Electronic module with modular heat dissipation device

Abstract

The present invention relates to an electronic device (1), - An electronic module (2) having a first surface (20) and a second surface (21), wherein the electronic module (2) has n openings (22) penetrating the electronic module (2), where n is a positive integer of 2 or more, and the electronic module (2) has at least one connector (23) extending from the second surface (21), - A heat conductive plate (4) that allows heat to be extracted from the electronic module (2) via the first surface (20), - A printed circuit board (3) is positioned at a distance from the second surface (21) and connected to at least one connector (23), - comprising m inserts (5), where m is a positive integer between 2 and n, each insert (5) is placed in one opening (22), each insert (5) is a thermal conductor, and the m inserts (5) are configured to mechanically connect the electronic module (2) to the thermal conductive plate (4) and to thermally connect the electronic module (2) to the printed circuit board (3).

Description

Technical Field

[0001] The present invention relates to power electronics, particularly power electronics equipped with a radiator.

Background Art

[0002] Power electronics includes not only power components that require cooling during operation, particularly semiconductor elements, but also so-called passive elements such as coils and diodes.

[0003] In this cooling, generally, it is performed by a metal radiator directly disposed on the component to be cooled, and good heat transfer is ensured. This type of power electronics assembly usually also includes a printed circuit board, which is also electrically connected to the power module. It is also conceivable to arrange the printed circuit board near the power module, connect the printed circuit board to the radiator, and exhaust the heat from the power module to the radiator through the printed circuit board.

[0004] However, today, with the increase in the power used in electrical equipment, the printed circuit board may not necessarily be able to meet the heat dissipation needs.

[0005] Therefore, it is necessary to couple a radiator to each power module to discharge the excess heat present in the power module. This radiator usually contacts the radiator directly and ensures the heat bridge function between the electronic component and the radiator that cools this electronic component.

[0006] However, adding a radiator to the power module has many drawbacks.

[0007] In practice, arranging a radiator for the power module has the drawback of reducing the compactness of the power assembly and increasing the mass of the entire assembly. However, in certain applications such as aerospace, these dimensions pose a real challenge.

[0008] Furthermore, despite dimensions being defined to compensate for the actual full power level, high power levels are rarely achieved in practice, and their duration is short. Also, depending on the required function, it is not always necessary to use the full power of the power module. Therefore, when the use of the power module is relatively limited, increasing the size of the cooling system can be inefficient. [Overview of the project] [Problems that the invention aims to solve]

[0009] The object of the present invention is to propose an electronic device equipped with a power module in order to solve some or all of the aforementioned problems, wherein the cooling means of the electronic device is designed to satisfy the functional requirements of the power module, that is, to ensure thermal efficiency when the power module generates a moderate amount of energy, and to improve cooling capacity when the power module generates a larger amount of power. [Means for solving the problem]

[0010] For this purpose, the subject of the present invention is an electronic device comprising the following components. - An electronic module having a first surface and a second surface facing the first surface, wherein the electronic module has n openings penetrating the electronic module, thereby connecting the first surface and the second surface, where n is a positive integer of 2 or more, and the electronic module has at least one connector extending from the second surface, - A thermal conductive plate having a first surface and a second surface, wherein the first surface is in contact with a first surface of an electronic power module, and the thermal conductive plate is capable of extracting heat from the electronic module through the first surface, - A printed circuit board positioned facing the second surface of an electronic module, wherein the printed circuit board is spaced apart from the second surface of the electronic module, and the printed circuit board is electrically connected to at least one connector, - m inserts, where m is a positive integer between 2 and n, each insert of the m inserts is placed in one of the n openings, each insert of the m inserts is a thermal conductor, the m inserts are configured to mechanically connect the electronic module to a thermal conductor plate, and the m inserts are configured to thermally connect the electronic module to a printed circuit board, thereby cooling the electronic module in a first low-heat dissipation configuration.

[0011] According to one aspect of the present invention, the electronic device includes a radiator, the radiator is connected to a second surface of a heat conduction plate, m inserts mechanically connect the electronic module, the heat conduction plate, and the radiator, the m inserts are spaced apart from the printed circuit board, and the radiator is configured to cool the electronic module in a second configuration with high heat dissipation.

[0012] According to one aspect of the present invention, n is equal to m.

[0013] According to one aspect of the present invention, n is equal to 2, the first and second surfaces of the electronic module have side edges, and each of the n openings is located on an opposing side edge.

[0014] According to one aspect of the present invention, n is equal to 2, the first and second surfaces of the electronic module have corners, and each of the n openings is located at an opposing corner.

[0015] According to one aspect of the present invention, at least one connector includes a polished end that is mechanically connected to a printed circuit board.

[0016] According to one aspect of the present invention, m inserts are manufactured from a material having a thermal conductivity equal to that of the thermal conductive plate.

[0017] According to one aspect of the present invention, the heat conductive plate is manufactured from a material selected from copper, brass, or an alloy of nickel, iron, and cobalt.

[0018] The present invention is provided by way of example and will be better understood by reading the detailed description of the embodiments illustrated by the accompanying drawings, and other advantages will become apparent.

Brief Description of the Drawings

[0019] [Figure 1] Shows a schematic view from the front of an electronic device according to the present invention in a low-power configuration. [Figure 2] Shows a schematic view from the front of an electronic device according to the present invention in a high-power configuration. [Figure 3] Shows a schematic view from the top of the power module of an electronic device according to the present invention. [Figure 4] Shows the thermal distribution of the electronic device according to the present invention in a low-power configuration. [Figure 5] Shows the thermal distribution of the electronic device according to the present invention in a high-power configuration.

[0020] For clarity, the same reference numerals are assigned to the same components in different figures.

Embodiments for Carrying Out the Invention

[0021] FIG. 1 shows a schematic view from the front of an electronic device 1 including an electronic power module 2. In particular, the power module 2 has a first surface 20 and a second surface 21 facing the first surface 20 along a vertical axis V. The electronic power module 2 also has n openings 22 passing through the electronic power module 2 so as to connect the first surface 20 and the second surface 21. The number n is a positive integer of 2 or more. As shown in FIG. 1, the number n of the openings is equal to 2. That is, at least two openings 22 pass through the power module 2 and connect the first surface 20 and the second surface 21. However, it is also conceivable that the power module 2 includes two or more openings 22. The electronic power module 2 also includes at least one connector 23 extending from the second surface 21.

[0022] The electronic device 1 further includes a printed circuit board 3, also referred to as a PCB, disposed facing the second surface 21 of the electronic power module 2. The printed circuit board 3 is disposed at a distance from the second surface 21 of the electronic power module 2. The printed circuit board 3 is also electrically connected to at least one connector 23 of the power module 2. That is, the printed circuit board 3 is not connected to the second surface 21 and provides an electrical connection function with the power module 2 via at least one connector 23. Therefore, a space can be observed between the second surface 21 of the electronic power module 2 and the printed circuit board 3.

[0023] Therefore, the first surface 20 represents the upper surface of the power module 2, and the second surface 21 represents the lower surface of the power module 2. As a result, the printed circuit board 3 is disposed below the power module 2 with respect to the vertical axis V.

[0024] The printed circuit board 3 further includes openings 32. The printed circuit board 3 includes n openings 32. Each opening 32 of the printed circuit board faces the opening 22 of the power module 2.

[0025] The electronic device 1 includes a heat conducting plate 4 having a first surface 40 and a second surface 41. The first surface 40 contacts the first surface 20 of the electronic power module 2. The heat conducting plate 4 extends over the first surface 20 of the power module 2. Therefore, the heat conducting plate 4 enables heat to be extracted from the electronic power module 2 through the first surface 20. That is, the heat generated by the electronic power module 2 is transmitted to the heat conducting plate 4 by passing through the first surface 20 and the first surface 40. According to a preferred modification, the heat conducting plate 4 extends over the entire first surface 20 of the electronic power module 2, thereby maximizing the contact between the power module 2 and the heat conducting plate 4 and improving the heat exchange by conduction between the electronic power module 2 and the heat conducting plate 4.

[0026] Therefore, along the vertical axis V, an overlap of the printed circuit board 3, the power module 2, and the heat conducting plate 4 can be observed.

[0027] The heat conductive plate 4 is manufactured from copper, brass, or an alloy of nickel, iron, and cobalt, or other material having excellent thermal conductivity.

[0028] The electronic device 1 also includes m inserts 5. The number m is a positive integer greater than or equal to 2 and less than or equal to n. Each of the m inserts 5 is placed in one of the n openings 22. The m inserts 5 make it possible to mechanically connect the electronic power module 2 to the heat conduction plate 4, and the heat conduction plate 4 is fixed to the electronic power module 2. Thus, each insert 5 is in contact with the heat conduction plate 4. Each of the m inserts 5 is also a heat conductor.

[0029] Each of the m inserts 5 is connected to the printed circuit board 3 without requiring any fixing between the electronic power module 2 and the printed circuit board 3. That is, each insert 5 penetrates the printed circuit board 3 through the opening 32.

[0030] Therefore, the m inserts 5 are configured to thermally connect the electronic power module 2 to the printed circuit board 3 in order to cool the electronic power module 2 in a first low-energy dissipation configuration, as shown in Figure 1. The m inserts 5 are manufactured from a material whose thermal conductivity is equal to or greater than that of the thermal conductive plate 4, and assist in heat conduction in the direction of the inserts. As an example, the thermal conductivity of the thermal conductive plate 4 and the m inserts 5 exceeds 50 W / m*K.

[0031] In fact, in a low-energy-dissipation configuration, i.e., when the power module 2 generates a moderate amount of heat, the printed circuit board 3 is sufficient to dissipate the heat generated by the power module 2. Therefore, in the low-energy-dissipation configuration shown in Figure 1, the heat generated by the electronic power module 2 is dissipated towards the heat conduction plate 4 via the first surface 20 and the first surface 40. This heat is transferred to each of the m inserts 5, as shown in the propagation direction 6, and the inserts 5 then directly transfer it to the printed circuit board 3 for heat dissipation.

[0032] Furthermore, the structure of the printed circuit board 3 can be defined to assist in heat extraction. For this purpose, in a low heat dissipation configuration, additional heat conduction elements can be added to the printed circuit board, or the thickness of the printed circuit board 3 can be increased to increase the number of heat conduction elements. As an example, copper can be added to the printed circuit board 3.

[0033] In a low-heat-dissipation configuration, the electronic device 1 can dissipate heat via the printed circuit board 3. This is possible when the power consumed by the power module 2 is less than 4W.

[0034] Furthermore, each of the m inserts 5 has a head 51 and a tail 52. The head 51 of each insert 5 is supported and positioned on a heat conduction plate 4, and the head applies pressure to the heat conduction plate 4, thereby holding the heat conduction plate 4 against the power module 2. The tail 52 of each of the m inserts 5 also contacts the printed circuit board 3, allowing the m inserts 5 to conduct the heat energy they need to dissipate toward the printed circuit board 3.

[0035] In a low-heat dissipation configuration, the electronic device 1 has the advantage of being compact while achieving the appropriate cooling capacity of the cooling module 2.

[0036] Figure 2 shows a second operating configuration of the electronic device 1, which is classified as a high-heat-dissipation configuration in relation to the configuration in Figure 1. In this high-heat-dissipation configuration, i.e., when the electronic power module 2 supplies a large amount of energy and heat, the cooling capacity of the printed circuit board is no longer sufficient to dissipate the heat generated by the power module 2.

[0037] Therefore, in the high-energy dissipation configuration, the electronic device 1 also includes a radiator 7. The radiator 7 is connected to the second surface 41 of the heat conduction plate 4. This makes it possible to observe that the printed circuit board 3, power module 2, heat conduction plate 4, and radiator 7 are superimposed along the vertical axis V. Note that only the power module 2, heat conduction plate 4, and radiator 7 are in direct contact. The printed circuit board 3 is positioned spaced apart from the power module 2 in that portion.

[0038] The m inserts 5 mechanically connect the electronic power module 2, the heat conduction plate 4, and the radiator 7. Thus, the m inserts 5 fix the electronic power module 2, the heat conduction plate 4, and the radiator 7 to each other. Each of the m inserts 5 is positioned spaced apart from the printed circuit board 3.

[0039] Therefore, in the second configuration, the radiator 7 is configured to cool the electronic module 2 in a high-heat state.

[0040] Therefore, the heat generated by the electronic power module 2 is transferred in the direction of the radiator 7, not in the direction of the printed circuit board 3. That is, the heat generated by the power module 2 is transferred to the heat conduction plate 4 via the first surface 20 and the first surface 40. The heat conduction plate 4 then transfers this energy in the form of heat to the radiator 7 via the second surface 41. The radiator 7 ensures that this energy is dissipated in the form of heat.

[0041] As a result, in the second energy dissipation configuration shown in Figure 2, energy in the form of heat is not transferred to the printed circuit board 3, nor to the insert 5.

[0042] Furthermore, in the second high-energy-dissipation configuration, the fixing direction of each of the m inserts 5 is reversed. More specifically, the head 51 contacts the second surface 21 of the electronic power module 2, and the tail 52 contacts the radiator 7. Reversing the fixing direction of the inserts 5 has the advantage of improving the compactness of the assembly even when the radiator 7 is added. In fact, since the heads 51 have a certain thickness, each head 51 will protrude relative to the radiator 7. Advantageously, reversing the fixing direction of the inserts 5 makes it possible to bring the radiator 7 into direct contact with the heat conduction plate 4, thereby facilitating heat exchange.

[0043] As mentioned above, in the second energy dissipation configuration shown in Figure 2, no heat exchange occurs between the power module 2 and the printed circuit board 3 via the insert 5. Therefore, to prevent any heat transfer in this direction, it is conceivable to add an insulating function between the head 51 of each insert 5 and the printed circuit board 3.

[0044] In the preferred configuration, the printed circuit board 3 is formed along the head 51 of the insert 5, thereby preventing any direct contact between the m inserts 5 and the printed circuit board 3. That is, a space 53 is provided between each head 51 and the printed circuit board 3, ensuring the heat insulation of the insert 5. Therefore, the objective is simply to increase the cross-sectional area of ​​the opening 32 along a plane perpendicular to the vertical axis V. This spacing between the m inserts 5 and the printed circuit board 3 also has the advantage of not putting excessive stress on the mechanical coupling between the printed circuit board 3 and the power module 2, which is already connected by at least one connector 23. In fact, applying further stress to the fixing of the printed circuit board 3 could cause deformation of the printed circuit board 3, or even deterioration of this component.

[0045] Therefore, at least one connector 23 is equipped with a polished or file-shaped end 230 that is mechanically connected to the printed circuit board 3, so as not to impose excessive mechanical stress on the electronic device 1. This file-shaped end 230 can be spirally wrapped around pins or additional connectors within the printed circuit board 3, thereby flexibly holding the printed circuit board 3 relative to the electronic power module 2 along the vertical axis V. In other words, the printed circuit board 3 is connected to the power module 2 by this flexible connection, but still has relative free movement along the vertical axis V.

[0046] Therefore, in the second high-energy dissipation configuration, the m inserts 5 only provide the function of mechanically fixing the power module 2, the heat conduction plate 4, and the radiator 7. The printed circuit board 7 only provides the function of electrical wiring. This changes the heat conduction path so that the direction of heat propagation 6 is directed toward the radiator 7.

[0047] In the second configuration of energy dissipation, the module operates at higher power, and energy dissipation exceeds 30% of the power of the power module.

[0048] Therefore, the electronic device 1 has the advantage of being adaptable to different operating configurations; that is, in a low-power configuration, energy consumption is low and heat dissipation is sufficiently possible with the printed circuit board 3, or in a high-power configuration, energy consumption is high and the radiator 7 ensures energy dissipation in the form of heat from the electronic module 2 instead of the printed circuit board 3. Transitioning from one configuration to the other, i.e., from the configuration in Figure 1 to the configuration in Figure 2, requires only a change in the fixing direction of the m inserts 5 relative to the vertical axis V. The electronic device 1 is advantageously compact while accommodating numerous energy constraints by enabling a wider operating range and heat dissipation range. Therefore, the heat dissipation function switches from the printed circuit board 3 to the radiator 7 depending on the power generated by the electronic power module 2.

[0049] Figure 3 shows a viewpoint perpendicular to the vertical axis V of the heat conductive plate 4, which is placed on the electronic device 1, more specifically on the power module 2.

[0050] As described above, the heat conduction plate 4 extends onto the first surface of the power module 2. The first surface 40 of the heat conduction plate 4 is in direct contact with the first surface 20 of the power module 2. As shown in Figure 3, the heat conduction plate 4 extends to cover the entire first surface 20 of the power module 2.

[0051] Similar to the power module 2 and the printed circuit board 3, the thermal conductive plate 4 has n openings 42 as shown in Figure 3, allowing each insert 5 to penetrate the thermal conductive plate 4 of the power module 2 and the printed circuit board 3. Just as the electronic power module 2 has two openings 22, in the configuration of Figure 3, the thermal conductive plate 4 has two openings 42. Although not shown in Figure 3, the printed circuit board 3 also has two openings 32.

[0052] Preferably, the electronic device 1 has the same number of openings as the number of inserts 5. That is, the number n of openings 22 is equal to the number m of inserts 5. Therefore, the openings 22 of the power module 2, i.e., the openings 42 of the thermal conductive plate 4 (and the openings 32 of the printed circuit board) are occupied by the inserts 5.

[0053] In an ideal configuration, the number n of openings 22 and the number m of inserts 5 are equal to 2, as shown in Figure 3. The first surface 20 of the electronic module 2 has corners 200, 201, 202, and 203. Similarly, the second surface 21 also has corners. Furthermore, each opening 22 between the two openings 22 is spaced apart from the other opening 22 between them. The greater the distance between the two openings 22, the better the heat distribution in the heat conduction plate 4. In fact, since the two openings 22 enable thermal connection between the heat conduction plate 4 and the two inserts 5, in a low-energy dissipation configuration, spacing the two openings 22 apart from each other allows the transfer of thermal energy to the two inserts 5 in the form of heat, which is distributed across the entire first surface 20.

[0054] Preferably, the two openings 22 are located on opposing side edges. That is, the first opening 22' can be located at the first corner 200, and the second opening 22'' can be located at the third corner 202. This structure makes it possible to obtain symmetry in the distribution of heat transfer in the direction of the insert 5.

[0055] As a variation, the second opening 22" can also be positioned at the second corner 201 or the fourth corner 203.

[0056] Similarly, it is conceivable that the two openings 22 be positioned along the two side edges 205, 206, 207, and 208. Preferably, the two side edges are positioned opposite each other to facilitate good heat distribution on the heat transfer plate 4 between the two inserts 5.

[0057] Furthermore, if the number of openings 22 and the number of inserts 5 is 3, it is conceivable that the first opening be placed at the first corner 200, the second opening at the second corner 201, and the third opening at the third corner 202 or the fourth corner 203, or that the first opening be placed at the first side edge 205, the second opening at the second side edge 206, and the third opening at the third side edge 207 or the fourth side edge 208.

[0058] It is also conceivable that the first opening be placed at the corner of the first surface 20, and the second opening be placed at the side edge of the first surface 20.

[0059] By positioning the heat conduction plate 4 on the power module 2 along the vertical axis V, there is an advantage that thermal energy can be efficiently transferred towards the insert 5 in low-energy dissipation configurations, and thermal energy can be efficiently transferred towards the radiator 7 in high-energy dissipation configurations. Furthermore, this position of the heat conduction plate 4 also has the advantage of enabling easy interface with the radiator 7, thereby allowing for easy addition of the radiator 7 even when considerable heat dissipation is required. The heat conduction plate 4 may be processed to have a second surface 41 that is as smooth as possible to facilitate heat transfer towards the radiator 7, and a first surface 40 that matches the height of the components of the power module 2 in order to minimize thermal resistance between the power module 2 and the heat conduction plate 4.

[0060] Figure 4 shows a schematic diagram of the heat distribution when the electronic device 1 is configured for low energy dissipation. This diagram clearly shows the distribution of heat mainly distributed around the heat conduction plate 4, insert 5, and printed circuit board 3, and then dissipated.

[0061] In contrast, Figure 5 shows a schematic diagram of the heat distribution when the electronic device 1 is configured for heat dissipation. As can be seen in Figure 5, the heat distribution is more concentrated around the heat conduction plate 4 and the radiator 7 for heat dissipation.

[0062] The temperature rise is approximately 1 degree, significantly improving the thermal performance level of Power Module 2 and achieving far superior cooling capabilities.

Claims

1. - An electronic module (2) having a first surface (20) and a second surface (21) facing the first surface (20), wherein the electronic module (2) has n openings (22) penetrating the electronic module (2), thereby connecting the first surface (20) and the second surface (21), where n is a positive integer of 2 or more, and the electronic module (2) has at least one connector (23) extending from the second surface (21), - A heat conductive plate (4) having a first surface (40) and a second surface (41), wherein the first surface (40) is in contact with the first surface (20) of the electronic power module (2), and the heat conductive plate (4) is capable of extracting heat from the electronic module (2) via the first surface (20), - A printed circuit board (3) is positioned facing the second surface (21) of the electronic module (2), wherein the printed circuit board (3) is positioned at a distance from the second surface (21) of the electronic module (2), and the printed circuit board (3) is electrically connected to the at least one connector (23), - m inserts (5), where m is a positive integer between 2 and n, each of the m inserts (5) is placed in one of the n openings (22), each of the m inserts (5) is a thermal conductor, the m inserts (5) are configured to mechanically connect the electronic module (2) to the thermal conductive plate (4), and the m inserts (5) are configured to thermally connect the electronic module (2) to the printed circuit board (3), thereby cooling the electronic module (2) in a first low-heat dissipation configuration, An electronic device (1) equipped with the following:

2. The electronic device (1) according to claim 1, comprising a radiator (7), the radiator (7) being connected to the second surface (21) of the heat conduction plate (4), the m inserts (5) mechanically connecting the electronic module (2), the heat conduction plate (4), and the radiator (7), the m inserts (5) being spaced apart from the printed circuit board (3), and the radiator (7) being configured to cool the electronic module (2) in a second high heat dissipation configuration.

3. The electronic device (1) according to claim 1 or 2, wherein n is equal to m.

4. The electronic device (1) according to claim 3, wherein n is equal to 2, the first surface (20) and the second surface (21) of the electronic module (2) have side edges (205, 206, 207, 208), and each of the n openings (22) is positioned on an opposing side edge (205, 206, 207, 208).

5. The electronic device (1) according to claim 3, wherein n is equal to 2, the first surface (20) and the second surface (21) of the electronic module (2) have corners (200, 201, 202, 203), and each of the n openings (22) is located at an opposing corner (200, 201, 202, 203).

6. The electronic device (1) according to any one of claims 1 to 5, wherein the at least one connector (23) includes a polished end (230) that is mechanically connected to the printed circuit board (3).

7. The electronic device (1) according to any one of claims 1 to 6, wherein the m inserts (5) are manufactured from a material having a thermal conductivity equal to that of the thermal conductive plate (4).

8. The electronic device (1) according to any one of claims 1 to 7, wherein the heat conductive plate (4) is manufactured from a material selected from copper, brass, or an alloy of nickel, iron, and cobalt.

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