Sliding enclosure on the outside of the tool

Abstract

The system includes a tool positioned within an internal volume. An inner frame, having a front wall and a rear wall, covers the front and rear surfaces of the internal volume, respectively, and an outer frame is positioned on the inner frame. The outer frame includes a first section and a second section, each having a top wall, a left wall, and a right wall. In the closed position, the walls of the first and second sections cover the top, left, and right surfaces of the internal volume, respectively, and the internal volume is at least partially sealed from the outside, with the first section being sealed by the second section. The outer frame is movable relative to the inner frame to an open position, where at least portions of the top, left, and right surfaces of the internal volume are open to the outside.

Description

Technical Field

[0001] The present disclosure relates to a tool enclosure, and more particularly, to an enclosure for a semiconductor manufacturing tool.

Background Art

[0002] With the development of the semiconductor manufacturing industry, there is an increasing demand for yield management, particularly for measurement and inspection systems. Although the critical dimensions continue to shrink, there is a need in the industry to reduce the time required to achieve high-yield and high-value production. By minimizing the total time from detecting a yield problem to correcting it, the return on investment of semiconductor manufacturers is maximized.

[0003] Fabricating semiconductor devices such as logic devices and memory devices typically involves processing semiconductor wafers using a number of fabrication processes to form various features and multiple levels of semiconductor devices. For example, lithography is a semiconductor fabrication process that includes transferring a pattern from a reticle to a photoresist disposed on a semiconductor wafer. Further examples of semiconductor fabrication processes include, but are not limited to, chemical mechanical polishing (CMP), etching, deposition, and ion implantation. The placement of multiple semiconductor devices fabricated on a single semiconductor wafer may be separated into individual semiconductor devices.

[0004] Inspection processes are used in various stages of semiconductor manufacturing to detect defects on wafers, leading to higher yields and therefore higher profits in the manufacturing process. Inspection has always been a crucial part of fabricating semiconductor devices such as integrated circuits (ICs). However, as the dimensions of semiconductor devices decrease, inspection becomes even more important for the successful manufacture of acceptable semiconductor devices, as even smaller defects can cause the device to fail. For example, as the dimensions of semiconductor devices decrease, it has become necessary to detect small defects, as even relatively small defects can cause undesirable aberrations in the semiconductor device.

[0005] Defect review typically involves re-detecting defects identified by the inspection process and generating additional information about the defects at higher resolution using either a high-magnification optical system or a scanning electron microscope (SEM). Defect review is typically performed at separate locations on the specimen where the defect was detected by inspection. The high-resolution defect data generated by defect review is better suited for determining defect attributes such as profile, roughness, or more precise size information.

[0006] Measurement processes are used at various steps during semiconductor manufacturing to monitor and control the process. Unlike inspection processes, which detect defects on the wafer, measurement processes are used to measure one or more characteristics of the wafer that cannot be determined using existing inspection tools. Measurement processes can be used to measure one or more characteristics of the wafer so that the performance of the process can be determined from one or more characteristics. For example, a measurement process can measure the dimensions of features formed on the wafer during the process (e.g., line width, thickness, etc.). In addition, if one or more characteristics of the wafer are unacceptable (e.g., outside a predetermined range), the measurement of one or more characteristics of the wafer may be used to modify one or more parameters of the process so that additional wafers manufactured by the process have one or more acceptable characteristics.

[0007] Semiconductor measurement and inspection tools can be highly sensitive to temperature fluctuations, particle contamination, electromagnetic interference, and acoustic vibrations from the external tool environment. For example, these external influences can negatively impact the accuracy of measurements collected by measurement tools and the quality of images collected by inspection tools. Therefore, these tools can be operated within enclosures that mitigate these external influences. However, existing enclosures are often fixed structures that are difficult to install and disassemble. For instance, if tool maintenance is required, the entire enclosure must be disassembled to access a portion of the tool. While some enclosures have doors or access panels that allow access to parts of the tool, the usefulness of these doors is limited by their size and placement on the enclosure. These drawbacks can increase the time required for tool maintenance and troubleshooting, potentially reducing system throughput time. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] U.S. Patent Application Publication No. 2015 / 0233814 [Overview of the project] [Problems that the invention aims to solve]

[0009] Therefore, an enclosure is needed that can protect the tools and provide easier access for maintenance and servicing. [Means for solving the problem]

[0010] This disclosure provides a system having a sliding enclosure around a tool. The system may comprise an inner frame, an outer frame, and a tool. The tool may be a semiconductor measuring tool or a semiconductor inspection tool. The inner frame may define an internal volume, and the tool may be placed within the internal volume. The inner frame may comprise a front wall covering the front and rear surfaces of each of the internal volumes, and a rear wall. The outer frame may be placed on the inner frame, and the outer frame may comprise a first section and a second section. The first section may include a first top wall, a first left wall, and a first right wall, and the second section may include a second top wall, a second left wall, and a second right wall. In the closed position, the first upper wall, the second upper wall, the first left wall, the second left wall, the first right wall, and the second right wall can cover the top, left, and right surfaces of the internal volume, and the internal volume may be at least partially sealed from the outside, and the first section may be sealed by the second section. The outer frame may be movable relative to the inner frame to an open position in which at least a portion of the top, left, and right surfaces of the internal volume are open to the outside.

[0011] In some embodiments, the first section and the second section may be movable independently of the inner frame.

[0012] In some embodiments, the first section and the second section may be coplanar. In the open position, the first section may be separated from the second section.

[0013] In some embodiments, the first section and the second section may be parallel. In the open position, the first section is positioned above the second section.

[0014] In some embodiments, the front and rear walls of the inner frame may be provided with acoustic damping panels.

[0015] In some embodiments, the first upper wall, second upper wall, first left wall, second left wall, first right wall, and second right wall of the outer frame are provided with acoustic attenuation panels.

[0016] In some embodiments, the inner frame is fixed to the ground.

[0017] In some embodiments, the system may further include a lower member. An inner frame and an outer frame may be positioned at the top of the lower member.

[0018] In some embodiments, the lower member may include guide rails. The outer frame may be movable relative to the inner frame by sliding within the guide rails.

[0019] In some embodiments, the first left wall, second left wall, first right wall, and second right wall of the outer frame may be equipped with wheels, and the outer frame may be movable relative to the inner frame by rotating the wheels.

[0020] In some embodiments, the wheels are retracted in the closed position and, when unfolded, allow the outer frame to move to the open position by rolling against the inner frame.

[0021] In some embodiments, the internal volume may be temperature-controlled and at least partially insulated from the outside in the closed position.

[0022] In some embodiments, the tool may be accessible from the top, left, and right surfaces of the internal volume in the open position.

[0023] In some embodiments, the inner frame may further include a raceway for routing electrical wires and / or fluid lines connected to the tool.

[0024] In some embodiments, the outer frame may further include a control panel disposed on one of the first right wall or the first left wall. The control panel can be connected to the electrical wires of the tool in the raceway via a flexible relief loop that can maintain the connection between the control panel and the electrical wires of the tool when the outer frame is in the open and closed positions.

[0025] In some embodiments, at least one of the first left wall, the second left wall, the first right wall, and the second right wall of the outer frame may include a door that is openable and closable when the outer frame is in the closed position.

[0026] In some embodiments, at least one of the first left wall, the second left wall, the first right wall, and the second right wall of the outer frame may be at least partially transparent.

[0027] In some embodiments, the internal volume may be partially sealed from the outside in the closed position, and the leakage rate is 20% or less.

[0028] In some embodiments, the pressure difference between the internal volume and the outside can cause an outward airflow between the inner frame and the outer frame in the closed position.

[0029] In some embodiments, the inner and outer frames can shield the internal volume from electromagnetic interference in the closed position.

[0030] To fully understand the nature and purpose of this disclosure, the following detailed description should be referred to in conjunction with the attached drawings. [Brief explanation of the drawing]

[0031] [Figure 1] This is a side cross-sectional view of a system according to one embodiment of the present disclosure. [Figure 2] Figure 1 is a front cross-sectional view of the system. [Figure 3] This is a front perspective view of a system of one embodiment of the present disclosure in the closed position. [Figure 4] This is a rear perspective view of the system in the closed position shown in Figure 3. [Figure 5] This is a front perspective view of the system in the open position shown in Figure 3. [Figure 6] This is a front cross-sectional view of a system according to one embodiment of the present disclosure. [Figure 7] This is a side view of the system in the closed position shown in Figure 6. [Figure 8] This is a side view of the system in Figure 6 in the open position. [Figure 9] This is a top cross-sectional view of a system of one embodiment of the present disclosure in the closed position. [Figure 10] This is a top cross-sectional view of the system in Figure 9 in the open position. [Figure 11] This is a front perspective view of the system of another embodiment of the present disclosure in the closed position. [Figure 12] This is a rear perspective view of the system in Figure 11 in the closed position. [Figure 13] This is a front perspective view of the system in Figure 11 in the open position. [Figure 14] This is a front cross-sectional view of a system according to another embodiment of the present disclosure. [Figure 15] This is a top cross-sectional view of another embodiment of the system of this disclosure in the closed position. [Figure 16]This is a top cross-sectional view of the system in Figure 15 in the open position. [Modes for carrying out the invention]

[0032] While the claimed subject matter is described in relation to specific embodiments, other embodiments, including those that do not provide all of the advantages and features described herein, are also within the scope of this disclosure. Various structural, logical, process, step, and electronic modifications can be made without departing from the scope of this disclosure. Accordingly, the scope of this disclosure is defined solely by reference to the appended claims.

[0033] One embodiment of the present disclosure provides a system 100 shown in Figures 1 and 2. System 100 may be part of a semiconductor manufacturing system that performs semiconductor measurement, inspection, or other processes. For example, system 100 may include a tool 105. As used herein, tool 105 can refer to any tool used to perform measurements on a substrate before, during, after, or in between a substrate processing step. For example, tool 105 may be a semiconductor measurement tool or a semiconductor inspection tool. The tool may use an electron beam, a photon beam, X-rays, or an ion beam.

[0034] Measurement tools are generally configured to perform analysis by taking measurements and providing outputs corresponding to values ​​of some physical property. Value outputs are typically numerical or set of numerical values ​​and can be transmitted or stored in analog or digital format. Examples of measurement tools include, but are not limited to, overlay tools, interferometers, limit dimension (CD) tools (e.g., CD scanning electron microscopes (CD-SEMs)), film thickness tools, ion implantation measurement tools, surface profiling tools, resistivity measurement tools, reticle pattern placement measurement tools, edge measurement tools, reflectometers, and ellipsometers.

[0035] Inspection tools are generally configured to examine defects, i.e., anything that is unusual. A typical output of an inspection tool is the number of defects per unit area of ​​the substrate or a portion of the substrate. Examples of inspection tools include, but are not limited to, optical and electron beam wafer inspection systems for patterned or unpatterned wafers, macro defect inspection tools, edge defect inspection tools, infrared inspection tools, and reticle inspection tools. Inspection tools may also be configured for back-end-of-line (BEOL) inspection of fabricated devices. Examples of BEOL inspection tools include, but are not limited to, component inspection tools configured to inspect various semiconductor components handled in a tray, such as microprocessors or memory chips. Functions of component defect inspection tools include, but are not limited to, 3D coplanarity inspection, measurement of contact uniformity, and 2D surface inspection to verify package surface characteristics, identification marks, and orientation. BEOL inspection tools may also be configured to inspect diced or undiced wafers, or diced wafers mounted on a film frame carrier. Such tools may be configured to inspect wafer surface quality, wafer cutting quality, or wafer bumps.

[0036] Tool 105 can perform inspection or measurement processes using light sources such as a white light source, an ultraviolet (UV) laser, an arc lamp or electrodeless lamp, a laser sustained plasma (LSP) source, a supercontinuum source (such as a broadband laser source), or a short-wavelength source such as an X-ray source, an extreme UV source, or a combination thereof. In some embodiments, Tool 105 can use an electron beam or an ion beam. The specific functions and structures of Tool 105 may vary and are not limited herein.

[0037] The system 100 may further comprise an inner frame 120. The inner frame 120 can define an internal volume 110, and the tool 105 can be placed within the internal volume 110. The geometric shape and dimensions of the internal volume 110 may depend on the geometric shapes and dimensions of the tool 105 and the inner frame 120. For example, the inner frame 120 may be larger than the tool 105 so that the tool 105 is completely housed within the internal volume 110. In some embodiments, the inner frame 120 may be sized such that only a portion of the tool 105 is housed within the internal volume 110. In one example, the internal volume 110 may be a rectangular prism having a front 111, a rear 112, a top 113, a left 114, and a right 115. The number of sides and the overall shape of the internal volume 110 may vary.

[0038] As shown in Figure 1, the inner frame 120 may comprise a front wall 121 and a rear wall 122. The front wall 121 and rear wall 122 may be on either side of the inner frame 120 and may cover the respective front 111 and rear 112 surfaces of the internal volume 110. The front wall 121 and rear wall 122 may comprise acoustic damping panels. Thus, the front wall 121 and rear wall 122 can enter from the front 111 and rear 112 surfaces of the internal volume 110 and prevent external vibrations from affecting the tool 105. In some embodiments, the acoustic damping panels may be 30 to 75 mm thick, but the thickness and / or material may vary depending on the specific application or the desired level of acoustic isolation for the tool 105. The front wall 121 and rear wall 122 may be further configured to shield the internal volume 110 from electromagnetic interference (EMI). For example, the front wall 121 and rear wall 122 may form a Faraday cage. Therefore, the front wall 121 and rear wall 122 can prevent external electromagnetic waves (e.g., from other tools or system components) from entering the internal volume 110, which may affect the measurements and images collected by the tool 105. It should be understood that some tools 105 may have different levels of sensitivity to EMI, and therefore the type of shielding may depend on the specific tool 105.

[0039] The system 100 may further comprise an outer frame 130. The outer frame 130 may be positioned on the inner frame 120. As shown in Figure 2, the outer frame 130 may include an upper wall 133, a left wall 134, and a right wall 135. The left wall 134 and the right wall 135 may be on either side of the outer frame 130 and may be connected by the upper wall 133. The upper wall 133, the left wall 134, and the right wall 135 may cover the uppermost surface 113, the left surface 114, and the right surface 115, respectively, of the internal volume section 110. The upper wall 133, the left wall 134, and the right wall 135 may comprise acoustic damping panels. Thus, the upper wall 133, the left wall 134, and the right wall 135 can prevent external vibrations from affecting the tool 105 entering from the uppermost surface 113, the left surface 114, and the right surface 115 of the internal volume section 110. In some embodiments, the acoustic attenuation panel may be 30 to 75 mm thick, but the thickness and / or material may vary depending on the desired level of acoustic isolation for the particular application or tool 105. The top wall 133, left wall 134, and right wall 135 may be further configured to shield the internal volume 110 from electromagnetic interference. For example, the top wall 133, left wall 134, and right wall 135 can form a Faraday cage. Thus, the top wall 133, left wall 134, and right wall 135 can prevent external electromagnetic waves (e.g., from other tools or system components) from entering the internal volume 110, which could affect the measurements and images collected by the tool 105. At least one of the top wall 133, left wall 134, and right wall 135 may be at least partially transparent. Thus, a portion of the internal volume 110 and the tool 105 can be seen through the outer frame 130. At least one of the upper wall 133, left wall 134, and right wall 135 may include a door 136, as shown in Figures 3 and 4. The door 136 may be hinged or sliding so that it can be opened and closed. Thus, part of the internal volume 110 and tools may be accessible through the door 136. The door 136 may be made of the same acoustic damping panel (e.g., having the same material and thickness) as the surrounding upper wall 133, left wall 134, or right wall 135.Door 136 may have other features (e.g., interlock switches, grounding, etc.) that can comply with the requirements of the Semiconductor Equipment and Materials Association (SEMI).

[0040] The outer frame 130 may be movable relative to the inner frame 120 between a closed position and an open position. In the closed position shown in Figures 3 and 4, the front wall 121, rear wall 122, top wall 133, left wall 134, and right wall 135 of the inner frame 120 and outer frame 130 can cover the front 111, rear 112, top 113, left 114, and right 115, respectively, of the internal volume section 110. Thus, the internal volume section 110 may be at least partially sealed from the outside by the inner frame 120 and outer frame 130. For example, in the closed position, the internal volume section 110 may have a leakage rate of 20% or less. Thus, the internal volume section 110 does not need to be completely sealed from the outside. In some embodiments, there may be a pressure difference between the internal volume section 110 and the outside. This pressure difference, based on the leakage rate, can create an outward airflow from the internal volume section 110 between the inner frame 120 and the outer frame 130. Leaks may occur around the door 136, at the joint between the top wall 133 and the left wall 134 or right wall 135, or at other locations such as cable penetration cutouts. Such outward flow can prevent contaminants that could affect the measurements and images collected by the tool 105 from entering the internal volume 110. In some embodiments, the internal volume 110 may be temperature-controlled and at least partially insulated from the outside. For example, the front wall 121, rear wall 122, top wall 133, left wall 134, and right wall 135 of the inner frame 120 and outer frame 130 may be composed of insulating material that can help prevent temperature fluctuations in the internal volume 110 despite changes in the external temperature. The material and thickness of the front wall 121, rear wall 122, top wall 133, left wall 134, and right wall 135 may depend on the specific application or the desired level of insulation for the tool 105.

[0041] In the open position shown in Figure 5, the top wall 133, left wall 134, and right wall 135 of the outer frame 130 are moved so that at least a portion of the top surface 113, left surface 114, and right surface 115 of the internal volume section 110 is open to the outside. Thus, the tool 105 may be accessible from the outside by the top surface 113, left surface 114, and right surface 115 of the internal volume section 110. The outer frame 130 may be movable relative to the inner frame 120 by pushing or pulling any of the top wall 133, left wall 134, or right wall 135. In other words, pushing or pulling any of the top wall 133, left wall 134, or right wall 135 can cause the corresponding movement of the other wall based on the connections between the top wall 133, left wall 134, and right wall 135.

[0042] In some embodiments, the inner frame 120 may be placed on the ground 101. The specific type of ground 101 may depend on the environment of the system 100, but is not limited herein. The inner frame 120 may be fixed to the ground 101 by one or more anchors, but is not limited herein. Thus, the inner frame 120 and the internal volume 110 may be fixed in place, and the outer frame 130 may be movable relative to the fixed inner frame 120.

[0043] The system 100 may further comprise a lower member 140. The lower member 140 may be placed on the ground 101. For example, the lower member 140 may be fixed to the ground 101 by one or more anchors, but is not limited herein. The inner frame 120 and the outer frame 130 may be placed on the lower member 140. For example, the inner frame 120 may be fixed to the lower member 140 by one or more anchors, but is not limited herein. Thus, the lower member 140 can provide a flat surface on which the inner frame 120 and the tool 105 can be mounted.

[0044] In some embodiments, the outer frame 130 may be movable relative to the inner frame 120 by wheels. For example, as shown in Figure 6, the left wall 134 and the right wall 135 may have one or more wheels 139 that can roll along the ground 101 or the lower member 140. Thus, the outer frame 130 is movable relative to the inner frame 120 by rotating the wheels 139, thereby facilitating easier movement between the closed position (shown in Figure 7) and the open position (shown in Figure 8). The wheels 139 may be fixed to the left wall 134 and the right wall 135 or retracted. For example, the wheels 139 may be on jacking screws, and the rotation of the jacking screws causes the wheels 139 to move upward / downward and the corresponding contact / separation between the ground 101 and the left wall 134 and the right wall 135. The wheels 139 may be locked in the closed and open positions. Using a retractable wheel 139, the wheel 139 may be retracted when the outer frame 130 is in the closed position, or it may extend so that the outer frame 130 can rotate to the open position. Such extension and retraction can be performed manually or by a combination of actuators and / or motors, and are not limited herein.

[0045] In some embodiments, the outer frame 130 may be movable relative to the inner frame 120 by sliding. For example, the left wall 134 and the right wall 135 may slide on the ground 101 or a lower member 140 so as to move relative to the inner frame 120. As shown in Figures 9 and 10, the lower member 140 may include a left guide rail 144 and a right guide rail 145, and the left wall 134 and the right wall 135 may be configured to slide within the left guide rail 144 and the right guide rail 145, respectively. The left guide rail 144 and the right guide rail 145 may help keep the sliding segments aligned while moving and locking the inner frame 120 and the outer frame 130 into open and closed positions. If the sliding segments are not aligned, parts of the inner frame 120 and the outer frame 130 may come into contact with each other, making movement difficult due to friction. The left wall 134 and the right wall 135 may also be lifted so as to move relative to the inner frame 120. For example, the left wall 134 and the right wall 135 may be positioned on the ground 101 or a lower member 140 in a closed position (shown in Figure 9), and after being lifted from the ground 101 or the lower member 140, they may be slid to an open position (shown in Figure 10) relative to the inner frame 120. Such lifting and / or sliding can be performed manually or by a combination of actuators and / or motors, and are not limited herein.

[0046] The inner frame 120 may further include a raceway 129. The raceway 129 may extend from the front wall 121 to the rear wall 122. This allows the raceway 129 to connect the front wall 121 to the rear wall 122, maximizing access around the top of the tool 105 for maintenance and repair. Wires 106 and / or fluid lines connected to the tool 105 may be routed through the raceway 129, as shown in Figure 5. Wires 106 and / or fluid lines may drop from the raceway 129 and connect to the tool 105.

[0047] The outer frame 130 may further comprise a control panel 150. The control panel 150 may be located on either the left wall 134 or the right wall 135. In some embodiments, the control panel 150 may be located on either the front wall 121 or the rear wall 122. The control panel 150 may be connected to the wires 106 of the tool 105. For example, the control panel 150 may be connected to the wires 106 by a flexible relief loop 156. The relief loop 156 may be long and / or flexible enough to maintain the connection between the control panel 150 and the wires 106 when the outer frame 130 is in the closed and open positions. In other words, as the outer frame 130 moves relative to the inner frame 120, the relief loop 156 may extend and / or flexibly adapt to maintain the connection between the control panel 150 and the wires 106, even though the control panel 150 is in a different relative position. In some embodiments, the relief loop 156 may be an extra length of the wire 106 that is slack and hangs down when the outer frame 130 is in the closed position and taut when the outer frame 130 is in the open position. Alternatively, the relief loop 156 may be a separate component connected to the wire 106 that moves or adapts based on the position of the outer frame 130. The control panel 150 may be configured to receive commands to cause the tool 105 to perform a measurement or inspection process. The methods by which the control panel 150 can receive or perform commands may vary and are not limited herein.

[0048] In some embodiments, the outer frame 130 may include one or more sections that are movable independently of (or dependent on) the inner frame 120. For example, as shown in Figures 3 to 5, the outer frame 130 may comprise a first section 130a and a second section 130b. The first section 130a may comprise a first upper wall 133a, a first left wall 134a, and a first right wall 135a (shown in Figure 3), and the second section 130b may comprise a second upper wall 133b, a second left wall 134b, and a second right wall 135b (shown in Figure 4). The individual walls of the first section 130a and the second section 130b may together cover the top surface 113, left surface 114, and right surface 115 of the internal volume section 110 in the closed position, and the walls of the first section 130a and / or the second section 130b may be moved so that at least a portion of the top surface 113, left surface 114, and right surface 115 of the internal volume section 110 is open to the outside in the open position (as shown in Figure 5). The first section 130a may be locked to the second section 130b in the closed position to prevent accidental movement. For example, the first section 130a and the second section 130b may be locked using sealing plates connected to each section. The sealing plates may be hinged to one section and connected to the other section when locked. The number of sections of the outer frame 130 is not limited herein. The individual walls of the first section 130a and the second section 130b may share the features of the outer frame 130 described above, individually and collectively, but this is not repeated here.

[0049] In some embodiments, the first section 130a and the second section 130b may be coplanar. In other words, the first upper wall 133a and the second upper wall 133b may be coplanar. The first left wall 134a and the second left wall 134b may be coplanar. The first right wall 135a and the second right wall 135b may be coplanar. Thus, the individual walls of the first section 130a and the second section 130b may be fitted end-to-end in the closed position and separated in the open position. In some embodiments, the ends of the first section 130a and the second section 130b may form an overlap joint when fitted together. The individual walls of the first section 130a and the second section 130b may be moved by the wheel 139 or slid within the left guide rail 144 and the right guide rail 145 of the lower member 140.

[0050] In some embodiments, the first section 130a and the second section 130b may be parallel. In other words, the first upper wall 133a and the second upper wall 133b may be parallel. The first left wall 134a and the second left wall 134b may be parallel. The first right wall 135a and the second right wall 135b may be parallel. As shown in Figures 11 and 12, the individual walls of the first section 130a may be larger than the individual walls of the second section 130b. Thus, the individual walls of the first section 130a may be positioned against the respective walls of the second section 130b in the open position (shown in Figure 13). Such an arrangement can result in an expansion and contraction effect where the sections of the outer frame 130 are stacked on top of each other in the open position. As shown in Figures 14 to 16, each wall of the first section 130a may have an inner flange 137a projecting inward toward the internal volume 110, and each wall of the second section 130b may have an outer flange 138b projecting outward from the internal volume 110. In the closed position shown in Figure 15, the inner flange 137a and the outer flange 138b may engage with each other to at least partially seal the first section 130a to the second section 130b. An elastomer seal can be provided between the inner flange 137a and the outer flange 138b to seal these components to each other in the closed position. As shown in Figure 16, when the first section 130a is moved to the open position relative to the inner frame 120, the inner flange 137a and the outer flange 138b may separate, thereby allowing the first section 130a to be positioned in the second section 130b. In some embodiments in which the outer frame 130 includes three or more sections, each wall of the second section 130b may further include an inner flange 137b projecting inward toward the internal volume. The inner flange 137b, like the inner flange 137a described above, can engage with the outer flange of a subsequent section to further create expansion and contraction effects.The individual walls of the first section 130a and the second section 130b may be moved by the wheels 139, or they may slide within the first left guide rail 144a and the first right guide rail 145a and the second left guide rail 144b and the second right guide rail 145b of the lower member 140.

[0051] In system 100, the inner frame 120 and outer frame 130 can provide an enclosure for the tool 105, which can provide an environment for maintaining cleanliness, temperature control, electromagnetic interference shielding, and acoustic isolation for the tool 105. Furthermore, the outer frame 130 can be moved relative to the inner frame 120 to expose the tool 105 to the outside. Such a move can be performed with less effort, improving access for maintenance and troubleshooting, thereby reducing system downtime and throughput.

[0052] While this disclosure has been described in relation to one or more specific embodiments, it will be understood that other embodiments of this disclosure can be constructed without departing from the scope of this disclosure. Therefore, this disclosure is considered to be limited only by the appended claims and their reasonable interpretation.

Claims

1. A system, wherein the system An inner frame that defines the internal volume, The inner frame comprises a front wall and a rear wall that cover the front and rear surfaces of the respective internal volume sections, A tool disposed within the aforementioned internal volume, which is a semiconductor measurement tool or a semiconductor inspection tool, An outer frame disposed on the inner frame, A first section including a first upper wall, a first left wall, and a first right wall, The outer frame includes a second section comprising a second upper wall, a second left wall, and a second right wall, In the closed position, the first upper wall, the second upper wall, the first left wall, the second left wall, the first right wall, and the second right wall can cover the uppermost, left, and right surfaces, respectively, of the internal volume, so that the internal volume is at least partially sealed from the outside, and the first section is sealed by the second section. A system in which the outer frame is movable relative to the inner frame to an open position in which at least a portion of the uppermost surface, left surface, and right surface of the internal volume is open to the outside.

2. The system according to claim 1, wherein the first section and the second section are independently movable relative to the inner frame.

3. The system according to claim 1, wherein the first section and the second section are on the same plane, and in the open position, the first section is separated from the second section.

4. The system according to claim 1, wherein the first section and the second section are parallel, and in the open position, the first section is positioned on top of the second section.

5. The system according to claim 1, wherein the front wall and the rear wall of the inner frame are provided with sound-damping panels.

6. The system according to claim 1, wherein the first upper wall, the second upper wall, the first left wall, the second left wall, the first right wall, and the second right wall of the outer frame are equipped with sound-attenuating panels.

7. The system according to claim 1, wherein the inner frame is fixed to the ground.

8. The system according to claim 1, further comprising a lower member, A system in which the inner frame and the outer frame are positioned on top of the lower member.

9. The system according to claim 8, wherein the lower member is provided with a guide rail, and the outer frame is movable relative to the inner frame by sliding within the guide rail.

10. The system according to claim 1, wherein the first left wall, the second left wall, the first right wall, and the second right wall of the outer frame are equipped with wheels, and the outer frame is movable relative to the inner frame by rotating the wheels.

11. The system according to claim 10, wherein the wheel is stored in the closed position, and the outer frame extends so that it can move relative to the inner frame to the open position by rotation.

12. The system according to claim 1, wherein in the closed position, the internal volume is temperature-controlled and at least partially insulated from the outside.

13. The system according to claim 1, wherein in the open position, the tool is accessible from the uppermost surface, the left surface, and the right surface of the internal volume.

14. The system according to claim 1, wherein the inner frame further comprises a raceway for routing electric wires and / or fluid lines connected to the tool.

15. The system according to claim 14, wherein the outer frame further comprises a control panel located on either the first right wall or the first left wall, and when the outer frame is in the open and closed positions, the control panel is connected to the wires of the tool in the raceway via a flexible relief loop, and the relief loop maintains the connection between the control panel and the wires of the tool.

16. The system according to claim 1, wherein at least one of the first left wall, the second left wall, the first right wall, and the second right wall of the outer frame is provided with a door that can be opened and closed when the outer frame is in the closed position.

17. The system according to claim 1, wherein at least one of the first left wall, the second left wall, the first right wall, and the second right wall of the outer frame is at least partially transparent.

18. The system according to claim 1, wherein in the closed position, the internal volume is partially sealed from the outside with a leakage rate of 20% or less.

19. The system according to claim 1, wherein, in the closed position, the pressure difference between the internal volume and the outside generates an outward airflow between the inner frame and the outer frame.

20. The system according to claim 1, wherein in the closed position, the inner frame and the outer frame shield the internal volume from electromagnetic interference.

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