Optimized film deposition and ion implantation for substrate stress and deformation relief

Abstract

The disclosed systems and techniques aim to correct the out-of-plane deformation (OPD) of a substrate (e.g., a wafer) by using optical inspection data to identify a profile of the substrate's OPD and performing a polynomial decomposition of the profile to determine polynomial coefficients that characterize an underlying deformation shape of the substrate. The technique further includes identifying characteristics of a stress compensation layer (SCL) for the substrate based on the polynomial coefficients and depositing the SCL on the substrate. The technique further includes performing a statistical simulation to identify settings for non-uniform stress relaxation exposure of the SCL by sampling from one or more statistical distributions associated with previously performed stress relaxation exposures, and performing the non-uniform stress relaxation exposure of the SCL using the identified settings.

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