Process for IPC coating

Abstract

The printhead, components, or other parts of an inkjet printer include an internal cavity with a protective coating. Multiple other surfaces of the component may also be coated. To form the protective coating, a target thickness of HfO2 (hafnia) film is selected to prevent the formation of pinholes, thin film areas, and nodule growth. Using atomic layer deposition (ALD) with a process adjusted to the target thickness, the HfO2 film is deposited as a conformal layer on the component, including the surface of the internal cavity, to form the coated component. The HfO2 film may include a non-wettable coating.

Description

Technical Field

[0001]

[0001] Printer inks used in inkjet printers can be acidic or alkaline or strong solvents, which can cause cumulative damage and may limit the operating life of the print head and other components of these devices. The print head itself often has multiple components, including an integrated circuit die, a microelectromechanical system (MEMS) die, a piezoelectric transducer, an internal chamber for ink, a print head mount having nozzles, etc. These various components are made of various structural materials (e.g., processed integrated circuit dies, processed microelectromechanical dies, plastics, metals) as well as assembly materials (e.g., joining materials (e.g., solder, glue, adhesive, epoxy), fasteners), and these materials each impose constraints on what can be done to protect the components from degradation due to exposure to printer ink and perhaps other acidic or alkaline or strong solvents (e.g., during manufacturing, cleaning, or repair). For example, solvent inks can potentially have an adverse effect on epoxy interfaces or the epoxy / adhesives themselves. Therefore, protection and improvement of the operating life in print heads and other components of inkjet printers are continuously sought in this technical field, and this improvement may also benefit further components of other devices.

Summary of the Invention

[0002]

[0002] Processes and methods for manufacturing articles or materials having a protective coating are disclosed. In some embodiments, a method for manufacturing a material for an article comprises providing a component of an apparatus having at least one internal cavity accessible for processing and being exposed to acidic liquids, alkaline liquids or other liquids that chemically corrode the component during use of the apparatus; selecting a target thickness of an HfO2 film to prevent the formation of pinholes, thin films and nodule growth; and forming a coated component by depositing an HfO2 film as a conformal layer in contact with the component, including the surface of at least one internal cavity, using atomic layer deposition (ALD) with a process adjusted to the target thickness, wherein the material has the deposited HfO2 film as a protective coating.

[0003]

[0003] Other aspects and advantages of the embodiments will become apparent from the following detailed description in conjunction with the accompanying drawings illustrating the principles of the embodiments described.

[0004]

[0004] The embodiments described and their advantages will be best understood by referring to the following description in conjunction with the accompanying drawings. These drawings do not limit in any way any modifications of the embodiments described that can be made to the embodiments described by those skilled in the art without departing from the spirit and scope of the embodiments described. [Brief explanation of the drawing]

[0005] Figures 1A to 1E show components of an inkjet printer suitable for protective coating treatments and materials described in various embodiments of this specification. [Figure 1A] This shows the head mount, a component of the print head. [Figure 1B] The components of a print head are shown as a MEMS die mounted on a carrier and multiple ICs mounted on that MEMS die. [Figure 1C]Figures 1A and 1B show a print head, which is constructed by an assembly of multiple components, as a component of an inkjet printer. [Figure 1D] This shows a cross-sectional view of an example printhead, which consists of multiple layers defining the internal cavity and nozzle. [Figure 1E] A cross-sectional view of yet another example of a printhead, consisting of multiple layers defining the internal cavity and nozzle, is shown. [Figure 2A] This shows an HfO2 coating provided in contact with a component in one embodiment. [Figure 2B] This shows a non-wettable coating on an HfO2 coating provided in contact with a component in one embodiment. [Figure 2C] Figures 3A to 3D show cross-sectional views of various components having an HfO2 coating provided in contact with the component, including a coating on the internal cavity, in multiple embodiments. [Figure 3A] The diagram shows a cross-sectional view of the main body, which has an internal cavity exposed through a processing passage and a conformal coating of HfO2. [Figure 3B] The diagram shows a cross-sectional view of a body having an internal cavity (e.g., a passage exposed for processing) and a conformal coating of HfO2. [Figure 3C] The diagram shows a cross-sectional view of a body constructed by assembling two bodies together, having an internal cavity exposed for processing, and having a conformal coating of HfO2. [Figure 3D] Figures 4A to 4C show a cross-section of a body constructed by assembling two bodies together using an adhesive (glue) or other bonding material, the body having a conformal coating of HfO2. [Figure 4A] The image shows a body equipped with electrical contact pads having gold on another metal. [Figure 4B] Figure 4A shows a cross-sectional view of the embodiment, illustrating a conformal layer of HfO2 provided in contact with the surface of the main body, including the area above the electrical contact region, and a mask that defines the selective removal region. [Figure 4C] Figure 4A shows a cross-sectional view of the embodiment after further processing from the cross-sectional view in Figure 4B, indicating that a portion of the HfO2 in the electrical contact area has been selectively removed and a portion of the gold in contact with the electrical contact pad has been partially removed. [Figure 5] This diagram shows a flowchart of one embodiment of a method for producing a protective coating for a component, which can be carried out using the various embodiments described herein. [Figure 6] A flowchart shows one embodiment of a method for selectively removing a protective coating from a component having an electrical contact area, which can be carried out using one of the embodiments described herein. [Modes for carrying out the invention]

[0006]

[0025] This specification describes various embodiments of material processing, films, materials, coatings, components, and apparatus, more specifically, protective coatings and / or internal protective coatings for printheads of inkjet printers, as well as several variations, of which further other embodiments are understood. The embodiments disclosed herein demonstrate improvements to several technologies, including films, coatings, material processing, and inkjet printer technology. The embodiments disclosed herein present technical solutions to the technical challenge of how to protect, mitigate damage to, and improve the operational life of inkjet printer printheads and other components exposed to inkjet printer ink or other acidic or alkaline liquids. To convey to the reader various aspects, principles, advantages, and practical methods for manufacturing and using various embodiments, the following describes the research objectives, findings, and techniques, followed by a description of the drawings.

[0007]

[0026] The coatings described herein include advanced coatings—IPC (Internal Protective Coating) and NWC (Non-Wetting Coating). The following description includes the use and deposition of HfO2 (i.e., hafnia) coatings, at least one rationale for selecting such films, and alternative materials to HfO2, including ZrO2, TiO2, Ta2O5, SiCN, and various nitrides (further described below). Methods and applications of coating for higher-order assemblies (MEMS (Micro-Electro-Mechanical Systems) / IP (Inkjet Printheads) / HM) are described, but regarding the integration of NWC, both methods and applications are described, including the optimization of IPC for NWC adhesion, density, and robustness, and the optimization of NWC for inkjet applications. In some embodiments, the coatings are deposited using atomic layer deposition (ALD). In some other embodiments, other types of deposition methods are used (e.g., chemical vapor deposition (CVD) and plasma-enhanced (PE)-CVD).

[0008]

[0027] Inkjet printheads can be manufactured using known microfabrication techniques, allowing for the production of multiple high-precision and highly repeatable devices in large arrays. One of the best materials for forming such high-precision structures is silicon. Silicon has excellent mechanical properties and typically does not exhibit mechanical hysteresis at operating temperatures below 400°C. Silicon is highly resistant to corrosion from most acids. However, silicon can dissolve in solutions with a sufficiently high pH or in the presence of hydrofluoric acid (HF). While spraying HF is uncommon, alkaline inks are very common and, in themselves, often corrode the silicon structures that make up microfabricated printheads. For this reason, it is desirable to protect all surfaces that may be wetted by these inks from such chemical corrosion, especially from alkaline chemicals.

[0009]

[0028] An ideal passivation layer (IPC) has the following multiple characteristics. 1) High resistance to chemical (especially alkaline) corrosion. 2) Robustness against handling in standard wafer manufacturing processes. 3) It should be possible to form a thin film without significantly affecting precise dimensions or other performance criteria. 4) It should be possible to form a high-density film to prevent corrosion of silicon or other structural components. 5) It has high conformality, and joints or cracks do not become paths for corrosion of silicon or other structural components. 6) The growth rate is not overly sensitive to surface texture, and nodules / whiskers do not become weak points for subsequent mechanical damage or chemical corrosion. 7) It should be possible to achieve uniform coating in small and relatively inaccessible spaces. 8) It can be integrated with microfabrication processes - all wetted surfaces can be coated at the end of the manufacturing process, or it can be coated in contact with each layer of a printable head structure that may get wet. [[ID=】]9) When implemented at the end of the manufacturing flow, it should be possible to form a film at a sufficiently low temperature so as not to adversely affect sensitive layers such as actuators, interconnections, or non-silicon structural layers. These non-silicon materials include, but are not limited to, metals, organics, or ceramics. 10) It should be compatible with additional layer functions such as non-wetting coatings, whether endogenous or exogenous. 11) It should be selectively removable to accommodate other processes (electrical interconnection, singulation, etching). 12) It does not react excessively with other constituent materials in the structure. 13) It should be possible to adhere other necessary materials, including non-wetting coatings, primers, or others.

[0010]

[0029] Atomic layer deposition (ALD) and similar related techniques are a series of deposition techniques that exhibit many of the desirable properties as described above. These techniques can be used to deposit several ceramic materials with excellent chemical resistance into thin, high-density, and highly conformal layers, and can be carried out at temperatures compatible with the materials used in piezoelectric inkjet. Considering that there are many materials to be considered, it is desirable to select the most excellent materials from among these materials. Ceramic experts have investigated to understand which materials have high resistance to chemical corrosion.

[0011]

[0030] For example, in "Corrosion Prevention Technology" written by Katsutoshi Yoneya and Katsutoshi Nishida, 35,646 - 655 (1986) [Japanese], while showing multiple elements from the periodic table, a graph of the cation radius versus the cation charge is divided into the following three regions. I. Prone to react with acids II. React or do not react with acids and alkalis III. Prone to react with alkalis

[0012]

[0031] “Hot corrosion of Al2O3and SiC ceramics by KCl‐NaCl molten salt”, Takaaki NAGAOKA, 3 Ken‘ichiro KITA and Naoki KONDO, technical report in Journal of the Ceramic Society of Japan 123 [8] 685‐689 2015” discusses the high-temperature corrosion test of alumina and silicon carbide ceramics.

[0013]

[0032] In the research related to the embodiments of the present application, it has been found that ZrO2, TiO2, and Ta2O5 are candidates as materials that have higher alkali resistance than SiO2 and can be deposited in thin layers. HfO2 having an ionic radius of 0.83 Å and an ionic charge of +4 is also an excellent candidate as a film formed by ALD.

[0014]

[0033] There are many possible flows, and one embodiment of the processing flow (including multiple variations) includes the following wafer structure. 1) An internal cavity / piping that allows for the inflow and outflow of ink or other functional fluids, at least one actuator, and electrical and fluid connection means (for example, referred to here as an inkjet wafer). 2) IPC film deposition - selective or non-selective 3) The IPC may be a single material layer, or it may be a multilayer / multicomponent laminate of the same or different materials. 4) Means for selectively removing IPCs - regardless of whether or not they are selectable to the patterning layer or substrate, by masking or removal. 5) Surfaces suitable for additional coating or functional modification. That is, any of the following: 6) Surfaces specific to the film during deposition 7) Externally modified surface to allow for additional coating 8) A surface compatible with an additional intermediate coating (primer) that allows for the deposition of at least one additional functional layer.

[0015]

[0034] In studies of several embodiments disclosed herein, the following candidate oxide films were evaluated. 1) SiO2 has some resistance to alkalis, although it is not very strong. 2) SiOC has some resistance to alkalis, although it is not very strong. 3) ITO (Indium Tin Oxide) - No conclusion reached. 4) Al2O3 has low resistance to alkalis without high-temperature annealing. 5) Excellent resistance to ZrO2-alkali 6) HfO2 - Among the films studied, this film showed the highest resistance to alkali. 7) TiO2 has some resistance to alkalis, although it is not very strong. 8) Ta2O5 has good resistance to alkalis. 9) High resistance to Y2O3-fluorine plasma and other highly reactive chemicals.

[0016]

[0035] Nitride films are also promising candidates that are likely to require plasma-assisted deposition. These films include, but are not limited to, the following: 1) SiCN - has excellent alkali resistance, but is currently deposited at undesirable high temperatures. 2) TiN - It is an excellent wear-resistant coating and also possesses conductivity, making it effective in preventing unwanted static electricity discharge. 3) TiCN - A coating with enhanced wear resistance.

[0017]

[0036] One embodiment (including variations) has the following characteristics: I. A nearly completed wafer containing multiple printhead dies, each having multiple arrays of injection structures. II. An opening that allows reactive material to enter an internal space that will eventually come into contact with the ink in order to form a protective coating. This protective coating may also be provided in contact with multiple external surfaces in various embodiments. III. Deposition an IPC (e.g., a single-component multilayer stack of HfO2 coating) to achieve a coating thickness in the range of 10 to 50 nm. IV. Processing to form a priming layer (e.g., modified deposition conditions for the outermost layer, post-plasma treatment, or ultrathin coating of an additional layer) enables subsequent functionalization (e.g., by silanization). V. The system includes an option to selectively remove the HfO2 layer to expose electrical interconnections or other structures by physical, chemical, or other means. Such a process may involve the use of a physical mask.

[0018]

[0037] The following describes higher-order assemblies. The microfabricated silicon structures described above typically do not possess all the necessary functions for creating a printhead. Therefore, it is common to combine microfabricated inkjet wafers with other microfabricated wafer layers that may include other functions such as ink distribution, temperature measurement / control, and fluid and electrical interfaces. These inkjet layers and other functional layers can be bonded to each other by various means, including bonding with metals (e.g., solder) or organic adhesion / structural materials (e.g., glue, adhesive, epoxy, etc.). These materials may be susceptible to corrosion from inks and other functional fluids. Therefore, it is desirable to have an IPC coating that can be applied after bonding the various layers. Furthermore, it is desirable that the IPC coating be generally compatible with these additional materials. For example, 1) The IPC coating bonds to the adhesive layer / structural layer, preventing this layer from being corrosive by corrosive fluids. 2) The IPC coating is processed at a temperature suitable for such an adhesive layer / structural layer. 3) The IPC coating must have sufficient elasticity to prevent damage due to differences in thermal expansion between the constituent layers. 4) The IPC coating must be able to prevent the penetration of liquids or vapors into the substrate in order to prevent expansion, corrosion, or other structural damage.

[0019]

[0038] The Additional Functional Layer (AFL) may include, in various embodiments: This is unique to films immediately after deposition. 1) In particular, modifying the deposition conditions towards the end of the deposition process can increase the density of desired terminal groups. In the case of HfO2, this involves modifying the mixture to include H2O and / or O3 in appropriate proportions to increase the density of the -OH terminal groups, which are the binding sites in NWC chemistry. Note that improving, and potentially optimizing, the growth rate can lead to the formation of a more defect-free or denser layer. Externally modified to allow for additional coating. 1) The film is subjected to additional processing after deposition to promote the formation of desired end groups. In the case of HfO2, this includes ion milling (generating reactive / dangling bonds by ion bombardment and then hydrating them), plasma treatment (converting O groups to -OH groups using H2O, H2 / Ar, or other gases), etc. 2) An additional intermediate coating (primer) that allows for the deposition of an additional functional layer. 3) Deposition of an additional layer with a high density of desired end groups. These layers should be thick enough to produce a sufficient end group density for increasing the reaction sites, but also thin enough not to be affected by lateral undercuts. If they are too thin, the result will be that the subsequent coating peels off from the surface "like opening a zipper". In the case of HfO2, the additional layer may be Al2O3, SiO2, or a similar hydration material having -OH ends which are the bonding sites for the NWC chemical reaction. In some embodiments, the additional layer also includes an abrasion-resistant coating (e.g., one or more nitrides).

[0020]

[0039] The following discusses the properties of polymers, including their impact on IPC and the overall process. Polymers tend to degrade more easily with heat than many other suitable materials, however, solder may be an exception, as it is intentionally designed with a low melting point. Also, in some embodiments, solder is excluded from the pre-IPC structure. Certain piezoelectric actuator materials (e.g., PZT) have been shown to degrade at temperatures above 280°C, especially in the presence of electric / magnetic fields. The temperature at which polymers degrade (e.g., shrinkage, expansion, sinking, reflow, embrittlement, or cracking) determines the upper limit temperature at which a subsequent IPC or NWC film is deposited in some embodiments. In one embodiment, SU-8 (EPON photocurable epoxy) is used for the MEMS die structure. The glass transition temperature of SU-8 is 230°C, but due to extensive crosslinking, the shape does not change significantly at this temperature. Above this temperature, especially approaching 270°C, greater shape changes and shrinkage occur, stressing multiple other layers and potentially causing performance / reliability problems. For these reasons, one ALD deposition technique is attractive because it can deposit high-quality materials at temperatures below 250°C, preferably below 230°C. In yet another embodiment, another process that can deposit films with high density, high uniformity, and high conformability at temperatures below these would be attractive. While ALD appears to be the only method that can achieve all objectives, other methods would also be worth investigating and / or developing. In other embodiments, different precursors are used to enable use at lower temperatures. In some additional embodiments, plasma support is used for one or more reactants. 1) In some embodiments, additional gold plating is included, the details of which are described below. One embodiment of the processing flow includes: a wafer structure having an internal cavity / piping that allows the inflow and outflow of ink or other functional fluid, at least one actuator, and electrical and fluid connection means (referred to here as the inkjet wafer). IPC deposition - may be selective or atypical. 2) IPC can be a single material layer, or a multilayer / multicomponent laminate of the same or different materials. 3) Treatment to selectively eliminate IPCs - Using masking or removal as a means, regardless of whether or not it is selective to the patterning layer or substrate. 4) A surface suitable for additional coating or functional modification. For example, either a surface inherent to the film during deposition or a surface externally modified to allow for additional coating. Such a surface is compatible with an additional intermediate coating (primer) that allows for the deposition of at least one additional functional layer.

[0021]

[0040] In some embodiments, for products having flexible circuits and / or external electrical connections established by one or more methods such as flexible substrates, wire bonding, and soldering, it is necessary to remove IPC from the electrical connection area of ​​the injection die. However, in some embodiments where the electrical connection is established via wire bonding, it may not be necessary to remove IPC because it may be bonded through a thin coating by mechanical impact. This is similar to bonding an Au wire bond to an Al bond pad with a thin AlO passivation layer. In some embodiments, this layer is often destroyed by scrubbing action at the joint by applying ultrasonic energy to the bond head. In some embodiments, one or both of two different electrical wiring metallization schemes having Au (gold) as the final coating are employed because they have the ability to establish a reliable connection. Other metals (e.g., Pd, Pt, Nb, etc.) can also be used. In some flex circuit embodiments, soldering is performed on pads provided in contact with the device, so there are limitations on the amount of Au that can be provided in contact with multiple pads. This is because Au dissolves into the molten solder, making the solder brittle during cooling and causing reliability issues with the electrical connection. However, if Au is added to the pad in one process and all of the Au in contact with the pad is removed in another process, then in at least one subsequent process, the solder will not wet the pad. This situation imposes constraints on both the amount of Au added to the pad and the amount of Au that was added and subsequently removed from the pad (for example, when removing IPC in multiple electrical connection areas). These considerations apply equally to other interface materials in addition to Au.

[0022]

[0041] In one embodiment, at least one IPC film is deposited after the injection die piping is opened to the outside (via the nozzle or ink filling port), i.e., after at least one internal cavity is exposed for material processing. This allows all surfaces that come into contact with the ink to be coated with IPC. The fact that the internal cavity is opened / exposed for processing makes it currently impossible to use wet chemical treatment to remove the IPC, because wet chemical treatment would remove the IPC from the internal cavity where the coating should remain. On the other hand, photopolymerizable films combined with efficient dry peeling are being considered.

[0023]

[0042] In one embodiment, IPC films (e.g., ALD oxide) are difficult to remove by selective chemical means included in dry / plasma etching methods. Including chlorine-containing etching species may facilitate removal. One method is to utilize argon (i.e., Ar) ion milling, which is a process with certain selectivity. Unfortunately, the selectivity is skewed in the wrong direction, so Au is removed relatively easily compared to ALD oxide. Polymers are not easily removed by this process. In one embodiment, the thickness of the ALD oxide is typically 30-50 nm, and the selectivity for removing Au compared to hafnia (i.e., HfO2) is approximately 3:1. That is, Au is removed three times more easily by argon ion milling than by removing HfO2. Therefore, in one embodiment, which includes a 30-50 nm ALD oxide coating on the electrical contact area, there is approximately 150 nm of extra Au in contact with the pad (e.g., the electrical contact in this context), and the excess Au can be removed while leaving enough Au to ensure the solderability of the pad (assuming 100% over-etching by argon ion milling). In this method, the Au layer is thickened in areas where the Au is exposed to ion milling, but not in areas that remain covered by polymer passivation (note that Au is relatively expensive). This process has been demonstrated in one manufacturing environment.

[0024]

[0043] The following description includes illustrative processing steps, as well as a discussion of the coating of plastics onto the surface and what should happen to ensure successful IPC (Instructional Processing). Plastic materials are attractive in printhead structures for several reasons, the primary being that they can be implemented relatively inexpensively by molding, while maintaining the level of dimensional accuracy required for the external piping (e.g., head mount) of the Si die. The coefficient of thermal expansion (CTE) of polymer materials can vary in the range of 15–75 ppm / °C. For comparison, the CTE of Si is 3 ppm / °C. Transfer molding of thermosetting materials (e.g., EMC, CTE=10–12 ppm / °C) widely used in semiconductor packaging applications is well established and includes materials suitable for inkjet printhead structures. In one embodiment, SU-8 (CTE=55–60 ppm / °C) is the plastic material used for the printhead structure. Multiple Si layers, the head mount, and other elements exposed to ink are bonded to each other using an epoxy (i.e., glue, adhesive, etc.) that is compatible with the ink. If all Si components are coated with IPC, they will be protected from chemical corrosion, meaning they will not be affected by chemical corrosion. In other words, plastic elements are the weak point of any structure in terms of such chemical corrosion. The ability to deposit IPC (e.g., bulk HfO2 CTE = 6.0 ppm / °C) in contact with the printhead structure at stages beyond the wafer level of the injection die is attractive for improving the chemical resistance of the printhead. In various embodiments, IPC materials are brittle ceramics, typically stronger in compression than in tension, but will break under excessive load. Considering the above, being able to establish the chemical protection function of IPC at the lowest possible temperature is fundamentally important for realizing reliable structures using various materials. ALD (e.g., using HfO2 as described in various embodiments herein) can provide sufficient film density, uniformity, fit, adhesion, and chemical resistance for inkjet applications.

[0025]

[0044] Furthermore, in some embodiments having a coating applied over an adhesive (glue) (e.g., for encapsulating the adhesive) or other bonding material, one of the main objectives of IPC in this context is to coat at low temperatures to prevent degradation of the adhesive (glue) while maintaining sufficient film performance. The printhead material needs to be selected to obtain an appropriate balance of CTE, adhesion, and modulus of elasticity when fully cured (with nearly zero residual outgassing). Tests have confirmed that coating over SU-8 films using various embodiments of this method yields excellent results. This implies that IPC can be coated over various printhead structural materials while maintaining chemical resistance, provided that a suitable adhesive (glues) (e.g., DELO-OB787 with CTE = 38 ppm / °C @ 50°C, 72 ppm / °C @ 150°C) is selected and the process has sufficient adhesion and an appropriate curing schedule.

[0026]

[0045] Figures 1A to 1C show components of an inkjet printer suitable for the protective coating treatments and protective coating materials described herein in various embodiments. One or more components can be coated before assembly with other components, or multiple components can be coated in various combinations in a subassembly consisting of two or more components, or in a finished assembly consisting of multiple components.

[0027]

[0046] Figure 1A shows the head mount 102, a component of the print head 130 (see Figure 1C). In one embodiment, the head mount 102 is made of thermoplastic resin and has an open channel 106 containing a plurality of openings 108 intended for use with printer ink. Furthermore, the plurality of openings 104, 108 support the mounting of other components, such as transducers, ink supply fittings, or electrical connections. The plurality of channels 106 are closed by assembly with one or more other components. This means that there are multiple ways in which the internal cavity can be coated. One method is to coat the visible surface of the head mount 102, as shown in Figure 1A, or to coat the entire head mount 102. In either case, the coating is applied in contact with the surface of the channel 106, which will become the inner surface of the cavity when the print head is assembled. Another method involves assembling two or more components of the print head 130, including the head mount 102, such that the channel 106 is closed, but at least one internal cavity for processing is exposed by multiple openings 108, and then coating is applied using a process (e.g., atomic layer deposition) that diffuses a precursor gas into the internal cavity through the openings 108 to coat the surface of the internal cavity.

[0028]

[0047] Figure 1B shows a MEMS (Micro Electromechanical System) 122 die mounted on a carrier 120, and several ICs 124 mounted on the MEMS die, which are components of the print head 130. For example, the multiple ICs 124 may be mounted on the MEMS die by multiple solder balls to achieve electrical connection. The MEMS 122 die is also mounted on the carrier 120 by solder balls, or by wave soldering or other electrical connection techniques. The MEMS 122 die comprises transducers and nozzles. These may be mechanically attached by, for example, adhesive (glue) or other bonding materials. In various embodiments, this assembled component may be coated before being further assembled with at least one other component. Alternatively, this assembled component may be assembled with one or more further components, and then the assembly may be coated.

[0029]

[0048] Figure 1C shows a printhead 130 constructed through assembly including the components shown in Figures 1A and 1B, which are components of an inkjet printer. For example, the head mount 102 comprises a transducer 132, an ink reservoir 138 with fluid ports 134 (e.g., vents) and 136 (e.g., vents), all assembled together with adhesive (glue), and also includes various electrical contacts formed by multiple solder balls, wave soldering, or other soldering techniques. In various embodiments, the various components can be coated before such assembly, or the entire printhead 130 can be coated after assembly. Internal cavities exposed for processing receive the coating, for example, through openings or passages.

[0030]

[0049] Figure 1D shows a cross-sectional view of an exemplary printhead 140, which consists of multiple layers defining various features including an internal cavity and a nozzle 170. These layers can be made of various materials, have various structures and shapes in various embodiments, and are not limited to the multiple specific layers, structures and shapes described herein as one embodiment. In general, there are multiple methods and multiple sets of materials that can be used to form a printhead having an internal cavity 168 and a nozzle 170. In the embodiment shown in Figure 1D, lead zirconate titanate (PZT) is an important material due to the remarkable piezoelectric properties of its crystalline structure, and the printhead 140 is formed by laminating multiple layers as follows.

[0031]

[0050] The lower electrode 150 and the adhesion layer 160 form the base of the lower electrode stack, and the adhesion layer 160 has a buffer PZT layer 148. The epitaxial growth layer 146, adhesion layer 144, and upper electrode 142, which are in physical contact with the buffer PZT layer 148, are the upper layers in the structure shown in the figure. On the opposite side of the adhesion layer 160 (i.e., the lower side in the figure), the flexure film 162 defines several surfaces for the bodies 164A and 164B to adhere to, as well as defining the surface of the internal cavity 168. Further surfaces of the cavity are defined by several parts of the bodies 164A and 164B, which in one embodiment are fabricated from a base wafer defining an ink channel 167 and a pumping chamber 168. The nozzle plates 166A and 166B, bonded to the main bodies 164A and 164B, are provided with openings 171, and this structure defines the nozzle 170. Depending on the perspective, the ink channels 167 and the pumping chamber 168 can be considered, individually or in combination, as the internal cavity of the printhead 140. As such, the internal cavity and nozzle 170 are intended to receive a protective coating. The surfaces of the internal cavity and nozzle 170 are exposed through the nozzle 170 during material processing and receive a protective coating as described in various embodiments herein.

[0032]

[0051] Figure 1E shows a cross-sectional view of a printhead 180 of a further example, comprising multiple layers defining internal cavities and nozzles. In this embodiment, the actuator 182 is mounted on a support structure 184 having multiple grooves 183 and including a deformable portion 181. A substrate 185 having various portions 186A, 188A, 186B, 188B, 186C, 188C arranged to define one or more cavities is mounted on the support structure 184, and the deformable portion 181 of the support structure 184 can discharge ink through nozzles 196 defined by openings in nozzle plates 190A, 190B mounted on the substrate 185. The portions 186A, 188A of the substrate 185 and the nozzle plate 190A further define outlet supply channels 192 and outlet passages 193 which are connected to a descending portion 195 leading to the nozzles 196. Parts 186A and 186B of the substrate 185 and part of the support structure 184 define the lower section 195 and the pumping chamber 198, which are connected to each other and also to the upper section 197. The upper section 197 is defined by parts 186B and 186C of the substrate 185 and is connected to an inlet supply channel 194 defined by parts 186B, 188B, 186C, and 188C of the substrate 185 and the nozzle plate 190B. In this context, “connected” means that the various chambers are fluidically connected to contain, transport, and / or discharge a fluid, specifically printer ink in this example. Multiple inner surfaces of these various chambers (including the outlet supply channel 192, outlet passage 193, inlet supply channel 194, rise section 197, pumping chamber 198, descend section 195, and at least one inner surface of the nozzle 196) are intended to receive a protective coating, are exposed through the nozzle 196 during material handling, and receive the protective coating in the various embodiments described herein. Multiple outer surfaces, for example, the outer surfaces of the nozzle plates 190A and 190B, may also receive such a protective coating. Further multiple outer surfaces of the print head 180 may also receive a protective coating.However, in embodiments where multiple exposed surfaces are coated with protective coatings before the print head is assembled to at least one other component, some surfaces may be covered and not coated with protective coatings.

[0033]

[0052] Figure 2A shows an HfO2 coating 204 provided in contact with a component in one embodiment. This shows a cross-section of the main body 202, which has a layer of HfO2 film as a conformal coating provided in contact with the surface of the main body 202. It should be noted that this figure is intended as a generalization, and it should be understood that such a layer of HfO2 can be provided on other surfaces depending on the arrangement (e.g., inside the deposition chamber) and exposure conditions. This includes the bottom, side, and internal (e.g., chamber) surfaces (see Figures 3A-3D).

[0034]

[0053] Figure 2B shows, in one embodiment, a non-wettable coating (NWC) 206 on an HfO2 coating 204 provided in contact with a component. Various materials described herein can be used for the non-wettable coating 206, which is applied directly to or on the HfO2 film or coating 204 provided in contact with the main body 202 of the component. Other surfaces, such as the bottom, sides, and interior, may also have these layers, depending on their arrangement and exposure conditions. In the case of inkjet printer components, the NWC coating 206 is advantageous for printer inks. In some embodiments, the NWC exists in contact with a film or coating derived from a group of various silanes having functional end groups (e.g., perfluorododecyltrichlorosilane (FDTS)), and is formed as a film on the HfO2 film or as a layer by a treatment applied to the HfO2 film.

[0035]

[0054] Figure 2C shows a multilayer coating provided in contact with a component in one embodiment. To improve the adhesion of the non-wetting coating 210, various materials described herein can be applied between the non-wetting coating 210 and the HfO2 film or coating 204 provided in contact with the body 202. For example, the HfO2 coating 204 is first applied to the body 202 by being ejected from the print head through the nozzle 196, then one or more layers of at least one other material, including Al2O3 or SiO2 in some embodiments, are applied as coating 208 on top of the HfO2 coating 204, and the non-wetting coating 210 is applied on top of the coating 208. Multiple other surfaces, such as the bottom, sides, and interior, may also have these layers depending on their arrangement and exposure conditions.

[0036]

[0055] Figures 3A–3D show cross-sectional views of various components coated with HfO2 in contact with the components in various embodiments, including coating the internal cavities. These cross-sectional views are general and applicable to the main body and components, and are also applicable to components of printheads, inkjet printers, and other devices that benefit from the protective coatings of the various embodiments described herein.

[0037]

[0056] Figure 3A is a cross-sectional view of a body 302 having an internal cavity 304 exposed through a passage 306 for processing, and having a conformal coating 204 of HfO2. In various embodiments, the thickness of the conformal coating 204 (indicated by opposing arrows) is approximately 30 nm, 20 nm to 40 nm, 30 nm to 50 nm, or 10 nm to 50 nm. These thicknesses, or ranges of thickness, are selected as the target thickness for the processing to which the coating 204 is applied, to minimize or prevent the formation of pinholes, thin films (for thinner thicknesses) and the growth of microclumps (for thicker thicknesses). Determining the optimal thickness of the conformal coating 204 may require experimentation with a given processing and a set of processing parameters, as well as / or a given arrangement of components and cavities, which should be easily understood and should not require excessive experimentation. For example, tests (e.g., sample runs) may be performed at three target thicknesses for minimum, intermediate, and maximum thickness values ​​and specific components.

[0038]

[0057] Figure 3B is a cross-sectional view of a body 308 having an internal cavity 310 (e.g., a passage exposed for processing) and a conformal coating 204 of HfO2. A precursor gas enters the internal cavity 310 from outside the body 308 and deposits the conformal coating 204 on the surface of the internal cavity 310. The outer surface of the body 308 is also coated with the conformal coating 204.

[0039]

[0058] Figure 3C is a cross-sectional view of a body having a conformal coating of HfO2 204, constructed by assembling two bodies 320, 322 together, with an internal cavity 324 exposed for processing. Many processes are applicable to constructing a single body (e.g., a component) by assembling two bodies 320, 322, including mechanical assembly (e.g., by fasteners or press-fitting), thermal assembly (e.g., thermocompression bonding), and chemical assembly (e.g., chemical bonding; see also adhesive (glue) in Figure 3D). Standard testing of multiple samples can determine whether a particular component is suitable for coating. See also the explanation of the optimal coating thickness in Figure 3A.

[0040]

[0059] Figure 3D is a cross-sectional view of a body constructed by assembling two bodies 330 and 332 together with an adhesive (glue) 334, the body having a conformal coating 204 of HfO2. Here, the conformal coating 204 is provided on at least one exposed surface of the assembled body and on the exposed portion 336 of the adhesive (glue) 334. The adhesive (glue) described herein is suitable, but other adhesives (glues) can also be easily tested using at least one sample and test run. These test runs should be easy to understand and do not require excessive experimentation. Note that other bonding materials can also be used instead of adhesive (glue).

[0041]

[0060] Figures 4A to 4C show a body 402 having an electrical contact area in several embodiments. For example, an electrical contact area is an area to which a solder ball, solder paste, or other form of solder is applied in order to electrically connect the electrical or electronic circuit of one component to the electrical or electronic circuit of another component. In these embodiments, the electrical contacts are formed on an electrical contact pad 405 having exposed gold 406 for application of the appropriate form of solder.

[0042]

[0061] Figure 4A shows a body 402 including an electrical contact pad 405 having gold 406 on another metal. For example, the pad 405 and the wire 404 leading to or extending from the pad 405 can be formed of aluminum, copper, or other electrically conductive metal in contact with the surface of the body 402. For example, the body 402 can be a printed circuit board, a flexible circuit board, a carrier, a multi-chip assembly on a board, a thermosetting plastic, or other component or material suitable for supporting the electrical contact pad 405 and making electrical connections to the electrical contact pad 405. In these embodiments, it is intended that the body 402 be coated with a conformal coating 204 of HfO2 to protect it as much as possible or to a specified extent, while exposing at least one electrical contact area for soldering.

[0043]

[0062] Figure 4B shows a cross-sectional view of the embodiment of Figure 4A, which has a conformal layer or coating 204 of HfO2 provided in contact with the surface of the main body 402, and includes a mask 408 that defines the selective removal region 410 above the electrical contact area. The coating 204 is applied to an appropriate thickness as described herein, as in the various embodiments described herein. The mask 408 is positioned, for example, by UV (ultraviolet) exposure and removal according to a predetermined pattern in the UV exposure of a photoresist, or by electron beam writing, or by other masking processes used in the industry. Mechanical masks (e.g., laser-cut silicon) are also possible. Whatever mask is used, the selective removal region 410 is aligned with the gold 406 and pad 405 where electrical contacts by soldering are intended. At least one portion of the mask 408 that has been removed exposes the surface of the coating 204 in the selective removal region 410. Removal is performed, for example, by ion milling. At least one remaining portion of the mask 408 protects the remaining surface of the coating 204 and is not removed at that time by, for example, ion milling.

[0044]

[0063] Figure 4C shows a cross-sectional view of the embodiment shown in Figure 4A, after further processing from the cross-sectional view in Figure 4B. In Figure 4C, a portion of the conformal coating 204 of HfO2 in the electrical contact area 410 is selectively removed, and a portion 412 of the gold 406 provided in contact with the electrical contact pad 405 is partially removed. In some embodiments, ion milling is performed with a controlled amount of over-etching (e.g., 50-150% over-etching) as a result, all of the gold 406 in the electrical contact area 410 and the HfO2 on the pad 405 are removed. However, since a portion of the gold 406 (e.g., a portion 412 of the gold 406 shown by the dashed line) is also removed by ion milling, the amount of additional gold added to the electrical contact pad 405 is adjusted, taking over-etching into account, depending on the thickness of the HfO2 and the length of time for ion milling to remove that thickness. The minimum amount of gold 406 added to the electrical contact pad 405 is determined by over-etching, and the maximum amount of gold 406 added to the electrical contact pad 405 is determined by preventing solder embrittlement. In one embodiment, the thickness of HfO2 is in the range of 20 to 40 nm, and the amount of additional gold added to the pad 405 is approximately 150 nm, so the total thickness of gold 406 on the electrical contact pad 405 exceeds 170 nm. Note that the figures are not to scale. In some other embodiments, the amount of gold used is sufficient to prevent oxidation (and allow solder wetting), while being thin enough to prevent embrittlement of the solder and Au.

[0045]

[0064] In some embodiments, non-selective processing exists that does not use masking, allowing ion milling to remove the entire coating from one (or more) outer surfaces of the wafer and / or components. Such masking-free processing is used when the surface is not expected to be exposed to fluid corrosion.

[0046]

[0065] Figure 5 is a flowchart illustrating one embodiment of a method for producing a protective coating for a component, which can be carried out using the embodiments described herein. This method can be carried out using an atomic layer deposition apparatus, a precursor gas of HfO2, and various components, including components of an inkjet printer and components of an inkjet printhead. In yet another embodiment, this method can be carried out using candidate oxide films and candidate nitride films having various properties described herein.

[0047]

[0066] Action 502 provides components for coating. For example, components of an inkjet printhead, a printhead assembly or printhead subassembly, or components of an inkjet printer may be used. The components may be manufactured in-house or sourced externally and brought in for further processing. In various embodiments, the components have at least one internal cavity accessible for processing. In various embodiments, the components are expected to be exposed to acidic or alkaline liquids during use of the apparatus. For example, the liquid may be printer ink.

[0048]

[0067] Action 504 involves selecting a film material for coating. In various embodiments described herein, the film material is HfO2 and is fabricated as a conformal coating using atomic layer deposition.

[0049]

[0068] In Action 506, the target thickness of the film is selected. In various embodiments described herein, the target thickness of the HfO2 film is between 10 and 50 nm, between 20 and 40 nm, between 30 and 50 nm, or about 30 nm. The target thickness is selected to prevent the formation of pinholes, thin film areas, and the growth of microclumps. In some embodiments in which laser dicing is used, the thickness of the HFO2 is maintained at less than 50 nm.

[0050]

[0069] Action 508 selects a temperature for film formation. In various embodiments described herein, this temperature is suitable for forming a film in contact with a thermosetting resin and / or adhesive (glue) (or other bonding material). In some embodiments, the selected temperature is in the range of 185°C to 275°C.

[0051]

[0070] In Action 510, a film of the selected film material is deposited as a conformal layer in contact with the components, including the internal cavities exposed for processing, using an atomic layer deposition method adjusted to the selected target thickness and temperature.

[0052]

[0071] This method can be modified by adding additional actions, such as depositing an additional film (e.g., an NWC coating), as described herein.

[0053]

[0072] Figure 6 is a flowchart illustrating one embodiment of a method for selectively removing a protective coating from a component having an electrical contact area, and this method can be carried out using any of the embodiments described herein. In particular, the method shown in Figure 6, when combined with the method shown in Figure 5, can be used to manufacture a component having a protective coating that includes multiple openings for electrical contacts.

[0054]

[0073] Action 602 involves applying a specified amount of gold, or a specified thickness range, to at least one electrical contact area of ​​the component. For example, in some embodiments, at least 200 nm of gold, or gold thicker than 200 nm (e.g., thicker than 300 nm), or gold in the range of 220-240 nm, is applied to the contact pad of the component. In some other embodiments, a smaller amount of gold may be used. The amount of gold is specified as follows: that is, an amount remaining in contact with the contact pad after the HfO2 film or coating in the defined electrical contact area has been removed by ion milling with over-etching (an amount sufficient for solder wetting, but not so much that the solder becomes brittle).

[0055]

[0074] In Action 604, a conformal film, layer, or coating of HfO2 is deposited in contact with the constituent elements using atomic layer deposition (see, for example, the method in Figure 5). The target thickness or measured thickness of the coating should be available in Action 608 when determining at least one processing parameter, such as etching time including over-etching.

[0056]

[0075] Action 606 identifies, in some embodiments, multiple selective removal regions for removing HfO2. For example, a mask, photoresist, or physical masking is used to expose a portion of the HfO2 while protecting the remaining HfO2 from removal. It is recommended that the selective removal regions align with the electrical contact areas of the components.

[0057]

[0076] Action 608 uses argon ion milling with selected over-etching to remove HfO2 in selective removal regions, leaving sufficient gold in at least one electrical contact area for soldering with solder wetting rather than solder embrittlement.

[0058]

[0077] This specification describes several exemplary embodiments.

[0059]

[0078] Example 1 is a method for manufacturing a material for an article, comprising: preparing a component of an apparatus having at least one internal cavity accessible for processing and being exposed to acidic liquids, alkaline liquids, or other liquids that chemically corrode the component during use of the apparatus; selecting a target thickness of an HfO2 film to prevent the formation of pinholes, thin films, and nodule growth; and forming a coated component by depositing an HfO2 film as a conformal layer in contact with the component, including the surface of at least one internal cavity, using atomic layer deposition (ALD) with a process adjusted to the target thickness, wherein the material has the deposited HfO2 film as a protective coating.

[0060]

[0079] Example 2 is the method according to claim 1, which may optionally include a target thickness of 10 nm or more and 50 nm or less.

[0061]

[0080] Example 3 is the method according to claim 1, which may optionally include a target thickness of 20 nm or more and 40 nm or less.

[0062]

[0081] Example 4 is the method according to claim 1, which optionally includes the condition that the deposition of the HfO2 film is carried out in a temperature range of 185°C to 275°C.

[0063]

[0082] Example 5 is the method according to claim 1, which optionally includes the following: the component is a component of an inkjet print head, the acidic, alkaline, or chemically corrosive liquid of the component is printer ink, and the material functions as a protective coating of the component against the printer ink.

[0064]

[0083] Example 6 is the method according to claim 1, wherein the components have a plurality of members integrally bonded and / or constructed with a bonding material, and the deposition of the HfO2 film may optionally include deposition in contact with the exposed portion of the bonding material.

[0065]

[0084] Example 7 is the method according to claim 6, which optionally includes at least one selected from the group consisting of glue, epoxy, adhesive, solder, and photoresist.

[0066]

[0085] Example 8 is the method according to claim 1, which optionally includes attaching a non-wettable coating (NWC) to a film of HfO2, wherein the material has a film of HfO2 with the attached non-wettable coating.

[0067]

[0086] Example 9 is the method according to claim 1, which optionally includes depositing at least one from the group consisting of Al2O3 or SiO2 in contact with a deposited HfO2 film, and depositing a non-wettable coating (NWC) in contact with at least one of the deposited films from the group.

[0068]

[0087] Example 10 is the method according to claim 1, which optionally includes selectively removing multiple portions of the deposited HfO2 film using ion milling to expose a surface containing gold or other conductive material suitable for electrical interconnection.

[0069]

[0088] Example 11 is the method according to claim 1, which optionally includes shielding a first portion of a component using a physical mask having at least one opening to expose a second portion of the coated component, and removing a portion of the deposited HfO2 film from the exposed second portion of the coated component using ion milling.

[0070]

[0089] Example 12 is the method according to claim 1, which optionally comprises a component having a plurality of electrical contact regions, each containing gold. The method further comprises selectively removing a plurality of portions of a deposited HfO2 film, each having a thickness between 10 nm and 50 nm, using argon ion milling with over-etching of 50% to 150%, thereby exposing each of the plurality of electrical contact regions, wherein the over-etching removes a portion of the gold in each of the plurality of electrical contact regions.

[0071]

[0090] Example 13 is the method according to claim 1, wherein the components include at least a portion of a thermosetting plastic, and the deposition of the HfO2 film is optionally performed in a temperature range below the damage temperature of the thermosetting plastic.

[0072]

[0091] Example 14 is the method according to claim 1, which optionally includes the following: the components comprise at least a portion of a polymer material, and the deposition of the HfO2 film is carried out in a temperature range below the temperature at which the polymer material undergoes structural degradation.

[0073]

[0092] Example 15 is a method for manufacturing a material for an article, comprising: depositing a metal in contact with a plurality of electrical contacts in a component of an apparatus having at least one internal cavity accessible for processing and being exposed to acidic, alkaline or other chemically corrosive liquids during use of the apparatus; selecting a target thickness of a film which is HfO2, ZrO2, TiO2, or a chemically resistant oxide or nitride; and forming a coated component by depositing a film of a target thickness as a conformal layer in contact with the surface of at least one internal cavity and the metal provided in contact with the electrical contacts, wherein the material includes the deposited film as a protective coating, and the method further comprises selectively removing / eliminating a plurality of portions of the deposited film to expose the metal provided in contact with the plurality of electrical contacts.

[0074]

[0093] Example 16 is the method according to claim 15, which optionally includes gold, copper, or nickel as the metal.

[0075]

[0094] Example 17 is the method according to claim 15, which optionally includes adhering a non-wettable coating (NWC) to a deposited film, wherein the material includes a deposited film having the adhering non-wettable coating.

[0076]

[0095] Example 18 is the method according to claim 15, which optionally includes depositing at least one from the group consisting of Al2O3 or SiO2 in contact with the deposited film, and depositing a non-wettable coating (NWC) in contact with the deposited film.

[0077]

[0096] Example 19 is the method according to claim 15, which optionally includes using ion milling to remove multiple portions of the deposited film.

[0078]

[0097] Example 20 is the method according to claim 15, which optionally includes shielding a first portion of a component using a physical mask having at least one opening to expose a second portion of a coated component, and removing a portion of the deposited film from the exposed second portion of the coated component using ion milling.

[0079]

[0098] Example 21 is the method according to claim 15, comprising removing multiple portions of a deposited film having a thickness between 10 nm and 50 nm, each using argon ion milling with over-etching of 50% to 150%, thereby exposing each of a plurality of electrical contact regions, wherein the over-etching may optionally include removing a portion of gold in each of the plurality of electrical contact regions.

[0080]

[0099] This specification discloses detailed embodiments. However, the specific functional details disclosed herein are merely illustrative to illustrate multiple embodiments. Multiple embodiments can be implemented in many alternative forms and should not be construed as being limited to only the embodiments described herein. Descriptions of direction and orientation are for convenience of interpretation and should be understood as not being limited to the orientation of the device relative to gravity. In other words, the device can be installed upside down, upright, oblique, vertical, horizontal, etc., and descriptions of direction and orientation are relative to the parts of the device itself, not absolute.

[0081]

[0100] In this specification, terms such as "first," "second," etc., may be used to describe various procedures or calculations, but it should be understood that these procedures or calculations should not be limited by these terms. These terms are used solely to distinguish one procedure or calculation from another. For example, without departing from the scope of this disclosure, a first calculation may be referred to as a second calculation, and similarly, a second procedure may be referred to as a first procedure. As used herein, the terms “and / or” and the “ / ” symbol include any combination of one or more of the related enumerated items.

[0082]

[0101] In this specification, the singular forms “a,” “an,” and “the” include the plural form unless otherwise clearly indicated by the context. Furthermore, the terms “comprises,” “comprising,” “includes,” and / or “including” as used herein are used to identify the features, components, procedures, operations, parts, and / or components described herein, and are not intended to prevent the existence or addition of one or more other features, components, procedures, operations, parts, components, and / or groups thereof. Accordingly, the terms used herein are used to describe only specific embodiments and are not intended to be restrictive.

[0083]

[0102] It should also be noted that in some alternative implementations, the functions / operations described may differ in order from those shown in the diagrams. For example, two diagrams shown consecutively may actually execute substantially simultaneously, or, depending on the related functions / operations, in reverse order.

[0084]

[0103] While the multiple operations in the method are described in a specific order, it should be understood that other operations may be performed between the described operations, the order of the described operations may be adjusted slightly, or the described operations may be distributed within a system that allows processing operations to be performed at various intervals related to the processing.

[0085]

[0104] Various units, circuits, or other components may be described or claimed as “configured to” perform one or more tasks. In such contexts, the phrase “configured to” is used to imply a structure by indicating that each of the multiple units / circuits / components includes a structure (e.g., a circuit or mechanical feature) that performs one or more tasks while in operation. Thus, even if a specified unit / circuit / component is not currently operating (e.g., not powered on), it can be said that the unit / circuit / component is configured to perform tasks. Each of the multiple units / circuits / components used in the term “configured to” includes hardware (e.g., multiple circuits, memory that stores executable program instructions to perform operations). The statement that a unit / circuit / component is “configured to” perform one or more tasks is not intended to expressly impose the application of 35 United States Code § 112 6 to that unit / circuit / component. Furthermore, “configured to” may include a general-purpose structure (e.g., a general-purpose circuit) controlled by software and / or firmware (e.g., an FPGA or a general-purpose processor running the software) that operates in a manner capable of performing at least one task in question. Also, “configured to” may include adapting a manufacturing process (e.g., a semiconductor manufacturing facility) to produce a device (e.g., an integrated circuit or product) adapted to implement or perform one or more tasks, or designing an article or apparatus to have a particular characteristic or capability.

[0086]

[0105] The above description has been made with reference to several specific embodiments for the sake of explanation. However, the above exemplary discussion is not exhaustive and does not limit the invention to the exact form disclosed. In light of the above teachings, many modifications and variations are possible. The embodiments have been selected and described to best illustrate the principles of the embodiments and their practical applications, so that those skilled in the art can best utilize embodiments and various modifications that would be suitable for specific intended uses. Accordingly, these embodiments are exemplary and not limiting, and the invention is not limited to the details described herein, but can be modified within the scope of the appended claims and equivalents.

Claims

1. A method for manufacturing materials for articles, Preparing a component of the apparatus having at least one internal cavity accessible for processing, and which is exposed to an acidic liquid, an alkaline liquid, or another liquid that chemically corrodes the component during use of the apparatus, HfO prevents the formation of pinholes, thin films, and node growth. 2 Selecting the target thickness of the film, Using atomic layer deposition (ALD) adjusted to the target thickness, HfO is used as a conformal layer in contact with the components, including the surface of at least one internal cavity. 2 Forming a film and creating coated components, Equipped with, The aforementioned material is a film-formed HfO 2 A method having a film as a protective coating.

2. The method according to claim 1, wherein the target thickness is 10 nm or more and 50 nm or less.

3. The method according to claim 1, wherein the target thickness is 20 nm or more and 40 nm or less.

4. The HfO 2 The method according to claim 1, wherein the film formation is carried out in a temperature range of 185°C to 275°C.

5. The aforementioned components are parts of an inkjet print head. The acidic, alkaline, or chemically corrosive liquid of the constituent elements is printer ink. The method according to claim 1, wherein the material functions as a protective coating for the component against the printer ink.

6. The aforementioned component includes a plurality of members that are integrally joined and / or constructed with a joining material, HfO 2 The method according to claim 1, wherein forming the film includes forming it in contact with the exposed portion of the bonding material.

7. The method according to claim 6, wherein the bonding material comprises at least one selected from the group consisting of glue, epoxy, adhesive, solder, and photoresist.

8. A non-wettable coating (NWC) is deposited on HfO 2 The material further includes adhering to a film of HfO, wherein the material is a film-formed HfO having an attached non-wetting coating. 2 The method according to claim 1, comprising a film.

9. The formed HfO 2 is contacted with the film, and Al 2 O 3 or SiO 2 is formed to form at least one selected from the group consisting of them. The method according to claim 1, further comprising forming a non-wettable coating (NWC) in contact with at least one of the formed films from the group.

10. HfO film deposited using ion milling 2 The method according to claim 1, further comprising selectively removing a plurality of portions of the aforementioned film to expose a surface containing gold or other conductive material suitable for electrical interconnection.

11. A physical mask having at least one opening is used to shield a first portion of the component and expose a second portion of the coated component, Using ion milling, the HfO film is deposited from the exposed second portion of the coated component. 2 The method according to claim 1, further comprising removing a portion of the aforementioned film.

12. Each of the aforementioned components has multiple electrical contact regions containing gold, The aforementioned method, Using argon ion milling with over-etching of 50% to 150%, HfO films with thicknesses of 10 nm to 50 nm were deposited. 2 The method further comprises selectively removing multiple portions of the film to expose each of the multiple electrical contact regions. The method according to claim 1, wherein the over-etching removes a portion of the gold in each of the plurality of electrical contact regions.

13. The aforementioned component includes at least a portion of a thermosetting plastic, HfO 2 The method according to claim 1, wherein the deposition of the film is carried out in a temperature range below the damage temperature of the thermosetting plastic.

14. The aforementioned component includes at least a portion of the polymer material, HfO 2 The method according to claim 1, wherein the deposition of the film is carried out in a temperature range below the temperature at which the polymer material undergoes structural degradation.

15. A method for manufacturing materials for articles, A component of the apparatus having at least one internal cavity accessible for processing, and having a metal deposited in contact with multiple electrical contacts in the component that are exposed to acidic, alkaline, or other chemically corrosive liquids during use of the apparatus, HfO 2 , ZrO 2 , TiO 2 Alternatively, selecting a target thickness for a film that is a chemically resistant oxide or nitride, Forming a coated component by depositing a film as a conformal layer with the target thickness in contact with the component, which includes the surface of at least one internal cavity and the metal provided in contact with the plurality of electrical contacts, Equipped with, The aforementioned material includes a formed film as a protective coating. A method further comprising selectively removing / eliminating a plurality of portions of the formed film to expose the metal provided in contact with the plurality of electrical contacts.

16. The method according to claim 15, wherein the metal includes gold, copper, or nickel.

17. The method according to claim 15, further comprising attaching a non-wettable coating (NWC) to the formed film, wherein the material includes the formed film having the attached non-wettable coating.

18. In contact with the formed film, Al 2 O 3 or SiO 2 Depositing at least one from the group consisting of, The method according to claim 15, further comprising forming a non-wettable coating (NWC) in contact with the formed film.

19. The method according to claim 15, further comprising using ion milling to remove the plurality of portions of the deposited film.

20. Using a physical mask having at least one opening to shield a first portion of the component and expose a second portion of the coated component, The method according to claim 15, further comprising using ion milling to remove a portion of the film formed from the exposed second portion of the coated component.

21. The method according to claim 15, further comprising using argon ion milling with over-etching of 50% to 150%, removing a plurality of portions of the deposited film, each having a thickness between 10 nm and 50 nm, to expose each of the plurality of electrical contact regions, wherein the over-etching removes a portion of gold in each of the plurality of electrical contact regions.

Images