Substrate holding device and substrate bonding device
Patent Information
- Application Number
- JP2025062532
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-04-04
- Publication Date
- 2026-10-16
Smart Images
Figure 2026168951000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a substrate holding apparatus and a substrate bonding apparatus.
Background Art
[0002] Patent Document 1 describes that "when positioning a pair of substrates 121 to be bonded at the positioning unit 170, the alignment marks 128 of the opposing substrates 121 are observed by the microscopes 231 and 251 to measure the relative positions of the substrates 121. Further, by moving the fine movement stage 230 to eliminate the measured relative position deviation, the substrates 121 can be aligned." (Paragraph 0055). [Prior Art Documents] [Patent Documents] [Patent Document 1] Japanese Unexamined Patent Publication No. 2013-8804
Summary of the Invention
[0003] In a first aspect, there is provided a substrate holding apparatus comprising: a holding plate that holds a substrate on a holding surface; a plurality of actuators connected to the holding plate and configured to deform the holding plate at least in a normal direction of the holding surface; a base plate that supports the plurality of actuators; a table main body that supports the base plate; and a mechanism disposed between the table main body and the base plate, the mechanism deforming in response to reaction forces of the plurality of actuators generated in the base plate.
[0004] In the above substrate holding apparatus, the mechanism may include a fixed support portion that fixedly supports the base plate and the table main body, and a damper disposed between the base plate and the table main body. The fixed support portion may be disposed in a region overlapping the center of the base plate, and a plurality of the dampers may be disposed in a region overlapping the edge of the base plate.
[0005] In the above substrate holding apparatus, the mechanism may include a hinge that suppresses deformation of the table main body relative to deformation of the base plate. The hinge may deform in response to at least one of tilting of the base plate and radial movement of the base plate.
[0006] The above-described substrate holding device may further include a leaf spring that connects the base plate and the holding plate.
[0007] In the above-described substrate holding device, each of the multiple actuators may be movable in the planar direction relative to the holding plate and may have a link mechanism that transmits the displacement of the actuator in the normal direction.
[0008] The above-described substrate holding device may further include an indicator placed on the table body for detecting the position of the table body.
[0009] In a second embodiment, a substrate bonding apparatus is provided. The substrate bonding apparatus includes a substrate holding part for holding another substrate. Either of the substrate bonding apparatuses bonds the substrate and the other substrate by moving at least one of the substrate holding part and the substrate holding part toward the other.
[0010] In any of the above-described substrate bonding apparatuses, the substrate holding device may be movable in the planar direction of the substrate.
[0011] The above summary of the invention does not enumerate all of its features. Subcombinations of these features may also constitute an invention. [Brief explanation of the drawing]
[0012] [Figure 1] A schematic plan view of the laminate manufacturing system 100 is shown. [Figure 2] A schematic longitudinal cross-sectional view of the substrate bonding apparatus 170 is shown. [Figure 3] A schematic cross-sectional view of the substrate bonding apparatus 170 is shown. [Figure 4] This shows an example of how the laminate manufacturing system 100 bonds the substrates 121. [Figure 5] A conceptual perspective view is shown of a pair of substrates 121 facing each other and intended for bonding. [Figure 6] A schematic plan view of the holding section 220 and the fine-movement stage 230 is shown. [Figure 7] A schematic AA cross-sectional view of the holding section 220 and the fine-movement stage 230 is shown. [Figure 8] A schematic cross-sectional view of the retaining portion 220 is shown. [Figure 9] A schematic cross-sectional view of the retaining portion 220 is shown. [Figure 10] Figure 9 shows a schematic enlargement of the area indicated by the dashed line. [Figure 11] A schematic cross-sectional view of the retaining portion 220 is shown. [Figure 12] A schematic diagram of the hinge 650 used as a support is shown. [Figure 13] A schematic diagram shows the fixed support part 670 and the damper 672 used as support parts. [Modes for carrying out the invention]
[0013] The following embodiments are not intended to limit the invention as claimed. Not all combinations of features described in the embodiments are necessarily essential to the solution of the invention.
[0014] Figure 1 is a configuration diagram showing the laminate manufacturing system 100 according to this embodiment. The laminate manufacturing system 100 comprises a housing 106, a substrate case 120, a first transport robot 132, a substrate buffer 161, a substrate position adjustment unit 163, a second transport robot 134, an activation device 165, a cleaning device 167, a substrate bonding device 170, and a control device 110. The laminate manufacturing system 100 manufactures a laminate 123 formed by stacking a plurality of substrates 121. The substrates 121 are, for example, circular silicon substrates on which circuit patterns, alignment marks, electrodes, etc., are formed. The laminate manufacturing system 100 can also laminate unprocessed substrates, compound semiconductor substrates, printed circuit boards, glass substrates, etc. It can also laminate substrates with circuit patterns formed on them and unprocessed substrates, or laminate substrates of the same type, such as substrates with circuit patterns formed on them and unprocessed substrates. The substrate 121 to be stacked may itself be a substrate already formed by stacking multiple substrates. Furthermore, the substrate 121 to be stacked is not limited to a circular substrate, but may also be a rectangular substrate.
[0015] The substrate case 120 is a case capable of housing the substrate 121, and houses the substrate 121 on which circuit patterns, etc., are formed. The first transport robot 132 removes the substrate 121 from the substrate case 120 and transports the substrate 121 to the substrate buffer 161 or the substrate position adjustment unit 163. The substrate buffer 161 temporarily stores the substrate 121. The substrate position adjustment unit 163 pre-aligns the substrate 121 before it is transported to various devices such as the activation device 165, the cleaning device 167, and the substrate bonding device 170. The second transport robot 134 transports the substrate 121 between the substrate buffer 161, the substrate position adjustment unit 163, the activation device 165, the cleaning device 167, and the substrate bonding device 170.
[0016] The activation device 165 activates the surface of the substrate 121. Specifically, the surface of the substrate 121 is activated by plasma treatment. The cleaning device 167 cleans the substrate 121 that has undergone activation treatment by the activation device 165. The substrate 121 cleaned by the cleaning device 167 is conveyed to the substrate bonding device 170. The substrate bonding device 170 laminates (bonds) the two substrates 121.
[0017] The control device 110 has an arithmetic processing circuit such as a CPU, and memories such as a ROM and a RAM, and executes a predetermined program to realize its functions. The control device 110 is, for example, a computer, and comprehensively controls each part of the laminate manufacturing system 100. The control device 110 controls the driving of the first transfer robot 132, the second transfer robot 134, the substrate position adjustment unit 163, the activation device 165, the cleaning device 167, and the substrate bonding device 170.
[0018] The laminate manufacturing system 100 includes the substrate bonding device 170 disposed inside the housing 106. The laminate manufacturing system 100 bonds a plurality of substrates 121 to manufacture the laminate 123.
[0019] The laminate 123 manufactured in the laminate manufacturing system 100 is accommodated in another substrate case 120 and unloaded from the laminate manufacturing system 100. In this manner, by using the substrate case 120, a plurality of substrates 121 can be collectively loaded into the laminate manufacturing system 100, and a plurality of laminates 123 can be collectively unloaded from the laminate manufacturing system 100.
[0020] The first transfer robot 132 disposed facing the substrate case 120 unloads the substrates 121 to be bonded from the substrate case 120. In addition, the first transfer robot 132 carries the manufactured laminate 123 into the substrate case 120. In this way, the first transfer robot 132 directly transfers the substrates 121 or the laminate 123.
[0021] The substrate bonding apparatus 170 comprises a fixed stage section 250 and a movable stage section 240 arranged inside a frame 210. The fixed stage section 250 is fixed to the frame 210. The movable stage section 240 includes a fine-movement stage 230 that moves relative to the fixed stage section 250. The holding section 220 is positioned on the fine-movement stage 230. With the holding section 220 gripping the substrate 121, the movable stage section 240 moves relative to the fixed stage section 250.
[0022] The outer surface of the frame 210 is closed by the wall material 212, preventing radiant heat from the surroundings from influencing the substrate bonding device 170. The micro-movement stage 230 is equipped with a reflector 224. An interferometer 222 is placed inside the wall material 212. The interferometer 222 uses the reflector 224 to measure the position of the micro-movement stage 230 with high precision. This allows the substrate 121 held by the holding unit 220 to be positioned with high precision relative to the substrate 121 held by the holding unit 252 of the fixed stage unit 250. In addition, the reflector 224 can be said to be an indicator for detecting the position of the micro-movement stage 230.
[0023] After positioning, the micro-movement stage 230 moves toward the fixed stage section 250, and the laminate manufacturing system 100 bonds the substrates 121 together to form a laminate 123. The laminate 123 is then handed over to the second transport robots 134 and 132 and collected in the substrate case 120.
[0024] Furthermore, the control device 110 includes an operating unit that the user can operate externally to power on the laminate manufacturing system 100, input various settings and information, and a display unit that conveys information to the user. In addition, the control device 110 may also include a connection unit that connects to other additionally deployed equipment.
[0025] Figure 2 is a schematic longitudinal cross-sectional view of the substrate bonding apparatus 170. The fixed stage section 250 is suspended downward from the ceiling surface of the frame 210 via a plurality of load cells 254. The fixed stage section 250 includes a holding section 252. The holding section 252 may be a vacuum chuck. The holding section 252 holds the substrate 121 vertically downward. The load cells 254 detect the vertically downward force acting on the fixed stage section 250.
[0026] A microscope 251 is positioned vertically downwards on the ceiling surface of the frame 210, to the side of the fixed stage section 250. The microscope 251 observes the surface of the substrate 121 held by the holding section 220. Since the microscope 251 is fixed to the frame 210, the relative position of the microscope 251 and the fixed stage section 250 does not change.
[0027] The movable stage section 240 comprises a movable base plate 242, a coarse adjustment stage 244, a gravity canceling unit 246, a spherical seat 248, and a fine adjustment stage 230. The movable base plate 242, carrying the coarse adjustment stage 244, the gravity canceling unit 246, and the fine adjustment stage 230, moves along a guide rail 241 fixed to the inner bottom surface of the frame 210. As the movable base plate 242 moves, the movable stage section 240 moves between a position directly below the fixed stage section 250 and a position away from directly below the fixed stage section 250.
[0028] The coarse adjustment stage 244 moves relative to the moving platen 242 in a horizontal direction including the X and Y components indicated by the arrows in the figure. When moving relative to the moving platen 242, the fine adjustment stage 230 also moves along with the coarse adjustment stage 244.
[0029] The gravity canceling unit 246 expands and contracts while detecting minute displacements of the micro-movement stage 230, thereby reducing the apparent weight of the micro-movement stage 230. This reduces the load on the actuator that displaces the micro-movement stage 230, improving the accuracy of position control.
[0030] A holding unit 220 is positioned on the fine-adjustment stage 230. The holding unit 220 holds the substrate 121 to be bonded. During the positioning operation of the substrate 121, the fine-adjustment stage 230 moves in accordance with the movement of the movable platen 242 and the coarse-adjustment stage 244, which is mounted on the movable platen 242. In the next stage, the fine-adjustment stage 230 is displaced relative to the coarse-adjustment stage 244. The displacement of the fine-adjustment stage 230 relative to the coarse-adjustment stage 244 includes translation and rotation in all X, Y, and Z axes. The amount of displacement of the fine-adjustment stage 230 is sufficiently small that even when the fine-adjustment stage 230 is displaced, it does not come into contact with the push-up pin 623, which will be described later. In addition, with the above configuration, the movable stage unit 240 is movable at least in the planar direction of the substrate 121. The positioning control unit 112 controls the displacement of the movable platen 242, the coarse-adjustment stage 244, and the fine-adjustment stage 230.
[0031] Furthermore, the micro-movement stage 230 has a microscope 231 fixed to its side. Since the microscope 231 is fixed to the micro-movement stage 230, the relative positions of the micro-movement stage 230 and the microscope 231 do not change. The microscope 231 observes the surface of the substrate 121 held by the fixed stage section 250. The substrate bonding apparatus 170 uses the observation results from the microscope 231 and the microscope 251 to measure the relative positions of the substrates 121.
[0032] Figure 3 is a schematic cross-sectional view of the substrate bonding apparatus 170. Elements common to both Figure 2 and Figure 3 are given the same reference numerals, and redundant explanations are omitted.
[0033] The movable base plate 242 and the holding unit 220 mounted on the movable base plate 242 move along the guide rail 241.
[0034] The movable platen 242 moves along the guide rail 241, bringing the substrate 121 gripped by the holding part 252 and the substrate 121 gripped by the holding part 220 to face each other. After positioning the pair of held substrates 121, the fine-movement stage 230 is raised, bringing the pair of substrates 121 closer together.
[0035] Figure 4 shows an example of how the laminate manufacturing system 100 bonds substrates 121 together. In the example shown in Figure 4, the holding portion 220 and the substrate 121 held by the holding portion 220 are deformed in a way that the center is raised higher than the surrounding area. The holding portion 252 is equipped with a pressing projection 641 in its center. The pressing projection 641 is displaced vertically. First, the pressing projection 641 is displaced vertically downward from the center of the holding portion 252, pressing down on the center of the substrate 121 gripped by the holding portion 252. Subsequently, the substrate 121 held by the holding portion 220 approaches the substrate 121 gripped by the holding portion 252.
[0036] Since the surface of the substrate 121 is activated, when the central parts of the substrates 121 come into contact, the intermolecular forces between the substrates 121 autonomously attract and bond adjacent regions to each other. After parts of the substrates 121 come into contact, the holding part 252 releases its grip on the substrates 121. The bonded region of the substrates 121 expands sequentially from the contacted area to the adjacent regions. This generates a bonding wave (sometimes called a bonding wave) in which the contacted area expands sequentially, and the bonding of the substrates 121 progresses. The bonding wave propagates from the center of the substrate 121 toward the edges in the direction of the arrow. Eventually, the substrates 121 come into contact and bond across their entire surfaces. As a result, the substrates 121 form a laminate 123.
[0037] Figure 5 is a conceptual perspective view of a pair of substrates 121 facing each other and intended for bonding. The dashed line connecting the ends of the two substrates 121 indicates that the two substrates 121 are facing each other and intended for bonding. Each substrate 121 has a disc-shaped form with a portion cut out by a notch 124, and each surface has multiple element regions 126 and alignment marks 128.
[0038] The notch 124 is formed in accordance with the crystal orientation of the substrate 121. Therefore, when handling the substrate 121, the orientation of the substrate 121 can be determined by using the notch 124 as an indicator.
[0039] Multiple element regions 126 are arranged on the surface of the substrate 121. A semiconductor device formed by processing the substrate 121 using photolithography or the like is mounted on each of the element regions 126. Each of the element regions 126 also includes pads and the like that serve as connection terminals when the substrate 121 is bonded to another substrate 121.
[0040] Furthermore, blank areas exist between multiple element regions 126 where no functional elements such as elements or circuits are placed. Scribe lines 122 are placed in the blank areas to be used when dividing the substrate 121 into individual element regions 126.
[0041] Furthermore, alignment marks 128 are placed on the scribe line 122 to serve as indicators for positioning the substrate 121. Since the scribe line 122 disappears as a saw cut during the process of cutting the substrate 121 into a die, the presence of alignment marks 128 does not reduce the effective area of the substrate 121.
[0042] Although the element regions 126 and alignment marks 128 are depicted large in the diagram, the number of element regions 126 formed on a substrate 121 with a diameter of 300 mm can be several hundred or more. In addition, wiring patterns formed on the element regions 126 may be used as alignment marks 128.
[0043] When positioning a pair of substrates 121 to be bonded in the substrate bonding apparatus 170, the substrate bonding apparatus 170 measures the relative positions of the substrates 121 by observing the alignment marks 128 of the opposing substrates 121 using microscopes 231 and 251. Furthermore, the substrate bonding apparatus 170 adjusts the position of each substrate 121 by moving the micro-adjustment stage 230 to eliminate any discrepancies in the measured relative positions.
[0044] Figures 6 to 9 show the holding section 220 and the fine-movement stage 230. In Figures 6 to 12, the substrate 121 is omitted from the illustration for simplicity.
[0045] Figure 6 is a schematic plan view of the holding section 220 and the fine-adjustment stage 230. The circle 647 shown by the dashed line in Figure 6 indicates the outer diameter of the substrate 121 when it is held. Figure 7 is a schematic cross-sectional view of the holding section 220 and the fine-adjustment stage 230, shown as AA in Figure 6. Figure 8 is a schematic cross-sectional view of the holding section 220, shown as BB in Figure 6. Figure 9 is a schematic cross-sectional view of the holding section 220, shown as CC in Figure 6.
[0046] Figures 6 to 9 show the holding unit 220 when the actuator 615 is not operating. Note that the reflector 224 and the fine-adjustment stage 230 are omitted in Figures 7 and 8.
[0047] The fine-adjustment stage 230 includes a reflector 224 and a support portion 601. The holding portion 220 includes a base plate 603, a leaf spring 605, a holding plate 607, an actuator 615, a valve 629, a negative pressure source 633, a holding control portion 631, and a deformation control portion 637. The holding plate 607 has a suction portion 609, a support projection 611, a holding surface 613, a surface 635 opposite the holding surface, a through hole 619, and a through hole 625. In Figure 6, only one of the circles corresponding to the support projection 611 and the through hole 625 is indicated by a reference numeral, but multiple such features are provided on the holding plate 607. Circles with the same shape as the circles indicated by each reference numeral similarly indicate the support projection 611 and the through hole 625. The holding plate 607 is made of, for example, alumina. The actuator 615 has a link mechanism 617 and a shaft 627. The gravity canceling unit 246 supports the push mechanism 621 and also includes a temporary holding control unit 639. The push mechanism 621 has a push-up pin 623.
[0048] As shown in Figures 6 and 9, the fine-adjustment stage 230 has a plurality of support parts 601 directly below the vertical end of the base plate 603. The support parts 601 support the base plate 603. The base plate 603 supports a plurality of actuators 615. The base plate 603 is made of, for example, aluminum. The retaining part 220 has leaf springs 605 on all four sides. Each leaf spring 605 is screwed to the base plate 603 and the retaining plate 607, connecting the base plate 603 and the retaining plate 607.
[0049] As shown in Figure 6, the retaining plate 607 has multiple (two in the example in Figure 8) through holes 619 inside the circles indicated by dashed lines. The gravity canceling section 246 supports a push mechanism 621 below each through hole 619. The push-up pins 623 pass through the micro-movement stage 230 and the base plate 603 so as not to come into contact with them. This suppresses the transmission of heat and vibration from the push-up pins 623 to the micro-movement stage 230. The temporary holding control section 639 controls each push mechanism 621, which moves the push-up pins 623 in and out of the through holes 619 in a vertical direction. The push mechanism 621 is, for example, a ball screw.
[0050] When the holding surface 613 is not holding the substrate 121, the push mechanism 621 extends the push-up pin 623 so that its upper end is higher than the holding surface 613. The second transport robot 134 places the substrate 121 on the push-up pin 623, causing the push-up pin 623 to temporarily hold the substrate 121. When the push mechanism 621 retracts the push-up pin 623, which is temporarily holding the substrate 121, vertically downward from the holding surface 613, the holding surface 613 supports the substrate 121 in place of the push-up pin 623. The push-up pin 623 is also used to retract the substrate 121 that was held by the holding surface 613 by a process that is almost the reverse of the above.
[0051] The retaining plate 607 has a suction section 609 and a plurality of support protrusions 611 inside the circle indicated by the dashed line. The virtual surface defined by the tips of the plurality of support protrusions 611 forms the retaining surface 613. The support protrusions 611 support the substrate 121. The suction section 609 is connected to a negative pressure source 633 through a valve 629. The retaining control unit 631 controls the opening and closing of the valve 629, and when the retaining control unit 631 releases the valve 629, the suction section 609 and the negative pressure source 633 are connected. As the support protrusions 611 support the substrate 121 and the retaining control unit 631 releases the valve 629, the pressure between the retaining plate 607 and the substrate 121 is reduced, and the retaining plate 607 attracts and holds the substrate 121. In addition, the retaining plate 607 and the retaining control unit 631 constitute a vacuum chuck that holds the substrate 121.
[0052] The retaining plate 607 further has through holes 625 inside the circles shown by dashed lines in Figure 6. As shown in Figure 9, the retaining portion 220 is provided with actuators 615 below each of the through holes 625. The through holes 625 and actuators 615 are arranged concentrically with respect to the retaining plate 607.
[0053] The through-hole 619 is not located in the center of the retaining plate 607. Since the substrate 121 is joined by a bonding wave, the through-hole 619 is not located in the center of the retaining plate 607, i.e., not at the ideal starting point of the bonding wave, which suppresses bonding misalignment of the substrate 121.
[0054] Figure 10 is a schematic enlarged view of the portion shown by the dashed line in Figure 9. The actuator 615 is connected to a shaft 627, which extends vertically upward. The end of the shaft 627 not connected to the actuator 615 is screwed to a link mechanism 617. The end of the link mechanism 617 not screwed to the shaft 627 is in contact with the lower surface of the retaining plate 607. The actuator 615 displaces the retaining plate 607 vertically upward via the shaft 627 and the link mechanism 617.
[0055] The through hole 625 has a counterbore, into which a bolt 643 is placed. The bolt 643 placed in the counterbore is embedded in the link mechanism 617, and the bolt 643 fastens the retaining plate 607 to the link mechanism 617. The actuator 615 is connected to the retaining plate 607 via the shaft 627 and the link mechanism 617. As a result, the actuator 615 displaces the retaining plate 607 vertically downward.
[0056] Furthermore, the shaft 627, the link mechanism 617, and the bolt 643 can be said to collectively constitute a connecting member 645. In this case, the connecting member 645 is inserted into each of the multiple through holes 625 and connects to the corresponding actuator 615 among the multiple actuators 615.
[0057] The deformation control unit 637 controls each actuator 615 individually. The deformation control unit 637 controls the actuators 615, and as the shaft 627 is displaced in the direction normal to the holding surface 613 (i.e., the vertical up and down direction in Figures 7 to 10), the actuators 615 deform the holding plate 607 in the direction normal to the holding surface 613. The holding surface 613 has a predetermined uneven shape when the actuators 615 are not operating. In the example shown in Figure 9, the predetermined uneven shape is more convex at the periphery than at the center.
[0058] The surface 635 on the retaining plate 607 opposite to the retaining surface 613 is flat when the actuator 615 is not operating. This makes it easier to screw the link mechanism 617 into the corresponding through hole 625 and simplifies the assembly of the retaining section 220.
[0059] Figure 11 shows the holding portion 220 in the CC cross-section with the actuator 615 in operation. Elements common to Figures 7 through 10 are given the same reference numerals, and redundant explanations are omitted. Figure 11 shows an example in which the holding surface 613 is deformed to a greater curvature than in Figure 9. In this case, the actuator 615 deforms the holding plate 607 to be more convex in the vertically upward direction.
[0060] When the actuator 615 operates and exerts a force that deforms the retaining plate 607, a reaction force acts on the base plate 603. For example, in the example shown in Figure 11, the actuator 615 pushes up the center of the retaining plate 607, so a reaction force acts on the base plate 603 that pushes down the center.
[0061] When the base plate 603 deforms due to this reaction force, this deformation may further deform the micro-movement stage 230 via the support portion 601. For example, in the example shown in Figure 11, the reaction force causes the center of the base plate 603 to dent, that is, the periphery to lift relatively. If the support portion 601 is a rigid, solid block, the deformation of the base plate 603 acts via the support portion 601, causing a force that relatively lifts the periphery of the micro-movement stage 230. In such a case, the support portion 601 is subjected to a vertical upward force and a horizontal force pulling it towards the center of the base plate 603.
[0062] If the micro-movement stage 230 deforms, the reflector 224 mounted on the micro-movement stage 230 will tilt. When the reflector 224 tilts, the position where the light from the interferometer 222 strikes the reflector 224 changes from when it is upright, which may cause the interferometer 222 to misdetect the position of the micro-movement stage 230. Furthermore, the deformation of the micro-movement stage 230 may also cause misdetection if the reflector 224 is displaced in the direction of movement of the micro-movement stage 230, for example, in the horizontal direction.
[0063] Therefore, in this embodiment, a mechanism is provided between the micro-movement stage 230 and the base plate 603 that deforms in response to the reaction force of the actuator 615 generated on the base plate 603. This deformation of the mechanism prevents deformation of the micro-movement stage 230.
[0064] Figure 12 schematically shows a hinge 650 used as a support portion 601. The hinge 650 is positioned between the base plate 603 and the fine adjustment stage 230 at four locations indicated as support portions 601 by the dashed lines in Figure 6. In the example shown in Figure 6, the hinge 650 is provided in a location corresponding to where the leaf spring 605 is provided, but it may be provided in other locations.
[0065] The hinge 650 has a plate-shaped hinge portion 652 and a cylindrical tilt hinge portion 660 positioned on top of the hinge portion 652. The hinge portion 652 is screwed to the fine-adjustment stage 230. The tilt hinge portion 660 is screwed to the base plate 603.
[0066] The hinge portion 652 has four grooves on its upper surface around the tilt hinge portion 660. Although only grooves 654, 655, and 656 are shown in Figure 12, there is another groove hidden by the tilt hinge portion 660. Specifically, there is another groove opposite groove 654, such that grooves 655 and 656 face each other on either side of the tilt hinge portion 660. The four grooves, including grooves 654, 655, and 656, extend in a direction perpendicular to the radial direction of the substrate 121 or retaining plate 607. Each of the four grooves, including grooves 654, 655, and 656, has the shape of ''" (square brackets). The tilt hinge portion 660 can move horizontally, and especially radially, of the substrate 121 or retaining plate 607, through the four grooves, including grooves 654, 655, and 656. Therefore, the hinge 650 deforms in accordance with the radial movement of the base plate 603 relative to the fine-adjustment stage 230. This prevents the fine-adjustment stage 230 from deforming, even when the base plate 603 deforms radially due to the reaction force of the actuator 615, by also deforming the hinge 650 in accordance with that deformation. Note that the number and shape of grooves in the hinge portion 652 are examples only and are not limited to these.
[0067] The tilt hinge portion 660 has four grooves on its side. Although only grooves 662, 663, and 664 are shown in Figure 12, there is another groove on the back side of the tilt hinge portion 660. Grooves 662 and 663 allow the tilt hinge portion 660 to deform in a rotational direction around the radial direction of the substrate 121. In addition, groove 664 and the other groove (not shown) allow the tilt hinge portion 660 to deform in a rotational direction around a direction perpendicular to the radial direction of the substrate 121. As a result, even when the base plate 603 tilts relative to the surface direction of the substrate 121 due to the reaction force of the actuator 615, the tilt hinge portion 660 also deforms in accordance with the tilt, preventing deformation of the fine-movement stage 230. Note that the number of grooves on the tilt hinge portion 660 is just an example and is not limited to four.
[0068] As described above, the hinge 650 functions as a mechanism that deforms in response to the reaction force of the actuator 615 generated on the base plate 603. Furthermore, the hinge 650 can be said to suppress the deformation of the micro-movement stage 230 in response to the deformation of the base plate 603. This can also be said to prevent the reaction force of the actuator 615 from being transmitted to the micro-movement stage 230.
[0069] Figure 13 shows a configuration to prevent deformation of the fine-adjustment stage 230, replacing the hinge 650 which is the support part 601 in Figure 12. Figure 13 schematically shows the fixed support part 670 and damper 672 used as support parts. The fixed support part 670 is positioned at a location corresponding to the center of the retaining plate 607. In other words, the fixed support part 670 is positioned in a region that overlaps with the center of the base plate 603. The fixed support part 670 is, for example, a solid block-shaped member with high rigidity, and is screwed to the base plate 603 and the fine-adjustment stage 230 respectively to fix and support them.
[0070] The dampers 672 are positioned between the base plate 603 and the fine-adjustment stage 230 at four locations, indicated as support sections 601 in Figure 6, and connect them. In the example shown in Figure 6, the dampers 672 are provided in the locations where the leaf springs 605 are installed. In addition, it can be said that multiple dampers 672 are provided in the area overlapping with the edge of the base plate 603. The dampers 672 may be provided at other locations, and the number of dampers 672 is not limited to four.
[0071] In Figure 13, the base plate 603 is fixed and supported at essentially one point by the fixed support part 670. Therefore, even if the base plate 603 deforms, that deformation is less likely to be transmitted to the micro-movement stage 230.
[0072] Furthermore, the damper 672 also supports the base plate 603 relative to the micro-movement stage 230. Here, the damper 672 absorbs the deformation of the base plate 603. Therefore, the damper 672 functions as a mechanism that deforms in response to the reaction force of the actuator 615 generated on the base plate 603. In addition, it can be said that the damper 672 and the fixed support part 670 suppress the deformation of the micro-movement stage 230 in response to the deformation of the base plate 603. This can also be said to prevent the reaction force of the actuator 615 from being transmitted to the micro-movement stage 230.
[0073] The base plate 603 may be made of a metal material other than aluminum. The base plate 603 may be made of a ceramic material. The base plate 603 may be made of alumina, SiC (silicon carbide), or low thermal expansion ceramic. The retaining plate 607 may be made of a ceramic material other than alumina. The retaining plate 607 may be made of SiC (silicon carbide) or low thermal expansion ceramic.
[0074] In addition to the configuration shown in Figure 12 or Figure 13, deformation of the micro-movement stage 230 may be suppressed by increasing the rigidity of at least one of the base plate 603 and the micro-movement stage 230. Methods for increasing rigidity include increasing the thickness and using a highly rigid material.
[0075] Furthermore, in addition to the configuration shown in Figure 12 or Figure 13, the detection result of the interferometer 222 may be corrected based on the amount of deformation of the micro-movement stage 230 due to the reaction force of the actuator 615. In this case, the extent to which the reflector 224 deforms when the actuator 615 is driven can be determined through analysis and actual machine measurement, and the position of the micro-movement stage 230 may be corrected according to the amount of drive of the actuator 615.
[0076] Although the invention has been described using embodiments, the technical scope of the present invention is not limited to the scope described in the embodiments above. It will be apparent to those skilled in the art that various modifications or improvements can be made to the embodiments described above. It will be clear from the claims that such modified or improved forms may also be included in the technical scope of the present invention.
[0077] It should be noted that the execution order of operations, procedures, steps, and stages in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not explicitly stated as "before" or "prior to," and can be implemented in any order unless the output of a previous process is used in a later process. Even if the operation flow in the claims, specifications, and drawings is described using phrases such as "first," "next," etc., for convenience, this does not mean that it is essential to perform the operations in that order. [Explanation of Symbols]
[0078] 100 Laminate manufacturing system, 106 Housing, 110 Control device, 112 Positioning control unit, 120 Substrate case, 121 Substrate, 123 Laminate, 132 First transport robot, 134 Second transport robot, 161 Substrate buffer, 163 Substrate position adjustment unit, 165 Activation device, 167 Cleaning device, 170 Substrate bonding device, 222 Interferometer, 212 Wall material, 210 Frame, 220 Holding unit, 224 Reflecting mirror, 230 Fine adjustment stage, 231 Microscope, 240 Moving stage unit, 242 Moving base plate, 244 Coarse adjustment stage, 246 Gravity cancellation unit, 248 Spherical seat, 250 Fixed stage unit, 251 Microscope, 252 Holding unit, 601 Support unit, 603 Base plate, 605 Leaf spring, 607 609 Retaining plate, 611 Suction part, 613 Support projection, 613 Retaining surface, 619 Through hole, 615 Actuator, 617 Link mechanism, 621 Push mechanism, 623 Push-up pin, 625 Through hole, 627 Shaft, 629 Valve, 631 Retaining control unit, 633 Negative pressure source, 635 Surface, 637 Deformation control unit, 639 Temporary retaining control unit, 641 Pressing projection, 643 Bolt, 645 Connecting member, 650 Hinge, 652 Hinge part, 654, 655, 656, 662, 663, 664 Groove, 660 Tilt hinge part, 670 Fixed support part, 672 Damper
Claims
1. A retaining plate that holds the substrate on the retaining surface, A plurality of actuators connected to the retaining plate, which deform the retaining plate at least in the direction normal to the retaining surface, A base plate supporting the plurality of actuators, A table body that supports the base plate, A mechanism disposed between the table body and the base plate, which deforms in response to the reaction force of the plurality of actuators generated on the base plate, A substrate holding device equipped with the following features.
2. The aforementioned mechanism is A fixing support portion that fixes and supports the base plate and the table body, A damper is disposed between the base plate and the table body. A substrate holding device according to claim 1, having the following features.
3. The aforementioned fixed support portion is positioned in a region that overlaps with the center of the base plate. Multiple dampers are arranged in a region that overlaps with the edge of the base plate. The substrate holding device according to claim 2.
4. The substrate holding device according to claim 1, wherein the mechanism has a hinge that suppresses deformation of the table body in response to deformation of the base plate.
5. The substrate holding device according to claim 4, wherein the hinge deforms in accordance with at least one of the inclination and radial movement of the base plate.
6. The substrate holding device according to claim 1, further comprising a leaf spring connecting the base plate and the holding plate.
7. The substrate holding device according to claim 1, wherein each of the plurality of actuators is movable in the planar direction relative to the holding plate and has a link mechanism that transmits the displacement of the actuator in the normal direction.
8. The substrate holding device according to any one of claims 1 to 7, further comprising an indicator disposed on the table body for detecting the position of the table body.
9. A substrate holding device according to claim 1, A substrate holding part that holds other substrates and Equipped with, A substrate bonding device that bonds the substrate to the other substrate by moving at least one of the substrate holding device and the substrate holding part toward the other.
10. The substrate bonding apparatus according to claim 9, wherein the substrate holding device is movable in the planar direction of the substrate.