Process temperature sensor with improved thermal insulation
The temperature sensor assembly addresses thermal gradient and environmental exposure issues by using elastomer rings for thermal insulation, enhancing measurement accuracy and reducing manufacturing complexity.
Patent Information
- Application Number
- JP2025574326
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-06-21
- Filing Date
- 2024-06-13
- Publication Date
- 2026-07-13
AI Technical Summary
Existing surface-mount temperature sensors for low-temperature measurements face challenges in maintaining accurate readings due to thermal gradients and environmental exposure, leading to inaccuracies and increased manufacturing complexity and cost.
The temperature sensor assembly incorporates elastomer rings to provide thermal insulation between the sensor housing and the cap, allowing for flexible contact with the measured surface while maintaining constant pressure, thereby reducing heat transfer and improving measurement accuracy.
The solution enhances thermal insulation and maintains consistent contact with the measured surface, reducing inaccuracies and manufacturing complexity, thus improving measurement accuracy and flexibility.
Smart Images

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