Superconducting hardstop for flip chip
JP2026516431APending Publication Date: 2026-05-25IQM FINLAND OY
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- IQM FINLAND OY
- Filing Date
- 2024-04-16
- Publication Date
- 2026-05-25
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Figure 2026516431000001_ABST
Abstract
The present invention relates to the field of integrated circuit device manufacturing, and more specifically to the manufacturing of superconducting hard stops for flip-chip devices. The superconducting hard stops are formed on a first substrate and are used to restrict the position of a second substrate relative to the first substrate.
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