Imaging module and endoscope

Abstract

The objective is to provide an imaging module and an endoscope. This application provides an imaging module and an endoscope, wherein the imaging module comprises an imaging unit and a second substrate, the imaging unit comprises a camera, a light source component and a first substrate, the first substrate includes a first rigid substrate, the camera and the light source component are electrically connected to the first rigid substrate, the second substrate comprises a second rigid substrate and a flexible substrate, one end of the second rigid substrate is electrically connected to the first rigid substrate and an angle is formed between the second rigid substrate and the first rigid substrate, and the other end of the second rigid substrate is electrically connected to the flexible substrate. The imaging module reduces the difficulty of the manufacturing process and improves production efficiency and the yield rate of products.

Description

Technical Field

[0001] This application relates to the technical field of medical devices, and particularly to an imaging module and an endoscope.

Background Art

[0002] Endoscopes are mainly used in surgical operations and daily medical examinations. During clinical use, a doctor inserts the insertion part of the endoscope into the body through a natural cavity of the human body or a tiny incision made in the body, and performs in-body surgical operations from outside the body through other surgical instruments and an image processing device. Compared with conventional surgical operations, minimally invasive surgery using an endoscope has less trauma and faster postoperative recovery of patients, so endoscopes are widely popularized.

[0003] Endoscopes mainly illuminate or observe the body cavities and tissues of the human body through an imaging module. To enable the insertion part of the endoscope to smoothly pass through a narrow human body cavity and reduce the burden on the patient during the surgical process, the size of the imaging module is becoming increasingly smaller. As a result, the manufacturing process of the imaging module has also become difficult to implement. In related technologies, the imaging module usually draws out signals through a lead wire or a flexible printed circuit board (FPC). Due to the small size of the imaging module and the flexible materials of the lead wire and the flexible printed circuit board, soldering is difficult, the defective rate is high, and the production efficiency is low.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The imaging module according to an embodiment of this application includes a photographing unit and a second substrate. The photographing unit includes a camera, a light source component, and a first substrate. The first substrate includes a first rigid substrate. The camera and the light source component are electrically connected to the first rigid substrate. The second substrate includes a second rigid substrate and a flexible substrate. One end of the second rigid substrate is electrically connected to the first rigid substrate, and an angle is formed between the second rigid substrate and the first rigid substrate. The other end of the second rigid substrate is electrically connected to the flexible substrate. [Means for solving the problem]

[0005] To reduce the difficulty of the manufacturing process and improve product reliability and yield, this application provides an imaging module and an endoscope.

[0006] The imaging module for endoscopes comprises an imaging unit and a second circuit board. The imaging unit comprises a camera, a light source component, and a first substrate, the first substrate comprising a first hard substrate, and the camera and the light source component being electrically connected to the first hard substrate. The second substrate comprises a second hard substrate and a soft substrate, one end of the second hard substrate is electrically connected to the first hard substrate, an angle is formed between the second hard substrate and the first hard substrate, and the other end of the second hard substrate is electrically connected to the soft substrate.

[0007] Next, we will explain the technical plan further:

[0008] In one embodiment, the first rigid substrate is provided with a first mounting surface and a second mounting surface facing away from each other, the camera and the light source component are electrically connected to the first mounting surface, the second rigid substrate is electrically connected to the second mounting surface, and an angle is formed between the second rigid substrate and the second mounting surface.

[0009] In one embodiment, a right angle is formed between the second hard substrate and the second mounting surface.

[0010] In one embodiment, the second rigid substrate comprises a connected head portion and a constricted portion, the head portion being electrically connected to the first rigid substrate, the constricted portion being connected to the soft substrate, and the width of the constricted portion being smaller than the width of the head portion.

[0011] In one embodiment, the width of the soft substrate is less than or equal to the width of the constricted portion.

[0012] In one embodiment, the imaging module further comprises a sleeve, an electronic component is provided in the constricted portion, and the sleeve is placed over the constricted portion and covers the electronic component.

[0013] In one embodiment, the sleeve is a heat-shrinkable tube, which shrinks when heated and is placed over the constricted portion.

[0014] In one embodiment, the first rigid substrate is provided with a first mounting surface and a second mounting surface facing away from each other, the camera and the light source component are electrically connected to the first mounting surface, and the head portion is electrically connected to the second mounting surface.

[0015] In one embodiment, the head portion is provided with a contact point, and the head portion is welded to the second mounting surface through the contact point.

[0016] In one embodiment, a reinforcing adhesive is applied between the head portion and the second mounting surface.

[0017] In one embodiment, the imaging module further comprises a connector which is electrically connected to the end of the soft substrate away from the second hard substrate, and the connector is used to electrically connect to a substrate in the handle of the endoscope.

[0018] In one embodiment, the imaging module further includes a discharge component for discharging static electricity, and the discharge component penetrates the first hard substrate.

[0019] In one embodiment, the imaging module further comprises a tip case, the tip case having a housing cavity for housing the camera and the first hard substrate, the front end of the tip case having a first mounting hole communicating with the housing cavity, the light source component being placed in the mounting hole, and the light source component being electrically connected to the first hard substrate via lead wires.

[0020] In one embodiment, the light source component is mounted on the first hard substrate, the imaging module further comprises a tip case, the tip case is provided with a housing cavity for housing the imaging unit, a light guide component is provided in the housing cavity, one end of the light guide component abuts against the light source component, and the other end of the light guide component extends to the front end of the tip case.

[0021] In one embodiment, the light guide component and the tip case are integrally molded.

[0022] In one embodiment, the camera comprises a lens and an imaging chip, the imaging chip being electrically connected to the first hard substrate, the lens being connected to the end of the imaging chip away from the first hard substrate, the imaging unit further comprising a height adjustment block, the height adjustment block being connected to the first hard substrate, and the light source component being connected to the end of the height adjustment block away from the first hard substrate.

[0023] In one embodiment, the distance from the light-emitting surface of the light source component to the first hard substrate is greater than the distance from the joint between the imaging chip and the lens to the first hard substrate, and the distance from the light-emitting surface of the light source component to the first hard substrate is less than or equal to the distance from the front end surface of the lens to the first hard substrate.

[0024] In one embodiment, the height adjustment block comprises an insulator and a conductor attached to the insulator, the conductor being electrically connected to the light source component and the first hard substrate.

[0025] In one embodiment, the conductors are attached to both sides of the insulator, and the two conductors are connected to the positive and negative electrodes of the light source component, respectively.

[0026] This application further provides an endoscope. The endoscope includes an insertion portion, a handle, and the above imaging module. The front end of the insertion portion is connected to the imaging module, the rear end of the insertion portion is connected to the handle, the second substrate penetrates through the insertion portion, and the end of the flexible substrate away from the second rigid substrate is electrically connected to the circuit board in the handle.

[0027] The above imaging module is configured to include a first substrate as a rigid first rigid substrate and a second substrate as a rigid second rigid substrate and a flexible flexible substrate. When soldering the second substrate and the first substrate, the rigid second rigid substrate and the first rigid substrate do not bend and deform. Thereby, the soldering alignment of the second rigid substrate and the first rigid substrate becomes easy, the difficulty of the soldering process is reduced, and the production efficiency and the product yield are improved. Further, since an angle is formed between the second rigid substrate and the first rigid substrate, it is advantageous for reducing the size of the imaging module. At the same time, the rigid second rigid substrate provides more stable support for the imaging unit, improving the structural stability of the imaging unit. When assembling the imaging module into the insertion portion, the second rigid substrate serves as a gripping portion, which not only facilitates manual assembly but is also suitable for automated assembly. Also, since the flexible flexible substrate can be bent and deformed, it well conforms to the bending angles of the insertion portion and the handle, and can easily pass through the insertion portion of the endoscope and be electrically connected to the substrate inside the handle. Thereby, the signal transmission stability between the imaging unit and the handle is ensured.

Brief Description of the Drawings

[0028] The drawings constituting a part of this application are used to provide an understanding of this application, and the embodiments of this application and their descriptions are used to interpret this application, and do not unduly limit this application.

[0029] To more clearly explain the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments are briefly introduced below. However, the drawings in the following description represent only a portion of the embodiments of this application, and those skilled in the art can obtain other drawings based on these without any creative effort.

[0030] Note that the drawings are not drawn to a 1:1 scale, and the relative dimensions of each component are shown illustratively only and are not necessarily drawn to the actual scale. In the drawings: [Figure 1] This is an exploded view of the structure of an imaging module in one embodiment. [Figure 2] Figure 1 is a schematic diagram of the structure of the imaging module with the tip case and light source components hidden. [Figure 3] Figure 2 is a front view of the imaging module. [Figure 4] This is a schematic diagram of the structure of the second substrate in one embodiment. [Figure 5] Figure 4 is a schematic diagram of the combination of the second substrate and the sleeve shown. [Figure 6] This is a schematic diagram showing the rear end structure of a flexible substrate in one embodiment. [Figure 7] This is a structural exploded view of an imaging module in another embodiment. [Figure 8] Figure 7 is a schematic diagram of the structure of the imaging unit of the imaging module shown. [Figure 9] Figure 7 is a schematic diagram of the structure of the height adjustment block of the imaging module shown. [Figure 10] This is a structural exploded view of an imaging module in another embodiment. [Figure 11] Figure 10 is a schematic diagram of the structure of the imaging unit of the imaging module shown. [Figure 12] Figure 10 is a cross-sectional view of the tip case of the imaging module. [Modes for carrying out the invention]

[0031] To make the above-mentioned objectives, features, and advantages of this application clearer and easier to understand, the technical solutions in the embodiments of this application will be described clearly and completely below with reference to the drawings in the embodiments of this application. Many specific details will be described in order to fully understand this application. However, this application is not limited to the specific embodiments disclosed below, as this application can be carried out in many ways different from those described herein, and those skilled in the art can make similar improvements without contradicting the concept of this application.

[0032] In the description of this application, the orientations or positional relationships indicated by terms such as "center," "vertical," "horizontal," "length," "width," "thickness," "top," "bottom," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "internal," "external," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" are based on the orientations or positional relationships shown in the drawings and are intended to facilitate and simplify the description of this application. They do not mean that the indicated or implied devices or components have a particular orientation or must be configured or operate in a particular orientation. Therefore, they should not be construed as limitations on this application.

[0033] Furthermore, when these terms “first” and “second” are used, they are used solely for descriptive purposes and should not be interpreted as indicating or implying relative importance, nor as implying the number of technical features being referred to. Thus, features limited by “first” and “second” may include at least one, explicitly or implicitly. Where the term “plural” is used in this application, unless otherwise explicitly limited, “plural” means at least two, for example, two, three, etc.

[0034] In the description of this application, unless otherwise explicitly specified and limited, the terms “attachment,” “connection,” “linking,” and “fixing” should be interpreted broadly. For example, this could refer to a fixed connection, a removable connection, a one-piece molded structure, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, a communication relationship within two components, or an interaction relationship between two components. A person skilled in the art will be able to understand the specific meaning of these terms in this application on a case-by-case basis.

[0035] In this application, unless otherwise explicitly stated and limited, when a first feature is described as being "above" or "below" a second feature, the meaning includes direct contact between the first and second features, or indirect contact between them through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "on the top surface" of a second feature, it indicates that the first feature is directly above or diagonally above the second feature, or simply that the horizontal height of the first feature is greater than that of the second feature. When a first feature is described as being "below," "below," or "on the bottom surface" of a second feature, it indicates that the first feature is directly below or diagonally below the second feature, or simply that the horizontal height of the first feature is lower than that of the second feature.

[0036] When one component is described as being "fixed" or "installed" on another component, it may be directly on the other component or exist through an intermediate component. When one component is described as being "connected" to another component, it may be directly connected to the other component or connected through an intermediate component. The terms "vertical," "horizontal," "up," "down," "left," "right," and similar terms used in this application are for illustrative purposes only and do not indicate only one embodiment.

[0037] This application provides an endoscope for acquiring image information within a target body cavity or tissue. Specifically, the endoscope of one embodiment includes an insertion section, a handle, and an imaging module, the front end of the insertion section being connected to the imaging module, and the rear end of the insertion section being connected to the handle. The imaging module is used for illumination and image information acquisition of the target body cavity or tissue, and the imaging module is electrically connected to a circuit board in the handle.

[0038] Specifically, in conventional endoscopes, the imaging module generally includes a light source component for illumination and a camera for acquiring image information. The circuit board inside the handle is electrically connected to the imaging module and assists its operation. The insertion section is usually long and requires a certain degree of bending flexibility. Also, because a certain angle is formed between the handle and the insertion section, the imaging module is usually electrically connected to the circuit board inside the handle via soft lead wires or flexible circuit boards to ensure the bending flexibility of the insertion section and to facilitate wiring between the imaging module and the circuit board inside the handle. However, because the material of the lead wires and flexible circuit boards is soft and the imaging module is generally small, alignment during soldering is difficult, resulting in a high defect rate and low production efficiency. Furthermore, the soft lead wires and flexible circuit boards cannot adequately support the imaging module, making the overall structure of the imaging module unstable, unreliable, and inconvenient to assemble.

[0039] Based on this, embodiments of the present application further provide an imaging module. Specifically, referring to Figures 1 to 3, the imaging module of one embodiment includes an imaging unit and a second substrate 20, the imaging unit includes a camera 30, a light source component 41 and a first substrate, the first substrate includes a first rigid substrate 11, and both the camera 30 and the light source component 41 are electrically connected to the first rigid substrate 11. Here, the camera 30 is used to acquire image information within a target body cavity or tissue, and the light source component 41 is used for illumination. The second substrate 20 includes a second rigid substrate 21 and a flexible substrate 22, one end of the second rigid substrate 21 is electrically connected to the first rigid substrate 11, and an angle is formed between the second rigid substrate 21 and the first rigid substrate 11, and the other end of the second rigid substrate 21 is electrically connected to the flexible substrate 22. Furthermore, the imaging unit is installed at the front end of the insertion section, and the second substrate 20 is installed through the insertion section. Here, the end of the flexible substrate 22 that is away from the second rigid substrate 21 is electrically connected to the circuit board in the handle. Preferably, in this embodiment, both the first rigid substrate 11 and the second rigid substrate 21 are rigid PCB substrates, and the flexible substrate 22 is a flexible FPC substrate.

[0040] Specifically, during manufacturing, the camera 30 and the light source component 41 are first assembled onto the first hard plate 11 to form an integrated imaging unit, and then one end of the second hard plate 21 of the second substrate 20 is assembled onto the first hard plate 11. This forms an integrated imaging unit. Compared with conventional imaging modules that extract signals using lead wires or flexible substrates, the imaging module of this application is configured such that the first substrate includes a hard first hard substrate 11, and the second substrate 20 includes a hard second hard substrate 21 and a flexible substrate 22. As a result, when soldering the second substrate 20 and the first hard substrate 11, the hard second hard substrate 21 and the first hard substrate 11 do not bend or deform, making it easier to align the soldering position of the second hard substrate 21 and the first hard substrate 11, reducing the difficulty of the soldering process, and improving production efficiency and the yield rate of good products. Furthermore, since the second rigid substrate 21 and the first rigid substrate 11 are positioned to form an angle, it is advantageous for reducing the size of the imaging module. At the same time, the rigid second rigid plate 21 can support the imaging unit more stably, improving the structural stability of the imaging unit. When assembling the imaging module to the insertion section, the second rigid plate 21 can be used as a gripping part, not only facilitating manual assembly but also being suitable for automated assembly. In addition, the flexible soft substrate 22 can be bent and deformed, and can flexibly adapt to the bending angles of the insertion section and the handle, so that it can easily pass through the insertion section of the endoscope and be electrically connected to the circuit board inside the handle, ensuring the stability of signal transmission between the imaging unit and the handle.

[0041] Referring to Figure 3, or in one embodiment, a first mounting surface 111 and a second mounting surface 112 facing away from each other are installed on the first rigid plate 11, the camera 30 and the light source component 41 are both electrically connected to the first mounting surface 111, the second rigid plate 21 is electrically connected to the second mounting surface 112, and an angle is formed between the second rigid plate 21 and the second mounting surface 112. Preferably, in this embodiment, a right angle is formed between the second rigid plate 21 and the second mounting surface 112, and the second rigid plate 21 and the first rigid plate 11 form a structurally stable and reliable "T" shape. This saves space and simplifies wiring.

[0042] Referring to Figure 5, in one embodiment, the imaging module further includes a sleeve 23 that covers the second substrate 20, thereby providing electrostatic discharge protection and waterproof and dustproof protection to the second substrate 20.

[0043] Furthermore, referring to Figure 4, the second rigid substrate 21 includes a connected head portion 211 and a constricted portion 212. The head portion 211 is electrically connected to the first rigid substrate 11. The constricted portion 212 is connected to the flexible substrate 22. The width of the constricted portion 212 is smaller than the width of the head portion 211. The width of the flexible substrate 22 is less than or equal to the width of the constricted portion 212. Electronic components 213 such as resistors and capacitors are provided in the constricted portion 212. The sleeve 23 covers the constricted portion 212 and protects the electronic components 213 on the constricted portion 212 by covering them. Specifically, the insertion portion is usually designed to be narrow so that it can pass smoothly through narrow body cavities and does not damage human tissue. In response to this, the lumen of the insertion portion is also small, and furthermore, since the lumen of the insertion portion not only accommodates the second substrate 20 but also needs to secure an instrument passage for surgical instruments to pass through, the size of the second substrate 20 needs to be as small as possible. By providing a narrow constriction 212 and a narrow soft substrate 22, and covering the constriction 212 with the sleeve 23, the electronic components 213 on the second substrate 20 can be protected, while at the same time avoiding the overall dimensions of the second substrate 20 and the sleeve 23 being too large.

[0044] Preferably, referring to Figure 5, the sleeve 23 is a heat-shrinkable tube, which shrinks when heated and fits over the constricted portion 212. Therefore, it is easy to process and the dimensions are smaller. Specifically, the head portion 211 is electrically connected to the second mounting surface 112, and contacts are provided on the head portion 211. The head portion 211 is welded to the second mounting surface 112 through the contacts, achieving a highly reliable weld. Furthermore, a reinforcing adhesive is applied between the head portion 211 and the second mounting surface 112 to improve the overall structural stability.

[0045] Referring to Figure 6, in one embodiment, the imaging module further includes a connector 24, which is electrically connected to the end of the flexible substrate 22 away from the second rigid substrate 21, and is used to electrically connect to a substrate in the handle of the endoscope. As a result, during assembly, the electrical connection between the flexible substrate 22 and the substrate is achieved simply by inserting the connector 24 into the substrate in the handle, eliminating the soldering process and improving assembly efficiency.

[0046] Referring to Figure 2, the imaging module further includes a discharge component 51 for discharging static electricity, and the discharge component 51 penetrates the first hard substrate 11. The discharge component 51 discharges static electricity from the environment and removes static electricity from the first hard substrate 11, thereby preventing static electricity from affecting components such as the camera 30 and light source component 41 on the first hard substrate 11, and preventing the camera 30 and light source component 41 from being subjected to electromagnetic interference. Preferably, the first hard substrate 11 is provided with through holes, and the discharge component 51 penetrates through these through holes. Furthermore, there are at least two discharge components 51, and at least two discharge components 51 penetrate the first hard substrate 11 with a gap between them. This improves the static electricity prevention effect and the electromagnetic interference prevention effect. Preferably, the discharge component 51 is a metal needle.

[0047] Referring to Figure 2, in one embodiment, the camera 30 includes a lens 31 and an imaging chip 32, the imaging chip 32 being electrically connected to the first hard substrate 11, and the lens 31 being connected to the end of the imaging chip 32 away from the first hard substrate 11. Preferably, the imaging chip 32 is electrically connected to the first mounting surface 111 of the first hard substrate 11 via a conductive adhesive, from which the lens 31 is further bonded to the imaging chip 32 via a conductive adhesive and packaged.

[0048] Referring to Figure 1, the imaging module further comprises a tip case 60, which is used to waterproof and dustproof the imaging unit. Specifically, the tip case 60 is provided with a housing cavity for housing the camera 30 and the first hard substrate 11, and an imaging port 62 communicating with a container is provided at the front end of the tip case 60, with the camera 30 positioned inside the imaging port 62. Alternatively, in one embodiment, the tip case 60 is first injection molded during manufacturing, the imaging unit is then mounted in the housing cavity of the tip case 60, and finally resin is injected into the housing cavity to connect and fix the tip case 60 and the imaging unit. In another embodiment, after fixing the imaging unit in the mold of the tip case, resin is injected into the mold of the tip case, and after curing and demolding, the tip case 60 is formed integrated with the outside of the imaging unit.

[0049] Referring to Figure 1, in one embodiment, the front end of the tip case 60 is provided with a first mounting hole 61 that communicates with a housing cavity, the light source component 41 is placed in the mounting hole 61, and the light source component 41 is electrically connected to the first hard substrate 11 via lead wires. This fixes the light source component 41 to the front end of the tip case 60, prevents light rays from the light source component 41 from being obstructed, and makes the irradiation of the detection target area more uniform. Preferably, there are at least two light source components 41, and accordingly, at least two mounting holes 61 are provided at the front end of the tip case 60, and the light source components 41 are placed separately in each mounting hole 61. Furthermore, the light source components 41 are fixed to the mounting holes 61 with adhesive. During installation, first the camera 30 and the first rigid substrate 11 are inserted into the housing cavity from the rear end of the tip case 60, then the light source component 41 with the lead wires attached is inserted into the mounting hole 61 from the front end of the tip case 60 and fixed with adhesive, and finally the lead wires are connected to the first substrate 11 to complete the installation of the light source component 41. Preferably, in this embodiment, the light source component 41 is an LED lamp.

[0050] In other embodiments, the light source component 41 can also be attached to the first hard substrate 11. This allows the heat from the light source component 41 to be transferred to the second substrate 20 via the first hard substrate 11, preventing the heat from being directly transferred to the patient via the tip case 60 and causing burns. At the same time, it also prevents the heat from concentrating at the front end of the tip case 60. Therefore, on the one hand, it is possible to meet the temperature limits in relevant domestic and international standards for medical devices. Furthermore, the camera 30 is a heat-sensitive element, and if it overheats, noise will be generated and stable imaging will become impossible. Therefore, by installing the light source component 41 on the first hard substrate 11, the heat from the light source component 41 is transferred to the rear via the first hard substrate 11 and the second substrate 20, ensuring stable imaging by the camera.

[0051] Furthermore, when installing the light source component 41 on the first hard substrate 11, it is necessary to maintain an appropriate relative position between the light-emitting surface of the light source component 41 and the front end surface of the lens 31. Specifically, if the light-emitting surface of the light source component 41 is positioned higher than the front end surface of the lens 31, it is likely to cause overexposure of the camera 30. If the light-emitting surface of the light source component 41 is positioned significantly lower than the front end surface of the lens 31, some of the light from the light source component 41 will be blocked by the side of the camera 30, resulting in uneven illumination of the detection target area. This will result in uneven brightness and color tone in the captured image, making it difficult to accurately and quickly diagnose lesions, and potentially leading to misdiagnosis.

[0052] Based on this, referring to Figures 7 and 8, in another embodiment, the imaging unit further includes a height adjustment block 42, the height adjustment block 42 is connected to the first hard substrate 11, and the light source component 41 is connected to the end of the height adjustment block 42 away from the first hard substrate 11, so that an appropriate relative position is maintained between the light-emitting surface of the light source component 41 and the front end surface of the lens 31. Preferably, the distance from the light-emitting surface of the light source component 41 to the first hard substrate 11 is greater than the distance from the joint between the imaging chip 32 and the lens 31 to the first hard substrate 11, and the distance from the light-emitting surface of the light source component 41 to the first hard substrate 11 is less than or equal to the distance from the front end surface of the lens 31 to the first hard substrate 11. This allows the light source component 41 to be positioned higher using the height adjustment block 42, so that the light-emitting surface of the light source component 41 is higher than the joint between the imaging chip 32 and the lens 31. This prevents light from the light source component 41 from penetrating the joint between the imaging chip 32 and the lens 31 and affecting the light-receiving surface of the imaging chip 32. Furthermore, by setting the light-emitting surface of the light source component 41 lower than or equal to the front end surface of the lens 31, overexposure of the camera 30 is prevented, and at the same time, some of the light rays from the light source component 41 are prevented from being blocked by the side of the camera 30, resulting in more uniform illumination of the detection target area and improved imaging quality. Simultaneously, the heat from the light source component 41 is transferred to the first hard substrate 11 via the height adjustment block 42, and further to the second substrate 20. This prevents heat from concentrating at the front end of the tip case 60, preventing burns to the patient, and also avoids affecting the imaging performance of the camera 30.

[0053] Furthermore, referring to Figure 9, the height adjustment block 42 includes an insulator 422 and a conductor 421 attached to the insulator 422, the conductor 421 electrically connecting the light source component 41 and the first hard substrate 11, and achieving effective conductivity. Specifically, the conductors 421 are attached to both sides of the insulator 422, and the two conductors 421 are connected to the positive and negative electrodes of the light source component 41, respectively. The insulator 422 insulates the two conductors 421, preventing a short circuit of the light source component 41. Preferably, in this embodiment, the light source component 41 is an LED lamp.

[0054] Referring to Figures 10 to 12, in another embodiment, the light source component 41 is mounted on the first hard substrate 11, and a light guide component 63 is provided in the housing cavity of the tip case 60. One end of the light guide component 63 abuts against the light source component 41, and the other end of the light guide component 63 extends to the front end of the tip case 60. As a result, the light from the light source component 41 is concentrated and transmitted to the front end of the tip case 60 via the light guide component 63, reducing the luminescence energy loss of the light source component 41. Therefore, it is not necessary to consider that the light from the light source component 41 may be blocked by the camera 30, and scattering of the light from the light source component 41 at the junction of the imaging chip 32 and the lens 31 is also reduced. Furthermore, the light guide component 63 and the tip case 60 are integrally molded, resulting in high structural strength. Preferably, in this embodiment, the light source component 41 is an LED lamp. Furthermore, by covering the joint between the imaging chip 32 and the lens 31 with a light-shielding layer or light-shielding material, the amount of light from the light source component 41 irradiating the joint between the imaging chip 32 and the lens 31 can be further reduced. In addition, the heat from the light source component 41 is transferred to the rear via the first hard substrate 11 and the second substrate 20, ensuring stable shooting by the camera.

[0055] The technical features of the above embodiments can be combined in any way, and for the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no inconsistency in these combinations of technical features, they should be considered to fall within the scope described herein.

[0056] The above embodiments represent only a few embodiments of this application, and although the descriptions are specific and detailed, they are not intended to limit the scope of this application. Those skilled in the art will be aware that various modifications and improvements are possible without departing from the technical spirit of this application, and such modifications and improvements are included within the scope of protection of the present invention. [Explanation of symbols]

[0057] 11 first rigid substrate; 111 First mounting surface, 112 Second mounting surface, 20 second board, 21 second rigid substrate; 211 Head section, 212 Stenosis, 213 Electronic components, 22 Soft substrate, 23 sleeves, 24 connectors, 30 cameras, 31 lenses, 32 shooting chips, 41 Light source components, 42 Height adjustment blocks, 421 Conductors, 422 Insulator, 51 Discharge components, 60 tip cases, 61 mounting holes, 62 shooting opening, 63. Light guide components.

Claims

1. An imaging module for endoscopes, comprising an imaging unit and a second substrate, The imaging unit comprises a camera, a light source component, and a first substrate, the first substrate comprising a first hard substrate, and the camera and the light source component being electrically connected to the first hard substrate. The imaging module is characterized in that the second substrate comprises a second hard substrate and a soft substrate, one end of the second hard substrate is electrically connected to the first hard substrate, an angle is formed between the second hard substrate and the first hard substrate, and the other end of the second hard substrate is electrically connected to the soft substrate.

2. The imaging module according to claim 1, characterized in that the first rigid substrate has a first mounting surface and a second mounting surface facing away from each other, the camera and the light source component are electrically connected to the first mounting surface, the second rigid substrate is electrically connected to the second mounting surface, and an angle is formed between the second rigid substrate and the second mounting surface.

3. The imaging module according to claim 2, characterized in that a right angle is formed between the second hard substrate and the second mounting surface.

4. The imaging module according to claim 1, wherein the second rigid substrate comprises a connected head portion and a constricted portion, the head portion is electrically connected to the first rigid substrate, the constricted portion is connected to the soft substrate, and the width of the constricted portion is smaller than the width of the head portion.

5. The imaging module according to claim 4, characterized in that the width of the soft substrate is less than or equal to the width of the constricted portion.

6. The imaging module according to claim 4, further comprising a sleeve, wherein an electronic component is provided in the constricted portion, and the sleeve covers the constricted portion and covers the electronic component.

7. The imaging module according to claim 6, wherein the sleeve is a heat-shrinkable tube, and the heat-shrinkable tube shrinks when heated and is placed over the constricted portion.

8. The imaging module according to claim 4, characterized in that the first rigid substrate has a first mounting surface and a second mounting surface facing away from each other, the camera and the light source component are electrically connected to the first mounting surface, and the head portion is electrically connected to the second mounting surface.

9. The imaging module according to claim 8, characterized in that the head portion is provided with contacts, and the head portion is welded to the second mounting surface through the contacts.

10. The imaging module according to claim 9, characterized in that a reinforcing adhesive is applied between the head portion and the second mounting surface.

11. The imaging module according to claim 1, further comprising a connector, the connector being electrically connected to the end of the soft substrate away from the second hard substrate, and the connector being used to electrically connect to a substrate in the handle of the endoscope.

12. The imaging module according to claim 1, further comprising a discharge component for discharging static electricity, wherein the discharge component penetrates the first hard substrate.

13. The imaging module according to claim 1, further comprising a tip case, the tip case having a housing cavity for housing the camera and the first hard substrate, the front end of the tip case having a first mounting hole communicating with the housing cavity, the light source component being placed in the mounting hole, and the light source component being electrically connected to the first hard substrate via lead wires.

14. The imaging module according to claim 1, wherein the light source component is attached to the first hard substrate, the imaging module further comprises a tip case, the tip case is provided with a housing cavity for housing the imaging unit, a light guide component is provided in the housing cavity, one end of the light guide component abuts against the light source component, and the other end of the light guide component extends to the front end of the tip case.

15. The imaging module according to claim 1, characterized in that the light guide component and the tip case are integrally molded.

16. The imaging module according to claim 1, characterized in that the camera comprises a lens and an imaging chip, the imaging chip is electrically connected to the first hard substrate, the lens is connected to the end of the imaging chip away from the first hard substrate, the imaging unit further comprises a height adjustment block, the height adjustment block is connected to the first hard substrate, and the light source component is connected to the end of the height adjustment block away from the first hard substrate.

17. The imaging module according to claim 16, characterized in that the distance from the light-emitting surface of the light source component to the first hard substrate is greater than the distance from the coupling portion of the imaging chip and the lens to the first hard substrate, and the distance from the light-emitting surface of the light source component to the first hard substrate is less than or equal to the distance from the front end surface of the lens to the first hard substrate.

18. The imaging module according to claim 16, wherein the height adjustment block comprises an insulator and a conductor attached to the insulator, and the conductor is electrically connected to the light source component and the first hard substrate.

19. The imaging module according to claim 18, characterized in that the conductors are attached to both sides of the insulator, and the two conductors are connected to the positive and negative electrodes of the light source component, respectively.

20. An endoscope comprising an insertion section, a handle, and an imaging module as described in claims 1 to 19, wherein the front end of the insertion section is connected to the imaging module, the rear end of the insertion section is connected to the handle, the second substrate penetrates the insertion section, and the end of the soft substrate away from the second hard substrate is electrically connected to a rotating substrate in the handle.

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