High-precision dressing tool and method for manufacturing the same

Abstract

This application relates to the field of CMP chemical mechanical grinding and polishing technology, and more particularly to a high-precision dressing tool and a method for manufacturing the same. The high-precision dressing tool includes a disc and diamond pieces, of which a plurality of diamond pieces are provided, each of which is provided on the disc and distributed at intervals along the axis of the disc, and the diamond pieces are formed with protrusions, each of which is tower-shaped, and the protrusions have a multilayer structure, with each layer of the protrusions having a horizontal edge and an inclined side edge. This application has the effect of improving the dressing capacity of the dresser and improving the dressing accuracy of the dresser.

Description

Technical Field

[0001] This application relates to the field of CMP chemical mechanical polishing technology, and particularly to high-precision dressing tools and their manufacturing methods.

Background Art

[0002] CMP chemical mechanical polishing is an advanced microelectronics process widely applied in the semiconductor manufacturing industry and other microelectronics fields. This technology combines chemical reactions and mechanical friction to act on the surface, corrode or polish and smooth the high parts of the surface, thereby making the surface smoother, and thus improving the performance and reliability of the device. In such a polishing process, the wafer must be abutted against a rotating pad made of a durable organic substance (such as polyurethane). By using a chemical grinding fluid containing substances that can break the wafer and some abrasive particles (used for physically grinding the wafer surface), and continuously supplying the grinding fluid to the rotating CMP polishing pad, a dual chemical and mechanical force is applied to the wafer to polish the wafer in the desired manner.

[0003] With the widespread application of semiconductor CMP processes, the market demands higher dressing accuracy, service life, and reliability for polishing pad dressing tools. Existing technologies can be broadly categorized into two types. One category is electroplated or brazed diamond polishing pad dressers, where diamond particles are electroplated or brazed onto the base of the polishing pad dresser, and the exposed diamond crystals are used for dressing the polishing pad. The drawback is that the height of the exposed diamond is uncontrollable, and therefore the dressing accuracy is greatly affected by the difference in the exposed diamond height. Furthermore, electroplated or brazed diamond polishing pad dressers are subjected to lateral forces during operation, which carries the risk of tiny diamond particles falling off. If tiny diamond particles fall off and enter the wafer polishing position, the wafer will be discarded. The service life of this type of product is also affected by the sharpness of the exposed diamond particles.

[0004] One category is CVD diamond polishing dressers, which engrave uniform protrusions on the surface of CVD single-crystal diamonds and bond the single-crystal CVD pieces to the base of the polishing pad dresser. Generally, 6 to 8 CVD single-crystal diamonds are arranged in a ring. The advantages are that the height of the diamond protrusions is controllable, the dressing accuracy is high, and the service life is better than electroplated or brazed polishing pad dressers. The disadvantages are that the cost is high, and if the spacing between the diamonds is designed to be too large, a gap may be created when the CVD single-crystal diamonds alternately dress during the operation of the polishing pad dresser, which can affect the dressing effect of the polishing pad. Currently, common structures for protrusions on the surface of CVD single-crystal diamonds include hexagonal protrusions, pyramidal protrusions, or truncated square protrusions. During processing, breakage is likely to occur at the sharp corners, and the dressing accuracy of the polishing dresser is affected by the flatness of the diamond pieces and protrusions.

[0005] Therefore, designing a dresser with stronger dressing capability and higher dressing precision is an urgent issue that needs to be addressed. [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] This application provides a high-precision dressing tool and a method for manufacturing the same in order to improve the dressing capacity of a dresser and to improve the dressing precision of a dresser. [Means for solving the problem]

[0007] The high-precision dressing tool and its manufacturing method provided in this application employ the following technical solutions.

[0008] A high-precision dressing tool comprising a disc and a plurality of diamond pieces, the plurality of diamond pieces all being provided on the disc and distributed at intervals along the axis of the disc, with projections formed on the diamond pieces, the projections being tower-shaped and having a multilayer structure, and each layer of the projection structure having a horizontal edge and an inclined side edge.

[0009] By employing the above technical solution, each diamond piece is sequentially attached to the disc during installation. At the same height, the multi-layered tower structure increases the number of horizontal and lateral edges of the protrusions, and the lateral edges are distributed in multiple directions, thereby improving the cutting ability and making it easier to cut cleanly. From a microscopic perspective, the lateral edges of the protrusions penetrate and scratch the polishing pad, forming certain grooves. The polishing fluid enters these grooves and can roughen the surface of the polishing pad, thereby dressing the surface of the polishing pad to a predetermined roughness requirement. In this way, improving the protrusion structure improves the dressing ability of the dresser and, consequently, the dressing accuracy of the dresser.

[0010] Selectively, the projection includes a plurality of shaved layer structures, the cross-sectional area of ​​the shaved layer structures gradually decreasing in the direction away from the diamond piece along the direction in which the projection and the diamond piece are in contact, the bottom surface of the upper shaved layer structure and the top surface of the lower shaved layer structure are in contact, and a connecting surface is formed between the periphery of the top surface of the lower shaved layer structure and the periphery of the bottom surface of the upper shaved layer structure.

[0011] By employing the above technical solution, a horizontal connecting surface is formed between each abrasive layer structure, and no groove is formed between two adjacent abrasive layer structures, thereby reducing damage to the abrasive pad surface.

[0012] Selectively, the projection includes a large tower and a small tower, the cross-section of the large tower located in the same layer of cut structure is larger than the cross-section of the small tower located in the same layer of cut structure, both the large tower and the small tower are provided in multiples, the large towers and the small towers are distributed alternately, the distance between the top of the large tower and the surface of the diamond piece is greater than or equal to the distance between the top of the small tower and the surface of the diamond piece, the height of the large tower is 0.04 to 2 mm, the height of the small tower is 0.03 to 2 mm, and the distance between the center point of the large tower and the center point of the small tower is in the range of 0.1 to 4 mm.

[0013] By adopting the above technical solution, the protrusions are arranged and cooperate with one large and one small one. When the large and small towers are set at the same height, the grooves in the polishing pad include both large and small ones. When the small tower enters the large groove, its small cross-section prevents it from cleanly scraping off the shavings in the large groove. This problem can be solved by installing a large tower. However, if all the towers set on the same diamond piece are large towers, the large towers will wear down the polishing pad surface significantly during movement, and when scraping, the roughness of the polishing pad surface tends to change significantly (become rougher). Small towers at the same height have a smaller cross-sectional area, so they wear down the polishing pad surface less and have less impact on the roughness of the polishing pad surface, resulting in less change in roughness from the initial roughness. Therefore, by combining large and small towers at the same height, it is possible to cleanly scrape off the remaining shavings in the large and small grooves while minimizing the change in the roughness of the polishing pad.

[0014] The shape of the large tower is selectable to be the same as the shape of the small tower.

[0015] By employing the above technical solution, the shape of the large tower is the same as that of the small tower, ensuring that the grinding marks on the polishing pad are almost identical, thereby improving the dressing effect.

[0016] The number of the milled layer structure can be selected from 2 to 1000 layers.

[0017] The dressing accuracy of the dresser is determined by the number of layers in the cutting layer structure; the more layers there are, the higher the dressing accuracy, and the dresser in this application has a wide range of applications.

[0018] The diamond piece is optionally provided with a chip-receiving groove, which is a blind hole.

[0019] By adopting the above technical solution, the chips generated during the grinding process can enter the chip accommodating grooves, thus avoiding the chips from affecting the subsequent grinding process and improving the dressing accuracy.

[0020] Optionally, the chip accommodating grooves are formed on the upper surface of the diamond piece and the bottom of the protrusion.

[0021] By adopting the above technical solution, chip accommodating grooves are formed between the protrusions. In this way, the flanges on the protrusions are exactly aligned with the chip accommodating grooves, which is beneficial for the chips to fall in.

[0022] Optionally, the shape of the diamond piece is circular, rectangular, or square.

[0023] By adopting the above technical solution, the types of diamond pieces are diversified. As a result, it is possible to manufacture diamond pieces in corresponding shapes according to needs. The shape of the diamond piece is no longer limited to a single shape, and the practicality is improved.

[0024] Optionally, it further includes a diamond tray attached to the disk, and the diamond piece is on the diamond tray.

[0025] By adopting the above technical solution, the effect of dressing the polishing pad is guaranteed, the usage amount of diamond is saved, and the cost is reduced.

[0026] This application further relates to a manufacturing method of a high-precision dressing tool. Step S 1 of growing diamond rough. Step S 2 of performing edge treatment and slicing with a laser. Step S 3 of thinning the diamond rough. Step S 4 of processing the diamond rough to the required dimensions with a laser. Step S 5 of chamfering with a laser. Step S6 of adhering the semi-finished diamond piece to the diamond tray, Step S7 of adhering the diamond tray to the disk, Step S8 of performing overall polishing on the diamond piece and the disk, Step S9 of engraving protrusions with a laser, Step S10 of performing sealant treatment, Step S11 of cleaning and packaging, and includes.

[0027] By adopting the above technical solution, in the first step, the diamond rough is grown to reach the required conditions. In the second step, the edge of the diamond rough is cut according to the required dimensions to reach the standard dimensions. In the third step, the diamond rough is cut in the thickness direction. In the fourth step, the diamond rough is processed to the required dimensions with a laser. In the fifth step, chamfering is processed using a laser. In the sixth step, the semi-finished diamond piece is adhered to the diamond tray. In the seventh step, the diamond tray is adhered to the disk. In the eighth step, overall polishing of the diamond piece and the disk is performed. In the ninth step, the required protrusions are engraved using a laser. In the tenth step, sealant treatment is performed on the diamond piece. Finally, the whole is cleaned and packaged. In this way, appropriate disks, diamond trays and diamond pieces can be manufactured according to the actual situation, and the processing is simple and convenient.

Effects of the Invention

[0028] Summarizing the above, this application includes at least one of the following beneficial technical effects.

[0029] 1. This invention provides a high-precision dressing tool comprising a disc, a diamond tray, and diamond pieces. The diamond tray is mounted on the disc, and the diamond pieces are attached to the diamond tray. The surface of the diamond pieces is formed with protrusions, which have a multilayer structure. The edges of the multilayer protrusions include horizontal edges and inclined lateral edges. At the same height, there are more horizontal edges than the number of horizontal edges of existing pyramidal protrusions. The edges are arranged in many directions, thereby increasing the cutting ability against chips and making it easier to achieve a clean finish. From a microscopic perspective, the lateral edges of the protrusions penetrate and scratch the polishing pad, forming certain grooves. The polishing fluid enters these grooves and can roughen the surface of the polishing pad. Meanwhile, the small platforms of the multilayer protrusions serve to smooth the grooves and cover the holes, dressing the surface of the polishing pad to a predetermined roughness requirement. This improves the dressing ability of the dresser by modifying the protrusion structure, and consequently, improves the dressing accuracy of the dresser.

[0030] 2. By adopting the above technical solution, the protrusions are arranged and work in cooperation with one large and one small one. Since there are both large and small grooves in the polishing pad, when the small tower enters the large groove, its small cross-section prevents it from cleanly scraping off the shavings in the large groove. This problem can be solved by installing a large tower. However, if all towers are installed, the large tower will wear down the surface of the polishing pad significantly during movement, and when scraping, the roughness of the polishing pad surface tends to change significantly (become rougher). Small towers of the same height have a small cross-sectional area, so they wear down the surface of the polishing pad less and have less impact on the roughness of the polishing pad surface, resulting in less change in roughness. Therefore, by combining large and small towers of the same height, it is possible to cleanly scrape off the remaining shavings in the large and small grooves, while minimizing the change in the roughness of the polishing pad.

[0031] 3. In this invention, the projection employed has a multilayer structure, and the insertion depth can be adjusted by adjusting parameters such as the number of layers, step width, and step height. The larger the parameter value, the shallower the insertion depth becomes, thus achieving the objective of customization as needed. [Brief explanation of the drawing]

[0032] [Figure 1] This is a plan view of the high-precision dressing tool of the present invention. [Figure 2] This is a magnified view of area A in Figure 1. [Figure 3] This is a schematic diagram of the structure of the diamond piece of the present invention. [Figure 4] This is a magnified view of area B in Figure 3. [Figure 5] This is a front view of the diamond piece of the present invention. [Figure 6] This is a schematic diagram of the multiple shapes of protrusions of the present invention. [Modes for carrying out the invention]

[0033] The present application will be explained in more detail below, with reference to Figures 1-6.

[0034] An embodiment of the present application discloses a high-precision dressing tool, which, referring to Figures 1 and 2, comprises a disc 1 and a diamond piece 3 provided on the disc 1, the diamond piece 3 having a plurality of protrusions 31, each protrusion 31 having a multilayer structure and a tower-like shape.

[0035] The multi-layered tower structure design improves the contact effect between the projections 31 and the grooves of the polishing pad, thereby improving the cutting ability and making it easier to achieve a clean finish. In addition, the side edges 5 of the projections 31 penetrate and scratch the polishing pad, forming certain grooves. The polishing fluid can enter these grooves, thereby roughening the surface of the polishing pad and bringing its surface roughness to a predetermined requirement. By adjusting the structure of the projections 31, the dressing ability of the dresser is improved, and consequently, the dressing accuracy of the dresser is also improved.

[0036] Specifically, referring to Figures 3 and 4, the projection 31 includes multiple abrasive layer structures 311, and the cross-sectional area of ​​the abrasive layer structures 311 gradually decreases in the direction away from the diamond piece 1 along the direction in which the projection 31 and the diamond piece 3 are in contact. Of two adjacent abrasive layer structures 311, the bottom surface of the upper abrasive layer structure 311 is in contact with the top surface of the lower abrasive layer structure 311, and a connecting surface 312 is formed between the periphery of the top surface of the lower abrasive layer structure 311 and the periphery of the bottom surface of the upper abrasive layer structure 311. Each abrasive layer structure 311 has a horizontal edge 4 and an inclined side edge 5. Because a horizontal connecting surface is formed between each abrasive layer structure 311, no groove is formed between two adjacent abrasive layer structures 311, reducing damage to the polishing pad surface.

[0037] Naturally, the shape of the shaved layer structure 311 is not unique, and by adjusting the machining angle, different multi-layered tower-like structures can be machined. In this embodiment, a preferred example will be given without specific explanation. It should be noted that grooves should not be formed between each layer of the shaved layer structure 311 during machining, as once grooves are formed, the destructive force on the polishing pad increases.

[0038] The top of the projection 31 is preferably designed to be flat (not pointed), because pointed parts have low strength and are prone to breaking when interacting with the polishing pad. Furthermore, the size of the top surface area of ​​the projection 31 is related to the shape of the grooves formed on the surface of the polishing pad during operation.

[0039] Furthermore, the multi-layered tower-shaped protrusion 31 can be used in conjunction with the conventional protrusion 31 structure (pyramid type). The multi-layered tower-shaped protrusion 31 is inserted into the polishing pad to treat the surface of the polishing pad and dress the polishing pad until the roughness of the polishing pad meets the requirements. The conventional protrusion 31 structure is mainly used to scrape off and remove particles on the polishing pad to prevent damage to the wafer caused by particles. In order to achieve the above effects, the dimensions of the multi-layered tower-shaped protrusion 31 need to be larger than the dimensions of the conventional protrusion 31 structure.

[0040] Naturally, multiple diamond pieces 3 are provided, and each diamond piece 3 is distributed at uniform intervals along the axis of the disc 1 (in this embodiment, six will be used as an example).

[0041] In this embodiment, referring to Figures 4 and 5, the projection 31 includes a large tower 313 and a small tower 314. The cross-section of the large tower 313 located in the same layer cutting structure 311 is larger than the cross-section of the small tower 314 located in the same layer cutting structure 311. Multiple large towers 313 and small towers 314 are provided, and they are distributed alternately. The distance between the top of the large tower 313 and the surface of the diamond piece 3 is greater than the distance between the top of the small tower 314 and the surface of the diamond piece 3. The projection 31 employs an arrangement and cooperation of one large and one small. Since there are both large and small grooves in the polishing pad, when the small tower 314 enters a large groove, its cross-section is small, making it unable to cleanly scrape off the chips in the large groove. This problem can be solved by installing the large tower 313. On the other hand, because the cross-sectional area of ​​the small tower 314 is small, it wears down the surface of the polishing pad only slightly, and has little effect on the roughness of the polishing pad surface, resulting in little change in roughness. Therefore, the combination of the large tower 313 and the small tower 314 can effectively scrape off the remaining debris in the large and small grooves, while minimizing the impact on the roughness of the polishing pad. In other embodiments, the height of the large tower can be made greater than the height of the small tower. In this case, the small tower only scrapes off the residue on the surface of the polishing pad, and the scraping by the small tower has less effect on the roughness of the polishing pad surface compared to the large tower which is deeply inserted into the groove.

[0042] Preferably, since the shape of the large tower 313 is the same as the shape of the small tower 314, it is possible to ensure that the grinding marks on the polishing pad are almost the same, and the dressing effect can be improved.

[0043] In this embodiment, the number of cut layer structures 311 (large towers 313 and small towers 314) ranges from 2 to 1000 layers. The dressing accuracy of the dresser is determined by the number of cut layer structures 311; the more layers there are, the higher the dressing accuracy, and the dresser in this application has a wide range of applications.

[0044] Taking the square projection 31 as an example, the large tower 313 has a base length of 0.1 to 2 mm, a top length of 0.005 to 1 mm, and a height of 0.04 to 2 mm. The distance between each cut layer structure 311 of the large tower 313 is 0.001 to 1 mm, the height of the cut layer structure 311 at the top of the large tower 313 is 0.001 to 1 mm, and the width of each connecting surface 312 of the large tower 313 is 0.001 to 1 mm. The small tower 314 has a base length of 0.08 to 2 mm, a top length of 0.005 to 1 mm, and a height of 0.03 to 2 mm. The distance between each cut layer structure 311 of the small tower 314 is 0.001 to 1 mm, and the distance between the center point of the large tower 313 and the center point of the small tower 314 is in the range of 0.1 to 4 mm. Naturally, the dressing effect differs depending on the change in each parameter, and in order to ensure that the dressing effect reaches its optimal level during actual use, it is necessary to select the appropriate parameters according to the actual situation.

[0045] In particular, as shown in Figure 6, the diamond piece 3 has a chip collection groove 2, and the chips generated during the cutting process can enter the chip collection groove 2, thus preventing the chips from affecting subsequent cutting processes and further improving dressing accuracy.

[0046] Referring to Figures 5 and 6, the shape of the chip collection groove 2 can be arbitrarily set, as long as it is ensured that the chip collection groove 2 is a blind hole (a through hole would break the connection between the diamond piece 3 and the diamond tray). Preferably, the chip collection groove 2 is opened on the upper surface of the diamond piece 3 and the bottom of the projection 31, that is, it is preferable that the chip collection groove 2 is provided between each projection 31, so that the convex edge on the projection 31 is aligned with the chip collection groove 2, which is advantageous for chips to fall into, although of course it can be provided in other positions as well. Because of the large wear, the diamond piece 3 is generally discarded after 50 hours of use, so there is no need to clean the air-blocking particles in the chip collection groove 2.

[0047] In this embodiment, the diamond piece 3 is described as having a rectangular shape, but of course, a circular shape or any other arbitrary shape can also be used. By diversifying the types of diamond pieces 3, it is possible to manufacture the diamond pieces 3 in corresponding shapes to meet the needs, thus improving practicality as it is no longer limited to a single shape.

[0048] This embodiment further includes a diamond tray (not shown), the diamond tray is attached to the disc 1, and the diamond pieces 3 are attached to the diamond tray. Both the method for connecting the diamond tray and the diamond pieces 3 can be adhesive (using a corrosion-resistant epoxy resin adhesive). By utilizing the diamond tray, the amount of diamond used can be significantly reduced.

[0049] To explain in more detail, when the diamond piece 3 is directly bonded to the disc 1, a relatively thick diamond piece 3 is often used to ensure that the diamond piece 3 protrudes from the surface of the disc 1 and to consider the cause of fracture due to stress. On the other hand, when the diamond tray is designed with a circular, shallow groove structure, a thinner diamond piece 3 can be selected and processed, and since the bottom of the diamond piece 3 is protected by the diamond tray, it is more stable than the direct bonding structure. Therefore, the dressing effect of the polishing pad is ensured, and the amount of CVD diamond used can be reduced.

[0050] The material of the disc 1 and the diamond tray is preferably stainless steel, but of course, other materials that meet the requirements can be selected depending on the actual situation, and specific examples will not be given in this embodiment.

[0051] The implementation principle of the high-precision dressing tool according to the embodiment of the present invention is as follows. First, by adopting a multi-layered tower structure for the projections 31 on the diamond piece 3, the number of horizontal edges 4 and side edges 5 of the projections 31 can be increased, and the side edges 5 are distributed in multiple directions, thereby improving the cutting ability and making it easier to cut cleanly. Next, the projections 31 adopt the arrangement and cooperation of large towers 313 and small towers 314, and the combination of large towers 313 and small towers 314 allows for the clean scraping of remaining chips in the large and small grooves, and minimizes the change in the roughness of the polishing pad. This improves the dressing ability of the dresser and, consequently, the dressing accuracy of the dresser. Finally, the chip collection groove 2 is further widened so that chips generated during the cutting process can enter the chip collection groove 2, thereby preventing chips from affecting subsequent cutting processes and improving dressing accuracy.

[0052] The embodiments of the present application further disclose a method for manufacturing a high-precision dressing tool, the method for manufacturing a high-precision dressing tool comprising S1 to S11.

[0053] In Season 1, you cultivate rough diamonds.

[0054] S1 belongs to diamond growth technology, that is, growing a rough diamond under specific temperature and pressure conditions. The growth of the rough diamond belongs to process technology well known to those skilled in the art and will not be specifically described in this embodiment.

[0055] In S2, edge finishing and slicing are performed using a laser.

[0056] In S3, the rough diamond is thinned.

[0057] In S4, rough diamonds are processed with a laser to the required dimensions.

[0058] In S5, the edges are chamfered using a laser.

[0059] S2 to S4 belong to laser processing technology, which is a process technology well known to those skilled in the art and will not be specifically described in this embodiment.

[0060] In S6, the semi-finished diamond pieces 3 are bonded to the diamond tray.

[0061] The diamond pieces 3 can be connected to the diamond tray using a highly corrosion-resistant epoxy resin adhesive, and of course, welding can also be used.

[0062] In S7, glue the diamond tray to disc 1.

[0063] Similarly, the diamond tray can be connected to the disc 1 using a corrosion-resistant epoxy resin adhesive, and of course, welding can also be used.

[0064] In S8, the entire surface of the diamond pieces (3) and the disc (1) is polished.

[0065] Polishing is a surface processing technique and a process technique well known to those skilled in the art, and will not be specifically described in this embodiment.

[0066] In S9, the protrusion 31 is engraved using a laser.

[0067] Depending on the actual needs, the shape of the required protrusions 31 is engraved according to the predetermined number of layers, step width, and step height.

[0068] In step S10, a sealing agent treatment is performed.

[0069] In S11, the product is washed and packaged.

[0070] In the first step, rough diamonds are grown to the required size; in the second step, the edges of the rough diamonds are cut to the required dimensions to meet the standard dimensions; in the third step, the rough diamonds are cut in the thickness direction; in the fourth step, the rough diamonds are processed to the required dimensions using a laser; in the fifth step, the edges are chamfered using a laser; in the sixth step, the semi-finished diamond pieces 3 are bonded to the diamond tray; in the seventh step, the diamond tray is bonded to the disc 1; in the eighth step, the diamond pieces 3 and disc 1 are polished overall; in the ninth step, the required protrusions 31 are engraved using a laser; in the tenth step, the diamond pieces 3 are treated with a sealant; and finally, the entire assembly is cleaned and packaged. This allows for the production of appropriate discs 1, diamond trays, and diamond pieces 3 according to the actual situation, and the processing is simple and convenient.

[0071] The above are all preferred embodiments of the present application and do not limit the scope of protection of the present application. Therefore, equivalent modifications made in accordance with the structure, shape, and principle of the present application should all be included within the scope of protection of the present application. [Explanation of Symbols]

[0072] 1…Disc, 2... Shavings collection groove, 3... Diamond fragments, 31...protrusion, 311... Cut layer structure, 312... Connection surface, 313...Ōtō, 314...small tower, 4…Horizontal edge, 5... Side edge.

Claims

1. The device comprises a disc (1) and a plurality of diamond pieces (3), the plurality of diamond pieces (3) all being provided on the disc (1) and distributed at intervals along the axis of the disc (1), the diamond pieces (3) having projections (31) formed thereon, the projections (31) being tower-shaped and having a multilayer structure, each layer of the projection (31) having a horizontal edge (4) and an inclined side edge (5) formed thereon. The projection (31) includes a plurality of shaved layer structures (311), the cross-sectional area of ​​the shaved layer structures (311) gradually decreases in the direction away from the diamond piece (3) along the direction in which the projection (31) and the diamond piece (3) are in contact, the bottom surface of the upper shaved layer structure (311) and the top surface of the lower shaved layer structure (311) are in contact, and a connecting surface (312) is formed between the periphery of the top surface of the lower shaved layer structure (311) and the periphery of the bottom surface of the upper shaved layer structure (311). The projection (31) includes a large tower (313) and a small tower (314), the cross-section of the large tower (313) located in the same layer-cut structure (311) is larger than the cross-section of the small tower (314) located in the same layer-cut structure (311), both the large tower (313) and the small tower (314) are provided in multiples, the large tower (313) and the small tower (314) are distributed alternately, the distance between the top of the large tower (313) and the surface of the diamond piece (3) is greater than or equal to the distance between the top of the small tower (314) and the surface of the diamond piece (3), the height of the large tower (313) is 0.04 to 2 mm, the height of the small tower (314) is 0.03 to 2 mm, and the distance between the center point of the large tower (313) and the center point of the small tower (314) is in the range of 0.1 to 4 mm. A dressing tool characterized by the following.

2. The shape of the large tower (313) is the same as the shape of the small tower (314). The dressing tool according to feature 1.

3. The number of the aforementioned shaved layer structure (311) is 2 to 1000 layers. The dressing tool according to feature 1.

4. The diamond piece (3) has a chip collection groove (2) which is a blind hole. The dressing tool according to feature 1.

5. The chip collection groove (2) is opened on the upper surface of the diamond piece (3) and at the bottom of the projection (31). The dressing tool according to feature 4.

6. The shape of the diamond piece (3) is circular, rectangular, or square. The dressing tool according to feature 1.

7. The present invention further includes a diamond tray mounted on the disc (1), wherein the diamond pieces (3) are located on the diamond tray. The dressing tool according to feature 1.

8. A method for manufacturing a dressing tool according to any one of claims 1 to 7, Step S1 for growing a rough diamond, Step S2 involves performing edge treatment and slicing with a laser, Step S3, which thins the rough diamond, Step S4 involves laser-processing a rough diamond to the required dimensions, Step S5 involves chamfering with a laser, Step S6 involves bonding the semi-finished diamond pieces (3) to the diamond tray, Step S7 involves gluing the diamond tray to the disc (1), Step S8 involves polishing the entire diamond piece (3) and the disc (1), Step S9 involves engraving a protrusion (31) with a laser, Step S10 involves performing a sealing agent treatment, Step S11 includes washing and packaging, A method for manufacturing a dressing tool characterized by the following.

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