Window assembly including solderless electrical connectors

Abstract

To provide an improved solderless electrical connector. [Solution] The window assembly includes a transparent substrate, conductive features formed on the surface of the transparent substrate, and a solderless electrical connector for electrically coupling the vehicle's wiring harness to the conductive features. The solderless electrical connector includes an insulating cover and a conductive biasing member. The conductive biasing member includes a first end that is elastically compressed between the insulating cover and the conductive features so that the conductive biasing member is positioned in electrical contact with the conductive features, a second end configured to be coupled to the wiring harness, and a central region between them. The central region defines a notched area for engaging with the insulating cover to hold the conductive biasing member against the insulating cover. The solderless electrical connector further includes an adhesive disposed between the insulating cover and the transparent substrate for bonding the insulating cover to the transparent substrate.

Description

TECHNICAL FIELD

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the priority benefit of U.S. Utility Patent Application No. 19 / 174,512, filed on April 9, 2025, which is a continuation-in-part of U.S. Utility Patent Application No. 17 / 860,296 filed on July 8, 2022. The entire disclosures of those applications are incorporated herein by reference.

[0002] The present disclosure relates generally to window assemblies, and more specifically to window assemblies with electrically insulated, solderless electrical connectors. BACKGROUND ART

[0003] Window assemblies for vehicles are often functionalized to include one or more conductive features disposed on a transparent substrate. Typically, these conductive features are printed circuits formed by placing conductive ink, often containing silver, on the transparent substrate which is often made of glass. The conductive features may include, for example, antennas and heating elements. To supply power to these conductive features, a wiring harness is usually connected to these conductive features via electrical connectors. In common applications, the electrical connector is mechanically and electrically joined to the conductive feature and the underlying transparent substrate through a solder joint formed between the electrical connector and the conductive feature. There is a desire in the industry to eliminate the use of lead-based solders in such solder joints. Lead-free solder compositions provide alternatives to lead-based solders, but have performance and / or cost drawbacks.

[0004] Conventionally, conductive features like those described above are formed by placing a conductive paste / ink containing silver and ceramic frit onto a transparent substrate and firing the conductive paste / ink so that the ceramic frit component of the conductive paste / ink fuses with the transparent substrate to form the conductive feature. In recent years, in order to eliminate the strain caused by the above firing process, efforts have been made to form conductive features using conductive inks that do not contain ceramic frit, but instead contain organic compounds. However, a problem is that these conductive inks typically exhibit peak temperatures of 150°C to 330°C at the solder / ink interface, and do not have sufficient thermal resistance to the temperatures required for conventional soldering applications. Therefore, the bonding interface between the conductive ink and the transparent substrate is often damaged due to conventional soldering applications.

[0005] Furthermore, conductive inks that do not contain ceramic frit and instead contain organic compounds typically have much lower adhesion to these transparent substrates and are therefore unsuitable for conventional soldering applications. While the bonding performance of conductive inks can be improved through primers, the organic nature of conductive inks and the absence of frit suggest that it is difficult to improve adhesion sufficiently to achieve bonding performance that can withstand soldering.

[0006] Furthermore, conventional solderless connector assemblies face the challenge of providing sufficient current to the conductive features while maintaining an operating temperature low enough that the conductive components of the solderless connector do not melt and / or separate from the electrical insulation cover of the solderless connector. [Overview of the project] [Problems that the invention aims to solve]

[0007] Therefore, improved solderless electrical connectors are needed. [Means for solving the problem]

[0008] This disclosure generally applies to window assemblies for vehicles. A window assembly includes a transparent substrate and conductive features formed on the surface of the transparent substrate. The window assembly also includes a solderless electrical connector for electrically coupling the vehicle's wiring harness to the conductive features. The solderless electrical connector includes an insulating cover, which includes an inner surface facing the transparent substrate and an outer surface on the opposite side. The solderless electrical connector also includes a conductive biasing member. The conductive biasing member includes a first end, which extends from the inner surface of the insulating cover and is elastically compressed between the insulating cover and the conductive features so that the conductive biasing member is positioned in electrical contact with the conductive features. The conductive biasing member also includes a second end, which extends from the outer surface of the insulating cover and is configured to couple to the vehicle's wiring harness. The conductive biasing member connects a first end and a second end, and further includes a central region extending between the first end and the second end, the central region extending through an insulating cover and coupled to the insulating cover. The central region defines a notched region for engaging with the insulating cover and holding the conductive biasing member against the insulating cover. A solderless electrical connector is disposed between the inner surface of the insulating cover and a transparent substrate and includes an adhesive for bonding the inner surface of the insulating cover to the transparent substrate, the first end of the conductive biasing member being elastically compressed between the inner surface of the insulating cover and the transparent substrate to maintain the conductive biasing member in electrical contact with the conductive feature.

[0009] The window assembly according to this disclosure advantageously provides solderless electrical connections to conductive features disposed on a transparent substrate, having improved current transport capability and improved tensile strength / insulation retention of biasing members against the cover, without damaging reactive conductive ink (if used).

[0010] The advantages of this disclosure will become more readily apparent as they are better understood by examining the following detailed description in relation to the attached drawings. [Brief explanation of the drawing]

[0011] [Figure 1] This is a rear perspective view of a vehicle including a rear window assembly formed in accordance with this disclosure.

[0012] [Figure 2] This is a schematic cross-sectional view of the window assembly shown in Figure 1, taken along line 2-2, which includes a single sheet of glass and conductive ink applied thereto, according to one exemplary embodiment.

[0013] [Figure 3] This is a schematic cross-sectional view of the window assembly of Figure 1, taken along line 3-3, which includes a single sheet of glass and conductive ink applied thereto, according to another exemplary embodiment.

[0014] [Figure 4] This is a schematic cross-sectional view of the window assembly of Figure 1, taken along line 4-4, which includes a laminated window assembly to which conductive ink has been applied, according to another exemplary embodiment.

[0015] [Figure 5] This is a schematic cross-sectional view of the window assembly of Figure 1, taken along line 5-5, which includes a laminated window assembly to which conductive ink has been applied, according to another exemplary embodiment.

[0016] [Figure 6] This is a schematic cross-sectional view of the window assembly of Figure 1, taken along line 6-6, which includes a laminated window assembly to which conductive ink has been applied, according to another exemplary embodiment.

[0017] [Figure 7] This is a schematic cross-sectional view of the window assembly of Figure 1, taken along line 7-7, which includes a laminated window assembly to which conductive ink has been applied, according to another exemplary embodiment.

[0018] [Figure 8]FIG. 3 is a perspective view of a portion of the window assembly of FIG. 3, further comprising a solderless electrical connector to which conductive ink is applied and which is electrically connected to the conductive ink, in accordance with an exemplary embodiment.

[0019] [Figure 9] FIG. 4 is an exploded view of a portion of the laminated window assembly of FIG. 4, in which the outer transparent substrate and the intermediate layer are scalloped to expose the inward facing surface of the inner transparent substrate to which conductive ink has been applied, in accordance with another exemplary embodiment.

[0020] [Figure 10] FIG. 9 is an assembled view of FIG. 9.

[0021] [Figure 11] FIG. 10 is a perspective view of the laminated window assembly of FIG. 10, further comprising a solderless electrical connector electrically connected to the conductive ink on the opposite side of the inner transparent substrate, in accordance with another exemplary embodiment.

[0022] [Figure 12] FIG. 12 is a bottom perspective view of a solderless electrical connector in accordance with another exemplary embodiment.

[0023] [Figure 13] FIG. 12 is a top perspective view of FIG. 12.

[0024] [Figure 14] FIG. 12 is a front view of FIG. 12 in accordance with one configuration of a solderless electrical connector.

[0025] [Figure 15] FIG. 12 is a partial front view of FIG. 12 in accordance with another configuration of a solderless electrical connector.

[0026] [Figure 16] FIG. 14 is a schematic cross-sectional view of FIG. 14 taken along line 14-14, in accordance with one exemplary embodiment of a solderless electrical connector.

[0027] [Figure 17]Figure 3 is a perspective view of a portion of the window assembly, which is coated with conductive ink and further includes solderless electrical connectors, as shown in Figures 12-14, electrically connected to each electrical connection component and the conductive ink.

[0028] [Figure 18] Figure 9 is a perspective view of a portion of the transparent laminated window assembly, further including the solderless electrical connectors shown in Figures 12-14, which are electrically connected to the respective electrical connection components and the conductive ink applied to the inner surface of the inner transparent substrate.

[0029] [Figure 19] Figure 5 is a schematic cross-sectional view of a portion of the laminated window assembly, further including solderless electrical connectors electrically connected to each electrical connection component and conductive ink applied to the inner surface of the inner transparent substrate.

[0030] [Figure 20] This is a flowchart illustrating a method for manufacturing a glass assembly having a solderless electrical connector, according to an exemplary embodiment.

[0031] [Figure 21] This is a flowchart illustrating a method for manufacturing a glass assembly with a solderless electrical connector, according to another related exemplary embodiment.

[0032] [Figure 22] This is a flowchart illustrating a method for manufacturing a glass assembly with a solderless electrical connector, according to yet another related exemplary embodiment.

[0033] [Figure 23] This is a flowchart illustrating a method for manufacturing a glass assembly with a solderless electrical connector, according to yet another related exemplary embodiment.

[0034] [Figure 24A] This is a front view of an example of a conductive biasing member according to the present disclosure.

[0035] [Figure 24B] Figure 24B is a top perspective view of the conductive biasing member.

[0036] [Figure 25] Figures 24A to 24B show schematic cross-sectional representations of solderless electrical connectors including conductive biasing members.

[0037] [Figure 26A] Figures 24A-24B are top perspective views of another configuration of a solderless electrical connector including a conductive biasing member.

[0038] [Figure 26B] Figure 26A is a bottom perspective view of a solderless electrical connector.

[0039] [Figure 27] This is a schematic cross-sectional representation of a solderless electrical connector that includes a green-strength adhesive to hold the insulating cover in place by pressing it against the surface of a transparent substrate without external fixing. [Modes for carrying out the invention]

[0040] Referring to the drawings, similar or identical components are identified in various figures using similar reference numerals, and Figure 1 schematically shows a window assembly 10 having conductive features 16 formed on a transparent substrate 18. Although not required, the window assembly 10 may be used in the context of an automobile, such as a vehicle 20, where the conductive features 16 can function to provide an electrical path along a portion of the transparent substrate 18. Of course, it should be recognized that the window assembly 10 can be used outside the context of an automobile.

[0041] As defined herein, the term “transparent,” also referred to as “substantially transparent,” when used in reference to a substrate, refers to a material that allows 70% or more of light transmission within a given visible light range to pass through. Unless otherwise specified, the given visible light range is the interval of the electromagnetic spectrum that the human eye can see. More simply, wavelengths within this range are called visible light. Typically, the human eye can perceive wavelengths between 380 and 780 nanometers; therefore, as defined herein, the given visible light range refers to wavelengths of light between 380 and 780 nanometers unless otherwise specified.

[0042] The conductive feature 16 is defined by conductive ink 52 (see, e.g., Figures 2-3) or 104 (see, e.g., Figures 4-7) applied to one or more surfaces of the transparent substrate 18, as described in the various exemplary embodiments below. The conductive feature 16 may define one or more bus bars, antennas, or heating elements. The conductive feature 16 may also be used with one or more electrical components 22 that are integrated into or directly coupled to the conductive feature 16. For example, one or more electrical components 22 may include a circuit resistance heater capable of locally heating and / or defrosting a portion of the transparent substrate 18. Additionally or alternatively, one or more electrical components 22 may include one or more antennas, LED lighting, camera modules, or other similar electrical equipment. It should be recognized that an electrical connection component 14, shown as a wire harness 14 in various embodiments, may transmit power from a separate power source to the conductive feature 16 and the associated one or more electrical components 22. Hereafter, the terms "electrical connection component 14" and "wire harness 14" may be used synonymously.

[0043] In certain embodiments, the conductive feature 16 may include one or more electrical conductors 24 or wires that are bonded to or integrally formed as an outer layer of the substrate 18. One or more electrical conductors 24 may include, for example, a conductive layer of silver. In other embodiments, the electrical conductor 24 may be made of another conductive metal in addition to or instead of silver. The electrical conductor 24 may be a film, a coating, and / or may take other forms, as long as the electrical conductor 24 is conductive and performs any function known in the art relating to such electrical conductors. The electrical conductor 24 may be porous and / or non-porous. In various embodiments, the electrical conductor 24 is a porous silver film. In certain embodiments, the electrical conductor 24 is an electrical extension of the electrical component 22 and / or the conductive feature 16. In other embodiments, the electrical conductor 24 is separately attached to the substrate 18 and electrically coupled to the electrical component 22 and / or the conductive feature 16.

[0044] In an alternative embodiment, the window assembly 10 also has a solderless electrical connector 12 (Figures 8 and 11) or 300 (Figures 15 and 16) which electrically contacts electrical connection components 14, such as the wire harness 14 shown herein, with the conductive feature 16 to mechanically and electrically couple or connect them.

[0045] In certain embodiments, such as those shown in Figures 2 and 3, the transparent substrate 18 may include a plate of glass 50, which is shown here as a single sheet of glass 50, and the glass 50 includes an outward-facing surface 50A (also referred to as the "P1 surface") and an inward-facing surface 50B (also referred to as the "P2 surface"). In other words, the glass substrate 50 includes first and second opposite surfaces 50A and 50B. When installed in the opening 25 of the vehicle 20, the inward-facing surface 50B is positioned adjacent to the interior area 27 of the vehicle 20, which may also be referred to as the passenger compartment 27 of the vehicle 20, while the outward-facing surface 50A is positioned facing the exterior 29 of the vehicle 20.

[0046] In one example of forming a curved transparent substrate 18, the curved transparent substrate 18 is first formed as a flat glass sheet. The flat glass sheet may be manufactured using any suitable flat glass manufacturing method, including, but not limited to, the float process. The flat glass sheet may be made of any suitable glass composition, including, but not limited to, soda-lime glass, aluminosilicate glass, borosilicate glass, boroaluminosilicate glass, etc. After forming the flat glass sheet, the flat glass sheet is bent to form the curved transparent substrate 18. The flat glass sheet may be bent using any suitable glass bending method, including, but not limited to, press bending, gravity bending (i.e., deflection bending), roll forming, or cold bending. The flat glass sheet may be bent into any geometric shape suitable for the desired application.

[0047] In other examples, the curved transparent substrate 18 is formed first as a curved substrate, in contrast to the production of a flat glass plate and subsequent bending. The curved transparent substrate may be produced using any suitable curved glass manufacturing method, including, but not limited to, glassblowing. In this example, where the curved transparent substrate 18 is formed first, similar to the flat glass plate described above, the curved transparent substrate 18 may consist of any suitable glass composition, including, but not limited to, soda-lime glass, aluminosilicate glass, borosilicate glass, boroaluminosilicate glass, etc.

[0048] In some examples, the transparent substrate 18 may be formed as a curved transparent substrate 18 before the conductive ink 52 is applied to the surface of the transparent substrate 18. In other examples, the conductive ink 52 is applied to the surface of the transparent substrate 18 before the transparent substrate 18 is curved according to the method described above. In these examples, especially if the conductive ink 52 contains ceramic frit, the bending operation also heats the conductive ink 52 so that the ceramic frit component fuses with the transparent substrate 18 to form conductive features 16.

[0049] In some embodiments, for example, the transparent substrate 18 may contain various additives that modify the transmittance of the transparent substrate 18 in order to provide various levels of shade or coloration while keeping the transparent substrate 18 "transparent" or "substantially transparent" as described above.

[0050] In other embodiments, the transparent substrate 18 may, for the alternative, be a single polymer substrate made solely from a transparent polymer material such as polymethyl methacrylate, polycarbonate, or polyvinyl butyral.

[0051] In yet another embodiment, as shown in Figures 4-7, the transparent substrate 18 is in the form of a laminated window assembly 90, in contrast to the form of a single sheet of glass 50 or a single sheet of polymer substrate. The transparent substrate 18 includes an inner transparent substrate 106 and an outer transparent substrate 100, and an intermediate layer 102 disposed between the inner and outer transparent substrates 106 and 100. In a particular embodiment, the intermediate layer 102 bonds the inner and outer transparent substrates 106 and 100, allowing the laminated window assembly 90 to hold fragments of the inner and outer transparent substrates 106, 100 in the event of impact or breakage. When installed in the opening 25 of the vehicle 20, the inner transparent substrate 106 is positioned adjacent to the interior area 27, sometimes referred to as the passenger compartment 27 of the vehicle 20, while the outer transparent substrate 100 is positioned facing the exterior 29 of the vehicle 20.

[0052] In these embodiments, the inner transparent substrate 106 includes surfaces 106A and 106B that are opposite to each other (i.e., first and second opposite surfaces 106A and 106B), and the outer transparent substrate 100 includes surfaces 100A and 100B that are opposite to each other (i.e., first and second opposite surfaces 100A and 100B). Similarly, the intermediate layer 102 includes surfaces 102A and 102B that are opposite to each other (i.e., first and second opposite surfaces 102A and 102B). As described herein, the outward-facing surface 100A may be referred to as P1, and the inward-facing surface 100B may be referred to as P2. Similarly, the inward-facing surface 106A may be referred to as P3, and the outward-facing surface 106B may be referred to as P4.

[0053] In certain embodiments, the inner and outer transparent substrates 106, 100 are formed from the same material as described above with respect to the transparent substrate 18 (e.g., a single sheet of glass or a single polymer substrate). The inner and outer transparent substrates 106, 100 may be made of the same or different materials. In certain embodiments, for example, the inner and outer transparent substrates 106, 100 are substantially transparent sheets of glass. However, in other embodiments, the inner and / or outer transparent substrates 106, 100 may be plastic, fiberglass, or any other suitable substantially transparent polymer material as described above. In other embodiments, the inner and outer transparent substrates 106, 100 are sheets of less transparent glass. For example, if the laminated window assembly 90 is privacy glass, the transparency of the laminated window assembly 90 is substantially reduced, thus allowing less than 70% light transmission in a given wavelength range, such as greater than 0 to 70% light transmission in a given wavelength range.

[0054] Typically, the interlayer 102 is substantially transparent to light and contains a polymer or thermoplastic resin such as polyvinyl butyral (PVB). However, other suitable materials for mounting the interlayer 102 may be used. Like the inner and outer transparent substrates 106, 100, the interlayer 102 is also substantially transparent to light or otherwise transparent. Therefore, a laminated window assembly 90 including the interlayer 102 between the inner and outer transparent substrates 106, 100 may also be substantially transparent to light or otherwise transparent.

[0055] In each illustrated embodiment, whether the window assembly 10 is in the form of a single transparent substrate 18 or a laminated window assembly 90, each component of the window assembly 10 is curved to include an inner curved surface (such as 50B of the single glass plate 50 in Figures 2-3, or 106A of the laminated window assembly 90 in Figures 4-7) and an outer curved surface (such as 50A of the single glass plate 50 in Figures 2-3, or 100A of the laminated window assembly 90 in Figures 4-7). Therefore, in each illustrated embodiment, each component of the curved transparent substrate 18 defines a curved outward-facing surface and an inward-facing surface on the opposite side.

[0056] Furthermore, in the vehicle 20 shown in Figure 1, the inner curved surface of the transparent substrate 18 is positioned facing the internal region 27 of the vehicle 20 to further define the boundary of the internal region 27, while the outer curved surface is positioned facing the exterior 29 of the vehicle 20.

[0057] In certain embodiments, such as those shown in Figures 2-3 and described below, the conductive feature 16 includes a conductive ink 52 applied to one or both of the outward and inward surfaces (e.g., 50A, 50B of a single sheet of glass 50) of a curved transparent substrate 18. In one example, the conductive ink 52 includes conductive particles (e.g., silver) and ceramic frit such that when fired, the conductive ink 52 fuses with the transparent substrate to form the conductive feature 16. In another example, the conductive ink 52 does not contain ceramic frit. For example, the conductive ink 52 may include a thermosetting organic monomer and conductive particles (e.g., silver nanoparticles) dispersed in an organic monomer. In yet another example, it should be recognized that the organic monomer may instead be an oligomer or a combination of monomer and oligomer. In yet another example, the conductive ink 52 includes any other suitable metal-organic complex containing an organic component and a conductive metallic component, such as a metal-organic complex containing a silver organic compound or a copper organic compound.

[0058] In certain embodiments, the applied conductive ink 52 is photocured and / or thermally cured to form a cured conductive ink 52 on one or both of the outward and inward surfaces (e.g., 50A, 50B of a single sheet of glass 50) of the curved transparent substrate 18, or sintered to form a sintered conductive ink. In other embodiments, particularly when the conductive ink 52 contains ceramic frit, the applied conductive ink 52 is fired so that the ceramic frit component fuses with the transparent substrate 18 to form a conductive feature 16.

[0059] More specifically, one example of curing the conductive ink 52 includes thermal curing the conductive ink 52. Any suitable thermal curing apparatus is intended for thermal curing the conductive ink 52, including, but not limited to, an oven, a heat gun, or an IR heater. Thermal curing in the context of this disclosure involves exposing the curved transparent substrate 18 to a temperature sufficient to cure the conductive ink 52 on the surface of the curved transparent substrate 18. In some examples, the conductive ink may fuse with the transparent substrate 18, as described above.

[0060] In some cases, particularly when the conductive ink 52 does not contain ceramic frit, the curing temperature for curing the conductive ink 52 is selected considering the thermal degradation temperature of the conductive ink 52. More specifically, a curing temperature lower than the thermal degradation temperature of the conductive ink 52 applied to the transparent substrate 18 is selected to prevent the conductive ink 52 from burning out of the curved transparent substrate 18 and to minimize optical distortion of the curved transparent substrate 18. For example, the conductive ink 52 may have a thermal degradation temperature of 210 degrees Celsius after being applied to the transparent substrate 18. Therefore, a curing temperature lower than 210 degrees Celsius, such as 200 degrees Celsius, may be selected.

[0061] In another example, the conductive ink 52 includes a thermosetting metal-organic complex. The metal-organic complex may include a silver organic compound containing an organic component and a conductive metal component, such as a copper organic compound, or any other suitable metal-organic complex. In this example, after the conductive ink 52 containing the metal-organic complex is applied to the surface of the curved transparent substrate 18, the conductive ink 52 may be exposed to a temperature sufficient to volatilize the organic component of the metal-organic complex so that only the metal particles (e.g., silver particles) remain on the surface of the curved transparent substrate 18.

[0062] Another example of curing the conductive ink 52 includes photocuring the conductive ink 52 using a UV curing device. In this example, the conductive ink 52 is a photocurable conductive ink 52. The photocurable conductive ink 52 may comprise a photoinitiator, an organic monomer, and conductive particles (e.g., silver nanoparticles) dispersed in the organic monomer. In other examples, it should be recognized that the organic monomer may instead be an oligomer or a combination of monomer and oligomer. The photoinitiator may comprise any suitable compound that, upon exposure to UV light, initiates polymerization of the organic monomer. For example, the photoinitiator may be a compound that, upon exposure to UV light, produces a reactive species (e.g., a free radical, a cation, or an anion) that initiates polymerization of the organic monomer and / or oligomer. Thus, in this example, curing the conductive ink 52 comprises exposing the conductive ink 52 to a UV curing device to activate the photoinitiator and initiate polymerization of the organic monomer to cure the conductive ink.

[0063] For example, a UV curing device is a UV light-emitting diode that emits UV light. For instance, a UV curing device may emit UV light having a wavelength of 315 to 400 nanometers (commonly known as the UV-A spectrum). A UV light-emitting diode may emit UV light with a narrower spectrum, such as emitting UV light with a wavelength of substantially 385 nanometers. Any wavelength within the UV spectrum is intended.

[0064] In certain embodiments, the curing of the conductive ink 52 may be started immediately after application to prevent the conductive ink 52 from dripping or smudging. For example, the curing of the conductive ink 52 may be started within 0 to 5 seconds after application. Alternatively, curing may be started within 5 seconds, 4 seconds, 3 seconds, 2 seconds, or 1 second after application of the conductive ink 52.

[0065] In yet another embodiment, the conductive ink 52 is sintered after application. The sintering step is a process in which the applied conductive ink 52 is compressed and molded using heat or pressure so that the particles of the conductive ink 52 can coalesce to form a solid mass without melting the applied conductive ink 52 to the point of liquefaction. Therefore, during the sintering step, the applied conductive ink 52 may be heated to a temperature sufficient to sinter the applied conductive ink 52 without melting it. This is hereafter referred to as heating to the sintering temperature. Alternatively, during the sintering step, the applied conductive ink 52 is subjected to a pressure sufficient to sinter the applied conductive ink 52 without melting it. This is hereafter referred to as pressurizing to the sintering pressure. In yet another alternative embodiment, the sintering step may be a combination of heating the applied conductive ink 52 sufficiently to sinter it and applying pressure, thereby forming sintered conductive ink on the surface of the curved substrate.

[0066] In yet another embodiment, the conductive ink 52 may be a conductive silver ink 52 containing silver nanoparticles. In a particular embodiment, the silver nanoparticles of the conductive silver ink 52 may have an average particle size of 1 to 100 nanometers. One non-limiting conductive silver ink 52, 104 that may be used is a commercially available silver nanoparticle ink from Fujifilm, which has a sintering temperature of 80 degrees Celsius for 5 minutes. In these embodiments, the conductive ink 52, 104 is photocured, thermocured, sintered, or dried after application, as described above. For example, the conductive silver ink 52 may be applied to the surface of a curved transparent substrate 18 in line widths from 10 micrometers to 1 millimeter and then sintered.

[0067] Alternatively, in other embodiments, the conductive ink 52 applied to one or more outward-facing and inward-facing surfaces of the curved transparent substrate 18 (e.g., 50A, 50B of a single sheet of glass 50) is left uncured and unsintered, and is simply dried or otherwise adhered to the outward-facing and / or inward-facing surfaces, respectively.

[0068] For the sake of simplicity in the following explanation, when the description of conductive ink 52 refers simply to the conductive ink 52 applied to the curved transparent substrate 18, or simply to conductive ink 52 as in any of Figures 2-16, unless otherwise specified, it should be understood that the applied conductive ink 52 specifically includes the applied conductive ink 52 which is later cured, sintered, fired, or simply dried on the curved transparent substrate 18.

[0069] Figures 2 and 3 show examples of conductive ink applied to a curved transparent substrate 18. In these examples, the curved transparent substrate 18 is a single sheet of glass 50. In the example shown in Figure 2, the conductive ink 52 is applied to the inward surface 50B of the curved glass plate 50. On the other hand, in the example shown in Figure 3, the conductive ink 52 is applied to the outward surface 50A of the curved glass plate 50. It is intended that the conductive ink 52 may be applied to both the outward and inward surfaces of the curved transparent substrate 18.

[0070] In certain alternative embodiments, such as those shown in Figures 4-7 and described below, where the transparent substrate 18 is in the form of a laminated window assembly 90, the conductive feature 16 includes conductive ink 104 applied to one of the outward-facing or inward-facing surfaces 100A, 106A, 100B, and 106B of each of the inner and outer transparent substrates 106, 100 of the laminated window assembly 90. In these embodiments, the step of laminating an intermediate layer 102 onto each of the inner and outer transparent substrates 106, 100 is performed after the step of applying and / or curing the conductive ink 104. The conductive ink 104 may have the same or a different composition as the conductive ink 52.

[0071] Referring first to Figure 4, in one embodiment, the conductive ink 104 is applied to the surface 106A of the inner transparent substrate 106 and thus disposed between the inner transparent substrate 100 and the intermediate layer 102.

[0072] In Figure 5, in another embodiment, the conductive ink 104 is applied to the inward surface 100B of the outer transparent substrate 100, and is therefore disposed between the outer transparent substrate 100 and the intermediate layer 102.

[0073] In Figure 6, in another embodiment, the conductive ink 104 is applied to the outward-facing surface 100A of the outer transparent substrate 100, so that the outer transparent substrate 100 is positioned between the intermediate layer 102 and the conductive ink 104.

[0074] In Figure 7, in another embodiment, the conductive ink 104 is applied to the surface 106B of the inner transparent substrate 106, so that the inner transparent substrate 106 is placed between the intermediate layer 102 and the conductive ink 104.

[0075] In yet another embodiment, the conductive ink 104 may be applied to two or more of the outward-facing or inward-facing surfaces 100A, 106A, 100B, and 106B of each of the inner and outer transparent substrates 106, 100 of the laminated window assembly 90 (i.e., one of P1, P2, P3, or P4), in contrast to the conductive ink 104 being applied to one or more of the outward-facing or inward-facing surfaces 100A, 106A, 100B, and 106B of each of the inner and outer transparent substrates 106, 100 of the laminated window assembly 90. For example, conductive ink 104 may be applied to both surfaces 100A and 100B of the outer transparent substrate 100 (i.e., both P1 and P2); both surfaces 106A and 106B of the inner transparent substrate 106 (i.e., both P3 and P4); both outward-facing surfaces 106B and 100A (i.e., P1 and P4) of each of the inner and outer transparent substrates 106, 100 of the laminated window assembly 90; or both inward-facing surfaces 106A and 100B (i.e., P2 and P3) of each of the inner and outer transparent substrates 106, 100 of the laminated window assembly 90.

[0076] In certain embodiments, the composition of any one impregnation layer of conductive ink 52, 104 may be the same as or different from the composition of the other impregnation layers of conductive ink 52, 104, and the composition may differ based on various factors including the method or location of impregnation.

[0077] In certain embodiments, the composition of the conductive ink 52 before imparting includes a binder, a pigment, and a solvent such as water, and optionally another solvent such as an organic solvent in certain embodiments. In these embodiments, one or both of the binder and / or pigment may impart a desired level of conductivity to the imparted conductive ink 52. In embodiments in which the imparted conductive ink 52 is photocured, the binder material includes a photocurable organic monomer / oligomer, such as acrylic monomers and / or oligomers and mixtures thereof. Exemplary pigments that may be used include conductive pigments such as carbon black, e.g., CIBlack7 carbon black. Other pigments may be included that impart a desired color appearance to the imparted conductive ink 52, such as various other nonconductive black pigments used in conjunction with the conductive pigments described above.

[0078] The conductive inks 52 and 104 may be applied to the curved transparent substrate using analog printing methods such as screen printing or spray printing with a mask. For example, to screen print the conductive inks 52 and 104, a mask (i.e., a "screen") defining a space corresponding to the desired area to be printed is placed on the transparent substrate 18. The conductive inks 52 and 104 are then applied to the transparent substrate 18 in the desired pattern by placing them on the mask using manual methods such as rollers, squeegees, brushes, or sprays. Any method for applying the conductive inks 52 and 104 is considered.

[0079] In certain embodiments, the application of conductive inks 52, 104 includes digitally applying the conductive inks 52, 104 to the substrate 18. The term "digitally applied" refers to any preferred application method in which the application of conductive inks 52 is digitally controlled to place the conductive inks 52 on the substrate according to a digitally based image. Exemplary methods for digitally applying conductive inks 52 include, but are not limited to, inkjet printing, electrohydrodynamic printing, and laser printing. Notably, the high-precision control provided by digitally applying conductive inks 52 allows the conductive inks 52 to be placed with a much higher resolution than analog printing methods. For example, conductive ink 52 has over 200 dots per inch, over 300 dots per inch, over 400 dots per inch, over 500 dots per inch, over 600 dots per inch, over 700 dots per inch, over 800 dots per inch, over 900 dots per inch, over 1000 dots per inch, over 1100 dots per inch, over 1200 dots per inch, over 1300 dots per inch, over 1400 dots per inch, and per inch The conductive ink 52 may be digitally applied to the surface of the curved transparent substrate 18 at a resolution of over 1500 dots, over 1600 dots per inch, over 1700 dots per inch, over 1800 dots per inch, over 1900 dots per inch, over 2000 dots per inch, over 2100 dots per inch, over 2200 dots per inch, over 2300 dots per inch, over 2400 dots per inch, over 2500 dots per inch, or over 2600 dots per inch. It should be noted that when the conductive ink 52 is applied digitally, a mask, which is usually required in analog printing methods, is not necessary. Instead, the conductive ink 52 is placed directly on the surface of the curved transparent substrate 18 according to the digital-based image, eliminating the need for a mask.

[0080] For example, digitally applying conductive ink 52 includes inkjet printing the conductive ink onto the surface of a curved transparent substrate 18. Generally, the term "inkjet printing" refers to a printing method in which a digitally controlled print head fires droplets of ink onto a substrate according to a digitally based image. Examples of inkjet printing methods include, but are not limited to, continuous inkjet printing, thermal inkjet printing, piezo inkjet printing, and drop-on-demand inkjet printing. Inkjet printing conductive ink 52 onto the surface of a curved transparent substrate 18 can achieve density levels of over 200 dots per inch, over 300 dots per inch, over 400 dots per inch, over 500 dots per inch, over 600 dots per inch, over 700 dots per inch, over 800 dots per inch, over 900 dots per inch, over 1000 dots per inch, over 1100 dots per inch, over 1200 dots per inch, over 1300 dots per inch, and 1 It may be implemented at a resolution of more than 1400 dots per inch, more than 1500 dots per inch, more than 1600 dots per inch, more than 1700 dots per inch, more than 1800 dots per inch, more than 1900 dots per inch, more than 2000 dots per inch, more than 2100 dots per inch, more than 2200 dots per inch, more than 2300 dots per inch, more than 2400 dots per inch, more than 2500 dots per inch, or more than 2600 dots per inch.

[0081] In another example, digitally applying conductive ink 52 involves electrohydrodynamically printing the conductive ink 52 onto the surface of a curved transparent substrate 18. Generally, the term “electrohydrodynamic printing” refers to a printing method in which a digitally controlled, charged print head directs ink from nozzles onto the substrate according to a digitally based image. In some examples, the nozzle width may be as small as 10 micrometers, such that the line width of the applied conductive ink 52 is also 10 micrometers. Of course, it should be recognized that a nozzle width greater than 10 micrometers may be selected to form conductive features 16 with line widths W greater than 10 micrometers. Furthermore, electrohydrodynamic printing of conductive ink 52 onto the surface of the curved transparent substrate 18 can result in over 200 dots per inch, over 300 dots per inch, over 400 dots per inch, over 500 dots per inch, over 600 dots per inch, over 700 dots per inch, over 800 dots per inch, over 900 dots per inch, over 1000 dots per inch, over 1100 dots per inch, over 1200 dots per inch, over 1300 dots per inch, and 1 inch It is intended that the work may be carried out at a resolution of over 1400 dots per square meter, over 1500 dots per inch, over 1600 dots per inch, over 1700 dots per inch, over 1800 dots per inch, over 1900 dots per inch, over 2000 dots per inch, over 2100 dots per inch, over 2200 dots per inch, over 2300 dots per inch, over 2400 dots per inch, over 2500 dots per inch, or over 2600 dots per inch. In embodiments in which conductive inks 52 and 104 are applied digitally by an inkjet printing method or the like, the conductive inks 52 and 104 may have a line width of 10 micrometers to 1 millimeter.

[0082] It is worth noting that, after digital application, the applied conductive ink 52 may spread or disperse on the surface of the curved transparent substrate 18 before the applied conductive ink 52 is cured. For example, the conductive ink 52 may be digitally applied at a resolution of 400 dots per inch, but before curing, the conductive ink 52 digitally applied at 400 dots per inch may spread on the surface of the curved transparent substrate 18, and when cured, the conductive features 16 may have a lower resolution than the resolution at the time of the initial digital application, for example, a resolution of 200 dots per inch. Furthermore, the curing process itself can also affect the resolution of the conductive features 16. For example, the conductive ink 52 may expand or contract during the curing step, affecting the resolution of the conductive features 16.

[0083] Therefore, the resolution of the conductive ink 52 when applied digitally may differ from the resolution of the conductive feature 16 after the digitally applied conductive ink 52 has been cured. Thus, when the digitally applied conductive ink 52 has been cured, the conductive feature 16 may have a resolution of more than 200 dots per inch. In detail, the conductive feature may have a resolution of more than 200 dots per inch, more than 300 dots per inch, more than 400 dots per inch, more than 500 dots per inch, more than 600 dots per inch, more than 700 dots per inch, more than 800 dots per inch, more than 900 dots per inch, more than 1000 dots per inch, more than 1100 dots per inch, more than 1200 dots per inch, more than 1300 dots per inch, and more than 1400 dots per inch. It is intended that the resolution may be greater than 1500 dots per inch, greater than 1600 dots per inch, greater than 1700 dots per inch, greater than 1800 dots per inch, greater than 1900 dots per inch, greater than 2000 dots per inch, greater than 2100 dots per inch, greater than 2200 dots per inch, greater than 2300 dots per inch, greater than 2400 dots per inch, greater than 2500 dots per inch, or greater than 2600 dots per inch.

[0084] Figures 8 and 11 show an overall embodiment of a solderless electrical connector 12 for electrically and mechanically coupling or connecting a wire harness 14 to a conductive feature 16. In certain embodiments, the solderless electrical connector 12 includes an adhesive 150 for mechanically connecting the wire harness 14 to the conductive feature 16 disposed on a substrate 18. In certain embodiments, the adhesive 150 is conductive and may therefore be called conductive adhesive 150, and the conductive adhesive 150 is part of the electrical connection that also electrically connects the wire harness 14 to the conductive feature 16 disposed on the substrate 18. In other embodiments, the adhesive 150 is nonconductive, and the nonconductive adhesive 150 is not part of the electrical connection that electrically connects the wire harness 14 to the conductive feature 16 disposed on the transparent substrate 18, but simply serves as the mechanical connection of the wire harness 14 to the transparent substrate 18.

[0085] Figure 8 shows a solderless electrical connector 12 in one exemplary embodiment used in a curved glass panel 50 in which conductive ink 52 is applied to the inward surface 50B as in Figure 2. On the other hand, Figure 11 shows a solderless electrical connector 12 in another exemplary embodiment used in a laminated window assembly 90 of Figure 4 in which conductive ink 104 is applied to the surface 106A of the inner transparent substrate 106.

[0086] In alternative embodiments, solderless electrical connectors 300 (see Figures 12-14) are provided according to another alternative embodiment, as shown in Figures 15 and 16. Figure 15 shows a solderless electrical connector 300 used in a curved glass panel 50 in which conductive ink 52 is applied to the inward surface 50B as in Figure 2. On the other hand, Figure 16 shows a solderless electrical connector 300 used in a laminated window assembly 90 of Figure 5 in which conductive ink 104 is applied to the inward surface 100B of an outer transparent substrate 100.

[0087] On the other hand, the figures in Figures 8, 11, 15, and 16 show flat transparent substrates 18, but these substrates 18 are depicted flat simply for ease of illustration. The glass panels 50 in Figures 8 and 15, and the substrates 100, 102, and 106 in Figures 11 and 16 are depicted flat, but in reality they are curved substrates / panels corresponding to those shown in Figures 2-7 and described above.

[0088] Referring first to Figures 8 and 11, a solderless electrical connector 12 according to a particular exemplary embodiment includes an adhesive 150 used to mechanically connect a wire harness 14 to conductive inks 52, 104 applied to the outer or inner substrates 100, 106 of a single glass 50 or a laminated window assembly 90.

[0089] In certain embodiments, the selected adhesive 150 is conductive to transfer electrical energy from the wire harness 14 to the conductive feature 16, and is therefore a conductive adhesive. Thus, the conductive adhesive 150 serves to mechanically and electrically connect the wire harness 14 to a single pane of glass 50 or to conductive inks 52, 104 applied to the outer or inner substrates 100, 106 of the laminated window assembly 90.

[0090] Furthermore, the adhesive 150 applied to the transparent substrate 18 and / or the applied conductive inks 52, 104 is cured at a temperature lower than the thermal degradation temperature of the applied conductive inks 52, 104. This is desirable to prevent a decrease in conductivity, particularly in the applied conductive inks 52, 104, along some or all of the conductive features 16. This curing may be carried out by photocuring, thermocuring, or a combination thereof.

[0091] In certain embodiments, the adhesive 150 has sufficient green strength (i.e., initial contact bonding strength) to maintain the solderless electrical connector 12 in a sealed bond state with the transparent substrate 18 and / or with conductive inks 52, 104 applied to the transparent substrate 18 during use, without the need for external fixation during the curing process.

[0092] As also shown in Figures 8 and 11, in certain exemplary embodiments, the solderless electrical connector 12 also includes a terminal assembly 160, which is used as an electrical connection mounting point for the wire harness 14, thereby electrically connecting the wire harness 14 to the conductive inks 52, 104 through the solderless electrical connector 12.

[0093] The terminal assembly 160 includes a base plate portion 162 having a lower surface 164 and an upper surface 166, and an outer peripheral edge portion 168 connecting the lower surface 164 to the upper surface 166. The lower surface 164 is disposed on and in contact with the adhesive 150. The terminal assembly 160 also includes a flange portion 170 coupled to and extending from a portion of the outer peripheral edge portion 168. In Figures 8 and 11, the flange portion 170 is L-shaped and includes a first portion 172 extending transversely to the upper surface 166, and a second portion 174 extending transversely to the first portion 172. In the embodiments of Figures 8 and 11, the second portion 174 provides an electrical coupling point for the wire harness 14 (shown separated from the second portion 174 in Figures 8 and 11).

[0094] In certain embodiments, both the base plate portion 162 and the flange portion 170 are formed from a conductive material such as metal or a metal alloy, so that when the wire harness 14 is coupled to the flange portion 170, an electrical connection is formed between the wire harness 14 and the conductive inks 52, 104 through the flange portion 170 and the base plate portion 162 of the solderless electrical connector 12. In some examples, the base plate portion 162 and the flange portion 170 are formed integrally, but they may also be formed as two separate components that are fixed to each other and electrically connected (if each of the base plate portion 162 and the flange portion 170 is formed from a conductive material) to form an integrated structure.

[0095] In alternative embodiments, the base plate portion 162 is formed from a non-conductive or insulating material, such as a non-conductive polymer material, and the flange portion 170 is formed from a conductive material as described above. In certain embodiments, the polymer material may be a durable plastic material such as nylon. In these embodiments, the flange portion 170 may be bonded to the base plate portion 162 through a molding operation such as injection molding to form a single unit. To provide electrical connectivity, the underside of the first portion 172 of the flange portion 170 is positioned such that, in embodiments where the adhesive 150 is a conductive adhesive, the first portion 172 is in electrical contact with the adhesive 150 which is in electrical contact with the conductive inks 52, 104, or with the transparent substrate 18 which is in electrical contact with the conductive inks 52, 104.

[0096] In the embodiments of Figures 8 and 11, which include the conductive adhesive 150, the conductive adhesive 150 is applied to the outer surfaces 53 and 105 of the conductive inks 52 and 104, opposite to the surfaces 50B and 106A of the glass panels 50 and 106 to which the conductive inks 52 and 104 are applied. Otherwise, if a non-conductive adhesive 150 is used, the non-conductive adhesive 150 may be applied directly to the glass panels 50 and 106, adjacent to or otherwise in close proximity to the outer surfaces 53 and 105 of the conductive inks 52 and 104.

[0097] In particular, in the representative embodiment of Figure 8, which includes a conductive adhesive 150, the conductive adhesive 150 is applied to the outer surface 53 of the conductive ink 52, opposite the inward surface 50B of the single sheet of glass 50. As shown in Figure 8, the conductive ink 52 is applied to the inward surface 50B according to the embodiment described above in Figure 2. However, in alternative embodiments, the conductive ink 52 may be applied to the outward surface 50A, or to both the inward surface 50B and the outward surface 50A, according to the embodiment described above in Figure 3.

[0098] In the representative embodiment of Figure 11, which includes a conductive adhesive 150, the conductive adhesive 150 is applied to the outer surface 105 of the conductive ink 104, opposite the surface 106A of the inner substrate 106, according to the embodiment described above in Figure 4.

[0099] More specifically, according to the embodiment of Figure 5 described above, it is desirable to be able to access the conductive ink 104 without having to cut or otherwise remove portions of the outer transparent substrate 100 and the intermediate layer 102 for such application, in order to apply the conductive adhesive 150 to the outer surface 105 of the conductive ink 104 opposite the surface 106A of the inner substrate 106.

[0100] Therefore, as best shown in Figures 9 and 10 related to Figure 11, the outer transparent substrate 100 and the intermediate layer 102 of the laminated window assembly 90 are scalloped between their respective forming steps (i.e., the edges of the outer transparent substrate 100 and the intermediate layer 102 each include scalloped edge regions 100C, 102C) to expose the inward-facing surface 106A of the portion of the outer substrate 100 containing the conductive ink 104. Preferably, this scalloping is performed when the outer transparent substrate 100 and the intermediate layer 102 are first formed.

[0101] While the laminated window assembly 90 is assembled by the lamination method, as shown in Figure 10, the scalloped edge regions 100C and 102C are aligned to form a scalloped edge 107 with the same extent. At this time, a portion of the outward-facing surface 106A of the inner substrate 106 and a portion of the conductive ink 104 remain uncovered, and these areas can be used to apply the conductive adhesive 150 to the areas removed by the scalloping process.

[0102] In the embodiment shown in the figure, the scalloped edge regions 100C and 102C are located along the outer periphery of the laminated window assembly 90. However, in other embodiments, the scalloped edge regions 100C and 102C may be located inward relative to the respective outer substrate 100 and intermediate layer 102, and thus the scalloped edge regions 100C and 102C define an opening enclosed by the respective outer substrate 100 and intermediate layer 102.

[0103] In certain embodiments, the conductive adhesive 150 may also be applied to the peripheral edge portions 52A and 104A of the conductive inks 52 and 104, and to the surfaces 50A and 106A of the curved transparent substrate 18 adjacent to the peripheral edge portions 52A and 104A of the conductive inks 52 and 104. Thus, the conductive adhesive 150 may form a peripheral seal adjacent to the peripheral edge portions 52A and 104A of the conductive inks 52 and 104.

[0104] After applying the conductive adhesive 150, the lower surface 164 of the base plate portion 162 is placed on the conductive adhesive 150 on the opposite side of the transparent substrate 18, in contact with it.

[0105] Next, the conductive adhesive 150 is cured to fix the base plate portion 162 to the conductive inks 52 and 104, and optionally to the transparent substrate 18 (in an embodiment where the thermal conductive adhesive 150 is applied to the surfaces 50A and 106A of the curved transparent substrate 18 adjacent to the peripheral edge portions 52A and 104A of the conductive inks 52 and 104, as described above).

[0106] In the exemplary embodiment, as mentioned above, the adhesive 150 is cured at a temperature lower than the thermal degradation temperature of the applied conductive inks 52, 104. This is desirable to prevent a decrease in conductivity along some or all of the applied conductive inks 52, 104 of the conductive feature 16.

[0107] In certain embodiments, the adhesive 150 is photocured at a temperature lower than the thermal degradation temperature of the conductive inks 52 and 104. In certain other embodiments, the adhesive 150 is thermocured at a temperature lower than the thermal degradation temperature of the applied conductive inks 52 and 104. In yet another embodiment, the applied adhesive 150 is photocured and thermocured at a temperature lower than the thermal degradation temperature of the conductive inks 52 and 104.

[0108] Exemplary conductive adhesives 150 that may be used include, but are not limited to, acrylate polymers, epoxy polymers, copolymers of acrylate and epoxy, or polyurethane adhesives. Conductive adhesives 150 may be reactive adhesives (i.e., adhesives that begin to cure in response to external stimuli such as exposure to light, heat, moisture, or other initiating chemicals). In some examples, conductive adhesives 150 may contain a photoinitiator that initiates polymerization of the adhesive in response to exposure to UV light. The conductivity of these conductive adhesives 150 may be provided by the polymer itself (i.e., an inherently conductive polymer) or by conductive fillers such as metal or carbon fillers (powder or fibers) dispersed in the polymer.

[0109] In an alternative embodiment to Figure 11, the adhesive 150 is applied to the outer surface 105 of the applied conductive ink 104, according to embodiments of the laminated window assembly 90 shown in Figures 5, 6, and 7, respectively.

[0110] In the embodiment shown in Figure 5, the procedure is largely the same as in Figure 11, except that the inner transparent substrate 106 (in contrast to the outer transparent substrate 100) and the intermediate layer 102 are scalloped, and the adhesive 150 is applied to the outer surface 105 of the conductive ink 104 that has been pre-applied to the inward surface 100B of the outer transparent substrate 100.

[0111] In the embodiments of Figures 6 and 7, the same overall procedure as in Figure 8 is followed, where neither the inner nor outer transparent substrates 100, 106 (along with the intermediate layer 102) are scalloped. Instead, the adhesive 150 is applied to the outer surface 105 of the conductive ink 104, which has been pre-applied to the outward-facing surface 100A of the outer transparent substrate 100 (as in Figure 6), or to the surface 106B of the inner transparent substrate 106.

[0112] Referring here to Figures 12-18, in contrast to using the adhesive 150 and terminal assembly 160 as a solderless electrical connector 12 to electrically couple the conductive ink 52 to the wire harness 14, as shown in Figures 8 and 11, an alternative solderless connector 300 may be used.

[0113] First, referring to Figures 12-16 and 24A-26B, the solderless electrical connector 300 according to an alternative embodiment includes, as its main components, an insulating cover 302, a conductive biasing member 320, and an adhesive 350, the adhesive 350 which adheres the insulating cover 302 to the transparent substrate 18 with at least a portion of the conductive biasing member 320 elastically compressed between the insulating cover 302 and the conductive feature 16 disposed on the transparent substrate 18.

[0114] The insulating cover 302 may be formed from a durable polymer material such as nylon and is generally in the form of a plate defined within an inner surface 306, an outer surface 308, and an edge surface 310, the edge surface 310 extending between the inner surface 306 and the outer surface 308 and connecting them.

[0115] The conductive biasing member 320 may be in the form of one or more leaf springs 320. Each conductive biasing member / leaf spring 320 includes a first end 322 and a second end 324 on the opposite side, and a central region 326 that connects the first end 322 and the second end 324 together and extends between them. The second end 324 of each conductive biasing member / leaf spring 320 may define an opening 328 or other structure used as a wire connection point for the wires of the wire harness 14. The conductive biasing member / leaf spring 320 is formed from a conductive material, such as a metal or metal alloy, which allows electricity to flow from the wire harness 14 to conductive features 16 disposed on the transparent substrate 18 when the solderless connector 300 is assembled and coupled to the transparent substrate 18, as further described below, and the wire harness 14 is connected to the conductive biasing member / leaf spring 320 in its assembled state. In some examples, the conductive biasing member / leaf spring 320 is formed from copper or a copper alloy (e.g., copper-nickel, copper-beryllium, etc.). For example, the conductive biasing member / leaf spring 320 may be punched, die-cut, etc., from a sheet of copper or a copper alloy. The sheet of copper or a copper alloy on which the conductive biasing member / leaf spring 320 is formed may have a thickness of about 0.4 mm, but other thicknesses are intended.

[0116] Each conductive biasing member / leaf spring 320 includes a first end 322, which extends from the inner surface 306 of the insulating cover 302 and is elastically compressed between the insulating cover 302 and the conductive feature 16 disposed on the transparent substrate 18 so that the conductive biasing member / leaf spring 320 is positioned and maintained in electrical contact with the conductive feature 16. Each conductive biasing member / leaf spring 320 also includes a second end 324, which extends from the outer surface 308 of the insulating cover 302 and is configured to be coupled to the vehicle's wiring harness 14. Each conductive biasing member / leaf spring 320 further includes a central region 326 that connects the first end 322 and the second end 324 and extends between them, the central region 326 extending through the insulating cover 302 and being fixed to the insulating cover 302.

[0117] The second end 324 of each biasing member / leaf spring 320 may curve along its length and extend outward and transversely away from the outer surface 308 of the insulating cover 302, as shown in embodiments in Figures 12-16 and 24A-26B, so that the end 324a of the second end 324 of the conductive biasing member / leaf spring 320 is furthest from the outer surface 308 of the insulating cover 302. If one or more leaf springs 320 include a pair of leaf springs 320, the end 324a of each second end 324 are positioned closer to each other than the rest of the length of each second end 324 (such as the portion of the second end 324 adjacent to the central region 326). In a further alternative embodiment, the second end 324 may extend along its length between the central region and each end 324a, substantially perpendicular to the outer surface 308, with the end 324a being the furthest from the outer surface 308 of the insulating cover 302.

[0118] The first end 322 of each conductive biasing member / leaf spring 320 may be straight or curved along its length, as shown in embodiments in Figures 12-16 and 24A-26B, and may extend outward and transversely away from the inner surface of the insulating cover 302, so that the end 322a of the second end 322 of the conductive biasing member / leaf spring 320 is furthest from the inner surface 306 of the insulating cover 302. If one or more leaf springs 320 include a pair of leaf springs 320, the ends 322a of each first end 322 are positioned closer to each other than the rest of the length of each first end 322 (such as the portion of the first end 322 adjacent to the central region 326), as shown in the figures.

[0119] In certain embodiments, the end portion 322a is curved relative to the remainder of the length of the first end portion 322 to provide an additional surface area for bonding the transparent substrate 18.

[0120] In yet another embodiment, as shown in Figures 15 and 24A, the first end 322 of the conductive biasing member / leaf spring 320 includes a stepped portion 323 adjacent to the central portion 326. This stepped portion 323 allows the additional length of the first end 322 of the biasing member / leaf spring 320 to contact the inner surface 306 of the insulating cover 302 when the insulating cover 302 is bonded to the glass plate 50 as part of the formation of the solderless electrical connector 300.

[0121] The conductive biasing member / leaf spring 320 used in either Figures 12-16 and Figures 24A-26B may be molded into or otherwise bonded to the insulating cover 302, so that the central region 326 extends through and is fixed to the insulating cover 302, with the first end 322 extending outward away from the inner surface 306 and the second end 324 extending outward away from the outer surface 308. For example, the insulating cover 302 may be overmolded over the central region 326 of the conductive biasing member / leaf spring 320 so that the insulating cover 302 is bonded to the central region 326 of the conductive biasing member / leaf spring 320. Other configurations for bonding the insulating cover 302 to the central region 326 of the conductive biasing member / leaf spring 320 are contemplated.

[0122] In certain embodiments, the conductive biasing member / leaf spring 320 is in the form of a metal (aluminum, copper, etc.) or a metal alloy (aluminum alloy, copper alloy, etc.). In certain high-current examples, the conductive biasing member / leaf spring 320 is formed from copper beryllium and may include plating of an additional conductive material such as silver. In other embodiments, the conductive biasing member / leaf spring 320 is in the form of a polymer material and / or elastomer material (which may include additives to impart conductivity) that is resistant to compression set over time and maintains some functional elasticity over time at temperatures ranging from approximately minus 40 degrees Celsius to approximately 120 degrees Celsius.

[0123] In other alternative embodiments, the polymer material of the conductive biasing member / leaf spring 320 may include a foam such as an open-cell foam or a closed-cell foam. In certain embodiments, the polymer material and / or elastomer material of the conductive biasing member / leaf spring 320 may include, for example, polyurethane, rubber (such as rubber formed from ethylene propylene diene monomer (EPDM)), or polystyrene, and may also include additives such as silver particles to provide conductivity.

[0124] To facilitate connection with the conductive feature 16, the conductive biasing member / leaf spring 320 is conductive. If the conductive biasing member / leaf spring 320 is made of a conductive polymer, conductivity may be provided by the polymer itself (i.e., an inherently conductive polymer), by conductive fillers such as metal or carbon fillers (powder or fibers) dispersed in the polymer, and / or by the use of a conductive sheath such as metal or metal alloy foil disposed on top of the polymer.

[0125] In yet another embodiment, as shown in Figures 16 and 24A-25, the central region 326 of the conductive biasing member / leaf spring 320 defines a pair of notched regions 327 along its length. These notched regions 327 serve to increase the tensile strength of the biasing member / leaf spring 320 molded into the insulating cover 302 during use. The notched regions 327 may define any preferred geometry and, in some examples, may be on opposite sides of each other. In other words, in these configurations, the conductive biasing member / leaf spring 320 is held against the insulating cover 302, as opposed to being held directly against the conductive feature 16. Thus, advantageously, the notched regions 327 improve the retention of the biasing member / leaf spring 320 against the insulating cover 302 compared to a configuration in which there are no notched regions 327 for engaging with the insulating cover 302.

[0126] Figures 24A to 26B show another configuration of the solderless electrical connector 300, which includes a conductive biasing member / leaf spring 320 with a notched region 327. As best shown in Figure 24A, in some examples, the first end 322 of the conductive biasing member / leaf spring 320 has a first width W1, and the central region 326 of the conductive biasing member / leaf spring 320 has a second width W2 which is greater than the first width W1. Here, the notched region 327 has a third width W3 which is greater than or equal to the first width W1 and less than the second width W2, so that the notched region 327 engages with the insulating cover 302 to hold the conductive biasing member / leaf spring 320 against the insulating cover 302 (see Figure 25). The second end 324 of the conductive biasing member / leaf spring 320 also defines a width which may be greater than or equal to the first width W1. Advantageously, the third width W3 of the notched region 327 is greater than or equal to the first width W1 of the first end 322, so the notched region 327 in Figure 24A has a cross-sectional area greater than or equal to the first end 322 of the conductive biasing member 320. Therefore, in the configurations of Figures 24A to 26B, the notched region 327 experiences little to no localized heating when current is passed through the conductive biasing member 320, leading to an improved ability to transport current while engaging with the insulating cover 302 and holding the conductive biasing member / leaf spring 320 against the insulating cover 302. It should be recognized that the configuration shown in Figures 24A to 26B is one exemplary configuration in which the first end 322 (and preferably the second end 324) of the conductive biasing member / leaf spring 320 has a first width W1, the central region 326 of the conductive biasing member / leaf spring 320 has a second width W2 greater than the first width W1, and the notched region 327 has a third width W3 greater than or equal to the first width W1 and less than the second width W2. Other configurations are conceivable in which the notched region 327 has a cross-sectional area greater than or equal to the first end 322 of the conductive biasing member 320.

[0127] The adhesive 350 may be applied to the inner surface 306 of the insulating cover 302 adjacent to the intersection 309 of the inner surface 306 and the edge surface 310. The adhesive 350 may also be applied to areas of the inner surface 306 that are not related to the second end 324 of the biasing member / leaf spring 320. As will be described in more detail below, the surface area of ​​the adhesive 350 applied to the inner surface 306 of the insulating cover 302 (in conjunction with the type of adhesive used) may be determined such that the green strength of the adhesive 350 is sufficient to press and maintain the insulating cover 302 against the surface of the transparent substrate 18 without external fastening while the adhesive 350 is curing.

[0128] In certain embodiments, the adhesive 350 is in the form of a tape (i.e., adhesive tape) that is bonded to the inner surface 306. In certain embodiments, the adhesive 350 used in the tape 350 is nonconductive, but in other embodiments, the adhesive 350 and / or the tape adhesive 350 may be an adhesive similar to the adhesive 150 described above with respect to Figures 8-11. Before being applied to the inner surface, the tape adhesive 350 may include a carrier layer (i.e., a liner) that is removed before the tape adhesive 350 is bonded to the inner surface 306. A separate opposite carrier layer may also be provided, which is removed later before the tape adhesive 350 is bonded to the transparent substrate 18, as described below.

[0129] In some embodiments, the selected adhesive 350 may have sufficient Green strength (i.e., initial contact strength) to maintain the insulating cover 302 in a sealed bond state by pressing it against the surface of the transparent substrate 18 without the need for external fixation during the curing process. In other words, the Green strength of the adhesive 350 may be sufficient to maintain the insulating cover 302 in a pressed state against the surface of the transparent substrate 18 by elastically compressing the first end 322 of the conductive biasing member / leaf spring 320 between the insulating cover 302 and the conductive feature 16 disposed on the transparent substrate 18, without external fixation while the adhesive 350 is curing. Advantageously, eliminating the need to externally press and fix the insulating cover 302 to the transparent substrate 18 while the adhesive 350 is curing simplifies the assembly process and saves time and money.

[0130] For example, referring to Figure 27, the first end 322 of the conductive biasing member / leaf spring 320 is elastically compressed between the insulating cover 302 and the conductive feature 16 disposed on the transparent substrate 18, resulting in the conductive biasing member / leaf spring 320 exerting a force F that pushes the insulating cover 302 away from the transparent substrate 18. In these configurations, as shown in Figure 27, the green strength GS of the adhesive 350 is greater than or equal to force F, so that the adhesive 350 holds the insulating cover 302 pressed against the surface of the transparent substrate 18 without external fixation while the adhesive 350 is curing.

[0131] In one measured configuration, the force F was approximately 6.5 N, but it should be recognized that the force F may vary between configurations based on several factors, including the composition, thickness, and deformation level of the conductive biasing member / leaf spring 320, without being limited to these. Therefore, the green strength GS is 6.5 N or greater so that the adhesive 350 holds the insulating cover 302 in place on the surface of the transparent substrate 18 without external fastening while the adhesive 350 is curing. It should be recognized that the green strength GS of the adhesive 350 may be determined / adjusted by several factors, including the composition of the adhesive 350 and the surface area to which the adhesive 350 is applied. For example, the green strength characteristics of the adhesive 350 (which can generally be confirmed from the adhesive supplier in the specifications or upon request) and / or the surface area to which the adhesive 350 is applied may be selected or adjusted based on the force F exerted by the first end 322 of the conductive biasing member / leaf spring 320 when elastically compressed between the insulating cover 302 and the conductive feature 16 disposed on the transparent substrate 18.

[0132] Exemplary adhesives 350 that may be used include, but are not limited to, acrylate polymers, epoxy polymers, acrylate-epoxy copolymers, and polyurethane adhesives. Adhesive 350 may be a reactive adhesive (i.e., an adhesive that begins to cure in response to an external stimulus such as exposure to light, heat, moisture, or other initiating chemicals). In some examples, adhesive 350 may contain a photoinitiator that initiates polymerization of the adhesive in response to exposure to UV light. One exemplary tape adhesive based on an acrylate-epoxy copolymer is Structural Bonding Tape 9550, commercially available from 3M® in St. Paul, Minnesota. Another exemplary tape adhesive based on epoxy resin chemistry is UV-LUX®, commercially available from Lohmann GmbH & Co.KG in Neuwied, Germany.

[0133] In certain embodiments, the adhesive tape 350 is a solid pressure-sensitive adhesive (PSA) tape 350, which can adhere to the transparent substrates 18, 100 by applying pressure to the tape 350 to ensure close contact between the tape 350 and the transparent substrates 18, 100, thereby removing air bubbles between the tape 350 and the transparent substrates 18, 100. In certain embodiments, the pressure applied to the PSA tape 350 initiates a curing process within the PSA tape 350, which occurs at a temperature lower than the thermal degradation temperature of the conductive ink 104 as described above. In yet other embodiments, in addition to initiating a curing process within the PSA tape 350 using pressure, the PSA tape can be photocured and / or thermally cured, which occurs at a temperature lower than the thermal degradation temperature of the conductive ink 104 as described above.

[0134] In certain embodiments, the adhesive 350 is conductive and is a conductive adhesive 350. The conductivity of the conductive adhesive 350 may be provided by the polymer itself (i.e., an inherently conductive polymer) or by a conductive filler such as a metal or carbon filler (powder or fiber) dispersed in the polymer.

[0135] In the assembled state best shown in the two exemplary embodiments of Figures 17 and 18 (described in further detail below), the first end 322 is positioned in electrical contact with the conductive feature 16 disposed on the transparent substrate 18 and is elastically compressed between the insulating cover 302 and the conductive feature 16 disposed on the transparent substrate 18. In embodiments where the adhesive 350 is in the form of a tape, if there is a carrier layer, it is removed from the tape adhesive 350, then photocuring of the tape adhesive is initiated, and thereafter the tape adhesive 350 is pressed against the transparent substrate 18 or the outer surfaces 53, 105 of the applied conductive inks 52, 104, thereby directly bonding the insulating cover 302 to the transparent substrate 18 or indirectly bonding it to the transparent substrate 18 through the conductive inks 52, 104, thereby sealing the first end 322 of the conductive biasing member / leaf spring 320 between the adhesive 350, the inner surface 306 of the insulating cover 302, and the upper surface of the applied conductive inks 52, 104. If the adhesive 350 is not in the form of a tape, the carrier removal step is not required. Instead, the adhesive 350 is applied to the outer surface 53, 105 of the transparent substrate 18 or the applied conductive ink 52, 104 to directly bond the insulating cover 302 to the transparent substrate 18, or indirectly to the transparent substrate 18 through the conductive ink 52, 104, thereby sealing the first end 322 of the conductive biasing member / leaf spring 320 between the adhesive 350, the inner surface 306 of the insulating cover 302, and the upper surface of the conductive ink 52, 104. The second end 324 of the conductive biasing member / leaf spring 320 extends outward from the outer surface 308 of the insulating cover 302, away from the transparent substrate 18 and the conductive ink 52, 104, and is configured to connect to the wires of the wire harness 14 through the opening 328 of the second end 324.

[0136] Figures 15 and 16 schematically illustrate embodiments of a solderless electrical connector 300 that mechanically and electrically connects a wire harness 14 to an assembled conductive feature 16 disposed on a transparent substrate 18. Figure 15 shows a solderless electrical connector 300 used in a curved glass panel 50 with conductive ink 52 applied to the inward surface 50B as in Figure 2, and Figure 16 shows a solderless electrical connector 12 used in a laminated window assembly 90 of Figure 5, with conductive ink 104 applied to the inward surface 100B of an outer transparent substrate 100.

[0137] As relating to Figure 15, and similar to the above description relating to Figure 8, this disclosure also considers alternative embodiments in which the solderless electrical connector 300 is used in a curved glass panel 50 in which conductive ink 104 is applied to the outward surface 50A, or to both the outward surface 50A and the inward surface 50B, as in the embodiment shown in Figure 3.

[0138] Furthermore, as relating to Figure 16, and similar to the above description relating to Figure 11, this disclosure also considers alternative embodiments in which a solderless electrical connector 300 is used to which conductive ink 104 is applied according to embodiments of the laminated window assembly 90 shown in Figures 5, 6, and 7, respectively.

[0139] In an embodiment in which the inner transparent substrate 106 (in contrast to the outer transparent substrate 100) and the intermediate layer 102 are scalloped and conductive ink 104 is pre-applied to the inward surface 100B of the outer transparent substrate 100, the solderless electrical connector 300 is brought about by substantially the same procedure as described above, as shown in Figure 16.

[0140] In an alternative embodiment in which neither the inner nor outer transparent substrates 100, 106 (along with the intermediate layer 102) are scalloped, and instead conductive ink 104 is pre-applied to the outward-facing surface 100A of the outer transparent substrate 100 (as in Figure 6), or to the inward-facing surface 106B of the inner transparent substrate 106, the solderless electrical connector 300 is brought about by substantially the same procedure as described above with respect to the single sheet of glass 50 in Figure 15, etc.

[0141] Referring now to Figure 19, yet another alternative embodiment of the laminated window assembly 90 including the solderless electrical connector 300 of Figure 17 is shown. In this embodiment, a conductive foil 111 (i.e., conductive ribbon 111) is used to form an electrical connection to a conductive ink layer 104 applied to the inward surface 100B(P2) of the outer transparent substrate 100 and / or the inward surface 106A of the inner transparent substrate 106. In this embodiment, the electrical connection component 14 is located either outside the outer transparent substrate 100 or inside the inner transparent substrate 106, and does not require a scalloped configuration as in Figure 18.

[0142] For the sake of clarity and illustration, in the embodiment of Figure 19, the conductive ink 104 is applied to the inward surface 100B (i.e., P2) of the outer transparent substrate 100 and is therefore disposed between the outer transparent substrate 100 and the intermediate layer 102.

[0143] Referring to Figure 19, the conductive foil 111, shown here as aluminum foil 111, is electrically coupled or connected to the conductive ink 104 at its outer edge, and in certain embodiments, physically connected. The conductive foil 111 extends along the edge of the outward-facing surface 100A of the outer substrate 100 (i.e., along P1) and is coupled to a solderless electrical connector 300, which includes an insulating cover 302, a biasing member 320, and an adhesive 350, as shown below.

[0144] In the assembled state shown in Figure 19, the first end 322 of the biasing member 320 is positioned in electrical contact with the conductive foil 111 extending along the outward surface 100A of the outer substrate 100, and is elastically compressed between the molded insulating cover 302 and the conductive foil 111. In embodiments where the adhesive 350 is in the form of a tape, if there is a carrier layer, it is removed from the tape adhesive 350, and then the photocuring of the tape adhesive 350 is initiated, after which the tape adhesive 350 is pressed against the outward surface 100A and optionally along the upper surface of the conductive foil 111, thereby bonding the insulating cover 302 to the outward surface 100A of the substrate 100 directly and / or indirectly through the conductive foil 111, thereby sealing the first end 322 of the biasing member / leaf spring 320 between the adhesive 350, the inner surface 306 of the insulating cover 302, and the conductive foil 111. If the adhesive 350 is not in the form of a tape, the carrier removal step is not required. Also, the second end 324 of the biasing member / leaf spring 320 extends outward from the outer surface 308 of the insulating cover 302, away from the outward surface 100A of the substrate 100 and the conductive foil 111, and is configured to connect to the wires of the wire harness 14 through the opening 328 of the second end 324 in the same manner as described in Figure 17 above. Thus, the energization of the conductive ink 104 at P2 (or P3 in an alternative embodiment where the conductive ink 104 is applied to the inward surface 106A as in Figure 4) occurs by activating the electrical connection component 14 with a charge that extends through the conductive foil to the conductive ink 104.

[0145] As mentioned above, this disclosure also covers a related manufacturing method for a glass assembly having a solderless electrical connector 12 utilizing the adhesive 150 and terminal assembly 160, together with either a single sheet of glass 50 (see flowchart in Figure 20 corresponding to Figure 8) or a laminated window assembly 90 (see flowchart in Figure 21 corresponding to Figure 11), using the adhesive 150 in accordance with the specific exemplary embodiments described above. This disclosure also covers a related manufacturing method for a glass assembly having an alternative solderless electrical connector 300 with either a single sheet of glass 50 or a laminated window assembly 90 (see flowcharts in Figures 21 and 22 corresponding to Figures 15 and 16).

[0146] Referring to Figure 20, one exemplary embodiment of a method 500 for forming a glass assembly 10 having a solderless electrical connector 12 on a single sheet of glass 50 is provided. For simplicity of explanation, the flowchart in Figure 20 will be described in relation to the embodiment in Figure 8 in which the solderless electrical connector 12 is disposed on the inward surface 50B of the single sheet of glass 50. However, the same procedure can be used to dispose of the solderless electrical connector 12 on the outward surface 50A of the single sheet of glass 50 according to the flowchart in Figure 20, with only slight differences in the procedure described in step 504 below.

[0147] Referring first to step 502, a curved transparent substrate 18 is formed as a single sheet of glass 50 having an inward-facing surface 50B and an outward-facing surface 50A, as described above.

[0148] Next, in step 504, the conductive ink 52 is applied to one or both of the inward surface 50B and the outward surface 50A (shown in Figure 8 as being applied to the inward surface 50B as in Figure 2). Preferred methods for applying the conductive ink 52 have been described above. In certain embodiments, as part of step 504, after applying the conductive ink 52, the conductive ink 52 is dried by photocuring, thermal curing, sintering, or other methods to attach it to the curved glass substrate 50, as described above.

[0149] In step 506, the adhesive 150 is applied to a portion of the conductive ink 52 and optionally to the surface of the curved transparent substrate 18 adjacent to the conductive ink 52 (i.e., to the portion of the inward-facing surface 50B adjacent to the edge of the conductive ink 52).

[0150] In step 508, the terminal assembly 160 is placed on the adhesive 150 opposite the conductive ink 52. More specifically, the lower surface 164 of the base plate portion 162 is positioned on the upper surface of the adhesive 150 and makes contact with it. More specifically, the lower surface 164 of the base plate portion 162 is pressed onto the upper surface of the adhesive 150.

[0151] In embodiments where the base plate portion 162 is formed from a non-conductive material, in step 508, the second portion 174 of the flange portion 170 is also brought into contact with the upper surface of the adhesive 150. In yet another alternative embodiment where the base plate portion 162 is formed from a conductive material, in step 508, the second portion 174 of the flange portion 170 is also brought into contact with the upper surface of the adhesive 150.

[0152] In embodiments where the base plate portion 162 and the flange portion 170 are separate components, step 508 may include a lower step in which the base plate portion 162 and the flange portion 170 are fixed to each other before or after being placed on the adhesive to form an integrated structure.

[0153] Next, in step 510, the adhesive 150 is cured to form the solderless electrical connector 12. In step 510, the curing of the adhesive 150 is performed at a temperature lower than the thermal degradation temperature of the applied conductive ink 52. This is desirable to prevent a decrease in conductivity along some or all of the applied conductive ink 52, and therefore the conductive features 16, which would result from the degradation of the applied conductive ink 52 if exposed to temperatures above the thermal degradation temperature.

[0154] In certain embodiments, the adhesive 150 is photocured at a temperature lower than the thermal degradation temperature of the applied conductive ink 52. In certain other embodiments, the adhesive 150 is thermocured at a temperature lower than the thermal degradation temperature of the applied conductive ink 52. In yet another embodiment, the adhesive 150 is photocured and thermocured at a temperature lower than the thermal degradation temperature of the applied conductive ink 52.

[0155] In an alternative embodiment of the method in Figure 20, the step of curing the adhesive 150 as described in step 510, in particular the step of photocuring the adhesive 150 as in step 510, is started before placing the terminal assembly 160 on the adhesive 150 opposite the conductive ink 52, as in step 508.

[0156] In step 512, the wire harness 14 is coupled to the terminal assembly 160. More specifically, as shown in Figure 8, the wires of the wire harness 14 are electrically coupled to the second portion 174 of the flange portion 170.

[0157] Referring next to Figure 21, one exemplary embodiment of method 600 for forming a glass assembly 10 having a solderless electrical connector 12 on a laminated window assembly 90 is provided. For simplicity of explanation, the flowchart of Figure 21 will be described in relation to the embodiment of Figure 11 in which the solderless electrical connector 12 is disposed on the surface 106A of the inner transparent substrate 106. However, the same procedure can be used to dispose of the solderless electrical connector 12 on the inward surface 100B of the outer transparent substrate 100 according to the flowchart of Figure 21, with only slight differences in the procedure described in step 604 below.

[0158] Referring first to step 602, the outer transparent substrate 100, the intermediate layer 102, and the inner transparent substrate 106 are formed, as best shown in Figure 9, with the outer transparent substrate 100 and the intermediate layer 102 having scalloped edges 100C, 102C as described above. Although not shown in Figure 9, the outer transparent substrate 100, the intermediate layer 102, and the inner transparent substrate 106 are formed as curved outer transparent substrate 100, curved intermediate layer 102, and inner transparent substrate 106 as part of these forming steps.

[0159] Next, in step 604, the conductive ink 104 is applied to at least one surface 100B, 106A of one or both of the outer and inner transparent substrates 100, 106 (shown in Figure 11 as being applied to surface 106A of the inner transparent substrate 106). The method of applying the conductive ink 104 is the same as described above and will not be repeated here for brevity. Optionally, as part of step 604, the applied conductive ink 104 is photocured and / or heatcured to form a cured conductive ink, or sintered to form a sintered conductive ink 104, or otherwise dried, as described above.

[0160] Next, in step 605, the laminated window assembly 90 is formed, where, as shown in Figure 10, an intermediate layer 102 is placed between the outer transparent substrate 100 and the inner transparent substrate 106, and conductive ink 104 is placed between the intermediate layer 102 and the inner transparent substrate 106. As part of step 605, heat and pressure are applied that is sufficient to form a laminate in which the intermediate layer 102 is bonded to both the outer transparent substrate 100 and the conductive ink 104, but insufficient to degrade the conductive ink 104. Also as part of step 605, the scalloped edge regions 100C and 102C are aligned to form a scalloped edge 107 with the same extent, leaving a portion of the surface 106A of the inner transparent substrate 106 and a portion of the conductive ink 104 uncovered.

[0161] Next, in step 606, the adhesive 150 is applied to a portion of the conductive ink 104 and optionally to the surface 106A of the inner transparent substrate 106 adjacent to the conductive ink 104 (i.e., to the portion of the inward-facing surface 106A adjacent to the edge of the conductive ink 104).

[0162] In step 608, the terminal assembly 160 is placed on the adhesive 150 opposite the conductive ink 104. More specifically, the lower surface 164 of the base plate portion 162 is positioned on the upper surface of the adhesive 150 and makes contact with it. More specifically, the lower surface 164 of the base plate portion 162 is pressed against the upper surface of the adhesive 150.

[0163] In embodiments where the base plate portion 162 is formed from a non-conductive material, in step 608, the second portion 174 of the flange portion 170 is also brought into contact with the upper surface of the adhesive 150. In yet another alternative embodiment where the base plate portion 162 is formed from a conductive material, in step 608, the second portion 174 of the flange portion 170 is also brought into contact with the upper surface of the adhesive 150.

[0164] In embodiments where the base plate portion 162 and the flange portion 170 are separate components, step 608 may include a lower step in which the base plate portion 162 and the flange portion 170 are fixed to each other before or after being placed on the adhesive 150 to form an integrated structure.

[0165] Next, in step 610, the adhesive 150 is cured in the manner described above to form the solderless electrical connector 12, which will not be repeated here for brevity.

[0166] In step 612, the wire harness 14 is coupled to the terminal assembly 160. More specifically, as shown in Figure 11, the wires of the wire harness 14 are electrically coupled to the second portion 174 of the flange portion 170.

[0167] Referring next to Figure 22, one exemplary embodiment of a method 700 for forming a glass assembly 10 having a solderless electrical connector 300 on a single sheet of glass 50 is provided. For simplicity of explanation, the flowchart will be described with respect to the embodiment of Figure 15 in which the solderless electrical connector 300 is disposed on the inward surface 50B of the single sheet of glass 50. However, the same procedure can be used to dispose of the solderless electrical connector 300 on the outward surface 50A of the single sheet of glass 50 according to the flowchart of Figure 22, with only slight differences in the procedure described in step 704 below.

[0168] Referring first to step 702, a single sheet of glass 50 is formed as curved glass having an inward-facing surface 50B and an outward-facing surface 50A as described above.

[0169] Next, in step 704, the conductive ink 52 is applied to one or both of the inward surface 50B and the outward surface 50A using the same procedure as described in step 504 in Figure 17 above (shown in Figure 8 as being applied to the inward surface 50B as in Figure 2). The procedure will not be repeated. The method of applying the conductive ink 104 is the same as described above and will not be repeated here for brevity. Optionally, as part of step 704, the applied conductive ink 52 is photocured and / or heatcured to form a cured conductive ink, or sintered to form a sintered conductive ink 52, or otherwise dried, as described above.

[0170] In step 706, a solderless electrical connector 300 according to an alternative embodiment is formed or otherwise provided.

[0171] In certain embodiments in which a solderless connector is formed, as described above, the biasing member / leaf spring 320 may be molded into the molded insulating cover 302 or otherwise bonded to the insulating cover 302 so that the central region 326 extends through the insulating cover 302 and is fixed to the insulating cover 302, with the first end 322 extending outward away from the inner surface 306 and the second end 324 extending outward away from the outer surface 308. The adhesive 350 is then applied to the inner surface 306 of the insulating cover 302 adjacent to the intersection 309 of the inner surface 306 and the edge surface 308. In certain embodiments, the adhesive 350 may also be applied to areas of the inner surface 306 that are not related to the second end 324 of the biasing member / leaf spring 320.

[0172] In exemplary embodiments such as those shown in Figures 12-16, the adhesive 350 is in the form of a tape that adheres to the inner surface 306 and may be non-conductive or conductive.

[0173] Next, in step 708, the solderless connector 300 is coupled to the conductive ink 52. Specifically, the first end 322 of each biasing member 320 is positioned in electrical contact with the conductive ink 52 and elastically compressed between the molded insulating cover 302 and the conductive ink 52. The adhesive 350 is pressed onto the transparent substrate 18, particularly against the outward surface 50B of the single sheet of glass 50 or the outer surface 53 of the conductive ink 52, thereby bonding the insulating cover 302 to the transparent substrate 18 / single sheet of glass 50 either directly or indirectly through the conductive ink 52, thereby sealing the first end 322 of the biasing member / leaf spring 320 between the adhesive 350, the inner surface 306 of the insulating cover 302, and the upper surface of the conductive ink 52. Furthermore, the second end 324 of the biasing member / leaf spring 320 extends outward from the outer surface 308 of the insulating cover 302, away from the transparent substrate 18 / single sheet of glass 50 and the conductive ink 52.

[0174] Next, in step 710, the adhesive 350 is cured to form the solderless electrical connector 12. In step 710, the curing of the adhesive 350 is initiated by applying a stimulus. Specifically, the curing of the adhesive 350 is at a temperature lower than the thermal degradation temperature of the conductive ink 52. This is desirable to prevent a decrease in conductivity along some or all of the conductive features 16 that would result from the degradation of the conductive ink 52 if exposed to temperatures above the thermal degradation temperature.

[0175] In certain embodiments, the adhesive 350 is photocured / photoinitiated at a temperature lower than the thermal degradation temperature of the conductive ink 52. For example, the adhesive 350 is photocured / photoinitiated by instantaneously exposing the adhesive to an ultraviolet light source. In such embodiments, the curing process may be self-sustaining after being initiated externally, but is slow enough to provide a minimum amount of time (e.g., more than about 20 seconds) for the user to perform the remaining steps. In one example, self-sustaining curing may be facilitated by providing one or more catalysts and initiators using a plurality of microcapsules that can release catalysts and / or initiators when exposed to a light source such as an ultraviolet lamp.

[0176] In certain other embodiments, the adhesive 350 is heat-cured at a temperature lower than the thermal degradation temperature of the conductive ink 52. In these embodiments, the applied adhesive 350 may be cured in an oven or by other heat means, or it may be air-cured, provided that the curing is performed at a temperature lower than the thermal degradation temperature of the conductive ink 52, 104 as described above. In yet another embodiment, the adhesive 350 is photocured and heat-cured at a temperature lower than the thermal degradation temperature of the conductive ink 52, in the manner described above.

[0177] If the adhesive 350 is a light-activated tape adhesive 350, the tape adhesive 350 is irradiated with light before the carrier material is removed from the adhesive 350 and the tape adhesive 350 is applied to the transparent substrate 18, particularly to the outward surface 50B of the single sheet of glass 50, or to the outer surface 53 of the conductive ink 52, so that the insulating cover 302 is bonded to the transparent substrate 18 / single sheet of glass 50 directly or to the transparent substrate 18 / single sheet of glass 50, as in step 708.

[0178] In step 712, the wire harness 14 is coupled to the second end 324 of each biasing member 320. More specifically, as shown in Figure 15, the wires of the wire harness 14 are electrically coupled to the second end 324 of each biasing member 320 through the openings in the biasing member 320.

[0179] Referring next to Figure 23, one exemplary embodiment of method 800 for forming a glass assembly 10 having a solderless electrical connector 300 on a laminated window assembly 90 is provided. For simplicity of explanation, the flowchart will be described with respect to the embodiment of Figure 16 in which the solderless electrical connector 300 is disposed on the outward surface 100A of the outer transparent substrate 100. However, the same procedure can be used to dispose of the solderless electrical connector 300 on the inward surface 100B of the outer transparent substrate 100 according to this flowchart, with only slight differences in the procedure described in step 804 below.

[0180] Referring first to step 802, the outer transparent substrate 100, the intermediate layer 102, and the inner transparent substrate 106 are formed as described above, as best shown in Figure 9, and this will not be repeated here.

[0181] Next, in step 804, the conductive ink 104 is applied to at least one surface 100B, 106A of one or both of the outer and inner transparent substrates 100, 106 (shown in Figure 16 as being applied to the outward-facing surface 100A of the outer transparent substrate 100).

[0182] The method for applying the conductive ink 104 is the same as that described in step 504 of Figure 17 above with respect to the application of the conductive ink 52, and will not be repeated here for brevity. Optionally, as part of step 804, the applied conductive ink 52 may be photocured and / or heatcured to form a cured conductive ink, or sintered to form a sintered conductive ink 52, or otherwise dried, as described above.

[0183] Next, in step 805, the laminated window assembly 90 is formed in the same manner as described above, where an intermediate layer 102 is placed between the outer transparent substrate 100 and the inner transparent substrate 106, as shown in Figure 16, and conductive ink 104 is placed between the intermediate layer 102 and the inner transparent substrate 106. The method is not repeated here for brevity.

[0184] In step 806, a solderless electrical connector 300 according to an alternative embodiment is formed or provided in accordance with the method described above, the method of which is not repeated here for brevity.

[0185] Next, in step 808, the solderless connector 300 is coupled to the conductive ink 104. Specifically, the first end 322 of each biasing member 320 is positioned in electrical contact with the conductive ink 104 and elastically compressed between the molded insulating cover 302 and the conductive ink 104. The adhesive 350 is pressed onto the transparent substrate 18, particularly the outward surface 106B of the inner transparent plate 106, or onto the outer surface 105 of the conductive ink 104, thereby bonding the insulating cover 302 to the transparent substrate 18 / inner transparent plate 106 directly or indirectly through the conductive ink 104, thereby sealing the first end 322 of the biasing member / leaf spring 320 between the adhesive 350, the inner surface 306 of the insulating cover 302, and the upper surface 105 of the conductive ink 104. Furthermore, the second end 324 of the biasing member / leaf spring 320 extends outward from the outer surface 308 of the insulating cover 302, away from the transparent substrate 18 / inner transparent plate 106 and the conductive ink 104.

[0186] Next, in step 810, the adhesive 350 is cured to form the solderless electrical connector 300 in substantially the same manner as described in step 710 of Figure 20 above, which will not be repeated here for the sake of brevity.

[0187] In step 812, the wire harness 14 is coupled to the second end 324 of each biasing member 320. Specifically, as shown in Figure 16, the wires of the wire harness 14 are electrically coupled to the second end 324 of each biasing member 320 through the openings in the biasing member 320.

[0188] Several embodiments have been described in the above description. However, the embodiments described herein are not exhaustive, nor are they intended to limit the invention to any particular form. The terms used are intended to be descriptive rather than restrictive. Many modifications or variations are possible in light of the above teachings, and the invention may be carried out in ways different from those specifically described.

[0189] Various additional modifications beyond those already described herein can be made to the embodiments described above. This disclosure is presented for illustrative purposes only and should not be construed as an exhaustive description of all embodiments or as limiting the scope of the claims to specific elements illustrated or described in relation to those embodiments. For example, any individual element of the embodiments described may be replaced by an alternative element that provides substantially similar functionality or otherwise provides suitable performance. This includes, for example, currently known alternative elements such as elements that may now be known to those skilled in the art, and alternative elements that may be developed in the future, such as elements that, when developed, may be recognized as alternatives by those skilled in the art. References to singular claim elements using, for example, the articles “a,” “an,” “the,” or “the” should not be construed as limiting the element to the singular form. It will be further recognized that the words “include, includes, including” have the same meaning as the words “comprise, comprises, comprising.”

Claims

1. A window assembly for a vehicle, Transparent substrate and A conductive feature formed on the surface of the transparent substrate, The vehicle comprises a solderless electrical connector for electrically coupling the wiring harness of the vehicle to the conductive feature, and the solderless electrical connector is An insulating cover including an inner surface facing the transparent substrate and an outer surface on the opposite side, A conductive biasing member, A first end portion extending from the inner surface of the insulating cover, the first end portion being elastically compressed between the insulating cover and the conductive feature such that the conductive biasing member is positioned in electrical contact with the conductive feature, A second end extending from the outer surface of the insulating cover and configured to be coupled to the wiring harness of the vehicle, A central region connecting the first end and the second end, extending between the first end and the second end, the central region extending through the insulating cover and connected to the insulating cover, the central region defining a notch region for engaging with the insulating cover to hold the conductive biasing member against the insulating cover, A conductive biasing member comprising, An adhesive disposed between the inner surface of the insulating cover and the transparent substrate for bonding the inner surface of the insulating cover to the transparent substrate, the adhesive comprising: an adhesive in which the first end of the conductive biasing member is elastically compressed between the inner surface of the insulating cover and the transparent substrate, thereby maintaining the conductive biasing member in electrical contact with the conductive feature; Window assembly.

2. The first end of the conductive biasing member has a first width, The window assembly according to claim 1, wherein the central region of the conductive biasing member has a second width greater than the first width, the notched region has a third width greater than or equal to the first width but less than the second width, and the notched region engages with the insulating cover to hold the conductive biasing member against the insulating cover.

3. The window assembly according to claim 1, wherein the conductive biasing member includes copper beryllium.

4. To provide an additional surface area of ​​the first end that is electrically in contact with the conductive feature, the first end of the conductive biasing member is curved along its length, optionally The window assembly according to claim 1, wherein the first end of the conductive biasing member includes a stepped portion adjacent to the central region so that the additional surface area of ​​the first end can be positioned in electrical contact with the conductive feature.

5. The green strength of the adhesive is sufficient, while the adhesive is curing, to maintain the insulating cover pressed against the surface of the transparent substrate with the first end of the conductive biasing member elastically compressed between the insulating cover and the conductive feature, without external fixation, optionally The window assembly according to claim 1, wherein the first end of the conductive biasing member, elastically compressed between the insulating cover and the conductive feature, exerts a force that pushes the insulating cover away from the transparent substrate, and the Green strength of the adhesive is greater than or equal to the force.

6. The window assembly according to claim 1, wherein the adhesive comprises a photoinitiator that initiates curing of the adhesive in response to exposure to UV light.

7. The adhesive is a pressure-sensitive adhesive, and / or The window assembly according to claim 1, wherein the adhesive is tape.

8. The window assembly according to claim 1, wherein the first end of the conductive biasing member is disposed between the adhesive, the inner surface of the insulating cover, and the conductive feature disposed on the transparent substrate.

9. The conductive feature includes a layer of conductive ink formed on the surface of the transparent substrate, optionally, The window assembly according to claim 1, wherein the conductive ink is screen printed onto the surface of the transparent substrate.

10. The window assembly according to claim 9, wherein the conductive ink comprises conductive particles and ceramic frit such that when subjected to firing, the conductive ink fuses with the transparent substrate to form the conductive feature.

11. The window assembly according to claim 9, wherein the conductive ink comprises conductive particles and organic monomers.

12. The window assembly according to claim 11, wherein the conductive ink includes a photoinitiator that causes the conductive ink to harden in response to exposure to UV light.

13. The window assembly according to claim 11, wherein the conductive ink is a thermosetting conductive ink.

14. The transparent substrate is the first transparent substrate, The window assembly according to claim 1, further comprising a second transparent substrate and an intermediate layer disposed between the first transparent substrate and the second transparent substrate.

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