Gas distributor including gas and coolant plenum

Abstract

A particular embodiment relates to a device having first and second surfaces, a gas distribution port, a plenum interposed between the surfaces, and a liquid cooling passage fluidly isolated from the plenum, wherein in one embodiment, the liquid cooling passage has a meandering configuration.

Description

Technical Field

[0001] Incorporation by Reference The PCT application is filed herewith simultaneously with this specification as part of this application. Each application that claims the benefit or priority as identified in the PCT application filed simultaneously herewith is incorporated herein by reference in its entirety for all purposes.

Background Art

[0002] A substrate processing tool can be used to perform various processing operations including deposition, etching, and / or other processes on or related to a substrate such as a semiconductor wafer. For example, a process chamber can be utilized to perform atomic layer deposition (ALD), atomic layer etching (ALE), chemical vapor deposition (CVD), chemical vapor etching (CVE), etc., as well as their plasma-enhanced and / or chemically enhanced versions. In other examples, the process chamber can be used for ion implantation or cleaning purposes. In any case, the substrate may be disposed on a substrate support such as a pedestal, an electrostatic chuck (ESC) within the process chamber. For example, as part of a plasma-enhanced etching process, at least one gas mixture containing one or more precursors can be introduced into the process chamber via a gas distributor, and plasma can be applied to etch the substrate or the material disposed thereon. However, it should be noted that the quality and productivity of such processes can be significantly affected by the extent to which the temperature of such processes and / or their components can be controlled. This is an even greater concern considering the role of temperature in the development of shrinking design rules and the adoption of increasingly complex process chemistries and semiconductor materials.

[0003] The background art provided herein is for the purpose of generally presenting the context of this disclosure. To the extent described herein, the inventors' research and aspects of the explanation that may not be recognized as prior art at the time of filing are not expressly or implicitly recognized as prior art to this disclosure. [Overview of the Initiative] [Means for solving the problem]

[0004] Details of one or more implementations of the subject matter described herein are given in the accompanying drawings and the following description. Other features, embodiments, and advantages will become apparent from the description, drawings, and claims. The following non-limiting implementations are considered part of this disclosure, and other implementations will also become apparent from the entire disclosure and the accompanying drawings.

[0005] According to some embodiments, a gas distributor is provided that includes both a gas and a coolant plenum.

[0006] Additional embodiments are described in the following detailed description, some of which may be apparent from this disclosure or known by the embodiments disclosed and / or the practice of the claimed subject matter.

[0007] According to one embodiment, the apparatus includes a first surface, a second surface, a plurality of first gas distribution ports, a first gas distribution plenum, and one or more liquid cooling passages. The second surface faces the first surface in a first direction. The plurality of first gas distribution ports extend in a first direction and are fluidly connected to at least one first gas inlet. Each first gas distribution port has a distal end that forms a first gas distribution opening on the first surface. The first gas distribution plenum is interposed between the first surface and the second surface. The first gas distribution plenum is fluidly connected between at least one first gas inlet and the proximal ends of the first gas distribution ports. One or more liquid cooling passages are interposed between the first surface and the second surface. A reference plane extending in a second direction across the first direction extends through the central portion of one or more liquid cooling passages. The reference plane is interposed between the first gas distribution plenum and the first surface in a first direction. Between the first surface and the second surface, one or more liquid cooling passages are fluidly isolated from the first gas distribution plenum.

[0008] In some embodiments, the apparatus may further include a cooling layer comprising a third surface and a fourth surface facing the third surface in a first direction. The cooling layer may further include one or more liquid cooling passages interposed between the third surface and the fourth surface, and portions of a first gas distribution port extending from the third surface through the fourth surface.

[0009] In some embodiments, the third surface can define the first surface.

[0010] In some embodiments, the cooling layer may further include a coolant inlet passage fluidly connected to at least one of one or more liquid cooling passages, and a coolant outlet passage fluidly connected to at least one of one or more liquid cooling passages.

[0011] In some embodiments, the cooling layer may further include a fifth surface extending between the third and fourth surfaces. The fifth surface may include a coolant inlet opening forming the proximal end of the coolant inlet passage and a coolant outlet opening forming the distal end of the coolant outlet passage. The coolant inlet passage may include a first portion extending in a second direction traversing the first direction. The coolant outlet passage may include a second portion extending in a third direction traversing the first direction.

[0012] In some embodiments, the coolant inlet passage may further include a third portion fluidly connected between a first portion and at least one of the coolant passages, and the coolant outlet passage may further include a fourth portion fluidly connected between a second portion and at least one of the coolant passages, and the third and fourth portions may extend in a fourth direction traversing each of the second and third directions.

[0013] In some embodiments, the cooling inlet passage may be one of a plurality of cooling inlet passages fluidly connected to one or more liquid cooling passages. The cooling outlet passage may be one of a plurality of cooling outlet passages fluidly connected to one or more liquid cooling passages. Each of the cooling inlet passages may include a section extending radially inward from the corresponding coolant inlet opening of the fifth surface toward the central portion of the cooling plate. Each of the cooling outlet passages may include a section extending radially inward from the corresponding coolant outlet opening of the fifth surface toward the central portion of the cooling plate.

[0014] In some embodiments, the fourth surface of the cooling layer may include a coolant inlet opening and a coolant outlet opening. The coolant inlet opening may form the proximal end of the first portion of the coolant inlet passage. The distal end of the first portion of the coolant inlet passage may be fluidically connected to at least one of one or more liquid cooling passages. The coolant outlet opening may form the distal end of the first portion of the coolant outlet passage. The proximal end of the first portion of the coolant outlet passage may be fluidically connected to at least one of one or more liquid cooling passages. The first portion of the coolant inlet passage may extend in a fourth direction. The first portion of the coolant outlet passage may extend in a fourth direction.

[0015] In some embodiments, the first and fourth directions may be equivalent.

[0016] In some embodiments, a cooling inlet passage may be one of a plurality of cooling inlet passages fluidly connected to one or more liquid cooling passages, and a cooling outlet passage may be one of a plurality of cooling outlet passages fluidly connected to one or more liquid cooling passages, each of the cooling inlet passages may include a section extending in a third direction toward the first surface from a corresponding coolant inlet opening on the fourth surface, and each of the cooling outlet passages may include a section extending in a third direction toward the first surface from a corresponding coolant outlet opening on the fourth surface.

[0017] In some embodiments, one or more liquid cooling passages may be multiple liquid cooling passages, each of the multiple cooling inlet passages may be fluidly connected to a corresponding cooling passage among the liquid cooling passages, and each of the multiple cooling outlet passages may be fluidly connected to a corresponding cooling passage among the liquid cooling passages.

[0018] In some embodiments, the cooling layer may include multiple cooling layers connected to one another.

[0019] In some embodiments, one or more liquid cooling passages can define recesses formed in at least one of the cooling layers.

[0020] In some embodiments, the width of each of one or more liquid cooling passages in at least one direction perpendicular to the first direction may be greater than the height of each of the one or more liquid cooling passages in the first direction.

[0021] In some embodiments, one or more liquid cooling passages can include one or more structures configured to induce turbulent flow along the one or more liquid cooling passages.

[0022] In some embodiments, one or more liquid cooling passages can correspond to a single liquid cooling passage.

[0023] In some embodiments, the single liquid cooling passage may have a cylindrical configuration.

[0024] In some embodiments, when viewed in the first direction, one or more liquid cooling passages can include a first liquid cooling passage and a second liquid cooling passage surrounding the first liquid cooling passage.

[0025] In some embodiments, when viewed in the first direction, the first and second liquid cooling passages may have an annular configuration.

[0026] In some embodiments, the first and second liquid cooling passages may surround a central axis extending in the first direction through the first and second surfaces, and one or more liquid cooling passages can further include one or more third liquid cooling passages extending radially from the central axis.

[0027] In some embodiments, the first, second, and one or more third liquid cooling passages may be fluidly connected to each other between the first surface and the second surface.

[0028] In some embodiments, when viewed in a first direction, one or more liquid cooling passages may have one or more serpentine configurations.

[0029] In some embodiments, when viewed in a first direction, one or more serpentine configurations may serpentine around a central axis extending in the first direction through first and second surfaces.

[0030] In some embodiments, when viewed in a first direction, one or more liquid cooling passages can form a fractal pattern.

[0031] In some embodiments, a first gas distribution port may be disposed outside one or more liquid cooling passages.

[0032] In some embodiments, at least one of the first gas distribution ports may be disposed outside one or more liquid cooling passages, and at least one of the first gas distribution ports may be disposed inside one or more liquid cooling passages.

[0033] In some embodiments, the gas distribution layer can further include a first gas distribution plenum intervening between a sixth surface and a seventh surface.

[0034] In some embodiments, the sixth surface can define the second surface.

[0035] In some embodiments, the gas distribution layer further includes an eighth surface extending between a sixth surface and a seventh surface and a first gas inlet passage fluidly connected to the first gas distribution plenum. The eight surfaces can include a first gas inlet forming a proximal end of the first gas inlet passage. The first gas inlet passage can include a first portion extending in a fifth direction transverse to the first direction.

[0036] In some embodiments, the first gas inlet passage may further include a second portion fluidly connected between a first portion of the first gas inlet passage and a first gas distribution plenum. The second portion of the first gas inlet passage may extend in a sixth direction traversing a fifth direction.

[0037] In some embodiments, the first and sixth directions may be equivalent.

[0038] In some embodiments, the first gas inlet passage may be one of a plurality of first gas inlet passages fluidly connected to the first gas distribution plenum, each of which may include a section extending radially inward from the corresponding first gas inlet on the eighth surface toward the central portion of the gas distribution layer.

[0039] In some embodiments, the gas distribution layer may further include a second portion of a coolant inlet passage and a second portion of a coolant outlet passage. The second portion of the coolant inlet passage may extend from a sixth surface through a seventh surface. The second portion of the coolant inlet passage may be fluidically connected to a first portion of the coolant inlet passage. The second portion of the coolant outlet passage may extend from a sixth surface through a seventh surface. The second portion of the coolant outlet passage may be fluidically connected to a first portion of the coolant outlet passage.

[0040] In some embodiments, the apparatus may further include a plurality of second gas distribution ports and a second gas distribution plenum. The plurality of second gas distribution ports may extend in a first direction and may be fluidically connected to a second gas inlet. Each second gas distribution port may have a distal end that forms a second gas distribution opening on the first surface. The second gas distribution plenum may be interposed between the first surface and the second surface. The second gas distribution plenum may be fluidically connected between the second gas inlet and the respective proximal ends of the second gas distribution ports.

[0041] In some embodiments, the first gas distribution port may surround the second gas distribution port, and the first gas distribution plenum may surround the second gas distribution plenum.

[0042] In some embodiments, the first surface may face an internal cavity in a first direction.

[0043] In some embodiments, the process chamber can be defined as a transformer-coupled plasma etching chamber.

[0044] In some embodiments, the second surface may be exposed to the surrounding environment.

[0045] In some embodiments, the pedestal may face a first surface in a first direction.

[0046] In some embodiments, the liquid coolant may be non-thermally conductive.

[0047] In some embodiments, the liquid coolant may be nonpolar.

[0048] In some embodiments, the liquid coolant may include at least one of polyfluoride compounds, perfluoride compounds, separated hydrofluoroether compounds, metal oxides, and carbon nanotubes.

[0049] The general description above and the detailed description below are illustrative and explanatory, and are intended to provide further explanation of the claimed subject matter.

[0050] Various embodiments disclosed herein are shown as examples, not as limitations, in the drawings of the appended drawings, where similar reference numerals refer to similar elements. [Brief explanation of the drawing]

[0051] [Figure 1]A schematic representation of a substrate processing system is provided, which can be used to process semiconductor wafers and, in some embodiments, may also allow for thermal control of the temperature of the gas distributor. [Figure 2] A schematic perspective view of the gas distributor shown in Figure 1, according to several embodiments, is shown. [Figure 3] A schematic cross-sectional view of the gas distributor in a partially assembled state according to several embodiments is shown in Figure 2. [Figure 4] A schematic cross-sectional view of the gas distributor in a partially assembled state according to several embodiments is shown in Figure 2. [Figure 5] A schematic perspective view of the first part of the gas distributor of Figure 2 according to several embodiments is shown. [Figure 6] A schematic orthographic projection of the first part of the gas distributor of Figure 2 according to several embodiments is shown. [Figure 7] Schematic cross-sectional views of the first portion of the gas distributor in Figures 5 and 6, taken along cross-sectional lines 7-7 and 8-8, respectively, according to several embodiments, are shown. [Figure 8] Schematic cross-sectional views of the first portion of the gas distributor in Figures 5 and 6, taken along cross-sectional lines 7-7 and 8-8, respectively, according to several embodiments, are shown. [Figure 9] A schematic cross-sectional view of the first part of a gas distributor according to several embodiments is shown. [Figure 10] A schematic cross-sectional view of the first part of a gas distributor according to several embodiments is shown. [Figure 11] Schematic cross-sectional views of the first portion of the gas distributor in Figures 5 and 6, taken along the cross-sectional line 11-11, are shown according to several embodiments. [Figure 12] A schematic cross-sectional view of another first part of a gas distributor according to several embodiments is shown. [Figure 13] A schematic cross-sectional view of another first part of a gas distributor according to several embodiments is shown. [Figure 14] A schematic cross-sectional view of another first part of a gas distributor according to several embodiments is shown. [Figure 15] A schematic cross-sectional view of another first part of a gas distributor according to several embodiments is shown. [Figure 16] A schematic cross-sectional view of another first part of a gas distributor according to several embodiments is shown. [Figure 17] A schematic perspective view of the second part of the gas distributor in Figure 2, according to several embodiments, is shown. [Figure 18] A schematic perspective view of the second part of the gas distributor in Figure 2, according to several embodiments, is shown. [Figure 19] A schematic orthographic projection of the second portion of the gas distributor in Figure 2, according to several embodiments, is shown. [Figure 20] A schematic cross-sectional view of the second part of the gas distributor in Figure 2, according to several embodiments, is shown. [Figure 21] A schematic enlarged detail view of part 21 shown in Figure 20, according to several embodiments, is shown. [Figure 22] A schematic enlarged detail view of part 22 shown in Figure 21, according to several embodiments, is shown. [Figure 23] A schematic enlarged detail view of part 23 shown in Figure 19, according to several embodiments, is shown. [Figure 24] A schematic cross-sectional view of the second portion of the gas distributor in Figure 2, taken along the cross-sectional line 24-24, is shown according to several embodiments. [Figure 25] A schematic cross-sectional view of the second part of the gas distributor in Figure 2, according to several embodiments, is shown. [Figure 26] A schematic cross-sectional view of the second part of a gas distributor according to several embodiments is shown. [Figure 27] A schematic cross-sectional view of the second part of a gas distributor according to several embodiments is shown. [Figure 28] Schematic orthographic views of the ring assembly of the gas distributor shown in Figure 2, according to several embodiments, are shown. [Figure 29] Schematic perspective views of the ring structure of the ring assembly shown in Figure 28 according to several embodiments are shown. [Figure 30]A schematic cross-sectional view of the gas distributor portion of Figure 2 is shown according to several embodiments. [Figure 31] Schematic perspective views of various aspects of the connection block of the gas ring assembly shown in Figure 28, according to several embodiments, are shown. [Figure 32] Schematic perspective views of various aspects of the connection block of the gas ring assembly shown in Figure 28, according to several embodiments, are shown. [Figure 33] Schematic perspective views of partially assembled gas distributors according to several embodiments are shown. [Figure 34] A schematic cross-sectional view of a partially assembled gas distributor, as shown in Figure 33, is provided for several embodiments. [Figure 35] Schematic perspective views of partially assembled gas distributors according to several embodiments are shown. [Figure 36] A schematic cross-sectional view of a partially assembled gas distributor, as shown in Figure 35, is provided for several embodiments. [Figure 37] Several embodiments of a multi-station process tool are schematically shown. [Modes for carrying out the invention]

[0052] The following description includes numerous specific details to provide a thorough understanding of the various embodiments. The disclosed embodiments may be implemented without some or all of these specific details. In other examples, well-known process behaviors are not described in detail so as not to unnecessarily obscure the disclosed embodiments. The disclosed embodiments are described in conjunction with specific embodiments, but it should be understood that this is not intended to limit the disclosed embodiments.

[0053] In this application, the terms “semiconductor wafer,” “wafer,” “substrate,” “wafer substrate,” and “partially fabricated integrated circuit” are used interchangeably. Those skilled in the art will understand that the term “partially fabricated integrated circuit” can refer to a silicon wafer in any of the many stages of integrated circuit fabrication on which it is made. Wafers or substrates used in the semiconductor device industry typically have a diameter of 200 mm, 300 mm, or 450 mm. In addition to semiconductor wafers, other workpieces that may utilize the disclosed embodiments include a variety of articles such as printed circuit boards, magnetic recording media, magnetic recording sensors, mirrors, optical elements, and micromechanical devices.

[0054] context As feature sizes continue to shrink, high aspect ratio (HAR) structures are becoming more common. HAR structures typically exhibit features with height-to-width ratios exceeding 5:1, 20:1, or even 50:1. Fabricating such features using conventional wet etching techniques presents several challenges, including reduced efficiency, at least partially attributable to decreased diffusion and surface charge layer overlap in geometrically confined space. Dry etching techniques utilizing gas and / or vapor phase etching chemistry attempt to address these issues to some extent, but as mentioned above, the quality and productivity of such processes can be heavily influenced by how well the temperature of the process and its components can be controlled. Typically, reacting species of gas and / or vapor phase precursors are generated by exciting molecules in a plasma discharge through a dielectric window above the process chamber, but cooling the dielectric window can be difficult. This is especially true with regard to conventional air cooling techniques, which utilize relatively large, noisy, expensive, and inefficient fans and / or compressors to extract heat from the dielectric window. Therefore, air-cooled devices are typically not only affected by ambient temperature conditions but also susceptible to magnetostriction, which can cause the air-cooled device itself to introduce heat into the system or generate audible hum. Thus, one or more embodiments of liquid cooling technology stem from the recognition that liquid cooling technology has a higher ability to transfer thermal energy compared to air-cooled solutions, thereby potentially providing greater thermal performance over a smaller working range. This, in turn, allows for the extraction of more heat from the dielectric window, resulting in a higher plasma density within the process chamber. Furthermore, liquid cooling technology provides greater control over the cooling system, as such technology increases control over inlet temperature and flow rate, not to mention enabling environmentally sealed solutions.

[0055] Semiconductor processing system Figure 1 schematically shows a substrate processing system that can be used to process semiconductor wafers, and in some embodiments, it may also be possible to thermally control the temperature of the gas distributor.

[0056] Referring to Figure 1, a substrate processing system (or system) 100 is shown which can be used to etch a substrate 101 or a material placed thereon. In some embodiments, system 100 can be used to adjust or control the temperature of a gas distributor 103 before, during, and / or after one or more etching processes that can be driven using thermal and / or plasma energy. While inductively coupled plasma (ICP) etching systems are particularly referred to, any other type of ICP or transformer-coupled plasma (TCP) etching system and / or other plasma processing system can be used. In some implementations, system 100 can include radio frequency (RF) generation systems 105 and 107. RF generation system 105 can include an RF source 109 (e.g., a transformer-coupled plasma RF generator) connected to a transformer-coupled capacitive tuning (TCCT) circuit 111 which can be configured to output current to an inductive coil structure 113.

[0057] In some embodiments, the TCCT circuit 111 may include a matching network 115 and a power distributor 117. The matching network 115 may be connected to the RF source 109 by a transmission line and may be configured to match the impedance of the RF source 109 to at least the rest of the TCCT circuit 111, such as the power distributor 117 and / or an inductive coil structure 113. The TCCT circuit 111 may have or include any number of suitable electrical designs, but at least one configuration is shown and described in U.S. Patent Application Publication No. 2013 / 0135058 filed by Long et al., vested in the same assignee, which is incorporated herein by reference for all purposes as if it were fully described herein.

[0058] The induction coil structure 113 may include a single induction coil, a pair of induction coils, an inner and outer induction coil pair, or any other configuration. In this way, the power distributor 117 can be used to control the relative amount of induced current supplied to the coils of the induction coil structure 113, thereby generating one or more time-varying magnetic fields that can be used to spark, induce, or excite the plasma 119 in the process chamber 121. Depending on the process performed through the process chamber 121, the induction coil structure 113 may be driven in capacitive mode to generate a plasma 119 with a relatively low density, and / or driven in induction mode to generate a plasma 119 with a relatively high density. Furthermore, the coils of the induction coil structure 113 may have any suitable configuration, such as planar coils, cylindrical coils, or half-toroidal coils. In some embodiments, the induction coil structure 113 may be located outside the process chamber 121, adjacent to the gas distributor 103, for example, to reduce the possibility of contamination from the material of the induction coil structure 113 (e.g., metal).

[0059] The process chamber 121 may have any suitable geometric configuration that defines at least one or more internal cavity regions capable of processing the substrate 101, such as an internal cavity region 123. In some cases, the process chamber 121 may include a gas distributor 103 positioned along at least one of its sides or surfaces. Although the gas distributor 103 is shown as having a “top plate” configuration, embodiments are not limited thereto. For example, the gas distributor 103 may have a showerhead or other type of configuration. As will be described in more detail later, the gas distributor 103 may include one or more plenum volumes 125, one or more liquid cooling passages 127, and a window 129. For convenience of explanation, the plenum volumes 125 and the liquid cooling passages 127 are referred to collectively and / or individually as plenum volumes 125 and liquid cooling passages 127 unless otherwise indicated in the context. However, generally, the plenum volume 125 may be located between the induction coil structure 113 and a window 129, which may be a dielectric window extending along at least one wall (or side) of the process chamber 121. The liquid cooling passage 127 may be located between the plenum volume 125 and the window 129, which may interface with an internal cavity region 123 of the process chamber 121. Exemplary gas distributors and their components are described in more detail with reference to Figures 2-36.

[0060] According to various embodiments, the temperature of the gas distributor 103 can be adjusted by controlling the flow of one or more thermally conductive cooling fluids, such as a liquid coolant 131, through the liquid cooling passage 127 via at least one regulator, such as a valve 133, and, for example, a pump 135. In some cases, controlling the temperature of the gas distributor 103 can also facilitate the control of the temperature of one or more walls of the process chamber 121 and / or one or more gases flowing through the gas distributor 103. It should also be noted that by controlling the temperature of the gas distributor 103, the temperature of the walls of the process chamber 121, and / or the temperature of the gases flowing through the gas distributor 103, the possibility of condensation forming in or on them can be prevented or at least reduced.

[0061] The process chamber 121 may also include a substrate support 137 configured to support the substrate 101 during at least one semiconductor process. The substrate support 137 may be an electrostatic chuck, a mechanical chuck, and / or any other suitable type of chuck / support structure, or may include them. During at least one semiconductor process, plasma 119 may be generated within the process chamber 121. The plasma 119 can be used, for example, to etch the substrate 101 and / or material placed on it.

[0062] The RF generation system 107 may include one or more bias RF sources 139 and 141 and a bias matching circuit 142. The RF source 139 can provide a bias RF voltage to bias the substrate support 137 during operation. The bias matching circuit 142 can match the impedances of the RF sources 139 and 141 to, for example, the electrode assembly of the substrate support 137. Collectively, the RF generation systems 105 and 107 can form an RF generation system 143, and may therefore be called the RF generation system 143, and may be controlled by a system controller 145.

[0063] The gas delivery system 147 can be used to supply one or more gases, such as a gas mixture, to the process chamber 121 before, during, and / or after at least one semiconductor process. In some cases, the gas delivery system 147 may be located adjacent to the gas distributor 103. The gas delivery system 147 may include one or more process gas sources 149, at least one measuring system 151, and a manifold 153. The at least one measuring system 151 may include one or more valves and one or more mass flow controllers that can be configured together with the manifold 153 to mix and / or supply one or more process gases to the process chamber 121 via at least the gas distributor 103.

[0064] The thermally conductive cooling fluid delivery system 155 can be used to deliver the liquid coolant 131 through the liquid cooling passage 127 via, for example, a valve 133 or at least one regulator and a pump 135. In some implementations, the liquid coolant 131 may include at least one of aliphatic compounds, polyfluorinated compounds, perfluorinated compounds, segregated hydrofluoroether compounds, glycols, metals, liquid metals, metal oxides, carbon nanotubes, diamonds, and ionic liquids. In some cases, the liquid coolant 131 may be non-thermally conductive and non-polar. For example, the liquid coolant 131 may be one of 3M's Fluorinert® compounds, one of 3M's Novec® compounds, one of Solvay's Galden® compounds, and so on. As described above, the liquid coolant 131 can be used to cool, for example, a gas distributor 103, but the embodiments are not limited thereto. A heater and / or cooler (hereinafter referred to as a temperature regulator) 157 can be used to heat and / or cool the substrate support 137 to a determined temperature or temperature range. In some cases, the temperature regulator 157 may include one or more resistive heating elements and / or one or more coolant passages arranged in relation to at least one of the process chamber 121, the gas distributor 103, and / or the substrate support 137.

[0065] According to various embodiments, the gas can exit the process chamber 121 through an exhaust gas port or outlet that is fluidly coupled to, for example, a vacuum pump 159, which may be part of the exhaust system 161. The vacuum pump 159 may be a one-stage or two-stage mechanical dry pump and / or a turbomolecular pump. In this way, the gas can be drawn from the process chamber 121 to the exhaust section 163 to maintain a suitable low pressure within the process chamber 121. For this reason, a closed-loop flow limiting device 165, such as a throttle valve or pendulum valve, can be controlled by the system controller 145 to further ensure a suitable low pressure within the process chamber 121. In some cases, the exhaust section 163 may be a scrub exhaust section.

[0066] The system controller 145 can be used to control at least one semiconductor process performed on or against the substrate 101, such as an etching process. In this way, the system controller 145 can be configured to operate the system 100 by executing one or more sequences of one or more instructions that define at least one process recipe. For example, the system controller 145 can be configured to monitor various process parameters such as temperature, pressure, power, grounding, timing, and distance, as well as to control, for example, the delivery of one or more gas mixtures, the ignition, maintenance, and extinguishing of the plasma 119, the removal of reactants, the supply of liquid coolant 131 to the liquid cooling passage 127, and the mechanical movement of at least one of the gas distributor 103, the substrate support 137, and the substrate 101. The system 100 may also include a temperature controller 167 configured to control the temperature of at least one of the gas distributor 103, the process chamber 121, and the substrate support 137. In this way, the system controller 145 and / or temperature controller 167 can control and / or exchange information with various components of the system 100, including, for example, application-specific integrated circuits (ASICs), programmable logic devices (e.g., field-programmable gate arrays (FPGAs)), etc.

[0067] According to some embodiments, the system controller 145 receives input signals from the sensor 169 and, based on the input signals, can control the operation of one or more of the RF sources 109, 139, and 141, the bias matching circuit 142, the temperature regulator 157, and / or other components of the system 100. The sensor 169 can be located in the RF generation system 143, the process chamber 121, the gas distributor 103, the substrate support 137, and / or other locations in the system 100. Various sensors within the sensor 169 can detect, for example, the supplied RF voltage, temperature, gas and / or coolant flow rate, and gas and / or coolant pressure.

[0068] The selection module 171 may be connected to the temperature controller 167 and may include a sensor 169 (e.g., a multi-range voltage sensor) and a multiplexer (MUX) 173. In some cases, the selection module 171 may be contained within the process chamber 121, as shown in the figure, or outside the process chamber 121. The multiplexer 173 may be configured to select one or more signals received from one or more of the sensors 169 for, for example, transmission to the temperature controller 167. Based on the voltage signals received from the multiplexer 173, the temperature controller 167 can control the temperature of the gas distributor 103, the substrate support 137, and / or other components of the system 100. In some cases, the temperature controller 167 may receive an RF voltage signal from the system controller 145 and / or directly from the RF generation system 143, as shown by the dashed line 175, indicating the RF voltage generated by the RF generation system 143. The RF voltage signal may also be used, either additionally or alternatively, to control the temperature of, for example, the gas distributor 103, the substrate support 137, and / or other components of the system 100.

[0069] An Ethernet (EtherCAT) medium (or cable) 177 for control automation technology may be present between the EtherCAT interface of the RF generation system 143, the system controller 145, the temperature controller 167, and the selection module 171. An analog medium (or cable), such as a signal line 175, may be present between the RF generation system 143 and the temperature controller 167. Relatively fast parameter transmission via the EtherCAT interface and / or analog interface may be provided for relatively rapid / real-time responses (e.g., response times of 1 millisecond (ms) or less), but the embodiments are not limited thereto. In some cases, each EtherCAT interface may have a data transfer rate of 1 kilohertz (kHz), but the implementation is not limited thereto.

[0070] Exemplary gas distributor Figure 2 schematically shows perspective views of the gas distributor of Figure 1 in several embodiments. Figures 4 and 3 schematically show various cross-sectional views of the gas distributor of Figure 2 in a partially assembled state in several embodiments.

[0071] Referring to Figures 2, 4, and 3, the gas distributor 200 may, in some embodiments, have a multi-piece (e.g., three-piece) configuration including a first part 201, a second part 203, and a third part 205. In some cases, the first part 201 and the second part 203 may have a substantially circular plate configuration and may be made of one or more electrically insulating materials such as alumina, silicon nitride, aluminum nitride, doped silicon carbide, or quartz. The third part 205 may be an assembly of components and may have a substantially ring-shaped (or annular) configuration that at least partially surrounds the first part 201 and the second part 203 in the assembled state of the gas distributor 200. In some cases, the first portion 201 and the second portion 203 may be layers of a monolithic body, or they may be plates joined to each other using one or more fasteners such as anchors, bolts, clips, nuts, rivets, screws, ties, and / or any other suitable joining technique such as adhesive bonding, diffusion bonding, soldering, or welding. It is also conceivable that at least one of the first portion 201 and the second portion 203 may be formed from one or more layers. In any case, the gas distributor 200 may have a first surface 301 and a second surface 303 facing the first surface 301 in a first direction, such as the axial direction of the gas distributor 200. The axial direction may extend parallel (or substantially parallel) to an axis 207, which may be the central axis of the gas distributor 200. For this reason, the first surface 301 may face the substrate 101 in the first direction as part of at least one stage of a processing operation utilizing the process chamber 121. The first part 201 will be described in more detail, at least in relation to Figure 5-16, and the second part 203 will be described more completely, at least in relation to Figures 17-27. The third part 205 will be described later, at least with reference to Figures 28-32.

[0072] Before describing the various parts of the gas distributor 200 in more detail, it should be noted that the gas distributor 200 may include one or more gas distribution plenums (e.g., a first gas distribution plenum 305 and a second gas distribution plenum 307), one or more groups of gas distribution ports (e.g., a first gas distribution port 309 and a second gas distribution port 311), and one or more liquid cooling passages (e.g., a first liquid cooling passage 313 and a second liquid cooling passage 315). In some embodiments, one or more groups of gas distribution ports may extend in a first direction between a second surface 303 and a first surface 301 and be fluidly connected to a corresponding gas inlet. For example, the first gas distribution port 309 may be fluidically connected to the first gas inlet 317 by the first gas distribution plenum 305, and the second gas distribution port 311 may be fluidically connected to one or more second gas inlets (e.g., second gas inlets 319_1, ..., 319_n, where n is a positive integer of 1 or more) by the second gas distribution plenum 307. One or more groups of gas distribution ports may have distal ends that form corresponding gas distribution openings (e.g., a first gas distribution opening 321 and a second gas distribution opening 323) on the first surface 301. Therefore, the first gas distribution plenum 305 and the second gas distribution plenum 307 can be interposed between the second surface 303 and the first surface 301 in the first direction and may be fluidly connected to the respective proximal ends (e.g., the first proximal end 325 and the second proximal end 327) of one or more groups of gas distribution ports.

[0073] According to various embodiments, the first reference surface 329 may extend through the central portion of one or more liquid cooling passages and may be located between one or more gas distribution plenums and the first surface 301 in a first direction. It should be noted that one or more liquid cooling passages may be fluidly isolated from one or more gas distribution plenums and one or more gas distribution ports in the gas distributor 200. Nevertheless, some of the gas distribution ports may extend through one or more liquid cooling passages in various embodiments, as will become clearer below. One or more liquid cooling passages, such as the first liquid cooling passage 313 and the second liquid cooling passage 315, may correspond to the liquid cooling passage 127 described in relation to system 100. Thus, one or more liquid cooling passages may be configured to carry a liquid coolant (e.g., liquid coolant 131) to control or otherwise adjust the temperature of the gas distributor 200. Therefore, one or more liquid cooling passages can be fluidly connected at their respective distal ends to corresponding coolant inlet / outlet passages (e.g., a first coolant inlet passage 331A and a first coolant outlet passage 331B / a second coolant inlet passage 333A and a second coolant outlet passage 333B), thereby forming corresponding coolant outlet / inlet openings of the coolant inlet / outlet passages (e.g., a first coolant outlet opening 401B and a first coolant inlet opening 401A / a second coolant outlet opening 403B and a second coolant inlet opening 403A). The coolant inlet / outlet passages may also have respective proximal ends that form corresponding coolant inlet / outlet openings (e.g., a first coolant inlet opening 405A and a first coolant outlet opening 405B / a second coolant inlet opening 407A and a second coolant outlet opening 407B).

[0074] In various implementations, the width 409 of each liquid cooling passage may be greater than (e.g., substantially greater than) the corresponding height 411 of the liquid cooling passage. For example, the width 409 may be about an order of magnitude larger than the height 411, but the embodiment is not limited thereto. For example, the width 409 may be about twice, three times, or four times the height 411. Furthermore, the liquid cooling passages may be configured to support relatively high flow rates of the liquid coolant 131 in order to facilitate the cooling of the gas distributor 200. For example, one or more liquid cooling passages may be configured to flow at a maximum of about 10 liters / minute (L / min), e.g., about 3 L / min to about 8 L / min, e.g., 5 L / min to about 9 L / min, e.g., about 3 L / min to about 7 L / min. However, it should be noted that the flow rate of the liquid coolant 131 through the liquid cooling passages may be set based on the processing operations performed using the gas distributor 200. The liquid cooling passage may include one or more internal features or collision points (e.g., the presence of one or more gas distribution ports) that can promote turbulence within it and, consequently, promote the cooling of the gas distributor 200. For example, the Reynolds number of the flow may be greater than at least 4000, but embodiments are not limited thereto. Thus, the liquid cooling passage may be configured to remove up to about 10 kilowatts (kW) of heat from the gas distributor 200. In some cases, the liquid cooling passage may be configured to remove a heat flux in the range of about 100 W to about 10 kW, e.g., about 1 kW to about 5 kW, e.g., about 2 kW to about 5 kW, e.g., about 3 kW to about 4 kW, but embodiments are not limited thereto. Furthermore, the configuration of the liquid cooling passage can enable a more uniform temperature profile across the gas distributor 200.

[0075] Example of Part 1 Figure 5 schematically shows perspective views of the first part of the gas distributor of Figure 2 according to several embodiments, and Figure 6 schematically shows orthographic projections of the first part of the gas distributor of Figure 2 according to several embodiments. Figures 7 and 8 schematically show cross-sectional views of the first part of the gas distributor of Figures 5 and 6 according to several embodiments. Figure 11 schematically shows cross-sectional views of the first part of the gas distributor of Figures 5 and 6 taken along cross-sectional line 11-11 according to several embodiments.

[0076] Referring to Figures 5-8 and 11, the first portion 201 may include a first (e.g., lower) surface 501, a second (e.g., upper) surface 503, a third (e.g., first outer) surface 505, a fourth (e.g., second outer) surface 507, and a fifth (e.g., intermediate) surface 509. In this way, the first portion 201 may have a stepped configuration in which the second surface 503, the third surface 505, and the fifth surface 509 at least partially border or define the upper section 701, and the first surface 501 and the fourth surface 507 at least partially border or define the lower section 703. The fifth surface 509 may optionally be an annular vacuum sealing surface configured to vacuum seal to, for example, a temperature-controlled wall (or surface) of the process chamber 121. It should be noted that the first surface 501 may generally correspond to the first surface 301 described in relation to at least Figures 3 and 4.

[0077] The first gas distribution port 511 may extend axially along axis 512 between the second surface 503 and the first surface 501 in a first area of ​​the first portion 201. Axis 513 may define the central axis of the first portion 201 in some implementations. The second gas distribution port 515 may extend axially along axis 512 between the second surface 503 and the first surface 501 in a second area of ​​the first portion 201. In some cases, the first area and the second area may be a first annular area and a second annular area of ​​the first portion 201, with the second annular area surrounding the first annular area, but the embodiments are not limited thereto. For this reason, the first gas distribution port 511 may each include a first gas inlet 801 and a first gas outlet 803, and the second gas distribution port 515 may each include a second gas inlet 805 and a second gas outlet 807. The first gas distribution port 511 and the second gas distribution port 515 may correspond to the first gas distribution port 309 and the second gas distribution port 311 described in relation to at least Figures 3 and 4. As will become clearer below, the first gas distribution port 511 may be fluidically isolated from the second gas distribution port 515 in the gas distributor 200, but the embodiments are not limited thereto. For example, the first gas distribution port 511 and the second gas distribution port 515 may be fluidically connected to each other by a common supply plenum in the gas distributor 200. In any case, the first gas outlet 803 and the second gas outlet 807 can output one or more gases in the process chamber 121 before, during, and / or after at least one stage of the processing operation.

[0078] According to some embodiments, one or more liquid cooling passages (e.g., a first liquid cooling passage 313 and a second liquid cooling passage 315) can be formed in the area interposed between the second surface 503 and the first surface 501 of the first portion 201. For convenience of explanation, the one or more liquid cooling passages formed in the first portion 201 will be referred to below as the first liquid cooling passage 313 and the second liquid cooling passage 315, but as will become more apparent below, the first portion 201 may contain any suitable configuration and / or number of liquid cooling passages. In some embodiments, a first reference surface 329 extending in a second direction traversing a first direction may extend through the central portions of the first liquid cooling passage 313 and the second liquid cooling passage 315. According to some embodiments, the first reference surface 329 may be positioned such that the upper surfaces 313a and 315a of the first liquid cooling passage 313 and the second liquid cooling passage 315, respectively, are aligned (or substantially aligned) with the fifth surface 509, but the embodiments are not limited thereto.

[0079] The first liquid cooling passage 313 and the second liquid cooling passage 315 may be annular passages that surround the axis 512 of the first portion 201 when viewed along the axis 512, as shown in Figure 11. In some implementations, the annular passage may be partially annular, e.g., C-shaped, or otherwise partially surround the axis 512. In some cases, the annular passage may not be truly annular, additionally or alternatively; for example, the annular passage may have an octagonal cross-section when viewed along the axis 512, thus resulting in an annular passage with radial symmetry rather than axial symmetry. Thus, the term “annular passage” as used herein may refer to a passage that extends around all or part of the axis 512 in a plane perpendicular to the axis 512, regardless of the exact shape of such a passage. Thus, the annular passage may have, for example, a circular, elliptical, polygonal, or any other suitable cross-sectional shape when viewed along the axis 512. Furthermore, at least one cross-sectional shape of the annular passage may differ from at least one other of the annular passage in terms of size, shape, etc.

[0080] In some embodiments, the first liquid cooling passage 313 may be aligned concentrically (or substantially concentrically) with the second liquid cooling passage 315 such that the second liquid cooling passage 315 surrounds the first liquid cooling passage 313. It should also be noted that embodiments are not limited to the first liquid cooling passage 313 and the second liquid cooling passage 315 being fluidically isolated from each other within the gas distributor 200. For example, two or more liquid cooling passages, such as the first liquid cooling passage 313 and the second liquid cooling passage 315 of the gas distributor 200, may be fluidically connected to each other. For this purpose, the first liquid cooling passage 313 may be fluidically connected to the first cooling inlet passage 331A and the first cooling outlet passage 331B, and thus the first portion 201 may include the first section 601 of the first cooling inlet passage 331A and the first section 603 of the first cooling outlet passage 331B. The second liquid cooling passage 315 may be fluidly connected to the second cooling inlet passage 333A and the second cooling outlet passage 333B, and thus the first portion 201 may include the first section 605 of the second cooling inlet passage 333A and the first section 607 of the second cooling outlet passage 333B. The first sections 601 and 605 of the first cooling inlet passage 331A and the second cooling inlet passage 333A may each include the first coolant outlet opening 401B and the second coolant outlet opening 403B. The first sections 603 and 607 of the first cooling outlet passage 331B and the second cooling outlet passage 333B may each include the first coolant inlet opening 401A and the second coolant inlet opening 403A. In this manner, the liquid coolant 131 can flow into the first liquid cooling passage 313 and the second liquid cooling passage 315 via the first cooling inlet passage 331A and the second cooling inlet passage 333A, and can flow out from the first liquid cooling passage 313 and the second liquid cooling passage 315 via the first cooling outlet passage 331B and the second cooling outlet passage 333B.

[0081] As shown in Figure 11, the first gas distribution port 511 and the second gas distribution port 515 may be located in their respective areas of the first portion 201 of the gas distributor 200. For example, the first portion 201 may include a first area 1101 where the first gas distribution port 511 is located and a second area 1103 where the second gas distribution port 513 is located. In some implementations, the first area 1101 may be surrounded by a first liquid cooling passage 313, and the second area 1103 may be surrounded by a second liquid cooling passage 315. The first portion 201 may also include a third area 1105 that can surround the second liquid cooling passage 315. Thus, the first area 1101, the first liquid cooling passage 313, the second area 1103, the second liquid cooling passage 315, and the third area 1105 may be concentrically aligned (or substantially aligned) with respect to one another, but the embodiments are not limited thereto. It should also be noted that the first sections 601 and 605 of the first cooling inlet passage 331A and the second cooling inlet passage 333A, and the first sections 603 and 607 of the first cooling outlet passage 331B and the second cooling outlet passage 333B are shown in Figure 11 using dashed lines to illustrate, for example, the relative positioning of the first sections 601, 603, 605, and 607 with respect to the first liquid cooling passage 313 and the second liquid cooling passage 315.

[0082] According to some embodiments, the first gas distribution port 511 and the second gas distribution port 513 may be distributed in any suitable arrangement within the first area 1101 and the second area 1103. For example, the first gas distribution port 511 may be distributed to the first area 1101 in a first multi-ring configuration, and the second gas distribution port 513 may be distributed to the second area 1103 in a second multi-ring configuration. The first and second multi-ring configurations may be concentrically aligned (or substantially aligned) with the first area 1101, the first liquid cooling passage 313, the second area 1103, the second liquid cooling passage 315, and the third area 1105, but embodiments are not limited thereto. In some embodiments, one or more of the first gas distribution ports 511 and the second gas distribution ports 513 may be located in one or more of the first liquid cooling passage 313 and the second liquid cooling passage 315 (e.g., surrounded by their respective portions). Some examples of such configurations will be described in more detail with reference to Figures 12, 14, 15, and 16. In any case, the presence of at least one gas distribution port in the corresponding liquid cooling passage can form other obstacles that can increase the velocity of such liquid coolant 131, as well as, for example, collision surfaces, constraints, or other obstacles that can increase the velocity of such liquid coolant 131, as well as promote more turbulence in the liquid coolant 131 through the corresponding liquid cooling passage. The turbulence and / or increased velocity may have accompanying advantages in terms of cooling efficiency, e.g., improved heat extraction rate from the gas distributor 200, a more uniform temperature profile of the gas distributor 200, and so on. In some embodiments, additional or alternative forms such as collision surfaces, restrictions, and / or other obstacles, protrusions, or winding passages can be formed in one or more of the liquid cooling passages of the gas distributor 200 to enhance its thermal performance.

[0083] Figures 12, 13, 14, 15, and 16 schematically show cross-sectional views of other first parts of a gas distributor according to several embodiments.

[0084] As shown in Figure 12, the first portion 1200 may include a single liquid cooling passage, i.e., a liquid cooling passage 1201. In some cases, the liquid cooling passage 1201 may have a substantially circular configuration when viewed along the axis 1203, which is shown in Figure 12 as extending out of the plane of the paper. In some embodiments, the axis 1203 may form the central axis of the first portion 1200. The liquid cooling passage 1201 may be surrounded by an outer region 1205 when viewed along the axis 1203. Unlike the first portion 201, the first portion 1200 may include a first gas distribution port 1207 and a second gas distribution port 1209 located in the liquid cooling passage 1201 (e.g., surrounded by each portion). Similar to the first gas distribution ports 511 and 515 of the first part 201, the first gas distribution ports 1207 and 1209 of the first part 1200 can distribute in one or more (e.g., first and second) multi-ring configurations that can be aligned (or substantially aligned) concentrically with axis 1203. Furthermore, the liquid cooling passage 1201 may be fluidically connected to one or more cooling inlet passages and one or more cooling outlet passages. For example, the liquid cooling passage 1201 may receive one or more flows of liquid coolant from three liquid cooling inlet passages 1211 and three liquid cooling outlet passages 1213, but embodiments are not limited thereto. In other words, the liquid cooling passage 1201 may be fluidically connected to any suitable number of cooling inlet and cooling outlet passages, and the number of cooling inlet passages does not have to be equal to the number of cooling outlet passages. The liquid cooling inlet passage 1211 and the liquid cooling outlet passage 1213 are shown with dashed lines because the cross-sectional view shown in Figure 12 does not actually intersect these passages; however, it should be noted that the use of dashed lines also at least indicates the relative position of these passages to, for example, the liquid cooling passage 1201. Furthermore, the first part 1200 may include any appropriate number and / or arrangement of gas distribution ports.

[0085] Referring to Figure 13, the first portion 1300 may include multiple liquid cooling passages, such as a plurality of annularly configured liquid cooling passages (e.g., a first liquid cooling passage 1301 and a second liquid cooling passage 1303) and a plurality of radially extending liquid cooling passages (e.g., a third liquid cooling passage 1305). The first liquid cooling passage 1301 and the second liquid cooling passage 1303 may be concentrically (or substantially) aligned with the axis 1307, which are shown in Figure 13 as extending out of the plane of the paper. The third liquid cooling passage 1305 may extend radially from the axis 1307 and may be fluidly connected to the first liquid cooling passage 1301 and the second liquid cooling passage 1303. The first portion 1300 is shown to include two annularly configured liquid cooling passages and eight radially extending liquid cooling passages, but embodiments are not limited thereto. For example, the first part 1300 may include any suitable number of annularly configured and / or radially extending liquid cooling passages.

[0086] According to some embodiments, the second liquid cooling passage 1303 may surround the first liquid cooling passage 1303. The first liquid cooling passage 1301 may not only surround the first area 1309 of the first portion 1300, but may also function as a boundary between the first area 1309 and the second area 1311 of the first portion 1300. Similarly, the second liquid cooling passage 1303 may not only surround the second area 1311 of the first portion 1300, but may also function as a boundary between the second area 1311 and the third area 1313 of the first portion 1300. In some cases, the first 1309 to the third area 1313 of the first portion 1300 may be aligned concentrically (or substantially aligned) with the axis 1307. It should also be noted that the various liquid cooling passages of the first portion 1300 may be fluidly connected to a common cooling inlet passage 1315 and a plurality of cooling outlet passages 1317. Similar to the liquid cooling inlet passage 1211 and the liquid cooling outlet passage 1213, the common cooling inlet passage 1315 and the cooling outlet passage 1317 are shown with dashed lines because the cross-sectional view shown in Figure 13 does not actually intersect these passages, but the use of dashed lines indicates, at least, the relative position of these passages to the various liquid cooling passages of the first section 1300. As shown, the common cooling inlet passage 1315 may be concentric with the axis 1307 in a central area of ​​the first section 1300, such as the center (or substantial center) of the first area 1309. In this way, the corresponding proximal end of the third liquid cooling passage 1305 may be fluidly connected to the common cooling inlet passage 1315. The distal end of the third liquid cooling passage 1305 may be fluidly connected to each of the cooling outlet passages 1317, and the cooling outlet passages may be circumferentially arranged around the axis 1307 of the third area 1313 of the first section 1300. In this way, the liquid coolant 131 can flow into the various liquid cooling passages of the first section 1200 via the common cooling inlet passage 1315 and out of the various liquid cooling passages of the first section 1200 via the cooling outlet passage 1317.

[0087] Similar to the first part 201, the first part 1300 may include first gas distribution ports 1319 and second gas distribution ports 1321 distributed in one or more (e.g., first and second) multi-ring configurations that can be aligned (or substantially aligned) concentrically with axis 1307. For example, the first gas distribution port 1319 may be distributed in a first multi-ring configuration in a first area 1309 of the first part 1300, and the second gas distribution port 1321 may be distributed in a second multi-ring configuration in a second area 1311 of the first part 1300. However, it should be noted that the first part 1300 may include any appropriate number and / or arrangement of gas distribution ports.

[0088] With respect to Figure 14, the first portion 1400 may include one or more liquid cooling passages having a meandering configuration when viewed along the axis 1401, which are shown extending out of the plane of the paper. For example, the first portion 1400 may include a liquid cooling passage 1403 having a meandering configuration around the axis 1401. As used herein, a passage having a meandering configuration generally refers to a passage that follows a winding or meandering path, such as a passage that includes a plurality of parallel / straight or concentric / curved long segments extending between two regions, where the end of each such long segment is generally connected by a short segment to the nearest end of another such long segment or one of two nearest ends (except for the start and end of such a passage which may not feature such short segments). For example, the liquid cooling passage 1403 may include a plurality of concentric / curved long segments 1405 that are fluidically connected to one another by corresponding short segments of a plurality of short segments 1407 adjacent to the opposing sides of an inlet segment 1409. The first part 1400 is shown to include five long segments 1405 and four short segments 1407, but embodiments are not limited thereto. For example, any suitable number of long segments and / or short segments can be used to achieve a desired amount of cooling.

[0089] According to some embodiments, the proximal end of the liquid cooling passage 1403, for example, the proximal end of the inlet segment 1409, may be fluidly connected to a cooling inlet passage 1411, and the distal end of the liquid cooling passage 1403 may be fluidly connected to a cooling outlet passage 1413. The cooling inlet passage 1411 and the cooling outlet passage 1413 are shown by dashed lines because the cross-sectional view shown in Figure 14 does not actually intersect these passages, but the use of dashed lines at least illustrates examples of relative positioning that may be available for these passages with respect to the liquid cooling passage 1403. In this way, the liquid coolant (e.g., liquid coolant 131) may flow into the liquid cooling passage 1403 via the cooling inlet passage 1411, which may be located in the outer annular region 1415 of the first portion 1400, or it may flow into the inner circular region 1417 along the inlet segment 1409, the inner circular region 1417 may be spaced apart from the outer annular region 1415 by an intermediate annular region 1419. In some embodiments, regions 1415, 1417, and 1419 may be concentrically aligned (or substantially aligned) with respect to each other. From the inner circular region 1417, the liquid coolant can flow along a meandering path provided by segments 1405 and 1407 of the liquid cooling passage 1403 to provide a flow of liquid coolant to each of regions 1415, 1417, and 1419. The flow of liquid coolant can exit the first portion 1400 through a cooling outlet passage 1413, which may also be located in the outer annular region 1415.

[0090] Similar to the first portion 201, the first portion 1400 may include first gas distribution ports 1421 and second gas distribution ports 1423 distributed in one or more (e.g., first and second) multi-ring configurations that can be aligned (or substantially aligned) concentrically with the axis 1401. For example, the first gas distribution ports 1421 may be distributed in a first multi-ring configuration in an inner circular region 1417 of the first portion 1400, and the second gas distribution ports 1423 may be distributed in a second multi-ring configuration in an intermediate annular region 1419. The first gas distribution ports 1421 may include one or more first gas distribution ports 1421A located in an area outside the liquid cooling passage 1403 and one or more first gas distribution ports 1421B located in an area inside the liquid cooling passage 1403. The first gas distribution ports 1421B may optionally surround the first gas distribution ports 1421A. The second gas distribution port 1423 may be located in an area inside the liquid cooling passage 1403. However, it should be noted that the first part 1400 may include any appropriate number and / or arrangement of gas distribution ports.

[0091] According to some embodiments, one or more liquid cooling passages of the first portion 201 may have any suitable fractal pattern, two examples of which are described in further detail with reference to Figures 15 and 16.

[0092] Referring to Figure 15, the first portion 1500 may include an annular cooling passage 1501, a first radial cooling passage 1503, a second radial cooling passage 1505, and multiple liquid cooling passages such as a cooling passage pattern, e.g., a cooling passage pattern 1507. Hereinafter, the cooling passage patterns will be referred to collectively or individually as cooling passage pattern 1507. In some embodiments, the annular cooling passage 1501 may be formed in an outer annular region 1509 of the first portion 1500, which may have a central axis 1511 extending out of the plane of the paper. The outer annular region 1509 may surround an inner circular region 1513, and the inner circular region 1513 may be separated from the outer annular region 1509 by an intermediate annular region 1515. In some implementations, the regions 1509, 1513, and 1515 of the first portion 1500 may be concentrically aligned (or substantially aligned) with respect to each other. The proximal ends of the first radial cooling passage 1503 and the second radial cooling passage 1505 may extend radially from the central axis 1511 and may be fluidically connected to each other within the inner circular region 1513. The distal end of the first radial cooling passage 1503 may be fluidically connected to the corresponding portion of the annular cooling passage 1501 within the outer annular region 1509, and the distal end of the second radial cooling passage 1505 may be fluidically connected to one or more cooling passage patterns of the cooling passage pattern 1507. In the illustrated example, the distal ends of the second radial cooling passage 1505 are each connected to two cooling passage patterns of the cooling passage pattern 1507.

[0093] According to some embodiments, each cooling passage pattern 1507 may include a corresponding first branch passage 1517 that fluidly connects a second radial cooling passage among the second radial cooling passages 1505 to a plurality of second branch passages 1519, the second branch passages 1519 which may form a repeating pattern of cooling passages within regions 1509 and 1513 of the first portion 1500. In some cases, the configuration of the repeating pattern of cooling passages formed by a first group of second branch passages 1519 associated with one first branch passage 1517 may be symmetrical to the configuration of the repeating pattern of cooling passages formed by a second group of second branch passages 1519 associated with the other first branch passage 1517, centered on one or more axes of symmetry, such as axes 1521 and 1523. In this way, the combination of the annular cooling passage 1501, the first radial cooling passage 1503, the second radial cooling passage 1505, and multiple cooling passage patterns, such as the cooling passage pattern 1507, can exhibit double symmetry.

[0094] In some implementations, the annular cooling passage 1501 may be fluidically connected to one or more cooling inlet passages, such as cooling inlet passages 1525, which can be located on diametrically opposed sides of the first portion 1500. For example, the cooling inlet passages 1525 may be located on diametrically opposed sides of the first portion 1500, and the axis 1523 may extend through the central portion of each of the cooling inlet passages 1525, and optionally through the central portion of the second radial cooling passage 1505. If the annular cooling passage 1501, the first radial cooling passage 1503, the second radial cooling passage 1505, and a plurality of cooling passage patterns, for example, cooling passage pattern 1507, exhibit double symmetry, the axis 1521 may extend through the central portion of the first radial cooling passage 1503. It should also be noted that the distal end of the second branch passage 1519 may be fluidly connected to a corresponding cooling outlet passage, such as a cooling outlet passage 1527. The cooling inlet passage 1525 and the cooling outlet passage 1527 are shown with dashed lines because the cross-sectional view shown in Figure 15 does not actually intersect these passages; however, the use of dashed lines at least illustrates an example of their relative positioning with respect to the area of ​​the first section 1500.

[0095] The liquid coolant (e.g., liquid coolant 131) can flow into multiple liquid cooling passages of the first section 1500 via the cooling inlet passage 1525 and flow circumferentially around the outer annular region 1509 to the distal end of the first radial cooling passage 1503. In this way, the liquid coolant can flow radially inward along the first radial cooling passage 1503, thereby flowing through regions 1509, 1513, and 1515 to the proximal end of the second radial cooling passage 1505. The liquid coolant can then flow radially outward along the second radial cooling passage 1505 from the inner circular region 1513 to the intermediate annular region 1515 and be distributed into the respective cooling passage patterns 1507. The liquid coolant flows through the cooling passage pattern 1507 and can exit the first section 1500 via a cooling outlet passage (e.g., cooling outlet passage 1527) that is fluidly connected to the distal end of the second branch passage 1519.

[0096] Similar to the first part 201, the first part 1500 may include first gas distribution ports 1529 and second gas distribution ports 1531 distributed in one or more (e.g., first and second) multi-ring configurations that can be aligned (or substantially aligned) concentrically with the axis 1511. For example, the first gas distribution ports 1529 may be distributed in a first multi-ring configuration in an inner circular region 1513 of the first part 1500, and the second gas distribution ports 1531 may be distributed in a second multi-ring configuration in an intermediate annular region 1515. The second gas distribution ports 1531 may include one or more first gas distribution ports 1531A located in areas outside various liquid cooling passages of the first part 1500, and one or more second gas distribution ports 1531B located in areas inside at least one liquid cooling passage of the first part 1500. In some cases, the second gas distribution port 1531A may be located in one or more of the various rings of gas distribution ports that form the second multi-ring configuration of the second gas distribution port 1531. The same applies to the second gas distribution port 1531B. The first gas distribution port 1529 may be located in an area outside the various liquid cooling passages of the first section 1500. In some cases, the arrangement of the first gas distribution port 1529 and the second gas distribution port 1531 may also exhibit bisymmetry with respect to axes 1521 and 1523. However, it should be noted that the first section 1500 can include any suitable number and / or arrangement of gas distribution ports.

[0097] Referring to Figure 16, the first portion 1600 may include a plurality of liquid cooling passages, such as an annular cooling passage 1601, a radial cooling passage 1603, a first branching passage 1605, and a second branching passage 1607, which together form a plurality of repeating cooling passage patterns 1609. In some embodiments, the plurality of repeating cooling passage patterns 1609 may form a snowflake-like fractal pattern of liquid cooling passages. In some cases, the annular cooling passage 1601 may be formed in an outer annular region 1611 of the first portion 1600, which may have a central axis 1613 extending out of the plane of the paper. The outer annular region 1611 may surround an inner circular region 1615, which may be separated from the outer annular region 1611 by an intermediate annular region 1617. Regions 1611, 1615, and 1617 of the first portion 1600 may be concentrically aligned (or substantially aligned) with respect to each other in some implementations. The proximal radial cooling passage 1603 may extend radially from the central axis 1613 and may be fluidically connected to each other within the inner circular region 1615. The distal end of the radial cooling passage 1603 may be fluidically connected to the corresponding portion of the annular cooling passage 1601 within the outer annular region 1611. Each radial cooling passage of the radial cooling passage 1603 may have a plurality of first branch passages of the first branch passage 1605, which are fluidly connected at various intermediate positions between the inner circular region 1615 and the outer annular region 1611. For example, the first pair of proximal ends of the first branch passage 1605 may extend in a first oblique direction from the first and second intermediate positions of the corresponding radial cooling passage 1603, and the second pair of proximal ends of the first branch passage 1605 may extend in a second oblique direction from the first and second intermediate positions of the corresponding radial cooling passage 1603. The second oblique direction may be different from the first oblique direction. In addition, each cooling passage pattern in the cooling passage pattern 1609 may include a second branch passage in the second branch passage 1607 that fluidly connects the distal end of the first branch passage of the first branch passage 1605 which constitutes a part of the cooling passage pattern.In some cases, the distal end of the radially outermost first branch of the first branch passage 1605 may also be fluidly connected to the corresponding portion of the annular cooling passage 1601. In this configuration, the snowflake-like fractal pattern formed by the various liquid cooling passages of the first portion 1600 can exhibit multiple symmetries (e.g., triple symmetry) with respect to a folding axis extending, for example, along the radial cooling passage 1603.

[0098] In some implementations, the proximal end of a radial cooling passage 1603 may be fluidically connected to a common cooling inlet passage 1619, which may be concentric (or substantially aligned) with the axis 1613 and located within an inner circular region 1615. Furthermore, multiple cooling outlet passages 1621 may be fluidly connected to annular cooling passages 1601 in areas located within an outer annular region 1611. In some embodiments, the cooling outlet passages 1621 may be circumferentially arranged around the axis 1613, and each cooling passage pattern of the cooling passage pattern 1609 may be associated with each cooling outlet passage of the cooling outlet passages 1621. Thus, the cooling outlet passages 1621 may be circumferentially arranged between the distal ends of adjacent radial cooling passages of the radial cooling passages 1603. In some cases, each cooling outlet passage 1621 can be radially aligned (or substantially aligned) with the corresponding second branch passage 1607 of the respective cooling passage pattern 1609. The cooling inlet passage 1619 and the cooling outlet passage 16121 are shown with dashed lines because the cross-sectional view shown in Figure 16 does not actually intersect these passages. However, it should be noted that the use of dashed lines is at least to illustrate an example of the relative positioning that may be used for these passages with respect to the area of ​​the first section 1600.

[0099] According to some embodiments, a liquid coolant (e.g., liquid coolant 131) can flow into multiple liquid cooling passages of the first section 1600 via a common cooling inlet passage 1619, and flow outward in a substantially radial flow pattern from the inner circular region 1615 through the intermediate annular region 1617 to the outer annular region 1611 via a combination of radial cooling passages 1603, a first branching passage 1605, and a second branching passage 1607. However, it should be noted that a substantially radial flow of the liquid coolant may be distributed to the intermediate annular region 1617 via the first branching passage 1605 and the second branching passage 1607, and a substantially radial flow of the liquid coolant may flow radially from the distal end of the radial cooling passage 1603 through the corresponding portion of the annular cooling passage 1601 and be circumferentially distributed to the outer annular region 1611. The liquid coolant distributed in the intermediate annular region 1617 can also flow into the annular cooling passage 1601 via the second branching passage 1607 and the radially outermost pair of distal ends of the first branching passages 1605 associated with each cooling passage pattern 1609. In this way, the liquid coolant flowing into the annular cooling passage 1601 can exit from the first section 1600 via the cooling outlet passage 1621.

[0100] Similar to the first sections 1400 and 1500, the first section 1600 may include first gas distribution ports 1623 and second gas distribution ports 1625 distributed in one or more (e.g., first and second) multi-ring configurations that can be aligned (or substantially aligned) concentrically with the axis 1613. For example, the first gas distribution ports 1623 may be distributed in a first multi-ring configuration in an inner circular region 1615 of the first section 1600, and the second gas distribution ports 1625 may be distributed in a second multi-ring configuration in an intermediate annular region 1617. The first gas distribution ports 1623 may include one or more first gas distribution ports 1623A located in areas outside various liquid cooling passages of the first section 1600, and one or more first gas distribution ports 1623B located in areas inside at least one liquid cooling passage of the first section 1600. Therefore, the first gas distribution port 1623A may be located in one or more of the various rings of the first gas distribution port that form the first multi-ring configuration of the first gas distribution port 1623. Similarly, the second gas distribution port 1625 may include one or more second gas distribution ports 1625A located in the outer areas of the various liquid cooling passages of the first section 1600, and one or more second gas distribution ports 1625B located in the inner areas of at least one liquid cooling passage of the first section 1600. In some cases, the second gas distribution port 1625A may be located in one or more of the various rings of the second gas distribution port that form the second multi-ring configuration of the second gas distribution port 1625. In some cases, the arrangement of the first gas distribution port 1623 and the second gas distribution port 1625 may also exhibit multiple symmetries (e.g., triple symmetry) with respect to a folding axis extending, for example, along the radial cooling passage 1603. However, the first part 1600 may include any appropriate number and / or arrangement of gas distribution ports.

[0101] Example of the second part Figures 17 and 18 schematically show perspective views of the second portion of the gas distributor in Figure 2 according to several embodiments. Figure 19 schematically shows an orthographic projection of the second portion of the gas distributor in Figure 2 according to several embodiments. Figure 20 schematically shows a cross-sectional view of the second portion of the gas distributor in Figure 2 according to several embodiments. Figure 21 schematically shows an enlarged detail view of the portion 21 shown in Figure 20 according to several embodiments. Figure 22 schematically shows an enlarged detail view of the portion 22 shown in Figure 21 according to several embodiments. Figure 23 schematically shows an enlarged detail view of the portion 23 shown in Figure 19 according to several embodiments. Figure 24 schematically shows a cross-sectional view of the second portion of the gas distributor in Figure 2 taken along cross-sectional line 24-24 according to several embodiments. Figure 25 schematically shows a cross-sectional view of the second portion of the gas distributor according to several embodiments.

[0102] Referring to Figures 17 to 24, the second portion 203 may have a substantially annular configuration including a first (e.g., upper) surface 1701, a second (e.g., lower) surface 1703, a third (e.g., inner) surface 1705, and a fourth (e.g., outer) surface 1707. The first surface 1701 may correspond to the second surface 303 of the gas distributor 200. Multiple radially extending gas passages 1709 may extend inward from the fourth surface 1707 toward the axis 1711, and multiple axially extending gas passages 1801 may extend axially parallel (or substantially parallel) to the axis 1711 toward the first surface 1701 from the second surface 1703. In some cases, the axis 1711 may form the central axis or central axis of the second portion 203 and / or the gas distributor 200. While eight radially extending gas passages 1709 and eight gas passages 1801 are shown as examples, embodiments are not limited thereto. For example, the second part 203 may include more or fewer than eight radially extending gas passages 1709 and / or more or fewer than eight gas passages 1801. For convenience of explanation, we will assume that the second part 203 includes eight radially extending gas passages 1709 and eight gas passages 1801.

[0103] The proximal end of s may be fluidly connected to a radially extending gas passage 1709, and the distal end of the gas passage 1801 may be fluidly connected to a first recess 1803 formed in the second surface 1703. The first recess 1803 may define a second gas distribution plenum 307 within the gas distributor 200 together with the second surface 503 of the first portion 201. The second gas distribution plenum 307 may have a substantially annular configuration when viewed along the axis 1711 and may be laterally sealed between a first gasket (e.g., an O-ring) 609 and a second gasket 611 (shown as dashed in Figure 6), which may be at least partially supported by a second recess 1805 and a third recess 1807 of the second surface 1703. In some cases, when the first portion 201 and the second portion 203 are combined to form the gas distributor 200, the first gasket 609 and the second gasket 611, which are at least partially supported in the second recess 1805 and the third recess 1807, may be at least partially compressed between the second surfaces 1703 and 503 of the second portion 203 and the first portion 201, respectively.

[0104] The third surface 1705 of the second portion 203 may define the outer boundary of the first gas inlet 317, and the first gas inlet 317 may have a substantially cylindrical configuration extending along the axis 1711 from the first surface 1701 to the second surface 1703. The proximal end of the first gas inlet 317 may be configured to receive one or more gases (e.g., one or more process gases) from, for example, a gas delivery system 147, and the distal end of the first gas inlet 317 may be fluidly connected to the first gas distribution plenum 305. In some cases, the first gas distribution plenum 305 may have a substantially cylindrical configuration when viewed along the axis 1711, and may be defined by the combination of the fourth recess 1813 of the second surface 1703 and the second surface 503 of the first portion 201. Therefore, the first gas distribution plenum 305 can be fluidly isolated from the second gas distribution plenum 307 in the gas distributor 200 by a third gasket (e.g., an O-ring) 613 (shown as a dashed line in Figure 6) which can be at least partially supported in a fifth recess 1815 of the second surface 1703 of the second portion 203. In some cases, when the first portion 201 and the second portion 203 are combined to form the gas distributor 200, the third gasket 613 may be at least partially compressed between the second surfaces 1703 and 503 of the second portion 203 and the first portion 201, respectively.

[0105] To supply one or more gases (e.g., process gases) to radially extending gas passages 1709, the second portion 203 may include first mounting holes 1713 and second mounting holes 1715 for coupling (e.g., detachably coupling) each gas connection mounting block 209 thereto. For example, the second portion 203 may include eight pairs of axially extending mounting holes (e.g., first mounting holes 1713) and eight pairs of radially extending mounting holes (e.g., second mounting holes 1715). In this way, each gas passage 1709 may be associated with a corresponding pair of first mounting holes 1713 and a corresponding pair of second mounting holes 1715. The first mounting holes 1713 may extend through the second portion 203 along their respective central axes 2401, for example, each of the first mounting holes 1713 may extend from the first surface 1701 through the second surface 1703 along the corresponding central axis 2401, which is shown in Figure 24 as extending out of the plane of the paper. Each pair of the second mounting holes 1715 may be positioned corresponding to each mounting surface, such as a mounting surface 1717 that can form a plane (or substantially plane) on the fourth surface 1707. Thus, the second portion 203 may include eight mounting surfaces 1717 of the fourth surface 1707 that are circumferentially arranged around the axis 1711 in relation to the corresponding radially extending gas passage 1709. The corresponding central axis 2403 of each second mounting hole 1715 may extend radially inward toward the axis 1711 and may intersect with the corresponding central axis 2401. Thus, each of the second mounting holes 1715 may be fluidly connected to the corresponding first mounting hole 1713, as shown in Figure 24, but the embodiment is not limited thereto. For this reason, each pair of the first mounting holes 1713 and the second mounting holes 2415 may be spaced evenly (or substantially evenly) from the corresponding central axis 2405 of the radially extending gas passage 1709.

[0106] In some implementations, the supply of one or more gases (e.g., process gases) to the first gas inlet 317 can be facilitated using an annular projection 1719 that can extend from the first surface 1701 of the second portion 203 along the axis 1711. The annular projection 1719 can be configured to structurally engage with a gas supply stem (or other structure) that is fluidly connected to, for example, the gas delivery system 147, as well as to be fluidly connected to the first gas inlet 317. In some cases, the annular projection 1719 may also include one or more mating engagement features, such as a bayonet-type engagement mechanism 2001 configured to work in conjunction with one or more corresponding mating engagement features of the gas supply stem. However, it is conceivable that any other suitable mating engagement features, such as one or more fasteners, adhesives, other mating engagement structures, or welds, could be utilized.

[0107] According to various embodiments, the second portion 203 may further include a second section 2501 of the first cooling inlet passage 331A and a second section 2503 of the first cooling outlet passage 331B. The second portion 203 may also include a second section 2505 of the second cooling inlet passage 333A and a second section 2507 of the second cooling outlet passage 333B. When the first section 201 and the second section 203 are incorporated as part of the gas distributor 200, the distal end 2509 of the second section 2501 may be fluidically connected to the first section 601 formed in the first section 201, the distal end 2511 of the second section 2503 may be fluidically connected to the first section 603 of the first section 201, the distal end 2513 of the second section 2505 may be fluidically connected to the first section 605 of the first section 201, and the distal end 2515 of the second section 2507 may be fluidically connected to the first section 607 of the first section 201. In this manner, the liquid coolant 131 can flow into the first liquid cooling passage 313 and the second liquid cooling passage 315 of the first section 201 via the first cooling inlet passage 331A and the second cooling inlet passage 333A, and can flow out of the first liquid cooling passage 313 and the second liquid cooling passage 315 of the first section 201 via the first cooling outlet passage 331B and the second cooling outlet passage 333B.

[0108] According to some embodiments, at least one of the first part 201 and the second part 203 may be manufactured, for example, by machining or otherwise forming their various features from one or more material pieces or layers. For example, as seen in Figures 7, 8, 20, and 25, the various features of the first part 201 and the second part 203 may each be formed on a single part or material body. In Figures 9, 10, 26, and 27, the first part 201 and the second part 203 can be manufactured, for example, by machining or otherwise forming their various features using a plurality of separate layers, and then joining, fusing, or otherwise fitting the various layers into a stack laminated or otherwise joined together to provide the first part 201 and the second part 203. However, it is conceivable that equivalent structures can be produced using other suitable techniques, for example, by additive manufacturing, at least one of the first part 201 and the second part 203 can be “3D printed” from, for example, metal, ceramic, and / or any other suitable material. Examples of multiple distinct layers forming the first portion 201 and the second portion 203 are described in more detail with reference to Figures 9, 10, 26, and 27.

[0109] Figures 9 and 10 schematically show cross-sectional views of the first part of a gas distributor according to several embodiments.

[0110] Referring to Figures 9 and 10, the first part 201 may initially be formed as a first part 900 including separate layers 901 and 903. Layer 901 may define a second surface 503 and include a mating surface 905, and layer 903 may define a first surface 501 and include a mating surface 907. In this way, features such as the first liquid cooling passage 313 and the second liquid cooling passage 315 may be formed as corresponding recesses in the mating surface 907 of layer 903, rather than as sealed cavities as in the case of a single part or material structure. When joined to form the first part 900, the mating surfaces 905 and 907 may be joined, fused, or otherwise connected to each other, and the mating surface 905 may, for example, at least partially enclose the first liquid cooling passage 313 and the second liquid cooling passage 315 within the first part 900. This allows for simplification and / or reduction of manufacturing costs for the first part 201. However, this could increase the complexity of aligning parts of features that span different layers, such as the first gas distribution port 511 and the second gas distribution port 515.

[0111] Figures 26 and 27 schematically show cross-sectional views of the second part of a gas distributor according to several embodiments.

[0112] Referring to Figures 26 and 27, the second portion 203 may initially be formed as a second portion 2600 including separate layers 2601 and 2603. Layer 2601 may define a first surface 1701 and include a mating surface 2605, and layer 2603 may define a second surface 1703 and include a mating surface 2607. In this way, features such as radially extending gas passages 1709 may be formed as corresponding recesses in the mating surface 2605 of layer 2601 having a relatively low aspect ratio, in contrast to blind holes with a relatively high aspect ratio formed on the fourth surface 1707 of a single part or material structure. When joined to form section portion 2600, the mating surfaces 2605 and 2607 may be joined, fused, or otherwise connected to one another, and the mating surface 2607 may, for example, at least partially enclose a radially extending gas passage 1709 within the second portion 2600. This can simplify the second portion 203 and / or reduce manufacturing costs. However, this may increase the complexity of aligning portions of features that span different layers of the second portion 2600, such as the second sections 2501 and 2503 of the first cooling inlet passage 331A and the first cooling outlet passage 331B, and the second sections 2505 and 2507 of the second cooling inlet passage 333A and the second cooling outlet passage 333B.

[0113] Example of the third part Figure 28 schematically shows orthographic projections of the ring assembly of the gas distributor of Figure 2 according to several embodiments. Figure 29 schematically shows perspective views of the ring structure of the ring assembly of Figure 28 according to several embodiments. Figure 30 schematically shows cross-sectional views of parts of the gas distributor of Figure 2 according to several embodiments. Figures 31 and 32 schematically show various perspective views of the connection block of the gas ring assembly of Figure 28 according to several embodiments.

[0114] Referring to Figures 28 to 32, the third portion 205 of the gas distributor 200 can define a gas delivery structure having a plurality of gas connection mounting blocks 209 coupled to their respective mounting positions 2901 on (or within) the support ring 2801. The blocks 209 may be fluidly connected between the gas delivery system 147 and the corresponding radially extending gas passages 1709 of the second portion 203 of the gas distributor 200. Thus, the number of blocks 209 can correspond to the number of radially extending gas passages 1709, but embodiments are not limited thereto. However, for the sake of explanation, we will assume that the number of blocks 209 corresponds to the number of radially extending gas passages 1709. As shown in the figure, the number of blocks 209 is 8.

[0115] According to various embodiments, the block 209 may be coupled to corresponding mounting positions 2901 that can be distributed circumferentially around the support ring 2801 in correspondence with the locations of radially extending gas passages 1709. In some cases, the block 209 may be coupled to the corresponding mounting positions 2901 via a plurality of fasteners that interface with each mounting point 2903 of each mounting position 2901 and the corresponding mounting holes 3101 of the corresponding block 209. The blocks 209 may be fluidically connected to one another via a plurality of connection passages 2803 that can supply one or more gases via gas supply inlets 2905 formed in the inlet section 2805 of the support ring 2801. In some implementations, the support ring 2801 may include a plurality of gas supply outlets 2907 that may be fluidly connected to one another by the connection passages 2803.

[0116] Referring further to Figure 17, each of the blocks 209 may include a corresponding mounting surface 3203 which contacts the respective mounting surface 2909 at the corresponding mounting position 2901 of the support ring 2801, such that when the gas distributor 200 is assembled, the corresponding gas supply outlet 2907 aligns (or substantially aligns) with the corresponding radially extending gas passage 1709 of the second part 203. Thus, each mounting hole 3103 of the block 209 can align (or substantially align) with the corresponding second mounting hole 1715 of the mounting surface 1717 of the second part 203. This allows a fastener (e.g., a shoulder screw) 3105 slidably engaged in the mounting hole 3103 to engage with the second mounting hole 1715 of the second part 203. In some cases, the fastener 3001 can not only engage with the first mounting hole 1713 of the second portion 203 but also interface (e.g., abut) with each sacrificial sleeve 3107 that fits (e.g., press-fit) into the corresponding fastener 3105, thereby forming a more stable connection between the block 209 and the second portion 203. The grooves 3109 on each surface 3111 of each block 209 can surround the corresponding outlet port 3113 of the block 209. In this way, a gasket (e.g., an O-ring) can be at least partially supported within the grooves 3109 and at least partially compressed between the respective mounting surfaces 1717 of the block 209 and the second portion 203, thereby providing a seal between the block 209 and the second portion 203 in the assembled state of the gas distributor 200. The corresponding grooves 3205 on each mounting surface 3203 of block 209 surround the corresponding input port 3201 of block 209, at least partially supporting each gasket therein, and allowing at least partial compression between block 209 and each mounting surface 2909 of support ring 2801 in the assembled state of the third part 205. This provides a seal between block 209 and support ring 2801.Therefore, the gas introduced into the gas supply inlet 2905 of the support ring 2801 flows into the connecting passage 2803 and out through the gas supply outlet 2907, supplying a portion of the gas to each of the input ports 3201 of the block 209. The gas can then flow out through the corresponding outlet port 3113 of the block 209 and into the radially extending gas passages 1709 of each of the second section 203.

[0117] Some changes to the examples in Part 1, Part 2, and / or Part 3 In some implementations, the gas distributor can be modified to allow alternative inflow and outflow of liquid coolant into its liquid cooling passage. Several examples of such gas distributors are described in more detail with reference to Figures 33-36.

[0118] Figure 33 schematically shows perspective views of partially assembled gas distributors according to several embodiments. Figure 34 schematically shows cross-sectional views of the partially assembled gas distributor of Figure 33 according to several embodiments. Note that the gas distributor 3300 described in relation to Figures 33 and 34 may be the same as the gas distributor 200 described in relation to Figures 2 to 32, and therefore the main differences described below are to be noted.

[0119] Referring to Figures 33 and 34, the gas distributor 3300 may include at least a first portion 3301 and a second portion 3303, which can be configured similarly to the first portion 201 and second portion 203 of the gas distributor 200, but the first portion 3301 and the second portion 3303 may be configured to allow radial input and output of liquid coolant 131 via the coolant inlet area 3305A and coolant outlet area 3305B of the second portion 3303, as well as radial input of one or more gases via the gas inlet area 3307 of the second portion 3303. In some embodiments, the coolant inlet area 3305A and the coolant outlet area 3305B may be arranged alternately with the gas inlet area 3307 around the circumferential area of ​​the second portion 3303. The gas inlet area 3307 may include a radially extending gas passage 3309 configured similarly to the radially extending gas passage 1709, thereby supplying the input gas to the second gas distribution plenum 307 in a manner similar to that described in relation to the gas distributor 200. However, it should be noted that the coolant inlet area 3305A and the coolant outlet area 3305B may include radially extending liquid coolant inlet passages 3311A and 3311B, respectively, which are fluidly connected to a liquid cooling passage 3401 that can be configured similarly to the liquid cooling passage 1201 described in relation to Figure 12. In this way, the gas distributor 3300 can omit the first cooling inlet passage 331A and the second cooling inlet passage 333A, as well as the first cooling outlet passage 331B and the second cooling outlet passage 333B, and the sections of the first cooling inlet passage 331A and the second cooling inlet passage 333A and the sections of the first cooling outlet passage 331B and the second cooling outlet passage 333B formed in the first section 201 and the second section 203.

[0120] According to various embodiments, the radially extending coolant inlet passage 3311A and coolant outlet passage 3311B may be configured similarly to the radially extending gas passage 1709 of the gas distributor 200, except that the radially extending coolant inlet passage 3311A and coolant outlet passage 3311B may be fluidically connected to the first coolant outlet 3403B and coolant inlet 3403A of the second section 3303. The first coolant outlet 3403B and first coolant inlet 3403A may extend axially and be fluidically connected to the second coolant inlet 3405A and second coolant outlet 3405B of the first section 201. The second coolant inlet 3405A and second coolant outlet 3405B may also extend axially and be fluidically connected to the coolant passage 3401. In this way, the liquid coolant 131 can flow into the liquid cooling passage 3401 of the first section 3301 via the radially extending liquid coolant inlet passage 3311A, the first liquid coolant outlet 3403B, and the second liquid coolant inlet 3405A. Similarly, the liquid coolant 131 can flow out of the liquid cooling passage 3401 of the first section 3301 via the second liquid coolant outlet 3405B, the first liquid coolant inlet 3403A, and the radially extending liquid coolant outlet passage 3311B. The remainder of the gas distributor 3300 can be configured substantially similarly to the gas distributor 200, except that the connecting blocks fluidly connected to the coolant inlet area 3305A and the coolant outlet area 3305B may be configured to carry the liquid coolant 131 rather than one or more gases used before, during, and / or after at least one semiconductor processing step.

[0121] Figure 35 schematically shows perspective views of partially assembled gas distributors according to several embodiments. Figure 36 schematically shows cross-sectional views of the partially assembled gas distributor of Figure 35 according to several embodiments. Note that the gas distributor 3500 described in relation to Figures 35 and 36 may be the same as the gas distributor 200 described in relation to Figures 2 to 32, and therefore the main differences described below are to be noted.

[0122] Referring to Figures 35 and 36, the gas distributor 3500 may include at least a first portion 3501 and a second portion 3503, which can be configured similarly to the first portion 201 and second portion 203 of the gas distributor 200. However, the first portion 3501 may be configured to allow radial input and output of the liquid coolant 131 through the liquid coolant inlet passage 3505A and liquid coolant outlet passage 3505B, which extend radially from the first portion 3501, to the first cooling inlet passage 331A and the second cooling inlet passage 333A and the first cooling outlet passage 331B and the second cooling outlet passage 333B, as described in relation to the gas distributor 200. Therefore, the gas distributor 3500 can omit the first cooling inlet passage 331A and the second cooling inlet passage 333A, as well as the first cooling outlet passage 331B and the second cooling outlet passage 333B, and the sections of the first cooling inlet passage 331A and the second cooling inlet passage 333A and the first cooling outlet passage 331B and the second cooling outlet passage 333B formed in the first section 201 and the second section 203.

[0123] According to various embodiments, the radially extending liquid coolant inlet passage 3505A and liquid coolant outlet passage 3505B may be fluidly connected to a liquid coolant passage 3601, which can be configured similarly to the liquid coolant passage 1201 described in relation to Figure 12. The radially extending liquid coolant inlet passage 3505A and liquid coolant outlet passage 3505B may be configured similarly to the radially extending gas passage 1709 of the gas distributor 200, except that the radially extending liquid coolant inlet passage 3505A and liquid coolant outlet passage 3505B are formed in the first section 3501 and may be fluidly connected to a liquid coolant outlet 3603B and liquid coolant inlet 3603A, which are also formed in the first section 3501. The liquid coolant outlet 3603B and liquid coolant inlet 3603A may extend axially and may be fluidly connected to the liquid coolant passage 3601. In this way, the liquid coolant 131 can flow into the liquid cooling passage 3601 of the first section 3501 via the radially extending liquid coolant inlet passage 3311A and liquid coolant outlet 3603B. Similarly, the liquid coolant 131 can flow out of the liquid cooling passage 3601 of the first section 3501 via the liquid coolant outlet 3603B and the radially extending liquid coolant outlet passage 3505B. The remaining portion of the gas distributor 3500 may be configured substantially similarly to the gas distributor 200, except that the first section 3501 of the gas distributor 3500 may be connected to a fourth section configured similarly to the third section 205 described in relation to the gas distributor 200. However, the fourth section of the gas distributor 3500 may include a connection block configured to allow the liquid coolant 131 to flow into and out of the gas distributor 3500, rather than a connection block 209 configured to allow one or more gases to flow into the gas distributor 200.

[0124] Multi-station process tool Figure 37 schematically shows a multi-station process tool according to several embodiments.

[0125] In some implementations, the multi-station process tool 3700 may include an inbound load lock 3703 and an outbound load lock 3705, either or both of which may include a plasma source and / or an ultraviolet (UV) source. At atmospheric pressure, the robot 3707 is configured to move a wafer from a cassette loaded through a pod 3709 to the inbound load lock 3703 via an atmospheric port 3711. The substrate 101 is placed by the robot 3707 on a pedestal 3713 within the inbound load lock 3703, the atmospheric port 3711 is closed, and the inbound load lock 3703 is pumped down. In examples where the inbound load lock 3703 includes a remote plasma source, the substrate 101 may be exposed to remote plasma processing within the inbound load lock 3703 before being introduced into the process chamber 3715. In some embodiments, the process chamber 121 may form part of the process chamber 3715. Furthermore, the substrate 101 may be heated in an inbound load lock 3703 to remove, for example, moisture and / or adsorbed gases. Next, a chamber transfer port 3717 to a process chamber 3715 is opened, and another robot 3719 places the wafer 101 into the reactor on the pedestal of the first station, shown inside the reactor for processing. While the implementation configuration depicted in Figure 37 includes a load lock, it will be understood that in some implementation configurations, direct entry of the substrate 101 into the process station may be provided.

[0126] As shown in Figure 37, the process chamber 3715 includes four process stations numbered 1 through 4. Each station has a gas distributor (e.g., gas distributor 103 for station 1) and a gas line inlet. It will be understood that in some cases each process station may have different or multiple purposes. For example, in some embodiments, a process station may be switchable between chemical vapor deposition (CVD) process mode and PECVD process mode. In another example, the deposition process, e.g., PECVD process, may be performed at one station, and exposure to UV radiation for UV curing may be performed at another station. In some cases, deposition and UV curing may be performed at the same station. Furthermore, although the process chamber 3715 is shown as including four stations, embodiments are not limited to this. For example, the process chamber 3715 may have any suitable number of stations, such as five or more stations or three or fewer stations.

[0127] The multi-station process tool 3700 may include a wafer handling system (e.g., a robot 3719 including a spider fork 3701) for transporting and / or positioning wafers within the process chamber 3715. In some embodiments, the wafer handling system may transport wafers between various process stations and / or between process stations and load locks. However, it is conceivable that any suitable wafer handling system, such as a wafer carousel or other wafer handling robot, may be used. Furthermore, the multi-station process tool 3700 may include (or be otherwise coupled to) a system controller 3723 used to control the processing conditions and hardware state of the multi-station process tool 3700. The system controller 3723 may include one or more memory devices 3725, one or more mass storage devices 3727, and one or more processors 3729. Each processor 3729 may include a central processing unit (CPU) or computer, analog and / or digital input / output connections, a stepper motor controller board, and the like.

[0128] In some embodiments, the system controller 3723 controls each of the operations of the multi-station process tool 3700. For example, the system controller 3723 may execute system control software 3731, which is stored in a mass storage device 3727, loaded into a memory device 3725, and executed by a processor 3729. Alternatively, the control logic may be hardcoded within the system controller 3723. For these purposes, application-specific integrated circuits (ASICs), programmable logic devices (e.g., field-programmable gate arrays (FPGAs)), etc., may be used. Wherever “software” or “code” is used in the following description, functionally equivalent hardcoded logic may be used instead. The system control software 3731 may include instructions for controlling the relative displacement between the substrate support and the gas distributor of the process chamber, timing, gas mixing, gas flow rate, liquid coolant flow rate through one or more liquid cooling passages (e.g., liquid cooling passage 127) of the gas distributor (e.g., gas distributor 103), flow conductance, the temperatures of the components forming the system 100, chamber and / or station pressure, chamber and / or station temperature, wafer temperature, target power level, RF power level, substrate support, chuck and / or susceptor position, and / or other parameters of a particular process performed by the multi-station process tool 3700. For example, various process tool component subroutines or control objects may be written to control the operation of process tool components used to perform various process tool processes. The system control software 3731 may be coded in any preferred computer-readable programming language.

[0129] In some embodiments, the system control software 3731 may include input / output control (IOC) sequencing instructions for controlling the various parameters described above. In some embodiments, other computer software and / or programs may be used, stored in the mass storage device 3727 and / or memory device 3725 associated with the system controller 3723. Examples of such programs or sections of programs include a substrate positioning program, a process gas control program, a pressure control program, a heater control program, a cooler control program, and a plasma control program.

[0130] The substrate positioning program may include program code for process tool components used to load and orient the wafer 101 (sometimes referred to as the "substrate") onto the pedestal 3721 and to control the spacing between the substrate 101 and other parts of the multi-station process tool 3700.

[0131] The process gas control program may include code to control the gas composition (e.g., silicon-containing gas, oxygen-containing gas, nitrogen-containing gas, dilution (or inert) gas, etc.), flow rate, and flow conductance, and optionally include code to flow gas into one or more process stations before deposition to stabilize the pressure within the process stations. The pressure control program may include code to control the pressure within the process stations by adjusting, for example, a throttle valve in the exhaust system of the process station, or the gas flow to the process station via the gas delivery system 147.

[0132] The heater control program may include code for controlling current to one or more heating units used to heat the pedestal (e.g., pedestal 3721), the gas distributor in the process chamber 3715 (e.g., gas distributor 103), the conduits and / or other components of the gas delivery system 147, etc. Additionally or alternatively, the heater control program may control the delivery of a heat transfer gas (such as helium) to the gas distributor and thereby to the substrate 101.

[0133] The cooling control program may include code for extracting heat from the pedestal (e.g., pedestal 3721) and / or gas distributor (e.g., gas distributor 103) of the process chamber 3715, thereby controlling the flow rate of one or more liquid coolants (e.g., liquid coolant 131) through cooling units used to transfer such thermal energy, for example, to a waste heat capture, storage, recycling, and / or disposal system. The flow of liquid coolants can also extract heat from the substrate 101.

[0134] The plasma control program may include code for setting the RF power levels applied to process electrodes in one or more process stations according to various embodiments.

[0135] The pressure control program may include code for maintaining the pressure within the reaction chamber according to various embodiments.

[0136] In some embodiments, a user interface may be provided in conjunction with the system controller 3723. The user interface may include a display screen, a graphical software display of the device and / or processing conditions, as well as user input devices such as a pointing device, keyboard, touch screen, and microphone.

[0137] In some embodiments, the parameters adjusted by the system controller 3723 may relate to processing conditions. Non-limiting examples include the composition and flow rate of the process gas, temperature, pressure, plasma conditions (such as RF bias power level), pressure, and temperature. These parameters may be provided to the user in the form of a recipe, which may be entered using a user interface.

[0138] Signals for monitoring the process may be provided by analog and / or digital input connections to the system controller 3723 from various process tool sensors. Signals for controlling the process may be output to analog and / or digital output connections to the multi-station process tool 3700. Non-exclusive examples of process tool sensors that may be monitored include mass flow controllers, pressure sensors (such as pressure gauges), thermocouples, etc. Appropriately programmed feedback and control algorithms may be used in conjunction with data from sensors to maintain processing conditions.

[0139] The system controller 3723 can provide program instructions for performing one or more of the processes described above. These program instructions can control various process parameters such as DC power levels, RF bias power levels, pressure, and temperature. The instructions can control parameters to operate the deposition of the stress compensation layer film stack according to various embodiments.

[0140] The system controller 3723 typically includes one or more memory devices and one or more processors configured to execute instructions so that the device performs a method according to several embodiments. In some cases, a machine-readable medium containing instructions for controlling process operations according to various embodiments may be coupled to the system controller 3723.

[0141] In some embodiments, the system controller 3723 may be part of a system, and the system may be part of at least one of the examples described above. Such a system may include semiconductor processing equipment, including one or more process tools, one or more chambers, one or more platforms for processing, and / or specific processing components (e.g., wafer pedestals, gas flow systems, thermal management systems, etc.). The systems described above may be integrated with electronic equipment to control their operation before, during, and / or after processing of semiconductor wafers or substrates. The electronic equipment may be called a “controller” that can control various components or sub-components of one or more systems. For example, depending on the processing requirements and / or the type of system, the system controller 3723 may be programmed to control any of the processes disclosed herein, including the supply of process gas, temperature setting (e.g., heating and / or cooling), valve operation, flow regulator operation, light source control for radiant heating, pressure setting, vacuum setting, power setting, RF generator setting, RF matching circuit setting, frequency setting, flow rate setting, fluid supply setting, position and operation setting, and wafer transfer between a tool or chamber and other transfer tools and / or load lock connected to or interfaced with a particular system. In this way, the system controller 3723 can be configured to control various actuators and motors of the wafer processing system as well as flow regulators of the fluid delivery system, among other systems.

[0142] Generally, the system controller 3723 may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive and issue instructions, control operations, enable cleaning operations, enable endpoint measurement, etc. The integrated circuits may include chips in the form of firmware that store program instructions, chips defined as digital signal processors (DSPs), application-specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers (e.g., software) that execute the program instructions. The program instructions may also be instructions communicated to the system controller 3723 in the form of various individual settings (or program files) that define operating parameters for performing a particular process on a semiconductor wafer or system. In some embodiments, the operating parameters may be part of a recipe defined by a process engineer to achieve one or more processing steps during the manufacturing of one or more layers, materials, metals, oxides, silicon, silicon oxide, surfaces, circuits, dies, etc., of a wafer.

[0143] In some implementations, the system controller 3723 may be part of or coupled to a computer, which is integrated into the system, coupled to, or otherwise networked to the system, or a combination thereof. For example, the system controller 3723 may be in the “cloud” or in all or part of a fab host computer system, enabling remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of a processing operation, to investigate the history of past processing operations, to investigate trends or performance metrics from multiple processing operations, to change the parameters of the current process, to set processing steps to follow the current process, or to start a new process. In some examples, a remote computer (e.g., a server) may provide process recipes to the system over a network which may include a local network or the internet. The remote computer may include a user interface that allows input or programming of parameters and / or settings, which are then transmitted from the remote computer to the system. In some examples, the controller receives instructions in the form of data, which specify the parameters of each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be executed and the type of tool to which the controller is configured to interface or control. Therefore, as described above, the system controller 3723 may be distributed, for example, by including one or more separate controllers that are networked together and operate toward a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes is one or more integrated circuits on a chamber that communicate with one or more remotely located integrated circuits (such as platform-level or part of a remote computer) that are combined to control the processes on the chamber.

[0144] Exemplary systems may include, but are not limited to, plasma etching chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, clean chambers or modules, bevel edge etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and / or any other semiconductor processing systems that may be related to or used in the processing and / or manufacture of semiconductor wafers.

[0145] As described above, depending on one or more processing steps performed by the tool, the system controller 3723 may communicate with one or more of the following: other tool circuits or modules, other tool components, cluster tools, other tool interfaces, neighboring tools, adjacent tools, tools located throughout the factory, the main computer, another controller, and / or tools used for material transport to carry wafer containers to and from tool locations and / or load ports in the semiconductor manufacturing plant.

[0146] Additional and / or alternative embodiments Certain embodiments relate to a device comprising: a first surface; a second surface facing the first surface in a first direction; a plurality of first gas distribution ports extending in a first direction and fluidly connected to at least one first gas inlet, each having a distal end forming a first gas distribution opening on the first surface; a first gas distribution plenum interposed between the first surface and the second surface, fluidly connected between at least one first gas inlet and each proximal end of the first gas distribution ports; and one or more liquid cooling passages interposed between the first surface and the second surface. In these embodiments, a reference plane extending in a second direction across the first direction extends through the central portion of one or more liquid cooling passages, the reference plane is interposed between the first gas distribution plenum and the first surface in the first direction, and one or more liquid cooling passages are fluidly isolated from the first gas distribution plenum between the first surface and the second surface. In some of these embodiments, the fourth surface of the cooling layer comprises a coolant inlet opening forming the proximal end of a first portion of the coolant inlet passage, the distal end of the first portion of the coolant inlet passage being fluidly connected to at least one of one or more liquid cooling passages, and a coolant outlet opening forming the distal end of a first portion of the coolant outlet passage, the proximal end of the first portion of the coolant outlet passage being fluidly connected to at least one of one or more liquid cooling passages, wherein the first portion of the coolant inlet passage extends in a fourth direction, and the first portion of the coolant outlet passage extends in a fourth direction. In some embodiments, a cooling inlet passage is one of a plurality of cooling inlet passages fluidly connected to one or more liquid cooling passages, and a cooling outlet passage is one of a plurality of cooling outlet passages fluidly connected to one or more liquid cooling passages, each of the cooling inlet passages comprising a section extending in a third direction toward the first surface from a corresponding coolant inlet opening on the fourth surface, and each of the cooling outlet passages comprising a section extending in a third direction toward the first surface from a corresponding coolant outlet opening on the fourth surface.

[0147] Certain embodiments relate to a device comprising: a first surface; a second surface facing the first surface in a first direction; a plurality of first gas distribution ports extending in a first direction and fluidly connected to at least one first gas inlet, each having a distal end forming a first gas distribution opening on the first surface; a first gas distribution plenum interposed between the first surface and the second surface, fluidly connected between at least one first gas inlet and each proximal end of the first gas distribution ports; and one or more liquid cooling passages interposed between the first surface and the second surface. In these embodiments, a reference plane extending in a second direction across the first direction extends through the central portion of one or more liquid cooling passages, the reference plane is interposed between the first gas distribution plenum and the first surface in the first direction, and one or more liquid cooling passages are fluidly isolated from the first gas distribution plenum between the first surface and the second surface. In some of these embodiments, one or more liquid cooling passages correspond to a single liquid cooling passage. In one embodiment, the single liquid cooling passage has a cylindrical configuration. In some other embodiments, viewed from a first direction, one or more liquid cooling passages include a first liquid cooling passage and a second liquid cooling passage surrounding the first liquid cooling passage. In one embodiment, viewed from a first direction, the first and second liquid cooling passages have an annular configuration. In one example, the first and second liquid cooling passages surround a central axis extending in a first direction through the first and second surfaces, and one or more liquid cooling passages further comprise one or more third liquid cooling passages extending radially from the central axis. In one example, the apparatus also has the first, second, and one or more third liquid cooling passages fluidly connected to each other between the first and second surfaces.

[0148] Certain embodiments relate to a device comprising: a first surface; a second surface facing the first surface in a first direction; a plurality of first gas distribution ports extending in a first direction and fluidly connected to at least one first gas inlet, each having a distal end forming a first gas distribution opening on the first surface; a first gas distribution plenum interposed between the first surface and the second surface, fluidly connected between at least one first gas inlet and each proximal end of the first gas distribution ports; and one or more liquid cooling passages interposed between the first surface and the second surface. In these embodiments, a reference plane extending in a second direction across the first direction extends through the central portion of one or more liquid cooling passages, the reference plane is interposed between the first gas distribution plenum and the first surface in the first direction, and one or more liquid cooling passages are fluidly isolated from the first gas distribution plenum between the first surface and the second surface. In some embodiments, when viewed from a first direction, one or more liquid cooling passages form a fractal pattern. In other embodiments, the cooling layer further comprises a fifth surface extending between a third surface and a fourth surface, the fifth surface comprising a coolant inlet opening forming the proximal end of a coolant inlet passage and a coolant outlet opening forming the distal end of a coolant outlet passage, the coolant inlet passage comprising a first portion extending in a second direction traversing the first direction, and the coolant outlet passage comprising a second portion extending in a third direction traversing the first direction. The coolant inlet passage further comprises a third portion fluidly connected between the first portion and at least one of the one or more liquid cooling passages, the coolant outlet passage further comprises a fourth portion fluidly connected between the second portion and at least one of the one or more liquid cooling passages, the third and fourth portions extending in a fourth direction traversing the second and third directions, respectively. Furthermore, the apparatus further comprises a gas distribution layer having a sixth surface and a seventh surface facing the sixth surface in a first direction, and the gas distribution layer further comprises a first gas distribution plenum interposed between the sixth surface and the seventh surface.In some cases, the gas distribution layer further comprises an eighth surface extending between a sixth surface and a seventh surface, and a first gas inlet passage fluidly connected to a first gas distribution plenum, the eighth surface comprising a first gas inlet forming the proximal end of the first gas inlet passage, the first gas inlet passage comprising a first portion extending in a fifth direction traversing a first direction. In some cases, the first gas inlet passage further comprises a second portion fluidly connected between a first portion of the first gas inlet passage and the first gas distribution plenum, the second portion of the first gas inlet passage extending in a sixth direction traversing a fifth direction. According to one embodiment, the first and sixth directions are equivalent. According to another embodiment, the first gas inlet passage is one of a plurality of first gas inlet passages fluidly connected to a first gas distribution plenum, each of the first gas inlet passages comprising a section extending radially inward from a corresponding first gas inlet on the eighth surface toward the central portion of the gas distribution layer.

[0149] Certain embodiments relate to a device comprising: a first surface; a second surface facing the first surface in a first direction; a plurality of first gas distribution ports extending in a first direction and fluidly connected to at least one first gas inlet, each having a distal end forming a first gas distribution opening on the first surface; a first gas distribution plenum interposed between the first surface and the second surface, fluidly connected between at least one first gas inlet and each proximal end of the first gas distribution ports; and one or more liquid cooling passages interposed between the first surface and the second surface. In these embodiments, a reference plane extending in a second direction across the first direction extends through the central portion of one or more liquid cooling passages, the reference plane is interposed between the first gas distribution plenum and the first surface in the first direction, and one or more liquid cooling passages are fluidly isolated from the first gas distribution plenum between the first surface and the second surface. In some embodiments, when viewed from a first direction, one or more liquid cooling passages form a fractal pattern. In other embodiments, the cooling layer further comprises a fifth surface extending between a third surface and a fourth surface, the fifth surface comprising a coolant inlet opening forming the proximal end of a coolant inlet passage and a coolant outlet opening forming the distal end of a coolant outlet passage, the coolant inlet passage comprising a first portion extending in a second direction traversing the first direction, and the coolant outlet passage comprising a second portion extending in a third direction traversing the first direction. The coolant inlet passage further comprises a third portion fluidly connected between the first portion and at least one of the one or more liquid cooling passages, the coolant outlet passage further comprises a fourth portion fluidly connected between the second portion and at least one of the one or more liquid cooling passages, the third and fourth portions extending in a fourth direction traversing the second and third directions, respectively. Furthermore, the apparatus further comprises a gas distribution layer having a sixth surface and a seventh surface facing the sixth surface in a first direction, and the gas distribution layer further comprises a first gas distribution plenum interposed between the sixth surface and the seventh surface.In these embodiments, the gas distribution layer further comprises a second portion of a coolant inlet passage extending from a sixth surface through a seventh surface, which is fluidly connected to a first portion of the coolant inlet passage, and a second portion of a coolant outlet passage extending from a sixth surface through a seventh surface, which is fluidly connected to a first portion of the coolant outlet passage.

[0150] Certain embodiments relate to a device comprising: a first surface; a second surface facing the first surface in a first direction; a plurality of first gas distribution ports extending in a first direction and fluidly connected to at least one first gas inlet, each having a distal end forming a first gas distribution opening on the first surface; a first gas distribution plenum interposed between the first surface and the second surface, fluidly connected between at least one first gas inlet and each proximal end of the first gas distribution ports; and one or more liquid cooling passages interposed between the first surface and the second surface. In these embodiments, a reference plane extending in a second direction across the first direction extends through the central portion of one or more liquid cooling passages, the reference plane is interposed between the first gas distribution plenum and the first surface in the first direction, and one or more liquid cooling passages are fluidly isolated from the first gas distribution plenum between the first surface and the second surface. In some embodiments, when viewed from a first direction, one or more liquid cooling passages form a fractal pattern. In other embodiments, the cooling layer further comprises a fifth surface extending between a third surface and a fourth surface, the fifth surface comprising a coolant inlet opening forming the proximal end of a coolant inlet passage and a coolant outlet opening forming the distal end of a coolant outlet passage, the coolant inlet passage comprising a first portion extending in a second direction traversing the first direction, and the coolant outlet passage comprising a second portion extending in a third direction traversing the first direction. The coolant inlet passage further comprises a third portion fluidly connected between the first portion and at least one of the one or more liquid cooling passages, the coolant outlet passage further comprises a fourth portion fluidly connected between the second portion and at least one of the one or more liquid cooling passages, the third and fourth portions extending in a fourth direction traversing the second and third directions, respectively. Furthermore, the apparatus further comprises a gas distribution layer having a sixth surface and a seventh surface facing the sixth surface in a first direction, and the gas distribution layer further comprises a first gas distribution plenum interposed between the sixth surface and the seventh surface.The apparatus further comprises a plurality of second gas distribution ports extending in a first direction and fluidly connected to a second gas inlet, each having a distal end forming a second gas distribution opening on the first surface; and a second gas distribution plenum interposed between the first surface and the second surface, fluidly connected between the second gas inlet and the respective proximal ends of the second gas distribution ports. The first gas distribution ports surround the second gas distribution ports, and the first gas distribution plenum surrounds the second gas distribution plenum.

[0151] Certain embodiments relate to a device comprising: a first surface; a second surface facing the first surface in a first direction; a plurality of first gas distribution ports extending in a first direction and fluidly connected to at least one first gas inlet, each having a distal end forming a first gas distribution opening on the first surface; a first gas distribution plenum interposed between the first surface and the second surface, fluidly connected between at least one first gas inlet and each proximal end of the first gas distribution ports; and one or more liquid cooling passages interposed between the first surface and the second surface. In these embodiments, a reference plane extending in a second direction across the first direction extends through the central portion of one or more liquid cooling passages, the reference plane is interposed between the first gas distribution plenum and the first surface in the first direction, and one or more liquid cooling passages are fluidly isolated from the first gas distribution plenum between the first surface and the second surface. The apparatus further comprises a process chamber having an internal cavity, the first surface facing the internal cavity in a first direction. In one embodiment, the process chamber defines a transformer-coupled plasma etching chamber. In another embodiment, the apparatus further comprises an inductively coupled structure supported on a second surface.

[0152] Certain embodiments relate to a device comprising: a first surface; a second surface facing the first surface in a first direction; a plurality of first gas distribution ports extending in a first direction and fluidly connected to at least one first gas inlet, each having a distal end forming a first gas distribution opening on the first surface; a first gas distribution plenum interposed between the first surface and the second surface, fluidly connected between at least one first gas inlet and each proximal end of the first gas distribution ports; and one or more liquid cooling passages interposed between the first surface and the second surface. In these embodiments, a reference plane extending in a second direction across the first direction extends through the central portion of one or more liquid cooling passages, the reference plane is interposed between the first gas distribution plenum and the first surface in the first direction, and one or more liquid cooling passages are fluidly isolated from the first gas distribution plenum between the first surface and the second surface. In one embodiment, the liquid coolant is non-thermally conductive. In another embodiment, the liquid coolant is non-polar. In yet another embodiment, the liquid coolant comprises at least one of polyfluoride compounds, perfluoride compounds, separated hydrofluoroether compounds, metal oxides, and carbon nanotubes.

[0153] Unless otherwise specified, the illustrated embodiments should be understood as providing exemplary features of various details of several embodiments. Accordingly, unless otherwise specified, various illustrated features, components, modules, layers, films, regions, aspects, structures, etc. (hereinafter referred to individually or collectively as one or more “elements”) may be combined, separated, replaced, and / or rearranged in other ways without departing from the teachings of this disclosure.

[0154] The terms used herein are for the purpose of describing some embodiments and are not limiting. Where used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context clearly indicates otherwise. Where used herein, expressions such as “for each <item> of one or more <items>” and “for each <item> of one or more <items>” should be understood to include both single item groups and multiple item groups; that is, the expression “for each…” should be understood to be used in the sense that it is used in programming languages ​​to refer to each item in a set of items being referenced. For example, if the set of items being referenced is a single item, “each” refers only to that single item (despite the dictionary definition of “each” which often defines a term that means “one of two or more things”) and does not mean that there must be at least two of those items. Similarly, the terms “set” or “subset” should not be considered by themselves to necessarily include multiple items, and it will be understood that a set or subset can include only one member or more members (unless the context indicates otherwise). The terms “comprises,” “comprising,” “includes,” and / or “including,” as used herein, specify the presence of a described feature, integer, step, action, element, component, and / or group thereof, but do not exclude the presence or addition of one or more other features, integers, steps, actions, elements, components, and / or groups thereof. Furthermore, it should be noted that the terms “substantially,” “approximately,” and other similar terms as used herein are used as terms of approximation, not as terms of degree, and are therefore used to describe inherent deviations in measurements, calculations, and / or provided values ​​that would be recognized by those skilled in the art. Thus, as used herein, “substantially” means within 5% of the referenced value unless otherwise specified.For example, "effectively perpendicular" means within ±5% of parallel.

[0155] The use of cross-hatching and / or shading in the accompanying drawings is generally provided to clarify the boundaries between adjacent elements. Therefore, the presence or absence of cross-hatching or shading, unless otherwise specified, does not convey or indicate any preference or requirement regarding specific materials, material properties, dimensions, proportions, commonalities between illustrated elements, and / or any other features, attributes, or properties of the elements. Furthermore, in the accompanying drawings, the size and relative size of elements may be exaggerated for clarity and / or explanatory purposes. Therefore, the size and relative size of each element are not necessarily limited to those shown in the drawings. Where embodiments may be implemented differently, a particular process sequence may be performed differently from the order described. For example, two consecutively described processes may be performed substantially simultaneously, or in the reverse order of the description.

[0156] When an element such as a layer is said to be “on,” “connected to,” or “joined to” another element, it may be directly on, directly connected to, or directly joined to the other element, and there may be at least one intervening element. However, when an element is said to be “directly on,” “directly connected to,” or “directly joined to” another element, there is no intervening element. Other terms and / or phrases used herein to describe relationships between elements should be interpreted in the same way as “between” vs. “directly between,” “adjacent” vs. “directly adjacent,” “on” vs. “directly on.” Furthermore, the term “connected” may refer to a physical connection, an electrical connection, and / or a fluid connection. For the purposes of this disclosure, the phrase “fluidically connected” is used with respect to volumes, plenums, holes, etc., that can be connected to each other, either directly or through one or more intervening components or volumes, in order to form a fluid connection, in the same way that the phrase “electrically connected” is used with respect to components that are connected to form an electrical connection. The phrase "fluidically intervening" may be used to refer to a component, volume, plenum, hole, etc. that is fluidically connected to at least two other components, volumes, plenums, holes, etc., such that a fluid flowing from one of those components, volumes, plenums, holes, etc., to the other or another of those components, volumes, plenums, holes, etc., first flows through the "fluidically intervening" component before reaching the other or another of those components, volumes, plenums, holes, etc. For example, if a pump is fluidically intervening between a reservoir and an outlet, the fluid flowing from the reservoir to the outlet will first flow through the pump before reaching the outlet. The phrase "fluidically adjacent," when used, refers to the arrangement of a fluid element to another fluid element such that there is no potential fluidically intervening structure between the two elements that could potentially obstruct the fluid flow between the two fluid elements.For example, in a flow path having a first valve, a second valve, and a third valve arranged continuously along it, the first valve is fluidically adjacent to the second valve, the second valve is fluidically adjacent to both the first and third valves, and the third valve is fluidly adjacent to the second valve.

[0157] For the purposes of this disclosure, “at least one of X, Y, ..., and Z” and “at least one selected from the group consisting of X, Y, ..., and Z” may be interpreted as X only, Y only, ..., Z only, or any combination of two or more of X, Y, ..., and Z, such as XYZ, XYY, YZ, and ZZ. The term “and / or” as used herein includes one or any combination of the relevant enumerated items.

[0158] In this specification, terms such as “first,” “second,” and “third” may be used to describe various elements, but these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, the first element described below may be called the second element without deviation from the teachings of this disclosure. For this reason, the use of such identifiers, e.g., “first element,” should not be read as necessarily implicit or inherently suggesting the existence of another instance, e.g., “second element.” The use of sequential indicators in this disclosure and the appended claims, e.g., (a), (b), (c), ..., or (1), (2), (3), ..., should be understood not to convey any particular order or sequence unless such order or sequence is explicitly indicated. For example, if there are three steps labeled (i), (ii), and (iii), it should be understood that, unless otherwise indicated, these steps may be performed in any order (or simultaneously, if not particularly contraindicated). For example, if step (ii) involves handling elements created in step (i), then step (ii) may be considered to occur at some point after step (i). Similarly, if step (i) involves handling elements created in step (ii), the reverse should be understood.

[0159] Spatially relative terms such as “directly below,” “down,” “below,” “downward,” “up,” “upper,” “directly above,” “above,” and “lateral” (e.g., “side wall”) are used herein for descriptive purposes and may be used to describe the spatial relationship of one element to at least one other element as shown in the drawings. Spatially relative terms are intended to encompass different orientations of the apparatus in use, operation, and / or manufacture, in addition to the orientation depicted in the drawings. For example, if the apparatus in the drawing is turned upside down, an element described as being “below” or “directly below” another element or feature will be oriented “above” or “directly above” the other element or feature. Thus, the term “below” can encompass both up and down orientations. Furthermore, the apparatus may be oriented in other directions (e.g., rotated 90 degrees or in other directions), and therefore the spatially relative descriptors used herein are interpreted accordingly.

[0160] As used herein and in conjunction with a range of values, the term “between” should be understood to include the start and end values ​​of that range unless otherwise specified. For example, between 1 and 5 (between 1 and 5) should be understood to include the digits 1, 2, 3, 4 and 5, as well as the digits 2, 3 and 4.

[0161] Where used herein, the phrase “operably connected” should be understood to mean a state in which two components and / or systems are directly or indirectly connected such that, for example, at least one component or system can control the other. For example, a controller may be described as operably connected to a resistive heating unit, which includes a controller connected to a subcontroller of the resistive heating unit, the subcontroller being electrically connected to a relay, the relay being configured to controllly connect or disconnect the resistive heating unit to a power source capable of providing an amount of energy that can power the resistive heating unit to produce a desired degree of heating. The controller itself is likely unable to directly supply such power to the resistive heating unit due to the currents involved, but it will be understood that the controller is nevertheless operably connected to the resistive heating unit.

[0162] Where used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise. Where used herein, expressions such as “for each <item> of one or more <items>” and “for each <item> of one or more <items>” should be understood to include both single and multiple item groups; that is, the expression “for each…” should also be understood to be used in the sense that it is used in programming languages ​​to refer to each item in a set of items being referenced. For example, if the set of items being referenced is a single item, “each” refers only to that single item (despite the dictionary definition of “each” which often defines a term that means “one of two or more things”) and does not mean that at least two of those items must exist. Similarly, the terms “set” or “subset” should not be considered by themselves to necessarily include multiple items, and it should be understood that a set or subset can include only one member or more members (unless the context indicates otherwise). In addition, the terms “comprises,” “comprising,” “includes,” and / or “including,” as used herein, specify the presence of the described features, terms, steps, actions, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integers, steps, actions, elements, components, and / or groups thereof.

[0163] Various embodiments are described herein with reference to section views, isometric views, perspective views, plan views, and / or exploded views that are schematic representations of idealized embodiments and / or intermediate structures. Therefore, deformations from the shape shown in the drawings are to be expected, for example, as a result of manufacturing techniques and / or tolerances. Accordingly, embodiments disclosed herein should not be construed as being limited to specific illustrated shapes of areas, but should include, for example, shape deviations resulting from manufacturing. For this reason, areas shown in the drawings may be schematic in nature, and the shapes of these areas may not reflect, and are therefore not limiting, the actual shapes of areas of the device.

[0164] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art in the field of which this disclosure is part. Terms such as those defined in commonly used dictionaries should be construed to have the meaning consistent with their meaning in the context of the relevant art, and should not be construed in an idealized or overly formal sense unless expressly defined herein.

[0165] As is customary in the art, some embodiments are described and illustrated in the accompanying drawings with respect to functional blocks, units, and / or modules. Those skilled in the art will understand that these blocks, units, and / or modules may be physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, hardwired circuits, memory elements, and wiring connections, and may be formed using semiconductor-based fabrication techniques or other manufacturing techniques. Where blocks, units, and / or modules are implemented by microprocessors or other similar hardware, they may be programmed and controlled using software (e.g., microcode) to perform the various functions described herein, and may optionally be driven by firmware and / or software. Each block, unit, and / or module may also be implemented by dedicated hardware, or as a combination of dedicated hardware for performing some functions and a processor (e.g., one or more programmed microprocessors and associated circuits) for performing other functions. Furthermore, each block, unit, and / or module in some embodiments may be physically separated into two or more interacting separate blocks, units, and / or modules without departing from the concept of the present invention. Furthermore, some embodiments of blocks, units, and / or modules may be physically combined into more complex blocks, units, and / or modules without departing from the teachings of this disclosure.

[0166] While the embodiments described above have been explained in some detail to clarify understanding, it will be clear that certain changes and modifications can be made within the scope of the attached claims. It should be noted that there are many alternative ways of implementing the processes, systems, and apparatus of the disclosed embodiments. Therefore, the embodiments should be considered illustrative and not limiting, and the embodiments should not be limited to the details given herein. [Explanation of Symbols]

[0167] 1 Station, 7 Sectional Line, 11 Sectional Line, 21 Part, 22 Part, 23 Part, 24 Sectional Line, 100 System, 101 Wafer, 101 Substrate, 103 Gas Distributor, 105 Generation System, 105 RF Generation System, 107 RF Generation System, 109 RF Source, 109 Source, 111 TCCT Circuit, 111 Circuit, 113 Induction Coil Structure, 115 Matching Network, 117 Power Distributor, 119 Plasma, 121 Processing Chamber, 123 Internal Cavity Region, 125 Plenum Volume, 127 Liquid Cooling Passage, 129 Window, 131 Liquid Coolant, 133 Valve, 135 Pump, 137 Substrate Support, 139 Source, 139 RF Source, 139 Bias RF Source, 142 Bias Matching Circuit, 143 RF Generation System, 145 System controller, 147 Gas delivery system, 149 Process gas source, 151 Measurement system, 153 Manifold, 155 Conductive cooling fluid delivery system, 157 Temperature controller, 159 Vacuum pump, 161 Exhaust system, 163 Exhaust section, 165 Closed-loop flow limiting device, 167 Temperature controller, 169 Sensor, 171 Selection module, 173 Multiplexer, 175 Signal line, 175 Virtual line, 200 Gas distributor, 201 Section, 203 Section, 205 Section, 207 Axis, 209 Gas connection mounting block, 209 Block, 209 Connection block, 301 Surface, 303 Surface, 305 Gas distribution plenum, 307 Gas distribution plenum, 309 Gas distribution port, 311 Gas distribution port, 313 Liquid cooling passage, 313a Upper surface, 315 Liquid cooling passage, 317 Gas inlet, 319_1 Gas inlet, 321 Gas distribution opening, 323 Gas distribution opening, 325 Proximal end, 327 Proximal end, 329 Reference plane, 331A Coolant inlet passage, 331A Cooling inlet passage, 331B Cooling outlet, 331B Cooling outlet passage, 333A Cooling inlet passage, 333A Coolant outlet passage, 333B Cooling outlet passage, 333B Coolant outlet passage, 401A Coolant inlet opening, 401B Coolant outlet opening, 403A Coolant inlet opening, 403B Coolant outlet opening, 405A Coolant inlet opening, 407A Coolant outlet opening, 407B Coolant outlet opening, 411 Height, 501 Surface, 503 Surface, 505 Surface, 507 Surface, 509Surface, 511 Gas distribution port, 512 Shaft, 513 Gas distribution port, 515 Gas distribution port, 601 Section, 603 Section, 605 Section, 607 Section, 609 Gasket, 611 Gasket, 613 Gasket, 701 Upper section, 703 Lower section, 801 Gas inlet, 803 Gas outlet, 805 Gas inlet, 807 Gas outlet, 900 Part, 901 Layer, 903 Layer, 905 Mating surface, 907 Mating surface, 1101 Area, 1103 Area, 1105 Area, 1200 Part, 1201 Liquid cooling passage, 1203 Shaft, 1205 Outer area, 1207 Gas distribution port, 1209 Gas distribution port, 1211 Liquid cooling inlet passage, 1213 Liquid cooling outlet passage, 1300 section, 1301 liquid cooling passage, 1303 liquid cooling passage, 1305 liquid cooling passage, 1307 axis, 1309 area, 1311 area, 1313 area, 1315 common cooling inlet passage, 1317 cooling outlet passage, 1319 gas distribution port, 1321 gas distribution port, 1400 section, 1401 axis, 1403 liquid cooling passage, 1405 segment, 1407 segment, 1409 inlet segment, 1411 cooling inlet passage, 1413 cooling outlet passage, 1415 region, 1415 annular region, 1417 circular region, 1417 region, 1419 annular region, 1421 gas distribution port, 1421A gas distribution port, 1421B gas distribution port, 1423 Gas distribution port, 1500 section, 1501 annular cooling passage, 1503 radial cooling passage, 1505 radial cooling passage, 1507 cooling passage pattern, 1509 region, 1509 annular region, 1511 central axis, 1511 axis, 1513 region, 1513 circular region, 1515 annular region, 1517 branching passage, 1519 branching passage, 1521 axis, 1523 axis, 1525 cooling inlet passage, 1527 cooling outlet passage, 1529 gas distribution port, 1531 gas distribution port, 1531A gas distribution port, 1531B gas distribution port, 1600 section, 1601 annular cooling passage, 1603 proximal radial cooling passage, 1603 radial cooling passage, 1605 branching passage, 1607 Branching passage, 1609 Cooling passage pattern, 1609 Repeating cooling passage pattern, 1611 Region, 1611Annular region, 1613 Central axis, 1613 Axis, 1615 Region, 1615 Circular region, 1617 Annular region, 1619 Common cooling inlet passage, 1619 Cooling inlet passage, 1621 Cooling outlet passage, 1623 Gas distribution port, 1623A Gas distribution port, 1623B Gas distribution port, 1625 Gas distribution port, 1625A Gas distribution port, 1625B Gas distribution port, 1701 Surface, 1703 Surface, 1705 Surface, 1705 Face, 1707 Surface, 1707 Fitting surface, 1709 Gas passage, 1711 Axis, 1713 Mounting hole, 1715 Mounting hole, 1715 Second mounting hole, 1717 Mounting surface, 1719 Annular projection, 1801 Gas passage, 1803 Recess, 1805 Recess, 1807 Recess, 1813 Recess, 1815 Recess, 2001 Bayonet-type engagement mechanism, 2401 Central shaft, 2403 Central shaft, 2405 Central shaft, 2415 Mounting hole, 2501 Section, 2503 Section, 2505 Section, 2507 Section, 2509 Distal end, 2511 Distal end, 2513 Distal end, 2515 Distal end, 2600 Part, 2600 Section part, 2601 Layer, 2603 Layer, 2605 Surface, 2605 Mating surface, 2607 Mating surface, 2801 Support ring, 2803 Connecting passage, 2805 Inlet section, 2901 Mounting position, 2903 Mounting point, 2905 Gas supply inlet, 2907 Gas supply outlet, 2909 Mounting surface, 3001 Fastener, 3101 Mounting hole, 3103 Mounting hole, 3105 Fastener, 3107 Sacrificial sleeve, 3109 Groove, 3111 Surface, 3113 Outlet port, 3201 Input port, 3203 Mounting surface, 3205 Groove, 3300 Gas distributor, 3301 Section, 3303 Section, 3305A Coolant inlet area, 3305B Coolant outlet area, 3307 Gas inlet area, 3309 Gas passage, 3311A Liquid coolant inlet passage, 3311B Liquid coolant outlet passage, 3401 Liquid coolant passage, 3401 Liquid coolant passage, 3403A Liquid coolant inlet, 3403B Liquid coolant outlet, 3405A Liquid coolant inlet, 3405B Liquid coolant outlet, 3500 gas distributor, 3501 section, 3503 section, 3505A liquid coolant inlet passage, 3505B liquid coolant outlet passage, 3601 liquid cooling passage, 3603A liquid coolant inlet, 3603BLiquid coolant outlet, 3700 Multi-station process tool, 3701 Spider fork, 3703 Inbound load lock, 3705 Outbound load lock, 3707 Robot, 3709 Pod, 3711 Atmospheric port, 3713 Pedestal, 3715 Processing chamber, 3717 Chamber transfer port, 3719 Robot, 3721 Pedestal, 3723 System controller, 3725 Memory device, 3727 Mass storage device, 3729 Processor, 3731 System control software

Claims

1. It is a device, The first surface and The first surface and the second surface facing each other in the first direction, A plurality of first gas distribution ports extending in the first direction and fluidly connected to at least one first gas inlet, each having a distal end forming a first gas distribution opening on the first surface, A first gas distribution plenum interposed between the first surface and the second surface, the first gas distribution plenum being fluidly connected between the at least one first gas inlet and the proximal end of each of the first gas distribution ports, The device comprises one or more liquid cooling passages interposed between the first surface and the second surface, A reference plane extending in a second direction intersecting the first direction extends through the central portion of the one or more liquid cooling passages, and the reference plane is interposed between the first gas distribution plenum and the first surface in the first direction. An apparatus in which one or more liquid cooling passages are fluidly isolated from the first gas distribution plenum between the first surface and the second surface.

2. The cooling layer further comprises a third surface and a fourth surface facing the third surface in the first direction, The cooling layer is The one or more liquid cooling passages interposed between the third surface and the fourth surface, Each portion of the first gas distribution port extending from the third surface through the fourth surface further includes, The apparatus according to claim 1.

3. The apparatus according to claim 2, wherein the third surface defines the first surface.

4. The cooling layer is A coolant inlet passage fluidly connected to at least one of the one or more liquid cooling passages, The apparatus according to claim 2, further comprising a coolant outlet passage fluidly connected to at least one of the one or more liquid cooling passages.

5. The cooling layer further comprises a fifth surface extending between the third surface and the fourth surface, the fifth surface being The coolant inlet opening that forms the proximal end of the coolant inlet passage, The coolant outlet opening forms the distal end of the coolant outlet passage, The coolant inlet passage includes a first portion that extends in a second direction that crosses the first direction, The coolant outlet passage includes a second portion that extends in a third direction that crosses the first direction. The apparatus according to claim 4.

6. The coolant inlet passage further comprises a third portion that is fluidly connected between the first portion and at least one of the one or more liquid cooling passages, The coolant outlet passage further comprises a fourth portion that is fluidly connected between the second portion and at least one of the one or more liquid cooling passages, The third and fourth portions extend in a fourth direction that intersects each of the second and third directions. The apparatus according to claim 5.

7. The cooling inlet passage is one of a plurality of cooling inlet passages fluidly connected to the one or more liquid cooling passages. The cooling outlet passage is one of a plurality of cooling outlet passages that are fluidly connected to the one or more liquid cooling passages. Each of the cooling inlet passages comprises a section extending radially inward from the corresponding coolant inlet opening of the fifth surface toward the central portion of the cooling layer, Each of the cooling outlet passages comprises a section extending radially inward from the corresponding coolant outlet opening of the fifth surface toward the central portion of the cooling layer. The apparatus according to claim 5.

8. The fourth surface of the cooling layer is A coolant inlet opening that forms the proximal end of the first portion of the coolant inlet passage, wherein the distal end of the first portion of the coolant inlet passage is fluidly connected to at least one of the one or more liquid cooling passages, A coolant outlet opening that forms the distal end of the first portion of the coolant outlet passage, wherein the proximal end of the first portion of the coolant outlet passage is fluidly connected to at least one of the one or more liquid cooling passages, comprising: The first portion of the coolant inlet passage extends in a fourth direction, The first portion of the coolant outlet passage extends in the fourth direction. The apparatus according to claim 4.

9. The apparatus according to claim 6, wherein the first and fourth directions are equivalent.

10. The one or more liquid cooling passages are a plurality of liquid cooling passages, Each of the plurality of cooling inlet passages is fluidly connected to the corresponding cooling passage among the liquid cooling passages, Each of the plurality of cooling outlet passages is fluidly connected to the corresponding cooling passage among the liquid cooling passages. The apparatus according to claim 7.

11. The apparatus according to claim 2, wherein the cooling layer comprises a plurality of cooling layers connected to one another.

12. The apparatus according to claim 11, wherein the one or more liquid cooling passages define a recess formed in at least one of the cooling layers.

13. The apparatus according to claim 1, wherein the width of each of the one or more liquid cooling passages in at least one direction perpendicular to the first direction is greater than the height of each of the one or more liquid cooling passages in the first direction.

14. The apparatus according to claim 1, wherein the one or more liquid cooling passages comprises one or more structures configured to induce turbulence along the one or more liquid cooling passages.

15. The apparatus according to claim 1, wherein, viewed from the first direction, one or more liquid cooling passages have one or more meandering configurations.

16. The apparatus according to claim 15, wherein, viewed from the first direction, one or more meandering configurations follow a path around a central axis extending in the first direction through the first and second surfaces.

17. The apparatus according to claim 1, wherein at least one of the first gas distribution ports is located outside the one or more liquid cooling passages.

18. At least one of the first gas distribution ports is located inside the one or more liquid cooling passages. The apparatus according to claim 17.

19. The gas distribution layer further comprises a sixth surface and a seventh surface facing the sixth surface in the first direction, The gas distribution layer further comprises the first gas distribution plenum interposed between the sixth surface and the seventh surface. The apparatus according to claim 5.

20. The apparatus according to claim 19, wherein the sixth surface defines the second surface.

21. The aforementioned device is A plurality of second gas distribution ports extending in the first direction and fluidly connected to a second gas inlet, each having a distal end forming a second gas distribution opening on the first surface, The apparatus according to claim 19, further comprising: a second gas distribution plenum interposed between the first surface and the second surface, the second gas distribution plenum being fluidly connected between the second gas inlet and the proximal ends of the second gas distribution port, respectively.

22. A process chamber having an internal cavity, wherein the first surface faces the internal cavity in a first direction, further comprising the process chamber. The apparatus according to claim 15.

23. The apparatus according to claim 22, wherein the second surface is exposed to the surrounding environment.

24. A pedestal configured to support a semiconductor wafer within the internal cavity, further comprising a pedestal facing the first surface in the first direction, The apparatus according to claim 22.

25. The system further comprises a source of liquid coolant fluidly connected to one or more liquid cooling passages. The apparatus according to claim 1.

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