A method for sending a profile to a chip module and operating the chip module, a chip module, and a device comprising such a chip module.

Abstract

The present invention relates to a method for transmitting profiles to a chip module and operating the chip module, a chip module for maintaining a plurality of profiles that can be selectively enabled, and a communication module and a device having the chip module. A plurality of profiles of different profile types can be stored in the chip module, and each profile is assigned its own profile type and profile data. The chip module operates with one or more profiles. Depending on the profile type of the enabled profile, the chip module operates in a first operating mode or a second operating mode.

Description

Technical Field

[0001] The present invention relates to a method for transmitting a profile to a chip module and operating the chip module, to a chip module for maintaining a plurality of selectively activatable profiles, and to a device comprising a communication module and said chip module.

[0002] Background Art For example, chip modules in the form of chip cards or integrated circuits are used in many fields to grant or deny permission for access to services. Chip modules contain data that can uniquely identify a person or a device. However, chip modules also comprise a processor capable of performing computation processes.

[0003] If the chip module is designed as a chip card, the chip card comprises, for example, a card body and an integrated circuit embedded in the card body in the form of a chip module having, for example, a chip. The chip module is inserted into a cavity or a module opening of the card body.

[0004] However, the chip module can also be designed as an integrated electronic circuit. It should be understood that, in this respect, references to chip cards and descriptions relating to chip cards in connection with the present description are generally always applicable to chip modules and the implementation thereof as integrated electronic circuits.

[0005] Before a smart card can be used to access a service, the smart card usually needs to be provisioned with a profile. One or more profiles can be stored on the chip card, each profile enabling or requiring different access rights or different operating modes for the chip card and a device comprising the chip card.

[0006] When accessing mobile communication services, the chip module is used as a so-called SIM card (subscriber identification module) or eSIM (embedded SIM) to grant the device or user appropriate access rights. A profile is stored in the chip module to configure access to the communication services.

[0007] There are configurations that allow a device to use different profiles to transfer data over a communication network. Therefore, a device may include multiple chip modules, for example, using a first profile to transfer data from the user and a second profile to perform data exchange between the device and the manufacturer for maintenance or other purposes.

[0008] The device may also be operated using different profile types in different time zones or environments.

[0009] The relevant GMSA standard in the consumer sector is SGP.22, and the relevant GMSA standard in the IoT sector is SGP.32. SGP.22 and SGP.32 differ in how profiles are transferred to the chip module and how profiles are managed. Currently, SGP.22 and SGP.32 require separate chip modules.

[0010] U.S. Patent Application Publication No. 20210368329 discloses a method for adaptively generating profile packages for installing profiles on an embedded universal integrated circuit card (eUICC). According to this method, a different profile description, unique to each use case, is received from a mobile network operator server. The profile description corresponds to a different configuration of the eUICC. The eUICC, data preparation server, or MNO server also receives configuration information. A profile description matching the received configuration information is selected. The profile data is provided to the data preparation server. The data preparation server generates a profile package from the profile description and profile data that can be loaded onto the eUICC.

[0011] U.S. Patent Application Publication No. 20190327605 describes a method for loading a profile onto eUICC using a local profile assistant on eUICC. In response to instructions given by the local profile assistant on eUICC to download a target profile from a download server indicated by download information, the user terminal uses the local eUICC profile assistant to send the target profile specified in the download information to eUICC.

[0012] U.S. Patent Application Publication No. 20170077975 discloses a method for loading and managing profiles on eUICC. eUICC retrieves configuration information from terminal devices with embedded eUICC and transmits it to a subscription management platform. The subscription management platform creates a profile that matches the configuration information.

[0013] U.S. Patent Application Publication No. 20190098488 discloses a management system for eSIMs that acts as an abstraction layer between various partners, mobile network operators, mobile virtual network operators, and / or enterprises and SIM or eSIM providers, supporting real-time profiling. To respond to profiling requests and provide profiles as needed, the system reads network information into a relational database, receives profiling requests from subscription management applications, calls a data preparation platform to assign an Integrated Circuit Card Identifier (ICCID) for the profiling request, and reads the ICCID details into a real-time storage network database.

[0014] Summary of the Invention Therefore, it can be considered that an objective of the present invention is to simplify the use of different profile types in communication devices.

[0015] This objective is achieved by a method for transmitting profiles to a chip module and operating the chip module, a chip module that maintains multiple enableable profiles, and a device having a communication module and a chip module. Further embodiments can be obtained from the dependent claims and the following description.

[0016] According to one embodiment, a method is provided for transmitting a profile to a chip module and operating the chip module. This method includes the following steps: triggering the transmission of a profile to a chip module; transmitting profile type information to the chip module, the profile type information being linked to the triggered transmission of the profile; requesting profile data from a profile deployment unit; the profile deployment unit transmitting the profile data to a profile management unit; the profile management unit transferring the profile data to the chip module; linking the profile data to the profile type information to generate a profile; and storing the generated profile in the profile memory space of the chip module.

[0017] Profiles are used to identify devices and / or people to service providers and to assign access rights and / or roles to devices and / or people. Profiles allow service providers to grant or deny access to services.

[0018] Before a device accesses a service for the first time, that service must be prepared to accommodate that access. This includes, among other things, storing profiles. In this context, these include profiles for accessing communication networks, particularly wireless mobile communication networks. A transmission process is triggered first to ensure that the device receives the profile. This transmission process writes the profile to the chip module.

[0019] The method described here provides that profile types are assigned to profiles. In particular, profile types can affect how profiles are managed and how chip modules function when associated profiles are made available.

[0020] For example, the profile type can indicate whether the profile is for a device belonging to a natural person in the capacity of a consumer (a so-called consumer device) or for a network device used in an IoT environment (a so-called IoT device). The deployment process and use of profiles for consumer devices are defined in the GSMA's SGP.22 specification family. The deployment process and use of profiles for IoT devices are defined in the SGP.32 specification family. SGP.22 and SGP.32 describe how profiles are placed on a chip module and how devices function using the corresponding profiles.

[0021] A notable aspect in this case is that profile type information is transmitted to the chip module before the profile data is transferred from the profile deployment unit to the profile management unit and the chip module. Therefore, the chip module has relevant information about which profile type will be transmitted next. Thus, the chip module can link the next received profile data to this profile type. Furthermore, the chip module can also apply communication behavior corresponding to the transmitted profile type. Following the example above, the chip module must function differently for SGP.22 profiles and SGP.32 profiles. Once this profile type information is available to the chip module, the chip module can already apply the corresponding behavior according to the corresponding specification family during the profile data transmission stage.

[0022] In this way, the chip module can receive different profile types, and it can also know which profile type a profile belongs to each time.

[0023] After the chip module receives information about the profile type, it can request profile data from the profile deployment unit. The requested profile data is uniquely identified using a known mechanism (i.e., a mechanism in which a profile is requested and deployed for a specific person and / or device, and this profile is identified by a unique identifier such as a number) so that it can be properly deployed by the profile deployment unit.

[0024] The requested profile data is sent from the profile deployment unit to the profile management unit. For example, the profile deployment unit is a central entity of a service provider, such as a mobile network operator. For example, the profile deployment unit can be a so-called SM-DP+ (Subscription Manager-Data Preparation) as defined in the GSMA protocol.

[0025] The profile management unit is a local module that operates on a remote device or chip module. The profile management unit receives profile data from the profile deployment unit and transfers it to the chip module. Specifically, the profile management unit implements the functions of the Local Profile Assistant (LPA) and / or IoT Profile Assistant (IPA), where IoT refers to the Internet of Things. In particular, the profile management unit also plays a role in handling the transfer of profile data from the profile deployment unit to the chip module. For example, the profile management unit can store profile data in a buffer and then convert it to a format that is transferred to the chip module.

[0026] When the profile deployment unit transmits profile data to the profile management unit, all known security and confidentiality mechanisms can be used to protect the content of the transmitted data packets from unauthorized access.

[0027] In the chip module, a profile is generated by linking profile data to profile type information. The generated profile is stored, i.e., stored, in the profile memory space of the chip module.

[0028] In this way, multiple profiles of different profile types can be stored in and used by the chip module. In particular, a single physical chip module can include multiple profiles of different profile types, and can also have the capability to function in accordance with each respective profile type.

[0029] In one embodiment, the profile type information is configured to indicate a profile type selected from the group including at least two different profile types.

[0030] The information related to the profile type notifies the chip module which profile type the subsequently transmitted profile data belongs to, and which profile type the profile created therewith includes. Therefore, the chip module can, for example, switch to an operation mode that needs to be operated for the corresponding profile type, and this operation mode relates to both receiving the profile type and operating in accordance with the specific profile type.

[0031] The profile type information may be a data field or a value uniquely assigned to a specific profile type. For example, a first value of the profile type information may indicate an SGP.22 profile, and a second value may indicate an SGP.32 profile.

[0032] In another embodiment, the transmission of a profile to the chip module is triggered via a profile activation unit, which is an activation module or remote access unit of the device housing the chip module.

[0033] Depending on the profile type, the transmission of the profile to the chip module is triggered either locally by the activation module or remotely by the remote access unit.

[0034] For example, if the profile is a consumer profile using SGP.22, it is usually the responsibility of the operator of the associated device to trigger the transmission of the profile. The activation module may be, for example, a software module that runs on the device and allows the user to trigger the transmission of the profile to the chip module.

[0035] For IoT devices, which often lack direct user interfaces for input and output, this approach is not always possible or feasible via a local activation module. Therefore, in the case of profiling with SGP.32, profile transmission is triggered via a remote access unit.

[0036] When profile transmission is triggered, profile type information may be simultaneously transmitted to the chip module so that the chip module operates in the appropriate mode and the next transmitted profile is linked to a matching profile type and stored in its memory. For example, the enablement module may send a message to the chip module indicating that a profile is being transmitted via SGP.22. When the chip module receives the profile, it links it to the corresponding profile type. The remote access unit may send a message to the chip module indicating that a profile is being transmitted via SGP.32, and when the chip module receives this profile, it takes the appropriate action and links it to the corresponding profile type.

[0037] This means the chip module receives a message indicating that a new profile is being transferred to it, and another message indicating which profile type this new profile belongs to. This message is sent to the chip module before the new profile is stored in it. Now the chip module is ready to receive the profile. As soon as the profile arrives at the chip module, it is assigned to a profile type according to the previously received message.

[0038] In a further embodiment, the step of linking profile data to profile type information in order to generate a profile includes the step of storing the profile data and profile type information together under a unique profile number.

[0039] For a profile to be complete, both profile data and profile type are required. Profile data includes service provider values ​​and parameters, which are used by the service provider to, for example, set access parameters for the services being provided. The profile type indicates the type of profile in question and therefore influences how the chip module must operate within that particular profile.

[0040] Each profile includes a unique profile number that distinguishes it from other profiles. Profiles can be selected and activated via their profile number.

[0041] In further embodiments, the method also includes the steps of selecting a profile from the profile memory space of the chip module and operating the chip module according to the selected profile.

[0042] A chip module can contain multiple profiles within its profile memory space. The number of profiles is limited only by the size of the profile memory space.

[0043] Preferably, a new profile can be sent to the chip module at any time, even if the chip module already contains one or more profiles. One of the profiles contained in the profile memory space can be selected to operate the chip module with the corresponding profile. The selected profile may also be called the active profile.

[0044] In a further embodiment, a chip module is defined for maintaining a plurality of selectively enableable profiles. The chip module comprises a processor, memory, and a communication interface. The chip module is configured to receive profile type information and profile data via the communication interface. The processor is configured to store the profile type information and profile data as profiles in memory. The memory is configured to contain a plurality of profiles, at least two of which differ from each other with respect to their respective profile type information. The chip module is configured to operate in operating modes according to the profile types, and the chip module can operate with a first profile type in a first operating mode, or with a second profile type in a second operating mode.

[0045] The chip module described herein implements the functions described above in relation to this method. This chip module is suitable for operation as a single physical hardware module with different profiles. Therefore, the chip module can be operated and configured in a terminal device in different operating modes, for example, in a first operating mode according to the SGP.22 specification and in a second operating mode according to the SGP.32 specification.

[0046] This is made possible by the chip module first receiving a message that notifies it of the profile type of the next profile to be transferred. Therefore, the chip module can directly assign the desired profile type to the received profile data and store the profile data along with information about the profile type. If this profile is later activated, the chip module can read the profile type and operate in the corresponding operating mode.

[0047] The chip modules described here can store profiles of different profile types and therefore can be operated selectively; thus, they can be called profile-type independent chip modules.

[0048] In one embodiment, the chip module is configured to enable at least two profiles of a first profile type simultaneously in a first operating mode.

[0049] In particular, the consumer sector using SGP.22 allows multiple profiles to be enabled at once, and the corresponding communication device can be operated so that both profiles of the same profile type are active simultaneously.

[0050] In a further embodiment, the chip module is configured to manage profiles of a second profile type via a remote access unit.

[0051] The second operating mode corresponds to operation by SGP.32. Profiles for this operating mode are typically only accessible via a remote access unit. Conversely, this means that profiles for the second operating mode are not locally accessible to the device user. Preferably, the chip module is designed so that the remote access unit exclusively receives access to profiles of the second profile type and prohibits access to profiles of the first profile type.

[0052] This structure allows the device user to configure the device locally and load and activate the corresponding profile into the chip module, but it is also possible to store profiles of different profile types on the same chip module, which can only be managed via remote access.

[0053] In another embodiment, the chip module is configured to deny access to the remote access unit to a profile of a first profile type.

[0054] This can be done, for example, by having the chip module filter profiles by profile type and transfer information related only to profiles of the second profile type to the remote access unit. This means that no information about profiles of the first profile type is output to the remote access unit at all. Other mechanisms are also possible. For example, profiles of the first and second profile types could be stored in different areas of the chip module memory, and the remote access unit could receive access privileges only to the memory area containing profiles of the second profile type.

[0055] If a profile activation unit includes a local activation module and a profile management unit includes a submodule implemented as an LPA, and these are used for managing and activating profiles, then such a local activation module and LPA may be denied access to profiles of a second profile type.

[0056] In other words, the IPA and its corresponding remote access device can only access profiles of the second profile type (SGP.32), while the LPA and local enablement module can only access profiles of the first profile type (SGP.22).

[0057] In another embodiment, a device having a communication module and a chip module as described herein is defined. The chip module is assigned to the communication module and enables the communication module to access communication services through at least one profile. The device has a profile management unit configured to receive profile data from a profile deployment unit. The profile management unit is configured to receive profile type information and transfer profile type information and profile data so that a profile is generated and stored in the memory of the chip module.

[0058] This embodiment describes the chip module described above in the context of a device having a communication module. The chip module is used in the communication module to enable one or more profiles and to enable the use of communication services through the communication module.

[0059] For example, the device may be a smartphone or other personal device used by a human user to access communication services. The device may also be another type of network device, such as a sensor, medical device, controller, or entertainment device, which the communication module uses to send and receive data.

[0060] For further details regarding the chip module, please refer to the corresponding sections of this description. The features and functions of the chip module will not be repeated at this point, but nevertheless, they also apply to the chip module in the context of this device described herein. The device is configured, in particular, to perform the method described herein, or the steps of this method, for sending a profile to the chip module and for operating the chip module. The steps of this method can be implemented as a function of the device without explicitly repeating these steps here.

[0061] In one embodiment, the profile management unit has a first submodule and a second submodule, the first submodule configured to process profile type information for a first profile type, and the second submodule configured to process profile type information for a second profile type.

[0062] The first submodule is configured to send a message to the chip module's processor indicating that a profile is being sent via SGP.22, for example, and the second submodule is configured to send a message to the chip module's processor indicating that a profile is being sent via SGP.32.

[0063] Therefore, the first submodule is the so-called LPA (Local Profile Assistant), and the second submodule is the so-called IPA (IoT Profile Assistant).

[0064] The profile management unit implements two submodules and can therefore handle two different types of profiles. Depending on the profile type, either the first or second submodule addresses the chip module and sends a corresponding message when a profile of the first or second profile type is written to the chip module. Similarly, depending on the profile type, the first or second submodule requests profile data from the profile deployment unit, receives the profile data, prepares it, and transfers it to memory within the chip module. As far as basic functionality is concerned, the first and second submodules operate in the same way, except that the first submodule is addressed via the local enablement module and the second submodule is addressed via the remote access unit.

[0065] In another embodiment, the profile management unit is a functional module that runs within the device or on a chip module.

[0066] Depending on the available computing power within the chip module, the profile management unit may be a module implemented in software executed by the chip module's processor. However, it is also conceivable to provide the profile management unit as a separate functional module within the device, distinct from the chip module.

[0067] In another embodiment, the device has an enablement module, which is a functional module that runs locally on the device and is configured to accept user input and send a message to a first submodule based on that input, thereby triggering the transmission of a profile of a first profile type to the chip card.

[0068] For example, an activation module is an application or program that runs on the device. The activation module allows the device user to load a profile of a first profile type, i.e., SGP.22, onto, for example, a chip module. The activation module outputs information that the profile to be loaded is a profile of the first profile type, so that the chip module links the profile to the matching profile type. Once the profile is activated, the chip module and the device also operate in the corresponding operating mode.

[0069] In a further embodiment, the second submodule is configured to receive a message from the remote access unit, thereby triggering the transmission of a profile of the second profile type to the chip card.

[0070] For example, when loading a profile of a second profile type using SGP.32 into a chip module, this is initiated by the remote access unit sending a corresponding command to a second submodule of the profile management unit. The second submodule generates and outputs an appropriate message to prepare the chip module to send the profile of the second profile type. Furthermore, the second submodule can retrieve the profile data from the profile deployment unit and transfer this profile data to the chip module's memory. The chip module marks the corresponding data to indicate that it is linked to the profile type and that the chip module and device will operate in the second operating mode when the profile of the second profile type is activated.

[0071] In summary, the method, chip module, and device described here enable the storage of multiple profiles of different profile types on a single physical chip module, selectively enabling profiles, and allowing the chip module and device to operate in a first or second operating mode depending on the profile type of the enabled profile (or multiple enabled profiles), which applies to both the transmission and operating type of the relevant profile when using the profile. This means that if a communication device operates with a profile according to, for example, SGP.22 or SGP.32, it does not need to use multiple physical chip modules. Before the profile data is transmitted, the profile type to which the profile data belongs is notified to the chip module, and the profile data and profile type are stored together in the profile, so that profiles according to both standards can be stored on the same chip module.

[0072] The references to SGP.22 and SGP.32 are essentially illustrative. It should be understood that the methods, chip modules, and devices described here can also operate with profiles according to other standards.

[0073] Some details are explained in more detail below with reference to the attached drawings. The drawings are schematic and not drawn to scale. The same reference number refers to the same or similar element. [Brief explanation of the drawing]

[0074] [Figure 1] This is a schematic diagram of a chip module. [Figure 2] This is a schematic diagram of the components involved in transmitting profiles to the chip module. [Figure 3] Figure 2 is a schematic diagram of message exchange in the constellation. [Figure 4] This is a schematic diagram of a chip module. [Figure 5] This is a schematic diagram of a device having a communication module and a chip module. [Figure 6] This is a schematic diagram illustrating the process for sending a profile to a chip module and operating the chip module.

[0075] Modes for carrying out the invention Figure 1 shows a chip module 10. The chip module 10 comprises a processor 12 and memory 14. Memory 14 is, for example, non-volatile memory. The processor 12 is configured to execute instructions, in particular instructions stored in memory 14. The chip module 10 also has a communication interface 16. Data can be written to memory 14 via the communication interface 16.

[0076] Figure 2 schematically shows the components involved in sending the profile to the chip module 10. A profile activation unit 40, such as an application or remote access unit that provides services to a user, sends a message to the profile management unit 20. The profile management unit 20 then sends a message to the chip module 10 indicating that a new profile must be created.

[0077] In connection with this message, the profile management unit 20 can send information about the profile type of the profile to be created to the chip module 10. The profile type information can be explicitly received by the profile activation unit 20 from the profile activation unit 40, or the profile management unit 20 can derive the profile type from the type of message exchange between the profile activation unit 40 and the profile management unit 20.

[0078] Furthermore, the profile management unit 20 queries the profile deployment unit 30 for profile data. In this query, the profile management unit 20 can send information to the profile deployment unit 30 that identifies the profile data to be deployed. The profile deployment unit 30 then sends the profile data to the profile management unit 20. The profile data can be protected from unauthorized access by an encryption mechanism.

[0079] The chip module 10 enters receive mode upon receiving a message from the profile management unit 20. After the profile management unit 20 receives profile data from the profile deployment unit 30, the profile management unit 20 can perform specific processing or preparation steps on the profile data. Then, the profile management unit 20 transmits the profile data to the chip module 10.

[0080] The chip module 10 links the profile type received from the profile management unit 20 to the subsequently received profile data, and then forms a profile, which is stored in the profile memory space 50 within the memory 14.

[0081] Figure 3 schematically illustrates the exchange of messages and information between the components shown in Figure 2. The exchange of messages or information is indicated by arrows. The arrows indicate which entity sends the message and which entity receives the message. In the diagram in Figure 3, two branches are shown for different profile types. The sequence for the first profile type (e.g., SGP.22, indicated by the letter A in the reference code) is shown on the left, and the sequence for the second profile type (e.g., SGP.32, indicated by the letter B in the reference code) is shown on the right.

[0082] The transmission and generation of a profile of the first profile type is triggered by the activation module 40A requesting a profile from the first submodule 20A of the profile management unit 20 in message 61A. The first submodule 20A then sends message 62A to the chip module 10. Message 62A contains at least one piece of information about the profile type (in this case, the first profile type, e.g., SGP.22) and instructs the chip module 10 to create the first profile 50A in memory 14 and assign it to the first profile type. The first submodule 20A requests profile data from the profile deployment unit 30 in message 63A. The profile deployment unit 30 sends the profile data to the profile management unit 20, as indicated by the direct message path 64A, and the profile management unit forwards the profile data to the chip module 10. This profile data from message 64A is assigned to the first profile 50A.

[0083] The transmission and generation of the profile for the second profile type is triggered by the remote access unit 40B, which requests the profile from the second submodule 20B of the profile management unit 20 in message 61B. The second submodule 20B then sends message 62B to the chip module 10. Message 62B contains at least one piece of information about the profile type (in this case, the second profile type, e.g., SGP.32) and instructs the chip module 10 to create the second profile 50B in memory 14 and assign it to the second profile type. The second submodule 20B requests the profile data from the profile deployment unit 30 in message 63B. The profile deployment unit 30 sends the profile data to the profile management unit 20, as indicated by the direct message path 64B, and the profile management unit forwards the profile data to the chip module 10. This profile data from message 64B is assigned to the second profile 50B.

[0084] Here, the chip module 10 includes two profiles 50A and 50B of different profile types. The chip module 10 can operate with profiles of different profile types because the profile management unit 20 can handle different profile types accordingly, and each profile is stored in the memory 14 of the chip module 10 so that it contains information about the profile type. Profiles 50A and 50B can be selectively enabled, and the chip module 10 can be operated in the corresponding operating mode.

[0085] Arrows 61A / B, 62A / B, 63A / B, and 64A / B are not necessarily intended to reflect the direct path of message exchange. Rather, these arrows indicate which entity sends the message and which entity receives it. The path the message follows may also differ from the schematic diagram in Figure 3. This allows the profile deployment unit 30 to send profile data to the chip module 10 via different paths.

[0086] In the first modification, profile data is transmitted from the profile deployment unit 30 to the profile management unit 20, which receives the profile data, stores it in a buffer, and prepares it for further transmission to the chip module 10, for example, by another protocol. In the second modification, profile data is transmitted directly from the profile deployment unit 30 to the chip module 10. In the second modification, the functionality of the profile management unit 20 having a first submodule 20A and a second submodule 20B can be implemented on the chip module 10 and, in principle, can perform the same tasks as in the first modification. In the third modification, profile data is transmitted from the profile deployment unit 30 to the profile activation unit 40, from there to the profile management unit 20, and from the profile management unit 20 to the chip module 10. In the fourth modification, profile data is transmitted from the profile deployment unit 30 to the profile activation unit 40, from there to the chip module 10. In some or all of these four modifications, profile data can be transferred between the profile deployment unit 30 and the chip module 10 via an end-to-end encrypted data transmission link.

[0087] Figure 4 shows a chip module 10 having a memory 14 and two internally stored profiles 50A and 50B. Profile 50A schematically represents the contents of the profile. Each profile includes a unique profile number 51, a profile type indication 52, and profile data 53, and the profile can be selected and activated via the profile number 51. The profile type 52 includes a unique and distinct string assigned to the profile type. The chip module uses this string to detect the profile type of the profile.

[0088] Although only two profiles are shown in Figure 4, please understand that the number of profiles stored in memory 14 is limited only by the available memory space within memory 14.

[0089] Figure 5 shows a schematic diagram of a device 100 having a communication module 105. The communication module 105 is assigned a chip module 10, one of the examples described above. The chip module 10 registers the communication module 105 with the communication network and enables it to send and receive data over the communication network.

[0090] The device may be a user's personal device such as a smartphone, or a network device that does not directly interact with the user, such as an IoT device. The IoT device can perform any desired function, sending and receiving values ​​in the process, and then performing actions based on the received values.

[0091] The chip module and method described herein enable changing the operating mode of device 100 by loading a profile having a corresponding profile type onto the chip module 10. For example, the device can operate according to SGP.22 and / or SGP.32, depending on which profile is enabled.

[0092] Figure 6 schematically shows method 200 having steps 201 to 207. This method exhibits the functions described in relation to Figures 1 to 5.

[0093] In step 201, the transmission of profiles 50A and 50B to the chip module 10 is triggered. In step 202, profile type information 52 is transmitted to the chip module 10, and the profile type information 52 is linked to the triggered transmission of profiles 50A and 50B. The profile type information 52 is linked to attributes that specify which entity, such as a remote management unit or application, triggered the transmission of the profiles, and which operating mode corresponds to it.

[0094] In step 203, profile data 53 is requested from the profile deployment unit 30. In step 204, the profile data 53 is sent by the profile deployment unit 30 to the profile management unit 20. In step 205, the profile data 53 is transferred by the profile management unit 20 to the chip module 10. In step 206, the profile data 53 is linked to profile type information 52 to generate profiles 50A and 50B. In step 207, the generated profiles 50A and 50B are stored in the profile memory space 50 of the chip module 10.

[0095] For completeness, note that “comprising” or “having” does not exclude other elements or processes, and “a” or “an” does not exclude plurals. Also note that any feature or process described with reference to any one of the above examples may be used in combination with other features or processes of the other exemplary embodiments described above. Reference numerals in the claims should not be considered limiting. [Explanation of Symbols]

[0096] 10. Chip module (card or electronic component) 12 processors 14 memory 16 Communication Interfaces 20. Profile Management Units (LPA, IPA) 20A First Submodule (LPA) 20B Second Submodule (IPA) 30 Profile Deployment Unit (SM-DP+) 40 Profile Activation Units (End Users, eIM) 40A Activation Module 40B Remote Access Unit 50 Profile Memory Space 50A First Profile 50B Second Profile 51 Profile Number 52 Profile Types 53 Profile Data 61. Request a profile 62. Generating a Profile Space 63 Request for Profile Data 64. Sending profile data 100 devices 105 Communication Module 200 ways 201-207 Steps of the Method

Claims

1. A method (200) for transmitting profiles (50A, 50B) to a chip module (10) and for operating the chip module (10), comprising the following steps: Step (201) triggers the transmission of profiles (50A, 50B) to the chip module (10), A step (202) of transmitting profile type information (52) to the chip module (10), wherein the profile type information (52) is linked to the triggered transmission of the profiles (50A, 50B), The process (203) involves requesting profile data (53) from the profile deployment unit (30), The process (204) involves the profile deployment unit (30) transmitting the profile data (53) to the profile management unit (20), The process (205) involves the profile management unit (20) transferring the profile data (53) to the chip module (10), The process (206) involves linking the profile data (53) to the profile type information (52) in order to generate profiles (50A, 50B), The steps (207) include storing the generated profiles (50A, 50B) in the profile memory space (50) of the chip module (10) and Method (200), including the method (200).

2. The profile type information (52) is configured to indicate a profile type selected from a group containing at least two different profile types. The method according to claim 1 (200).

3. The transmission of the profiles (50A, 50B) to the chip module (10) is triggered via the profile activation unit (40) (201), The profile activation unit (40) is an activation module (40A) or a remote access unit (40B) of the device (100) that includes the chip module (10). The method according to claim 1 or 2 (200).

4. The step (206) of linking the profile data (53) to the profile type information (52) in order to generate profiles (50A, 50B) includes the step of storing the profile data (53) and the profile type information (52) together under a unique profile number (51), The method according to any one of claims 1 to 3 (200).

5. A step of selecting a profile (50A, 50B) from the profile memory space (50) of the chip module (10), A step of operating the chip module (10) according to the selected profile (50A, 50B) and The method according to any one of claims 1 to 4, further comprising (200).

6. A chip module (10) for maintaining multiple selectively enableable profiles (50A, 50B), Processor (12), Memory (14) and, Communication interface (16) and Equipped with, The chip module (10) is configured to receive profile type information (52) and profile data (53) via the communication interface (16). The processor (12) is configured to store the profile type information (52) and the profile data (53) as profiles (50A, 50B) in the memory (14). The memory (14) is configured to include a plurality of profiles (50A, 50B), of which at least two profiles (50A, 50B) differ from each other with respect to their respective profile type information. The chip module (10) is configured to operate in an operating mode according to a profile type, and the chip module (10) can operate with a first profile type in a first operating mode, or with a second profile type in a second operating mode. Chip module (10).

7. The chip module (10) is configured to enable at least two profiles of the first profile type simultaneously in the first operating mode. The chip module (10) according to claim 6.

8. The chip module (10) is configured to manage the profile of the second profile type via a remote access unit (40B). The chip module (10) according to claim 6 or 7.

9. The chip module (10) is configured to deny the remote access unit (40B) access to the profile of the first profile type. The chip module (10) according to claim 8.

10. A device (100) having a communication module (105) and a chip module (10) according to any one of claims 6 to 9, The chip module (10) is assigned to the communication module (105), enabling the communication module (105) to access communication services through at least one profile. The device (100) has a profile management unit (20) configured to receive profile data (53) from a profile deployment unit (30), The profile management unit (20) is configured to receive profile type information (52), The profile management unit (20) is configured to transfer the profile type information (52) and the profile data (53) so that profiles (50A, 50B) are generated and stored in the memory (14) of the chip module (10). Device (100).

11. The profile management unit (20) includes a first submodule (20A) and a second submodule (20B), The first submodule (20A) is configured to process profile type information (52) of the first profile type, The second submodule (20B) is configured to process profile type information (52) of the second profile type. The device (100) according to claim 10.

12. The profile management unit (20) is a functional module implemented within the device (100) or on the chip module (10). The device (100) according to claim 11.

13. Equipped with an activation module (40A), The activation module (40A) is a functional module that runs locally on the device (100) and is configured to receive user input and, based on the input, send a message to the first submodule (20A), thereby triggering the transmission of a profile of the first profile type to the chip card. The device (100) according to claim 11 or 12.

14. The second submodule (20B) is configured to receive a message from the remote access unit (40B), thereby triggering the transmission of a profile of the second profile type to the chip card. The device (100) according to any one of claims 11 to 13.

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