Component mounting device, component mounting method, and component mounting system

Abstract

To improve the precision of mounting components onto the circuit board. [Solution] The component mounting apparatus in this disclosure comprises a stage for holding a substrate, a mounting head having a nozzle capable of picking up components, a stage moving device for moving the stage horizontally, a head moving device for moving the mounting head, a first imaging device for imaging the substrate below, a second imaging device for imaging the components above that have been picked up by the nozzle, and a control unit that controls the stage moving device and / or the head moving device to perform horizontal alignment when mounting components onto the substrate based on the imaging results of the first and second imaging devices. The control unit obtains a first imaging result by imaging a first feature portion provided on the stage with the first imaging device, obtains a second imaging result by imaging a second feature portion provided on the mounting head with the second imaging device, and performs calibration related to alignment during component mounting based on the first and second imaging results.

Description

Technical Field

[0001] The present disclosure relates to a component mounting apparatus, a component mounting method, and a component mounting system for mounting components on a substrate.

Background Art

[0002] Conventionally, a component mounting apparatus for mounting components on a substrate is known, as disclosed in Patent Document 1. The component mounting apparatus includes a stage that holds the substrate, a mounting head that holds the component, and an imaging apparatus that recognizes the component and the substrate by capturing images thereof. The component mounting apparatus operates the stage and the mounting head based on the positions of the component and the substrate recognized by the imaging apparatus, to mount the component at a desired position on the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the component mounting apparatus generates heat as it is driven. The mounting position of the imaging apparatus may be displaced due to the influence of heat and the like generated from the component mounting apparatus. As a result, the component mounting apparatus may mount a component at a position deviated from the desired position on the substrate. Accordingly, there is room for improvement in terms of the accuracy of mounting components.

[0005] To solve the above problem, the present disclosure provides a component mounting apparatus, a component mounting method, and a component mounting system capable of improving the accuracy of mounting components.

Means for Solving the Problems

[0006] A component mounting apparatus according to one aspect of the present disclosure is a component mounting apparatus for mounting components on a substrate, comprising: a stage for holding the substrate; a mounting head having a nozzle capable of picking up the components; a stage moving device for moving the stage horizontally; a head moving device for moving the mounting head; a first imaging device for imaging the substrate below; a second imaging device for imaging the components above that are picked up by the nozzle of the mounting head; and a control unit that controls the stage moving device and / or the head moving device to perform horizontal alignment when mounting the components picked up by the nozzle of the mounting head onto the substrate, based on the imaging results of the first imaging device and the imaging results of the second imaging device, wherein the control unit obtains a first imaging result by imaging a first feature portion provided on the stage with the first imaging device, obtains a second imaging result by imaging a second feature portion provided on the mounting head with the second imaging device, and performs calibration for alignment during component mounting based on the first imaging result and the second imaging result.

[0007] Furthermore, a component mounting method according to one aspect of the present disclosure is a component mounting method for mounting a component onto a substrate by adsorption, comprising: controlling a control unit to hold the substrate on a stage; controlling the control unit to adsorb the component onto the nozzle of a mounting head; controlling the control unit to operate a head moving device that moves the mounting head and / or a stage moving device that moves the stage so as to perform horizontal alignment when mounting the component onto the substrate, based on the imaging result of a first imaging device that images the substrate and the imaging result of a second imaging device that images the component adsorbed onto the nozzle; controlling the control unit to cause the first imaging device to image a first feature portion provided on the stage and acquire a first imaging result; controlling the control unit to cause the second imaging device to image a second feature portion provided on the mounting head and acquire a second imaging result; and controlling the control unit to perform calibration regarding alignment during component mounting based on the first imaging result and the second imaging result.

[0008] Furthermore, a component mounting system according to one aspect of the present disclosure is a component mounting device system for mounting components on a substrate, comprising a storage unit having instructions and a control unit, wherein, when an instruction is executed, the control unit is instructed to hold the substrate on a stage, to pick up the components with the nozzles of a mounting head, to operate a head moving device that moves the mounting head and / or a stage moving device that moves the stage, based on the imaging results of a first imaging device that images the substrate and the imaging results of a second imaging device that images the components picked up with the nozzles, to perform horizontal alignment when mounting the components on the substrate, to instruct the first imaging device to image a first feature portion provided on the stage and to acquire a first imaging result, to instruct the second imaging device to image a second feature portion provided on the mounting head and to acquire a second imaging result, and to perform calibration regarding alignment during component mounting based on the first imaging result and the second imaging result. [Effects of the Invention]

[0009] According to this disclosure, the precision of mounting components can be improved. [Brief explanation of the drawing]

[0010] [Figure 1] Schematic diagram of a component mounting device and component mounting system according to an embodiment. [Figure 2] Plan view showing imaging results of the first feature area. [Figure 3] Plan view showing imaging results of the second feature area. [Figure 4] A flowchart illustrating the process by which a component mounting device according to the embodiment mounts components onto a substrate. [Figure 5A] Schematic diagram showing the operation of the component mounting device according to the embodiment. [Figure 5B] Schematic diagram showing the operation of the component mounting device according to the embodiment. [Figure 5C] Schematic diagram showing the operation of the component mounting device according to the embodiment. [Figure 5D] Schematic diagram showing the operation of the component mounting device according to the embodiment. [Figure 5E] Schematic diagram showing the operation of the component mounting apparatus according to the embodiment [Figure 5F] Schematic diagram showing the operation of the component mounting apparatus according to the embodiment [Figure 5G] Schematic diagram showing the operation of the component mounting apparatus according to the embodiment [Figure 5H] Schematic diagram showing the operation of the component mounting apparatus according to the embodiment [Figure 5I] Schematic diagram showing the operation of the component mounting apparatus according to the embodiment [Figure 6A] Flowchart showing the calibration process of the component mounting apparatus according to the embodiment [Figure 6B] Flowchart for determining whether to perform calibration based on the imaging result of the substrate camera [Figure 6C] Flowchart for determining whether to perform calibration based on the imaging result of the UL camera [Figure 7] Schematic diagram showing the operation of the component mounting apparatus according to the embodiment for imaging the first feature portion and the second feature portion [Figure 8] Schematic diagram showing a state where the substrate camera and the UL camera are misaligned [Figure 9A] Plan view showing the misalignment of the first feature portion [Figure 9B] Plan view showing the misalignment of the second feature portion [Figure 10] Graph showing the relationship between the driving time of the component mounting apparatus and the displacement of the camera [Mode for Carrying Out the Invention]

[0011] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In each drawing, each element is shown in an exaggerated manner for ease of explanation. More detailed description than necessary may be omitted. For example, detailed description of well-known matters or redundant description for substantially the same configuration may be omitted.

[0012] The accompanying drawings and the following description are provided to enable those skilled in the art to fully understand this disclosure and are not intended to limit the subject matter described in the claims.

[0013] (Embodiment) A component mounting device according to an embodiment of this disclosure will be described.

[0014] [Overall structure] Figure 1 is a schematic diagram of a component mounting device 1 and a component mounting system 100 according to an embodiment. In Figure 1, the direction perpendicular to the plane of the paper is the X direction, the left-right direction is the Y direction, and the up-down direction is the Z direction.

[0015] The component mounting system 100 is a system for manufacturing a mounted circuit board by mounting component B1 onto a substrate C1. The component mounting system 100 comprises a component mounting device 1, a management terminal 90, and a portable information terminal 92.

[0016] The component mounting device 1 is a device that repeatedly performs a series of component mounting operations, such as mounting component B1 onto substrate C1.

[0017] Component B1 is a thin, plate-like member, such as a die or an IC chip. Component B1 is formed from, for example, silicon, silicon carbide (SiC), or the like.

[0018] The substrate C1 is a plate-shaped member and may be circular or rectangular in shape. The substrate C1 is formed from, for example, silicon, glass, or resin.

[0019] The component mounting device 1 comprises a stage unit 10, a mounting head 20, a head moving device 40, a component supply device 50, a substrate camera (first imaging device) 61, an Apple Locking (UL) camera (second imaging device) 62, an operation unit 70, and a control unit 80.

[0020] The component mounting device 1 receives instructions from the operator using the operation unit 70. The operation unit 70 transmits the operator's instructions to the control unit 80. The control unit 80 executes the work based on the operator's instructions. Based on the imaging results from the substrate camera 61 and the UL camera 62, the control unit 80 operates the mounting head 20 that picks up component B1 and the stage unit 10 that holds the substrate C1. As a result, the component mounting device 1 mounts component B1 onto the substrate C1.

[0021] The stage unit 10 is a device that holds the substrate C1 and moves the substrate C1 to a predetermined position. The stage unit 10 includes a stage 12 and a stage moving device 14.

[0022] Stage 12 is a component that holds the substrate C1. Stage 12 holds the substrate C1 on its upper surface.

[0023] The stage moving device 14 is a device that moves the stage 12 in the horizontal direction. The stage moving device 14 is configured, for example, by combining a ball screw and a motor. The stage moving device 14 may also have a means for detecting the amount of movement, such as a linear scale (not shown). This allows the stage moving device 14 to perform positioning with high precision.

[0024] The stage unit 10 may further include a stage tilting device 16. The stage tilting device 16 is a device that tilts the stage 12. This allows the stage unit 10 to tilt and hold the substrate C1.

[0025] The stage unit 10 further includes a substrate heating device 18. The substrate heating device 18 heats the substrate C1 held by the stage 12, thereby facilitating the joining of component B1 and substrate C1.

[0026] The mounting head 20 is a device that adsorbs and holds component B1. The mounting head 20 includes a nozzle 22, a component heating device 26, thermometers 28 and 32, an ultrasonic oscillator 30, and a nozzle drive unit 34.

[0027] The nozzle 22 is a component that attracts part B1. The nozzle 22 is connected to a vacuum pump (not shown) and generates negative pressure in the suction hole 24. This causes the nozzle 22 to attract part B1. The nozzle 22 also has a valve (not shown) that can switch the communication state between the suction hole 24 and the vacuum pump. This allows the nozzle 22 to switch the generation of negative pressure in the suction hole 24.

[0028] The component heating device 26 and the ultrasonic oscillator 30 are devices for bonding component B1 to substrate C1. The component heating device 26 heats component B1 to facilitate bonding with substrate C1. The ultrasonic oscillator 30 vibrates component B1 to bond it to substrate C1 by rubbing it against it. Thermometers 28 and 32 are positioned to detect the temperatures of the component heating device 26 and the ultrasonic oscillator 30.

[0029] The nozzle drive unit 34 is a device that raises and lowers the nozzle 22. This allows the nozzle 22 to move in the Z direction. The nozzle drive unit 34 may have a mechanism such as a cylinder or a voice coil motor.

[0030] The head moving device 40 is a device that moves the mounting head 20 in the horizontal direction. The head moving device 40 is composed of a Y-beam, a linear guide, a ball screw, and a motor. The head moving device 40 moves the mounting head 20 along the linear guide attached to the Y-beam using the ball screw and motor. The head moving device 40 may further have a mechanism that moves the Y-beam along the X direction. This allows the head moving device 40 to move the mounting head 20 in both the X and Y directions.

[0031] The component supply device 50 is a device that supplies component B1 to the mounting head 20. The component supply device 50 includes a table 52, a table moving device 54, and a pickup head 56.

[0032] Table 52 is a component that supports part B1. Table 52 supports, for example, a wafer and supplies part B1 from the wafer.

[0033] The table moving device 54 is a device that moves the table 52 horizontally. This allows the table moving device 54 to move part B1 below the pickup head 56.

[0034] The pickup head 56 is a device that holds the part B1 supplied from the table 52 and transfers it to the mounting head 20. Specifically, the pickup head 56 holds one side of the part B1 and transfers the part B1 to the mounting head 20 so that the mounting head 20 holds the other side. Therefore, the pickup head 56 inverts the part B1 from its position on the table 52 and transfers it to the mounting head 20.

[0035] The substrate camera (first imaging device) 61 is a device that images the substrate C1 from above. The substrate camera 61 is mounted on the head moving device 40 above the substrate C1 so as to face downwards. The substrate camera 61 is, for example, a fixed-focus camera. The focal length of the substrate camera 61 corresponds to the distance between the substrate camera 61 and the substrate C1 held on the stage 12.

[0036] The Apple-locking (UL) camera (second imaging device) 62 is a device that images the component B1, which is attracted to the mounting head 20, from below. The UL camera 62 is positioned between the stage unit 10 and the component supply device 50, facing upwards. The UL camera 62 is, for example, a fixed-focus camera. The focal length of the UL camera 62 corresponds to the distance between the UL camera 62 and the component B1 attracted to the mounting head 20.

[0037] The control unit 70 is a device for receiving instructions from the operator. The control unit 70 has a screen 72 that displays the status of the component mounting device 1. The display screen 72 may be a touchscreen, or it may display operation buttons for operating the component mounting device 1.

[0038] The control unit 80 is electrically connected to the stage unit 10, the mounting head 20, the head moving device 40, the component supply device 50, the substrate camera 61, the UL camera 62, and the operation unit 70.

[0039] The control unit 80 can control the operation of the stage unit 10. Specifically, the control unit 80 can operate the stage moving device 14, the stage tilting device 16, and the substrate heating device 18. The control unit 80 can also electrically connect to a linear scale (not shown) to acquire the stage displacement. Based on the measurement of the stage displacement, the control unit 80 can operate the stage moving device 14.

[0040] The control unit 80 can control the operation of the mounting head 20. Specifically, the control unit 80 can operate the valve, the component heating device 26, the ultrasonic oscillator 30, and the nozzle drive unit 34. The control unit 80 can also electrically connect to thermometers 28 and 32 to acquire temperature. Based on the acquired temperature, the control unit 80 can operate the component heating device 26 and the ultrasonic oscillator 30.

[0041] The control unit 80 can control the operation of the component supply device 50. Specifically, the control unit 80 can operate the table moving device 54 and the pickup head 56. The control unit 80 can link the mounting head 20 and the component supply device 50 to transfer component B1 from the component supply device 50 to the mounting head 20.

[0042] The control unit 80 can control the operation of the substrate camera 61 and the UL camera 62. Specifically, the control unit 80 can cause the substrate camera 61 and the UL camera 62 to take images. Furthermore, the control unit 80 can acquire the imaging results from the substrate camera 61 and the UL camera 62.

[0043] The control unit 80 is connected to the operation unit 70 and can accept operations from an operator. The control unit 80 can also display information about the component mounting device 1 on the screen 72 of the operation unit 70.

[0044] The control unit 80 is composed of, for example, a microcontroller, CPU, MPU, GPU, DSP, FPGA, ASIC, or a combination thereof. The functions of the control unit 80 may be composed of hardware alone, or they may be realized by a combination of hardware and software.

[0045] The control unit 80 further includes a storage unit 82. The control unit 80 can perform predetermined functions by reading data and programs stored in the storage unit 82 and performing various calculation processes.

[0046] The control unit 80 is also connected to the management terminal 90.

[0047] The management terminal 90 is connected to the control unit 80 in a communication manner and manages information about the component mounting device 1 collectively. The management terminal 90 is, for example, a host computer.

[0048] The portable information terminal 92 can communicate with the management terminal 90 to check the information held by the management terminal 90. The portable information terminal 92 may be, for example, a tablet or a smartphone.

[0049] The component mounting device 1 having the above configuration performs positional alignment each time it mounts component B1 onto substrate C1, using the imaging results of substrate camera 61 and UL camera 62. Specifically, the control unit 80 identifies the position of substrate C1 based on the imaging results of substrate camera 61. The control unit 80 further identifies the position of component B1 based on the imaging results of UL camera 62. The control unit 80 performs positional alignment by applying a correction to the programmed mounting position of component B1 on substrate C1 based on the identified positions of substrate C1 and component B1.

[0050] The component mounting device 1 generates heat during operation. For example, the generated heat may cause the members supporting the substrate camera 61 and UL camera 62, as well as the substrate camera 61 and UL camera 62 themselves, to expand. This may cause the mounting positions of the substrate camera 61 and UL camera 62 to shift, resulting in a shift in the imaging position. As a result, the position identification of component B1 and substrate C1 may be inaccurate, and the mounting position may be inaccurate. To suppress this mounting position shift, the component mounting device 1 performs calibration of the mounting positions of the substrate camera 61 and UL camera 62 at predetermined intervals using the first feature section A1 and the second feature section A2.

[0051] The first feature A1 is a mark provided for calibrating the position of the substrate camera 61. Figure 2 is a plan view showing the imaging result obtained when the substrate camera 61 images the stage 10. As shown in Figure 2, the first feature A1 is provided on the upper surface of the stage 12 and outside the substrate C1. The distance between the substrate C1 and the substrate camera 61 is approximately equal to the distance between the stage 12 and the substrate camera 61. Therefore, the substrate camera 61 can easily focus on the first feature A1.

[0052] The first feature section A1 is provided on the stage 12 that directly holds the substrate C1. Therefore, the substrate C1 and the first feature section A1 are misaligned by a similar vector. As shown in Figure 2, if the first feature section A1 is misaligned horizontally due to the effects of heat or other factors (arrow D11), the substrate C1 held on the stage 12 is also misaligned by a similar vector (arrow D12). Therefore, because there are few factors that affect the relative position of the first feature section A1 and the substrate C1, accurate calibration can be performed.

[0053] The first feature portion A1 is located outside the substrate C1 held by the stage 12. As a result, the substrate camera 61 can image the first feature portion A1 regardless of whether the stage 12 is holding the substrate C1 or not.

[0054] The second feature section A2 is a mark provided for calibrating the position of the UL camera 62. The second feature section A2 can be optionally provided on the mounting head 20. Figure 3 is a plan view showing the imaging result when the UL camera 62 images the mounting head 20. As shown in Figure 3, the second feature section A2 in this embodiment is provided in the suction hole 24. This eliminates the need to provide an additional calibration mark for the second feature section A2. Also, the distance between the suctioned part B1 and the UL camera 62 is approximately equal to the distance between the suction hole 24 and the UL camera 62. Therefore, the UL camera 62 can easily focus on the suction hole 24.

[0055] The second feature section A2 is misaligned by the same vector as component B1 held by the mounting head 20. Therefore, because there are few factors that affect the relative position between the second feature section A2 and component B1, accurate calibration can be performed.

[0056] The first feature area A1 is positioned in the XY plane in a location that does not overlap with the substrate C1, which is the object to be held. Therefore, the first feature area A1 can be imaged regardless of whether or not the substrate C1 is being held.

[0057] On the other hand, the second feature section A2 is located in the XY plane at a position that overlaps with the attracted part B1. Therefore, calibration using the second feature section A2 is more accurate as it can easily reflect the positional shift of part B1 caused by the positional shift of the UL camera 62.

[0058] (operation) An example of the operation of the component mounting device 1 configured as described above will be explained. The operation of the component mounting device 1 to mount component B1 onto substrate C1 and the calibration operation of the component mounting device 1 will be explained.

[0059] (The component mounting device 1 mounts component B1 onto substrate C1.) First, we will explain the operation of the component mounting device 1 in which it mounts component B1 onto substrate C1, referring to Figures 4 and 5A to 5I. Figure 4 is a flowchart of the operation of the component mounting device 1 in which it mounts component B1 onto substrate C1. Figures 5A to 5I are schematic diagrams of the operation of the component mounting device 1 in which it mounts component B1 onto substrate C1.

[0060] The control unit 80 images the substrate C1 (S10). Specifically, the control unit 80 uses the substrate camera 61 to image the substrate C1 held on the stage 12 and acquires the imaging results. The imaging results from the substrate camera 61 include, for example, information on the XY coordinates of the orientation flat of the substrate C1.

[0061] The control unit 80 inverts part B1 (S11). Specifically, as shown in Figure 5A, the control unit 80 holds part B1, which is placed on the table 52, using the pickup head 56. The control unit 80 further moves the pickup head 56 along the direction D1 shown in Figure 5B. This causes the control unit 80 to invert part B1. The control unit 80 may also move the table moving device 54 according to the position of part B1 and the position of the pickup head 56.

[0062] The control unit 80 moves the mounting head 20 to the component transfer position P1 (S12). Specifically, as shown in Figure 5C, the control unit 80 uses the head moving device 40 to move the mounting head 20 along direction D2 to position P1 above the pickup head 56.

[0063] The control unit 80 lowers the mounting head 20 (S13). Specifically, as shown in Figure 5D, the control unit 80 operates the nozzle drive unit 34 to lower the nozzle 22 along direction D3.

[0064] The control unit 80 uses the mounting head 20 to pick up component B1 (S14). Specifically, the control unit 80 operates the valve of the mounting head 20 to generate negative pressure in the suction hole 24, thereby picking up component B1 held by the pickup head 56.

[0065] The control unit 80 raises the mounting head 20 (S15). Specifically, as shown in Figure 5E, the control unit 80 operates the nozzle drive unit 34 to raise the nozzle 22, which is holding the part B1, along direction D4.

[0066] The control unit 80 moves the mounting head 20 to the component imaging position P2 (S16). Specifically, as shown in Figure 5F, the control unit 80 uses the head moving device 40 to move the mounting head 20, which is holding component B1, along direction D5 to the component imaging position P2 above the UL camera 62.

[0067] The control unit 80 images the attached component B1 (S17). Specifically, the control unit 80 uses the UL camera 62 to image the component B1 while it is attached to the mounting head 20, and acquires the imaging results. The imaging results from the UL camera 62 include, for example, information on the XY coordinates of the leads of component B1.

[0068] The control unit 80 moves the mounting head 20 to the component mounting position P3 (S18). Specifically, as shown in Figure 5G, the control unit 80 uses the head moving device 40 to move the mounting head 20, which is holding component B1, along direction D6 to the component mounting position P3 above the substrate C1.

[0069] The control unit 80 aligns the substrate C1 (S19). Specifically, the control unit 80 uses the stage moving device 14 to align the position of the substrate C1 held on the stage 12 based on the imaging results of the substrate camera 61 and UL camera 62 described above.

[0070] Alignment refers to moving component B1 and / or substrate C1 in the XY coordinate system so that, for example, the joint portion of component B1 and the joint portion of substrate C1 can be joined together. In this embodiment, the control unit 80 uses the stage moving device 14 to move the joint portion of substrate C1 in the XY coordinate system to the joint portion of component C1 that is being held by the mounting head 20. The position of the mounting head 20 may be a fixed position or a position moved according to the mounting position of substrate C1.

[0071] The control unit 80 lowers the mounting head 20 (S20). Specifically, as shown in Figure 5H, the control unit 80 operates the nozzle drive unit 34 to lower the nozzle 22 along direction D7. As a result, the bonding portion of component B1 comes into contact with the corresponding bonding portion of substrate C1.

[0072] The control unit 80 joins component B1 to substrate C1 (S21). Specifically, the control unit 80 uses the component heating device 26 and the ultrasonic oscillator 30 to join the joining portion of component B1 to the joining portion of substrate C1. The control unit 80 may further use the substrate heating device 18 to heat substrate C1 to facilitate joining with component B1.

[0073] The control unit 80 stops the suction of component B1 (S22). Specifically, the control unit 80 operates the valve of the mounting head 20 to stop the generation of negative pressure in the suction hole 24, thereby releasing the suction of component B1.

[0074] The control unit 80 raises the mounting head 20 (S23). Specifically, as shown in Figure 5I, it operates the nozzle drive unit 34 to raise the nozzle 22 along direction D8.

[0075] The control unit 80 checks for the presence or absence of the following component (S24). Specifically, the control unit 80 refers to the programmed process to check if component B1, which must be installed, remains.

[0076] If there are still components B1 that need to be installed (Yes in S24), the control unit 80 repeats steps S10 to S24 as described above.

[0077] If there are no remaining components B1 that need to be mounted (No in S24), the control unit 80 terminates the operation of mounting components B1 onto the substrate C1.

[0078] The above is an example of how the component mounting device 1 mounts component B1 onto substrate C1.

[0079] (Calibration operation of component mounting device 1) Next, the calibration operation of the component mounting device 1 will be described. The calibration operation of the component mounting device 1 is performed based on a first difference, which is the difference between the imaging result of the first feature area A1 and the imaging result of a subsequent imaging, and a second difference, which is the difference between the imaging result of the second feature area A2 and the imaging result of a subsequent imaging.

[0080] Figures 6A to 6C are flowcharts illustrating the calibration operation of the component mounting device 1. Figure 7 is a schematic diagram showing the calibration operation of the component mounting device 1. The calibration operation is performed in parallel with the operation of mounting the aforementioned component B1 onto the substrate C1.

[0081] The control unit 80 captures an image of the first feature area A1 using the substrate camera 61 (S30).

[0082] Specifically, the control unit 80 moves the stage 12 to the first imaging position P4. As shown in Figure 7, the control unit 80 uses the stage moving device 14 to move the stage 12 to a predetermined position P4. The predetermined position P4 is, for example, a position where the first feature section A1 is positioned below the substrate camera. However, it is not limited to this, and the predetermined position P4 may be any position, for example, the edge of the movable range of the stage 12. Furthermore, if the first feature section A1 is already positioned within the imaging range of the substrate camera 61, the step of moving the stage 12 to the predetermined position P4 may be omitted.

[0083] The control unit 80 uses the substrate camera 61 to image the first feature area A1. The control unit 80 acquires the imaging result shown in Figure 2 and also acquires the XY coordinates (p1, q1) of the first feature area A1. The control unit 80 stores the information of the XY coordinates (p1, q1) of the first feature area A1 in the storage unit 82.

[0084] The above is an example of the operation of imaging the first feature area A1 using the substrate camera 61 (S30).

[0085] Returning to Figure 6A, the control unit 80 uses the UL camera 62 to image the second feature area (S31).

[0086] Specifically, as shown in Figure 7, the control unit 80 uses the head moving device 40 to move the mounting head 20, which is not holding component B1, to position P2. Position P2 is, as mentioned above, above the UL camera 62.

[0087] The control unit 80 uses the UL camera 62 to image the second feature area A2. The control unit 80 acquires the imaging results shown in Figure 3 and also acquires the XY coordinates (p2, q2) of the second feature area A2. The control unit 80 stores the information of the XY coordinates (p2, q2) of the second feature area A2 in the storage unit 82.

[0088] The above is an example of the operation of imaging the second feature area A2 using the UL camera 62 (S31).

[0089] Returning to Figure 6A, the control unit 80 determines whether a predetermined time has elapsed (S32). Specifically, the control unit 80 determines whether the time elapsed since the completion of steps S30 and S31 has exceeded a predetermined time. The control unit 80 mounts component B1 onto the substrate C1 within the predetermined time. The predetermined time can be determined arbitrarily. Furthermore, the predetermined time may be defined not by time, but by the number of component B1 mounted, etc.

[0090] If the predetermined time has not elapsed (No in S32), the control unit 80 restarts the operation of mounting component B1 onto substrate C1.

[0091] If a predetermined time has elapsed (Yes in S32), the control unit 80 performs calibration. The component mounting device 1 generates heat and other forces during operation, which may cause misalignment of the mounting positions of the substrate camera 61 and the UL camera 62. Figure 8 is a schematic diagram showing a state in which misalignment has occurred in the mounting positions of the substrate camera 61 and the UL camera 62. In Figure 8, the misalignment is exaggerated.

[0092] As shown in Figure 8, the substrate camera 61 shifts along direction D9 from its position in step S30, and the amount of the shift is (-Δp1, -Δq1) in the XY coordinate system. The UL camera 62 shifts along direction D10 from its position in step S40, and the amount of the shift is (-Δp2, -Δq2) in the XY coordinate system. Calibration corrects the amount of shift of the stage moving device 14 by comparing it with the imaging results in steps S30 and S40. The direction of the shift is not limited to the direction shown in Figure 8, and may be, for example, the opposite direction.

[0093] Returning to Figure 6A, if a predetermined time has elapsed (Yes in S32), the control unit 80 uses the substrate camera 61 to image the first feature area (S33). The operation in step S33 is the same as the operation in step S30, so the explanation of the overlapping parts will be omitted.

[0094] The control unit 80 acquires the imaging results shown in Figure 9A, and also acquires the XY coordinates (p1+Δp1, q1+Δq1) of the first feature section A1.

[0095] The above is an example of the operation of imaging the first feature area A1 using the substrate camera 61 (S33).

[0096] Returning to Figure 6A, the control unit 80 uses the UL camera 62 to image the second feature area A2 (S34). Since the operation of step S34 is the same as that of step S31, the explanation of the overlapping parts will be omitted.

[0097] The control unit 80 acquires the imaging results as shown in Figure 9B, and also acquires the XY coordinates (p2+Δp2, q2+Δq2) of the second feature section A2.

[0098] The above is an example of the operation of imaging the second feature area A2 using the UL camera 62 (S34).

[0099] Returning to Figure 6A, the control unit 80 performs calibration based on the first difference (S40). Specifically, the control unit 80 performs calibration according to the flowchart shown in Figure 6B.

[0100] The control unit 80 compares the imaging result of the first feature A1 with the next imaging result (S41). Specifically, the control unit 80 compares the XY coordinates (p1, q1) of the imaging result in step S30 with the XY coordinates (p1+Δp1, q1+Δq1) of the imaging result in step S32 and calculates the first difference (Δp1, Δq1).

[0101] The control unit 80 determines whether Δp1 is greater than a threshold (S42). Specifically, the control unit 80 determines whether the X component Δp1 of the first difference is greater than a threshold. The threshold can be arbitrarily determined, and may be, for example, the operating accuracy of the stage moving device 14.

[0102] If Δp1 is greater than the threshold (Yes in S42), the control unit 80 determines whether Δq1 is greater than the threshold (S43). Specifically, the control unit 80 determines whether the Y component Δq1 of the first difference is greater than the threshold. The threshold can be arbitrarily determined, for example, the operating accuracy of the stage moving device 14.

[0103] If Δp1 is greater than the threshold (No in S42), the control unit 80 determines whether Δq1 is greater than the threshold (S44). Specifically, the control unit 80 determines whether the Y component Δq1 of the first difference is greater than the threshold. The threshold can be arbitrarily determined, and may be, for example, the operating accuracy of the stage moving device 14.

[0104] The control unit 80 decides whether to reflect the first difference (S45 to S48). Specifically, the control unit 80 reflects the component of the first difference that it determined to be greater than the threshold in steps S42 to S44 into the amount of movement of the stage moving device 14.

[0105] If Δp1 and Δq1 are greater than the threshold (Yes in S42, Yes in S43), the control unit 80 reflects Δp1 and Δq1 in the substrate alignment operation shown in step S19 of Figure 4 (S45).

[0106] If Δp1 is greater than the threshold (Yes in S42, No in S43), the control unit 80 reflects Δp1 in the substrate alignment operation shown in step S19 of Figure 4 (S46).

[0107] If Δq1 is greater than the threshold (No in S42, Yes in S44), the control unit 80 reflects Δq1 in the substrate alignment operation shown in step S19 of Figure 4 (S47).

[0108] If Δp1 and Δq1 are not greater than the threshold (No in S42, No in S44), the control unit 80 does not reflect Δp1 and Δq1 in the substrate alignment operation shown in step S19 of Figure 4 (S48).

[0109] The control unit 80 can accurately mount component B1 onto substrate C1 by reflecting the first difference in the amount of movement of the stage moving device 14.

[0110] Furthermore, by not reflecting a first difference smaller than the operating accuracy of the stage moving device 14, the control unit 80 can mount component B1 onto the substrate C1 more accurately.

[0111] If Δp1 and Δq1 are not greater than the threshold (No in S42, No in S44), the control unit 80 extends the time interval for imaging the first feature area A1 using the substrate camera 61 (S49). Specifically, the control unit 80 extends the predetermined time in step S35 of Figure 6A, which will be described later. As a result, the control unit 80 extends the time interval for imaging the first feature area A1. Therefore, production efficiency is improved.

[0112] Returning to Figure 6A, the control unit 80 performs calibration based on the second difference (S50). Specifically, the control unit 80 performs calibration according to the flowchart shown in Figure 6C.

[0113] The control unit 80 compares the imaging result of the second feature A2 with the next imaging result (S51). Specifically, the control unit 80 compares the XY coordinates (p2, q2) of the imaging result in step S31 with the XY coordinates (p2+Δp2, q2+Δq2) of the imaging result in step S34 and calculates the second difference (Δp2, Δq2).

[0114] The control unit 80 determines whether Δp2 is greater than a threshold (S52). Specifically, the control unit 80 determines whether the X component Δp2 of the second difference is greater than a threshold. The threshold can be arbitrarily determined, and may be, for example, the operating accuracy of the stage moving device 14.

[0115] If Δp2 is greater than the threshold (Yes in S52), the control unit 80 determines whether Δq2 is greater than the threshold (S53). Specifically, the control unit 80 determines whether the Y component Δq2 of the second difference is greater than the threshold. The threshold can be arbitrarily determined, for example, the operating accuracy of the stage moving device 14.

[0116] If Δp2 is greater than the threshold (No in S52), the control unit 80 determines whether Δq2 is greater than the threshold (S54). Specifically, the control unit 80 determines whether the Y component Δq2 of the second difference is greater than the threshold. The threshold can be arbitrarily determined, and may be, for example, the operating accuracy of the stage moving device 14.

[0117] The control unit 80 decides whether to reflect the second difference (S55 to S58). Specifically, the control unit 80 reflects the component of the second difference that it determined to be greater than the threshold in steps S52 to S54 into the amount of movement of the stage moving device 14.

[0118] If Δp2 and Δq2 are greater than the threshold (Yes in S52, Yes in S53), the control unit 80 reflects Δp2 and Δq2 in the substrate alignment operation shown in step S19 of Figure 4 (S55).

[0119] If Δp2 is greater than the threshold (Yes in S52, No in S53), the control unit 80 reflects Δp2 in the substrate alignment operation shown in step S19 of Figure 4 (S56).

[0120] If Δq2 is greater than the threshold (No in S52, Yes in S54), the control unit 80 reflects Δq2 in the substrate alignment operation shown in step S19 of Figure 4 (S57).

[0121] If Δp2 and Δq2 are not greater than the threshold (No in S52, No in S54), the control unit 80 does not reflect Δp2 and Δq2 in the substrate alignment operation shown in step S19 of Figure 4 (S58).

[0122] The control unit 80 reflects the second difference in the amount of movement of the stage moving device 14, thereby enabling the component B1 to be accurately mounted on the substrate C1.

[0123] Furthermore, by not reflecting a second difference smaller than the operating accuracy of the stage moving device 14, the control unit 80 can mount component B1 onto the substrate C1 more accurately.

[0124] If Δp2 and Δq2 are not greater than the threshold (No in S52, No in S54), the control unit 80 extends the time interval for imaging the second feature area A2 using the UL camera 62 (S59). Specifically, the control unit 80 extends the predetermined time in step S35 of Figure 6A, which will be described later. As a result, the control unit 80 extends the time interval for imaging the second feature area A2. Therefore, production efficiency is improved.

[0125] The control unit 80 mounts component B1 onto substrate C1 based on the position calibrated based on the first and second differences. Specifically, the control unit 80 uses the stage moving device 14 to align substrate C1 (step S19 in Figure 4), taking into account the correction amounts determined based on steps S40 and S50.

[0126] As an example, the case in which Δp1 and Δq1 are reflected (S45) and Δp2 and Δq2 are also reflected (S55) will be described. The control unit 80 recognizes the position where component B1 should be mounted on the substrate C1 with a shift based on the first difference (Δp1, Δq1) and the second difference (Δp2, Δq2). Therefore, when the component mounting device 1 moves the stage moving device 14 without considering the first difference (Δp1, Δq1) and the second difference (Δp2, Δq2), component B1 is mounted on the substrate C1 at a position shifted by the sum of the first and second differences (Δp1+Δp2, Δq1+Δq2). Therefore, the control unit 80 corrects the amount of movement of the stage moving device 14 by (-Δp1-Δp2, -Δq1-Δq2) by considering the first difference (Δp1, Δq1) and the second difference (Δp2, Δq2). This allows the component mounting device 1 to accurately mount component B1 onto substrate C1.

[0127] Returning to Figure 6A, the control unit 80 determines whether a predetermined time has elapsed (S35). Specifically, it determines whether the time elapsed since the completion of steps S70 and S80 exceeds a predetermined time. The predetermined time can be determined arbitrarily. The predetermined time may be further extended by step S49 in Figure 6B and step S59 in Figure 6C, as described above. This improves production efficiency.

[0128] If a predetermined time has elapsed (Yes in S35), the control unit 80 takes an image of the first feature area A1 using the substrate camera 61 (S33) and an image of the second feature area A2 using the UL camera 62 (S34) in order to perform calibration again.

[0129] If a predetermined time has elapsed (Yes in S35), the control unit 80 continues the operation of mounting component B1 onto the substrate C1.

[0130] The above is an example of the calibration operation of component mounting device 1.

[0131] (summary) To summarize the above explanation, the features of this disclosure are described below.

[0132] Conventionally, component mounting devices have been used to mount components onto substrates. These devices precisely mount components onto substrates based on the imaging results of an imaging device. The position of the imaging device may shift due to the heat generated by the operation of the component mounting device. Therefore, component mounting devices are equipped with calibration marks to calibrate the imaging device. However, these calibration marks could also shift due to the heat generated by the operation of the component mounting device. As a result, there was a risk that the calibration of the imaging device would not be performed accurately. The inventors investigated the position of the calibration marks.

[0133] Specifically, the component mounting device 1 has the first feature section A1 on the upper surface of the stage 12. Therefore, calibration is performed based on the portion close to the substrate C1, which is the object to be imaged, making it less likely for relative positional deviations between the first feature section A1 and the substrate C1 to occur due to heat, etc. Similarly, the second feature section A2 is also calibrated based on the portion close to the component B1, which is the object to be imaged, making it less likely for relative positional deviations between the second feature section A2 and the component B1 to occur due to heat, etc. As a result, accurate calibration is possible.

[0134] The misalignment of the substrate camera 61 and UL camera 62 is minute, and may be smaller than the operating accuracy of the stage movement device 14. If the component mounting device 1 uses the stage movement device 14 to compensate for a magnitude exceeding that minute misalignment, it may misalign the position in which component B1 is mounted on the substrate C1. Therefore, in some cases, it may be possible to accurately mount component B1 on the substrate C1 by not compensating for the misalignment of the stage movement device 14. The component mounting device 1 can determine whether or not to perform calibration depending on the magnitude of the misalignment.

[0135] Figure 10 is a graph showing the relationship between the operating time of the component mounting device 1 and the amount of displacement of the mounting position of the substrate camera 61 or UL camera 62. As shown in Figure 10, there is a period T1 in which the amount of camera displacement increases in accordance with the passage of operating time, and a period T2 in which the amount of camera displacement does not change as much as in period T1. The control unit 80 can also perform calibration as appropriate in period T1 and reduce the frequency of calibration in period T2.

[0136] (Effects / Actions) The component mounting device 1 of this embodiment can achieve the following effects.

[0137] The component mounting apparatus 1 of the embodiment is a component mounting apparatus 1 for mounting a component B1 on a substrate C1, and comprises a stage 12 for holding the substrate C1, a mounting head 20 having a nozzle 22 capable of picking up the component B1, a stage moving device 14 for moving the stage 12 horizontally, a head moving device 40 for moving the mounting head 20, a first imaging device 61 for imaging the substrate C1 below, a second imaging device 62 for imaging the upper component B1 picked up by the nozzle 22 of the mounting head 20, and a mounting device that performs the mounting based on the imaging results of the first imaging device 61 and the imaging results of the second imaging device 62. The system includes a control unit 80 that controls the stage moving device 14 and / or head moving device 40 to perform horizontal alignment when mounting a component B1, which has been adsorbed onto the nozzle 22 of the head 20, onto the substrate C1. The control unit 80 uses a first imaging device 61 to image a first feature area A1 provided on the stage 12 and acquires a first imaging result, and uses a second imaging device 62 to image a second feature area A2 provided on the mounting head 20 and acquires a second imaging result. Based on the first and second imaging results, the control unit 80 performs calibration related to the alignment during component mounting.

[0138] This configuration reduces the number of elements that affect the relative positional change between the first feature section A1 and the substrate C1, and the elements that affect the relative positional relationship between the second feature section A2 and component B1. Therefore, compared to cases where there are many elements that affect the relative positional change, calibration can be performed more accurately, and the accuracy of mounting component B1 onto the substrate C1 can be improved.

[0139] Furthermore, in the component mounting device 1 of the embodiment, the second feature A2 is the suction hole 24 on the suction surface of the nozzle 22 of the mounting head 20, and the control unit 80 acquires a second imaging result by imaging the position including the suction hole 24 when the mounting head 20 is not adsorbing the component B1.

[0140] With this configuration, the displacement of the second feature portion A2 and the relative positional change of the mounting head 20 can be further reduced. In addition, since the second feature portion A2 is located in a place that overlaps with the attracted component B1 in the XY plane, the component mounting device 1 can be calibrated more accurately.

[0141] Furthermore, in the component mounting device 1 of the embodiment, the control unit 80 performs calibration based on a first difference, which is the difference between a first imaging result of imaging the first feature portion A1 and a second imaging result of imaging the first feature portion A1 afterwards, and a second difference, which is the difference between a second imaging result of imaging the second feature portion A2 and a second imaging result of imaging the second feature portion A2 afterwards.

[0142] With this configuration, calibration can be performed based on the first difference and the second difference.

[0143] Furthermore, in the component mounting device 1 of this embodiment, the control unit 80 performs calibration based on the first difference if the first difference is not within the first tolerance range, and does not perform calibration based on the first difference if the first difference is within the first tolerance range.

[0144] With this configuration, if the first difference is smaller than the operating accuracy, calibration is not performed. Therefore, the component mounting device 1 can accurately mount component B1 onto substrate C1 compared to when calibration is performed based on a first difference smaller than the operating accuracy.

[0145] Furthermore, in the component mounting device 1 of this embodiment, the control unit 80 extends the interval until the next first imaging result is acquired if the first difference is within the first allowable range.

[0146] This configuration allows for a reduction in the frequency of calibration and an improvement in production efficiency.

[0147] Furthermore, in the component mounting device 1 of this embodiment, the control unit 80 performs calibration based on the second difference if the second difference is not within the second tolerance range, and does not perform calibration based on the second difference if the second difference is within the second tolerance range.

[0148] With this configuration, if the second difference is smaller than the operating accuracy, calibration can be omitted. Therefore, the component mounting device 1 can accurately mount component B1 onto substrate C1 compared to when calibration is performed based on a second difference smaller than the operating accuracy.

[0149] Furthermore, in the component mounting device 1 of this embodiment, the control unit 80 extends the interval until the next second imaging result is acquired if the second difference is within the second tolerance range.

[0150] This configuration allows for a reduction in the frequency of calibration and an improvement in production efficiency.

[0151] Furthermore, in the component mounting device 1 of the embodiment, horizontal alignment includes alignment in the X direction and alignment in the Y direction, and the control unit 80 performs calibration for alignment in the X direction based on the position information in the X direction in the first imaging result and the second imaging result, and performs calibration for alignment in the Y direction based on the position information in the Y direction in the first imaging result and the second imaging result.

[0152] With this configuration, calibration based on the first imaging result and calibration based on the second imaging result can be reflected on the same axis.

[0153] Furthermore, in the component mounting device 1 of this embodiment, the control unit 80 corrects the position of the stage 12 based on the first imaging result and the second imaging result when performing calibration.

[0154] With this configuration, correction can be performed by the highly accurate stage moving device 14. Therefore, more accurate calibration can be achieved.

[0155] Furthermore, in the component mounting device 1 of this embodiment, the first feature portion A1 is provided on the upper surface of the stage 12 and on the outside of the substrate C1.

[0156] With this configuration, the first imaging result can be obtained regardless of whether the stage 12 is holding the substrate C1 or not.

[0157] Furthermore, the component mounting method of the embodiment is a component mounting method for attaching component B1 to substrate C1 by suction, wherein the control unit 80 controls the stage 12 to hold substrate C1, the control unit 80 controls the nozzle 22 of the mounting head 20 to suction component B1, and the control unit 80 controls the mounting head 20 to perform horizontal alignment when mounting component B1 to substrate C1 based on the imaging results of the first imaging device 61 that images substrate C1 and the imaging results of the second imaging device 62 that images component B1 suctioned to the nozzle 22. This includes operating the head moving device 40 and / or the stage moving device 14 for moving the stage 12, controlling the control unit 80 to cause the first imaging device 61 to image the first feature portion A1 provided on the stage 12 and to acquire a first imaging result, controlling the control unit 80 to cause the second imaging device 62 to image the second feature portion A2 provided on the mounting head 20 and to acquire a second imaging result, and controlling the control unit 80 to perform calibration for alignment during component mounting based on the first and second imaging results.

[0158] This configuration reduces the number of elements that affect the relative positional change between the first feature section A1 and the substrate C1, and the elements that affect the relative positional relationship between the second feature section A2 and component B1. Therefore, compared to cases where there are many elements that affect the relative positional change, calibration can be performed more accurately, and the accuracy of mounting component B1 onto the substrate C1 can be improved.

[0159] Furthermore, the component mounting system of the embodiment is a component mounting device 1 for mounting component B1 on a substrate C1, and comprises a memory unit 82 that has instructions and a control unit 80, and when the instructions are executed, the control unit 80 instructs the stage 12 to hold the substrate C1, to pick up component B1 with the nozzle 22 of the mounting head 20, and based on the imaging results of the first imaging device 61 that images the substrate C1 and the imaging results of the second imaging device 62 that images the component B1 picked up by the nozzle 22, to determine the horizontal position when mounting component B1 on the substrate C1. This includes operating a head moving device 40 to move the mounting head 20 and / or a stage moving device 14 to move the stage 12 in order to perform alignment; having the first imaging device 61 image the first feature portion A1 provided on the stage 12 and acquire a first imaging result; having the second imaging device 62 image the second feature portion A2 provided on the mounting head 20 and acquire a second imaging result; and performing calibration related to the positioning during component mounting based on the first and second imaging results.

[0160] This configuration reduces the number of elements that affect the relative positional change between the first feature section A1 and the substrate C1, and the elements that affect the relative positional relationship between the second feature section A2 and component B1. Therefore, compared to cases where there are many elements that affect the relative positional change, calibration can be performed more accurately, and the accuracy of mounting component B1 onto the substrate C1 can be improved.

[0161] Furthermore, the component mounting device 1 may perform calibration of the UL camera 62 while the mounting head 20 is holding component B1. This allows the component mounting device 1 to perform calibration regardless of whether the mounting head 20 is holding component B1 or not. On the other hand, the first feature portion A1 needs to be provided on the mounting head 20 in the XY plane that is outside the portion of the mounted component B1 that is being held.

[0162] Furthermore, in the flowchart shown in Figure 6A, the control unit 80 determines whether to reflect the first difference and the second difference individually, but this is not the only case. For example, the decision may be made based on the sum of the first difference and the second difference (Δp1+Δp2, Δq1+Δq2). The threshold can be arbitrarily determined, as described above. The control unit 80 may further determine whether to extend the calibration interval based on the sum of the first difference and the second difference (Δp1+Δp2, Δq1+Δq2), or it may make an individual decision based on the first difference (Δp1,Δq1) and the second difference (Δp2,Δq2).

[0163] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be obvious to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the invention as defined by the appended claims.

[0164] (Note) The above description of embodiments discloses the following technologies.

[0165] (Technology 1) A component mounting apparatus for mounting components onto a substrate, comprising: a stage for holding the substrate; a mounting head having a nozzle capable of picking up the components; a stage moving device for moving the stage horizontally; a head moving device for moving the mounting head; a first imaging device for imaging the substrate below; a second imaging device for imaging the components above that are picked up by the nozzle of the mounting head; and a control unit that controls the stage moving device and / or the head moving device to perform horizontal alignment when mounting the components picked up by the nozzle of the mounting head onto the substrate, based on the imaging results of the first imaging device and the imaging results of the second imaging device, wherein the control unit captures a first feature portion provided on the stage with the first imaging device and obtains a first imaging result; captures a second feature portion provided on the mounting head with the second imaging device and obtains a second imaging result; and performs calibration related to alignment during component mounting based on the first and second imaging results.

[0166] (Technology 2) The component mounting apparatus according to Technology 1, wherein the second feature is an adsorption hole on the adsorption surface of the nozzle of the mounting head, and the control unit captures an image of the position including the adsorption hole when the mounting head is not adsorbing the component, and obtains the second imaging result.

[0167] (Technology 3) The component mounting apparatus according to Technology 1 or 2, wherein the control unit performs the calibration based on a first difference, which is the difference between a first imaging result obtained by imaging the first feature portion and a second imaging result obtained by imaging the first feature portion thereafter, and a second difference, which is the difference between a second imaging result obtained by imaging the second feature portion and a second imaging result obtained by imaging the second feature portion thereafter.

[0168] (Technology 4) The component mounting apparatus according to Technical Reference 3, wherein the control unit performs the calibration based on the first difference if the first difference is not within the first tolerance range, and does not perform the calibration based on the first difference if the first difference is within the first tolerance range.

[0169] (Technology 5) The component mounting apparatus according to Technology 3 or 4, wherein the control unit extends the interval until the next first imaging result is acquired when the first difference is within a first tolerance range.

[0170] (Technology 6) The component mounting apparatus according to any one of the technologies 3 to 5, wherein the control unit performs the calibration based on the second difference if the second difference is not within the second tolerance range, and does not perform the calibration based on the second difference if the second difference is within the second tolerance range.

[0171] (Technology 7) The component mounting apparatus according to any one of the technologies 3 to 6, wherein the control unit extends the interval until the next second imaging result is acquired when the second difference is within the second tolerance range.

[0172] (Technology 8) The component mounting apparatus according to any one of the technologies 1 to 7, wherein the horizontal alignment includes alignment in the X direction and alignment in the Y direction, and the control unit performs the calibration for the alignment in the X direction based on the position information in the X direction in the first imaging result and the second imaging result, and performs the calibration for the alignment in the Y direction based on the position information in the Y direction in the first imaging result and the second imaging result.

[0173] (Technology 9) The component mounting apparatus according to any one of the technologies 1 to 8, wherein the control unit corrects the position of the stage based on the first imaging result and the second imaging result when performing the calibration.

[0174] (Technology 10) The first feature portion is provided on the upper surface of the stage and on the outside of the substrate, and is a component mounting device according to any one of the technologies 1 to 9.

[0175] (Technology 11) A component mounting method for attaching a component to a substrate by suction, comprising: controlling a control unit to hold the substrate on a stage; controlling the control unit to suction the component onto the nozzle of a mounting head; controlling the control unit to operate a head moving device that moves the mounting head and / or a stage moving device that moves the stage so as to perform horizontal alignment when mounting the component onto the substrate, based on the imaging result of a first imaging device that images the substrate and the imaging result of a second imaging device that images the component suctioned onto the nozzle; controlling the control unit to cause the first imaging device to image a first feature portion provided on the stage and acquire a first imaging result; controlling the control unit to cause the second imaging device to image a second feature portion provided on the mounting head and acquire a second imaging result; and controlling the control unit to perform calibration regarding alignment during component mounting based on the first imaging result and the second imaging result.

[0176] (Technology 12) A component mounting system for mounting components on a substrate, comprising a memory unit having instructions and a control unit, wherein, when an instruction is executed, the control unit is instructed to hold the substrate on a stage, to pick up the components with the nozzles of a mounting head, to operate a head moving device that moves the mounting head and / or a stage moving device that moves the stage, based on the imaging results of a first imaging device that images the substrate and the imaging results of a second imaging device that images the components picked up with the nozzles, to perform horizontal alignment when mounting the components on the substrate, to instruct the first imaging device to image a first feature portion provided on the stage and to acquire a first imaging result, to instruct the second imaging device to image a second feature portion provided on the mounting head and to acquire a second imaging result, and to perform calibration related to alignment during component mounting based on the first and second imaging results. [Industrial applicability]

[0177] This disclosure is useful as a component mounting device, component mounting method, and component mounting system that align the position of components on a substrate based on imaging results. [Explanation of symbols]

[0178] 1. Component mounting device 10 Stage Section 12 stages 14 Stage Movement Device 16 Stage tilting device 18 Substrate heating device 20 mounting heads 22 nozzles 24 Adsorption hole 26. Parts heating device 28 Thermometer 30 Ultrasonic Oscillators 32 Thermometer 34 Nozzle drive unit 40 Head moving device 50 Parts supply device 52 tables 54 Table moving device 56 Pickup Head 61. Circuit board camera (first imaging device) 62 Apple-locking (UL) camera (second imaging device) 70 Operation section 72 screens 80 Control Unit 82 Memory section 90 Management terminals 92 Portable Information Terminals 100-component system A1 First Feature Section A2 Second Feature Section B1 Parts C1 substrate Directions from D1 to D12 P1 to P4 location

Claims

1. A component mounting device for mounting components onto a circuit board, A stage for holding the substrate, A mounting head having a nozzle capable of picking up the aforementioned component, A stage moving device for moving the aforementioned stage in the horizontal direction, A head moving device for moving the aforementioned mounting head, A first imaging device for imaging the substrate below, A second imaging device for imaging the upper component that is attracted to the nozzle of the mounting head, A control unit controls the stage moving device and / or the head moving device to perform horizontal alignment when mounting the component, which has been adsorbed onto the nozzle of the mounting head, onto the substrate, based on the imaging results of the first imaging device and the imaging results of the second imaging device. Equipped with, The control unit, The first imaging device captures the first feature portion provided on the stage and obtains a first imaging result. The second imaging device captures the second feature portion provided on the mounting head and obtains a second imaging result. Based on the first and second imaging results, a calibration is performed for the alignment of the component during mounting. Component mounting device.

2. The second characteristic feature is the suction hole in the suction surface of the nozzle of the mounting head, The control unit acquires the second imaging result by imaging the position including the suction hole when the mounting head is not adsorbing the component. The component mounting device according to claim 1.

3. The control unit performs the calibration based on a first difference, which is the difference between a first imaging result obtained by imaging the first feature portion and a second imaging result obtained by imaging the first feature portion thereafter, and a second difference, which is the difference between a second imaging result obtained by imaging the second feature portion and a second imaging result obtained by imaging the second feature portion thereafter. The component mounting device according to claim 1.

4. The control unit, If the first difference is not within the first tolerance range, perform the calibration based on the first difference. If the first difference is within the first tolerance range, the calibration based on the first difference is not performed. The component mounting device according to claim 3.

5. The control unit extends the interval until the next first imaging result is acquired if the first difference is within the first acceptable range. The component mounting device according to claim 3.

6. The control unit, If the second difference is not within the second tolerance range, perform the calibration based on the second difference. If the second difference is within the second tolerance range, the calibration based on the second difference is not performed. The component mounting device according to claim 3.

7. The control unit extends the interval until the next second imaging result is acquired if the second difference is within the second tolerance range. The component mounting device according to claim 3.

8. The aforementioned horizontal alignment includes alignment in the X direction and alignment in the Y direction. The control unit, Based on the position information in the X direction in the first imaging result and the second imaging result, the calibration for alignment in the X direction is performed. Based on the position information in the Y direction in the first imaging result and the second imaging result, the calibration for alignment in the Y direction is performed. The component mounting device according to claim 1.

9. When performing the calibration, the control unit corrects the position of the stage based on the first imaging result and the second imaging result. The component mounting device according to claim 1.

10. The first feature portion is provided on the upper surface of the stage and on the outside of the substrate, The component mounting device according to claim 1.

11. A component mounting method for attaching components to a substrate by suction, The control unit controls the stage to hold the substrate, The control unit controls the nozzle of the mounting head to pick up the component, The control unit controls the head moving device that moves the mounting head and / or the stage moving device that moves the stage, based on the imaging results of the first imaging device that images the substrate and the imaging results of the second imaging device that images the component adsorbed to the nozzle, in order to perform horizontal alignment when mounting the component onto the substrate. The control unit controls the first imaging device to image the first feature portion provided on the stage and to acquire the first imaging result. The control unit controls the second imaging device to image the second feature portion provided on the mounting head and acquire the second imaging result. The control unit controls the following: performing calibration for component mounting based on the first and second imaging results. Component mounting method.

12. A component mounting system for mounting components onto a circuit board, A memory unit that has instructions, Control unit and Equipped with, When the above instruction is executed, the control unit will: To hold the substrate on the stage, The nozzle of the mounting head is used to attract the aforementioned component. Based on the imaging results of the first imaging device that images the substrate and the imaging results of the second imaging device that images the component adsorbed onto the nozzle, the head moving device that moves the mounting head and / or the stage moving device that moves the stage are operated to perform horizontal alignment when mounting the component onto the substrate. The first imaging device is instructed to image a first feature area provided on the stage and to acquire the first imaging result. The second imaging device is instructed to image the second feature portion provided on the mounting head and to acquire the second imaging result. Based on the first and second imaging results, perform a calibration for the alignment of the component during mounting. including Component mounting system.

Images