses and protrusions are reversed relative to the mold 4y, for example, an imprint mold, can be obtained.

[0064] The disclosures herein include the following curable compositions, film-forming methods, and methods for manufacturing articles.

[0065] (Item 1) In a substrate processing apparatus comprising a substrate holding portion having a holding surface on which a plurality of protrusions that contact the substrate are arranged, A supply unit for selectively supplying a curable material to a portion of the holding surface, A drive mechanism for driving the substrate holding portion or the substrate so as to shorten or widen the distance between the holding surface and the substrate, A curing section for curing the curable material supplied to the holding surface, A control unit controls the drive mechanism to bring the curable material supplied to the holding surface and the substrate close together and into contact, and to peel off the curable material, which has been cured by the curing unit while in contact with the substrate, from the holding surface together with the substrate. A substrate processing apparatus characterized by comprising:

[0066] (Item 2) The substrate processing apparatus according to item 1, wherein the drive mechanism is a push-pin mechanism that pushes the substrate up from the holding surface.

[0067] (Item 3) The substrate processing apparatus according to item 1 or 2, wherein the retaining surface has through holes in which pins are arranged, and the supply unit supplies the curable material in such a way that it does not enter the through holes.

[0068] (Item 4) The substrate processing apparatus according to any one of items 1 to 3, wherein the curable material is a photocurable composition and the curing part is a curing part that is irradiated with light.

[0069] (Item 5) The substrate processing apparatus according to claim 4, characterized in that the substrate is a substrate that transmits ultraviolet light, and the ultraviolet light is irradiated onto the curable material by transmitting it through the substrate.

[0070] (Item 6) A substrate processing apparatus according to any one of items 3 to 5, wherein the curable material is selectively supplied based on the uneven shape of the holding surface or the arrangement of the through holes.

[0071] (Item 7) The apparatus according to any one of items 1 to 6, wherein the contact angle of the curable material with respect to the surface of the holding surface is 5 degrees or more.

[0072] (Item 8) A substrate processing apparatus according to any one of items 1 to 7, wherein an adhesion layer is formed on the surface of the substrate that comes into contact with the curable material.

[0073] (Item 9) The substrate processing apparatus according to any one of items 1 to 8, wherein the supply unit is a dispenser that discharges the curable material as droplets.

[0074] (Item 10) The substrate processing apparatus according to any one of items 1 to 8, wherein the supply unit is a syringe.

[0075] (Item 11) A substrate processing apparatus according to any one of items 1 to 10, comprising a measuring mechanism for measuring the height of the surface of a substrate placed on the substrate holding portion, wherein the region for supplying the curable material to the holding surface is determined based on the measurement result.

[0076] (Item 12) It is equipped with a mold-holding section that holds the mold, A mold is used to form the pattern of the imprint material on the substrate. A substrate processing apparatus as described in any one of items 1 through 11.

[0077] (Item 13) A method for removing foreign matter in a substrate processing apparatus, which includes a substrate holding part having a holding surface on which a plurality of protrusions that contact the substrate are arranged, A step of selectively supplying a curable material to a portion of the holding surface, A step of bringing the curable material supplied to a part of the holding surface into contact with the substrate, A step of curing the curable material supplied to the holding surface while in contact with the substrate, A step of peeling off the cured product of the curable material together with the substrate from the holding surface, A method for removing foreign matter having the following characteristics.

[0078] (Item 14) A step of forming a pattern on a substrate using a substrate processing apparatus described in any one of items 1 to 12, A step of obtaining an article by processing the substrate on which the pattern is formed, A method for manufacturing articles, characterized by including the following:

[0079] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0080] 105 First substrate 109 Board holding part 111 Convex part 106 Ultraviolet light source 107 Imprint material supply unit 108 Curable material supply section 104 Imprint Material 200 Curable materials 113 Through hole 300 Second circuit board

Claims

1. In a substrate processing apparatus comprising a substrate holding portion having a holding surface on which a plurality of protrusions that contact the substrate are arranged, A supply unit for selectively supplying a curable material to a portion of the holding surface, A drive mechanism for driving the substrate holding portion or the substrate so as to shorten or widen the distance between the holding surface and the substrate, A curing section for curing the curable material supplied to the holding surface, A control unit controls the drive mechanism to bring the curable material supplied to the holding surface and the substrate close together and into contact, and to peel off the curable material, which has been cured by the curing unit while in contact with the substrate, from the holding surface together with the substrate. A substrate processing apparatus characterized by comprising:

2. The substrate processing apparatus according to claim 1, wherein the drive mechanism is a push pin mechanism that pushes the substrate up from the holding surface.

3. The substrate processing apparatus according to claim 1, wherein the retaining surface has through holes in which pins are arranged, and the supply unit supplies the curable material in such a way that it does not enter the through holes.

4. The substrate processing apparatus according to claim 1, wherein the curable material is a photocurable composition, and the curing part is a curing part that is irradiated with light.

5. The substrate apparatus according to claim 4, wherein the substrate is a substrate that transmits ultraviolet light, and the substrate is transmitted through the substrate to irradiate the curable material with ultraviolet light.

6. The substrate processing apparatus according to claim 3, wherein the curable material is selectively supplied based on the uneven shape of the holding surface or the arrangement of the through holes.

7. The apparatus according to claim 1, wherein the contact angle of the curable material with respect to the surface of the holding surface is 5 degrees or more.

8. The substrate processing apparatus according to claim 1, wherein an adhesion layer is formed on the surface of the substrate that is in contact with the curable material.

9. The substrate processing apparatus according to claim 1, wherein the supply unit is a dispenser that discharges the curable material as droplets.

10. The substrate processing apparatus according to claim 1, wherein the supply unit is a syringe.

11. The substrate processing apparatus according to claim 1, which has a measuring mechanism for measuring the height of the surface of a substrate placed on the substrate holding portion, and determines the region in which the curable material is supplied to the holding surface based on the measurement result.

12. It is equipped with a mold-holding section that holds the mold, A mold is used to form the pattern of the imprint material on the substrate. The substrate processing apparatus according to claim 1.

13. A method for removing foreign matter in a substrate processing apparatus, which includes a substrate holding part having a holding surface on which a plurality of protrusions that contact the substrate are arranged, A step of selectively supplying a curable material to a portion of the holding surface, A step of bringing the curable material supplied to a part of the holding surface into contact with the substrate, A step of curing the curable material supplied to the holding surface while in contact with the substrate, A step of peeling off the cured product of the curable material together with the substrate from the holding surface, A method for removing foreign matter having the following characteristics.

14. A step of forming a pattern on a substrate using a substrate processing apparatus according to any one of claims 1 to 12, A step of obtaining an article by processing the substrate on which the pattern is formed, A method for manufacturing articles, characterized by including the following:

Images