Systems and methods for implementing micropulsing schemes using dual individual pulsers

JP2026501077APending Publication Date: 2026-01-14APPLIED MATERIALS INC
View PDF 9 Cites 0 Cited by

Patent Information

Application Number
JP2025530356
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-11-29
Filing Date
2023-11-01
Publication Date
2026-01-14

Smart Images

  • Figure 2026501077000001_ABST
    Figure 2026501077000001_ABST
Patent Text Reader

Abstract

[0006] Embodiments of the present disclosure presented herein include an apparatus and method for processing a substrate in a plasma processing system. The apparatus includes a pulsed voltage (PV) waveform generator, the PV waveform generator comprising at least one synchronization signal and a plurality of pulsers for providing a plurality of TTL inputs. The PV waveform generator generates a waveform including pulses or bursts containing micropulses corresponding to the plurality of TTL input signals and the at least one synchronization signal. The method includes receiving, from a controller, a first TTL input signal and a synchronization signal; providing a first micropulse to an electrode assembly after receiving the first TTL input signal and synchronization signal; and providing a second micropulse to the electrode assembly after receiving a second TTL input signal and synchronization signal.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Improvement of plasma process uniformity of entire wafer through distribution of power of a plurality of VHF sources

    JP2008187179A

  • Frequency enhanced impedance dependent power control for multi-frequency RF pulsing

    JP2013171840A

  • Plasma processing method and plasma processing apparatus

    JP2014204050A

  • Plasma processing method and plasma processing apparatus

    JP2019036658A

  • Synchronous controller for high-output impulse magnetron sputtering

    JP2019090104A