Handlers and methods for handling electronic components during the separation of assembled electronic components.

Abstract

The present invention relates to a handler for handling electronic components during the separation of assembled electronic components, comprising a contact surface having a plurality of separated chambers, wherein the separated chambers open to the contact side and have side walls, and at least one central chamber is at least partially surrounded by at least one peripheral chamber, and the at least one central chamber and at least one peripheral chamber have different gas passage openings. The present invention also relates to a method for handling electronic components during the separation of assembled electronic components using such a handler.

Description

Technical Field

[0001] The present invention relates to a handler for handling electronic components during separation of assembled electronic components, including a contact surface having a plurality of separated chambers, the separated chambers being open on the contact side and having side walls. The present invention also relates to a method for handling electronic components during separation of assembled electronic components using such a handler.

Background Art

[0002] At the final stage of electronic component fabrication, electronic components fabricated in an assembled configuration can be separated (singulated, diced) to obtain individual products. An example of such fabrication is the manufacture of semiconductors (ICs). A semiconductor package substrate including a plurality of semiconductor packages is divided into individual semiconductor packages using package singulation. Singulation can be performed by machining a substrate interconnecting the individual products, for example using a rotating saw blade, and the assembled electronic components can be formed by a wafer, lead frame, or substrate. As part of the machining operation, chips and / or other debris will be generated and often a liquid coolant is also used. This can cause sensitive parts of the electronic components to be undesirably contaminated during the separation process. A commonly used solution is to cover sensitive parts of the electronic components with a removable tape that adheres to the sensitive parts of the electronic components during the separation process before the separation process begins. After separation, the tape is removed from the separated electronic components. The attachment and removal of the tape is also a labor-intensive process because the electronic components generally involved are relatively small, generally on the order of a few millimeters in size, for example between 3×3 mm and 20×20 mm, and tend to be even smaller. Therefore, an alternative solution is sought that does not have the limitations of the prior art solution of covering with tape to protect sensitive parts of the electronic components from contamination during the separation process.

Summary of the Invention

[0003] The problem with prior art solutions for protecting sensitive parts of molded electronic components from undesirable contamination during machining is that they are time-consuming and do not always yield the desired results.

[0004] Therefore, the object of the present invention is to overcome these drawbacks and provide a solution that protects sensitive parts of molded electronic components from undesirable contamination during machining of the electronic components, enabling easier and / or cheaper processing and / or better results. [Means for solving the problem]

[0005] To achieve this objective, the present invention provides a handler for handling electronic components during the separation of assembled electronic components, the handler comprising a contact surface having a plurality of separated chambers, the separated chambers opening to the contact side and having side walls, at least one central chamber at least partially surrounded by at least one perimeter chamber, and at least one central chamber and at least one perimeter chamber having different gas passage openings. The central chamber may be surrounded by a single, e.g., circular / coaxial perimeter chamber, but the central chamber may also be partially surrounded by one or more perimeter chambers. The shape of the chambers can be any shape, e.g., circular, elliptical, square, rectangular, hexagonal, etc. Separation of assembled electronic components may be achieved by a framing process, e.g., by a machining process such as sawing or cutting, or alternatively by an etching process such as plasma etching. Fragmentation is achieved from the side of the electronic component facing away from the handler (and thus the side of the electronic component opposite to the side contacted by the handler). In general, during fragmentation, a considerable amount of chips, debris, deposits, or other types of contaminants can be generated. Such contaminants can contaminate semiconductors, and more specifically, sensitive parts of electronic components. The present invention here provides an opportunity to vary the gas pressure levels between a central chamber and at least one corresponding peripheral chamber such that the pressure level in at least one peripheral chamber is lower than the pressure level in the corresponding central chamber. The advantage of such a pressure level difference is that the central chamber can cover and thereby protect sensitive parts of electronic components from contamination. In the peripheral chamber, since the gas pressure level is lower than in the central chamber, further protection against contamination of sensitive parts of electronic components may be provided, in that contaminants near the central chamber will preferentially move towards the peripheral chamber.The suction of contaminants into the (usually depressurized) chamber should preferably be limited as much as possible, but in any case, it is difficult (in fact impossible) to completely avoid contaminants entering the chamber. As long as contaminants enter the surrounding chamber, this does not seriously adversely affect the quality of the electronic component, as long as the contaminants enter only one or more of the surrounding chambers (not the central chamber), since the surrounding chamber does not cover the sensitive parts of the electronic component. Contamination in the surrounding chamber is not so harmful. Most importantly, the central chamber covers the sensitive parts of the electronic component, thus protecting the central chamber from contamination. This effect can be further supported if a higher pressure level than the pressure level of the ambient gas (air) is achieved in the central chamber. The handler according to the present invention not only covers the sensitive parts of the electronic component but also makes it possible to create a pressure level difference that further helps protect the sensitive parts of the electronic component from contamination. Therefore, the new handler can provide a double protective effect on the sensitive parts, thereby providing a high level of protection, and therefore a high level of quality. Further advantages of the handler according to the present invention are that it is easy to position and that it eliminates the need for time-consuming individual covering and removal of covering from sensitive parts of electronic components after fragmentation. Therefore, this handler not only achieves high-quality covering but is also easier to use and saves time compared to prior art covering techniques.

[0006] During the fragmentation process, material from the electronic components can be removed outside the area covered by the central chamber. Therefore, material can be removed at any location outside the area covered by the central chamber. This further includes fragmentation locations (partially) covered by the periphery chamber, in which case the periphery chamber may be used for active removal of debris. Pressure level adjustments in the central and periphery chambers may be automatic, but additional manual adjustments are also possible. The pressure level in the central chamber during processing is preferably lower than the ambient gas (air) pressure level. This facilitates a firm engagement of the electronic components by the handler. The handler may also be equipped with one or more mechanical clamps for mechanically gripping the electronic components.

[0007] In one embodiment, the far side of the chamber's sidewall is located on a single surface. Advantageously, this provides the opportunity to handle electronic components / dies of uniform height. Alternatively, the far side of the chamber's sidewall may be located on various surfaces. Differences in height allow for the handling of electronic component packages with varying heights.

[0008] The sidewalls may include at least a flexible material, an inflexible material, or a combination thereof. The advantage of using a more or less flexible sidewall is that it can adapt to unexpected situations, while the advantage of using an inflexible (rigid) sidewall is that it provides certainty regarding its precise location.

[0009] In another embodiment, the handler may include a stable base with protruding side walls. Gas passage openings in the central and peripheral chambers may pass through the stable base. The stable base makes the handler's position very easy to handle. At least a portion of the stable base may also be covered with a non-flexible material, a flexible material, or a combination thereof. For example, the flexible protruding walls of the material may be made of silicone or rubber material.

[0010] To control the movement of the handler, the handler may include a manipulator for controlling the movement of a contact surface having multiple separate chambers. For example, the manipulator, such as at least a robotic arm or a number of robotic arm manipulators, may be automatically controlled by a programmable control unit. This can improve the accuracy and speed of large-scale individualization manufacturing processes.

[0011] The present invention also provides a handler that may include at least two independently controllable gas pressure level regulators connected to the gas passage openings of at least one central chamber and at least one perimeter chamber. Both the central chamber pressure level and the perimeter chamber pressure level can be reduced to below the perimeter pressure level, but alternatively, at least the central chamber gas pressure level can be raised above the perimeter gas (air) pressure level to minimize the risk of contaminants entering the central chamber. Each gas pressure level regulator of the chamber type is preferably independently controllable with respect to the adjustment of pressure level and / or gas type. Non-limiting examples of gas pressure regulators are pumps, extractors, vents, and low-pressure or over-pressure central gas pipe systems. The gas pressure level regulators can be controlled manually or automatically. The regulators may be controlled, for example, by a mass flow controller with an integrated pressure level regulator device or an electronic pressure level regulator. When multiple central and perimeter chambers are coupled to a single manipulator, as in typical situations, pressure level adjustment may preferably be performed at the individual chamber level. This makes it possible to avoid significant pressure level losses, for example, if one or more positions of the electronic component assembly are open, and / or if one or more chambers are not properly sealed to the electronic component assembly for other reasons. The control unit can also control other parameters used in the piecemaking process of the present invention, such as time, movement, safety control, maintenance, data monitoring, and position (e.g., handler, substrate, individual electronic components, individual chambers, etc.). Advantageously, the control unit can assist the user by having the ability to record, store, and recall specific pressurization procedures, such as various gas types, amounts of pressure levels, and / or specific settings for chamber openings. The control unit can also adjust the piecemaking process.

[0012] In a further embodiment, the handler includes a group of chambers comprising at least one central chamber surrounded by at least one perimeter chamber, the central chamber and the perimeter chambers having different gas passage openings. Each chamber includes at least one gas passage opening. The gas passage openings can deliver different pressure levels to each chamber. In this way, a well-controlled pressure level can be achieved in each chamber.

[0013] The present invention also provides a method for handling electronic components using a handler for handling electronic components according to the present invention during the separation of assembled electronic components, the method comprising: A) bringing an electronic component assembly into contact with the contact side of the handler so that at least one contamination-sensitive assembly portion is covered by a central chamber and at least one peripheral portion less contaminated than the contamination-sensitive portion is covered by at least one peripheral chamber; B) lowering the pressure level of at least one peripheral chamber to a lower pressure level than the ambient pressure level so that the pressure level in at least one central chamber is higher than the pressure level in at least one peripheral chamber; C) separating the assembled electronic components while maintaining a higher pressure level in at least one central chamber than in at least one peripheral chamber; and D) increasing the pressure level in at least one peripheral chamber to release the separated electronic components. In a particular embodiment of this method, during step B), both at least one central chamber and at least one perimeter chamber are brought to a pressure level lower than the ambient pressure level, and during step D), the pressure levels of both at least one central chamber and at least one perimeter chamber are increased. The advantages of this method using the handler assembly according to the present invention have already been stated above and are incorporated here in relation to the method for handling electrical components for piecemaking according to the present invention. The method of the present invention results in enhanced effectiveness and efficiency in preventing contamination of sensitive parts of electronic components during piecemaking (e.g., sawing or cutting). This method is beneficial because it does not require an additional cleaning method step to remove contaminants and / or shielding elements (such as tape) from the piecemade electronic components. This can result in shorter piecemaking cycle times. In a further advantageous application of this method, the contamination-sensitive electronic component parts may be embodied as, for example, sensors, detectors, optical windows, lenses, heat exchange surfaces, microprocessors, magnetic elements, radio frequency sensing elements, or micro-electromechanical systems (MEMs).Contamination-sensitive electronic components are not only protected from contamination by this invention, but also from other contacts (e.g., abrasion, wear, oxidation, etc.) that could adversely affect their quality. This further contributes to the quality of the isolated electronic components. Moreover, it may improve time and performance throughout the entire fractionation cycle.

[0014] In a specific application of the method according to the present invention, during process step C), the pressure level difference between one or more central chambers and one or more ambient chambers is at least 5 mbar. The pressure level in at least one central chamber can be adjusted within the range of [5 to 1024] mbar, and the pressure level in at least one ambient chamber can be adjusted within the range of [5 to 500] mbar. This pressure level difference minimizes the risk of contaminants entering at least one central chamber, as contaminants will preferentially enter at least one ambient chamber first. Furthermore, it is preferable that the pulverized electronic components remain attached to the handler during and after the pulverization process. Therefore, if the central chamber is not at a pressure level below the ambient pressure level during the pulverization process (or during the initial stages of the pulverization process), it is preferable to reduce the pressure level to below the ambient pressure level before the pulverization is complete, so that the handler can continue to grasp the pulverized electronic components.

[0015] In another specific application of the method according to the present invention, the pressure level in the chamber prior to process step C) may be adapted to limit the distortion (warping) of the electronic component assembly. This may be done automatically by using a control unit that receives input regarding the flatness or lack thereof of the electronic component assembly. In this way, improved accuracy of the pieceization process can be achieved.

[0016] The present invention will be further described with reference to non-limiting exemplary embodiments shown in the following figures. Corresponding elements are indicated in the figures by their corresponding reference numerals. [Brief explanation of the drawing]

[0017] [Figure 1] This is a schematic perspective view of a handler according to the present invention, which holds an electronic component. [Figure 2A] This is a schematic cross-sectional view of an electronic component assembly before it is separated into individual components. [Figure 2B-2C] This is a schematic cross-sectional view of a handler according to the present invention, which holds an electronic component assembly during subsequent method steps of the present invention. [Figure 2D] Figures 2B and 2C show schematic cross-sectional views of an electronic component assembly that has been separated according to the steps described. [Figure 3] This is a perspective view of one embodiment of a handler according to the present invention, which includes multiple central chambers. [Figure 4A-4C] These are schematic top views of various alternative embodiments of the central and peripheral chambers used in the handler according to the present invention. [Modes for carrying out the invention]

[0018] Figure 1 shows a schematic cross-sectional view of a handler (100) that holds a molded electronic component package (101) formed by a substrate (108) that holds an electronic component (120) sealed by a sealing material (102). The electronic component (120) has a contamination-sensitive surface portion (121). The handler (100) includes a plurality of chambers (104, 105), namely a central chamber (104) and two peripheral chambers (105). The chambers (104, 105) include side walls (103) that separate the chambers (104, 105) from each other. The central chamber (104) further includes a gas passage opening (106) to allow adjustment of the pressure level within the central chamber (104). Each of the peripheral chambers (105) further includes a gas passage opening (107a, 107b) to similarly allow adjustment of the pressure level within the peripheral chamber (105). The gas passage openings (106, 170a, 170b) are connected to pressure level regulators (not shown) for independently adjusting the pressure levels within the chambers (104, 105). Each pressure level within the chambers (104, 105) can be changed independently of each other. Close contact, preferably near-airtight contact, of the handler (100) with the contact surface (102) of the molded electronic component package (101) allows the pressure levels within the chambers (104, 105) to differ from the ambient pressure level. The pressure level in the central chamber (104) must be higher than the (lower) pressure level in the surrounding chamber (105), preferably at least 5 mbar higher. It is also possible to adjust or adapt the pressure levels in the chambers (104, 105) to limit the warping of the electronic component (101). The pressure level difference between the central chamber (104) and the surrounding chamber (105) protects the central chamber (104) from contamination from the separation process, as contaminants preferentially enter the surrounding chamber (105). As a result, the contamination-sensitive surface portions (121) of the electronic components (101) remain substantially free of contamination.

[0019] Figure 2A shows an assembly of multiple molded electronic components (101) with a common substrate (108) and connected sealing material (102), in which electronic components (120) are embedded. Figure 2A shows an uncut assembly of multiple molded electronic components (101).

[0020] Figures 2B and 2C show schematic cross-sectional views of a handler according to the present invention that holds an electronic component assembly (123) during subsequent method steps of the present invention. In Figure 2B, the gas supply / discharge feeds (109a, 109b) of the handler (100) are connected to gas passage openings (106a, 106b, 106c, 107a, 107b, 107c, 107d). The gas supply / discharge feeds (109a, 109b) allow for independent pressure level adjustment or control in each chamber (104, 105). The gas supply / discharge feed (109a) to the central chamber (104) via the gas passage openings (106a, 106b, 106c) allows for pressure level adjustment, in particular, to protect the central chamber (104) from contamination. Another gas supply / exhaust feed (109b) connects to the periphery chamber (105) via gas passage openings (107a, 107b, 107c, 107d), allowing for pressure level adjustment within the periphery chamber (105) and, not with the intention of attracting contaminants, but insofar as contaminants may approach the central chamber (104), better attacking such contaminants in the periphery chamber (105) before they enter one of the central chambers (104). Low pressure levels acting at least in the periphery chamber (105), optionally also in the central chamber (104), and on the contact surfaces (102) of the electronic component assembly (123) will further affect the mounting of the assembly (123) to the handler (100). The handler (100) includes a stable base (110) from which side walls (103) protrude to separate the chambers (104, 105). The stable base (110) of the handler (100) holds the gas passage openings (106a, 106b, 106c, 107a, 107b, 107c, 107d) and the gas supply / discharge feeds (109a, 109b) connected to a gas feed / discharge means (not shown). The side wall (103) will typically be in contact with the contact surface (102) of the electronic component assembly (123).

[0021] Figure 2C shows that the electronic component assembly (123) from Figure 2B is divided into individualized molded electronic components (101) after singulation. The singulation process by the saw blade (112) resulted in a cut line (111) that ends outside both the central chamber (104) and the peripheral chamber (105). Contaminants such as chips / debris from machining or laser machining of the cut line (111) are partially collected in the peripheral chamber (105) and will be discharged through the peripheral chamber (105). Since the pressure level in the peripheral chamber (105) is lower than the pressure level in the central chamber (104), contaminants will not enter the central chamber (104) (or will enter only on a very limited scale). After singulation, the handler (100) will be removed from the contact surface (102) by raising the pressure level in the chambers (103, 104) usually at least to the ambient pressure level. This will result in a plurality of individualized molded electronic components (101) as shown in Figure 2D.

[0022] Figure 3 shows a perspective view of the contact surface of another embodiment of the handler (200) according to the present invention, which includes a plurality of central chambers (201). Here, a number of central chambers (201) are surrounded by a single peripheral chamber (202). Each of the central chambers (201) has a gas passage opening (203), and further, a gas passage opening (204) is shown in the peripheral chamber (202).

[0023] Figures 4A - 4C are schematic top views of alternative embodiments of the configurations (301, 302, 303) of the central chambers (305, 306, 307) and the peripheral chambers (308, 309, 310) used in the handler according to the present invention.

[0024] Figure 4A shows a square central chamber (305) completely surrounded by a square peripheral chamber (308).

[0025] Figure 4B shows a circular central chamber (306) completely surrounded by a circular peripheral chamber (309).

[0026] Figure 4C shows a square central chamber (307), surrounded by four crescent-shaped peripheral chambers (310) that do not completely enclose the central chamber 307.

[0027] The above-described inventive concepts are illustrated by several exemplary embodiments. Individual inventive concepts may be applied without further application of other details of the described examples.

[0028] As used in this patent publication, the verb "comprise" and its conjugations are understood to mean not only "comprise," but also "contain," "substantially consist of," and "formed by," and their conjugations.

Claims

1. A handler for handling electronic components during the separation of assembled electronic components, wherein the handler includes a contact surface having a plurality of separated chambers, the separated chambers opening to the contact side and having side walls, at least one central chamber at least partially surrounded by at least one peripheral chamber, and the at least one central chamber and the at least one peripheral chamber having different gas passage openings.

2. The handler according to claim 1, characterized in that the far side of the side wall of the chamber is located on a single surface.

3. The handler according to claim 1, characterized in that the far side of the side wall of the chamber is located on various surfaces.

4. The handler according to any one of claims 1 to 3, characterized in that the side wall comprises at least a flexible material, an inflexible material, or a combination thereof.

5. The handler according to any one of claims 1 to 4, characterized in that the handler includes a stable base from which the side wall protrudes.

6. The handler according to any one of claims 1 to 5, characterized in that the handler includes a manipulator for controlled movement of the contact surface having a plurality of separate chambers.

7. The handler according to any one of claims 1 to 6, characterized in that the handler includes at least two independently controllable gas pressure level regulators connected to the gas passage openings of the at least one central chamber and the at least one peripheral chamber.

8. The handler according to any one of claims 1 to 7, wherein the handler includes a plurality of chamber groups of at least one central chamber surrounded by at least one peripheral chamber, and the central chamber and the peripheral chambers are provided with different gas passage openings.

9. A method for handling electronic components, wherein during the separation of assembled electronic components, a handler for handling electronic components according to any one of claims 1 to 8 is used, A) A step of bringing an electronic component assembly into contact with the contact side of the handler, thereby covering at least one contamination-sensitive portion of the assembly with the central chamber and at least one peripheral portion less contamination-sensitive than the contamination-sensitive portion with the peripheral chamber, B) A step of lowering the pressure level of at least one peripheral chamber to a lower pressure level than the ambient pressure level, thereby lowering the pressure level in the at least one central chamber to a lower pressure level than the pressure level in the at least one peripheral chamber. C) The step of isolating the assembled electronic components while maintaining a higher pressure level in the at least one central chamber than in the at least one surrounding chamber, D) A step of increasing the pressure level in at least one ambient chamber to release the isolated electronic components. Methods that include...

10. The method according to claim 9, characterized in that during step B), both the at least one central chamber and the at least one peripheral chamber are brought to a pressure level lower than the ambient pressure level, and during step D), the pressure levels of both the at least one central chamber and the at least one peripheral chamber are increased.

11. The method according to claim 10, characterized in that the at least one contamination-sensitive assembly portion is selected from the group consisting of sensors, detectors, optical windows, lenses, heat exchange surfaces, microprocessors, magnets, radio frequencies, power management, micro-electromechanical systems (MEM), and the like.

12. The method according to any one of claims 9 to 11, characterized in that during process step C), the pressure level difference between the central chamber and the surrounding chamber is at least 5 mbar.

13. The method according to any one of claims 9 to 12, characterized in that during process step C), the pressure level in the at least one central chamber is in the range of [5 to 1024] mbar, and the pressure level in the at least one peripheral chamber is in the range of [5 to 500] mbar.

14. The method according to any one of claims 9 to 13, characterized in that the pressure level in the chamber prior to the process step is adapted to limit the strain (warping) of the electronic component assembly.

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