Sealing system for reactor systems

Abstract

We provide reactors. [Solution] The reactor may comprise a reaction chamber volume enclosed within a reaction chamber, a susceptor configured to move vertically within the reaction chamber, a reaction space above the susceptor and a lower chamber space below the susceptor within the reaction chamber volume, and / or a sealing system that substantially fluidly separates the reaction space and the lower chamber space. The sealing system may comprise a spacer plate surrounding the susceptor, and / or a sealing device coupled to and / or engaged with the susceptor and the spacer plate, the sealing device comprising a base ring coupled to the susceptor and a spring coupled to the base ring. The spring may have spring biasing, which facilitates the formation of a substantial seal between the spacer plate and the susceptor, resulting in a substantial fluid separation between the reaction space and the lower chamber space as the susceptor moves horizontally within the reaction chamber.

Description

TECHNICAL FIELD

[0001] The present disclosure relates generally to semiconductor processing or reactor systems, and in particular to reactor systems and components contained therein that enable sealing between an upper volume and a lower volume within a reaction chamber.

BACKGROUND ART

[0002] Reaction chambers may be used in various processes during the formation of electronic devices. For example, reaction chambers may be used to deposit various material layers onto semiconductor substrates, etch materials, and / or clean surfaces. A substrate may be disposed on a susceptor within the reaction chamber. Both the substrate and the susceptor may be heated to a desired substrate temperature set point. In an exemplary process, one or more reactant gases may pass over the heated substrate, causing deposition of a thin film of material on the substrate surface.

[0003] A reaction chamber may comprise, for example, two spaces or volumes separated by a susceptor. Processing may be performed in the reaction space or chamber of the two chambers (e.g., the upper chamber disposed vertically above the lower chamber). During operation of a reactor system comprising two chambers separated by a susceptor, contaminants may undesirably migrate from the reaction space to the other chamber (e.g., from the upper chamber to the lower chamber) or vice versa. Accordingly, systems and methods for providing a seal between two volumes within a reaction chamber (e.g., for at least partially fluidly isolating the two chambers) may be desirable.

[0004] Any discussion of the problems and solutions included in this disclosure is merely for the purpose of providing the content of this disclosure, and should not be construed as an admission that any or all of such discussion was known at the time the disclosure was made.

SUMMARY OF THE INVENTION

[0005] This summary is provided to introduce the selected concepts in a simplified form. These concepts are described in more detail in the detailed description of the exemplary embodiments of this disclosure below. This summary is not intended to identify any major or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0006] In several examples, reactor systems are provided. The reactor systems disclosed herein can facilitate at least partial sealing (e.g., substantial sealing) between two chambers or volumes within the reaction chamber of the reactor system. [Means for solving the problem]

[0007] In various examples, the reactor may comprise a reaction chamber volume enclosed within a reaction chamber, a susceptor configured to move parallel to the axis up and down within the reaction chamber, a reaction space above the susceptor within the reaction chamber volume, a lower chamber space below the susceptor within the reaction chamber volume, and / or a sealing system that substantially fluidly separates the reaction space and the lower chamber space. The sealing system may comprise a spacer plate surrounding the susceptor, and / or a sealing device coupled to and / or engaged with the susceptor and the spacer plate, the sealing device comprising a base ring coupled to the susceptor and a spring coupled to the base ring. The spring may have a spring bias toward a compressed or extended position, and the spring bias facilitates the formation of a substantial seal between the spacer plate and the susceptor, resulting in substantial fluid separation of the reaction space and the lower chamber space as the susceptor moves up and down within the reaction chamber.

[0008] In various examples, the sealing system may further comprise a flow control ring positioned around the susceptor and between the susceptor and a spacer plate. The sealing device may be positioned between the flow control ring and the spacer plate such that the sealing device is coupled to the susceptor via the flow control ring. Substantial sealing between the spacer plate and the susceptor can be facilitated by spring biasing between the flow control ring and the spacer plate. The sealing device may be positioned between the upward-facing surface of the flow control ring and the downward-facing surface of the spacer plate. The spring may be biased toward an extended position such that a downward force from the spring acts on the flow control ring, thereby creating a downward force on the susceptor, forming a substantial seal between the flow control ring and the susceptor, and creating a substantial fluid separation between the reaction space and the lower chamber space. The spring may be fixedly coupled to a base ring. The sealing device can enclose the susceptor, and the spring comprises multiple bellows plates, including a first bellows plate and an end bellows plate, each bellows plate extending between the flow control ring and the spacer plate.

[0009] The base ring may have an inner diameter closest to the susceptor, and the spring may have an inner diameter closest to the susceptor, with the base inner diameter being closer to the susceptor than the spring inner diameter. The base ring may comprise a bottom surface positioned in contact with the upward surface of the flow control ring and a radially inner surface positioned in contact with the outer surface of the flow control ring, and the base ring may further comprise a chamfered surface extending between the bottom surface and the radially inner surface of the base ring. The flow control ring may further comprise a ring chamfered surface extending between the upward surface and the outer surface, which may be complementary to the chamfered surface of the base ring. The base ring may comprise a top surface and a coupling projection projecting upward from the top surface, and a first bellows plate among a plurality of bellows plates is coupled to the coupling projection. The first bellows plate may comprise a flat end surface coupled to the coupling projection. The base ring may have an inner diameter closest to the susceptor, and the coupling projection is positioned close to the inner diameter of the base. The end bellows plate may be coupled to the spacer plate and / or positioned in contact with the spacer plate. The sealing device may further include a second base ring coupled to the end bellows plate such that the spring extends between the base ring and the second base ring. The second base ring can contact the spacer plate to create a substantial seal between the second base ring and the spacer plate. The base ring may have a mass of at least three times the mass of the spring.

[0010] In various examples, the reactor sealing device may comprise a base ring and / or a spring fixedly coupled to and extending from the base ring, the spring comprising a plurality of bellows plates extending between a first bellows plate and an end bellows plate. The base ring may have a base inner diameter, and the spring may have a spring inner diameter, with the base inner diameter being radially inward of the spring inner diameter. The base ring may comprise a bottom surface, a radially inward surface, and a chamfered surface extending between the bottom surface and the radially inward surface of the base ring. The base ring may comprise a top surface and a coupling projection projecting from the top surface, the first bellows plate of the plurality of bellows plates may have a flat end face coupled to the coupling projection.

[0011] In various examples, a reactor sealing system may comprise a spacer plate configured to surround a susceptor, a flow control ring configured to surround the susceptor and be positioned between the spacer plate and the susceptor, and / or a sealing device. The sealing device may comprise a base ring and / or a spring fixedly coupled to and extending from the base ring, the spring comprising a plurality of bellows plates including a first bellows plate and an end bellows plate, the base ring and spring extending between the upward-facing surface of the flow control ring and the downward-facing surface of the spacer plate. The spring may include a spring bias toward an extended position configured to create a substantial seal between the flow control ring and the spacer plate.

[0012] For the purpose of outlining the benefits achieved beyond this disclosure and the prior art, specific purposes and benefits of this disclosure are described above. Naturally, it should be understood that not all of these purposes or benefits necessarily have to be achieved according to any specific example of this disclosure. Therefore, a person skilled in the art will recognize that, for example, the examples disclosed herein can be performed in a manner that achieves or optimizes one or more of the benefits taught or suggested herein, without necessarily achieving other purposes or benefits that may be taught or suggested herein.

[0013] All of these examples are intended to be within the scope of this disclosure. These examples and other examples will be readily apparent to those skilled in the art from the following “Modes for Carrying Out the Invention” of a particular example with reference to the attached drawings, and this disclosure is not limited to any particular example(s) considered. [Brief explanation of the drawing]

[0014] [Figure 1] This is a schematic diagram illustrating various exemplary reactor systems. [Figure 2A] This is a schematic diagram of an exemplary reaction chamber in which various susceptors are positioned at the bottom. [Figure 2B] This is a schematic diagram of an exemplary reaction chamber in which susceptors are positioned in an elevated position, as shown in various examples. [Figure 3] These are schematic diagrams of parts of reaction chambers in various examples. [Figure 4] These are schematic diagrams of sealing devices for reactor systems, illustrating various examples. [Figure 5A] Perspective cross-sectional views of sealing devices for reactor systems, showing various examples. [Figure 5B] Perspective cross-sectional views of sealing devices for reactor systems, showing various examples.

[0015] This specification specifically identifies examples of the present disclosure and concludes in the explicitly claimed claims, although the merits of the examples of the present disclosure may be more readily apparent from the description of certain examples when read in conjunction with the accompanying drawings. Elements that are given the same reference numerals throughout the drawings are intended to be the same as one another.

[0016] It should be understood that the elements in the drawings are illustrated for simplicity and clarity and are not necessarily drawn to actual size. For example, the dimensions of some elements in the drawings may be exaggerated relative to others to help improve understanding of the illustrated embodiments of this disclosure. [Modes for carrying out the invention]

[0017] The descriptions of examples of methods, structures, devices, and systems provided below are illustrative and intended solely for illustrative purposes, and are not intended to limit the scope of this disclosure or the claims. Furthermore, the enumeration of multiple examples having the described features is not intended to exclude other examples having additional features or incorporating different combinations of the described features. For example, various examples may be described as embodiments and enumerated in dependent claims. Unless otherwise stated, examples or their components may be combined or applied separately from one another. Methods may include steps disclosed in any preferred and / or desired order or combination. The examples presented herein are not meant to represent any particular material, apparatus, structure, or device in actual form, but are merely representations used to describe embodiments of this disclosure.

[0018] As used herein, the term "and / or" includes any combination of one or more of the related enumerated items. Unless otherwise stated, expressions such as "at least one of" modify the entire list of elements when preceding a list of elements, and not necessarily modify any individual element of the list.

[0019] As used herein, the terms “includes,” “equips / includes,” “includes,” and / or “equips / includes” identify the presence of a described feature, integer, step, process, member, component, and / or group thereof, but do not exclude the presence or addition of one or more other features, integers, steps, processes, members, components, and / or groups thereof. In this disclosure, any defined meaning does not necessarily exclude the usual customary meaning in some examples.

[0020] As used herein, the term “substrate” may refer to one or more arbitrary substrate materials, including one or more arbitrary substrate materials, which may be modified or on which devices, circuits, or films may be formed. “Substrate” can be continuous or discontinuous, rigid or flexible, solid or porous, or a combination thereof. A substrate can be in any form, such as powder, plate, or workpiece. A substrate in plate form may include wafers of various shapes and sizes. A substrate may be made from semiconductor materials, for example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0021] As used herein, the term "atomic layer deposition" (ALD) may refer to a vapor deposition process in which a deposition cycle, preferably a plurality of consecutive deposition cycles, is performed in a process chamber. Typically, during each deposition cycle, the precursor is chemisorbed to the deposition surface (e.g., a substrate surface or a previously deposited underlying surface such as material from a previous ALD cycle), forming a monolayer or sub-monolayer that does not readily react with additional precursor (i.e., a self-limiting reaction). Thereafter, if necessary, a reactant (e.g., another precursor or reaction gas) may then be introduced into the process chamber for use in converting the chemisorbed precursor to the desired material on the deposition surface. Typically, this reactant is capable of further reaction with the precursor. Further, a purge step may also be utilized during each cycle to remove excess precursor from the process chamber and / or remove excess reactant and reaction byproducts from the process chamber after conversion of the chemisorbed precursor. Further, as used herein, the term "atomic layer deposition" is also meant to include processes indicated by related terms such as "chemical vapor deposition atomic layer deposition", "atomic layer epitaxy" (ALE), molecular beam epitaxy (MBE), gas source MBE, or organometallic MBE, as well as chemical beam epitaxy when performed with alternating pulses of precursor composition(s), reactive gas, and purge (e.g., inert carrier) gas.

[0022] As used herein, the term "chemical vapor deposition" (CVD) may refer to any process in which a substrate is exposed to one or more volatile precursors, which react and / or decompose on the substrate surface to produce the desired deposit.

[0023] In some examples, a "film" refers to a layer extending in a direction perpendicular to the thickness direction. In some examples, a "layer" refers to a material with a certain thickness formed on a surface, which may be a synonym for a film, or may be a structure that is not a film. A film or layer may be constituted by an individual single film or layer having certain properties, or a plurality of films or layers, and the boundary between adjacent films or layers may or may not be distinct, and may or may not be established based on physical, chemical, and / or any other properties, formation processes or sequences, and / or the function or purpose of adjacent films or layers. A layer or film may or may not be continuous. Further, a single film or layer may be formed using one or more deposition cycles and / or one or more deposition and treatment cycles.

[0024] As used herein, the term "contaminant" may refer to any undesirable material disposed within a reaction chamber that can affect the purity of a substrate disposed within the reaction chamber. The term "contaminant" may refer to, but is not limited to, unwanted deposits, metallic and non-metallic particles, impurities, and waste disposed within a reactor system or reaction chamber or any portion thereof.

[0025] In this disclosure, any two numbers of variables can constitute a viable range of those variables, any range shown may include or exclude an endpoint, and all ranges and ratios disclosed herein may be combined. In addition, in some examples, any value of a variable shown (whether they are shown with “approximately” or not) may refer to an exact value or an approximate value, may include an equality, or may refer to a mean, median, representative value, or majority, etc. Unless specifically stated otherwise, references to “one (a),” and / or “it,” may include one or more items, and references to singular items may also include plural items. When referring to components of a system discussed herein, the term “combined” refers, as necessary, to direct or indirect combination with other intervening elements. Unless otherwise indicated, terms such as “first,” “second,” and / or “primary,” “secondary,” etc., are used herein merely as identifiers and are not intended to impose any sequential, positional, or hierarchical requirements on the items referred to by these terms. Furthermore, a reference to, for example, a “second” item does not require or exclude the existence of, for example, a “first” item or a lesser numbered item, and / or, for example, a “third” item or a more numbered item. Moreover, a reference to, for example, a “first” item and a “second” item does not mean that there are no intervening items, and such intervening items may exist.

[0026] Reactor systems used in ALD, CVD, and / or similar processes can be used for a variety of applications, including the deposition and etching of materials onto a substrate surface. In various examples, referring to Figure 1, the reactor system 50 may comprise a reaction chamber 4, a susceptor 6 for holding a substrate 30 during processing, a fluid distribution system 8 (e.g., a showerhead) for distributing one or more reactants onto the surface of the substrate 30, and one or more reactant sources 10, 12, and / or carrier and / or purge gas sources 14, which are fluid-coupled to the reaction chamber 4 via lines 16-20 and / or valves or controllers 22-26. The reactor system 50 may also comprise a vacuum source 28 fluid-coupled to the reaction chamber 4. A sealing member 29 may separate (e.g., fluidly at least partially separate) portions of the volume within the reaction chamber 4.

[0027] Referring to Figures 2A and 2B, examples of the present disclosure may include reactor systems and methods that can be used to process substrates in reactor 100. In various examples, reactor 100 may comprise a reaction chamber 110 for processing substrates. In various examples, reaction chamber 110 may comprise a reaction space 112 (i.e., upper chamber) and / or a lower chamber space 114 (i.e., lower chamber) which can be configured to process one or more substrates. The lower chamber space 114 may be configured for loading and unloading substrates from the reaction chamber and / or to provide a pressure difference between the lower chamber space 114 and the reaction space 112.

[0028] In various examples, the substrate 150 and the susceptor 130 may be movable relative to each other. For example, in various examples, the lift pin 139 may be configured to allow the substrate 150 to separate from the susceptor 130 and to allow the substrate 150 to be fixed in contact with the susceptor 130 (i.e., supported by the susceptor 130). In various examples, the susceptor 130 may be moved up or down, for example by a susceptor elevator 104, so that the susceptor 130 moves relative to the substrate 150. In various examples, the lift pin 139 may be moved up or down, for example by a lift pin elevator / platform 202, so that the substrate 150 moves relative to the susceptor 130. In various examples, the susceptor 130 and / or the lift pin 139 may remain stationary while the other is moving. In various examples, the susceptor 130 and / or the lift pin 139 may be configured to move relative to the other.

[0029] In various examples, the susceptor 130 may move from the loading position 103 to the processing position 106, and thus the substrate 150 may be moved into the reaction space 112. The substrate 150 can then be processed in the reaction chamber.

[0030] In various examples, the reaction space 112 and the lower chamber space 114 may be separated by a susceptor 130 located within the reaction chamber 110. In various examples, the reaction space 112 and the lower chamber space 114 may be substantially fluidically separated or isolated from each other. For example, the susceptor 130 can substantially fluidly separate the reaction space 112 and the lower chamber space 114 by creating at least a partial seal (i.e., at least restricting fluid flow) between the susceptor 130 and the chamber sidewall 111 of the reaction chamber 110 located in close proximity to the susceptor outer surface 132 of the susceptor 130. That is, the space 108 between the susceptor 130 and the chamber sidewall 111 may be minimized or eliminated so that there is little or no fluid movement between the susceptor 130 and the chamber sidewall 111. As used herein, “substantially fluid-separated,” “substantially sealed,” “substantially sealed,” and / or other similar terms can mean a seal whose purpose is to reduce as much as possible the movement of fluid beyond the seal so that it is undesirable and / or not measured for any fluid to pass through the seal (i.e., leak) (the goal is a perfect seal, although in practice some fluid may leak).

[0031] In various examples, one or more sealing members (e.g., sealing member 129) may be coupled to the susceptor 130 (e.g., from the susceptor outer surface 132) and / or to the chamber sidewall 111 of the reaction chamber 110, to prevent or reduce fluid flow between the susceptor 130 and the chamber sidewall 111 (i.e., to create a substantial seal between them), to prevent or reduce fluid flow between them (i.e., to create a substantial seal between them). The sealing member 129 may be a diaphragm. A substantial seal of the reaction space 112 from the lower chamber space 114 may be desirable to prevent or reduce the entry and / or contact of precursor gases and / or other fluids used in the processing of the substrate 150 into and / or into the lower chamber space 114 of the reaction chamber 110. For example, a precursor gas used to treat a substrate in the reaction space may come into contact with the lower chamber space 114 and generate undesirable deposits / contaminants / particles, which may then be reintroduced into the reaction space 112, thereby potentially containing corrosive deposit precursors that provide a source of contamination to the substrate placed in the reaction space.

[0032] In various examples, the reaction chamber may include a sealing system positioned between a susceptor and the chamber sidewall to create a substantial seal between the reaction space and the lower chamber space. For example, the sealing system in reaction chamber 110 may include a sealing member 129 positioned between a susceptor 130 and the chamber sidewall 111 to create a substantial seal between the reaction space 112 and the lower chamber space 114.

[0033] In various examples, the sealing system within the reaction chamber may include a spacer plate (e.g., spacer plate 370 in Figure 3), at least a portion of which may protrude from the chamber sidewall into the reaction chamber volume. In various examples, the spacer plate may surround a susceptor within the reaction chamber (e.g., susceptor 330 in Figure 3). The spacer plate may be coupled to the susceptor (e.g., depending on whether the reaction chamber is moved or positioned in a processing position (e.g., an elevated position)). In various examples, the spacer plate may be in contact with and / or directly coupled to the susceptor (e.g., when the susceptor is in an elevated or processing position). For example, the downward-facing surface of the spacer plate (e.g., downward-facing surface 374 in Figure 3) may be coupled to and / or in contact with the upward-facing surface of the susceptor (e.g., upward-facing surface 336 in Figure 3). In various examples, the upward-facing surface of the susceptor that can engage with the spacer plate may be a substrate support surface.

[0034] In various examples, the sealing system may include a flow control ring (e.g., the flow control ring 390 in Figure 3) positioned between the susceptor and the spacer plate. The flow control ring may be positioned around the susceptor and may be configured to control the flow of fluid within the reaction chamber. For example, the sealing member 129 in Figure 1 may be a flow control ring. Thus, the susceptor may be coupled to and / or engaged with the spacer plate via the flow control ring. The reaction space and the lower chamber space may be substantially separated (fluidically and / or physically) by the susceptor, the flow control ring, and / or the spacer plate. For example, as shown in Figure 3, the flow control ring 390 may be positioned between the spacer plate 370 and the susceptor 330. The flow control ring 390 may have an upward-facing surface 394 that engages with (i.e., couples to and / or contacts with) the downward-facing surface 374 of the spacer plate 370. The flow control ring 390 may have a downward-facing surface 392 that engages with (i.e., couples with and / or contacts with) the upward-facing surface 337 of the susceptor 330. In various examples, the upward-facing surface of the susceptor with which the flow control ring engages may be a substrate support surface. In various examples, at least a portion of the flow control ring may be positioned above at least a portion of the spacer plate so that the flow control ring cannot be moved parallel to the spacer plate below it.

[0035] In various examples, the sealing system within the reaction chamber may include a sealing device (e.g., sealing device 200) positioned between and / or coupled to the spacer plate and the susceptor (e.g., the upward surface of the susceptor is configured to engage with the downward surface of the spacer plate via the sealing device). In various examples, the sealing device may be positioned between and / or coupled to the spacer plate and the flow control ring within the sealing system for the reaction chamber (e.g., the flow control ring is positioned between the susceptor and the spacer plate). In the above example, the sealing device may be coupled to the susceptor via the flow control ring.

[0036] Referring to Figure 4, in various examples, the sealing device 400 may comprise a base ring 420 and a spring 440 coupled to the base ring 420. The spring 440 may be coupled to the base ring 420 in a removable or fixed manner. The spring 440 may be coupled to the upper surface 424 of the base ring 420. The base ring 420 may at least partially surround the susceptor and / or flow control ring and may have an inner diameter 421 and an outer diameter 429. The inner diameter 421 may be part of the base ring 420 closest to the susceptor, and the outer diameter 429 may be part of the base ring 420 furthest from the susceptor. The inner diameter 421 may be aligned with at least part of the radially inner surface 426 of the base ring 420. The base ring 420 may include a height extending between the upper surface 424 and the bottom surface 423. The bottom surface 423 may be positioned in contact with the upward surface of the susceptor or flow control ring. The radially inner surface 426 of the base ring 420 may be positioned in close proximity to and / or in contact with the outer surface of the susceptor or flow control ring.

[0037] In various examples, the spring 440 may at least partially surround the susceptor and / or flow control ring and may comprise a bellows plate stack (e.g., a bellows). The bellows plate stack may comprise one or more bellows plates 450. The bellows plates 450 may be integral and / or monolithic with respect to each other, or the bellows plates 450 may be separate plates joined together. Each bellows plate 450 may extend between an inner end 452 and an outer end 454, and between the inner diameter 421 and outer diameter 429 of the base ring 420. The inner end 452 of each bellows plate 450 may be the portion of each bellows plate 450 that is closest to the inner diameter 421 of the base ring 420. The outer end 454 of each bellows plate 450 may be considered the portion of each bellows plate 450 that is closest to the outer diameter 429 of the base ring 420. The inner end 452 of one bellows plate 450 may be joined to the inner end 452 of another (adjacent) bellows plate 450 in the bellows plate stack. Similarly, the outer end 454 of one bellows plate 450 may be joined to the outer end 454 of another (adjacent) bellows plate 450 in the bellows plate stack. The bellows plates 450 can be joined to each other (fixed) in any suitable manner (e.g., welding, adhesive, fasteners, and / or similar) to form a bellows.

[0038] The inner end 452 of each bellows plate 450 may have an inner flat end 456, and / or the outer end 454 of each bellows plate 450 may have an outer flat end 457. The flat ends of the bellows plates 450 can facilitate coupling to other bellows plates 450 and / or to the base ring 420. That is, the flat ends provide a flat surface for coupling (e.g., coupling between bellows plates 450 and / or coupling to the base ring 420), providing a larger surface area for contact and coupling between each component, instead of the bellows plates 450 forming a bellows or zigzag configuration without a flat surface at the ends of the bellows plates 450. The flat ends may include any suitable dimensions, such as having a length of about 1 millimeter (mm) (in this description, "about" means ±0.5 mm) (the length between the inner and outer diameters of each flat end). The flat ends of the bellows plates 450 may extend in a direction substantially parallel to the surface of the base ring 420 to which the springs 440 are coupled, and / or in a direction substantially perpendicular to the direction of compression or extension of the springs 440 ("substantially" means ±10 degrees). The body 458 of each bellows plate 450 extends between the flat ends and may be angled from the direction of the flat ends of the bellows plates 450 (the angle may vary depending on the compression or extension of the springs 440).

[0039] The spring 440 (bellows plate stack) may extend or protrude from the base ring 420 (e.g., the upper surface 424). The spring 440 may extend between the first bellows plate 442 and the end bellows plate 444 (e.g., in the direction of compression or extension of the spring 440). The first bellows plate 442 may be coupled to the base ring 420 (e.g., to its upper surface 424). The first end of the first bellows plate 442 may be coupled to the base ring 420 in any preferred manner, such as by welding, adhesive, fasteners, and / or similar. The first end of the first bellows plate 442 may be coupled to the base ring 420 adjacent to the inner diameter 421 such that the first bellows plate 442 extends from its first end toward the outer diameter 429 of the base ring 420. Bringing the first bellows plate 442 close to the inner diameter 421 of the base ring 420 (and / or near the inner diameter 441 of the spring 440) can reduce the potential for contamination by reducing the space through which particles or contaminants can flow, in contrast to bonding the first bellows plate 442 closer to the outer diameter 429 of the base ring 420.

[0040] The spring 440 may have an inner diameter 441 (the portion of the bellows plate 450 closest to the susceptor) and an outer diameter 449 (the portion of the bellows plate 450 furthest from the susceptor). The inner diameter 441 of the spring 440 may be radially outward of the inner diameter 421 of the base ring 420 (i.e., the inner diameter 421 of the base ring 420 may be smaller than the inner diameter 441 of the spring 440 and therefore closer to the susceptor). Thus, the base ring 420 may contact the susceptor and / or flow control ring by positioning the base ring 420 (or its inner diameter 421) in contact with the susceptor and / or flow control ring, while the smaller inner diameter 421 of the base ring 420 leaves the inner diameter 441 of the spring 440 separated from the susceptor and / or flow control ring. Therefore, the base ring 420, which may be made of solid material, can protect the more fragile spring 440 from being struck, deformed, or damaged by contact with other components of the reactor.

[0041] In various examples, the sealing device 400 may further comprise a second base ring 460. The second base ring 460 may be located on the opposite side of the base ring 420, with the spring 440 extending between them. The second base ring 460 may extend radially from a radial inner surface 466 that can at least partially align with the inner diameter 421 (and / or the radial inner surface 426 of the base ring 420). The second base ring 460 may include a height extending between the top surface 464 and the bottom surface 463. The top surface 464 may be in contact with and / or abut against the downward surface of the spacer plate (for example, in response to the movement of the susceptor toward an elevated position, which can compress the spring 440). The radial inner surface 466 of the second base ring 460 may be located in close proximity to and / or abut against the outer surface of the susceptor or flow control ring.

[0042] In various examples, the sealing device may not include a second base ring 460. Thus, the end bellows plate 444 (or its inner flat end 456) may be positioned to contact and / or abut against the downward surface of the spacer plate (for example, in response to the movement of the susceptor toward an upward position, which can compress the spring 440). The inner flat end 456 of the end bellows plate 444 provides a larger contact surface area and therefore can facilitate a better seal (e.g., a substantial seal) with the spacer plate, in contrast to a smaller contact point between them.

[0043] Further reference to Figures 5A and 5B illustrates additional examples of sealing devices. The sealing devices 500A and 500B shown in Figures 5A and 5B, respectively, may have components similar to the sealing device 400 in Figure 4. Thus, the consideration of the sealing device 400 and its components may be applied to the sealing devices 500A and 500B and their corresponding components as needed. The base ring 520 (another example of the base ring 420) may extend radially between the radially inner surface 526 and the radially outer surface 528, and may include a height extending between the top surface 524 and the bottom surface 523. The bottom surface 523 may be positioned in contact with the upward surface of the susceptor or flow control ring. The radially inner surface 526 of the base ring 520 may be positioned in close proximity to and / or in contact with the outer surface of the susceptor or flow control ring. The radially inner surface 526 of the base ring 520 can at least partially define the base inner diameter 521 of the sealing device 500A.

[0044] In various examples, the base ring 520 may have a chamfered surface 525 extending between the bottom surface 523 and the radially inner surface 526. The chamfered surface 525 may be angled between the bottom surface 523 and the radially inner surface 526 (i.e., an angled bridge). The chamfered surface 525 may be positioned at any preferred angle. For example, the chamfered surface 525 may be positioned at an angle of about 45 degrees with respect to the plane and / or about 135 degrees with respect to the bottom surface 523, with respect to the plane. The chamfered surface 525 may be positioned at an angle of about 45 degrees with respect to the plane and / or about 135 degrees with respect to the radially inner surface 526, with respect to the plane (in this description, the term “about” means ±20 degrees or ±30 degrees). The chamfered surface 525 may be configured to provide a gentler surface that can contact the susceptor or flow control ring (for example, rather than a sharper corner between the bottom surface 523 and the radially inner surface 526 which could cause scraping, chipping, or other damage to the susceptor or flow control ring). Thus, referring to Figure 3, if the seal device 200 (an example of the seal device 500A) is positioned (removably) between the flow control ring 390 and the spacer plate 370, the base ring 220 may be positioned such that the bottom surface 223 of the base ring 220 contacts the upward surface 394 of the flow control ring 390, and the chamfered surface 225 and / or radially inner surface 226 of the base ring 220 can move or slide along the upward surface 394 of the flow control ring 390 until they contact the ring chamfered surface 395 and / or outer surface 393 of the flow control ring 390, respectively.

[0045] The sealing devices 500A and 500B may include a spring (similar to the spring 440 of the sealing device 400) comprising a plurality of bellows plates 550 (similar to the bellows plate 450). The sealing device 500A may include a spring 540A, and the sealing device 500B may include a spring 540B. The spring 540A may extend between the first bellows plate 542 and the end bellows plate 544A (e.g., in the direction of compression or extension of the spring 540). The first bellows plate 542 may be coupled to the base ring 520. The end bellows plate 544A may be coupled to and / or engage with the spacer plate (i.e., positioned in contact with it) (e.g., in response to the susceptor translating upward to cause contact between the sealing device 500A and the spacer plate and / or compression of the spring 540A) to form a substantial seal between them. Springs 540A and 540B may have an inner spring diameter 541. The inner spring diameter 541 may be located radially outward of the base inner diameter 521 of the base ring 520, separated, for example, by a radial gap 533.

[0046] Each bellows plate 550 may extend between its inner end 552 and outer end 554, and between the base inner diameter 521 and base outer diameter 529 of the base ring 420. The inner end 552 and / or outer end 554 of each bellows plate 550 may be provided with a flat end (e.g., an inner flat end 556 or an outer flat end 557), which can facilitate coupling to other bellows plates (or their respective flat ends(s)) and / or the base ring, and / or facilitate engagement with a spacer plate to form a substantial seal with it.

[0047] In various examples, the base ring 520 may have a coupling projection 530 projecting from the upper surface 524. The coupling projection 530 may extend from the base ring 520 in the direction of compression or extension of the spring 540. The first bellows plate 542 can be coupled to the coupling projection 530 (e.g., the top or apex of the coupling projection 530). The coupling projection 530 may have a coupling surface 534 to which the first bellows plate 542 can be coupled. The coupling surface 534 may be at least partially flattened to facilitate coupling with the flat end of the inner end 552 of the first bellows plate 542. That is, the coupling surface 534 may have a complementary surface (including complementary shape, dimensions, texture, and / or similar) to the surface of the inner end 552 of the first bellows plate 542, which can facilitate coupling between them. The first bellows plate 542 can be (fixed and) coupled to the coupling projection 530 by any preferred manner, such as welding, adhesive, mechanical coupling, fasteners, and / or similar. The coupling projection 530 may be positioned on an upper surface 524 that is closer to the base inner diameter 521 than to the base outer diameter 529. The coupling projection 530 may be positioned on an upper surface 524 radially inward from the base inner diameter 521 and separated from the base inner diameter 521 by a radial gap 533.

[0048] The surface between the radial gap 533 and the radial inner surface 526 of the base ring 520 may include an angled surface 527. The angled surface 527 may include an angle similar to that of the chamfered surface 525. The angled surface 527 may be configured to provide a gentler surface that can contact the susceptor or flow control ring (rather than a sharper corner between the radial gap 533 and the radial inner surface 526, which could cause scraping, chipping, or other damage to the susceptor or flow control ring, for example).

[0049] The coupling projection 530 may have a substantially flat or vertical radial inner surface ("substantially" means within ±20 degrees from flat or vertical). The coupling projection 530 may have an inclined or angled radially outward surface that tapers downward toward the upper surface 524 of the base ring 520 in a radially outward direction. The tapered radially outward surface of the coupling projection 530 may allow access to the joint between the coupling projection 530 and the first bellows plate 542 (for example, to allow tools for joining, unjoining, or maintaining the components). The radially inner surface of the coupling projection 530 may include an access recess 532 recessed therein. The access recess 532 may be recessed in the radially inner surface of the coupling projection 530 adjacent to the joint surface 534 to allow access to the joint between the coupling projection 530 and the first bellows plate 542 (for example, to allow tools for joining, unjoining, or maintaining the components).

[0050] Referring further to Figure 5B, the spring 540B may extend between the first bellows plate 542 and the end bellows plate 544B (for example, in the direction of compression or extension of the spring 540B). The end bellows plate 544B may be coupled to the second base ring 560 in the same or similar manner as the first bellows plate 542 is coupled to the base ring 520. Thus, the spring 540B (and the bellows plate 550 contained therein) may extend between the base ring 520 and the second base ring 560.

[0051] The second base ring 560 (an example of the second base ring 460) may have the same or similar structure as the base ring 520 (for example, it may be a mirror image of the base ring 520). The second base ring 560 may extend radially between the radially inner surface 566 and the radially outer surface 568, and may include a height extending between the top surface 563 and the bottom surface 564. The top surface 563 may be positioned in contact with the downward surface of the spacer plate as the susceptor moves upward and / or the spring 540B is compressed. Thus, the second base ring 560 can contact the spacer plate and create a substantial seal with it. The radially inner surface 566 of the second base ring 560 may be positioned in close proximity to and / or in contact with the outer surface of the susceptor or flow control ring. The radially inner surface 566 of the second base ring 560 can at least partially define the base inner diameter 521 of the sealing device 500B.

[0052] In various examples, the second base ring 560 may have a chamfered surface 565 extending between the top surface 563 and the radially inner surface 566. The chamfered surface 565 may be angled (i.e., an angled bridge) between the top surface 563 and the radially inner surface 566. The chamfered surface 565 may be positioned at any suitable angle, such as approximately 45 degrees with respect to the plane and / or approximately 135 degrees with respect to the top surface 563, where the top surface 563 extends along that plane. The chamfered surface 525 may be positioned at approximately 45 degrees with respect to the plane and / or approximately 135 degrees with respect to the radially inner surface 566, where the radially inner surface 566 extends along that plane (in this context, the term “approximately” means ±20 or 30 degrees). The chamfered surface 565 may be configured to provide a gentler surface that can contact the susceptor or flow control ring (rather than the sharper corner between the top surface 563 and the radially inner surface 566, which could cause scraping, chipping, or other damage to the susceptor or flow control ring, for example).

[0053] In various examples, the second base ring 560 may have a coupling projection 570 projecting from the bottom surface 564. The coupling projection 570 may extend from the second base ring 560 in the direction of compression or extension of the spring 540. The end bellows plate 544B can be coupled to the coupling projection 570 (for example, at the top or apex of the coupling projection 570). The coupling projection 570 may have a coupling surface 574 to which the end bellows plate 544B can be coupled. The coupling surface 574 may be at least partially flat to facilitate coupling with the flat end of the inner end 552 of the end bellows plate 544B. That is, the coupling surface 574 may have a surface (including complementary shape, dimensions, texture, and / or similar) to the surface of the inner end 552 of the end bellows plate 544B in order to facilitate coupling between them. The end bellows plate 544B can be fixedly coupled to the coupling projection 570 by any preferred method, such as welding, adhesive, mechanical coupling, fasteners, and / or similar. The coupling projection 570 may be positioned on the bottom surface 564, which is closer to the base inner diameter 521 than to the base outer diameter 529. The coupling projection 570 may also be positioned radially inward from the base inner diameter 521 on the bottom surface 564 and separated from the base inner diameter 521 by a radial gap 573.

[0054] The surface between the radial gap 573 and the radial inner surface 566 of the second base ring 560 may include an angled surface 567. The angled surface 567 may include an angle similar to that of the chamfered surface 525. The angled surface 567 may be configured to provide a gentler surface that can contact the susceptor or flow control ring (rather than a sharper corner between the radial gap 573 and the radial inner surface 566, which could cause scraping, chipping, or other damage to the susceptor or flow control ring, for example).

[0055] The coupling projection 570 may have a substantially flat or vertical radial inner surface (where “substantially” means within ±20 degrees from flat or vertical). The coupling projection 570 may have an inclined or angled radially outward surface that tapers upward toward the upper surface 563 of the second base ring 560 in a radially outward direction. The tapered radially outward surface may allow access to the joint between the coupling projection 570 and the end bellows plate 544B (for example, to allow tools for joining, unjoining, or maintaining the components). The radially inner surface of the coupling projection 570 may include an access recess 572 recessed therein. The access recess 572 may be recessed in the radially inner surface of the coupling projection 570 adjacent to the joint surface 574 to allow access to the joint between the coupling projection 570 and the end bellows plate 544B (for example, to allow tools for joining, unjoining, or maintaining the components).

[0056] Referring to Figure 3, a reactor 300 is illustrated having a susceptor 330, a flow control ring 390, a spacer plate 370, and / or a sealing device 200. The sealing device 200 is an example of sealing devices 500A, 500B, and / or sealing device 400, and therefore the description of sealing devices 400 and / or 500A, 500B, and their components, may be applied to the sealing device 200 and its components as needed. The sealing device comprises a base ring 220 (similar to base rings 420, 520) and a spring 240 (similar to springs 440 and / or springs 540A, 540B) coupled to the base ring 220. The base ring 220 may extend radially between a radially inner surface 226 and a radially outer surface 228 (the radial direction is along the y-axis) and may include a height extending between a top surface 224 and a bottom surface 223. The bottom surface 223 may be positioned in contact with the upward surface 394 of the flow control ring 390. The radially inner surface 226 of the base ring 220 may be positioned in close proximity to and / or in contact with the outer surface 393 of the flow control ring 390.

[0057] The base ring 220 may have a chamfered surface 225 (similar to chamfered surface 525) extending between the bottom surface 223 and the radially inner surface 226. The chamfered surface 225 may be angled between the bottom surface 223 and the radially inner surface 226 (i.e., an angled bridge). The chamfered surface 225 may be positioned at an angle of about 45 degrees with respect to the plane and / or about 135 degrees with respect to the bottom surface 223, where the bottom surface 223 extends along that plane. The chamfered surface 225 may be positioned at an angle of about 45 degrees with respect to the plane and / or about 135 degrees with respect to the radially inner surface 226, where the radially inner surface 226 extends along that plane (in this description, the term “about” means ±20 degrees or ±30 degrees). The chamfered surface 225 may be configured to provide a gentler surface that can contact the susceptor or flow control ring (rather than the sharper corner between the bottom surface 223 and the radially inner surface 226, which could cause scraping, chipping, or other damage to the susceptor or flow control ring, for example).

[0058] The flow control ring 390 may have a ring chamfered surface 395 extending between the outer surface 393 and the upward surface 394 of the flow control ring 390. The ring chamfered surface 395 may be complementary to the chamfered surface 225 of the base ring 220 (e.g., in dimensions, texture, and / or any other suitable properties) and may include an angle complementary to the angle of the chamfered surface 225 of the base ring 220. The complementary nature of the ring chamfered surface 395 of the flow control ring 390 and the chamfered surface 225 of the base ring 220 can facilitate the placement of the chamfered surface 225 of the base ring 220 in close proximity to and / or in contact with the ring chamfered surface 395 of the flow control ring 390, resulting in the two surfaces and their surrounding angles mate and fit together. In other words, the angle formed by the ring chamfered surface 395 and the upward surface 394 of the flow control ring 390 can match the angle formed by the bottom surface 223 and the chamfered surface 225 of the base ring 220, and the angle formed by the ring chamfered surface 395 and the outer surface 393 of the flow control ring 390 can match the angle formed by the radially inner surface 226 and the chamfered surface 225 of the base ring 220.

[0059] As shown in Figure 3, and as discussed in relation to the sealing devices disclosed herein, the inner diameter of the base ring 220 is smaller than the inner diameter of the spring 240. Therefore, the inner diameter of the base ring 220 is in contact with the flow control ring 390, preventing contact between the flow control ring 390 and the spring 240 (for example, to reduce the risk of damage to the spring 240).

[0060] In various examples, the sealing device and its components (e.g., base rings and / or springs) may include a shape that surrounds the susceptor within the reaction chamber. For example, the sealing device 200 in Figure 3 (including the base ring 220 and spring 240) may extend all around the susceptor 330. In various examples, the springs may be positioned at one or more points around the susceptor so that forces on the susceptor that create a seal within the reaction chamber may be generated at multiple points around the susceptor.

[0061] During operation, the susceptor 330 within the reactor 300 can be translated along the x-axis from a lower position to an elevated position. In various examples, the susceptor 330 does not need to be in contact with the flow control ring 390 in the lower position. In various examples, the flow control ring 390 and / or the seal device 200 can be translated in parallel with the susceptor 330. When the susceptor 330 is translated upward and comes into contact with / engages with the flow control ring 390 (and / or an upward force is applied), the spring 240 of the seal device 200 can be compressed between the flow control ring 390 and the spacer plate 370 from a relaxed or extended position to a compressed position. The spring 240 can be biased toward an uncompressed (extended) or less compressed position. The spacer plate 370, and / or the portion of the spacer plate 370 protruding from the chamber sidewall, may be substantially stationary (i.e., the spacer plate 370 and its portion do not move in response to the force from the spring 240). In response to the compression of the spring 240, the spring 240 may exert an upward force on the downward surface 374 of the spacer plate 370 and / or a downward force on the upward surface 394 of the flow control ring 390. As shown in Figure 3, the downward force from the spring 240 generates a downward force from the base ring 220 to the upward surface 394 of the flow control ring 390. In response, the flow control ring 390 may exert a downward force on the upward surface 337 of the susceptor 330. In various examples, the upward surface of the susceptor that receives downward forces from the spring and / or the flow control ring may be located on the substrate support surface of the susceptor. A substantial seal can be formed between the flow control ring 390 and the susceptor 330 by the downward force of the flow control ring 390 on the susceptor 330. A substantial seal can be formed between the flow control ring 390 and the sealing device by the downward force of the flow control ring 390 on the upward surface 394 (e.g., via the base ring 220 and its bottom surface 223). A substantial seal can be formed between the spacer plate 370 and the sealing device and / or its spring 240 by the upward force of the spacer plate 370 on the downward surface 374.In an example where the sealing device comprises a second base ring (e.g., second base rings 460 and / or 560) coupled to a spring (e.g., the other end of spring 240 opposite to base ring 220), an upward force from the upper surface of the second base ring onto the downward surface 374 of the spacer plate 370 can form a substantial seal between the spacer plate 370 and the sealing device (e.g., via the second base ring and its upper surface). Thus, the reaction space 312 and the lower chamber space 314 may be substantially fluidly separated.

[0062] As the susceptor 330 moves in parallel from an elevated position to another lower position, the spring 240 can be stretched, thereby reducing the force between the aforementioned components. Accordingly, the reaction space 312 and the lower chamber space 314 can be in fluid communication.

[0063] In various examples, the components of the sealing device may be made from and / or include any suitable material. The spring and its components may include metals (e.g., elemental metals) or metal alloys such as stainless steel, nickel, nickel alloys, Hastelloy®, and / or similar materials. The base ring may include metals (e.g., elemental metals) or metal alloys such as stainless steel, nickel, nickel alloys, Hastelloy®, and / or similar materials. In various examples, the spring and the base ring may include and / or be made from the same material.

[0064] The base ring of a sealing device may have a substantially greater weight and / or mass than the spring of the sealing device. For example, the base ring may have a mass at least 3 to 5 times greater than the mass of the spring, at least 2 or 3 or 5 times greater, or about 3 or 5 times greater (in this description, "about" means within 10% or 20% of the respective values). The spring may have a mass of 150 to 200 grams or about 180 grams, while the base ring may have a mass of 800 to 1000 grams or about 880 or 900 grams (in this description, "about" means ±50 grams).

[0065] A sealing device having one or more base rings may be configured to protect the spring coupled thereto from damage. The base rings may be relatively large relative to the spring and / or include solid block material, and the base rings may be configured to contact components of the sealing system and / or reactor system. Contact between the base rings and components of the sealing system and / or reactor system may be configured to prevent contact between the spring and such components of the sealing system and / or reactor system, thereby reducing the risk of damage to the spring due to such contact (the spring may be more fragile than the base ring). Relatively large base rings also facilitate handling of the sealing device because the user can grasp the base ring, not the spring, without worrying about damaging, warping, and / or bending the spring, or unintentionally modifying the sealing device in this way, so that the spring does not cease to function properly to produce the desired substantial seal. Thus, the sealing device may be removed and / or replaced between the spacer plate and the flow control ring, and / or between the spacer plate and the susceptor.

[0066] Furthermore, the substantially flat surface provided by the base ring of the sealing device can facilitate greater contact between the sealing device and the components in contact with it. Similarly, the flat ends of the spring bellows plates within the sealing device can facilitate greater contact between the bellows plates themselves, between the bellows plates and the base ring, and / or between the bellows plates and the spacer plates. Thus, as mentioned above, greater contact (e.g., through a larger contact surface area provided by the flat surfaces of the various components) can result in greater sealing capability to achieve the desired substantial seal.

[0067] The examples of this disclosure described above are merely illustrative and do not limit the scope of the claimed subject matter. The present invention is defined by the appended claims and their legal equivalents. Embodiments of any equivalent are intended to fall within the scope of this disclosure. In fact, various modifications of this disclosure, in addition to those shown and described herein, such as alternative useful combinations of the described elements, may be apparent to those skilled in the art from the description. Such modifications and embodiments are also intended to fall within the scope of the appended claims.

Claims

1. The reaction chamber volume enclosed within the reaction chamber, A susceptor configured to move parallel up and down along an axis within the reaction chamber, The reaction space above the susceptor within the reaction chamber volume, The lower chamber space below the susceptor within the reaction chamber volume, The system comprises a sealing system that substantially fluidly separates the reaction space and the lower chamber space, The sealing system is A spacer plate surrounding the susceptor, The system comprises a seal device coupled to the susceptor and the spacer plate, The sealing device, A base ring coupled to the susceptor, The spring to which the base ring is attached is provided, A reactor in which the spring has a spring bias towards a compressed or extended position, and as a result the spring bias promotes the formation of a substantial seal between the spacer plate and the susceptor, resulting in a substantial fluid separation between the reaction space and the lower chamber space as the susceptor moves up and down within the reaction chamber.

2. The reactor according to claim 1, wherein the sealing system further comprises a flow control ring disposed around the susceptor and between the susceptor and the spacer plate, wherein the sealing device is positioned between the flow control ring and the spacer plate such that the sealing device is coupled to the susceptor via the flow control ring, and the substantial seal between the spacer plate and the susceptor is facilitated by the spring bias between the flow control ring and the spacer plate.

3. The reactor according to claim 2, wherein the sealing device is disposed between the upward surface of the flow control ring and the downward surface of the spacer plate.

4. The reactor according to claim 3, wherein the spring is biased toward the extended position such that a downward force from the spring is applied to the flow control ring, and a downward force is generated on the susceptor such that a substantial seal is formed between the flow control ring and the susceptor, thereby forming the substantial fluid separation between the reaction space and the lower chamber space.

5. The reactor according to claim 3, wherein the spring is fixedly connected to the base ring.

6. The reactor according to claim 5, wherein the sealing device surrounds the susceptor, and the spring comprises a plurality of bellows plates including a first bellows plate and an end bellows plate, each bellows plate extending between the flow control ring and the spacer plate.

7. The reactor according to claim 6, wherein the base ring has an inner diameter of the base that is closest to the susceptor, the spring has an inner diameter of the spring that is closest to the susceptor, and the inner diameter of the base is closer to the susceptor than the inner diameter of the spring.

8. The reactor according to claim 7, wherein the base ring comprises a bottom surface that is in contact with the upward surface of the flow control ring and a radially inner surface that is in contact with the outer surface of the flow control ring, and the base ring further comprises a chamfered surface extending between the bottom surface and the radially inner surface of the base ring.

9. The reactor according to claim 8, wherein the flow control ring further comprises a ring chamfered surface that is complementary to the chamfered surface of the base ring and extends between the upward surface and the outer surface.

10. The reactor according to claim 6, wherein the base ring comprises an upper surface and a connecting projection that protrudes upward from the upper surface, and the first bellows plate among the plurality of bellows plates is connected to the connecting projection.

11. The reactor according to claim 10, wherein the first bellows plate has a flat end face connected to the connecting projection.

12. The reactor according to claim 11, wherein the base ring has an inner diameter closest to the susceptor, and the coupling projection is positioned close to the inner diameter of the base.

13. The reactor according to claim 11, wherein the end bellows plate is coupled to or positioned in contact with the spacer plate.

14. The reactor according to claim 11, further comprising a second base ring coupled to the end bellows plate such that the spring extends between the base ring and the second base ring.

15. The reactor according to claim 14, wherein the second base ring contacts the spacer plate to create a seal between the second base ring and the spacer plate.

16. The reactor according to claim 1, wherein the base ring has a mass at least three times the mass of the spring.

17. A sealing device for reactors, Base ring and, A spring fixedly connected to the base ring and extending from the base ring, comprising a plurality of bellows plates extending between a first bellows plate and an end bellows plate, A sealing device in which the base ring has a base inner diameter, the spring has a spring inner diameter, and the base inner diameter is radially inward of the spring inner diameter.

18. The sealing device according to claim 17, wherein the base ring comprises a bottom surface, a radially inner surface, and a chamfered surface extending between the bottom surface and the radially inner surface of the base ring.

19. The sealing device according to claim 17, wherein the base ring comprises an upper surface and a coupling projection protruding from the upper surface, and the first bellows plate among the plurality of bellows plates comprises a flat end face that is coupled to the coupling projection.

20. A spacer plate configured to surround the susceptor, A flow control ring is configured to surround the susceptor and to be positioned between the spacer plate and the susceptor. A sealing device, Base ring and, A sealing device comprising: a spring fixedly coupled to the base ring and extending from the base ring, wherein the spring comprises a plurality of bellows plates including a first bellows plate and an end bellows plate, and the base ring and the spring extend between the upward surface of the flow control ring and the downward surface of the spacer plate; The spring is configured to create a substantial seal between the flow control ring and the spacer plate, and has a spring bias toward the extended position, in a sealing system for a reactor.

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