Processing system, processing device, processing method, program, and storage medium

JP2026169407APending Publication Date: 2026-10-16KK TOSHIBA
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
JP2026185336
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-03-24
Filing Date
2026-08-06
Publication Date
2026-10-16

Smart Images

  • Figure 2026169407000001_ABST
    Figure 2026169407000001_ABST
Patent Text Reader

Abstract

To provide a processing system, processing device, processing method, program, and storage medium that can improve convenience. [Solution] The processing system according to the embodiment comprises a manipulator, a detection device, and a processing device. The detection device is attached to the manipulator. The detection device includes a detector, a first propagation member, and a second propagation member. The detector transmits ultrasonic waves toward an object and detects the reflected waves. The first propagation member is attached to the detector and through which the ultrasonic waves propagate. The second propagation member is attached to the first propagation member, through which the ultrasonic waves propagate, and is softer than the first propagation member. The processing device receives intensity data indicating the intensity of the reflected waves from the detector and detects the surface position of the object in the intensity data.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] Embodiments of the present invention relate to a processing system, a processing apparatus, a processing method, a program, and a storage medium.

Background Art

[0002] There is a system including a manipulator and a detection apparatus capable of transmitting and receiving ultrasonic waves. For this system, improvement in convenience is demanded.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0004] The problem to be solved by the present invention is to provide a processing system, a processing apparatus, a processing method, a program, and a storage medium that are capable of improving convenience.

Means for Solving the Problem

[0005] A processing system according to an embodiment includes a manipulator, a detection apparatus, and a processing apparatus. The detection apparatus is attached to the manipulator. The detection apparatus includes a detector, a first propagation member, and a second propagation member. The detector transmits ultrasonic waves toward an object and detects reflected waves. The first propagation member is attached to the detector, and the ultrasonic waves propagate therethrough. The second propagation member is attached to the first propagation member, the ultrasonic waves propagate therethrough, and the second propagation member is softer than the first propagation member. The processing apparatus receives intensity data indicating the intensity of the reflected waves from the detector, and detects the surface position of the object in the intensity data.

Brief Description of the Drawings

[0006] [Figure 1] Figure 1 is a schematic diagram showing a processing system according to an embodiment. [Figure 2] Figure 2 is a perspective view showing a detection device according to an embodiment. [Figure 3] Figure 3 is a perspective view showing the tip of the detection device according to this embodiment. [Figure 4] Figures 4(a) to 4(c) are schematic diagrams illustrating the detection results obtained by the detection device according to this embodiment. [Figure 5] Figure 5 is a schematic diagram illustrating the three-dimensional detection results obtained from the exploration. [Figure 6] Figure 6 is a flowchart showing the processing method according to the embodiment. [Figure 7] Figure 7 is a schematic diagram illustrating the angle adjustment of the detection device. [Figure 8] Figures 8(a) to 8(c) are examples of images showing extracted data. [Figure 9] Figure 9 is a schematic diagram showing a detection device related to a reference example. [Figure 10] Figures 10(a) and 10(b) are perspective and bottom views, respectively, of the second propagation member. [Figure 11] Figures 11(a) and 11(b) are side views showing the second propagation member. [Figure 12] Figures 12(a) and 12(b) are a bottom view and a side view showing a part of the detection device according to the embodiment. [Figure 13] Figures 13(a) and 13(b) are side views showing a detection device according to an embodiment. [Figure 14] Figures 14(a) and 14(b) are bottom views showing a part of the detection device according to the embodiment. [Figure 15] Figures 15(a) and 15(b) are a side view and a perspective view, respectively, of the detection device according to the embodiment. [Figure 16] Figures 16(a) and 16(b) are side views showing the tip of the detection device according to the embodiment. [Figure 17]FIG. 17 is a flowchart illustrating a processing method according to the first modification of the embodiment. [Figure 18] FIG. 18 is a flowchart illustrating a processing method according to the second modification of the embodiment. [Figure 19] FIG. 19 is a schematic diagram illustrating an example using the processing system according to the embodiment. [Figure 20] FIG. 20 is a schematic diagram illustrating a hardware configuration. [Mode for Carrying Out the Invention]

[0007] Hereinafter, each embodiment of the present invention will be described with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, and the like are not necessarily the same as actual ones. Even when the same part is represented, the dimensions and ratios may be represented differently among the drawings in some cases. In the present specification and each drawing, elements similar to those already described are denoted by the same reference numerals, and detailed descriptions thereof are omitted as appropriate.

[0008] FIG. 1 is a schematic diagram illustrating a processing system according to the embodiment. As shown in FIG. 1, a processing system 1 according to the embodiment includes a robot 10, a detection device 20, and a processing device 90. The robot 10 includes a manipulator 11 and a control device 12.

[0009] The manipulator 11 is, for example, a vertically articulated type. The manipulator 11 may be a horizontally articulated type or a parallel link type. The manipulator 11 may be a combination of two or more manipulators selected from the vertically articulated type, the horizontally articulated type, and the parallel link type. The control device 12 controls the operation of the manipulator 11. The control device 12 is a so-called robot controller.

[0010] The detection device 20 is attached to the tip of the manipulator 11. The control device 12 operates the manipulator 11 to move the detection device 20. The manipulator 11 operates such that the tip of the detection device 20 comes into contact with a target. For example, the position where the tip of the detection device 20 contacts the target is taught in advance. The control device 12 operates the manipulator 11 so that the tip of the detection device 20 is positioned at the teaching point.

[0011] The detection device 20 transmits ultrasonic waves toward a target and detects the reflected waves thereof. The target is, for example, a joined body joined by welding. Examples of the welding include laser welding, arc welding, and spot resistance welding. The invention according to the embodiment is particularly suitable for a joined body subjected to spot resistance welding.

[0012] As shown in Figure 1, an imaging device 30 may be further provided at the tip of the manipulator 11. The imaging device 30 captures an image of a target to obtain an image. The processing device 90 detects a welded portion of the joined body from the obtained image. The control device 12 may operate the manipulator 11 such that the tip of the detection device 20 comes into contact with the detected welded portion.

[0013] (Detection Device) Figure 2 is a perspective view showing the detection device according to the embodiment. As shown in Figure 2, the detection device 20 according to the embodiment includes a first propagation member 21, a second propagation member 22, a fixture 23, and a detector 25.

[0014] The detector 25 includes an element array 25a. The element array 25a includes a plurality of detection elements. Each detection element transmits ultrasonic waves. Further, each detection element detects reflected waves of the ultrasonic waves. Here, the transmission of ultrasonic waves and the detection of reflected waves by the detector 25 is referred to as probing. The side of the element array 25a is surrounded by a housing 25h of the detector 25. The side direction is a direction intersecting the transmission direction of the ultrasonic waves.

[0015] The first propagation member 21 is attached to the detector 25 (housing 25h). The first propagation member 21 is capable of propagating ultrasonic waves. For example, the first propagation member 21 is in contact with the detector 25. Alternatively, another ultrasonic wave-transmitting member may be provided between the first propagation member 21 and the detector 25.

[0016] The second propagation member 22 is attached to the first propagation member 21 by a fixing device 23. The first propagation member 21 is located between the detector 25 and the second propagation member 22. The second propagation member 22 is capable of propagating ultrasonic waves. The ultrasonic waves propagated by the first propagation member 21 propagate by the second propagation member 22 and are emitted outside the detection device 20.

[0017] If the second propagation member 22 can be attached to the first propagation member 21 by means other than the fixing device 23, the fixing device 23 can be omitted. For example, the second propagation member 22 may be attached to the first propagation member 21 by an adhesive medium.

[0018] The first propagation member 21 is solid. The first propagation member 21 has sufficient hardness so that substantial deformation does not occur even when the detection device 20 is in operation. This suppresses damage to the element array 25a. The second propagation member 22 is gel-like and not liquid. The second propagation member 22 is softer than the first propagation member 21. That is, the hardness of the second propagation member 22 is less than that of the first propagation member 21. For this reason, the second propagation member 22 deforms more easily than the first propagation member 21. The first propagation member 21 has sufficient softness so that it can deform according to the surface shape of the object being inspected when the detection device 20 is in operation.

[0019] The fixing device 23 fixes the second propagation member 22 in a state where the second propagation member 22 is in contact with the first propagation member 21. The fixing device 23 detachably fixes the second propagation member 22 to the first propagation member 21.

[0020] Here, the direction from the first propagation member 21 to the second propagation member 22 is defined as the Z direction. One direction intersecting the Z direction is defined as the X direction. One direction intersecting the ZX plane is defined as the Y direction. For example, the X, Y, and Z directions are mutually orthogonal.

[0021] Figure 3 is a perspective view showing the tip of the detection device according to this embodiment. Inside the detector 25, as shown in Figure 3, an element array 25a is provided. The element array 25a includes a plurality of detection elements 25b. The detection elements 25b are, for example, transducers that emit ultrasonic waves with a frequency of 1 MHz to 100 MHz. The plurality of detection elements 25b are arranged along the X and Y directions.

[0022] Figure 3 shows the process of performing a search on the joint 50. In the joint 50, a metal member 51 (first member) and a metal member 52 (second member) are joined together by spot resistance welding at a weld 53. At the weld 53, a solidified portion 54 (nugget) is formed when a portion of the metal member 51 and a portion of the metal member 52 melt and mix together and solidify. The second propagation member 22, which is in contact with the joint 50, deforms to conform to the shape of the surface of the joint 50. As a result, for example, the space between the joint 50 and the first propagation member 21 is filled with the second propagation member 22. Each detection element 25b transmits an ultrasonic wave US towards the joint 50. The transmitted ultrasonic wave US propagates towards the joint 50 through the first propagation member 21 and the second propagation member 22. At least a portion of the ultrasonic wave US is reflected by the joint 50. Each detection element 25b receives the reflected wave RW from the joint 50.

[0023] As a more specific example, as shown in Figure 3, one detection element 25b transmits ultrasonic waves US towards the weld 53. A portion of the ultrasonic waves US is reflected from the upper or lower surface of the joint 50. Each of the multiple detection elements 25b receives (detects) this reflected wave RW. Each detection element 25b sequentially transmits ultrasonic waves US, and each reflected wave RW is detected by the multiple detection elements 25b. This provides a detection result of the reflected wave indicating the condition near the weld 53.

[0024] The processing unit 90 controls the element array 25a of the detection device 20. During exploration, electrical signals are transmitted from the processing unit 90 to each detection element 25b, and ultrasonic waves are transmitted from each detection element 25b. Each detection element 25b also outputs an electrical signal in response to the detection of reflected waves. The magnitude of the electrical signal corresponds to the intensity of the reflected wave. Each detection element 25b transmits intensity data indicating the intensity of the detected reflected wave to the processing unit 90. The processing unit 90 performs various processes based on the intensity data.

[0025] Figures 4(a) to 4(c) are schematic diagrams illustrating the detection results obtained by the detection device according to this embodiment. When ultrasonic waves are transmitted from the detection device 20, as shown in Figure 4(a), some of the ultrasonic waves US are reflected by the upper surface 51a of the metal member 51 or the upper surface 53a of the welded portion 53. Another portion of the ultrasonic waves US enters the joint 50 and is reflected by the lower surface 51b of the metal member 51 or the lower surface 53b of the welded portion 53.

[0026] The positions of the upper surface 51a, lower surface 51b, upper surface 53a, and lower surface 53b in the Z direction are different from each other. That is, the distances in the Z direction between these surfaces and the detection element 25b are different from each other. When the detection element 25b detects reflected waves from these surfaces, the peaks of the reflected wave intensity are detected. By calculating the time from the transmission of the ultrasonic wave US until each peak is detected, it is possible to determine which surface the ultrasonic wave US is being reflected from.

[0027] Figures 4(b) and 4(c) are graphs illustrating the relationship between the time elapsed after transmitting an ultrasonic wave (US) and the intensity of the reflected wave (RW). Here, the intensity of the reflected wave (RW) is expressed as an absolute value. The graph in Figure 4(b) illustrates the detection results of reflected waves (RW) from the upper surface 51a and lower surface 51b of the metal member 51 and the lower surface 52b of the metal member 52. The graph in Figure 4(c) illustrates the detection results of reflected waves (RW) from the upper surface 53a and lower surface 53b of the welded joint 53.

[0028] In the graphs of Figures 4(b) and 4(c), peak Pe0 is based on the reflected wave RW from the interface between the first propagation member 21 and the second propagation member 22. Peak Pe1 is based on the reflected wave RW from the upper surface 51a. Peak Pe2 is based on the reflected wave RW from the lower surface 51b. The time from the transmission of the ultrasonic wave US until peaks Pe1 and Pe2 are detected corresponds to the positions of the upper surface 51a and lower surface 51b of the metal member 51 in the Z direction, respectively.

[0029] Similarly, peak Pe3 is based on the reflected wave RW from the upper surface 53a. Peak Pe4 is based on the reflected wave RW from the lower surface 53b. The time from the transmission of the ultrasonic US to the detection of peaks Pe3 and Pe4 corresponds to the positions of the upper surface 53a and lower surface 53b of the weld 53 in the Z direction, respectively.

[0030] Furthermore, the intensity data includes multiple peaks (e.g., peaks Pe5 to Pe8) after peaks Pe2 and Pe4. These peaks are based on reflected waves from the lower surface 52b and multiple reflected waves resulting from the ultrasonic waves being reflected multiple times between the surfaces of the joint 50.

[0031] The intensity of the reflected wave may be expressed in any manner. For example, the reflected wave intensity output from the detection element 25b includes positive and negative values ​​depending on the phase. Various processing may be performed based on the reflected wave intensity, which includes both positive and negative values. The reflected wave intensity, which includes both positive and negative values, may be converted to an absolute value. The average value of the reflected wave intensity may be subtracted from the reflected wave intensity at each time point. Alternatively, a weighted average value, a weighted moving average value, etc., of the reflected wave intensity may be subtracted from the reflected wave intensity at each time point. Even when using the results obtained by applying these processing to the reflected wave intensity, the various processing described in this application can still be performed.

[0032] Figure 5 is a schematic diagram illustrating the three-dimensional detection results obtained from the exploration. In the exploration, as described above, each detection element 25b sequentially transmits ultrasonic waves, and each reflected wave is detected by multiple detection elements 25b. In the specific example shown in Figure 3, 64 detection elements 25b are provided in an 8x8 configuration. In this case, the 64 detection elements 25b sequentially transmit ultrasonic waves. One detection element 25b repeatedly detects the reflected wave 64 times. From one detection element 25b, the detection result of the reflected wave intensity distribution in the Z direction is output 64 times. The intensity distributions of the 64 reflected waves output from one detection element 25b are summed up. The summed intensity distribution becomes the intensity distribution at the coordinates where one detection element 25b is provided in one exploration. The same processing is performed for the detection results from each of the 64 detection elements 25b. As a result, the intensity distribution of the reflected wave in the Z direction is generated at each point in the XY plane. Figure 5 shows the three-dimensional intensity distribution as an image. In Figure 5, areas with high brightness correspond to areas where the reflected ultrasonic wave intensity is relatively high.

[0033] The intensity of each peak in the reflected wave, as well as the position of each peak in the Z-direction, change depending on the state of the object. Therefore, information about the object can be obtained from the intensity data. For example, intensity data can be used to inspect the internal structure of an object.

[0034] (Processing method) Figure 6 is a flowchart showing the processing method according to the embodiment. Figure 7 is a schematic diagram illustrating the angle adjustment of the detection device. In the processing method PM shown in Figure 6, the control device 12 operates the manipulator 11 to move the detection device 20 (step S0). This causes the tip of the detection device 20 to come into contact with the target (welded area 53). The processing device 90 causes the detection device 20 to perform a search (step S1). The processing device 90 receives the intensity data obtained from the search from the detection device 20 (step S2). The processing device 90 detects the surface position of the target in the intensity data (step S3).

[0035] For example, as shown in Figure 4, the intensity data includes peaks based on reflected waves from each surface. The thickness of the first propagation member 21 does not change due to contact between the detection device 20 and the target. Therefore, the position of the interface between the first propagation member 21 and the second propagation member 22 in the intensity data is substantially constant. On the other hand, the position of each peak after peak Pe0 changes depending on the thickness of the second propagation member 22 when it is deformed, the state of the second propagation member 22, etc. Therefore, the position of each peak in the intensity data may change. The processing device 90 detects the position of the target surface (top surface 51a or 53a) in the intensity data. For example, the processing device 90 detects one or more peaks by comparing each peak included in the intensity data with a preset first threshold. The processing device 90 detects the first peak (the shallowest position) that appears in the intensity data as peak Pe0. Furthermore, after the peak Pe0 is detected, the processing unit 90 detects the first peak (second peak) with an intensity greater than a preset second threshold as a reflected wave from the surface of the target. The processing unit 90 detects the position (time) at which the first peak after peak Pe0 is detected as the "surface position" of the target in the Z direction. The first threshold for detecting peak Pe0 and the second threshold for detecting the surface position may be different from or the same as each other.

[0036] The processing unit 90 extracts a portion of the intensity data based on the detected surface position (step S4). For example, the length of the extracted range in the Z direction is set in advance. The processing unit 90 uses the detected surface position as the starting point in the Z direction and sets the endpoint of the range based on the starting point. The processing unit 90 extracts the range from the starting point to the endpoint from the intensity data. Alternatively, the extracted range may be set according to the peaks included in the intensity data. For example, the range from when a peak corresponding to the surface position is detected until a predetermined number of peaks are detected may be extracted from the intensity data. In the X and Y directions, a portion of the intensity data may or may not be extracted.

[0037] As an example, in step S4, intensity data included in the range Ra1 from the starting point SP to the ending point EP is extracted from the intensity data shown in Figure 4. Hereafter, a portion of the total intensity data extracted by the processing unit 90 will be referred to as "extracted data". The processing unit 90 can perform various processes using the extracted data. For example, the processing unit 90 uses the extracted data to calculate the slope of the detection device 20 (step S5) and to perform inspection of the target (step S8). By extracting a portion of the intensity data, the amount of computation required for subsequent processing can be reduced, and each process can be executed at a faster speed.

[0038] In step S5, the processing unit 90 calculates the inclination of the detection device 20 with respect to the target. The inclination is represented by the angle θx around the X direction and the angle θy around the Y direction between the direction D1 of the detection device 20 and the normal direction D2 of the surface of the welded part 53, as shown in Figure 7. Direction D1 is perpendicular to the arrangement direction of the multiple detection elements 25b.

[0039] Figures 8(a) to 8(c) are examples of images showing extracted data. The method for calculating the slope will now be explained. Figure 8(a) is an image showing the intensity distribution of reflected waves in the XY plane of the extracted data. Figure 8(b) is an image showing the intensity distribution of reflected waves in the YZ plane of the extracted data. Figure 8(c) is an image showing the intensity distribution of reflected waves in the XZ plane of the extracted data. In each of the images from Figures 8(a) to 8(c), the brightness corresponds to the intensity of the reflected wave. That is, the brighter the color of the pixel, the higher the reflected wave intensity at that point.

[0040] The angle θx is calculated based on the detection results in the YZ plane, as shown in Figure 8(b). The angle θy is calculated based on the detection results in the XZ plane, as shown in Figure 8(c). Specifically, the processing unit 90 calculates the average of the three-dimensional brightness gradient. The processing unit 90 uses the average of the gradient around the X direction as the angle θx. The processing unit 90 uses the average of the gradient around the Y direction as the angle θy.

[0041] The upper surface 53a and lower surface 53b of the welded joint 53 may be inclined with respect to the upper surface 51a of the metal member 51. This is due to factors such as the welded joint 53 containing a solidified portion 54 or deformation of the shape during the welding process. In this case, it is desirable to transmit ultrasonic waves (US) along a direction that is on average perpendicular to the upper surface 53a and lower surface 53b. This results in stronger reflection of the ultrasonic waves at the upper surface 53a and lower surface 53b. In the intensity data, the components of the reflected waves at the upper surface 53a and lower surface 53b can be made larger. As a result, for example, the accuracy of the inspection can be improved.

[0042] The processing unit 90 determines whether the calculated tilt is less than a preset threshold (step S6). If the tilt is greater than or equal to the threshold, the processing unit 90 transmits the tilt to the control unit 12. The control unit 12 operates the manipulator 11 according to the received tilt to adjust the angle between the target and the detection device 20 (step S7). This reduces the tilt of the detection device 20 relative to the target. After adjusting the angle, step S0 is executed again. For the subsequent step S3, the surface position detected in the first step S3 can be used. Therefore, detection of the surface position can be omitted.

[0043] If the slope is below a threshold, the processing unit 90 inspects the object (step S8). Specifically, the processing unit 90 determines whether a peak Pe2 exists in the reflected wave intensity distribution in the Z direction at each point in the XY plane. As an example, the processing unit 90 detects a peak in a predetermined range in the Z direction where a peak Pe2 can be detected. This predetermined range is set in advance based on the timing at which the ultrasonic waves were transmitted, according to the detected surface position, the thickness of the metal member 51, etc. This predetermined range may also be set based on the starting point of the extracted data. In this case, the predetermined range can be set without considering the surface position.

[0044] For example, among the intensity data shown in Figure 4, range Ra2 is set as a predetermined range. Range Ra2 includes peak Pe2. Range Ra2 is set with respect to the starting point SP of range Ra1. The processing unit 90 compares the intensity of the peaks included in range Ra2 with a predetermined threshold. When a peak exceeds the threshold, the processing unit 90 determines that the peak is peak Pe2. In the XY plane, the point where peak Pe2 exists corresponds to the point where the lower surface 51b exists. That is, the presence of peak Pe2 indicates that the metal members 51 and 52 are not joined at that point. The processing unit 90 determines that the point where peak Pe2 is detected is not joined.

[0045] The processing device 90 sequentially determines whether each point in the XY plane is joined. The set of points determined to be joined corresponds to the welded joint 53. For example, the inspection checks whether the welded joint 53 is formed. In addition, the inspection calculates the diameter (major or minor axis) of the welded joint 53 in the XY plane. The calculated diameter may be compared with a threshold value to inspect the quality of the welded joint 53.

[0046] The control device 12 determines if there are other objects to be detected (step S9). That is, the control device 12 determines if there are any welds 53 that have not yet been inspected. If other objects exist, step S0 is performed again for those objects.

[0047] Now, let's explain the advantages of this embodiment.

[0048] (First advantage) Figure 9 is a schematic diagram showing a detection device related to a reference example. In the reference example detection device 20a, the second propagation member 22 is not provided. Instead of the second propagation member 22, a liquid couplant 55 is applied to the surface of the object. The couplant 55 facilitates the propagation of ultrasonic waves between the detection device 20 and the object.

[0049] When using couplant, it is necessary to wipe off the couplant 55 after exploration. If the couplant 55 remains on the target surface, it may cause alteration (e.g., rust) or deterioration. However, wiping off the couplant 55 is time-consuming. To shorten the time required for exploration, there is a need for a technology that eliminates the need to apply and wipe off the couplant 55.

[0050] To address this issue, the detection device 20 according to this embodiment can use a second propagation member 22 instead of the couplant liquid. The second propagation member 22 is softer than the first propagation member 21 and can deform according to the surface shape of the target when the detection device 20 is in operation. As the second propagation member 22 deforms and fills the space between the first propagation member 21 and the target, the amount of air between the first propagation member 21 and the target can be reduced. By using the second propagation member 22, a couplant is not required during exploration. The time required for exploration can be shortened, and the convenience of the processing system 1 can be improved.

[0051] (Second advantage) As described above, the intensity data obtained by the detection device 20 is subjected to a process to detect the surface position of the target. The surface position is used to extract a portion of the intensity data. Alternatively, the surface position can also be used to determine whether a joint or not is formed at each point in the XY plane of the joint 50.

[0052] When performing the exploration using the robot 10, the detection of the surface position in the intensity data can be omitted. For example, the points to be explored on the target are taught to the robot 10 in advance. The robot 10 can set the position and angle of the detection device 20 more accurately than manual work. The relationship between the detection device 20 and the surface position of the target is substantially fixed, and the surface position in the intensity data is also determined. By pre-setting the surface position, the detection of the surface position can be omitted. In particular, when the first propagation member 21 shown in Figure 9 is brought into contact with the target via the couplant 55, the first propagation member 21 does not deform substantially, so the positional relationship between the detection device 20 and the surface position of the target can be determined with greater precision.

[0053] On the other hand, when the second propagation member 22 is used, as shown in Figure 3, the second propagation member 22 deforms to conform to the shape of the target. If the shape of the target surface is constant, the amount of deformation of the second propagation member 22 will also be constant. However, when exploring welds 53, the shape of each weld 53 is different. For example, the diameter, depth, etc., differ for each weld 53. Therefore, the amount of deformation of the second propagation member 22 during exploration differs for each weld 53.

[0054] If the deformation amount of the second propagation member 22 is different, the distance between the first propagation member 21 and the joint 50 changes. For example, when performing an inspection on a deeper weld 53, the deformation amount of the second propagation member 22 increases, and the distance between the first propagation member 21 and the joint 50 becomes shorter than usual. As a result, the surface position in the strength data also changes. When the surface position changes, the range of data extracted from the strength data changes. If data from an inappropriate range is extracted, the accuracy of the calculated slope decreases, or the accuracy of the inspection decreases.

[0055] In this embodiment, the processing device 90 detects the surface position of the target in the strength data. By detecting the surface position, the surface position can be appropriately set in each strength data even when the amount of deformation of the second propagation member 22 changes for each welded joint 53. For example, based on the detected surface position, a portion of the strength data can be extracted more appropriately, or more accurate inspection results can be obtained.

[0056] According to the embodiment, a convenient processing system and processing method can be provided that can shorten the time required for exploration and detect the surface position in the intensity data.

[0057] The following describes a preferred specific example of the detection device 20. The first propagation member 21 and the second propagation member 22 include resin. Specifically, the first propagation member 21 includes acrylic, and the second propagation member 22 includes segmented polyurethane.

[0058] The detection device 20 transmits ultrasonic waves to the joint and detects the reflected waves. The acoustic impedance of a typical steel plate used for joining is 4.5 × 10⁻⁶. 7 The impedance is approximately (Pa·s / m). To ensure that ultrasonic waves propagate sufficiently between the detection device 20 and the joint, the acoustic impedances of the first propagation member 21 and the second propagation member 22 are set to 1.0 × 10⁻¹⁰. 5 Larger than (Pa·s / m), 1.0 × 10 8 It is preferable that the acoustic impedance is less than (Pa·s / m). The acoustic impedance can be measured according to JIS A1405-1 (ISO 10534-1). The acoustic impedance may also be measured according to JIS A 1409 (ISO 354).

[0059] To suppress deformation of the first propagation member 21, the Rockwell hardness (M scale) of the first propagation member 21 is preferably greater than 80 and less than 110. The Rockwell hardness can be measured according to JIS Z 2245 (ISO 2039-2). To allow for easy deformation according to the surface shape of the target, the hardness of the second propagation member 22, measured by an Asker rubber hardness tester type F, is preferably greater than 40 and less than 60.

[0060] In the example shown in Figure 2, the fixture 23 includes a plate member 23a and a fastener 23b. The plate member 23a includes a first end E1 and a second end E2. The first end E1 is fastened and secured to the housing 25h by the fastener 23b. The fastener 23b is, for example, a screw. The plate member 23a extends along the direction from the housing 25h toward the second propagation member 22. The second end E2, opposite to the first end E1, is bent so that the second propagation member 22 is positioned between the first propagation member 21 and the second end E2. A portion of the second propagation member 22 is sandwiched between the second end E2 and the first propagation member 21.

[0061] The plate member 23a may be an elastic leaf spring. An elastic force is generated in the plate member 23a in a direction that presses the second propagation member 22 toward the first propagation member 21. Alternatively, the second propagation member 22 may be pressed by a linear member such as a hard steel wire instead of the plate member 23a. The specific structure of the fixing device 23 can be modified as appropriate, as long as it is equipped with a pressing member that can be fixed at one end to the housing 25h and at the other end can press the second propagation member 22 toward the first propagation member 21.

[0062] Figures 10(a) and 10(b) are perspective and bottom views, respectively, of the second propagation member. As shown in Figures 10(a) and 10(b), the second propagation member 22 includes a first portion 22a and a second portion 22b.

[0063] The first portion 22a is located on the outer periphery of the second propagation member 22 and is held in place by the fastener 23. The second portion 22b is surrounded by the first portion 22a. The first portion 22a is located around the second portion 22b along the XY plane. For example, the second portion 22b is located in the center of the second propagation member 22.

[0064] The second portion 22b protrudes more in the Z direction than the first portion 22a. For example, as shown in Figure 10(a), the thickness T2 of the second portion 22b is greater than the thickness T1 of the first portion 22a. The thickness corresponds to the length in the Z direction.

[0065] Figures 11(a) and 11(b) are side views showing the second propagation member. An example of the specific structure of the second propagation member 22 will be described. As shown in Figure 11(a), the first part 22a and the second part 22b each have a first surface Su1 and a second surface Su2 that intersect with the Z direction. The first part 22a and the second part 22b also have a common third surface Su3 that intersects with the Z direction. The third surface Su3 is located on the opposite side of the first surface Su1 and the second surface Su2. For example, the first surface Su1, the second surface Su2, and the third surface Su3 are parallel to each other. The position of the first surface Su1 in the Z direction is between the position of the second surface Su2 in the Z direction and the position of the third surface Su3 in the Z direction.

[0066] As another example, as shown in Figure 11(b), the first part 22a and the second part 22b may each have a third face Su3 and a fourth face Su4 intersecting the Z direction. The third face Su3 is located on the opposite side of the first face Su1. The fourth face Su4 is located on the opposite side of the second face Su2. For example, the first face Su1, the second face Su2, the third face Su3, and the fourth face Su4 are parallel to each other. The positions of the first face Su1 and the fourth face Su4 in the Z direction are between the positions of the second face Su2 and the third face Su3 in the Z direction.

[0067] Figures 12(a) and 12(b) are a bottom view and a side view showing a part of the detection device according to the embodiment. Figures 13(a) and 13(b) are side views showing the detection device according to the embodiment. As shown in Figures 12(a) and 12(b), the first portion 22a is pressed against the first propagation member 21 by the fixing device 23. As a result, the second propagation member 22 adheres tightly to the first propagation member 21 so that there is no gap between the first propagation member 21 and the second propagation member 22. For example, the first portion 22a deforms and its thickness decreases.

[0068] An opening OP is formed at the second end E2 of the plate member 23a. In the examples of Figures 12(a) and 12(b), the opening OP is a hole that penetrates the second end E2 in the thickness direction of the second end E2. The thickness direction of the second end E2 is parallel to the Z direction when the second end E2 is pressing against the second propagation member 22.

[0069] The fixing device 23 fixes the second propagation member 22 such that the second portion 22b protrudes in the Z direction beyond the first portion 22a and the second end E2. Specifically, the second portion 22b of the second propagation member 22 is inserted into the opening OP. As a result, when the first portion 22a is pressed against the fixing device 23, the second portion 22b protrudes in the Z direction beyond the second end E2 of the fixing device 23, as shown in Figures 12(b), 13(a), and 13(b). That is, as shown in Figure 12(b), the position of the second end E2 in the Z direction is between the position of the second surface Su2 in the Z direction and the position of the third surface Su3 in the Z direction.

[0070] By having the second portion 22b protrude more than the first portion 22a, the volume of the second portion 22b protruding from the second end E2 of the fixing device 23 can be increased. In other words, the volume of the second portion 22b that deforms to conform to the surface shape of the object can be increased. This makes it easier for the space between the first propagation member 21 and the object to be filled with the second propagation member 22.

[0071] Figures 14(a) and 14(b) are bottom views showing a part of the detection device according to the embodiment. As shown in Figure 14(a), the opening OP may extend in one direction in a slit shape. As shown in Figure 14(b), the plate member 23a may be composed of multiple wires W. The opening OP is formed at a position where no wires W are provided.

[0072] Figures 15(a) and 15(b) are a side view and a perspective view, respectively, of the detection device according to the embodiment. The fixing device 23 detachably fixes the second propagation member 22 to the first propagation member 21. In other words, by using the fixing device 23, it is possible to switch between a state in which the second propagation member 22 is fixed to the first propagation member 21 and a state in which the second propagation member 22 is not fixed to the first propagation member 21.

[0073] For example, as shown in Figures 15(a) and 15(b), the plate member 23a can be removed from the housing 25h by loosening the fastener 23b. When the plate member 23a is removed from the housing 25h, the second end E2 moves away from the first propagation member 21. That is, the distance between the second end E2 and the first propagation member 21 increases. As a result, the pressure from the second end E2 on the second propagation member 22 is eliminated. The second propagation member 22 becomes removable. The second propagation member 22 can be removed and a new, different second propagation member 22 can be installed.

[0074] Alternatively, the plate member 23a may be a leaf spring. In this case, the second end E2 may be moved away from the first propagation member 21 by deforming the plate member 23a. This eliminates the pressure from the second end E2 on the second propagation member 22, making the second propagation member 22 removable.

[0075] Figures 16(a) and 16(b) are side views showing the tip of the detection device according to the embodiment. Figure 16(a) shows the state of the second propagation member 22 before it contacts the target O. Figure 16(b) shows the state of the second propagation member 22 after it contacts the target O. As shown in Figures 16(a) and 16(b), the second portion 22b of the second propagation member 22 deforms and collapses upon contact with the target O. The thickness of the second portion 22b decreases.

[0076] The second part 22b deforms so that the fixing device 23 also comes into contact with the target O. The fixing device 23 is harder than the second propagation member 22 and has sufficient rigidity. Therefore, unlike the second propagation member 22, the fixing device 23 does not deform substantially even when it comes into contact with the target O. Also, the first part 22a, which is already held down by the fixing device 23, is less prone to deformation than the second part 22b. The contact of the fixing device 23 with the target O makes it easier to determine the distance D between the first propagation member 21 and the target O. This suppresses variations in the distance D due to the degree of deformation of the second propagation member 22.

[0077] The fixing device 23 has a first contact surface C1 facing the object O. The first contact surface C1 is oriented in the Z direction. When the second propagation member 22 contacts the object, the first contact surface C1 may also contact the object. For example, the second end E2 of the plate member 23a includes the first contact surface C1. In this example, the first contact surface C1 is composed of a single surface. The first contact surface C1 may be composed of multiple lines or multiple points. The first propagation member 21 has a second contact surface C2 that contacts the second propagation member 22. Preferably, the first contact surface C1 is parallel to the second contact surface C2. For example, the first contact surface C1 and the second contact surface C2 are parallel to the X and Y directions, which are the arrangement directions of the multiple detection elements described later.

[0078] For example, when the second part 22b comes into contact with the target O and is crushed, the first contact surface C1 of the fixing device 23 comes into contact with the target O. When the first contact surface C1 and the second contact surface C2 are parallel, the distance D is determined by the thickness T3 of the deformed first part 22a and the thickness T4 of the second end E2. For example, the distance D can be set to a predetermined value by pressing the detection device 20 toward the target O until the first contact surface C1 makes surface contact with the target O. Furthermore, the variation in distance D at each point in the XY plane can be reduced. This reduces the variation in reflected wave intensity for each exploration and also reduces the variation in reflected wave intensity at each point in the XY plane.

[0079] Furthermore, "parallel" does not mean strictly parallel, but may include variations in the manufacturing process, for example. There may be a slight inclination between the first contact surface C1, the second contact surface C2, and the alignment direction, as long as it does not cause problems with detection. For example, if the angle between any two of the first contact surface C1, the second contact surface C2, and the alignment direction is greater than -5 degrees and less than +5 degrees, then those two can be considered substantially parallel.

[0080] (First variation) Figure 17 is a flowchart showing a processing method according to a first modified example of the embodiment. The processing method PM1 according to the first modified example shown in Figure 17 further includes steps S10 and S11 compared to processing method PM. First, steps S0 to S3 are performed, similar to processing method PM. When the surface position is detected in step S3, the processing device 90 determines whether the surface position is within a predetermined range (step S10).

[0081] If the surface position is outside the predetermined range, the control device 12 operates the manipulator 11 to move the detection device 20. This adjusts the position of the detection device 20 so that the surface position in the intensity data approaches the predetermined range (step S11). After the position adjustment, step S1 is executed again. If the surface position is within the predetermined range, the processing device 90 uses that surface position to extract a portion of the intensity data (step S4). After that, steps S5 and onward are executed in the same manner as in processing method PM.

[0082] According to processing method PM1 of the first modification, a more appropriate range can be extracted from intensity data, similar to processing method PM. However, processing method PM1 requires more time than processing method PM because it involves position adjustment and repeated exploration. From the viewpoint of reducing the required time, processing method PM is preferable to processing method PM1.

[0083] (Second variation) Figure 18 is a flowchart showing a processing method according to a second modified example of the embodiment. The processing method PM2, according to the second modified example shown in Figure 18, further includes steps S20 to S24 compared to processing method PM. First, steps S0 to S3 are performed, similar to processing method PM. When a surface position is detected in step S3, the processing device 90 saves that surface position (step S20).

[0084] The control device 12 operates the manipulator 11 to bring the tip of the detection device 20 into contact with the target (step S21). At this time, the target that the detection device 20 contacts may be the same as the target that the detection device 20 contacted in step S0, or it may be different from the target that the detection device 20 contacted in step S0. If the targets are different between step S0 and step S21, they have substantially the same structure. For example, the target that the detection device 20 contacts in step S0 is used as a test piece.

[0085] The processing unit 90 causes the detection device 20 to perform the exploration (step S22). The processing unit 90 receives the intensity data obtained by the exploration from the detection device 20 (step S23). The processing unit 90 refers to the surface position saved in step S20 (step S24). In step S4, a portion of the intensity data is extracted using the referenced surface position. That is, in processing method PM2 according to the second modified example, the intensity data used to detect the surface position is different from the intensity data from which a portion is extracted based on the surface position. Thereafter, steps S5 and onward are executed in the same manner as in processing method PM.

[0086] If other objects exist in step S9, step S21 is executed again. Alternatively, step S0 may be executed again. Which step to execute can be selected depending on whether the structure of the object whose surface position was detected in step S3 is the same as the structure of the object to be explored in the next step S22.

[0087] According to the second modified processing method PM2, the surface position of the object to be explored in step S22 can be detected in advance. Therefore, the time from when the exploration is performed in step S22 until the extracted data is obtained can be shortened. For example, this method is particularly suitable when it is required to shorten the time from exploration to inspection in a mass production line or the like.

[0088] (Examples) Figure 19 is a schematic diagram showing an example using the processing system according to the embodiment. In the embodiment shown in Figure 19, the processing system 1 is used in the production line PL. The production line PL includes multiple processing systems 1 as well as multiple welding systems 100. The welding system 100 includes a manipulator 101 and a welding device 102 attached to the manipulator 101. In addition, the welding system 100 includes a robot controller, a power supply, etc. (not shown).

[0089] Each welding system 100 performs spot resistance welding on the metal members 51 and 52. This creates a joint 50. The joint 50, metal members 51, and metal members 52 are, for example, parts of a car body. Multiple processing systems 1 each inspect multiple welds 53 of the joint 50.

[0090] For example, a plurality of welding systems 100 includes welding systems 100A to 100D. Welding system 100A forms welds 53A1 to 53A3. Similarly, welding systems 100B to 100D form welds 53B1 to 53B3, welds 53C1 to 53C3, and welds 53D1 to 53D3.

[0091] Once welding of a pair of metal members 51 and 52 is completed by welding systems 100A to 100D, conveyor C transports the joined body 50. Another pair of metal members 51 and 52 are transported to the location where welding systems 100A to 100D are installed. The joined body 50 is transported to the location where processing systems 1A to 1D are installed.

[0092] Multiple processing systems 1 include processing systems 1A to 1D. Processing system 1A inspects welds 53A1 to 53A3. Similarly, processing systems 1B to 1D inspect welds 53B1 to 53B3, welds 53C1 to 53C3, and welds 53D1 to 53D3.

[0093] During the period when the joint 50 is being transported by conveyor C, processing systems 1A to 1D cannot inspect the joint 50. For example, multiple test pieces TP1 to TP4 are placed adjacent to processing systems 1A to 1D, respectively. Each test piece has substantially the same structure as the vicinity of the weld 53 of the joint 50. While conveyor C is transporting the joint 50, processing systems 1A to 1D each use test pieces TP1 to TP4 to detect the surface position and save that surface position. That is, steps S0 to S3 and S20 of processing method PM2 shown in Figure 18 are performed on test pieces TP1 to TP4 (an example of the target).

[0094] Once the conveyor C has finished transporting the joint 50, the processing systems 1A to 1D inspect the joint 50 (an example of another object). At this time, the processing systems 1A to 1D use the surface position detected using test pieces TP1 to TP4 to extract a portion of the strength data (other strength data) obtained from the joint 50. That is, steps S21 to S24 and S4 to S9 of the processing method PM2 shown in Figure 18 are performed for each weld 53 of the joint 50.

[0095] In the embodiment, a first operation using a test piece and a second operation on the joint 50 are performed alternately. In the first operation, the detector 25 transmits ultrasonic waves to the test piece, the detector 25 receives the reflected waves, and the processing device 90 detects the surface position. In the second operation, the detector 25 transmits ultrasonic waves to the joint 50, the detector 25 receives the reflected waves, and the processing device 90 extracts a portion of the intensity data from the joint 50.

[0096] According to the embodiment, the surface position to be used for inspection of the joint 50 can be detected before the joint 50 is inspected by utilizing the time while the conveyor C is transporting the joint 50. This reduces the time required for inspection of the joint 50. For example, it can improve the mass productivity of the joint 50.

[0097] Figure 20 is a schematic diagram representing the hardware configuration. As the processing unit 90, for example, the computer 90a shown in Figure 20 can be used. The computer 90a includes a CPU 91, ROM 92, RAM 93, storage device 94, input interface 95, output interface 96, and communication interface 97.

[0098] ROM92 stores programs that control the operation of computer 90a. ROM92 contains the programs necessary for computer 90a to perform each of the processes described above. RAM93 functions as a memory area where the programs stored in ROM92 are deployed.

[0099] The CPU 91 includes processing circuits. The CPU 91 uses the RAM 93 as work memory and executes programs stored in at least one of the ROM 92 or the storage device 94. During program execution, the CPU 91 controls each component via the system bus 98 and performs various processes.

[0100] The memory device 94 stores data necessary for program execution and data obtained through program execution.

[0101] The input interface (I / F) 95 connects the processing unit 90 and the input device 95a. The input I / F 95 is, for example, a serial bus interface such as USB. The CPU 91 can read various data from the input device 95a via the input I / F 95.

[0102] The output interface (I / F) 96 connects the processing unit 90 and the output device 96a. The output I / F 96 is a video output interface such as a Digital Visual Interface (DVI) or a High-Definition Multimedia Interface (HDMI®). The CPU 91 can transmit data to the output device 96a via the output I / F 96 and display an image on the output device 96a.

[0103] The communication interface (I / F) 97 connects the processing unit 90 to a server 97a located outside the processing unit 90. The communication I / F 97 is, for example, a network card such as a LAN card. The CPU 91 can read various data from the server 97a via the communication I / F 97.

[0104] The storage device 94 includes one or more selected from Hard Disk Drives (HDDs) and Solid State Drives (SSDs). The input device 95a includes one or more selected from a mouse, keyboard, microphone (voice input), and touchpad. The output device 96a includes one or more selected from a monitor, projector, printer, and speaker. Devices that have the functions of both input device 95a and output device 96a, such as a touch panel, may also be used.

[0105] The processing of the various data described above may be recorded as a program that can be executed by a computer on a magnetic disk (flexible disk and hard disk, etc.), an optical disk (CD-ROM, CD-R, CD-RW, DVD-ROM, DVD±R, DVD±RW, etc.), a semiconductor memory, or another non-transitory computer-readable storage medium.

[0106] For example, information recorded on a recording medium can be read by a computer (or embedded system). The recording format (storage format) of the recording medium is arbitrary. For example, a computer reads a program from the recording medium and has the CPU execute the instructions written in the program based on this program. In a computer, program acquisition (or reading) may be performed via a network.

[0107] Embodiments of the present invention include the following features. (Note 1) Manipulator and, A detection device attached to the manipulator, A detector that transmits ultrasound towards a target and detects the reflected wave, A first propagation member attached to the detector, through which the ultrasonic waves propagate, A second propagation member is attached to the first propagation member, through which the ultrasonic waves propagate, and which is softer than the first propagation member. The detection device includes, A processing device that receives intensity data indicating the intensity of the reflected wave from the detector and detects the surface position of the target in the intensity data, A processing system equipped with this system. (Note 2) The processing apparatus is the processing system described in Appendix 1, which extracts a portion of the intensity data based on the surface position. (Note 3) The processing system described in Appendix 2 calculates the inclination of the detection device relative to the target using a portion of the extracted intensity data. (Note 4) The subject is a joint in which a welded portion is formed, The processing system according to Appendix 2 or 3, wherein the processing apparatus inspects the welded portion using the extracted strength data. (Note 5) The processing system according to any one of the appendices 1 to 4, wherein the manipulator moves the detection device so that the surface position approaches a predetermined range. (Note 6) The processing system according to any one of the appendices 1 to 5, wherein the processing device receives additional intensity data indicating the intensity of the reflected wave from another object and extracts a portion of the additional intensity data based on the surface position. (Note 7) The other subject is a joint in which a welded portion is formed, The processing apparatus is the processing system described in Appendix 6, which inspects the welded portion using the extracted portion of the other strength data. (Note 8) A first operation including the transmission of ultrasonic waves to the target by the detector, the reception of reflected waves by the detector, and the detection of the surface position by the processing device, A second operation includes transmitting ultrasound to the other target by the detector, receiving the reflected wave by the detector, and extracting a portion of the other intensity data by the processing device. The processing system described in Appendix 6 involves alternating between the two. (Note 9) The processing system according to any one of appendices 1 to 8, further comprising a fixing device for detachably fixing the second propagation member to the first propagation member. (Note 10) The fixing device includes a first contact surface facing the object, The first propagation member includes a second contact surface that contacts the second propagation member, The processing system according to Appendix 9, wherein the first contact surface is parallel to the second contact surface. (Note 11) The processing system according to any one of appendices 1 to 10, wherein the processing device detects a first peak that first exceeds a first threshold in the intensity data, and a second peak that first exceeds a second threshold after the first peak, and uses the position of the second peak as the surface position. (Note 12) A detection device attached to a manipulator, A detector that transmits ultrasound towards a target and detects the reflected wave, A first propagation member attached to the detector, through which the ultrasonic waves propagate, A second propagation member is attached to the first propagation member, through which the ultrasonic waves propagate, and which is softer than the first propagation member. A processing device that receives intensity data indicating the intensity of the reflected wave from the detection device, and detects the surface position of the target in the intensity data. (Note 13) A detection device attached to a manipulator, A detector that transmits ultrasound towards a target and detects the reflected wave, A first propagation member attached to the detector, through which the ultrasonic waves propagate, A second propagation member is attached to the first propagation member, through which the ultrasonic waves propagate, and which is softer than the first propagation member. A processing method comprising receiving intensity data indicating the intensity of the reflected wave from the detection device, and detecting the surface position of the target in the intensity data. (Note 14) A program that causes a computer to execute the processing method described in Appendix 13. (Note 15) A storage medium containing the program described in Appendix 14.

[0108] According to the embodiments described above, a convenient processing system 1, processing method, or processing device 90 can be provided. For example, the time required for exploration can be reduced, and the surface position in the intensity data can be detected. Furthermore, similar effects can be obtained by using a program that causes a computer to execute the processing method.

[0109] Although several embodiments of the present invention have been illustrated above, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. Furthermore, the embodiments described above can be implemented in combination with each other.

Claims

1. Manipulator and, A detection device attached to the manipulator, A detector that transmits ultrasound towards a target and detects the reflected wave, A first propagation member attached to the detector, through which the ultrasonic waves propagate, A second propagation member is attached to the first propagation member, through which the ultrasonic waves propagate, and which is softer than the first propagation member. The detection device includes, A processing device that receives intensity data indicating the intensity of the reflected wave from the detector and detects the surface position of the target in the intensity data, Equipped with, The processing device is a processing system that receives additional intensity data indicating the intensity of the reflected wave from another object and extracts a portion of the additional intensity data based on the surface position.

2. The other subject is a joint in which a welded portion is formed, The processing system according to claim 1, wherein the processing apparatus inspects the welded portion using the extracted portion of the other strength data.

3. A first operation includes transmitting ultrasonic waves to the target by the detector, receiving reflected waves by the detector, and detecting the surface position by the processing device. A second operation includes transmitting ultrasound to the other target by the detector, receiving the reflected wave by the detector, and extracting a portion of the other intensity data by the processing device. The processing system according to claim 1, wherein the process is repeated alternately.

4. Manipulator and, A detection device attached to the manipulator, A detector that transmits ultrasound towards a target and detects the reflected wave, A first propagation member attached to the detector, through which the ultrasonic waves propagate, A second propagation member is attached to the first propagation member, through which the ultrasonic waves propagate, and which is softer than the first propagation member. The detection device includes, A processing device that receives intensity data indicating the intensity of the reflected wave from the detector and detects the surface position of the target in the intensity data, Equipped with, The detection device further includes a fixing device for detachably fixing the second propagation member to the first propagation member, The fixing device includes a first contact surface facing the object, The first propagation member includes a second contact surface that comes into contact with the second propagation member when the second propagation member is fixed by the fixing device. The fixing device is provided such that the first contact surface is parallel to the second contact surface when the second propagation member is fixed, in a processing system.

5. The processing system according to any one of claims 1 to 4, wherein the processing apparatus extracts a portion of the intensity data based on the surface position.

6. The processing system according to claim 5, wherein the processing device calculates the inclination of the detection device with respect to the target using a portion of the extracted intensity data.

7. The subject is a joint in which a welded portion is formed, The processing system according to claim 5, wherein the processing apparatus inspects the welded portion using the extracted strength data.

8. The processing system according to any one of claims 1 to 4, wherein the processing device detects a first peak that first exceeds a first threshold in the intensity data, and a second peak that first exceeds a second threshold after the first peak, and uses the position of the second peak as the surface position.

9. A detection device attached to a manipulator, A detector that transmits ultrasound towards a target and detects the reflected wave, A first propagation member attached to the detector, through which the ultrasonic waves propagate, A second propagation member is attached to the first propagation member, through which the ultrasonic waves propagate, and which is softer than the first propagation member. The detection device, which includes the above, receives intensity data indicating the intensity of the reflected wave, and detects the surface position of the target in the intensity data. A processing device that receives additional intensity data indicating the intensity of the reflected wave from another object, and extracts a portion of the additional intensity data based on the surface position.

10. A detection device attached to a manipulator, A detector that transmits ultrasound towards a target and detects the reflected wave, A first propagation member attached to the detector, through which the ultrasonic waves propagate, A second propagation member is attached to the first propagation member, through which the ultrasonic waves propagate, and which is softer than the first propagation member. The detection device, which includes the above, receives intensity data indicating the intensity of the reflected wave, and detects the surface position of the target in the intensity data. A processing method that receives additional intensity data indicating the intensity of the reflected wave from another object, and extracts a portion of the additional intensity data based on the surface position.

11. A program that causes a computer to execute the processing method described in claim 10.

12. A storage medium storing the program described in claim 11.

Citation Information

Patent Citations

  • Method and device for inspecting spot welded part

    JP2007278809A