Substrate holding device and substrate bonding device

Abstract

To provide a substrate holding device that deforms the holding plate at least in the direction normal to the holding surface. [Solution] In the substrate holding device, the holding section 220 comprises a holding plate 607 having a holding surface 613 for holding the substrate, a plurality of actuators 615 connected to the holding plate 607 and deforming the holding plate 607 at least in the direction normal to the holding surface 613, and a base plate 603 supporting the plurality of actuators 615. The holding surface 613 has a predetermined uneven shape when the plurality of actuators 615 are not operating.

Description

Technical Field

[0001] The present invention relates to a substrate holding apparatus and a substrate bonding apparatus.

Background Art

[0002] Patent Document 1 describes that "when positioning a pair of substrates 121 to be bonded at the positioning section 170, the alignment marks 128 of the opposing substrates 121 are observed by microscopes 231 and 251 to measure the relative position between the substrates 121. Further, by moving the fine movement stage 230 so as to eliminate the measured relative position deviation, the substrates 121 can be aligned." (Paragraph 0055). [Prior Art Documents] [Patent Documents] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2013-8804

Summary of the Invention

[0003] In a first aspect, a substrate holding apparatus is provided. The substrate holding apparatus may comprise a holding plate having a holding surface for holding a substrate. The substrate holding apparatus may comprise a plurality of actuators coupled to the holding plate and configured to deform the holding plate at least in a normal direction of the holding surface. The substrate holding apparatus may comprise a base plate that supports the plurality of actuators. In the substrate holding apparatus, the holding surface may have a predetermined uneven shape in a state where the plurality of actuators are not operating.

[0004] In the substrate holding apparatus, the predetermined uneven shape may be a shape in which a center portion is more convex than a peripheral portion.

[0005] In the substrate holding apparatus, a surface of the holding plate opposite to the holding surface may be flat in a state where the plurality of actuators are not operating.

[0006] In the above-described substrate holding device, the holding surface may become flat as the plurality of actuators operate.

[0007] In the above-described substrate holding device, the plurality of actuators may be arranged concentrically with respect to the holding plate.

[0008] The above-mentioned substrate holding device may further include a leaf spring that connects the base plate and the holding plate.

[0009] In the above substrate holding device, the holding plate may have a plurality of through holes. The substrate holding device may further include coupling members that are inserted into each of the plurality of through holes and coupled to the corresponding actuator among the plurality of actuators.

[0010] In the above substrate holding device, the coupling member may have a link mechanism that is movable in the planar direction relative to the holding plate and transmits the displacement of the actuator in the normal direction.

[0011] In the above-described substrate holding device, the holding plate may have through holes. The substrate holding device may further include push-up pins that are inserted into and removed from the through holes to temporarily hold the substrate.

[0012] In a second embodiment, a substrate bonding apparatus is provided. The substrate bonding apparatus may include a substrate holding part for holding another substrate. The substrate bonding apparatus may bond the substrate and the other substrate by moving at least one of the substrate holding part and the substrate holding part toward the other.

[0013] In the above-described substrate bonding apparatus, the substrate holding device may be movable in the planar direction of the substrate.

[0014] The above summary of the invention does not enumerate all of its features. Subcombinations of these features may also constitute an invention. [Brief explanation of the drawing]

[0015] [Figure 1] A diagram of the laminate manufacturing system 100 is shown. [Figure 2] A schematic longitudinal cross-sectional view of the substrate bonding apparatus 170 is shown. [Figure 3] A schematic cross-sectional view of the substrate bonding apparatus 170 is shown. [Figure 4] This shows an example of how the laminate manufacturing system 100 bonds the substrates 121. [Figure 5] A conceptual perspective view is shown of a pair of substrates 121 facing each other and intended for bonding. [Figure 6] A schematic plan view of the holding section 220 and the fine-movement stage 230 is shown. [Figure 7] A schematic AA cross-sectional view of the holding section 220 and the fine-movement stage 230 is shown. [Figure 8] A schematic cross-sectional view of the retaining portion 220 is shown. [Figure 9] A schematic cross-sectional view of the retaining portion 220 is shown. [Figure 10] Figure 9 shows a schematic enlargement of the area indicated by the dashed line. [Figure 11] A schematic cross-sectional view of the retaining portion 220 is shown. [Figure 12] A schematic cross-sectional view of the retaining portion 220 is shown. [Modes for carrying out the invention]

[0016] The following embodiments are not intended to limit the invention as claimed. Not all combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0017] Figure 1 is a configuration diagram showing a laminate manufacturing system 100 according to the present embodiment. The laminate manufacturing system 100 includes a housing 106, a substrate case 120, a first transfer robot 132, a substrate buffer 161, a substrate position adjustment unit 163, a second transfer robot 134, an activation device 165, a cleaning device 167, a substrate bonding device 170, and a control device 110. The laminate manufacturing system 100 manufactures a laminate 123 formed by laminating a plurality of substrates 121. The substrate 121 is, for example, a circular silicon substrate on which a circuit pattern, alignment marks, electrodes, and the like are formed. The laminate manufacturing system 100 can also laminate unprocessed substrates, compound semiconductor substrates, printed circuit boards, glass substrates, and the like. It is possible to laminate a substrate on which a circuit pattern or the like is formed and an unprocessed substrate, or to laminate substrates of the same type, such as substrates each having a circuit pattern formed thereon, or unprocessed substrates. The substrate 121 to be laminated may itself be a substrate already formed by laminating a plurality of substrates. Note that the substrate 121 to be laminated is not limited to a circular substrate, and may be a rectangular substrate.

[0018] The substrate case 120 is a case capable of accommodating the substrates 121, and accommodates the substrates 121 on which a circuit pattern or the like is formed. The first transfer robot 132 takes out the substrate 121 from the substrate case 120, and transfers the substrate 121 to the substrate buffer 161 or the substrate position adjustment unit 163. The substrate buffer 161 temporarily stocks the substrates 121. The substrate position adjustment unit 163 pre-aligns the substrate 121 before the substrate 121 is transferred to various devices such as the activation device 165, the cleaning device 167, and the substrate bonding device 170. The second transfer robot 134 transfers the substrate 121 among the substrate buffer 161, the substrate position adjustment unit 163, the activation device 165, the cleaning device 167, and the substrate bonding device 170.

[0019] The activation device 165 activates the surface of the substrate 121. Specifically, the surface of the substrate 121 is activated by plasma treatment. The cleaning device 167 cleans the substrate 121 that has been subjected to the activation treatment by the activation device 165. The substrate 121 cleaned by the cleaning device 167 is transported to the substrate bonding device 170. The substrate bonding device 170 laminates (bonds) the two substrates 121.

[0020] The control device 110 has an arithmetic processing circuit such as a CPU, and memories such as a ROM and a RAM, and executes a predetermined program to realize its functions. The control device 110 is, for example, a computer, and comprehensively controls each part of the laminate manufacturing system 100. The control device 110 controls the driving of the first transport robot 132, the second transport robot 134, the substrate position adjusting unit 163, the activation device 165, the cleaning device 167, and the substrate bonding device 170.

[0021] The laminate manufacturing system 100 includes a substrate bonding device 170 disposed inside a housing 106. The laminate manufacturing system 100 bonds a plurality of substrates 121 to manufacture a laminate 123.

[0022] The laminate 123 manufactured in the laminate manufacturing system 100 is accommodated in another substrate case 120 and unloaded from the laminate manufacturing system 100. In this manner, by using the substrate case 120, a plurality of substrates 121 can be collectively loaded into the laminate manufacturing system 100, and a plurality of laminates 123 can be collectively unloaded from the laminate manufacturing system 100.

[0023] The first transport robot 132 disposed facing the substrate case 120 unloads the substrates 121 to be bonded from the substrate case 120. The first transport robot 132 also carries the manufactured laminate 123 into the substrate case 120. In this way, the first transport robot 132 directly transports the substrates 121 or the laminate 123.

[0024] The substrate bonding apparatus 170 comprises a fixed stage section 250 and a movable stage section 240 arranged inside a frame 210. The fixed stage section 250 is fixed to the frame 210. The movable stage section 240 includes a fine-movement stage 230 that moves relative to the fixed stage section 250. The holding section 220 is positioned on the fine-movement stage 230. With the holding section 220 gripping the substrate 121, the movable stage section 240 moves relative to the fixed stage section 250.

[0025] The outer surface of the frame 210 is closed by the wall material 212, preventing radiant heat from the surroundings from influencing the substrate bonding device 170. The micro-movement stage 230 is equipped with a reflector 224. An interferometer 222 is placed inside the wall material 212. The interferometer 222 uses the reflector 224 to measure the position of the micro-movement stage 230 with high precision. This allows the substrate 121 held by the holding unit 220 to be positioned with high precision relative to the substrate 121 held by the holding unit 252 of the fixed stage unit 250. In addition, the reflector 224 can be said to be an indicator for detecting the position of the micro-movement stage 230.

[0026] After positioning, the micro-movement stage 230 moves toward the fixed stage section 250, and the laminate manufacturing system 100 bonds the substrates 121 together to form a laminate 123. The laminate 123 is then handed over to the second transport robots 134 and 132 and collected in the substrate case 120.

[0027] Furthermore, the control device 110 includes an operating unit that the user can operate externally to power on the laminate manufacturing system 100, input various settings and information, and a display unit that conveys information to the user. In addition, the control device 110 may also include a connection unit that connects to other additionally deployed equipment.

[0028] Figure 2 is a schematic longitudinal cross-sectional view of the substrate bonding apparatus 170. The fixed stage section 250 is suspended downward from the ceiling surface of the frame 210 via a plurality of load cells 254. The fixed stage section 250 includes a holding section 252. The holding section 252 may be a vacuum chuck. The holding section 252 holds the substrate 121 vertically downward. The load cells 254 detect the vertically downward force acting on the fixed stage section 250.

[0029] A microscope 251 is positioned vertically downwards on the ceiling surface of the frame 210, to the side of the fixed stage section 250. The microscope 251 observes the surface of the substrate 121 held by the holding section 220. Since the microscope 251 is fixed to the frame 210, the relative position of the microscope 251 and the fixed stage section 250 does not change.

[0030] The movable stage section 240 comprises a movable base plate 242, a coarse adjustment stage 244, a gravity canceling unit 246, a spherical seat 248, and a fine adjustment stage 230. The movable base plate 242, carrying the coarse adjustment stage 244, the gravity canceling unit 246, and the fine adjustment stage 230, moves along a guide rail 241 fixed to the inner bottom surface of the frame 210. As the movable base plate 242 moves, the movable stage section 240 moves between a position directly below the fixed stage section 250 and a position away from directly below the fixed stage section 250.

[0031] The coarse adjustment stage 244 moves relative to the moving platen 242 in a horizontal direction including the X and Y components indicated by the arrows in the figure. When moving relative to the moving platen 242, the fine adjustment stage 230 also moves along with the coarse adjustment stage 244.

[0032] The gravity canceling unit 246 expands and contracts while detecting minute displacements of the micro-movement stage 230, thereby reducing the apparent weight of the micro-movement stage 230. This reduces the load on the actuator that displaces the micro-movement stage 230, improving the accuracy of position control.

[0033] A holding unit 220 is positioned on the fine-adjustment stage 230. The holding unit 220 holds the substrate 121 to be bonded. During the positioning operation of the substrate 121, the fine-adjustment stage 230 moves in accordance with the movement of the movable platen 242 and the coarse-adjustment stage 244, which is mounted on the movable platen 242. In the next stage, the fine-adjustment stage 230 is displaced relative to the coarse-adjustment stage 244. The displacement of the fine-adjustment stage 230 relative to the coarse-adjustment stage 244 includes translation and rotation in all X, Y, and Z axes. The amount of displacement of the fine-adjustment stage 230 is sufficiently small that even when the fine-adjustment stage 230 is displaced, it does not come into contact with the push-up pin 623, which will be described later. In addition, with the above configuration, the movable stage unit 240 is movable at least in the planar direction of the substrate 121. The positioning control unit 112 controls the displacement of the movable platen 242, the coarse-adjustment stage 244, and the fine-adjustment stage 230.

[0034] Furthermore, the micro-movement stage 230 has a microscope 231 fixed to its side. Since the microscope 231 is fixed to the micro-movement stage 230, the relative positions of the micro-movement stage 230 and the microscope 231 do not change. The microscope 231 observes the surface of the substrate 121 held by the fixed stage section 250. The substrate bonding apparatus 170 uses the observation results from the microscope 231 and the microscope 251 to measure the relative positions of the substrates 121.

[0035] Figure 3 is a schematic cross-sectional view of the substrate bonding apparatus 170. Elements common to both Figure 2 and Figure 3 are given the same reference numerals, and redundant explanations are omitted.

[0036] The movable base plate 242 and the holding unit 220 mounted on the movable base plate 242 move along the guide rail 241.

[0037] The movable platen 242 moves along the guide rail 241, bringing the substrate 121 gripped by the holding part 252 and the substrate 121 gripped by the holding part 220 to face each other. After positioning the pair of held substrates 121, the fine-movement stage 230 is raised, bringing the pair of substrates 121 closer together.

[0038] Figure 4 shows an example of how the laminate manufacturing system 100 bonds substrates 121 together. In the example shown in Figure 4, the holding portion 220 and the substrate 121 held by the holding portion 220 are deformed in a way that the center is raised higher than the surrounding area. The holding portion 252 is equipped with a pressing projection 641 in its center. The pressing projection 641 is displaced vertically. First, the pressing projection 641 is displaced vertically downward from the center of the holding portion 252, pressing down on the center of the substrate 121 gripped by the holding portion 252. Subsequently, the substrate 121 held by the holding portion 220 approaches the substrate 121 gripped by the holding portion 252.

[0039] Since the surface of the substrate 121 is activated, when the central parts of the substrates 121 come into contact, the intermolecular forces between the substrates 121 autonomously attract and bond adjacent regions to each other. After parts of the substrates 121 come into contact, the holding part 252 releases its grip on the substrates 121. The bonded region of the substrates 121 expands sequentially from the contacted area to the adjacent regions. This generates a bonding wave (sometimes called a bonding wave) in which the contacted area expands sequentially, and the bonding of the substrates 121 progresses. The bonding wave propagates from the center of the substrate 121 toward the edges in the direction of the arrow. Eventually, the substrates 121 come into contact and bond across their entire surfaces. As a result, the substrates 121 form a laminate 123.

[0040] Figure 5 is a conceptual perspective view of a pair of substrates 121 facing each other and intended for bonding. The dashed line connecting the ends of the two substrates 121 indicates that the two substrates 121 are facing each other and intended for bonding. Each substrate 121 has a disc-shaped form with a portion cut out by a notch 124, and each surface has multiple element regions 126 and alignment marks 128.

[0041] The notch 124 is formed in accordance with the crystal orientation of the substrate 121. Therefore, when handling the substrate 121, the orientation of the substrate 121 can be determined by using the notch 124 as an indicator.

[0042] Multiple element regions 126 are arranged on the surface of the substrate 121. A semiconductor device formed by processing the substrate 121 using photolithography or the like is mounted on each of the element regions 126. Each of the element regions 126 also includes pads and the like that serve as connection terminals when the substrate 121 is bonded to another substrate 121.

[0043] Furthermore, blank areas exist between multiple element regions 126 where no functional elements such as elements or circuits are placed. Scribe lines 122 are placed in the blank areas to be used when dividing the substrate 121 into individual element regions 126.

[0044] Furthermore, alignment marks 128 are placed on the scribe line 122 to serve as indicators for positioning the substrate 121. Since the scribe line 122 disappears as a saw cut during the process of cutting the substrate 121 into a die, the presence of alignment marks 128 does not reduce the effective area of ​​the substrate 121.

[0045] Although the element regions 126 and alignment marks 128 are depicted large in the diagram, the number of element regions 126 formed on a substrate 121 with a diameter of 300 mm can be several hundred or more. In addition, wiring patterns formed on the element regions 126 may be used as alignment marks 128.

[0046] When positioning a pair of substrates 121 to be bonded in the substrate bonding apparatus 170, the substrate bonding apparatus 170 measures the relative positions of the substrates 121 by observing the alignment marks 128 of the opposing substrates 121 using microscopes 231 and 251. Furthermore, the substrate bonding apparatus 170 adjusts the position of each substrate 121 by moving the micro-adjustment stage 230 to eliminate any discrepancies in the measured relative positions.

[0047] Figures 6 to 9 show the holding section 220 and the fine-movement stage 230. In Figures 6 to 12, the substrate 121 is omitted from the illustration for simplicity.

[0048] Figure 6 is a schematic plan view of the holding section 220 and the fine-adjustment stage 230. The circle 647 shown by the dashed line in Figure 6 indicates the outer diameter of the substrate 121 when it is held. Figure 7 is a schematic cross-sectional view of the holding section 220 and the fine-adjustment stage 230, shown as AA in Figure 6. Figure 8 is a schematic cross-sectional view of the holding section 220, shown as BB in Figure 6. Figure 9 is a schematic cross-sectional view of the holding section 220, shown as CC in Figure 6.

[0049] Figures 6 to 9 show the holding section 220 when the actuator 615 is not operating. Note that the reflector 224 is omitted from Figure 7 onwards. Also, the fine adjustment stage 230 is omitted from Figure 8 onwards.

[0050] The fine-adjustment stage 230 includes a reflector 224 and a support portion 601. The holding portion 220 includes a base plate 603, a leaf spring 605, a holding plate 607, an actuator 615, a valve 629, a negative pressure source 633, a holding control portion 631, and a deformation control portion 637. The holding plate 607 has a suction portion 609, a support projection 611, a holding surface 613, a surface 635 opposite the holding surface, a through hole 619, and a through hole 625. In Figure 6, only one of the circles corresponding to the support projection 611 and the through hole 625 is indicated by a reference numeral, but multiple such features are provided on the holding plate 607. Circles with the same shape as the circles indicated by each reference numeral similarly indicate the support projection 611 and the through hole 625. The holding plate 607 is made of, for example, alumina. The actuator 615 has a link mechanism 617 and a shaft 627. The gravity canceling unit 246 supports the push mechanism 621 and also includes a temporary holding control unit 639. The push mechanism 621 has a push-up pin 623.

[0051] As shown in Figures 6 and 7, the fine-adjustment stage 230 has a plurality of support parts 601 directly below the vertical end of the base plate 603. The support parts 601 support the base plate 603. The base plate 603 supports a plurality of actuators 615. The base plate 603 is made of, for example, aluminum. The retaining part 220 has leaf springs 605 on all four sides. Each leaf spring 605 is screwed to the base plate 603 and the retaining plate 607, connecting the base plate 603 and the retaining plate 607.

[0052] As shown in Figure 6, the retaining plate 607 has multiple (two in the example in Figure 8) through holes 619 inside the circles indicated by dashed lines. The gravity canceling section 246 supports a push mechanism 621 below each through hole 619. The push-up pins 623 pass through the micro-movement stage 230 and the base plate 603 so as not to come into contact with them. This suppresses the transmission of heat and vibration from the push-up pins 623 to the micro-movement stage 230. The temporary holding control section 639 controls each push mechanism 621, which moves the push-up pins 623 in and out of the through holes 619 in a vertical direction. The push mechanism 621 is, for example, a ball screw.

[0053] When the holding surface 613 is not holding the substrate 121, the push mechanism 621 extends the push-up pin 623 so that its upper end is higher than the holding surface 613. The second transport robot 134 places the substrate 121 on the push-up pin 623, causing the push-up pin 623 to temporarily hold the substrate 121. When the push mechanism 621 retracts the push-up pin 623, which is temporarily holding the substrate 121, vertically downward from the holding surface 613, the holding surface 613 supports the substrate 121 in place of the push-up pin 623. The push-up pin 623 is also used to retract the substrate 121 that was held by the holding surface 613 by a process that is almost the reverse of the above.

[0054] The retaining plate 607 has a suction section 609 and a plurality of support protrusions 611 inside the circle indicated by the dashed line. The virtual surface defined by the tips of the plurality of support protrusions 611 forms the retaining surface 613. The support protrusions 611 support the substrate 121. The suction section 609 is connected to a negative pressure source 633 through a valve 629. The retaining control unit 631 controls the opening and closing of the valve 629, and when the retaining control unit 631 releases the valve 629, the suction section 609 and the negative pressure source 633 are connected. As the support protrusions 611 support the substrate 121 and the retaining control unit 631 releases the valve 629, the pressure between the retaining plate 607 and the substrate 121 is reduced, and the retaining plate 607 attracts and holds the substrate 121. In addition, the retaining plate 607 and the retaining control unit 631 constitute a vacuum chuck that holds the substrate 121.

[0055] The retaining plate 607 further has through holes 625 inside the circles shown by dashed lines in Figure 6. As shown in Figure 9, the retaining portion 220 is provided with actuators 615 below each of the through holes 625. The through holes 625 and actuators 615 are arranged concentrically with respect to the retaining plate 607.

[0056] The through-hole 619 is not located in the center of the retaining plate 607. Since the substrate 121 is joined by a bonding wave, the through-hole 619 is not located in the center of the retaining plate 607, i.e., not at the ideal starting point of the bonding wave, which suppresses bonding misalignment of the substrate 121.

[0057] Figure 10 is a schematic enlarged view of the portion shown by the dashed line in Figure 9. The actuator 615 is connected to a shaft 627, which extends vertically upward. The end of the shaft 627 not connected to the actuator 615 is screwed to a link mechanism 617. The end of the link mechanism 617 not screwed to the shaft 627 is in contact with the lower surface of the retaining plate 607. The actuator 615 displaces the retaining plate 607 vertically upward via the shaft 627 and the link mechanism 617.

[0058] The through hole 625 has a counterbore, into which a bolt 643 is placed. The bolt 643 placed in the counterbore is embedded in the link mechanism 617, and the bolt 643 fastens the retaining plate 607 to the link mechanism 617. The actuator 615 is connected to the retaining plate 607 via the shaft 627 and the link mechanism 617. As a result, the actuator 615 displaces the retaining plate 607 vertically downward.

[0059] Furthermore, the shaft 627, the link mechanism 617, and the bolt 643 can be said to collectively constitute a connecting member 645. In this case, the connecting member 645 is inserted into each of the multiple through holes 625 and connects to the corresponding actuator 615 among the multiple actuators 615.

[0060] The deformation control unit 637 controls each actuator 615 individually. The deformation control unit 637 controls the actuators 615, and as the shaft 627 is displaced in the direction normal to the holding surface 613 (i.e., the vertical up and down direction in Figures 7 to 10), the actuators 615 deform the holding plate 607 in the direction normal to the holding surface 613. The holding surface 613 has a predetermined uneven shape when the actuators 615 are not operating. In the example shown in Figure 9, the predetermined uneven shape is one in which the center is more convex than the periphery.

[0061] The surface 635 on the retaining plate 607 opposite to the retaining surface 613 is flat when the actuator 615 is not operating. This makes it easier to screw the link mechanism 617 into the corresponding through hole 625 and simplifies the assembly of the retaining section 220.

[0062] Figures 11 and 12 show the holding section 220 in the same CC cross-section as in Figure 9, with the actuator 615 in operation. Elements common to Figures 7 through 10 are given the same reference numerals, and redundant explanations are omitted.

[0063] Figure 11 shows an example in which the retaining surface 613 is deformed to a greater curvature than that shown in Figure 9. In this case, the actuator 615 deforms the retaining plate 607 to be more convex in the vertically upward direction.

[0064] In this case, the deformation control unit 637 controls the actuators 615 so that actuators 615 closer to the center are displaced more vertically upwards. Alternatively, instead of displacing actuators 615 closer to the center more vertically upwards, or in addition, actuators 615 further from the center may be displaced more vertically downwards.

[0065] The retaining plate 607 deforms not only vertically but also in its planar direction. The leaf spring 605 holds the retaining plate 607 in place so that its center position does not shift even when it deforms in its planar direction. Since the bending stiffness of the leaf spring 605 is sufficiently greater than that of the link mechanism 617, the center position of the retaining plate 607 is maintained by the bending of the link mechanism 617 even when the retaining plate 607 deforms in its planar direction. In other words, the link mechanism 617 is movable in the planar direction relative to the retaining plate 607.

[0066] Figure 12 shows an example in which the actuator 615 deforms the holding surface 613 so that it becomes flat. The deformation control unit 637 controls the actuator 615 so that the closer the actuator 615 is to the center, the greater the displacement of the actuator 615 in the vertical downward direction. In other words, the holding surface 613 becomes flat through the operation of multiple actuators 615. Alternatively, instead of displacing actuators 615 closer to the center more vertically downward, or in addition, actuators 615 further from the center more vertically upward may be displaced.

[0067] When the actuator 615 is driven to deform the retaining plate 607, undesirable deformation may occur. For example, since the retaining plate 607 has through holes 619 and 625, stress concentrates in the vicinity of the through holes 619 or 625, making these parts more susceptible to deformation than other parts of the retaining plate 607. Therefore, the greater the amount of deformation of the retaining plate 607, the more unevenly the deformation occurs in the vicinity of the through holes 619 or 625 relative to the entire retaining plate 607.

[0068] In contrast, in this embodiment, the holding surface 613 has a predetermined uneven shape when the actuator 615 is not operating. Therefore, even if the actuator 615 operates and deforms the holding surface, the amount of deformation of the holding plate 607 from the state when the actuator 615 is not operating is reduced. As a result, uneven deformation of the holding plate 607 is suppressed, and the accuracy of bonding the substrate 121 is improved.

[0069] Furthermore, the predetermined uneven shape may be formed at the median value of the unevenness when the holding surface 613 is deformed unevenly by the intended amount. For example, if the state in Figure 11 is when the holding surface 613 is most convex and the state in Figure 12 is when it is most concave, then the predetermined uneven shape is preferably the state in Figure 9, which is the median value between them. In addition, the predetermined uneven shape may be a shape other than one in which the center is more convex than the periphery. For example, it may be asymmetrical with respect to a vertical axis passing through the center of the holding surface 613, or with respect to a certain axis in the in-plane direction of the holding plate 607.

[0070] The base plate 603 may be made of a metal material other than aluminum. The base plate 603 may be made of a ceramic material. The base plate 603 may be made of alumina, SiC (silicon carbide), or low thermal expansion ceramic. The retaining plate 607 may be made of a ceramic material other than alumina. The retaining plate 607 may be made of SiC (silicon carbide) or low thermal expansion ceramic.

[0071] A shape where the center is more convex than the surrounding area means that, macroscopically, the area near the center is raised compared to the surrounding area. For example, this includes shapes where only a part of the surrounding area is raised. Furthermore, microscopically, there may be fine irregularities.

[0072] The surface 635 opposite to the holding surface 613 is considered flat if its vertical width is sufficiently small compared to the size of the surface 635 opposite to the holding surface 613. For example, it may have microscopic irregularities.

[0073] The actuator 615 may deform the retaining plate 607 before it holds the substrate 121. Alternatively, or in addition to this, the actuator 615 may deform the retaining plate 607 after it has held the substrate 121.

[0074] Furthermore, each of the multiple actuators 615 may be controlled individually. This allows the uneven shape of the holding surface 613 to be deformed into any desired shape within the range of motion of the actuators 615.

[0075] Although the invention has been described using embodiments, the technical scope of the present invention is not limited to the scope described in the embodiments above. It will be apparent to those skilled in the art that various modifications or improvements can be made to the embodiments described above. It will be clear from the claims that such modified or improved forms may also be included in the technical scope of the present invention.

[0076] It should be noted that the execution order of operations, procedures, steps, and stages in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not explicitly stated as "before" or "prior to," and can be implemented in any order unless the output of a previous process is used in a later process. Even if the operation flow in the claims, specifications, and drawings is described using phrases such as "first," "next," etc., for convenience, this does not mean that it is essential to perform the operations in that order. [Explanation of Symbols]

[0077] 100 Laminate manufacturing system, 106 Housing, 110 Control device, 112 Positioning control unit, 120 Substrate case, 121 Substrate, 123 Laminate, 132 First transport robot, 134 Second transport robot, 161 Substrate buffer, 163 Substrate position adjustment unit, 165 Activation device, 167 Cleaning device, 170 Substrate bonding device, 222 Interferometer, 212 Wall material, 210 Frame, 220 Holding unit, 224 Reflecting mirror, 230 Fine adjustment stage, 231 Microscope, 240 Moving stage unit, 242 Moving base plate, 244 Coarse adjustment stage, 246 Gravity cancellation unit, 248 Spherical seat, 250 Fixed stage unit, 251 Microscope, 252 Holding unit, 601 Support unit, 603 Base plate, 605 Leaf spring, 607 Holding plate, 609 Suction part, 611 Support projection, 613 Holding surface, 619 Through hole, 615 Actuator, 617 Link mechanism, 621 Push mechanism, 623 Push-up pin, 625 Through hole, 627 Shaft, 629 Valve, 631 Holding control unit, 633 Negative pressure source, 635 Opposite side of the holding surface, 637 Deformation control unit, 639 Temporary holding control unit, 641 Pressing projection, 643 Bolt, 645 Connecting member, 647 Circle indicated by dashed line

Claims

1. A retaining plate having a retaining surface for holding a substrate, A plurality of actuators connected to the retaining plate, which deform the retaining plate at least in the direction normal to the retaining surface, A base plate supporting the plurality of actuators and Equipped with, The holding surface is a substrate holding device having a predetermined uneven shape when the plurality of actuators are not operating.

2. The substrate holding device according to claim 1, wherein the predetermined uneven shape is such that the center is more convex than the surrounding area.

3. The substrate holding device according to claim 1, wherein the surface of the holding plate opposite to the holding surface is flat when the plurality of actuators are not operating.

4. The substrate holding device according to claim 3, wherein the holding surface becomes flat when the plurality of actuators operate.

5. The substrate holding device according to claim 1, wherein the plurality of actuators are arranged concentrically with respect to the holding plate.

6. The substrate holding device according to claim 1, further comprising a leaf spring connecting the base plate and the holding plate.

7. The retaining plate has a plurality of through holes, The substrate holding device according to claim 1, further comprising a coupling member inserted into each of the plurality of through holes and coupled to a corresponding actuator among the plurality of actuators.

8. The substrate holding device according to claim 7, wherein the connecting member is movable in the planar direction relative to the holding plate and has a link mechanism that transmits the displacement of the actuator in the normal direction.

9. The retaining plate has through holes, The substrate holding device according to claim 1, further comprising a push-up pin that is inserted into and removed from the through hole and temporarily holds the substrate.

10. A substrate holding device according to any one of claims 1 to 9, A substrate holding part that holds other substrates and Equipped with, A substrate bonding device that bonds the substrate to the other substrate by moving at least one of the substrate holding device and the substrate holding part toward the other.

11. The substrate bonding apparatus according to claim 10, wherein the substrate holding device is movable in the planar direction of the substrate.

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