Thermosetting compositions, curing compositions, and prepregs and laminates based thereon

Abstract

This disclosure relates to thermosetting compositions suitable for use in the manufacture of electronic materials such as circuit board substrates, and to cured compositions, prepregs, and laminates based on such thermosetting compositions. One aspect of this disclosure is a thermosetting composition comprising a poly(1,4-phenylene ether) component having a phenylene ether content of at least 80%, wherein the poly(1,4-phenylene ether) component comprises a poly(1,4-phenylene ether)bis(meth)acrylate component, a bis(vinyl)poly(1,4-phenylene ether) component, or a bis((meth)allyl)poly(1,4-phenylene ether) component, or a combination of two or more thereof, an aromatic crosslinking component having crosslinkable vinyl groups, (meth)allyl groups and / or (meth)acrylate groups having a weight-average molecular weight of 700 g / mol or less and an average number per molecule in the range of 1.75 to 3.5, a butadiene / styrene copolymer rubber component, microparticle silica, an organic halogen-free flame retardant component, and an effective amount of a thermal free radical initiator component.

Description

Technical Field

[0001] Cross - reference to related applications This application claims the benefit of priority of U.S. Provisional Patent Application No. 63 / 509,663, filed on June 22, 2023, the entire content of which is incorporated herein by reference.

[0002] The present disclosure relates to thermosetting compositions suitable for use in the manufacture of electronic materials such as circuit board substrates, and cured compositions, prepregs, and laminates based on such thermosetting compositions.

Background Art

[0003] Various polymer materials have been developed for use as substrates in electronics. In order to provide desirable high transmission speeds, particularly low dielectric constant and low dielectric tangent at high frequencies, as well as high glass transition temperature, low thermal expansion, and high temperature stability, etc. are included in the desirable properties.

[0004] Such materials are often provided with layers of copper foil laminated thereon. The peel strength between the copper foil and the polymer material is an important property of such materials. When processed into devices, these materials are subjected to high temperatures, for example, by soldering, etc., and insufficient adhesion between copper and the polymer can cause, for example, track lift, pad lift, and large - scale delamination in the device. Adhesive strength is usually measured by "peel strength", which quantifies the amount of force required to peel the copper layer from the said material.

[0005] However, while peel strength is important, electronic and thermal properties are also the same. There is a need for new materials that not only have high peel strength with copper, but also have good dielectric properties, particularly at high frequencies, and good thermal properties.

Summary of the Invention

[0006] One aspect of the present disclosure contains a poly(1,4-phenylene ether) component having a phenylene ether content of at least 80% in an amount within the range of 20 wt% to 35 wt%, wherein the poly(1,4-phenylene ether) component is a poly(1,4-phenylene ether)bis(meth)acrylate component, a bis(vinyl)poly(1,4-phenylene ether) component, or a bis((meth)allyl)poly(1,4-phenylene ether) component, or a combination of two or more thereof, and has a weight-average molecular weight of 700 g / mol or less, and This thermosetting composition contains, in an amount of 2 wt% to 15 wt%, an aromatic crosslinking component having crosslinkable vinyl groups, (meth)allyl groups and / or (meth)acrylate groups with an average number per unit area of ​​1.75 to 3.5; a butadiene / styrene copolymer rubber component in an amount of 5 wt% to 25 wt%; microparticle silica in an amount of 15 wt% to 50 wt%; an organic halogen-free flame retardant component in an amount of 15 wt% to 35 wt%; and an effective amount of a thermal free radical initiator component.

[0007] Another aspect of this disclosure is a cured product (e.g., partially cured or substantially fully cured) of a thermosetting composition described herein.

[0008] Another aspect of the present disclosure is a method for curing a thermosetting composition described herein, comprising heating the thermosetting composition at a temperature of 150°C to 250°C.

[0009] Another aspect of the present disclosure is a prepreg comprising a mesh substrate at least partially embedded in the cured product described herein.

[0010] Another aspect of this disclosure is a laminate comprising multiple prepregs described herein. [Brief explanation of the drawing]

[0011] [Figure 1] Figure 1 is a schematic cross-sectional view of a prepreg according to one embodiment of the present disclosure.

[0012] [Figure 2] Figure 2 is a schematic cross-sectional view of a laminate according to one embodiment of the present disclosure. [Modes for carrying out the invention]

[0013] The inventors have developed a specific thermosetting composition that provides not only good peel strength to copper, but also excellent dielectric properties at high frequencies and good thermal properties.

[0014] One aspect of the present disclosure contains a poly(1,4-phenylene ether) component having a phenylene ether content of at least 80% in an amount within the range of 20 wt% to 35 wt%, wherein the poly(1,4-phenylene ether) component is a poly(1,4-phenylene ether)bis(meth)acrylate component, a bis(vinyl)poly(1,4-phenylene ether) component, or a bis((meth)allyl)poly(1,4-phenylene ether) component, or a combination of two or more thereof, and has a weight-average molecular weight of 700 g / mol or less, and This thermosetting composition contains, in an amount of 2 wt% to 15 wt%, an aromatic crosslinking component having crosslinkable vinyl groups, (meth)allyl groups and / or (meth)acrylate groups with an average number per unit area of ​​1.75 to 3.5; a butadiene / styrene copolymer rubber component in an amount of 5 wt% to 25 wt%; microparticle silica in an amount of 15 wt% to 50 wt%; an organic halogen-free flame retardant component in an amount of 15 wt% to 35 wt%; and an effective amount of a thermal free radical initiator component.

[0015] As used herein, thermosetting compositions are substantially liquid compositions that harden from a liquid state to a solid state under the influence of heating. Various particularly desirable thermosetting compositions are "B-stageable," that is, they can be partially hardened to a moldable solid under a first heat treatment and then fully hardened under a second heat treatment. Partially hardened materials can be, for example, in a so-called "B-stage" and can be further hardened to a so-called "C-stage." Those skilled in the art of electronic materials are familiar with the use of thermosetting compositions in the manufacture of various products such as prepregs, resin films, resin-coated copper, laminates, and printed circuit boards, as described herein.

[0016] One component of the thermosetting composition of this disclosure is a poly(1,4-phenylene ether) component, which is a poly(1,4-phenylene ether) bis(meth)acrylate component, a bis(vinyl) poly(1,4-phenylene ether) component, or a bis((meth)allyl) poly(1,4-phenylene ether) component, or a combination of two or more thereof, having a phenylene ether content of at least 80 wt% and being included in an amount between 20 wt% and 35 wt%. The poly(1,4-phenylene ether) component may consist of a single sample of poly(1,4-phenylene ether) bis(meth)acrylate, bis(vinyl), or bis((meth)allyl) polymer (which usually contains multiple molecules with different degrees of polymerization), or a mixture of multiple samples of poly(1,4-phenylene ether) bis(meth)acrylate, bis(vinyl), or bis((meth)allyl) polymer.

[0017] The poly(1,4-phenylene ether) component has a phenylene ether content of at least 80 wt%. This means that at least 80 wt% of the component is composed of -O-(optionally substituted phenylene) groups. In various embodiments, the mass of (optionally substituted phenylene) groups in the -O-(optionally substituted phenylene) content of the poly(1,4-phenylene ether) component is composed of at least 50% phenyl carbons and phenyl hydrogens.

[0018] In various desirable embodiments, the poly(1,4-phenylene ether) component is a poly(1,4-phenylene ether)bismethacrylate component, i.e., it contains at least 75 wt%, for example, at least 90 wt%, of poly(1,4-phenylene ether)bismethacrylate.

[0019] In various embodiments, the poly(1,4-phenylene ether) component is a bis(vinyl)poly(1,4-phenylene ether) component, i.e., it contains at least 75 wt%, for example, at least 90 wt%, of bis(vinyl)poly(1,4-phenylene ether).

[0020] In various embodiments, the poly(1,4-phenylene ether) component is a bis(allyl)poly(1,4-phenylene ether) component, i.e., it contains at least 75 wt%, for example, at least 90 wt%, of bis(allyl)poly(1,4-phenylene ether).

[0021] In various embodiments, the poly(1,4-phenylene ether) component is a bis(metharyl)poly(1,4-phenylene ether) component, i.e., it contains at least 75 wt%, for example, at least 90 wt%, of bis(metharyl)poly(1,4-phenylene ether).

[0022] In various embodiments, the poly(1,4-phenylene ether) component has a structural formula [ka] having, wherein A is a bond, -CH2-, CH(CH3)-, -C(CH3)2-, -O-, -C(O)-, S(O) or S(O)2, and R 1 are each independently methacrylate, acrylate, vinyl, allyl, or methallyl, and R 2 are each independently methyl or hydrogen, and R 3 are each independently methyl or hydrogen. A, R 1 and R 2 Mixtures of molecules having different identities for are specifically contemplated in this definition. As will be understood by those skilled in the art, the values of x and y vary depending on the molecular weight of the material. <s

[0023] For example, in various embodiments, A is -CH2-, CH(CH3)- or -C(CH3)2-. In various embodiments, A is -C(CH3)2-.

[0024] The structure of the tetra-R 2 -substituted site can vary. For example, in various embodiments,

Chemical formula

Chemical formula

Chemical formula

[0025] In various embodiments, [ka] In at least 75% of the area, two R 2 It is methyl-substituted at the meta position, and two R 2 H is the case. For example, in various embodiments, [ka] In at least 90% of the area, two R 2 It is methyl-substituted at the meta position, and two R 2 H is the value of H in various embodiments. [ka] In at least 98% of the area, two R 2 It is methyl-substituted at the meta position, and two R 2 H is H.

[0026] In various embodiments, [ka] In at least 75% of the area, two R 2 It is methyl-substituted at the meta position distal to site A, and two R 2 H is the case. For example, in various embodiments, [ka] In at least 90% of the area, two R 2 It is methyl-substituted at the meta position distal to site A, and two R 2 H is the value of H in various embodiments. [ka] In at least 98% of the area, two R 2 It is methyl-substituted at the meta position distal to site A, and two R 2 H is H.

[0027] Tetra-R 3 -The structure of the substituted site may also change. For example, in various embodiments, [ka] In at least 75% of the area, two R 3 It is methyl and has two R 3 H is the case. For example, in various embodiments, [ka] In at least 90% of the area, two R 3 It is methyl and has two R 3 H is the value of H in various embodiments. [ka] In at least 98% of the area, two R 3 It is methyl and has two R 3 H is H.

[0028] In various embodiments, [ka] In at least 75% of the area, two R 3 It is methyl-substituted at the meta position, and two R 3 H is the case. For example, in various embodiments, [ka] In at least 90% of the area, two R 3 It is methyl-substituted at the meta position, and two R 3 H is the value of H in various embodiments. [ka] In at least 98% of the area, two R 3 It is methyl-substituted at the meta position, and two R 3H is H.

[0029] In various embodiments, [ka] In at least 75% of the area, two R 3 It is methyl-substituted at the meta position distal to site A, and two R 3 H is the case. For example, in various embodiments, [ka] In at least 90% of the area, two R 3 It is methyl-substituted at the meta position distal to site A, and two R 3 H is the value of H in various embodiments. [ka] In at least 98% of the area, two R 3 It is methyl-substituted at the meta position distal to site A, and two R 3 H is H.

[0030] As mentioned above, R 1 R may be one or more of methacrylate, acrylate, vinyl, allyl, and methallyl. In various embodiments, R 1 At least 75%, for example, at least 90%, or at least 95%, of which is methacrylate. In various embodiments, R 1 At least 75%, for example, at least 90%, or at least 95% of it is vinyl. In various embodiments, R 1 At least 75%, for example, at least 90%, or at least 95% is allyl. In various embodiments, R 1 At least 75%, for example, at least 90%, or at least 95% of is metharyl. In various embodiments, R 1 At least 75%, for example, at least 90%, or at least 95%, of which is methacrylate, vinyl, allyl, or metharyl.

[0031] In various specific embodiments, at least 75 wt% of the poly(1,4-phenylene ether) component is of the formula [ka] It has the following characteristics. In various embodiments, at least 90 wt% of the poly(1,4-phenylene ether) component is represented by the formula. In various such embodiments, at least 95 wt% of the poly(1,4-phenylene ether) component is represented by the formula.

[0032] The poly(1,4-phenylene ether) component may have various molecular weights. Those skilled in the art can select an appropriate molecular weight to impart desirable properties to the thermosetting composition, such as a desirable viscosity that allows for processing into prepregs or other cured products. For example, in various embodiments, the poly(1,4-phenylene ether) component has a number average molecular weight in the range of 1000 g / mol to 4000 g / mol, for example, 1000 g / mol to 3500 g / mol or 1000 g / mol to 3000 g / mol or 1000 g / mol to 2500 g / mol or 1500 g / mol to 4000 g / mol or 1500 g / mol to 3500 g / mol or 1500 g / mol to 2500 g / mol.

[0033] As mentioned above, the values ​​of x and y depend on the molecular weight of the material. In various embodiments, the poly(1,4-phenylene ether) component has a numerical average value of the sum of x + y within the range of 3 to 30, for example, 3 to 25, or 3 to 20, or 3 to 15, or 5 to 30, or 5 to 25, or 5 to 20, or 5 to 15, or 7 to 30, or 7 to 25, or 7 to 20, or 7 to 15, or 10 to 30, or 10 to 25, or 10 to 20, or 10 to 15.

[0034] Examples of suitable materials include NORYL SA-9000, available from SABIC; Kolon KPU-6000, available from Kolon Industries; and SP7-160, available from SilverAge Engineering Plastics Co Ltd.

[0035] As mentioned above, the poly(1,4-phenylene ether) component is present in the thermosetting composition in an amount between 20 wt% and 35 wt%. Those skilled in the art can generally change the amount within this range. For example, in various embodiments, the poly(1,4-phenylene ether) component is present in an amount between 22 wt% and 35 wt%, for example between 22 wt% and 32 wt%, or between 22 wt% and 30 wt%. In various embodiments, the poly(1,4-phenylene ether) component is present in an amount between 25 wt% and 35 wt%, for example between 25 wt% and 32 wt%, or between 25 wt% and 30 wt%.

[0036] As described above, the thermosetting composition further contains, in an amount of 2 wt% to 15 wt%, an aromatic crosslinking component having crosslinkable vinyl groups, (meth)allyl groups and / or (meth)acrylate groups, with a weight-average molecular weight of 700 g / mol or less and an average number per molecule in the range of 1.75 to 3.5.

[0037] Those skilled in the art will understand that various such aromatic crosslinking components may be used alone or in combination. For example, in various preferred embodiments, the aromatic crosslinking component includes (or is a cyanurate component). In various embodiments, the aromatic crosslinking component includes (or is a cyanurate component) which is triallyl cyanurate, triallyl isocyanurate, or a combination of triallyl cyanurate and triallyl isocyanurate. For example, in one embodiment, the aromatic crosslinking component includes (or is a triallyl cyanurate). In one embodiment, the aromatic crosslinking component includes (or is a triallyl isocyanurate). In one embodiment, the aromatic crosslinking component includes (or is a combination of triallyl cyanurate and triallyl isocyanurate). In one embodiment, the aromatic crosslinking component includes (or is a combination of triallyl cyanurate and triallyl isocyanurate).

[0038] However, those skilled in the art will understand that other aromatic crosslinking agents may be used in combination with the aforementioned cyanurate materials or, in their place. For example, in various embodiments, the aromatic crosslinking component includes (or is) divinylbenzene.

[0039] In various embodiments, the aromatic crosslinking component includes triallyl cyanurate, triallyl isocyanurate, trimethyl isocyanurate, divinylbenzene, or any combination thereof (or triallyl cyanurate, triallyl isocyanurate, trimethyl isocyanurate, divinylbenzene, or any combination thereof).

[0040] Aromatic crosslinking components, such as those mentioned above, are widely available from various vendors.

[0041] The thermosetting compositions described herein may contain aromatic crosslinking components in various amounts. For example, in various embodiments, the aromatic crosslinking component is present in an amount in the range of 2 wt% to 11 wt%, for example, 2 wt% to 9 wt%, or 2 wt% to 7 wt%. In various embodiments, the aromatic crosslinking component is present in an amount in the range of 3 wt% to 15 wt%, for example, 3 wt% to 11 wt%, or 3 wt% to 9 wt%, or 3 wt% to 7 wt%. In various embodiments, the aromatic crosslinking component is present in an amount in the range of 4 wt% to 15 wt%, for example, 4 wt% to 11 wt%, or 4 wt% to 9 wt%, or 4 wt% to 7 wt%. Those skilled in the art can impart desired properties to the cured material by adjusting the amount of aromatic crosslinking component.

[0042] The thermosetting composition further comprises a butadiene / styrene copolymer rubber component in an amount of 5 wt% to 25 wt%. The butadiene / styrene copolymer rubber used herein is a polymer formed from at least 80 wt% butadiene and styrene residues, and having a glass transition temperature of 5°C or less as measured by DSC. The corresponding component of the thermosetting composition may contain one or more samples of such rubber.

[0043] In various embodiments, the butadiene / styrene copolymer rubber component has a total content of at least 90 wt%, for example, at least 95 wt%, at least 97 wt%, at least 98 wt%, or at least 99 wt%, of butadiene residues and styrene residues.

[0044] However, in various embodiments, the butadiene / styrene copolymer rubber component contains substantial amounts of other residues. For example, in one embodiment, the butadiene / styrene copolymer rubber component contains divinylbenzene residues, for example, grafted onto the butadiene / styrene backbone. In various embodiments, the butadiene / styrene copolymer rubber component contains divinylbenzene residues in a range of up to 5 wt%, for example, 0.5 wt% to 5 wt%, or 0.5 wt% to 3 wt%, or 1 wt% to 5 wt%, or 1 wt% to 3 wt%.

[0045] In various embodiments described separately herein, the butadiene / styrene copolymer rubber component has butadiene and styrene arranged substantially randomly. Those skilled in the art will understand that such materials can be produced by copolymerization of butadiene and styrene in a single step. However, in other embodiments, copolymers having substantially block copolymer characteristics may be used.

[0046] In various embodiments, the butadiene / styrene copolymer rubber component has a number average molecular weight in the range of 1500 g / mol to 7000 g / mol, for example, 1500 g / mol to 5000 g / mol, or 2500 g / mol to 7000 g / mol, or 2500 g / mol to 5000 g / mol.

[0047] The amount of 1,2-vinyl moieties in the butadiene / styrene substantially random copolymer rubber component can vary. In various embodiments, the butadiene residues of the butadiene / styrene copolymer rubber component have a 1,2-vinyl moiety mole fraction in the range of 15 mol% to 80 mol%, for example, 15% to 70%, or 15% to 60%, or 20 mol% to 80%, or 20 mol% to 70%, or 20 mol% to 60%. In various embodiments, the butadiene residues of the butadiene / styrene copolymer rubber component have a 1,2-vinyl moiety mole fraction of 25 mol% to 80 mol%, for example, 25% to 70%, or 25% to 60%, or 30 mol% to 80%, or 30 mol% to 70%, or 30 mol% to 60%. In various embodiments, the butadiene residues of the butadiene / styrene copolymer rubber component have a mole fraction of 35 mol% to 80 mol% of the 1,2-vinyl moiety, for example, 35% to 70%, or 35% to 60%, or 40 mol% to 80%, or 40 mol% to 70%, or 40 mol% to 60%. In various embodiments, the butadiene residues of the butadiene / styrene copolymer rubber component have a mole fraction of 20 mol% to 60 mol% of the 1,2-vinyl moiety, for example, 20 mol% to 55 mol%, or 20 mol% to 50 mol%, or 20 mol% to 45 mol%, or 25 mol% to 60 mol%, or 25 mol% to 55 mol%, or 25 mol% to 50 mol%, or 25 mol% to 45 mol%, or 30 mol% to 60 mol%, or 30 mol% to 55 mol%, or 30 mol% to 50 mol%, or 30 mol% to 45 mol%, or 35 mol% to 60 mol%, or 35 mol% to 55 mol%, or 35 mol% to 50 mol%, or 35 mol% to 45 mol%, or 35 mol% to 60 mol%, or 35 mol% to 55 mol%, or 35 mol% to 50 mol%, or 35 mol% to 45 mol%.

[0048] The amount of styrene residues in the butadiene / styrene copolymer rubber component can also vary. In various embodiments, the butadiene / styrene substantially random copolymer rubber component has styrene residues in the range of 15 wt% to 40 wt%, for example, 15 wt% to 35 wt% or 15 wt% to 30 wt%. In various embodiments, the butadiene / styrene copolymer rubber component has styrene residues in the range of 20 wt% to 40 wt%, for example, 20 wt% to 35 wt% or 20 wt% to 30 wt%. In various embodiments, the butadiene / styrene copolymer rubber component has styrene residues in the range of 23 wt% to 40 wt%, for example, 23 wt% to 35 wt% or 23 wt% to 30 wt%.

[0049] Butadiene / styrene copolymer rubber components can be substantially produced from a single sample of butadiene / styrene copolymer rubber, although mixtures may be used in some cases. For example, in various embodiments, the butadiene / styrene copolymer rubber component consists of a first butadiene / styrene substantially random copolymer rubber subcomponent having 17 wt% to 27 wt% of styrene residues and a mole fraction of 60 mol% to 80 mol% of the 1,2-vinyl moiety of the butadiene residues, and a second butadiene / styrene substantially random copolymer rubber subcomponent having 20 wt% to 30 wt% of styrene residues and a mole fraction of 20 mol% to 40 mol% of the 1,2-vinyl moiety of the butadiene residues. In various such embodiments, the weight ratio of the first butadiene / styrene substantially random copolymer component to the second butadiene / styrene substantially random copolymer component is in the range of 1:1.2 to 1:2.3, for example, 1:1.5 to 1:2.3, or 1:1.2 to 1:2, or 1:1.5 to 1:2.

[0050] Butadiene / styrene substantially random copolymer rubber materials are available from various vendors, including Cray Valley (e.g., Ricon 100, Ricon 181, Ricon 184, Ricon 257) and Kurary Co., Ltd. (L-SBR grades including L-SBR-870, L-SBR-822, and L-SBR-841).

[0051] The amount of butadiene / styrene copolymer rubber component in the thermosetting composition may vary. For example, in various embodiments, the butadiene / styrene copolymer rubber component is present in an amount within the range of 5 wt% to 20 wt%, or 5 wt% to 18 wt%, or 5 wt% to 15 wt%. In various embodiments, the butadiene / styrene copolymer rubber component is present in an amount within the range of 7 wt% to 25 wt%, for example, 7 wt% to 20 wt%, or 7 wt% to 18 wt%, or 7 wt% to 15 wt%. In various embodiments, the butadiene / styrene substantially random copolymer rubber component is present in an amount within the range of 9 wt% to 25 wt%, for example, 9 wt% to 20 wt%, or 9 wt% to 18 wt%, or 9 wt% to 15 wt%.

[0052] The thermosetting composition further contains microparticle silica in an amount ranging from 15 wt% to 50 wt%. The microparticle silica used herein is at least 95 wt% SiO2, and d 50 The particle material has a particle size in the range of 0.1 microns to 100 microns. In various embodiments, the d of microparticle silica 50 The particle size is in the range of 0.5 microns to 10 microns, for example, 0.5 microns to 7 microns, or 0.5 microns to 5 microns, or 1 micron to 10 microns, or 1 micron to 7 microns, or 1 micron to 5 microns. In various embodiments, the d of the microparticle silica 90The particle size is within the range of 1 micron to 20 microns, for example, 1 micron to 14 microns, or 1 micron to 8 microns, or 3 microns to 20 microns, or 3 microns to 14 microns, or 3 microns to 8 microns. In various embodiments, the d of microparticle silica 10 The particle size is in the range of 0.1 microns to 5 microns, for example, 0.1 microns to 3 microns, or 0.1 microns to 2 microns, or 0.5 microns to 5 microns, or 0.5 microns to 3 microns, or 0.5 microns to 2 microns. In various embodiments, the microparticle silica has at least 99 wt% SiO2, for example, at least 99.5 wt% SiO2.

[0053] Microparticle silica is preferably substantially spherical. Those skilled in the art can confirm the sphericity using a microscope.

[0054] Suitable microparticle silica is available from various vendors, including DQ-1028L from Novoray, SS-15V from Sibelco, and FB-3SDC and FB-3SDX from Denka Co. Ltd.

[0055] The amount of microparticle silica can vary. For example, in various embodiments, microparticle silica is present in an amount ranging from 15 wt% to 45 wt%, or from 15 wt% to 40 wt%, or from 15 wt% to 35 wt%. In various specific embodiments, microparticle silica is present in an amount ranging from 20 wt% to 50 wt%, for example from 20 wt% to 45 wt%, or from 20 wt% to 40 wt%, or from 20 wt% to 35 wt%. In various specific embodiments, microparticle silica is present in an amount ranging from 25 wt% to 50 wt%, for example from 25 wt% to 45 wt%, or from 25 wt% to 40 wt%, or from 25 wt% to 35 wt%.

[0056] The thermosetting composition further contains an organic halogen-free flame retardant component present in an amount of 15 wt% to 35 wt%. In various embodiments, the organic halogen-free flame retardant contains phosphorus.

[0057] In particular, the inventors have found that certain flame retardants described in U.S. Patents 8,536,256, 9,012,546, 9,522,927 and 9,562,063 provide particularly good performance in the thermosetting compositions described herein. Accordingly, these patents are incorporated herein by reference in their entirety, and their contents are set forth below. This disclosure assumes the use of any flame retardant, either alone or in combination, as generally or specifically described in any of these patents, as part of the organic halogen-free flame retardants of the thermosetting compositions of this disclosure. For example, in various embodiments, the organic halogen-free flame retardant component is 6H-dibenz[c,e][1,2]oxaphosphorine,6,6'-(1,4-ethanediyl)bis-,6,6'-dioxide, 6H-dibenz[c,e][1,2]oxaphosphorine,6,6'-(1,4-butanediyl)bis-,6,6'-dioxide, or 6H-dibenz[c,e][1,2]oxaphosphorine,6,6'-(p-xylenediyl)bis-,6,6'-dioxide, or This includes any combination of these (or 6H-dibenz[c,e][1,2]oxaphosphorine,6,6'-(1,4-ethanediyl)bis-,6,6'-dioxide, 6H-dibenz[c,e][1,2]oxaphosphorine,6,6'-(1,4-butanediyl)bis-,6,6'-dioxide, or 6H-dibenz[c,e][1,2]oxaphosphorine,6,6'-(p-xylenediyl)bis-,6,6'-dioxide, or any combination thereof). In various embodiments, the flame retardant component includes (or is) a compound having the following structure. [ka] In various embodiments, the flame retardant component is formula IIa [ka] The high melting point isomer of the following formula [ka] The present invention includes a composition containing low-melting-point isomers of formulas IIb and IIc (or a composition containing a high-melting-point isomer of formula IIa and low-melting-point isomers of formulas IIb and IIc). The present invention includes a composition in which the isomer ratio calculated by 31P NMR is greater than approximately 0.5, and the isomer ratio = A h / ( A h +A l ) and the above A h This indicates the area of ​​the high melting point isomer peak, and A l This indicates the area of ​​the low-melting-point isomer peak.

[0058] However, in other embodiments, other halogen-free flame retardants may be used. In various embodiments, the organic halogen-free flame retardant is selected from phosphorus-containing flame retardants, such as FRM 6300 (Qingdao) and Mosaflam 615 (UFC).

[0059] Organic halogen-free flame retardant components can be provided in a wide range of amounts, from 15 wt% to 35 wt%, in the thermosetting composition. For example, in various embodiments, the organic halogen-free flame retardant component is present in an amount of 15 wt% to 30 wt%, for example, from 15 wt% to 25 wt%. In various embodiments, the organic halogen-free flame retardant component is present in an amount of 20 wt% to 35 wt%, for example, from 20 wt% to 30 wt%, or from 20 wt% to 25 wt%. In various embodiments, the organic halogen-free flame retardant component is present in an amount of 25 wt% to 35 wt%, for example, from 25 wt% to 30 wt%.

[0060] As described above, the thermosetting composition further comprises an effective amount of a thermal free radical initiator component. Those skilled in the art can select a desired amount of a desirable thermal free radical initiator or a combination thereof to initially polymerize the thermosetting composition into a B-stage composition, and to further polymerize the B-stage composition into a substantially polymerized composition, for example, in the form of a laminate. Suitable initiators are not limited to benzoyl peroxide, dicumyl peroxide, methyl ethyl ketone peroxide, lauryl peroxide, cyclohexanone peroxide, t-butyl hydroperoxide, t-butylbenzene hydroperoxide, acetylisobutyryl peroxide, diacetyl peroxide, t-butyl peroctoate, α,α'-bis(t-butylperoxy-m-isopropyl)benzene, 2,3-dimethyl-2,3-diphenylbutane, di(trimethylsilyl)peroxide, ,5-dimethyl-2,5-di(benzoylperoxy)hexane, 2,5-dimethylhexane-2,5-dihydroperoxide, 2,5-dimethyl-2,5-di(t-butylperoxy)-hexy-3-yine, di-t-butyl The compounds include peroxides, t-butylcumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, t-butylperoxybenzoate, 2,2-bis(t-butylperoxy)butane, 2,2-bis(t-butylperoxy)octane, 2-trimethylsilylphenyltriphenylsilyl peroxide, 2,3-trimethylsilyloxy-2,3-diphenylbutane, di(t-butylperoxy)isophthalate, azobisisobutyronitrile (AIBN), azobis(2-isopropyl)butyronitrile, 2,2'-azobis(2,4-dimethyl)valeronitrile (AVBN), (2,4-dichlorobenzoyl) peroxide, (2-dimethylbenzoyl) peroxide, and dodecanoyl peroxide. Those skilled in the art can use a single initiator or a combination of initiators as the initiator component. One or more initiators can be used together with a carrier in some embodiments, and those skilled in the art will understand that the mass of the thermal free radical initiator component can be calculated as the mass of the initiator compound itself, omitting the mass of any carrier.

[0061] Those skilled in the art can determine the effective amount of the thermal free radical initiator component. For example, in various embodiments, the thermal free radical initiator component is present in an amount within the range of 0.05 wt% to 4 wt%, for example, 0.05 wt% to 2 wt%, or 0.05 wt% to 1 wt%, or 0.05 wt% to 0.7 wt%. In various embodiments, the thermal free radical initiator component is present in an amount within the range of 0.07 wt% to 4 wt%, for example, 0.07 wt% to 2 wt%, or 0.07 wt% to 1 wt%, or 0.07 wt% to 0.7 wt%. In various embodiments, the thermal free radical initiator component is present in an amount within the range of 0.1 wt% to 4 wt%, for example, 0.1 wt% to 2 wt%, or 0.1 wt% to 1 wt%, or 0.1 wt% to 0.7 wt%. In various embodiments, the thermal free radical initiator component is present in an amount within the range of 0.2 wt% to 4 wt%, for example, 0.2 wt% to 2 wt%, or 0.2 wt% to 1 wt%, or 0.2 wt% to 0.7 wt%.

[0062] In some embodiments, additional components other than those described above may be present. For example, in various embodiments, the thermosetting composition may contain a silane coupling agent to impart bonding to microparticle silica fillers used in the manufacture of prepregs or laminates, and / or to glass materials. Those skilled in the art will be familiar with silane coupling agents and can select an appropriate one based on the description herein. For example, in some embodiments, the silane coupling agent may be one or more selected from (meth)acrylic functional silanes (e.g., 3-(meth)acryloxy)propyltrimethoxysilane), vinyl functional silanes (e.g., vinyltriethoxysilane), allyl functional silanes (e.g., allyltrimethoxysilane), and other reactive carbon-carbon double bond-containing silanes (e.g., styryltrimethoxysilane, 3-butenyltriethoxysilane, 7-octenyltriethoxysilane). The silane coupling agent may be present in an amount of, for example, up to 5 wt%, for example, in the range of 0.1 wt% to 5 wt%. However, the inventors have found that in many embodiments, a silane coupling agent is not necessarily required for good performance, and therefore, in various embodiments, the silane coupling agent is 0.01 wt% or less.

[0063] The amounts of components in the thermosetting compositions described herein are based on dry solids, i.e., the total amount of non-volatile components (i.e., boiling point less than 200°C at atmospheric pressure) of the composition is 100 wt%. In various embodiments, the thermosetting compositions are provided in a substantially non-volatile form, i.e., without the use of substantial amounts of solvent. The inventors have found that in many embodiments, the thermosetting compositions described herein can be obtained at the desired viscosity without the use of large amounts of solvent. Therefore, in various embodiments, the thermosetting compositions described herein may contain 10 wt% or less, for example, 5 wt% or less, or 3 wt% or less, or 1 wt% or less, of materials with a boiling point less than 200°C at atmospheric pressure, when calculated assuming 100 wt% of non-volatile components as described above.

[0064] However, the inventors have found that solvents can be useful in reducing the viscosity of materials for processing, particularly in the impregnation of glass fiber or polymer fabrics for the production of prepregs. Therefore, in various embodiments, the thermosetting composition further comprises a solvent having a boiling point of less than 200°C at atmospheric pressure. Those skilled in the art will understand that various solvents can be used alone or in combination, and will be able to determine a solvent suitable for suspending the various components of the composition. Possible examples include γ-butyrolactone, cyclohexanone, butanone, methyl isobutyl ketone, N,N-dimethylformamide, propylene glycol monomethyl ether, N,N-dimethylacetamide, ethylene glycol monomethyl ether, methoxyethyl acetate, ethoxyethyl acetate, propoxyethyl acetate, diisobutyl ketone (DIBK), N-methyl-pyrrolidone, xylene, ethyl acetate, toluene, trichloroethane, dibutyl ether, methyl ethyl ketone, and acetone. Similarly, those skilled in the art will understand that the amount of solvent can be varied to obtain the desired viscosity. In various embodiments, the amount of solvent is greater than the non-volatile components of the thermosetting composition (i.e., 100 wt% in total) up to 60 wt%, for example, in the range of 20 wt% to 60 wt%.

[0065] Another aspect of this disclosure is a cured product of a thermosetting composition described herein. Those skilled in the art will understand that in one embodiment the cured product is only partially cured to the extent that it forms a solid form, for example, that is easy to handle but can be fully cured by further processing. The partial curing may be to a so-called "B stage," or to a lower or higher degree. In other embodiments, the cured product may be substantially fully cured to be substantially stable for further processing. Various curing conditions may be used, but typically the curing is carried out at a curing temperature in the range of 100°C to 250°C for a sufficient time to reach the desired degree of curing.

[0066] Another aspect of the present disclosure is a prepreg comprising a mesh substrate at least partially embedded in a cured product of the present disclosure, preferably a partially cured product that can be further cured by subsequent further heating. One embodiment is shown by a schematic cross-sectional view in Figure 1, where the prepreg 100 comprises a mesh substrate 110 embedded in a cured product 120 of the present disclosure.

[0067] Those skilled in the art can use a variety of mesh substrates. For example, in various embodiments, the mesh substrate is a fabric (woven or nonwoven) made from various polymer fibers, such as glass fibers, carbon fibers, or aramid fibers, such as materials available under the trade name KEVLAR. In a particularly preferred embodiment, the substrate is a borosilicate glass fabric. In one such embodiment, the glass is formed from oxides of SiO2 (50 wt% to 80 wt%) and B2O3 (5 wt% to 25 wt%), and optionally contains CaO (up to 30 wt%), Al2O3 (up to 20 wt%), and MgO (up to 5 wt%). Examples of suitable glass fabrics include electronic grade E-glass, NE-glass, D-glass, and S-glass fabrics. In various embodiments, the mesh substrate is substantially embedded in the cured product. As those skilled in the art will understand, prepregs can be prepared in various overall thicknesses, but in one embodiment, the thickness of the prepreg is in the range of 10 microns to 300 microns, for example, 10 microns to 200 microns, or 10 microns to 150 microns, or 10 microns to 100 microns. In one embodiment, the thickness of the prepreg is in the range of 25 microns to 300 microns, for example, 25 microns to 200 microns, or 25 microns to 150 microns, or 25 microns to 100 microns. In one embodiment, the thickness of the prepreg is in the range of 50 microns to 300 microns, for example, 50 microns to 200 microns, or 50 microns to 150 microns. The prepreg preferably contains at least 30 wt%, for example, at least 50 wt%, of the cured product of the Disclosure.

[0068] Those skilled in the art will be familiar with the methods for producing prepregs, and such methods can be applied to use with the thermosetting compositions of this disclosure. The thermosetting composition may be brought into contact with a mesh substrate, dried as necessary to remove any volatiles, and cured by heating to at least partially cure the thermosetting composition, thereby providing a prepreg.

[0069] Another aspect of this disclosure is a laminate comprising multiple prepregs of this disclosure. One embodiment is shown by a schematic perspective view in Figure 2, where the laminate 230 comprises a laminate of multiple prepregs 200. The laminate can be produced by heat-pressing the multiple prepregs described herein to soften and further harden the partially hardened material of the prepregs and fuse them into a laminate structure. The heat-pressing conditions can be modified but are generally within the range of 150°C to 250°C and 1 MPa to 10 MPa. In many embodiments, further hardening can substantially completely harden the material. Substantially complete hardening as used herein can be determined using a delta-Tg measurement, in which the material is heated to 250°C in a differential scanning calorimeter to determine the first glass transition temperature (Tg). The sample is then cooled to room temperature, and the Tg measurement is repeated by heating to 250°C to obtain a second Tg. If the difference between the first Tg and the second Tg is 10°C or less, the material is considered substantially completely hardened. Here again, those skilled in the art will be familiar with the techniques for forming laminates from prepregs and can apply them to the use of the prepregs of this disclosure.

[0070] The laminates of the present disclosure may include one or more layers of metal, such as copper. The one or more layers of metal may be arranged, for example, on one or both main surfaces of the laminate and / or laminated between layers of prepreg. Each layer of metal may be substantially uniform or may be in the form of circuits by etching, for example. As those skilled in the art will understand, a circuit board laminate may be constructed in a series of steps, for example, by providing metal to one or both surfaces of a first laminate, then forming circuits from such metal, and then further laminating additional layers of prepreg and metal onto the processed first laminate to obtain a multilayer laminate.

[0071] The inventors have found that the material described herein provides good peel strength even when using thin, low-roughness copper. Such copper is available under the name "BF-NN". In various embodiments, one or more copper layers have a thickness in the range of 15 microns to 50 microns, for example, in the range of 17 microns to 37 microns. In various embodiments, each of the one or more copper layers has an outer surface that does not face the laminated prepreg and has one or more surface roughness Ra of 0.3 microns or less (contact measurement, ISO 4287) and / or a surface roughness Sa of 0.1 microns to 0.3 microns, for example, 0.15 microns to 0.25 microns (non-contact measurement, ISO 25178). In various embodiments, one or more copper layers each have an inner surface that is in contact with one of the prepregs having one or more surface roughnesses in the range of 0.1 microns to 0.4 microns (e.g., 0.12 microns to 0.3 microns), a surface roughness in the range of 1 micron to 5 microns (e.g., 1.2 microns to 4 microns), and / or a surface roughness in the range of 0.5 microns to 3 microns (e.g., 0.7 microns to 2 microns) (all measured non-contact, ISO 25178).

[0072] The inventors have found that the materials described herein possess various desirable properties, including a low Df value, good peel strength, and a high glass transition temperature. For example, in various embodiments, the laminate has a Df value measured according to IPC-TM-650 2.5.5.5 in the range of 0.0015 to 0.003, for example, 0.0015 to 0.0025. In various embodiments, the laminate has a peel strength measured according to IPC-TM-650 2.4.8 of at least 2.5 lb / in (for example, within the range of 2.5 lb / in to 5 lb / in, or 2.5 lb / in to 4.5 lb / in, or 2.5 lb / in to 4 lb / in, or 3 lb / in to 5 lb / in, or 3 lb / in to 4.5 lb / in, or 3 lb / in to 4 lb / in). In various embodiments, the laminate has a Tg measured by DSC in the range of 180°C to 240°C, for example, 180°C to 230°C, or 180°C to 220°C, or 190°C to 240°C, or 190°C to 230°C, or 190°C to 220°C.

[0073] Various aspects and embodiments of this disclosure will be further described below with reference to examples, but are not limited thereto.

[0074] Example 1 Various aspects and embodiments of this disclosure will be further described below with reference to examples, but are not limited thereto.

[0075] The compositions of various specific examples contain the following components on a solid basis. [Table 1]

[0076] PPO methacrylate has a nominal structural formula [ka] It is a poly(phenylene oxide) bismethacrylate available under the trade name NORYL. Styrene-butadiene rubber (70% 1,2 vinyl, 17-27 wt% styrene) is available under the trade name RICON® 100. Styrene-butadiene rubber (20-40% 1,2 vinyl, 20-30 wt% styrene) is available under the trade name RICON® 181. Styrene-butadiene rubber (30% 1,2 vinyl, 28% styrene) is available under the trade name RICON® 184. Particulate silica is DQ-1028L and is available from Novoray. The halogen-free flame retardant is formula IIa. [ka] The high melting point isomer of the following formula [ka] The composition contains low-melting-point isomers of formulas IIb and IIc, represented by . The composition has an isomer ratio greater than approximately 0.5 as measured by 31P NMR, and the isomer ratio = A h / ( A h +A l ) and the above A h This indicates the area of ​​the high melting point isomer peak, and A l This indicates the area of ​​the low-melting-point isomer peak.

[0077] The thermosetting composition is formed into a 6-ply laminate. The thermosetting composition is filled into an immersion pan and woven glass fabric (2116, low Dk glass, 0.10 mm thick, 105 g / m²). 2 The mixture is then drawn through a dipping pan and then between rollers with a gap thickness of 0.012. The resin-coated glass dough is dried in an oven to substantially remove the solvent (i.e., less than 1% solvent residue). This yields a prepreg material with 57% resin on the glass and a thickness of approximately 0.005 inches.

[0078] The six layers of the prepreg are stacked between two copper sheets (BF-NN grade, super flat profile, "1 ounce", nominal thickness 35 microns) with the copper processing surface in contact with the prepreg material. The assembly is then placed between two stainless steel press plates and loaded into a hot oil vacuum press. Pressure (200 psi to 500 psi) and vacuum (2 mbar to 5 mbar) are applied, and the temperature of the load is heated to a holding temperature (210°C) at a predetermined heating rate (2.5°C / min). After being held for a predetermined time (120 min), the press is cooled at approximately 5°C / min until the resulting laminate is cool enough to be removed.

[0079] The table below shows the data for the two example compositions. [Table 2]

[0080] The use of thin, highly flat copper is particularly challenging from the standpoint of peel strength. The compositions described herein have been shown to provide good peel strength even for BF-NN grade copper.

[0081] Various aspects of this disclosure can be described below by embodiments that can be combined in any number and any combination that is not technically or logically contradictory. Embodiment 1. A poly(1,4-phenylene ether) component having a phenylene ether content of at least 80% is contained in an amount within the range of 20 wt% to 35 wt%, and the poly(1,4-phenylene ether) component is a poly(1,4-phenylene ether)bis(meth)acrylate component, a bis(vinyl)poly(1,4-phenylene ether) component, or a bis((meth)allyl)poly(1,4-phenylene ether) component, or a combination of two or more thereof, and the weight-average molecular weight is 700 g / mol or less, and the molecular weight is 700 g / mol or less. This thermosetting composition contains an aromatic crosslinking component having crosslinkable vinyl groups, (meth)allyl groups, and / or (meth)acrylate groups with an average number per unit area of ​​1.75 to 3.5 in an amount ranging from 2 wt% to 15 wt%, a butadiene / styrene copolymer rubber component in an amount ranging from 5 wt% to 25 wt%, microparticle silica in an amount ranging from 15 wt% to 50 wt%, an organic halogen-free flame retardant component in an amount ranging from 15 wt% to 35 wt%, and an effective amount of a thermal free radical initiator component. Embodiment 2. The thermosetting composition of Embodiment 1, wherein the mass of the (optionally substituted phenylene) groups in the -O-(optionally substituted phenylene) content of the poly(1,4-phenylene ether) component consists of at least 50% phenyl carbon and phenyl hydrogen. Embodiment 3. The thermosetting composition of Embodiment 1 or 2, wherein the poly(1,4-phenylene ether)bis(meth)acrylate component is a poly(1,4-phenylene ether)bismethacrylate component, that is, having at least 75 wt%, for example, at least 90 wt%, of poly(1,4-phenylene ether)bismethacrylate. Embodiment 4. The thermosetting composition of Embodiment 1 or 2, wherein the poly(1,4-phenylene ether) component is a bis(vinyl)poly(1,4-phenylene ether) component, that is, having at least 75 wt%, for example, at least 90 wt%, of bis(vinyl)poly(1,4-phenylene ether). Embodiment 5. The thermosetting composition of Embodiment 1 or 2, wherein the poly(1,4-phenylene ether) component is a bis(allyl)poly(1,4-phenylene ether) component, that is, having at least 75 wt%, for example, at least 90 wt%, of bis(allyl)poly(1,4-phenylene ether). Embodiment 6. The thermosetting composition of Embodiment 1 or 2, wherein the poly(1,4-phenylene ether) component is a bis(metharyl)poly(1,4-phenylene ether) component, that is, having at least 75 wt%, for example, at least 90 wt%, of bis(metharyl)poly(1,4-phenylene ether). Embodiment 7. The poly(1,4-phenylene ether) component is of the formula [ka] The formula has a bond, where A is -CH2-, CH(CH3)-, -C(CH3)2-, -O-, -C(O)-, S(O) or S(O)2, and R 1 Each is independently methacrylate, acrylate, vinyl, allyl, or methallyl, and R 2 Each is independently methyl or hydrogen, and R 3 A thermosetting composition according to any one of Embodiments 1 to 6, wherein each is independently methyl or hydrogen. Embodiment 8. The thermosetting composition of Embodiment 7, wherein A is -CH2-, CH(CH3)-, or -C(CH3)2-. Embodiment 9. The thermosetting composition of Embodiment 7, wherein A is -C(CH3)2-. Embodiment 10. The above [ka] In at least 75% of the area (e.g., at least 90% or at least 98%), two R 2 It is methyl and has two R 2 A thermosetting composition according to any one of embodiments 7 to 9, wherein is H. Embodiment 11. The above [ka] In at least 75% of the area (e.g., at least 90% or at least 98%), two R 2 It is methyl-substituted at the meta position, and two R 2 A thermosetting composition according to any one of embodiments 7 to 9, wherein is H. Embodiment 12. The above [ka] In at least 75% of the area (e.g., at least 90% or at least 98%), two R 2 It is methyl-substituted at the meta position distal to site A, and two R 2 A thermosetting composition according to any one of embodiments 7 to 9, wherein is H. Embodiment 13. The above [ka] In at least 75% of the area (e.g., at least 90% or at least 98%), two R 3 It is methyl and has two R 3 A thermosetting composition according to any one of embodiments 7 to 12, wherein is H. Embodiment 14. The above [ka] In at least 75% of the area, two R 3 It is methyl-substituted at the meta position, and two R 3 A thermosetting composition according to any one of embodiments 7 to 13, wherein is H. Embodiment 15. The above [ka] In at least 75% of the area, two R 3It is methyl-substituted at the meta position distal to site A, and two R 3 A thermosetting composition according to any one of embodiments 7 to 14, wherein is H. Embodiment 16. The R 1 A thermosetting composition according to any one of embodiments 7 to 15, wherein at least 75%, for example, at least 90%, or at least 95% is methacrylate. Embodiment 17. The R 1 A thermosetting composition according to any one of embodiments 4 to 15, wherein at least 75%, for example, at least 90%, or at least 95% is vinyl. Embodiment 18. The R 1 A thermosetting composition according to any one of embodiments 4 to 15, wherein at least 75%, for example, at least 90%, or at least 95% is allyl. Embodiment 19. The R 1 A thermosetting composition of any of Embodiments 4 to 15, wherein at least 75%, for example, at least 90%, or at least 95% is metharyl. Embodiment 20. The R 1 A thermosetting composition according to any one of Embodiments 4 to 15, wherein at least 75%, for example, at least 90%, or at least 95% of the composition is methacrylate, vinyl, allyl, or methallyl. Embodiment 21. At least 75 wt%, for example, at least 90 wt% or at least 95 wt% of the poly(1,4-phenylene ether) component is of the formula [ka] A thermosetting composition having any one of embodiments 7 to 20. Embodiment 22. A thermosetting composition according to any of Embodiments 7 to 21, wherein the poly(1,4-phenylene ether) component has a numerical average value of the sum of x+y within the range of 3 to 30, for example, 3 to 25, or 3 to 20, or 3 to 15, or 5 to 30, or 5 to 25, or 5 to 20, or 5 to 15, or 7 to 30, or 7 to 25, or 7 to 20, or 7 to 15, or 10 to 30, or 10 to 25, or 10 to 20, or 10 to 15. Embodiment 23. A thermosetting composition according to any of Embodiments 1 to 22, wherein the poly(1,4-phenylene ether) component has a number average molecular weight in the range of 1000 g / mol to 4000 g / mol, for example, 1000 g / mol to 3500 g / mol or 1000 g / mol to 3000 g / mol or 1000 g / mol to 2500 g / mol or 1500 g / mol to 4000 g / mol or 1500 g / mol to 3500 g / mol or 1500 g / mol to 2500 g / mol. Embodiment 24. A thermosetting composition according to any one of Embodiments 1 to 23, wherein the poly(1,4-phenylene ether) component is present in an amount of 22 wt% to 35 wt%, for example, 22 wt% to 32 wt%, or 22 wt% to 30 wt%. Embodiment 25. A thermosetting composition according to any one of Embodiments 1 to 24, wherein the poly(1,4-phenylene ether) component is present in an amount of 25 wt% to 35 wt%, for example, 25 wt% to 32 wt%, or 25 wt% to 30 wt%. Embodiment 26. A thermosetting composition according to any one of Embodiments 1 to 25, wherein the aromatic crosslinking component includes (or is a cyanurate component). Embodiment 27. A thermosetting composition according to any one of Embodiments 1 to 26, wherein the aromatic crosslinking component is a cyanurate component which is triallyl cyanurate, triallyl isocyanurate, or a combination of triallyl cyanurate and triallyl isocyanurate. Embodiment 28. A thermosetting composition according to any one of Embodiments 1 to 27, wherein the aromatic crosslinking component contains (or is) triallyl cyanurate. Embodiment 29. A thermosetting composition according to any one of Embodiments 1 to 28, wherein the aromatic crosslinking component contains (or is) triallyl isocyanurate. Embodiment 30. A thermosetting composition according to any one of Embodiments 1 to 29, wherein the aromatic crosslinking component includes (or is a combination of) triallyl cyanurate and triallyl isocyanurate. Embodiment 31. A thermosetting composition according to any one of Embodiments 1 to 30, wherein the aromatic crosslinking component contains (or is) trimethyl isocyanurate. Embodiment 32. A thermosetting composition according to any one of Embodiments 1 to 30, wherein the aromatic crosslinking component contains (or is divinylbenzene). Embodiment 33. A thermosetting composition according to any one of Embodiments 1 to 30, wherein the aromatic crosslinking component comprises triallyl cyanurate, triallyl isocyanurate, trimethyl isocyanurate, divinylbenzene, or any combination thereof (or triallyl cyanurate, triallyl isocyanurate, trimethyl isocyanurate, divinylbenzene, or any combination thereof). Embodiment 34. A thermosetting composition according to any one of Embodiments 1 to 33, wherein the aromatic crosslinking component is present in an amount within the range of 2 wt% to 11 wt%, for example, 2 wt% to 9 wt%, or 2 wt% to 7 wt%. Embodiment 35. A thermosetting composition according to any one of Embodiments 1 to 33, wherein the aromatic crosslinking component is present in an amount within the range of 3 wt% to 15 wt%, for example, 3 wt% to 11 wt%, or 3 wt% to 9 wt%, or 3 wt% to 7 wt%. Embodiment 36. A thermosetting composition according to any of Embodiments 1 to 33, wherein the aromatic crosslinking component is present in an amount within the range of 4 wt% to 15 wt%, for example, 4 wt% to 11 wt%, or 4 wt% to 9 wt%, or 4 wt% to 7 wt%. Embodiment 37. The thermosetting composition according to any one of Embodiments 1 to 36, wherein the butadiene / styrene copolymer rubber component has a total content of at least 90 wt%, for example, at least 95 wt%, at least 97 wt%, at least 98 wt%, or at least 99 wt% of butadiene residues and styrene residues. Embodiment 38. A thermosetting composition according to any one of Embodiments 1 to 37, wherein the butadiene / styrene copolymer rubber component contains divinylbenzene residues in a range of up to 5 wt%, for example, 0.5 wt% to 5 wt%, or 0.5 wt% to 3 wt%, or 1 wt% to 5 wt%, or 1 wt% to 3 wt%. Embodiment 39. The butadiene / styrene copolymer rubber component is a thermosetting composition of any one of Embodiments 1 to 38, wherein butadiene and styrene are arranged substantially randomly. Embodiment 40. The butadiene / styrene copolymer rubber component is a thermosetting composition according to any one of Embodiments 1 to 39, wherein the number average molecular weight is in the range of 1500 g / mol to 7000 g / mol, for example, 1500 g / mol to 5000 g / mol, or 2500 g / mol to 7000 g / mol, or 2500 g / mol to 5000 g / mol. Embodiment 41. A thermosetting composition according to any one of Embodiments 1 to 40, wherein the butadiene residue of the butadiene / styrene copolymer rubber component has a mole fraction of 1,2-vinyl moiety in the range of 15 mol% to 80 mol%, for example, 15% to 70%, or 15% to 60%, or 20 mol% to 80 mol%, or 20 mol% to 70 mol%. Embodiment 42. A thermosetting composition according to any one of Embodiments 1 to 40, wherein the butadiene residue of the butadiene / styrene copolymer rubber component has a mole fraction of 25 mol% to 80 mol%, for example, 25% to 70%, or 25% to 60%, or 30 mol% to 80 mol%, or 30 mol% to 70 mol%. Embodiment 43. A thermosetting composition according to any one of Embodiments 1 to 40, wherein the butadiene residue of the butadiene / styrene copolymer rubber component has a mole fraction of 20 mol% to 60 mol%, for example, 20 mol% to 55 mol%, or 20 mol% to 50 mol%, or 20 mol% to 45 mol%, or 25 mol% to 60 mol%, or 25 mol% to 55 mol%, or 25 mol% to 50 mol%, or 25 mol% to 45 mol%, or 30 mol% to 60 mol%, or 30 mol% to 55 mol%, or 30 mol% to 50 mol%, or 30 mol% to 45 mol%, or 35 mol% to 60 mol%, or 35 mol% to 55 mol%, or 35 mol% to 50 mol%, or 35 mol% to 45 mol%, or 35 mol% to 50 mol%, or 35 mol% to 45 mol%, or 35 mol% to 45 mol%, or 35 mol% to 60 mol%, or 35 mol% to 55 mol%, or 35 mol% to 50 mol%, or 35 mol% to 4550 mol%, or 35 mol% to 45 mol%, or 35 mol% to 45 mol%, or 35 mol% to 45 mol%, or 35 mol% to 60 mol%, or 35 mol% to 55 mol%, or 35 mol% to 50 mol%, or Embodiment 44. The butadiene / styrene substantially random copolymer rubber component has styrene residues in the range of 15 wt% to 40 wt%, for example, 15 wt% to 35 wt% or 15 wt% to 30 wt%, according to any thermosetting composition of Embodiments 1 to 43. Embodiment 45. The butadiene / styrene copolymer rubber component is a thermosetting composition according to any one of Embodiments 1 to 43, having styrene residues in the range of 20 wt% to 40 wt%, for example, 20 wt% to 35 wt% or 20 wt% to 30 wt%. Embodiment 46. The butadiene / styrene copolymer rubber component is a thermosetting composition according to any one of Embodiments 1 to 43, having styrene residues in the range of 23 wt% to 40 wt%, for example, 23 wt% to 35 wt% or 23 wt% to 30 wt%. Embodiment 47. The thermosetting composition according to any one of Embodiments 1 to 46, wherein the butadiene / styrene copolymer rubber component comprises a first butadiene / styrene substantially random copolymer rubber auxiliary component having 17 wt% to 27 wt% of styrene residues and a mole fraction of 60 mol% to 80 mol% of the 1,2-vinyl moiety of the butadiene residues, and a second butadiene / styrene substantially random copolymer rubber auxiliary component having 20 wt% to 30 wt% of styrene residues and a mole fraction of 20 mol% to 40 mol% of the 1,2-vinyl moiety of the butadiene residues. Embodiment 48. The thermosetting composition of Embodiment 47, wherein the weight ratio of the first butadiene / styrene substantially random copolymer component and the second butadiene / styrene substantially random copolymer component is in the range of 1:1.2 to 1:2.3, for example, 1:1.5 to 1:2.3, or 1:1.2 to 1:2, or 1:1.5 to 1:2. Embodiment 49. A thermosetting composition according to any one of Embodiments 1 to 48, wherein the butadiene / styrene copolymer rubber component is present in an amount within the range of 5 wt% to 20 wt%, or 5 wt% to 18 wt%, or 5 wt% to 15 wt%. Embodiment 50. A thermosetting composition according to any one of Embodiments 1 to 48, wherein the butadiene / styrene copolymer rubber component is present in an amount within the range of 7 wt% to 25 wt%, for example, 7 wt% to 20 wt%, or 7 wt% to 18 wt%, or 7 wt% to 15 wt%. Embodiment 51. A thermosetting composition according to any one of Embodiments 1 to 48, wherein the butadiene / styrene substantially random copolymer rubber component is present in an amount within the range of 9 wt% to 25 wt%, for example, 9 wt% to 20 wt%, or 9 wt% to 18 wt%, or 9 wt% to 15 wt%. Embodiment 52. The d of the microparticle silica 50 A thermosetting composition according to any one of Embodiments 1 to 51, wherein the particle size is in the range of 0.5 microns or more and 10 microns or less, for example, 0.5 microns or more and 7 microns or less, or 0.5 microns or more and 5 microns or less, or 1 micron or more and 10 microns or less, or 1 micron or more and 7 microns or less, or 1 micron or more and 5 microns or less. Embodiment 53. The d of the microparticle silica 90 A thermosetting composition according to any of Embodiments 1 to 52, wherein the particle size is in the range of 1 micron to 20 microns, for example, 1 micron to 14 microns, or 1 micron to 8 microns, or 3 microns to 20 microns, or 3 microns to 14 microns, or 3 microns to 8 microns. Embodiment 54. The d of the microparticle silica 10 A thermosetting composition according to any of Embodiments 1 to 53, wherein the particle size is in the range of 0.1 microns or more and 5 microns or less, for example, 0.1 microns or more and 3 microns or less, or 0.1 microns or more and 2 microns or less, or 0.5 microns or more and 5 microns or less, or 0.5 microns or more and 3 microns or less, or 0.5 microns or more and 2 microns or less. Embodiment 55. A thermosetting composition according to any one of Embodiments 1 to 54, wherein the microparticle silica is substantially spherical. Embodiment 56. A thermosetting composition according to any one of Embodiments 1 to 55, wherein the microparticle silica has at least 99 wt% SiO2, for example, at least 99.5 wt% SiO2. Embodiment 57. A thermosetting composition according to any one of Embodiments 1 to 56, wherein the microparticle silica is present in an amount within the range of 15 wt% to 45 wt%, or 15 wt% to 40 wt%, or 15 wt% to 35 wt%. Embodiment 58. A thermosetting composition according to any one of Embodiments 1 to 57, wherein the microparticle silica is present in an amount within the range of 20 wt% to 50 wt%, for example, 20 wt% to 45 wt%, or 20 wt% to 40 wt%, or 20 wt% to 35 wt%. Embodiment 59. A thermosetting composition according to any one of Embodiments 1 to 58, wherein the microparticle silica is present in an amount within the range of 25 wt% to 50 wt%, for example, 25 wt% to 45 wt%, or 25 wt% to 40 wt%, or 25 wt% to 35 wt%. Embodiment 60. A thermosetting composition according to any one of Embodiments 1 to 59, wherein the halogen-free flame retardant component is a flame retardant described in any of U.S. Patents 8,536,256, 9,012,546, 9,522,927 and 9,562,063. Embodiment 61. The organic halogen-free flame retardant component includes 6H-dibenz[c,e][1,2]oxaphosphorine,6,6'-(1,4-ethanediyl)bis-,6,6'-dioxide, 6H-dibenz[c,e][1,2]oxaphosphorine,6,6'-(1,4-butanediyl)bis-,6,6'-dioxide, or 6H-dibenz[c,e][1,2]oxaphosphorine,6,6'-(p-xylenediyl)bis-,6,6'-dioxide, or any combination thereof. A thermosetting composition according to any of Embodiments 1 to 59, which is either 6H-dibenz[c,e][1,2]oxaphosphorine,6,6'-(1,4-ethanediyl)bis-,6,6'-dioxide, 6H-dibenz[c,e][1,2]oxaphosphorine,6,6'-(1,4-butanediyl)bis-,6,6'-dioxide, or 6H-dibenz[c,e][1,2]oxaphosphorine,6,6'-(p-xylenediyl)bis-,6,6'-dioxide, or any combination thereof. Embodiment 62. The organic halogen-free flame retardant component contains 6H-dibenz[c,e][1,2]oxaphosphorin, 6,6'-(1,4-ethanediyl)bis-, 6,6'-dioxide (or is 6H-dibenz[c,e][1,2]oxaphosphorin, 6,6'-(1,4-ethanediyl)bis-, 6,6'-dioxide), and is a thermosetting composition according to any one of Embodiments 1 to 59. Embodiment 63. The organic halogen-free flame retardant component contains a compound having a structure with the following structure (or is a compound having a structure with the following structure), and is a thermosetting composition according to any one of Embodiments 1 to 59. [Chemical formula] Embodiment 64. The organic halogen-free flame retardant component contains a high melting point isomer of Formula IIa [Chemical formula] and a low melting point isomer of Formula IIb and IIc represented by the following formula [Chemical formula] The composition contains (or is a composition containing a high melting point isomer of Formula IIa and low melting point isomers of Formula IIb and IIc). The isomer ratio of the composition using the 31P NMR method exceeds about 0.5, and the isomer ratio = A h / (A h + A l ), where A h represents the area of the high melting point isomer peak, and A l represents the area of the low melting point isomer peak, and is a thermosetting composition according to any one of Embodiments 1 to 59. Embodiment 65. The organic halogen-free flame retardant component is present in an amount of 15 wt% or more and 30 wt% or less, for example, 15 wt% or more and 25 wt% or less, and is a thermosetting composition according to any one of Embodiments 1 to 64. Embodiment 66. A thermosetting composition according to any one of Embodiments 1 to 64, wherein the organic halogen-free flame retardant component is present in an amount of 20 wt% to 35 wt%, for example, 20 wt% to 30 wt%, or 20 wt% to 25 wt%. Embodiment 67. A thermosetting composition according to any one of Embodiments 1 to 64, wherein the organic halogen-free flame retardant component is present in an amount of 25 wt% to 35 wt%, for example, 25 wt% to 30 wt%. Embodiment 68. The thermal free radical initiator component is benzoyl peroxide, dicumyl peroxide, methyl ethyl ketone peroxide, lauryl peroxide, cyclohexanone peroxide, t-butyl hydroperoxide, t-butylbenzene hydroperoxide, acetylisobutyryl peroxide, diacetyl peroxide, t-butyl peroctoate, α,α'-bis(t-butylperoxy-m-isopropyl)benzene, 2,3-dimethyl-2,3-diphenylbutane, di(trimethylsilyl)peroxide, ,5-dimethyl-2,5-di(benzoylperoxy)hexane, 2,5-dimethylhexane-2,5-dihydroperoxide, 2,5-dimethyl-2,5-di(t-butylperoxy)-hexy-3-yine, di-t-butylperoxide, t A thermosetting composition according to any one of Embodiments 1 to 67, comprising one or more of the following: butylcumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, t-butylperoxybenzoate, 2,2-bis(t-butylperoxy)butane, 2,2-bis(t-butylperoxy)octane, 2-trimethylsilylphenyltriphenylsilyl peroxide, 2,3-trimethylsilyloxy-2,3-diphenylbutane, di(t-butylperoxy)isophthalate, azobisisobutyronitrile (AIBN), azobis(2-isopropyl)butyronitrile, 2,2'-azobis(2,4-dimethyl)valeronitrile (AVBN), (2,4-dichlorobenzoyl) peroxide, (2-dimethylbenzoyl) peroxide, and dodecanoyl peroxide. Embodiment 69. A thermosetting composition according to any one of Embodiments 1 to 68, wherein the thermal free radical initiator component is present in an amount within the range of 0.05 wt% to 4 wt%, for example, 0.05 wt% to 2 wt%, or 0.05 wt% to 1 wt%, or 0.05 wt% to 0.7 wt%. Embodiment 70. A thermosetting composition according to any one of Embodiments 1 to 68, wherein the thermal free radical initiator component is present in an amount within the range of 0.07 wt% to 4 wt%, for example, 0.07 wt% to 2 wt%, or 0.07 wt% to 1 wt%, or 0.07 wt% to 0.7 wt%. Embodiment 71. A thermosetting composition according to any one of Embodiments 1 to 68, wherein the thermal free radical initiator component is present in an amount within the range of 0.1 wt% to 4 wt%, for example, 0.1 wt% to 2 wt%, or 0.1 wt% to 1 wt%, or 0.1 wt% to 0.7 wt%. Embodiment 72. A thermosetting composition according to any one of Embodiments 1 to 68, wherein the thermal free radical initiator component is present in an amount within the range of 0.2 wt% to 4 wt%, for example, 0.2 wt% to 2 wt%, or 0.2 wt% to 1 wt%, or 0.2 wt% to 0.7 wt%. Embodiment 73. A thermosetting composition according to any of Embodiments 1 to 72, further comprising the silane coupling agent in an amount of, for example, up to 5 wt%. Embodiment 74. A thermosetting composition according to any one of Embodiments 1 to 73, wherein the silane coupling agent is present in an amount of 0.01 wt% or less. Embodiment 75. A thermosetting composition according to any of Embodiments 1 to 74, provided in a substantially non-volatile form, i.e., without using a substantial amount of solvent. Embodiment 76. A thermosetting composition according to any of Embodiments 1 to 74, comprising 10 wt% or less, for example, 5 wt% or less, 3 wt% or less, or 1 wt% or less, of a material whose boiling point at atmospheric pressure is less than 200°C when calculated assuming all non-volatile components are 100 wt%. Embodiment 77. A thermosetting composition according to any one of Embodiments 1 to 74, further comprising a solvent having a boiling point of less than 200°C at atmospheric pressure. Embodiment 78. The thermosetting composition of Embodiment 77, wherein the solvent is one or more of γ-butyrolactone, cyclohexanone, butanone, methyl isobutyl ketone, N,N-dimethylformamide, propylene glycol monomethyl ether, N,N-dimethylacetamide, ethylene glycol monomethyl ether, methoxyethyl acetate, ethoxyethyl acetate, propoxyethyl acetate, diisobutyl ketone (DIBK), N-methyl-pyrrolidone, xylene, ethyl acetate, toluene, trichloroethane, dibutyl ether, methyl ethyl ketone, and acetone. Embodiment 79. The thermosetting composition of Embodiment 77 or 78, wherein the amount of the solvent is in the range of 20 wt% to 60 wt% and exceeds the non-volatile component of the thermosetting composition (i.e., 100 wt% in total). Embodiment 80. A cured product of any of the thermosetting compositions of Embodiments 1 to 79. Embodiment 81. A method for curing a thermosetting composition according to any one of Embodiments 1 to 79, comprising heating the thermosetting composition at a temperature of 150°C or higher and 250°C or lower. Embodiment 82. A prepreg comprising a mesh substrate at least partially embedded in the cured product of Embodiment 80 or a cured product produced by the method of Embodiment 81. Embodiment 83. The prepreg of Embodiment 82, wherein the cured product is a partially cured product. Embodiment 84. The prepreg of Embodiment 82 or 83, wherein the mesh substrate is a fabric (woven or nonwoven). Embodiment 85. The prepreg of Embodiment 84, in which the fabric is made from glass fibers, for example, as a borosilicate glass fabric. Embodiment 86. The prepreg of Embodiment 82 or 83, wherein the mesh substrate is an electronic grade E-glass fabric, NE-glass fabric, D-glass fabric, or S-glass fabric. Embodiment 87. A prepreg according to any of Embodiments 82 to 86, wherein the thickness is in the range of 10 microns to 300 microns, for example, 10 microns to 200 microns, or 10 microns to 150 microns, or 10 microns to 100 microns. Embodiment 88. A prepreg according to any of Embodiments 82 to 86, wherein the thickness is in the range of 25 microns or more and 300 microns or less, for example, 25 microns or more and 200 microns or less, or 25 microns or more and 150 microns or less, or 25 microns or more and 100 microns or less. Embodiment 89. A prepreg according to any of Embodiments 82 to 86, wherein the thickness is in the range of 50 microns or more and 300 microns or less, for example, 50 microns or more and 200 microns or less, or 50 microns or more and 150 microns or less. Embodiment 90. A prepreg of any of Embodiments 82 to 89, comprising at least 30 wt%, for example, at least 50 wt%, of the cured product of the present disclosure. Embodiment 91. A laminate formed by stacking multiple prepregs according to any of Embodiments 82 to 89. Embodiment 92. The laminate of Embodiment 91, wherein the cured prepreg in the laminate is substantially completely cured. Embodiment 93. The laminate of Embodiment 91 or 92, for example, further comprising one or more metal layers on one or more opposing main surfaces of the laminate. Embodiment 94. The laminate of Embodiment 93, wherein the one or more metal layers are copper layers. Embodiment 95. The laminate of Embodiment 94, wherein the one or more copper layers have a thickness in the range of 15 microns to 50 microns, for example, a thickness in the range of 17 microns to 37 microns. Embodiment 96. The laminate of Embodiment 94 or 95, wherein each of the one or more copper layers has an outer surface that does not face the laminated prepreg and has one or more surface roughnesses in the range of 0.3 microns or less Ra (contact measurement, ISO 4287) and / or 0.1 microns or more and 0.3 microns or less, for example, 0.15 microns or more and 0.25 microns or less Sa (non-contact measurement, ISO 25178). Embodiment 97. A laminate according to any one of Embodiments 94 to 96, wherein each of the one or more copper layers has an inner surface that is in contact with one of the prepregs having one or more surface roughnesses in the range of 0.1 microns to 0.4 microns (e.g., 0.12 microns to 0.3 microns), a surface roughness in the range of 1 micron to 5 microns (e.g., 1.2 microns to 4 microns), and / or a surface roughness in the range of 0.5 microns to 3 microns (e.g., 0.7 microns to 2 microns) (all measured non-contact, ISO 25178). Embodiment 98. A laminate according to any of Embodiments 93 to 97, wherein the peel strength measured according to IPC-TM-650 2.4.8 is at least 2.5 lb / in (for example, within the range of 2.5 lb / in to 5 lb / in, or 2.5 lb / in to 4.5 lb / in, or 2.5 lb / in to 4 lb / in, or 3 lb / in to 5 lb / in, or 3 lb / in to 4.5 lb / in, or 3 lb / in to 4 lb / in). Embodiment 99. A laminate of any of Embodiments 93 to 98, wherein the Df value measured according to IPC-TM-650 2.5.5.5 is in the range of 0.0015 to 0.003, for example, 0.0015 to 0.0025. Embodiment 100. A laminate according to any of Embodiments 93 to 99, wherein the Tg measured by DSC is in the range of 180°C to 240°C, for example, 180°C to 230°C, or 180°C to 220°C, or 190°C to 240°C, or 190°C to 230°C, or 190°C to 220°C.

Claims

1. The product contains a poly(1,4-phenylene ether) component having a phenylene ether content of at least 80% in an amount within the range of 20 wt% to 35 wt%, wherein the poly(1,4-phenylene ether) component is a poly(1,4-phenylene ether)bis(meth)acrylate component, a bis(vinyl)poly(1,4-phenylene ether) component, or a bis((meth)allyl)poly(1,4-phenylene ether) component, or a combination of two or more thereof. It contains an aromatic crosslinking component having a crosslinkable vinyl group, (meth)allyl group and / or (meth)acrylate group, with a weight-average molecular weight of 700 g / mol or less and an average number per molecule in the range of 1.75 to 3.5, in an amount of 2 wt% to 15 wt%, It contains a butadiene / styrene copolymer rubber component in an amount of 5 wt% to 25 wt%, It contains microparticle silica in an amount ranging from 15 wt% to 50 wt%, It contains an organic halogen-free flame retardant component in an amount of 15 wt% to 35 wt%, and a thermal free radical initiator component in an amount of 0.1 wt% to 3 wt%. Thermosetting composition.

2. The thermosetting composition according to claim 1, wherein the mass of the (optionally substituted phenylene) group in the -O-(optionally substituted phenylene) content of the poly(1,4-phenylene ether) component is composed of at least 50% phenyl carbon and phenyl hydrogen.

3. The thermosetting composition according to claim 1 or 2, wherein the poly(1,4-phenylene ether)bis(meth)acrylate component is a poly(1,4-phenylene ether)bismethacrylate component, that is, having at least 75 wt%, for example, at least 90 wt%, of poly(1,4-phenylene ether)bismethacrylate.

4. The aforementioned poly(1,4-phenylene ether) component is, 【Chemistry 1】 It has a compound, in which A is a bond, -CH ２ -, CH (CH ３ )-,-C(CH ３ ) ２ -, -O-, -C(O)-, S(O) or S(O) ２ And R １ Each of these is independently methacrylate, acrylate, vinyl, allyl, or methallyl, and R ２ Each is independently methyl or hydrogen, and R ３ The thermosetting composition according to any one of claims 1 to 3, wherein each is independently methyl or hydrogen.

5. At least 75 wt%, for example, at least 90 wt% or at least 95 wt% of the poly(1,4-phenylene ether) component is, 【Chemistry 2】 A thermosetting composition according to claim 4, having the following characteristics.

6. The thermosetting composition according to any one of claims 1 to 5, wherein the poly(1,4-phenylene ether) component is present in an amount of 25 wt% or more and 35 wt% or less.

7. The thermosetting composition according to any one of claims 1 to 6, wherein the aromatic crosslinking component is a cyanurate component which is triallyl cyanurate, triallyl isocyanurate, or a combination of triallyl cyanurate and triallyl isocyanurate.

8. The thermosetting composition according to any one of claims 1 to 6, wherein the aromatic crosslinking component comprises (or is) triallyl cyanurate.

9. The thermosetting composition according to any one of claims 1 to 8, wherein the aromatic crosslinking component is present in an amount within the range of 4 wt% to 15 wt%, for example, 4 wt% to 11 wt%, or 4 wt% to 9 wt%, or 4 wt% to 7 wt%.

10. The thermosetting composition according to any one of claims 1 to 9, wherein the butadiene / styrene copolymer rubber component has a total content of at least 95 wt% of butadiene residues and styrene residues.

11. The thermosetting composition according to any one of claims 1 to 10, wherein the butadiene / styrene copolymer rubber component has butadiene and styrene arranged substantially randomly.

12. The thermosetting composition according to any one of claims 1 to 11, wherein the butadiene / styrene copolymer rubber component has a number average molecular weight in the range of 1500 g / mol or more and 7000 g / mol or less.

13. The thermosetting composition according to any one of claims 1 to 12, wherein the butadiene residue of the butadiene / styrene copolymer rubber component has a mole fraction of 1,2-vinyl moiety in the range of 15 mol% to 80 mol%.

14. The thermosetting composition according to any one of claims 1 to 12, wherein the butadiene residue of the butadiene / styrene copolymer rubber component has a mole fraction of 30 mol% or more and 60 mol% or less of the 1,2-vinyl moiety.

15. The thermosetting composition according to any one of claims 1 to 13, wherein the butadiene / styrene copolymer rubber component has styrene residues in the range of 23 wt% to 40 wt%.

16. The thermosetting composition according to any one of claims 1 to 15, wherein the butadiene / styrene copolymer rubber component is composed of a first butadiene / styrene substantially random copolymer rubber auxiliary component having 17 wt% to 27 wt% of styrene residues and a mole fraction of 1,2-vinyl moieties of butadiene residues of 60 mol% to 80 mol%, and a second butadiene / styrene substantially random copolymer rubber auxiliary component having 20 wt% to 30 wt% of styrene residues and a mole fraction of 1,2-vinyl moieties of butadiene residues of 20 mol% to 40 mol%, and the weight ratio of the first butadiene / styrene substantially random copolymer auxiliary component and the second butadiene / styrene substantially random copolymer auxiliary component is in the range of 1:1.2 to 1:2.

3.

17. The thermosetting composition according to any one of claims 1 to 16, wherein the butadiene / styrene copolymer rubber component is present in an amount within the range of 9 wt% to 25 wt%.

18. The d of the micro-particle silica １０ The thermosetting composition according to any one of claims 1 to 17, wherein the particle diameter is in the range of 0.1 micron or more and 5 microns or less.

19. The thermosetting composition according to any one of claims 1 to 18, wherein the microparticle silica is substantially spherical.

20. The thermosetting composition according to any one of claims 1 to 19, wherein the microparticle silica is present in an amount within the range of 20 wt% to 45 wt%.

21. The thermosetting composition according to any one of claims 1 to 20, wherein the organic halogen-free flame retardant component comprises a compound having the following structure (or is a compound having the following structure). 【Transformation 3】

22. The thermosetting composition according to any one of claims 1 to 21, wherein the organic halogen-free flame retardant component is present in an amount of 20 wt% or more and 35 wt% or less.

23. The aforementioned thermal free radical initiator components are benzoyl peroxide, dicumyl peroxide, methyl ethyl ketone peroxide, lauryl peroxide, cyclohexanone peroxide, t-butyl hydroperoxide, t-butylbenzene hydroperoxide, acetylisobutyryl peroxide, diacetyl peroxide, t-butyl peroctoate, α,α'-bis(t-butylperoxy-m-isopropyl)benzene, 2,3-dimethyl-2,3-diphenylbutane, di(trimethylsilyl) peroxide, ,5-dimethyl-2,5-di(benzoylperoxy)hexane, 2,5-dimethylhexane-2,5-dihydroperoxide, 2,5-dimethyl-2,5-di(t-butylperoxy)-hexy-3-yine, di-t-butyl peroxide, t-butyl A thermosetting composition according to any one of claims 1 to 22, comprising one or more of the following: milperoxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, t-butylperoxybenzoate, 2,2-bis(t-butylperoxy)butane, 2,2-bis(t-butylperoxy)octane, 2-trimethylsilylphenyltriphenylsilylperoxide, 2,3-trimethylsilyloxy-2,3-diphenylbutane, di(t-butylperoxy)isophthalate, azobisisobutyronitrile (AIBN), azobis(2-isopropyl)butyronitrile, 2,2'-azobis(2,4-dimethyl)valeronitrile (AVBN), (2,4-dichlorobenzoyl)peroxide, (2-dimethylbenzoyl)peroxide, and dodecanoylperoxide.

24. The thermosetting composition according to any one of claims 1 to 23, wherein the thermal free radical initiator component is present in an amount within the range of 0.2 wt% to 2 wt%.

25. A cured product of a thermosetting composition according to any one of claims 1 to 24.

26. A method for curing a thermosetting composition according to any one of claims 1 to 24, comprising heating the thermosetting composition at a temperature of 150°C or higher and 250°C or lower.

27. A prepreg comprising a mesh substrate at least partially embedded in a cured product according to claim 25 or a cured product produced by the method described in claim 26.

28. A laminate comprising a plurality of prepregs according to claim 27.

29. The peel strength measured according to IPC-TM-650 2.4.8 is at least 2.5 lb / in, The Df value measured according to IPC-TM-650 2.5.5.5 is in the range of 0.0015 to 0.

003. and The laminate according to claim 28, wherein the Tg measured by DSC is in the range of 180°C to 240°C.

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