Thermal diffuser

Abstract

The package comprises multiple layers and related methods for manufacturing the same. The layers include an outer layer comprising an outer surface and an inner surface of an outer layer, and an interface layer having an interface surface and an inner surface of an interface layer, wherein the interface surface is in contact with the inner surface of the outer layer. The layers also include a thermal diffusion layer comprising a thermal diffuser surface and an inner surface of a thermal diffuser, wherein the thermal diffuser surface is in contact with the inner surface of the interface layer. The layers include a circuit configuration arranged in close proximity to and facing the inner surface of the thermal diffuser. In some embodiments, the thermal diffusion layer comprises at least one thermally conductive channel that transfers heat along at least one channel, and the heat is transferred to the outer layer via the interface layer.

Description

Technical Field

[0001] The present disclosure is directed to a thermal spreader, and more particularly to a thermal spreader inside a device housing.

Summary of the Invention

[0002] In accordance with the present disclosure, a package and a method for manufacturing the same are provided to improve thermal distribution on the outer surface of an outer layer of the package. The package may include a plurality of layers including an outer layer, an interface layer, a thermal diffusion layer, and a circuit arrangement, each layer arranged to improve thermal distribution of heat generated from the circuit arrangement to the outer layer. The package and the method for manufacturing the same disclosed herein facilitate distributed heat transfer from exothermic electrical components of the circuit arrangement to the outer layer, thereby reducing any non-uniform temperature distribution (hereinafter referred to as hot spots) on the outer surface of the outer layer. The circuit arrangement of the package is disposed facing the inner surface of the thermal diffusion layer, the circuit arrangement also includes at least one exothermic electrical component, and a portion of the thermal diffusion layer is in thermal contact therewith. The thermal diffusion layer is thermally conductive and is disposed throughout the package to allow heat generated from the exothermic electrical component to be transferred along the thermal diffusion layer away from a region of the package where the at least one exothermic electrical component is located. The interface layer of the package is disposed with conductive portions along edges of the package to ensure heat transfer from the thermal diffusion layer to the outer layer. In addition, the interface layer includes a heat insulating portion between (a) a portion of the thermal diffusion layer in thermal contact with the exothermic electrical component and (b) the outer layer, to reduce the risk of hot spot formation. The package and method disclosed herein are provided to improve thermal distribution of heat generated by at least one exothermic electrical component of a circuit arrangement. The improved thermal distribution ensures that the surface temperature of the outer layer remains below the maximum contact temperature limit under safety and regulatory requirements, and any possibility of thermal throttling of the circuit arrangement in the package is reduced or eliminated.

[0003] In some embodiments, a package (e.g., a solid-state storage device package) is provided having a circuit configuration (e.g., a solid-state storage device) facing the inner surface of a thermal diffusion layer. The interface layer includes an inner surface of the interface layer in contact with the outer surface of the thermal diffusion layer, and an outer surface of the interface layer in contact with the inner surface of the outer layer. In some embodiments, the package includes a housing, the housing includes an outer layer, and the outer surface of the outer layer is the outer surface of the package or housing. [Brief explanation of the drawing]

[0004] The following description includes a discussion of the drawings, which have examples given as implementations of embodiments of the embodiments of this disclosure. The drawings should be understood as examples, not limitations. Where used herein, references to one or more “embodiments” should be understood to describe specific features, structures, and / or characteristics contained in at least one implementation. Thus, phrases such as “in one embodiment” or “in an alternative embodiment” appearing herein describe various embodiments and implementations, not all of which refer to the same embodiment. However, they are not necessarily mutually exclusive.

[0005] [Figure 1] An exemplary exploded view of a package having a thermal diffusion layer, according to some embodiments of the present disclosure, is shown.

[0006] [Figure 2] An exemplary cross-sectional view of a package having a thermal diffusion layer, according to some embodiments of the present disclosure, is shown.

[0007] [Figure 3] An exemplary plan view of a package similar to that in Figure 2, according to several embodiments of the present disclosure, is shown.

[0008] [Figure 4] An exemplary exploded view of another implementation of a package having a thermal diffusion layer, according to some embodiments of the present disclosure, is shown.

[0009] [Figure 5] An exemplary diagram of the temperature distribution along the outer layer of a package without a thermal diffusion layer, according to some embodiments of this disclosure, is shown.

[0010] [Figure 6] An exemplary diagram of the temperature distribution along the outer layer of a package having a thermal diffusion layer, according to some embodiments of this disclosure, is shown.

[0011] [Figure 7] A flowchart illustrating exemplary steps for manufacturing a package having a thermal diffusion layer, according to some embodiments of the present disclosure, is shown.

[0012] [Figure 8] A flowchart illustrating exemplary steps for locating the thermal diffusion layer of a package, according to some embodiments of this disclosure, is shown.

[0013] [Figure 9] A flowchart illustrating exemplary steps of a subprocess for arranging the interface layer, as shown in Figure 7, according to some embodiments of this disclosure, is shown. [Modes for carrying out the invention]

[0014] In accordance with this disclosure, a package and a method for manufacturing the same are provided for improved thermal distribution on the outer surface of the outer layer. The package disclosed herein includes an outer layer, including an outer surface and an inner surface. In some embodiments, the outer layer may be part of a housing that seals the layer disclosed herein. The package disclosed herein may be any suitable packaging that puts an electrical component into any preferred form factor. For example, the package may be a housing containing one or more integrated circuits or dies. In some embodiments, the package itself may be an integrated circuit or a encapsulated die. In some embodiments, the outer layer is thermally conductive and acts as a heat sink to dissipate heat generated from the circuit configuration. Any heat generated by the circuit configuration may refer to the thermal output of the heat-generating electrical components of the circuit configuration (e.g., high-performance integrated circuit chips or cores).

[0015] The package includes an interface layer having an interface layer outer surface in contact with the inner surface of the outer layer. In some embodiments, the interface layer includes at least one insulating portion and at least one conductive portion. Each insulating portion is placed in contact with a portion of the thermal diffusion layer that is in thermal contact with the heat-generating electrical components of the circuit configuration. The insulating portion may be any insulating material. The insulating portion is positioned to reduce heat transfer from the heat-generating electrical components to the outer layer by insulating the portion of the thermal diffusion layer that is in thermal contact with the portion of the outer layer where hot spots are typically likely to occur, so as not to be in thermal contact with the portion of the outer layer where hot spots are typically likely to occur. With the insulating portion positioned, heat generated from the heat-generating electrical components is transferred laterally along the thermal diffusion layer toward each of the conductive portions of the interface layer. The conductive portion is thermally conductive and transfers heat away from the heat-generating electrical components from the thermal diffusion layer to the outer layer in a particular region. In some embodiments, to improve the thermal distribution across the entire outer surface of the outer layer, the conductive portion is positioned within the interface layer along the edge of the package. This improved thermal distribution of heat to different parts of the outer layer reduces the risk of hot spots forming on the outer surface of the outer layer.

[0016] The thermal diffusion layer of the package is arranged such that the outer surface of the thermal diffuser is in contact with the inner surface of the interface layer. The thermal diffusion layer may be divided into three types of features: thermal conductive plates, thermal conductive channels, and heat collection sections. Each thermal conductive plate is positioned in thermal contact with the heat-generating electrical components of the respective circuit configuration and is insulated from the inner surface of the outer layer by the insulating portion of the interface layer. Each channel of the thermal diffusion layer is in thermal contact with at least one of the thermal conductive plates and at least one heat collection section, transferring heat from the conductive plates to the heat collection sections along the channel. In some embodiments, each respective channel is positioned around the electrical components of the circuit configuration to prevent heat transfer from the respective channel to the electrical components of the circuit configuration, which can reduce or eliminate the amount of thermal throttling of the electrical components. In some embodiments, the heat collection sections of the thermal diffusion layer are positioned along the edges of the package so that heat is transferred away from the heat-generating electrical elements, with at least one channel transferring heat to each heat collection section. The heat collection sections make thermal contact with the conductive portion of the interface layer, transferring heat from each heat collection section to the inner surface of the outer layer.

[0017] The circuit configuration is positioned facing the inner surface of the thermal diffusor, and the circuit configuration includes electrical components, at least one of which is a heat-generating electrical component. The heat-generating electrical component may be any suitable high-performance electrical component (e.g., an integrated circuit device such as an application-specific integrated circuit (ASIC) device). In some embodiments, the circuit configuration includes a printed circuit board (PCB), which may include multiple dielectric layers on which the electrical components may be mounted. In some embodiments, the TIM may be positioned between each heat-generating electrical component and each thermal conductive plate of the thermal diffusor layer.

[0018] In some embodiments, the package includes a plurality of interface layers and a plurality of thermal diffusion layers. For example, the package may include a second interface layer and a second thermal diffusion layer. In such an example, the second interface layer and the second thermal diffusion layer are positioned between the first thermal diffusion layer (hereinafter referred to as the thermal diffusion layer) and the circuit configuration. Similar to the first interface layer, the second interface layer includes the outer surface of the second interface layer, which is positioned in contact with the inner surface of the first thermal diffusion layer. The second thermal diffusion layer includes the outer surface of the second thermal diffuser and the inner surface of the second thermal diffuser. The outer surface of the second thermal diffuser is positioned in contact with the inner surface of the second interface layer, and the circuit configuration is positioned close to and facing the inner surface of the second thermal diffuser. In some embodiments, there are more than two interface layers and more than two thermal diffusion layers. In such embodiments, each interface layer is not positioned in contact with another interface layer, and each thermal diffusion layer is not positioned in contact with another thermal diffusion layer.

[0019] For the purposes of brevity and clarity, the features of the disclosure described herein are those in the context of a package having an outer layer, interface layer, thermal diffusion layer, and circuit configuration. However, the principles of the disclosure may be applied to any other suitable context in which a housing for a circuit configuration is used.

[0020] In particular, this disclosure provides a package and a method for manufacturing the same, the package having improved thermal distribution and reducing the risk of hot spots on the outer surface of the outer layer. The provided package and method for manufacturing the same include a thermal diffusion layer and an interface layer arranged to reduce or eliminate non-uniform thermal distribution on the outer layer of the package. This also ensures that the surface temperature of the outer layer remains below the contact temperature limits in safety and regulatory requirements, and reduces or eliminates any possibility of thermal throttling of the circuit configuration in the package.

[0021] In some embodiments, the circuitry of the package may comprise any suitable processing circuitry, which may comprise any suitable processing chip (e.g., an application-specific integrated circuit (ASIC) chip) or processing core.

[0022] In some embodiments, the packages and methods for manufacturing packages of the present disclosure may include circuitry that functions as a storage device system (e.g., an SSD storage system), which includes a storage device such as a solid-state drive device.

[0023] An SSD is a data storage device that uses an integrated circuit assembly as memory to persistently store data. SSDs have no moving mechanical components, and this characteristic distinguishes SSDs from conventional electromechanical magnetic disks such as hard disk drives (HDDs) or floppy disks that include rotating disks and moving read / write heads. Compared with electromechanical disks, SSDs are typically more resistant to physical shock, operate more quietly, have shorter access times and lower latency.

[0024] Many types of SSDs retain data without power and use NAND-based flash memory, which includes types of non-volatile storage technology. The quality of service (QoS) of an SSD may relate to predictable low latency and consistent high input / output operations per second (IOPS) when processing read / write input / output (I / O) workloads. This means that the latency or completion time of I / O commands must fall within a specified range without unexpected outliers. Throughput or I / O speed may sometimes need to be tightly controlled without causing sharp drops in performance levels.

[0025] The subject matter of this disclosure can be better understood by referring to Figures 1 to 9.

[0026] Figure 1 shows an exemplary exploded view of a package 100 having a thermal diffusion layer 108 according to some embodiments of the present disclosure. The package 100 includes an outer layer 102, a thermal diffusion layer 108, and an interface layer 105 having at least one insulating portion 104 and at least one conductive portion 106. The outer layer 102 defines an outer and inner surface of the outer layer. The interface layer 105 may be defined by an inner surface of the interface layer and an outer surface of the interface layer in contact with the inner surface of the outer layer 102. The thermal diffusion layer 108 may define an inner surface of the thermal diffuser and an outer surface of the thermal layer in contact with the inner surface of the interface layer 105. The package 100 also includes a circuit configuration (not shown) which is located in close proximity to and facing the inner surface of the thermal diffuser of the thermal diffusion layer 108.

[0027] In some embodiments, the circuit configuration includes at least one electrical component, each of which may generate heat during operation. The heat diffusion layer 108 is arranged to be in thermal contact with the heat-generating electrical component so that heat is transferred away from the heat-generating electrical component along the heat diffusion layer 108. In some embodiments, a thermal interface material (TIM) is placed between the heat-generating electrical component of the circuit configuration and the inner surface of the heat diffuser of the heat diffusion layer 108.

[0028] Each of the thermal diffusion layer 108 and the outer layer 102 is thermally conductive. To reduce the risk of hot spots in the outer layer 102, the thermal diffusion layer 108 is thermally conductive and facilitates heat transfer, allowing heat generated from at least one electrical component during operation to move away from at least one heat-generating electrical component. The outer layer 102 is thermally conductive to dissipate heat generated from at least one electrical component during operation. The interface layer 105 is positioned between the outer layer 102 and the thermal diffusion layer 108 to facilitate heat transfer, thereby reducing the risk of hot spots in the outer layer 102.

[0029] The thermal insulation portion 104 of the interface layer 105 is positioned between the heat diffusion layer 108 and the outer layer 102, with each thermal insulation portion 104 positioned in thermal contact with a portion of the heat diffusion layer 108 that is in thermal contact with one of the at least one heat-generating electrical components. The thermal insulation portion 104 may be any thermal insulation material (e.g., an air pocket). The thermal insulation portion 104 is positioned to reduce direct heat transfer from each heat-generating electrical component by insulating the heat diffusion layer 108 so that it does not come into thermal contact with portions of the outer layer 102 where hot spots are typically likely to occur. With the thermal insulation portion 104 positioned, heat generated from at least one heat-generating electrical component can be transferred laterally along the heat diffusion layer 108 toward each of the at least one conductive portion 106 of the interface layer 105. The conductive portions 106 of the interface layer 105 are positioned coplane and laterally with respect to the thermal insulation portion 104. The conductive portion 106 is thermally conductive, and in some embodiments, each of the conductive portions 106 is a thermal interface material (TIM) that can provide heat transfer from the thermal diffusion layer 108 to the outer layer 102. In some embodiments, the interface layer 105 omits the conductive portions 106 and relies on thermal radiation through an air pocket positioned between the thermal diffusion layer 108 and the outer layer 102. The conductive portions 106 are positioned within the interface layer 105 along the edge of the package 100 so that heat generated from at least one heat-generating electrical component is transferred away from the area of ​​the package adjacent to the heat-generating electrical component. This allows for heat distribution to different parts of the outer layer 102, reducing the risk of hot spots forming on the outer layer 102.

[0030] While package 100 illustrates one embodiment in which the circuit configuration is sealed by an outer layer and other layers in accordance with this disclosure, it will be understood that any other suitable thermally conductive housing may be implemented. Additionally, package 100 illustrates one embodiment in which one interface layer 105 and one thermal diffusion layer 108 are present, but package 100 may include more than one interface layer 105 and more than one thermal diffusion layer 108 such that the number of interface layers 105 disposed within package 100 is the same as the number of thermal diffusion layers 108 within package 100.

[0031] For the purposes of clarity and brevity, and not as an limitation, this disclosure is provided in the context of package 100 and its manufacture, which provides the features and functions disclosed herein. Package 100 may be implemented, at least in part, for example, together with a server device or a storage device.

[0032] Figure 2 shows an exemplary cross-sectional view of a package 200 having a thermal diffusion layer 108 according to some embodiments of the present disclosure. The package 200 includes a printed circuit board (PCB) 202 and a circuit configuration 204. In some embodiments, the PCB 202 may be referred to as part of the circuit configuration 204. The circuit configuration 204 includes at least one electrical component, the at least one of which is a heat-generating electrical component. The circuit configuration 204 is arranged such that at least one heat-generating component is in thermal contact with the inner surface of the thermal diffusion layer 108. In some embodiments, a thermal interface material (TIM) 206 may be disposed between the thermal diffusion layer 108 and each of the at least one heat-generating electrical component of the circuit configuration 204. In some embodiments, the TIM 206 may be any suitable thermal conductive material that facilitates heat transfer from at least one heat-generating electrical component of the circuit configuration 204 to the thermal diffusion layer 108.

[0033] The outer surface of the thermal diffusion layer 108 is in contact with the inner surface of the interface layer 105. As discussed above, the interface layer 105 includes at least one insulating portion 104 disposed on top of at least one heat-generating electrical component of the circuit configuration 204, in contact with the outer surface of the thermal diffusion layer. The interface layer 105 also includes at least one conductive portion, which is coplane and lateral to the at least one insulating portion 104. The conductive portion 106 is disposed along the edge of the package 200, away from the region adjacent to the at least one heat-generating electrical component. In some embodiments, the conductive portion 106 is any suitable thermally conductive material (e.g., thermal interface material (TIM)) that can provide thermal transfer from the thermal diffusion layer 108 to the outer layer 102.

[0034] The outer surface of the interface layer 105 may be in contact with the inner surface of the outer layer 102. The outer layer 102 is made of a thermally conductive material (e.g., aluminum) and functions as a heat sink for the heat generated by the circuit configuration 204. The outer layer 102 is positioned so that heat is dissipated from its outer surface.

[0035] Figure 3 shows an exemplary plan view of a package 300 similar to the package 200 of Figure 2, according to some embodiments of the present disclosure. The package 300 includes an outer layer 102 having an outer outer surface and an inner outer surface. The outer layer 102 of the package 300 is thermally conductive to dissipate heat generated from the circuit configuration 204, specifically from any heat-generating electrical components. In some embodiments, the outer layer 102 may be part of a housing that seals the layers disclosed herein (e.g., interface layer 105, heat diffusion layer 108, and circuit configuration 204).

[0036] The interface layer is arranged such that its outer surface is in contact with the inner surface of the outer layer. The interface layer includes at least one thermal insulation portion 104 and at least one conductive portion 106. Each thermal insulation portion is arranged in contact with a conductive plate 306 of the thermal diffusion layer, which is in thermal contact with one of the heat-generating electrical components of the circuit configuration 204. The arranged thermal insulation portions facilitate the thermal transfer of heat generated from one heat-generating electrical component toward each heat-collecting section 304 of the thermal diffusion layer, laterally along at least one thermally conductive channel 302. The conductive portions 106 of the interface layer are arranged coplane and laterally with respect to the thermal insulation portion 104. Each conductive portion 106 is thermally conductive, and in some embodiments, each of the conductive portions 106 may be a TIM, providing heat transfer from the heat-collecting section 304 to the outer layer 102. The conductive portion 106 is positioned within the interface layer along the edge of the package 300 so that heat generated from the heat-generating electrical component is transferred away from the area of ​​the package 300 adjacent to the heat-generating electrical component. This allows the heat to be ultimately distributed to different parts of the outer layer 102, reducing the risk of hot spots forming on the outer surface of the outer layer.

[0037] The thermal diffusion layer is arranged such that its outer surface is in contact with the inner surface of the interface layer. The thermal diffusion layer includes at least one thermal conductive plate 306, at least one thermal conductive channel 302, and at least one heat collection section 304. Each of the thermal conductive plates 306 is positioned in thermal contact with the heat-generating electrical components of the circuit configuration 204 and is insulated from the inner surface of the outer layer by the insulating portion 104 of the interface layer. Each channel 302 is positioned in thermal contact with at least one of the thermal conductive plates 306 and at least one heat collection section 304, and transfers heat from the conductive plates 306 to the heat collection section 304 along the channel 302. The layout of each channel 302 is arranged to prevent thermal transfer from each channel 302 to any of the at least one electrical components of the circuit configuration 204, thereby avoiding thermal throttling of the electrical components. Each heat collection section 304 of the heat diffusion layer is positioned along the edge of the package 300, and at least one channel 302 transfers heat to the heat collection section 304. Each of the heat collection sections 304 is in thermal contact with a conductive portion 106 of the interface layer, which enables heat transfer from the heat collection section 304 to the outer layer 102.

[0038] Figure 4 shows an exemplary exploded view of another implementation of package 400 having a thermal diffusion layer 108, similar to package 100 in Figure 1. This implementation of package 400 includes a thermal diffusion layer 108 arranged with at least one conductive plate 306, at least one heat collection section, and heat tubes 402 that provide thermal transfer from each conductive plate 306 to each heat collection section 304. The heat tubes 402 may be arranged in any suitable package (e.g., package 400) and may replace at least one channel as seen in Figures 1-3. Each of the heat tubes 402 is arranged in the thermal diffusion layer and reduces thermal transfer from each heat tube 402 to any of the electrical components of the circuit configuration to avoid thermal throttling of the electrical components.

[0039] Similar to package 100 in Figure 1, package 400 includes an outer layer 102, a thermal diffusion layer 108, and an interface layer 105 having at least one insulating portion 104 and at least one conductive portion 106. Package 400 also includes a circuit configuration (not shown) which is positioned in close proximity to and facing the inner thermal diffusion surface of the thermal diffusion layer 108.

[0040] The thermal insulation portions 104 of the interface layer 105 are positioned between the heat diffusion layer 108 and the outer layer 102, with each thermal insulation portion 104 positioned in contact with its respective conductive plate 306. With the thermal insulation portions 104 positioned, heat generated from at least one heat-generating electrical component can be transferred laterally along the heat tubes 402 toward each of the heat-collecting sections 304 that are in thermal contact with each conductive portion 106 of the interface layer 105. The conductive portions 106 of the interface layer 105 are positioned coplane and laterally with respect to the thermal insulation portions 104. The conductive portions 106 are thermally conductive, and in some embodiments, each of the conductive portions 106 is a thermal interface material (TIM) that can provide heat transfer from the heat-collecting section 304 to the outer layer 102.

[0041] Figure 5 shows an exemplary diagram of the temperature distribution along the outer layer 102 of a package 500 without a thermal diffusion layer, according to some embodiments of the present disclosure. A first region 502 of the package 500 includes a hot spot where the surface temperature of the outer layer 102 is 75.4°C, while a second region 504 has a surface temperature of 58.0°C. This difference in surface temperatures between the first region 502 and the second region 504 indicates that the thermal distribution of heat generated within the package 500 is poor. The hot spot in the first region 502 may indicate a region where a heat source is generating heat within the package.

[0042] Figure 6 shows an exemplary diagram of the temperature distribution along the outer layer 102 of a package 600 having a thermal diffusion layer, according to some embodiments of the present disclosure. The outer temperatures of the first region 602 and the second region 604 are 65°C, respectively, which represents an improved thermal distribution along the outer layer 102 compared to the thermal distribution of package 500.

[0043] Figure 7 shows a flowchart of exemplary steps for a process 700 for manufacturing a package having a thermal diffusion layer, according to some embodiments of the present disclosure. In some embodiments, the outer layer, interface layer, thermal diffusion layer, circuit configuration, thermal insulation section, conductive section, thermal conductive plate, thermal conductive channel, and heat collection section mentioned may be implemented as the outer layer 102, interface layer 105, thermal diffusion layer 108, circuit configuration 204, thermal insulation section 104, conductive section 106, thermal conductive plate 306, thermal conductive channel 302, and heat collection section 304, respectively. In some embodiments, the process 700 can be modified, for example, by rearranging, changing, adding, and / or deleting steps.

[0044] In step 702, an outer layer is positioned, which includes an outer and inner surface. The outer layer of the package is thermally conductive to dissipate heat generated from the circuit configuration, specifically from any heat-generating electrical components. In some embodiments, the outer layer may be part of the housing of a enclosure that seals the layers disclosed herein.

[0045] In step 704, the interface layer is positioned such that the outer surface of the interface layer is in contact with the inner surface of the outer layer. The interface layer includes at least one insulating portion and at least one conductive portion. Each insulating portion is positioned in contact with a portion of the thermal diffusion layer that is in thermal contact with one of the at least one heat-generating electrical components of the circuit configuration. The insulating portion may be any insulating material. The insulating portion is positioned to reduce direct heat transfer from each heat-generating electrical component by insulating the thermal diffusion layer so that it is not in thermal contact with portions of the outer layer where hot spots are typically likely to occur. With the insulating portion positioned, heat generated from at least one heat-generating electrical component can be transferred laterally along the thermal diffusion layer toward each of the at least one conductive portion of the interface layer. The conductive portions are positioned coplane and laterally with respect to the insulating portion. Each conductive portion is thermally conductive, and in some embodiments, each conductive portion is a TIM that can provide heat transfer from the thermal diffusion layer to the outer layer. The conduction section is positioned within the interface layer along the edge of the package to transfer heat generated from at least one heat-generating electrical component away from the area of ​​the package adjacent to the heat-generating electrical component. This allows for heat distribution to different parts of the outer layer, reducing the risk of hot spots forming in the outer layer.

[0046] In step 706, the thermal diffusion layer is positioned such that the outer surface of the thermal diffuser is in contact with the inner surface of the interface layer. The positioned thermal diffusion layer includes at least one thermal conductive plate, at least one thermal conductive channel, and at least one heat collection section. Each of the thermal conductive plates is positioned in thermal contact with the heat-generating electrical components of the circuit configuration and is insulated from the inner surface of the outer layer by the insulating portion of the interface layer. Each channel of the thermal diffusion layer is in thermal contact with at least one of the thermal conductive plates and at least one heat collection section, transferring heat from the conductive plates to the heat collection section along the channel. Each respective channel is positioned within the thermal diffusion layer and prevents heat transfer from each channel to any of the at least one electrical components of the circuit configuration, thereby avoiding thermal throttling of the electrical components. Each heat collection section of the thermal diffusion layer is positioned along the edge of the package, and at least one channel transfers heat to each heat collection section. Each heat collection section is in thermal contact with the conductive portion of the interface layer, which enables heat transfer from the heat collection section to the outer layer.

[0047] In step 708, the circuit configuration is positioned so as to be in close proximity to and facing the inner surface of the thermal diffusor. The positioned circuit configuration includes at least one electrical component, at least one of which is a heat-generating electrical component. The heat-generating electrical component may be any suitable high-performance electrical component (e.g., an integrated circuit device such as an application-specific integrated circuit (ASIC) device). The circuit configuration includes a printed circuit board (PCB), which may include multiple dielectric layers on which at least one electrical component may be mounted. In some embodiments, the TIM may be positioned between each heat-generating electrical component and each thermal conductive plate of the thermal diffusor layer. In some embodiments, the layout design for the thermal conductive channels of the thermal diffusor layer is determined by the electrical components of the positioned circuit configuration. At least one channel is positioned to reduce the amount of heat transfer from each channel to any of the at least one electrical component of the circuit configuration.

[0048] In some embodiments, process 700 may include additional steps of arranging a plurality of interface layers and a plurality of thermal diffusion layers. For example, a second interface layer and a second thermal diffusion layer are arranged between a first thermal diffusion layer (hereinafter referred to as the thermal diffusion layer) and a circuit configuration. The outer surface of the second interface layer is arranged in contact with the inner surface of the first thermal diffusion layer. Additionally, the outer surface of the second thermal diffusion layer is arranged in contact with the inner surface of the second interface layer. The circuit configuration is then arranged in close proximity to and facing the inner surface of the second thermal diffusion layer. In some embodiments, there are more than two interface layers and more than two thermal diffusion layers. In such embodiments, each interface layer is not arranged in contact with another interface layer, and each thermal diffusion layer is not arranged in contact with another thermal diffusion layer.

[0049] Figure 8 shows a flowchart of exemplary steps for a process 800 for arranging a thermal diffusion layer of a package, according to some embodiments of the present disclosure. In some embodiments, the outer layer, interface layer, thermal diffusion layer, circuit configuration, thermal insulation section, conductive section, thermal conductive plate, thermal conductive channel, and heat collection section mentioned may be implemented as the outer layer 102, interface layer 105, thermal diffusion layer 108, circuit configuration 204, thermal insulation section 104, conductive section 106, thermal conductive plate 306, thermal conductive channel 302, and heat collection section 304, respectively. In some embodiments, the process 800 can be modified, for example, by rearranging, changing, adding, and / or deleting steps.

[0050] In step 802, at least one thermally conductive channel is positioned to transfer heat along at least one channel. The channel is positioned to facilitate distributed heat transfer throughout the package, thereby reducing or eliminating the risk of hot spots occurring on the outer surface of the outer layer.

[0051] In step 804, at least one electrical component is positioned such that thermal transfer from at least one channel to at least one electrical component is prevented, and at least one channel is not positioned on top of it. The electrical component is part of the circuit configuration of the package. In some embodiments, the circuit configuration includes a PCB, which may include multiple dielectric layers on which at least one electrical component may be mounted. In some embodiments, channels in the thermal diffusion layer are positioned around the electrical components of the circuit configuration to reduce the amount of thermal transfer from each channel to any of the at least one electrical component of the circuit configuration.

[0052] In step 806, at least one thermal conductive plate is arranged in thermal contact with at least one thermal conductive channel, with each thermal conductive plate positioned above its respective heat-generating electrical component. In some embodiments, the TIM is positioned between each heat-generating electrical component and each conductive plate to ensure thermal contact and heat transfer from each heat-generating electrical component and each conductive plate. The heat transferred from the heat-generating electrical component continues along the at least one thermal conductive channel in thermal contact with the conductive plate.

[0053] In step 808, at least one heat collection section is arranged in thermal contact with at least one thermally conductive plate, each heat collection section being positioned close to the edge of the package. Each heat collection section is in thermal contact with at least one conductive plate via at least one thermally conductive channel. Heat transferred from the conductive plate along each channel continues to each heat collection section, which is in thermal contact with the conductive portion of the interface layer. In addition, each heat collection section of the thermal diffusion layer is positioned along the edge of the package, providing an improved thermal distribution to the outer layer.

[0054] Figure 9 shows a flowchart of exemplary steps of a subprocess 900 for arranging the interface layer as shown in step 704 of Figure 7, according to some embodiments of the present disclosure. In some embodiments, the outer layer, interface layer, thermal diffusion layer, circuit configuration, thermal insulation section, conductive section, thermal conductive plate, thermal conductive channel, and heat collection section mentioned may be implemented as the outer layer 102, interface layer 105, thermal diffusion layer 108, circuit configuration 204, thermal insulation section 104, conductive section 106, thermal conductive plate 306, thermal conductive channel 302, and heat collection section 304, respectively. In some embodiments, the subprocess 900 can be modified, for example, by rearranging, changing, adding, and / or deleting steps.

[0055] In step 902, at least one insulating section is provided, each insulating section positioned between each respective thermal conductive plate and the inner surface of the outer layer. Each insulating section is made of any suitable insulating material, including but not limited to insulating forms, air pockets, or channels for flowing air. The insulating section is positioned to obstruct heat transfer from the conductive plates and is located directly in the outer layer in thermal contact with each respective heat-generating electrical component. This arrangement of the insulating section facilitates heat transfer from each respective conductive plate along any channels in thermal contact with each respective conductive plate. Lateral heat transfer through channels in the heat diffusion layer continues to at least one heat collection section.

[0056] In step 904, at least one conductive portion is positioned co-plane with the insulating portion, with each conductive portion positioned between each heat collection section and the inner surface of the outer layer. In some embodiments, one or more conductive portions of the interface layer may be omitted. In such embodiments, an air pocket may be positioned between the heat diffusion layer and the outer layer, and heat is transferred from the heat diffusion layer to the outer layer by thermal radiation through the air pocket. Each conductive portion of the interface layer is made of any suitable thermally conductive material, including but not limited to TIM. The conductive portions are positioned to allow direct thermal transfer from the heat collection sections to the outer layer. Each heat collection section is a portion of the heat diffusion layer that receives heat from a heat-generating electrical component via conductive plates and channels. In some embodiments, each heat collection section is positioned along the edge of the package, away from areas adjacent to at least one heat-generating electrical component. This arrangement ensures improved thermal distribution throughout the package to reduce the risk of hot spots occurring on the outer surface of the outer layer.

[0057] Unless otherwise explicitly stated, the terms “an embodiment,” “embodiment,” “embodiments,” “the embodiment,” “the embodiments,” “one or more embodiments,” “some embodiments,” and “one embodiment” mean “one or more (but not all) embodiments.”

[0058] Unless otherwise explicitly stated, the terms “including,” “comprising,” and “having,” and their variations, mean “including, but not limited to.”

[0059] Unless otherwise explicitly stated, the list of enumerated items does not imply that any or all of the items are mutually exclusive.

[0060] Unless otherwise explicitly stated, the terms “a,” “an,” and “the” mean “one or more.”

[0061] Unless otherwise explicitly stated, multiple devices communicating with each other do not need to communicate with each other continuously. In addition, multiple devices communicating with each other may communicate directly or indirectly through one or more intermediate media.

[0062] A description of an embodiment having multiple components communicating with one another does not imply that all such components are required. On the contrary, various optional components are described to illustrate a wide variety of conceivable embodiments. Furthermore, process stages, method stages, algorithms, or the like may be described in a sequential order, but such processes, methods, and algorithms may be configured to function in an alternative order. In other words, any order or sequence of stages that may be described does not necessarily imply that these stages must be performed in that order. The stages of the processes described herein may be performed in any practical order. Furthermore, several stages may be performed simultaneously.

[0063] Where a single device or article is described herein, it will be readily apparent that more than one device / article may be used instead of a single device / article (whether they work together or not). Similarly, where more than one device or article is described herein (whether they work together or not), it will be readily apparent that a single device / article may be used instead of more than one device or article, or that a different number of devices / articles may be used instead of the number of devices or programs shown. The functions and / or features of a device may be embodied by one or more other devices not expressly described as having such functions / features. Therefore, other embodiments do not necessarily have to include the device itself.

[0064] At least certain operations, which may be illustrated in the figures, represent specific events occurring in a particular order. In alternative embodiments, certain operations may be performed, modified, or omitted in a different order. Furthermore, steps may be added to the logic described above and still conform to the embodiments described. Moreover, the operations described herein may be performed sequentially, or certain operations may be processed in parallel. Furthermore, operations may be performed by a single processing unit or by distributed processing units.

[0065] The above description of various embodiments is presented for illustrative and explanatory purposes only. It is not intended to be exhaustive or to limit the invention to the exact forms disclosed. In light of the above teachings, many modifications and variations are possible.

Claims

1. A package comprising multiple layers, wherein the layers are Outer layer including the outer surface and inner surface of the outer layer; An interface layer including the outer surface and inner surface of the interface layer, wherein the outer surface of the interface layer is in contact with the inner surface of the outer layer; A thermal diffusion layer including the outer surface and inner surface of a thermal diffuser, wherein the outer surface of the thermal diffuser is in contact with the inner surface of the interface layer; and Circuit configurations arranged in close proximity to and facing the inner surface of the heat diffuser Having, package.

2. The package according to claim 1, wherein each of the outer layer and the heat diffusion layer is made of a thermally conductive material.

3. The package according to claim 1, wherein the thermal diffusion layer further includes at least one thermally conductive channel for transferring heat along the at least one thermally conductive channel.

4. The package according to claim 3, wherein the circuit configuration includes at least one electrical component, on which the at least one thermally conductive channel is not located, thereby preventing thermal transfer from the at least one thermally conductive channel to the at least one electrical component.

5. The package according to claim 1, wherein the thermal diffusion layer further comprises at least one thermally conductive plate in thermal contact with at least one thermally conductive channel, each thermally conductive plate being positioned on top of its respective heat-generating electrical component.

6. The aforementioned interface layer is At least one insulating section, each insulating section is positioned between each thermally conductive plate and the inner surface of the outer layer; and At least one conductive portion is co-surfaced with the thermal insulation portion, each conductive portion being positioned between each heat collection section and the inner surface of the outer layer; Further including, The package according to claim 5.

7. The aforementioned heat diffusion layer is At least one heat-conducting plate; and At least one heat collection section; here Each heat collection section is in thermal contact with at least one heat-conducting plate, and each heat collection section is positioned close to the edge of the package. Further including, The package according to claim 1.

8. The package according to claim 7, further comprising at least one thermally conductive channel, each of which is in thermal contact with at least one thermally conductive plate and at least one heat collecting section.

9. The package according to claim 1, further comprising a thermal interface material (TIM) disposed between the circuit configuration and the inner surface of the thermal diffuser.

10. The package according to claim 1, wherein the circuit configuration includes a printed circuit board (PCB).

11. The package according to claim 1, further comprising a housing that seals the plurality of layers, the housing having the outer layer.

12. The package according to claim 1, wherein the temperature of the outer layer remains below the upper limit of contact temperature for safety and regulations.

13. A second interface layer including the outer surface and inner surface of the second interface layer, the outer surface of the second interface layer being in contact with the inner surface of the heat diffuser; and A second heat diffusion layer including the outer surface and inner surface of the second heat diffuser, wherein the outer surface of the second heat diffuser is in contact with the inner surface of the second interface layer, and the circuit configuration is in close proximity to and facing the inner surface of the second heat diffuser. The package according to claim 1, further comprising:

14. In the step of arranging the outer layer, the outer layer includes the outer surface and the inner surface of the outer layer; A step of positioning the interface layer such that the outer surface of the interface layer is in contact with the inner surface of the outer layer; The step of arranging the thermal diffusion layer such that the outer surface of the thermal diffusion material is in contact with the inner surface of the interface layer; and The step of arranging the circuit configuration so that it is in close proximity to and facing the inner surface of the heat diffuser. A method for manufacturing a package that includes the following features.

15. The method according to claim 14 for manufacturing a package, wherein each of the outer layer and the heat diffusion layer is made of a thermally conductive material.

16. The method according to claim 14 for manufacturing a package, wherein the step of arranging the heat diffusion layer comprises arranging the at least one heat conductive channel to transfer heat along the at least one heat conductive channel.

17. The method for manufacturing a package according to claim 16, wherein the step of arranging the circuit configuration includes arranging at least one electrical component so as to prevent thermal transfer from the at least one thermal conductive channel to the at least one electrical component, and the at least one thermal conductive channel is not arranged above it.

18. The method of manufacturing a package according to claim 14, wherein the step of arranging the heat diffusion layer is the step of arranging at least one heat conductive plate that is in thermal contact with at least one heat conductive channel, each heat conductive plate being arranged on top of each heat-generating electrical component.

19. The step of arranging the interface layer is, In the step of arranging at least one insulating section, each insulating section is positioned between each thermally conductive plate and the inner surface of the outer layer; and In the step of arranging at least one conductive portion co-plane with the thermal insulation portion, each conductive portion is positioned between each heat collection section and the inner surface of the outer layer; Having, The method according to claim 18 for manufacturing a package.

20. The step of arranging the heat diffusion layer is: The step of placing at least one heat-conducting plate; and In the step of arranging at least one heat-collecting section that is in thermal contact with at least one heat-conducting plate, each heat-collecting section is positioned close to the edge of the package. Having, The method according to claim 14 for manufacturing a package.

21. The method of manufacturing a package according to claim 20, further comprising the step of arranging at least one thermally conductive channel, wherein each channel is arranged in thermal contact with at least one thermally conductive plate and at least one heat collecting section.

22. The method according to claim 14 for manufacturing a package, further comprising the step of installing a thermal interface material (TIM) between the circuit configuration and the inner surface of the thermal diffuser.

23. The step of arranging the printed circuit board (PCB) layers, and Steps to mount the circuit configuration on the PCB layer. The method according to claim 14 for manufacturing a package, further comprising:

24. The method for manufacturing a package according to claim 14, further comprising the step of encapsulating the package in a housing, wherein the housing has the outer layer.

25. The step of positioning the second interface layer such that the outer surface of the second interface layer is in contact with the inner surface of the heat diffuser; and The outer surface of the second heat diffuser is in contact with the inner surface of the second interface layer, and the circuit configuration is a step in which the second heat diffuser layer is positioned in close proximity to and facing the inner surface of the second heat diffuser. The method according to claim 14 for manufacturing a package, further comprising:

26. Housing, where the housing seals multiple layers, the multiple layers are Outer layer including the outer surface and inner surface of the outer layer; An interface layer including the outer surface and inner surface of the interface layer, wherein the outer surface of the interface layer is in contact with the inner surface of the outer layer; A thermal diffusion layer including the outer surface and inner surface of a thermal diffuser, wherein the outer surface of the thermal diffuser is in contact with the inner surface of the interface layer; and Circuit configurations arranged in close proximity to and facing the inner surface of the heat diffuser has A housing equipped with the following features.

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