Photosensitive resin composition, insulating film, and semiconductor device.

JP2026516451APending Publication Date: 2026-05-25LG CHEM LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
LG CHEM LTD
Filing Date
2024-09-10
Publication Date
2026-05-25

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Abstract

The present invention aims to provide a photosensitive resin composition containing a polyimide resin, an insulating film, and a semiconductor device.
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