Cryogenic modules and modular cryogenic infrastructure for use in modular cryogenic infrastructure
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-08-06
- Publication Date
- 2026-08-14
Smart Images
Figure 2026527658000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a cryogenic module for use in a modular cryogenic infrastructure, the modular cryogenic infrastructure, and a method of operating the modular cryogenic infrastructure. More specifically, the present disclosure relates to operating devices, particularly electronic devices, within an operating module under defined thermal conditions, for example at ultra-low temperatures in the sub-Kelvin or milli-Kelvin range.
Background Art
[0002] Cryostats are generally used to achieve and maintain low temperatures. Low temperatures can be achieved, for example, by using a cryogenic fluid bath such as liquid helium. However, cooling media such as liquid helium constantly evaporate due to external and / or internal heat input into the cryostat, and thus need to be refilled regularly. This requires a significant amount of time and resources, and the operating costs of such cryostats are high.
[0003] To overcome the above drawbacks, cryogen-free cryostats have been developed. Cryogen-free cryostats may use a cryogen-free closed-cycle system such as a pulse tube cryocooler. The latest pulse tube cryocoolers can achieve temperatures down to 1.2K. To achieve sub-Kelvin temperatures, in addition to a cryogen-free closed-cycle system, a magnetic cooling stage can be used. The magnetic cooling stage may be an adiabatic demagnetization refrigerator (ADR) that can achieve temperatures down to a few milli-Kelvin. ADRs are based on the magnetocaloric effect. When the medium is magnetized, the magnetic moments of the medium align and magnetization heat is released. Conversely, when the medium is demagnetized, the temperature of the medium decreases.
[0004] Cryostats have been used almost exclusively in scientific applications where power consumption, ease of use, operating time, and maintainability are far less important than performance, particularly cooling capacity and achievable temperature. With the proliferation of new commercial electronic hardware requiring cryostats to meet operating conditions, these previously overlooked characteristics will become essential for scaling new technologies beyond scientific laboratories.
[0005] In view of the above, novel cryogenic modules, cryogenic infrastructure, and methods of operation for such cryogenic modules and cryogenic infrastructure that overcome at least some of the problems in the relevant technical field are beneficial. [Overview of the project] [Problems that the invention aims to solve]
[0006] The purpose of this disclosure is to provide cryogenic modules, modular cryogenic infrastructure, and methods for operating modular cryogenic infrastructure for use in modular cryogenic infrastructure, enabling efficient operation of equipment, such as electronic devices, at low temperatures. Another purpose of this disclosure is to provide scalable cryogenic infrastructure and to reduce downtime and / or power consumption of cryogenic infrastructure. [Means for solving the problem]
[0007] A cryogenic module for use in a modular cryogenic infrastructure is provided according to an independent aspect of the present disclosure. The cryogenic module includes at least one first interface located outside the cryogenic module and configured to detachably connect the cryogenic module to a pre-cooling module, and at least one second interface located outside the cryogenic module and configured to detachably connect the cryogenic module to an operating module having operable equipment cooled by the cryogenic module.
[0008] At least one operating module may be configured to operate the equipment for its intended use (e.g., commercial use), or in the event of such use, rather than for testing, such as in a laboratory. At least one operating module may include or house any operable equipment, such as electronic equipment, optical equipment, or a combination thereof. Depending on the type of equipment, at least one operating module may also be referred to as an electronic module or an optical module.
[0009] Cryogenic modules may also be referred to as "cryostats." Cryostats are generally used to achieve and maintain low temperatures in the low Kelvin and / or sub-Kelvin range.
[0010] According to several embodiments that can be combined with other embodiments described herein, the cryogenic module and the pre-cooling module may be contained in (or mounted on) the same device. In this context, “same device” refers to a single instrument or apparatus that integrates both the cryogenic module and the pre-cooling module, enabling them to function together.
[0011] According to some embodiments that can be combined with other embodiments described herein, the cryogenic module is connectable to the precooling module when the precooling module is in a first operating state.
[0012] Preferably, the first operating state of the pre-cooling module is selected from the group including the ON state and the idle state of the pre-cooling module, or from the group consisting of the ON state and the idle state.
[0013] Preferably, the second operating state of the pre-cooling module is the off state of the pre-cooling module.
[0014] According to some embodiments that can be combined with other embodiments described herein, the cryogenic module is separable from the precooling module when the precooling module is in a first operating state.
[0015] According to some embodiments that can be combined with other embodiments described herein, the cryogenic module is connectable to the operating module when the cryogenic module is in a first operating state.
[0016] Preferably, the first operating state of the cryogenic module may be such that the operating temperature of the cryogenic module is lower than room temperature, for example, 1.5 to 10 K, or for example, 4 K. In some embodiments, the operating temperature of the cryogenic module may be a temperature provided by a pre-cooling module.
[0017] In addition or alternatively, the first operating state of the cryogenic module is selected from the group including the ON state and the idle state of the cryogenic module, or from the group consisting of the ON state and the idle state. In some embodiments, the idle state of the cryogenic module may correspond to an operating temperature of 1.5 to 10K, for example 4K, which may be a temperature provided by a pre-cooling module. The ON state may correspond to a lower temperature, for example 1K or less.
[0018] In addition, or alternatively, in a first operating state such as idle, the cryogenic module does not actively generate cooling capacity to maintain low temperatures. That is, means such as a pulsed tube cryocooler or magnetic cooling stage are not operated to generate cooling capacity. In addition, in a first operating state such as idle, the cryogenic module may transfer cooling capacity from the pre-cooling module to the operating module ("passive cooling capacity"). In this case, the cryogenic module transfers only a portion of the cooling capacity from the pre-cooling module to the operating module, and the remaining portion of the cooling capacity can be used to cool one or more internal thermal components of the cryogenic module, such as a heat shield.
[0019] Preferably, the second operating state of the cryogenic module is the off state of the cryogenic module.
[0020] Preferably, in the second operating state of the cryogenic module, the cryogenic module does not actively generate cooling capacity, and / or receive cooling capacity from other modules, and / or passively transmit cooling capacity to other modules.
[0021] According to some embodiments that can be combined with other embodiments described herein, the cryogenic module is separable from the operating module when the cryogenic module is in a first operating state.
[0022] The terms "connectable" and "separable" refer to a removable mechanical connection between modules. For example, modules can be connected to one another by positioning them in specific relative positions, for example, side by side or vertically, and by closing / fastening mounting means such as clamps and / or screws. Furthermore, modules can be separated or cut from one another by opening / releasing the mounting means. Thus, "separable" means that modules can be separated without damaging them.
[0023] The connection between modules may be any direct or indirect connection (e.g., a vacuum connection) suitable for the connected modules to interact thermally and optionally electronically and / or optically and / or fluidically. For example, the connection may be a substantially vacuum-tight connection using, for example, bellows, vacuum seals, rigid tubes, flexible tubes, O-rings, etc.
[0024] The term "on state" used throughout this disclosure refers to one of the multiple operating states of a module. In the on state, a precooling module or cryogenic module can actively generate cooling capacity by operating means such as a pulse tube cryocooler or magnetic cooling stage to maintain a low temperature. Further, in the on state, an operating module, particularly the electronics within the operating module, is operated or switched on.
[0025] In the off state, a precooling module or cryogenic module does not actively generate cooling capacity to maintain a low temperature. That is, means such as a pulse tube cryocooler or magnetic cooling stage are not operated to generate cooling capacity. Further, in the off state, an operating module, particularly the electronics within the operating module, is not operated or switched off.
[0026] The term "idle state" used throughout this disclosure refers to an intermediate state between the on state and the off state.
[0027] In addition or alternatively, the idle state can be the state of each module in which the module is ready for and / or preconfigured for actual operation in the on state.
[0028] Additionally or alternatively, in the idle state, the precooling module and / or the cryogenic module may not actively generate cooling capacity, but at least some of the components of the module may be operating or switched on, and the module is ready for operation in the on state. Further, in the idle state, the operating module, particularly the electronics within the operating module, is ready for operation in the on state.
[0029] Additionally or alternatively, the module may be fully switched on and / or operable in the on state, partially switched on and / or operable in the idle state, and fully switched off and / or inoperable in the off state.
[0030] Additionally or alternatively, the idle state may correspond to a temperature at which the operating temperature of the module is lower than room temperature, for example, 1.5 to 10 K, for example, 4 K. In some embodiments, the operating temperature of the module may be the temperature provided by the precooling module. In the on state, the operating temperature may be lower than that, for example, 1 K or less.
[0031] According to some embodiments that can be combined with other embodiments described herein, the precooling module includes an interface mechanism that is compatible with at least one first interface of the cryogenic module.
[0032] According to some embodiments that can be combined with other embodiments described herein, the operating module includes an interface mechanism that is compatible with at least one second interface of the cryogenic module.
[0033] According to some embodiments that can be combined with other embodiments described herein, at least one first interface of the cryogenic module includes at least one first thermal interface. The precooling module may have a (first) thermal interface mechanism that is compatible with at least one first thermal interface of the cryogenic module.
[0034] Preferably, at least one first thermal interface is configured to be cooled to a first temperature by the pre-cooling module, particularly via the (first) thermal interface mechanism, when the pre-cooling module is turned on.
[0035] Preferably, the first temperature is 1K or higher, or 4K or higher. For example, the first temperature may be in the range of 1K to 100K, or 1K to 50K, or 4K to 100K, or 4K to 50K. In exemplary embodiments, the first temperature may be about 4K or about 1.2K.
[0036] According to some embodiments that can be combined with other embodiments described herein, at least one first interface includes at least one first electrical interface. The pre-cooling module may have a (first) electrical interface mechanism that matches at least one first electrical interface of the cryogenic module. The electrical connection between the cryogenic module and the pre-cooling module may be configured for data communication, such as that relating to the operation and / or control of the cryogenic module and the pre-cooling module.
[0037] According to some embodiments that can be combined with other embodiments described herein, at least one first interface of the cryogenic module includes at least one first optical interface. The pre-cooling module may have a (first) optical interface mechanism that is compatible with at least one first optical interface of the pre-cooling module. The optical connection between the cryogenic module and the pre-cooling module may be configured for data communication, such as that relating to the operation and / or control of the cryogenic module and the pre-cooling module.
[0038] According to some embodiments that can be combined with other embodiments described herein, at least one second interface of the cryogenic module includes at least one second thermal interface. The operating module may have a (second) thermal interface mechanism that is compatible with at least one second thermal interface of the cryogenic module.
[0039] Preferably, at least one second thermal interface is configured to be cooled to a second temperature by the cooling mechanism of the cryogenic module, particularly when the cryogenic module is turned on.
[0040] Preferably, the second temperature is lower than the first temperature.
[0041] Preferably, the second temperature is 4K or less, or 1K or less. For example, the second temperature may be in the range of 1K to 4K, or in the range of 100mK to 4K, or in the range of 2mK to 1K.
[0042] According to some embodiments that can be combined with other embodiments described herein, at least one second interface includes at least one second electrical interface. The operating module may have a (second) electrical interface mechanism that matches at least one second electrical interface of the cryogenic module. The electrical connection between the cryogenic module and the operating module may be configured for data communication, such as that relating to the operation and / or control of the cryogenic module and the operating module.
[0043] According to some embodiments that can be combined with other embodiments described herein, at least one second interface of the cryogenic module includes at least one second optical interface. The operating module may have a (second) optical interface mechanism that is compatible with at least one second optical interface of the cryogenic module. The optical connection between the cryogenic module and the operating module may be configured for data communication, such as that relating to the operation and / or control of the cryogenic module and the operating module.
[0044] According to some embodiments that can be combined with other embodiments described herein, at least one second interface of a cryogenic module is multiple second interfaces. Thus, a cryogenic module may be connectable to multiple other modules, such as other cryogenic modules and / or multiple operating modules, via the second interfaces.
[0045] According to some embodiments that can be combined with other embodiments described herein, the cryogenic module is connectable to the operating module while it is connected to the pre-cooling module. In other words, the operating module is connectable to the cryogenic module while it is already connected to the pre-cooling module.
[0046] According to some embodiments that can be combined with other embodiments described herein, the cryogenic module is separable from the operating module while connected to the precooling module. In other words, the operating module is separable from the cryogenic module while the cryogenic module is still connected to the precooling module.
[0047] According to some embodiments that can be combined with other embodiments described herein, the cryogenic module is connectable to the operating module when the operating module is in a second operating state.
[0048] Preferably, the second operating state of the operating module is the off state of the operating module. The first operating state of the operating module may be selected from a group including the idle state and the on state, or from a group consisting of the idle state and the on state.
[0049] According to some embodiments that can be combined with other embodiments described herein, the cryogenic module is separable from the operating module when the operating module is in a second operating state. In other words, the operating module is separable from the cryogenic module when the operating module is in the off state.
[0050] According to some embodiments that can be combined with other embodiments described herein, the cryogenic module is connectable to the precooling module while it is connected to the operating module. In other words, the precooling module is connectable to the cryogenic module while the cryogenic module is already connected to the operating module.
[0051] According to some embodiments that can be combined with other embodiments described herein, the cryogenic module is separable from the precooling module while connected to the operating module. In other words, the precooling module is separable from the cryogenic module while the operating module is still connected to the cryogenic module.
[0052] According to some embodiments that can be combined with other embodiments described herein, the cryogenic module can be connected to the precooling module when it is in a second operating state, i.e., the off state.
[0053] According to some embodiments that can be combined with other embodiments described herein, the cryogenic module is separable from the precooling module when in a second operating state, i.e., the off state.
[0054] According to some embodiments that can be combined with other embodiments described herein, the cryogenic module includes a heater mechanism configured to heat at least one first interface and / or at least one second interface, located at at least one first interface and / or at least one second interface. For example, if the operating module is disconnected from the cryogenic module, the load reduction can be compensated using the heater mechanism to stabilize the operation of the cryogenic module.
[0055] According to another independent aspect of this disclosure, a modular cryogenic infrastructure is provided. The modular cryogenic infrastructure includes at least one cryogenic module, a pre-cooling module, and at least one operating module. The cryogenic module may be the cryogenic module described above.
[0056] According to several embodiments that can be combined with other embodiments described herein, modular cryogenic infrastructure is scalable.
[0057] According to several embodiments that can be combined with other embodiments described herein, multiple cryogenic modules can be connected in parallel to (or connected to) a precooling module. In particular, multiple cryogenic modules may be connected to (or can be connected to) the same precooling module.
[0058] Preferably, the pre-cooling module has a plurality of (first) thermal interface mechanisms, and one cryogenic module can be connected to each of the thermal interface mechanisms.
[0059] Optionally, the pre-cooling module has multiple (first) electrical interface mechanisms, and one cryogenic module can be connected to each of the electrical interface mechanisms. In addition or alternatively, the pre-cooling module has multiple (first) optical interface mechanisms, and one cryogenic module can be connected to each of the optical interface mechanisms.
[0060] Preferably, multiple cryogenic modules can be connected to (or are connected to) a pre-cooling module simultaneously.
[0061] Preferably, the pre-cooling module is configured to simultaneously supply cooling capacity to multiple cryogenic modules.
[0062] According to some embodiments that can be combined with other embodiments described herein, at least two operating modules are connectable to (or connected to) each other via corresponding interfaces such as a thermal interface and / or an electrical interface and / or an optical interface.
[0063] According to some embodiments that can be combined with other embodiments described herein, at least two operating modules include a first operating module and a second operating module, wherein the first operating module is connectable to (or connected to) the second operating module.
[0064] Preferably, the first of at least two operating modules is connectable to (or connected to) the first cryogenic module.
[0065] In some embodiments, the second operating module is connectable to (or connected to) the second cryogenic module.
[0066] In other embodiments, the second operating module of at least two operating modules is connectable to (or connected to) the first operating module when it is not connected to the cryogenic module. In particular, the second operating module is not connectable to (or not connected to) any cryogenic module. For example, the pre-cooling module, the first cryogenic module, the first operating module, and the second operating module may be connected in series. In this case, cooling capacity may be provided from the first cryogenic module to the second operating module via the first operating module.
[0067] According to some embodiments that can be combined with other embodiments described herein, at least one operating module is a quantum technology module, in particular a quantum computing module, a quantum communication module, a quantum sensing module, an optical module, or a combination thereof, or includes them.
[0068] According to some embodiments that can be combined with other embodiments described herein, at least one cryogenic module is an adiabatic demagnetizing refrigeration module, or includes an adiabatic demagnetizing refrigeration module.
[0069] According to some embodiments that can be combined with other embodiments described herein, the pre-cooling module is a centralized pre-cooling module or includes a centralized pre-cooling module.
[0070] According to some embodiments that can be combined with other embodiments described herein, the pre-cooling module is a turbo-Brayton cooling module, or includes a turbo-Brayton cooling module.
[0071] Preferably, the pre-cooling module is part of a commercial facility such as a data center.
[0072] According to some embodiments that can be combined with other embodiments described herein, the modular cryogenic infrastructure is a data center or is included in a data center.
[0073] According to some embodiments that can be combined with other embodiments described herein, the modular cryogenic infrastructure is a commercial installation or is included in a commercial installation.
[0074] According to some embodiments that can be combined with other embodiments described herein, the modular cryogenic infrastructure includes a user interface.
[0075] Preferably, the user interface includes at least one display unit and at least one input unit, such as a keyboard. In some embodiments, the user interface includes a touchscreen.
[0076] Preferably, the user interface is configured to allow the user to control the operation of the modular cryogenic infrastructure.
[0077] Preferably, the user interface is configured to notify and / or guide the user during the module connection process and / or module disconnection process.
[0078] Preferably, the user interface may be configured to guide the user through the individual steps of the module connection process and / or module disconnection process.
[0079] Preferably, the user interface may be configured to receive user input regarding process steps completed by the user, such as the installation of screws and / or clamps. Upon receiving user input, the user interface may notify the user of the next steps in the module connection process and / or module disconnection process.
[0080] According to another independent aspect of this disclosure, a pre-cooling module for use in a modular cryogenic infrastructure is provided. The modular cryogenic infrastructure may be the modular cryogenic infrastructure of the embodiments of this disclosure.
[0081] According to some embodiments which can be combined with other embodiments described herein, the pre-cooling module includes an interface mechanism located outside the pre-cooling module, configured to detachably connect the pre-cooling module to one or more cryogenic modules and / or one or more operating modules of a cryogenic infrastructure, wherein the pre-cooling module is connectable to one or more cryogenic modules and / or one or more operating modules, and / or detachable from one or more cryogenic modules and / or one or more operating modules, when the pre-cooling module is in a first operating state.
[0082] Preferably, the first operating state of the pre-cooling module is selected from the group including the ON state and the idle state of the pre-cooling module, or from the group consisting of the ON state and the idle state.
[0083] According to some embodiments that can be combined with other embodiments described herein, the pre-cooling module includes a heater mechanism located in the (thermal) interface mechanism and configured to heat the (thermal) interface mechanism. For example, if the cryogenic module is disconnected from the pre-cooling module, the load reduction can be compensated for using the heater mechanism to stabilize the operation of the pre-cooling module.
[0084] According to another independent aspect of this disclosure, an operating module for use in a modular cryogenic infrastructure is provided. The modular cryogenic infrastructure may be the modular cryogenic infrastructure of the embodiments of this disclosure.
[0085] According to some embodiments which can be combined with other embodiments described herein, the operating module includes an interface mechanism located outside the operating module and configured to detachably connect the operating module to a pre-cooling module of cryogenic infrastructure, the operating module being connectable to and / or detachable from the pre-cooling module when the pre-cooling module is in a first operating state.
[0086] Preferably, the first operating state of the pre-cooling module is selected from the group including the ON state and the idle state of the pre-cooling module, or from the group consisting of the ON state and the idle state.
[0087] According to another independent aspect of this disclosure, an operating module for use in a modular cryogenic infrastructure is provided. The modular cryogenic infrastructure may be the modular cryogenic infrastructure of the embodiments of this disclosure.
[0088] According to some embodiments which can be combined with other embodiments described herein, the operating module includes an external interface mechanism configured to detachably connect the operating module to at least one cooling module of the cryogenic infrastructure.
[0089] According to several embodiments that can be combined with other embodiments described herein, the operating module may be configured according to any of the embodiments described herein.
[0090] According to several embodiments that can be combined with other embodiments described herein, at least one cooling module includes a pre-cooling module and / or a cryogenic module. The pre-cooling module and / or cryogenic module may be configured according to any of the embodiments described herein.
[0091] According to some embodiments which can be combined with other embodiments described herein, the operating module is connectable to and / or detachable from at least one cooling module when at least one cooling module is in a first operating state.
[0092] Preferably, the first operating state of at least one cooling module (110) is either ON or idle.
[0093] According to another independent aspect of this disclosure, a method for operating a modular cryogenic infrastructure is provided. This method may utilize the modular cryogenic infrastructure of an embodiment of this disclosure.
[0094] According to some embodiments which can be combined with other embodiments described herein, the method includes connecting a cryogenic module to a precooling module when the precooling module is in a first operating state.
[0095] Preferably, the first operating state of the pre-cooling module is selected from the group including the ON state and the idle state of the pre-cooling module, or from the group consisting of the ON state and the idle state.
[0096] According to some embodiments which can be combined with other embodiments described herein, the method includes separating the cryogenic module from the precooling module when the precooling module is in a first operating state.
[0097] According to some embodiments which can be combined with other embodiments described herein, the method includes connecting the cryogenic module to an operating module when the cryogenic module is in a first operating state.
[0098] Preferably, the first operating state of the cryogenic module is selected from the group including the ON state and the idle state of the cryogenic module, or from the group consisting of the ON state and the idle state.
[0099] According to some embodiments which can be combined with other embodiments described herein, the method includes separating the cryogenic module from the operating module when the cryogenic module is in a first operating state.
[0100] According to another independent aspect of this disclosure, a cryogenic infrastructure is provided. The cryogenic infrastructure includes a pre-cooling module, an operating module connectable to the pre-cooling module, and one or more cryogenic modules connectable to the operating module.
[0101] The cryogenic infrastructure may be the modular cryogenic infrastructure described throughout this document. In addition or alternatively, the precooling module may be the precooling module described throughout this document. In addition or alternatively, the operating module may be the operating module described throughout this document. In addition or alternatively, the cryogenic module may be the cryogenic module described throughout this document.
[0102] According to some embodiments that can be combined with other embodiments described herein, the pre-cooling module may be a single pre-cooling module.
[0103] According to some embodiments that can be combined with other embodiments described herein, the operating module may be a single operating module.
[0104] According to some embodiments that can be combined with other embodiments described herein, the operating module has an operable device that is cooled by a cryogenic module.
[0105] According to some embodiments that can be combined with other embodiments described herein, the operating module is configured to provide a thermal path between a pre-cooling module and one or more cryogenic modules in order to provide pre-cooling to one or more cryogenic modules. Thus, one or more cryogenic modules can provide the operating module with a cooling capacity (e.g., 1K or less) to cool the operating equipment and can also receive a pre-cooling capacity (e.g., 4K) from the pre-cooling module via the same operating module. In other words, a bidirectional thermal path may exist between the operating module and one or more cryogenic modules. The bidirectional thermal path can be implemented, for example, using a nested thermal interface.
[0106] According to some embodiments that can be combined with other embodiments described herein, the operating module is configured to use the pre-cooling capacity received from the pre-cooling module to cool one or more internal thermal components of the operating module. Thus, the pre-cooling capacity does not have to be used by one or more cryogenic modules alone, but may also be used by the operating module to cool one or more internal thermal components of the operating module, such as a heat shield.
[0107] Preferably, the operating module can transfer cooling capacity from the pre-cooling module to one or more cryogenic modules ("passive cooling capacity"). For example, the operating module may transfer only a portion of the cooling capacity from the pre-cooling module to one or more cryogenic modules, and use the remaining cooling capacity to cool one or more internal thermal components of the operating module, such as a heat shield.
[0108] Further aspects, advantages, and features of this disclosure are evident from the claims, specification, and accompanying drawings.
[0109] To gain a more detailed understanding of the features of this disclosure described above, a more detailed description of this disclosure, which has been briefly summarized above, can be obtained by referring to the embodiments. The accompanying drawings relate to embodiments of this disclosure and are described below. [Brief explanation of the drawing]
[0110] [Figure 1] A schematic diagram of a modular cryogenic infrastructure in an assembled state according to an embodiment of the present disclosure is shown. [Figure 2] A schematic diagram of a modular cryogenic infrastructure in a disassembled state according to an embodiment of the present disclosure is shown. [Figure 3] A schematic diagram of a modular cryogenic infrastructure in a disassembled state according to a further embodiment of the present disclosure is shown. [Figure 4] A schematic diagram of a modular cryogenic infrastructure according to an embodiment of this disclosure is shown. [Figure 5] A schematic diagram of a modular cryogenic infrastructure according to further embodiments of this disclosure is shown. [Figure 6] A schematic diagram of a modular cryogenic infrastructure according to further embodiments of this disclosure is shown. [Figure 7] A schematic diagram of a modular cryogenic infrastructure according to further embodiments of this disclosure is shown. [Modes for carrying out the invention]
[0111] Herein, various embodiments of the present disclosure are given in detail, and one or more examples are shown in the figures. In the following description of the drawings, the same reference numerals refer to the same components. Generally, only differences relating to individual embodiments are described. Each example is provided for illustrative purposes of the present disclosure and is not intended to limit the present disclosure. Furthermore, features illustrated or described as part of one embodiment can be used in other embodiments or in conjunction with other embodiments to obtain yet another embodiment. This specification is intended to include such modifications and variations.
[0112] Cryostats have been used almost exclusively in scientific applications where power consumption, ease of use, operating time, and maintainability are far less important than performance, particularly cooling capacity and achievable temperature. With the proliferation of new commercial electronic hardware requiring cryostats to meet operating conditions, these previously overlooked characteristics will become essential for scaling new technologies beyond scientific laboratories.
[0113] Embodiments of this disclosure overcome the aforementioned drawbacks by providing a modular cryogenic infrastructure having a centralized pre-cooling mechanism and independently operable modules. This makes the cryogenic infrastructure flexible and scalable beyond scientific laboratories, making it suitable for large facilities such as data centers. In addition, the modularity eliminates the need to completely shut down the cryogenic infrastructure for maintenance, repair, and the addition of further cryogenic modules and / or operating modules.
[0114] Figure 1 shows a schematic diagram of the modular cryogenic infrastructure 100 in an assembled state according to an embodiment of the present disclosure. Figure 2 shows a schematic diagram of the modular cryogenic infrastructure 100 in a partially disassembled state. Figure 3 shows a schematic diagram of the modular cryogenic infrastructure 100 in another partially disassembled state.
[0115] The modular cryogenic infrastructure 100 can be used to operate equipment such as quantum technology devices under specified thermal conditions, for example, at ultra-low temperatures in the sub-kelvin or millikelvin range.
[0116] According to some non-limiting embodiments of this disclosure, the modular cryogenic infrastructure 100 is a commercial facility, such as a data center, or is included in a commercial facility.
[0117] The modular cryogenic infrastructure 100 includes a pre-cooling module 110, at least one cryogenic module 120, and at least one operating module 130.
[0118] The pre-cooling module 110 may be a centralized pre-cooling module such as a turbo-Brayton cooling module. A single centralized pre-cooling module, such as a turbo-Brayton cooling module, can be implemented on an industrial scale and reduces power consumption.
[0119] At least one cryogenic module 120 may be an adiabatic demagnetizing refrigeration (ADR) module. In some embodiments, an adiabatic demagnetizing refrigeration (ADR) module can use the magnetocaloric effect to achieve and maintain low temperatures in the low Kelvin and / or sub-Kelvin range.
[0120] The operational module 130, which may also be called a payload module, has operable devices such as electronic and / or optical devices that are cooled by the cryogenic module 120. At least one operational module 130 may be a quantum technology module, such as a quantum computing module, a quantum communication module, and / or a quantum sensing module. In particular, at least one operational module 130 may be configured to operate quantum technology for intended use (e.g., commercial use) rather than for testing, such as in a laboratory. In other words, the operable electronic devices cooled by the cryogenic module 120 may be quantum electronic devices such as a quantum computer.
[0121] In some embodiments, the operating module can be understood as a component or module containing all the elements necessary for the operation and / or control and / or testing of a sample, device, chip, etc., and is specifically configured to interface with one or more cryogenic modules and / or one or more pre-cooling modules to achieve and maintain different temperatures. The operating module is essentially a self-contained unit designed to support and operate, for example, a quantum chip or similar device, ensuring that all necessary conditions and controls are in place, except for providing the low temperatures handled by the cryogenic modules and / or pre-cooling modules.
[0122] The characteristics of the operating module may include, but are not limited to, the following: • Different temperature stages that can interface with the corresponding stages of the cooling module, and / or In particular, in order to minimize thermal noise to the operating and / or tested object / sample / device / chip, and / or to minimize the thermal load on individual temperature stages, the stepped implementation of thermal stages and radiation shields for thermally coupling control wiring, support structures and / or electronic equipment to custom intermediate temperature stages, and / or • Objects / samples / devices / chips being tested and / or being operated, and / or • Sockets and / or holders for objects / samples / devices / chips, and / or • Control wiring for the operation and / or testing of an object / sample / device / chip, and / or • Auxiliary electronic equipment for controlling or reading objects / samples / devices / chips, and / or • Magnetic field shielding and / or electric field shielding, and / or • Vacuum shielding and / or radiation shielding, and / or • Diagnostic devices and / or control devices (e.g., sensors (e.g., thermometers), heaters, active magnetic field erasing devices, etc.), and / or • Electronic equipment for controlling room temperature, and / or • Essentially everything necessary for the operation of a quantum chip, except for the generation of low temperatures.
[0123] The individual modules 120, 130 may take the form of 19-inch racks, and interfaces may be provided between these racks to facilitate the connection and disconnection of individual modules without interfering with the operation of preceding modules. These interfaces may enable the interface of individual vacuum, temperature, and / or electrical signals.
[0124] In the example shown in Figure 1, the pre-cooling module 110, the cryogenic module 120, and the operating module 130 are each in a first operating state, such as the ON state or the idle state. The second operating state of the pre-cooling module 110, the cryogenic module 120, and the operating module 130 may be the OFF state.
[0125] As used throughout this disclosure, the term “on state” refers to the actual operating state of each module. Similarly, as used throughout this disclosure, the term “off state” refers to the non-operating state of each module. For example, in the on state, the pre-cooling module 110 may actively generate cooling capacity, for example, by operating a turbo-Brayton mechanism. In the off state, the pre-cooling module 110 does not need to generate cooling capacity, for example, by operating a turbo-Brayton mechanism. The idle state is an intermediate state between the on state and the off state in which the module is ready for actual operation.
[0126] The cryogenic module 120 includes at least one first interface 122 located outside the cryogenic module 120, configured to detachably connect the cryogenic module 120 to the pre-cooling module 110, and at least one second interface 124 located outside the cryogenic module 120, configured to detachably connect the cryogenic module 120 to an operating module 130 having operable equipment cooled by the cryogenic module 120.
[0127] The pre-cooling module 110 includes an interface mechanism 112 that is compatible with at least one first interface 122 of the cryogenic module 120.
[0128] In some embodiments, at least one first interface 122 of the cryogenic module 120 may include at least one first thermal interface, and the interface mechanism 112 of the precooling module 110 may have a thermal interface mechanism that is compatible with at least one first thermal interface of the cryogenic module 120.
[0129] At least one first thermal interface of the cryogenic module 120 may be configured to be cooled to a first temperature by the pre-cooling module 110 when the pre-cooling module 110 is ON. In some embodiments, the first temperature may be 1K or higher, or 4K or higher. For example, the first temperature may be in the range of 1K to 100K, or 1K to 50K, or 4K to 100K, or 4K to 50K. In exemplary embodiments, the first temperature may be about 4K or about 1.2K.
[0130] In some embodiments, at least one first interface 122 of the cryogenic module 120 may include at least one first electrical interface, and the interface mechanism 112 of the pre-cooling module 110 may have an electrical interface mechanism compatible with at least one first electrical interface of the cryogenic module 120. The electrical connection between the cryogenic module 120 and the pre-cooling module 110 may be configured for data communication, such as that relating to the operation and / or control of the cryogenic module 120 and the pre-cooling module 110.
[0131] In some embodiments, at least one first interface 122 of the cryogenic module 120 may include at least one first optical interface, and the interface mechanism 112 of the pre-cooling module 110 may have an optical interface mechanism compatible with at least one first optical interface of the cryogenic module 120. The optical connection between the cryogenic module 120 and the pre-cooling module 110 may be configured for data communication, such as that relating to the operation and / or control of the cryogenic module 120 and the pre-cooling module 110.
[0132] The operating module 130 includes an interface mechanism 132 that is compatible with at least one second interface 124 of the cryogenic module 120.
[0133] In some embodiments, at least one second interface 124 of the cryogenic module 120 may include at least one second thermal interface, and the interface mechanism 132 of the operating module 130 may have a thermal interface mechanism that is compatible with at least one second thermal interface of the cryogenic module 120.
[0134] At least one second thermal interface of the cryogenic module 120 may be configured to be cooled to a second temperature lower than the first temperature by the cooling mechanism of the cryogenic module 120 when the cryogenic module 120 is ON. The second temperature may be 4K or less, or 1K or less. For example, the second temperature may be in the range of 1K to 4K, or in the range of 100mK to 4K, or in the range of 100mK to 1K.
[0135] In some embodiments, at least one second interface 124 of the cryogenic module 120 may include at least one second electrical interface, and the interface mechanism 132 of the operating module 130 may have an electrical interface mechanism compatible with at least one second electrical interface of the cryogenic module 120. The electrical connection between the cryogenic module 120 and the operating module 130 may be configured for data communication, such as that relating to the operation and / or control of the cryogenic module 120 and the operating module 130.
[0136] In some embodiments, at least one second interface 124 of the cryogenic module 120 may include at least one second optical interface, and the interface mechanism 132 of the operating module 130 may have an optical interface mechanism compatible with at least one second optical interface of the cryogenic module 120. The optical connection between the cryogenic module 120 and the operating module 130 may be configured for data communication, such as that relating to the operation and / or control of the cryogenic module 120 and the operating module 130.
[0137] As shown in the example in Figure 2, in some embodiments, the cryogenic module 120 and the operating module 130 can be connected to each other when the cryogenic module 120 is in a first operating state, such as the ON state or idle state, and optionally when the pre-cooling module 110 is in a first operating state, such as the ON state or idle state, and / or when the operating module 130 is in a second operating state, such as the OFF state. In addition, the cryogenic module 120 and the operating module 130 can be disconnected from each other when the cryogenic module 120 is in a first operating state, and optionally when the pre-cooling module 110 is in a first operating state, and / or when the operating module 130 is in a second operating state.
[0138] In addition or alternatively, the cryogenic module 120 and the operating module 130 can be connected to each other while the cryogenic module 120 is already connected to the pre-cooling module 110. In addition, the cryogenic module 120 and the operating module 130 can be disconnected from each other while the cryogenic module 120 is still connected to the pre-cooling module 110.
[0139] As shown in the example in Figure 3, in some embodiments, the cryogenic module 120 and the pre-cooling module 110 can be connected to each other when the pre-cooling module 110 is in a first operating state, such as the ON state or idle state, and optionally when the cryogenic module 120 is in a second operating state (OFF state), and / or when the operating module 130 is in a second operating state (OFF state). In addition, the cryogenic module 120 and the pre-cooling module 110 can be disconnected from each other when the pre-cooling module 110 is in a first operating state (ON state or idle state), and optionally when the cryogenic module 120 is in an OFF state, and / or when the operating module 130 is in a second operating state (OFF state).
[0140] In addition or alternatively, the cryogenic module 120 and the pre-cooling module 110 can be connected to each other while the cryogenic module 120 is already connected to the operating module 130. In addition, the cryogenic module 120 and the pre-cooling module 110 can be disconnected from each other while the cryogenic module 120 is still connected to the operating module 130.
[0141] In view of the above, there are releasable mechanical connections between modules 110, 120 and 130. For example, modules 110, 120 and 130 can be connected to each other by positioning them, for example, side by side and / or vertically in specific relative positions, and optionally by closing / fastening mounting means such as clamps and / or screws. Furthermore, modules 110, 120 and 130 can be separated from each other by opening / releasing the mounting means. Thus, "separable" means that modules 110, 120 and 130 can be separated without damaging them.
[0142] The connections between modules 110, 120, and 130 may be any direct or indirect connections suitable for the connected modules to interact thermally and, optionally, electronically and / or optically.
[0143] In some embodiments, the connection may be substantially a vacuum-sealed connection.
[0144] Optionally, one or more vacuum locks may be provided to maintain a vacuum in one or more areas of the modular cryogenic infrastructure during the addition and / or removal of modules. For example, one or more vacuum locks may be configured to maintain a vacuum in a module in a first operating state, such as the ON or idle state. Optionally, one or more vacuum locks may be configured to maintain a vacuum in a module in a second operating state, i.e., the OFF state.
[0145] Optionally, vacuum itself may be used to secure the connections between modules. Optionally, fastening means such as plug connections using male and female plugs, screw connections, bayonet locks, latch connections, etc., may be used to secure the connections between modules.
[0146] Optionally, stabilization means can be provided to stabilize the assembly process of the two modules. For example, pneumatic devices and / or guide devices can be used so that the surfaces are slowly pulled together when a vacuum is generated.
[0147] Optionally, first, specific parts of the module may be drawn together to thermally and optionally electrically connect the module, then a vacuum may be created in at least one of the modules, and / or fastening means may be fastened to securely connect the module and prevent vacuum leakage.
[0148] Optionally, one or more electrical verifying means, such as pins, may be provided on the module. If the electrical (and therefore thermal) connection between modules is properly established, the current flowing through one or more pins may indicate the connection. For example, one or more pins may be provided on an electrical interface.
[0149] In some embodiments, the connection may include a flexible tube, such as a bellows tube. The flexible tube provides flexibility that allows the relative position between modules to change within a predetermined range. The thermal interface can be located inside the flexible tube. Optionally, the electrical interface and / or optical interface can be located inside the flexible tube. In this case, the electrical interface and / or optical interface can be thermally coupled. Alternatively, the electrical interface and / or optical interface can be located outside the flexible tube. In this case, the electrical interface and / or optical interface do not need to be thermally coupled. This is particularly useful when (pre)cooling of the electrical interface and / or optical interface is not required.
[0150] Optionally, one or more thermal shields and / or spacer means can be placed inside the flexible tube to separate different components and / or temperature regions from one another. For example, a millikelvin bath, a 4K shield, a 40K shield, and a vacuum vessel can be arranged in this order from the inside out, with space between them to prevent contact. Stabilizing connections such as spacer means between these “layers” may have low thermal conductivity (e.g., due to a small diameter) to minimize thermal interaction between different temperature regions.
[0151] Optionally, three or more flexible tubes can be connected to each other, for example, in a crossing or transverse device. For example, a first flexible tube may be connected to a pre-cooling module and a crossing or transverse device, and two or more second flexible tubes can be connected to two or more cryogenic modules corresponding to the crossing or transverse device. Similar connections can be provided between one or more cryogenic modules and one or more operating modules.
[0152] In other embodiments, the connection may include a rigid tube. The thermal interface may be located inside the rigid tube. Optionally, the electrical interface and / or optical interface may be located inside the rigid tube. In this case, the electrical interface and / or optical interface may be thermally coupled. Alternatively, the electrical interface and / or optical interface may be located outside the rigid tube. In this case, the electrical interface and / or optical interface may not be thermally coupled. This is particularly useful when (pre)cooling of the electrical interface and / or optical interface is not required.
[0153] Optionally, one or more thermal shields and / or spacer means can be placed inside the rigid tube to separate different components and / or temperature regions from each other. For example, a millikelvin bath, a 4K shield, a 40K shield, and a vacuum vessel can be placed in this order from the inside out, with space between them to prevent contact. Stabilizing connections such as spacer means between these “layers” may have low thermal conductivity (e.g., due to a small diameter) to minimize thermal interaction between different temperature regions. Due to the rigidity of the tube, the space between the “layers” can be reduced, thereby enabling a compact design.
[0154] Optionally, three or more rigid tubes can be connected to each other, for example, in a crossing or transverse device. For example, a first rigid tube may be connected to a pre-cooling module and a crossing or transverse device, and two or more second rigid tubes may be connected to two or more cryogenic modules corresponding to the crossing or transverse device. Similar connections can be provided between one or more cryogenic modules and one or more operating modules.
[0155] Figure 4 shows a schematic diagram of a modular cryogenic infrastructure 200 according to an embodiment of the present disclosure. Since the cryogenic infrastructure 200 is the same as the cryogenic infrastructure shown in Figures 1 to 3, descriptions of similar or identical embodiments will not be repeated.
[0156] The cryogenic infrastructure 200 is scalable. The term "scalable" means that multiple cryogenic modules and / or multiple operating modules can be connected to each other and / or to a single pre-cooling module 110 in various ways. For this purpose, modules 110, 120 and 130 may each have multiple interfaces for connecting modules 110, 120 and 130.
[0157] Figure 5 shows a schematic diagram of a modular cryogenic infrastructure 300 according to a further embodiment of the present disclosure. Since the cryogenic infrastructure 300 is similar to the cryogenic infrastructure shown in Figures 1 to 4, the descriptions of similar or identical embodiments will not be repeated.
[0158] In some embodiments, the pre-cooling module 110 has a plurality of interface mechanisms 112, and one cryogenic module 120a, 120b can be connected to each of the interface mechanisms 112.
[0159] As shown in Figure 5, multiple cryogenic modules 120a, 120b can be connected in parallel to a single pre-cooling module 110. Preferably, multiple cryogenic modules 120a, 120b are connected to the pre-cooling module 110 simultaneously, and the cooling capacity from the pre-cooling module 110 is supplied to them simultaneously.
[0160] In addition, multiple operating modules 130a and 130b can be provided, and each operating module 130a and 130b can be connected to the corresponding cryogenic modules 120a and 120b. In the example shown in Figure 5, the first operating module 130a is connected to the first cryogenic module 120a, and the second operating module 130b is connected to the second cryogenic module 120b.
[0161] While the example in Figure 5 shows two cryogenic modules and two operating modules, the disclosure is not limited thereto, and it should be understood that different numbers of cryogenic modules and operating modules may be connected to and / or to each other simultaneously. In particular, the number of cryogenic modules and operating modules connected to and / or to each other simultaneously may be the same or different.
[0162] In some embodiments, the number of cryogenic modules may be 2 or more, 5 or more, 10 or more, 20 or more, 50 or more, or 100 or more.
[0163] In addition or alternatively, the number of operating modules may be 2 or more, 5 or more, 10 or more, 20 or more, 50 or more, or 100 or more.
[0164] Figure 6 shows a schematic diagram of a modular cryogenic infrastructure 400 according to a further embodiment of the present disclosure. Since the cryogenic infrastructure 400 is similar to the cryogenic infrastructure shown in Figures 1 to 5, similar or identical embodiments will not be repeated.
[0165] In some embodiments, at least two adjacent operating modules 130a, 130b are connected to each other via corresponding interfaces 132, such as a thermal interface and / or an electrical interface and / or an optical interface.
[0166] The connection between at least two operating modules 130a, 130b may be configured for heat transfer between the at least two operating modules 130a, 130b. In addition or alternatively, the connection between at least two operating modules 130a, 130b may be configured for data communication, such as that relating to the operation and / or control of the at least two operating modules 130a, 130b.
[0167] In the example shown in Figure 6, at least two operating modules include a first operating module 130a and a second operating module 130b, where the first operating module 130a is connected to the second operating module 130b. The first operating module 130a is connected to the first cryogenic module 120a, and the second operating module 130b is connected to the second cryogenic module 120b.
[0168] Figure 7 shows a schematic diagram of a modular cryogenic infrastructure 500 according to a further embodiment of the present disclosure. Since the cryogenic infrastructure 500 is similar to the cryogenic infrastructure shown in Figures 1 to 6, similar or identical embodiments will not be repeated.
[0169] In the example shown in Figure 7, the second operating module 130b is connected to the first operating module 130a when it is not connected to a cryogenic module. In particular, the second operating module 130b does not have to be connected to any cryogenic module. For example, the pre-cooling module 110, cryogenic module 120, first operating module 130a, and second operating module 130b may be connected in series. In this case, cooling capacity can be provided from the cryogenic module 120 to the second operating module 130b via the first operating module 130a and the corresponding interfaces 124 and 132.
[0170] In view of the foregoing, embodiments of the present disclosure provide a modular cryogenic infrastructure having a centralized pre-cooling mechanism and independently operable modules. This makes the cryogenic infrastructure flexible and scalable beyond scientific laboratories, making it suitable for large facilities such as data centers. In addition, the modularity eliminates the need to completely shut down the cryogenic infrastructure for maintenance, repair, and the addition of further cryogenic modules and / or operating modules.
[0171] The foregoing relates to embodiments of the present disclosure, but other and further embodiments of the present disclosure may be devised without departing from its basic scope, the scope of which will be determined by the following claims.
Claims
1. A cryogenic module (120) for use in modular cryogenic infrastructure (100, 200, 300, 400, 500), At least one first interface (122) located outside the cryogenic module (120), configured to detachably connect the cryogenic module (120) to the pre-cooling module (110) of the cryogenic infrastructure (100, 200, 300, 400, 500), At least one second interface (124) located outside the cryogenic module (120), configured to detachably connect the cryogenic module (120) to an operating module (130) having an operable device cooled by the cryogenic module (120), Equipped with, - The cryogenic module (120) is connectable to and / or detachable from the precooling module (110) when the precooling module (110) is in a first operating state, the first operating state of the precooling module (110) being the ON state or idle state of the precooling module (110), and / or - The cryogenic module (120) is connectable to and / or detachable from the operating module (130) when the cryogenic module (120) is in a first operating state, and the first operating state of the cryogenic module (120) is the ON state or the idle state of the cryogenic module (120). Cryogenic module (120).
2. - The at least one first interface (122) includes at least one first thermal interface and / or at least one first electrical interface and / or at least one first optical interface, and / or - The at least one second interface (124) includes at least one second thermal interface and / or at least one second electrical interface and / or at least one second optical interface, The cryogenic module (120) according to claim 1.
3. - The cryogenic module (120) is connectable to and / or detachable from the operating module (130) while connected to the pre-cooling module (110), and / or - The cryogenic module (120) is connectable to and / or detachable from the operating module (130) when the operating module (130) is in a second operating state, and the second operating state of the cryogenic module (120) is the off state. The cryogenic module (120) according to claim 1 or 2.
4. - The cryogenic module (120) is connectable to and / or detachable from the pre-cooling module (110) while connected to the operating module (130), and / or - The cryogenic module (120) is connectable to and / or detachable from the pre-cooling module (110) when in the second operating state, and the second operating state of the cryogenic module (120) is the off state. A cryogenic module (120) according to any one of claims 1 to 3.
5. A cryogenic module (120) according to any one of claims 1 to 4, Pre-cooling module (110), At least one operating module (130) and Modular cryogenic infrastructure (100, 200, 300, 400, 500) equipped with these features.
6. The modular cryogenic infrastructure (300, 400) according to claim 5, wherein a plurality of cryogenic modules (120a, 120b) can be connected in parallel to the pre-cooling module (110).
7. The modular cryogenic infrastructure (300, 400, 500) according to claim 5 or 6, wherein at least two operating modules (130a, 130b) are connectable to each other via corresponding interfaces.
8. - The first operating module (130a) of the at least two operating modules (130a, 130b) is connectable to the first cryogenic module (120a), the second operating module (130b) of the at least two operating modules (130a, 130b) is connectable to the second cryogenic module (120b), and the first operating module (130a) is connectable to the second operating module (130b), or - Of the at least two operating modules (130a, 130b), the first operating module (130a) is connectable to the first cryogenic module (120a), and the second operating module (130b) of the at least two operating modules (130a, 130b) is connectable to the first operating module (130a) when not connected to the cryogenic module. The modular cryogenic infrastructure (400) according to claim 7.
9. - The at least one operating module (130) is a quantum technology module, in particular a quantum computing module, a quantum communication module, a quantum sensing module, an optical module, or a combination thereof, and / or - The at least one cryogenic module (120) is an adiabatic demagnetizing refrigeration module, or includes an adiabatic demagnetizing refrigeration module, and / or - The pre-cooling module (110) is a centralized pre-cooling module and / or a turbo-Brayton cooling module, or includes a centralized pre-cooling module and / or a turbo-Brayton cooling module. A modular cryogenic infrastructure (100, 200, 300, 400, 500) according to any one of claims 5 to 8.
10. A pre-cooling module (110) for use in modular cryogenic infrastructure (100, 200, 300, 400, 500), An interface mechanism (112) located outside the pre-cooling module (110) is configured to detachably connect the pre-cooling module (110) to one or more cryogenic modules (120) and / or one or more operating modules (130) of the cryogenic infrastructure (100, 200, 300, 400, 500), The pre-cooling module (110) is connectable to and / or detachable from the one or more cryogenic modules (120) and / or the one or more operating modules (130) when the pre-cooling module (110) is in a first operating state, and the first operating state of the pre-cooling module (110) is either ON or idle. Pre-cooling module (110).
11. An operating module (130) for use in modular cryogenic infrastructure (100, 200, 300, 400, 500), An interface mechanism (132) located outside the operating module (130) is configured to detachably connect the operating module (130) to at least one cooling module (110) of the cryogenic infrastructure (100, 200, 300, 400, 500). Operation module (130).
12. The operating module (130) according to claim 11, wherein the at least one cooling module (110) includes a pre-cooling module (110) and / or a cryogenic module.
13. The operating module (130) according to claim 11 or 12, wherein the operating module (130) is connectable to and / or detachable from the at least one cooling module (110) when the at least one cooling module (110) is in a first operating state, and the first operating state of the at least one cooling module (110) is either ON or idle.
14. A method for operating a modular cryogenic infrastructure (100, 200, 300, 400, 500) according to any one of claims 5 to 9, Connecting the cryogenic module (120) to the pre-cooling module (110) when the pre-cooling module (110) is in a first operating state, wherein the first operating state of the pre-cooling module (110) is either ON or idle, and / or Separating the cryogenic module (120) from the pre-cooling module (110) when the pre-cooling module (110) is in the first operating state, and / or Connecting the cryogenic module (120) to the operating module (130) when the cryogenic module (120) is in a first operating state, wherein the first operating state of the cryogenic module (120) is either ON or idle, and / or When the cryogenic module (130) is in the first operating state, the cryogenic module (120) is separated from the operating module (130). Methods that include...
15. Pre-cooling module and An operating module that can be connected to the pre-cooling module, One or more cryogenic modules that can be connected to the aforementioned operating module, Equipped with, The operating module has an operable device that is cooled by the cryogenic module, and the operating module is configured to provide a thermal path between the pre-cooling module and the one or more cryogenic modules in order to provide pre-cooling to the one or more cryogenic modules. Cryogenic infrastructure.