Electronic devices including acoustic tubes

Abstract

The present invention provides an electronic device that includes an acoustic tube with improved audio signal quality. [Solution] The electronic device according to the present invention includes a frame comprising a first frame part and a second frame part coupled to the first frame part and comprising an audio hole; a display comprising a first portion supported by the first frame part and a second portion extending from the first portion in a first direction and covered by the second frame part; a speaker positioned in the frame and an acoustic conduit connecting the space in front of the speaker and the audio hole, penetrating at least a portion of the frame and separated by at least a portion of the first frame part from the space in which the second portion is located.

Description

Technical Field

[0004] , , ,

[0001] The present invention relates to an electronic device including an acoustic pipeline.

Background Art

[0002] An electronic device can include a speaker for providing an audio signal and a display for providing visual information. Sound waves generated from the speaker are transmitted to an audio hole along an acoustic pipeline inside the electronic device. To connect the speaker and the audio hole inside the electronic device, a part of the acoustic pipeline is formed as an empty space inside the electronic device. The display is electrically connected to electronic components (e.g., a display driving circuit and / or a printed circuit board) for driving the display.

[0003] The above information is provided as background art for the purpose of assisting the understanding of the present invention. No claim or determination is made regarding whether any of the above contents are applied as prior art in relation to the present invention.

Summary of the Invention

Means for Solving the Problems

[0004] An electronic device is provided. The electronic device includes a frame comprising a first frame part and a second frame part coupled to the first frame part and comprising an audio hole. The electronic device includes a display comprising a first portion in contact with a display panel comprising a plurality of pixels, a second portion opposite to the first portion and connected to a display driver circuit configured to control the display panel, and a third portion connecting the first portion and the second portion, projecting from the first portion in a first direction and covered by the second frame part. The electronic device includes a speaker disposed within the frame. The electronic device includes an acoustic conduit connecting the space in front of the speaker within the frame to the audio hole, penetrating at least a portion of the frame, and separated by at least a portion of the first frame part from the space in which the second portion is located. The acoustic conduit is characterized in that it is separated by at least a portion of the first frame part from the space in which the third portion is located.

[0005] An electronic device is provided. The electronic device includes a housing that includes a first housing part and a second housing part that is movably coupled to the first housing part in a first direction and a second direction opposite to the first direction and includes an audio hole. The electronic device includes a display that includes a first portion supported by the second housing part and a second portion extending from the first portion in the first direction and covered by the second housing part. The electronic device includes a speaker located in the second housing part. The electronic device includes an acoustic conduit connecting the space in front of the speaker and the audio hole. The electronic device is characterized by including a plate at least partially positioned between the acoustic conduit and the space in which the second portion is located, so as to separate the acoustic conduit from the space in which the second portion is located. [Brief explanation of the drawing]

[0006] [Figure 1]This is a block diagram of an electronic device in a network environment according to one embodiment. [Figure 2a] This is a top plan view of an electronic device in a first state according to one embodiment. [Figure 2b] This is a bottom view of an electronic device in a first state according to one embodiment. [Figure 2c] This is a plan view of an electronic device in a second state according to one embodiment. [Figure 2d] This is a bottom view of an electronic device in a second state according to one embodiment. [Figure 3a] This is an exploded perspective view of an electronic device according to one embodiment. [Figure 3b] This is a disassembled perspective view of an electronic device according to one embodiment. [Figure 4a] This is a cross-sectional view of an electronic device in a first state according to one embodiment. [Figure 4b] This is a cross-sectional view of an electronic device in a second state according to one embodiment. [Figure 5a] This diagram shows how the second frame part is joined to the first frame part according to one embodiment. [Figure 5b] This figure shows an electronic device according to one embodiment. [Figure 5c] This is a cross-sectional view of an electronic device according to one embodiment, taken along the line C-C' in Figure 5b. [Figure 5d] This figure shows a part of an electronic device in which a display module according to one embodiment is arranged. [Figure 6a] This is a cross-sectional view of an electronic device according to one embodiment, taken along line D-D' in Figure 5b. [Figure 6b] This is a perspective view of a portion of the first frame part according to one embodiment. [Figure 6c] This is a front view of the first surface of the first frame part according to one embodiment. [Figure 7a]This is a cross-sectional view of an electronic device according to one embodiment, taken along line D-D' in Figure 5b. [Figure 7b] This figure shows a frame on which a sealing member according to one embodiment is arranged. [Figure 8] This is a cross-sectional view of an electronic device according to one embodiment, taken along line D-D' in Figure 5b. [Figure 9] This is a cross-sectional view of an electronic device according to one embodiment, taken along line D-D' in Figure 5b. [Figure 10] This figure shows a frame in which the display is omitted according to one embodiment. [Figure 11] This graph compares the quality of an audio signal provided by an electronic device according to a comparative example with that provided by an electronic device according to one embodiment. [Modes for carrying out the invention]

[0007] Figure 1 is a block diagram of an electronic device in a network environment according to one embodiment.

[0008] Referring to Figure 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of the electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to one embodiment, the electronic device 101 communicates with the electronic device 104 via server 108. According to one embodiment, the electronic device 101 includes a processor 120, memory 130, input module 150, acoustic output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, tactile module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197. In some embodiments, the electronic device 101 may omit at least one of these components (e.g., connection terminal 178) or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0009] The processor 120, for example, executes software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120 and performs various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 stores instructions or data received from other components (e.g., sensor module 176 or communication module 190) in volatile memory 132, processes the instructions or data stored in volatile memory 132, and stores the resulting data in non-volatile memory 134. According to one embodiment, the processor 120 may include a main processor 121 (e.g., central processing unit or application processor) or an auxiliary processor 123 (e.g., graphics processing unit, neural network processing unit (NPU), image signal processor, sensor hub processor, or communication processor) that can operate independently or together with it. For example, if the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be configured to specialize in a specified function. The auxiliary processor 123 can be implemented separately from or as part of the main processor 121.

[0010] The auxiliary processor 123 controls, for example, at least a portion of the functions or states related to at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) on behalf of the main processor 121 when the main processor 121 is inactive (e.g., sleep), or together with the main processor 121 when the main processor 121 is active (e.g., running an application). According to one embodiment, the auxiliary processor 123 (e.g., image signal processor or communication processor) can be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). According to one embodiment, the auxiliary processor 123 (e.g., neural network processing unit) can include hardware structures dedicated to processing artificial intelligence models. The artificial intelligence models are generated through machine learning. Such learning may be performed, for example, on the electronic device 101 itself on which the artificial intelligence model is run, or via a separate server (e.g., server 108). Learning algorithms include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. Artificial intelligence models include multiple artificial neural network layers. Artificial neural networks may be, but are not limited to, deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), deep Q-networks, or any combination of two or more of the above.An artificial intelligence model can include a software structure additionally or alternatively, in addition to a hardware structure.

[0011] Memory 130 stores various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The data includes, for example, software (e.g., the program 140), and input data or output data for related instructions. Memory 130 includes a volatile memory 132 or a non-volatile memory 134.

[0012] Program 140 is stored as software in memory 130 and includes, for example, an operating system 142, middleware 144, or an application 146.

[0013] Input module 150 receives instructions or data used by a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). Input module 150 includes, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0014] The acoustic output module 155 outputs an acoustic signal to the outside of the electronic device 101. The acoustic output module 155 includes, for example, a speaker or a receiver. The speaker is used for general purposes such as multimedia playback and recording playback. The receiver is used to receive an incoming call. According to one embodiment, the receiver is implemented separately from or as part of the speaker.

[0015] The display module 160 provides information visually to an external party (e.g., a user) outside of the electronic device 101. The display module 160 includes, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect touches, or a pressure sensor configured to measure the intensity of the force generated by a touch.

[0016] The audio module 170 converts sound into electrical signals, or conversely, converts electrical signals into sound. According to one embodiment, the audio module 170 acquires sound via the input module 150, or outputs sound via the sound output module 155, or via an external electronic device (e.g., electronic device 102) (e.g., speaker or headphones) directly or wirelessly connected to the electronic device 101.

[0017] The sensor module 176 senses the operating state of the electronic device 101 (e.g., power or temperature) or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the sensed state. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0018] Interface 177 supports one or more designated protocols used by the electronic device 101 to connect directly or wirelessly to an external electronic device (e.g., electronic device 102). According to one embodiment, interface 177 includes, for example, HDMI® (high definition multimedia interface), USB (universal serial bus) interface, SD card interface, or audio interface.

[0019] The connection terminal 178 includes a connector through which the electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to one embodiment, the connection terminal 178 includes, for example, an HDMI® connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0020] The tactile module 179 converts electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that the user can perceive through touch or kinesthetic sense. According to one embodiment, the tactile module 179 includes, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0021] The camera module 180 captures still images and videos. According to one embodiment, the camera module 180 includes one or more lenses, an image sensor, an image signal processor, or a flash.

[0022] The power management module 188 manages the power supplied to the electronic device 101. According to one embodiment, the power management module 188 is implemented, for example, as at least part of a PMIC (power management integrated circuit).

[0023] The battery 189 supplies power to at least one component of the electronic device 101. According to one embodiment, the battery 189 includes, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0024] The communication module 190 supports the establishment of a direct (e.g., wired) or wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and the execution of communication over the established communication channel. The communication module 190 operates independently of the processor 120 (e.g., the application processor) and may include one or more communication processors that support direct (e.g., wired) or wireless communication. According to one embodiment, the communication module 190 includes a wireless communication module 192 (e.g., a cellular communication module, a near-field wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module 194 (e.g., a LAN (local area network) communication module, or a power line communication module). Of these communication modules, the corresponding communication module communicates with the external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth®, WiFi® (Wireless Fidelity) Direct, or IrDA (infrared data association)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN)). Some types of such communication modules may be integrated into a single component (e.g., a single chip) or implemented in multiple separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to verify or authenticate the electronic device 101 within the communication network, such as the first network 198 or the second network 199.

[0025] The wireless communication module 192 supports 5G networks following 4G networks and next-generation communication technologies, such as NR connection technology (new radio access technology). NR connection technology supports high-speed transmission of large amounts of data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 supports high-frequency bands (e.g., mmWave bands) to achieve high data rates, for example. The wireless communication module 192 supports various technologies to ensure performance in high-frequency bands, such as beamforming, massive array multiple-input and multiple-output (massive MIMO (multiple-input and multiple-output)), full-dimensional multiplexing (FD-MIMO (full-dimensional MIMO)), array antennas, analog beamforming, or large-scale antennas. The wireless communication module 192 supports various requirements specified by the electronic device 101, external electronic devices (e.g., electronic device 104), or network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports a peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) are each 0.5 ms or less, or round trip is 1 ms or less) for URLLC realization.

[0026] The antenna module 197 transmits and receives signals or power to and from an external source (e.g., an external electronic device). According to one embodiment, the antenna module 197 includes an antenna comprising a radiator consisting of a conductor or conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network, such as a first network 198 or a second network 199, is selected from the plurality of antennas, for example, by the communication module 190. Signals or power are transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., an RFIC (radio frequency integrated circuit)) are further formed as part of the antenna module 197.

[0027] According to one embodiment, the antenna module 197 forms an mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., the bottom surface) of the printed circuit board that supports a specified high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., the top or side surface) of the printed circuit board that transmit or receive signals in the specified high-frequency band.

[0028] At least some of the above components are connected to each other via a peripheral device communication method (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., instructions or data) with each other.

[0029] According to one embodiment, commands or data are transmitted or received between the electronic device 101 and the external electronic device 104 via a server 108 connected to a second network 199. The external electronic devices 102 or 104 may be the same type of device as or different from the electronic device 101. According to one embodiment, all or part of the operations performed by the electronic device 101 can be performed by one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 needs to perform some function or service automatically or in response to a request from a user or another device, the electronic device 101 does not perform the function or service itself, or additionally requests one or more external electronic devices to perform at least part of that function or service. One or more external electronic devices that receive the request perform at least part of the requested function or service, or additional functions or services related to the request, and transmit the results of the execution to the electronic device 101. The electronic device 101 provides the results as they are, or additionally processed, as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies can be used. The electronic device 101 can provide ultra-low latency services, for example, using distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 includes an IoT (Internet of Things) device. The server 108 is an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0030] According to one embodiment, the display of the display module 160 is flexible. For example, the display includes a display area exposed outside the housing of the electronic device 101, which provides at least a portion of the outer surface of the electronic device 101. For example, because the display is flexible, at least a portion of the display is rollable into or slidable within the housing. For example, the size of the display area is changed depending on the size of at least a portion of the display that is rolled into or slid within the housing. For example, the electronic device 101 including the display can be in a plurality of states, including a first state that provides a display area having a first size and a second state that provides a display area having a second size different from the first size. For example, the first state is illustrated through the description of Figures 2a and 2b.

[0031] Figure 2a is a top plan view of an electronic device in a first state according to one embodiment.

[0032] Referring to Figure 2a, the electronic device 101 includes a housing 201 and a display 230. For example, the housing 201 includes a first housing part 210 and a second housing part 220. The second housing part 220 is movable relative to the first housing part 210 in a first direction 261 parallel to the y-axis, or in a second direction 262 parallel to the y-axis and opposite to the first direction 261.

[0033] In this specification, the second housing part 220 is described as moving relative to the first housing part 210, but the present invention is not limited thereto. The housing 201 has a structure in which the overall size of the housing 201 is changed in accordance with the change in the relative positional relationship between the first housing part 210 and the second housing part 220. The relative positional relationship between the first housing part 210 and the second housing part 220 is changed by the operation of the motor 361, which will be described later. For example, the motor 361 may make either the first housing part 210 or the second housing part 220 movable, or both the first housing part 210 and the second housing part 220 movable.

[0034] The electronic device 101 is in a first state. In the first state, the second housing part 220 is movable relative to the first housing part 210 in the first direction 261 of the two directions 261 and 262. In the first state, the second housing part 220 is not movable relative to the first housing part 210 in the second direction 262.

[0035] In the first state, the display 230 provides a display area having the smallest size. For example, in the first state, the display area corresponds to area 230a. Although not shown in Figure 2a, in the first state, a different area of ​​the display 230 from the display area 230a (e.g., area 230b in Figure 2c) is included within the first housing part 210. For example, in the first state, the area (e.g., area 230b in Figure 2c) is covered by the first housing part 210. For example, in the first state, the area is enclosed within the first housing part 210. For example, in the first state, area 230a includes a planar portion. However, it is not limited to this. For example, in the first state, area 230a may include a curved portion that extends from the planar portion and is located at the edge portion.

[0036] The first state is referred to as a slide-in state or closed state in that at least a portion of the second housing part 220 is located within the first housing part 210. The first state is also referred to as a retracted state in that it provides a display area with the smallest size. However, it is not limited to these states.

[0037] For example, the second housing part 220 includes a first image sensor 250-1 within the camera module 180, exposed through a portion of region 230a and oriented in a third direction 263 parallel to the z-axis. Although not shown in Figure 2a, the second housing part 220 also includes one or more second image sensors within the camera module 180, exposed through a portion of the second housing part 220 and oriented in a fourth direction 264 parallel to the z-axis and opposite to the third direction 263. One or more second image sensors are illustrated through the description in Figure 2b.

[0038] Figure 2b is a bottom view of an electronic device in a first state according to one embodiment.

[0039] Referring to Figure 2b, in the first state, one or more second image sensors 250-2 located within the second housing part 220 are located within a structure located within the first housing part 210 for one or more second image sensors 250-2. Light from outside the electronic device 101 is received by one or more second image sensors 250-2 through the structure in the first state. Since one or more second image sensors 250-2 are located within the structure in the first state, one or more second image sensors 250-2 are exposed through the structure in the first state. The structure can be implemented in various ways. For example, the structure is an opening or a notch. For example, the structure is an opening 212a in the first plate 212 of the first housing part 210 that surrounds at least a portion of the second housing part 220. However, it is not limited thereto. For example, in the first state, one or more second image sensors 250-2 contained within the second housing part 220 may be covered by the first plate 212 of the first housing part 210.

[0040] The first state is changed to the second state. For example, the first state (or the second state) is changed to the second state (or the first state) via an intermediate state between the first and second states.

[0041] The first state (or second state) is changed to the second state (or first state) based on user input. For example, the first state (or second state) is changed to the second state (or first state) in response to user input to a physical button exposed through part of the first housing part 210 or part of the second housing part 220. For example, the first state (or second state) is changed to the second state (or first state) in response to touch input to an executable object displayed within the display area. For example, the first state (or second state) is changed to the second state (or first state) in response to touch input having a contact point on the display area and a pressing force equal to or greater than a reference force. For example, the first state (or second state) is changed to the second state (or first state) in response to audio input received via the microphone of the electronic device 101. For example, the first state (or second state) is changed to the second state (or first state) in response to an external force applied to the first housing part 210 and / or the second housing part 220 in order to move the second housing part 220 relative to the first housing part 210. For example, the first state (or second state) is changed to the second state (or first state) in response to user input identified from an external electronic device (e.g., earbuds or a smart watch) connected to the electronic device 101. However, it is not limited to this.

[0042] The second state is illustrated through the descriptions of Figures 2c and 2d.

[0043] Figure 2c is a plan view of the electronic device in a second state according to one embodiment.

[0044] Referring to Figure 2c, the electronic device 101 is in a second state. In the second state, the second housing part 220 is movable relative to the first housing part 210 in the second direction 262, of the two directions 261 and 262. In the second state, the second housing part 220 is not movable relative to the first housing part 210 in the first direction 261.

[0045] In the second state, the display 230 provides a display area having the largest size. In the second state, the display area corresponds to area 230c, which includes areas 230a and 230b. Area 230b, which was contained within the first housing part 210 in the first state, is exposed in the second state. In the second state, area 230a includes, but is not limited to, a planar portion. Area 230a may also include a curved portion that extends from the planar portion and is located at the edge portion. In the second state, unlike area 230a in the first state, area 230b includes, but is not limited to, a planar portion and a planar portion of the curved portion. Area 230b may also include a curved portion that extends from the planar portion of area 230b and is located at the edge portion.

[0046] The second state is referred to as a slide-out state or open state in relation to the first state, in that at least a portion of the second housing part 220, which is located outside the first housing part 210, is extended. The second state is also referred to as an extended state in that it provides the largest display area. However, it is not limited to these states.

[0047] The first image sensor 250-1, facing the third direction 263, moves with region 230a in accordance with the movement of the second housing part 220 in the first direction 261 when the state of the electronic device 101 changes from the first state to the second state. Although not shown in Figure 2c, one or more second image sensors 250-2, facing the fourth direction 264, also move in accordance with the movement of the second housing part 220 in the first direction 261 when the state of the electronic device 101 changes from the first state to the second state. The relative positional relationship between one or more second image sensors 250-2 and the above structure illustrated through the description in Figure 4b changes in accordance with the movement of one or more second image sensors 250-2. The change in the relative positional relationship is illustrated through Figure 2d.

[0048] Figure 2d is a bottom view of an electronic device in a second state according to one embodiment.

[0049] Referring to Figure 2d, in the second state, one or more second image sensors 250-2 are located outside the structure. For example, the structure includes an opening 212a. In the second state, one or more second image sensors 250-2 are located outside the opening 212a in the first plate 212. One or more second image sensors 250-2 are exposed through the opening 212a in the first state. One or more second image sensors 250-2 are exposed in the second state because they are located outside the first housing part 210 in the second state. One or more second image sensors 250-2 are exposed in the second state because they are located outside the structure in the second state.

[0050] If the electronic device 101 does not include a structure such as the aperture 212a, one or more second image sensors 250-2 are exposed in the second of the first and second states.

[0051] Although not shown in Figures 2a, 2b, 2c, and 2d, the electronic device 101 may be in an intermediate state between the first and second states. For example, the size of the display area in the intermediate state is larger than the size of the display area in the first state and smaller than the size of the display area in the second state. The display area in the intermediate state corresponds to an area that includes part of area 230a and area 230b. In the intermediate state, part of area 230b is exposed, and other part (or the remaining part) of area 230b is covered by the first housing part 210 or is enclosed within the first housing part 210. However, it is not limited to this.

[0052] Referring again to Figure 1, the electronic device 101 includes a structure for moving the second housing of the electronic device 101 (e.g., the second housing part 220 in Figure 2a) relative to the first housing of the electronic device 101 (e.g., the first housing part 210 in Figure 2a). This structure is illustrated through the description of Figures 3a and 3b.

[0053] Figures 3a and 3b are exploded perspective views of an electronic device according to one embodiment.

[0054] Referring to Figures 3a and 3b, the electronic device 101 includes a first housing part 210, a second housing part 220, a display 230, and a drive unit 360.

[0055] According to one embodiment, the first housing part 210 includes a first cover 311, a first plate 212, and a frame 313.

[0056] For example, the first cover 311 forms at least partially the side portion of the outer surface of the electronic device 101. The first cover 311 includes an opening 311a for one or more second image sensors 250-2. The first cover 311 includes a surface that supports the first plate 212. The first cover 311 is coupled to the first plate 212. The first cover 311 includes a frame 313. The first cover 311 is coupled to the frame 313.

[0057] For example, the first plate 212 forms at least partially the back portion of the outer surface. The first plate 212 includes an opening 212a for one or more second image sensors 250-2. The first plate 212 is positioned on the above surface of the first cover 311. The opening 212a is aligned with the opening 311a.

[0058] For example, frame 313 is at least partially surrounded by the first cover 311.

[0059] For example, frame 313 is at least partially enclosed by the display 230. Although frame 313 is at least partially enclosed by the display 230, the position of frame 313 is maintained independently of the movement of the display 230. Frame 313 is arranged in relation to at least some of the components of the display 230. Frame 313 includes a rail 313a that provides (or guides) a path for the movement of at least one component of the display 230.

[0060] For example, frame 313 is coupled to at least one component of the electronic device 101. Frame 313 supports a battery 189. The battery 189 is supported through a recess or hole in the surface 313b of frame 313. Frame 313 is coupled to one end of a flexible printed circuit board (FPCB) 325 on a surface on frame 313. Although not explicitly shown in Figures 3a and 3b, the other end of the FPCB 325 is connected to a printed circuit board 324 via at least one connector. Printed circuit board 324 is electrically connected to another printed circuit board 327 via the FPCB 325.

[0061] For example, frame 313 is coupled to at least one structure of the electronic device 101 for multiple states, including a first state and a second state. Frame 313 fastens the motor 361 of the drive unit 360.

[0062] According to one embodiment, the second housing part 220 includes a second cover 321 and a second plate 322.

[0063] For example, the second cover 321 is at least partially enclosed by the display 230. Unlike the frame 313, the second cover 321 is coupled to at least a portion of the area 230a of the display 230 surrounding the second cover 321, so that the display 230 moves in accordance with the second housing part 220 which moves relative to the first housing part 210. For example, the second cover includes a first frame part 321a and a second frame part 321b. The first frame part 321a and the second frame part 321b will be described later.

[0064] For example, the second cover 321 is coupled to at least one component of the electronic device 101. The second cover 321 is coupled to a printed circuit board 324 containing components of the electronic device 101. For example, a processor (processor 120 in Figure 1) is located on the printed circuit board 324. The second cover 321 supports one or more second image sensors 250-2.

[0065] For example, the second cover 321 is coupled to at least one structure of the electronic device 101 for multiple states, including a first state and a second state. The second cover 321 secures the rack gear 363 of the drive unit 360.

[0066] For example, the second cover 321 is coupled to the second plate 322.

[0067] For example, the second plate 322 is coupled to the second cover 321 to protect at least one component of the electronic device 101 coupled within the second cover 321 and / or at least one structure of the electronic device 101 coupled within the second cover 321. The second plate 322 includes a structure for at least one component. The second plate 322 includes one or more openings 326 for one or more second image sensors 250-2. The one or more openings 326 are aligned with one or more second image sensors 250-2 positioned on the second cover 321. The size of each of the one or more openings 326 corresponds to the size of each of the one or more second image sensors 250-2. A camera decoration member 328 is positioned between the second cover 321 and the second plate 322. The second cover 321 supports a speaker 370.

[0068] For example, the electronic device 101 includes a support member 331 for supporting at least a portion of the display 230. For example, the support member 331 includes a plurality of bars (multi-bar or bars). The plurality of bars are connected to one another. The support member 331 supports area 230b of the display 230.

[0069] According to one embodiment, the drive unit 360 includes a motor 361, a pinion gear 362, and a rack gear 363.

[0070] For example, the motor 361 operates based on power from the battery 189. For example, power is supplied to the motor 361 in response to user input.

[0071] For example, the pinion gear 362 is coupled to the motor 361 via a shaft. The pinion gear 362 rotates based on the operation of the motor 361 transmitted through the shaft.

[0072] For example, the rack gear 363 is arranged in relation to the pinion gear 362. For example, the teeth of the rack gear 363 mesh with the teeth of the pinion gear 362. The rack gear 363 moves in a first direction 261 or a second direction 262 in response to the rotation of the pinion gear 362. The second housing part 220 moves in the first direction 261 and the second direction 262 by the rack gear 363, which moves in response to the rotation of the pinion gear 362 due to the operation of the motor 361. The first state of the electronic device 101 is changed to a different state (e.g., one or more intermediate states or a second state) via the movement of the second housing part 220 in the first direction 261. The second state of the electronic device 101 is changed to a different state (e.g., one or more intermediate states or a first state) via the movement of the second housing part 220 in the second direction 262. The process of changing the first state to the second state by the drive unit 360, and the process of changing the second state to the first state by the drive unit 360, is illustrated by Figures 4a and 4b.

[0073] Figure 4a is a cross-sectional view of the electronic device in a first state according to one embodiment. Figure 4b is a cross-sectional view of the electronic device in a second state according to one embodiment.

[0074] For example, Figure 4a is a cross-sectional view of an electronic device 101 according to one embodiment, cut along line A-A' in Figure 2a. For example, Figure 4b is a cross-sectional view of an electronic device 101 according to one embodiment, cut along line B-B' in Figure 2c.

[0075] Referring to Figures 4a and 4b, the motor 361 operates based at least in part on a defined user input received in a first state, state 490. The pinion gear 362 rotates in a first rotational direction 411 based at least in part on the operation of the motor 361. The rack gear 363 moves in a first direction 261 based at least in part on the rotation of the pinion gear 362 in the first rotational direction 411. The second cover 321 in the second housing part 220 secures the rack gear 363, so the second housing part 220 moves in the first direction 261 based at least in part on the movement of the rack gear 363 in the first direction 261. The second cover 321 within the second housing part 220 is coupled to at least a portion of area 230a of the display 230 and secures the rack gear 363 so that the display 230 moves at least in part based on the movement of the rack gear 363 in the first direction 261. The display 230 moves along the rail 313a. The shape of at least some of the bars of the support member 331 of the display 230 is changed when state 490 is changed to state 495, which is the second state.

[0076] For example, region 230b of the display 230 moves in accordance with the movement of the display 230. Region 230b moves through the space between the first cover 311 and the frame 313 when state 490 is changed to state 495 according to a defined user input. Region 230b in state 495 is exposed, unlike region 230b in state 490 which is rolled into space.

[0077] For example, the second cover 321 within the second housing part 220 is coupled to a printed circuit board 324 connected to the other end of the FPCB 325 to secure the rack gear 363, so the shape of the FPCB 325 changes when state 490 is changed to state 495.

[0078] Motor 361 operates based at least in part on a defined user input received in state 495. Pinion gear 362 rotates in a second rotational direction 412 based at least in part on the operation of motor 361. Rack gear 363 moves in a second direction 262 based at least in part on the rotation of pinion gear 362 in the second rotational direction 412. The second cover 321 in the second housing part 220 moves in a second direction 262 based at least in part on the movement of rack gear 363 in the second direction 262, in order to secure the rack gear 363. The second cover 321 of the second housing part 220 is coupled to at least a portion of the area 230a of the display 230 and secures the rack gear 363 so that the display 230 moves at least in part based on the movement of the rack gear 363 in the second direction 262. The display 230 moves along the rail 313a. The shape of at least some of the bars of the support member 331 of the display 230 is changed as state 495 is deformed to state 490. The support member 331 moves relative to the first housing part 210. In state 490, the support member 331, housed inside the first housing part 210, is positioned between the first cover 311 and the frame 313. As the support member 331 moves, the display 230 moves relative to the first housing part 210.

[0079] For example, region 230b of the display 230 moves in response to the movement of the display 230. Region 230b moves through the space between the first cover 311 and the frame 313 when state 495 is changed to state 490 according to defined user input. Region 230b in state 490 is rolled into space, unlike region 230b that is exposed in state 495.

[0080] For example, the second cover 321 of the second housing part 220 is coupled to a printed circuit board 324 connected to the other end of the FPCB 325 to secure the rack gear 363, so the shape of the FPCB 325 changes when state 495 is changed to state 490.

[0081] Figure 5a shows how the second frame part is joined to the first frame part according to one embodiment. Figure 5b shows an electronic device according to one embodiment. Figure 5c is a cross-sectional view of the electronic device according to one embodiment, cut along C-C' in Figure 5b. Figure 5d shows a part of the electronic device in which a display module according to one embodiment is arranged.

[0082] One or more components described below with reference to the drawings are implemented together with the components of the electronic device 101 described with reference to Figures 2a to 4b. Explanations that overlap with the above explanation are omitted.

[0083] In this specification, relative terms such as top, bottom, front, and back are used to describe the relative positions between components. For example, if the electronic device 101 shown in the drawing is inverted, top and bottom are swapped with each other. For example, if the electronic device 101 shown in the drawing is inverted, front and back are swapped with each other.

[0084] Referring to Figures 5a and 5b, an electronic device 101 according to one embodiment includes a housing 201 and a display 230. The housing 201 is referred to as the housing 201 described with reference to Figures 2a to 4b. For example, the housing 201 includes a first housing part (e.g., the first housing part 210 in Figure 2a) and a second housing part movable relative to the first housing part 210 (e.g., the second housing part 220 in Figure 2a). While an electronic device 101 according to one embodiment includes a first housing part 210 and a second housing part 220 that are movably coupled as described above, the present invention is not limited thereto. For example, the electronic device 101 may be a bar-type electronic device in which the first housing part 210 and the second housing part 220 are integrally coupled to form a single housing.

[0085] According to one embodiment, the electronic device 101 includes a frame 501 which includes a first frame part 510 and a second frame part 520. For example, the frame 501 is referred to as the second cover 321 shown in Figure 3a. For example, the first frame part 510 is referred to as the first frame part 321a shown in Figure 3a. For example, the second frame part 520 is referred to as the second frame part 321b shown in Figure 3a.

[0086] According to one embodiment, the first frame part 510 supports at least a portion of the display 230. The first frame part 510 includes a first surface 510a and a second surface (for example, the second surface 510b in Figure 5c). The first surface 510a is a surface of the first frame part 510 facing a first direction 261. The second surface 510b is perpendicular to the first surface 510a and is a surface of the first frame part 510 that supports at least a portion of the display 230. For example, the second surface 510b is referred to as a surface of the first frame part 510 facing the +z direction. The second frame part 520 covers a portion of the first surface 510a and the second surface 510b.

[0087] In Figure 5a, the first frame part 510 and the second frame part 520 are shown as separate structures, but the present invention is not limited thereto. For example, the first frame part 510 and the second frame part 520 are formed integrally (see Figure 8). When the first frame part 510 and the second frame part 520 are formed integrally, they can have a relatively better appearance than when the first frame part 510 and the second frame part 520 are formed separately. When the first frame part 510 and the second frame part 520 are formed integrally, assembly of the electronic device 101 becomes difficult. For example, when assembling the electronic device 101, at least a portion of the support member (e.g., support member 331 in Figure 3a) is coupled to a rail (e.g., rail 313a in Figure 3a). A cover for the support member 331 is required to prevent the support member 331 from detaching from the rail 313a. When the first frame part 510 and the second frame part 520 are formed integrally, the second housing part 220 needs to perform the function of covering the support member 331, which increases the difficulty of assembly related to the joining of the display 230. In terms of reducing the difficulty of assembly, it is advantageous to construct the second frame part 520 separately from the first frame part 510. For example, the second frame part 520 is manufactured separately from the first frame part 510 and then joined. For example, the second frame part 520 is joined to the side of the first frame part 510 and covers a part of the first frame part 510.

[0088] The second frame part 520 is referred to as a protective member, a deco member, and / or a cover member, in view of covering a portion of the first frame part 510. For example, a portion of the second frame part 520 protects a third portion (e.g., the third portion 233 in Figure 2d) described later by covering the space between the display 230 and the first frame part 510. For example, the second frame part 520 includes a non-conductive material. For example, the second frame part 520 is manufactured by an injection molding process using a non-conductive material (e.g., resin). However, it is not limited to this. For example, at least a portion of the second frame part 520 includes a conductive material. In addition, to reduce static electricity, a conductive tape (not shown) connected to an electrostatic discharge path is placed over at least a portion of the portion where the first frame part 510 and the second frame part 520 are joined.

[0089] According to one embodiment, the second frame part 520 includes a first portion 520a for covering a first surface 510a facing a first direction 261, and a second portion 520b extending substantially perpendicularly to the first portion 520a. The second portion 520b includes a flange portion 522 for covering a third portion 233 of the display 230, and protruding portions 523, 524 coupled to guide grooves 510c formed on at least a portion of the side surface of the first frame part 510. For example, the second portion 520b includes a first protruding portion 523 coupled to a portion of one side surface of the first frame part 510 (e.g., the side facing the +x direction), and a second protruding portion 524 coupled to a portion of the other side surface of the first frame part 510 (e.g., the side facing the -x direction). The flange portion 522 is formed between the first protruding portion 523 and the second protruding portion 524. For example, the length a of the flange portion 522 is shorter than the length b of the protruding portions 523 and 524. Because the length a of the flange portion 522 is shorter than the length b of the protruding portions 523 and 524, the flange portion 522 covering the second portion 232 does not overlap with the display 230, or the area over which it overlaps with the display 230 is reduced.

[0090] Referring to Figure 5c, part 230b of the display is bent inward into the first housing part 210 based on the movement of the second housing part 220. For example, part 230b of the display includes a bendable part that is at least partially deformed in response to the movement of the second housing part 220. For example, another part of the display (e.g., another part 230a of the display in Figure 5d) is always visible from the outside, independently of the state of the electronic device 101. For example, regardless of whether the electronic device 101 is in a first state (e.g., slide-in state) or a second state (e.g., slide-out state), the other part 230a of the display is a flat planar part.

[0091] For example, in the first state, a portion 230b of the display is rollable into the first housing portion 210. In the second state, the portion 230b of the display is at least partially unfolded. As the display 230 moves, the position of the rollable portion 230b of the display changes. For example, in the first state, the portion 230b of the display is located inside the first housing portion 210. For example, in the second state, the portion 230b of the display is located at least partially outside the first housing portion 210. When the portion 230b of the display is located outside the first housing portion 210, the display area of ​​the display 230 is expanded by unfolding the portion 230b of the display. For example, the portion 230b of the display is referred to as the aforementioned area (e.g., area 230b in Figure 2c), and the other portion 230a of the display is referred to as the aforementioned area (e.g., area 230a in Figure 2a).

[0092] According to one embodiment, a first frame part 510 is movably coupled to a first housing part 210. When the first frame part 510 moves away from the first housing part 210 in a first direction 261, movement of the display 230 coupled to the first frame part 510 in the first direction 261 is caused. As the display 230 moves in the first direction 261, a portion 230b of the display that was trapped inside the first housing part 210 is pulled out of the first housing part 210. For example, when the first frame part 510 moves in a second direction 262 toward the first housing part 210, movement of the display 230 coupled to the first frame part 510 in the second direction 262 is caused. As the display 230 moves in the second direction 262, the portion 230b of the display that has been pulled out of the first housing part 210 is retracted into the first housing part 210.

[0093] Referring to Figure 5d, an electronic device 101 according to one embodiment includes a display module 550 which includes a display 230 and a display driver integrated circuit (DDI) 553 for controlling the display 230.

[0094] According to one embodiment, the display 230 is placed in a recess 511 formed in the first frame part 510. The size of the recess 511 is larger than the size of the display 230 placed in the recess 511. For example, the recess 511 is formed by partially recessing a portion of the second surface of the first frame part 510 (510b in Figure 5c) (for example, the surface facing the +z direction) inward (for example, in the -z direction). For example, the display 230 placed in the recess 511 is coupled to the first frame part 510. For example, the electronic device 101 includes adhesive tape 570 for bonding the display 230 onto the first frame part 510.

[0095] According to one embodiment, the display 230 includes a first portion 231, a second portion 232, and a third portion 233. The first portion 231 is in contact with a display panel containing a plurality of pixels. The second portion 232 is opposite to the first portion 231 and is connected to a display driver circuit 553 configured to control the display panel. The third portion 233 connects the first portion 231 and the second portion 232.

[0096] According to one embodiment, the first portion 231 faces the front of the electronic device 101 (e.g., in the +z direction). The second portion 232 faces the interior of the electronic device 101 (e.g., in the -z direction). The second portion 232 is electrically connected to the display driver circuit 553. The third portion 232 is bent to connect the first portion 231 and the second portion 232, which are located on opposite sides of each other.

[0097] According to one embodiment, a plurality of pixels are configured to emit light toward the front (e.g., in the +z direction). Since the display panel is exposed to the outside of the frame 501, a plurality of protective members are placed on the display panel to protect the display panel. For example, a flexible glass 554, a protective layer 555, and / or a protective film 556 are placed on the display panel. The plurality of protective members include an adhesive layer 557 for fixing the flexible glass 554, the protective layer 555, and / or the protective film 556. The plurality of protective members are formed of a substantially transparent material to allow light emitted through the display panel to pass through. However, the above protective members are illustrative and not limited thereto.

[0098] For example, the second portion 232 is positioned below the first portion 231 (e.g., in the -z direction). For example, when the first portion 231 is viewed from above, the second portion 232 overlaps (or covers) the first portion 231. The second portion 232 is separated from the first portion 231. For example, a spacer 558a and / or reinforcing member 558b are positioned between the first portion 231 and the second portion 232. For example, the spacer 558a can reduce the inflow of moisture by occupying part of the space between the first portion 231 and the second portion 232. For example, the spacer 558a can reduce the curvature of the third portion 233 by occupying the space between the first portion 231 and the second portion 232. For example, the reinforcing member 558b supports the first portion 231. For example, the second portion 232 is electrically connected to electronic components for driving the display 230. For example, the display driver circuit 553 and the printed circuit board 324 are electrically connected to the second part 232. Because the display driver circuit 553 is connected to the second part 232 which is located beneath the first part 231, the structure of the display 230 according to one embodiment is referred to as a COP (chip on plastic) structure. For example, the printed circuit board 324 is located between the second part 232 and the first frame part 510. For example, the printed circuit board 324 and the display driver circuit 553 are electrically connected via the second part 232. For example, the display module 550 includes a protective tape 590 for protecting the display driver circuit 553. For example, the protective tape 590 includes a conductive material to discharge static electricity generated inside the frame 501 or static electricity flowing in from outside the frame 501.

[0099] For example, the third portion 233 extends (or protrudes) from the first portion 231 in a first direction 261. For example, the third portion 233 electrically connects the first portion 231 and the second portion 232 by extending from the first portion 231 to the second portion 232. The third portion 233 is at least partially bent to connect the first portion 231 and the second portion 232. For example, the third portion 233 is flexible. For example, the third portion 233 is part of a polymer substrate (e.g., a polyimide substrate) that extends from the first portion 231 to the second portion 232. For example, the third portion 233 may be mounted as a flexible printed circuit board.

[0100] For example, the display driver circuit 553 is configured to control the operation of the display 230. For example, the display driver circuit 553 is configured to provide visual information via the display 230 based on receiving video control signals and / or video data from a processor located on the printed circuit board 324 (for example, the processor 120 in Figure 1). The display driver circuit 553 is electrically connected to the display 230 by being located on a third portion 233 of the display 230.

[0101] Referring again to Figure 5c, an electronic device 101 according to one embodiment includes structures and components for the operation of a deformable display 230. For example, the first housing part 210 includes a recess 210a to provide space for at least a portion of the second housing part 220 and a portion of the display 230b. For example, in a first state, the second housing part 220 and the portion of the display 230b are located in the internal space of the first housing part 210 formed by the recess 210a. For example, the electronic device 101 includes a support member 331 (e.g., a plurality of bars) for supporting the portion of the flexible display 230b. As shown in Figure 5d, since the first housing part 210 includes structures and components for the operation of the deformable display 230, if a third portion of the display 230 (e.g., the third portion 233 in Figure 5d) is extended from the first portion (e.g., the first portion 231 in Figure 5d) in a second direction 262, there is insufficient space to accommodate the third portion 233. According to one embodiment, the third portion 233 extends from the first portion 231 in a first direction 261. For example, the third portion 233 is located close to the edge of the first frame part 510 facing the first direction 261.

[0102] Referring again to Figures 5a and 5b, the third portion (for example, the third portion 233 in Figure 5a) extends from the first portion 231 in the first direction 261. For example, the third portion 233 extends from the edge of the first portion 231 facing the first direction 261 to the second portion 232. Referring to Figure 5a, a portion of the third portion 233 extended in the first direction 261 is exposed to the outside of the first frame part 510. The second frame part 520 is coupled to the first frame part 510 to cover the exposed third portion 233. Referring to Figure 5b, with the second frame part 520 coupled to the first frame part 510, the third portion 233 is covered by the second frame part 520. The third portion 233 is covered by the third portion 233 of the second frame part 520. The second frame part 520 protects the third portion 233 by covering the third portion 233 that is exposed to the outside of the first frame part 510. The second frame part 520 maintains a fixed state to the first frame part 510 even when the first frame part 510 moves in the first direction 261 and the second direction 262, so the third portion 233 is covered by the second frame part 520 independently of the movement of the second housing part 220.

[0103] An electronic device 101 according to one embodiment includes a speaker (e.g., speaker 530 in Figure 6a) configured to provide an audio signal. For example, speaker 530 is located inside a frame 501 (e.g., a first frame part 510). Speaker 530 generates sound waves by vibrating based on control signals provided by at least one processor (e.g., processor 120 in Figure 1). Frame 501 includes an acoustic conduit (e.g., acoustic conduit 502 in Figure 6a) for providing a path for sound waves generated by speaker 530 to be transmitted to the outside of the electronic device 101. Acoustic conduit 502 connects the internal space of frame 501 in which speaker 530 is located to the external space of frame 501.

[0104] According to one embodiment, the first frame part 510 includes a recessed portion (for example, the recessed portion 513 in Figure 6b) and a through hole (for example, the through hole 514 in Figure 6b) formed on the first surface 510a. For example, the recessed portion 513 forms a part of the acoustic conduit 502 (for example, the second conduit in Figure 6a) by forming a space between the first surface 510a and the second frame part 520 that covers the first surface 510a. For example, the through hole 514 connects the recessed portion 513 to a part of the acoustic conduit 502 formed inside the first frame part 510 (for example, the first conduit 502a in Figure 6a). The structure of the acoustic conduit 502 will be described later with reference to Figures 6b and 6c.

[0105] For example, the second frame part 520 includes an audio hole 521. For example, there may be one or more audio holes 521. For example, the audio holes 521 are connected to the acoustic conduit 502 so that sound waves transmitted through the acoustic conduit 502 are transmitted to the outside of the electronic device 101. For example, the audio holes 521 are connected to a recessed portion 513 that forms part of the acoustic conduit 502. For example, the audio holes 521 are formed in a flange portion 522 to cover a third portion 233. Sound waves generated from the speaker 530 are transmitted to the outside of the electronic device 101 via the acoustic conduit 502 and the audio holes 521.

[0106] As described above, since the third portion 233 extends from the first portion 231 in the first direction 261, the space in which the third portion 233 is located (for example, space S2 in Figure 6a) and the acoustic conduit 502 overlap at least partially. For example, the space S2 in which the third portion 233, extended from the first portion 231, is located is connected to the acoustic conduit 502.

[0107] As the acoustic conduit 502 and the space S2 in which the third portion 233 is located are at least partially superimposed, interference occurs between the sound waves transmitted along the acoustic conduit 502 and the third portion 233. When sound waves generated from the speaker 530 are transmitted along the acoustic conduit 502, the third portion 233 vibrates due to the sound waves, affecting them. For example, noise generated by the vibration of the third portion 233 degrades the quality of the audio signal provided by the speaker 530. For example, the third portion 233 may be damaged by foreign matter and / or air flowing into the acoustic conduit 502. For example, if air with high pressure flows into the acoustic conduit 502, the pressure of the air may damage the third portion 233. For example, if rigid foreign matter flows into the acoustic conduit 502, the foreign matter may damage the third portion 233.

[0108] An electronic device 101 according to one embodiment includes a structure and / or components for separating the space S2 in which the acoustic conduit 502 and the third portion 233 are located in order to reduce interference between sound waves transmitted along the acoustic conduit 502 and the third portion 233. For example, the electronic device 101 includes a first conduit 502a of the acoustic conduit 502 and a plate 540 for separating the space S2 in which the third portion 233 is located.

[0109] Figure 6a is a cross-sectional view of an electronic device according to one embodiment, cut along line D-D' in Figure 5b. Figure 6b is a perspective view of a part of the first frame part according to one embodiment. Figure 6c is a front view of the first surface of the first frame part according to one embodiment.

[0110] Referring to Figure 6a, an electronic device 101 according to one embodiment includes a plate 540 for separating the acoustic conduit 502 from the space S2 in which the third portion 233 is located. For example, the plate 540 is coupled to the first frame part 510 as a separate component from the first frame part 510. For example, the first frame part 510 and the plate 540 are manufactured separately and then coupled. However, it is not limited to this. For example, the plate 540 may be formed integrally with the first frame part 510. For example, the plate 540 and the first frame part 510 may be manufactured integrally in a single process.

[0111] For example, at least a portion of the speaker 530 is placed within the frame 501. For example, the speaker 530 includes a diaphragm configured to generate sound waves by vibrating based on an electrical signal. The sound waves generated from the diaphragm are emitted into the space S1 in front of the speaker 530. The front is understood substantially as the direction from which the sound waves are emitted from the speaker 530. The space S1 in front of the speaker 530 is referred to as the internal space of the first frame part 510 surrounding the front of the speaker 530, which is placed within the first frame part 510. The space behind the speaker 530 provides a resonant space for the resonance of the sound waves. The sound waves generated from the speaker 530 are transmitted along the acoustic conduit 502 to the audio hole 521 and provided to the outside of the frame 501 through the audio hole 521.

[0112] For example, the acoustic conduit 502 provides a path for sound waves generated from the speaker 530 by connecting the space S1 in front of the speaker 530 with the audio hall 521. Since a portion of the acoustic conduit 502 is formed inside the first frame part 510, the acoustic conduit 502 overlaps, at least partially, with the space where the third portion 233 is located. If the acoustic conduit 502 and the space where the third portion 233 is located are not separated but connected to each other, the quality of the audio signal provided by the speaker 530 will be degraded, and the third portion 233 may be damaged by foreign matter and / or air flowing through the acoustic conduit 502. The plate 540 can reduce the degradation of the audio signal quality and damage to the third portion 233 by separating the space S2 where the third portion 233 is located from the acoustic conduit 502.

[0113] For example, a first portion 231 and / or a second portion 232 are supported by a first frame part 510. For example, the first frame part 510 includes a recess 511 on which the display 230 is seated. For example, the recess 511 is formed on a second surface 510b of the first frame part 510 that supports at least a portion of the display 230. For example, the recess 511 is formed by recessing a portion of the second surface 510b in a direction facing inward (e.g., the -z direction) of the first frame part 510. The edge of the recess 511 is separated from the edge of the first frame part 510. The recess 511 is formed on the inside of the edge of the first frame part 510. The recess 511 forms a side wall (or stepped portion) 512. A portion of the third portion 233 is supported by the first frame part 510 by contacting the recess 511. The third portion 233 extends from the first portion 231, which is located within the recess 511, and thus extends toward the side wall 512 of the first frame portion 510 formed in the recess 511.

[0114] According to one embodiment, the plate 540 is positioned between the acoustic conduit 502 and the space S2 in which the third portion 233 is located, so as to separate the acoustic conduit 502 from the space in which the third portion 233 is located. For example, a portion of the plate 540 is supported by the first frame part 510 and is located below the first portion 231 and the second portion 232 of the display 230 (e.g., in the -z axis direction). Another portion of the plate 540 is positioned between the space in which the second frame part 520 is located (e.g., the space between the side wall 512 and the third portion 233). Another portion of the plate 540 is in contact with the side wall 512. The plate 540 separates the space S2 in which the third portion 233 is located from the acoustic conduit 502 by being positioned between the space S2 in which the third portion 233 is located and the acoustic conduit 502. For example, the space S2 in which the third part 233 is located is surrounded by the first frame part 510, the second frame part 520, and the plate 540.

[0115] According to one embodiment, a through-hole (e.g., an opening 516 in Figure 7b) is formed between the acoustic conduit 502 and the space in which the third portion 233 is located. The opening 516 connects the acoustic conduit 502 and the space in which the third portion 233 is located. The plate 540 may be included within the first frame part 510 by being formed integrally with the first frame part 510. The plate 540 may not be added as a separate component, and the opening 516 may not be formed in the first frame part 510. If the opening 516 is not formed, the space S2 in which the acoustic conduit 502 and the third portion 233 are located is separated by the structure of the first frame part 510 itself. When the plate 540 and the first frame part 510 are formed integrally, the thickness is increased by about 0.3 mm to about 0.5 mm for mold strength. In contrast, when an opening 516 is formed in the first frame part 510 and a plate 540 is placed to cover the opening 516, the increase in the thickness of the first frame part 510 is reduced. For example, the thickness of the plate 540 is about 0.1 mm to about 0.15 mm, and by covering the opening 516 with a plate 540 having the above thickness, the space S2 in which the acoustic conduit 502 and the third part 233 are located can be separated. When an opening 516 is formed and the opening 516 is covered with a plate 540, the increase in the thickness of the first frame part 510 is reduced compared to when the opening 516 is omitted and the space S2 in which the acoustic conduit 502 and the third part 233 are located is separated.

[0116] According to one embodiment, the acoustic conduit 502 connects the space S1 in front of the speaker 530 to the audio hall 521. For example, the acoustic conduit 502 includes a first conduit 502a and a second conduit 502b. In this specification, the first conduit 502a is referred to as the portion of the acoustic conduit 502 that includes the space enclosed by the dotted line. For example, in this specification, the second conduit 502b is referred to as the portion of the acoustic conduit 502 that includes the space enclosed by the dashed line.

[0117] According to one embodiment, the first conduit 502a is part of an acoustic conduit 502 formed inside the first frame part 510. For example, the first conduit 502a includes the space S1 in front of the speaker. For example, the first conduit 502a is connected from inside the first frame part 510 where the speaker 530 is located to a through hole 514 that penetrates the first surface 510a. For example, the first conduit 502a extends from the space S1 in front of the speaker 530 to the through hole 514. The first conduit 502a formed inside the first frame part 510 overlaps with the space S2 where the third portion 233 is located. The plate 540 is positioned between the first conduit 502a and the space S2 where the third portion 233 is located.

[0118] For example, the second conduit 502b is another part of the acoustic conduit 502 formed outside the first frame part 510 and connected to the audio hole 521. For example, the second conduit 502b is connected to the audio hole 521 and to the through hole 514 and to the second direction 262. For example, the second conduit 502b is formed by recessing a portion of the first surface 510a of the first frame part 510, which faces the first direction 261, toward the second direction 262.

[0119] Referring to Figures 6b and 6c, the first frame part 510 includes a first surface 510a and a second surface 510b. The first surface 510a is a surface of the first frame part 510 facing the first direction 261. The second surface 510b is a surface of the first frame part 510 that supports at least a portion of the display 230. As described above, a recess 511 is formed on the second surface 510b on which the display 230 is seated.

[0120] For example, the first frame part 510 includes a recessed portion 513 for forming a second conduit (e.g., the second conduit 502b in Figure 6a). The recessed portion 513 is formed on the first surface 510a. For example, the recessed portion 513 is formed by recessing a portion of the first surface 510a in a second direction 262. The recessed portion 513 gives the first surface 510a a stepped appearance. The recessed portion 513 forms a space between the first frame part 510 and the second frame part 520 when the second frame part (e.g., the second frame part 520 in Figure 6a) is coupled to the first frame part 510. The recessed portion 513 is connected to a through hole 514 connected to the first conduit 502a and to an audio hole in the second frame part 520 (e.g., an audio hole 521 in Figure 6a).

[0121] Referring again to Figure 6a, the second conduit 502b is formed by a recessed portion (for example, recessed portion 513 in Figure 6b). For example, the second conduit 502b connects to the audio hole 521 and the through hole 514. The audio hole 521 is formed on one surface 520c of the second frame part 520 that substantially faces the front of the electronic device 101, so as to connect to the space between the first frame part 510 and the second frame part 520 formed by the recessed portion 513. For example, one surface 520c of the second frame part 520 is formed in the second part (520b in Figure 5a or Figure 5b) and is the surface of the second frame part 520 that faces the +z direction. For example, the first conduit 502a is connected to the through hole 514 in the first direction 261, and the second conduit 502b is connected to the through hole 514 in the second direction 262. The first conduit 502a and the second conduit 502b are connected via the through hole 514. Since the second conduit 502b is connected to the audio hall 521, the first conduit 502a, which is connected to the space S1 in front of the speaker 530, is connected to the audio hall 521.

[0122] According to one embodiment, the acoustic conduit 502 is separated by the plate 540 from the space S2 in which the third portion 233 is located. For example, the space S2 in which the third portion 233 is located is referred to as the space between the side wall 512 formed by the recess 511 and the first portion 231. As the plate 540 separates the acoustic conduit 502 from the space S2 in which the third portion 233 is located, interference between sound waves transmitted along the acoustic conduit 502 and the third portion 233 is reduced. For example, when sound waves, which are vibrations of air, are transmitted along the acoustic conduit 502 to the audio hall 521, the plate 540 reduces the transmission of sound wave vibrations to the third portion 233. As the transmission of sound waves to the third portion 233 is reduced, the vibration of the third portion 233 due to the sound waves is reduced. Because the vibration of the third portion 233 is reduced, noise caused by the vibration of the third portion 233 is reduced. The plate 540 reduces noise, thereby improving the quality of the audio signal provided by the speaker 530. For example, if foreign matter and / or air with high pressure enters through the audio hole 521, the plate 540 reduces the amount of foreign matter and / or air entering the space S2 where the third part 233 is located. As the amount of foreign matter and / or air entering the space S2 where the third part 233 is located is reduced, damage to the third part 233 by foreign matter and / or air is reduced.

[0123] In the above description, the side wall 512 was described as part of the first frame part 510, but is not limited thereto. For example, the side wall 512 may be part of a second frame part 520. For example, the side wall 512 may be implemented as an extension from one surface 520c of the second frame part 520. For example, if the side wall 512 is implemented as part of the second frame part 520, the second conduit 502b may be implemented as a through-hole extending from the audio hole 521.

[0124] Figure 7a is a cross-sectional view of an electronic device according to one embodiment, cut along line D-D' in Figure 5b. Figure 7b is a view of a frame on which a sealing member according to one embodiment is arranged.

[0125] Referring to Figures 7a and 7b, the electronic device 101 according to one embodiment includes a sealing member 560 (e.g., a sealant). For example, the sealing member 560 seals the space S2 in which the third portion 233 is located and the acoustic conduit 502.

[0126] For example, the first frame part 510 includes a seating portion 515 for supporting the plate 540. For example, the seating portion 515 is referred to as the portion of the first frame part 510 that contacts a portion of the plate 540. For example, a portion of the seating portion 515 extends from the side wall 512 into the interior of the first frame part 510. Another portion 515a of the seating portion 515 is a portion that extends from the second surface 510b of the first frame part 510. However, it is not limited to this. The plate 540 is supported by a portion of it being positioned on the seating portion 515.

[0127] For example, the sealing member 560 is positioned between the seating portion 515 and a portion of the plate 540 placed on the seating portion 515, thereby sealing the space S2 in which the acoustic conduit 502 and the third portion 233 are located. Referring to Figure 7b, the sealing member 560 may be positioned along at least a portion of the seating portion 515 that is in contact with a portion of the plate 540. For example, the sealing member 560 may be positioned along at least a portion of the edge of the plate 540. For example, the sealing member 560 may be positioned to surround the edge of the opening 516. The sealing member 560 shown in Figure 7b has a substantially rectangular ring shape by being positioned along the edge of the plate 540, which has a substantially rectangular shape, but is not limited thereto. For example, the sealing member 560 may be positioned along a portion of the edge of the plate 540.

[0128] For example, the sealing member 560 includes a compressible material. For example, the sealing member 560 includes poron, rubber, silicone, urethane, and / or a combination thereof. For example, the sealing member 560 firmly seals the gap between the seating portion 515 and the plate 540 by being clamped by the plate 540. As the space between the plate 540 and the seating portion 515 is sealed, the acoustic conduit 502 is separated from the space S2 in which the third portion 233 is located.

[0129] Figure 8 is a cross-sectional view of an electronic device according to one embodiment, obtained by cutting along line D-D' in Figure 5b.

[0130] The second housing part described above (for example, the second housing part 220 in Figure 5a) distinguishes between the first frame part (for example, the first frame part 510 in Figure 6a) and the second frame part (for example, the second frame part 520 in Figure 6a), but is not limited thereto. Referring to Figure 8, the first frame part 510 and the second frame part 520 described above are formed integrally. For example, the second frame part 520 is referred to not as a separate component coupled to the first frame part 510, but as part of the frame 501 formed integrally with the first frame part 510. The frame 501 is identical to the components of the electronic device 101 described above in other respects, except that it does not include multiple connectable structures and has a single structure.

[0131] For example, at least a portion of the speaker 530 is placed inside the frame 501. The acoustic conduit 502 is formed inside the frame 501. The acoustic conduit 502 connects the space S1 in front of the speaker 530 to the audio hall 521, providing a path for sound waves generated by the speaker 530 to be transmitted to the outside of the electronic device 101.

[0132] For example, frame 501 includes an audio hole 521. The audio hole 521 is formed on one surface 501a of frame 501 that faces substantially towards the front of the electronic device 101. For example, one surface 501a of frame 501 is the surface of frame 501 that faces in the +z direction.

[0133] For example, the acoustic conduit 502 includes a first conduit 502a and a second conduit 502b. For example, the first conduit 502a includes the space S1 in front of the speaker 530. For example, the first conduit 502a extends from inside the frame 501 in a first direction 261. For example, the second conduit 502b extends from the audio hole 521 in a direction perpendicular to the first direction 261 (e.g., the -z direction). For example, the direction in which the second conduit 502b extends is toward the inside of the frame 501. For example, the first conduit 502a and the second conduit 502b are connected via a through hole 514. For example, the through hole 514 is formed between the first conduit 502a and the second conduit 502b. For example, the first conduit 502a is connected to the through hole 514 in a first direction 261, and the second conduit 502b is connected to the through hole 514 in a second direction 262.

[0134] As shown in Figure 8, the integral formation of the first frame part 510 and the second frame part 520 eliminates the need for another member (e.g., the second frame part 520) to cover the third portion 233. The frame 501 covers the third portion 233 so that it is not exposed to the outside of the electronic device 101. For example, the third portion 233 is covered by the frame 501. The frame 501, formed integrally from the first frame part 510 and the second frame part 520, stably protects the third portion 233. The integral formation of the first frame part 510 and the second frame part 520 simplifies the manufacturing process of the frame 501.

[0135] As described above, the electronic device 101 includes a plate 540 for separating the first conduit 502a of the acoustic conduit 502 from the space S2 in which the third portion 233 is located. By separating the acoustic conduit 502 from the space S2 in which the third portion 233 is located, the plate 540 reduces interference between sound waves transmitted along the acoustic conduit 502 and the third portion 233.

[0136] Figure 9 is a cross-sectional view of an electronic device according to one embodiment, obtained by cutting along line D-D' in Figure 5b.

[0137] Referring to Figure 9, the first frame part 510 supports the display 230. For example, the first part 231 and the second part 232 are supported by the first frame part 510.

[0138] According to one embodiment, a second frame part 520 is positioned within a first frame part 510. The second frame part 520 has a structure for covering a third portion 233. For example, the second frame part 520 includes a flange portion 522 that protrudes to cover the third portion 233. By the flange portion 522 covering the third portion 233, the third portion 233 is protected by the second frame part 520.

[0139] According to one embodiment, the acoustic conduit 502 includes a first conduit 502c and a second conduit 502d. For example, the second frame part 520 is positioned away from the side wall 512 of the first frame part 510. For example, a gap is formed between the second frame part 520 and the side wall 512. For example, the gap between the first frame part 510 and the second frame part 520 forms the first conduit 502c. The audio hole 521 is formed at the end of the gap that connects to the outside of the frame 501.

[0140] According to one embodiment, the first frame part 510 includes a through hole 514. For example, a first conduit 502c is connected to the through hole 514. For example, the through hole 514 is formed in a direction perpendicular to the first direction 261 and the second direction 262 (for example, a direction parallel to the z-axis), and the first conduit 502c is connected to the through hole 514 in a direction substantially toward the rear of the electronic device 101 (for example, the -z direction). The through hole 514 is connected to the space S1 in front of the speaker 530. A second conduit 502d is connected to the space S1 in front of the speaker 530 and the through hole 514. For example, the second conduit 502d is connected to the through hole 514 in a direction substantially toward the front of the electronic device 101 (for example, the +z direction). According to one embodiment, the path through which sound waves are transmitted is formed along the first conduit 502c, the through-hole 514, the second conduit 502d, and the audio hole 521. Since a portion of the acoustic conduit 502 is formed substantially toward the front of the electronic device 101, the speaker 530 is positioned obliquely to at least a portion of the first frame part 510 so that sound waves emitted toward the front of the speaker 530 are smoothly transmitted along the acoustic conduit 502. For example, the front of the speaker 530 is not aligned with the display 230 but is inclined toward the acoustic conduit 502.

[0141] Figure 10 shows a frame in which the display is omitted according to one embodiment.

[0142] Referring to Figure 10, an electronic device 101 according to one embodiment includes an adhesive tape 570 positioned on a first frame part 510 supporting a first part (e.g., the first part 231 in Figure 6a) and / or a second part (e.g., the second part 232 in Figure 6a). For example, the adhesive tape 570 is positioned between the first part 231 of the display 230 and the first frame part 510. Referring to a display module shown in Figure 5c (e.g., the display module 550 in Figure 5c), for example, the adhesive tape 570 is attached underneath (e.g., in the -z direction) a protective tape (e.g., the protective tape 590 in Figure 5c).

[0143] For example, the adhesive tape 570 connects the first frame part 510 to the first portion 231. For example, one side of the adhesive tape 570 is connected to the first frame part 510, and the other side of the adhesive tape 570 opposite to the first side is connected to the first portion 231 of the display 230. Multiple adhesive tapes 570 are provided to connect multiple areas of the first portion 231 that are in contact with the first frame part 510 to the first frame part 510.

[0144] Figure 11 is a graph comparing the quality of an audio signal provided by an electronic device according to a comparative example and an audio signal provided by an electronic device according to one embodiment.

[0145] For example, an electronic device (e.g., electronic device 101 in Figure 6a) is used for voice communication. The electronic device 101 receives a radio signal containing an audio signal via an antenna, and the audio signal contained in the received radio signal is provided to the user via a speaker (e.g., speaker 530 in Figure 6a). For example, speaker 530 includes a receiver (earpiece). The audio signal provided from speaker 530 is transmitted to the user via an acoustic conduit (e.g., acoustic conduit 502 in Figure 6a).

[0146] In graph G of Figure 11, the x-axis represents the gain of the input audio signal (in decibels), and the y-axis represents the distortion of the audio signal provided by the speaker (in decibels).

[0147] The first graph G1 in Figure 11 is a graph of the audio signal provided by the speaker of an electronic device according to a comparative example when an audio signal of approximately 1020 Hz is input. The second graph G2 in Figure 11 is a graph of the audio signal provided by the speaker 530 of an electronic device 101 according to one embodiment when an audio signal of approximately 1020 Hz is input. The third graph G3 in Figure 11 is a graph showing the lower limit of the international standard for voice call quality as defined by 3GPP (registered trademark).

[0148] For example, an electronic device 101 according to one embodiment is referred to as the electronic device 101 shown in Figure 6a. The electronic device 101 according to one embodiment includes a structure in which the space where the second part (for example, the third part 233 in Figure 6a) is located (for example, space S2 in Figure 6a) is separated from the acoustic conduit 502.

[0149] For example, the comparative electronic device includes a structure in which an acoustic conduit is connected to the space where the part corresponding to the third part 233 of the electronic device 101 according to one embodiment is located.

[0150] Referring again to Figure 11, the second graph G2 has a larger magnitude than the first graph G1 within the audio signal gain range of approximately 0 dB to approximately -45 dB. The first graph G1 has a smaller magnitude than the third graph G3 within the audio signal gain range of approximately 0 dB to approximately -10 dB. For example, when the electronic device 101 according to one embodiment provides an audio signal with a magnitude between approximately 0 dB and approximately -10 dB, it cannot meet the lower limit of the international standard for voice call quality. The values ​​shown in the first graph G1 and the second graph G2 in Figure 11 are confirmed in [Table 1] below.

[0151] [Table 1]

[0152] Referring to [Table 1], the quality of the audio signal provided by the comparative example electronic device is lower than the quality of the audio signal provided by the electronic device 101 according to one embodiment. The audio signal provided by the comparative example electronic device contains more noise components than the audio signal provided by the electronic device 101 according to one embodiment. For example, in the comparative example electronic device, when sound waves generated from the speaker are transmitted along the acoustic conduit to the audio hall, the vibration of the sound waves causes vibration in the part of the electronic device 101 corresponding to the third part 233, thus generating noise, and the generated noise degrades the quality of the audio signal. In the electronic device 101 according to one embodiment, the vibration of the third part 233 is reduced because the acoustic conduit 502 and the space S2 in which the third part 233 is located are separated. As the vibration of the third part 233 is reduced, the quality of the audio signal provided by the electronic device 101 according to one embodiment is improved.

[0153] An electronic device 101 is provided. The electronic device 101 includes a frame 501 which includes a first frame part 510 and a second frame part 520 coupled to the first frame part 510 and including an audio hole 521. The electronic device 101 includes a display 230. The display 230 includes a first part 231 which is in contact with a display panel including a plurality of pixels, a second part 232 which is opposite to the first part 231 and connected to a display driver circuit 553 configured to control the display panel, and a third part 233 which connects the first part 231 and the second part 232. The third part 233 protrudes from the first part 231 in a first direction 261. The third part 233 is covered by the second frame part 520. The electronic device 101 includes a speaker 530 which is located within the frame 501. The electronic device 101 includes an acoustic conduit 502 that penetrates at least a portion of the frame 501 to connect the space S1 in front of the speaker 530 with the audio hall 521. The acoustic conduit 502 is separated from the space S2 in which the third portion 233 is located by at least a portion of the first frame part 510.

[0154] According to one embodiment, the acoustic conduit 502 includes a first conduit 502a and a second conduit 502b. The first conduit 502a includes the space S1 in front of the speaker 530. The first conduit 502a is connected in the first direction 261 to a through hole 514 that penetrates at least a portion of the frame 501. The second conduit 502b is connected to the audio hole 521. The second conduit 502b is connected in a second direction 262 opposite to the through hole 514 and the first direction 261.

[0155] According to one embodiment, the audio hole 521 is formed on one surface 501a of the frame 501 substantially facing the front of the electronic device 101.

[0156] According to one embodiment, the first frame part 510 includes a plate 540. The plate 540 further includes a plate 540 which is at least partially positioned between the space S2 in which the third part 233 is located and the acoustic conduit 502, thereby separating the space S2 in which the third part 233 is located from the first conduit 502a of the acoustic conduit 502.

[0157] According to one embodiment, the third portion 233 is located in the space S2 formed by the first frame part 510, the second frame part 520, and the plate 540.

[0158] According to one embodiment, the first frame part 510 includes a seating portion 515 that supports the plate 540 by contacting a portion of the plate 540. The electronic device 101 further includes a sealing member 560. The sealing member 560 is positioned between a portion of the plate 540 and at least a portion of the seating portion 515 to seal the space S2 in which the third portion 233 is located and the acoustic conduit 502.

[0159] According to one embodiment, the first frame part 510 includes a recess 511 that supports the first portion 231. The second frame part 520 is positioned within the recess 511 so as to be separated from the side wall 512 of the first frame part 510 formed by the recess 511. The acoustic conduit 502 includes a first conduit 502c and a second conduit 502d. The first conduit 502c is formed by the gap between the first frame part 510 and the second frame part 520. The first conduit 502c is connected to a through hole 514 of the first frame part 510. The second conduit 502d is connected to the space S1 in front of the speaker 530 and the through hole 514.

[0160] According to one embodiment, the second frame part 520 includes a flange portion 522 that overlaps with the third portion 233 and covers the third portion 233.

[0161] According to one embodiment, the electronic device further includes a housing 201. The housing 201 includes a first housing part 210 and a second housing part 220. The second housing part 220 is coupled to the first housing part 210 so as to be movable in the first direction 261 and the second direction 262 opposite to the first direction 261. A frame 501 is part of the second housing part 220.

[0162] According to one embodiment, a portion of the first portion 231 is bent into the first housing portion 210 based on the movement of the second housing portion 220.

[0163] According to one embodiment, the third portion 233 is covered by the frame 501 independently of the movement of the second housing portion 220.

[0164] According to one embodiment, the electronic device 101 further includes an adhesive tape 570. The adhesive tape 570 is positioned between the first portion 231 and the first frame part 510. The adhesive tape 570 connects the first portion 231 to the first frame part 510.

[0165] According to one embodiment, the third portion 233 is at least partially bent to connect the first portion 231 and the second portion 232.

[0166] According to one embodiment, the electronic device 101 further includes a printed circuit board 324 that is electrically connected to the display driving circuit 553. The printed circuit board 324 is positioned between the second portion 232 and the first frame portion 510.

[0167] According to one embodiment, the display 230 is electrically connected to the printed circuit board 324 via the third portion 233.

[0168] An electronic device 101 is provided. The electronic device 101 includes a housing 201, a display 230, a speaker 530, an acoustic conduit 502, and a plate 540. The housing 201 includes a first housing part 210 and a second housing part 220. The second housing part 220 is coupled to the first housing part 210 so as to be movable in the first direction 261 and in a second direction 262 opposite to the first direction 261. The second housing part 220 includes an audio hole 521. The display 230 includes first parts 231, 232 and a second part 233. The first parts 231, 232 are supported by the second housing part 220. The second part 233 protrudes from the first part 231 in the first direction 261. The second part 233 is covered by the second housing part 220. The speaker 530 is positioned in the second housing part 220. The acoustic conduit 502 connects the space S1 in front of the speaker 530 to the audio hole 521. The plate 540 is positioned at least partially between the acoustic conduit 502 and the space S2 in which the second part 233 is located, so as to separate the acoustic conduit 502 from the space S2 in which the second part 233 is located.

[0169] According to one embodiment, the second housing part 220 includes a first frame part 510 and a second frame part 520. The first frame part 510 supports the first portion 231. The second frame part 520 is coupled with the first frame part 510. The second frame part 520 covers the second portion 233. The second frame part 520 includes the audio hole 521.

[0170] According to one embodiment, the acoustic conduit 502 includes a first conduit 502a and a second conduit 502b. The first conduit 502a includes the space S1 in front of the speaker 530. The first conduit 502a is connected in the first direction 261 to a through hole 514 that penetrates at least a portion of the second housing part 220. The second conduit 502b is connected to the audio hole 521. The second conduit 502b is connected in a second direction 262 opposite to the through hole 514 and the first direction 261.

[0171] According to one embodiment, the second housing part 220 includes a seating portion 515 that supports the plate 540 by contacting a portion of the plate 540. The electronic device 101 further includes a sealing member 560. The sealing member 560 is positioned between a portion of the plate 540 and at least a portion of the seating portion 515 to seal the space in which the second part 233 is located and the acoustic conduit 502.

[0172] According to one embodiment, the second housing part 220 includes a first frame part 510 and a second frame part 520. The first frame part 510 includes a recess 511 that supports the first portion 231. The second frame part 520 is positioned within the recess 511 so as to be separated from the side wall 512 of the first frame part 510 formed by the recess 511. The acoustic conduit 502 includes a first conduit 502c and a second conduit 502d. The first conduit 502c is formed by the gap between the first frame part 510 and the second frame part 520. The first conduit 502c is connected to a through hole 514 of the first frame part 510. The second conduit 502d is connected to the space S1 in front of the speaker 530 and the through hole 514.

[0173] Electronic devices according to various embodiments of the present invention are devices of various forms. These electronic devices include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. However, the electronic devices according to embodiments of the present invention are not limited to the devices described above.

[0174] The various embodiments of the present invention and the terminology used herein should be understood to include various modifications, equivalents, or substitutions of the embodiments, and are not intended to limit the technical features described herein to any particular embodiment. In the description of the drawings, similar or related components may be given the same reference number. The singular form of a noun corresponding to an item includes one or more items unless otherwise clearly indicated in the context. In this specification, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B or C” includes any of the items listed together in the corresponding phrase of that phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first,” or “second” are used simply to distinguish that component from other corresponding components and do not limit that component to other aspects (e.g., importance or order). When one component (for example, the first) is referred to as "coupled" or "connected" to another component (for example, the second), either in combination with or without such terms, it means that some of the above components are connected to other components directly (for example, by wire), wirelessly, or via a third component.

[0175] As used in various embodiments of the present invention, the term "module" includes units implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit. A module may be a component configured as a whole, or the smallest unit or part thereof of a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an ASIC (application-specific integrated circuit).

[0176] Various embodiments of the present invention can be implemented as software (e.g., program 140) containing one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) invokes and executes at least one of the one or more instructions stored in the storage medium. This enables the machine to operate to perform at least one function in accordance with the invoked at least one instruction. The one or more instructions include code generated by a compiler or code executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, "non-transitory" simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0177] According to one embodiment, methods according to various embodiments of the present invention may be provided in a computer program product. The computer program product is traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a device-readable storage medium (e.g., CD-ROM (compact disc read-only memory)), or online (e.g., downloaded or uploaded) via an application store (e.g., Play Store®), or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product can be temporarily stored or temporarily generated on a device-readable storage medium such as the memory of the manufacturer's server, the application store's server, or an intermediary server.

[0178] According to various embodiments, each component of the above-mentioned components (e.g., a module or a program) may include one or more individuals, and some of the individuals may be separated and arranged in different components. According to various embodiments, one or more of the above-mentioned components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as they were performed by the respective components before integration. According to various embodiments, operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or empirically, or one or more operations may be performed in a different order or omitted, or one or more other operations may be added. [Explanation of Symbols]

[0179] 101 Electronic equipment 180 Camera Module 189 batteries 201 Housing 210 First Housing Part 210a, 511 recess 212 First Plate 212a, 311a, 326 aperture 220 Second Housing Part 230 displays 250-1 First image sensor 250-2 Second image sensor 311 First Cover 313, 501 frames 313a Rail 321 Second cover 321a, 510 First frame part 321b, 520 Second frame part 322 Second Plate 324, 327 Printed circuit boards 325 FPCB (Flexible Printed Circuit Board) 328 Camera decoration parts 331 Support member 360 Drive Unit 361 Motor 362 Pinion Gear 363 Rack Gear 370, 530 speakers 502 Acoustic conduit 512 Side wall 513 Sinkhole 514 Through hole 515 Seating area 516 Opening 521 Audio Hall 522 Flange section 523, 524 protruding part 540 Plate 550 Display Modules 553 Display driver circuit 554 Flexible glass 555 Protective layer 556 Protective Film 557 Adhesive layer 558a Spacer 558b Reinforcement member 560 Sealing component 570 Adhesive Tape 590 Protective Tape

Claims

1. In electronic devices, A frame comprising a first frame part and a second frame part, which is combined with the first frame part and includes an audio hole, The display and A speaker arranged within the aforementioned frame, The frame includes an acoustic conduit that penetrates at least a portion of the frame to connect the space in front of the speaker within the frame with the audio hall, The aforementioned display is A first portion that is in contact with a display panel containing multiple pixels, Contrary to the first part, a second part is connected to a display driver circuit configured to control the display panel, It includes a third portion that connects the first portion and the second portion, protrudes from the first portion in a first direction, and is covered by the second frame portion, The aforementioned acoustic conduit is An electronic device characterized in that at least a portion of the first frame part separates the third part from the space in which it is located.

2. The aforementioned acoustic conduit is A first conduit, including the space in front of the speaker, is connected to a through hole that penetrates at least a portion of the frame in the first direction, The electronic device according to claim 1, characterized in that it includes a second conduit connected to the audio hall and connected to the through hole in a second direction opposite to the first direction.

3. The aforementioned audio hall is The electronic device according to claim 1 or 2, characterized in that it is formed on one surface of the frame facing the front of the electronic device.

4. The first frame part described above includes a plate, The aforementioned plate is The electronic device according to any one of claims 1 to 3, characterized in that the third portion is at least partially positioned between the space in which the third portion is located and the acoustic conduit, thereby separating the space in which the third portion is located from the first conduit of the acoustic conduit.

5. The third part mentioned above is: The electronic device according to claim 4, characterized in that it is located in the space formed by the first frame part, the second frame part, and the plate.

6. The first frame part includes a seating portion that contacts a part of the plate and supports the plate, The aforementioned electronic device is The electronic device according to claim 4 or 5, further comprising a sealing member disposed between a part of the plate and at least a part of the seating portion, thereby sealing the space in which the third portion is located and the acoustic conduit.

7. The first frame part includes a recess that supports the second part, The second frame part is positioned within the recess so as to be separated from the side wall of the first frame part formed by the recess, The aforementioned acoustic conduit is A first conduit is formed by the gap between the first frame part and the second frame part and is connected to a through hole in the first frame part, The electronic device according to any one of claims 1 to 6, characterized in that it includes the space in front of the speaker and a second conduit connected to the through-hole.

8. The aforementioned second frame part is, The electronic device according to any one of claims 1 to 7, characterized in that it includes a flange portion that overlaps with the third portion and covers the third portion.

9. The housing further includes a first housing part and a second housing part coupled to the first housing part so as to be movable in a first direction and a second direction opposite to the first direction, The aforementioned frame is The electronic device according to any one of claims 1 to 8, characterized in that it is part of the second housing part.

10. Part of the first part mentioned above is, The electronic device according to claim 9, characterized in that it is bent into the interior of the first housing part based on the movement of the second housing part.

11. The third part mentioned above is: The electronic device according to claim 9 or 10, characterized in that it is covered by the frame independently of the movement of the second housing part.

12. The electronic device according to any one of claims 1 to 11, further comprising an adhesive tape positioned between the third portion and the first frame portion, and connecting the third portion to the first frame portion.

13. The third part mentioned above is: The electronic device according to any one of claims 1 to 12, characterized in that it is at least partially bent to connect the first part and the second part.

14. The system further includes a printed circuit board electrically connected to the display driving circuit, The aforementioned printed circuit board is The electronic device according to any one of claims 1 to 13, characterized in that it is positioned between the second part and the first frame part.

15. The aforementioned display is The electronic device according to claim 14, characterized in that it is electrically connected to the printed circuit board via the second portion.

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