Component mounting system

Abstract

The present invention provides a component mounting system capable of accurately determining whether the mounting area for a large component on a circuit board is normal before the component is mounted on the board. [Solution] The component mounting system includes a first measurement unit 4U1 and a second measurement unit 4U2 that measure the height of a second region on a circuit board where a large second component is mounted. The first measurement unit 4U1 acquires first height data of the second region before mounting a small first component based on processing by the first processing unit 3U1. The second measurement unit 4U2 acquires second height data of the second region after mounting the first component based on processing by the first processing unit 3U1 and before mounting the second component based on processing by the second processing unit 3U2. The second processing unit 3U2 uses height difference data, which is the difference between the first height data and the second height data, to determine whether the second region on the circuit board is normal or not.

Description

Technical Field

[0001] The present invention relates to a component mounting system that mounts small components and large components on a substrate.

Background Art

[0002] Conventionally, component mounting systems are known that mount small components such as ICs, chip resistors and chip capacitors, and large components such as BGA (Ball Grid Array) and QFP (Quad Flat Package) on a substrate such as a printed wiring board. In this type of component mounting system, when inspecting a substrate after small components and large components are mounted, it is difficult to inspect whether a foreign object such as a small component exists under the large component.

[0003] Accordingly, Patent Document 1 discloses a technique for determining whether a mounting region for a large component on a substrate is normal before the large component is mounted. In the technique disclosed in Patent Document 1, based on the luminance difference between an initial image captured by an imaging device targeting the mounting region of the large component on the substrate before the small components and the large component are mounted, and a comparison image after the small components are mounted and before the large component is mounted, it is determined whether the mounting region of the large component is normal. Then, when it is determined that the mounting region of the large component is normal, the large component is mounted. This makes it possible to suppress the occurrence of defective substrates where a foreign object such as a small component is present under the large component.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the case of judgment based on the brightness difference of an image, as disclosed in Patent Document 1, it is expected that the accuracy of the judgment will decrease, for example, if foreign matter is present in the silk-screened area on the substrate.

[0006] The objective of the present invention is to provide a component mounting system that can accurately determine whether the mounting area for a large component on a substrate is normal before mounting the component. [Means for solving the problem]

[0007] A component mounting system according to one aspect of the present invention includes: a first mounting unit positioned above a substrate transport path that transports a substrate in the transport direction and performing a mounting operation to mount a first component in a first region on the substrate; a first processing unit that performs processing to cause the first mounting unit to perform the mounting operation; a second mounting unit positioned above the substrate transport path downstream of the first mounting unit in the transport direction and performing a mounting operation to mount a second component larger than the first component in a second region on the substrate different from the first region; a second processing unit that performs processing to cause the second mounting unit to perform the mounting operation; and a component mounting system positioned above the substrate transport path based on the processing of the first processing unit. The system includes: a first measurement unit that measures the height of each of a plurality of measurement points in the second region before the first component is mounted by the first mounting unit and acquires first height data indicating the height data for each of the plurality of measurement points relative to their respective two-dimensional coordinate positions; and a second measurement unit that is positioned above the substrate transport path and measures the height of each of the plurality of measurement points in the second region after the first component has been mounted by the first mounting unit based on the processing of the first processing unit, and before the second component has been mounted by the second mounting unit based on the processing of the second processing unit, and acquires second height data indicating the height data for each of the plurality of measurement points relative to their respective two-dimensional coordinate positions. The second processing unit obtains height difference data indicating the difference between the first height data and the second height data, determines whether the second region on the substrate is normal or not using determination height data based on the height difference data, and if it determines that the second region is normal, causes the second mounting unit to perform the mounting operation.

[0008] According to the component mounting system described above, the first measurement unit acquires first height data of the second region on the substrate where the large second component will be mounted, before the first mounting unit mounts the small first component based on the processing of the first processing unit. The second measurement unit acquires second height data of the second region on the substrate after the first component has been mounted and before the second mounting unit mounts the second component based on the processing of the second processing unit. The second processing unit then calculates height difference data, which is the difference between the first height data and the second height data, and uses the height difference data to determine whether the second region on the substrate is normal or not. The height difference data to determine whether the second region is normal or not is determined using the height difference data to determine whether the large second component will be mounted on the substrate. Furthermore, if the second processing unit determines that the second region is normal, it instructs the second mounting unit to perform a mounting operation to mount the second component in the second region. This suppresses the occurrence of defective substrates where foreign objects such as small first components are present beneath larger second components.

[0009] In the component mounting system described above, the second processing unit may acquire first positional displacement data indicating the amount of positional displacement of the substrate with respect to a reference position on the substrate transport path during measurement by the first measurement unit, and second positional displacement data indicating the amount of positional displacement of the substrate with respect to a reference position on the substrate transport path during measurement by the second measurement unit. The second processing unit may then correct at least one of the first height data and the second height data based on the first and second positional displacement data so that the two-dimensional coordinate positions of the plurality of measurement points coincide between the first height data and the second height data, and use the corrected data to obtain the height difference data.

[0010] In this embodiment, the second processing unit can correct at least one of the first height data and the second height data by taking into account the amount of displacement of the substrate on the substrate transport path during height measurement by the first measurement unit and the second measurement unit, respectively. In this case, the height data for determination based on the height difference data using the corrected first height data and second height data will be data that more accurately represents the height change before and after mounting of the first component in the second region on the substrate before mounting of the second component.

[0011] In the component mounting system described above, if the first scale, which represents the two-dimensional scale of the first height data, and the second scale, which represents the two-dimensional scale of the second height data, are different, the second processing unit may correct at least one of the first height data and the second height data so that the first scale and the second scale match, and then use the corrected data to obtain the height difference data.

[0012] In this embodiment, the second processing unit can correct at least one of the first height data and the second height data so that the scales of the first and second height data match. In this case, the height data for determination based on the height difference data using the corrected first and second height data will be data that more accurately represents the height change before and after the mounting of the first component in the second region on the substrate before the mounting of the second component.

[0013] In the component mounting system described above, the second processing unit may divide the second region into a plurality of divided regions, obtain the height difference data for each of the plurality of divided regions, and use the determination height data based on the height difference data for each of the plurality of divided regions to determine whether or not the second region on the substrate is normal.

[0014] During height measurement by the first and second measurement units, deformation such as warping may occur in the substrate on the substrate transport path. If the warping state of the substrate differs between the height measurement by the first and second measurement units, it is necessary to obtain height difference data in a way that suppresses the influence of this difference in the substrate's warping state. Therefore, the second processing unit divides the second region on the substrate, which is the target of height measurement by the first and second measurement units, into multiple divided regions and obtains height difference data for each of these divided regions. As a result, the second processing unit can obtain height difference data for each divided region in a way that suppresses the influence of differences in the substrate's warping state during height measurement by the first and second measurement units. Therefore, the second processing unit can use the height data for determination based on the height difference data for each divided region to accurately determine whether the second region, which will be the mounting area for the second component, is normal before mounting the large second component onto the substrate.

[0015] In the component mounting system described above, the second processing unit may set the two-dimensional size of the plurality of divided regions according to the warping state of the substrate on the substrate transport path during measurement by the first measurement unit and the second measurement unit, respectively.

[0016] In this embodiment, the second processing unit can obtain height difference data for each appropriately sized divided region corresponding to the warping state of the substrate.

[0017] In the component mounting system described above, the second processing unit may obtain the height difference data for each of the plurality of divided regions, and obtain least-squares plane height difference data showing the difference between the first least-squares plane data showing the least-squares plane data of the first height data and the second least-squares plane data showing the least-squares plane data of the second height data, and further obtain the difference between the height difference data and the least-squares plane height difference data as the determination height data. The second processing unit may then use the determination height data for each of the plurality of divided regions to determine whether the second region on the substrate is normal or not.

[0018] In this embodiment, the second processing unit calculates the difference between the height difference data and the least-squares plane height difference data for each divided region as the determination height data. In this case, since the determination height data is calculated using the least-squares plane height difference data, the influence of differences in the warping state of the substrate during height measurement by the first measurement unit and the second measurement unit is suppressed. Therefore, the second processing unit can use the determination height data for each divided region to accurately determine whether the second region, which will be the mounting area for the large second component, is normal before mounting the second component onto the substrate.

[0019] In the component mounting system described above, the second processing unit may, for each of the plurality of divided regions, extract two-dimensional coordinate positions in the determination height data that are at or above a predetermined height threshold as specific two-dimensional coordinate positions, generate an extracted coordinate block by combining the extracted specific two-dimensional coordinate positions as a single block through expansion and contraction processing, and determine that the second region on the substrate is normal if the area of ​​the extracted coordinate block is less than a predetermined area threshold.

[0020] In this embodiment, the second processing unit can determine whether the second region, which is the mounting area for a large second component on the substrate, is normal or not by using the area of ​​an extracted coordinate block formed by combining two-dimensional coordinate positions that are above a predetermined height threshold in the determination height data. In this case, the second processing unit can determine that the second region is normal if the area of ​​the extracted coordinate block is less than a predetermined area threshold.

[0021] In the component mounting system described above, the second processing unit may set the number of times the expansion process and the reduction process are performed when generating the extracted coordinate block based on the external dimensions of the first component.

[0022] When a small first component exists as a foreign object in a second region which is a mounting region for a large second component on a substrate, the second region is not normal. For this reason, when determining whether the second region is normal using the area of an extracted coordinate block formed by combining two-dimensional coordinate positions having a height equal to or greater than a predetermined height threshold in the height data for determination, the outer dimension of the small first component can serve as a determination index. Accordingly, the second processing unit sets the number of expansion processes and contraction processes performed when generating the extracted coordinate block, based on the outer dimension of the small first component. As a result, the second processing unit can accurately determine, using the area of the extracted coordinate block, whether the second region, which is the mounting region for the large second component on the substrate, is normal.

[0023] In the component mounting system described above, the first measurement unit may be disposed upstream of the second measurement unit in the transport direction above the substrate transport path.

[0024] In this aspect, as the substrate is transported in the transport direction on the substrate transport path, the second measurement unit can acquire the second height data after the first measurement unit acquires the first height data.

[0025] In the component mounting system described above, when a plurality of the second regions are present on the substrate, the second processing unit may cause the second mounting unit to perform a mounting operation targeting the second regions that have been determined to be normal, after the determination targeting all the second regions using the height data for determination is completed.

[0026] When a foreign object such as a small first component is present in a second region, which is a mounting region for a large second component on a board, resulting in an abnormal state, a correction operation such as removing the foreign object from the second region is performed by an operator. In a case where a plurality of second regions exist on the board, when the large second component is mounted every time the determination targeting the second regions is completed, a situation may arise in which the correction operation is performed on the board with the second component already mounted thereon. In this case, there is a risk that a problem such as positional displacement of the second component already mounted on the board may occur due to impact or vibration generated during the correction operation or the like. In view of such circumstances, the second processing unit causes the second mounting unit to perform a mounting operation of mounting the second component on the second regions determined to be normal, after the determination targeting all the second regions using the height data for determination is completed.

[0027] The above component mounting system may further include a storage unit that stores the first height data and the second height data for each of the boards conveyed to the board conveyance path.

[0028] In this aspect, the first height data and the second height data stored in the storage unit can be used for investigation when a defective board occurs.

[0029] The above component mounting system may further include an imaging unit that images the second region from above to acquire two-dimensional specific image data when the second processing unit determines that the second region is not normal. In this case, the storage unit may store the specific image data in association with the first height data and the second height data.

[0030] In this aspect, in addition to the first height data and the second height data stored in the storage unit, the specific image data can be used for investigation when a defective board occurs.

[0031] The component mounting system described above may further include: a first imaging unit positioned above the substrate transport path, which captures the second region from above to acquire two-dimensional first image data before the first component is mounted by the first mounting unit based on the processing of the first processing unit; and a second imaging unit positioned above the substrate transport path, which captures the second region from above to acquire two-dimensional second image data after the first component has been mounted by the first mounting unit based on the processing of the first processing unit, and before the second component is mounted by the second mounting unit based on the processing of the second processing unit. In this case, the second processing unit may determine whether the second region on the substrate is normal or not using luminance difference data indicating the luminance difference between the first image data and the second image data, and the determination height data based on the height difference data.

[0032] In this embodiment, the second processing unit can more accurately determine whether the second region, which will be the mounting area for the large second component, is normal before mounting the large second component onto the substrate, by using a combination of determination using height data for determination based on height difference data and determination using brightness difference data. [Effects of the Invention]

[0033] As described above, the present invention provides a component mounting system that can accurately determine whether or not the mounting area for a large component is normal before mounting the large component onto the substrate. [Brief explanation of the drawing]

[0034] [Figure 1] Figure 1 shows the overall configuration of the component mounting system. [Figure 2] Figure 2 is a block diagram of the component mounting system according to the first embodiment. [Figure 3] Figure 3 is a flowchart showing the processing flow of the component mounting system according to the first embodiment. [Figure 4]Figure 4 illustrates the correction of height data acquired by the first and second measurement units provided in the component mounting system. [Figure 5] Figure 5 illustrates the calculation method for obtaining height difference data and determination height data from each height data point. [Figure 6] Figure 6 is a flowchart showing the processing flow of the component mounting system according to the second embodiment. [Figure 7] Figure 7 is a diagram illustrating the calculation method for obtaining height difference data and judgment height data for each divided region. [Figure 8] Figure 8 is a diagram illustrating the determination process using height data for each divided region. [Figure 9] Figure 9 is a block diagram of the main parts of the component mounting system according to the third embodiment. [Modes for carrying out the invention]

[0035] Embodiments of the present invention will be described below with reference to the attached drawings. Note that the following embodiments are merely examples of the present invention and do not limit the technical scope of the present invention. Furthermore, in the following, directional relationships will be described using the XYZ Cartesian coordinate system. In this case, mutually orthogonal directions on the horizontal plane are referred to as the X-axis and Y-axis directions, and the vertical directions perpendicular to the X-axis and Y-axis directions are referred to as the Z-axis direction.

[0036] [Overall configuration of the component mounting system] Figure 1 shows the overall configuration of the component mounting system 100. The component mounting system 100 is a system for mounting small first components P1 and large second components P2 on a substrate B such as a printed circuit board. The first components P1 are small components such as ICs, chip resistors, and chip capacitors. The second components P2 are large components such as BGAs (Ball Grid Arrays) and QFPs (Quad Flat Packages). The substrate B has a first region B1 where the first components P1 are mounted, and a second region B2 where the second components P2 are mounted.

[0037] The component mounting system 100 includes a component mounting line 1. The component mounting line 1 produces multiple mounted substrates in lot units, each in which a first component P1 is mounted in a first area B1 of the substrate B and a second component P2 is mounted in a second area B2 of the substrate B. In the component mounting line 1, for example, a printing device 11, a printing inspection device 12, a first mounting device 13, a second mounting device 14, a reflow oven 15, and a substrate inspection device 16 are arranged in tandem from the upstream side to the downstream side of the transport direction D1, on a substrate transport path TR that transports the substrate B in the transport direction D1 along the X axis. A loader LD is located at the upstream end of the component mounting line 1 to load the substrate B into the printing device 11, and an unloader ULD is located at the downstream end to remove the mounted substrates after production from the substrate inspection device 16.

[0038] The printing device 11 prints solder paste, such as solder paste, onto the substrate B using, for example, a screen printing method. The printing device 11 captures an image of the substrate B and, based on the captured image, recognizes FID (fiducial) marks on the substrate B, the size of the substrate B, and other information, while printing the solder paste onto the substrate B.

[0039] The printing inspection device 12 inspects whether the position, amount, and height of the solder paste printed on the substrate B are correct. The printing inspection device 12 captures an image of the substrate B on which the solder paste is printed, and based on the captured image, it recognizes the FID mark and the size of the substrate B, while inspecting the position and amount of solder paste on the substrate B.

[0040] The first mounting device 13 mounts the first component P1 to the first region B1 on the substrate B on which solder paste is printed. The second mounting device 14 mounts the second component P2 to the second region B2 on the substrate B on which solder paste is printed. In addition to mounting the second component P2 to the second region B2 on the substrate B, the second mounting device 14 may also be configured to mount the first component P1 to the first region B1 on the substrate B.

[0041] The reflow oven 15 heats the substrate B on which the first component P1 and the second component P2 are mounted, melting the solder and fixing the first component P1 and the second component P2 to the substrate B.

[0042] The circuit board inspection device 16 inspects the mounting status of the first component P1 and the second component P2 on the circuit board B.

[0043] [First Embodiment] (Configuration of the component mounting system) The component mounting system 100 according to the first embodiment will be described with reference to the block diagram in Figure 2 in addition to Figure 1. The component mounting system 100 includes a first mounting unit 2U1, a second mounting unit 2U2, a first processing unit 3U1, a second processing unit 3U2, a first measurement unit 4U1, a second measurement unit 4U2, a first imaging unit 5U1, a second imaging unit 5U2, a first substrate support unit 6U1, a second substrate support unit 6U2, and a storage unit 7U.

[0044] In the example shown in Figure 1, the first mounting unit 2U1, the first processing unit 3U1, the first measurement unit 4U1, the first imaging unit 5U1, and the first substrate support unit 6U1 are mounted in the first mounting device 13. The second mounting unit 2U2, the second processing unit 3U2, the second measurement unit 4U2, the second imaging unit 5U2, and the second substrate support unit 6U2 are mounted in the second mounting device 14. The storage unit 7U is mounted in the substrate inspection device 16.

[0045] In the first mounting apparatus 13, the first substrate support unit 6U1 positions the substrate B on the substrate transport path TR by supporting the substrate B from below with a plurality of first backup pins 6U11.

[0046] The first mounting unit 2U1 is positioned in the first mounting apparatus 13 so as to be movable in the X-axis and Y-axis directions above the substrate transport path TR. The first mounting unit 2U1 moves in the X-axis and Y-axis directions between a predetermined component supply unit and a substrate B supported by the first substrate support unit 6U1. The first mounting unit 2U1 attracts and holds the first component P1 supplied by the component supply unit at a predetermined negative pressure level. Then, the first mounting unit 2U1 releases the first component P1 it is attracting in response to the release of the negative pressure, thereby performing a mounting operation to mount the first component P1 to a first region B1 on the substrate B supported by the first substrate support unit 6U1.

[0047] The first imaging unit 5U1 is mounted on the first mounting unit 2U1. This allows the first imaging unit 5U1 to be positioned above the substrate transport path TR in the first mounting apparatus 13, so as to move in the X-axis and Y-axis directions as the first mounting unit 2U1 moves. The first imaging unit 5U1 is an imaging camera equipped with an image sensor such as a CMOS (Complementary metal-oxide-semiconductor) or a CCD (Charged-coupled device). Before the first mounting unit 2U1 performs its mounting operation, the first imaging unit 5U1 captures the FID marks on the substrate B supported by the first substrate support unit 6U1 from above, acquiring the first mark image data DM1. The first mark image data DM1 acquired by the first imaging unit 5U1 is input to the first processing unit 3U1.

[0048] The first measurement unit 4U1 is mounted on the first mounting unit 2U1. As a result, the first measurement unit 4U1 is positioned above the substrate transport path TR in the first mounting apparatus 13 so as to be movable in the X-axis and Y-axis directions as the first mounting unit 2U1 moves. Before the first mounting unit 2U1 mounts the first component P1 onto the substrate B, the first measurement unit 4U1 measures the height along the Z-axis direction of each of the multiple measurement points B21 (see Figure 4 below) within the second region B2, which is the mounting area for the second component P2 on the substrate B. Based on the measurement results of the height of the second region B2 on the substrate B, the first measurement unit 4U1 acquires first height data DB1, which shows the height data for each two-dimensional coordinate position (XY coordinate position) of the multiple measurement points B21 within the second region B2.

[0049] The first measurement unit 4U1 employs various methods for measuring height, such as a laser length measurement method, a stereo camera method, and a phase shift method. The first measurement unit 4U1 employing the laser length measurement method measures the height of multiple measurement points B21 within the second region B2 on the substrate B by irradiating the region B2 with laser light. In this case, the first measurement unit 4U1 measures the height of multiple measurement points B21 within the second region B2 by irradiating the second region B2 on the substrate B with laser light and receiving the reflected light from the second region B2. The first measurement unit 4U1 employing the stereo camera method has multiple lenses arranged at predetermined intervals in the X-axis or Y-axis direction, and acquires a stereo image by imaging the second region B2 on the substrate B from multiple different directions. The stereo image is an image that reproduces so-called binocular parallax, allowing for a three-dimensional spatial understanding. In this case, the first measurement unit 4U1 measures the height of each of the multiple measurement points B21 within the second region B2 based on the stereo image. The first measurement unit 4U1 employing a phase shift method measures the height of each of the multiple measurement points B21 within the second region B2 by taking images while changing the phase of the light irradiated onto the second region B2 on the substrate B. In this case, the first measurement unit 4U1 takes images each time pattern light, such as a sinusoidal wave pattern with a different phase, is irradiated onto the second region B2 on the substrate B, and measures the height of each of the multiple measurement points B21 within the second region B2 by analyzing the phase change originating from the surface shape of the second region B2 based on the brightness change in multiple images for each image taken.

[0050] The first measurement unit 4U1 measures the height of each of several measurement points B21 within the second region B2 on the substrate B before the first mounting unit 2U1 mounts the first component P1 onto the substrate B. For this reason, the first measurement unit 4U1 is not limited to being located in the first mounting device 13. The first measurement unit 4U1 may be located in the printing device 11 or printing inspection device 12 upstream of the first mounting device 13 in the transport direction D1 of the substrate B on the substrate transport path TR. Furthermore, if the second mounting device 14 is configured to mount the first component P1 on the first region B1 on the substrate B in addition to mounting the second component P2 on the second region B2 on the substrate B, the first measurement unit 4U1 may be located in the second mounting device 14. The first height data DB1 acquired by the first measurement unit 4U1 is input to the second processing unit 3U2 and the storage unit 7U described below.

[0051] The first processing unit 3U1 is composed of a processor that performs various calculations. In the first mounting device 13, after the first measurement unit 4U1 measures the height of the second region B2 on the substrate B, the first processing unit 3U1 causes the first mounting unit 2U1 to perform a mounting operation to mount the first component P1 on the first region B1 on the substrate B. At this time, the first processing unit 3U1 recognizes the FID marks on the substrate B based on the first mark image data DM1 input from the first imaging unit 5U1 and obtains first positional displacement data DA1 which indicates the amount of positional displacement of the substrate B relative to the reference position on the substrate transport path TR. Based on the first positional displacement data DA1, the first processing unit 3U1 causes the first mounting unit 2U1 to perform the mounting operation while recognizing the amount of positional displacement of the substrate B relative to the reference position on the substrate transport path TR.

[0052] The first positional displacement data DA1 is also data indicating the amount of positional displacement of substrate B relative to a reference position on the substrate transport path TR when the height of the second region B2 on substrate B is measured by the first measurement unit 4U1. The first positional displacement data DA1 includes the X positional displacement amount, which indicates the positional displacement amount in the X direction, the Y positional displacement amount, which indicates the positional displacement amount in the Y direction, and the R positional displacement amount, which indicates the positional displacement amount in the rotational direction around the Z axis along the Z direction.

[0053] The first processing unit 3U1 determines the measurement positions of the first measurement unit 4U1 in the X-axis and Y-axis directions above the substrate transport path TR, taking into consideration the X-axis and Y-axis displacement amounts included in the first position displacement data DA1. Then, when the first measurement unit 4U1 measures the height of the second region B2 on the substrate B, the first processing unit 3U1 moves the first mounting unit 2U1 so that the first measurement unit 4U1 is positioned at the measurement location. The first position displacement data DA1 obtained by the first processing unit 3U1 is input to the second processing unit 3U2, which will be described later.

[0054] The second substrate support unit 6U2 positions the substrate B on the substrate transport path TR in the second mounting apparatus 14 by supporting the substrate B from below with a plurality of second backup pins 6U21.

[0055] The second mounting unit 2U2 is positioned in the second mounting apparatus 14 so as to be movable in the X-axis and Y-axis directions above the substrate transport path TR. The second mounting unit 2U2 moves in the X-axis and Y-axis directions between a predetermined component supply unit and a substrate B supported by the second substrate support unit 6U2. The second mounting unit 2U2 attracts and holds the second component P2 supplied by the component supply unit at a predetermined negative pressure level. Then, the second mounting unit 2U2 releases the second component P2 it is attracting in response to the release of the negative pressure, thereby performing a mounting operation to mount the second component P2 to the second region B2 on the substrate B supported by the second substrate support unit 6U2. Furthermore, if the second mounting device 14 is configured to mount the second component P2 in the second region B2 on the substrate B, and also to mount the first component P1 in the first region B1 on the substrate B, then the second mounting unit 2U2 will mount the first component P1 in the first region B1 on the substrate B, and also mount the second component P2 in the second region B2 on the substrate B.

[0056] The second imaging unit 5U2 is mounted on the second mounting unit 2U2. This allows the second imaging unit 5U2 to be positioned above the substrate transport path TR in the second mounting apparatus 14, so as to move in the X-axis and Y-axis directions as the second mounting unit 2U2 moves. The second imaging unit 5U2 is an imaging camera equipped with an image sensor such as a CMOS or CCD. Before the second mounting unit 2U2 performs its mounting operation, the second imaging unit 5U2 captures images from above of the FID marks on the substrate B supported by the second substrate support unit 6U2, and acquires the second mark image data DM2. The second mark image data DM2 acquired by the second imaging unit 5U2 is input to the second processing unit 3U2.

[0057] The second measurement unit 4U2 is mounted on the second mounting unit 2U2. As a result, the second measurement unit 4U2 is positioned above the substrate transport path TR in the second mounting apparatus 14 so as to be movable in the X-axis and Y-axis directions as the second mounting unit 2U2 moves. The second measurement unit 4U2 measures the height along the Z-axis direction of multiple measurement points B21 within the second region B2, which is the mounting area for the second component P2 on the substrate B, after the first component P1 has been mounted on the substrate B by the first mounting unit 2U1 and before the second component P2 has been mounted on the substrate B by the second mounting unit 2U2. Based on the measurement results of the height of the second region B2 on the substrate B, the second measurement unit 4U2 acquires second height data DB2, which shows the height data for each two-dimensional coordinate position (XY coordinate position) of the multiple measurement points B21 within the second region B2.

[0058] The second measurement unit 4U2, like the first measurement unit 4U1, employs various height measurement methods, such as a laser length measurement method, a stereo camera method, and a phase shift method. The second measurement unit 4U2 employing the laser length measurement method measures the height of each of the multiple measurement points B21 within the second region B2 by irradiating the second region B2 on the substrate B with laser light. The second measurement unit 4U2 employing the stereo camera method has multiple lenses arranged at predetermined intervals in the X-axis or Y-axis direction. The second measurement unit 4U2 acquires a stereo image by imaging the second region B2 on the substrate B from multiple different directions, and measures the height of each of the multiple measurement points B21 within the second region B2 based on the stereo image. The second measurement unit 4U2 employing the phase shift method measures the height of each of the multiple measurement points B21 within the second region B2 by performing imaging while changing the phase of the light irradiated onto the second region B2 on the substrate B.

[0059] The second measurement unit 4U2 measures the height of each of the multiple measurement points B21 within the second region B2 on the substrate B after the first component P1 has been mounted on the substrate B by the first mounting unit 2U1, and before the second component P2 has been mounted on the substrate B by the second mounting unit 2U2. For this reason, the second measurement unit 4U2 is not limited to being located in the second mounting device 14. The second measurement unit 4U2 may be located in the first mounting device 13.

[0060] The second measurement unit 4U2 is positioned above the substrate transport path TR, downstream of the first measurement unit 4U1 in the transport direction D1. In other words, the first measurement unit 4U1 is positioned above the substrate transport path TR, upstream of the second measurement unit 4U2 in the transport direction D1. In this case, as the substrate B is transported along the substrate transport path TR in the transport direction D1, the first measurement unit 4U1 can acquire the first height data DB1, and then the second measurement unit 4U2 can acquire the second height data DB2.

[0061] The second height data DB2 acquired by the second measurement unit 4U2 is input to the second processing unit 3U2 and the storage unit 7U.

[0062] The second processing unit 3U2 is composed of a processor that performs various calculations. In the second mounting device 14, after the second measurement unit 4U2 measures the height of the second region B2 on the substrate B, the second processing unit 3U2 causes the second mounting unit 2U2 to perform a mounting operation to mount the second component P2 on the second region B2 on the substrate B. At this time, the second processing unit 3U2 recognizes the FID marks on the substrate B based on the second mark image data DM2 input from the second imaging unit 5U2 and obtains second positional displacement data DA2 which indicates the amount of positional displacement of the substrate B relative to the reference position on the substrate transport path TR. Based on the second positional displacement data DA2, the second processing unit 3U2 causes the second mounting unit 2U2 to perform the mounting operation while recognizing the amount of positional displacement of the substrate B relative to the reference position on the substrate transport path TR.

[0063] The second positional displacement data DA2 also represents the amount of positional displacement of substrate B relative to a reference position on the substrate transport path TR when the height of the second region B2 on substrate B is measured by the second measurement unit 4U2. The second positional displacement data DA2 includes the X positional displacement amount, which represents the positional displacement in the X-axis direction, the Y positional displacement amount, which represents the positional displacement in the Y-axis direction, and the R positional displacement amount, which represents the positional displacement in the rotational direction around the Z-axis along the Z-axis direction.

[0064] The second processing unit 3U2 determines the measurement positions of the second measurement unit 4U2 in the X-axis and Y-axis directions above the substrate transport path TR, taking into consideration the X-axis and Y-axis displacement amounts included in the second position displacement data DA2. Then, when the second measurement unit 4U2 measures the height of the second region B2 on the substrate B, the second processing unit 3U2 moves the second mounting unit 2U2 so that the second measurement unit 4U2 is positioned at the measurement location.

[0065] The second processing unit 3U2 obtains height difference data DH1, which shows the difference between the first height data DB1 obtained by the first measurement unit 4U1 and the second height data DB2 obtained by the second measurement unit 4U2. Then, the second processing unit 3U2 uses the determination height data DH3 based on the height difference data DH1 to determine whether the second region B2 on the substrate B is normal or not. If it determines that the second region B2 is normal, it causes the second mounting unit 2U2 to perform the mounting operation to mount the second component P2 on the second region B2 on the substrate B.

[0066] If multiple second regions B2 exist on the substrate B, the second processing unit 3U2, after completing the determination of all second regions B2 using the determination height data DH3, causes the second mounting unit 2U2 to perform the mounting operation on the second regions B2 that it has determined to be normal.

[0067] If foreign objects such as a small first component P1 are present in the second region B2, which is the mounting area for the large second component P2 on substrate B, and the area is not normal, the operator will perform corrective work such as removing the foreign objects from the second region B2. If there are multiple second regions B2 on substrate B, and the large second component P2 is mounted after the judgment for each second region B2 is completed, corrective work may be performed on substrate B with the second component P2 mounted on it. In this case, there is a risk that the shocks and vibrations that occur during the corrective work may cause malfunctions such as displacement of the second component P2 already mounted on substrate B. In light of these circumstances, the second processing unit 3U2, after the judgment for all second regions B2 using the judgment height data DH3 has been completed, causes the second mounting unit 2U2 to perform a mounting operation to mount the second component P2 to the second region B2 that has been determined to be normal.

[0068] Furthermore, if the second processing unit 3U2 determines that the second region B2 on the substrate B is not normal, the second imaging unit 5U2 may image the second region B2 from above to acquire two-dimensional specific image data GDS.

[0069] The storage unit 7U is located in the substrate inspection device 16. The storage unit 7U is not limited to being located in the substrate inspection device 16, but may also be located in, for example, the second mounting device 14. For each substrate B transported on the substrate transport path TR, the storage unit 7U stores the first height data DB1 acquired by the first measurement unit 4U1 and the second height data DB2 acquired by the second measurement unit 4U2. The first height data DB1 and second height data DB2 stored in the storage unit 7U can be used to investigate defective substrates, such as when a small first component P1 is found beneath a large second component P2. In addition, if the second processing unit 3U2 determines that the second region B2 on the substrate B is not normal, the storage unit 7U may store specific image data GDS acquired by the second imaging unit 5U2 in association with the first height data DB1 and second height data DB2. In this case, the specific image data GDS can be used together with the first height data DB1 and second height data DB2 to investigate defective substrates.

[0070] As described above, in the component mounting system 100 according to this embodiment, the first measurement unit 4U1 acquires first height data DB1 of the second region B2 on the substrate B where the large second component P2 is mounted, before the first mounting unit 2U1 mounts the small first component P1 based on the processing of the first processing unit 3U1. The second measurement unit 4U2 acquires second height data DB2 of the second region B2 on the substrate B after the first component P1 is mounted and before the second mounting unit 2U2 mounts the second component P2 based on the processing of the second processing unit 3U2.

[0071] The second processing unit 3U2 then calculates the height difference data DH1, which is the difference between the first height data DB1 and the second height data DB2, and uses the determination height data DH3 based on the height difference data DH1 to determine whether the second region B2 on the substrate B is normal or not. The determination height data DH3 based on the height difference data DH1 accurately represents the height change in the second region B2 on the substrate B before the mounting of the first component P1, before the mounting of the second component P2. Therefore, by using the determination height data DH3 based on the height difference data DH1, the second processing unit 3U2 can accurately determine whether the second region B2, which will be the mounting area for the second component P2, is normal or not before mounting the large second component P2 on the substrate B. Furthermore, if the second processing unit 3U2 determines that the second region B2 is normal, it causes the second mounting unit 2U2 to perform the mounting operation to mount the second component P2 in the second region B2. This makes it possible to suppress the occurrence of defective substrates in which foreign objects such as a small first component P1 are present beneath a large second component P2.

[0072] (Operation of the component mounting system) The operation of the component mounting system 100 will be described in detail with reference to Figures 3 to 5. Figure 3 is a flowchart showing the processing flow of the component mounting system 100 according to the first embodiment. Figure 4 is a diagram illustrating the correction of the height data DB1 and DB2 acquired by the first measurement unit 4U1 and the second measurement unit 4U2. Figure 5 is a diagram illustrating the calculation method for obtaining height difference data DH1 and determination height data DH3 from the height data DB1 and DB2.

[0073] When the substrate B, which has been transported along the substrate transport path TR, is brought into the first mounting device 13, the first substrate support unit 6U1 positions the substrate B on the substrate transport path TR by supporting it from below with a plurality of first backup pins 6U11. In this state, before the first mounting unit 2U1 performs the mounting operation, the first imaging unit 5U1 images the FID marks on the substrate B supported by the first substrate support unit 6U1 from above and acquires first mark image data DM1. The first processing unit 3U1 recognizes the FID marks on the substrate B based on the first mark image data DM1 acquired by the first imaging unit 5U1 and obtains first positional displacement data DA1 indicating the amount of positional displacement of the substrate B relative to a reference position on the substrate transport path TR (step a1).

[0074] The first processing unit 3U1 determines the measurement positions of the first measurement unit 4U1 in the X-axis and Y-axis directions, taking into consideration the X-axis and Y-axis displacement amounts included in the first position displacement data DA1. Then, the first processing unit 3U1 moves the first implementation unit 2U1 so that the first measurement unit 4U1 is positioned at the measurement position.

[0075] Before the first component P1 is mounted on the substrate B by the first mounting unit 2U1, the first measurement unit 4U1 measures the height of each of the multiple measurement points B21 within the second region B2 on the substrate B and acquires first height data DB1 which shows the height data for each of the multiple measurement points B21 within the second region B2 in terms of their two-dimensional coordinate positions (step a2). The first height data DB1 acquired by the first measurement unit 4U1 is stored in the storage unit 7U.

[0076] After the first measurement unit 4U1 measures the height of the second region B2 on the substrate B, the first processing unit 3U1 causes the first mounting unit 2U1 to perform a mounting operation (step a3). As a result, a small first component P1 is mounted on the first region B1 on the substrate B.

[0077] When substrate B is transported to the second mounting device 14 downstream of the first mounting device 13 in the transport direction D1, the second substrate support unit 6U2 positions substrate B on the substrate transport path TR by supporting it from below with a plurality of second backup pins 6U21. In this state, before the second mounting unit 2U2 performs the mounting operation, the second imaging unit 5U2 images the FID marks on substrate B supported by the second substrate support unit 6U2 from above and acquires second mark image data DM2. The second processing unit 3U2 recognizes the FID marks on substrate B based on the second mark image data DM2 acquired by the second imaging unit 5U2 and obtains second positional displacement data DA2 indicating the amount of positional displacement of substrate B relative to a reference position on the substrate transport path TR (step a4).

[0078] The second processing unit 3U2 determines the measurement positions of the second measurement unit 4U2 in the X-axis and Y-axis directions, taking into account the X-axis and Y-axis displacement amounts included in the second position displacement data DA2. Then, the second processing unit 3U2 moves the second implementation unit 2U2 so that the second measurement unit 4U2 is positioned at the measurement position.

[0079] The second measurement unit 4U2 measures the height of each of the multiple measurement points B21 within the second region B2 on the substrate B after the first component P1 has been mounted on the substrate B by the first mounting unit 2U1 and before the second component P2 has been mounted on the substrate B by the second mounting unit 2U2, and acquires second height data DB2 which shows the height data for each of the multiple measurement points B21 within the second region B2 in terms of their two-dimensional coordinate positions (step a5). The second height data DB2 acquired by the second measurement unit 4U2 is stored in the storage unit 7U.

[0080] As shown in Figure 4, the second processing unit 3U2 corrects the R position shift amount of at least one of the first height data DB1 and second height data DB2 data so that the two-dimensional coordinate positions (XY coordinate positions) of the multiple measurement points B21 coincide between the first height data DB1 and the second height data DB2, based on the first position shift data DA1 and the second position shift data DA2 (step a6). At this time, the second processing unit 3U2 may also correct the X position shift amount and the Y position shift amount of at least one of the first height data DB1 and second height data DB2 data. The second processing unit 3U2 can correct at least one of the first height data DB1 and second height data DB2 data by taking into account the position shift amount of the substrate B on the substrate transport path TR during height measurement by the first measurement unit 4U1 and the second measurement unit 4U2, respectively. In this case, the height data DH3 for determination, based on the height difference data DH1 using the corrected first height data DB1 and second height data DB2, will more accurately represent the height change before and after the mounting of the first component P1 in the second region B2 on the substrate B before the mounting of the second component P2.

[0081] Furthermore, if the first scale, which represents the two-dimensional scale of the first height data DB1, and the second scale, which represents the two-dimensional scale of the second height data DB2, are different, the second processing unit 3U2 may correct at least one of the data from the first height data DB1 and the second height data DB2 so that the first scale and the second scale match. In this way, the second processing unit 3U2 can correct at least one of the data from the first height data DB1 and the second height data DB2 so that the respective scales of the first height data DB1 and the second height data DB2 match. In this case, the height data DH3 for determination based on the height difference data DH1 using the corrected first height data DB1 and second height data DB2 will be data that more accurately represents the height change before and after the mounting of the first component P1 in the second region B2 on the substrate B before the mounting of the second component P2.

[0082] As shown in Figure 5, the second processing unit 3U2 obtains height difference data DH1, which shows the difference between the first height data DB1 and the second height data DB2 after positional misalignment correction and scale correction (step a7).

[0083] During height measurement by the first measurement unit 4U1 and the second measurement unit 4U2, deformation such as warping may occur in the substrate B on the substrate transport path TR. If the warping state of the substrate B differs between the substrate B supported by the first substrate support unit 6U1 during height measurement by the first measurement unit 4U1 and the substrate B supported by the second substrate support unit 6U2 during height measurement by the second measurement unit 4U2, it is necessary to obtain determination height data DH3 based on height difference data DH1 in order to suppress the effect of the difference in the warping state of the substrate B. Therefore, the second processing unit 3U2 obtains least squares plane height difference data DH2, which shows the difference between the first least squares plane data DC1, which shows the least squares plane data of the first height data DB1, and the second least squares plane data DC2, which shows the least squares plane data of the second height data DB2 (step a8).

[0084] Then, the second processing unit 3U2 calculates the difference between the height difference data DH1 and the least-squares plane height difference data DH2 as the determination height data DH3 (step a9). In this case, since the determination height data DH3 is obtained using the least-squares plane height difference data DH2, the influence of differences in the warping state of the substrate B during height measurement by the first measurement unit 4U1 and the second measurement unit 4U2 is suppressed. Therefore, the second processing unit 3U2 can use the determination height data DH3 to accurately determine whether the second region B2, which will be the mounting area for the large second component P2, is normal or not before mounting the second component P2 on the substrate B (step a10).

[0085] If no foreign objects such as small first components P1 are present in the second region B2 on substrate B, and it is determined that the second region B2 is normal (YES in step a10), the second processing unit 3U2 causes the second mounting unit 2U2 to perform a mounting operation to mount the second component P2 in the second region B2 on substrate B (step a11). This suppresses the occurrence of defective substrates in which foreign objects such as small first components P1 are present beneath the large second component P2.

[0086] On the other hand, if it is determined that the second region B2 on substrate B is not normal (NO in step a10), the second processing unit 3U2 instructs the second imaging unit 5U2 to image the second region B2 from above and acquire two-dimensional specific image data GDS (step a101). The specific image data GDS acquired by the second imaging unit 5U2 is stored in the storage unit 7U. Furthermore, the second processing unit 3U2 outputs error information to notify that the second region B2 on substrate B is not normal (step a102). When error information is output from the second processing unit 3U2, the operator performs corrective work such as removing foreign matter from the second region B2 on substrate B. When corrective work completion information indicating that such corrective work has been completed is input (step a103), the second processing unit 3U2 instructs the second mounting unit 2U2 to perform a mounting operation to mount the second component P2 on the second region B2 on substrate B (step a11). This makes it possible to suppress the occurrence of defective substrates in which foreign objects such as a small first component P1 are present beneath a large second component P2.

[0087] [Second Embodiment] The component mounting system 100 according to the second embodiment will be described with reference to Figures 6 to 8. Figure 6 is a flowchart showing the processing flow of the component mounting system 100 according to the second embodiment. Figure 7 is a diagram illustrating a calculation method for obtaining height difference data DH1 and determination height data DH3 for each divided region B2A of the second region B2 on the substrate B. Figure 8 is a diagram illustrating determination using the determination height data DH3 for each divided region B2A.

[0088] The component mounting system 100 according to the second embodiment differs from the first embodiment in the calculation method used by the second processing unit 3U2 to obtain the height difference data DH1 and the determination height data DH3. Other than this, the component mounting system 100 according to the second embodiment is the same as the first embodiment.

[0089] When the substrate B, which has been transported along the substrate transport path TR, is brought into the first mounting device 13, the first substrate support unit 6U1 positions the substrate B on the substrate transport path TR by supporting it from below with a plurality of first backup pins 6U11. In this state, the first measurement unit 4U1 measures the height of each of the plurality of measurement points B21 within the second region B2 on the substrate B before the first component P1 is mounted on the substrate B by the first mounting unit 2U1, and acquires first height data DB1 which shows the height data for each of the plurality of measurement points B21 within the second region B2 relative to their respective two-dimensional coordinate positions (step b1). The first height data DB1 acquired by the first measurement unit 4U1 is stored in the storage unit 7U.

[0090] After the first measurement unit 4U1 measures the height of the second region B2 on the substrate B, the first processing unit 3U1 causes the first mounting unit 2U1 to perform a mounting operation (step b2). As a result, a small first component P1 is mounted on the first region B1 on the substrate B.

[0091] When the substrate B is transported to the second mounting device 14 downstream of the first mounting device 13 in the transport direction D1, the second substrate support unit 6U2 positions the substrate B on the substrate transport path TR by supporting it from below with a plurality of second backup pins 6U21. In this state, the second measurement unit 4U2 measures the height of each of the plurality of measurement points B21 within the second region B2 on the substrate B after the first component P1 has been mounted on the substrate B by the first mounting unit 2U1 and before the second component P2 has been mounted on the substrate B by the second mounting unit 2U2, and acquires second height data DB2 which shows the height data for each of the plurality of measurement points B21 within the second region B2 in relation to their respective two-dimensional coordinate positions (step b3). The second height data DB2 acquired by the second measurement unit 4U2 is stored in the storage unit 7U.

[0092] The second processing unit 3U2 may perform positional displacement correction and scale correction on at least one of the data from the first height data DB1 and the second height data DB2, similar to the case of the first embodiment described above.

[0093] Furthermore, as shown in Figure 7, the second processing unit 3U2 divides the second region B2 on the substrate B into multiple divided regions B2A. Then, for each of the multiple divided regions B2A, the second processing unit 3U2 calculates height difference data DH1, which shows the difference between the first height data DB1 and the second height data DB2 (step b4).

[0094] During height measurement by the first measurement unit 4U1 and the second measurement unit 4U2, deformation such as warping may occur in the substrate B on the substrate transport path TR. If the warping state of the substrate B differs between the height measurement by the first measurement unit 4U1 and the height measurement by the second measurement unit 4U2, it is necessary to obtain height difference data DH1 in a way that suppresses the influence of the difference in the warping state of the substrate B. Therefore, the second processing unit 3U2 divides the second region B2 on the substrate B, which is the target of height measurement by the first measurement unit 4U1 and the second measurement unit 4U2, into multiple divided regions B2A, and obtains height difference data DH1 for each of the divided regions B2A. In this way, the second processing unit 3U2 can obtain height difference data DH1 for each divided region B2A in a way that suppresses the influence of the difference in the warping state of the substrate B during height measurement by the first measurement unit 4U1 and the second measurement unit 4U2. Therefore, the second processing unit 3U2 can accurately determine whether the second region B2, which will be the mounting area for the large second component P2, is normal or not before mounting the large second component P2 on the substrate B, using the determination height data DH3 based on the height difference data DH1 for each divided region B2A.

[0095] In this case, the second processing unit 3U2 may set the two-dimensional size B2AS of the multiple divided regions B2A according to the warping state of the substrate B on the substrate transport path TR during height measurement by the first measurement unit 4U1 and the second measurement unit 4U2, respectively. This allows the second processing unit 3U2 to obtain height difference data DH1 for each divided region B2A of an appropriate size B2AS according to the warping state of the substrate B. Specifically, the second processing unit 3U2 sets the two-dimensional size B2AS of the multiple divided regions B2A based on the spacing of the first backup pins 6U11 of the first substrate support unit 6U1 and the spacing of the second backup pins 6U21 of the second substrate support unit 6U2. In this case, the second processing unit 3U2 sets the two-dimensional size B2AS of the multiple divided regions B2A to correspond to, for example, half the distance between the spacing of the first backup pins 6U11 and the second backup pins 6U21. Alternatively, the second processing unit 3U2 sets the two-dimensional size B2AS of the multiple divided regions B2A based on the external dimensions of the first component P1 and the second component P2, and the allowable amount of warpage of the substrate B. In this case, the second processing unit 3U2, for example, calculates a division value by dividing the allowable amount of warpage of the substrate B by 1 / 4 of the external dimensions of the first component P1, and sets the two-dimensional size B2AS of the multiple divided regions B2A to a value corresponding to the external dimensions of the second component P2 divided by this division value.

[0096] After obtaining the height difference data DH1 for each divided region B2A, the second processing unit 3U2 obtains the least squares plane height difference data DH2 for each divided region B2A, which is the difference between the first least squares plane data DC1, which shows the least squares plane data of the first height data DB1, and the second least squares plane data DC2, which shows the least squares plane data of the second height data DB2 (step b5).

[0097] Then, the second processing unit 3U2 calculates the difference between the height difference data DH1 and the least-squares plane height difference data DH2 for each divided region B2A as the determination height data DH3 (step b6). In this case, since the determination height data DH3 is calculated using the least-squares plane height difference data DH2, the data is less affected by the difference in the warping state of the substrate B during height measurement by the first measurement unit 4U1 and the second measurement unit 4U2. Therefore, the second processing unit 3U2 can accurately determine whether the second region B2, which will be the mounting area for the large second component P2, is normal or not before mounting the large second component P2 on the substrate B, using the determination height data DH3 for each divided region B2A.

[0098] After obtaining the judgment height data DH3 for each divided region B2A, the second processing unit 3U2 extracts, as shown in Figure 8, two-dimensional coordinate positions (XY coordinate positions) in the judgment height data DH3 that are above a predetermined height threshold HT for each of the multiple divided regions B2A as specific two-dimensional coordinate positions SXY (step b7). Then, the second processing unit 3U2 generates an extracted coordinate block MS by combining the pixel group indicated by the extracted specific two-dimensional coordinate position SXY into a single block through expansion and contraction processing (step b8).

[0099] The second processing unit 3U2 may set the number of expansion and contraction processes when generating the extracted coordinate block MS based on the external dimensions of the first component P1. If a small first component P1 exists as a foreign object in the second region B2, which is the mounting area for the large second component P2 on substrate B, then the second region B2 is not normal. Therefore, when determining whether the second region B2 is normal using the area of ​​the extracted coordinate block MS, which is formed by combining specific two-dimensional coordinate positions SXY that are above a predetermined height threshold HT in the judgment height data DH3, the external dimensions of the small first component P1 can serve as a judgment indicator. Accordingly, the second processing unit 3U2 sets the number of expansion and contraction processes when generating the extracted coordinate block MS based on the external dimensions of the small first component P1. As a result, the second processing unit 3U2 can accurately determine whether the second region B2, which is the mounting area for the large second component P2 on substrate B, is normal using the area of ​​the extracted coordinate block MS.

[0100] Specifically, the second processing unit 3U2 determines whether the second region B2 on substrate B is normal by determining whether the area of ​​the extracted coordinate block MS is less than a predetermined area threshold AT (step b9). If the area of ​​the extracted coordinate block MS is less than the predetermined area threshold AT (YES in step b9), the second processing unit 3U2 determines that the second region B2 on substrate B is normal and causes the second mounting unit 2U2 to perform a mounting operation to mount the second component P2 on the second region B2 on substrate B (step b10). This suppresses the occurrence of defective substrates in which foreign objects such as a small first component P1 are present beneath a large second component P2.

[0101] On the other hand, if the area of ​​the extracted coordinate block MS is not less than a predetermined area threshold AT (NO in step b9), the second processing unit 3U2 determines that the second region B2 on the substrate B is not normal and instructs the second imaging unit 5U2 to image the second region B2 from above and acquire two-dimensional specific image data GDS (step b91). The specific image data GDS acquired by the second imaging unit 5U2 is stored in the storage unit 7U. Furthermore, the second processing unit 3U2 outputs error information to notify that the second region B2 on the substrate B is not normal (step b92). When error information is output from the second processing unit 3U2, the operator performs corrective work such as removing foreign matter from the second region B2 on the substrate B. When corrective work completion information indicating that such corrective work has been completed is input (step b93), the second processing unit 3U2 instructs the second mounting unit 2U2 to perform a mounting operation to mount the second component P2 on the second region B2 on the substrate B (step b10). This makes it possible to suppress the occurrence of defective substrates in which foreign objects such as a small first component P1 are present beneath a large second component P2.

[0102] The second processing unit 3U2 may learn at least one of the following as input data: the first height data DB1 and the second height data DB2 when it is determined that the second region B2 on the substrate B is normal, and the first height data DB1 and the second height data DB2 when it is determined that the second region B2 on the substrate B is not normal. Based on the learning results, it may then use an AI method to determine whether or not the second region B2 on the substrate B is normal.

[0103] [Third Embodiment] The component mounting system 100 according to the third embodiment will be described with reference to Figure 9. Figure 9 is a block diagram of the main parts of the component mounting system 100 according to the third embodiment. The component mounting system 100 according to the third embodiment differs from the first embodiment in that the second processing unit 3U2 determines the second region B2 on the substrate B. Other than this, the component mounting system 100 according to the third embodiment is the same as the first embodiment.

[0104] In the component mounting system 100 according to the third embodiment, the first imaging unit 5U1 acquires two-dimensional first image data GD1 by imaging a second region B2 on the substrate B from above, before the first component P1 is mounted by the first mounting unit 2U1 based on the processing of the first processing unit 3U1. The first image data GD1 acquired by the first imaging unit 5U1 is input to the second processing unit 3U2. The second imaging unit 5U2 acquires two-dimensional second image data GD2 by imaging a second region B2 on the substrate B from above, after the first component P1 has been mounted by the first mounting unit 2U1 based on the processing of the first processing unit 3U1, and before the second component P2 is mounted by the second mounting unit 2U2 based on the processing of the second processing unit 3U2. The second image data GD2 acquired by the second imaging unit 5U2 is input to the second processing unit 3U2.

[0105] The second processing unit 3U2 uses luminance difference data DD1, which shows the luminance difference between the first image data GD1 and the second image data GD2, and height data DH3 for determination, which is based on height difference data DH1, which shows the difference between the first height data DB1 and the second height data DB2, to determine whether the second region B2 on the substrate B is normal or not. In this case, by using a combination of determination using height data DH3 based on height difference data DH1 and determination using luminance difference data DD1, the second processing unit 3U2 can determine with even greater accuracy whether the second region B2, which will be the mounting area for the large second component P2, is normal or not before mounting the second component P2 on the substrate B. [Explanation of Symbols]

[0106] 1. Component mounting line 100-component mounting system 2U1 First Implementation Unit 2U2 Second Implementation Unit 3U1 First Processing Unit 3U2 Second Processing Unit 4U1 First Measurement Unit 4U2 Second Measurement Unit 5U1 First Imaging Unit 5U2 Second Imaging Unit 6U1 First circuit board support unit 6U2 Second board support unit 7U Memory Unit B substrate B1 1st area B2 2nd area B21 Measurement Point B2A split area DA1 First position shift data DA2 Second position shift data DB1 First Height Data DB2 Second Height Data DC1 First Least Squares Plane Data DC2 Second Least Squares Plane Data DD1 Brightness Difference Data DH1 Height Difference Data DH2 Least Squares Plane Height Difference Data DH3 Height data for determination GD1 Image Data 1 GD2 2nd Image Data GDS Specific Image Data P1 Part 1 P2 Part 2 TR substrate transport path

Claims

1. A first mounting unit is positioned above a substrate transport path that transports the substrate in the transport direction and performs a mounting operation to mount a first component in a first region on the substrate, A first processing unit that performs processing to cause the first implementation unit to perform implementation operations, A second mounting unit is positioned above the substrate transport path, downstream of the first mounting unit in the transport direction, and performs a mounting operation to mount a second component, which is larger than the first component, in a second region on the substrate that is different from the first region. A second processing unit that performs processing to cause the second implementation unit to perform implementation operations, A first measurement unit is positioned above the substrate transport path and, before the first component is mounted by the first mounting unit based on the processing of the first processing unit, measures the height of each of the multiple measurement points in the second region and acquires first height data indicating the height data for each of the multiple measurement points relative to their respective two-dimensional coordinate positions. The system includes a second measurement unit positioned above the substrate transport path, which measures the height of each of the plurality of measurement points within the second region and acquires second height data indicating the height data of each of the plurality of measurement points relative to the respective two-dimensional coordinate positions, after the first component has been mounted by the first mounting unit based on the processing of the first processing unit and before the second component has been mounted by the second mounting unit based on the processing of the second processing unit, A component mounting system comprising: a second processing unit which obtains height difference data showing the difference between the first height data and the second height data; a determination height data based on the height difference data which determines whether the second region on the substrate is normal; and a second mounting unit which performs a mounting operation if it determines that the second region is normal.

2. The second processing unit is, First positional displacement data indicating the amount of positional displacement of the substrate relative to a reference position on the substrate transport path during measurement by the first measurement unit, and second positional displacement data indicating the amount of positional displacement of the substrate relative to a reference position on the substrate transport path during measurement by the second measurement unit are acquired. A component mounting system according to claim 1, wherein, based on the first positional displacement data and the second positional displacement data, at least one of the first height data and the second height data is corrected so that the two-dimensional coordinate positions of the plurality of measurement points coincide between the first height data and the second height data, and the height difference data is obtained using the corrected data.

3. The component mounting system according to claim 1, wherein the second processing unit, if the first scale indicating the two-dimensional scale of the first height data and the second scale indicating the two-dimensional scale of the second height data are different, corrects at least one of the first height data and the second height data so that the first scale and the second scale match, and uses the corrected data to obtain the height difference data.

4. The component mounting system according to claim 1, wherein the second processing unit divides the second region into a plurality of divided regions, obtains the height difference data for each of the plurality of divided regions, and determines whether the second region on the substrate is normal using the determination height data based on the height difference data for each of the plurality of divided regions.

5. The component mounting system according to claim 4, wherein the second processing unit sets the two-dimensional size of the plurality of divided regions according to the warping state of the substrate on the substrate transport path during measurement by the first measurement unit and the second measurement unit, respectively.

6. The second processing unit is, For each of the plurality of divided regions, the height difference data is obtained, and least squares plane height difference data is obtained that shows the difference between the first least squares plane data showing the least squares plane data of the first height data and the second least squares plane data showing the least squares plane data of the second height data, and further, the difference between the height difference data and the least squares plane height difference data is obtained as the determination height data. The component mounting system according to claim 4, wherein the determination of whether the second region on the substrate is normal is determined using the determination height data for each of the plurality of divided regions.

7. The component mounting system according to claim 6, wherein the second processing unit extracts two-dimensional coordinate positions in the determination height data that are at or above a predetermined height threshold for each of the plurality of divided regions as specific two-dimensional coordinate positions, generates an extracted coordinate block by combining the extracted specific two-dimensional coordinate positions as a single block through expansion and contraction processing, and determines that the second region on the substrate is normal if the area of ​​the extracted coordinate block is less than a predetermined area threshold.

8. The component mounting system according to claim 7, wherein the second processing unit sets the number of times the expansion process and the reduction process are performed when generating the extracted coordinate block based on the external dimensions of the first component.

9. The component mounting system according to any one of claims 1 to 8, wherein the first measurement unit is positioned above the substrate transport path and upstream of the second measurement unit in the transport direction.

10. The component mounting system according to any one of claims 1 to 8, wherein, if there are multiple second regions on the substrate, the second processing unit, after completing a determination for all second regions using the determination height data, causes the second mounting unit to perform a mounting operation on the second regions that have been determined to be normal.

11. The component mounting system according to any one of claims 1 to 8, further comprising a storage unit for storing the first height data and the second height data for each substrate transported on the substrate transport path.

12. If the second processing unit determines that the second region is not normal, the system further includes an imaging unit that images the second region from above to acquire specific two-dimensional image data. The component mounting system according to claim 11, wherein the storage unit stores the specific image data in association with the first height data and the second height data.

13. A first imaging unit is positioned above the substrate transport path and, before the first component is mounted by the first mounting unit based on the processing of the first processing unit, it images the second region from above to acquire two-dimensional first image data, The system further comprises a second imaging unit positioned above the substrate transport path, which captures the second region from above to acquire two-dimensional second image data after the first component has been mounted by the first mounting unit based on the processing of the first processing unit, and before the second component has been mounted by the second mounting unit based on the processing of the second processing unit, The second processing unit is, A component mounting system according to any one of claims 1 to 8, wherein it determines whether the second region on the substrate is normal using luminance difference data indicating the luminance difference between the first image data and the second image data, and the determination height data based on the height difference data.

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