Heat dissipation devices for electronic equipment

Abstract

To provide a heat dissipation device for electronic equipment that can significantly improve heat dissipation performance. [Solution] The heat dissipation device for electronic equipment includes a heat dissipation housing having an internal space with an open front, multiple types of heat-generating elements arranged in multiple vertical regions on the inner surface corresponding to the internal space of the heat dissipation housing, and multiple heat sink fins arranged on the rear surface of the heat dissipation housing, elongated in the vertical direction and detachably connected at predetermined distances apart in the left and right horizontal directions. The multiple heat sink fins are separated and arranged so as to be discontinuous in the vertical direction near the boundaries of the multiple regions.

Description

Technical Field

[0001] The present invention relates to a heat dissipation apparatus for an electronic device, and more particularly, to a heat dissipation apparatus for an electronic device that can improve higher heat dissipation performance corresponding to a plurality of heat generating elements having different heat generation amounts and heat generation positions.

Background Art

[0002] Related technologies in various industrial fields such as communication, electronics, and electricity tend to be continuously and highly developed for application to more advanced industries. High-level technology development requires high-output energy, and devices using high-output energy inevitably face the problem of high heat generation. Therefore, the development of a suitable level of heat dissipation system must also be accompanied.

[0003] Heat dissipation systems are used in various industries such as air conditioners, mobile communications, data centers, aviation mobility, electric vehicles, energy storage devices, and displays. Such heat dissipation systems are one of the main causes of power consumption, and power consumption tends to gradually increase with the development of the industry.

[0004] Generally, heat dissipation devices can be broadly divided into an Active Cooling Device and a Passive Cooling Device. The Active Cooling Device mainly utilizes forced convection by a fan, and the Passive Cooling Device can be classified as a technology that utilizes natural convection without using a fan.

[0005] However, conventional heat dissipation systems have limitations in dissipating the high heat generated by continuously evolving advanced technologies. Therefore, there is a need for innovative technologies that can solve these problems in related industrial fields, and as part of addressing this, heat dissipation devices using phase change materials are being developed.

[0006] Furthermore, electronic devices are equipped with multiple types of heating elements that operate electrically but generate different amounts of heat. However, depending on the application and actual usage of the electronic device, it may be unavoidable that multiple types of heating elements must dissipate heat through only one side.

[0007] In this case, a heat dissipation housing made of a thermally conductive material is provided to cover one of the aforementioned surfaces on which heat is dissipated, so as to facilitate heat dissipation from the internal space of the electronic device to the outside (outside air). Multiple heat sink fins may be provided integrally or detachably on the outer surface of the heat dissipation housing to increase the heat exchange area with the outside air.

[0008] However, if multiple heat sink fins are uniformly arranged vertically on the outer surface of the heat dissipation housing, without considering the different types of heat-generating elements and their respective positions, and without regard to interference from rising airflow, then when heat is concentrated towards the upper side due to rising airflow inside the electronic device, the heat dissipation requirement in the vertical direction changes, making uniform heat dissipation difficult.

[0009] Furthermore, if each individual heat sink fin in a multi-layer heat sink fin system is long enough to extend across the entire vertical surface of the heat dissipation housing, the heat conducted from the lower part of the electronic device's interior may, during its upward movement, affect heat-generating elements mounted in the upper part that are vulnerable to high temperatures, potentially leading to a degradation of the performance of those elements.

[0010] For example, in the case of a phase-changeable refrigerant used as a heat transfer medium, unlike cases where the heat dissipation performance depends on the thermal conductivity of the metal material itself, its superior heat dissipation performance can actually lead to a decrease in the function of heat-sensitive heating elements due to the high temperature of condensation heat generated when the gaseous refrigerant condenses into the liquid refrigerant. [Overview of the Initiative] [Problems that the invention aims to solve]

[0011] The present invention has been made to solve the above technical problems, and aims to provide a heat dissipation device for electronic equipment that dissipates internal heat with uniform heat dissipation performance throughout the entire vertical surface by mounting a plurality of heat sink fins on the back of the heat dissipation housing in a way that divides specific heat dissipation areas according to the vertical position on the back of the heat dissipation housing.

[0012] In addition, another objective of the present invention is to provide a heat dissipation device for electronic equipment that can prevent the reverse conduction of heat inside the heat dissipation housing, which occurs when the heat dissipation performance of multiple heat sink fins is dramatically high.

[0013] Furthermore, the present invention aims to provide a heat dissipation device for electronic equipment that enables rapid heat dissipation in the left-right horizontal direction of some high-heat generating elements.

[0014] Furthermore, the present invention aims to provide a heat dissipation device for electronic equipment that utilizes not only heat conduction due to the inherent material of multiple heat sink fins depending on their installation position, but also phase changes of a refrigerant.

[0015] Furthermore, another objective of the present invention is to provide a heat dissipation device for electronic equipment in which the range of the heat dissipation area in the vertical direction is divided and designed so as to minimize the degradation of the function of the heat-generating element due to condensation heat when multiple heat sink fins utilize the phase change of the refrigerant.

[0016] The technical problems of the present invention are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0017] One embodiment of a heat dissipation device for electronic equipment according to the present invention includes a heat dissipation housing having an internal space with an open front, multiple types of heat-generating elements arranged in multiple vertical regions on the inner surface corresponding to the internal space of the heat dissipation housing, and multiple heat sink fins arranged on the rear surface of the heat dissipation housing that are elongated in the vertical direction and attached and detached at predetermined distances apart in the left and right horizontal directions, wherein the multiple heat sink fins are separated and arranged to be discontinuous in the vertical direction near the boundaries of the multiple regions.

[0018] Here, the plurality of heat sink fins may be separated and arranged such that heat transfer of conductive heat is interrupted in the vertical direction relative to the rear surface of the heat dissipation housing.

[0019] Furthermore, when the multiple heat sink fins can be divided into an upper region located relatively above the rear surface of the heat dissipation housing, an intermediate region located in the middle, and a lower region located below, the heat sink fins may be provided on the rear surface of the heat dissipation housing so that they independently receive heat from the heat-generating elements located in each region and then dissipate the heat through independent heat transfer paths.

[0020] Furthermore, when the plurality of heat sink fins can be divided into an upper region located relatively above the rear surface of the heat dissipation housing, an intermediate region located in the middle, and a lower region located below, the plurality of heat sink fins may include an upper heat sink fin connected to the upper region to dissipate heat from the upper heat source located in the upper region among the plurality of types of heat sources, an intermediate heat sink fin connected to the intermediate region to dissipate heat from the intermediate heat source located in the middle region among the plurality of types of heat sources, and a lower heat sink fin connected to the lower region to dissipate heat from the lower heat source located in the lower region among the plurality of types of heat sources.

[0021] Further, the upper heat sink fins, the intermediate heat sink fins, and the lower heat sink fins may be arranged on a vertical line that is straight in the vertical direction.

[0022] Further, the upper heat sink fins and the intermediate heat sink fins have a first thermal conductivity, the lower heat sink fins have a second thermal conductivity that is relatively lower than the first thermal conductivity, and the upper heating element and the intermediate heating element located in the upper region and the intermediate region may dissipate heat at a higher temperature than the lower heating element located in the lower region.

[0023] Further, the interior of the upper heat sink fins and the intermediate heat sink fins is filled with a phase-changeable refrigerant, and the first thermal conductivity can be achieved by the flow caused by the phase change of the refrigerant.

[0024] Further, the lower heat sink fins can have the second thermal conductivity due to the thermal conductivity of the material itself.

[0025] Further, a part of the upper end of the upper heat sink fins may extend forward from the back surface of the heat dissipation housing, and an extended heat dissipation plate portion that covers at least a part of the upper surface of the heat dissipation housing may be integrally formed.

[0026] Further, the extended heat dissipation plate portion may be formed in a form in which the refrigerant flow space filled with the refrigerant inside the upper heat sink fins is expanded.

[0027] Further, in the intermediate region, in addition to the intermediate heating element, a high-heating element having a heat generation amount larger than that of the intermediate heating element is further located, and the intermediate region can be divided into an upper intermediate region including the part where the high-heating element is located and a lower intermediate region including the part where the high-heating element is not located.

[0028] Further, a plurality of heat pipes for dispersing the heat generated from the high heat-generating body in the horizontal direction of the heat dissipation housing to the left and right may be disposed on the inner surface of the internal space of the heat dissipation housing corresponding to the upper intermediate region.

[0029] Further, a press-fitting portion for installing the plurality of heat sink fins is further provided on the back surface of the heat dissipation housing. The press-fitting portion includes an upper press-fitting portion to which the upper heat sink fins among the plurality of heat sink fins are coupled, an intermediate press-fitting portion to which the intermediate heat sink fins among the plurality of heat sink fins are coupled, and a lower press-fitting portion to which the lower heat sink fins among the plurality of heat sink fins are coupled. When included, the back surface of the heat dissipation housing where the intermediate press-fitting portion is formed may be formed to be divided by a stepped surface.

[0030] Further, the front end portion of the intermediate heat sink fins located in the upper intermediate region may be recessed stepwise rearward from the front end portion of the intermediate heat sink fins located in the lower intermediate region.

[0031] Further, the upper heat sink fins and the intermediate heat sink fins may include a heat conduction panel body having a refrigerant flow space that provides a space for gas-liquid circulation in which the refrigerant releases heat while undergoing a phase change within a space filled with the refrigerant and closed.

[0032] Further, the refrigerant flow space includes a first refrigerant flow path as an evaporation region that is one end in the width direction for receiving heat from the upper heat-generating body and the intermediate heat-generating body that are heat dissipation targets in the heat conduction panel body, and a plurality are formed in the condensation region excluding the first refrigerant flow path. A second refrigerant flow path that serves as a flow path for the liquid-phase refrigerant condensed from the gaseous state to the liquid state among the refrigerants from the other end in the width direction of the heat conduction panel body to the first refrigerant flow path side by surface tension or gravity may be included.

[0033] Furthermore, the heat conduction panel bodies of the upper heat sink fins and intermediate heat sink fins may be provided in the shape of a plate made of SUS material, while the lower heat sink fins may be provided in the shape of a plate made of aluminum material, which has a higher thermal conductivity than the heat conduction panel bodies.

[0034] Furthermore, the heat conduction panel bodies of the upper heat sink fins and intermediate heat sink fins may be provided in the shape of a SUS plate material that forms the refrigerant flow space inside, while the lower heat sink fins may be provided in the shape of a SUS plate material that does not provide the refrigerant flow space. [Effects of the Invention]

[0035] The heat dissipation device for electronic equipment according to the present invention has the effect of significantly improving heat dissipation performance by preventing thermal deflection phenomena caused by multiple types of heat-generating elements inside a vertically elongated heat dissipation housing, thereby enabling heat dissipation with overall uniform performance.

[0036] In addition, the heat dissipation device for electronic equipment according to the present invention has the effect of protecting the heat-generating element, which is vulnerable to high temperatures inside, by preventing the reverse conduction phenomenon of heat that may occur due to the high heat dissipation performance of the multiple heat sink fins, thereby improving the reliability of the product. [Brief explanation of the drawing]

[0037] [Figure 1] These are front and rear perspective views showing a heat dissipation device for electronic equipment according to one embodiment of the present invention. [Figure 2A] Figure 1 is a front section exploded perspective view. [Figure 2B] Figure 1 is a rear section exploded perspective view. [Figure 3] Figure 1 is a partially exploded perspective view of the rear section illustrating the coupling relationships between the multiple heat sink fins in the configuration shown. [Figure 4] Figure 1 shows perspective views (a, b, c) and cross-sectional views (d, e) along lines AA and BB, illustrating the configuration of multiple heat sink fins. [Figure 5] Figure 1 is a projected perspective view showing the upper heat sink fin among the multiple heat sink fins. [Figure 6] Figure 5 is an exploded perspective view. [Figure 7] Figure 5 shows a partial incision oblique view (a), a magnified view of the same section (b), and a cross-sectional view thereof (c). [Figure 8] Figure 1 is an exploded perspective view illustrating the relationship between the multiple heat sink fins based on the type and mounting position of the heat-generating element in the configuration shown. [Figure 9] Figure 8 shows the rear view (a) and the side view (b). [Figure 10A] Figure 1 is a partially cutaway perspective view illustrating the coupling relationship of the heat pipes that distribute heat horizontally from left to right within the heat dissipation housing. [Figure 10B] Figure 1 is a partially cutaway perspective view illustrating the coupling relationship of the heat pipes that distribute heat horizontally from left to right within the heat dissipation housing. [Modes for carrying out the invention]

[0038] Hereinafter, a heat dissipation device for electronic equipment according to one embodiment of the present invention will be described in detail with reference to the attached drawings.

[0039] When assigning reference numerals to the components in each drawing, it should be noted that, as far as possible, identical components should have the same reference numeral even if they are shown in other drawings. Furthermore, when describing embodiments of the present invention, if it is determined that a specific description of such known configurations or functions would hinder understanding of the embodiments of the present invention, such detailed description will be omitted.

[0040] In describing the components of the embodiments of the present invention, terms such as First, Second, A, B, (a), (b), etc., may be used. Such terms are merely for distinguishing a component from other components, and do not limit the nature, order, or procedure of that component. Furthermore, unless otherwise specified, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains. Terms as defined in commonly used dictionaries should be interpreted as having the meaning consistent with their meaning in the context of the relevant art, and not in an ideal or overly formal sense unless explicitly defined in this application.

[0041] Figure 1 is a front and rear perspective view showing a heat dissipation device for electronic equipment according to one embodiment of the present invention, and Figures 2A and 2B are exploded perspective views of the front and rear sections of Figure 1, respectively.

[0042] Generally, heat-generating devices (electronic devices) are manufactured in a variety of forms across all industries. However, the applicant for this invention is a company engaged in the manufacture of other wireless communication devices. Therefore, in describing a heat dissipation device for electronic devices according to one embodiment of the present invention, an antenna device 1, which is a typical heat-generating device (electronic device) that the heat dissipation device targets, will be used as a specific example.

[0043] However, it should be noted that the electronic device to which the heat dissipation device of one embodiment of the present invention described later is applied should not necessarily be limited to antenna device 1 only, and that all specific terms used below for "antenna device 1" and "related components" should be interpreted as encompassing all similar electronic devices and their components.

[0044] First, let's explain antenna device 1, which was adopted as a typical example of electronic equipment, as follows.

[0045] An antenna device 1 to which a heat dissipation device according to one embodiment of the present invention is applied includes a heat dissipation housing 10 formed in a rectangular parallelepiped shape, which has an internal space 10S that opens to the front and is substantially long in the vertical direction and thin in the front-to-back accommodation width, as shown in Figures 1 to 2B.

[0046] Here, the heat dissipation housing 10 provides a location (internal space 10S) for various internal components, as described later, and is made of a robust material to protect the internal components from external impacts. In particular, it is preferable that the internal components be made of a metal material with excellent thermal conductivity so that the heat generated during system operation can be dissipated to the outside by utilizing the thermal conductivity of the material itself.

[0047] Inside the internal space 10S of the heat dissipation housing 10, an RF module 40 consisting of a combination of multiple MBF (Micro Bellows Filter) elements 41 and antenna elements 42 is arranged on the front side via a clamshell 25 as a substrate for a DTU (Digital Transceiving Unit), and a main board 20 with a type of heat-generating element mounted on the back side may be stacked.

[0048] Here, the main board 20 can be fitted with components that generate a large amount of heat during operation, such as RFIC elements or PA elements and FPGAs (see the reference numerals "21, 22, 22C" in Figure 8, described later).

[0049] However, in the embodiments of the present invention, the electronic device is merely used as the antenna device 1 for explanation, and it should be noted that the heating elements 21, 22, and 22C are not limited to the above configuration. For example, the heating elements 21, 22, and 22C could also be used as semiconductors, which are typical heating elements.

[0050] In addition, a PSU board 30, on which electrical components related to the PAU (Power Amplifier Unit) are mounted, may be stacked in the lower part of the internal space 10S of the heat dissipation housing 10 so as to have the same layer configuration as the main board 20.

[0051] However, the PSU board 30 does not necessarily have to be placed on the same layer as the main board 20 in the internal space 10S of the heat dissipation housing 10. It may be placed on different layer layers, taking into consideration the external shape or rearward protrusion length of the components mounted on the back of the main board 20 and the back of the PSU board 30.

[0052] For reference, the main board 20 described above is stacked in the upper region I and the intermediate region II of the internal space 10S of the heat dissipation housing 10, as will be described later (see Figure 8), and can generate a relatively higher amount of heat than the heat-generating electrical components of the PSU board 30, which is located in the lower region III below it.

[0053] On the other hand, a radome panel 50 is provided on the front of the internal space 10S of the heat dissipation housing 10, which protects the radiating element realized by the antenna element 42 from the outside, and at the same time plays a role in ensuring that radiation is carried out smoothly from the radiating element.

[0054] Here, since the radome panel 50 is made of a material through which the radiation beam of the radiating element can easily pass, it can be classified as a component that hinders the dissipation of system operating heat generated in the internal space 10S of the heat dissipation housing 10 toward the front. This can lead to the heat dissipation housing 10 itself being designed to be longer in the vertical direction in order to increase the heat dissipation surface area for concentrated heat dissipation toward the rear of the heat dissipation housing 10.

[0055] A heat dissipation device according to one embodiment of the present invention may be provided on the rear surface of such a heat dissipation housing 10. Here, the heat dissipation device according to one embodiment of the present invention may be provided by a plurality of heat sink fins 100 that protrude a predetermined distance rearward from the rear surface of the heat dissipation housing 10. A specific description of the plurality of heat sink fins 100 will be given later.

[0056] On the other hand, a heat dissipation device for electronic equipment according to one embodiment of the present invention may further include a finger guard assembly 60 provided to surround a portion of the rear and upper sides of the heat dissipation housing 10, as shown in Figures 2A and 2B, to prevent external objects (or people) from approaching the plurality of heat sink fins 100.

[0057] The finger guard assembly 60 may include a rear finger guard panel 61 positioned vertically vertically to cover the entire rear end of a plurality of heat sink fins 100; an upper top finger guard panel 62 whose rear end is connected to the upper end of the rear finger guard panel 61 and whose front end extends horizontally forward; a right finger guard panel 63 whose front end is connected to the right rear end of the heat dissipation housing 10 and whose rear end is connected to the right end of the rear finger guard panel 61, and which is positioned to cover the rear right portion of the heat dissipation housing 10; a left finger guard panel 64 whose front end is connected to the left rear end of the heat dissipation housing 10 and whose rear end is connected to the left end of the rear finger guard panel 61, and which is positioned to cover the rear left portion of the heat dissipation housing 10; and an upper front finger guard panel 65 positioned to cover the space between the front end of the upper top finger guard panel 62 and the front upper end of the heat dissipation housing 10.

[0058] Here, the right finger guard panel 63 and the left finger guard panel 64 may include upper side guard panels 63-1 and 64-1 provided above the clamping bracket 5 (described later), and lower side guard panels 63-2 and 64-2 provided below the clamping bracket 5.

[0059] Therefore, the upper side guard panels 63-1 and 64-1 can be divided into the right upper side guard panel 63-1, which corresponds to the right finger guard panel 63 provided above the clamping bracket 5, and the left upper side guard panel 64-1, which corresponds to the left finger guard panel 64 provided above the clamping bracket 5. The lower side guard panels 63-2 and 64-2 can be divided into the right lower side guard panel 63-2, which corresponds to the right finger guard panel 63 provided below the clamping bracket 5, and the left lower side guard panel 64-2, which corresponds to the left finger guard panel 64 provided below the clamping bracket 5.

[0060] On the other hand, the finger guard assembly 60 may further include guard mounting bars 66, 67, and 68 that provide predetermined screw fastening holes 69 for screw connections at each corner, while simultaneously reinforcing the rigidity of the corners.

[0061] Here, the rear finger guard panel to the front finger guard panels 61 to 65 described above are made of plastic material to reduce the weight of the overall antenna device 1, and the guard mounting bars 66, 67, and 68 described above may be manufactured in the shape of aluminum extruded bars for rigid reinforcement.

[0062] The guard mounting bars 66, 67, and 68 may further include a front end guard mounting bar 66 positioned between the upper top finger guard panel 62 and the upper front finger guard panel 65 and providing a plurality of screw fastening holes 69, a rear end guard mounting bar 67 positioned between the upper top finger guard panel 62 and the rear finger guard panel 61 and providing a plurality of screw fastening holes 69, and a lower end guard mounting bar 68 positioned at the lower end of the rear finger guard panel 61 and having a plurality of screw fastening holes 69 formed therein.

[0063] In addition, the finger guard assembly 60 must be able to allow air from the outside space (outside air) to flow in for heat exchange with the multiple heat sink fins 100 provided inside it, so multiple mesh (or grid) shaped ventilation holes 60h-1, 60h-2 may be formed therein.

[0064] The finger guard assembly 60 having such a configuration may be arranged to surround all of the heat sink fins 100 attached to the rear of the heat dissipation housing 10, except for the lower ends, as shown in Figures 1 to 2B.

[0065] On the other hand, clamping brackets 5, which mediate attachment to a support pole (not shown), may be provided at the left and right ends of the heat dissipation housing 10 so as to surround the outer surface of the rear finger guard panel 61 of the finger guard assembly 60 described above.

[0066] As described above, the clamping bracket 5 not only facilitates attachment to the support pole, but also functions as a handle that allows workers on site to grasp and move the antenna device 1 by hand. To facilitate this, hole-shaped handle holes 6 can be formed at both ends.

[0067] On the other hand, thermal contact portions 11, 12, and 13 may be formed on the inner surface of the internal space 10S of the heat dissipation housing 10, which are matched to the shape of the heat-generating elements 21, 22, 22C mounted on the back of the main board 20 or the back of the PSU board 30.

[0068] Here, the thermal contact portions 11, 12, and 13 may include heating element contact portions 11 and 12, which are provided in a shape that protrudes or is recessed in a manner that makes surface thermal contact with the heating elements 21, 22, and 22C mounted on the back of the main board 20, and a heat pipe contact portion 13, which is provided in a groove shape so that a plurality of heat pipes 140 (see Figure 8), described later, can be inserted into it.

[0069] On the other hand, the lower end of the heat dissipation housing 10 may further be provided with an external mounting member 70 for electrical or signal connection with the main board 20 of the internal space 10S. The external mounting member 70 can be understood as a component that serves as a connection terminal for all connecting lines, including power cables and wires, for connecting and supplying electricity or signals in general electronic equipment.

[0070] Figure 3 is a partially exploded perspective view of the rear to explain the coupling relationship of multiple heat sink fins in the configuration of Figure 1; Figure 4 is a perspective view (a, b, c) and a cross-sectional view (d, e) along lines AA and BB showing multiple heat sink fins in the configuration of Figure 1; Figure 5 is a projected perspective view showing the upper heat sink fin among the multiple heat sink fins of Figure 1; Figure 6 is an exploded perspective view of Figure 5; Figure 7 is a partially cut-out perspective view (a), a partially enlarged view (b), and a cross-sectional view (c) of Figure 5; Figure 8 is an exploded perspective view to explain the operational relationship of multiple heat sink fins depending on the type and mounting position of the heat-generating element in the configuration of Figure 1; Figure 9 is a rear view (a) and a side view (b) of Figure 8; Figures 10A and 10B are partially cut-out perspective views to explain the coupling relationship of heat pipes for dispersing heat horizontally from left to right inside the heat dissipation housing in the configuration of Figure 1.

[0071] As shown in Figure 3, a heat dissipation device for electronic equipment according to one embodiment of the present invention may include a plurality of heat sink fins 100 provided on press-fit portions 16, 17, and 18 formed on the rear surface of the heat dissipation housing 10.

[0072] Here, the press-fit portions 16, 17, and 18 may include an upper press-fit portion 17 to which the upper heat sink fin 110 of the plurality of heat sink fins 100 is joined, an intermediate press-fit portion 16 to which the intermediate heat sink fin 120 of the plurality of heat sink fins 100 is joined, and a lower press-fit portion 18 to which the lower heat sink fin 130 of the plurality of heat sink fins 100 is joined.

[0073] These press-fit portions 16, 17, and 18 are integrally formed on the rear surface of the heat dissipation housing 10 and may be provided in the shape of vertically elongated slit grooves so that a portion of the front end of a plurality of heat sink fins 100 can be inserted in a crimp-fit ​​configuration.

[0074] However, the press-fit portions 16, 17, and 18 may be formed by recessing the long slot grooves described above forward with respect to the back surface of the heat dissipation housing 10, or they may be formed by protruding rearward with respect to the back surface of the heat dissipation housing 10, such that a pair of slot ribs (not shown in the drawing reference numerals) form the long slot grooves described above.

[0075] Here, among the press-fit portions 16, 17, and 18, the intermediate press-fit portion 16 may be divided into an intermediate lower press-fit portion 16a into which the lower end of the intermediate heat sink fin 120 of the multiple heat sink fins 100 (described later) is inserted, and an intermediate upper press-fit portion 16b into which the upper end of the intermediate heat sink fin 120 is inserted.

[0076] The inner surface of the internal space 10S of the heat dissipation housing 10, where the intermediate upper press-fit portion 16b is formed, may be further projected slightly to the rear to form a heat pipe contact portion 13, which will be provided with a plurality of heat pipes 140, as described later.

[0077] Here, the depth of the slot grooves forming the intermediate upper press-fit portion 16b and the intermediate lower press-fit portion 16a, or the protruding length of the pair of slot ribs, are all formed to be the same. However, the back surface of the heat dissipation housing 10, which serves as the basis for their formation, may be formed such that each portion in which the intermediate upper press-fit portion 16b and the intermediate lower press-fit portion 16a are formed is separated by a stepped surface. This will be explained in more detail later.

[0078] On the other hand, in a heat dissipation device for electronic equipment according to one embodiment of the present invention, the plurality of heat sink fins 100 may include, as shown in Figures 1 to 3, an upper heat sink fin 110 and an intermediate heat sink fin 120 that actively dissipate heat generated from the heat-generating elements 21, 22, and 22C to the outside using a phase-change material, and a lower heat sink fin 130 that dissipates heat generated from the heat-generating elements 21, 22, and 22C to the outside using a heat conduction method based on the thermal conductivity of its own material, which is not a phase-change material.

[0079] Here, the multiple heat sink fins 100 are arranged on the rear surface of the heat dissipation housing 10 in a long vertical direction and are detachably connected at predetermined distances apart in the left and right horizontal directions. For the individual press-fit installation of the multiple heat sink fins 100, the multiple press-fit portions 16, 17, and 18 formed on the rear surface of the heat dissipation housing 10 may also be arranged in a long vertical direction and formed at predetermined distances apart in the left and right horizontal directions.

[0080] In this case, the multiple heat sink fins 100 may be separated and arranged so as to be discontinuous in the vertical direction near the boundaries of the multiple regions I, II, and III.

[0081] The arrangement of multiple heat sink fins 100 so as to be discontinuous in the vertical direction means that the phase change flow range of the refrigerant filled in the closed refrigerant flow spaces 111 and 112 provided inside each of the multiple heat sink fins 100 (described later) is separated into multiple areas in the vertical direction at the rear of the heat dissipation housing 10, or it means that the areas to which heat is transferred are physically separated.

[0082] More specifically, as shown in Figures 8 and 9, the aforementioned multiple regions I, II, and III can be divided into an upper region I located relatively above the rear surface of the heat dissipation housing 10, an intermediate region II located in the middle, and a lower region III located below.

[0083] In this case, the multiple heat sink fins 100 may include an upper heat sink fin 110 connected to the rear surface of the heat dissipation housing 10 corresponding to the upper region I in order to dissipate heat from the upper heat element 21 located in the upper region I among the multiple types of heat elements 21, 22, and 22C; an intermediate heat sink fin 120 connected to the rear surface of the heat dissipation housing 10 corresponding to the intermediate region II in order to dissipate heat from the intermediate heat elements 22 and 22C located in the intermediate region II among the multiple types of heat elements 21, 22, and 22C; and a lower heat sink fin 130 connected to the rear surface of the heat dissipation housing 10 corresponding to the lower region III in order to dissipate heat from the lower heat element (not shown, e.g., PSU electrical component) located in the lower region III among the multiple types of heat elements 21, 22, and 22C.

[0084] Thus, the multiple heat sink fins 100, which are provided in different types across three vertical regions, may be arranged such that the upper heat sink fin 110, the intermediate heat sink fin 120, and the lower heat sink fin 130 are aligned on a vertical line that is straight in the vertical direction, so that when the hot air generated by heat dissipation in the vertical direction forms an upward airflow, it can be easily discharged upward without interference.

[0085] The multiple heat sink fins 100 configured as described above can be press-fitted into pre-formed press-fit portions 16, 17, and 18 on the back of the heat dissipation housing 10 using a press-fit method.

[0086] At this time, although not shown in the drawings, it is preferable that the press-fit portions 16, 17, and 18 are treated with thermal epoxy to improve heat transfer efficiency, and then the aforementioned multiple heat sink fins 100 are press-fitted into them.

[0087] The upper heat sink fin 110 and the intermediate heat sink fin 120 of the multiple heat sink fins 100 may have a first thermal conductivity, while the lower heat sink fin 130 may have a second thermal conductivity that is relatively lower than the first thermal conductivity.

[0088] As will be described later, the upper heat sink fin 110 and the intermediate heat sink fin 120 are equipped with a heat conduction panel body made of SUS (stainless steel) plate material, and it is known that SUS material has a lower thermal conductivity than metals such as aluminum (Al). However, the upper heat sink fin 110 and the intermediate heat sink fin 120 can smoothly release heat due to the phase change of the refrigerant in the refrigerant flow spaces 111 and 112 which are filled with refrigerant inside, and as a result the upper heat sink fin 110 and the intermediate heat sink fin 120 have a higher thermal conductivity than the lower heat sink fin 130.

[0089] Therefore, the upper heat sink fin 110 and the intermediate heat sink fin 120 are located in the upper region I and intermediate region II, and are used to dissipate heat from relatively high heat-generating elements 21, 22, and 22C, while the lower heat sink fin 130 is located in the lower region III, and may be used to dissipate heat from relatively low heat-generating elements (for example, electrical components on a PSU board).

[0090] However, the definitions of the positions of the upper region to the lower regions I to III are merely limitations used for understanding the heat dissipation device for electronic equipment according to one embodiment of the present invention. High-heat-generating elements 21, 22, and 22C are not necessarily placed in the upper region I and the intermediate region II, and low-heat-generating elements are not necessarily placed in the lower region III. Their positions may be mixed.

[0091] Here, the upper heat sink fin 110 may have a portion of its upper end extending forward beyond the press-fit portion (e.g., upper press-fit portion 17) into the rear of the heat dissipation housing 10, and an extended heat dissipation plate portion 105 may be integrally formed to cover at least a portion of the rear upper end of the heat dissipation housing 10.

[0092] The fact that the extended heat sink portion 105 is further formed integrally with the upper heat sink fin 110 is equivalent to increasing the phase change flow range of the refrigerant filling the internal refrigerant flow spaces 111 and 112 to a wider area.

[0093] In other words, the extended heat sink portion 105 can be formed in a manner that expands the refrigerant flow spaces 111 and 112, into which refrigerant is filled, inside the upper heat sink fins 110.

[0094] This is related to the fact that it increases the heat dissipation area through heat exchange with the outside air via a single upper heat sink fin 110.

[0095] Therefore, the extended heat dissipation plate portion 105 formed on the upper side of the upper heat sink fin 110 plays a role in guiding and conducting the heat transferred from the upper heat-generating element 21 in the upper region I to the outside air space above the heat dissipation housing 10, thereby enabling heat to be dissipated with higher heat dissipation performance.

[0096] On the other hand, in the intermediate region II, in addition to the intermediate heating element 22, a high-heat heating element 22C having a greater heat generation capacity than the intermediate heating element 22 can be further positioned. In one embodiment of the present invention, assuming that an antenna device 1 is used as the electronic device, the upper heating element 21 and the intermediate heating element 22 can be defined as RFIC elements or PA elements that generate a slightly higher amount of heat during their electrical operation, while the high-heat heating element 22C can be defined as an FPGA element.

[0097] In this case, intermediate region II can be divided into an upper intermediate region II-U, which includes the area where the high-heat-generating element 22C is located, and a lower intermediate region II-D, which includes the area where the high-heat-generating element 22C is not located and only the intermediate heating element 22 is located.

[0098] Here, a plurality of heat pipes 140 may be arranged on the inner surface of the internal space 10S of the heat dissipation housing 10, which corresponds to the upper intermediate region II-U, in order to disperse the heat generated from the high heat-generating element 22C in the left-right horizontal direction of the heat dissipation housing 10.

[0099] In particular, the front end of the intermediate heat sink fin 120 located in the upper intermediate region II-U may be recessed in a stepped manner behind the front end of the intermediate heat sink fin 120 located in the lower intermediate region II-D.

[0100] As described above, this is due to the fact that each portion of the back surface of the heat dissipation housing 10, where the intermediate upper press-fit portion 16b and the intermediate lower press-fit portion 16a are formed, is divided by a stepped surface. This is a change in shape design to accommodate the intermediate upper press-fit portion 16b, which protrudes further to the rearward side of the back surface of the heat dissipation housing 10, in order to secure space for the installation of the multiple heat pipes 140 arranged in the upper intermediate region II-U.

[0101] On the other hand, the upper heat sink fin 110 and the intermediate heat sink fin 120 among the multiple heat sink fins 100 include heat conduction panel bodies 110A and 110B, as shown in Figures 4 to 7, which have refrigerant flow spaces 111 and 112 that provide a space for gas-liquid circulation in which the refrigerant undergoes a phase change and releases heat within a closed space filled with refrigerant.

[0102] However, the upper heat sink fin 110 and the intermediate heat sink fin 120 are identical in that they both have refrigerant flow spaces 111 and 112 inside the heat conduction panel bodies 110A and 110B, except for the difference in the formation of the extended heat dissipation plate portion 105 described above. Therefore, although only the drawing of the upper heat sink fin 110 will be used in the following explanation, it can be understood that their detailed functions and configurations are all identical.

[0103] Here, although not shown in the drawings, the heat conduction panel bodies 110A and 110B are made of a single metal panel member and are formed by processing them using a predetermined bending method and joining them along their edges to create a sealed refrigerant flow space 111 and 112 as described above.

[0104] However, the method for forming the refrigerant flow spaces 111 and 112 is not necessarily limited to applying the single metal panel member type and bending method described above. It goes without saying that, as shown in Figures 4 to 7, it is also possible to join the entire edges of two metal panel members 110A and 110B using a predetermined joining method to form the refrigerant flow spaces 111 and 112 inside them.

[0105] Here, the refrigerant flow spaces 111 and 112, as shown in Figures 4 to 7, correspond to evaporation regions where the liquid-phase refrigerant filled inside evaporates due to heat transferred from the heat-generating elements 21, 22, and 22C. They may include a first refrigerant flow path 111, which is formed to be long in the vertical direction, and a second refrigerant flow path 112, which is formed in the condensation region other than the evaporation region. One end of the second refrigerant flow path 111 communicates with the first refrigerant flow path 111, and the other end is formed to be higher in the direction of gravity than the aforementioned end, and is inclined in the rearward oblique direction. The second refrigerant flow path 112 guides the liquid-phase refrigerant condensed from the condensation region to flow towards the first refrigerant flow path 111.

[0106] The shape of the second refrigerant flow path 112 can be defined by a plurality of inclined guides 112a that protrude toward the refrigerant flow spaces 111 and 112, so as to prevent substantially condensed liquid-phase refrigerant from falling directly in the direction of gravity, and so as to guide an inclined flow toward the first refrigerant flow path 111 due to the surface tension properties of the liquid.

[0107] Multiple strength-reinforcing portions 113 may be symmetrically formed in the heat-conducting panel bodies 110A and 110B, which correspond to the condensation region, so as to protrude into the interior of the refrigerant flow spaces 111 and 112, respectively.

[0108] When the heat conduction panel bodies 110A and 110B are joined to each other by bending or joining methods, the multiple strength-reinforcing parts 113 can serve to reinforce the overall strength of the heat conduction panel bodies 110A and 110B by joining their opposing parts inside the refrigerant flow spaces 111 and 112 using various joining methods such as laser welding.

[0109] Furthermore, the multiple strength-reinforcing sections 113 can also play a role in promoting active condensation by providing a larger interference area for the vaporized gaseous refrigerant that has vaporized for heat dissipation in the condensation region.

[0110] In addition, the multiple strength-reinforcing sections 113 are formed by recessing from the outer surface of the planar heat-conducting panel bodies 110A and 110B toward the refrigerant flow space 111 and 112, thereby creating a larger contact area with the outside air and additionally enabling more active heat exchange.

[0111] On the other hand, an absorber 116 may be further provided in the evaporation region corresponding to the first refrigerant flow path 111, which absorbs the liquid phase refrigerant and then allows the absorbed liquid phase refrigerant to vaporize actively due to the heat provided by the heating elements 21, 22, and 22C.

[0112] The absorbent 116 is preferably made of a fibrous material such as a nonwoven fabric with multiple pores formed on it, and also preferably made of a material that can disperse and move the liquid phase refrigerant by capillary action (or its own absorption capacity) against gravity in the vertical direction (i.e., in the opposite direction to gravity) at least up to a predetermined height, given that it is positioned on the first refrigerant flow path 111 which is formed to be long in the vertical direction.

[0113] However, if an extended heat sink portion 105 is further provided on the upper side, such as the upper heat sink fin 110, auxiliary absorbers 117 and 118 may also be further provided in any part of the second refrigerant flow path 112 that forms a boundary with the extended heat sink portion 105.

[0114] The auxiliary absorbers 117 and 118 can be placed on the auxiliary absorber installation sections 114 and 115, which are modified to have a wider width in part of the second refrigerant flow path 112.

[0115] The auxiliary absorbers 117 and 118 may include a first auxiliary absorber 117 provided in the middle portion of the upper heat sink fin 110 and a second auxiliary absorber 118 provided at the boundary portion of the extended heat sink plate portion 105.

[0116] In addition, auxiliary absorber installation sections 114 and 115 may also be provided at two locations, respectively, for the individual installation of the first auxiliary absorber 117 and the second auxiliary absorber 118.

[0117] In particular, the auxiliary absorbers 117 and 118 may be fitted together during the interlocking molding of the heat conduction panel bodies 110A and 110B so that the one-sided auxiliary absorbers 117A and 118A and the other-sided auxiliary absorbers 117B and 118B do not flow with respect to the multiple fixing ribs 119 in between.

[0118] On the other hand, although not shown in the drawings, spacer protrusions may be provided to stably fix the absorber 116 which is positioned inside the vertically elongated first refrigerant flow path 111. The aforementioned multiple fixing ribs 119 play the same role as the spacer protrusions for fixing the absorber 116 in stably fixing the auxiliary absorbers 117 and 118.

[0119] Such fixing ribs 119 can be formed integrally during the molding of the pair of heat conduction panel bodies 110A and 110B.

[0120] Here, it is preferable that the lower ends of the auxiliary absorbers 117 and 118 are interconnected to the absorber 116. This is because the condensed refrigerant (liquid phase refrigerant) absorbed by the auxiliary absorbers 117 and 118 is easily and naturally seeped into the absorber 116 side (or the first refrigerant flow path 111 side) that is closest to the heating elements 21, 22, and 22C.

[0121] On the other hand, the heat conduction panel bodies 110A and 110B of the upper heat sink fin 110 and the intermediate heat sink fin 120 may be provided in the shape of a plate made of SUS material (stainless steel), while the lower heat sink fin 130 may be provided in the shape of a plate made of aluminum material (Al material), which has a higher thermal conductivity than the heat conduction panel bodies 110A and 110B of the upper heat sink fin 110 and the intermediate heat sink fin 120.

[0122] The heat dissipation effect of the lower heat sink fin 130, made of aluminum, is expected to be far higher than that of the upper heat sink fin 110 and intermediate heat sink fin 120, based on the thermal conductivity of the material itself. Furthermore, in the case of a heat transfer method using a phase change material, as with the upper heat sink fin 110 and intermediate heat sink fin 120, the lower heat sink fin 130 has a significant effect in improving heat dissipation performance. Therefore, it can be adopted as a heat dissipation configuration suitable for heat-generating elements (such as PSU electrical components) that have a relatively low heat output among the heat-generating elements provided in the internal space 10S of the heat dissipation housing 10.

[0123] However, the lower heat sink fin 130 does not necessarily have to be made of a different metal material than the upper heat sink fin 110 and the intermediate heat sink fin 120; it can also be provided in the same SUS material as the upper heat sink fin 110 and the intermediate heat sink fin 120, but in the shape of a plate.

[0124] In other words, the heat conduction panel bodies 110A to 110B, which form the upper heat sink fin 110 and the intermediate heat sink fin 120, are provided in the shape of a SUS plate material that forms refrigerant flow spaces 111 and 112 inside, and the lower heat sink fin 130 is also provided in the shape of a SUS plate material, and does not have refrigerant flow spaces 111 and 112, and can transfer heat simply by the thermal conductivity of the SUS material itself.

[0125] On the other hand, in the case of the high-heat-generating element 22C located in the upper intermediate region II-U, there is a potential problem that it may be negatively affected by heat due to the high heat transfer performance of the intermediate heat sink fin 120 using a phase-change material.

[0126] More specifically, as shown in Figures 8 and 9, in the case of a high-heat-generating element 21C such as an FPGA element located in the upper intermediate region II-U, there is concern that the high temperature at the front end of the intermediate heat sink fin 120 may actually cause thermal damage.

[0127] To resolve these issues, multiple heat pipes 140 may be provided on the inner surface of the internal space 10S of the heat dissipation housing 10, which corresponds to the upper intermediate region II-U, to disperse the heat generated from the high heat-generating element 21C in the left-right horizontal direction of the heat dissipation housing 10.

[0128] In this heat pipe 140 as well, a phase-changeable refrigerant is filled inside the closed interior, and the refrigerant undergoes a phase change to a gaseous refrigerant due to the heat provided by the high-heat-generating element 21C. The gaseous refrigerant diffuses through an internal wick structure (not shown) with multiple pores, and then undergoes a phase change to a liquid refrigerant by condensing through heat exchange with the inner surface of the heat dissipation housing 10 (particularly the heat pipe contact portion 13).

[0129] In particular, the multiple heat pipes 140 are arranged such that at least one end of each heat pipe is in surface thermal contact with the heat-generating surface of the high-heat-generating element 21C, and the other end extends to the left or right end of the heat dissipation housing 10. This ensures that the high-temperature concentrated heat supplied from the high-heat-generating element 21C is uniformly distributed and supplied to the multiple intermediate heat sink fins 120 spaced a predetermined distance apart horizontally on the rear side of the heat dissipation housing 10. Thus, the heat dissipation device for electronic equipment according to one embodiment of the present invention offers the advantage of ensuring higher heat dissipation performance compared to dissipating heat generated from multiple types of heat-generating elements 21, 22, and 22C using multiple heat sink fins uniformly arranged vertically. By providing each heat-generating element 21, 22, and 22C to be responsible for a specific region (e.g., upper region, middle region, lower region, etc.) suitable for the amount of heat generated, and dissipating heat in a vertically divided manner, the heat dissipation device ensures higher heat dissipation performance.

[0130] In particular, the heat dissipation device for electronic equipment according to one embodiment of the present invention was described using "antenna device 1" and its accessory components, which are representative electronic equipment and familiar to the applicant of the present invention, as an example. However, it can be said that the technical feature is that it can be applied to any device, regardless of its name, as long as it relates to heat dissipation of heat-generating elements with different heat generation amounts in multiple regions.

[0131] An embodiment of the heat dissipation device for electronic equipment according to the present invention has been described in detail above with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the embodiment described above, and it goes without saying that various modifications and equivalent implementations are possible by persons with ordinary skill in the art to which the present invention pertains. Therefore, the true scope of the present invention is defined by the claims described later. [Industrial applicability]

[0132] The present invention provides a heat dissipation device for electronic equipment that ensures that internal heat is dissipated with uniform heat dissipation performance throughout the entire vertical surface by mounting multiple heat sink fins on the back of the heat dissipation housing in a way that divides specific heat dissipation areas according to their vertical position on the back of the heat dissipation housing. [Explanation of symbols]

[0133] 1: Antenna device, 10: Heat dissipation housing 20: Main board, 21: Upper heat source 22C: High-heating element, 22: Intermediate-heating element 25: Clamshell, 30: PSU board 40: RF module, 41: MBF element 42: Antenna element, 50: Radome panel 60: Finger guard assembly, 60h-1, 60h-2: Ventilation holes 70: External mounting component, 100: Multiple heat sink fins 110: Upper heatsink fins, 120: Middle heatsink fins 130: Lower heatsink fins

Claims

1. A heat dissipation housing having an internal space with an open front, Multiple types of heat-generating elements are arranged in multiple vertical regions on the inner surface corresponding to the internal space of the heat dissipation housing, The heat dissipation housing includes a plurality of heat sink fins that are arranged vertically and detachably on the rear surface, with each fin spaced a predetermined distance apart in the left and right horizontal directions. The aforementioned multiple heat sink fins are separated and arranged so as to be discontinuous in the vertical direction near the boundaries of multiple regions, in a heat dissipation device for electronic equipment.

2. The heat dissipation device for electronic equipment according to claim 1, wherein the plurality of heat sink fins are separated and arranged such that heat transfer of conductive heat is interrupted in the vertical direction relative to the rear surface of the heat dissipation housing.

3. The heat dissipation device for electronic equipment according to claim 1, wherein the plurality of heat sink fins are provided on the back of the heat dissipation housing such that when the plurality of regions can be divided into an upper region located relatively above the back of the heat dissipation housing, an intermediate region located in the middle, and a lower region located below, the heat sink fins independently receive heat from the heat-generating elements located in each region and then dissipate the heat through independent heat transfer paths.

4. The aforementioned plurality of heat sink fins are When the multiple regions can be divided into an upper region located relatively above the rear surface of the heat dissipation housing, an intermediate region located in the middle, and a lower region located below, An upper heat sink fin is coupled to the upper region in order to dissipate heat from the upper heat source located in the upper region among the multiple types of heat sources, An intermediate heat sink fin is coupled to the intermediate region in order to dissipate heat from the intermediate heat source located in the intermediate region among the multiple types of heat sources, A heat dissipation device for an electronic device according to claim 1, comprising a lower heat sink fin coupled to the lower region for dissipating heat from the lower heating element located in the lower region among the plurality of heating elements.

5. The heat dissipation device for electronic equipment according to claim 4, wherein the upper heat sink fin, the intermediate heat sink fin, and the lower heat sink fin are arranged on a vertical line that is in a straight line in the vertical direction.

6. The upper heat sink fin and the intermediate heat sink fin have a first thermal conductivity, The lower heat sink fin has a second thermal conductivity that is relatively lower than the first thermal conductivity. The heat dissipation device for electronic equipment according to claim 4, wherein the upper heating element and the intermediate heating element located in the upper and intermediate regions dissipate heat at a higher temperature than the lower heating element located in the lower region.

7. The heat dissipation device for electronic equipment according to claim 6, wherein the upper heat sink fin and the intermediate heat sink fin are filled with a phase-changeable refrigerant, and the flow due to the phase change of the refrigerant provides the first thermal conductivity.

8. The heat dissipation device for electronic equipment according to claim 6, wherein the lower heat sink fin has the second thermal conductivity due to the thermal conductivity of the material itself.

9. The heat dissipation device for electronic equipment according to claim 6, wherein a portion of the upper end of the upper heat sink fin extends forward beyond the back surface of the heat dissipation housing, and an extended heat dissipation plate portion is integrally formed to cover at least a portion of the upper surface of the heat dissipation housing.

10. The heat dissipation device for electronic equipment according to claim 9, wherein the extended heat dissipation plate portion is formed in such a way that the refrigerant flow space, in which refrigerant is filled inside the upper heat sink fin, is expanded.

11. In the aforementioned intermediate region, in addition to the intermediate heating element, a high-heat heating element having a greater heat output than the intermediate heating element is further positioned. The heat dissipation device for electronic equipment according to claim 6, wherein the intermediate region is divided into an upper intermediate region including the portion where the high-heat-generating element is located, and a lower intermediate region including the portion where the high-heat-generating element is not located.

12. A heat dissipation device for electronic equipment according to claim 11, wherein a plurality of heat pipes are arranged on the inner surface of the internal space of the heat dissipation housing corresponding to the upper intermediate region, for dispersing the heat generated from the high heat-generating element in the left-right horizontal direction of the heat dissipation housing.

13. The rear surface of the heat dissipation housing is further provided with press-fitting sections for installing the plurality of heat sink fins. When the press-fit portion includes an upper press-fit portion to which the upper heat sink fin of the plurality of heat sink fins is joined, an intermediate press-fit portion to which the intermediate heat sink fin of the plurality of heat sink fins is joined, The heat dissipation device for electronic equipment according to claim 12, wherein the back surface of the heat dissipation housing on which the intermediate press-fit portion is formed is formed to be separated by a stepped surface.

14. The heat dissipation device for electronic equipment according to claim 12, wherein the front end of the intermediate heat sink fin located in the upper intermediate region is recessed in a stepped manner behind the front end of the intermediate heat sink fin located in the lower intermediate region.

15. The heat dissipation device for electronic equipment according to claim 4, wherein the upper heat sink fin and the intermediate heat sink fin include a heat conduction panel body having a refrigerant flow space that provides a space for gas-liquid circulation so that the refrigerant is filled with a refrigerant and released heat while undergoing a phase change within a closed space.

16. The aforementioned refrigerant flow space is The heat conduction panel body includes a first refrigerant flow path, which is an evaporation region at one end in the width direction that receives heat from the upper heating element and the intermediate heating element, which are the targets for heat dissipation, A heat dissipation device for electronic equipment according to claim 15, comprising: a plurality of second refrigerant channels formed within the condensation region excluding the first refrigerant channel, wherein liquid-phase refrigerant, which has condensed from a gaseous state to a liquid state, acts as a flow path toward the first refrigerant channel side by surface tension or gravity from the other end in the width direction of the heat conduction panel body.

17. The heat conduction panel bodies of the upper heat sink fin and the intermediate heat sink fin are provided in the shape of a plate made of SUS material. The heat dissipation device for electronic equipment according to claim 15, wherein the lower heat sink fin is provided in the shape of a plate made of aluminum, which has a higher thermal conductivity than the heat conduction panel body.

18. The heat conduction panel bodies of the upper heat sink fins and intermediate heat sink fins are provided in the shape of a plate made of SUS material that forms the coolant flow space. The heat dissipation device for electronic equipment according to claim 15, wherein the lower heat sink fin is provided in the shape of a plate made of SUS material that does not have the coolant flow space.

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