Negative-type photosensitive composition
The negative-type photosensitive composition addresses high curing temperature issues in polysiloxane coatings by using specific components for low-temperature curing, ensuring chemical resistance and preventing film shrinkage and peeling.
JP2026519292APending Publication Date: 2026-06-15MERCK PATENT GMBH
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- MERCK PATENT GMBH
- Filing Date
- 2024-06-04
- Publication Date
- 2026-06-15
AI Technical Summary
⚠Technical Problem
Existing polysiloxane compositions for coatings require high curing temperatures, leading to issues such as low chemical resistance, film shrinkage, and long curing times, with peeling occurring due to film shrinkage during heating.
⚗Method used
A negative-type photosensitive composition comprising polysiloxane A with specific repeating units, a polymerization initiator, compounds with (meth)acryloyloxy groups, thiol compounds with sulfanyl groups, and a solvent, which allows for low-temperature curing and suppresses film shrinkage and peeling.
🎯Benefits of technology
The composition achieves low-temperature curing with sufficient chemical resistance, short curing time, and prevents film shrinkage and peeling, while maintaining film integrity.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 2026519292000001 
Figure 2026519292000002 
Figure 2026519292000003
Abstract
To provide a negative-type photosensitive composition that can be cured at low temperatures. [Solution] A negative-type photosensitive composition comprising (I) a polysiloxane A having a specific structure, (II) a polymerization initiator, (III) a compound containing two or more (meth)acryloyloxy groups, (IV) a thiol compound containing two or more sulfanyl groups, and (V) a solvent.
Need to check novelty before this filing date? Find Prior Art