Liquid material vaporization system

The liquid material vaporization system addresses residual liquid and contamination issues by incorporating a purge and exhaust gas treatment system, enhancing vaporization efficiency and environmental safety in semiconductor manufacturing.

JP2026523264APending Publication Date: 2026-07-13BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
JP2026500154
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-07-14
Filing Date
2024-07-12
Publication Date
2026-07-13

AI Technical Summary

Technical Problem

Existing liquid-state process media vaporization methods in semiconductor manufacturing face issues such as residual liquid in pipelines, limited applicability due to high heat resistance limitations, and environmental contamination from unvaporized media.

Method used

A liquid material vaporization system with a purge pipeline, control units, and exhaust gas treatment pipeline to manage vaporization, purge, and exhaust processes, reducing residual liquid and contaminants.

Benefits of technology

Effectively vaporizes liquid media, minimizes pipeline residue, and prevents environmental pollution by treating contaminants, ensuring safe and efficient semiconductor processing.

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Abstract

This application provides a liquid material vaporization system applicable to semiconductor process equipment. The system includes a vaporizer 20, a liquid material pipeline 10, a purge pipeline 40, a first control unit 50, a delivery pipeline 30, an exhaust gas treatment pipeline 62, and a second control unit 70, wherein the first control unit 50 selectively controls the purge pipeline 40 or the liquid material pipeline 10 to communicate with the vaporizer, and the second control unit 70 selectively controls the exhaust gas treatment pipeline 62 or the delivery pipeline 30 to communicate with the vaporizer.
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