Component recognition device, component mounting device, and component recognition method

Abstract

The present invention provides a component recognition device, a component mounting device, and a component recognition method that can appropriately recognize the position of pins on components having pins with flat tips. [Solution] A part recognition method for recognizing a part having a pin involves capturing an image of the part with light illuminating the part body and the tip of the pin (ST13, ST14), capturing an image of the part with light illuminating the part body but not the tip of the pin (ST15, ST16), and recognizing the tip of the pin from the difference between the acquired first image and the second image (ST19).

Description

Technical Field

[0001] The present disclosure relates to a component recognition apparatus, a component mounting apparatus, and a component recognition method for recognizing a component having pins.

Background Art

[0002] A component mounting apparatus is known that images a component such as a connector having pins protruding downward from the component body from below with a camera, recognizes the positions of the pins, and mounts the component on a substrate. Patent Document 1 discloses a component mounting apparatus that causes a component to enter from above into light emitted horizontally by a light irradiation unit, and performs imaging from below with a camera while the component is moving downward in the light, so as to recognize the tapered end face of the tip of the pin.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in the conventional techniques including Patent Document 1, although the positions of the pins can be recognized by illuminating the tapered surfaces at the tips of the pins with horizontally emitted light, there is a problem that it is difficult to recognize the tips of pins that are flat without a taper or the like at the pin tips.

[0005] Accordingly, the present disclosure aims to provide a component recognition apparatus, a component mounting apparatus, and a component recognition method that can appropriately recognize the positions of pins of a component having pins with flat tips.

Means for Solving the Problems

[0006] The part recognition device of this disclosure is a part recognition device for recognizing a part having a pin, and comprises: a first illumination unit that irradiates light onto the body of the part and the tip of the pin; a second illumination unit that irradiates light onto the body of the part but does not irradiate light onto the tip of the pin; an imaging unit that acquires a first image by imaging the part while the body of the part and the tip of the pin are irradiated with light by the first illumination unit, and acquires a second image by imaging the part while the body of the part is irradiated with light by the second illumination unit; and a pin tip recognition unit that recognizes the tip of the pin from the difference between the first image and the second image acquired by the imaging unit.

[0007] The component mounting apparatus of the present disclosure is a component mounting apparatus for mounting a component having pins onto a substrate, comprising: a first illumination unit that irradiates light onto the body of the component and the tips of the pins; a second illumination unit that irradiates light onto the body of the component but not onto the tips of the pins; an imaging unit that acquires a first image by imaging the component while the body of the component and the tips of the pins are irradiated with light by the first illumination unit, and acquires a second image by imaging the component while the body of the component is irradiated with light by the second illumination unit; a pin tip recognition unit that recognizes the tips of the pins from the difference between the first image and the second image acquired by the imaging unit; a component holding unit that holds the component; and a component moving unit that moves the component held by the component holding unit above the imaging unit.

[0008] The part recognition method of this disclosure is a part recognition method for recognizing a part having a pin, wherein a first image is obtained by imaging the part while light is irradiated onto the body of the part and the tip of the pin, a second image is obtained by imaging the part while light is irradiated onto the body of the part and light is not irradiated onto the tip of the pin, and the tip of the pin is recognized from the difference between the obtained first image and the second image. [Effects of the Invention]

[0009] According to this disclosure, the position of a pin in a component having a pin with a flat tip can be appropriately recognized. [Brief explanation of the drawing]

[0010] [Figure 1] A plan view showing the configuration of the main part of a component mounting device according to one embodiment of the present disclosure. [Figure 2] A diagram illustrating the configuration of a component mounting apparatus according to one embodiment of the present disclosure. [Figure 3] A diagram illustrating the configuration of a component recognition camera included in a component mounting apparatus according to one embodiment of the present disclosure. [Figure 4] (a) a side view and (b) a bottom view of an example of a component having pins that is mounted on a substrate by a component mounting apparatus according to one embodiment of the present disclosure. [Figure 5] (a) An explanatory diagram showing that a component is imaged by an imaging unit while the body and the tip of the pin are illuminated by a coaxial illumination unit of a component mounting apparatus according to one embodiment of the present disclosure. (b) An explanatory diagram showing an example of an image of the component captured by the imaging unit. [Figure 6] (a) An explanatory diagram showing that a component is imaged by an imaging unit while the body and the tip of the pin are illuminated by a reflective illumination unit of a component mounting apparatus according to one embodiment of the present disclosure. (b) An explanatory diagram showing an example of an image of the component captured by the imaging unit. [Figure 7] (a) An explanatory diagram showing that a component is imaged by an imaging unit while the body is illuminated by a body illumination unit of a component mounting apparatus according to one embodiment of the present disclosure. (b) An explanatory diagram showing an example of an image of a component captured by the imaging unit. [Figure 8] A block diagram showing the configuration of a control system for a component mounting device according to one embodiment of the present disclosure. [Figure 9] An explanatory diagram of an example of a first image obtained by a component mounting apparatus according to one embodiment of the present disclosure. [Figure 10] An explanatory diagram of an example of a second image obtained by a component mounting apparatus according to one embodiment of the present disclosure. [Figure 11] An explanatory diagram of an example of a pin tip recognized from the difference between a first image and a second image by a component mounting apparatus according to one embodiment of the present disclosure. [Figure 12]A flowchart of a component mounting method according to one embodiment of the present disclosure. [Figure 13] A flowchart of a component recognition method according to one embodiment of the present disclosure. [Modes for carrying out the invention]

[0011] An embodiment of this disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples for illustrative purposes and can be modified as appropriate according to the specifications of the component mounting device and component recognition device. In the following, corresponding elements are denoted by the same reference numerals in all drawings, and redundant explanations are omitted. In Figure 1 and some parts described later, the X-axis in the substrate transport direction (left-right direction in Figure 1) and the Y-axis in the substrate transport direction (up-down direction in Figure 1) are shown as two mutually orthogonal axes in the horizontal plane. In Figure 1 and some parts described later, the Z-axis (up-down direction in Figure 2) is shown as the height direction perpendicular to the horizontal plane.

[0012] First, the configuration of the component mounting apparatus 1 will be explained with reference to Figures 1 and 2. The component mounting apparatus 1 has the function of performing component mounting work to manufacture a mounted substrate by mounting components supplied to the component supply unit by the mounting head onto the substrate. A substrate transport mechanism 3 is positioned along the X-axis in the center of the base 2. The substrate transport mechanism 3 transports the substrate B, which has been transported from upstream, to the mounting work position, positions it, and holds it. The substrate transport mechanism 3 also transports the substrate B, after the component mounting work is completed, downstream.

[0013] Component supply units 4 are provided on both sides (front and rear directions along the Y-axis) of the substrate transport mechanism 3. Each component supply unit 4 is fitted with a trolley 6 on which multiple tape feeders 5 are arranged along the X-axis. The trolley 6 holds a reel 8 that stores a carrier tape 7, which has pockets for holding components, in a wound state. The tape feeders 5 feed the carrier tape 7 pulled out from the reel 8 in a pitch direction from the outside of the component supply unit 4 toward the substrate transport mechanism 3 (tape feeding direction), thereby supplying components to the component removal positions where components are removed by the mounting head 14, which will be described below.

[0014] In FIG. 1, the front component supply unit 4 is equipped with a tray feeder 11 that supplies a pallet 10 holding trays 9 containing components such as large-sized components, connectors, and communication modules to a component pick-up position. The tray feeder 11 is attachable to and detachable from the component supply unit 4. Hereinafter, components such as connectors having pins Db protruding from a body Da are simply referred to as "component D" (see FIG. 4). That is, the component D having the pins Db protruding from the body Da is accommodated in the tray 9 with the pins Db oriented downward, and is supplied to the component pick-up position by the tray feeder 11.

[0015] In FIG. 1 and FIG. 2, Y-axis tables 12 each provided with a linear drive mechanism are arranged along the Y-axis at both end portions in the X-axis direction on the upper surface of the base 2. A beam 13 similarly provided with a linear drive mechanism is coupled to the Y-axis tables 12 so as to be movable along the Y-axis. The beam 13 is arranged along the X-axis. A mounting head 14 is mounted on the beam 13 via a plate 13a so as to be movable along the X-axis. A nozzle 15 that sucks and holds the component D is mounted on the lower portion of the mounting head 14. The mounting head 14 moves the nozzle 15 up and down and rotates it around the Z-axis.

[0016] The Y-axis tables 12 and the beam 13 constitute a head moving mechanism 16 that moves the mounting head 14 along the X-axis and the Y-axis. The head moving mechanism 16 and the mounting head 14 perform a mounting turn, in which a component is sucked and picked up from the tape feeder 5 or the tray feeder 11 arranged in the component supply unit 4 by the nozzle 15 mounted on the mounting head 14, and the component is mounted at the mounting position of the substrate B positioned on the substrate transport mechanism 3.

[0017] In Figures 1 and 2, a component recognition camera 20 is positioned between the component supply unit 4 and the substrate transport mechanism 3. When the mounting head 14, which has taken a component from the component supply unit 4, moves above the component recognition camera 20, the component recognition camera 20 captures an image of the component held by the mounting head 14. The holding posture of the component is recognized from the captured image. A head camera 17 is attached to the plate 13a to which the mounting head 14 is mounted. The head camera 17 moves integrally with the mounting head 14.

[0018] As the mounting head 14 moves, the head camera 17 moves above the substrate B positioned by the substrate transport mechanism 3, and captures images of the substrate marks (not shown) provided on the substrate B to recognize the position of the substrate B. During the component mounting operation on the substrate B by the mounting head 14, the mounting position is corrected by taking into account the component recognition result by the component recognition camera 20 and the substrate position recognition result by the head camera 17.

[0019] In Figure 1, a touch panel 18 is installed at the front of the component mounting device 1 where the worker works. The touch panel 18 displays various information on its display, and the worker uses the operation buttons displayed on the display to input data and operate the component mounting device 1.

[0020] Next, with reference to Figure 3, the configuration of the part recognition camera 20 will be described. The part recognition camera 20 includes an imaging unit 22 inside a housing 21 that has an image sensor such as a one-dimensional CCD or a two-dimensional CMOS sensor. A ceiling plate 21a made of transparent glass or the like is installed on the top surface of the housing 21. A lens 23 is positioned above the imaging unit 22. The imaging unit 22 is installed with its optical axis 22a facing upward, and it images the part D held by the nozzle 15 through the lens 23 and the ceiling plate 21a.

[0021] Inside the housing 21, above the lens 23, are installed a coaxial illumination unit 24, a reflective illumination unit 25, and a body illumination unit 26. The coaxial illumination unit 24 is composed of a coaxial illumination means 24a made up of multiple LED chips and a half mirror 24b. The half mirror 24b is positioned in the middle of the optical axis 22a of the imaging unit 22, and reflects the light 24c emitted from the coaxial illumination means 24a upwards to illuminate the lower surface of component D (see Figure 5(a)).

[0022] In Figure 3, the reflective illumination unit 25 is composed of multiple LED chips and illuminates the reflector 15a of the nozzle 15, which is located above the part recognition camera 20, from a downward oblique direction. The reflective illumination unit 25 is arranged to surround the lens 23. In the case of a part smaller than the reflector 15a, the light 25a emitted from the reflective illumination unit 25 is mainly reflected by the reflector 15a of the nozzle 15, illuminating the small part held by the nozzle 15 from above. In the case of a part D larger than the reflector 15a, the light 25a emitted from the reflective illumination unit 25 illuminates the underside of part D (see Figure 6(a)).

[0023] The body lighting unit 26 is composed of a body lighting means 26a, which is made up of multiple LED chips, and a light shielding plate 26b. The body lighting means 26a and the light shielding plate 26b extend in the Y-axis direction and are positioned above and outside the reflective lighting unit 25 so as to be symmetrical with respect to the optical axis 22a. The body lighting means 26a illuminates the part D from below at an oblique angle. The light shielding plate 26b is positioned on the optical axis 22a side of the body lighting means 26a, and its upper part is tilted toward the optical axis 22a side. The light shielding plate 26b blocks light 26c emitted from the body lighting means 26a so as not to hit the tip Dc of the pin Db of the part D near the optical axis 22a (see Figure 7(a)).

[0024] In Figure 3, the imaging unit 22 captures (scans) the component D held by the nozzle 15 of the mounting head 14, which is moving along the X-axis by the head moving mechanism 16 (arrow a), while at least one of the coaxial illumination unit 24, the reflected illumination unit 25, or the body illumination unit 26 is illuminating the component D with light 24c, 25a, or 26c. In this way, the mounting head 14 constitutes a component holding unit 41 (Figure 8) that holds the component D. The head moving mechanism 16 also constitutes a component moving unit 42 (Figure 8) that moves the component D held by the component holding unit 41 above the imaging unit 22. Note that the component holding unit 41 may be configured to hold the component D by vacuum suction using the nozzle 15, or it may be configured to grip and hold the component D with a chuck or the like.

[0025] Next, with reference to Figure 4, the component D having pins Db in this embodiment will be described. Component D has a body Da and a plurality (14 in this case) of pins Db protruding downward from the lower surface of the body Da. The tips Dc of the pins Db are flat and have no taper. A concave groove Dd and a convex protrusion De are formed on the lower surface of the body Da. The height of the protrusion De is lower than the length of the pins Db.

[0026] Next, referring to Figures 5 to 7, we will explain the images acquired by the imaging unit 22 when the coaxial illumination unit 24, reflective illumination unit 25, and body illumination unit 26 of the part recognition camera 20 are illuminating with light 24c, 25a, and 26c. Figures 5 to 7 show examples where the nozzle 15 is stopped so that pin DbA near the center of the part D held by the nozzle 15 is near the optical axis 22a of the imaging unit 22, or where the image was taken while scanning was performed and pin DbA of the part D held by the nozzle 15 was near the optical axis 22a of the imaging unit 22. Figures 5(b), 6(b), and 7(b) are images of the imaging range acquired by the imaging unit 22. The imaging range is set so that pin DbB adjacent to pin DbA near the optical axis 22a is not included.

[0027] Figure 5(a) shows the state in which the nozzle 15 holding the part D is stopped or moving above the part recognition camera 20, and the part D is being imaged by the imaging unit 22 while the coaxial illumination unit 24 illuminates the lower surface of the part D with light 24c. The light 24c emitted from the coaxial illumination unit 24 is reflected by the lower surface of the body Da and the tip Dc of the pin DbA, and the reflected light 24c is imaged by the imaging unit 22.

[0028] Figure 5(b) shows the image 27 of the imaging range captured by the imaging unit 22. In the image 27, the area outside of component D appears dark because light 24c is not reflected. Also, in the image 27, the lower surface of body Da, the tip Dc of pin DbA, the groove Dd, and the protrusion De are recognizable due to the difference in the reflection of light 24c at these points. Thus, the coaxial illumination unit 24 illuminates the body Da and the tip Dc of pin DbA of component D with light 24c.

[0029] Figure 6(a) shows the state in which the nozzle 15 holding the part D is stopped or moving above the part recognition camera 20, and the part D is being imaged by the imaging unit 22 while the underside of the part D is illuminated with light 25a by the reflective illumination unit 25. The light 25a emitted from the reflective illumination unit 25 is reflected by the underside of the body Da and the tip Dc of the pin DbA, and the reflected light 25a is imaged by the imaging unit 22.

[0030] Figure 6(b) shows the image 28 of the imaging range captured by the imaging unit 22. In the image 28, the area outside of component D appears dark because light 25a is not reflected. Also, in the image 28, the lower surface of body Da, the tip Dc of pin DbA, the groove Dd, and the protrusion De are recognizable due to the difference in the reflection of light 25a at these points. Thus, the reflective illumination unit 25 irradiates light 25a onto the body Da and the tip Dc of pin Db of component D.

[0031] Figure 7(a) shows the state in which the nozzle 15 holding part D is stopped or moving above the part recognition camera 20, and the part D is being imaged by the imaging unit 22 while the body illumination unit 26 illuminates the underside of part D with light 26c. The light 26c emitted from the body illumination unit 26 is reflected from the underside of the body Da, and the reflected light 26c is imaged by the imaging unit 22. The light 26c emitted from the body illumination unit 26 is blocked by the light shielding plate 26b and does not hit the tip Dc of pin DbA near the optical axis 22a. The light 26c emitted from the body illumination unit 26 does hit the tip Dc of pin DbB adjacent to pin DbA near the optical axis 22a, but the setting is such that pin DbB adjacent to pin DbA near the optical axis 22a is not included in the imaging range.

[0032] Figure 6(b) shows the image 29 of the imaging range captured by the imaging unit 22. In the image 29, the area outside of component D appears dark because light 26c is not reflected there. Also, in the image 29, the lower surface of body Da, groove Dd, and protrusion De are recognizable due to the difference in the reflection of light 26c at these points. Note that the tip Dc of pin DbA is not illuminated by light 26c, so the tip Dc of pin DbA appears dark in the image 29. Thus, the reflective illumination unit 25 illuminates the body Da of component D with light 26c.

[0033] In order for the body illumination unit 26 to illuminate the body Da of part D with light 26c without illuminating the tip Dc of pin DbA, the angle of the body illumination means 26a (illumination angle of light 26c), the position of the light shielding plate 26b, the height of part D held by the nozzle 15, and the imaging range of the imaging unit 22 are set according to the area of ​​the tip Dc of pin Db (size viewed from below), the length of pin Db, and the distance between adjacent pins Db.

[0034] Thus, the coaxial illumination unit 24 and reflective illumination unit 25 of the component recognition camera 20 constitute a first illumination unit 43 (Figure 8) that illuminates the body Da and the tip Dc of the pin Db of component D with light 24c and 25a. In addition, the body illumination unit 26 of the component recognition camera 20 constitutes a second illumination unit 44 (Figure 8) that illuminates the body Da of component D with light 26c, but does not illuminate the tip Dc of the pin Db with light 26c. The first illumination unit 43 illuminates with light 24c or light 25a from either the coaxial illumination unit 24 or the reflective illumination unit 25, depending on the setting. Alternatively, the first illumination unit 43 illuminates with light 24c and light 25a from both the coaxial illumination unit 24 and the reflective illumination unit 25.

[0035] Next, referring to Figure 8, the configuration of the control system of the component mounting device 1 will be explained. Here, the focus will be on the function of mounting component D, which has pin Db, onto substrate B.

[0036] In Figure 8, the control device 30 of the component mounting apparatus 1 is connected to a substrate transport mechanism 3, a tape feeder 5, a tray feeder 11, a mounting head 14 (component holding section 41), a head moving mechanism 16 (component moving section 42), a head camera 17, a touch panel 18, and a component recognition camera 20. The control device 30 includes a storage unit 31, a mounting processing unit 34, and an imaging processing unit 35. The storage unit 31 is a memory device that stores mounting data 32, imaging condition data 33, and the like.

[0037] The component recognition camera 20 includes an imaging unit 22, a first illumination unit 43 (coaxial illumination unit 24, reflective illumination unit 25), a second illumination unit 44 (body illumination unit 26), as well as an imaging control unit 45 and a pin tip recognition unit 46. The imaging control unit 45 controls the imaging unit 22, the first illumination unit 43, and the second illumination unit 44 based on the information contained in the imaging condition data 33 to acquire an image. The imaging control unit 45 also temporarily stores the acquired image and performs image processing.

[0038] In Figure 8, the mounting data 32 stores information necessary for component mounting work, such as the size of the board B, information about the component D to be mounted (component name, size, position of pin Db, etc.), and mounting position (XY coordinates), for each type of mounting board. The imaging condition data 33 stores information for each component name of component D having pin Db, such as the illumination conditions of the first illumination unit 43 (coaxial illumination unit 24, reflective illumination unit 25) and the second illumination unit 44 (body illumination unit 26) when imaging component D with the component recognition camera 20, as well as the movement speed and movement range of component D during scan imaging.

[0039] The mounting processing unit 34 controls each part of the component mounting device 1 based on the mounting data 32 and the position of the tip Dc of pin Db of component D recognized by the pin tip recognition unit 46 (described later), correcting the angle and position of component D held by the mounting head 14 (component holding unit 41) to perform the component mounting operation of mounting component D onto the substrate B.

[0040] In Figure 8, the imaging processing unit 35 controls the mounting head 14 (component holding unit 41), the head moving mechanism 16 (component moving unit 42), and the component recognition camera 20 based on the imaging condition data 33, to cause the component recognition camera 20 to image the component D having pin Db held by the mounting head 14, and to acquire an image of the component D.

[0041] Specifically, the imaging processing unit 35 controls the head movement mechanism 16 to move the component D held by the mounting head 14 along the X-axis above the imaging unit 22 of the component recognition camera 20. The imaging processing unit 35 also transmits commands such as an imaging start command and an imaging end command to the imaging control unit 45 of the component recognition camera 20. The imaging control unit 45 controls the imaging unit 22, the first illumination unit 43, and the second illumination unit 44 according to the commands from the imaging processing unit 35 to acquire an image of the component D.

[0042] In other words, while the head movement mechanism 16 (part movement unit 42) moves part D once along the X-axis above the imaging unit 22, the imaging control unit 45 alternately illuminates part D with light 24c, 25a, and 26c using the first illumination unit 43 and the second illumination unit 44. Then, with the first illumination unit 43 illuminating the body Da and the tip Dc of the pin Db of part D with light 24c and 25a, the imaging control unit 45 causes the imaging unit 22 to image part D and acquire a first image (scan imaging), and simultaneously, with the second illumination unit 44 illuminating the body Da of part D with light 26c, the imaging unit 22 images part D and acquire a second image (scan imaging).

[0043] In this way, the imaging unit 22 acquires a first image and a second image by imaging the part D that the part moving unit 42 (head moving mechanism 16) moves above the imaging unit 22. Specifically, the imaging unit 22 acquires a first image by imaging the part D that the part moving unit 42 moves while the first illumination unit 43 is illuminating the part D with light 24c, 25a. The imaging unit 22 also acquires a second image by imaging the part D that the part moving unit 42 moves while the second illumination unit 44 is illuminating the part D with light 26c.

[0044] Figure 9 shows an example of a first image 50 of part D acquired by scanning imaging of the imaging unit 22. In the first image 50, the body Da, the tip Dc of the pin Db, the groove Dd, and the protrusion De of part D are clearly visible due to the light 24c and 25a irradiated onto the body Da and the tip Dc of the pin Db by the first illumination unit 43.

[0045] Figure 10 shows an example of a second image 51 of part D acquired by scanning imaging of the imaging unit 22. In the second image 51, the body Da, groove Dd, and protrusion De are clearly visible due to the light 26c illuminating the body Da of part D by the second illumination unit 44. In addition, in the second image 51, the tip Dc of pin Db is not illuminated by light 26c, so the tip Dc of pin Db appears dark in the captured image 29.

[0046] In Figure 8, the pin tip recognition unit 46 recognizes the tip Dc of pin Db from the difference between the first image 50 and the second image 51 acquired by the imaging unit 22. Figure 11 shows an example of a difference image 52 acquired by the pin tip recognition unit 46 by image processing the difference between the first image 50 and the second image 51. In the difference image 52, the body Da, groove Dd, and protrusion De, which were visible in both the first image 50 and the second image 51, disappear due to image processing, and only the tip Dc of pin Db, which appeared differently in the first image 50 and the second image 51, is displayed without disappearing.

[0047] As described above, the imaging processing unit 35, the first illumination unit 43 (coaxial illumination unit 24, reflective illumination unit 25), the second illumination unit 44, the imaging unit 22, the component holding unit 41 (mounting head 14), the component moving unit 42 (head moving mechanism 16), and the pin tip recognition unit 46 constitute a component recognition device 40 (Figure 8) that recognizes a component D having pin Db. Note that the pin tip recognition unit 46 may be configured as it is in the component recognition camera 20, or it may be configured as it is in the control device 30.

[0048] The component recognition device 40 acquires a first image 50 when the imaging unit 22 images the component D while the body Da and the tip Dc of the pin Db are illuminated with light 24c and 25a by the first illumination unit 43, and a second image 51 when the imaging unit 22 images the component D while the body Da of the component D is illuminated with light 26c by the second illumination unit 44, and the pin tip recognition unit 46 recognizes the tip Dc of the pin Db from the difference between the first image 50 and the second image 51 (see Figure 11). This makes it possible to appropriately recognize the position of the pin Db of a component D that has a pin Db with a flat tip Dc.

[0049] Next, following the flow chart in Figure 12, a component mounting method for mounting component D onto substrate B using component mounting equipment 1 will be described. Here, the process of mounting component D onto substrate B held at the mounting work position of substrate transport mechanism 3 will be described. First, the mounting processing unit 34 picks up component D supplied to the tray feeder 11 by attracting it with the nozzle 15 of the mounting head 14 (component holding unit 41) (ST1: component attraction process). Next, the imaging processing unit 35 uses the component recognition camera 20 to image component D held by the mounting head 14 (ST2: component recognition process).

[0050] Next, the mounting processing unit 34 corrects the angle and position of the component D held by the mounting head 14 based on the position of the tip Dc of the pin Db of the component D recognized in the component recognition step (ST2), and mounts it to the mounting position on the substrate B (ST3: component mounting step). If there are still components D to be mounted on the substrate B (Yes in ST4), the component suction step (ST1), component recognition step (ST2), and component mounting step (ST3) are repeatedly executed.

[0051] Next, the details of the component recognition process (ST2) (component recognition method) will be explained according to the flow chart in Figure 13. In the component recognition process (ST2), first, the imaging processing unit 35 moves the component D held by the mounting head 14 (component holding unit 41) to the front of the imaging unit 22 using the head moving mechanism 16 (component moving unit 42) (ST11: moving process). Then, the imaging processing unit 35 moves the component D in the X-axis direction at a constant speed using the head moving mechanism 16 and sends an imaging start command to the imaging control unit 45 to start scanning (ST12: scanning start process).

[0052] Next, the imaging control unit 45 uses the first illumination unit 43 to illuminate the body Da of part D and the tip Dc of pin Db with light 24c and 25a (ST13: first illumination step). Next, the imaging control unit 45 uses the imaging unit 22 to image part D and acquire a first image 50 of the imaging range (ST14: first image acquisition step). Next, the imaging control unit 45 uses the second illumination unit 44 to illuminate the body Da of part D with light 26c (ST15: second illumination step). Next, the imaging control unit 45 uses the imaging unit 22 to image part D and acquire a second image 51 of the imaging range (ST16: second image acquisition step).

[0053] In Figure 13, the imaging control unit 45 repeatedly executes the first illumination process (ST13), the first image acquisition process (ST14), the second illumination process (ST15), and the second image acquisition process (ST16) until the entire part D is imaged (No in ST17). When the entire part D is imaged (Yes in ST17), the imaging processing unit 35 stops moving the part D by the head movement mechanism 16 and sends an imaging completion command to the imaging control unit 45 to end the scan imaging (ST18: scan completion process). As a result, a first image 50 (Figure 9) and a second image (Figure 10) of the entire part D are acquired. Next, the pin tip recognition unit 46 recognizes the tip Dc of pin Db from the difference between the first image 50 and the second image 51 (ST19: pin tip recognition process) (Figure 11).

[0054] In this way, the component recognition method involves capturing an image of component D with light 24c and 25a illuminating the body Da of component D and the tip Dc of pin Db, thereby acquiring a first image 50 (ST13, ST14); capturing an image of component D with light 26c illuminating the body Da of component D and not illuminating the tip Dc of pin Db, thereby acquiring a second image 51 (ST15, ST16); and recognizing the tip Dc of pin Db from the difference between the acquired first image 50 and the second image 51 (ST19), thereby recognizing component D having pin Db.

[0055] As explained above, this disclosure discloses the following technical concepts.

[0056] (Technology 1) A component recognition device 40 that recognizes a component D having pin Db, A first illumination unit 43 (coaxial illumination unit 24, reflective illumination unit 25) illuminates the body Da and the tip Dc of pin Db of component D with light 24c, 25a, A second illumination unit 44 (body illumination unit 26) illuminates the body Da of part D with light 26c but does not illuminate the tip Dc of pin Db with light 26c, The imaging unit 22 acquires a first image 50 by imaging the component D while the body Da and the tip Dc of the pin Db are illuminated with light 24c and 25a by the first illumination unit 43, and a second image 51 by imaging the component D while the body Da of the component D is illuminated with light 26c by the second illumination unit 44, A component recognition device 40 comprising a pin tip recognition unit 46 that recognizes the tip Dc of pin Db from the difference between a first image 50 and a second image 51 acquired by an imaging unit 22.

[0057] This allows for proper recognition of the position of pin Db of component D, which has a flat pin Db at its tip Dc.

[0058] (Technology 2) A component holding section 41 (mounting head 14) that holds component D, The system includes a component moving unit 42 (head moving mechanism 16) that moves the component D held by the component holding unit 41 above the imaging unit 22, The part recognition device 40 described in Technical Reference 1, wherein the imaging unit 22 images the part D that the part moving unit 42 moves above the imaging unit 22 to acquire a first image 50 and a second image 51.

[0059] This allows for proper recognition of the position of pin Db on a large component D that has a flat pin Db at its tip Dc.

[0060] (Technology 3) While the component moving unit 42 moves component D once above the imaging unit 22, The first illumination unit 43 and the second illumination unit 44 alternately irradiate component D with light. The imaging unit 22 images the component D and acquires a first image 50 and a second image 51, as described in Technical Reference 2, for the component recognition device 40.

[0061] This allows for the proper recognition of the position of pin Db of a component D having a flat tip Dc, through a single scan image.

[0062] (Technology 4) The imaging unit 22 is With the first illumination unit 43 irradiating the component D with light 24c, 25a, the component moving unit 42 captures an image of the component D to be moved and acquires the first image 50. The part recognition device 40 according to Technology 2 or 3, wherein the part moving unit 42 captures an image of the part D to be moved while the second illumination unit 44 is irradiating the part D with light 26c, and acquires a second image 51.

[0063] This allows for proper recognition of the position of pin Db on a large component D that has a flat pin Db at its tip Dc.

[0064] (Technology 5) A component mounting apparatus 1 for mounting a component D having pins Db onto a substrate B, A first illumination unit 43 that irradiates light 24c, 25a onto the body Da and the tip Dc of the pin Db of component D, A second illumination unit 44 illuminates the body Da of component D with light 26c but does not illuminate the tip Dc of pin Db with light 26c, The imaging unit 22 acquires a first image 50 by imaging the component D while the body Da and the tip Dc of the pin Db are illuminated with light 24c and 25a by the first illumination unit 43, and a second image 51 by imaging the component D while the body Da of the component D is illuminated with light 26c by the second illumination unit 44, A pin tip recognition unit 46 recognizes the tip Dc of pin Db from the difference between the first image 50 and the second image 51 acquired by the imaging unit 22, A component holding section 41 that holds component D, A component mounting apparatus 1 comprises a component moving unit 42 that moves a component D held by a component holding unit 41 above an imaging unit 22.

[0065] This allows for proper recognition of the position of pin Db of component D, which has a flat pin Db at its tip Dc.

[0066] (Technology 6) A component recognition method for recognizing a component D having pin Db, With light 24c and 25a illuminating the body Da and the tip Dc of the pin Db of part D, part D is imaged to obtain the first image 50 (ST13, ST14). With light 26c illuminating the body Da of part D but not the tip Dc of pin Db, part D is imaged to acquire a second image 51 (ST15, ST16). A component recognition method (ST19) that recognizes the tip Dc of pin Db from the difference between the acquired first image 50 and the second image 51.

[0067] This allows for proper recognition of the position of pin Db of component D, which has a flat pin Db at its tip Dc. [Industrial applicability]

[0068] The component recognition device, component mounting device, and component recognition method of this disclosure have the effect of being able to appropriately recognize the position of pins of components having pins with flat tips, and are useful in the field of mounting components onto a substrate. [Explanation of Symbols]

[0069] 1. Component mounting equipment B substrate D parts Da Body Db, DbA, DbB pins DC tip 22 Imaging Department 24c, 25a, 26c light 40. Parts Recognition Device 41 Parts holding section 42 Component movement section 43. First lighting section 44 Second lighting section 50 Image 1 51 Image 2

Claims

1. A component recognition device that recognizes a component having a pin, The body of the component and the tip of the pin are illuminated by a first illumination unit, A second illumination unit that illuminates the body of the component with light but does not illuminate the tip of the pin, An imaging unit acquires a first image by imaging the component while the body and the tip of the pin of the component are illuminated with light by the first illumination unit, and acquires a second image by imaging the component while the body of the component is illuminated with light by the second illumination unit, A component recognition device comprising: a pin tip recognition unit that recognizes the tip of the pin from the difference between the first image and the second image acquired by the imaging unit.

2. A component holding section for holding the aforementioned component, The system includes a component moving unit that moves the component held by the component holding unit above the imaging unit, The part recognition device according to claim 1, wherein the imaging unit images the part being moved above the imaging unit by the part moving unit to acquire a first image and a second image.

3. While the component moving unit moves the component once above the imaging unit, The first illumination unit and the second illumination unit alternately irradiate the component with light. The component recognition device according to claim 2, wherein the imaging unit images the component to obtain the first image and the second image.

4. The imaging unit is While the first illumination unit is irradiating the component with light, the component moving unit captures an image of the component being moved to acquire the first image. The component recognition device according to claim 2, wherein the component moving unit captures an image of the component being moved while the second illumination unit is irradiating the component with light, thereby acquiring a second image.

5. A component mounting apparatus for mounting components having pins onto a circuit board, The body of the component and the tip of the pin are illuminated by a first illumination unit, A second illumination unit that illuminates the body of the component with light but does not illuminate the tip of the pin, An imaging unit acquires a first image by imaging the component while the body and the tip of the pin of the component are illuminated with light by the first illumination unit, and acquires a second image by imaging the component while the body of the component is illuminated with light by the second illumination unit, A pin tip recognition unit recognizes the tip of the pin from the difference between the first image and the second image acquired by the imaging unit, A component holding section for holding the aforementioned component, A component mounting apparatus comprising: a component moving unit that moves the component held by the component holding unit above the imaging unit.

6. A component recognition method for recognizing a component having pins, With light illuminating the body of the component and the tip of the pin, the component is imaged to acquire a first image. A second image is obtained by imaging the component while light is irradiated onto the body of the component and light is not irradiated onto the tip of the pin. A component recognition method that recognizes the tip of the pin from the difference between the acquired first image and the second image.

Images