Encapsulation method, electronic device, storage medium and semiconductor device

Abstract

This application relates to a sealing method, an electronic device, a storage medium, and a semiconductor device. The semiconductor device comprises a splashproof cover, a splashproof cover base, a lifting module, a detection module, and a control module, wherein the control module is coupled between the lifting module and the detection module. The lifting module is used to raise and lower the splashproof cover, the detection module is used to detect airflow information parameters between the splashproof cover and the splashproof cover base, and the control module controls the lifting module to raise and lower the splashproof cover based on the airflow information parameters, thereby achieving sealing between the splashproof cover and the splashproof cover base. According to this application, the problem of reduced wafer yield due to poor sealing between the splashproof cover and the splashproof cover base can be solved, and the sealing between the splashproof cover and the splashproof cover base is improved, and further wafer yield is also improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor devices, and particularly to a sealing method, an electronic device, a storage medium, and a semiconductor device.

Background Art

[0002] In the process of wafer manufacturing, the cleaning process accounts for 20 - 30% of the entire process. As the integration degree of integrated circuits increases, the proportion of the cleaning process also increases. Among wet processes, the monolithic wet process is widely applied in recent years because of its excellent uniformity, reproducibility, and stability. In the current monolithic wet process, the wafer to be cleaned or etched is fixed to a wafer chuck and rotated for driving, and the process treatment is performed on the wafer surface by spraying chemical solutions.

[0003] In the process of performing wet etching or wet cleaning, different chemical solutions are used depending on the particles to be cleaned. While treating the wafer surface, these chemical solutions generate mist in the cavity. If these mists are not quickly discharged, crystals will form in the cavity or adsorb on the wafer surface to generate particles, resulting in a reduction in yield. Therefore, in the process of the monolithic wet process, controlling the magnitude and direction of the airflow inside the cavity plays a very important role in controlling particles.

[0004] In the current semiconductor device process, as shown in Figure 1, when the splashproof cover 10 rises, a hard limit block 13 is added between the connection block 16 of the lifting module 14 and the bottom plate 15 to limit the height to which the splashproof cover 10 rises as the lifting module 14 rises. A seal ring 12 is then added between the splashproof cover 10 and the splashproof cover base 11 to achieve sealing. However, in the research and development process, the thickness of the hard limit block 13 is fixed, so when the lifting module 14 raises the splashproof cover 10, the height of the splashproof cover 10 is fixed after the hard limit block 13 hits the bottom plate 15. At this time, there is a gap between the splashproof cover base 11 and the splashproof cover 10, so exhaust gas leaks through the gap during the process, reducing the process exhaust. Acidic gases on the wafer surface cannot be immediately discharged, adhere to the wafer edge, and form edge particle defects.

[0005] Conventionally, no effective solution has been proposed to address the related technical challenge of poor sealing between the splashproof cover and the splashproof cover base, which leads to reduced wafer yield. [Overview of the project]

[0006] Embodiments of the present invention provide a sealing method, an electronic device, a storage medium, and a semiconductor device, which solve the problem in at least related technologies of poor sealing performance between a splashproof cover and a splashproof cover base, resulting in reduced wafer yield.

[0007] According to a first aspect, an embodiment of the present application provides a semiconductor device comprising a splashproof cover, a splashproof cover base, a lifting module, a detection module, and a control module, wherein the control module is coupled between the lifting module and the detection module. The aforementioned lifting module is used to raise and lower the splashproof cover. The detection module is used to detect airflow information parameters between the splashproof cover and the splashproof cover base. The control module controls the lifting module based on the airflow information parameters to raise and lower the splashproof cover, thereby achieving sealing between the splashproof cover and the splashproof cover base.

[0008] In some embodiments, the airflow information parameter includes wind speed, the detection module comprises a speed measuring unit, the speed measuring unit is coupled to the control module and used to detect the wind speed between the splashproof cover and the splashproof cover base.

[0009] In some embodiments, the speed control module comprises a first determination unit and a first control unit, wherein the first determination unit is coupled to the speed measuring unit, and the first control unit is coupled between the first determination unit and the speed lifting module. The first determination unit is used to determine whether the wind speed is greater than a preset wind speed. The first control unit is used to achieve sealing between the splashproof cover and the splashproof cover base by controlling the lifting module to raise the splashproof cover when the first determination unit determines that the wind speed is greater than a preset wind speed, and by controlling the lifting module to stop the splashproof cover from rising when the wind speed is less than a preset wind speed.

[0010] In some embodiments, the airflow information parameter includes pitch, the detection module comprises a distance measuring unit, the distance measuring unit is coupled to the control module and used to detect the pitch between the splashproof cover and the splashproof cover base.

[0011] In some embodiments, the control module comprises a second determination unit and a second control unit, the second determination unit being coupled to the distance measuring unit, and the second control unit being coupled between the second determination unit and the rapid lifting module. The second determination unit is used to determine whether the pitch is greater than a preset pitch. The second control unit is used to achieve sealing between the splashproof cover and the splashproof cover base by controlling the lifting module to raise the splashproof cover when the second determination unit determines that the pitch is greater than a preset pitch, and by controlling the lifting module to stop the splashproof cover from rising when the pitch is smaller than a preset pitch.

[0012] According to a second aspect, an embodiment of the present application provides a sealing method applicable to a semiconductor device comprising a splashproof cover, a splashproof cover base, and a lifting module. The airflow information parameters between the splashproof cover and the splashproof cover base are detected. By controlling the lifting module according to the aforementioned airflow information parameters to raise and lower the splashproof cover, sealing between the splashproof cover and the splashproof cover base is achieved.

[0013] In some embodiments, the airflow information parameter includes wind speed, and detecting the airflow information parameter between the splashproof cover and the splashproof cover base is This includes detecting the wind speed between the splashproof cover and the splashproof cover base.

[0014] In some embodiments, after detecting the wind speed between the splashproof cover and the splashproof cover base, the method further: Determine whether the wind speed is greater than a predetermined wind speed. If it is determined that the wind speed is greater than a preset wind speed, the lifting module is controlled to raise the splashproof cover, thereby achieving sealing between the splashproof cover and the splashproof cover base.

[0015] In some embodiments, the airflow information parameter includes pitch, and detecting the airflow information parameter between the splashproof cover and the splashproof cover base is This includes detecting the pitch between the splashproof cover and the splashproof cover base.

[0016] In some embodiments, after detecting the pitch between the splashproof cover and the splashproof cover base, the method further Determine whether the aforementioned pitch is greater than a preset pitch. If it is determined that the pitch is greater than a preset pitch, the lifting module is controlled to raise the splashproof cover, thereby achieving sealing between the splashproof cover and the splashproof cover base.

[0017] According to a third aspect, an embodiment of the present invention provides an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, upon executing the computer program, realizes the sealing method described in the second aspect.

[0018] According to a fourth aspect, an embodiment of the present invention provides a storage medium in which a computer program is stored, and when executed by a processor, the program implements the sealing method described in the second aspect.

[0019] Compared to related technologies, the sealing method, electronic device, storage medium, and semiconductor device according to the embodiments of the present application provide a semiconductor device comprising a lifting module, a detection module, and a control module, wherein the control module is coupled between the lifting module and the detection module. Here, the lifting module is used to raise and lower a splashproof cover, the detection module is used to detect airflow information parameters between the splashproof cover and the splashproof cover base, and the control module is used to achieve sealing between the splashproof cover and the splashproof cover base by controlling the lifting module to raise and lower the splashproof cover based on the airflow information parameters. According to the above embodiment, the problem of reduced wafer yield due to poor sealing performance between the splashproof cover and the splashproof cover base can be solved, and the sealing performance between the splashproof cover and the splashproof cover base is improved, and furthermore, wafer yield is also improved.

[0020] Details of one or more embodiments of the present application are presented in the following drawings and description to make other features, purposes, and advantages of the present application more concise and clear. [Brief explanation of the drawing]

[0021] The drawings described herein are provided for a better understanding of the present application, form a part of the present application, and the schematic embodiments and their descriptions are for explaining the present application and do not constitute an undue limitation of the present application. The drawings are as follows. [Figure 1] FIG. 1 is a schematic diagram of the structure of a semiconductor device according to the related art. [Figure 2] FIG. 2 is a schematic diagram of the structure of a semiconductor device according to an embodiment of the present application. [Figure 3] FIG. 3 is a flowchart of a sealing method according to an embodiment of the present application.

Embodiments for Carrying Out the Invention

[0022] Hereinafter, in order to make the objectives, technical concepts and advantages of the present application clearer, the present application will be described and explained with reference to the drawings and embodiments. It should be understood that the specific embodiments described here are only for interpreting the present application and not for limiting the present application. Based on the embodiments made according to the present application, all other embodiments obtained by those skilled in the art without creative work belong to the protection scope of the present application. Also, although such efforts in the development process may be complex and lengthy, for those skilled in the art related to the content disclosed in the present application, some changes in design, manufacturing or production, etc. made based on the technical content disclosed in the present application are merely conventional technical means, and it should not be understood that the content disclosed in the present application is insufficient.

[0023] As used herein, the term "embodiment" means that a particular feature, structure or characteristic described in relation to an embodiment may be included in at least one embodiment of the present application. The appearance of this phrase at various places in the specification does not necessarily refer to the same embodiment, nor is it an embodiment independent or alternative to other embodiments in a mutually exclusive manner. Those skilled in the art should explicitly and implicitly understand that the embodiments described in the present application can be combined with other embodiments without conflict.

[0024] Unless otherwise defined, technical or scientific terms relating to this application should have the ordinary meaning that can be understood by a person with general skills in the art to which this application pertains. Synonyms such as "one," "one," "one kind," and "the said" relating to this application do not express a limitation on quantity and may represent singular or plural. Terms relating to this application such as "equip," "include," "possess," and variations thereof are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device comprising a series of steps or modules (units) may not be limited to the listed steps or units, but may further include steps or units not listed, or may further include other steps or units inherent in such processes, methods, products, or devices. Synonyms such as "connect," "connected," and "joined" relating to this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Multiple" relating to this application means two or more. "And / or" describes the relationship between related objects and indicates that three types of relationships exist. For example, "A and / or B" may indicate that A exists alone, A and B exist simultaneously, or B exists alone. The terms "first," "second," "third," etc., in this application merely distinguish similar objects and do not represent a specific order of objects.

[0025] This embodiment provides a semiconductor device 100, and Figure 2 is a schematic diagram of the structure of a semiconductor device according to an embodiment of the present invention. As shown in Figure 2, the device comprises a splashproof cover 10, a splashproof cover base 11, a lifting module 14, a detection module 20, and a control module 30. The control module 30 is coupled between the lifting module 14 and the detection module 20. Here, the lifting module 14 is used to raise and lower the splashproof cover 10, the detection module 20 is used to detect airflow information parameters between the splashproof cover 10 and the splashproof cover base 11, and the control module 30 is used to achieve sealing between the splashproof cover 10 and the splashproof cover base 11 by controlling the lifting module 14 to raise and lower the splashproof cover 10 based on the airflow information parameters.

[0026] In this embodiment, a detection module 20 for detecting airflow information parameters between the splashproof cover 10 and the splashproof cover base 11 is provided between the splashproof cover 10 and the splashproof cover base 11. The control module 30 controls the lifting module 14 to raise and lower the splashproof cover 10 based on these airflow information parameters, thereby achieving sealing between the splashproof cover 10 and the splashproof cover base 11. This avoids the problem in related technologies where, due to the adoption of a hard limit block 13, the height to which the splashproof cover 10 is raised is fixed, automatic adjustment between the splashproof cover 10 and the splashproof cover base 11 cannot be achieved, resulting in low sealing performance between the splashproof cover 10 and the splashproof cover base 11 and affecting wafer yield. In this application, by realizing a method in which the raising and lowering of the splashproof cover 10 can be adjusted based on airflow information parameters, the sealing performance between the splashproof cover 10 and the splashproof cover base 11 is improved, and wafer yield is also improved.

[0027] The airflow information parameters may include, but are not limited to, at least one of wind speed and pitch. They may also include other parameters that can affect the airflow between the splashproof cover 10 and the splashproof cover base 11, and this invention is not particularly limited.

[0028] The lifting module 14 in this embodiment may be a lifting cylinder or lifting motor capable of realizing a lifting function, or it may be another configuration that can realize the embodiment of the present application and also has a lifting function.

[0029] In some embodiments, the detection module 20 includes a speed measuring unit. The speed measuring unit is coupled to the control module 30 and is used to detect the wind speed between the splashproof cover 10 and the splashproof cover base 11.

[0030] In this embodiment, the wind speed can be accurately obtained by detecting the wind speed between the splashproof cover 10 and the splashproof cover base 11 using a speed measuring unit. The control module 30 controls the lifting unit according to this wind speed to raise and lower the splashproof cover 10, thereby achieving sealing between the splashproof cover 10 and the splashproof cover base 11.

[0031] The speed measurement unit may also consist of several components or sensors capable of measuring wind speed or airflow.

[0032] In some embodiments, the control module 30 comprises a first determination unit and a first control unit, the first determination unit being coupled to the speed measuring unit, and the first control unit being coupled between the first determination unit and the lifting module 14, wherein the first determination unit is used to determine whether the wind speed detected by the speed measuring unit is greater than a preset wind speed, and the first control unit is used to control the lifting module 14 to raise the splashproof cover 10 when the first determination unit determines that the wind speed detected by the speed measuring unit is greater than a preset wind speed, and to control the lifting module 14 to stop the raising of the splashproof cover 10 when the wind speed detected by the speed measuring unit is less than a preset wind speed, thereby achieving precise sealing between the splashproof cover 10 and the splashproof cover base 11.

[0033] In this embodiment, automatic adjustment of the splashproof cover 10 is achieved by comparing the actual wind speed between the splashproof cover 10 and the splashproof cover base 11 with a preset wind speed. This solves the problem in related technologies where automatic adjustment between the splashproof cover 10 and the splashproof cover base 11 cannot be achieved due to the use of a hard limit block 13, resulting in poor sealing between the splashproof cover 10 and the splashproof cover base 11 and a decrease in wafer yield. Furthermore, it improves the sealing between the splashproof cover 10 and the splashproof cover base 11 and improves wafer yield.

[0034] Furthermore, the pre-set wind speed can be set to different values ​​depending on the wafer process, and this invention is not specifically limited.

[0035] In some embodiments, the detection module 20 includes a distance measuring unit, which is coupled to a control module 30 and used to detect the pitch between the splashproof cover 10 and the splashproof cover base 11.

[0036] In this embodiment, the distance measuring unit detects the pitch between the splashproof cover 10 and the splashproof cover base 11. The specific pitch position is M in Figure 2, and the pitch between the splashproof cover 10 and the splashproof cover base 11 can be accurately obtained. The control module 30 controls the lifting unit according to this pitch to raise and lower the splashproof cover 10, thereby achieving precise sealing between the splashproof cover 10 and the splashproof cover base 11.

[0037] The distance measuring unit may also consist of several components or sensors capable of measuring the pitch between the splashproof cover 10 and the splashproof cover base 11.

[0038] In this embodiment, a seal ring 12 may be provided at M in Figure 2 to further enhance sealing.

[0039] In some embodiments, the control module 30 comprises a second determination unit and a second control unit, the second determination unit being coupled to a distance measuring unit, and the second control unit being coupled between the second determination unit and the lifting module 14, where the second determination unit is used to determine whether the pitch is greater than a preset pitch, and the second control unit is used to control the lifting module 14 to raise the splashproof cover 10 if the second determination unit determines that the pitch is greater than the preset pitch, and to control the lifting module 14 to stop the splashproof cover 10 from rising if the pitch is smaller than the preset pitch, thereby achieving a precise seal between the splashproof cover 10 and the splashproof cover base 11.

[0040] In this embodiment, automatic adjustment of the splashproof cover 10 is achieved by comparing the pitch detected by the distance measuring unit with a preset pitch. This solves the problem in related technologies where the sealing performance between the splashproof cover 10 and the splashproof cover base 11 is low and wafer yield decreases due to the inability to achieve automatic adjustment between the splashproof cover 10 and the splashproof cover base 11. Furthermore, it further improves the sealing performance between the splashproof cover 10 and the splashproof cover base 11.

[0041] The pre-set pitch can be set to different sizes depending on the wafer process, and this invention is not specifically limited to this.

[0042] The embodiments of the present invention further provide a sealing method applicable to the semiconductor device in the embodiments described above, and Figure 3 is a flowchart of the sealing method according to the embodiments of the present invention, and as shown in Figure 3, the sealing method includes the following steps.

[0043] In step S301, airflow information parameters between the splashproof cover 10 and the splashproof cover base 11 are detected.

[0044] In step S302, the lifting module 14 is controlled based on airflow information parameters to raise and lower the splashproof cover 10, thereby achieving a seal between the splashproof cover 10 and the splashproof cover base 11.

[0045] Furthermore, if the pitch between the splashproof cover 10 and the splashproof cover base 11 is large, the sealing performance between the splashproof cover 10 and the splashproof cover base 11 deteriorates, and air leakage occurs between the splashproof cover 10 and the splashproof cover base 11. In addition, exhaust gas during the wafer processing process leaks through the gap, reducing the process exhaust, preventing acidic gases on the wafer surface from being quickly discharged. This can lead to adhesion to the wafer edge, formation of edge particle defects, and a decrease in wafer yield.

[0046] Therefore, in order to solve the above problem, in this embodiment, by detecting airflow information parameters between the splashproof cover 10 and the splashproof cover base 11, and then controlling the lifting module 14 to raise and lower the splashproof cover 10 based on these airflow information parameters, sealing between the splashproof cover 10 and the splashproof cover base 11 is achieved. This avoids the problem in related technologies where, due to the adoption of a hard limit block 13, the height to which the splashproof cover 10 is raised is fixed, automatic adjustment between the splashproof cover 10 and the splashproof cover base 11 cannot be achieved, resulting in low sealing performance between the splashproof cover 10 and the splashproof cover base 11 and affecting wafer yield. In this application, by realizing a method in which the raising and lowering of the splashproof cover 10 can be adjusted based on airflow information parameters, the sealing performance between the splashproof cover 10 and the splashproof cover base 11 is improved, and wafer yield is also improved.

[0047] In some embodiments, detecting airflow information parameters between the splashproof cover 10 and the splashproof cover base 11 includes detecting the wind speed between the splashproof cover 10 and the splashproof cover base 11.

[0048] In this embodiment, the wind speed between the splashproof cover 10 and the splashproof cover base 11 is detected by the speed measuring unit in the above embodiment, thereby enabling accurate acquisition of the wind speed. Finally, the control module 30 controls the lifting unit according to this wind speed to raise and lower the splashproof cover 10, thereby achieving sealing between the splashproof cover 10 and the splashproof cover base 11.

[0049] In some embodiments, after detecting the wind speed between the splashproof cover 10 and the splashproof cover base 11, it may be determined whether the wind speed is greater than a preset wind speed. If it is determined that the wind speed is greater than a preset wind speed, the lifting module 14 is controlled to raise the splashproof cover 10. If the wind speed is less than a preset wind speed, the raising of the splashproof cover 10 is stopped, thereby achieving precise sealing between the splashproof cover 10 and the splashproof cover base 11.

[0050] In this embodiment, by comparing the wind speed with a preset wind speed according to this wind speed, automatic adjustment to the splashproof cover 10 can be achieved. This solves the problem in related technologies where the sealing performance between the splashproof cover 10 and the splashproof cover base 11 is low and wafer yield decreases due to the inability to achieve automatic adjustment between the splashproof cover 10 and the splashproof cover base 11. This improves the sealing performance between the splashproof cover 10 and the splashproof cover base 11 and also improves wafer yield.

[0051] Furthermore, the pre-set wind speed can be set to different values ​​depending on the wafer process, and this invention is not specifically limited.

[0052] In some embodiments, detecting airflow information parameters between the splashproof cover 10 and the splashproof cover base 11 includes detecting the pitch between the splashproof cover 10 and the splashproof cover base 11.

[0053] In this embodiment, the distance measuring unit in the above embodiment detects the pitch between the splashproof cover 10 and the splashproof cover base 11, thereby accurately acquiring the pitch. The control module 30 controls the lifting unit according to this pitch to raise and lower the splashproof cover 10, thereby achieving precise sealing between the splashproof cover 10 and the splashproof cover base 11.

[0054] In some of these embodiments, after detecting the pitch between the splashproof cover 10 and the splashproof cover base 11, it may be determined whether the pitch is greater than a preset pitch. If it is determined that the pitch is greater than a preset pitch, the lifting module 14 is controlled to raise the splashproof cover 10. If the pitch is smaller than a preset pitch, the raising of the splashproof cover 10 is stopped, thereby achieving sealing between the splashproof cover 10 and the splashproof cover base 11.

[0055] In this embodiment, automatic adjustment to the splashproof cover 10 can be achieved by comparing it with a preset pitch according to this pitch. This solves the problem in related technologies where the sealing performance between the splashproof cover 10 and the splashproof cover base 11 is poor and wafer yield decreases due to the inability to achieve automatic adjustment between the splashproof cover 10 and the splashproof cover base 11, and further improves the sealing performance between the splashproof cover 10 and the splashproof cover base 11.

[0056] The pre-set pitch can be set to different sizes depending on the wafer process, and this invention is not specifically limited to this.

[0057] This embodiment further provides an electronic device comprising a memory storing a computer program and a processor, wherein the processor is configured to execute the computer program in order to perform the steps in any one of the method embodiments described above.

[0058] Selectively, the above electronic device may further comprise a transmission device and an input / output device, wherein the transmission device is connected to the above processor, and the input / output device is connected to the above processor.

[0059] Selectively, in this embodiment, the above-mentioned processor may be configured to perform the following steps via a computer program.

[0060] In step S1, airflow information parameters between the splashproof cover and the splashproof cover base are detected.

[0061] In step S2, the lifting module is controlled according to the airflow information parameters to raise and lower the splashproof cover, thereby achieving sealing between the splashproof cover and the splashproof cover base.

[0062] Specific examples in this embodiment may refer to the examples described in the above-mentioned embodiments and optional embodiments, and this embodiment will not be repeated here.

[0063] Furthermore, in conjunction with the sealing method in the above-described embodiment, the embodiment of the present application can be realized by providing a storage medium. When a computer program is stored in the storage medium, and the computer program is executed by a processor, one of the sealing methods of the above-described embodiment is realized.

[0064] Those skilled in the art will understand that any combination of the technical features of the above embodiments is possible, and for the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as these combinations of technical features are inconsistent, they should all be considered to fall within the scope described herein.

[0065] The embodiments described above represent only a few embodiments of the present application, and although the descriptions are relatively specific and detailed, they should be understood as limiting the scope of the invention patent. Those skilled in the art can make some modifications and improvements without departing from the concept of the present application, and all of these fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent should be in accordance with the attached claims.

Claims

1. It is a semiconductor device, The system comprises a splashproof cover, a splashproof cover base, a lifting module, a detection module, and a control module, wherein the control module is coupled between the lifting module and the detection module. The aforementioned lifting module is used to raise and lower the splashproof cover. The detection module is used to detect airflow information parameters between the splashproof cover and the splashproof cover base. The semiconductor device is characterized in that the control module is used to achieve sealing between the splashproof cover and the splashproof cover base by controlling the lifting module to raise and lower the splashproof cover based on the airflow information parameters.

2. A semiconductor device according to claim 1, A semiconductor device characterized in that the airflow information parameter includes wind speed, the detection module comprises a speed measuring unit, the speed measuring unit is coupled to the control module and used to detect the wind speed between the splashproof cover and the splashproof cover base.

3. A semiconductor device according to claim 2, The speed control module comprises a first determination unit and a first control unit, the first determination unit being coupled to the speed measuring unit, and the first control unit being coupled between the first determination unit and the lifting module. The first determination unit is used to determine whether the wind speed is greater than a preset wind speed. The semiconductor device is characterized in that the first control unit is used to achieve sealing between the splashproof cover and the splashproof cover base by controlling the lifting module to raise the splashproof cover when the first determination unit determines that the wind speed is greater than a preset wind speed, and by controlling the lifting module to stop the splashproof cover from rising when the wind speed is less than a preset wind speed.

4. A semiconductor device according to claim 1, The aforementioned airflow information parameters include pitch, The semiconductor device is characterized in that the detection module comprises a distance measuring unit, the distance measuring unit is coupled to the control module and used to detect the pitch between the splashproof cover and the splashproof cover base.

5. A semiconductor device according to claim 4, The control module comprises a second determination unit and a second control unit, the second determination unit being coupled to the distance measuring unit, and the second control unit being coupled between the second determination unit and the rapid lifting module. The second determination unit is used to determine whether the pitch is greater than a preset pitch. The semiconductor device is characterized in that the second control unit is used to achieve sealing between the splashproof cover and the splashproof cover base by controlling the lifting module to raise the splashproof cover when the second determination unit determines that the pitch is greater than a preset pitch, and by controlling the lifting module to stop raising the splashproof cover when the pitch is smaller than a preset pitch.

6. A sealing method applicable to a semiconductor device comprising a splashproof cover, a splashproof cover base, and a lifting module, The airflow information parameters between the splashproof cover and the splashproof cover base are detected. A sealing method characterized by controlling the lifting module according to the airflow information parameters to raise and lower the splashproof cover, thereby achieving sealing between the splashproof cover and the splashproof cover base.

7. A sealing method according to claim 6, The aforementioned airflow information parameters include wind speed, A sealing method characterized in that detecting airflow information parameters between the splashproof cover and the splashproof cover base includes detecting the wind speed between the splashproof cover and the splashproof cover base.

8. A sealing method according to claim 7, After detecting the wind speed between the splashproof cover and the splashproof cover base, the method Determine whether the wind speed is greater than a predetermined wind speed. A sealing method characterized in that, when it is determined that the wind speed is greater than a preset wind speed, the lifting module is controlled to raise the splashproof cover, thereby achieving sealing between the splashproof cover and the splashproof cover base.

9. A sealing method according to claim 6, The aforementioned airflow information parameters include pitch, A sealing method characterized in that detecting airflow information parameters between the splashproof cover and the splashproof cover base includes detecting the pitch between the splashproof cover and the splashproof cover base.

10. A sealing method according to claim 9, After detecting the pitch between the splashproof cover and the splashproof cover base, the method proceeds as follows: Determine whether the aforementioned pitch is greater than a preset pitch. A sealing method characterized in that, when it is determined that the pitch is greater than a preset pitch, the lifting module is controlled to raise the splashproof cover, thereby achieving sealing between the splashproof cover and the splashproof cover base.

11. An electronic device comprising memory and a processor, The electronic device is characterized in that a computer program is stored in the memory, and the processor is configured to execute the computer program in order to carry out the sealing method described in any one of claims 6 to 10.

12. A storage medium, The storage medium is characterized in that it stores a computer program, and the computer program is configured to execute the sealing method described in any one of claims 6 to 10 when it is executed.

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