Parallel fluid heat sink

Abstract

A fluid-cooled parallel heat sink comprising a fluid inlet and a fluid outlet, and a cooling chamber coupled by a lid and tabs. The fluid-cooled parallel heat sink further comprises an intermediate component and a plurality of fins located within the cooling chamber. The intermediate component at least partially separates the cooling chamber into an inlet chamber, a fin chamber in which a plurality of fins are arranged, and an outlet chamber. The tabs may include an inlet cavity and an outlet cavity, the cavities being molded to generate a uniform flow rate across the plurality of fins.

Description

Technical Field

[0001] Cross-Reference to Related Applications This application claims the benefit of U.S. Provisional Application No. 63 / 533,870, filed on August 21, 2023, the entire disclosure of which is incorporated herein by reference in its entirety.

[0002] The present disclosure relates to heat sinks used for dissipating heat from components. Specifically, the present disclosure relates to parallel fluid heat sinks used for cooling semiconductor components. Background Art

[0003] In the context of heat sinks, there is a need for better heat dissipation, and specifically for more uniform heat dissipation from a plurality of semiconductor components. Conventional fluid-cooled heat sinks are sometimes referred to as series heat sinks, where fluid flows in a uniform direction through the heat sink such that some semiconductor components are exposed to heated fluid from other upstream semiconductor components. However, conventional heat sinks fail to provide uniform flow or uniform cooling, which results in system inefficiency and increased cost. Summary of the Invention

[0004] The apparatus, systems, and methods disclosed herein have several features, no single one of which is solely responsible for their desirable attributes. Without limiting the scope as represented by the following claims, the more prominent features will be briefly described herein. After considering this description, and particularly after reading the section entitled "Detailed Description of Embodiments", you will understand how the features of one or more embodiments of the system and method provide several advantages over conventional systems and methods.

[0005] In some embodiments, the technology described herein relates to a fluid-cooled parallel heat sink comprising an inlet, an outlet, a lid including mounting positions for a plurality of components, a tab connected to the lid such that the tab and the lid structurally form a cooling chamber, an intermediate member disposed within the cooling chamber, and a plurality of fins disposed within the cooling chamber, wherein the intermediate member at least partially separates the cooling chamber into an inlet chamber, a fin chamber in which the plurality of fins are disposed, and an outlet chamber, and a fluid flow path flows from the inlet into the inlet chamber, into the fin chamber, into the outlet chamber, and out from the outlet.

[0006] In some embodiments, the technology described herein relates to a fluid-cooled parallel heat sink in which a plurality of fins are located between a lid and an intermediate member.

[0007] In some embodiments, the technology described herein relates to a fluid-cooled parallel heat sink in which a tab comprises an inner wall, the inner wall at least partially defining an inlet cavity and an outlet cavity, the inlet cavity forming at least a portion of an inlet chamber, and the outlet cavity forming at least a portion of an outlet chamber.

[0008] In some embodiments, the technology described herein relates to a fluid-cooled parallel heat sink in which the volume of the inlet cavity decreases along the length of the fluid-cooled parallel heat sink.

[0009] In some embodiments, the technology described herein relates to a fluid-cooled parallel heatsink in which the width of the inlet cavity decreases along the longitudinal direction of the fluid-cooled parallel heatsink.

[0010] In some embodiments, the technology described herein relates to a fluid-cooled parallel heat sink in which the inlet and outlet cavities are molded to generate a uniform flow rate across a plurality of fins.

[0011] In some embodiments, the technology described herein relates to a heat sink comprising a lid and tabs that structurally form at least partially a cooling chamber; intermediate members disposed within the cooling chamber and partially defining an inlet chamber, a fin chamber, and an outlet chamber within the cooling chamber; and a plurality of fins disposed within the fin chamber and in contact with the lid, wherein the inlet chamber, fin chamber, and outlet chamber are of a size and shape that allows a fluid flowing through the heat sink to uniformly dissipate heat from the plurality of fins.

[0012] In some embodiments, the technology described herein relates to a heat sink, wherein the tabs include a plurality of tab columns arranged within a cooling chamber, and the plurality of tab columns are configured to guide the flow of fluid.

[0013] In some embodiments, the technology described herein relates to a heat sink, wherein the lid includes a lid connection feature, the tab includes a tab connection feature, the lid connection feature has a concave shape, the tab connection feature has a convex shape, and the lid connection feature and the tab connection feature are configured to connect the lid and the tab.

[0014] In some embodiments, the technology described herein relates to a heat sink in which a first fin of a plurality of fins comprises a plurality of dimples configured to connect the first fin to a second fin of the plurality of fins.

[0015] In some embodiments, the technology described herein relates to a heat sink comprising a lid, a tab such that the lid and tab structurally form a cooling chamber, an intermediate member disposed within the cooling chamber, and a plurality of fins located between the intermediate member and the lid, wherein the plurality of fins are configured to dissipate heat from the lid to the fluid as the fluid flows across the plurality of fins.

[0016] In some embodiments, the technology described herein relates to a heat sink in which the lid has multiple mounting positions, heat originates from the multiple mounting positions, and heat is uniformly dissipated between the multiple mounting positions.

[0017] In some embodiments, the technology described herein relates to a heat sink in which each of a plurality of mounting positions accommodates a heat-generating semiconductor device.

[0018] In some embodiments, the technology described herein relates to a heat sink, wherein the tabs include a plurality of tab columns arranged within a cooling chamber, and the plurality of tab columns are configured to guide the flow of fluid.

[0019] In some embodiments, the technology described herein relates to a heat sink, wherein the lid includes a lid connection feature, the tab includes a tab connection feature, the lid connection feature has a concave shape, the tab connection feature has a convex shape, and the lid connection feature and the tab connection feature are configured to connect the lid and the tab.

[0020] In some embodiments, the technology described herein further comprises a tab-lid brazing filler, wherein at least a portion of the tab-lid brazing filler is located between the lid connection feature and the tab connection feature.

[0021] In some embodiments, the technology described herein relates to a heat sink in which a first fin of a plurality of fins comprises a plurality of dimples configured to connect the first fin to a second fin of the plurality of fins.

[0022] In some embodiments, the technology described herein relates to a heat sink in which a first fin comprises a first edge and a second edge, the first edge and the second edge being connected to an intermediate member.

[0023] In some aspects, the technology described herein relates to a heat sink, wherein a lid, a tab, and an intermediate member at least partially define an inlet chamber, a fin chamber, and an outlet chamber within a cooling chamber, and a plurality of fins are disposed within the fin chamber.

[0024] In some aspects, the technology described herein relates to a heat sink that further comprises an inlet and an outlet, the inlet is configured to allow fluid entering the inlet chamber and flowing toward the fin chamber and the outlet chamber, and the outlet is configured to allow fluid flowing out of the outlet chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] These and other features, aspects, and advantages of the present disclosure will be described with reference to the drawings of preferred embodiments, which are intended to illustrate rather than limit the present disclosure.

[0026] [Figure 1] It is an exploded perspective view of a parallel heat sink according to an embodiment of the present disclosure.

[0027] [Figure 2] It is a cross-sectional view of the parallel heat sink.

[0028] [Figure 3] It is a perspective view of a tab of the parallel heat sink.

[0029] [Figure 4] It is a diagram showing a lid and a plurality of fins of the parallel heat sink.

[0030] [Figure 5] It is the same diagram as FIG. 4, except that the intermediate member is disposed on the plurality of fins.

[0031] [Figure 6] It is an exploded perspective view of the parallel heat sink.

[0032] [Figure 7A] This is a diagram of the top surface of the lid.

[0033] [Figure 7B] This is a diagram of the bottom surface of the lid.

[0034] [Figure 8A] This is a diagram of the top surface of the tab.

[0035] [Figure 8B] This is a diagram of the bottom of the tab.

[0036] [Figure 9A] This is a detailed diagram of an exemplary component of a parallel heatsink.

[0037] [Figure 9B] This is a detailed diagram of an exemplary component of a parallel heatsink.

[0038] [Figure 10A] This is a diagram of a tab-lid brazing filler.

[0039] [Figure 10B] This is a cross-sectional view of a tab-lid brazing filler.

[0040] [Figure 11] This is a perspective view of the intermediate member.

[0041] [Figure 12A] This diagram shows individual fin pieces from a group of fins.

[0042] [Figure 12B] This is another diagram showing individual fin pieces from a group of fins.

[0043] [Figure 12C] This is an end view showing an individual fin piece among multiple fins.

[0044] [Figure 13A] This is a diagram illustrating the components of an example parallel heatsink.

[0045] [Figure 13B] Another diagram illustrating the components of a parallel heatsink.

[0046] [Figure 14A] This is a diagram of a conventional heatsink fin.

[0047] [Figure 14B] This is a diagram of a conventional heatsink fin.

[0048] [Figure 15A] This is a cross-sectional view along the length of the parallel heatsink.

[0049] [Figure 15B] This is an alternative embodiment of the cross-sectional view along the length of the parallel heatsink shown in Figure 15A.

[0050] [Figure 15C] This is one embodiment of a cross-sectional view of a parallel heatsink.

[0051] [Figure 16A] This is a top view of semiconductors arranged in two rows on the cover of a parallel heatsink.

[0052] [Figure 16B] This chart shows uniform heat dissipation across semiconductors mounted on parallel heatsinks.

[0053] [Figure 16C] This chart shows the uneven heat dissipation across semiconductors attached to a conventional heatsink.

[0054] [Figure 17A] This is a thermal perspective view of a conventional heatsink design.

[0055] [Figure 17B] This is a thermal perspective view of another conventional heatsink design.

[0056] [Figure 17C] This is a thermal perspective view of another conventional heatsink design.

[0057] [Figure 17D] This is a thermal perspective view of another conventional heatsink design.

[0058] [Figure 18] This is a thermal diagram of one embodiment of a parallel heatsink. [Modes for carrying out the invention]

[0059] Generally speaking, one or more aspects of this disclosure relate to heat sinks. Specifically, this disclosure relates to fluid-cooled heat sinks configured to cool semiconductor devices related to electric vehicles. The heat sink structures and methods disclosed herein are generally applicable to many products and industries, including automotive, marine, aerospace, and robotics. For ease of explanation, the heat sinks and methods are described in the context of cooling vehicles, specifically semiconductors within vehicles. However, the semiconductor structures disclosed herein are not limited to vehicles and are applicable to many industries.

[0060] The heat sink disclosed herein is a two-layer parallel fluid heat sink. In certain embodiments, the parallel heat sink includes a lid, a tab, and an intermediate member. The lid can be connected to the tab to form a cooling cavity. The intermediate member is located inside the cooling cavity and divides the cooling cavity into an inlet cavity and an outlet cavity. It should be understood that the inlet cavity and the outlet cavity are hydraulically connected, and the intermediate member does not completely separate the inlet cavity from the outlet cavity. When fluid flows into the parallel fluid heat sink, the fluid enters the inlet cavity. The inlet cavity is configured to provide a uniform flow distribution through each of the smaller fin channels it supplies, which may be called microchannels. These smaller fin channels then flow into the outlet cavity, where the fluid is collected. Specifically, the outlet cavity may be adjacent to the lid and tab, and the inlet cavity may be adjacent only to the tab.

[0061] Figure 1 is an exploded view of one embodiment of a parallel heatsink 100, which may also be called a fluid-cooled parallel heatsink. The parallel heatsink 100 includes at least one inlet 102 and at least one outlet 104. In certain embodiments, the heatsink 100 is reversible in that at least one inlet 102 can be configured as an outlet and at least one outlet 104 can be configured as an inlet.

[0062] In certain embodiments, the parallel heat sink 100 comprises a lid 200, a tab 300, an intermediate member 400, and a plurality of fins 500. In certain embodiments, the lid 200 is connected to the tab 300 to form a sealed cooling chamber 110. In certain embodiments, the intermediate member 400 is located within the cooling chamber 110 between the lid 200 and the tab 300. In certain embodiments, the intermediate member 400 may be parallel or relatively parallel to the lid 200 and / or the tab 300. In certain embodiments, the plurality of fins 500 are located between the intermediate member 400 and the lid 200. The plurality of fins 500 draw heat from the lid 200 and dissipate the heat into the fluid as the fluid flows across the plurality of fins 500. In certain embodiments, the lid 200, the plurality of fins 500, the intermediate member 400, and the tab 300 are all connected. For example, the lid 200, the multiple fins 500, the intermediate member 400, and the tab 300 can be connected to dissipate heat from the lid 200 via the heat sink 100. In certain embodiments, the lid 200, the multiple fins 500, the intermediate member 400, and the tab 300 may be connected by brazing, welding, or formed as one by additive manufacturing.

[0063] The parallel heatsink 100 is designed to withstand the forces of sintering. Sintering is a process that requires a structure that can withstand significant compression and heat. In this embodiment, the parallel heatsink 100 is designed so that the semiconductor is attached to the lid 200 at multiple mounting positions 210 via sintering. Sintering results in a superior thermal connection between the components and the parallel heatsink 100. Furthermore, this thermal connection is more durable. Conventional connection methods, such as using grease or paste in combination with screws, cannot produce the same results and also have service life issues. Moreover, conventional structures cannot withstand the heat and strength requirements of sintering.

[0064] Figure 2 is a cutaway view of the parallel heat sink 100 of Figure 1. In Figure 2, the flow is shown in the XY direction, as indicated by arrow 10. It should be understood that the fluid also flows in the Z direction. In certain embodiments, the intermediate member 400 divides the cooling chamber 110 into three subcavities, which can be characterized as an inlet chamber 120, which may also be called a first cavity; a fin chamber 130, which may also be called a second cavity; and an outlet chamber 140, which may also be called a third cavity. In certain embodiments, the fluid is configured to enter the parallel heat sink 100 through the inlet 102, flow out of the inlet chamber 120, pass through the intermediate penetration 125 into the fin chamber 130, enter the outlet chamber 140, and exit through the outlet 104. It should be understood that the inlet chamber 120, the fin chamber 130, and the outlet chamber 140 are not completely separate chambers. The chambers are hydraulically connected so that the fluid can flow between them.

[0065] Figure 3 shows a tab 300 of a parallel heat sink 100. Figure 3 shows the flow in the Z direction indicated by arrow 20. In certain embodiments, the tab 300 may include a plurality of tab columns 304 (Figure 8A). The plurality of tab columns 304 may be configured to guide the fluid flow in the inlet chamber 120, or may function purely for structural purposes, in particular to withstand sintering forces. The plurality of tab columns 304 may be in a number or size that corresponds to the sintering load requirements associated with sintering the semiconductor onto the lid 200. Furthermore, the plurality of tab columns 304 may be elliptical in shape to create the smallest possible pressure drop within the manifold. The tab 300 may include an inlet cavity 320 and an outlet cavity 340, the inlet cavity 320 at least partially defining the inlet chamber 120, and the outlet cavity 340 at least partially defining the outlet chamber 140. The inlet cavity 320 may be separated from the outlet cavity 340 by an inner wall 302. The inner wall 302 can further define at least a portion of the inlet cavity 320 and the outlet cavity 340. The inlet cavity 320 can be configured to pass through the intermediate penetration 125 (shown in Figure 2) and generate a uniform flow rate across the multiple fins 500 in the fin chamber 130. The inlet cavity 320 can generate a uniform flow rate across the multiple fins 500.

[0066] The inlet cavity 320 can be molded so that its volume or width decreases along the length of the parallel heatsink 100. The length of the parallel heatsink 100 may be referred to as the Z-axis. The decrease in volume along the length of the inlet cavity 320 results in an overall decrease in the volume of the inlet chamber 120 along the length of the parallel heatsink 100. The decrease in volume allows for a more uniform pressure within the inlet chamber 120. Thus, the flow rate from the inlet chamber 120 through the intermediate penetration 125 and across the multiple fins 500 in the fin chamber 130 is uniform along the length of the parallel heatsink 100. Furthermore, the increase in volume along the length of the outlet chamber 140, driven by the shape of the outlet cavity 340, generates a uniform pressure along the length of the outlet chamber 140. This uniform pressure also generates a uniform flow across the multiple fins 500 because there is no pressure buildup. In certain embodiments, the specific shapes of the inlet cavity 320 and outlet cavity 340 generate optimal uniform flow. It should be understood that various shapes and / or inner wall configurations can be used to reduce the volume of the inlet chamber 120 along its length, or to increase the volume of the outlet chamber 140 along its length. Furthermore, this system may be used in reverse, in which case the shape allows for equally effective heat dissipation. In certain embodiments, the parallel heatsink 100 reduces overall pressure loss compared to conventional heatsink designs.

[0067] Figure 4 shows some components of the parallel heatsink 100. Figure 4 shows the flow in the X direction across the multiple fins 500, as indicated by arrow 30. The multiple fins 500 are connected to a lid 200 located below the multiple fins 500 in Figure 4. A tab 300, not shown in Figure 4, is connected to the visible side of the multiple fins 500 and forces the fluid to pass through the multiple fins 500. As the fluid exits the multiple fins 500, it enters an outlet cavity 340 which at least partially defines the outlet chamber 140.

[0068] Figure 5 shows the configuration of Figure 4 with the addition of the intermediate member 400. The intermediate member 400 is connected to multiple fins 500 on the fin side 402. Although not shown, the intermediate member 400 is connected to tab 300 on the tab side 404. Figure 5 shows the flow in the Z direction indicated by arrow 40. However, it should be understood that the flow may be in other directions such as Y. The fluid exits the fin chamber 130 and enters the outlet chamber 140. Once the fluid enters the outlet chamber 140, it flows out from the outlet 104.

[0069] Figure 6 is an exploded view of one embodiment of a parallel heatsink 100. The parallel heatsink 100 may comprise a lid 200, a tab 300, an intermediate member 400, and a plurality of fins 500. The parallel heatsink 100 may further comprise an inlet port 112 and an outlet port 114. The parallel heatsink may also comprise a first threaded boss 150 and a second threaded boss 152. The components of the parallel heatsink 100 may be connected via brazing, and therefore the parallel heatsink 100 may comprise brazed components 600. The brazed components 600 may include a tab-lid brazing filler 610, a fin-lid brazing filler 620, a boss brazing ring 630, and a fitting brazing ring 640.

[0070] Figure 7A shows one embodiment of the lid 200. In a particular embodiment, the lid 200 includes a plurality of mounting positions 210 on the upper surface 202 of the lid 200. The plurality of mounting positions 210 are configured for mounting semiconductors or other components at those locations. The parallel heat sink 100 is configured to dissipate heat from the components.

[0071] Figure 7B is a diagram of one embodiment of the lid 200 shown in Figure 7A. The bottom surface 204 of the lid 200 includes an outer wall 206. The outer wall 206 is configured to connect to an outer tab wall 306 (shown in Figure 8A). In certain embodiments, the top surface of the outer wall 206 includes a lid connection feature 208. The lid connection feature 208 is configured to connect the lid 200 to the tab 300, more specifically, to the outer tab wall 306 to the outer wall 206. In certain embodiments, the lid connection feature 208 may be a groove or a wedge. In certain embodiments, the bottom surface 204 of the lid 200 further includes a fin cavity 230. The fin cavity 230 at least partially defines the fin chamber 130.

[0072] Figure 8A shows one embodiment of the tab 300. In a particular embodiment, the tab 300 includes a plurality of tab columns 304, an inner wall 302, and an outer tab wall 306. The tab columns 304 are located inside 308 of the tab 300. The upper surfaces of the tab columns 304 and the upper surfaces of the inner wall 302 are configured to connect to an intermediate member 400. In a particular embodiment, they may be connected to the intermediate member 400 by brazing or some other type of connection.

[0073] The tab 300 may further include an inlet 102 and an outlet 104. The upper surface of the outer tab wall 306 may further include a tab connection feature 314 (shown in Figure 9A). The tab connection feature 314 can be configured to connect the lid 200 to the tab 300, more specifically the outer tab wall 306 to the outer wall 206, and even more specifically the lid connection feature 208 to the tab connection feature 314. The tab connection feature 314 may be a groove or a wedge, and the lid connection feature 208 may be the opposite.

[0074] Figure 8B is a diagram of one embodiment of the tab 300 shown in Figure 8A. The tab 300 may include a plurality of standoffs 310 located on the outside 312 of the tab 300.

[0075] Figure 9A is a detailed view of the components of the parallel heat sink 100. The parallel heat sink 100 may include a single tab-lid brazing filler 610 or multiple tab-lid brazing fillers 610 as shown in Figure 9A. The lid 200 includes a lid connection feature 208. In the illustrated embodiment, the lid connection feature 208 has a concave shape. During the brazing process, the tab-lid brazing filler 610 melts and forms a pool of material within the lid connection feature 208. The outer tab wall 306 of the tab 300 is then inserted into the pool of material to form a sealed connection. This type of connection may be called a rake brazing connection 800. Rake brazing allows for a strong seal with the ability to accommodate large tolerances. In certain embodiments, the rake brazing connection 800 can form a seal as long as the tip of the convex outer tab wall 306 is in contact with the pool of material. Thus, the range of tolerances that this system can accommodate is determined by the depth of the concave lid connection feature 208. Figure 9B shows the rake brazed connection 800 in the configuration of the parallel heatsink 100.

[0076] Figure 10A shows one embodiment of the tab-lid brazing filler 610. In a particular embodiment, the tab-lid brazing filler 610 can be molded to match the shape of the outer wall 206 and the outer tab wall 306. Figure 10B further shows a cross-section of the tab-lid brazing filler 610 as seen in Figure 10A. The cross-section of the tab-lid brazing filler 610 can be molded to fit into the recess of the lid connection feature 208. Furthermore, the cross-section of the tab-lid brazing filler 610 may include a tab holding feature 612. In a particular embodiment, the tab holding feature 612 may be a concave feature configured to receive the convex portion of the tab connection feature 314. The tab holding feature 612 can help hold, guide, or position the tab 300 during manufacturing, particularly during the brazing process.

[0077] Figure 11 shows one embodiment of the intermediate member 400. In certain embodiments, the intermediate member 400 may be a plate. In certain embodiments, the intermediate member 400 includes a central slot 410. In certain embodiments, the central slot 410 is configured to coincide with that of the inner wall 302, and the central slot 410 may form part of the outlet chamber 140. The intermediate member 400 may be sized to withstand the sintering forces. Specifically, the thickness of the intermediate member 400 may be based on the minimum thickness that can distribute the sintering compressive forces between the brazed component 600 and the tab 300 or a plurality of tab columns 304.

[0078] Figures 12A, 12B, and 12C show embodiments of individual fin pieces 510 of a plurality of fins 500. In this embodiment, each individual fin piece 510 contains two fins, but it should be understood that each individual fin piece 510 may contain a single fin or three or more fins. In certain embodiments, these fin pieces may be between 0.4 mm and 0.6 mm, or between 0.3 mm and 0.7 mm, or between 0.2 mm and 1 mm. In certain embodiments, each individual fin piece 510 may contain a plurality of dimples 520. The plurality of dimples 520 can be manufactured by semi-shear stamping. The height of the dimples can determine or set the gap between the fins. The dimples 520 may be connected to adjacent fins, may be in contact with adjacent fins, or may be brazed to adjacent fins. Connecting the dimples 520 to adjacent fin pieces 510 may help to reinforce the plurality of fins 500 and the overall parallel heat sink structure. This connection of the multiple dimples 520 to the individual fin pieces 510 can also be considered as lateral supports. Specifically, the dimples 520 can function to increase the compressive strength of the multiple fins 500 and / or the parallel heat sink 100 when subjected to a sintering load. The multiple dimples 520 can also enable more efficient heat transfer from the multiple fins 500 to the fluid. Figures 13A and 13B show additional embodiments of the parallel heat sink 100 and the mounting positions of the multiple fins 500.

[0079] It should be further understood that in certain embodiments, the plurality of fins 500 are composed of individual fin pieces 510. Each of these individual fin pieces has a first edge 530 and a second edge 540, as seen in Figure 12C. By having individual fin pieces 510 with edges 530, 540, the plurality of fins 500 can cope with higher compressive loads and thus support the sintering of semiconductors onto the parallel heat sink 100. In certain embodiments, each fin piece 510 forms a butt joint with the intermediate member 400 and the lid 200. Thus, either the first edge 530 or the second edge 540 is connected to the intermediate member 400, and the other edge 530, 540 is connected to the intermediate member 400. The first edge 530 and the second edge 540 are sintered into their respective joints. This butt joint connection, combined with the connection of multiple dimples 520 to adjacent fins 510, forms a very strong structure capable of withstanding the forces associated with semiconductor sintering to the lid 200. Figures 14A and 14B show conventional fin structures used in series or parallel heat sinks. It should be understood that such structures cannot withstand the sintering forces because the fins buckle under load.

[0080] Figures 15A and 15B show cross-sectional views of the parallel heat sink 100 along the Z-axis. In certain embodiments, the lid 200 is connected to a plurality of fins 500 via brazing. In certain embodiments, the plurality of fins 500 is connected to an intermediate member 400 via brazing. In certain embodiments, the intermediate member 400 is connected to a tab 300 via brazing. The lid 200, the plurality of fins 500, the intermediate member 400, and the tab 300 can all be connected to each other via brazing and together form a compression stack. In certain embodiments, these plurality of components form a compression stack during manufacturing. It should be further understood that in certain embodiments, the connection between the outer wall 206 of the lid 200 and the outer tab wall 306 of the tab 300 is not part of the compression stack. Figure 15C shows a central component 160 which may comprise a plurality of fins 500, an intermediate member 400, and / or a plurality of tab columns 304. The rake brazed joint 800 shown in Figures 9A and 9B can be used to absorb tolerances and allow for higher compression, and therefore better connections between the components and interfaces within the cooling chamber 110. As seen in Figure 15C, the rake brazed joint 800 between the lid 200 and the tab 300 can form a sealed connection insofar as the tab connection feature 314 extends into the lid connection feature 208. Thus, depending on the embodiment, the joint 800 may be able to form a seal with tolerances of up to 1 mm, or 0.8 mm, or 0.6 mm in stack height. Although different types of connections are shown in Figures 15A and 15B, it should be understood that the rake brazed joint described and illustrated in Figure 15C may be used.

[0081] Figure 16A is a top view of a semiconductor mounted on a parallel heatsink 100. As shown in Figure 16A, each of areas BL1, BL2, BL3, BL4, BH1, BH2, BH3, BH4, CL1, CL2, CL3, CL4, CH1, CH2, CH3, CH4, AL1, AL2, AL3, AL4, AH1, AH2, AH3, and AH4 may correspond to one of a plurality of mounting positions 210 on the lid 200. In some embodiments, each of the mounting positions shown in Figure 16A can accommodate a semiconductor device (e.g., a semiconductor power switch). Figure 16B is a chart showing uniform heat dissipation across semiconductors mounted on the parallel heatsink 100. The temperature distribution shown in Figure 16B is uniform across all semiconductor locations. This uniform heat dissipation is in contrast to the conventional fluid-cooled heatsink design shown in Figure 16C. Figure 16C shows that semiconductors positioned towards the end of a conventional heatsink operate at significantly higher temperatures than semiconductors positioned towards the beginning of the flow. Figures 17A, 17B, 17C, and 17D illustrate embodiments of the thermal properties of a conventional fluid-cooled heatsink, as shown in Figure 16C. As seen in these figures, there is a significant temperature gradient across the conventional heatsink. Thus, in this case, the performance and efficiency of the system, such as a vehicle, may be affected. The entire system may be limited because the semiconductor or other components cannot be cooled uniformly. If the system is not limited, using a conventional heatsink increases the likelihood of semiconductor or other components failing. Figure 18 is a thermal diagram of the currently disclosed parallel heatsink 100. Uniform heat dissipation allows for improved performance and efficiency. This may be provided directly in the form of semiconductors or by a reduction in the system flow rate, thus providing energy savings.

[0082] The foregoing disclosure is not intended to limit the disclosure to the exact form or specific field of use disclosed. Therefore, various alternative embodiments and / or modifications to the disclosure, whether expressly described or implied herein, are possible in light of the disclosure. While embodiments of the disclosure have been described in this manner, those skilled in the art will recognize that modifications in form and detail can be made without departing from the scope of the disclosure. Therefore, the disclosure is limited solely by the claims.

[0083] The above specification describes the disclosure with reference to specific embodiments. However, as those skilled in the art will understand, the various embodiments disclosed herein can be modified or implemented in various other ways without departing from the spirit and scope of the disclosure. Therefore, this description should be considered illustrative and is intended to teach those skilled in the art how to manufacture and use the various embodiments of the disclosed parallel heatsink. It should be understood that the forms of disclosure shown and described herein should be interpreted as representative embodiments. Equivalent elements, materials, processes, or steps may be substituted with those representatively shown and described herein. Furthermore, all particular features of the disclosure can be utilized independently of the use of other features, so as will become apparent to those skilled in the art after benefiting from this description of the disclosure. Expressions such as “including,” “comprising,” “incorporating,” “consisting of,” “have,” and “is” used to describe and claim the disclosure are intended to be interpreted in a non-exclusive manner, that is, to allow for the existence of items, components, or elements not expressly described. References to the singular form should also be interpreted as relating to the plural form.

[0084] Furthermore, the various embodiments disclosed herein should be interpreted in an illustrative and descriptive sense and not in any way as limiting the disclosure. All references to joining (e.g., mounting, fixing, joining, connecting, etc.) are used solely to aid the reader's understanding of the disclosure and do not imply any limitation with respect to the location, orientation, or use of the systems and / or methods disclosed herein. Accordingly, where there is a reference to joining, it should be interpreted broadly. Furthermore, such references to joining do not necessarily mean that the two elements are directly connected to each other. Furthermore, without limitation, all numerical terms such as “first,” “second,” “third,” “primary,” “secondary,” “main,” or any other ordinary and / or numerical terms should also be interpreted solely as identifiers to aid the reader's understanding of the various elements, embodiments, variations, and / or modifications of the disclosure and, in particular, do not impose any limitation on the order or preference of any element, embodiment, variation, and / or modification to or beyond another element, embodiment, variation, and / or modification.

[0085] It will also be understood that, depending on the specific application, one or more of the elements shown in the drawings / figures may also be implemented in a more separated or integrated manner, or in certain cases may even be removed or abandoned as non-functional.

Claims

1. A fluid-cooled parallel heat sink, The entrance and Exit and A lid including mounting positions for multiple components, A tab connected to the lid, wherein the tab and the lid structurally form a cooling chamber, An intermediate member disposed within the cooling chamber, The cooling chamber comprises a plurality of fins arranged within the cooling chamber, The intermediate member at least partially separates the cooling chamber into an inlet chamber, a fin chamber in which the plurality of fins are arranged, and an outlet chamber. A fluid-cooled parallel heat sink in which the fluid flows from the inlet into the inlet chamber, into the fin chamber, into the outlet chamber, and out from the outlet.

2. The fluid-cooled parallel heat sink according to claim 1, wherein the plurality of fins are located between the lid and the intermediate member.

3. The tab has an inner wall, and the inner wall at least partially defines the inlet cavity and the outlet cavity. The inlet cavity forms at least a portion of the inlet chamber, The fluid-cooled parallel heat sink according to claim 1, wherein the outlet cavity forms at least a portion of the outlet chamber.

4. The fluid-cooled parallel heat sink according to claim 3, wherein the volume of the inlet cavity decreases along the length of the fluid-cooled parallel heat sink.

5. The fluid-cooled parallel heat sink according to claim 3, wherein the width of the inlet cavity decreases along the length of the fluid-cooled parallel heat sink.

6. The fluid-cooled parallel heat sink according to claim 3, wherein the inlet cavity and the outlet cavity are molded to generate a uniform flow rate across the plurality of fins.

7. It is a heatsink, A lid and tab that structurally form at least partially the cooling chamber, An intermediate member disposed within the cooling chamber, which partially defines the inlet chamber, fin chamber, and outlet chamber within the cooling chamber, The fin chamber comprises a plurality of fins arranged within it and in contact with the lid, A heat sink in which the inlet chamber, the fin chamber, and the outlet chamber are sized and shaped such that the fluid flow through the heat sink allows heat to be uniformly dissipated from the plurality of fins.

8. The heat sink according to claim 7, further comprising a plurality of tab columns disposed within the cooling chamber, wherein the plurality of tab columns are configured to structurally support the load from sintering.

9. The heat sink according to claim 7, wherein the lid comprises a first connection feature portion, the tab comprises a second connection feature portion, the first connection feature portion has a first curved shape, the second connection feature portion has a second curved shape different from the first curved shape, and the first connection feature portion and the second connection feature portion are configured to connect the lid and the tab during assembly.

10. The heat sink according to claim 7, wherein the first fin among the plurality of fins comprises a plurality of dimples configured to connect the first fin to the second fin among the plurality of fins.

11. It is a heatsink, The lid and A tab, wherein the lid and the tab structurally form a cooling chamber, An intermediate member disposed within the cooling chamber, It comprises a plurality of fins located between the intermediate member and the lid, A heat sink in which the plurality of fins are configured to dissipate heat from the lid to the fluid as the fluid flows across the plurality of fins.

12. The heat sink according to claim 11, wherein the lid has a plurality of mounting positions, the heat originates from the plurality of mounting positions, and the heat is uniformly dissipated between the plurality of mounting positions.

13. The heat sink according to claim 12, wherein each of the plurality of mounting positions accommodates a semiconductor device that generates heat.

14. The heat sink according to claim 11, wherein the tab comprises a plurality of columns arranged in the cooling chamber, and the plurality of columns are configured to structurally support the load from sintering.

15. The heat sink according to claim 11, wherein the lid comprises a first connection feature portion, the tab comprises a second connection feature portion, the first connection feature portion has a first curved shape, the second connection feature portion has a second curved shape different from the first curved shape, and the first connection feature portion and the second connection feature portion are configured to connect the lid and the tab during assembly.

16. The heat sink according to claim 15, further comprising a brazing filler, wherein at least a portion of the brazing filler is located between the first connection feature portion and the second connection feature portion.

17. The heat sink according to claim 11, wherein the first fin among the plurality of fins comprises a plurality of dimples configured to connect the first fin to the second fin among the plurality of fins.

18. The heat sink according to claim 17, wherein the first fin comprises a first edge and a second edge, and the first edge and the second edge are connected to the intermediate member.

19. The heat sink according to claim 11, wherein the lid, the tab, and the intermediate member at least partially define the inlet chamber, fin chamber, and outlet chamber within the cooling chamber, and the plurality of fins are arranged within the fin chamber.

20. The heat sink according to claim 19, further comprising an inlet and an outlet, wherein the inlet is configured to allow the fluid flowing into the inlet chamber to flow toward the fin chamber and the outlet chamber, and the outlet is configured to allow the fluid to flow out of the outlet chamber.

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