Microporous aligned film and its manufacturing method, classification filter, optical control filter and anisotropic conductive connector

Abstract

A microporous aligned film that eliminates the difficulty of handling films without relying on fluorine components, and a method for manufacturing the same. [Solution] A microporous aligned film 1 comprising a film substrate 2 having a plurality of regularly aligned through holes 3, a first vapor-deposited film 4 on the first surface of the film substrate 2 in which the portion overlapping with the plurality of through holes 3 is designated as a first hole portion 5, and a second vapor-deposited film 6 on the second surface of the film substrate 2 in which the portion overlapping with the plurality of through holes 3 is designated as a second hole portion 7, wherein a plurality of communicating holes are formed in which the through holes 3, the first hole portion 5 and the second hole portion 7 are in communication, and the first vapor-deposited film 4 and the second vapor-deposited film 6 contain silicon as a constituent element.

Description

Technical Field

[0001] The present invention relates to a micropore-aligned film, a method for producing the same, a classification filter, a light control filter, and an anisotropic conductive connector.

Background Art

[0002] Micropore-aligned films in which a plurality of fine through-holes are regularly aligned are applied in various fields. For example, a micropore-aligned film formed of a light-shielding material to serve as a light-shielding portion, with the portion where a plurality of micropores are formed serving as a light-transmitting portion, can be used as an optical film that transmits only light in a specific direction, or a narrow-viewing-angle peeping prevention film. It can also be used for classification filters, anisotropic conductive connectors, and the like.

[0003] Micropore-aligned films are mainly formed of rubber, particularly silicone rubber, from the viewpoint of processability and physical properties. However, films made of rubber, especially silicone rubber, have adhesiveness (tackiness), poor slippage, and are easily charged. Therefore, the films tend to stick to each other or to smooth surfaces of other materials and are difficult to peel off. Furthermore, there is also a problem that dust in the air, proteins, and the like are easily adsorbed. In order to eliminate such difficulty in handling the film, Patent Document 1 proposes introducing a fluorine component to the surface of a silicone rubber sheet by dry-etching the silicone rubber sheet in a gas atmosphere containing fluorine and oxygen.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of Invention

Problems to be Solved by the Invention

[0005] However, microporous aligned films incorporating fluorine components, such as those described in Patent Document 1, may be subject to manufacturing and usage restrictions from an environmental protection standpoint. Therefore, the object of the present invention is to provide a microporous aligned film that eliminates the difficulty of handling films without relying on fluorine components, a method for manufacturing the same, a classification filter, an optical control filter, and an anisotropic conductive connector using the microporous aligned film. [Means for solving the problem]

[0006] The present invention includes the following embodiments. [1] A microporous aligned film comprising a film substrate having a plurality of regularly aligned through holes, and a vapor-deposited film on at least one surface of the film substrate in which the portion overlapping with the plurality of through holes is a hole, The multiple communicating holes, which are connected to the holes in the deposited film, penetrate the micro-pore aligned film. The aforementioned vapor-deposited film is a microporous aligned film containing silicon as a constituent element. [2] The micropore alignment film according to [1], wherein the film substrate is made of silicone rubber. [3] The microporous aligned film according to [1] or [2], wherein the deposited film comprises one or both silicon oxide and silicon carbide. A method for manufacturing a microporous aligned film according to any one of [1] to [3], wherein the deposited film is formed on at least one surface of the film substrate by plasma CVD. [5] A classification filter having a micropore alignment film as described in any of [1] to [3]. [6] A light control filter having a micropore alignment film as described in any of [1] to [3], A light control filter comprising a light-transmitting portion composed of the plurality of communication holes and a light-shielding portion consisting of the portion other than the plurality of communication holes. An anisotropic conductive connector having a microporous aligned film as described in any of [7] [1] to [3], An anisotropic conductive connector comprising an insulating portion consisting of parts other than the plurality of communication holes, and a conductive portion in which each of the plurality of communication holes is filled with a conductive member containing a conductive material. [Effects of the Invention]

[0007] The present invention provides a pore-aligned film and a method for manufacturing the same, which can eliminate the difficulty in handling films. Furthermore, the classification filter, optical control filter, and anisotropic conductive connector of the present invention are easy to handle because they utilize the pore alignment film of the present invention. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic diagram of a micro-porous aligned film according to one embodiment, viewed from the thickness direction. [Figure 2] Figure 1 is a cross-sectional view of the microporous aligned film, AA. [Figure 3] This is a schematic cross-sectional view showing an example of a mold used in the manufacture of a film substrate for a micro-porous aligned film according to the embodiment. [Figure 4] This is an explanatory diagram illustrating the process of manufacturing film substrates. [Figure 5] Figure 3 is a schematic cross-sectional view showing a film substrate precursor molded using the mold shown. [Figure 6] Figure 4 is a schematic cross-sectional view showing the film substrate obtained from the film substrate precursor. [Figure 7] This is an explanatory diagram illustrating the process of forming a vapor-deposited film on the film substrate shown in Figure 4. [Figure 8] This is a schematic plan view showing an example of a framed film, in which a frame is provided on a micro-porous aligned film according to one embodiment. [Figure 9] This is a schematic cross-sectional view showing an example of a classification apparatus equipped with a classification filter according to the embodiment. [Modes for carrying out the invention]

[0009] Hereinafter, the present invention will be described with reference to the drawings. Note that the dimensions and the like of the drawings illustrated in the following description are not exact. For convenience of explanation, the thickness direction and the size of holes in particular are shown with emphasis. The present invention can be implemented with appropriate modifications within a range that does not alter the gist thereof. In the present specification and claims, a numerical range represented by "~" means a numerical range that includes the numerical values before and after "~" as the lower limit value and the upper limit value. For example, A to B is synonymous with A or more and B or less.

[0010] [Micropore-aligned film] Figure 1 is a view of a micropore-aligned film according to an example of an embodiment, viewed from the thickness direction. Figure 2 is an A-A cross-sectional view of the micropore-aligned film of Figure 1. The example micropore-aligned film 1 shown in Figure 1 and Figure 2 is composed of a film base material 2, a first deposited film 4, and a second deposited film 6. The first deposited film 4 is formed on the first surface (the upper side in the drawing) of the film base material 2, and the second deposited film 6 is formed on the second surface (the lower side in the drawing) of the film base material 2.

[0011] A plurality of regularly aligned through-holes 3 are formed in the film base material 2. Further, the first deposited film 4 is formed with a first hole portion 5 at a position overlapping the opening of the through-hole 3 on the first surface in plan view, and the second deposited film 6 is formed with a second hole portion 7 at a position overlapping the opening of the through-hole 3 on the second surface in plan view.

[0012] The through-hole 3, the first hole portion 5, and the second hole portion 7 each formed at overlapping positions communicate with each other to form a communication hole 8 as a whole. That is, a plurality of regularly aligned communication holes 8 are formed in the micropore-aligned film 1. Note that the peripheral edges along the four sides of the micropore-aligned film 1 are defined as a peripheral edge portion 9 where no communication holes 8 are formed.

[0013] The planar shape of the microporous aligned film 1, viewed from the thickness direction, is typically rectangular, as shown in Figure 1, but is not limited to this. The planar shape can be appropriately selected depending on the application; for example, circular, elliptical, polygonal, or any other shape can be used. The size of the microporous aligned film 1 is also not particularly limited and can be appropriately designed depending on the application. Hereinafter, for convenience, the longitudinal direction of the micro-porous aligned film 1 in the planar direction will be the X direction, the short direction will be the Y direction, and the direction perpendicular to the XY plane (thickness direction) will be the Z direction.

[0014] The material constituting the film substrate 2 is not particularly limited, and for example, rubber (thermosetting elastomer), thermoplastic elastomer, resin, etc. can be used. Among these, elastomers, which are elastic materials, are preferred, and insulating rubber materials that are insulating and can be press-molded are particularly preferred. Examples of elastomers include thermosetting elastomers such as urethane rubber, isoprene rubber, ethylene propylene rubber, natural rubber, ethylene propylene diene rubber, styrene butadiene rubber, and silicone rubber; thermoplastic elastomers such as urethane-based, ester-based, styrene-based, olefin-based, and butadiene-based elastomers; or composites thereof. These may be used individually or in combination of two or more types. As the material constituting the film substrate 2, silicone rubber is preferred because it has low compression set and excellent heat resistance.

[0015] The materials constituting the film substrate 2 may contain known additives such as antioxidants, dyes, pigments, fillers, and leveling agents. These additives may be used individually or in combination of two or more.

[0016] The film substrate 2 preferably has a Shore A hardness of A25° to A90°, more preferably A40° to A75°, and even more preferably A50° to A70°, as measured using a durometer in accordance with JIS K6253-3:2012.

[0017] The thickness of the film substrate 2 is preferably 50 to 1,000 μm, more preferably 80 to 500 μm, and even more preferably 100 to 300 μm. If the thickness of the film substrate 2 is above the lower limit, sufficient rigidity is easily ensured, tearing of the film substrate 2 is suppressed, and handling is improved. If the thickness of the film substrate 2 is below the upper limit, the formation of through holes 3 becomes easier, the amount of material used can be reduced, and release from the mold is also improved. The thickness of the film substrate 2 is determined as the average value of the thicknesses measured at any 10 locations.

[0018] Each through-hole 3 formed in the film substrate 2 penetrates from one surface of the film substrate 2 to the other surface. The opening shape of the through-hole 3 and the cross-sectional shape when cut in a direction parallel to the XY plane are typically circular, but are not limited to these. The opening shape and cross-sectional shape of the through-hole 3 may be elliptical, quadrilateral, or other polygonal. The opening shape and cross-sectional shape of each through-hole 3 are preferably the same, but may be different.

[0019] The average aperture diameter of the through-holes 3 is preferably 5 to 100 μm, and more preferably 10 to 50 μm. The larger the average aperture diameter of the through-holes 3, the more easily the filter allows larger particles and more light to pass through, while the smaller the average aperture diameter of the through-holes 3, the more easily the filter allows only fine particles and less light to pass through. The opening diameter of the through-hole 3 is the diameter of the circle inscribed in the opening shape when the film substrate 2 is viewed from the Z direction (thickness direction). The average opening diameter of the through-hole 3 is the average value of the opening diameters measured for 10 arbitrarily selected through-holes 3.

[0020] The central axis of the through hole 3 is preferably parallel to the Z direction (thickness direction), but it may also be inclined with respect to the Z direction (thickness direction). The angle between the central axis of the through hole 3 and the Z-direction is preferably 0 to 60°, more preferably 0 to 45°, and even more preferably 0 to 30°.

[0021] The first vapor-deposited film 4 and the second vapor-deposited film 6 are vapor-deposited films containing silicon as a constituent element. Specifically, examples include vapor-deposited films containing one or both of silicon oxide and silicon carbide, such as silicon dioxide. The proportion of silicon oxide and silicon carbide in the entire film (the total proportion if both are included) is preferably 6% by mass or more, more preferably 8% by mass or more, and even more preferably 10% by mass or more. The first vapor-deposited film 4 and the second vapor-deposited film 6 preferably contain silicon oxide, particularly silicon dioxide.

[0022] The thicknesses of the first vapor-deposited film 4 and the second vapor-deposited film 6 are preferably 1 μm or less, more preferably 1 to 800 nm, and even more preferably 10 to 500 nm. If the thicknesses of the first vapor-deposited film 4 and the second vapor-deposited film 6 are below the above preferred upper limit, tackiness can be reduced without blocking the through-holes. If the thicknesses of the first vapor-deposited film 4 and the second vapor-deposited film 6 are above the above preferred lower limit, the effect of eliminating the handling difficulties unique to the film substrate 2 is significant. The thicknesses of the first deposited film 4 and the second deposited film 6 are determined as the average value of the thicknesses measured at 10 arbitrary locations using a spectrophotometer.

[0023] The first hole portion 5 of the first deposited film 4 is formed in a position that overlaps with the opening on the first surface of the through hole 3 in a plan view. Preferably, the first hole portion 5 is formed in the same position with exactly the same shape and area as the opening on the first surface of the through hole 3, but a deviation such that the opening diameter of the communication hole 8 is not substantially different from the opening diameter of the through hole 3 is acceptable. For example, it is acceptable for a small amount of the first deposited film 4 to be formed on the inner surface near the opening on the first surface of the through hole 3.

[0024] The second hole portion 7 of the second vapor-deposited film 6 is formed in a position that overlaps with the opening on the second surface of the through hole 3 in a plan view. Preferably, the second hole portion 7 is formed in the same position with exactly the same shape and area as the opening on the second surface of the through hole 3, but a deviation such that the opening diameter of the communication hole 8 is not substantially different from the opening diameter of the through hole 3 is acceptable. For example, it is acceptable for a small amount of the second vapor-deposited film 6 to be formed on the inner surface near the opening on the second surface of the through hole 3.

[0025] Each communication hole 8 formed in the micro-porous aligned film 1 is configured such that a through hole 3 formed at an overlapping position communicates with the first hole portion 5 and the second hole portion 7. The communication hole 8 penetrates from one surface of the micro-porous aligned film 1 to the other surface. When viewed from the thickness direction of the micro-porous aligned film 1, each connecting hole 8 is regularly aligned. The alignment pattern of each connecting hole 8 is staggered in the example shown in Figure 1, but it is not limited to this pattern. For example, the alignment pattern may be such that each connecting hole 8 is aligned in a matrix shape both vertically and horizontally.

[0026] The pitch of the communication holes 8, that is, the distance between the centers of adjacent communication holes 8, is preferably 10 to 300 μm, more preferably 20 to 100 μm, and even more preferably 30 to 80 μm. If the pitch of the communication holes 8 is above the lower limit, it is easier to manufacture the mold. If the pitch of the communication holes 8 is below the upper limit, a filter with a high aperture ratio can be manufactured. The pitch of the communication holes 8 is determined as the average value of the distance between the centers of any 10 pairs of adjacent communication holes 8. The distance between the centers of adjacent communication holes 8 is measured using a microscope.

[0027] The preferred opening shape of the communication hole 8 and the preferred cross-sectional shape when cut in a direction parallel to the XY plane are the same as the preferred opening shape of the through hole 3 and the preferred cross-sectional shape when cut in a direction parallel to the XY plane. The preferred average opening diameter of the communication hole 8 is the same as the preferred average opening diameter of the through hole 3. The opening diameter of the communication hole 8 is the diameter of the circle inscribed in the opening shape when the micro-porous aligned film 1 is viewed from the Z direction (thickness direction). The average opening diameter of the communication hole 8 is the average value of the opening diameters measured by a microscope for 10 arbitrarily selected communication holes 8.

[0028] The aperture ratio of the microporous aligned film 1 having multiple interconnected holes 8 is preferably 20% or more, more preferably 25-80%, and even more preferably 30-60%. If the aperture ratio is above the lower limit, a filter that transmits more particles and light can be manufactured. If the aperture ratio is below the upper limit, it is easier to ensure sufficient rigidity and to suppress tearing of the microporous aligned film 1. The aforementioned aperture ratio is the ratio of the total area of ​​the openings of the multiple communication holes 8 to the area of ​​the micro-porous aligned film 1 (excluding the peripheral portion 9) when the micro-porous aligned film 1 is viewed from the thickness direction.

[0029] [Method for manufacturing a microporous aligned film] The microporous aligned film 1 according to the embodiment can be manufactured by forming a film substrate 2, and then forming a first vapor-deposited film 4 and a second vapor-deposited film 6 on both sides of the film substrate 2.

[0030] (Molding of film substrate) The film substrate 2 can be manufactured, for example, by press molding. Below, as an example, a method for manufacturing a silicone rubber film substrate 2 using the mold 100 shown in Figure 3 will be described.

[0031] The molding die 100 comprises a lower mold 110 and an upper mold 120. A recess 112 for filling with silicone rubber material L is formed on the upper surface of the lower mold 110, and an annular groove 114 is formed outside the recess 112 so as to surround the recess 112. The upper mold 120 consists of a plate-shaped main body 121 and a plurality of columnar sections 122. The plurality of columnar sections 122 are provided so as to extend from the lower surface of the main body 121 toward the bottom surface of the recess 112 of the lower mold 110.

[0032] The recess 112 of the lower mold 110 is deeper than the thickness of the target film substrate 2. Also, the height of the inner circumferential wall 115 of the groove 114 that separates the groove 114 from the recess 112 is lower than the height of the outer circumferential wall 116 of the groove 114. The lengths of the multiple columnar portions 122 of the upper mold 120 are longer than the lengths of the multiple through-holes 3 of the target film substrate 2, and their tips are not long enough to reach the bottom surface of the recess 112 of the lower mold 110.

[0033] A method for manufacturing a silicone rubber microporous aligned film using a mold 100 includes, for example, the following molding and cutting steps. Molding process: Liquid silicone rubber material L is poured into the recess 112 of the lower mold 110 in the molding die 100, the lower mold 110 and the upper mold 120 are brought close together, and the silicone rubber material L is cured by press molding to obtain a film substrate precursor with multiple non-penetrating holes formed therein. Cutting process: The burrs of the film substrate precursor and the non-opening sides of the multiple non-penetrating holes are partially cut away to open each hole and form multiple through-holes.

[0034] As the liquid silicone rubber material L, a known curable silicone can be used, and a polymerization catalyst may be added. If the silicone rubber material L is thermosetting, a thermal polymerization catalyst can be added, and if the silicone rubber material L is photopolymerizable, a photopolymerization catalyst can be added. Other components such as solvents may be mixed into the silicone rubber material L as needed.

[0035] In the molding process, as shown in Figure 3, liquid silicone rubber material L is poured into the recess 112 of the lower mold 110 in the molding die 100, and as shown in Figure 4, the lower mold 110 and the upper mold 120 are brought close together until the outer peripheral wall 116 of the lower mold 110 and the main body 121 of the upper mold 120 come into contact. At this time, a gap is formed between the inner circumferential wall 115 of the lower mold 110 and the main body 121 of the upper mold 120.

[0036] As a result, the excess liquid silicone rubber material L extruded by the column portion 122 flows out from the recess 112 of the lower mold 110 through the gap between the inner circumferential wall 115 and the main body 121 of the upper mold 120 into the groove portion 114. In this state, the liquid silicone rubber material L is cured by heating or light irradiation, and then the film substrate precursor 10, which consists of the cured silicone rubber material as shown in Figure 5, is removed from the mold 100.

[0037] The film substrate precursor 10 comprises a film portion 11 and a burr portion 12 attached around the film portion 11. In addition, the film portion 11 has multiple non-penetrating holes 13 formed by columnar portions 122.

[0038] In the cutting process, for example, at the position of the straight line k in Figure 5, the film substrate precursor 10 is sliced ​​in a direction perpendicular to its thickness using a metal blade or the like. As a result, the side of the film substrate precursor 10 where each hole 13 is not open is partially cut off, and both sides of each hole 13 become open, thereby forming multiple through holes 3 in the film substrate 2. Also, the burr portion 12 is removed. Furthermore, if necessary, the film substrate 2 can be obtained by slicing it in a direction perpendicular to the thickness direction, either as needed, into one or more film-like sheets. By the above steps, a film substrate 2 for the micro-porous aligned film 1 according to the embodiment can be obtained.

[0039] (Formation of vapor-deposited film) There are no particular limitations on the method for forming the first vapor-deposited film 4 and the second vapor-deposited film 6; for example, CVD (Chemical Vapor Deposition) or PVD (Physical Vapor Deposition) can be used. Examples of CVD methods include plasma CVD, photoCVD, and thermal CVD. Among these methods, the plasma CVD method is preferred because it facilitates the formation of a deposited film without blocking the through-holes 3 in the film substrate 2, and the resulting deposited film exhibits excellent flexibility.

[0040] As shown in Figure 7, the first and second deposited films 4 and 6 produced by plasma CVD can be formed by placing the film substrate 2 in a plasma chamber 150 and decomposing the raw material gas G with plasma on the surface of the film substrate 2. For example, the first vapor-deposited film 4 can be formed by placing the film substrate 2 with its first surface facing upwards in the plasma chamber 150, and then the second vapor-deposited film 6 can be formed by placing the film substrate 2 with its second surface facing upwards in the plasma chamber 150.

[0041] As the raw material gas G, for example, if you want to obtain a vapor-deposited film containing silicon dioxide, you can use TEOS (orthoethyl tetrasilicate) or TMOS (orthomethyl tetrasilicate). If you want to obtain a vapor-deposited film containing silicon carbide, you can use methane, acetylene, or a mixture thereof. As the carrier gas introduced into the chamber 150 along with the raw material gas G, for example, nitrogen can be used.

[0042] [Framed film 20] The micro-porous aligned film 1 may be made into a framed film 20 by providing a frame 21 around it, as shown in Figure 8. The frame 21 in Figure 8 is formed around the entire circumference of the microporous aligned film 1 and is thicker than the microporous aligned film 1. By having the frame 21 around the microporous aligned film 1, sufficient rigidity can be ensured even when the microporous aligned film 1, which has multiple connecting holes 8, has a high aperture ratio, and handling is improved.

[0043] The thickness of the frame 21 is preferably 0.5 to 5 mm, more preferably 1 to 3 mm, and even more preferably 1.5 to 2 mm. If the thickness of the frame 21 is above the lower limit, sufficient rigidity can be easily ensured, tearing of the micro-porous aligned film 1 is suppressed, and handling is improved. If the thickness of the frame 21 is below the upper limit, the amount of material used can be reduced, and release from the mold is also improved. The thickness of frame 21 is determined as the average value of the thickness measured at any 10 locations.

[0044] The width of the frame 21 when viewed from the Z direction (thickness direction) is preferably 50 to 3000 μm, more preferably 100 to 2000 μm, and even more preferably 200 to 1000 μm. If the width of the frame 21 is greater than or equal to the lower limit, it is easier to ensure sufficient rigidity and to suppress tearing of the micro-porous aligned film 1. If the width of the frame 21 is less than or equal to the upper limit, the amount of material used can be reduced. The width of frame 21 is determined as the average value of the widths measured at any 10 locations.

[0045] The frame 21 may be integrally molded with the film substrate 2 of the microporous alignment film 1, or it may be formed as a component independent of the microporous alignment film 1. When the micro-porous alignment film 1 is formed from a component independent of it, for example, the micro-porous alignment film 1 may be attached to the upper or lower surface of the frame 21, or two frame members of the same shape may be used as the frame 21, with the micro-porous alignment film 1 sandwiched between them.

[0046] [Application] The applications of the micro-porous aligned film according to this embodiment are not particularly limited and include, for example, classification filters, optical control filters such as privacy films, and anisotropic conductive connectors.

[0047] (Classification filter) The microporous aligned film 1 according to this embodiment has a plurality of communication holes 8, and can therefore be used as a classification filter, which is a sieve for separating objects of a specific size. For example, a classification device can be constructed by arranging multiple classification filters, each consisting of a plurality of microporous aligned films 1 with different opening diameters of the communication holes 8, in multiple stages vertically.

[0048] Figure 9 shows an example of a classification apparatus, a classification apparatus 50 using three framed films 20. The classification device 50 is configured by mounting classification filters 30A, 30B, and 30C in three stages from top to bottom on a rack 51.

[0049] Classification filter 30A is a framed film 20 consisting of a microporous aligned film 1A with communication holes 8A formed thereon and a frame 21. Classification filter 30B is a framed film 20 consisting of a microporous aligned film 1B with communication holes 8B formed thereon and a frame 21. Classification filter 30C is a framed film 20 consisting of a microporous aligned film 1C with communication holes 8C formed thereon and a frame 21. The opening diameter of communication hole 8B is smaller than the opening diameter of communication hole 8A. The opening diameter of communication hole 8C is smaller than the opening diameter of communication hole 8B.

[0050] Therefore, when a sample containing particles of various sizes is supplied from above, large particles P1 that are larger than the opening diameter of the communication hole 8A remain on the classification filter 30A, medium particles P2 that are smaller than the opening diameter of the communication hole 8A but larger than the opening diameter of the communication hole 8B remain on the classification filter 30B after passing through the classification filter 30A, small particles P3 that are smaller than the opening diameter of the communication hole 8B but larger than the opening diameter of the communication hole 8C remain on the classification filter 30C after passing through the classification filters 30A and 30B, and fine particles that are smaller than the opening diameter of the communication hole 8C also pass through the classification filter 30C. This allows for the classification of particles of various sizes.

[0051] (Light control filter) The micro-porous aligned film 1 according to this embodiment can be used as a light control filter by making the multiple communication holes 8 into light-transmitting parts and the parts other than the communication holes 8 into light-shielding parts.

[0052] The communication holes 8, which function as light-transmitting sections, may be filled with air or with a light-transmitting material. When the communication holes 8 are filled with air, the refractive index of the transmitted light is small, which allows for a smaller viewing angle. When the communication holes 8 are filled with a light-transmitting material, the shape of the communication holes 8 is more easily maintained by the light-transmitting material, making it easier to maintain the shape of the light-transmitting section even when the light control filter is deformed.

[0053] Examples of light-transmitting materials include transparent resins and glass. From the viewpoint of improving the flexibility of the light control filter, transparent elastomers are preferred. Examples of transparent elastomers include silicone and polyurethane. From the viewpoint of excellent transparency and heat resistance, silicone rubber is preferred as the transparent elastomer. The transparent elastomer filling the through-holes may be one type or two or more types.

[0054] It is preferable that the portion of the microporous aligned film 1, which functions as a light-shielding section, other than the connecting holes 8, contains a light-shielding material. It is preferable that the light-shielding material be included in the film substrate 2 portion. As a light-shielding material, at least one of a light-absorbing material and a light-reflecting material can be used. Light-absorbing materials contain a light-absorbing agent. Examples of light-absorbing agents include carbon, dyes, and pigments. Among light-absorbing agents, carbon is preferred because of its excellent light-absorbing properties. Examples of carbon include carbon black, graphite, and carbon fibers. Carbon black is particularly preferred because it is a versatile light-absorbing agent. Examples of light-reflective materials include metals. Examples of metals include aluminum, silver, gold, chromium, and nickel.

[0055] Light control filters can be used, for example, to control the viewing angle. More specifically, they can be attached to image display devices such as liquid crystal displays as, for example, a privacy film. They can also be attached to image display devices such as liquid crystal displays for purposes such as brightness improvement or glare reduction. For example, light control filters can be attached to light-emitting elements such as light-emitting diodes and organic electroluminescent elements, and light-receiving elements such as light sensors.

[0056] (Anisotropic conductive connector) The micro-porous aligned film 1 according to this embodiment can be used as an anisotropic conductive connector by making the multiple communication holes 8 conductive parts and the parts other than the communication holes 8 insulating parts. Anisotropic conductive connectors can be used, for example, to connect circuit boards containing electronic device components, module components, and the like.

[0057] When used as an anisotropic conductive connector, the micro-porous alignment film 1 is made of an insulating material. In particular, it is preferable that the film substrate 2 be made of insulating rubber. The insulating rubber is not particularly limited and examples include synthetic rubbers such as acrylonitrile-butadiene rubber, silicone rubber, chloroprene rubber, ethylene-chloroprene rubber, ethylene-propylene-diene rubber, styrene-butadiene rubber, fluororubber, butadiene rubber, isoprene rubber, and urethane rubber. Among these, silicone rubber is preferred due to its high elasticity and excellent heat resistance. These elastic materials may be used individually or in combination of two or more types.

[0058] The communication hole 8 is filled with a conductive member containing a conductive material. The conductive member can be, for example, a composite member of a conductive material and an elastic material that disperses the conductive material. The conductive material is not particularly limited as long as it contains movable charges and conducts electricity easily, i.e., is a material with high conductivity. Examples include carbon nanotubes, carbon nanobats, carbon nanohorns, silver particles, copper particles, and gold particles. These conductive materials may be used individually or in combination of two or more. [Explanation of Symbols]

[0059] 1. Micro-porous aligned film 2 Film substrate 3 Through hole 4. First Deposited Film 5 1st hole 6. Second Vapor-Deposited Coating 7 2nd hole 8 Communication hole 9 Peripheral area 10 Film substrate precursor 20 framed films 21 frames

Claims

1. A microporous aligned film comprising a film substrate having a plurality of regularly aligned through holes, and a vapor-deposited film on at least one surface of the film substrate in which the portions overlapping with the plurality of through holes are pores, The multiple communicating holes, which are connected to the holes in the deposited film, penetrate the micro-pore aligned film. The aforementioned vapor-deposited film is a microporous aligned film containing silicon as a constituent element.

2. The micropore alignment film according to claim 1, wherein the film substrate is made of silicone rubber.

3. The microporous aligned film according to claim 1 or 2, wherein the vapor-deposited film comprises one or both silicon oxide and silicon carbide.

4. A method for manufacturing a microporous aligned film according to claim 1 or 2, wherein the vapor-deposited film is formed on at least one surface of the film substrate by a plasma CVD method.

5. A classification filter having a micropore alignment film according to claim 1 or 2.

6. Micropore alignment according to claim 1 or 2 A light control filter having a film, A light control filter comprising a light-transmitting portion composed of the plurality of communication holes and a light-shielding portion consisting of the portion other than the plurality of communication holes.

7. Micropore alignment according to claim 1 or 2 An anisotropic conductive connector having a film, An anisotropic conductive connector comprising an insulating portion consisting of parts other than the plurality of communication holes, and a conductive portion in which each of the plurality of communication holes is filled with a conductive member containing a conductive material.

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