Processing method, processing apparatus, and article manufacturing method

Abstract

This technology offers advantages in efficiently reducing the charge generated by delamination charging. [Solution] The processing apparatus comprises a substrate holding unit for holding the substrate of a structure in which a mold is arranged on the substrate via a composition film, a mold holding unit for holding the mold of the structure, a first adjustment mechanism for adjusting the relative positions of the substrate holding unit and the mold holding unit so that the mold is separated from the composition film, an irradiation unit for irradiating the mold with electromagnetic waves and generating ions between the composition film and the mold by electromagnetic waves transmitted through the mold, and a second adjustment mechanism for adjusting the relative positions of the irradiation unit and the mold holding unit in the process of separating the mold from the composition film.

Description

Technical Field

[0001] The present invention relates to a processing method, a processing apparatus, and an article manufacturing method.

Background Art

[0002] There is a process of forming a cured film on a substrate by bringing a mold into contact with a curable composition disposed on the substrate, then curing the curable composition, and separating the mold from the cured product of the curable composition. As the mold, in addition to a mold having a pattern, a super straight for planarization can be used.

[0003] On the other hand, Patent Document 1 discloses a technique for improving alignment accuracy by removing static electricity charged on a near-field exposure mask and an object to be exposed in near-field exposure. The apparatus described in Patent Document 1 is provided with a soft X-ray irradiation apparatus to remove static electricity charged on the near-field exposure mask and the object to be exposed. Patent Document 1 describes peeling the near-field exposure mask from the substrate to be exposed while irradiating soft X-rays with a soft X-ray irradiation apparatus. Patent Document 1 does not describe changing the irradiation position of soft X-rays by the soft X-ray irradiation apparatus in the process of peeling the near-field exposure mask from the substrate to be exposed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0005] To neutralize or reduce the charge generated by delamination charging, electromagnetic waves such as soft X-rays with sufficient intensity should be supplied to the area where charging occurs. In the configuration described in Patent Document 1, electromagnetic waves are irradiated simultaneously over almost the entire area of ​​the near-field exposure mask. Therefore, if electromagnetic waves with high intensity are irradiated to the area where charging occurs, electromagnetic waves with high intensity may also be irradiated to the area where no charging occurs. However, irradiating areas where no charging occurs with electromagnetic waves with high intensity is inefficient.

[0006] The present invention aims to provide a technology that is advantageous for efficiently reducing the electric charge generated by delamination charging. [Means for solving the problem]

[0007] One aspect of the present invention relates to an apparatus, the apparatus comprising: a substrate holding unit for holding a substrate of a structure in which a mold is arranged on a substrate via a composition film; a mold holding unit for holding the mold of the structure; a first adjustment mechanism for adjusting the relative positions of the substrate holding unit and the mold holding unit so that the mold is separated from the composition film; an irradiation unit for irradiating the mold with electromagnetic waves and generating ions between the composition film and the mold by electromagnetic waves transmitted through the mold; and a second adjustment mechanism for adjusting the relative positions of the irradiation unit and the mold holding unit in a process in which the mold is separated from the composition film. [Effects of the Invention]

[0008] According to the present invention, an advantageous technique is provided for efficiently reducing the charge generated by delamination charging. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic diagram showing the configuration of the processing apparatus of the first embodiment. [Figure 2] A schematic diagram showing the structure processed by the processing unit. [Figure 3] A schematic diagram showing the configuration of the separation assistance mechanism. [Figure 4]A schematic diagram illustrating the movement of the irradiation area as the separation process progresses. [Figure 5] A schematic diagram illustrating the movement of the irradiation area as the separation process progresses. [Figure 6] A schematic diagram illustrating the movement of the irradiation area as the separation process progresses. [Figure 7] A schematic diagram illustrating the movement of the irradiation area as the separation process progresses. [Figure 8] A schematic diagram illustrating the movement of the irradiation area as the separation process progresses. [Figure 9] A diagram illustrating the separation procedure in the processing apparatus of the first embodiment. [Figure 10] A diagram illustrating the separation procedure in the processing apparatus of the first embodiment. [Figure 11] A diagram illustrating the separation procedure in the processing apparatus of the first embodiment. [Figure 12] A schematic diagram showing the configuration of the processing apparatus of the second embodiment. [Figure 13] A diagram illustrating the separation procedure in the processing apparatus of the second embodiment. [Figure 14] A diagram schematically showing the configuration of the third embodiment. [Figure 15] A diagram illustrating the separation procedure in the processing apparatus of the third embodiment. [Figure 16] A diagram schematically showing the configuration of the fourth embodiment. [Figure 17] A diagram illustrating the manufacturing method of an item. [Modes for carrying out the invention]

[0010] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0011] In each of the following embodiments, directions are indicated in an XYZ coordinate system in which the horizontal plane is defined as the XY plane.

[0012] <First Embodiment> FIG. 1 schematically illustrates the configuration of a processing apparatus 100 according to the first embodiment. FIG. 2 schematically illustrates a structure 1 to be processed by the processing apparatus 100. In the first embodiment, the processing apparatus 100 is configured as an apparatus for processing the structure 1 in which a mold 1b is disposed on a substrate 1a with a composition film 1c interposed therebetween, more specifically, as an apparatus for separating the mold 1b from the composition film 1c. However, as will be described later, in other embodiments, the processing apparatus 100 may be configured as an apparatus that disposes an uncured composition on the substrate 1a, brings the mold 1b into contact with the uncured composition, cures the uncured composition to form the composition film 1c, and separates the mold 1b from the composition film 1c. The processing apparatus 100 may include, for example, a substrate holding unit 2, a mold holding unit 3, a first adjustment mechanism 4, an irradiation unit 5, a second adjustment mechanism 6, a separation assisting mechanism 7, a first surface plate 8, a base 9, first support columns 10, and a second surface plate 11. The processing apparatus 100 may further include a transport mechanism 12 and a control unit 200.

[0013] Here, the structure 1 will be described. As described above, for example, the structure 1 can be obtained by disposing an uncured composition on a substrate 1a, bringing a mold 1b into contact with the uncured composition, and curing the uncured composition to form a composition film 1c. The uncured composition is a curable composition that cures when curing energy is applied. Electromagnetic waves, heat and the like can be used as the curing energy. The electromagnetic waves can be, for example, light selected from a wavelength range of 10 nm to 1 mm, such as infrared rays, visible light, ultraviolet rays and the like. The curable composition may be understood as a composition that cures by light irradiation or by heating. Among these, the photocurable composition that cures by light irradiation contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component. The uncured composition can be disposed on the substrate in the form of droplets, or in the form of islands or a film formed by connecting a plurality of droplets. Alternatively, the uncured composition may be supplied onto the substrate in a film form by a spin coater or a slit coater. The viscosity of the uncured composition (viscosity at 25°C) can be, for example, 1 mPa·s or more and 100 mPa·s or less.

[0014] The base material of the substrate 1a can be composed of, for example, glass, ceramics, metal, semiconductor (e.g., silicon, compound semiconductor), resin, or the like. The substrate 1a may have a layer made of a material different from the base material on the base material. The substrate 1a may be a blank mold for producing a replica mold which is a duplicate of a master mold by an imprint process.

[0015] Mold 1b has a molding surface that contacts the uncured composition and molds the uncured composition to conform to the molding surface. Mold 1b may be a planarization mold having a flat molding surface, i.e., a superstraight mold, or it may be an imprint mold having a pattern on its molding surface. If mold 1b is a superstraight mold, it has a flat surface of a size similar to that of the substrate 1a and may have a thickness in the range of, for example, 0.3 mm to 1.0 mm. Mold 1b may be made of a quartz or borosilicate glass wafer that can transmit electromagnetic waves such as soft X-rays. Mold 1b is separated from the composition film 1c in the processing apparatus 100. In other words, the composition film 1c is separated from mold 1b in the processing apparatus 100. The operation of separating the composition film 1c and mold 1b from each other is also called demolding. Figure 2(A) is a schematic side view of the structure 1. Figure 2(B) is a schematic perspective plan view of the structure 1. The substrate 1a may have a feature portion 1a' for positioning, such as a V-notch or an orientation flat.

[0016] Next, the components of the processing apparatus 100 will be described with reference to Figure 1. The transport mechanism 12 includes a transport hand and the like, which can hold the structure 1 and transport it from an unshown location outside or inside the processing apparatus 100 to the substrate holding section 2. The substrate holding section 2 can hold the substrate 1a of the structure 1 by means of vacuum suction, electrostatic suction, or mechanical clamping, for example. The mold holding section 3 can hold the mold 1b of the structure 1 by means of vacuum suction, electrostatic suction, or mechanical clamping, for example. The mold holding section 3 may be made of a material that can transmit electromagnetic waves such as soft X-rays, such as acrylic resin. If the shape of the structure 1 is circular, the shape of the mold holding section 3 may be annular, but is not limited to that.

[0017] The substrate holder 2 and the mold holder 3 may be connected to the first base plate 8 and the second base plate 11, respectively, via the first adjustment mechanism 4. Alternatively, only one of the substrate holder 2 or the mold holder 3 may be connected to the first adjustment mechanism 4. If only the substrate holder 2 is connected to the first adjustment mechanism 4, the mold holder 3 is fixed to the second base plate 11, and if only the mold holder 3 is connected to the first adjustment mechanism 4, the substrate holder 2 is fixed to the first base plate 8. The first adjustment mechanism 4 can adjust the relative positions of the substrate holder 2 and the mold holder 3 so that the mold 1b is separated from the composition film 1c.

[0018] The first adjustment mechanism 4 may include an actuator such as a linear motor, rotary motor, or voice coil motor. The first adjustment mechanism 4 may also include a ball screw or a linear guide. The first adjustment mechanism 4 may drive both or one of the substrate holder 2 and the mold holder 3 in a direction parallel to the Z axis. The first adjustment mechanism 4 may be configured to drive both or one of the substrate holder 2 and the mold holder 3 in a direction parallel to the X axis and / or parallel to the Y axis. The first adjustment mechanism 4 may further be configured to rotatably drive both or one of the substrate holder 2 and the mold holder 3 in at least one of the X axis, Y axis, and Z axis.

[0019] The irradiation unit 5 irradiates the mold 1b of the structure 1 with electromagnetic waves such as soft X-rays, and the electromagnetic waves transmitted through the mold 1b can generate ions between the composition film 1c and the mold 1b. These ions can function to neutralize or reduce the charge that may be generated by delamination charging. Soft X-rays are defined as electromagnetic waves having any wavelength in the range of 0.1 nm or more and 10 nm or less. However, the wavelength of the electromagnetic waves used is not limited to the range of 0.1 nm or more and 10 nm or less, as long as it can generate ions. The irradiation unit 5 may be arranged so that the mold 1b and the composition film 1c are positioned between the irradiation unit 5 and the substrate 1a. The second adjustment mechanism 6 may be configured to adjust the relative position between the irradiation unit 5 and the mold holding unit 3 in the separation process in which the mold 1b is separated from the composition film 1c. The processing apparatus 100 may include a plurality of irradiation units 5 and a plurality of second adjustment mechanisms 6 that drive each of the plurality of irradiation units 5.

[0020] In the separation process in which the mold 1b is separated from the composition film 1c, delamination charging may occur on the surface of the mold 1b and the surface of the composition film 1c. Electromagnetic waves such as soft X-rays irradiated from the irradiation unit 5 can penetrate the mold 1b and generate ions in the space between the mold 1b and the composition film 1c, thereby neutralizing or reducing the charge generated by delamination charging. The control unit 200 can control the second adjustment mechanism 6 so that the relative position between the irradiation unit 5 and the mold holding unit 3 changes according to the progress of the separation process in which the mold 1b is separated from the composition film 1c. The second adjustment mechanism 6 may include, for example, an actuator such as a linear motor, a rotary motor, or a voice coil motor. The second adjustment mechanism 6 may also include a ball screw or a linear guide. The second adjustment mechanism 6 may include, for example, a mechanism to change the relative position between the irradiation unit 5 and the mold holding unit 3 in a direction parallel to the XY plane. The second adjustment mechanism 6 may also include, for example, a mechanism to change the relative position between the irradiation unit 5 and the mold holding unit 3 in a direction parallel to the Z axis. The second adjustment mechanism 6 may include, for example, a mechanism for rotating the irradiation unit 5 around at least one of the X, Y, and Z axes. The first adjustment mechanism 4 may include a mold drive mechanism 4b that drives the mold by driving the mold holding unit 3, and at least a portion of the irradiation unit 5 may be located within the mold drive mechanism 4b.

[0021] As schematically shown in Figure 4, the processing device 100 may further include a shielding member 5a that limits the irradiation area to which electromagnetic waves such as soft X-rays emitted from the irradiation unit 5 are irradiated. This makes it possible to prevent irradiation of areas or components to which irradiation of electromagnetic waves such as soft X-rays is to be avoided, for example, the separation assist mechanism 7. The processing device 100 may further include a drive mechanism 5b that drives the shielding member 5a.

[0022] The separation assist mechanism 7 can, for example, apply force to a portion of the edge of the structure 1 so that a crack is formed between the composition film 1c and the mold 1b. The separation assist mechanism 7 may, for example, press a solid (e.g., a pin or knife) against a portion of the edge of the structure 1, or it may blow a fluid such as gas onto it. Below, an example is described in which the separation assist mechanism 7 has a solid member 71 and an actuator 72 that drives the solid member 71, and is configured to press the solid member 71 against a portion of the edge of the structure 1, more specifically, a portion of the edge of the mold 1b. The separation assist mechanism 7 may, for example, be mounted on the substrate holding portion 2.

[0023] Figure 3 schematically shows an example configuration of the separation assistance mechanism 7. Note that the substrate holding part 2 and the mold holding part 3 are not shown in Figure 3. The tip of the solid member 71 may be positioned below the mold 1b and at a location where the characteristic part 1a' (in this case, a notch) of the substrate 1a exists. When the solid member 71 is driven in the positive Z-axis direction by the actuator 72, a force in the positive Z-axis direction is applied to the mold 1b of the structure 1, and a crack that serves as the starting point for separation of the composition film 1c and the mold 1b may be formed around the characteristic part 1a'. The tip of the solid member 71 may be made of, for example, a resin material to suppress dust generation due to contact between the tip and the mold 1b.

[0024] The control unit 200 may consist of, for example, a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), or a general-purpose or dedicated computer with a program installed, or a combination of all or part of these. The control unit 200 may include an interface for connecting to an external device. The interface may include a communication interface for communicating with a host computer. The host computer may control other devices in addition to the processing unit 100, for example. The control unit 200, in whole or in part, may be located in a rack inside the chamber (enclosure) of the processing unit 100, or it may be located outside the chamber.

[0025] The control unit 200 controls the operation of the processing unit 100. To this end, the control unit 200 can control the operation of several components of the processing unit 100, such as the irradiation of electromagnetic waves by the irradiation unit 5, the operation of the first adjustment mechanism 4, and the operation of the second adjustment mechanism 6. For example, the control unit 200 can control the second adjustment mechanism 6 so that the irradiation area of ​​electromagnetic waves by the irradiation unit 5 is controlled in accordance with the operation of the first adjustment mechanism 4, i.e., the progress of the separation process.

[0026] The following describes, with reference to Figures 4, 5, 6, 7, and 8, an illustrative method for controlling the irradiation area of ​​electromagnetic waves by the irradiation unit 5 according to the progress of the separation process. In Figures 4(B), 5(B), (C), 6(B), (C), 7(B), (C), and 8(B), (C), the substrate 1a is not shown. The region where the mold 1b and the composition film 1c are bonded (hereinafter referred to as the unseparated region) is shown in grayscale, and the composition film 1c in the region where separation is complete (hereinafter referred to as the already separated region) is shown in white.

[0027] Figure 4 illustrates the IR region of electromagnetic waves irradiated by the irradiation unit 5 immediately after the crack 1d is formed by the separation assist mechanism 7. In this state, delamination charging occurs only around the crack 1d. Generally, the intensity of electromagnetic waves radiated from the irradiation unit 5 decreases with distance from the irradiation unit 5. Therefore, when the irradiation unit 5 is far from the crack 1d, the intensity of electromagnetic waves reaching the area where delamination charging is occurring is small, and thus the efficiency of neutralizing or reducing the charge generated by delamination charging decreases. Therefore, it is preferable to bring the irradiation unit 5 closer to the crack 1d using the second adjustment mechanism 6, thereby increasing the intensity of electromagnetic waves irradiated to the crack 1d and its surroundings. This makes it possible to efficiently neutralize or reduce the charge generated by delamination charging. Thus, the time required to neutralize or reduce the charge can be shortened, and the occurrence of discharge due to the charge generated by delamination charging and the problems caused thereby can be suppressed. Irradiation of the tip of the solid member 71 of the separation assist mechanism 7 with electromagnetic waves can accelerate the deterioration of the tip, especially when the tip is made of resin. Therefore, it is preferable to drive the shielding member 5a with the drive mechanism 5b so that electromagnetic waves are not irradiated to the tip of the solid member 71.

[0028] Figure 5 illustrates the irradiated region IR in a state where the separation process has progressed further. As the separation process progresses, up to a certain point, the boundary BP between the separated and unseparated regions, i.e., the region where delamination charging occurs, can become larger. Therefore, if an attempt is made to irradiate the entire boundary BP with electromagnetic waves at once, the irradiation unit 5 must be moved away from the structure 1. On the other hand, in that case, the intensity of the electromagnetic waves reaching the boundary BP will decrease, and therefore the efficiency of neutralizing or reducing the charge generated by delamination charging may decrease.

[0029] Therefore, as schematically shown in Figure 5(B), in the first embodiment, the distance between the irradiation unit 5 and the structure 1 is set to a distance at which electromagnetic waves are locally irradiated to the boundary BP, and the second adjustment mechanism 6 can drive the irradiation area IR by the irradiation unit 5 along the boundary BP. The second adjustment mechanism 6 may, for example, move the irradiation unit 5 in a direction parallel to the Y axis so that the irradiation area IR by the irradiation unit 5 moves along the boundary BP, or it may rotate the irradiation unit 5 around the X axis. Alternatively, as schematically shown in Figure 5(C), multiple irradiation units 5 and multiple second adjustment mechanisms 6 may be provided to move multiple irradiation units 5.

[0030] Figure 6 illustrates the irradiation area IR when the separation process is carried out in a manner different from the example shown in Figure 5. In the example shown in Figure 6, the separation process may proceed along a circular orbit. In this case, as schematically shown in Figure 6(B), the second adjustment mechanism 6 can move the irradiation area IR from the irradiation unit 5 along a circular orbit. The second adjustment mechanism 6 may, for example, move the irradiation unit 5 so that the irradiation area IR from the irradiation unit 5 moves along a circular orbit, or it may rotate the irradiation unit 5 around the X axis and the Y axis. Alternatively, as schematically shown in Figure 6(C), multiple irradiation units 5 and multiple second adjustment mechanisms 6 may be provided so that multiple irradiation units 5 are moved along circular orbits.

[0031] Figure 7 illustrates the irradiation area IR in a state where the separation process has progressed further than the state shown in Figure 6. As the separation process progresses, the unseparated region may become circular in shape. Subsequently, the separation process may progress radially. At this time, for example, as schematically shown in Figure 7(B), the second adjustment mechanism 6 may move the irradiation unit 5 in a circular orbit along the outer circumference of the unseparated region, and reduce the radius of the circular orbit as the separation process progresses. The second adjustment mechanism 6 may, for example, move the irradiation unit 5 so that the irradiation area IR produced by the irradiation unit 5 moves along the circular orbit, or it may rotate the irradiation unit 5 around the X axis and the Y axis. Alternatively, as schematically shown in Figure 7(C), multiple irradiation units 5 and multiple second adjustment mechanisms 6 may be provided so that multiple irradiation units 5 move along circular orbits.

[0032] Figure 8 illustrates a different irradiation region IR than that shown in Figure 7. In the example shown in Figure 8, the irradiation unit 5 irradiates the entire unseparated region with electromagnetic waves. In this case, the second adjustment mechanism 6 can drive the irradiation unit 5 to move closer to the structure 1 as the separation process progresses. In this example, as the irradiation unit 5 approaches the structure 1, the efficiency of neutralizing or reducing the charge generated by delamination charging improves.

[0033] Figure 9 illustrates the operation of the processing apparatus 100 according to the first embodiment. The operation shown in Figure 9 can be controlled by the control unit 200. First, in step S01, under the control of the control unit 200, the structure 1 can be transported by the transport mechanism 12 from an external or internal position to the substrate holding unit 2, and the structure 1 can be held by the substrate holding unit 2. In step S02, under the control of the control unit 200, the substrate holding unit 2 and the mold holding unit 3 can be positioned by the first adjustment mechanism 4 to execute the separation process. In step P1, under the control of the control unit 200, a crack formation process is performed to form a crack 1d that serves as the starting point for the separation of the composition film 1c and the mold 1b. In step P2, under the control of the control unit 200, the main separation process is performed. In step S03, the structure having the substrate 1a and the composition film 1c can be transported by the transport mechanism 12 to a first unshown output destination. In step S04, under the control of the control unit 200, the mold 1b may be transported by the transport mechanism 12 to a second output destination (not shown).

[0034] Figure 10 shows a detailed example of step P1 in Figure 9. The operation shown in Figure 10 can be controlled by the control unit 200. In step S11, under the control of the control unit 200, the second adjustment mechanism 6 may move the irradiation unit 5 above the position where the crack 1d should be formed. In step S12, under the control of the control unit 200, the irradiation unit 5 begins irradiating the mold 1b (structure 1) with electromagnetic waves. In step S13, under the control of the control unit 200, the separation assist mechanism 7 begins to apply force to a portion of the edge of the structure 1, specifically near the feature portion 1a', so that a crack 1d is formed between the composition film 1c and the mold 1b. This operation is, for example, an operation to move the solid member 71 in the positive Z-axis direction. In parallel with this, in step S14, under the control of the control unit 200, the first adjustment mechanism 4 begins to move the mold holding unit 3, which holds the mold 1b of the structure 1 by suction, in the positive Z-axis direction. In step S15, a crack 1d is formed near the characteristic part 1a' of the structure 1. Then, in step S16, the operation of applying force to a part of the edge of the structure 1, specifically near the characteristic part 1a', for example, the operation of moving the solid member 71 in the positive Z-axis direction is stopped. In parallel with this, in step S17, under the control of the control unit 200, the first adjustment mechanism 4 stops the operation of moving the mold holding part 3 in the positive Z-axis direction. Then, in step S18, the control unit 200 terminates step P1 after waiting for the charge generated by peeling charge near the crack 1d to be neutralized or reduced.

[0035] Figure 11 shows a detailed example of step P2 in Figure 9. The operation shown in Figure 11 can be controlled by the control unit 200. In step S21, under the control of the control unit 200, the first adjustment mechanism 4 starts adjusting the relative positions of the substrate holding unit 2 and the mold holding unit 3 so that the separation process of separating the mold 1b from the composition film 1c proceeds. In parallel with this, in step S22, under the control of the control unit 200, the second adjustment mechanism 6 starts adjusting the relative positions of the irradiation unit 5 and the mold holding unit 3 so that the irradiation area IR moves in accordance with the progress of the separation process.

[0036] After step S21, the separation process proceeds in step S23 and is completed in step S25. After step S22, in step S24, under the control of the control unit 200, the second adjustment mechanism 6 adjusts the relative positions of the irradiation unit 5 and the mold holding unit 3 so that the irradiation area IR moves in accordance with the progress of the separation process. This allows the charge generated by peeling charge to be efficiently neutralized or reduced. After step S25, in step S26, under the control of the control unit 200, the first adjustment mechanism 4 finishes adjusting the relative positions of the substrate holding unit 2 and the mold holding unit 3. In step S27, the process of neutralizing or reducing the charge generated by peeling charge is completed, and in step S28, under the control of the control unit 200, the irradiation unit 5 finishes irradiating the mold 1b (structure 1) with electromagnetic waves. In step S29, under the control of the control unit 200, the second adjustment mechanism 6 finishes adjusting the relative positions of the irradiation unit 5 and the mold holding unit 3 in accordance with the progress of the separation process.

[0037] <Second Embodiment> The following describes the processing apparatus 100 of the second embodiment. Matters not mentioned in the description of the second embodiment may be described in accordance with the description of the first embodiment. Figure 12 schematically shows the configuration of the processing apparatus 100 of the second embodiment. The processing apparatus 100 of the second embodiment has an imaging unit 13 added to the processing apparatus 100 of the first embodiment. The imaging unit 13 may be configured to image the structure 1. The imaging unit 13 may be positioned to image the structure 1 from the side of its mold 1b. The mold 1b may be made of a light-transmitting material, such as quartz. The imaging unit 13 may be used to monitor the progress of the separation process. The imaging unit 13 may be configured so that the entire structure 1 is within its field of view, or it may be configured so that only a part of the structure 1 is within its field of view.

[0038] The second adjustment mechanism 6 can move the irradiation unit 5 so that the relative position between the irradiation unit 5 and the mold holding unit 3 is adjusted during the separation process in which the mold 1b is separated from the composition film 1c. The second adjustment mechanism 6 can also be configured to move the irradiation unit 5 outside the field of view of the imaging unit 13. The second adjustment mechanism 6 can be configured, for example, to move the irradiation unit 5 in directions parallel to the X-axis, parallel to the Y-axis, and parallel to the Z-axis. The control unit 200 can control the irradiation area of ​​electromagnetic waves by the irradiation unit 5 while monitoring or observing the progress of the separation process using the imaging unit 13.

[0039] In the second embodiment, the details of step P2 shown in Figure 13 are adopted instead of the details of step P2 in the first embodiment shown in Figure 11. Figure 13 shows a detailed example of step P2 in the processing apparatus 100 of the second embodiment. The operation shown in Figure 13 can be controlled by the control unit 200. In step S201, under the control of the control unit 200, the irradiation unit 5 terminates the irradiation of electromagnetic waves to type 1b (structure 1). In step S202, under the control of the control unit 200, the second adjustment mechanism 6 retracts the irradiation unit 5 out of the field of view of the imaging unit 13. In step S203, under the control of the control unit 200, the imaging unit 13 images the structure 1. The image captured by the imaging unit 13 at this time shows the state of the boundary between the separated region and the unseparated region immediately after the end of step P1.

[0040] In step S204, under the control of the control unit 200, the first adjustment mechanism 4 starts adjusting the relative positions of the substrate holding unit 2 and the mold holding unit 3 so that the separation process of separating the mold 1b from the composition film 1c proceeds. In step S205, the separation process proceeds. In step S206, under the control of the control unit 200, the first adjustment mechanism 4 stops adjusting the relative positions of the substrate holding unit 2 and the mold holding unit 3 so that the separation process stops. In step S207, under the control of the control unit 200, the imaging unit 13 images the structure 1. The image captured by the imaging unit 13 at this time shows the state of the boundary between the already separated region and the unseparated region immediately after step S206. In step S208, the control unit 200 can detect the boundary immediately after step S203 and the boundary immediately after step S207 by processing the images captured in steps S203 and S207, respectively. Furthermore, the control unit 200 can determine the extent to which the separation process has progressed based on the difference between the boundary immediately after process S203 and the boundary immediately after process S207. In process S209, the control unit 200 can determine the movement path of the irradiation unit 5 (a path that changes the relative position of the irradiation unit 5 and the mold holding unit 3) based on the results of the process in process S208.

[0041] In step S210, the control unit 200 may determine whether the separation process is complete based on the image captured in step S207. If it determines that the separation process is not complete, the control unit 200 executes steps S211 to S216 and then executes steps S204 to S210 again. In step S211, under the control of the control unit 200, the second adjustment mechanism 6 may change the relative positions of the irradiation unit 5 and the mold holding unit 3 according to the movement path determined in step S209. In step S212, under the control of the control unit 200, the irradiation unit 5 starts irradiating the mold 1b (structure 1) with electromagnetic waves. In step S213, under the control of the control unit 200, the second adjustment mechanism 6 changes the relative positions of the irradiation unit 5 and the mold holding unit 3 in accordance with the progress of the separation process. In step S214, the process of neutralizing or reducing the charge generated by peeling and charging is completed, and in step S215, under the control of the control unit 200, the irradiation unit 5 ends the irradiation of electromagnetic waves to the mold 1b (structure 1). In step S216, under the control of the control unit 200, the second adjustment mechanism 6 ends the operation of changing the relative position of the irradiation unit 5 and the mold holding unit 3.

[0042] Subsequently, steps S204 to S210 described above are executed again, but in step S208, the image acquired in step S207 of the previous sequence of steps S204 to S210 is used instead of the image acquired in step S203.

[0043] If the control unit 200 determines that the separation process is complete in step S210, it executes steps S221 to S226. In step S221, under the control of the control unit 200, the second adjustment mechanism 6 can change the relative positions of the irradiation unit 5 and the mold holding unit 3 according to the movement path determined in step S209. In step S222, under the control of the control unit 200, the irradiation unit 5 starts irradiating the mold 1b (structure 1) with electromagnetic waves. In step S223, under the control of the control unit 200, the second adjustment mechanism 6 adjusts the relative positions of the irradiation unit 5 and the mold holding unit 3 so that the irradiation area moves in accordance with the progress of the separation process. In step S224, the process of neutralizing or reducing the charge generated by peeling and charging is completed, and in step S225, under the control of the control unit 200, the irradiation unit 5 ends the irradiation of the mold 1b (structure 1) with electromagnetic waves. In step S226, under the control of the control unit 200, the second adjustment mechanism 6 completes the operation of changing the relative positions of the irradiation unit 5 and the mold holding unit 3.

[0044] In the above example, the irradiation area of ​​the electromagnetic waves by the irradiation unit 5 is determined based on the image captured by the imaging unit 13, but it may also be determined by the method described in the first embodiment.

[0045] <Third Embodiment> The processing apparatus 100 of the third embodiment will be described below. Matters not mentioned in the description of the third embodiment may be described in the description of the first or second embodiment. Figure 14 schematically shows the configuration of the processing apparatus 100 of the third embodiment. The processing apparatus 100 of the third embodiment has a supply unit (dispenser) 14 and a curing unit 15 added to the processing apparatus 100 of the second embodiment.

[0046] The transport mechanism 12 includes a transport hand and can hold the substrate 1a with the transport hand and transport it to the substrate holding section 2. The transport mechanism 12 can also hold the mold 1b with the transport hand and transport it to the mold holding section 3. The substrate 1a that the transport mechanism 12 transports to the substrate holding section 2 may or may not have an uncured composition on it.

[0047] The processing apparatus 100 may include a substrate drive mechanism 4a (first drive mechanism) for driving the substrate drive mechanism 2 and a mold drive mechanism 4b (second drive mechanism) for driving the mold drive mechanism 3 as adjustment mechanisms for adjusting the relative positions of the substrate drive mechanism 2 and the mold drive mechanism 3. The substrate drive mechanism 4a may be arranged to connect the substrate drive mechanism 2 and the first base plate 8. The mold drive mechanism 4b may be arranged to connect the mold drive mechanism 3 and the second base plate 11. The mold drive mechanism 4b may be omitted, in which case the mold drive mechanism 3 may be fixed to the second base plate 11.

[0048] The substrate drive mechanism 4a and the mold drive mechanism 4b may include actuators such as a linear motor, a rotary motor, or a voice coil motor. The substrate drive mechanism 4a and the mold drive mechanism 4b may also include a ball screw or a linear guide. The first drive mechanism 4a is configured to move the substrate holder 2 to a position below the mold holder 3, below the supply unit 14, and below the curing unit 15.

[0049] The supply unit 14 is fixed to the second platen 11, for example, and is configured to supply an uncured composition onto the substrate 1a for forming a composition film 1c. The curing unit 15 is fixed to the second platen 11, for example, and has a light source that emits curing energy to cure the uncured composition, and irradiates the uncured composition through the mold 1b to cure the uncured composition. This allows a composition film 1c consisting of a cured product of the uncured composition to be formed. The light source may include, for example, a UV lamp or a UV LED.

[0050] Figure 15 illustrates the operation of the processing apparatus 100 according to the third embodiment. The operation shown in Figure 15 can be controlled by the control unit 200. In step S01', under the control of the control unit 200, the transport mechanism 12 may transport the substrate 1a to the substrate holding unit 2 and the mold 1b to the mold holding unit 3. However, if the mold 1b is used for multiple substrates 1a, the mold 1b that has already been used may be held by the mold holding unit 3. In that case, the transport mechanism 12 does not transport the mold 1b to the mold holding unit 3.

[0051] Next, in step S03', under the control of the control unit 200, the substrate driving mechanism 4a moves the substrate holding unit 2, which holds the substrate 1a, to a position below the supply unit 14. Then, in step S04', under the control of the control unit 200, the supply unit 14 supplies the uncured composition for forming the composition film 1c onto the substrate 1a. However, if the uncured composition has already been placed on the substrate 1a that has been transported to the substrate holding unit 2 by the transport mechanism 12, steps S03' and S04' do not need to be performed.

[0052] In step S05', under the control of the control unit 200, the substrate driving mechanism 4a positions the substrate holding unit 2 below the mold holding unit 3 with the uncured composition placed on the substrate 1a. In step S06', under the control of the control unit 200, the first adjustment mechanism 4 places the mold 1b on the substrate 1a via the uncured composition. More specifically, at least one of the substrate driving mechanism 4a and the mold driving mechanism 4b operates to bring the mold 1b into contact with the uncured composition on the substrate 1a. This forms a laminate with the uncured composition placed between the substrate 1a and the mold 1b. In step S07', under the control of the control unit 200, the substrate driving mechanism 4a positions the substrate holding unit 2 so that the laminate is placed below the curing unit 15. In step S08', under the control of the control unit 200, the curing unit 15 cures the uncured composition of the laminate by irradiating the laminate with curing energy, thereby forming a structure 1 in which the substrate 1a and the mold 1b are bonded by the composition film 1c.

[0053] Subsequent steps S09' to S11' may be the same as steps S02 to S04 in the first or second embodiment. However, in step S09' (S02), under the control of the control unit 200, the mold holding unit 3 holds the mold 1b of the structure 1 located below the mold holding unit 3. In other words, in the third embodiment, the mold holding unit 3 holds the mold 1b of the structure 1 after the uncured composition has been cured by the curing unit 15 (i.e., after the composition film 1c has been formed). Also, if the mold 1b is used for multiple substrates 1a, in step S11, the mold 1b may continue to be held by the mold holding unit 3.

[0054] <Fourth Embodiment> The following describes the processing apparatus 100 of the fourth embodiment. Matters not mentioned in the description of the fourth embodiment may be described in accordance with the descriptions of the first to third embodiments. Figure 16 schematically shows the configuration of the processing apparatus 100 of the fourth embodiment. The processing apparatus 100 of the fourth embodiment has a configuration in which the curing unit 15 of the processing apparatus 100 of the third embodiment is arranged differently. Specifically, in the processing apparatus 100 of the fourth embodiment, the uncured composition in the laminate, in which the uncured composition is placed between the substrate 1a and the mold 1b, is located below the mold holding unit 3, and the uncured composition in the laminate is cured by the curing unit 15 to form the structure 1.

[0055] The operation of the processing apparatus 100 in the fourth embodiment may be the operation of the third embodiment shown in Figure 15 with step S07' removed. In other words, in the fourth embodiment, after forming the laminate in step S06', step S08' may be executed without moving the substrate holding unit 2. Also, in step S06', it is not necessary to release the mold 1b from the mold holding unit 3.

[0056] <Examples of processing device applications> The processing apparatus 100 can be used as a planarization apparatus for forming a planarization film on a substrate 1a using an uncured composition. In the planarization apparatus, a mold 1b (super straight) having a flat surface is used. The substrate 1a on which the planarization film is to be formed may have an uneven profile due to the pattern formed in the previous process. In particular, with the increasing multilayer structure of memory elements in recent years, the substrate 1a on which the planarization film is to be formed may have steps of, for example, about 100 nm. Steps caused by gentle undulations that may exist throughout the substrate 1a can be dealt with by the focus tracking function of the scan exposure apparatus used in the photolithography process. However, fine-pitched unevenness that fits within the exposure slit area of ​​the exposure apparatus consumes the DOF (Depth Of Focus) of the exposure apparatus. Conventionally, methods such as SOC (Spin On Carbon) and CMP (Chemical Mechanical Polishing) have been used as methods for smoothing the underlying pattern of the substrate. However, these methods have the problem of not being able to obtain sufficient planarization performance, and furthermore, the unevenness difference of the underlying surface due to multilayering is expected to increase in the future. Therefore, flattening using Super Straight as described above is useful.

[0057] Furthermore, the processing apparatus 100 described above may be configured as an imprint apparatus that forms a pattern using the uncured composition on the substrate 1a. In the imprint apparatus, the pattern of mold 1b may be transferred to each of the multiple shot regions of the substrate 1a. Alternatively, in the imprint apparatus, the pattern of mold 1b may be transferred to multiple shot regions of the substrate collectively (the entire substrate, or in units of one or more shot regions).

[0058] The patterns of cured materials formed using an imprint apparatus are used permanently on at least a portion of various articles, or temporarily during the manufacturing of various articles. Articles include electrical circuit elements, optical elements, MEMS, recording elements, sensors, or molds. Examples of electrical circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, as well as semiconductor elements such as LSI, CCD, image sensors, and FPGAs. Examples of molds include molds for imprinting.

[0059] The pattern of the cured material is either used as is as a component of at least some of the above-mentioned articles, or temporarily used as a resist mask. After etching or ion implantation is performed during the substrate processing process, the resist mask is removed.

[0060] The following is an example of a manufacturing method for producing an article using a processing apparatus 100 configured as an imprint device. As shown in Figure 7(A), a substrate 1z such as a silicon wafer is prepared on which a workpiece 2z such as an insulator is formed on its surface, and then an imprint material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, multiple droplet-shaped imprint material 3z are shown applied to the substrate.

[0061] One embodiment of the article manufacturing method may include a step of forming a composition film 1c on a substrate 1a by a processing method that can be performed by a processing device 100 which may be configured as a planarizing device or an imprinting device. The article manufacturing method may also include a step of obtaining an article by processing the substrate 1a on which the composition film 1c has been formed.

[0062] As shown in Figure 17(B), the mold 4z for imprinting is positioned opposite the imprint material 3z on the substrate, with the side where the uneven pattern is formed facing it. As shown in Figure 17(C), the substrate 1z to which the imprint material 3z is applied is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z fills the gap between the mold 4z and the workpiece 2z. In this state, when light is shone through the mold 4z as curing energy, the imprint material 3z hardens.

[0063] As shown in Figure 17(D), after the imprint material 3z has hardened, when the mold 4z and substrate 1z are separated, a pattern of the hardened imprint material 3z is formed on the substrate 1z. In this pattern, the recesses of the mold correspond to the protrusions of the hardened material, and the protrusions of the mold correspond to the recesses of the hardened material. In other words, the uneven pattern of the mold 4z has been transferred to the imprint material 3z.

[0064] As shown in Figure 17(E), when etching is performed using the cured material pattern as an etching-resistant mask, the parts of the workpiece 2z surface that are free of or have a thin remaining cured material are removed, forming grooves 5z. As shown in Figure 17(F), when the cured material pattern is removed, an article with grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the cured material pattern was removed, but it may also be used without removal after processing, for example, as an interlayer insulating film included in semiconductor devices, i.e., as a component of the article.

[0065] Although the example of using a mold with a raised and recessed pattern for transferring circuit patterns was described as type 4z, a member having a flat surface without a raised and recessed pattern (a flat template) may also be used.

[0066] This specification and drawings include the following disclosures: (Item 1) A substrate holding portion of a structure in which a mold is placed on a substrate via a composition film, The structure includes a mold holding portion that holds the mold, A first adjustment mechanism adjusts the relative positions of the substrate holding portion and the mold holding portion so that the mold is separated from the composition film, An irradiation unit that irradiates the mold with electromagnetic waves and generates ions between the composition film and the mold by electromagnetic waves that have passed through the mold, A second adjustment mechanism for adjusting the relative position between the irradiation unit and the mold holding unit in the process of separating the mold from the composition film, A processing apparatus characterized by comprising: (Item 2) The system further includes a control unit that controls the second adjustment mechanism so that the relative position between the irradiation unit and the mold holding unit changes in accordance with the progress of the process in which the mold is separated from the composition film. The apparatus according to item 1, characterized in that (Item 3) The separation assist mechanism further comprises applying force to a portion of the edge of the structure so as to form a crack between the composition film and the mold. The apparatus according to item 1 or 2, characterized in that (Item 4) The system further includes a shielding member that limits the irradiation area to which the electromagnetic waves emitted from the irradiation unit are irradiated. The apparatus according to any one of items 1 to 3, characterized in that (Item 5) The vehicle further comprises a drive mechanism for driving the aforementioned blocking member. The apparatus according to item 4, characterized in that (Item 6) The separation assisting mechanism further comprises applying force to a portion of the edge of the structure so as to form a crack between the composition film and the mold, The irradiation unit drives the shielding member so that the electromagnetic waves are not irradiated onto the separation assist mechanism. The apparatus according to item 5, characterized in that (Item 7) The system further includes an imaging unit for imaging the aforementioned structure. The processing apparatus according to any one of items 1 to 6, characterized in that (Item 8) The second adjustment mechanism is configured to move the irradiation unit, The second adjustment mechanism is capable of moving the illumination unit outside the field of view of the imaging unit. The apparatus according to item 7, characterized in that (Item 9) The first adjustment mechanism includes a mold drive mechanism that drives the mold by driving the mold holding portion, At least a portion of the irradiation unit is located within the type drive mechanism. The apparatus according to any one of items 1 to 8, characterized in that (Item 10) The wavelength of the electromagnetic waves irradiated onto the mold by the irradiation unit is within the range of 0.1 nm or more and 10 nm or less. The apparatus according to any one of items 1 to 9, characterized in that (Item 11) The system further comprises a supply unit for supplying an uncured composition onto the substrate held by the substrate holding unit, The mold is placed on the substrate via the uncured composition by the first adjustment mechanism. The processing apparatus according to any one of items 1 to 10, characterized in that (Item 12) The curing unit further comprises curing the uncured composition to form the composition film, The curing unit cures the uncured composition after the mold is placed on the substrate via the uncured composition by the mold holding unit. The apparatus according to item 11, characterized in that (Item 13) The mold holding portion holds the mold after the uncured composition has been cured by the curing portion. The apparatus according to item 12, characterized in that (Item 14) A first adjustment step involves adjusting the relative positions of the substrate holding portion and the mold holding portion so that the mold is separated from the composition film, while the substrate of a structure in which a mold is placed on a substrate via a composition film is held by a substrate holding portion and the mold of the structure is held by a mold holding portion. In the process of separating the mold from the composition film, an irradiation step is performed in which electromagnetic waves are irradiated onto the mold by an irradiation unit, and ions are generated between the composition film and the mold by the electromagnetic waves that have passed through the mold. The process includes a second adjustment step in which the relative position between the irradiation unit and the mold holding unit is adjusted, A processing method characterized by including the following. (Item 15) In the second adjustment step, the relative position between the irradiation unit and the mold holding unit changes as the process of separating the mold from the composition film progresses. The processing method described in item 14, characterized by the following: (Item 16) In the irradiation step, a shielding member is driven to limit the irradiation area to which the electromagnetic waves are irradiated. The processing method according to item 14 or 15, characterized by the above. (Item 17) The aforementioned type is a super straight for flattening. The processing method according to any one of items 14 to 16, characterized by the following: (Item 18) The wavelength of the electromagnetic wave is within the range of 0.1 nm or more and 10 nm or less. The processing method according to any one of items 14 to 17, characterized by the following: (Item 19) A step of supplying an uncured composition onto the substrate, A step of placing the mold on the substrate via the uncured composition, A step of forming the structure by curing the uncured composition to form the composition film, The processing method according to any one of items 14 to 18, further comprising the following: (Item 20) A step of forming a composition film on a substrate by the processing method described in item 19, A step of obtaining an article by processing the substrate on which the composition film is formed, A method for manufacturing articles, characterized by including the following:

[0067] (others) The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0068] 1: Structure, 1a: Substrate, 1b: Mold, 1c: Composition film, 2: Substrate holding part, 3: Mold holding part, 4: First adjustment mechanism, 5: Irradiation part, 6: Second adjustment mechanism, 7: Separation assist mechanism, 100: Processing device, 200: Control unit

Claims

1. A substrate holding portion of a structure in which a mold is placed on a substrate via a composition film, The structure includes a mold holding portion that holds the mold, A first adjustment mechanism adjusts the relative positions of the substrate holding portion and the mold holding portion so that the mold is separated from the composition film, An irradiation unit that irradiates the mold with electromagnetic waves and generates ions between the composition film and the mold by electromagnetic waves that have passed through the mold, A second adjustment mechanism for adjusting the relative position between the irradiation unit and the mold holding unit in the process of separating the mold from the composition film, A processing apparatus characterized by comprising:

2. The system further includes a control unit that controls the second adjustment mechanism so that the relative position between the irradiation unit and the mold holding unit changes in accordance with the progress of the process in which the mold is separated from the composition film. The apparatus according to claim 1.

3. The separation assist mechanism further comprises applying force to a portion of the edge of the structure so as to form a crack between the composition film and the mold. The apparatus according to claim 1.

4. The system further includes a shielding member that limits the irradiation area to which the electromagnetic waves emitted from the irradiation unit are irradiated. The apparatus according to claim 1.

5. The vehicle further comprises a drive mechanism for driving the aforementioned blocking member. The apparatus according to feature 4.

6. The separation assisting mechanism further comprises applying force to a portion of the edge of the structure so as to form a crack between the composition film and the mold, The irradiation unit drives the shielding member so that the electromagnetic waves are not irradiated onto the separation assist mechanism. The apparatus according to claim 5.

7. The system further includes an imaging unit for imaging the aforementioned structure. The apparatus according to claim 1.

8. The second adjustment mechanism is configured to move the irradiation unit, The second adjustment mechanism is capable of moving the illumination unit outside the field of view of the imaging unit. The apparatus according to feature 7.

9. The first adjustment mechanism includes a mold drive mechanism that drives the mold by driving the mold holding portion, At least a portion of the irradiation unit is located within the type drive mechanism. The apparatus according to claim 1.

10. The wavelength of the electromagnetic waves irradiated onto the mold by the irradiation unit is within the range of 0.1 nm or more and 10 nm or less. The apparatus according to claim 1.

11. The system further comprises a supply unit for supplying an uncured composition onto the substrate held by the substrate holding unit, The mold is placed on the substrate via the uncured composition by the first adjustment mechanism. The apparatus according to any one of claims 1 to 10.

12. The curing unit further comprises curing the uncured composition to form the composition film, The curing unit cures the uncured composition after the mold is placed on the substrate via the uncured composition by the mold holding unit. The apparatus according to feature 11.

13. The mold holding portion holds the mold after the uncured composition has been cured by the curing portion. The apparatus according to feature 12.

14. A first adjustment step involves adjusting the relative positions of the substrate holding portion and the mold holding portion so that the mold is separated from the composition film, while the substrate of the structure, in which a mold is placed on the substrate via a composition film, is held by the substrate holding portion and the mold of the structure is held by the mold holding portion. In the process of separating the mold from the composition film, an irradiation step is performed in which electromagnetic waves are irradiated onto the mold by an irradiation unit, and ions are generated between the composition film and the mold by the electromagnetic waves that have passed through the mold. The process includes a second adjustment step in which the relative position between the irradiation unit and the mold holding unit is adjusted, A processing method characterized by including the following.

15. In the second adjustment step, the relative position between the irradiation unit and the mold holding unit changes as the process of separating the mold from the composition film progresses. The processing method according to feature 14.

16. In the irradiation step, a shielding member is driven to limit the irradiation area to which the electromagnetic waves are irradiated. The processing method according to feature 14.

17. The aforementioned type is a super straight for flattening. The processing method according to feature 14.

18. The wavelength of the electromagnetic wave is within the range of 0.1 nm or more and 10 nm or less. The processing method according to feature 14.

19. A step of supplying an uncured composition onto the substrate, A step of placing the mold on the substrate via the uncured composition, A step of forming the structure by curing the uncured composition to form the composition film, The processing method according to any one of claims 14 to 18, further comprising the following:

20. A step of forming a composition film on a substrate by the processing method described in claim 19, A step of obtaining an article by processing the substrate on which the composition film is formed, A method for manufacturing articles, characterized by including the following:

Images