Compression molding machine

Abstract

The present invention provides a compression molding apparatus that can prevent molding defects caused by uneven spraying, residual gas, and dust generation during molding, and can also prevent the formation of thin burrs of the sealing resin on exposed parts of the molded product. [Solution] The workpiece W has a configuration in which an electronic component Wb is mounted on a base material Wa, and the sealing resin R is formed in a grid shape with through holes Rh. The first mold 204 has a movable piece 236 that is positioned inside the cavity 208 at a location corresponding to the through holes Rh of the sealing resin R and is movable up and down. The second mold 206 has a workpiece holding part 205 that holds the workpiece W, and when the sealing mold 202 is closed, the movable piece 236 enters the through holes Rh and contacts the upper surface Wbf of the electronic component Wb. A transport device is provided to transport the workpiece W and the sealing resin R into the sealing mold 202, and the through holes Rh have the same shape as the electronic component Wb.

Description

TECHNICAL FIELD

[0001] The present invention relates to a compression molding apparatus. BACKGROUND ART

[0002] As an example of a resin encapsulation apparatus and a resin encapsulation method for processing a workpiece having an electronic component mounted on a base material into a molded product by encapsulating the workpiece with an encapsulating resin, a compression molding type is known.

[0003] The compression molding method is a technique for performing resin encapsulation by supplying a predetermined amount of encapsulating resin to an encapsulation region (cavity) provided in an encapsulation mold configured with an upper mold and a lower mold, arranging a workpiece in the encapsulation region, and performing clamping with the upper mold and the lower mold. As an example, when an encapsulation mold having a cavity in an upper mold is used, a technique of collectively supplying an encapsulating resin to the center position on a workpiece to perform molding is known. On the other hand, when an encapsulation mold having a cavity in a lower mold is used, a technique of supplying a release film (hereinafter sometimes simply referred to as "film") covering the mold surface including the cavity and an encapsulating resin to perform molding is known (see Patent Document 1: International Publication No. WO2015 / 159743). PRIOR ART DOCUMENTS PATENT DOCUMENTS

[0004] PATENT DOCUMENT 1 International Publication No. WO2015 / 159743 SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION

[0005] Conventionally, there is also an idea that the method is superior from the viewpoint of preventing deformation of a workpiece caused by flow or contact of an encapsulating resin, and a compression molding method in which a workpiece is held in an upper mold, a cavity is provided in a lower mold, and an encapsulating resin (as an example, a granular resin) is supplied into the cavity has been widely adopted.

[0006] However, in a configuration where the workpiece is held in the upper mold and a cavity is provided in the lower mold, there was a problem that when the workpiece was thin or large, it was difficult to hold it in the upper mold and it was prone to falling. In addition, when granular resin was used as the sealing resin, there was a problem that dust was generated during molding due to friction between the resin particles, and handling was difficult. Furthermore, it was difficult to supply (spread) the sealing resin evenly to the entire area of ​​the cavity provided in the lower mold, which was prone to uneven distribution. In addition, there was a problem that when the sealing resin was spread, air contained in the gaps between the particles and gaseous components due to degassing from the sealing resin during melting could not be removed and remained in the molded product as voids, which was prone to molding defects.

[0007] On the other hand, regardless of the cavity arrangement, when forming molded products in which electronic components such as heat sinks or flip-chip connected chips are exposed, a thin burr of the sealing resin tends to form on the exposed parts of the molded product (specifically, the top surface of the electronic components), resulting in incomplete exposure. [Means for solving the problem]

[0008] The present invention has been made in view of the above circumstances and aims to provide a compression molding apparatus that can prevent the occurrence of molding defects caused by uneven spraying, residual gas, and dust generation during molding, and can also prevent the formation of thin burrs of the sealing resin on exposed parts of the molded product.

[0009] The present invention solves the above problem by a solution described below as one embodiment.

[0010] A compression molding apparatus according to one embodiment is a compression molding apparatus that processes a workpiece into a molded product by sealing it with a sealing resin using a sealing mold comprising a first mold and a second mold, one of which is an upper mold and the other is a lower mold, wherein the workpiece has a configuration in which an electronic component is mounted on a base material, and the sealing resin is formed in a grid shape having through holes, the first mold has a cavity configured as a recess with a cavity piece forming the bottom, and a movable piece disposed inside the cavity at a position corresponding to the through holes in the sealing resin and movable up and down, the second mold has a workpiece holding part that holds the workpiece, and when the sealing mold is closed, the movable piece enters the through holes and contacts the upper surface of the electronic component, and the apparatus is equipped with a transport device that transports the workpiece and the sealing resin into the sealing mold, and the through holes are required to have the same shape as the electronic component.

[0011] Furthermore, it is preferable that the transport device arranges the workpiece and the sealing resin in the sealing mold in a manner that aligns them relative to each other so that the electronic components are housed in the through-holes.

[0012] Furthermore, the sealing resin is preferably a solid resin formed by compressing powder resin into tablets, or a sheet-like resin. [Effects of the Invention]

[0013] The compression molding apparatus according to the present invention makes it possible to prevent molding defects caused by uneven spraying, residual gas, and dust generation during molding, and also prevents the formation of thin burrs of the sealing resin on exposed parts of the molded product. [Brief explanation of the drawing]

[0014] [Figure 1] This is a plan view showing an example of a compression molding apparatus according to an embodiment of the present invention. [Figure 2] This is a side view showing an example of a press apparatus for a compression molding apparatus according to the first embodiment of the present invention. [Figure 3]FIG. 1 is a front cross-sectional view showing an example of a sealing mold of a compression molding apparatus according to a first embodiment of the present invention. [Figure 4] FIG. 2 is an explanatory view illustrating an example of a compression molding method performed by a compression molding apparatus provided with the press apparatus shown in FIG. 2 and the sealing mold shown in FIG. 3. [Figure 5] FIG. 4 is an explanatory view continuing from FIG. 4. [Figure 6] FIG. 5 is an explanatory view continuing from FIG. 5. [Figure 7] FIG. 6 is an explanatory view continuing from FIG. 6. [Figure 8] FIG. 7 is an explanatory view continuing from FIG. 7. [Figure 9] FIG. 8 is an explanatory view continuing from FIG. 8. [Figure 10] FIG. 9 is a front cross-sectional view showing another example of the sealing mold of the compression molding apparatus according to the first embodiment of the present invention. [Figure 11] FIG. 10 is an explanatory view illustrating an example of a compression molding method performed by a compression molding apparatus provided with the press apparatus shown in FIG. 2 and the sealing mold shown in FIG. 10. [Figure 12] FIG. 11 is an explanatory view continuing from FIG. 11. [Figure 13] FIG. 12 is an explanatory view continuing from FIG. 12. [Figure 14] FIG. 13 is an explanatory view continuing from FIG. 13. [Figure 15] FIG. 14 is a side view showing an example of a press apparatus of a compression molding apparatus according to a second embodiment of the present invention. [Figure 16] FIG. 15 is a front cross-sectional view showing an example of a sealing mold of a compression molding apparatus according to the second embodiment of the present invention. [Figure 17] FIG. 16 is an explanatory view illustrating an example of a compression molding method performed by a compression molding apparatus provided with the press apparatus shown in FIG. 15 and the sealing mold shown in FIG. 16. [Figure 18] FIG. 17 is an explanatory view continuing from FIG. 17. [Figure 19] FIG. 18 is an explanatory view continuing from FIG. 18. [Figure 20] FIG. 19 is an explanatory view continuing from FIG. 19. [Figure 21] FIG. 20 is an explanatory view continuing from FIG. 20. [Figure 22] FIG. 21 is an explanatory view continuing from FIG. 21. [Figure 23] This is a front cross-sectional view showing another example of a sealing die for a compression molding apparatus according to a second embodiment of the present invention. [Figure 24] This is an explanatory diagram illustrating an example of a compression molding method using a compression molding apparatus equipped with a press device as shown in Figure 15 and a sealing die as shown in Figure 23. [Figure 25] This is an explanatory diagram following Figure 24. [Figure 26] This is an explanatory diagram following Figure 25. [Figure 27] This is an explanatory diagram following Figure 26. [Figure 28] A perspective view showing an example of a workpiece to be molded using a compression molding apparatus and compression molding method according to an embodiment of the present invention. [Figure 29] This is a perspective view showing an example of a sealing resin used in a compression molding apparatus and compression molding method according to an embodiment of the present invention. [Figure 30] Figure 29 is a perspective view showing an example of a molded product that has been compression-molded using the sealing resin shown. [Figure 31] This is a perspective view showing another example of a sealing resin used in a compression molding apparatus and compression molding method according to an embodiment of the present invention. [Figure 32] Figure 31 is a perspective view showing an example of a molded product that has been compression molded using the sealing resin shown. [Modes for carrying out the invention]

[0015] [First Embodiment] The compression molding apparatus 1 according to this embodiment is a device that performs resin sealing (compression molding) of a workpiece (molded product) W using a sealing mold 202 equipped with a first mold (upper mold in this embodiment) 204 and a second mold (lower mold in this embodiment) 206. Hereinafter, the compression molding apparatus 1 will be described as an example in which the workpiece W is held by a workpiece holding section 205 provided in the lower mold 206, and the cavity 208 (including a part of the mold surface 204a) provided in the upper mold 204 in a corresponding arrangement is covered with a release film F, and the upper mold 204 and lower mold 206 are clamped together to seal the workpiece W with sealing resin R.

[0016] The workpiece W to be molded has a configuration in which electronic components Wb are mounted on a substrate Wa (see Figure 28). More specifically, examples of substrate Wa include plate-shaped members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. Examples of electronic components Wb include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive members, spacers, and coil sheets (however, the workpiece W may consist only of electronic components Wb). Typical shapes of substrate Wa include rectangles (strips), squares, and circles. The number of electronic components Wb mounted on a single substrate Wa can be set to one or more.

[0017] Examples of methods for mounting electronic components Wb on a substrate Wa include flip-chip mounting and wire bonding. Alternatively, in configurations where the substrate (a glass or metal carrier plate) Wa is peeled off the molded product Wp after resin encapsulation, the electronic components Wb can be attached using heat-release adhesive tape or UV-curable resin that hardens upon UV irradiation. In this embodiment, a configuration in which the electronic components Wb are flip-chip connected to the substrate Wa via bumps Wc is described as an example, but the invention is not limited to this. Furthermore, a portion of the substrate Wa can be exposed and resin encapsulation performed, and the electronic components Wb can be mounted on the exposed portion after resin encapsulation.

[0018] A thermosetting resin (for example, an epoxy resin containing a filler, but not limited to this) is used as the sealing resin R. The sealing resin R is formed as a solid resin having a predetermined shape whose overall shape corresponds to the shape of the workpiece W. Usually, one piece constitutes the "whole" amount required for sealing (one batch per workpiece W), but it may also be configured so that several pieces (for example, two or three pieces) constitute the "whole" amount required for sealing.

[0019] The "predetermined shape" described above is a grid-like shape that is roughly plate-shaped and has through holes Rh that penetrate the plate surface of the main body Ra (see Figure 29). Here, "grid-like shape" in this application is exemplified as a matrix shape including a single row, but is not limited to this, and may be a matrix shape with multiple rows and columns, or a random shape, etc. By performing resin encapsulation (compression molding) using the above-described sealing resin R (hereinafter sometimes referred to as "R1"), it is possible to prevent the formation of thin burrs on the upper surface Wbf of the electronic component Wb, and to form a molded product Wp (see Figure 30) in which the upper surface Wbf is reliably exposed (details of the formation method will be described later). The through holes Rh are slightly larger in size than the individual electronic component Wb and need to have the same shape as the electronic component Wb. In addition, the amount (height) of the sealing resin R (R1) needs to be such that the resin can penetrate under the electronic component Wb and encapsulate it without excess or deficiency.

[0020] Furthermore, the term "solid" above does not refer to a completely solid state, but includes a state that has melted to the so-called B stage, or a state just before melting. As the solid sealing resin R, a solid resin formed by tableting powder resin is preferably used. This allows for extremely precise control and supply of the resin amount compared to tablet resins formed using granular resin or crushed resin. However, it is not limited to powder resin; a configuration using granular resin, crushed resin, solid resin, liquid resin, or a combination of several of these resins is also acceptable. In addition, sheet-like resin is also preferably used as the solid sealing resin R. By using a solid sealing resin R, it is possible to solve the problems of dust generation during molding, difficulty in handling, and uneven distribution, compared to conventional granular resins. Furthermore, since the generation of voids can be suppressed, mold underfill of flip-chip connected electronic components Wb can be reliably performed.

[0021] Furthermore, suitable examples of film F include film materials with excellent heat resistance, ease of peeling, flexibility, and stretchability, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidine chloride.

[0022] Next, an overview of the compression molding apparatus 1 according to this embodiment will be described. As shown in Figure 1, the compression molding apparatus 1 mainly comprises a supply unit 10A for supplying workpieces W and sealing resin R, a press unit 10B for processing workpieces W into molded products Wp by resin sealing with the sealing resin R, and a storage unit 10C for storing the molded products Wp. As an example, the supply unit 10A, press unit 10B, and storage unit 10C are arranged in the order shown along the X direction in Figure 1. However, the configuration is not limited to the above, and the equipment configuration within the units, the number of units, the arrangement order of the units, etc. may be changed. For example, the supply unit 10A and the storage unit 10C may be arranged in opposite directions along the X direction, or they may be arranged to be concentrated in one of the positions (not shown). In addition, a configuration with units other than those described above is also possible (not shown).

[0023] Furthermore, the compression molding apparatus 1 has a guide rail 20 provided in a straight line spanning between each unit, and a transport device (first loader) 22 for transporting workpiece W and sealing resin R (may also be used for transporting materials other than workpiece W and sealing resin R), and a transport device (second loader) 24 for transporting molded product Wp (may also be used for transporting materials other than molded product Wp) are provided to move along the guide rail 20 between predetermined units. However, the apparatus is not limited to the above configuration, and may also be configured to include a common (single) transport device (loader) for transporting workpiece W, sealing resin R, and molded product Wp, etc. (not shown). In addition, the transport device may be configured to include a robot hand or the like instead of a loader.

[0024] Furthermore, the compression molding apparatus 1 has a control unit 90 that controls the operation of each mechanism in each unit, located in the supply unit 10A (it may also be configured to have the control unit 90 located in another unit).

[0025] (Supply unit) Next, we will explain in detail the supply unit 10A provided by the compression molding apparatus 1.

[0026] The supply unit 10A includes a work supply magazine 12 in which multiple workpieces W are stored. Here, a known stack magazine, slit magazine, etc., can be used for the work supply magazine 12. The supply unit 10A may also be configured to include a work stage, etc. (not shown) on which the workpieces W removed from the work supply magazine 12 are placed.

[0027] Furthermore, the supply unit 10A includes a resin supply unit 14 for supplying the sealing resin R. Here, a known stack magazine, slit magazine, etc., can be used for the resin supply unit 14. The supply unit 10A may also be configured to include a resin stage, etc. (not shown) on which the sealing resin R taken out from the resin supply unit 14 is placed. The resin supply unit 14 may also be located in the press unit 10B or the storage unit 10C (not shown). Alternatively, as another example, the resin supply unit 14 may be located outside the compression molding apparatus 1 and transported into the apparatus using a conveying device such as a belt conveyor or a robot hand (not shown).

[0028] The workpiece W and the sealing resin R are held by the first loader 22 and transported to the press unit 10B, where they are set in a predetermined position in the sealing mold 202. In this embodiment, the workpiece W is held by the workpiece holding section 205 of the lower mold 206, and the sealing resin R is placed on top of the workpiece W held by the workpiece holding section 205 (details of the process will be described later). The holding mechanism for the workpiece W and sealing resin R in the first loader 22 is a known holding mechanism (for example, a configuration that grips with holding claws, a configuration that adsorbs with suction holes communicating with a suction device, etc.) (not shown).

[0029] As a variation of the above conveying device, instead of the first loader 22 that moves in the X and Y directions, a separate conveying device (loader) that moves in the X direction to convey units between units and a separate conveying device (loader) that moves in the Y direction to load and set units into the sealing mold 202 may be provided (not shown).

[0030] Furthermore, the supply unit 10A is equipped with a preheating heater (not shown) for preheating the workpiece W and the sealing resin R. As an example, a known heating mechanism (e.g., an electric heating wire heater, an infrared heater, etc.) can be used for the preheating heater. This allows the workpiece W and the sealing resin R to be preheated before being loaded into the sealing mold 202. Note that the configuration may be made without a preheating heater. Alternatively, the first loader 22 may be equipped with a preheating heater (not shown) in place of, or together with, the preheating heater.

[0031] (Press Unit) Next, we will explain in detail the press unit 10B provided in the compression molding apparatus 1.

[0032] In this embodiment, the press unit 10B is provided with two units (it may be three or more units or just one unit). The press unit 10B is equipped with a sealing die 202 having a pair of dies that can be opened and closed (for example, a set of multiple die blocks, die plates, die pillars, and other components made of alloy tool steel). The press unit 10B is also equipped with a press device 250 that drives the sealing die 202 to open and close to seal the workpiece W with resin. As an example, the configuration is shown with one press device 250, but it may also be equipped with multiple units (not shown). A side view (schematic diagram) of the press device 250 provided in the press unit 10B is shown in Figure 2, and a front cross-sectional view (schematic diagram) of the sealing die 202 is shown in Figure 3.

[0033] Here, as shown in Figure 2, the press device 250 is configured to include a pair of platens 254 and 256, a plurality of tie bars 252 on which the pair of platens 254 and 256 are mounted, and a drive device for moving (raising and lowering) the platen 256. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 260 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 262 (however, it is not limited to this). In this embodiment, the upper platen 254 in the vertical direction is set as a fixed platen (a platen fixed to the tie bar 252), and the lower platen 256 is set as a movable platen (a platen that is slidably held by the tie bar 252 and moves up and down). However, it is not limited to this, and the top and bottom may be reversed, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper and lower sides may be set as movable platens (none of which are shown).

[0034] On the other hand, as shown in Figure 3, the sealing die 202 comprises a first die (upper die) 204 (204A) and a second die (lower die) 206 as a pair of dies disposed between the pair of platens 254 and 256 in the press device 250. The upper die 204 (204A) is assembled to the upper platen (in this embodiment, the fixed platen 254), and the lower die 206 is assembled to the lower platen (in this embodiment, the movable platen 256). The upper die 204 (204A) and the lower die 206 move closer to and further apart from each other to close and open the dies (the vertical direction (up and down direction) is the direction of die opening and closing).

[0035] Furthermore, in this embodiment, as an example, a film supply mechanism 211 is provided for transporting (supplying) a roll-shaped film F into the sealing mold 202. Depending on the configuration of the workpiece W, the film F may be used in the form of strips instead of a roll.

[0036] Next, the lower mold 206 of the sealing mold 202 will be described in detail. As shown in Figure 3, the lower mold 206 includes a second chase 240 and a second plate 242 held therein.

[0037] Furthermore, in this embodiment, a workpiece holding portion 205 is provided to hold the workpiece W in a predetermined position on the upper surface of the second plate 242. This workpiece holding portion 205, as an example, has a workpiece guide pin (not shown) and a suction passage (hole or groove, etc.) that penetrates the second plate 242 and communicates with a suction device (not shown). Specifically, one end of the suction passage is connected to the mold surface 206a of the lower mold 206, and the other end is connected to a suction device disposed outside the lower mold 206. This makes it possible to drive the suction device to suck the workpiece W from the suction passage and hold the workpiece W by suction to the mold surface 206a (in this case, the upper surface of the second plate 242). Instead of the above suction holding mechanism, or together with the suction holding mechanism, a configuration may be provided with holding claws that grip the outer circumference of the workpiece W (not shown). The shape and number of workpiece holding portions 205 provided in one lower mold 206 are appropriately set according to the shape and number of workpieces W (one or more).

[0038] In this embodiment, a lower mold heating mechanism (not shown) is provided to heat the lower mold 206 to a predetermined temperature. This lower mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control unit 90. As an example, the heater is built into the second chase 240 and is configured to apply heat to the entire lower mold 206 and the workpiece W held in the workpiece holding section 205. The heater heats the lower mold 206 to a predetermined temperature (e.g., 100°C to 300°C).

[0039] Next, the upper mold 204 (204A) of the sealing mold 202 will be described in detail. As shown in Figure 3, the upper mold 204 (204A) comprises a first chase 210 and a cavity piece 226, clamper 228, etc., held by it. The first chase 210 is fixed to the lower surface of the support plate 214 via a support pillar 212. A cavity 208 is provided on the lower surface of the upper mold 204 (204A) (the surface on the lower mold 206 side).

[0040] The clamper 228 is configured in an annular shape to surround the cavity piece 226 and is assembled to move vertically while floating apart from the lower surface of the support plate 214 via a push pin 222 and a clamper spring (for example, a biasing member exemplified by a coil spring) 224 (however, it is not limited to this assembly structure). The cavity piece 226 constitutes the back (bottom) of the cavity 208, and the clamper 228 constitutes the side of the cavity 208. The shape and number of cavities 208 provided in one upper die 204 (204A) are appropriately set according to the shape and number of workpieces W (one or more).

[0041] Here, a movable piece 236 is provided in the cavity piece 226 (inside the cavity 208) at a position corresponding to the through hole Rh of the sealing resin R(R1) held by the workpiece holding portion 205. The movable piece 236 is supported by a movable piece spring 234 via a push pin 232, biased toward the lower mold 206, and is configured to move in the mold opening and closing direction. Furthermore, as an example, the movable piece 236 is set to have an outer diameter that is a predetermined dimension larger than the outer shape of the electronic component Wb in a plan view. That is, when the mold is closed, the movable piece 236 enters the through hole Rh of the sealing resin R(R1) and comes into contact with the entire surface Wbf of the upper surface of the electronic component Wb. This makes it possible to form a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed.

[0042] Furthermore, suction passages (holes, grooves, etc.) communicating with a suction device are provided on the lower surface of the clamper 228 and at the boundary between the clamper 228 and the cavity piece 226 (not shown). This allows the film F supplied from the film supply mechanism 211 to be adsorbed and held on the mold surface 204a, including the inner surface of the cavity 208. In addition, degassing of the cavity 208 can be performed when closing the mold and performing resin sealing.

[0043] Furthermore, in this embodiment, an upper mold heating mechanism (not shown) is provided for heating the upper mold 204 (204A) to a predetermined temperature. This upper mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control unit 90. As an example, the heater is built into the first chase 210 and is configured to apply heat to the entire upper mold 204 (204A) and the sealing resin R contained in the cavity 208. The heater heats the upper mold 204 (204A) to a predetermined temperature (e.g., 100°C to 300°C).

[0044] (Storage unit) Next, we will explain in detail the storage unit 10C provided by the compression molding apparatus 1.

[0045] The molded product Wp is held by the second loader 24 and unloaded from the sealing mold 202, and transported to the storage unit 10C. The second loader 24 uses a known holding mechanism for the molded product Wp (for example, a configuration that grips with holding claws, a configuration that uses suction with suction holes communicating with a suction device, etc.) (not shown).

[0046] As a variation of the above conveying device, instead of the second loader 24 that moves in the X and Y directions, a separate conveying device (loader) that moves in the X direction to convey between units and a separate conveying device (loader) that moves in the Y direction to unload from the sealing mold 202 may be provided (not shown).

[0047] The storage unit 10C includes a storage magazine 18 in which multiple molded products Wp are stored. Here, a known stack magazine, slit magazine, etc., can be used for the storage magazine 18. The storage unit 10C may also be configured to include a molded product stage (not shown) on which the molded products Wp transported from the press unit 10B are placed.

[0048] (Compression molding method) Next, the steps of the compression molding method according to this embodiment, which is carried out using the compression molding apparatus 1 described above, will be explained. Here, Figures 4 to 9 are explanatory diagrams of each step, and are shown as front cross-sectional views in the same direction as Figure 3.

[0049] First, as a preparation step, a heating step (upper mold heating step) is performed in which the upper mold 204 (204A) is heated to a predetermined temperature (for example, 100°C to 300°C) using the upper mold heating mechanism. Next, a heating step (lower mold heating step) is performed in which the lower mold 206 is heated to a predetermined temperature (for example, 100°C to 300°C) using the lower mold heating mechanism. Finally, a film supply step is performed in which a new film F is supplied by operating the film supply mechanism 211 and adsorbed to cover a predetermined area of ​​the mold surface 204a, including the inner surface of the cavity 208 in the upper mold 204 (204A).

[0050] After the preparation process, a workpiece holding process is performed in which the workpiece W is held in the workpiece holding section 205 of the lower mold 206 (see Figure 4). Specifically, the workpiece W supplied from the workpiece supply magazine 12 is held by the first loader 22 and transported into the sealing mold 202, where it is held in the workpiece holding section 205 of the second plate 242 (mold surface 206a).

[0051] After the workpiece holding process, a resin placement process is performed in which the sealing resin R(R1) is placed on the workpiece W held in the workpiece holding section 205 (see Figure 5). Specifically, the sealing resin R(R1) supplied from the resin supply section 14 is held by the first loader 22 (or other transport device) and transported into the sealing mold 202, and placed on the workpiece W held in the workpiece holding section 205. When forming a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed, the workpiece W and the sealing resin R are aligned with each other and placed so that the electronic component Wb is housed in the through hole Rh of the sealing resin R(R1).

[0052] Alternatively, as another example of the resin placement process, it may be carried out as a process of placing the sealing resin R(R1) on the workpiece W before the workpiece holding process described above. In that case, the workpiece holding process becomes a process of holding the workpiece W with the sealing resin R(R1) placed on it in the workpiece holding unit 205. That is, the first loader 22 holds the workpiece W with the sealing resin R(R1) placed on it and loads it into the sealing mold 202, where it is held in the workpiece holding unit 205. In this case, there is an advantage in that the loading of the workpiece W and the sealing resin R(R1) into the sealing mold 202 is done in one step, rather than separately.

[0053] After the resin placement process, a mold closing process is performed in which the workpiece W is sealed with sealing resin R(R1) to process it into a molded product Wp. Specifically, the sealing mold 202 is closed, and the cavity piece 226 is lowered relative to the cavity 208 surrounded by clamper 228, thereby heating and pressurizing the sealing resin R(R1) on the workpiece W.

[0054] More specifically, the upper mold 204 (204A) and the lower mold 206 are brought closer together. At this time, the movable piece 236 enters the through hole Rh in the sealing resin R (R1) and comes into contact with the upper surface Wbf of the electronic component Wb of the workpiece W, covering the entire surface Wbf (see Figure 6). Next, the clamper 228 comes into contact with the base material Wa of the workpiece W via the film F, and clamps the workpiece W (see Figure 7). These steps may be set in the reverse order or simultaneously. Next, the lower surface of the cavity piece 226 (the area where the movable piece 236 is not provided) comes into contact with the sealing resin R (R1) placed on the base material Wa of the workpiece W, and further pressure is applied. As a result, the sealing resin R (R1) heat-cures and the resin sealing (compression molding) is completed (see Figure 8).

[0055] As a subsequent step following the mold closing process described above, the sealing mold 202 is opened to separate the molded product Wp from the used film F and to allow the molded product Wp to be removed (see Figure 9). In this embodiment, as described above, the movable piece 236 covers the entire upper surface Wbf of the electronic component Wb of the workpiece W when resin sealing is performed, so that a thin burr is not formed on the upper surface Wbf of the electronic component Wb, and a molded product Wp is formed in which the entire upper surface Wbf is reliably exposed. As a modification, it is also possible to set a portion of the upper surface Wbf of the electronic component Wb as the exposed area instead of the entire surface (not shown). It is also possible to set a portion of the base material Wa as the exposed area and mount the electronic component Wb on the exposed area after resin sealing (not shown).

[0056] After the mold opening process, the molded product unloading process is performed in which the molded product Wp is unloaded from the sealing mold 202 by the second loader 24 and transported to the storage unit 10C. For example, the transported molded product Wp is stored in the storage magazine 18. After the molded product unloading process, or in parallel therewith, the film supply mechanism 211 is activated to send out the used film F from the sealing mold 202 and feed a new film F into the sealing mold 202 and set it in place.

[0057] The above outlines the main steps of the compression molding method performed using the compression molding apparatus 1 equipped with a sealing mold 202. However, the above order of steps is merely an example, and the order can be changed or the steps performed in parallel as long as there are no obstacles.

[0058] As another example, the workpiece W can also be compression molded using a sealing resin R (hereinafter sometimes referred to as "R2") having a different configuration. Specifically, the sealing resin R(R2) has a lattice structure with through holes Rh, and a heat sink H is fixed to one side, blocking all or part of the through holes Rh (see Figure 31). The heat sink H is, for example, a plate-shaped member formed from a metal material (e.g., copper alloy, aluminum alloy, etc.) with a thickness of about 0.1 mm to several mm, but is not limited to this. By performing resin sealing (compression molding) using the sealing resin R(R2), a molded product Wp (see Figure 32) can be easily formed with the heat sink H exposed on the upper surface (details of the formation method will be described later).

[0059] When forming a molded product Wp in which the heat sink H is exposed using the above-mentioned sealing resin R(R2), instead of the upper mold 204A (see Figure 3) having the aforementioned movable piece 236, an upper mold 204B (see Figure 10) with a general configuration without a movable piece may be used as the upper mold 204. The steps of the compression molding method carried out in this case will be explained with reference to Figures 11 to 14.

[0060] First, as a preparation step, the upper mold heating step, the lower mold heating step, and the film supply step are carried out.

[0061] After the preparation process, a workpiece holding process is performed in which the workpiece W is held in the workpiece holding section 205 of the lower mold 206.

[0062] After the workpiece holding process, a resin placement process is performed in which the sealing resin R(R2) is placed on the workpiece W held in the workpiece holding section 205. Alternatively, as another example of the resin placement process, it may be performed before the workpiece holding process in which the sealing resin R(R2) is placed on the workpiece W. By using the sealing resin R2, it is not necessary to transport the sealing resin R and the heat sink H separately into the sealing mold 202 (i.e., they can be transported in one process as a single component), thus simplifying the process and reducing time.

[0063] After the resin placement process, a mold closing process is performed to seal the workpiece W with sealing resin R(R2) to process it into a molded product Wp. Specifically, the upper mold 204(204B) and the lower mold 206 are brought closer together. At this time, the clamper 228 comes into contact with the base material Wa of the workpiece W via the film F, and the workpiece W is held between the clamper and the clamper (see Figure 11). Next, the lower surface of the cavity piece 226 comes into contact with the upper surface of the heat sink plate H of the sealing resin R(R2) placed on the base material Wa of the workpiece W, and the entire surface of the heat sink plate H is covered (see Figure 12). These actions may be set to occur simultaneously. Next, the lower surface of the heat sink plate H, which is in contact with the cavity piece 226, pressurizes the sealing resin R(R2) placed on the base material Wa of the workpiece W. As a result, the sealing resin R(R2) heat-cures and the resin sealing (compression molding) is completed (see Figure 13). In this example, a sealing resin R2 with a heat sink H as shown in Figure 31 is used, but it is not necessary to use a sealing resin with a heat sink H. In that case, the same molding can be achieved by performing a workpiece holding process, then a resin placement process in which a sealing resin R1 without a heat sink as shown in Figure 29 is placed on the workpiece W, then a heat sink placement process in which the heat sink H is placed on the sealing resin R1, and finally a mold closing process.

[0064] As a subsequent step following the mold closing process described above, the mold opening process is performed to open the sealing mold 202, separating the molded product Wp from the used film F so that the molded product Wp can be removed (see Figure 14). As described above, since resin sealing is performed with the cavity piece 226 covering the entire upper surface of the heat sink H of the sealing resin R (R2), the formation of a thin burr on the upper surface of the heat sink H is prevented, and a molded product Wp is formed with the entire upper surface (see Figure 32) reliably exposed.

[0065] Here, an elastic thermal conductive resin sheet S may be placed between the surface of the electronic component Wb mounted on the workpiece W facing the heat sink H and the surface of the sealing resin R(R2) placed on the workpiece facing the heat sink H of the sealing resin R(R2) placed on the workpiece. This fills the gap between the electronic component Wb and the heat sink H, preventing the upper surface of the electronic component Wb from being sealed with resin. In addition, it is possible to press down on the sealing resin R(R2) via the heat sink H and absorb the clamping force during mold closing, preventing damage to the electronic component Wb. The elastic thermal conductive resin sheet S may be provided on the workpiece W (electronic component Wb) in advance (for example, attached), or an elastic thermal conductive resin sheet supply unit may be provided in the apparatus (for example, in a supply unit 10A) and supplied onto the workpiece W (electronic component Wb) before resin sealing (not shown).

[0066] After the mold opening process, the molded product unloading process is performed in which the molded product Wp is unloaded from the sealing mold 202 by the second loader 24 and transported to the storage unit 10C. Also, after the molded product unloading process, or in parallel therewith, the film supply mechanism 211 is activated to send out the used film F from the sealing mold 202 and feed a new film F into the sealing mold 202 and set it in place.

[0067] [Second Embodiment] Next, a second embodiment of the present invention will be described. The compression molding apparatus 1 and compression molding method according to this embodiment have the same basic configuration as the first embodiment described above, but there are differences in the configuration of the press unit 10B (particularly the configuration of the press device and the sealing mold), and in the process carried out mainly with respect to the press unit 10B. The following description will focus on these differences in this embodiment.

[0068] The press unit 10B according to this embodiment includes a sealing die 302 having a pair of dies that can be opened and closed (for example, a set of multiple die blocks, die plates, die pillars, and other components made of alloy tool steel). The press unit 10B also includes a press device 350 that drives the sealing die 302 to open and close to seal the workpiece W with resin. As an example, the configuration includes one press device 350, but it may also include multiple units (not shown). A side view (schematic diagram) of the press device 350 provided in the press unit 10B is shown in Figure 15, and a front cross-sectional view (schematic diagram) of the sealing die 302 is shown in Figure 16.

[0069] Here, as shown in Figure 16, the press device 350 is configured to include a pair of platens 354 and 356, a plurality of tie bars 352 on which the pair of platens 354 and 356 are mounted, and a drive device for moving (raising and lowering) the platen 356. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 360 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 362 (however, it is not limited to this). In this embodiment, the upper platen 354 in the vertical direction is set as a fixed platen (a platen fixed to the tie bar 352), and the lower platen 356 is set as a movable platen (a platen that is slidably held by the tie bar 352 and moves up and down). However, it is not limited to this, and the top and bottom may be reversed, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper and lower sides may be set as movable platens (none of which are shown).

[0070] On the other hand, as shown in Figure 16, the sealing die 302 comprises a first die (lower die) 306 and a second die (upper die) 304 as a pair of dies arranged between the pair of platens 354 and 356 in the press device 350. The upper die 304 is assembled to the upper platen (in this embodiment, the fixed platen 354), and the lower die 306 is assembled to the lower platen (in this embodiment, the movable platen 356). The upper die 304 and the lower die 306 move closer to and further apart from each other to close and open the dies (the vertical direction (up and down direction) is the direction of die opening and closing).

[0071] Furthermore, in this embodiment, as an example, a film supply mechanism 313 is provided for transporting (supplying) a roll-shaped film F into the sealing mold 302. Depending on the configuration of the workpiece W, the film F may be used in the form of strips instead of a roll.

[0072] Next, the upper mold 304 of the sealing mold 302 will be described in detail. As shown in Figure 16, the upper mold 304 includes a second chase 340 and a second plate 342 held therein.

[0073] In this embodiment, a workpiece holding portion 305 is provided to hold the workpiece W in a predetermined position on the lower surface of the second plate 342. This workpiece holding portion 305, as an example, has a workpiece guide pin (not shown) and a suction passage (hole or groove, etc.) that penetrates the second plate 342 and communicates with a suction device (not shown). Specifically, one end of the suction passage is connected to the mold surface 304a of the upper mold 304, and the other end is connected to a suction device disposed outside the upper mold 304. This makes it possible to drive the suction device to suck the workpiece W from the suction passage and hold the workpiece W by suction to the mold surface 304a (in this case, the lower surface of the second plate 342). Instead of the above suction holding mechanism, or together with the suction holding mechanism, a configuration may be provided with holding claws that grip the outer circumference of the workpiece W (not shown). The shape and number of workpiece holding portions 305 provided on one upper mold 304 are appropriately set according to the shape and number of workpieces W (one or more).

[0074] Furthermore, in this embodiment, an upper mold heating mechanism (not shown) is provided to heat the upper mold 304 to a predetermined temperature. This upper mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control unit 90. As an example, the heater is built into the second chase 340 and is configured to apply heat to the entire upper mold 304 and the workpiece W held in the workpiece holding section 305. The upper mold 304 is heated by this heater to a predetermined temperature (e.g., 100°C to 300°C).

[0075] Next, the lower mold 306 (306A) of the sealing mold 302 will be described in detail. As shown in Figure 16, the lower mold 306 (306A) comprises a first chase 310 and a cavity piece 326, clamper 328, etc., held by it. The first chase 310 is fixed to the lower surface of the support plate 314 via a support pillar 312. A cavity 308 is provided on the upper surface of the lower mold 306 (306A) (the surface on the upper mold 304 side).

[0076] The clamper 328 is configured in an annular shape to surround the cavity piece 326 and is assembled to move vertically while floating apart from the lower surface of the support plate 314 via a push pin 322 and a clamper spring (for example, a biasing member exemplified by a coil spring) 324 (however, it is not limited to this assembly structure). The cavity piece 326 constitutes the back (bottom) of the cavity 308, and the clamper 328 constitutes the side of the cavity 308. The shape and number of cavities 308 provided in one lower die 306 (306A) are appropriately set according to the shape and number of workpieces W (one or more).

[0077] Here, a movable piece 336 is provided in the cavity piece 326 (inside the cavity 308) at a position corresponding to the through hole Rh of the sealing resin R(R1) held by the workpiece holding portion 305. The movable piece 336 is supported by a movable piece spring 334 via a push pin 332, biased toward the upper mold 304, and is configured to move in the mold opening and closing direction. Furthermore, as an example, the movable piece 336 is set to have an outer diameter that is a predetermined dimension larger than the outer shape of the electronic component Wb in a plan view. That is, when the mold is closed, the movable piece 336 enters the through hole Rh of the sealing resin R(R1) and comes into contact with the entire surface Wbf of the upper surface of the electronic component Wb. This makes it possible to form a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed.

[0078] Furthermore, suction passages (holes, grooves, etc.) communicating with a suction device are provided on the upper surface of the clamper 328 and at the boundary between the clamper 328 and the cavity piece 326 (not shown). This allows the film F supplied from the film supply mechanism 313 to be adsorbed and held on the mold surface 306a, including the inner surface of the cavity 308. In addition, degassing of the cavity 308 can be performed when closing the mold and performing resin sealing.

[0079] Furthermore, in this embodiment, a lower mold heating mechanism (not shown) is provided for heating the lower mold 306 (306A) to a predetermined temperature. This lower mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control unit 90. As an example, the heater is built into the first chase 310 and is configured to apply heat to the entire lower mold 306 (306A) and the sealing resin R contained in the cavity 308. The heater heats the lower mold 306 (306A) to a predetermined temperature (e.g., 100°C to 300°C).

[0080] Next, the steps of the compression molding method according to this embodiment, which is carried out using the compression molding apparatus 1 described above, will be explained. Here, Figures 17 to 22 are explanatory diagrams of each step, and are shown as front cross-sectional views in the same direction as Figure 16.

[0081] First, as a preparation step, a heating step (upper mold heating step) is performed in which the upper mold 304 is heated to a predetermined temperature (for example, 100°C to 300°C) using the upper mold heating mechanism. Then, a heating step (lower mold heating step) is performed in which the lower mold 306 (306A) is heated to a predetermined temperature (for example, 100°C to 300°C) using the lower mold heating mechanism. Furthermore, a film supply step is performed in which a new film F is supplied by operating the film supply mechanism 313 and adsorbed so as to cover a predetermined area of ​​the mold surface 306a, including the inner surface of the cavity 308 in the lower mold 306 (306A).

[0082] After the preparation process, a workpiece holding process is performed in which the workpiece W is held in the workpiece holding section 305 of the upper mold 304 (see Figure 17). Specifically, the workpiece W supplied from the workpiece supply magazine 12 is held by the first loader 22 and transported into the sealing mold 302, where it is held in the workpiece holding section 305 of the second plate 342 (mold surface 304a).

[0083] After the workpiece holding process, or in parallel thereafter, a resin placement process is performed in which the sealing resin R(R1) is placed (contained) in the cavity 308 of the lower mold 306 (306A) (see Figure 18). Specifically, the sealing resin R(R1) supplied from the resin supply unit 14 is held by the first loader 22 (or other transport device) and transported into the sealing mold 302, where it is contained in the cavity 308 of the lower mold 306 (306A) (specifically, placed on the upper surface of the cavity piece 326). When forming a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed, the workpiece W and the sealing resin R(R1) are aligned with each other and placed so that the electronic component Wb is contained in the through hole Rh of the sealing resin R(R1).

[0084] After the resin placement process, a mold closing process is performed in which the workpiece W is sealed with sealing resin R (R1) to process it into a molded product Wp. Specifically, the sealing mold 302 is closed, and the cavity piece 326 is lowered relative to the cavity 308 surrounded by clamper 328, thereby heating and pressurizing the sealing resin R against the workpiece W.

[0085] More specifically, the upper mold 304 and the lower mold 306 (306A) are brought closer together. At this time, the movable piece 336 enters the through hole Rh of the sealing resin R(R1) and comes into contact with the upper surface Wbf (downward-facing) of the electronic component Wb of the workpiece W, covering the entire surface Wbf (see Figure 19). Next, the clamper 328 comes into contact with the base material Wa of the workpiece W via the film F, clamping the workpiece W (see Figure 20). These steps may be set in the reverse order or simultaneously. Next, the sealing resin R(R1) is pressed between the upper surface of the cavity piece 326 (the area where the movable piece 336 is not provided) and the base material Wa of the workpiece W. As a result, the sealing resin R(R1) is heat-cured and the resin sealing (compression molding) is completed (see Figure 21).

[0086] As a subsequent step following the mold closing process described above, the sealing mold 302 is opened to separate the molded product Wp from the used film F and to allow the molded product Wp to be removed (see Figure 22). In this embodiment, as described above, the movable piece 336 covers the entire upper surface Wbf of the electronic component Wb of the workpiece W when resin sealing is performed, so that a thin burr is not formed on the upper surface Wbf of the electronic component Wb, and a molded product Wp is formed in which the entire upper surface Wbf is reliably exposed. As a modification, it is also possible to set a portion of the upper surface Wbf of the electronic component Wb as the exposed area instead of the entire surface (not shown). It is also possible to set a portion of the base material Wa as the exposed area and mount the electronic component Wb on the exposed area after resin sealing (not shown).

[0087] After the mold opening process, the molded product unloading process is performed in which the molded product Wp is unloaded from the sealing mold 302 by the second loader 24 and transported to the storage unit 10C. For example, the transported molded product Wp is stored in the storage magazine 18. After the molded product unloading process, or in parallel therewith, the film supply mechanism 313 is activated to send out the used film F from the sealing mold 302 and feed a new film F into the sealing mold 302 and set it in place.

[0088] The above describes the main steps of the compression molding method performed using the compression molding apparatus 1 equipped with a sealing die 302. However, the above order of steps is just one example, and the order can be changed or the steps performed in parallel as long as there are no problems.

[0089] As another example, compression molding of the workpiece W can also be performed using a sealing resin R(R2) having a different configuration. When forming a molded product Wp in which the heat sink H is exposed using sealing resin R(R2), a lower mold 306B (see Figure 23) with a general configuration without a movable piece can be used as the lower mold 306, instead of the lower mold 306A (see Figure 16) having the aforementioned movable piece 336. The steps of the compression molding method carried out in this case will be explained with reference to Figures 24 to 27.

[0090] First, as a preparation step, the upper mold heating step, the lower mold heating step, and the film supply step are carried out.

[0091] After the preparation process, a workpiece holding process is performed in which the workpiece W is held in the workpiece holding section 305 of the upper mold 304.

[0092] After the workpiece holding process, or concurrently therewith, a resin placement process is carried out in which the sealing resin R (R2) is placed (contained) in the cavity 308 of the lower mold 306 (306B). By using the sealing resin R2, it is not necessary to transport the sealing resin R and the heat sink H separately into the sealing mold 302 (i.e., they can be transported in one process as a single component), thus simplifying the process and reducing time.

[0093] After the resin placement process, a mold closing process is performed to seal the workpiece W with sealing resin R(R2) to process it into a molded product Wp. Specifically, the upper mold 304 and the lower mold 306(306B) are brought closer together. At this time, the clamper 328 comes into contact with the base material Wa of the workpiece W via the film F, and the workpiece W is held between the clamper (see Figure 24). Next, the base material Wa of the workpiece W comes into contact with the upper surface of the sealing resin R(R2) (the surface to which the heat sink H is not fixed) (see Figure 25). These actions may be set to occur simultaneously. Next, the sealing resin R(R2) is pressed by the heat sink H, which is in contact with the cavity piece 326, and the base material Wa of the workpiece W. As a result, the sealing resin R(R2) heats up and the resin sealing (compression molding) is completed (see Figure 26). In this example, a heat sink H-equipped sealing resin R2 as shown in Figure 31 is used, but it is not necessary to use a heat sink H. In that case, the same molding can be achieved by performing a workpiece holding process, then a heat sink placement process in which the heat sink H is simply placed in the cavity 308 shown in Figure 23, then a resin placement process in which the heat sink-less sealing resin R1 as shown in Figure 29 is placed on top of the heat sink H, and finally a mold closing process. However, the workpiece holding process and the heat sink placement process may be performed in reverse order or simultaneously.

[0094] As a subsequent step following the mold closing process described above, the mold opening process is performed to open the sealing mold 302, separating the molded product Wp from the used film F so that the molded product Wp can be removed (see Figure 27). As described above, since the resin sealing is performed with the cavity piece 326 covering the entire upper surface of the heat sink H of the sealing resin R (R2), the formation of a thin burr on the upper surface of the heat sink H is prevented, and a molded product Wp is formed with the entire upper surface reliably exposed (see Figure 32).

[0095] Here, an elastic thermal conductive resin sheet S may be placed between the surface of the electronic component Wb mounted on the workpiece W that faces the heat sink H, and the surface of the sealing resin R(R2) placed on the workpiece that faces the heat sink H. This fills the gap between the electronic component Wb and the heat sink H, preventing the upper surface of the electronic component Wb from being sealed with resin. In addition, it is possible to pressurize the sealing resin R(R2) by pushing it down through the heat sink H, and it is also possible to absorb the clamping force during mold closing, preventing damage to the electronic component Wb.

[0096] After the mold opening process, the molded product unloading process is performed in which the molded product Wp is unloaded from the sealing mold 302 by the second loader 24 and transported to the storage unit 10C. Also, after the molded product unloading process, or in parallel thereafter, the film supply mechanism 313 is activated to send out the used film F from the sealing mold 302 and feed a new film F into the sealing mold 302 and set it in place.

[0097] As described above, the compression molding apparatus according to the present invention makes it possible to prevent molding defects caused by uneven spraying, residual gas, and dust generation during molding, and also prevents the formation of thin burrs of the sealing resin on exposed parts of the molded product. Furthermore, it makes handling before resin sealing easier. Moreover, by using a grid-shaped solid sealing resin to which a heat sink is fixed, it is possible to easily form a molded product in which the heat sink is exposed on the upper surface, and the compression molding process can be simplified and the time can be shortened.

[0098] Furthermore, the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the scope of the invention. [Explanation of Symbols]

[0099] 1. Compression molding apparatus 202, 302 Sealing mold 236, 336 movable pieces H Heat sink R Sealing resin Rh through hole Double job Wa substrate Wb Electronic Components

Claims

1. A compression molding apparatus for processing a workpiece into a molded product by sealing it with a sealing resin, using a sealing mold comprising a first mold and a second mold, one of which is the upper mold and the other is the lower mold, The aforementioned workpiece has a configuration in which electronic components are mounted on a substrate. The sealing resin is formed in a grid pattern having through holes, The first mold has a cavity configured as a recess with a cavity piece forming the bottom, and a movable piece disposed inside the cavity at a position corresponding to the through hole of the sealing resin and movable up and down. The second mold has a workpiece holding portion for holding the workpiece, The configuration is such that when the sealing mold is closed, the movable piece enters the through hole and contacts the upper surface of the electronic component. The system includes a conveying device for transporting the workpiece and the sealing resin into the sealing mold, The through-hole has the same shape as the electronic component. A compression molding apparatus characterized by the following.

2. The transport device arranges the workpiece and the sealing resin in the sealing mold, aligning them relative to each other so that the electronic components are housed in the through holes. The compression molding apparatus according to claim 1, characterized by the following:

3. The sealing resin is a solid resin or a sheet-like resin formed by compressing powder resin into tablets. A compression molding apparatus according to claim 1 or 2, characterized by the following:

Images