A coating composition for strengthening PCB substrate glass, and PCB substrate glass manufactured using the same.

Abstract

The present invention provides a strength-enhancing coating composition for preventing damage caused by stress imbalances and impacts that occur during the manufacturing process of PCB substrates for packaging, and PCB substrate glass manufactured using the same, and relates to a PCB substrate glass strengthening coating composition comprising a compound represented by chemical formula 1, silica, a water-soluble organic solvent, and water, and PCB substrate glass manufactured using the same.

Description

[Technical Field]

[0001] The present invention relates to a coating agent composition used to form a coating film for reinforcing the strength of glass used in semiconductor packaging printed circuit boards (PCBs), and to a method for manufacturing a coating film using the coating agent composition. [Background technology]

[0002] The process of realizing circuits on a semiconductor wafer is called the front-end process (FE), and the process of assembling the wafer into a state where it can be used in an actual product is called the back-end process (BE). The packaging process is included in the back-end process. Recently, four core technologies in the semiconductor industry that have enabled the rapid power generation of electronic products are semiconductor technology, semiconductor packaging technology, manufacturing process technology, and software technology. Semiconductor technology has developed in various forms, such as line widths in the micro and nano units, more than tens of millions of cells, high-speed operation, and significant heat dissipation, but relatively speaking, the technology to perfectly package these is not yet fully established. For this reason, the electrical performance of a semiconductor is determined more by the packaging technology and electrical connections than by the performance of the semiconductor technology itself. Ceramic or resin materials are used for packaging substrates. In the case of ceramic materials, high resistance or high dielectric constant makes it difficult to mount high-performance high-frequency semiconductor elements. In the case of resin materials, it is relatively possible to mount high-performance high-frequency semiconductor elements, but there are limitations to reducing the wiring pitch. In recent years, research has been underway on the application of silicone and glass as materials for packaging PCB substrates. In particular, glass has electrical insulating properties, strong thermal resistance, and chemically stable attributes, making it stable in a variety of environments. Substrate glass manufactured with these properties possesses excellent thermal conductivity, effectively dissipating heat generated in high-temperature operating environments and helping to stabilize the temperature of components on printed circuit boards (PCBs). Substrate glass is also an insulator, preventing interference between different electrical signal paths and enabling more accurate and stable signal transmission. There are various types of substrate glass, with silicate glass and borosilicate glass being the most commonly used. Each type is selected according to its purpose and possesses specific physical, electrical, and chemical properties.

[0003] By forming through-holes in the substrate glass and applying a conductive material to these holes, the wiring length between the element and the motherboard can be shortened, resulting in superior electrical characteristics. Substrate glass used for packaging is manufactured by first producing a thin, uniform glass base sheet, and then cutting it into the desired shape using a laser. During the cutting process described above, pressure or heat changes occur along the cut surface of the substrate glass, which degrades the quality of the surface or edges of the substrate glass, leading to a decrease in the durability of the substrate glass. Furthermore, during the packaging process with the cut substrate glass, vibrations or shocks accumulate stress, causing cracks to form at the edges that were degraded during the cutting process, resulting in a decrease in the manufacturing yield of the packaging process. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Korean Registered Patent Publication No. 10-1133695 [Patent Document 2] Korean Registered Patent Publication No. 10-1441563 [Patent Document 3] Korean Registered Patent Publication No. 10-1749174 [Patent Document 4] Korean Registered Patent Publication No. 10-2188211 [Overview of the project] [Problems that the invention aims to solve]

[0005] The present invention aims to solve these problems by providing a strength-enhancing coating composition and coating method for preventing damage caused by stress imbalances and impacts that occur during the manufacturing process of a PCB substrate for packaging that uses a substrate glass. [Means for solving the problem]

[0006] To achieve the above objective, the present invention provides a coating agent composition characterized by comprising a compound represented by the following chemical formula 1, silica, a water-soluble organic solvent, and water. [Chemical formula 1] [ka] [In the formula, n is an integer selected from 15 to 100. R is C 1~6 Aldehydes; hydroxy, alkoxy, alkylcarboxy, oxiranes, i.e., epoxy-substituted C 1~6 C substituted with alkyl or OR' group 1~6 It is alkyl (where R' is C 2~6 C substituted with aldehyde, or hydroxy, alkyloxy, alkylcarboxy or oxirane 1~6 (It is alkyl.) R1 is a hydroxyl, alkoxy, or R group. In a preferred embodiment of the present invention, the coating composition for strengthening PCB substrate glass further comprises an acid catalyst and a nonionic surfactant. In a preferred embodiment of the present invention, the silica is not particularly limited, but is characterized by being fumed silica, which has hydroxyl groups bonded to its surface and exhibits hydrophilicity, as shown in the figure below. JPEG2026523158000002.jpg2933

[0007] In a preferred embodiment of the present invention, the water-soluble organic solvent is characterized by being one or more selected from the group consisting of methyl alcohol, ethyl alcohol, benzyl alcohol, isopropyl alcohol, isoamyl alcohol, isopropyl alcohol, pentyl alcohol, isobutyl alcohol, butyl alcohol, cetyl alcohol, lauryl alcohol, nonyl alcohol, undecyl alcohol, propylene glycol monomethyl ether, and propylene glycol monomethyl ether acetate. In a preferred embodiment of the present invention, the acid catalyst is characterized by being one or more selected from the group consisting of sulfuric acid, hydrochloric acid, sodium nitrate, potassium nitrate, nitric acid, potassium chromate, nitrite, perchloric acid, phosphoric acid, and acetic acid. In one preferred embodiment of the present invention, the nonionic surfactant is characterized by being one or more selected from the group consisting of polyoxyethylene alkylphenyl ether, polyoxyethylene alkyl ether, polyoxyethylene glycol fatty acid ester, oxypropylene-oxyethylene block copolymer, polyoxyethylene glycol, polyoxyethylene alkylamine ether, polyoxyalkylene glycol monoalkyl ether, polyoxyalkylene, and polyoxyalkylene alkyl ether. In a preferred embodiment of the present invention, the coating composition for strengthening PCB substrate glass is characterized by containing 20-30% by weight of the compound represented by chemical formula 1, 1-10% by weight of silica, and 50-70% by weight of a water-soluble organic solvent, with the remainder being water, based on the total weight of the composition. In a preferred embodiment of the present invention, the coating composition for strengthening PCB substrate glass is characterized by further comprising 0.5 to 1% by weight of an acid catalyst and 1 to 4% by weight of a nonionic surfactant, based on the total weight of the composition. In a preferred embodiment of the present invention, the PCB substrate glass strengthening coating composition is characterized in that it is for packaging substrate glass. In another embodiment, the present invention provides a PCB substrate glass strengthening coating film obtained by coating the edges of the substrate glass with the PCB substrate glass strengthening coating composition and then curing it.

[0008] The present invention provides a method for manufacturing a packaging substrate glass, which includes wet coating of the substrate glass with the PCB substrate glass strengthening coating composition of the present invention. There are no particular limitations on the method for the wet coating described above. For example, after performing dip coating, spin coating, brush coating, roll coating, or spray coating, the coated film is cured by heating. Heating can be performed by any method, but it is generally done using an electric furnace or an air heating furnace. Depending on the properties of the substrate glass, the coating agent of the present invention forms a sufficiently cured film within one hour by heating at a temperature of usually 100 to 300°C, preferably 110 to 150°C. After the coating film has hardened, the substrate glass is usually cooled slowly to complete the coating process. The heating or cooling temperature pattern is not particularly limited, but it is common to change the temperature within a range that does not cause thermal shock to the substrate glass and the coating film due to rapid temperature changes. [Effects of the Invention]

[0009] The present invention provides a compound for use as a strength-reinforcing coating agent, which is used to coat a substrate glass with a thin film thickness of several micrometers, thereby providing a strength-reinforcing coating agent that prevents cracking due to stress imbalance and impact. Therefore, when the coating composition of the present invention is applied to PCB substrate glass for semiconductor packaging, it is possible to prevent cracks in the substrate glass that occur during the packaging process, thereby improving the production yield and enhancing the quality level.

Best Mode for Carrying Out the Invention

[0010] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood in the art. In general, the nomenclature used herein is well known and commonly used in the art. Throughout this specification, when a part states that a certain component "includes", this means that it can further include other components without excluding other components, unless otherwise stated to the contrary. One embodiment of the present invention provides a coating composition and a coating method for glass reinforcement of a PCB substrate, which includes a compound represented by the following Chemical Formula 1, silica, a water-soluble organic solvent, and water. [Chemical Formula 1]

Chem.

[0011] In this case, in the compound represented by chemical formula 1, it is preferable that n is an integer selected from 25 to 75. If n is less than 25 in the compound represented by chemical formula 1, there is a high risk that the impact resistance of the coating film for strengthening PCB substrate glass will decrease, and if n is greater than 75, the viscosity will increase, the fluidity will decrease and the coating properties will decrease, and the intermolecular interactions will be strengthened and the adhesion between the substrate glass and the coating film may decrease, which is undesirable for PCB substrate glass strengthening coating applications. As described above, if the impact resistance of the coating film used to strengthen the glass on PCB substrates decreases, its durability will be poor, and the effect of the coating on PCB substrates cannot be maintained for a long period of time. If the viscosity increases, the coating properties will decrease, and a uniform coating film cannot be obtained. Therefore, in order to improve impact resistance, it is important that durability is maintained at a low viscosity. According to a preferred embodiment of the present invention, the coating composition for strengthening PCB substrate glass may further contain an acid catalyst and a nonionic surfactant.

[0012] The aforementioned coating composition for strengthening PCB substrate glass may contain 20-30% by weight of the compound represented by chemical formula 1, 1-10% by weight of silica, and 50-70% by weight of a water-soluble organic solvent, with the remainder being water, based on the total weight of the composition. Preferably, the compound represented by chemical formula 1 is present in an amount of 20 to 30% by weight relative to the total weight of the composition. If the amount of the compound represented by chemical formula 1 is less than 20% by weight, it is undesirable because it is difficult to ensure an appropriate thickness of the coating film for strengthening the PCB substrate glass. If it exceeds 50% by weight, the coating film becomes too thick, making it difficult to obtain appropriate coating uniformity and requiring additional dilution, which is also undesirable. The thickness of the glass-reinforced coating film for PCB substrates can be adjusted by the molecular weight and content of the compound represented by chemical formula 1. In the case of the glass-reinforced coating film of the present invention, a thickness of 1 to 10 μm is appropriate. If the glass-reinforced coating film is less than 1 μm, there is a high risk of reduced impact resistance, and if the glass-reinforced coating film is more than 10 μm, there is a risk of reduced uniformity of the coating film, which is undesirable. The silica is preferably present in an amount of 1 to 10% by weight relative to the total weight of the composition. If the silica content is less than 1% by weight, the impact resistance of the coating film may decrease, and if the silica content exceeds 10% by weight, the viscosity of the coating composition may increase and its fluidity may decrease. The aforementioned water-soluble organic solvent is preferably present in an amount of 50 to 70% by weight relative to the total weight of the composition. If the water-soluble organic solvent is used in an amount of less than 50% by weight, the solid content relative to the overall composition will be high, making it difficult to obtain appropriate uniformity of the coating film. If the water-soluble organic solvent is used in an amount exceeding 70% by weight, the solid content relative to the overall composition will be low, which may reduce the impact resistance, and is therefore undesirable.

[0013] The aforementioned water-soluble organic solvent may be a compound selected from the group consisting of methyl alcohol, ethyl alcohol, benzyl alcohol, isopropyl alcohol, isoamyl alcohol, isopropyl alcohol, pentyl alcohol, isobutyl alcohol, butyl alcohol, cetyl alcohol, lauryl alcohol, nonyl alcohol, undecyl alcohol, propylene glycol monomethyl ether, and propylene glycol monomethyl ether acetate, or a mixture of two or more of these. The aforementioned coating composition for strengthening PCB substrate glass may further contain 0 to 1% by weight of an acid catalyst and 1 to 4% by weight of a nonionic surfactant, based on the total weight of the composition. The acid catalyst is preferably present in an amount of 0.5 to 1% by weight relative to the total weight of the composition. If the acid catalyst is used in an amount exceeding 1% by weight, it is undesirable because the bonding between the compounds represented by chemical formula 1 increases, leading to a decrease in the uniformity of the coating film due to increased viscosity. The acid catalyst may be a compound selected from the group consisting of sulfuric acid, hydrochloric acid, sodium nitrate, potassium nitrate, nitric acid, potassium chromate, nitrite, perchloric acid, phosphoric acid, and acetic acid, or a mixture of two or more of these. The nonionic surfactant is preferably present in an amount of 1 to 4% by weight relative to the total weight of the composition. Using more than 4% by weight of the nonionic surfactant is undesirable because it results in poor impact resistance of the coating film. The nonionic surfactant may be a compound selected from the group consisting of polyoxyethylene alkylphenyl ether, polyoxyethylene alkyl ether, polyoxyethylene glycol fatty acid ester, oxypropylene-oxyethylene block copolymer, polyoxyethylene glycol, polyoxyethylene alkylamine ether, polyoxyalkylene glycol monoalkyl ether, polyoxyalkylene styrene phenyl ether, and polyoxyalkylene alkyl ether, or a mixture of two or more of these. The aforementioned coating composition for strengthening PCB substrate glass can be usefully applied to packaging substrates. As described above, by forming a coating film with the PCB substrate glass strengthening coating composition provided by the present invention, a coating film with excellent impact resistance can be provided.

[0014] The present invention will be described in more detail below through examples. It will be obvious to those ordinary skill in the art that these examples are for illustrative purposes only and should not be construed as limiting the present invention. [Examples 1 to 33 and Comparative Example 1] Example 1 A coating composition for strengthening PCB substrate glass was prepared by mixing 20.0 g of the compound represented by the following chemical formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 19.5 g of water. [Chemical formula 1] [ka] Example 2 A coating composition for strengthening PCB substrate glass was prepared by mixing 20.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 19.5 g of water. After storing the above-mentioned PCB substrate glass strengthening coating composition in a room maintained at 23°C±2°C for 6 hours to maintain the composition's temperature at 23°C±2°C, packaging PCB substrate glass (Corning EAGLE nG; width: 50 mm, length: 50 mm, thickness: 0.4 mm), which had been cleanly pre-treated without any contaminants on its surface, was slowly dipped into a water bath containing the coating composition using a dip coating method for 1 minute. After slowly removing the substrate glass, it was heated and cured in an oven heated to 110°C for 60 minutes, and then cooled at room temperature for 10 minutes. Ten glass specimens were prepared from each of these specimens, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm.

[0015] Example 3 A coating composition for strengthening PCB substrate glass was prepared by mixing 20.0 g of the compound represented by the above chemical formula 1 (n=50, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 19.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 4 A coating composition for strengthening PCB substrate glass was prepared by mixing 20.0 g of the compound represented by the above chemical formula 1 (n=75, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 19.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 5 A coating composition for strengthening PCB substrate glass was prepared by mixing 20.0 g of the compound represented by the above chemical formula 1 (n=100, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 19.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm.

[0016] Example 6 A coating composition for strengthening PCB substrate glass was prepared by mixing 20.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, 0.5 g of nitric acid, and 1.0 g of oxypropylene-oxyethylene block copolymer with 18.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 7 A coating composition for strengthening PCB substrate glass was prepared by mixing 20.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, 0.5 g of nitric acid, and 3.0 g of oxypropylene-oxyethylene block copolymer with 16.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 8 A coating composition for strengthening PCB substrate glass was prepared by mixing 20.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 18.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 9 A coating composition for strengthening PCB substrate glass was prepared by mixing 20.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 3 g of silica, 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 16.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm.

[0017] Example 10 A coating composition for strengthening PCB substrate glass was prepared by mixing 20.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethyl alcohol, 0.5 g of nitric acid, and 1.0 g of oxypropylene-oxyethylene block copolymer with 17.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 11 A coating composition for strengthening PCB substrate glass was prepared by mixing 20.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 3 g of silica, 60.0 g of ethyl alcohol, 0.5 g of nitric acid, and 3.0 g of oxypropylene-oxyethylene block copolymer with 13.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 12 A coating composition for strengthening PCB substrate glass was prepared by mixing 25.0 g of the compound represented by the above chemical formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 14.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 13 A coating composition for strengthening PCB substrate glass was prepared by mixing 25.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 14.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm.

[0018] Example 14 A coating composition for strengthening PCB substrate glass was prepared by mixing 25.0 g of the compound represented by the above chemical formula 1 (n=50, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 14.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 15 A coating composition for strengthening PCB substrate glass was prepared by mixing 25.0 g of the compound represented by the above chemical formula 1 (n=75, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 14.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 16 A coating composition for strengthening PCB substrate glass was prepared by mixing 25.0 g of the compound represented by the above chemical formula 1 (n=100, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 14.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 17 A coating composition for strengthening PCB substrate glass was prepared by mixing 25.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, 0.5 g of nitric acid, and 1.0 g of oxypropylene-oxyethylene block copolymer with 13.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm.

[0019] Example 18 A coating composition for strengthening PCB substrate glass was prepared by mixing 25.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, 0.5 g of nitric acid, and 3.0 g of oxypropylene-oxyethylene block copolymer with 11.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 19 A coating composition for strengthening PCB substrate glass was prepared by mixing 25.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 13.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 20 A coating composition for strengthening PCB substrate glass was prepared by mixing 25.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 3 g of silica, 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 11.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm.

[0020] Example 21 A coating composition for strengthening PCB substrate glass was prepared by mixing 25.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethyl alcohol, 0.5 g of nitric acid, and 1.0 g of oxypropylene-oxyethylene block copolymer with 12.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 22 A coating composition for strengthening PCB substrate glass was prepared by mixing 25.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 3 g of silica, 60.0 g of ethyl alcohol, 0.5 g of nitric acid, and 3.0 g of oxypropylene-oxyethylene block copolymer with 8.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 23 A coating composition for strengthening PCB substrate glass was prepared by mixing 30.0 g of the compound represented by the above chemical formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 9.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 24 A coating composition for strengthening PCB substrate glass was prepared by mixing 30.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 9.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm.

[0021] Example 25 A coating composition for strengthening PCB substrate glass was prepared by mixing 30.0 g of the compound represented by the above chemical formula 1 (n=50, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 9.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 26 A coating composition for strengthening PCB substrate glass was prepared by mixing 30.0 g of the compound represented by the above chemical formula 1 (n=75, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 9.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 27 A coating composition for strengthening PCB substrate glass was prepared by mixing 30.0 g of the compound represented by the above chemical formula 1 (n=100, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 9.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 28 A coating composition for strengthening PCB substrate glass was prepared by mixing 30.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, 0.5 g of nitric acid, and 1.0 g of oxypropylene-oxyethylene block copolymer with 8.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm.

[0022] Example 29 A coating composition for strengthening PCB substrate glass was prepared by mixing 30.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethyl alcohol, 0.5 g of nitric acid, and 3.0 g of oxypropylene-oxyethylene block copolymer with 6.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 30 A coating composition for strengthening PCB substrate glass was prepared by mixing 30.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 8.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 31 A coating composition for strengthening PCB substrate glass was prepared by mixing 30.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 3 g of silica, 60.0 g of ethyl alcohol, and 0.5 g of nitric acid with 6.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Example 32 A coating composition for strengthening PCB substrate glass was prepared by mixing 30.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethyl alcohol, 0.5 g of nitric acid, and 1.0 g of oxypropylene-oxyethylene block copolymer with 7.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm.

[0023] Example 33 A coating composition for strengthening PCB substrate glass was prepared by mixing 30.0 g of the compound represented by the above chemical formula 1 (n=25, R=OCH3, R1=OH), 3 g of silica, 60.0 g of ethyl alcohol, 0.5 g of nitric acid, and 3.0 g of oxypropylene-oxyethylene block copolymer with 3.5 g of water. Ten glass specimens were prepared by coating them with the PCB substrate glass strengthening coating composition manufactured as described above, using the same method as in Example 1, and their properties were analyzed. The thickness of the coating film, measured using an ellipsometer (HORIBA, UVISEL), was 5 μm. Comparative Example 1 Corning's "EAGLE nG" was used as the bare glass. [Measurement of impact strength characteristics (GIT, Glass Impact Test)] To prevent the scattering of glass fragments when the substrate glass is shattered by the drop weight, glass specimens prepared in polyethylene bags (less than 0.1 mm thick) were mounted on the lower fixture (ring outer diameter 50.8 mm, inner diameter 25.4 mm) of a glass impact tester (CKSI, E602SS). A steel ball (diameter 12.0 mm) was then attached to the top of the substrate glass so that it aligned with the lower end of the rail section. A 60 g aluminum weight was then raised in 5 cm increments, and the height (cm) before shattering was recorded.

[0024] The impact resistance height of the glass specimens from Examples 1 to 33 and Comparative Example 1 was measured, and the results are shown in Table 1. Five specimens of each glass specimen were evaluated, and the average of the five values ​​was recorded. [Table 1] Compared to the bare glass of Comparative Example 1, the fracture height of Examples 1 to 33 prepared according to the present invention was significantly higher, confirming superior resistance to external impacts.

[0025] [Measurement of Pen Drop Characteristics] To prevent the scattering of broken glass fragments, the glass specimens from Examples 1-33 and Comparative Example 1 were mounted on a metal (SUS) plate. A ballpoint pen manufactured by "BIC" (BIC Big Orange Ballpoint Pen 0.7mm, weight including cap: 5.7g) was then dropped vertically at 1cm intervals, with the cap still inserted behind the pen and the pointed tip of the pen facing the top surface of the mounted glass specimen. The height just before the glass specimen broke was recorded to confirm its crack prevention characteristics. The height just before the break of the glass specimens from Examples 1-33 and Comparative Example 1 was measured, and the results are shown in Table 2. Five specimens of each glass specimen were evaluated, and the average of the five values ​​was recorded. [Table 2]

[0026] Compared to the bare glass of Comparative Example 1, the fracture height of Examples 1 to 33 prepared according to the present invention was significantly higher, confirming superior resistance to external impacts. As described above, it was found that PCB substrate glass for semiconductor packaging coated with the PCB substrate glass strengthening coating composition of the present invention significantly reduced cracking due to external impact during the manufacturing process compared to uncoated PCB substrate glass for semiconductor packaging. Therefore, the PCB substrate glass strengthening coating composition of the present invention was evaluated as making a significant contribution to stabilizing the semiconductor packaging process using substrate glass.

Claims

1. The compound represented by the following chemical formula 1, Silica and, Water-soluble organic solvents, A coating composition for strengthening PCB substrate glass, comprising water. [Chemical formula 1] 【Chemistry 1】 [In the formula, n is an integer selected from 25 to 50. R is C １～６ Aldehydes; hydroxy, alkoxy, alkylcarboxy, oxiran, i.e., epoxy-substituted C １～６ Alkyl; or C substituted with an OR' group １～６ It is alkyl (where R' is C) ２～６ C substituted with aldehyde, or hydroxy, alkyloxy, alkylcarboxy or oxirane １～６ (It is alkyl.) R １ [The group is a hydroxyl, alkoxy, or R group.]

2. The PCB substrate glass strengthening coating composition according to claim 1, characterized in that it contains 20 to 30% by weight of the compound represented by chemical formula 1, 1 to 10% by weight of silica, 50 to 70% by weight of a water-soluble organic solvent, and 50 to 70% by weight of a water-soluble organic solvent, with the remainder being water.

3. The coating composition for strengthening PCB substrate glass according to claim 2, characterized in that the silica is fumed silica, which has hydroxyl groups bonded to it and exhibits hydrophilicity.

4. The coating composition for strengthening PCB substrate glass according to claim 2, characterized in that the water-soluble organic solvent is a compound selected from the group consisting of methyl alcohol, ethyl alcohol, benzyl alcohol, isopropyl alcohol, isoamyl alcohol, isopropyl alcohol, pentyl alcohol, isobutyl alcohol, butyl alcohol, cetyl alcohol, lauryl alcohol, nonyl alcohol, undecyl alcohol, propylene glycol monomethyl ether, and propylene glycol monomethyl ether acetate, or a mixture of two or more of these.

5. The PCB substrate glass strengthening coating composition according to claim 2, further comprising an acid catalyst.

6. The coating composition for strengthening PCB substrate glass according to claim 5, characterized in that the acid catalyst is contained in an amount of 0.5 to 1% by weight relative to the total weight of the composition.

7. The coating composition for strengthening PCB substrate glass according to claim 6, characterized in that the acid catalyst is a compound selected from the group consisting of sulfuric acid, hydrochloric acid, sodium nitrate, potassium nitrate, nitric acid, acetic acid, potassium chromate, nitrite, perchloric acid, phosphoric acid, and acetic acid, or a mixture thereof.

8. The PCB substrate glass strengthening coating composition according to claim 2, further comprising a nonionic surfactant.

9. The coating composition for strengthening PCB substrate glass according to claim 8, characterized in that the nonionic surfactant is contained in an amount of 1 to 4% by weight relative to the total weight of the composition.

10. The coating composition for strengthening PCB substrate glass according to claim 9, characterized in that the nonionic surfactant is a compound selected from the group consisting of polyoxyethylene alkylphenyl ether, polyoxyethylene alkyl ether, polyoxyethylene glycol fatty acid ester, oxypropylene-oxyethylene block copolymer, polyoxyethylene glycol, polyoxyethylene alkylamine ether, polyoxyalkylene glycol monoalkyl ether, polyoxyalkylene, and polyoxyalkylene alkyl ether, or a mixture of two or more of these.

11. A PCB substrate glass manufactured by coating at least one surface of a PCB substrate glass for semiconductor packaging with the PCB substrate glass strengthening coating composition according to any one of claims 1 to 10, and then curing it.

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