Image sensor package and camera device including the same.

Abstract

An image sensor package according to one embodiment of the present invention includes a plate, a circuit board disposed on the plate and including a hole, an image sensor disposed on the plate and disposed in the hole, a connecting member disposed on the circuit board and the image sensor, and a filter disposed on the connecting member, wherein a first groove is formed on the upper surface of the image sensor, a second groove is formed on the upper surface of the circuit board, and the connecting member includes a first adhesive layer disposed in the region from the first groove to the second groove, a conductive pattern layer disposed on the first adhesive layer, and a second adhesive layer disposed on the conductive pattern layer.

Description

Technical Field

[0001] The present invention relates to a camera device, and more particularly to an image sensor package and a camera device including the same.

Background Art

[0002] A camera is a device that captures a subject in a photograph or video, and is mounted on a portable device, a drone, a vehicle, etc. With the trends of full screen and narrow bezel in portable devices, as well as ultra-high resolution, multi-cameras, zoom functions, and 5G modules, further miniaturization and high performance of camera devices are required.

[0003] According to a general camera device, an image sensor is disposed on a printed circuit board, the image sensor and the printed circuit board are wire-bonded, an IR (infrared) filter is disposed on the image sensor, and a lens assembly may be disposed on the IR filter.

[0004] On the other hand, due to the need for a high CRA (chief ray angle), the flange back length (FBL), which is the distance from the lens assembly to the image sensor, tends to be short. Structurally, an IR filter must be disposed within the FBL. Also, in the case of a camera device having an autofocus function, additional space is required for the optical system within the lens assembly to move toward the image sensor. In order to implement a short FBL, it is important to reduce the thickness of the remaining structures excluding the IR filter.

[0005] Also, due to the need for high resolution, the area of the image sensor tends to be large, and accordingly, the area of the printed circuit board also becomes large. As the area of the printed circuit board increases, problems such as heat generation during driving of the camera device and bending of the printed circuit board due to the movement of the optical system may become more significant.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The technical problem that this invention aims to solve is to provide a compact, manufacturable, highly durable, and robust image sensor package and a camera device including the same. [Means for solving the problem]

[0007] An image sensor package according to one embodiment of the present invention includes a plate, a circuit board disposed on the plate and including a hole, an image sensor disposed on the plate and disposed in the hole, a connecting member disposed on the circuit board and the image sensor, and a filter disposed on the connecting member, wherein a first groove is formed on the upper surface of the image sensor and a second groove is formed on the upper surface of the circuit board, and the connecting member includes a first adhesive layer disposed in the region from the first groove to the second groove, a conductive pattern layer disposed on the first adhesive layer, and a second adhesive layer disposed on the conductive pattern layer.

[0008] The upper surface of the first adhesive layer includes a flat surface and a concave surface, the concave surface including a first recess located in the first groove, a second recess located in the second groove, and a third recess between the first and second recesses, and the conductive pattern layer may be located on the concave surface.

[0009] The height of the flat surface may be greater than the height of the third recess, and the height of the third recess may be greater than the heights of the first recess and the second recess.

[0010] The width of the first recess may be smaller than the width of the first groove, and the width of the second recess may be smaller than the width of the second groove.

[0011] The conductive pattern layer includes a first electrode disposed in the first recess, a second electrode disposed in the second recess, and a connecting electrode disposed in the third recess to connect the first electrode and the second electrode. The first groove and the first electrode are separated from each other by the first adhesive layer, the second groove and the second electrode are separated from each other by the first adhesive layer, the image sensor and the first electrode are electrically connected by the first adhesive layer, and the circuit board and the second electrode may be electrically connected by the first adhesive layer.

[0012] The thickness of the first electrode and the second electrode may be 1.5 times or more the depth of the first groove and the second groove, respectively.

[0013] The image sensor, the first recess, the first electrode, and the filter may be superimposed perpendicularly to each other, and the circuit board, the second recess, the second electrode, and the filter may be superimposed perpendicularly to each other.

[0014] The first adhesive layer includes a first hole formed in a region corresponding to the center of the image sensor, and the conductive pattern layer may be arranged around the region in which the first hole is formed.

[0015] The second adhesive layer includes a second hole formed to correspond to the first hole in the first adhesive layer, and the filter can face the image sensor directly in the optical axis direction.

[0016] The first adhesive layer may include an anisotropic conductive layer.

[0017] The circuit board includes a first rigid substrate disposed on the plate, a flexible substrate disposed on the first rigid substrate, and a second rigid substrate disposed on the flexible substrate, wherein the second groove may be formed on the second rigid substrate.

[0018] A camera device according to an embodiment of the present invention includes an image sensor package and a lens assembly disposed on the image sensor package, wherein the image sensor package includes a plate, a circuit board disposed on the plate and including a hole, an image sensor disposed on the plate and disposed in the hole, a connecting member disposed on the circuit board and the image sensor, and a filter disposed on the connecting member, wherein a first groove is formed on the upper surface of the image sensor, a second groove is formed on the upper surface of the circuit board, and the connecting member includes a first adhesive layer disposed in the region from the first groove to the second groove, a conductive pattern layer disposed on the first adhesive layer, and a second adhesive layer disposed on the conductive pattern layer.

[0019] An image sensor package according to an embodiment of the present invention includes a plate, a circuit board disposed on the plate and including a hole, an image sensor disposed on the plate and disposed within the hole, a connecting member disposed on the circuit board and the image sensor, and a filter disposed on the connecting member, wherein the connecting member includes a first adhesive layer disposed on the circuit board and the image sensor; a conductive pattern layer disposed on the first adhesive layer; and a second adhesive layer disposed on the conductive pattern layer, and the conductive pattern layer includes a first protrusion protruding toward the circuit board and a second protrusion protruding toward the image sensor.

[0020] An image sensor package according to an embodiment of the present invention includes a plate, a circuit board disposed on the plate and including a hole, an image sensor disposed on the plate and placed in the hole, a connecting member disposed on the circuit board and the image sensor, and a filter disposed on the connecting member, wherein the connecting member includes a first adhesive layer disposed on the circuit board and the image sensor and including a first hole formed on the image sensor, a second adhesive layer disposed on the circuit board and the image sensor and overlapping the first adhesive layer, and a conductive pattern layer disposed between the first adhesive layer and the second adhesive layer.

[0021] The filter can be attached onto the second adhesive layer.

Advantages of the Invention

[0022] According to the embodiments of the present invention, a camera device with a simple structure, a simple manufacturing process, and being miniaturized can be obtained. In particular, according to the embodiments of the present invention, a camera device with a small FBL can be obtained. Also, according to the embodiments of the present invention, a camera device with minimized flexure of the circuit board can be obtained.

Brief Description of the Drawings

[0023] [Figure 1] FIG. 1 is an exploded perspective view of a camera device according to an embodiment of the present invention.

[0024] [Figure 2] FIG. 2 is a perspective view of a camera device according to an embodiment of the present invention.

[0025] [Figure 3] FIG. 3 is a cross-sectional view of a camera device according to an embodiment of the present invention.

[0026] [Figure 4] FIG. 4 is a perspective view of an image sensor package according to an embodiment of the present invention.

[0027] [Figure 5] FIG. 5 is an exploded perspective view of an image sensor package according to an embodiment of the present invention.

[0028] [Figure 6] FIG. 6 is a cross-sectional view taken along the A-A' direction of FIG. 4.

[0029] [Figure 7] FIG. 7 is a cross-sectional view taken along the B-B' direction of FIG. 4.

[0030] [Figure 8]Figure 8 is a partially enlarged cross-sectional view of the image sensor package shown in Figure 4.

[0031] [Figure 9] Figure 9 is a cross-sectional view of an image sensor package according to another embodiment of the present invention.

[0032] [Figure 10] Figure 10 is a perspective view of the second plate included in the image sensor package shown in Figure 9.

[0033] [Figure 11] Figure 11 is a perspective view of a portable terminal device including a camera device according to an embodiment of the present invention.

[0034] [Figure 12] Figure 12 is a diagram showing the configuration of the portable terminal shown in Figure 11. [Modes for carrying out the invention]

[0035] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0036] However, the technical concept of the present invention is not limited to the embodiments described, but can be embodied in a variety of different forms, and within the scope of the technical concept of the present invention, one or more of the components between the embodiments can be selectively combined and substituted for each other.

[0037] Furthermore, unless explicitly defined, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a way that can be generally understood by a person with ordinary skill in the art to which the present invention pertains. Terms that are commonly used, such as those defined in dictionaries, may be interpreted in consideration of their meaning in the context of the relevant art.

[0038] Furthermore, the terms used in the embodiments of the present invention are for illustrative purposes only and do not limit the present invention.

[0039] In this specification, the singular form may also include the plural form unless otherwise specified in the text, and where it is written "A and / or at least one of B and C," it may include one or more of all possible combinations of A, B, and C.

[0040] Furthermore, when describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., can be used.

[0041] Such terminology is merely used to distinguish one component from another, and does not limit the essence, order, or procedure of the component in question.

[0042] Furthermore, when it is stated that one component is “linked,” “joined,” or “connected” to another component, this includes not only cases where the component is directly linked, joined, or connected to the other component, but also cases where it is “linked,” “joined,” or “connected” by another component that lies between it and the other component.

[0043] Furthermore, when it is stated that something is formed or positioned "above or below" each component, "above or below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or positioned between the two components. Also, when expressed as "above or below," it can include not only the upward direction but also the downward direction relative to one component.

[0044] The following describes an image sensor package and a camera device including the same according to an embodiment of the present invention, with reference to the attached drawings. For convenience of explanation, in each drawing, the x-axis and y-axis refer to directions perpendicular to the z-axis, which is the optical axis (OA) direction. The x-axis direction may be referred to as the first direction, the y-axis direction as the second direction, and the z-axis direction as the third direction.

[0045] A camera device according to an embodiment of the present invention may include an image stabilization function. The image stabilization function means a function that moves the lens in a direction perpendicular to the optical axis or tilts the lens with respect to the optical axis in order to cancel out vibrations or movements caused by the user's hand tremors.

[0046] A camera device according to an embodiment of the present invention may include an autofocus function. The autofocus function means a function that automatically adjusts the focus on a subject by moving the lens along the optical axis according to the distance to the subject in order to obtain a clear image of the subject.

[0047] Figure 1 is an exploded perspective view of a camera device according to an embodiment of the present invention, Figure 2 is a perspective view of a camera device according to an embodiment of the present invention, and Figure 3 is a cross-sectional view of a camera device according to an embodiment of the present invention.

[0048] Referring to Figures 1 to 3, the camera device 1000 includes an image sensor package 100, a lens drive device 200, and a lens assembly 300.

[0049] Here, the camera device 1000 may be represented as a camera module, imager, or camera.

[0050] The lens assembly 300 can be represented by a lens, lens section, lens module, optical system, etc. The lens assembly 300 includes at least one lens and has a predetermined field of view and focal length, capable of refracting incident light and transmitting it to the image sensor package 100. The lens assembly 300 is coupled to a lens drive device 200 and can be moved by the lens drive device 200. If the lens assembly 300 includes multiple lenses, each lens can be aligned with respect to a central axis to form an optical system. Here, the central axis may be the same as the optical axis of the optical system.

[0051] The lens assembly 300 is positioned in the aperture of the lens drive unit 200 and can be moved in the optical axis direction by the lens drive unit 200.

[0052] The lens drive unit 200 may be either an AF (Auto Focus) lens drive unit or an OIS (Optical Image Stabilizer) lens drive unit. An AF lens drive unit may mean a lens drive unit that performs only the autofocus function. An OIS lens drive unit may mean a lens drive unit that performs both the autofocus function and the OIS (Optical Image Stabilizer) function.

[0053] The lens drive unit 200 may include a base 210, a housing 220 positioned on the base 210, a bobbin 230 positioned inside the housing 220 for mounting the lens assembly 300, a plurality of coils (not shown) positioned on the bobbin 230, a plurality of magnets (not shown) positioned in the housing 220 and facing the plurality of coils, a guide member (not shown) for guiding the movement of at least one of the bobbin 230 and the housing 220, and a cover member 240 positioned on the base 210 to cover the internal configuration of the lens drive unit 200.

[0054] The guide member may be a ball member, a pin member, or an elastic member, but is not limited thereto. Although it is described that the coil is placed on the bobbin 230 and the magnet is placed on the housing 220, it is not limited thereto; the magnet may be placed on the bobbin 230 and the coil on the housing 220.

[0055] Such a lens drive unit 200 is placed on the image sensor package 100. For this purpose, an adhesive member is placed between the lower surface of the base 210 of the lens drive unit 200 and the image sensor package 100, through which the lens drive unit 200 and the image sensor package 100 can be joined. Here, the adhesive member may be an adhesive containing epoxy resin or silicone resin. Alternatively, the adhesive member may be in the form of a film on which an adhesive containing epoxy resin or silicone resin is applied to both sides.

[0056] The lens drive unit 200 is positioned on the image sensor package 100 and can receive electrical signals from the circuit board 130 of the image sensor package 100. To this end, the lens drive unit 200 further includes terminals 260, which can be electrically connected to the circuit board 130 of the image sensor package 100. For example, the lens drive unit 200 may include an FPCB (flexible printed circuit board) 270, and terminals 260 extending from the FPCB 270 may be positioned on the side of the base 210 of the lens drive unit 200. Thereafter, terminals 260 of the lens drive unit 200 can be electrically connected to the circuit board 130 of the image sensor package 100 by solder. In this specification, "electrically connected" means either being electrically connected by direct physical contact or being electrically connected using a conductive medium.

[0057] The signal applied to terminal 260 of the lens drive device 200 may be a drive signal for a coil located in the housing 220 or bobbin 230. The drive signal may be in the form of current or voltage and may include at least one of a DC signal or an AC signal. If the lens drive device 200 is an AF lens drive device, the bobbin 230 on which the lens assembly 300 is mounted can move in the optical axis direction due to the interaction between the coil to which the drive signal is applied and the magnet located opposite it.

[0058] Although not shown in the diagram, the lens drive unit 200 may further include a sensing magnet and a Hall sensor for driving AF feedback.

[0059] Figure 4 is a perspective view of an image sensor package according to an embodiment of the present invention, Figure 5 is an exploded perspective view of an image sensor package according to an embodiment of the present invention, Figure 6 is a cross-sectional view taken along the A-A' direction in Figure 4, Figure 7 is a cross-sectional view taken along the B-B' direction in Figure 4, and Figure 8 is an enlarged cross-sectional view of the image sensor package in Figure 4.

[0060] Referring to Figures 4 to 8, the image sensor package 100 includes a plate 110, an image sensor 120 placed on the plate 110, a circuit board 130 placed on the plate 110 so as to surround the image sensor 120, a connecting member 190 placed on the image sensor 120 and the circuit board 130, and a filter 150 attached to the connecting member 190. That is, the circuit board 130 is placed on the plate 110 and includes a hole, and the image sensor 120 is placed on the plate 110 and positioned within the hole in the circuit board 130.

[0061] Here, the plate 110 can have higher rigidity (stiffness) than the image sensor 120 and the circuit board 130. As a result, if the area of ​​the circuit board 130 tends to increase in accordance with the area of ​​the image sensor 120, even if the lens assembly 300 is repeatedly moved by the drive of the lens drive device 200, the plate 110 supports the circuit board 130, thus preventing the circuit board 130 from bending. For this reason, the plate 110 may be referred to as a reinforcing member or reinforcing plate.

[0062] Since the plate 110 has higher rigidity than the image sensor 120 and the circuit board 130, the plate 110 can be made of a metal material. In this case, the heat generated from the image sensor 120 and the circuit board 130 can be released to the bottom of the image sensor package 100 through the plate 110.

[0063] In this case, an adhesive member 160 may be further placed between the plate 110, the image sensor 120, and the circuit board 130. The image sensor 120 and the circuit board 130 can be fixed onto the plate 110 by the adhesive member 160. In this case, the adhesive member 160 may include, but is not limited to, epoxy resin or silicone resin. In addition to epoxy resin or silicone resin, the adhesive member 160 may further include a thermally conductive inorganic filler, such as aluminum oxide or boron nitride. Alternatively, the adhesive member 160 may include thermal grease. With this, the heat generated from the image sensor 120 and the circuit board 130 can be transferred to the plate 110 through the adhesive member 160.

[0064] According to an embodiment of the present invention, the circuit board 130 is arranged to surround the image sensor 120, and the image sensor 120 and the circuit board 130 are electrically connected via a connecting member 190. The image sensor 120 collects incident light to generate an image signal, and the semiconductor element used in the image sensor 120 may be a CCD (Charged Coupled Device) sensor, a CMOS (Complementary Metal-Oxide Semiconductor) sensor, or a semiconductor element that captures an image of a person or object and outputs an electrical signal.

[0065] The image sensor 120 may include a plurality of pixels arranged in a matrix. Each pixel may include a photoelectric conversion element and at least one transistor for sequentially outputting the voltage level of the photoelectric conversion element. The region where the plurality of pixels are arranged may be the active area 122 of the image sensor 120. The active area of ​​the image sensor 120 may be combined with the light-receiving section. The image sensor 120 may further include an inactive area 124 surrounding the active area 122.

[0066] The circuit board 130 may be an RPCB (Rigid Printed Circuit Board), an FPCB (Flexible Printed Circuit Board), an RFPCB (Rigid Flexible Printed Circuit Board), or a ceramic printed circuit board. Various passive elements 132 can be arranged on the circuit board 130. For example, a MLCC (multi-layer ceramic capacitor) can be arranged on the circuit board 130. As illustrated, as illustrated in the embodiment of the present invention, if the circuit board is an RFPCB, the circuit board 130 may include two rigid areas RA1 and RA2 and a flexible area (FA) arranged between them. In this case, the image sensor 120, filter 150, lens drive device 200, and lens assembly 300 are arranged in one rigid area RA1, other components such as terminals are arranged in the other rigid area RA2, and the flexible area FA may be arranged between one rigid area RA1 and the other rigid area RA2.

[0067] In this case, each rigid region may include a first rigid layer (RL1), a flexible layer (FL) placed on the first rigid layer RL1, and a second rigid layer RL2 placed on the flexible layer FL, and the flexible region FL may be connected to the flexible layer FL of the rigid regions RA1 and RA2.

[0068] According to this, the circuit board 130 can be folded by the flexible region FA between the rigid regions RA1 and RA2, and the camera device 1000 can be housed in a folded state within a narrow area.

[0069] According to an embodiment of the present invention, the circuit board 130 is arranged to surround the image sensor 120, and the image sensor 120 and the circuit board 130 are electrically connected through a connecting member 190.

[0070] Referring particularly to Figures 5 and 8, the connecting member 190 includes a first adhesive layer 192, a conductive pattern layer 194 disposed on the first adhesive layer 192, and a second adhesive layer 196 disposed on the conductive pattern layer 194. According to one embodiment of the present invention, the first adhesive layer 192 may be an anisotropic conductive layer. Thus, in this specification, the first adhesive layer 192 can be used interchangeably with an anisotropic conductive layer (192).

[0071] An anisotropic conductive layer is a layer through which electricity flows only in a specific direction, and may be an anisotropic conductive film or an anisotropic conductive paste. An anisotropic conductive layer is a form in which electrically conductive fine particles are dispersed in an adhesive that does not conduct electricity. When the layer is positioned between parts to be joined and then pressed together, electricity can flow in the direction of the press. Examples of fine particles included in an anisotropic conductive layer may be metallic materials such as Au, Ni, or Pd. For example, the fine particles may be in the form of a polymer coated with a metallic material such as Au, Ni, or Pd, followed by an insulating layer coated on the metallic material, but are not limited to this. The adhesive included in the anisotropic conductive layer may include thermosetting resins such as epoxy resins, polyurethane resins, or acrylic resins.

[0072] According to this, the conductive pattern layer 194 can be electrically connected to the circuit board 130 and the image sensor 120 without direct contact.

[0073] The conductive pattern layer 194 contains a conductive metallic material such as Cu and is placed on the upper surface of the first adhesive layer 192. One end of the conductive pattern layer 194 is placed on the upper surface of the first adhesive layer 192 which is placed on the image sensor 120, and the other end of the conductive pattern layer 194 is placed on the upper surface of the first adhesive layer 192 which is placed on the circuit board 130, so that the image sensor 120 and the circuit board 130 can be electrically connected to each other.

[0074] On the other hand, according to an embodiment of the present invention, the first adhesive layer 192 includes a first hole 192h formed in a region corresponding to the center of the image sensor 120, and the conductive pattern layer 194 is arranged on the upper surface of the first adhesive layer 192, but may be arranged on the outer edge of the region in which the first hole 192h is formed. In this case, the end of the first hole 192h of the first adhesive layer 192 may be arranged on the non-effective region 124 of the image sensor 120. With this, the first adhesive layer 192 and the conductive pattern layer 194 can connect the image sensor 120 and the printed circuit board 130 without hindering the light-receiving efficiency of the effective region 122 of the image sensor 120.

[0075] In addition, according to an embodiment of the present invention, the second adhesive layer 196 is placed on the image sensor 120 and the circuit board 130 and overlaps with the first adhesive layer 192. The second adhesive layer 196 includes a second hole 196h formed to correspond to the first hole 192h of the first adhesive layer 192. The conductive pattern layer 194 is placed between the first adhesive layer 192 and the second adhesive layer 196. This allows the filter 150 to face the image sensor 120 directly in the optical axis direction and not obstruct the light-receiving efficiency of the effective area 122 of the image sensor 120. The lower surface of the second adhesive layer 196 faces the first adhesive layer 192 and the conductive pattern layer 194 and is bonded to the first adhesive layer 192 and the conductive pattern layer 194, while the upper surface of the second adhesive layer 196 faces the filter 150 and is bonded to the filter 150. According to this, the first adhesive layer 192, the conductive pattern layer 194, and the filter 150 can be stably bonded by the second adhesive layer 196.

[0076] More specifically, referring to Figure 8, a first groove 801 is formed on the upper surface of the image sensor 120, and a second groove 802 is formed on the upper surface of the circuit board 130. The first groove 801 may be formed in the non-effective region 124 of the image sensor 120. The second groove 802 may be formed in the rigid layer RL2 of the circuit board 130. Although not shown, electrode pads may be placed on the bottom surfaces of the first groove 801 and the second groove 802, respectively.

[0077] According to an embodiment of the present invention, the first adhesive layer 192 of the connecting member 190 is placed on the image sensor 120 and the circuit board 130. As shown in Figure 5, the first adhesive layer 192 includes a first hole 192h formed in a region corresponding to the center of the image sensor 120. The area of ​​the first hole 192h may be larger than the area of ​​the effective region 122 of the image sensor 120 and smaller than the total area including the non-effective region 124 of the image sensor 120. That is, the edge of the first hole 192h may be placed on the non-effective region 124 of the image sensor 120. This allows the first adhesive layer 192 to be efficiently placed on electrode pads (not shown) within the non-effective region 124 of the image sensor 120 without reducing the light-receiving efficiency of the effective region 122 of the image sensor 120.

[0078] Referring again to Figure 8, the first adhesive layer 192 is positioned in the region from the first groove 801 of the image sensor 120 to the second groove 802 of the circuit board 130. That is, the first adhesive layer 192 fills the interior of the first groove 801 of the image sensor 120, fills the interior of the second groove 802 of the circuit board 130, and connects the first groove 801 and the second groove 802. The first adhesive layer 192 may be further positioned on the upper surface of the image sensor 120 for a predetermined distance in the direction toward the center of the image sensor 120 from the first groove 801 of the image sensor 120, and further positioned on the upper surface of the circuit board 130 for a predetermined distance in the direction toward the outer edge of the circuit board 130 from the second groove 802 of the circuit board 130. According to this, the entire lower surface of the first adhesive layer 192 can be in direct contact with the upper surface of the image sensor 120 and the upper surface of the circuit board 130. The upper surface of the first adhesive layer 192 includes a flat surface 810 and a concave surface, and the conductive pattern layer 194 can be accommodated in the concave surface. Here, the flat surface 810 can mean an area further positioned on the upper surface of the image sensor 120 for a predetermined distance in the direction toward the center of the image sensor 120 from the first groove 801 of the image sensor 120, and an area further positioned on the upper surface of the circuit board 130 for a predetermined distance in the direction toward the outer edge of the circuit board 130 from the second groove 802 of the circuit board 130. The concave surface can mean an area positioned in the region from the first groove 801 of the image sensor 120 to the second groove 802 of the circuit board 130. The concave surface may include a first recess 811 located in the first groove 801, a second recess 812 located in the second groove 802, and a third recess 813 located between the first recess 811 and the second recess 812.

[0079] On the other hand, the conductive pattern layer 194 includes a protrusion that protrudes toward the image sensor 120 and a protrusion that protrudes toward the circuit board 130. The conductive pattern layer 194 includes a first electrode 821 located in the first recess 811, a second electrode 822 located in the second recess 812, and a connecting electrode 823 located in the third recess 813 that connects the first electrode 821 and the second electrode 822. That is, the protrusion that protrudes toward the image sensor 120 is the first electrode 821 located in the first recess 811, and the protrusion that protrudes toward the circuit board 130 is the second electrode 822 located in the second recess 812. According to embodiments of the present invention, the conductive pattern layer 194 may include a plurality of conductive patterns, each conductive pattern may include the first electrode 821, the second electrode 822, and the connecting electrode 823. According to embodiments of the present invention, the plurality of conductive patterns may be extended in a line from the image sensor 120 toward the circuit board 130. According to this, the conductive pattern layer 194 can be electrically connected to the circuit board 130 and the image sensor 120 without direct contact.

[0080] In this case, the height of the flat surface 810 may be higher than the height of the third recess 813, and the height of the third recess 813 may be higher than the height of the first recess 811 and the height of the second recess 812. Here, the height may be the height relative to a predetermined reference surface. For example, the predetermined reference surface may be the top surface of the plate 110. That is, the thickness of the first adhesive layer 192 in the first recess 811 and the second recess 812 may be less than the thickness of the first adhesive layer 192 in the third recess 813, and the thickness of the first adhesive layer 192 in the third recess 813 may be less than the thickness of the first adhesive layer 192 in the flat surface 810. According to this, the conductive pattern layer 194 can be stably housed in the first recess 811, the second recess 812 and the third recess 813 of the first adhesive layer 192, and the conductive pattern layer 194 can be surrounded by the first adhesive layer 192 and the second adhesive layer 194. Furthermore, electricity can flow between the electrode pad (not shown) of the image sensor 120 and the first electrode 821 in the first recess 811, and between the electrode pad (not shown) of the circuit board 130 and the second electrode 822 in the second recess 812.

[0081] In this case, the width of the first recess 811 is smaller than the width of the first groove 801, the width of the second recess 812 is smaller than the width of the second groove 802, the first groove 801 and the first electrode 821 are separated from each other by the first adhesive layer 192, and the second groove 802 and the second electrode 822 may be separated from each other. Here, width can mean width in the horizontal direction, the first groove 801 and the first electrode 821 are separated from each other in the vertical direction, and the second groove 802 and the second electrode 822 are separated from each other in the vertical direction. In this case, the distance between the bottom surface of the first groove 801 and the bottom surface of the first recess 811 is smaller than the distance between the side surface of the first groove 801 and the side surface of the first recess 811, and the distance between the bottom surface of the second groove 802 and the bottom surface of the second recess 812 may be smaller than the distance between the side surface of the second groove 802 and the side surface of the second recess 812. According to this, the electrode pad (not shown) and the first electrode 811 located on the bottom surface of the first groove 801 of the image sensor 120 are electrically connected to each other by the first adhesive layer 192, and the electrode pad (not shown) and the second electrode 812 located on the bottom surface of the second groove 802 of the circuit board 130 can be electrically connected to each other by the first adhesive layer 192. That is, electricity can flow in opposing directions between the electrode pad (not shown) located on the bottom surface of the first groove 801 of the image sensor 120 and the first electrode 821, and between the electrode pad (not shown) located on the bottom surface of the second groove 802 of the circuit board 130 and the second electrode 822. According to this, the electrode pads of the image sensor 120 and the electrode pads of the circuit board 130 can be connected without wire bonding, so the wire bonding process can be omitted, the problem of wires detaching after wire bonding can be prevented, and the additional length in the Z direction required for wire bonding can be reduced. This can further reduce the FBL.

[0082] According to embodiments of the present invention, the thickness of the first electrode 821 and the second electrode 822 may be 1.5 times or more the depth of the first groove 801 and the second groove 802, preferably 1.5 times or more and 10 times or less, more preferably 1.5 times or more and 5 times or less, and even more preferably 1.5 times or more and 3 times or less. Here, thickness and depth can mean thickness and depth in the vertical direction. With this, the first electrode 821 and the second electrode 822 can be stably positioned with the first adhesive layer 192 in between toward the bottom surfaces of the first groove 801 and the second groove 802, respectively, thereby allowing electricity to flow between the first electrode 821 and the electrode pad (not shown) located on the bottom surface of the first groove 801, and between the second electrode 822 and the electrode pad (not shown) located on the bottom surface of the second groove 802. If the thickness of the first electrode 821 and the second electrode 822 is below the lower limit, the distance between the bottom surface of the first electrode 821 and the first groove 801, and the distance between the bottom surface of the second electrode 822 and the second groove 801 become larger, which can make it difficult for electricity to flow in the direction between the bottom surfaces of the first electrode 821 and the first groove 801, and in the direction between the bottom surfaces of the second electrode 822 and the second groove 801. If the thickness of the first electrode 821 and the second electrode 822 exceeds the upper limit, the thickness of the connecting electrode 813 also increases, which can increase the overall thickness of the image sensor package 100, making it difficult to reduce the FBL.

[0083] In this structure, the image sensor 120, the first recess 811 on the upper surface of the first adhesive layer 192, the first electrode 821, and the filter 150 are superimposed perpendicularly to each other, and the circuit board 130, the second recess 812 on the upper surface of the first adhesive layer 192, the second electrode 822, and the filter 150 can also be superimposed perpendicularly to each other. In this case, when pressure is applied to the first adhesive layer 192 between the first electrode 821 and the image sensor 120 due to the weight of the filter 150, electricity can flow between the first electrode 821 and the electrode pad of the image sensor 120. Similarly, when pressure is applied to the first adhesive layer 192 between the second electrode 822 and the circuit board 130 due to the weight of the filter 150, electricity can flow between the second electrode 822 and the electrode pad of the circuit board 130. According to this, the image sensor 120 and the circuit board 130 can be electrically connected through the conductive pattern layer 194 of the connecting member 190 instead of wire bonding, thereby eliminating the need for additional height for wire bonding and thus enabling a low FBL (Fiber Blocking Level).

[0084] According to the structure of the embodiment of the present invention, the first adhesive layer 192 may include multiple regions with different thicknesses. That is, the thicknesses of the flat surface 810, the first recess 811, and the third recess 813 may differ from each other, and the thicknesses of the flat surface 810, the second recess 812, and the third recess 813 may differ from each other. Furthermore, the conductive pattern layer 194 may include multiple regions with different thicknesses. That is, the thicknesses of the first electrode 821 and the second electrode 822 may differ from the thickness of the connecting electrode 823.

[0085] As mentioned above, the lower surfaces of the image sensor package 100 and the base 210 of the lens drive unit 200 can be bonded to each other by an adhesive member. For this purpose, the adhesive member 180 can be arranged as shown in Figures 4 and 5. The adhesive member 180 includes a hole formed in a region corresponding to the center of the image sensor 120 and can be placed on the circuit board 130. In this case, the adhesive member 180 can be placed between the passive elements 132 and pads 134 of the circuit board 130. This allows for electrical insulation between the passive elements 132 and pads 134 and 136 of the circuit board 130.

[0086] Figure 9 is a cross-sectional view of an image sensor package according to another embodiment of the present invention, and Figure 10 is a perspective view of the second plate included in the image sensor package of Figure 9. Descriptions identical to those explained with reference to Figures 1-8 will be omitted.

[0087] Referring to Figure 9, a second plate 140 may be further arranged on the printed circuit board 130. The second plate 140 may be arranged on the printed circuit board 130 so as to surround the sides of the connecting member 190 and the filter 150.

[0088] The second plate 140 can have higher rigidity (stiffness) than the circuit board 130. As a result, when the area of ​​the circuit board 130 tends to increase in accordance with the area of ​​the image sensor 120, even if the lens assembly 300 is repeatedly moved by the drive of the lens drive device 200, the first plate 110 supports the lower surfaces of the image sensor 120 and the circuit board 130, and the second plate 140 supports the upper surface of the circuit board 130, thus preventing the circuit board 130 from bending. For this reason, the second plate 140 is sometimes referred to as a reinforcing member or reinforcing plate.

[0089] The thermal conductivity of the second plate 140 may be higher than that of the circuit board 130. As a result, the heat generated from the circuit board 130 can be dissipated not only through the first plate 110 but also through the second plate 140 to the top of the image sensor package 100.

[0090] Because the second plate 140 has higher rigidity and higher thermal conductivity than the circuit board 130, the second plate 140 may be made of a metallic material. For example, the second plate 140 may include, but is not limited to, copper, aluminum, stainless steel, etc.

[0091] An adhesive member (not shown) may be further placed between the circuit board 130 and the second plate 140. The adhesive member may further contain a thermally conductive inorganic filler, such as aluminum oxide or boron nitride, in addition to epoxy resin or silicone resin. Alternatively, the adhesive member may contain thermal grease. In this case, heat generated from the circuit board 130 can be transferred to the second plate 140 through the adhesive member.

[0092] The second plate 140 extends to the outer casing of the circuit board 130. That is, the entire outer casing of the circuit board 130 is covered by the second plate 140. As a result, the second plate 140 supports the upper surface of the circuit board 130 up to its casing, thus preventing the circuit board 130 from bending.

[0093] According to an embodiment of the present invention, the second plate 140 may extend to the outer casing of the circuit board 130, and further extend to the side surface of the circuit board 130, with the lower surface of the second plate 140 positioned on the side surface of the circuit board 130 facing the upper surface of the first plate 110. In this case, the first plate 110 may be directly connected to the second plate 140 or connected by an adhesive member (not shown). That is, the circuit board 130 may not be positioned between the lower surface of the second plate 140 positioned on the side surface of the circuit board 130 and the upper surface of the first plate 110 positioned facing it. With this configuration, the second plate 140 can protect the side surface of the circuit board 130 from bending due to external impacts and foreign matter. Furthermore, the rigidity of the image sensor package 100 may be further increased, and heat released from the side surface of the circuit board 130 can be efficiently transferred to the second plate 140, resulting in an excellent heat dissipation effect.

[0094] The thickness of the second plate 140 is 0.1 mm or more and 0.5 mm or less, preferably 0.1 mm or more and 0.4 mm or less, and more preferably 0.1 mm or more and 0.3 mm or less. If the thickness of the second plate 140 is within this numerical range, the minimum distance that must be maintained between the image sensor 120 and the filter 150 is ensured and the FBL can be reduced. If the thickness of the second plate 140 is less than the lower limit of this numerical range, it is not easy to manufacture the second plate 140, and if the thickness of the second plate 140 is greater than the upper limit of this numerical range, the need to reduce the FBL cannot be satisfied.

[0095] The second plate 140 includes a plurality of through holes. The second plate 140 is positioned in a region including the center of the second plate 140 and includes a first through hole 142 in which the image sensor 130 is positioned. In this case, the area of ​​the first through hole 142 is larger than the area of ​​the image sensor 120. When the area of ​​the first through hole 142 is larger than the area of ​​the image sensor 120, the entire effective area of ​​the image sensor 120 can efficiently receive incident light through the first through hole 142.

[0096] The second plate 140 further includes a second through-hole 144 positioned between the first through-hole 142 and the outer casing of the second plate 140. As shown in the figure, there may be multiple second through-holes 144, and the area of ​​each second through-hole 144 may be smaller than the area of ​​the first through-hole 142. As previously mentioned, passive elements 132 are further arranged on the circuit board 130. Passive elements 132 may be, for example, capacitors. Passive elements 132 may be placed inside the second through-holes 144.

[0097] According to this, if the height of the upper surface of the passive element 132 is higher than the height of the upper surface of the second plate 140, the passive element 132 can protrude upward toward the second plate 140 through the second through-hole 144. According to this, there is no need to provide a separate space below the lower surface of the second plate 140 to accommodate the passive element 132, so the FBL can be reduced.

[0098] Although the diagram shows four second through-holes 144, it is not limited to this. The position and number of the second through-holes 144 can be varied in various ways depending on the arrangement of the passive elements 130.

[0099] As described above, the lens drive device 200 of the camera device 1000 according to an embodiment of the present invention includes a plurality of coils and a plurality of magnets, each coil being arranged to face each other. When an electrical signal is applied to each coil, an electrical interaction occurs between each coil and each magnet, which are arranged to face each other, and the lens drive device 200 can be driven to perform an AF function or an OIS function.

[0100] In this configuration, the multiple coils and magnets may be arranged symmetrically with respect to the lens assembly 300. For example, a pair of coils and magnets may be arranged symmetrically with respect to the lens assembly 300. To this end, the terminals 260 for applying electrical signals to each coil may be arranged symmetrically with respect to the lens assembly 300.

[0101] The terminals 260 that apply electrical signals to each coil are electrically connected to the circuit board 130 and receive electrical signals from the circuit board 130. The terminals that apply electrical signals to each coil can be electrically connected to the pads 134 of the circuit board 130 by solder (not shown).

[0102] According to an embodiment of the present invention, the second plate 140 further includes a third-first through-hole 146 positioned between the first through-hole 142 and the first outer casing S1 of the second plate 140, and a third-second through-hole 148 positioned between the first through-hole 142 and the second outer casing S2 of the second plate 140. The third-first through-hole 146 and the third-second through-hole 148 may be positioned symmetrically with respect to the first through-hole 142. A first pad 134 and a second pad 136 are further positioned on the circuit board 130, and the first pad 134 and solder (not shown) on the first pad 134 may be positioned in the third-first through-hole 146, and the second pad 136 and solder (not shown) on the second pad 136 may be positioned in the third-second through-hole 148. For this purpose, the first pad 134 is positioned between the first outer casing of the circuit board 130 corresponding to the first outer casing S1 of the second plate 140 and the image sensor 120, and the second pad 136 is positioned between the second outer casing of the circuit board 130 corresponding to the second outer casing S2 of the second plate 140 and the image sensor 120, and the first pad 134 and the second pad 136 may be positioned symmetrically with respect to the image sensor 120. Here, the first pad 134 and the solder placed on the first pad 134 electrically connect the circuit board 130 to terminals 260 that apply electrical signals to a pair of coils and magnets located on one side of the lens assembly 300, and the second pad 136 and the solder placed on the second pad 136 electrically connect the circuit board 130 to terminals 260 that apply electrical signals to another pair of coils and magnets located on the other side of the lens assembly 300.

[0103] According to this, if the upper surfaces of the solder placed on the first pad 134 and the solder placed on the second pad 136 are higher than the upper surface of the second plate 140, the solder placed on the first pad 134 and the solder placed on the second pad 136 can protrude upward toward the second plate 140 through the third-first through-hole 146 and the third-second through-hole 148. According to this, there is no need to provide a separate space in the second plate 140 to accommodate the solder placed on the first pad 134 and the solder placed on the second pad 136, so FBL can be reduced and the solder placed on the first pad 134 and the solder placed on the second pad 136 can be easily electrically connected to the terminals of the lens drive device 200.

[0104] Alternatively, as shown in Figure 10(b), the third-first through-hole 146 may extend to the first outer rim S1 of the second plate 140, and the third-second through-hole 148 may extend to the second outer rim S2 of the second plate 140. That is, the third-first through-hole 146 may be replaced by a groove formed in the first outer rim S1 of the second plate 140, and the third-second through-hole 148 may be replaced by a groove formed in the second outer rim S2 of the second plate 140.

[0105] Figure 11 is a perspective view of a portable terminal device including a camera device according to an embodiment of the present invention, and Figure 12 is a configuration diagram of the portable terminal device shown in Figure 11.

[0106] Referring to Figures 11 and 12, the portable terminal 1000A (hereinafter referred to as "terminal") may include a main unit 850, a wireless communication unit 710, an A / V input unit 720, a sensing unit 740, an input / output unit 750, a memory unit 760, an interface unit 770, a control unit 780, and a power supply unit 790. The terminal 1000A may also include the camera device described above.

[0107] The main body 850 shown in Figure 11 is in a bar shape, but is not limited to this. It may also have various structures such as a slide type, folder type, swing type, or swirl type in which two or more sub-bodies are connected in a way that allows for relative movement.

[0108] The main unit 850 may include an external case (casing, housing, cover, etc.). For example, the main unit 850 may be divided into a front case 851 and a rear case 852. Various electronic components of the terminal can be housed in the space formed between the front case 851 and the rear case 852.

[0109] The wireless communication unit 710 may be configured to include one or more modules that enable wireless communication between the terminal 1000A and the wireless communication system or between the terminal 1000A and the network on which the terminal 1000A is located. For example, the wireless communication unit 710 may be configured to include a broadcast receiving module 711, a mobile communication module 712, a wireless internet module 713, a short-range communication module 714, and a location information module 715.

[0110] The A / V (Audio / Video) input section 720 is for inputting audio signals or video signals and may include a camera 721 and a microphone 722, etc.

[0111] The camera 721 may include the camera device 1000 according to the embodiment shown in Figures 1 to 10.

[0112] The sensing unit 740 can sense the current state of the terminal 1000A, such as the open / closed state of the terminal 1000A, the position of the terminal 1000A, whether or not there is user contact, the orientation of the terminal 1000A, and the acceleration / deceleration of the terminal 1000A, and generate sensing signals to control the operation of the terminal 1000A. For example, if the terminal 1000A is in the form of a slide phone, it can sense whether or not the slide phone is open or closed. It is also responsible for sensing functions related to whether or not power is supplied by the power supply unit 790, and whether or not external devices are connected to the interface unit 770.

[0113] The input / output unit 750 is for generating inputs or outputs related to vision, hearing, or touch. The input / output unit 750 can generate input data for controlling the operation of the terminal 1000A, and can also display information processed by the terminal 1000A.

[0114] The input / output unit 750 may include a keypad unit 730, a display module 751, an audio output module 752, and a touchscreen panel 753. The keypad unit 730 can generate input data through keypad input.

[0115] The display module 751 may include multiple pixels whose color changes in response to an electrical signal. For example, the display module 751 may include at least one of the following: a liquid crystal display, a thin-film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, or a 3D display.

[0116] The audio output module 752 can output audio data received from the wireless communication unit 710 in call signal reception, communication mode, recording mode, voice recognition mode, or broadcast reception mode, or it can output audio data stored in the memory unit 760.

[0117] The touchscreen panel 753 can convert changes in capacitance caused by a user touching a specific area of ​​the touchscreen into an electrical input signal.

[0118] The memory unit 760 can store programs for processing and controlling the control unit 780, and can temporarily store input / output data (e.g., phone book, messages, audio, still images, photographs, videos, etc.). For example, the memory unit 760 can store images captured by the camera 721, such as photographs or videos.

[0119] The interface unit 770 acts as a passage connecting to external devices connected to the terminal unit 1000A. The interface unit 770 receives data from external devices, receives power supply and transmits it to various components inside the terminal unit 1000A, and enables data inside the terminal unit 1000A to be transmitted to external devices. For example, the interface unit 770 may include a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device equipped with an identification module, an audio I / O (input / output) port, a video I / O (input / output) port, and an earphone port.

[0120] The control unit (controller) 780 can control the overall operation of the terminal device 1000A. For example, the control unit 780 can perform related controls and processing for voice calls, data communications, and video calls.

[0121] The control unit 780 may include a multimedia module 781 for multimedia playback. The multimedia module 781 may be implemented within the control unit 180 or separately from the control unit 780.

[0122] The control unit 780 can perform pattern recognition processing that recognizes handwriting input or drawing input performed on the touchscreen as characters and images, respectively.

[0123] The power supply unit 790 can supply the power necessary for the operation of each component by applying an external or internal power supply under the control of the control unit 780.

[0124] Furthermore, the camera device described above may be applied to electronic devices or optical devices, including terminals. These electronic devices or optical devices may include any one of the following: mobile phones, smartphones, portable smart devices, digital cameras, laptop computers, digital broadcasting terminals, PDAs (Personal Digital Assistants), PMPs (Portable Multimedia Players), and navigation systems. However, the type of optical device is not limited to these; any device for capturing images or photographs may be included in the definition of optical device.

[0125] Although preferred embodiments of the present invention have been described above with reference to the present invention, those skilled in the art should understand that the present invention can be modified and altered in various ways, without departing from the spirit and scope of the invention as described in the following claims.

Claims

1. A plate and A circuit board including a hole is placed on the aforementioned plate, An image sensor is placed on the plate and positioned within the hole, The circuit board and the connecting member arranged on the image sensor, Includes a filter disposed on the connecting member, A first groove is formed on the upper surface of the image sensor. A second groove is formed on the upper surface of the circuit board. The aforementioned connecting member is A first adhesive layer is disposed in the region from the first groove to the second groove, A conductive pattern layer disposed on the first adhesive layer, An image sensor package characterized by comprising a second adhesive layer disposed on the conductive pattern layer.

2. The upper surface of the first adhesive layer includes a flat surface and a concave surface. The concave surface includes a first recess located in the first groove, a second recess located in the second groove, and a third recess between the first and second recesses. The image sensor package according to claim 1, characterized in that the conductive pattern layer is arranged on the concave surface.

3. The image sensor package according to claim 2, characterized in that the height of the flat surface is greater than the height of the third recess, and the height of the third recess is greater than the heights of the first recess and the second recess.

4. The image sensor package according to claim 3, characterized in that the width of the first recess is smaller than the width of the first groove, and the width of the second recess is smaller than the width of the second groove.

5. The conductive pattern layer includes a first electrode disposed in the first recess, a second electrode disposed in the second recess, and a connecting electrode disposed in the third recess that connects the first electrode and the second electrode. The first groove and the first electrode are separated from each other by the first adhesive layer. The second groove and the second electrode are separated from each other by the first adhesive layer. The image sensor and the first electrode are electrically connected by the first adhesive layer. The image sensor package according to claim 4, characterized in that the circuit board and the second electrode are electrically connected by the first adhesive layer.

6. The image sensor package according to claim 5, characterized in that the thickness of the first electrode and the second electrode is 1.5 times or more the depth of the first groove and the second groove, respectively.

7. The image sensor, the first recess, the first electrode, and the filter are superimposed perpendicularly to each other. The image sensor package according to claim 5, characterized in that the circuit board, the second recess, the second electrode, and the filter are superimposed perpendicularly to each other.

8. The first adhesive layer includes a first hole formed in a region corresponding to the center of the image sensor, The image sensor package according to claim 1, characterized in that the conductive pattern layer is arranged on the outer edge of the region where the first hole is formed.

9. The second adhesive layer includes a second hole formed to correspond to the first hole of the first adhesive layer, The image sensor package according to claim 8, characterized in that the filter is directly opposite the image sensor in the optical axis direction.

10. The image sensor package according to claim 1, characterized in that the first adhesive layer includes an anisotropic conductive layer.

Images