Power converter and electromechanical integrated motor

Abstract

The present invention provides a power conversion device that suppresses damage to the control board caused by thermal stress. [Solution] The power converter comprises a semiconductor unit 40, a control board 60, a noise shielding plate 70, and a support body 110. The noise shielding plate 70 is positioned between the semiconductor unit 40 and the control board 60 to block noise and support the control board 60. The support body 110 that supports the semiconductor unit 40 has a base member 111 and a plurality of beam members 112. The base member 111 is attached to a motor case 120 that houses a motor 12 and supports the semiconductor unit 40. The beam members 112 are beam-shaped and extend from the base member 111 toward the noise shielding plate 70, to which the noise shielding plate 70 is attached.

Description

TECHNICAL FIELD

[0001] The disclosure in the present specification relates to a power conversion device and a mechatronic integrated motor.

BACKGROUND ART

[0002] Patent Document 1 describes a power conversion device including a semiconductor unit, a control board that controls operation of the semiconductor unit, and an inverter case that accommodates the semiconductor unit and the control board. The inverter case includes a partition wall that separates a space for accommodating the semiconductor unit and a space for accommodating the control board. The control board is supported by the partition wall.

[0003] A side surface of the semiconductor unit is surrounded by a side wall of the inverter case, and an upper surface of the semiconductor unit is covered by the partition wall. That is, one box structure is provided by the side wall that annularly surrounds the side surface of the semiconductor unit, and the partition wall extending from the inner peripheral surface of the side wall.

PRIOR ART DOCUMENTS

PATENT DOCUMENTS

[0004]

PATENT DOCUMENT 1

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0005] However, when the power conversion device and the motor device are integrated, the following problems are concerned with the above box structure. That is, the amount of heat generated by the motor along with energization is large, and thermal stress is generated in the motor case due to thermal expansion and contraction that occurs with temperature changes. Distortion caused by the stress is sequentially transmitted to the inverter case and the control board. When the distortion of the control board accompanying this increases, defects such as damage to solder and wiring provided on the control board are concerned.

[0006] In particular, in the box structure described above, the effects of thermal stress transmitted from the motor case to the inverter case are significant, and the inverter case is prone to becoming distorted. As a result, the control board is also prone to becoming distorted, and the above concerns become more pronounced.

[0007] One of the disclosed objectives is to provide a power converter and a mechatronic motor that suppress damage to the control board due to thermal stress. [Means for solving the problem]

[0008] To achieve the above objectives, the power conversion device according to this disclosure is: A semiconductor unit (40) having a semiconductor element (32) that switches to convert power and outputs power to a motor (12) for driving the vehicle, A control board (60) that controls the operation of semiconductor elements, A noise shielding plate (70) is placed between the semiconductor unit and the control board to block noise and to support the control board, The device comprises a support (110) that supports a semiconductor unit, The support is A motor case (120) housing the motor is attached to a base member (111) that supports a semiconductor unit, It has a beam shape extending from the base member toward the noise shielding plate, and comprises a plurality of beam members (112) to which the noise shielding plate is attached.

[0009] The electromechanical integrated motor described herein is A motor (12) for driving the vehicle, A motor case (120) that houses the motor, A semiconductor unit (40) having a semiconductor element (32) that performs switching operation to convert power and output power to a motor, A control board (60) that controls the operation of semiconductor elements, A noise shielding plate (70) is placed between the semiconductor unit and the control board to block noise and to support the control board, The device comprises a support (110) that supports a semiconductor unit, The support is A base member (111) attached to the motor case and supporting the semiconductor unit, It has a beam shape extending from the base member toward the noise shielding plate, and comprises a plurality of beam members (112) to which the noise shielding plate is attached.

[0010] In the above-described power converter and electromechanical integrated motor, the base member and the noise shielding plate are connected by multiple beam members, forming a beam structure. Therefore, compared to the previously described box structure, the distortion caused by thermal stress on the motor case is less likely to be transmitted to the noise shielding plate. Thus, the thermal stress applied to the control board can be reduced, and the distortion generated in the control board can be suppressed, thereby suppressing damage to the control board. Moreover, the above beam structure ensures sufficient bending rigidity as a member supporting the semiconductor unit.

[0011] The reference numbers in parentheses above are merely examples of correspondences with specific configurations in the embodiments described later, and do not limit the technical scope in any way. [Brief explanation of the drawing]

[0012] [Figure 1] This figure shows the circuit configuration and drive system in a power conversion device according to the first embodiment. [Figure 2] This is a cross-sectional view showing a mechatronic motor equipped with a power conversion device according to the first embodiment. [Figure 3] This is a cross-sectional view along line III-III in Figure 2. [Figure 4] Figure 2 shows cross-sectional views of the support, noise shielding plate, and control board included in the power conversion device. [Figure 5] This is a cross-sectional view along the VV line in Figure 2. [Figure 6] This is a top view showing the individual structure of the support according to the first embodiment. [Modes for carrying out the invention]

[0013] Hereinafter, a plurality of embodiments will be described based on the drawings. Note that in each embodiment, corresponding components may be denoted by the same reference numerals to omit redundant descriptions. When only a part of the configuration is described in each embodiment, the configurations of other previously described embodiments can be applied to the other parts of the relevant configuration. Furthermore, not only combinations of configurations explicitly specified in the descriptions of the respective embodiments, but also partial combinations of configurations of a plurality of embodiments can be implemented even if not explicitly specified, as long as no particular obstacle arises in the combination.

[0014] (First Embodiment) First, the schematic configuration of a vehicle drive system 10 will be described based on FIG. 1.

[0015] The drive system 10 shown in FIG. 1 is mounted on a vehicle such as an electric vehicle (EV), a hybrid electric vehicle (HV), or a fuel cell vehicle. The drive system 10 includes a battery 11, a motor 12, and a power conversion device 13. The drive system 10 is a system that drives the motor 12 to drive the drive wheels of the vehicle.

[0016] The battery 11 is a DC voltage source composed of a rechargeable secondary battery, and corresponds to a power supply unit that supplies electric power to the motor 12 via the power conversion device 13. The secondary battery is, for example, a lithium-ion battery or a nickel-metal hydride battery. The battery 11 supplies a high voltage (for example, several hundreds of volts) to the inverter 30.

[0017] The motor 12 is a three-phase AC rotating electrical machine. The motor 12 has a U-phase, a V-phase, and a W-phase as the three phases. The motor 12 functions as an electric motor that is a travel drive source of the vehicle. The motor 12 functions as a generator during regeneration. The motor 12 can also be referred to as a motor generator or an electric motor.

[0018] The power converter 13 performs power conversion between the battery 11 and the motor 12. Here, the circuit configuration of the power converter 13 will be described with reference to Figure 1. The power converter 13 includes a smoothing capacitor 21, an inverter 30, and a control device 35.

[0019] The smoothing capacitor 21 is a capacitor that smooths the DC voltage supplied from the battery 11. The smoothing capacitor 21 is connected to the P line 25, which is the high-potential power line, and the N line 26, which is the low-potential power line. The P line 25 is connected to the positive terminal of the battery 11, and the N line 26 is connected to the negative terminal of the battery 11. The positive terminal of the smoothing capacitor 21 is connected to the P line 25 between the battery 11 and the inverter 30. The negative terminal of the smoothing capacitor 21 is connected to the N line 26 between the battery 11 and the inverter 30. The smoothing capacitor 21 is connected in parallel with the battery 11.

[0020] The inverter 30 is a DC-AC conversion circuit. The inverter 30 is configured with three arm circuits 31. Each arm circuit 31 has an upper arm 31a and a lower arm 31b. The upper arm 31a and the lower arm 31b are connected in series between the P line 25 and the N line 26, with the upper arm 31a on the P line 25 side. The connection point between the upper arm 31a and the lower arm 31b is connected to the winding of the corresponding phase in the motor 12 via an output line 27. The arm circuits 31 and output lines 27 are provided for the U phase, V phase, and W phase of the motor 12, respectively. The inverter 30 has three upper arms 31a and three lower arms 31b.

[0021] Arms 31a and 31b have a semiconductor element 32 and a freewheeling diode 33. The semiconductor element 32 switches to convert power and outputs power to the motor 12 for driving the vehicle. An example of the semiconductor element 32 is an n-channel insulated gate bipolar transistor (IGBT).

[0022] In the upper arm 31a, the collector of the semiconductor element 32 is connected to the P line 25. In the lower arm 31b, the emitter of the semiconductor element 32 is connected to the N line 26. The emitter of the semiconductor element 32 in the upper arm 31a and the collector of the semiconductor element 32 in the lower arm 31b are interconnected. The anode of the freewheeling diode 33 is connected to the emitter of the corresponding semiconductor element 32, and its cathode is connected to the collector.

[0023] The inverter 30 converts the DC voltage to AC voltage according to the switching control of the control device 35 and outputs it to the motor 12. As a result, the motor 12 operates to generate a predetermined rotational torque. The inverter 30 converts the DC power from the battery 11 to three-phase AC power and acts as a power conversion unit. During regenerative braking of the vehicle, the inverter 30 converts the AC voltage generated by the motor 12 in response to the rotational force from the drive wheels to a DC voltage according to the switching control of the control device 35 and outputs it to the P line 25. In this way, the inverter 30 performs bidirectional power conversion between the battery 11 and the motor 12.

[0024] The control device 35 controls the drive of the inverter 30. The control device 35 is mainly composed of a microcomputer (hereinafter referred to as microcontroller 36) that includes, for example, a processor, memory, I / O, and a bus connecting these. The control device 35 executes various processes related to the drive of the inverter 30 by executing a control program stored in memory.

[0025] The control device 35 generates drive commands using signals input from higher-level ECUs such as integrated ECUs mounted on the vehicle, and signals input from various sensors such as current sensors, and causes the semiconductor element 32 to perform ON or OFF drives in accordance with these drive commands.

[0026] Next, the structure of the power converter 13 will be described based on Figure 2. The arrows in Figure 2 indicating up, down, front, and back indicate the front-rear and up-down directions of the vehicle when the integrated electromechanical motor is mounted on the vehicle. The up-down direction of the vehicle coincides with the vertical direction. The arrows in Figure 3 indicating front, back, left, and right indicate the front-rear and left-right directions of the vehicle when the integrated electromechanical motor is mounted on the vehicle.

[0027] The power converter 13 includes a semiconductor unit 40, a capacitor unit 50, a control board 60, a noise shielding plate 70, and a support 110, etc. In addition to the above configuration, the electromechanical motor includes a transmission (not shown), a motor 12, a motor case 120, and a cover member 130, etc.

[0028] The motor case 120 is made of metal and has a motor housing section 121, a partition wall 122, and a housing section 123. The motor case 120 has a motor chamber 121a inside for housing the motor 12. The housing section 123 has a power chamber 123a inside for housing the power converter 13. The partition wall 122 is plate-shaped and separates the motor chamber 121a and the power chamber 123a.

[0029] The housing portion 123 has a ring-shaped structure that surrounds the power converter 13 and has an opening 123b into which the power converter 13 is inserted into the power chamber 123a. The lid member 130 is attached to the housing portion 123 and closes the opening 123b. A sealing material 130s, such as an O-ring, is installed between the end face of the housing portion 123 and the lid member 130, so that the power chamber 123a is sealed.

[0030] The semiconductor unit 40 constitutes the arm circuit 31, i.e., the inverter 30. The semiconductor unit 40 includes a semiconductor element 32, a current sensor (not shown), and a cooler, etc. The semiconductor element 32 is sealed in a resin body and formed into a card shape, and is also called a power card. The current sensor is attached to the output line 27 and detects the magnitude of the current output from the power card to each winding of the motor 12. The cooler has a passage for liquid coolant inside and is in contact with the power card. This allows the heat from the power card to be dissipated to the liquid coolant.

[0031] The cooler according to this embodiment has a plurality of cooling pipes, a distribution pipe, a manifold pipe, an inlet pipe 41, and an outlet pipe 42. The inlet pipe 41 and the outlet pipe 42 are connected to the external piping of the power converter 13 and circulate liquid refrigerant. The inlet pipe 41 supplies liquid refrigerant to the distribution pipe. The outlet pipe 42 causes the liquid refrigerant to flow out from the manifold pipe. The cooling pipes have a cooling surface that contacts the power card. The cooling pipes and power card are stacked alternately, so that the power card is cooled from both sides by the cooling pipes. The distribution pipe is connected to the upstream end of the plurality of cooling pipes and distributes the liquid refrigerant supplied from the inlet pipe 41 to the plurality of cooling pipes. The manifold pipe is connected to the downstream end of the plurality of cooling pipes and collects the liquid refrigerant, which flows out from the outlet pipe 42.

[0032] The capacitor unit 50 includes the smoothing capacitor 21 described above and a capacitor case 51 that houses the smoothing capacitor 21. A battery busbar B1 and a semiconductor busbar B2 are connected to the positive and negative terminals of the smoothing capacitor 21, respectively. The battery busbar B1 is connected to the battery 11. The semiconductor busbar B2 is connected to the main terminal of the semiconductor element 32. The battery busbar B1 and the semiconductor busbar B2 provide the P line 25 and the N line 26. An output busbar B3 is connected to the other main terminal of the semiconductor element 32. The output busbar B3 is connected to the winding of the motor 12.

[0033] The control board 60 is equipped with a control device 35. The control device 35 includes a microcontroller 36 and a drive circuit, etc. The microcontroller 36 controls the switching of the semiconductor element 32. The drive circuit supplies a drive voltage to the semiconductor element 32 based on a drive command from the microcontroller 36.

[0034] The noise shielding plate 70 is made of metal and is plate-shaped. The noise shielding plate 70 is positioned parallel to the control board 60. The noise shielding plate 70 is placed between the semiconductor unit 40 and the control board 60 to block noise. For example, it prevents noise from the semiconductor element 32 generated during switching operation from affecting the control board 60 and causing malfunctions. The noise shielding plate 70 is also placed between the capacitor unit 50 and the control board 60.

[0035] As shown in Figures 3 and 4, the control board 60 is attached to the noise shielding plate 70. Specifically, the control board 60 is fixed to the noise shielding plate 70 at multiple points using screws N1 (fixing members) as shown in Figure 3. In this way, the noise shielding plate 70 supports the control board 60. The area obtained by projecting the noise shielding plate 70 in a direction perpendicular to the control board 60 (vertical direction) is defined as the shielding plate area A1. In other words, the area inside the outline 71 of the noise shielding plate 70 in a top view corresponds to the shielding plate area A1. As shown in Figure 3, the size and position of the noise shielding plate 70 are set so that the entire control board 60 is included in the shielding plate area A1.

[0036] The support 110 is made of metal and supports the semiconductor unit 40, the capacitor unit 50, and the noise shielding plate 70. As shown in Figures 4 and 5, the support 110 has a base member 111, a beam member 112, a connecting wall 113, and a shield wall 114. The support 110 is made of a metal such as aluminum, and the base member 111, beam member 112, connecting wall 113, and shield wall 114 are integrally formed by casting or the like.

[0037] The base member 111 is attached to and supported by the bulkhead 122 of the motor case 120. The bulkhead 122 and the base member 111 are plate-shaped and extend parallel to the control board 60. Multiple bosses 124 are formed on the bulkhead 122. The bosses 124 are cylindrical in shape and extend in the vertical direction. With the base member 111 placed on the bosses 124, the base member 111 is fixed to the motor case 120 by fastening bolts N5 (not shown) to the bosses 124.

[0038] The base member 111 has a semiconductor coupling portion 111a, a capacitor coupling portion 111b, and a case coupling portion 111c. The case coupling portion 111c is the part that is coupled to the boss 124 of the motor case 120 with bolts N4 (fixing members), and is located on the side of the base member 111 that faces the partition wall 122.

[0039] A semiconductor unit 40 and a capacitor unit 50 are attached to the base member 111 on the side opposite the partition wall 122. The semiconductor coupling portion 111a is the part to which the semiconductor unit 40 is connected by a bolt N3 (fixing member). For example, the semiconductor coupling portion 111a is a hole with an internal thread on its inner circumference, and the semiconductor unit 40 is fixed to the base member 111 by screwing the bolt N3 into this hole.

[0040] The capacitor coupling portion 111b is the part to which the capacitor coupling portion 111b is connected by a bolt N4 (fixing member). For example, the capacitor coupling portion 111b is a hole with an internal thread on its inner circumference, and the capacitor coupling portion 111b is fixed to the base member 111 by screwing the bolt N4 into that hole.

[0041] The beam member 112 is a beam shape that extends upward from the base member 111 toward the noise shielding plate 70. For example, the beam member 112 is a solid cylindrical shape. Multiple beam members 112 are provided. The tip of the beam member 112 is the part to which the noise shielding plate 70 is connected by screws N2 (fixing members). For example, a hole with a female thread is formed on the inner circumference of the tip of the beam member 112. By fastening screws N2 into this hole, the noise shielding plate 70 is fixed to multiple beam members 112.

[0042] The support 110 and the noise shielding plate 70 are fastened together with screws N2 to provide a single integrated beam structure. Specifically, the opposing base members 111 and the noise shielding plate 70 are connected by a plurality of beam members 112 to form a beam structure. This beam structure has sufficient bending rigidity against loads from all directions. Different materials are used for the support 110 and the noise shielding plate 70. The coefficient of thermal expansion of the noise shielding plate 70 is closer to that of the control board 60 than that of the support 110. As a specific example of materials that satisfy these conditions, aluminum is selected for the support 110 and an iron-based metal is selected for the noise shielding plate 70.

[0043] The connecting wall 113 protrudes upward from the base member 111 and has a shape that connects multiple beam members 112. For example, the connecting wall 113 connects multiple beam members 112 that are far apart from each other. Alternatively, the connecting wall 113 may connect all of the beam members 112.

[0044] The shield wall 114 protrudes upward from the base member 111 and covers the capacitor unit 50 from the side. The shield wall 114 blocks noise emitted from the capacitor unit 50. It is desirable that the height of the shield wall 114, i.e., its vertical length, be greater than that of the capacitor unit 50. It is also desirable that the width of the shield wall 114, i.e., its length perpendicular to the vertical direction, be greater than that of the capacitor unit 50.

[0045] Here, the amount of heat generated by the motor 12 when power is applied is large, and thermal expansion and contraction caused by temperature changes put thermal stress on the motor case 120. The strain caused by this stress is sequentially transmitted to the support 110, the noise shielding plate 70, and the control board 60. If the resulting strain on the control board 60 becomes large, there is a concern that malfunctions such as damage to the solder and wiring on the control board 60 may occur.

[0046] In view of this point, in this embodiment, the support 110 that supports the semiconductor unit 40 has a base member 111 and a plurality of beam members 112. The base member 111 is attached to the motor case 120 and supports the semiconductor unit 40. The beam members 112 are beam-shaped and extend from the base member 111 toward the noise shielding plate 70. The noise shielding plate 70 is attached to the ends of the plurality of beam members 112.

[0047] According to this, the support 110 and the noise shielding plate 70 provide a single beam structure. Specifically, the opposing base member 111 and the noise shielding plate 70 form a beam structure connected by a plurality of beam members 112. Therefore, compared to a box structure (comparative example) in which the base member 111 and the noise shielding plate 70 are connected by side walls surrounding the entire perimeter of the semiconductor unit 40, the following advantageous effects are achieved.

[0048] In other words, compared to the box structure described above, the distortion caused by thermal stress on the motor case 120 is less likely to be transmitted to the noise shielding plate 70. Therefore, the thermal stress applied to the control board 60 can be reduced, and the distortion occurring in the control board 60 can be suppressed, thus preventing damage to the control board 60.

[0049] Furthermore, since heat from the motor case 120 is less likely to be transferred to the noise shielding plate 70, temperature changes of the control board 60 can be reduced, and the amount of thermal contraction of the control board 60 can be reduced. Therefore, damage to the control board 60 can be suppressed.

[0050] Furthermore, vibrations from the motor 12 and the vehicle are less likely to be transmitted to the noise shielding plate 70, thus suppressing damage to the control board 60. At the same time, since the base member 111 and the noise shielding plate 70 are connected by multiple beam members 112 to form a beam structure, sufficient bending rigidity can be ensured as a member supporting the semiconductor unit 40.

[0051] In this embodiment, the shield wall 114 and the connecting wall 113 are provided on the base member 111, and they are provided in such a way as to maintain the beam structure described above. For example, the connecting wall 113 is not shaped to extend across the entire vertical space between the noise shielding plate 70 and the base member 111, but is spaced apart from the noise shielding plate 70. The same applies to the shield wall 114; it is not shaped to extend across the entire vertical space between the noise shielding plate 70 and the base member 111, but is spaced apart from the noise shielding plate 70. The beam member 112 is then positioned in these spaced-away areas. In other words, the beam member 112 is positioned between the shield wall 114 and the connecting wall 113 and the noise shielding plate 70.

[0052] Furthermore, in this embodiment, as shown in Figure 6, the semiconductor coupling portion 111a of the base member 111 that is coupled to the semiconductor unit 40 is located outside the noise path region A2. The noise path region A2 is the region of the base member 111 that connects the case coupling portion 111c and the beam member 112 by the shortest distance. Here, noise generated in the control board 60 is absorbed by the noise shielding plate 70 and flows into the motor case 120 through the beam member 112 and the base member 111. This noise path includes the noise path region A2. And since the semiconductor coupling portion 111a is located outside the noise path region A2, it is possible to suppress the semiconductor element 32 from being adversely affected by the above noise.

[0053] Furthermore, in this embodiment, the area where the noise shielding plate 70 is projected in a direction perpendicular to the control board 60 is defined as the shielding plate area A1. The entire control board 60 is included in the shielding plate area A1. Therefore, the beam structure provided by the noise shielding plate 70 and the support 110 can exhibit sufficient noise shielding effect while ensuring sufficient bending rigidity.

[0054] Furthermore, in this embodiment, the support 110 and the noise shielding plate 70 are made of different materials. The coefficient of thermal expansion of the noise shielding plate 70 is closer to that of the control board 60 than that of the support 110. Therefore, the difference in the coefficients of thermal expansion between the noise shielding plate 70 and the control board 60 can be reduced, thereby reducing the thermal stress applied to the control board 60.

[0055] (Other embodiments) The disclosure in this specification is not limited to the exemplary embodiments. The disclosure encompasses the exemplary embodiments and variations thereof by those skilled in the art. For example, the disclosure is not limited to the combinations of parts and elements shown in the embodiments, but can be implemented in various variations. The disclosure can be implemented in a variety of combinations. The disclosure may have additional parts that can be added to the embodiments. The disclosure encompasses embodiments in which parts and elements have been omitted. The disclosure encompasses substitutions or combinations of parts and elements between one embodiment and another. The scope of the disclosed technical field is not limited to the descriptions of the embodiments. The scope of the disclosed technical field is indicated by the claims and should be understood to include all modifications within the meaning and scope equivalent to the claims.

[0056] In each of the above embodiments, the beam member 112 is provided on the support 110, but it may also be provided on the noise shielding plate 70. In this case, it is desirable that the connecting wall 113 is also provided on the noise shielding plate 70.

[0057] In each of the above embodiments, the semiconductor coupling portion 111a is located outside the noise path region A2, but it may also be located inside the noise path region A2. In each of the above embodiments, the entire control substrate 60 is included in the shielding plate region A1, but a part of the control substrate 60 may be located outside the shielding plate region A1. In each of the above embodiments, different materials are used for the support 110 and the noise shielding plate 70, but they may also be made of the same material. [Explanation of symbols]

[0058] 12...Motor, 13...Power converter, 32...Semiconductor element, 40...Semiconductor unit, 60...Control board, 70...Noise shielding plate, 110...Support, 111...Base member, 111a...Semiconductor coupling part, 111c...Case coupling part, 112...Beam member, 120...Motor case, A1...Shielding plate area, A2...Noise path area.

Claims

1. A semiconductor unit (40) having a semiconductor element (32) that switches to convert power and outputs power to a motor (12) for driving the vehicle, A control board (60) for controlling the operation of the semiconductor element, A noise shielding plate (70) is placed between the semiconductor unit and the control board to block noise and to support the control board, A support (110) that supports the semiconductor unit, Equipped with, The aforementioned support is A base member (111) is attached to the motor case (120) that houses the motor and supports the semiconductor unit, The beam shape extends from the base member toward the noise shielding plate, and there are multiple beam members (112) to which the noise shielding plate is attached, A power conversion device having the following features.

2. The base member has a semiconductor coupling portion (111a) that connects to the semiconductor unit and a case coupling portion (111c) that connects to the motor case. Of the base members, the region connecting the case joint and the beam member by the shortest distance is defined as the noise path region (A2). The power conversion device according to claim 1, wherein the semiconductor coupling portion is located outside the noise path region.

3. The region where the noise shielding plate is projected in a direction perpendicular to the control board is defined as the shielding plate region (A1). The power conversion device according to claim 1 or 2, wherein the entire control board is included in the shielding plate region.

4. The support and the noise shielding plate are made of different materials. The power conversion device according to claim 1 or 2, wherein the coefficient of linear expansion of the noise shielding plate is closer to the coefficient of linear expansion of the control board than to the coefficient of linear expansion of the support.

5. A motor (12) for driving the vehicle, A motor case (120) housing the motor, A semiconductor unit (40) having a semiconductor element (32) that performs switching operation to convert power and output power to the motor, A control board (60) for controlling the operation of the semiconductor element, A noise shielding plate (70) is placed between the semiconductor unit and the control board to block noise and to support the control board, A support (110) that supports the semiconductor unit, Equipped with, The aforementioned support is A base member (111) attached to the motor case and supporting the semiconductor unit, The beam shape extends from the base member toward the noise shielding plate, and there are multiple beam members (112) to which the noise shielding plate is attached, A mechatronic integrated motor having the following features.

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