Method and system for controlling underfill bleed-out in semiconductor packaging.

Abstract

This application relates to the control of underfill bleed-out in semiconductor packaging. A first substrate is placed on a support substrate, and a bracket structure is placed on the support substrate at a first interval from the first substrate. An underfill material is applied to the support substrate. The bracket structure automatically controls the bleed-out of the underfill material. In some embodiments, the bracket structure is removed from the support substrate upon determination that the underfill material has substantially cured. In some embodiments, the first substrate includes a semiconductor package, and the support substrate includes a printed circuit board (PCB). Alternatively, in some embodiments, the first substrate includes a chip, and the support substrate includes a semiconductor package, together with the first substrate, to form a system-in-package (SiP).

Description

[Technical Field]

[0001] (Cross-reference of related applications) This application is a continuation of U.S. Patent Application No. 18 / 123,612, filed on March 20, 2023, entitled “Method and System for Controlling Underfill Bleedout in Semiconductor Packaging,” claiming priority therefrom and incorporating by reference all the contents of the said application.

[0002] This application relates to semiconductor packaging technology, not limited to methods, systems, and devices for controlling bleed-out of underfill material that mechanically secures a substrate within an electronic device. [Background technology]

[0003] Silicon dies are mounted to the mounting surface by underfill. The underfill is applied to at least one side of the silicon die and bleeds out to the other exhaust side where the underfill is not applied. Keep-out zones (KOZs) must be reserved on four sides of each silicon die to allow for underfill injection or bleed-out. For some electronic devices, it is desirable that the width of the KOZ to which the underfill is applied or bleed out be controlled to be below a threshold width. The width of the KOZ to which the underfill is applied (e.g., 1 mm) is often greater than the width of the KOZ to which the underfill bleed out (e.g., 0.5 mm). Additional electronic components must be kept away from the KOZ (e.g., at least 0.5 or 1 mm away from the silicon die) when mounted to the mounting surface. In some cases, the underfill is applied to four sides of the silicon die, resulting in a larger total KOZ area than when only one side of the silicon die is used for underfill application. The width of these KOZs determines the mounting density in which the silicon dies and electronic components are mounted. Narrowing the width of the KOZ surrounding the silicon die is beneficial in order to increase the mounting density and cost-effectiveness of electronic devices. [Overview of the Initiative]

[0004] Various embodiments of this application relate to methods, systems, and devices for controlling the bleed-out of underfill material surrounding one or more sides of a substrate. After a first substrate is placed on a support substrate, a bracket structure is placed on the support substrate at a first interval from the first substrate. The underfill material is applied onto the support substrate from at least one corner or side of the first substrate. The underfill material flows between the first substrate and the support substrate until it hardens. During this process, the bracket structure automatically controls the bleed-out of the underfill material into each keep-out zone (KOZ) (also called a bleed-out area) surrounding the first substrate. After the underfill material has substantially hardened, the bracket structure is removed from the support substrate. By these means, the bleed-out of the underfill material is controlled to reduce the distance between the first substrate and adjacent substrates or electronic components. The first substrate and other substrates or electronic components can be mounted using a smaller support substrate. Alternatively, more substrates or electronic components can be mounted on the same support substrate.

[0005] Specifically, the bracket structure acts as a barrier to the underfill material, restricting its movement in one or both of two planar directions parallel to the upper surface of the support substrate. In some embodiments, the underfill material has a predetermined volume. The underfill material is thicker when the bracket structure is applied compared to when the bleed-out is not restricted by the bracket structure. Alternatively, in some embodiments, the predetermined volume is reduced when the bracket structure is applied, thereby allowing the underfill material to maintain substantially the same thickness as when the bleed-out is not restricted by the bracket structure. A smaller predetermined volume of the underfill material results in shorter throughput times and lower manufacturing costs for the electronic device. In some embodiments, the bracket structure is applied after the first substrate is mechanically and electronically bonded to the support substrate and before the underfill material is applied. The bracket structure is removed once the underfill material has cured. Compared to unrestricted underfill material bleed-out, the KOZ defined by the bracket structure is narrower, allowing other substrates or electronic components to be positioned closer to the first substrate. In some embodiments, the bracket structure includes a rectangular bracket. In some embodiments, the bracket structure includes a single side configured to control the flow of the underfill material in one direction. In some embodiments, the bracket structure includes two connected sides configured to control the flow of the underfill material in two directions, for example, for edge filling or corner filling.

[0006] In one embodiment, a method is employed to control the bleed-out of underfill. The method includes arranging a first substrate on a support substrate and arranging a bracket structure on the support substrate at a first interval from the first substrate. The method further includes applying an underfill material onto the support substrate and automatically controlling the bleed-out of the underfill material by the bracket structure. In some embodiments, the method further includes removing the bracket structure from the support substrate upon determination that the underfill material has substantially cured.

[0007] In some embodiments, the first substrate includes a semiconductor package, and the support substrate includes a printed circuit board (PCB). Alternatively, in some embodiments, the first substrate includes a chip, and the support substrate includes a semiconductor package, and together with the first substrate, they form a system-in-package (SiP).

[0008] In some embodiments, the method further includes electrically coupling the first substrate to the support substrate via one or more conductive connectors located between the opposing surfaces of the first substrate and the support substrate when the first substrate is placed on the support substrate.

[0009] In some embodiments, the bracket structure is positioned close to the first edge of the first substrate and then spaced a first distance away from it to control the bleed-out of the underfill material from the first edge of the first substrate. The underfill material is applied to at least one of the corners, the first edge, and the second edge of the first substrate, the second edge being different from the first edge.

[0010] In some embodiments, the method includes positioning the second substrate on the support substrate. The bracket structure extends near the second substrate and is spaced at a second interval from the second substrate. After the first and second substrates are positioned, the underfill material is applied sequentially to the first and second substrates. Bleed-out of the underfill material under the second substrate is automatically controlled by the bracket structure.

[0011] In other embodiments, some implementations include an electronic device comprising a support substrate, a first substrate disposed on the support substrate, and an underfill material coated between the support substrate and the first substrate. At least a portion of the underfill material has an upright edge at a first distance from the first substrate. Furthermore, in some embodiments, the underfill material is cured and configured to hold the first substrate in a first position on the support substrate.

[0012] In some embodiments, the first substrate is electrically coupled to the support substrate via one or more conductive connectors located between the opposing surfaces of the first substrate and the support substrate.

[0013] In some embodiments, the first substrate has a plurality of edges. The upright edges of the underfill material are located near at least some of the edges, two, three, or four of the plurality of edges of the first substrate. Furthermore, in some embodiments, the first distance is less than a predetermined first spacing limit. In some embodiments, the upright edges of the underfill material have a height higher than the threshold height associated with the first distance.

[0014] These exemplary embodiments and implementations mentioned herein are not intended to limit or restrict the disclosure, but rather to provide examples that aid in understanding it. Additional embodiments are discussed in the section on embodiments for carrying out the invention and further explanation is provided.

[0015] To better understand the various implementation forms described, please refer to the following forms for implementing the following invention in association with the following drawings. Similar reference numbers refer to corresponding parts throughout the drawings.

Brief Description of the Drawings

[0016] [Figure 1] It is a block diagram of a system module example in a typical electronic device according to some embodiments. [Figure 2A] It is a cross-sectional view of an example of an electronic device including two substrates according to some embodiments. [Figure 2B] It is a cross-sectional view of an example of an electronic device including more than two substrates according to some embodiments. [Figure 3] FIG. 3A is a cross-sectional view of an example of an electronic device configured to control the bleed-out of underfill by a bracket structure according to some embodiments. FIGS. 3B and 3C are top views of the example of the electronic device shown in FIG. 3A according to some embodiments. [Figure 4] FIGS. 4A to 4F show an example of a process for forming an electronic device in which the bleed-out of an underfill material is controlled according to some embodiments. [Figure 5] FIGS. 5A to 5C are top views of an example of an electronic device in which the bleed-out of underfill is controlled by a bracket structure according to some embodiments. [Figure 6] FIG. 6A is a top view of an example of a bracket structure according to some embodiments. FIGS. 6B and 6C are top views of an example of an electronic device in which the bleed-out of underfill is controlled by a bracket structure according to some embodiments. [Figure 7] It is a flowchart of an example of a method for controlling the bleed-out of underfill in an electronic device according to some embodiments.

Embodiments for Implementing the Invention

[0017] Similar reference numbers refer to corresponding parts throughout multiple drawings in a drawing.

[0018] Specific embodiments are described in detail below, examples of which are shown in the accompanying drawings. In the following detailed description, numerous non-limiting details are included to aid in understanding the subject matter presented herein. However, it will be obvious to those skilled in the art that various alternative forms may be used without departing from the claims, and that the subject matter may be implemented without these specific details. For example, it will be obvious to those skilled in the art that the subject matter presented herein can be implemented in numerous types of electronic devices having digital video capabilities.

[0019] Figure 1 is a block diagram of an example of a system module 100 in a typical electronic device according to several embodiments. The system module 100 in this electronic device includes at least a processor module 102, a memory module 104 for storing programs, instructions, and data, an input / output (I / O) controller 106, one or more communication interfaces such as a network interface 108, and one or more communication buses 140 for interconnecting these components. In some embodiments, the I / O controller 106 enables the processor module 102 to communicate with I / O devices (e.g., keyboards, mice, or trackpads) via a universal serial bus interface. In some embodiments, the network interface 108 includes one or more separate interfaces for Wi-Fi, Ethernet, and Bluetooth networks, enabling the electronic device to exchange data with external sources such as a server or another electronic device. In some embodiments, the communication bus 150 includes circuitry (sometimes called a chipset) that interconnects the various system components included in the system module 100 and controls communication between them.

[0020] In some embodiments, the memory module 104 includes high-speed random access memory such as DRAM, static random access memory (SRAM), double data rate (DDR) dynamic random access memory (RAM), or other random access solid-state memory devices. In some embodiments, the memory module 104 includes non-volatile memory such as one or more magnetic disk storage devices, optical disk storage devices, flash memory devices, or other non-volatile solid-state storage devices. In some embodiments, the memory module 104, or alternatively the non-volatile memory device within the memory module 104, includes a non-transient computer-readable storage medium. In some embodiments, a memory slot is reserved on the system module 100 to receive the memory module 104. When inserted into the memory slot, the memory module 104 is integrated into the system module 100.

[0021] In some embodiments, the system module 100 further includes one or more components selected from a memory controller 110, a solid-state drive (SSD) 112, a hard disk drive (HDD) 114, a power management integrated circuit (PMIC) 118, a graphics module 120, and a sound module 122. The memory controller 110 is configured to control communication between the processor module 102 and the memory components, including the memory module 104, in the electronic device. The SSD 112 is configured to apply an integrated circuit as an assembly for storing data in the electronic device, and in many embodiments is based on a NAND or NOR memory configuration. The HDD 114 is a conventional data storage device for storing and retrieving digital information based on an electromechanical magnetic disk. The power connector 116 is electrically coupled to accept an external power supply. The PMIC 118 is configured to adjust the accepted external power supply to other desired DC voltage levels, such as 5V, 3.3V, 1.8V, or any other suitable voltage level, as required by various components or circuits in the electronic device (e.g., the processor module 102). The graphics module 120 is configured to generate a feed of output images for one or more display devices according to their desired image / video format. The sound module 122 is configured to facilitate the input and output of audio signals to electronic devices under the control of a computer program.

[0022] It should be noted that the communication bus 140 also interconnects various system components, including components 110-122, and controls communication between them.

[0023] Furthermore, those skilled in the art will understand that as new data storage technologies are developed for storing information in non-temporary computer-readable storage media within the memory module 104 and the SSD 112, other non-temporary computer-readable storage media may be used. Although these data storage technologies are currently under development and not yet commercialized, these new non-temporary computer-readable storage media include, but are not limited to, those manufactured from biomaterials, nanowires, carbon nanotubes, and individual modules.

[0024] Some of the mounting configurations of this application relate to semiconductor mounting techniques applied to form one or more of components 102-122 or to mount a subset of components 102-122 on the same substrate (e.g., PCB). After the first substrate is placed on a support substrate, an underfill material (also called an encapsulant) is applied from the corners or edges of the first substrate and spreads to fill the gap between the first substrate and the support substrate due to the surface tension of the underfill material. The underfill material improves the reliability and durability of the assembly of the first substrate and the support substrate, making the physical contact and electrical coupling stronger and more reliable. In particular, after the first substrate is placed but before the underfill material is applied to the support substrate, a bracket structure is placed on the support substrate at a first distance from the first substrate. The resulting underfill material extends beyond the side of the first substrate and hardens with substantially sharp upright edges.

[0025] Figure 2A is a cross-sectional view of an electronic device 200 including two substrates, substrate 202 and substrate 204, according to some embodiments. The first substrate 202 is positioned on the support substrate 204 to form a flip-chip assembly of the electronic device 200. The first substrate 202 has a first surface 202A and a second surface 202B, and the support substrate 204 has an upper surface 204A. One or more first electronic contacts 206 are exposed on the first surface 202A of the first substrate 202. In some embodiments, an integrated circuit is formed on the first surface 202A of the first substrate 202. One or more second electronic contacts 208 are exposed on the upper surface 204A of the support substrate 204. The first substrate 202 is inverted and coupled to the support substrate 204 by the first surface 202A of the first substrate 202 facing the upper surface 204A of the support substrate 204. One or more first electronic contacts 206 on the first surface 202A are electrically coupled to one or more second electronic contacts 208 on the upper surface 204A of the support surface 204 via one or more conductive connectors 210. In one example, the conductive connectors 210 include solder balls arranged in a ball grid array (BGA).

[0026] The underfill material 212 is applied to enhance the electronic connection between the conductive connector 210 and either the first electronic contact 206 or the second electronic contact 208. In some embodiments, the underfill material 212 includes a composite material composed of an epoxy polymer containing a large amount of filler. Furthermore, in some embodiments, the additives added to the underfill material 212 include one or more of the following: a fluidizer, an adhesion promoter, and a dye.

[0027] The underfill material 212 is applied on or near the periphery 214 of the first substrate 202 and falls onto the upper surface 204A of the support substrate 204. The periphery 214 of the first substrate 202 includes corners or edges. Optionally, the underfill material 212 is applied by a nozzle 216. The nozzle 216 stops near a corner of the first substrate 202, and a predetermined volume of underfill material 212 is applied as a whole on or near the corner of the first substrate 202. Alternatively, the nozzle 216 moves near at least a portion (e.g., 1 / 2) of the edge of the first substrate 202, and a predetermined volume of underfill material 212 is applied on or near at least a portion of the edge of the first substrate 202. Furthermore, in some embodiments, the underfill material 212 is applied on or near one or more edges (e.g., 1, 1.5, 2, 3, and 4 edges) of the first substrate 202.

[0028] In some embodiments, the underfill material 212 automatically expands across the gap between the first substrate 202 and the support substrate due to capillary action (i.e., surface tension between the underfill material 212 and both surfaces 202A and 204A). The underfill material 212 stops expanding at a distance beyond each edge of the first substrate 202 and hardens to form a bleed-out region 218 that is in contact with each edge of the first substrate 202. The bleed-out region 218 has a bleed-out width W which optionally varies depending on its position on the edge of the first substrate 202. BO In some embodiments, the silicon device 200 is heated to a certain temperature (e.g., 125°C to 165°C) to cure the underfill material 212. Once cured, the underfill material 212 has improved resistance to vibration and reduced thermal stress damage, thereby improving the product reliability and product life of the electronic device 200.

[0029] In some embodiments, the bracket structure 220 is positioned on the support substrate 204 at a first distance S1 from the first substrate 202 after the first substrate 202 has been placed and before the underfill material 212 is applied to the support substrate 204 near the bracket structure 220A. Referring to Figure 2A, the underfill material 212 flows in a first direction toward the bracket structure 220A and is stopped by the bracket structure 220A, forming an upright edge that is in contact with the bracket structure 220A. The underfill material 212 also flows in other directions, including a second direction opposite to the first direction. In particular, the underfill material 212 flows between the first substrate 202 and the support substrate 204 and flows out from the edge of the first substrate 202B adjacent to the bracket structure 220B. In some cases, the underfill material 212 comes into contact with the bracket structure 220B and is stopped therefrom, forming an upright edge that is in contact with the bracket structure 220B. These means allow the bracket structure 220 to automatically control the bleed-out of the underfill material 212 within each keep-out zone (KOZ) defined by the bracket structure 220. After the underfill material 212 has substantially cured, the bracket structure 220 is removed from the support substrate 204, and the bleed-out of the underfill material 212 is controlled based on the KOZ defined by the position of the bracket structure 220. The width of the KOZ is equal to the first interval S1, and the bleed-out width W BO Smaller. Therefore, the devices in each of components 102-122 can be densely implemented to reduce the size of each component, and subsets of components 102-122 can also be densely assembled to reduce the overall size of the system module and improve the cost-effectiveness of system module 100, which includes components 102-122.

[0030] The bracket structure 220 has a height H that is sufficiently high (for example, higher than the second surface 202B of the first substrate 202) to prevent the underfill material 212 from overflowing from the bracket structure 220. Conversely, if the height H of the bracket structure 220 is slightly higher than the resulting upright edge of the underfill material 212, the height H needs to increase with the decrease in the first gap S1 in order to prevent overflow of the underfill material 212 and effectively control the bleed-out of the underfill material 212.

[0031] In addition, in some embodiments, the bracket structure 220A is positioned closer to the side of the first substrate 202A where the underfill material 212 is applied. In some embodiments, the bracket structure 220B is positioned closer to the exhaust side of the first substrate 202A where the underfill material 212 is applied closer to another edge of the first substrate 202 and then spreads there.

[0032] Figure 2B is a cross-sectional view of an electronic device 250 including two or more substrates according to several embodiments. An underfill material 212 is applied to enhance the electronic connections between two or more substrates of a chip-scale package (CSP). For example, the electronic device 250 includes a second substrate 252 bonded to the second surface 202B of a first substrate 202. The underfill material 212 is applied on or near the periphery of the second substrate 204 and flows to fill a first gap between the first substrate 202 and the support substrate 204 and a second gap between the first substrate 202 and the second substrate 252. In some embodiments, the underfill material 212 is applied in a single application operation. The underfill material 212 is applied on or near the periphery 254 of the second substrate 252. Alternatively, in some embodiments, the underfill material 212 is applied in two application operations. The underfill material 212 is applied on or near the periphery 214 of the first substrate 202 to fill the first gap between the first substrate 202 and the support substrate 204. Subsequently, the underfill material 212 is applied on or near the periphery 254 of the second substrate 202 to fill the second gap between the first substrate 202 and the second substrate 204. The electronic device 250 is optionally cured after each application operation or cured only once after both application operations are completed.

[0033] Figure 3A is a cross-sectional view of an example of an electronic device 300 configured to control underfill bleed-out by a bracket structure 220 according to some embodiments. Figures 3B and 3C are top views of the example of the electronic device 300 shown in Figure 3A according to some embodiments. The cross-sectional view in Figure 3A corresponds to the AA' cross-section in Figure 3C. A first substrate 202 is placed on a support substrate 204, and the bracket structure 220 is placed on the support substrate 204 with a first spacing S1 from the first substrate 202 (Figure 3B). The underfill material 212 is applied onto the support substrate 204, for example, from a corner or at least a portion of one edge of the first substrate 202. The bracket structure 220 automatically controls the bleed-out of the underfill material 212 within the first spacing S1 (Figures 3A and 3B). After the underfill material 212 has cured, the bracket structure 220 is removed (Figure 3C). The bracket structure 220 is manufactured from a material that can be easily attached to and detached from the underfill material 212. For example, the bracket structure 220 is manufactured from stainless steel.

[0034] The first substrate 202 has multiple edges (e.g., four edges). The bracket structure 220 is positioned close to at least a first subset of the multiple edges of the first substrate 202 (e.g., the left edge 202L) and separated from it by a first spacing S1. The bracket structure controls the bleed-out of the underfill material 212 from the first subset of the multiple edges of the first substrate 202. In one example, the first subset of the multiple edges of the first substrate 202 includes all four edges, and the bracket structure 220 includes a rectangular shape. Each side of the bracket structure 220 is separated from each side of the first substrate 202 by a respective spacing. In some embodiments, the first spacing S1 remains the same for the first subset of the multiple edges of the first substrate 202. Alternatively, in some embodiments, the first spacing S1 varies depending on the different positions of the first subset of the multiple edges of the first substrate 202. For example, the first substrate 202 has a left edge 202L separated from the bracket structure 220 by a first spacing S1, and a right edge 202R separated from the bracket structure 220 by a second spacing S2. The second spacing S2 between the bracket structure 220 and the right edge 202R is greater than the first spacing S1 between the bracket structure 220 and the left edge 202L. In some embodiments, regardless of whether the spacing varies depending on the position on the bracket structure 220, the first spacing S1 (e.g., 0.2 mm) is less than a predetermined first spacing limit (e.g., 0.5 mm), and the same applies to the second spacing S2 (e.g., 0.4 mm). The predetermined first spacing limit is further defined by the bleed-out width W BO (For example, 1 mm or less.)

[0035] The underfill material 212 is applied on or near the peripheral portion 214 of the first substrate 202. Optionally, the underfill material 212 is applied by a nozzle 216 (Figure 2A) from a fixed corner region 304 between the corner of the first substrate 202 and the corner of the bracket structure 220. A predetermined volume of underfill material 212 is applied, for example, at a controlled flow rate to the corner region 304 as a whole (Figure 3B). Alternatively, the underfill material 212 is applied along a path 306 (Figure 3B) between the first substrate 202 and the bracket structure 220. The path 306 optionally extends near a portion of an edge, a single edge, or more than one edge (e.g., 1.5 edges, 2 edges, 3 edges, or 4 edges). As it moves along the path 306, a predetermined volume of underfill material 212 is applied at a controlled flow rate within a first interval S1. In some unshown embodiments, the path 306 forms a closed loop surrounding the first substrate 202. The underfill material 212 is applied to all four edges of the first substrate 202.

[0036] In some embodiments, the bracket structure 220 has a threshold height H set to control the bleed-out of the underfill material 212. T It has a higher height H (Figure 2A). Furthermore, in some embodiments, the threshold height H T This is determined based on the first gap S1 between the first substrate and the bracket structure 220. Referring to Figure 2A, the height of the bleed-out region 218 gradually decreases depending on the distance from the corresponding edge of the first substrate 202A. Threshold height H T This decreases with increasing first interval S1 between the first substrate 202 and the bracket structure 220. In other words, the larger the first interval S1, the lower the threshold height H. T It is small. Conversely, the smaller the first interval S1, the lower the threshold height H. T The size is large. The height of the bracket structure 220 needs to be increased so that the underfill material 212 does not overflow from the bracket structure 220.

[0037] One or more electronic components 308 are arranged on the support substrate 204 in conjunction with the first substrate 202. For example, one or more electronic components 308 include one or more capacitor components, logic modules, resistor components, and another substrate 202. In some embodiments, the electronic components 308 are off-the-shelf components contained within a single package. Each of the one or more electronic components 308 maintains a component distance from the nearest edge of the first substrate 202. In some embodiments, the underfill material 212 adjacent to the electronic component 308 is controlled by a bracket structure 220, and the corresponding component distance is equal to the distance between the bracket structure 220 and the nearest edge of the first substrate 202. Alternatively, in some embodiments, the corresponding component distance is greater than the distance between the bracket structure 220 and the nearest edge of the first substrate 202. For example, the component distance is 0.1 mm greater than that distance.

[0038] In some embodiments, the first substrate 202 includes a semiconductor chip, and the support substrate 204 includes a semiconductor package, forming a SiP together with the first substrate 202. Alternatively, in some embodiments, the first substrate 202 includes a semiconductor package, and the support substrate 204 includes a PCB. For example, the support substrate 204 is the motherboard of a computer machine, and the semiconductor package includes electronic components mounted on the motherboard. In some embodiments, one or more conductive connectors 210 (e.g., solder ball, spring connector) are located in the gap between the first substrate 202 and the support substrate 204 or extend beyond the edge of the first substrate. Alternatively, in some embodiments, one or more conductive connectors 210 include a wire coupled between the second surface 202B of the first substrate 202 and the upper surface 204A of the support substrate 204. One or more conductive connectors 210 are embedded in the underfill material 212, whether or not a bracket structure 312 is applied to control the bleed-out of the underfill material 212.

[0039] Figures 4A to 4F show examples of process 400 (400A to 400F) for forming an electronic device 300 in which the bleed-out of the underfill material 212 is controlled, according to several embodiments. Process 400 is viewed from a cross section including the line B-B' in Figure 3C. The line B-B' is substantially parallel to the right edge 202R of the first substrate 202 and is located between the right edge 202R of the first substrate 202 and the bracket structure 220. Referring to Figure 4A (400A), a support substrate 204 is applied to manufacture the electronic device 300. In some embodiments, the support substrate 204 is manufactured from one of the following materials: PCB, ceramic, glass, polymer, silicon, and other semiconductor materials. Referring to Figure 4B (400B), the first substrate 202 is placed on the support substrate 204. The first substrate 202 has a first surface 202A and a second surface 202B, and the support substrate 204 has a top surface 204A. One or more first electronic contacts 206 are exposed on the first surface 202A of the first substrate 202. In some embodiments, an integrated circuit is formed on the first surface 202A of the first substrate 202. One or more second electronic contacts 208 are exposed on the upper surface 204A of the support substrate 204. The first substrate 202 is inverted and coupled to the support substrate 204 at the first surface 202A of the first substrate 202 that faces the upper surface 204A of the support substrate 204. One or more first electronic contacts 206 on the first surface 202A are electrically coupled to one or more second electronic contacts 208 on the upper surface 204A of the support surface 204 via one or more conductive connectors 210.

[0040] Referring to Figure 4C (400C), the bracket structure 220 is positioned on the support substrate 204. The first substrate 202 has multiple edges (e.g., four edges). The bracket structure 220 is positioned close to at least one of the multiple edges of the first substrate 202, with a first spacing S1 from it. In some embodiments (Figure 3B), the bracket structure 220 has a first spacing S1 from the left edge 202L and a second spacing S2 from the right edge 202R of the first substrate 202, respectively. The second spacing S2 is greater than the first spacing S1. In some embodiments, the bracket structure 220 is held on the support substrate 204 by an external force, such as a clamp. Alternatively, in some embodiments, adhesive is applied to multiple spots, subsets, or the entire underside of the bracket structure 220, and the bracket structure 220 is held on the support substrate 204 by the adhesive. Alternatively, in some embodiments, the bracket structure 220 is held on the support substrate 204 by a fastening structure 402. For example, the support substrate 204 has an opening slot 402 configured to receive and hold the bracket structure 220. External force, adhesive, and fastening structure 402 can all be easily released to remove the bracket structure 220 from the support substrate 204 as needed.

[0041] Referring to Figure 4D, the nozzle 216 moves along the path 404 and applies the underfill material 212 to the second gap S2 between the bracket structure 220 and the right edge 202R of the first substrate 202. The remaining three edges 202L, 202T, and 202M correspond to the exhaust sides of the first substrate 202 into which the underfill material 212 spreads or diffuses. In some embodiments, the first portion of the bracket structure 220 into which the underfill material 212 is applied has a coating structure height, and the second portion of the bracket structure 220, corresponding to the exhaust side of the substrate 202, has an exhaust structure height. The coating structure height is higher than the exhaust structure height. Alternatively, in some embodiments, the coating structure height and the exhaust structure height are the same.

[0042] The underfill material 212 is cured, for example, by heat treatment. In some embodiments, the bracket structure 220 remains on the support substrate 204 after the underfill material 212 is cured. Alternatively, in some embodiments, the bracket structure 220 is removed from the support substrate 204 after the underfill material 212 is cured. Additionally, in some embodiments, the bracket structure 220 includes a handling structure 406 (FIGS. 3B and 4D) configured to facilitate removal of the bracket structure 220 from the support substrate 204 after the underfill material 212 is substantially cured.

[0043] Referring to FIG. 4E, after the bracket structure 220 is removed, the underfill material 212 fills the gap between the first substrate 202 and the support substrate 204 and extends beyond the edge of the first substrate 202. In some embodiments, the bracket structure 220 is disposed on the support substrate 204 near a first subset of the edges of the first substrate 202. When the underfill material 212 is disposed near the first subset of the edges, the underfill material 212 has a controlled application height (h1) at an interval (e.g., S1) defined by the bracket structure 220. When the underfill material 212 is not disposed near the first subset of the edges, the underfill material 212 has a controlled exhaust height (h2) at an interval (e.g., S1) defined by the bracket structure 220. The controlled application height (h1) of the underfill material 212 is higher than the controlled exhaust height (h2). In some embodiments, the bracket structure 220 is disposed on the support substrate 204 but not near a second subset of the edges of the first substrate 202. Regardless of whether the underfill material 212 is disposed near the second subset of the edges, the second subset of the edges corresponds to a bleed-out region 218 (FIG. 2) where the underfill material 212 drops from an initial height to 0. The bleed-out width W BO is greater than the corresponding interval between the bracket structure 220 and the first substrate 202. By these means, the bracket structure 220 controls the bleed-out width W of the bleed-out region 218 BOThis is controlled to the corresponding distance (e.g., first distance S1) between the bracket structure 220 and the first substrate 202.

[0044] In other words, after the bracket structure 220 is removed, at least a portion of the underfill material 212 defined by the bracket structure 220 is located at a first distance L from the first substrate 202. E The underfill material 212 has an upright edge 212A. The first distance L1 is defined by the first spacing S1 between the bracket structure 220 and the corresponding edge of the first substrate 202. In some embodiments, the height h of the upright edge 212A of the underfill material 212 is determined based on the corresponding spacing S1 between the first substrate and the bracket structure 220. Specifically, the height h of the upright edge 212A of the underfill material 212 decreases with increasing spacing between the first substrate 202 and the bracket structure 220. In other words, the larger the spacing S1, the smaller the height h of the upright edge 212A of the underfill material 212. Conversely, the smaller the spacing S1, the larger the height h of the upright edge 212A of the underfill material 212. In addition, in some embodiments, the height h of the upright edge 212A includes a controlled coating height (h1) or exhaust height (h2), depending on whether the underfill material 212 is coated near the upright edge 212A.

[0045] Referring to Figure 4F, the electronic component 308 is positioned outside the underfill material 212 that connects the first substrate 202 and the support substrate 204. Compared to the bleed-out region 218 (Figure 2A), the distance between each electronic component 308 and the first substrate 202 is, for example, the bleed-out width W when the bracket structure 220 is applied. BOAs the spacing decreases from the first interval S1, the device density and cost-effectiveness of the electronic device 300 are improved. In some embodiments, the electronic component 308 is placed on the support substrate 204 before the bracket structure 220 is placed and the underfill material 212 is applied. In some embodiments, the electronic component 308 is placed on the support substrate 204 after the bracket structure 220 is placed and before the underfill material 212 is applied. In some embodiments, the electronic component 308 is placed on the support substrate 204 after the underfill material 212 is applied and before the bracket structure 220 is removed. In some embodiments, the electronic component 308 is placed on the support substrate 204 after the bracket structure 220 has been removed.

[0046] Figures 5A to 5C are top views of electronic devices 300A, 300B, and 300C, respectively, in which underfill bleedout is controlled by different bracket structures 220A, 220B, and 220C according to several embodiments. The first substrate 202 has multiple edges (e.g., four edges). The bracket structure 220 is positioned close to at least a first subset of the multiple edges of the first substrate 202, with a first spacing S1 between them. The bracket structure controls the bleedout of the underfill material from the first subset of the multiple edges of the first substrate. Referring to Figure 5A, the bracket structure 220A extends along 1.5 edges of the first substrate 202. A subset of electronic components 308 (e.g., 308B to 308E) is positioned close to 1.5 edges of the first substrate 202. Referring to Figure 5B, the bracket structure 220B extends along the entire length of the three edges of the first substrate 202, and the electronic components 308A to 308E are positioned close to two of these three edges.

[0047] Referring to Figure 5C, the bracket structure 220C includes three separate parts 220C-1, 220C-2, and 220C-3 that are selectively positioned near a subset of edges where electronic components are located or are located nearby. In some embodiments, the three parts 220C-1, 220C-2, and 220C-3 are separated from each other and individually positioned on the support substrate 204. Alternatively, in some embodiments, the three parts 220C-1, 220C-2, and 220C-3 are mechanically coupled to each other on the bracket structure 220C at a height above, for example, the second surface 202B of the first substrate 202. The areas 502 and 504 between the three parts 220C-1, 220C-2, and 220C-3 are left open on the upper surface 204A of the support substrate 204, thereby allowing the underfill material 212 to bleed out naturally. The underfill material 212 is confined to the first interval S1 in which the three parts 220C-1, 220C-1, and 220-3 of the bracket structure 220 are positioned, while the bleed-out width W corresponding to each of the areas 502 and 504 is confined. BO It spreads out to form a shape.

[0048] In some embodiments, the underfill material 212 is applied to a first subset of multiple edges of the first substrate 202. For example, referring to Figure 5C, the underfill material 212 is applied to the edges of the first substrate 202 facing three parts 220C-1, 220C-2, and 220C-3 of the bracket structure 220.

[0049] In some embodiments, the underfill material 212 is applied to at least a second subset of multiple edges of the first substrate 202, the second subset of multiple edges not overlapping with a first subset of multiple edges near which a bracket structure 220 is located. For example, referring to Figure 5A, the second subset of multiple edges of the first substrate 202 includes the right edge 212R. In another example, the underfill material 212 is applied to a corner region 304A-1 corresponding to the upper left corner of the first substrate 202 where a bracket structure 220 controlling bleed-out is not applied. In other words, in some embodiments, the bracket structure 220 is located near the right edge 202R of the first substrate 202 to control bleed-out of the underfill material 212 at the right edge 202R of the first substrate 202. The underfill material 212 is applied to at least one of the corners of the first substrate 202 (e.g., near corner region 304A-1), the right edge 202R, and the left edge 202L. The left edge 202L is different from the right edge 202R. Furthermore, in some embodiments, the bracket structure 220 does not extend near the upper edge 202T of the first substrate 202. The upper edge 202T is different from the right edge 202R. After the underfill material 212 is applied and cured, the underfill material 212 bleeds out beyond the upper edge 202T with a bleed-out width W. BO It persists. Bleed-out width W BO This is greater than the distance between the bracket structure 220 and the first substrate 202.

[0050] In one example (for instance, Figure 5A), the underfill material 212 has a coating side that is close to the left edge (202L) or upper edge (202T) that is not associated with the bracket structure 220, and the coating side has a first width (e.g., 1 mm) that exceeds the left edge (202L) or upper edge (202T). Conversely, the underfill material 212 has a bleed-out side that is close to the right edge 202R that is associated with the bracket structure 220C-1, and the coating side has a second width (e.g., 0.1 mm) that exceeds the right edge 202R. The first width is greater than the second width.

[0051] Alternatively, in some embodiments, the underfill material 212 is applied to at least a second subset of multiple edges of the first substrate 202, the second subset of multiple edges partially overlapping with the first subset of multiple edges, which is located near a bracket structure 220. For example, referring to Figure 5A, the second subset of multiple edges of the first substrate 202 includes the bottom edge 212M, and the underfill material 212 is applied to the first half of the bottom edge 212M without being limited by any bracket structure 220. The underfill material 212 is also applied to the second half of the bottom edge 212M, while being limited by the bracket structure 220A. In another example, the underfill material 212 is applied to corner regions 304A-2 or 304A-3 corresponding to the corners of the first substrate 202 and parts of the bracket structure 220A.

[0052] One or more electronic components 308 are arranged on the support substrate 204 in conjunction with the first substrate 202. For example, one or more electronic components 308 include one or more capacitor components, logic modules, resistor components, and another substrate 202. Each of the one or more electronic components 308 maintains a component distance from the nearest edge of the first substrate 202. In some embodiments, the underfill material 212 adjacent to the electronic component 308 is controlled by a bracket structure 220, and the corresponding component distance is greater than or equal to the distance between the bracket structure 220 and the nearest edge of the first substrate 202. Alternatively, in some embodiments (Figure 5A), the underfill material 212 adjacent to the electronic component 308A is not controlled by any bracket structure 220, and the corresponding component distance is greater than the distance between the bracket structure 220 and the first substrate 202, with respect to a bleed-out width W. BO That concludes the explanation. Electronic component 308A is positioned further away from the first substrate 202A than the other electronic components 308B to 308E (Figure 5A).

[0053] Referring to Figure 5B, in some embodiments, the upper surface 204A of the support substrate 204 includes a plurality of alignment marks 506. When the bracket structure is placed on the support substrate 204, the bracket structure 220 is aligned with the plurality of alignment marks 506 on the upper surface 204A of the support substrate 204.

[0054] Figure 6A is a top view of a bracket structure 312 according to several embodiments. Figures 6B and 6C are top views of an electronic device 300 in which underfill bleedout is controlled by the bracket structure 312 according to several embodiments. The plurality of substrates include a first substrate 202, a second substrate 602, a third substrate 604, and a fourth substrate 606. Each of the plurality of substrates is positioned at the respective location on the support substrate 204. In some embodiments, depending on the location of an electronic component 308 positioned close to the plurality of substrates, a plurality of control edges 608 of the plurality of substrates are selected for bleedout control. In some embodiments, a single bracket structure 312 is designed based on the location of the support substrate 204 on the plurality of substrates and the plurality of control edges 608. In other words, a single bracket structure 312 includes at least four openings 202', 602', 604', and 606' configured to adapt to substrates 202, 602, 604, and 606, respectively.

[0055] The bracket structure 312 is spaced a distance S from each of the multiple control edges 608 (e.g., 608A-608G). In some embodiments, the distances of the bracket structure 312 from each of the multiple control edges 608 are identical. Alternatively, in some embodiments, at least two of the distances between the bracket structure 220 and the multiple control edges 608 are different. The underfill material 212 is applied sequentially around or near the periphery of the multiple substrates. Bleed-out of the underfill material under different substrates 202 and 602-606 is automatically controlled by the bracket structure 220. Specifically, the underfill material 212 extends beyond the multiple control edges 608 based on the distance defined between the bracket structure 220 and the multiple control edges 608. The remaining edges of substrates 202 and 602-606 are complementary to the multiple control edges 608 and bleed out with a width W that is not controlled by the bracket structure 220. BO This corresponds to the bleed-out region 218 having the following characteristics. After the underfill material 212 has cured, the bracket structure 220 is removed from the support substrate 204, and the bleed-out adjacent to the multiple control edges 608 is controlled according to the bracket structure 220.

[0056] Referring to Figure 6B, in some embodiments, the upper surface 204A of the support substrate 204 includes a plurality of alignment marks 506. When the bracket structure 220 is placed on the support substrate 204, the bracket structure 220 is aligned with the plurality of alignment marks on the upper surface 204A of the support substrate 204, and the internal structure of the bracket structure 220 is automatically aligned with substrates 202 and 602-606.

[0057] Figure 7 is a flowchart of an example of a method 700 for controlling underfill bleed-out in an electronic device 300 according to several embodiments. The method 700 is carried out to manufacture an electronic device 300 (Figures 3C, 4E, and 4F) including a first substrate 202 and a support substrate 204. The first substrate 202 is placed on the support substrate 204 (operation 702). A bracket structure 220 is placed on the support substrate 204 at a first distance S1 from the first substrate 202 (operation 704). Underfill material 212 is applied to the support substrate 204 (operation 706). At least a portion of the underfill material 212 has an upright edge 212A (Figures 4E and 4F) at a first distance L1 (e.g., equal to the first distance S1) from the first substrate 202. The bracket structure 220 automatically controls the bleed-out of the underfill material 212 (operation 708). In some embodiments, upon determining that the underfill material 212 has substantially cured, the bracket structure 220 is removed from the support substrate 204 (operation 710).

[0058] In some embodiments, when the first substrate 202 is placed on the support substrate 204, the first substrate 202 is electrically coupled to the support substrate 204 via one or more conductive connectors 210 located between the opposing surfaces 202A and 204A of the first substrate 202 and the support substrate 204 (operation 712).

[0059] In some embodiments, the first substrate 202 has multiple edges, and the bracket structure 220 is positioned close to at least a first subset of the multiple edges of the first substrate 202, with a first spacing S1 between them. The bracket structure 220 controls the bleed-out of the underfill material 212 from the first subset of the multiple edges of the first substrate 202. Examples of the first subset of multiple edges include, but are not limited to, a portion of an edge (e.g., 1 / 2), one edge, 1.5 edges (Figure 5A), two edges, three edges (Figure 5B), four edges, a dispersed portion of an edge (Figure 5C), or a combination thereof. The bracket structure 220 optionally includes a single structure or a set of unconnected structures for controlling the bleed-out of the underfill material 212 from the first subset of the multiple edges of the first substrate 202. Furthermore, in some embodiments, the first spacing S1 is less than a predetermined first spacing limit (e.g., 1 mm).

[0060] In addition, in some embodiments, the underfill material 212 is applied to at least a second subset of multiple edges of the first substrate 202, the second subset of edges differs from the first subset of edges in that they do not overlap. Alternatively, in some embodiments, the underfill material 212 is applied to at least a second subset of multiple edges of the first substrate 202, the second subset of edges differs from the first subset of edges in that they partially overlap. In one example, the underfill material 212 is applied to a first subset of multiple edges of the first substrate 202.

[0061] In some embodiments, at least a portion of the bracket structure 220 is positioned close to a first subset of multiple edges of the first substrate 202, and at least a portion of the bracket structure 220 is positioned close to a threshold height H associated with a first interval S1. T It has a higher height H. The larger the first interval S1, the higher the threshold height H. TThe threshold height H is small. Conversely, the height H of the bracket structure 220 needs to be increased so that the underfill material 212 does not overflow from the bracket structure 220, so the smaller the first interval S1, the smaller the threshold height H. T It's big.

[0062] In some embodiments (Figure 5A), the bracket structure 220 is positioned close to a first edge (e.g., right edge 202R) of the first substrate 202 (operation 714), with a first gap S1 between them, to control the bleed-out of the underfill material 212 from the first edge 202 of the first substrate. The underfill material 212 is applied to at least one of the corners (e.g., 304A-1), the first edge, and the second edge (e.g., left edge 202L) of the first substrate 202 (operation 716). The second edge is different from the first edge. Furthermore, in some embodiments (Figure 5A), the bracket structure 220 does not extend close to a third edge (e.g., top edge 202T) of the first substrate 202 (operation 718), and the third edge is different from the first edge. After the underfill material 212 is applied and cured, the underfill material 212 bleeds out beyond the third edge with a bleed-out width W. BO It persists. Bleed-out width W BO However, the distance S1 between the bracket structure 220 and the first substrate 202 is greater than the distance S1 (operation 720).

[0063] In some embodiments (Figure 3B), the bracket structure 220 is positioned close to the first and second edges of the first substrate 202 to control the bleed-out of the underfill material 212 along the first and second edges of the first substrate 202. The bracket structure 220 has a first spacing S1 from the first edge (e.g., the left edge 202L in Figure 3B) and a second spacing S2 from the second edge (e.g., the right edge 202R in Figure 3B), where the second spacing S2 is greater than the first spacing S1.

[0064] In some embodiments, the first substrate 202 includes a semiconductor package (operation 722), and the support substrate 204 includes a printed circuit board (PCB). In some embodiments, the first substrate 202 includes a semiconductor chip (operation 724), and the support substrate 204 includes a semiconductor package, and together with the first substrate 202, they form a system-in-package (SiP).

[0065] In some embodiments (Figure 6B), the second substrate 602 is placed on the support substrate 204. The bracket structure 220 extends near the second substrate 602 and is spaced a second apart by a second distance S2 from it. After the first substrate 202 and the second substrate 602 are in place, the underfill material 212 is applied sequentially to the first substrate 202 and the second substrate 602. Bleed-out of the underfill material 212 under the second substrate 602 is automatically controlled by the bracket structure 220.

[0066] In some embodiments, the upper surface 204A of the support substrate 204 includes alignment marks 506 (Figures 5B and 6B). The first substrate 202 is positioned on the support substrate 204 by aligning the bracket structure 220 with the alignment marks 506 on the upper surface of the support substrate 204 and holding the bracket structure 220 on the support substrate 204 by fastening structures (e.g., opening slots 402 in Figure 4C), adhesive, or external force.

[0067] In some embodiments, the bracket structure 220 has a portion configured to facilitate removal of the bracket structure 220 from the support substrate 204 after the underfill material 212 has been substantially cured.

[0068] In some embodiments, the bracket structure 220 is manufactured from stainless steel. In some embodiments, the bracket structure 220 is manufactured from any other suitable material.

[0069] It should be understood that the specific sequence of operations described in Figure 8 is illustrative only and is not intended to indicate that it is the only sequence in which the operations can be performed. Those skilled in the art will be aware of various methods for controlling the bleed-out of the underfill material beneath the substrate. In addition, it should be noted that the details of the other processes described above with reference to Figures 1-7 also apply to method 800 described above with reference to Figure 8. For the sake of brevity, these details will not be repeated here.

[0070] The terms used in the descriptions of the various implementations described herein are intended solely to describe a particular implementation and are not intended to limit it. As used in the descriptions of the various implementations and the appended claims, the singular forms "a, an" and "the" are intended to include the plural unless the context explicitly states otherwise. The terms "and / or" as used herein are understood to mean and include any and all possible combinations of one or more of the enumerated items relating to the specification. Where used in this specification, the terms "includes, including" and "comprises and / or comprising" indicate the presence of a claimed function, integer, step, operation, element, and / or component, but are not understood to exclude the presence or addition of one or more other functions, integers, steps, operations, elements, components, and / or groups thereof. In addition, the terms "first," "second," etc., may be used herein to describe various elements, but these elements are not limited to these terms. These terms are used solely to distinguish one element from another use.

[0071] As used herein, the term "if" is to be interpreted, depending on the context, as to mean "when," "upon," "in response to a decision," "in response to detection," or "according to a decision." Similarly, the phrase "when it is decided" or "when the 'statement or event' is detected" is to be interpreted, depending on the context, as to mean "when it is decided," "in response to a decision," "when the 'statement or event' is detected," "in response to the detection of the 'statement or event'," or "according to the decision that the 'statement or event' was detected."

[0072] The above description, intended for interpretation, describes specific embodiments. However, the above descriptive consideration is not intended to be exhaustive or to limit the claims to only the disclosed forms. In light of the above teachings, many modifications and variations are possible. The embodiments have been selected and described in order to be understood by those skilled in the art, by best interpreting the principles of operation and practical applications.

[0073] While various drawings illustrate numerous logical stages in a specific order, the order-independent stages may be rearranged, and other stages may be combined or divided. Although some rearrangements or other groupings have been specifically mentioned, other rearrangements or groupings are obvious to those skilled in the art, and therefore the rearrangements and groupings presented herein are not an exhaustive list of alternative forms. Furthermore, it should be recognized that the stages can be implemented in hardware, firmware, software, or any combination thereof.

Claims

1. A method for controlling underfill bleed-out, Placing the first substrate on the support substrate, The bracket structure is arranged on the support substrate at a first interval from the first substrate, Applying an underfill material to the support substrate, A method comprising automatically controlling the bleed-out of the underfill material by the bracket structure.

2. The method according to claim 1, further comprising removing the bracket structure from the support substrate in response to the determination that the underfill material has been substantially cured.

3. The first substrate has multiple edges, The bracket structure is positioned close to at least a first subset of the plurality of edges of the first substrate, with a first spacing between them. The method according to claim 1 or 2, wherein the bracket structure controls the bleed-out of the underfill material of the first subset of the plurality of edges of the first substrate.

4. The method according to claim 3, wherein the underfill material is applied to at least a second subset of the plurality of edges of the first substrate, and the second subset of the plurality of edges is different from and does not overlap with the first subset of the plurality of edges.

5. The method according to claim 3 or 4, wherein the underfill material is applied to at least a second subset of the plurality of edges of the first substrate, and the second subset of the plurality of edges differs from and partially overlaps with the first subset of the plurality of edges.

6. The method according to any one of claims 3 to 5, wherein the underfill material is applied to a first subset of the plurality of edges of the first substrate, at least a portion of the bracket structure is positioned close to the first subset of the plurality of edges of the first substrate, and at least a portion of the bracket structure has a height higher than the threshold height associated with the first interval.

7. The bracket structure is positioned close to the first edge of the first substrate and separated by a first gap therefrom, and controls the bleed-out of the underfill material from the first edge of the first substrate. The method according to any one of claims 1 to 6, wherein the underfill material is applied to at least one of the corners, first edges, and second edges of the first substrate, the second edge being different from the first edge.

8. The bracket structure is positioned close to the first and second edges of the first substrate and controls the bleed-out of the underfill material along the first and second edges of the first substrate. The method according to any one of claims 1 to 6, wherein the bracket structure has a first interval from the first edge and a second interval from the second edge, the second interval being greater than the first interval.

9. The method according to any one of claims 1 to 8, wherein arranging the bracket structure on the support substrate further includes holding the bracket structure on the support substrate by a fastening structure, adhesive, or external force.

10. The method according to any one of claims 1 to 9, wherein the bracket structure has a portion configured to facilitate removal of the bracket structure from the support substrate after the underfill material has been substantially cured, and is made of stainless steel.

11. Support substrate and A first substrate placed on a support substrate, An underfill material applied between the support substrate and the first substrate, wherein at least a portion of the underfill material has an upright edge at a first distance from the first substrate, An electronic device equipped with the following features.

12. The electronic device according to claim 11, wherein the first substrate is electrically coupled to the support substrate via one or more conductive connectors located between the opposing surfaces of the first substrate and the support substrate.

13. The first substrate has multiple edges, The electronic device according to claim 11 or 12, wherein the upright edge of the underfill material is located near at least a portion of the edges, an edge, two, three, or four edges, or a combination thereof.

14. The electronic device according to claim 13, wherein the first distance is less than a predetermined first interval limit.

15. The underfill material has a first portion and a second portion, The first portion has a first upright edge at a first distance from the first substrate, and the second portion has a second upright edge at a second distance from the first substrate. The electronic device according to any one of claims 11 to 14, wherein the first distance is greater than the second distance and the first upright edge is lower than the second upright edge.

16. After the underfill material is applied and cured, the underfill material extends beyond the third edge in the bleed-out range and does not have the upright edge close to the third edge. The electronic device according to any one of claims 11 to 15, wherein the bleed-out range is greater than the first distance.

17. The electronic device according to any one of claims 11 to 16, wherein the first substrate includes a semiconductor package, and the support substrate includes a printed circuit board (PCB).

18. The electronic device according to any one of claims 11 to 16, wherein the first substrate includes a chip, and the support substrate includes a semiconductor package, and together with the first substrate, forms a system-in-package (SiP).

19. The electronic device according to any one of claims 11 to 18, further comprising a second substrate disposed on the support substrate, wherein the underfill material is applied between the support substrate and the second substrate and has a second upright edge at a second distance from the second substrate.

20. The electronic device according to any one of claims 11 to 19, wherein the upper surface of the support substrate includes alignment marks configured to facilitate aligning the bracket structure with the upper surface of the support substrate.

Images