Pressing device

Abstract

In particular, the present invention provides a press device that allows for easy and safe maintenance of the press section. [Solution] The press apparatus according to the present invention is a press apparatus 1 that presses a workpiece W using a die 202 having an upper die 204 and a lower die 206, comprising a supply unit 100A for supplying the workpiece W, one or more press units 100B on which the die 202 is arranged to press the workpiece W and process it into a molded product Wp, and a storage unit 100C for storing the molded product Wp, wherein the supply unit 100A, press units 100B and storage unit 100C are arranged in a predetermined order along a predetermined X direction, and a maintenance unit 100E is arranged adjacent to the press unit 100B, with a space provided between the press unit 100B and the other units.

Description

Technical Field

[0001] The present invention relates to a press apparatus.

Background Art

[0002] As examples of press apparatuses that press a workpiece with electronic components mounted on a base material to process it into a molded product, those adopting a transfer molding method or a compression molding method are known.

[0003] As a general example, the transfer molding method is a technique in which a pot for supplying a predetermined amount of sealing resin (hereinafter sometimes simply referred to as "resin") is provided in a sealing region (cavity) formed in a mold configured with an upper die and a lower die, workpieces are respectively arranged at positions corresponding to the sealing region, clamping is performed with the upper die and the lower die, and the resin is poured from the pot into the cavity to perform pressing (in this case, resin sealing) (Patent Document 1: Japanese Unexamined Patent Application Publication No. 2012-231030). The compression molding method is a technique in which a predetermined amount of resin is supplied to a sealing region (cavity) formed in a mold configured with an upper die and a lower die, a workpiece is arranged in the sealing region, and clamping is performed with the upper die and the lower die to perform pressing (in this case, resin sealing) (see Patent Document 2: Japanese Unexamined Patent Application Publication No. 2019-145550).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of Invention

Problems to be Solved by the Invention

[0005] All of the above methods are fundamentally based on a configuration that includes a press section for opening and closing the mold. This press section requires various maintenance tasks. For example, this includes replacing the film roll of the release film (hereinafter sometimes simply referred to as "film") that covers the mold surface, or cleaning the mold.

[0006] Traditionally, the above maintenance was performed by workers from outside the press machine (outside the outer circumference of the machine). However, the further the maintenance target was from the outside of the machine, the more difficult and time-consuming the work became. In addition, there was a risk of unintentionally touching a mold that was hot, for example. [Means for solving the problem]

[0007] This invention has been made in view of the above circumstances, and aims to provide a press device that allows for easy and safe maintenance of the press section.

[0008] The present invention solves the above-mentioned problem by a solution described below as one embodiment.

[0009] A press apparatus according to one embodiment is a press apparatus that presses a workpiece using a die comprising an upper die and a lower die, comprising a supply unit for supplying the workpiece, one or more press units on which the die is arranged to press the workpiece and process it into a molded product, and a storage unit for storing the molded product, wherein the supply unit, the press units and the storage unit are arranged in a predetermined order along a predetermined X direction, and a maintenance unit is provided adjacent to the press unit, with a space between the press unit and the other units. According to this, maintenance of the press unit can be performed by the maintenance unit provided adjacent to the press unit.

[0010] Furthermore, it is preferable that the maintenance unit is a unit that provides a space for replacing the film roll of release film supplied to the mold along the Y direction perpendicular to the X direction.

[0011] Furthermore, it is preferable that the release film is a lower mold release film supplied to the lower mold of the mold, and the film roll is a lower mold film roll.

[0012] Furthermore, it is preferable that the mold has two cavity regions arranged side by side along the X direction, and that the release film is supplied in two strips corresponding to each of the cavity regions.

[0013] Furthermore, it is preferable that the maintenance unit includes a maintenance space into which a worker can enter the unit, and a motion sensor that detects the worker's entry into the maintenance space.

[0014] Furthermore, it is preferable that the maintenance unit has a load-bearing section arranged along the Y direction for the operator to contact with their body when replacing the film roll with the press unit. [Effects of the Invention]

[0015] According to the present invention, it is possible to realize a press device that allows for easier and safer maintenance of the press section compared to conventional devices. [Brief explanation of the drawing]

[0016] [Figure 1] This is a plan view showing an example of a press apparatus according to an embodiment of the present invention. [Figure 2] Figure 1 is a perspective view showing an example of a press machine. [Figure 3] Figure 1 is a side view showing an example of the press section of a press machine. [Figure 4] Figure 1 is a front cross-sectional view showing an example of a mold for a press machine. [Figure 5] It is a plan view showing another example of the press apparatus of FIG. 1. [Figure 6] It is a plan view showing another example of the press apparatus of FIG. 1. [Figure 7] It is a plan view showing another example of the press apparatus of FIG. 1. [Mode for Carrying Out the Invention]

[0017] (Overall Configuration) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view (schematic diagram) showing an example of the press apparatus 1 according to an embodiment of the present invention, and FIG. 2 is a perspective view (schematic diagram). For convenience of description, arrows in the drawings indicate the X direction (hereinafter sometimes referred to as "left-right direction"), Y direction (hereinafter sometimes referred to as "front-rear direction"), and Z direction (hereinafter sometimes referred to as "up-down direction") in the press apparatus 1, and the respective directions are mutually orthogonal. Further, in all the drawings for describing the respective embodiments, members having the same function are denoted by the same reference numerals, and repeated description thereof may be omitted.

[0018] The press apparatus 1 according to the present embodiment is an apparatus that processes a workpiece (molding target) W into a molded product by pressing (the present embodiment takes resin sealing as an example, and the same applies hereinafter) using a mold 202 including an upper die 204 and a lower die 206. Hereinafter, as the press apparatus 1, description will be given by taking a transfer molding type press apparatus as an example, in which the lower die 206 is provided with a workpiece holding portion 205, the upper die 204 is provided with a cavity 208 in a corresponding arrangement, the mold surfaces of the lower die 206 and the upper die 204 are covered with a film Fm, the upper die 204 and the lower die 206 are caused to perform a clamping operation, and the workpiece W is sealed with a resin R. However, the configuration is not limited to this, and a configuration in which the upper die 204 is provided with a workpiece holding portion and the lower die 206 is provided with a cavity may also be adopted (not shown). Further, a configuration in which one of the mold surfaces of the lower die 206 or the upper die 204 is covered with the film Fm may also be adopted (not shown). Note that "pressing" is not limited to "resin sealing", but also includes "sintering", "direct bonding", "resin tableting", and the like. Therefore, the "molded product" is not limited to a "resin-sealed product", but also includes a "joined product by sintering", a "joined product by direct bonding", a "tableted resin", and the like.

[0019] First, the workpiece W to be molded has a configuration in which one or a plurality of electronic components Wb are mounted on a base material Wa in a predetermined arrangement. Examples of the general base material Wa include a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, a wafer, and the like formed in a plate shape such as a rectangular shape or a circular shape, and examples of the electronic component Wb include a semiconductor chip, a MEMS chip, a passive element, a heat dissipation plate, a conductive member, a spacer, and the like. Further, examples of the method for mounting the electronic component Wb on the base material Wa include mounting methods by die bonding mounting, flip chip mounting, and the like.

[0020] Further, as the workpiece W, a resin may be used for the entire configuration. That is, in the configuration in which a resin is used as the workpiece W, the resin is carried into the mold 202 and pressed to be molded into a semi-solid resin molded body (tableted resin). This semi-solid resin molded body is used as a sealing resin when an electronic component is sealed with a resin.

[0021] As an example of resin R, a tablet-shaped (for example, cylindrical) thermosetting resin (e.g., an epoxy resin containing fillers) is used. However, resin R is not limited to the above, and may be in shapes other than cylindrical, liquid resin, granular resin, pre-molded resin, sheet resin, or other forms, and may be made of materials other than epoxy thermosetting resins.

[0022] Furthermore, suitable examples of film Fm include film materials with excellent heat resistance, ease of peeling, flexibility, and stretchability, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidine chloride. In this embodiment, a roll-shaped film is used as film Fm. As another example, a configuration using strip-shaped film may also be used (not shown).

[0023] Next, an overview of the press apparatus 1 according to this embodiment will be described. As shown in Figure 1, the press apparatus 1 mainly comprises a supply unit 100A that primarily supplies the workpiece W to be pressed (resin-sealed) and the resin R, a press unit 100B that primarily processes the workpiece W into a molded product Wp by pressing (resin-sealing), and a storage unit 100C that primarily stores the molded product Wp after pressing (resin-sealing). Note that the unit that supplies the workpiece W and the unit that supplies the resin R may be configured as separate units (not shown).

[0024] Furthermore, the press apparatus 1 is equipped with a transport mechanism 100D that moves between each unit to transport the workpiece W, resin R, and molded product Wp. As an example, the transport mechanism 100D includes an in-loader 122 for loading the workpiece W and resin R into the press unit 100B, and an out-loader 124 for unloading the molded product Wp from the press unit 100B. In addition, a guide (e.g., a rail) 126 shared by the in-loader 122 and out-loader 124 is provided on the rear side of the apparatus so as to be parallel to the X direction. Note that the transport mechanism 100D is not limited to the above configuration, and may be configured to use known pickups or the like as appropriate (not shown).

[0025] Here, the inloader 122 receives the workpiece W and resin R from the supply unit 100A and transports them to the press unit 100B. As an example of the configuration of the inloader 122, there are two rows of workpiece holding sections 122A and 122B arranged side by side along the X direction, each capable of holding one workpiece W. In addition, a resin holding section 122C is provided between the two rows of workpiece holding sections 122A and 122B, capable of holding multiple (for example, four, but not limited to this, or even just one) resins R along the Y direction. Known holding mechanisms (for example, a configuration that grips with holding claws, a configuration that adsorbs with suction holes communicating with a suction device, etc.) are used for the workpiece holding sections 122A and 122B and the resin holding section 122C (not shown).

[0026] The in-loader 122 according to this embodiment is configured to move in the X direction (left-right direction) and the Y direction (front-back direction) to transport the workpiece W and resin R into the mold 202 and place them in a predetermined position on the lower mold 206. However, it is not limited to this configuration, and a separate loader may be provided, which moves in the X direction to transport between units and which moves in the Y direction to transport into the mold 202 (not shown).

[0027] Furthermore, the outloader 124 receives the molded product Wp (including unnecessary resin parts such as the calf section and runner section) from the press unit 100B and transports it to the storage unit 100C. As an example of the configuration of the outloader 124, a molded product holding section 124A capable of holding the molded product Wp (in this embodiment, including unnecessary resin parts such as the calf section and runner section) is provided. The molded product holding section 124A uses a known holding mechanism (for example, a configuration that grips with holding claws, a configuration that uses suction with suction holes communicating with a suction device, etc.) (not shown).

[0028] The outloader 124 according to this embodiment is configured to move in the X direction (left-right direction) and the Y direction (front-back direction) to transport the molded product Wp out of the mold 202 and place it on the molded product table 114. However, it is not limited to this configuration, and a separate loader may be provided that moves in the Y direction to transport the product out of the mold 202, and another loader that moves in the X direction to transport the product between units (not shown).

[0029] Furthermore, the press device 1 includes a maintenance unit 100E for performing maintenance on the press unit 100B (which may include other units or mechanisms). In this embodiment, all or part of the maintenance is performed by an operator, and the maintenance unit 100E is equipped with a maintenance space 301 into which an operator can enter. However, the configuration is not limited to this, and all or part of the maintenance may be performed by a maintenance robot, and the maintenance unit 100E may be equipped with a robot operating space (not shown).

[0030] The press apparatus 1 according to this embodiment is arranged adjacent to each other in the following order along a predetermined direction (for example, the X direction in Figure 1): supply unit 100A, press unit 100B, maintenance unit 100E, press unit 100B, and storage unit 100C. However, the configuration is not limited to this, and the arrangement and number of units may be changed, the configuration of each unit may be changed, or other units may be added (none of which are shown).

[0031] (Supply unit) Next, we will describe the supply unit 100A provided by the press device 1.

[0032] The supply unit 100A includes, for example, a workstocker 102 used to store workpieces W, and a worktable 104 on which the workpieces W are placed. The workstocker 102 uses a known stack magazine, slit magazine, etc., and is capable of storing multiple workpieces W at once. With this configuration, the workpieces W are removed from the workstocker 102 using a known pusher, etc. (not shown) and placed on the worktable 104 (for example, two workpieces W are placed side by side facing each other). Next, the workpieces W placed on the worktable 104 are held by the inloader 122 and transported to the press unit 100B.

[0033] Furthermore, the supply unit 100A (or any other unit) is equipped with a resin supply mechanism 140 that supplies resin R at a lateral position to the work table 104. For example, the resin supply mechanism 140 includes a supply section 142 that supplies resin R using a hopper, feeder, etc., and a transfer section 144 that has a transfer mechanism such as an elevator to hold multiple resins R supplied from the supply section 142 in a predetermined position. With this configuration, the multiple resins R held in the transfer section 144 are held by the in-loader 122 and transported to the press unit 100B.

[0034] (Press Unit) Next, the press unit 100B of the press device 1 will be described. This press unit 100B is equipped with a press section 250 that clamps and presses (resin seals) the workpiece W by driving the die 202 to open and close. Here, Figure 3 is a side view (schematic diagram) of the press section 250. Also, Figure 4 is a front cross-sectional view (schematic diagram) of the die 202 (Note that in Figure 4, the release film is omitted from the illustration in order to clarify the configuration).

[0035] As shown in Figure 3, the press section 250 includes a die 202 having a lower die 206 and an upper die 204 and disposed between a pair of platens 252 and 254, a plurality of connecting mechanisms 256 on which the pair of platens 252 and 254 are mounted, a drive source (e.g., an electric motor) 260 for moving (raising and lowering) the platen 254, and a drive transmission mechanism (e.g., a ball screw or toggle link mechanism) 262. In this embodiment, the upper die 204 is assembled to the fixed platen 252, and the lower die 206 is assembled to the movable platen 254. However, the configuration is not limited to this, and the upper die 204 may be assembled to the movable platen and the lower die 206 to the fixed platen, or both the upper die 204 and the lower die 206 may be assembled to the movable platen.

[0036] The lower mold 206 is composed of a lower mold base 212, a lower mold chase block 216, a lower mold clamp block 220, and the like, which are assembled together. For example, the lower mold chase block 216 is fixed on top of the lower mold base 212, and the lower mold base 212 is fixed on top of the movable platen 254. On the other hand, the upper mold 204 is composed of an upper mold base 210, an upper mold chase block 214, an upper mold clamp block 218, and the like, which are assembled together. For example, the upper mold chase block 214 is fixed to the lower surface of the upper mold base 210, and the upper mold base 210 is fixed to the lower surface of the fixed platen 252.

[0037] Furthermore, the press unit 100B is equipped with a mechanism for supplying a film Fm, which has no openings (holes) on its roll-shaped sheet surface, to the die 202 so that it is unwound from the film roll Fr1 and wound onto the film roll Fr2. As an example of the mechanism for supplying this film Fm, it is equipped with an upper die film supply mechanism 270 that supplies a single strip of film Fm in the Y direction (front-to-back direction) so as to cover the die surface 204a (a predetermined area including the cavity 208) of the upper die 204, and a lower die film supply mechanism 280 that supplies a single strip of film Fm in the Y direction (front-to-back direction) so as to cover the die surface 206a (a predetermined area including the workpiece holding portion 205) of the lower die 206. The upper die film supply mechanism 270 is configured such that unused film Fm is unwound in the unwinding section 271 and supplied so as to cover the above area of ​​the opened upper die 204, and after being used for pressing (resin sealing), it is wound up in the winding section 272 as used film Fm. Similarly, the lower die film supply mechanism 280 is configured such that unused film Fm is unwound in the unwinding section 281 and supplied to cover the above-mentioned area of ​​the lower die 206 when the die is opened, and after being used for pressing (resin sealing), it is wound up in the winding section 282 as used film Fm. Note that for both the upper die film supply mechanism 270 and the lower die film supply mechanism 280, the unwinding section and the winding section may be reversed in the Y direction, or they may be arranged to supply a single strip of film Fm in the X direction (left-right direction) (neither shown). Furthermore, as mentioned above, the configuration may consist of only the upper die film supply mechanism 270 or only the lower die film supply mechanism 280 (not shown).

[0038] As another example of the mechanism for supplying the film Fm described above, as shown in Figure 5, when the mold 202 (upper mold 204) has two cavity regions arranged side by side along the X direction, the upper mold film supply mechanism 270 may be configured to supply two strips of film Fm in the Y direction. Alternatively, the lower mold film supply mechanism 280 may be configured to supply two strips of film Fm in the Y direction.

[0039] Next, the lower mold 206 of the mold 202 will be described in detail. As shown in Figure 4, the lower mold 206 is provided with multiple cylindrical pots 240 along the Y direction (for example, four pots are given, but it is not limited to this, and there may be one or two) for containing resin (in this case, tablet-shaped resin) R. The pots 240 are formed as through holes continuous with the lower mold chase block 216 and the lower mold clamp block 220. A plunger 242 is also disposed inside the pot 240, which is pushed by a known transfer drive mechanism (not shown). With this configuration, the plunger 242 is pushed, and the resin R inside the pot 240 is supplied into the cavity 208 (described later).

[0040] Furthermore, in this embodiment, a workpiece holding section 205 is provided, which holds one or more workpieces W, in an arrangement surrounded by a lower clamp block 220 fixed on the lower chase block 216. More specifically, as shown in Figure 4, two workpiece holding sections 205 (first workpiece holding section 205A and second workpiece holding section 205B) are arranged to sandwich the pot 240 in the X direction. As an example, this workpiece holding section 205 is equipped with a suction passage (not shown) that communicates with a suction device, and is configured to hold the workpiece W by suction. Alternatively, instead of or in conjunction with the configuration equipped with a suction passage, a configuration equipped with holding claws that grip the outer circumference of the workpiece W may be provided (not shown).

[0041] Furthermore, a suction passage is provided in a predetermined area of ​​the lower mold 206 (such as the mold surface 206a or element boundary) that communicates with a suction device to perform degassing, adsorption of the workpiece W and film Fm, etc. (not shown).

[0042] Furthermore, the lower mold base 212 is provided with a lower mold heater (not shown). This allows heat to be conducted to the area around the pot 240 via the lower mold chase block 216, etc., enabling the resin R inside the pot 240 to be heated and melted to a predetermined temperature (approximately 180°C in this embodiment) in a short time and efficiently. As an example, known electric heating wire heaters, sheathed heaters, etc., can be used for the lower mold heater.

[0043] Next, the upper mold 204 of the mold 202 will be described in detail. As shown in Figure 4, the upper mold 204 is provided with a cal block 244 located directly above the pot 240 of the lower mold 206 (here, referring to a predetermined area of ​​width directly above it), which is fixed to the upper mold chase block 214 (here, including members fixed to the upper mold chase block 214), and has a cal 246 and a runner 247 (part of it) that communicates with the cal 246 drilled into its lower surface. Furthermore, a cavity 208 is provided that communicates with the runner 247 and houses a predetermined part of the workpiece W (the part on which the electronic component Wb is mounted). The boundary position (boundary region) between the runner 247 and the cavity 208 is referred to as the gate 248.

[0044] In this embodiment, the cavity 208 is drilled into the lower surface of a cavity block 226, which is surrounded by an upper mold clamp block 218 fixed below the upper mold chase block 214. More specifically, corresponding to the positions of the two workpiece holding sections 205 (first workpiece holding section 205A and second workpiece holding section 205B) of the lower mold 206, cavities 208 (first cavity 208A and second cavity 208B) are arranged on both sides of the cal block 244 in the X direction (or Y direction) in a plan view. These workpiece holding sections 205A, 205B and cavities 208A, 208B form a set of constituent units (block units) in which pressing (resin sealing) is performed by a single pot 240 and its corresponding cal 246, runner 247, and gate 248. In this embodiment, multiple sets of such constituent units are arranged in parallel in the Y direction (or X direction). However, the configuration is not limited to these, and the workpiece holding portion 205 and the cavity 208 may be arranged on only one side of the Calblock 244 in the X direction (or Y direction) (not shown). Also, the above-mentioned components may be arranged in a configuration where only one set is provided (not shown).

[0045] The cavity may also be provided in the lower mold 206. In this case, a configuration in which the resin R passes through a hole that penetrates the top and bottom of the workpiece W, or a configuration in which the resin R passes through a flow path that communicates from the cull of the upper mold 204 to the runner of the lower mold 206, can be adopted (not shown).

[0046] Furthermore, suction passages (not shown) are provided in predetermined parts of the upper mold 204 (such as the mold surface 206a and element boundaries) that communicate with a suction device to perform degassing and adsorption of film Fm.

[0047] Furthermore, the upper mold base 210 is provided with an upper mold heater (not shown). This allows heat to be conducted to the cavity 208 and the surrounding resin channels (cal 246, runner 247, gate 248, etc.) via the upper mold chase block 214, etc., and the molten resin R filling the cavity 208 and resin channels 246, 247, 248 can be heated to a predetermined temperature. As an example, known electric heating wire heaters, sheathed heaters, etc., can be used for the upper mold heater.

[0048] (Storage unit) Next, we will describe the storage unit 100C provided by the press device 1.

[0049] The storage unit 100C includes, as an example, a molded product table (also called a molded product mounting pallet) 114 on which molded products Wp are placed, a deduction mechanism 116 for removing unwanted resin parts from the molded products Wp, and a molded product stocker 112 used for storing the molded products Wp from which the unwanted resin parts have been removed. The molded product stocker 112 uses a known stack magazine, slit magazine, etc., and is capable of storing multiple molded products Wp at once. With this configuration, molded products Wp (including unwanted resin parts) transported from the press unit 100B using an outloader 124, etc., are placed on the molded product table 114. Next, they are transferred to the deduction mechanism 116 using a known pickup, etc. (not shown) to remove the unwanted resin parts, and then stored in the molded product stocker 112 using a known pusher, etc. (not shown). Alternatively, the molded product table 114 itself may move in the X direction with the molded products Wp on it to move to the deduction mechanism 116.

[0050] (Maintenance Unit) Next, we will describe the maintenance unit 100E provided by the press device 1.

[0051] As mentioned above, the maintenance unit 100E is a mechanism for performing maintenance on the press unit 100B (specifically, the press section 250). In this embodiment, it is positioned adjacent to the press unit 100B along the X direction. As an example, as shown in Figure 1, the system is configured with two press units 100B and one maintenance unit 100E positioned between them. However, the system is not limited to this configuration. As another example, as shown in Figure 6, the system may be configured with one press unit 100B and one maintenance unit 100E positioned downstream (or upstream) of it. Alternatively, as shown in Figure 7, the system may be configured with three (or more) press units 100B and one maintenance unit 100E positioned between each of them.

[0052] Maintenance unit 100E is, for example, a unit for performing maintenance such as replacing the film rolls Fr1 and Fr2 of film Fm. Alternatively, other maintenance may be performed in conjunction with or instead of this unit.

[0053] As described above, the press section 250 according to this embodiment is configured to supply film Fm to the mold 202 along the Y direction. Therefore, the film roll Fr1 set in the unwinding sections 271 and 281 is located close to the outer periphery of the press device 1, making replacement relatively easy and safe. However, the film roll Fr2 set in the winding sections 272 and 282 is located inside the press device 1, that is, far from the outer periphery of the device, making replacement extremely difficult. For example, even if one attempts to perform replacement work from the front of the device, it is difficult for the worker to reach, and even if they can reach it, there is a risk of unintentionally touching the mold 202 while it is heated. On the other hand, even if one attempts to perform replacement work from the rear of the device, avoiding the mold 202, the rear of the device is occupied by the installation area of ​​the guide 126 of the transport mechanism 100D and the movable areas of the inloader 122 and outloader 124, making it an inaccessible location. In particular, as shown in Figure 3, maintenance involving the replacement of the film roll inside the device (film roll Fr2 in the winding section 282 in this embodiment) used for the lower die film Fm is the most difficult, time-consuming, and unsafe procedure due to the device's structure. Furthermore, as shown in Figure 5, these problems become even more pronounced when two strips of film Fm are supplied in a single press section 250.

[0054] The maintenance unit 100E according to this embodiment can solve the above-mentioned problems. For example, the maintenance unit 100E is equipped with a maintenance space 301 into which an operator can enter. This allows an operator to enter the maintenance space 301 and replace the film roll Fr2 from a position directly to the side adjacent to the winding sections 272 and 282 (however, as mentioned above, a maintenance robot (not shown) may be used to perform the replacement). Therefore, even maintenance required in an internal position of the press device 1 (a position far from the outer circumference of the device) (in this embodiment, replacement of the film roll Fr2) can be performed much more easily and safely than in the conventional method. However, maintenance is not limited to this, and other examples include cleaning the mold 202.

[0055] Furthermore, the maintenance unit 100E is equipped with a human presence sensor 310 that detects when a worker enters the maintenance space 301. This makes it possible to take control measures such as emergency stopping the operation of the device if, for example, a worker accidentally enters the maintenance space 301 of the adjacent maintenance unit 100E while the press unit 250 or the like is in operation, thereby preventing unexpected accidents such as a worker being caught in the mold 202.

[0056] Furthermore, the maintenance unit 100E has a plate-shaped (or rod-shaped) load-bearing section 312 that the worker can lean against to support a portion of their body weight and the load of the parts. This section is positioned along the Y direction at a height from the worker's knees to their abdomen (approximately 500-1200 mm above the ground). This allows the worker to lean against the load-bearing section 312 to support a portion of their body weight and the load of the parts when performing maintenance in the maintenance space 301. For example, when replacing the film rolls Fr1 and Fr2 for the lower die, these are heavy objects, and there is a risk that the worker might fall into the press unit 100B with their upper body while holding them. However, with the above configuration, the worker can support a portion of their body weight and the load of the parts against the load-bearing section 312, allowing the worker to perform maintenance (in this case, replacing the film rolls Fr1 and Fr2) easily and safely.

[0057] As explained above, the press apparatus according to the present invention allows for easier and safer maintenance of the press section compared to conventional apparatuses.

[0058] Furthermore, the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the present invention. Specifically, although the above embodiments were described using a transfer molding press device as an example, the invention is not limited thereto and can also be applied to a compression molding press device. Also, although the explanation was given using the replacement of film rolls in a press unit as an example, the invention is not limited thereto. As another example, it can also be applied to maintenance such as cleaning of molds in a press unit. It can also be applied to maintenance in units other than the press unit (supply unit, storage unit, etc.). [Explanation of Symbols]

[0059] 1 Pressing device 100A supply unit 100B Press Unit 100C Storage Unit 100D Transport Mechanism 100E Maintenance Unit 250 Press Department 301 Maintenance Space Fm release film Fr1, Fr2 film rolls R Sealing resin Double job Wp molded product

Claims

1. A press device that presses a workpiece using a die comprising an upper die and a lower die, The system comprises a supply unit for supplying the workpiece, one or more press units on which the mold is arranged to press the workpiece and process it into a molded product, and a storage unit for storing the molded product. The supply unit, the press unit, and the storage unit are arranged in a predetermined order along a predetermined X direction. A maintenance unit is provided adjacent to the press unit, with a space between the press unit and other units. A press device characterized by the following.

2. The maintenance unit is a unit that has a space for replacing the film roll of release film supplied to the mold along the Y direction perpendicular to the X direction. The press apparatus according to claim 1, characterized by the following:

3. The release film is a lower mold release film supplied to the lower mold of the mold, The aforementioned film roll is a film roll for the lower die. The press apparatus according to claim 2, characterized by the following:

4. The mold has two cavity regions arranged side by side along the X direction, The release film is supplied in two strips, corresponding to each of the cavity regions. A press apparatus according to claim 2 or claim 3, characterized by the following:

5. The maintenance unit includes a maintenance space into which a worker can enter the unit, and a motion sensor that detects the worker's entry into the maintenance space. A press apparatus according to claim 2 or claim 3, characterized by the following:

6. The maintenance unit is provided with a load-bearing section arranged along the Y direction, which the operator uses to support their body when replacing the film roll in relation to the press unit. The press apparatus according to claim 5, characterized by the following:

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