Thermal control devices
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- NORTHROP GRUMMAN SYSTEMS CORP
- Filing Date
- 2024-06-06
- Publication Date
- 2026-08-03
Smart Images
Figure 2026525736000001_ABST
Abstract
Description
Technical Field
[0005] ,
[0004] , , , ,
[0001] The present disclosure generally relates to devices, systems, and methods for thermal regulation of electronic components.
Background Art
[0002] Electronic circuits are typically tested over a certain temperature range to ensure the effectiveness of their operation under various environmental conditions. A brazed cooling plate is used to thermally regulate the temperature of an electronic circuit undergoing a thermal test. A thermal regulation fluid is directed through channels integrated into the brazed cooling plate via an inlet and an outlet. The temperature of the thermal regulation fluid is adjusted via a thermal regulation fluid source. The brazed cooling plate is permanently attached to a heat sink connected to the electronic circuit. Even after the test is completed, the brazed cooling plate is not removed from the heat sink.
Summary of the Invention
[0003] The following presents a simplified summary to provide a basic understanding of the present disclosure. This summary is not an extensive overview of the disclosed subject matter. It is not intended to identify key / important elements or to limit the scope of the present disclosure. Its sole purpose is to present some concepts of the present disclosure in a simplified form as a prelude to the more detailed description that is presented later.
[0004] An example of the present disclosure is a thermal regulation device including a head portion including an inlet port and an outlet port, and a tubular rod portion in fluid communication with the head portion at a first end and closed at a second end opposite the first end. An axial cartridge is disposed within the tubular rod portion, and the axial cartridge provides heat transfer to the outer surface of the tubular rod portion. The tubular rod portion is removably fitted to the device to provide heat transfer to the device.
[0005] Another example of the present disclosure includes a method for thermally testing a device, which includes providing a thermal control system comprising a thermal control fluid source, a thermal control device, and a device to be thermally controlled. The thermal control device is removably fitted to the device. The thermal control fluid source is removably coupled to the thermal control device. The thermal control device is thermally controlled via a thermal control fluid from the thermal control fluid source. The thermal control device is then removed from the device.
[0006] A further example of the present disclosure is a thermal testing system comprising an electronic circuit assembly with a heat sink and a thermal control device detachably coupled to the heat sink of the electronic circuit assembly. A thermal control fluid source is detachably coupled to the thermal control device to supply thermal control fluid to the thermal control device. The thermal control device is configured to receive and discharge thermal control fluid from the thermal control fluid source to regulate heat transfer to the electronic circuit assembly via the heat sink. [Brief explanation of the drawing]
[0007] The accompanying drawings, incorporated into and constituting part of the specification, illustrate various systems, methods, and other examples of the disclosure. Element boundaries illustrated in the drawings (e.g., boxes, groups of boxes, or other shapes) represent examples of boundaries. In some examples, one element can be designed as multiple elements, or multiple elements can be designed as a single element. In some examples, an element shown as an internal component of another element can be implemented as an external component, and vice versa. [Figure 1] Figure 1 is an exemplary block diagram of an exemplary thermal testing system. [Figure 2] Figure 2 is an opaque perspective view of an exemplary thermal control device. [Figure 3] Figure 3 is a transparent perspective view of an exemplary thermal control device. [Figure 4] Figure 4 is a cross-sectional view of an exemplary thermal control device. [Figure 5]Figure 5 is a perspective view of a thermal control device inserted into a heat sink. [Figure 6] Figure 6 shows an example of a method for thermally testing a device using a thermal control device. [Modes for carrying out the invention]
[0008] Hereafter, the disclosure will be described with reference to drawings, where similar reference numbers are used throughout to refer to similar elements. In the following description, for the sake of clarity and to allow for a full understanding of the disclosure, numerous specific details have been included. However, it will be apparent that the disclosure can be carried out without these specific details. In other examples, well-known structures and devices are shown in block diagram form to facilitate the description of the disclosure.
[0009] While certain features are described herein (e.g., thickness, orientation, configuration, etc.), it should be understood that the features, functions, and benefits of this disclosure may adopt features different from those described herein. These alternatives should be included within the scope of the disclosures and claims appended herein.
[0010] Disclosed herein is a thermal control device for regulating the temperature or temperature range of a device (e.g., an electronic component, an electronic circuit, etc.) during thermal testing of the device (via heat transfer), which overcomes the inconveniences described below. As used herein, the term “device” refers to any of the various devices for which thermal control and / or testing is required, necessary, and / or advantageous, and is not limited to electronic circuits. The thermal control device comprises a head portion and a tubular rod portion integrated with the head portion. The head portion includes an inlet for receiving a thermal control fluid and an outlet for discharging the thermal control fluid. The tubular rod portion is insertable into and removable from a device assembly (e.g., an electronic circuit assembly) to regulate the temperature or temperature range of a device within the device assembly. During testing, the tubular rod portion is inserted into a female mating port of the circuit assembly (e.g., a female mating port of a heat sink), and the thermal control fluid flows into the inlet and out through the tubular rod portion from the outlet. The temperature of the thermal control fluid is controlled by a thermal control fluid source and can be adjusted to a desired temperature or temperature range based on the device in the device assembly. An axial cartridge is positioned inside the tubular rod portion. The axial cartridge includes fins to facilitate the transfer of the thermal control fluid temperature to the outer surface of the tubular rod portion. Once testing is complete, the thermal control device can be removed from the device assembly and reinstalled and reused for additional testing against other devices.
[0011] The simple design of the thermal control device allows it to be manufactured as a single component by an additive manufacturing process. The additive manufacturing process ensures that the thermal control device has a continuous (smooth) outer surface. A continuous surface avoids discontinuities such as joints or welds that could cause leakage in the tubular rod portion and prevent it from being inserted into and removed from the female mating port of the device assembly. The tubular rod portion of the thermal control devices described herein and shown in the drawings has a circular cross-section, but the cross-section can be any shape that facilitates the transfer of the temperature of the thermal control fluid to the outer surface of the tubular rod portion.
[0012] In addition, the simple design of the thermal control device allows for the modification of the thermal control fluid (e.g., air, water, PAO, EGW, JP-8, alcohol, etc.) to suit specific requirements (e.g., test bench, product application (e.g., temperature tuning, tactical application, etc.)) without the need to change the mating components (e.g., heat sink) and without fluid contamination of the mating components. In other words, separate thermal control devices can be used for different control fluids. Therefore, if a different thermal control fluid is desired, the thermal control device can be easily replaced with another one that has the desired control fluid. Consequently, purging of the thermal control device is not necessary, and as a result, fluid cross-contamination is not a problem.
[0013] An example of a conventional thermal control device comprises a brazed plate attached to the surface of a heatsink of a device assembly (e.g., an electronic circuit assembly). The device assembly includes the device to be thermally controlled (e.g., an electronic circuit) connected to the opposite surface of the heatsink. The plate includes a fluid channel, which has an inlet and an outlet. A thermal control fluid is guided through the channel via the inlet and outlet. The temperature of the thermal control fluid is controlled via a thermal control fluid source. In this example, the plate is permanently attached to the heatsink. Therefore, after testing is complete, the plate is not removed from the heatsink. Rather, the plate is packaged and shipped to the end user. However, after testing is complete, the plate has no functional use for the end user. The plate cannot be reused for thermal testing on any other device and is effectively discarded. A new plate must be manufactured for any other device that requires thermal testing. In other words, a new plate must be manufactured for each device that requires thermal testing.
[0014] As a result, thermal control plates have several drawbacks. For example, since the plate is permanently attached to the heat sink, it cannot be reused. Therefore, the weight of the plate adds unnecessary weight to the overall device assembly, which is undesirable for the end user. In addition, a different custom plate must be manufactured for each device assembly that requires thermal testing, resulting in increased manufacturing costs. Furthermore, if two or more thermal control fluids are used to thermally test the device assembly, the channels in the plate must be purged. This can lead to longer test cycles and cross-contamination between thermal control fluids. The thermal control device disclosed herein, which includes a tubular rod portion connected to a head portion, overcomes the aforementioned drawbacks.
[0015] Figure 1 is an exemplary block diagram of a thermal test system 100, which includes a thermal control fluid source 102, a thermal control device 104, and a device assembly (e.g., an electronic circuit assembly) 106. The thermal control fluid source 102 supplies a thermal control fluid (e.g., air, water, PAO, EGW, JP-8, alcohol, etc.) to the thermal control device 104 based on the application and / or specific requirements of the electronic circuit assembly 106 (e.g., test bench, product application (e.g., temperature tuning, tactical application, etc.)). The thermal control device 104 is an integrated unit including a head portion 108 and a tubular rod portion 110. The head portion 108 includes an inlet port 112 and an outlet port 114. The tubular rod portion 110 is in fluid communication with the head portion 108 at a first end and closed at a second end on the opposite side. The thermal control device 104 is configured to receive and discharge thermal control fluid from the thermal control fluid source 102 through the inlet port 112 and outlet port 114 of the head portion 108. Thus, during testing, the tubular rod portion 110 functions as a heat exchanger to regulate the temperature (heat transfer) transmitted to the electronic circuit assembly 106.
[0016] The device assembly 106 includes a device (e.g., an electronic circuit) 116 and a heat sink 118. Although the examples disclosed herein are described as electronic circuit assemblies consisting of electronic circuits (e.g., electronic circuits, transistors, capacitors, resistors, etc.), any variety of devices for which thermal control and / or testing is desired may be controlled and / or tested using the thermal control device 104. Thus, the examples described herein are not limited to electronic circuits. The electronic circuit 116 can be mounted on either side of the heat sink 118, depending on the specific application of the electronic circuit 116. The heat sink 118 includes a female mating port 120 that extends into the heat sink 118 and optionally penetrates the heat sink 118. The female mating port 120 is configured to removably receive (or be removably coupled to) a tubular rod portion 110 of the thermal control device 104. Thus, the female mating port 120 has a cross-section similar to that of the tubular rod portion 110. When inserted into the female mating port 120, the outer surface of the tubular rod portion 110 comes into contact with the inner surface of the female mating port 120, thereby improving heat transfer between the tubular rod portion 110 and the heat sink 118.
[0017] During testing of the electronic circuit 116, the temperature of the thermal control fluid is set to a predetermined temperature and circulated through the thermal control device 104. The temperature of the thermal control fluid provides cooling or heating to the heat sink 118 to a desired temperature, based on the application of the electronic circuit 116. Furthermore, the temperature of the thermal control fluid can be adjusted over a temperature range in which the temperature range can be tightly controlled.
[0018] Figures 2 to 4 are perspective views of the thermal control device 200. Specifically, Figure 2 is an opaque perspective view of the thermal control device 200, Figure 3 is a transparent perspective view, and Figure 4 is a cross-sectional perspective view. The thermal control device 200 can correspond to the thermal control device in the example in Figure 1. Therefore, the example in Figure 1 will be referenced in the following description of the examples in Figures 2 to 4.
[0019] The thermal control device 200 is an integrated unit formed from a thermally conductive material (e.g., aluminum, copper) and includes a head portion 202 and a tubular rod portion 204 having an axial length. As described above, the thermal control device 200 can be manufactured by an additive manufacturing process, which eliminates weld seams between the head portion 202 and the tubular rod portion 204, and within the tubular rod portion 204 itself. A flange 206 is positioned between the head portion 202 and the tubular rod portion 204. The flange 206 may include connection holes for detachably connecting the thermal control device to an electronic circuit assembly.
[0020] The head portion 202 includes an inlet port 208 and an outlet port 210. The inlet port 208 is in fluid communication with the inlet tube 212, and the outlet port 210 is in fluid communication with the outlet tube 214 (see Figures 3 and 4). The inlet port 208 and the outlet port 210 are positioned within the head portion 202 at an angle of approximately 90° to each other. However, it should be understood that the angle between the inlet port 208 and the outlet port 210 may vary (e.g., 10° to 90°) depending on the configuration of the thermal control device 200.
[0021] The tubular rod portion 204 is in fluid communication with the head portion 202 at its first end 216 and closed at its opposite second end 218. As described above, the thermal control device 200 is configured to receive and discharge thermal control fluid from a thermal control fluid source through the inlet port 208 and outlet port 210 of the head portion 202. Thus, during testing, the tubular rod portion 204 functions as a heat exchanger for regulating the temperature (heat transfer) transmitted to the electronic circuit assembly.
[0022] The inlet tube 212 extends from the inlet port 208 of the head portion 202 into the tubular rod-shaped portion 204. In the example shown in the figure, the inlet tube 212 bends at an angle of approximately 90° within the head portion 202 when the inlet tube 212 transitions to the tubular rod-shaped portion 204. The outlet tube 214 extends from the outlet port 210 of the head portion 202 into the tubular rod-shaped portion 204. In the example shown in the figure, the outlet tube 214 is arranged substantially linearly from the outlet port 210 into the tubular rod-shaped portion 204. However, the arrangements of both the inlet tube 212 and the outlet tube 214 can be arbitrary based on the configuration of the thermal regulation device 200. Therefore, the exemplary thermal regulation device shown in the figure is for illustrative purposes only and is not intended to limit the scope of the present invention.
[0023] The outlet tube 214 is arranged inside the inlet tube 212 when both the inlet tube 212 and the outlet tube 214 transition from the head portion 202 to the tubular rod-shaped portion 204. Therefore, the outlet tube 214 has a diameter smaller than the diameter of the inlet tube 212. The ends 220, 222 of the inlet tube 212 and the outlet tube 214, respectively, on the side opposite to the ends of the inlet port 208 and the outlet port 210 are open ends. Therefore, as best shown in FIG. 4, when the regulating fluid flows into the inlet port 208 and through the inlet tube 212, the regulating fluid flows out from the open end 220 of the inlet tube 212 as indicated by the arrow, flows into the open end 222 of the outlet tube 214, and flows out from the outlet port 210 through the outlet tube 214.
[0024] Referring to FIG. 3, an axially disposed cartridge 224 formed from a thermally conductive material (e.g., aluminum, copper) is disposed inside the tubular rod portion 204. Specifically, the cartridge 224 is inside the inlet tube 212 but outside the outlet tube 214. The cartridge 224 includes fins 226 that span the channel defined between the inner surface of the inlet tube 212 and the outer surface of the outlet tube 214. The fins 226 extend along the length of the cartridge 224 and can be split (e.g., separated by 1 / 8 inch) and offset in a staggered arrangement with respect to each other to facilitate the flow of the conditioning fluid. When the conditioning fluid flows through the inlet tube 212 and the outlet tube 214, the fins 226 facilitate the transfer of the temperature of the conditioning fluid to the outer surface of the tubular rod portion 204.
[0025] FIG. 5 is a perspective view of two thermal conditioning devices 500 including a head portion 502 and a tubular rod portion 504 inserted into a heat sink 506 of a circuit assembly. An electronic circuit (not shown for simplicity) can be attached to the upper or lower surface of the heat sink 506. The inlet port 508 and the outlet port 510 are configured to receive a fluid connector (e.g., a quick disconnect) 512 to facilitate the attachment of the thermal conditioning device 500 to a source of thermal conditioning fluid, as described above. As shown, the tubular rod portion 504 of the thermal conditioning device 500 is inserted into the female mating port of the heat sink 506 until the flange 514 of the thermal conditioning device contacts the heat sink 506. The flange 514 may include mounting holes for removably securing the thermal conditioning device 500 to the heat sink 506 during testing.
[0026] FIG. 6 shows an example of a method 600 for thermally testing an electronic circuit using a thermal conditioning device. The thermal conditioning device and the electronic circuit can correspond to the thermal conditioning device and the electronic circuit in the examples of FIGS. 1-5. Therefore, in the following description of the method of FIG. 6, the examples of FIGS. 1-5 are referred to.
[0027] In 602, a thermal control system 100 is provided, which includes a thermal control fluid source 102, thermal control devices 104,200, and an electronic circuit assembly 106. In 604, the thermal control devices 104,200 are removably mated (coupled) to the electronic circuit assembly 106. More specifically, the tubular rod portions 110,204 of the thermal control devices 104,200 are inserted into female mating ports 120 of the heat sinks 118,506 of the electronic circuit assembly 106. In 606, the thermal control fluid source 102 is removably coupled to the thermal control devices 104,200. More specifically, the thermal control fluid source 102 is connected to the inlet ports 112,208 and outlet ports 114,210 of the thermal control devices 104,200 via a fluid connector (e.g., a quick disconnect) 512. In 608, the thermal control devices 104,200 are thermally controlled via a thermal control fluid from a thermal control fluid source 102. More specifically, the temperature of the control fluid in the thermal control fluid source 102 is set to a predetermined temperature based on the electronic circuit 116 in the electronic circuit assembly 106 being tested. In addition, the thermal control fluid from the thermal control fluid source 102 is supplied to the thermal control devices 104,200 for a predetermined period corresponding to the duration of the thermal test. In 610, the thermal control devices 104,200 are removed from the electronic circuit assembly 106. In 612, the thermal control devices 104,200 are removably mated (coupled) to another circuit assembly for thermal testing of the electronic circuit associated with that other electronic circuit assembly.
[0028] The above description constitutes an example of the present disclosure. Of course, it is impossible to describe every conceivable combination of components or methods for the purpose of illustrating the present disclosure, but those skilled in the art will recognize that many further combinations and substitutions of the present disclosure are possible. Accordingly, the present disclosure is intended to encompass all such changes, modifications, and variations that fall within the scope of this application, including the appended claims.
Claims
1. A thermal control device, A head section including an inlet port and an outlet port, A tubular rod-shaped portion that is in fluid communication with the head portion at the first end and closed at the second end opposite to the first end, An axial cartridge disposed within the tubular rod portion, the axial cartridge providing heat transfer to the outer surface of the tubular rod portion. Equipped with, The tubular rod-shaped portion is a thermal control device that is removably fitted into a device to provide heat transfer to the device.
2. The thermal control device according to claim 1, further comprising an inlet tube coupled to the inlet port of the head portion and an outlet tube coupled to the outlet port of the head portion, wherein the outlet tube is disposed inside the inlet tube.
3. The thermal control device according to claim 2, wherein the inlet tube transitions at an angle from the head portion to the tubular rod portion, and the outlet tube transitions substantially linearly from the head portion to the tubular rod portion and is located inside the inlet tube within the tubular rod portion.
4. The thermal control device according to claim 2, wherein the cartridge includes fins spanning a channel defined between the inner surface of the inlet tube and the outer surface of the outlet tube, the fins facilitating heat transfer of the tubular rod portion to the outer surface.
5. The thermal control device according to claim 4, wherein the fins are arranged along the cartridge from the first end to the second end of the tubular rod portion.
6. The thermal control device according to claim 5, wherein the fins are divided and offset from one another in a staggered arrangement.
7. A method for providing thermal testing of a device, To provide a thermal control system including a thermal control fluid source, a thermal control device, and a device to be thermally controlled, The aforementioned thermal control device is to be removably fitted into the aforementioned device. The thermal control fluid source is detachably coupled to the thermal control device. During the thermal test of the device, the thermal control device is thermally controlled via a thermal control fluid from the thermal control fluid source, and Once the thermal test of the device is completed, the thermal control device is removed from the device. Methods that include...
8. The method according to claim 7, further comprising: removably fitting the thermal control device to another device; and thermally regulating the thermal control device via the thermal control fluid from the thermal control fluid source during a thermal test of the other device.
9. The method according to claim 7, wherein the removable fitting of the thermal control device to the device includes removably inserting the tubular rod portion of the thermal control device into the female fitting port of the heat sink of the device.
10. The method according to claim 7, wherein the removable coupling of the thermal control fluid source to the thermal control device includes removably connecting the thermal control fluid source to the inlet and outlet ports of the thermal control device via a fluid connector.
11. The method according to claim 7, wherein thermally regulating the thermal control device via a thermal control fluid from the thermal control fluid source includes setting the temperature of the thermal control fluid in the thermal control fluid source to a predetermined temperature based on the device being tested.
12. The method according to claim 11, further comprising supplying the thermal control fluid from the thermal control fluid source to the thermal control device for a predetermined period of time corresponding to the duration of the thermal test.
13. The method according to claim 12, further comprising adjusting the temperature of the thermally controlled fluid over a temperature range based on the device undergoing the thermal test.
14. A thermal testing system, An electronic circuit assembly including a heatsink, A thermal control device detachably coupled to the heatsink of the electronic circuit assembly, A thermal control fluid source is detachably coupled to the thermal control device and supplies thermal control fluid to the thermal control device. Equipped with, A thermal testing system comprising a thermal control device configured to receive and discharge the thermal control fluid from the thermal control fluid source to regulate heat transfer to the electronic circuit assembly via the heat sink.
15. The aforementioned thermal control device is A head section including an inlet port and an outlet port, A tubular rod-shaped portion that is in fluid communication with the head portion at the first end and closed at the second end opposite to the first end, An axial cartridge disposed within the tubular rod portion, the axial cartridge providing heat transfer to the outer surface of the tubular rod portion. The thermal testing system according to claim 14, including the following:
16. The thermal testing system according to claim 15, wherein the thermal control device further includes an inlet tube coupled to the inlet port of the head portion and an outlet tube coupled to the outlet port of the head portion, the outlet tube being located inside the inlet tube.
17. The thermal testing system according to claim 16, wherein the inlet tube transitions at an angle from the head portion to the tubular rod portion, and the outlet tube transitions substantially linearly from the head portion to the tubular rod portion and is located inside the inlet tube within the tubular rod portion.
18. The thermal testing system according to claim 16, wherein the axial cartridge includes fins spanning a channel defined between the inner surface of the inlet tube and the outer surface of the outlet tube, the fins facilitating heat transfer of the tubular rod portion to the outer surface.
19. The thermal testing system according to claim 18, wherein the fins are arranged along the axial cartridge from the first end to the second end of the tubular rod portion.
20. The thermal testing system according to claim 19, wherein the fins are divided and offset from one another in a staggered arrangement.