Detectors and equipment

Abstract

To provide a detector having a structure advantageous for suppressing temperature rise. [Solution] The detector comprises a first member having a first and second surface opposite to each other, a second member having a third and fourth surface opposite to each other, a third member connecting the second and third surfaces, and a cooling member disposed on the first surface. The first member has a detection region on which a detection element for detecting electromagnetic waves is disposed, and a peripheral circuit disposed outside the detection region in a plan view. The cooling member is disposed outside the detection region in a plan view.

Description

Technical Field

[0001] The present invention relates to a detector including a detection element and an apparatus using the same.

Background Art

[0002] In detectors having a detection element that detects electromagnetic waves with wavelengths in the visible light and radiation regions, the amount of signals processed by peripheral circuits has been increasing and the processing speed has been rising. Along with the increase in processing volume and speed, power consumption increases, and the amount of heat generation may rise. The patent literature discloses a structure for dissipating heat using a member with high thermal conductivity.

Prior Art Literature

Patent Literature

[0003]

Patent Document 1

Summary of Invention

Problem to be Solved by the Invention

[0004] A temperature rise accompanying heat generation may increase dark current and noise in the output signal of the detection element. An object of the present invention is to provide a detector having a structure advantageous for suppressing temperature rise.

Means for Solving the Problem

[0005] In view of the above problems, the detector of the present invention includes a first member having a first surface and a second surface opposite to each other, a second member having a third surface and a fourth surface opposite to each other, a third member joining the second surface and the third surface, and a cooling member arranged on the first surface, wherein the first member has a detection region in which a detection element for detecting electromagnetic waves is arranged, and a peripheral circuit arranged outside the detection region in a plan view, and the cooling member is arranged outside the detection region in a plan view.

Effects of the Invention

[0006] According to the present invention, it is possible to provide a detector having a structure that is advantageous in suppressing temperature rise. [Brief explanation of the drawing]

[0007] [Figure 1] This is a plan view configuration diagram of the detector according to the first embodiment. [Figure 2] This is a cross-sectional view of the detector configuration diagram according to the first embodiment. [Figure 3] This is an enlarged cross-sectional view of the first member and cooling member of the detector according to the first embodiment. [Figure 4] This is a cross-sectional view showing the configuration of the detector according to the second embodiment. [Figure 5] This is an enlarged cross-sectional view of the first member and cooling member of the detector according to the third embodiment. [Figure 6] This is a side view showing the configuration of the detector according to the fourth embodiment. [Figure 7] This is a side view showing the configuration of the detector according to the fourth embodiment. [Figure 8] This is a side view showing the configuration of the detector according to the fifth embodiment. [Figure 9] This is a top view of the detector according to the fifth embodiment, viewed from above. [Figure 10] This is a side view showing the configuration of the detector according to the sixth embodiment. [Figure 11] This is a side view showing the configuration of the detector according to the sixth embodiment. [Figure 12] This is a top view of the detector according to the sixth embodiment, viewed from above. [Figure 13] This is a top view of the detector according to the embodiment, viewed from above. [Figure 14] This is a top view of the detector according to the embodiment, viewed from above. [Figure 15] This is a top view of the detector according to the embodiment, viewed from above. [Figure 16] This is a top view of the detector according to the embodiment, viewed from above. [Figure 17]This is a top view of the detector according to the embodiment when viewed in plan from the top surface side. [Figure 18] This is a top view of the detector according to the embodiment when viewed in plan from the top surface side. [Figure 19] The figure schematically showing an application example of the detector to an apparatus. [Mode for Carrying Out the Invention]

[0008] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. A plurality of features are described in the embodiments, not all of the plurality of features are necessarily essential to the invention, and the plurality of features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant description is omitted.

[0009] (Embodiment 1) A first embodiment according to the present invention will be described below with reference to Figure 1, Figure 2, and Figure 3. Figure 1 and Figure 2 show the overall outline of the detector according to the present embodiment. The detector includes a detection element capable of detecting electromagnetic waves. The detector is a typical image sensor such as a CMOS (Complementary Metal Oxide Semiconductor) sensor or a CCD (Charge Coupled Device) sensor. Further, a SPAD (Single Photon Avalanche Diode) may be used as the detection element.

[0010] Figure 1 shows a top view of the detector when the detector is viewed in plan from the top surface side of the detector. Here, the plan view refers to viewing the detector from a direction perpendicular to the surface on which electromagnetic waves enter the detector. When the surface on which electromagnetic waves enter the detector is defined as the top surface, the detector may be viewed from the top surface side, or may be viewed from the bottom surface side which is the surface opposite to the surface on which electromagnetic waves enter. Figure 2 shows a cross-sectional view of the detector taken along the line A-A' in Figure 1.

[0011] The detector includes a first member 1, a second member 2, a third member 3, a cooling member 4, and a heat transfer member 5. The first member 1 has two surfaces opposite to each other. The second member 2 also has two surfaces opposite to each other. The third member 3 is a member sandwiched between the first member 1 and the second member 2, and is a member that joins one surface of the first member 1 and one surface of the second member 2. The detector includes a detection region 1a for detecting electromagnetic waves, and a peripheral circuit 1b for processing the detected signal.

[0012] FIG. 3 shows an enlarged cross-sectional view of the first member 1, the cooling member 4, and the heat transfer member 5 taken along the line A-A' in FIG. 1. As shown in FIG. 3, the first member 1 has an insulating film 1c, a circuit 1d, and a base material 1e. A single crystal layer such as silicon or germanium is used for the base material 1e, but a polycrystalline layer may also be used. The planar shapes of the detection region 1a and the peripheral circuit 1b of the first member 1, as well as the positional relationship between the two, are not particularly limited to those in FIG. 3. The peripheral circuit 1b is located around the detection region 1a, and may be provided as one or a plurality thereof.

[0013] The detection region 1a of the first member 1 is a part of a region where detection elements that convert electromagnetic waves into output signals which are electrical signals are arranged. When the detection elements are pixels, the detection region 1a can also be referred to as a pixel region. The detection region 1a of the first member 1 may include, in addition to a plurality of pixels for forming an image based on electromagnetic waves, a readout circuit that reads signals from the pixels. The detection region 1a generally has a substantially quadrilateral outer periphery in a plan view from the top surface. The detection region 1a can have a structure in which a plurality of pixels and readout circuits are arranged. The peripheral circuit 1b is provided with a drive circuit, a control circuit, a signal processing circuit, an output circuit, and the like.

[0014] The drive circuit can cause the pixels to perform imaging, or control the readout circuit to read signals from the pixels. The control circuit can control the timings of the drive circuit, the signal processing circuit, and the like. The signal processing circuit can process the signals read out from the pixels. The output circuit is a circuit for outputting the signal-processed signal from the detector. The peripheral circuit may be provided with an analog-to-digital converter (ADC) that converts signals from the pixels into digital signals.

[0015] The second component 2 is a circuit board made of resin or ceramic, having a wiring layer on which wiring forming the circuit is arranged. The second component 2 is larger in plan view than the outer shape of the first component 1 and is electrically connected to the peripheral circuit 1b of the first component 1. In addition, electrical components not shown, such as capacitors, resistors, and connectors, may be mounted on the second component 2. The second component 2 has many circuit wirings and electrical components arranged on it, and in order to mount the first component 1, it is generally larger in area in plan view than the peripheral circuit 1b, but the area can be reduced by mounting some of the components that form the circuit on a separate board.

[0016] The third component 3 is a bonding component that adheres one surface of the first component to one surface of the second component 2. The third component 3 can be an adhesive, grease, gel, solder, die bond material, etc. From the viewpoint of preventing heat from the second component 2 from transferring to the first component 1, it is appropriate to use a material with good heat insulation properties.

[0017] The cooling member 4 is positioned on the surface opposite to the surface to which the third member is joined. The cooling member 4 is in contact with the insulating film 1c on the peripheral circuit 1b. The cooling member 4 can suppress the temperature rise of the detection region 1a and the peripheral circuit 1b, thereby lowering the temperature. The cooling member 4 is preferably positioned directly above the peripheral circuit 1b, which is a heat source, and covering part or all of the peripheral circuit 1b.

[0018] The heat transfer member 5 is in contact with the cooling member 4, and heat from the detection area 1a and the surrounding circuit 1b is transferred from the cooling member 4 to the heat transfer member 5, dissipating to the outside. In order to dissipate heat, it is desirable that the heat transfer member 5 has a higher thermal conductivity than the external atmosphere of the area in which the detector is located and the third member 3. Suitable materials with high thermal conductivity for the heat transfer member include gold (Au), tungsten (W), copper (Cu), titanium (Ti), tantalum (Ta), aluminum (Al), ruthenium (Ru), or carbon graphite.

[0019] The heat transfer element 5 can extend from the detector and come into contact with an external component to dissipate heat to the outside. The heat transfer element 5 itself may be water-cooled. The cooling element 4 can be a water-cooled cooler, an electrically driven cooling element such as a Peltier element, or a cooling element that dissipates heat using thermal conduction.

[0020] According to this embodiment, the first member 1 can be cooled without the second member 2 and the third member 3 by directly contacting the cooling member with the first member 1. This allows for efficient cooling of the first member 1. According to this embodiment, the temperature rise of the first member 1 can be suppressed, thereby reducing the generation of dark current and noise in the detection region 1a. Therefore, it is possible to provide a detector with a good signal-to-noise ratio. Furthermore, according to this embodiment, the cooling structure is simple, and the cost of the detector can be reduced.

[0021] The detector used in this embodiment can be of various types, capable of detecting electromagnetic waves of desired wavelengths within the range of infrared light, visible light, and radiation. Radiation may include ionizing radiation such as X-rays and gamma rays. Radiation may also include particle beams such as alpha rays, beta rays, neutron beams, proton beams, heavy ion beams, and meson beams, as well as electron beams.

[0022] (Embodiment 2) A second embodiment will be described with reference to Figure 4. Figure 4 shows a cross-sectional view of the detector according to this embodiment. Here, in the second embodiment, the surface of the first member 1 that contacts the third member 3 is defined as the back surface, and the surface on the opposite side is defined as the front surface. The region obtained by projecting the detection region 1a of the first member 1 onto the second member 2 is defined as the first region. In a plan view, the region obtained by opening at least a part of the region of the second member 2 corresponding to the first region is defined as the first opening 12. In a plan view, the third member is arranged in at least a part of the region where the first member and the second member overlap. In the third member, the region obtained by opening the region corresponding to the first opening 12 is defined as the second opening 13.

[0023] The second member 2 and the third member 3 are provided with a first aperture 12 and a second aperture 13, respectively, which expose all or part of the back surface of the detection area 1a. When the detector detects radiation, the radiation is irradiated onto the front side of the first member 1 and transmitted to the back side. Since reflected or scattered transmitted radiation can become noise in the detection signal, it is desirable to provide an aperture on the back surface of the detection area 1a. Furthermore, to prevent an increase in noise due to collision and scattering of radiation, it is desirable to operate the detector 1 in a vacuum. The entire detector 1 may be operated in a vacuum, or only a part of the structure including the first region of the detector may be operated locally in a vacuum. If the parts of the first aperture 12 and the second aperture 13 are in a vacuum, the cooling efficiency in the vacuum may be improved.

[0024] When radiation is irradiated onto the detection region 1a, secondary electrons are generated in the first member 1, and these secondary electrons can cause crosstalk between pixels, potentially reducing resolution. If the thickness of the first member 1 is thick, the secondary electrons are scattered and spread, further reducing resolution. On the other hand, if the detection region 1a is thin, the amount of detection is insufficient, leading to a decrease in signal strength. For a good signal-to-noise ratio of the detector 1, the thickness of the detection region 1a is preferably between 10 μm and 100 μm.

[0025] (Embodiment 3) This embodiment will be described with reference to Figure 5. Figure 5 shows an enlarged cross-sectional view of the first member 1 and the cooling member 4 according to this embodiment. In the third embodiment, as shown in Figure 5, the cooling member 4 is brought into contact with the insulating film 1c via a highly thermally conductive intermediate member 6 such as heat dissipation putty, heat transfer grease, or a thermally conductive sheet. The highly thermally conductive intermediate member 6 improves the adhesion between the surface of the first member 1 and the cooling side surface of the cooling member 4, and the heat transfer efficiency between the cooling member 4 and the first member is improved by the use of the highly thermally conductive intermediate member 6, thereby improving the cooling efficiency. The structure according to this embodiment can be applied to the cooling portion structures of embodiments 1 and 2.

[0026] (Embodiment 4) This embodiment will be explained with reference to Figures 6 and 7. Figure 6 is a side view showing the configuration of the detector according to the embodiment. In this embodiment, a Peltier element 14 is used as the cooling member 4. The Peltier element 14 can move heat from the cooling side to the heat dissipation side by passing an electric current through it. It is possible to make the temperature on the cooling side lower than the external atmosphere.

[0027] In this embodiment, current is supplied from the electrode pads 8 of the second member 2 to the Peltier element 14, which is the cooling member 4, via wiring 7. The heat dissipated from the Peltier element can also flow to the second member 2 via wiring 7, which is advantageous for heat dissipation when using the Peltier element 14 as the cooling member 4. By using the Peltier element 14 as the cooling member 4, it is possible to lower the temperature of the first member 1, thereby reducing dark current and providing a detector with less noise.

[0028] Figure 7 shows an example of a configuration in which current is supplied directly to the Peltier element 14 from an external source. Current is supplied to the Peltier element 14, which is the cooling member 4, from an external power supply via the conductive member 7. The conductive member 17 may also be a power terminal for connecting external wiring. Since power can be supplied directly from an external source, there is no need to install a power pad or wiring to a power pad inside the second member 2. Therefore, there is no need to change the wiring or circuit of the second member 2, making it suitable when applying a Peltier element to an existing detector.

[0029] (Embodiment 5) This embodiment is an example in which a heat diffusion member 24 is used as the cooling member 4. Figure 8 is a side view showing the configuration of the detector according to this embodiment, and is a schematic cross-sectional view taken along the line A-A' in Figure 9. Figure 9 shows a schematic top view of the first member 1 and the cooling member 4 when viewed from the side of the first member 1. The heat diffusion member 24, which is the cooling member 4, may cover at least a part of the peripheral circuit 1b of the first member 1, or the heat diffusion member 24 may cover the entire area of ​​the peripheral circuit 1b.

[0030] A heat transfer member 5 can be placed on the surface of the heat diffusion member 24 opposite to the surface in contact with the first member 1. In the example shown in Figure 9, two peripheral circuits 1b are provided, but there may be one peripheral circuit 1b or two or more. The heat diffusion member 24 covers the heat-generating parts of the peripheral circuit 1b, increasing the heat absorption rate and thereby increasing the cooling efficiency.

[0031] (Embodiment 6) This embodiment will be described using Figures 10, 11, and 12. Figures 10 and 11 are side views showing the configuration of the detector according to this embodiment. They generally correspond to the cross-sectional view along line A-A' in Figure 12. Figure 12 shows a schematic top view of the first member 1 and the cooling member 4 viewed from above. The sixth embodiment shows a structure that cools by combining a Peltier element 14, which is the cooling member 4, and a heat diffusion member 24.

[0032] The cooling effect of the Peltier element 14 is diffused by the heat diffusion member 24, which is positioned to cover the heat-generating area, thereby uniformly cooling the surface of the first member, and stabilizing the temperature of the entire first member 1. As a result, the generation of dark current and noise in the detection region 1a of the first member 1 can be reduced, making it possible to provide a detector with a good signal-to-noise ratio. Furthermore, the wiring 7 to the power supply of the Peltier element can be supplied directly from an external source as shown in Figure 10, or it can be supplied using the internal wiring of the second member 2 as shown in Figure 11.

[0033] <Arrangement of cooling components> Variations in the arrangement of the cooling element 4 according to each of the above embodiments will be explained using Figures 13 to 18. Note that in the following examples, for illustrative purposes, there are examples with one or two peripheral circuits 1b, but there may be one or more peripheral circuits 1b.

[0034] Figure 13 shows a top view taken from the top of the detector. In this example, the cooling member 4 is positioned at the center of the peripheral circuit 1b. It is sufficient for the cooling member 4 to cover the central part of the peripheral circuit 1b. In this example, the cooling member 4 is positioned inside the peripheral circuit 1b in a plan view. By positioning the cooling member 4 to align with the center of the peripheral circuit 1b, which is the heat source, the generated heat is quickly dissipated, increasing the cooling efficiency against heat generation.

[0035] Figure 14 shows a top view of the detector, taken from the top. The example in Figure 14 shows a configuration in which the cooling member 4 covers a portion of the peripheral circuit 1b and is positioned closer to the detection area 1a, extending beyond the peripheral circuit 1b. By positioning the cooling member 4 so that it extends beyond the peripheral circuit 1b towards the detection area 1a, heat generated in the peripheral circuit 1b can be prevented from being transferred to the detection area 1a. Furthermore, with this configuration, the cooling member 4 also contributes to the cooling of the detection area 1a, thereby stabilizing the temperature of the detection area 1a and reducing the dark current. Therefore, it becomes possible to provide a detector with a good signal-to-noise ratio.

[0036] Figures 15 and 16 show top views of the detector according to this embodiment, viewed from the top. The examples in Figures 15 and 16 show cases where the cooling member 4 is placed in the region between the detection area 1a and the peripheral circuit 1b in a plan view. The cooling member 4 may be placed in two directions where there are two peripheral circuits 1b, as in Figure 15, or in all four directions around the detection area 1a, as in Figure 16.

[0037] By arranging the cooling element 4 around the outside of the detection region 1a, the heat generated in the peripheral circuit 1b can be blocked at the location of the cooling element 4 and prevented from being transmitted to the detection region 1a, thereby stabilizing the temperature of the detection region 1a. As a result, the dark current of the detection region 1a of the first element 1 can be reduced, making it possible to provide a detector with a good signal-to-noise ratio.

[0038] Figures 17 and 18 show top views of the detector according to this embodiment, viewed from the top. In the example in Figure 17, there is a heat source, such as the peripheral circuit 1b, in only one direction. When there is a heat source in only one direction, one cooling member 4 can be placed between the detection area 1a and the peripheral circuit 1b, as shown in Figure 17. Alternatively, as shown in Figure 18, the cooling member 4 may be placed between the detection area 1a and the peripheral circuit 1b, and on the outside of the sides that are not adjacent to the detection area 1a and the peripheral circuit 1b. This can further stabilize the temperature of the detection area 1a. In Figure 18, the cooling member 4 is placed on two sides that are not adjacent to the detection area 1a and the peripheral circuit 1b, but it may also be placed on one side or three sides.

[0039] <Examples of detector applications in equipment> An example of applying the detector according to the above embodiment to equipment 1000 will be explained with reference to Figure 19. The semiconductor chip 1110, which includes a detection element and is mounted on a package 1020, is mounted on equipment 1000. The semiconductor device 1100 includes the detector according to the above embodiment, which is provided with a cooling member (not shown). The semiconductor device 1100 may include a package 1020 that includes a substrate 1010 on which the semiconductor chip 1110 is fixed, and a light-transmitting member 1030 such as glass facing the semiconductor chip 1110. The package 1020 may be provided with connecting members such as wires and bumps that connect inner leads provided on the substrate 1010 to terminals such as pad electrodes provided on the semiconductor chip 1110.

[0040] The device 1000 may include at least one of the following: an optical device 1040, a control device 1050, a processing device 1060, a display device 1070, a storage device 1080, and a mechanical device 1090. The optical device 1040 is, for example, a lens, a shutter, or a mirror. The control device 1050 controls the semiconductor chip 1110. The control device 1050 is, for example, a semiconductor device such as an ASIC.

[0041] The processing unit 1060 processes the output signals from the semiconductor integrated circuit contained in the semiconductor chip 1110. The processing unit 1060 is a semiconductor device such as a CPU or ASIC that constitutes an analog front end (AFE) or a digital front end (DFE). For example, it may generate an image based on the imaging signal when an event is detected. The display device 1070 is an EL display device or liquid crystal display device that displays the information image obtained from the semiconductor chip 1110. The storage device 1080 is a magnetic device or semiconductor device that stores the information image obtained from the semiconductor chip 1110. The storage device 1080 is a volatile memory such as SRAM or DRAM, or a non-volatile memory such as flash memory or a hard disk drive.

[0042] The mechanical device 1090 has movable parts or propulsion parts such as a motor or engine. In the device 1000, signals output from the semiconductor chip 1110 are displayed on the display device 1070 or transmitted to the outside by a communication device (not shown) provided in the device 1000. For this purpose, the device 1000 may further include a storage device 1080 and a processing device 1060, separate from the memory circuits and arithmetic circuits of the semiconductor chip 1110. The mechanical device 1090 may be controlled based on signals output from the semiconductor chip 1110.

[0043] The device 1000 is suitable for electronic devices such as information terminals with shooting capabilities, such as smartphones and wearable devices, and cameras, such as interchangeable lens cameras, compact cameras, video cameras, and surveillance cameras. In a camera, the mechanical device 1090 may be a device that can drive components of the optical device 1040 for zooming, focusing, and shutter operation. Alternatively, the mechanical device 1090 in a camera may be a device that can move the optical device 1040 for vibration damping.

[0044] Furthermore, the device 1000 may be a transport device such as a vehicle or a ship. The mechanical device 1090 in the transport device may be used as a mobile device. The device 1000 as a transport device is suitable for transporting semiconductor chips 1110 or for assisting and / or automating driving operations through its imaging function. The processing device 1060 for assisting and / or automating driving operations can perform processing to operate the mechanical device 1090 as a mobile device based on information obtained from the semiconductor chip 1110. Alternatively, the device 1000 may be a medical device such as an endoscope, a measuring instrument such as a distance sensor, an analytical instrument such as an electron microscope, an office machine such as a copier, or an industrial machine such as a robot.

[0045] (Other embodiments) The disclosures herein include the detectors and equipment described below. (Item 1) A first member having a first surface and a second surface opposite to each other A second member having a third and fourth surface opposite to each other, A third member connecting the second surface and the third surface, A detector comprising a cooling member disposed on the first surface, The first member has a detection region on which a detection element for detecting electromagnetic waves is arranged, and a peripheral circuit arranged outside the detection region in a plan view. The detector is characterized in that the cooling member is positioned outside the detection area in a plan view. (Item 2) The detector according to item 1, characterized in that the second member has an opening that surrounds the detection area in a plan view. (Item 3) The detector according to item 2, characterized in that at least the region surrounded by the opening is a vacuum. (Item 4) The detector according to any one of items 1 to 3, characterized in that the third member is located in at least a portion of the region where the first member and the second member overlap in a plan view. (Item 5) The detector according to any one of items 1 to 4, characterized in that the cooling member is arranged to cover at least a portion of the peripheral circuit in a plan view. (Item 6) The detector according to any one of items 1 to 4, characterized in that the cooling member is arranged between the peripheral circuit and the detection region in a plan view. (Item 7) The detector according to any one of items 1 to 6, characterized in that at least a portion of the first surface is covered with an insulating film. (Item 8) The detector according to item 7, characterized in that the cooling member is in contact with the insulating film. (Item 9) The detector according to item 7, characterized in that the cooling member is in contact with the insulating film via a heat dissipation putty, heat transfer grease, or heat conductive sheet. (Item 10) The detector according to any one of items 1 to 9, characterized in that the cooling member has an electrode to which a current for driving the cooling member is supplied, and the electrode is connected to the electrode pad of the second member by a conductive member. (Item 11) The detector according to any one of items 1 to 9, characterized in that the cooling member is provided with a power terminal to which a current for driving the cooling member is supplied from outside the detector. (Item 12) The detector according to any one of items 1 to 11, characterized in that the first member contains silicon. (Item 13) The detector according to any one of items 1 to 12, characterized in that the second member has a wiring layer on which wiring is arranged, and the wiring is electrically connected to the first member. (Item 14) The detector according to any one of items 1 to 13, characterized in that the second member includes ceramic. (Item 15) The detector according to any one of items 1 to 14, characterized in that the cooling member is a Peltier element. (Item 16) The detector according to any one of items 1 to 15, characterized in that the cooling member is a heat diffusing member. (Item 17) The detector according to any one of items 1 to 16, characterized in that the cooling member includes a Peltier element and a heat diffusion member, and the Peltier element is in contact with the first surface via the heat diffusion member. (Item 18) A detector as described in any one of items 1 through 17, A device comprising a processing device for processing signals from the aforementioned detector.

[0046] The disclosures herein include not only what is described herein, but also all matters that can be understood from this specification and the drawings attached herein. The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to make the scope of the invention public. [Explanation of Symbols]

[0047] 1 First component, 1a Detection area, 1b Peripheral circuit, 2 Second component, 3 Third component, 4 Cooling component, 5 Heat transfer component

Claims

1. A first member having a first surface and a second surface opposite to each other A second member having a third and fourth surface opposite to each other, A third member connecting the second surface and the third surface, A detector comprising a cooling member disposed on the first surface, The first member has a detection region on which a detection element for detecting electromagnetic waves is arranged, and a peripheral circuit arranged outside the detection region in a plan view. The detector is characterized in that the cooling member is positioned outside the detection area in a plan view.

2. The detector according to claim 1, characterized in that the second member has an opening that surrounds the detection area in a plan view.

3. The detector according to claim 2, characterized in that at least the region surrounded by the opening is a vacuum.

4. The detector according to claim 1, characterized in that the third member is arranged in at least a portion of the region in which the first member and the second member overlap in a plan view.

5. The detector according to claim 1, characterized in that the cooling member is arranged to cover at least a portion of the peripheral circuit in a plan view.

6. The detector according to claim 1, characterized in that the cooling member is arranged between the peripheral circuit and the detection region in a plan view.

7. The detector according to claim 1, characterized in that at least a portion of the first surface is covered with an insulating film.

8. The detector according to claim 7, characterized in that the cooling member is in contact with the insulating film.

9. The detector according to claim 7, characterized in that the cooling member is in contact with the insulating film via a heat dissipation putty, heat transfer grease, or thermally conductive sheet.

10. The detector according to claim 1, wherein the cooling member has an electrode to which a current for driving the cooling member is supplied, and the electrode is connected to the electrode pad of the second member by a conductive member.

11. The detector according to claim 1, characterized in that the cooling member is provided with a power terminal to which a current for driving the cooling member is supplied from outside the detector.

12. The detector according to claim 1, characterized in that the first member includes silicon.

13. The detector according to claim 1, characterized in that the second member has a wiring layer on which wiring is arranged, and the wiring is electrically connected to the first member.

14. The detector according to claim 1, characterized in that the second member includes ceramic.

15. The detector according to claim 1, characterized in that the cooling member includes a Peltier element.

16. The detector according to claim 1, characterized in that the cooling member includes a heat diffusion member.

17. The detector according to claim 1, wherein the cooling member includes a Peltier element and a heat diffusion member, and the Peltier element is in contact with the first surface via the heat diffusion member.

18. A detector according to any one of claims 1 to 17, A device comprising a processing device for processing signals from the aforementioned detector.

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