A heatsink for releasably fastening to a cooling unit, and a cooling unit having a releasably fastened heatsink.

Abstract

The present invention relates to a heat sink for cooling a unit to be cooled, particularly an electrical unit, preferably a semiconductor assembly. The heat sink has a cooling channel and a first cooling wall positioned on the cooling channel surface facing the unit to be cooled. The heat sink further includes a coolant feed section and a coolant discharge section, both of which are fluidly connected to the cooling channel for supplying and discharging a coolant, particularly a coolant liquid, preferably a coolant. The heat sink is designed so that the unit to be cooled can be mechanically and thermally connected to the cooling wall. In addition, the heat sink is designed so that when the heat sink is fastened to the cooling unit, a first fluid connection can be made between the coolant feed section of the heat sink and the first fluid port of the cooling unit, and a second fluid connection can be made between the coolant discharge section of the heat sink and the second fluid port of the cooling unit, so that the heat sink can be releasably fastened to a cooling unit having a first fluid port and a second fluid port. The heatsink is designed such that when the heatsink is tightened to the cooling unit, a fluid-tight seal is simultaneously created between the first fluid connection and the second fluid connection.

Description

[Technical Field]

[0001] Summary The present invention relates to a heat sink for dissipating heat from a unit to be cooled, in particular an electrical unit, preferably a semiconductor assembly. The invention further relates to an electronic assembly, a cooling unit, and a cooling device for supplying a coolant to a heat sink. The invention further relates to a method for assembling a cooling device starting from a heat sink and a cooling unit. The invention also relates to a power converter for an industrial process assembly, preferably a plasma process assembly, or a heating assembly.

[0002] The present invention is in the field of power conversion for particularly power-intensive and instability-prone industrial processes, for example charging and discharging systems for large batteries such as plasma excitation, plasma coating processes, gas laser excitation, particle accelerators, flow batteries by microwave energy or induction heating, melting of solids, heating and / or vaporization of liquids. A common feature of all these processes is that they are designed to generate and accelerate charged atomic particles in a gaseous and / or plasma environment or in a liquid. Another feature of all these processes is that they have a high power consumption in the range of 1 kW or more, in particular 10 kW or more, preferably 100 kW or more. Many of these processes also have very high requirements for the stability of the power supply because the processes are highly complex, such as semiconductor manufacturing using plasma processes and / or heating by electromagnetic fields. Typically, power is converted from a commercial mains frequency in the range of approximately 50 Hz to 60 Hz to different frequencies that can be in the range of 1 kHz to 200 MHz. Conversion to direct current power, also called DC power, is also conceivable. Converting power to other frequencies requires a plurality of electronic components and assemblies, in particular power semiconductor devices such as transistors or diodes designed for currents ≧10 A and voltages ≧400 V. These electronic components and assemblies generate waste heat during operation. The waste heat is several mm 2It often occurs in a very limited area. The specific challenge is dissipating this waste heat to protect components and / or assemblies from overheating-induced failure. For this purpose, very large, material-intensive heatsinks are often used, and their manufacture is very expensive.

[0003] In conventional technology, heat is dissipated by cooling using cooling panels. When cooling with such conventional cooling panels, heat conduction from electrical components, which may have a copper layer, to the coolant is achieved by applying a material such as thermal paste to the thermal interface, thereby dissipating the generated heat. Such thermal interface materials have disadvantages. Firstly, they create another form of heat conduction with thermal resistance, and secondly, they are subject to friction, gradually reducing their effectiveness during operation. To dissipate a large amount of heat, or to generate less heat, the surface area of ​​the cooling panel is increased, or the number and performance of the components are reduced. Neither of these two options is sufficient. Because the installation space for such power supply housings is limited, the cooling area cannot be expanded indefinitely. Reducing the performance of individual components is also not a viable solution. Overall, inadequate cooling of electrical components leads to increased costs.

[0004] In many technical applications, particularly in the field of electronics, it is necessary to detach units to be cooled, such as semiconductor elements or semiconductor assemblies, from the rest of the assembly as needed. To enable the unit to be removably mounted to a heatsink, the unit to be cooled is often removably attached to the associated heatsink, for example, using thermal paste. This results in the disadvantage of a relatively weak thermal bond between the unit to be cooled and the heatsink. [Background technology]

[0005] The object of the present invention is to provide a heat sink, an electrical assembly, a cooling device, and a cooling unit that enables improved thermal coupling between the heat sink and the unit to be cooled, thereby improving ease of maintenance.

[0006] Summary of the Invention The objective can be achieved using a heat sink to dissipate heat from a unit to be cooled, particularly an electrical unit, preferably a semiconductor assembly. The heat sink comprises a cooling channel and a first cooling wall positioned on the side of the cooling channel facing the unit to be cooled. Furthermore, the heat sink includes a coolant feed section and a coolant discharge section, both of which are fluidly connected to the cooling channel for the supply and discharge of a coolant, particularly a coolant liquid, preferably coolant water. The heat sink is configured such that the unit to be cooled can be mechanically and thermally connected to the first cooling wall. Furthermore, the heat sink is configured such that when the heat sink is fastened to the cooling unit, a first fluid connection can be made between the coolant feed section of the heat sink and the first fluid port of the cooling unit, and a second fluid connection can be made between the coolant discharge section of the heat sink and the second fluid port of the cooling unit, so that the heat sink can be releasably fastened to a cooling unit having a first fluid port and a second fluid port. The heatsink is configured such that when the heatsink is tightened to the cooling unit, a fluid-tight seal is simultaneously created between the first fluid connection and the second fluid connection. The heatsink is further configured to be mechanically connected to the unit to be cooled, which is connected to the circuit board by one connection, and in particular several connections. In this way, the unit to be cooled can be cooled very efficiently by the heatsink. Therefore, when the circuit board is removed together with the unit to be cooled, for example, when separated from the cooling unit, the heatsink can be left on the unit to be cooled. This allows for more efficient and reliable heat conduction between the unit to be cooled and the heatsink.

[0007] A "fluidic connection" is a connection designed to allow a fluid to flow through it.

[0008] A "fluid port" is an opening designed to allow a fluid to pass through it and to which components having similar openings can be connected, thereby enabling the fluid to be guided through these openings.

[0009] The heatsink allows the heatsink to be releasably clamped to the cooling unit. The cooling unit is configured to supply and discharge coolant to the heatsink. The heatsink can be configured such that, for example, when the heatsink is clamped to the cooling unit, a fluid-tight fluid connection can be created between the heatsink and the cooling unit. If necessary, the heatsink can be removed from the cooling unit together with the unit to be cooled to which it is attached. This is particularly advantageous from the standpoint of maintenance and repair. According to embodiments of the present invention, the unit to be cooled can be removed from the cooling unit together with the heatsink, for example.

[0010] This development makes it possible, for example, to mechanically and permanently connect the unit to be cooled to the heat sink. Preferably, the result of this development is to fabricate the connection between the unit to be cooled and the heat sink as thinly as possible, using little to no additional material. During the process of study, simulation, and experimentation for this development, it became clear that this is particularly possible when the heat sink, through which the fluid flows, is permanently connected to the unit to be cooled, especially by a physical joint. This can be achieved, for example, by soldering, sintering, pressurization, or direct copper bonding (DCB). In this specification, the term “permanently” may mean “removable only by destructive means,” i.e., using a connection that cannot be removed with tools without damaging any component of either the unit to be cooled 10 or the heat sink 5, or both. Even in this case, the unit to be cooled may still be removable from the cooling unit together with the heat sink, for example, for maintenance purposes. Mechanically and permanently attaching the unit to be cooled to the heat sink allows for improved thermal coupling between the unit to be cooled and the heat sink, and better heat conduction from the unit to the heat sink.

[0011] Furthermore, the development involves an electronic assembly comprising a heatsink as described above, and a unit to be cooled that is mechanically and fixedly connected to the heatsink.

[0012] During development, an electronic assembly comprising a heatsink and a unit to be cooled, mechanically and fixedly connected to the heatsink, can, for example, be inserted into the cooling unit and removed entirely from the cooling unit. This allows access to the unit to be cooled.

[0013] The development also relates to a cooling unit for supplying a coolant, particularly a coolant liquid, preferably coolant water, to a heat sink having a coolant feed section and a coolant discharge section. The cooling unit has a first flow path and a second flow path. Furthermore, the cooling unit comprises a first fluid port fluidically connected to the first flow path and a second fluid port fluidically connected to the second flow path. The cooling unit is configured such that the heat sink can be releasably fastened to the cooling unit, and that when the heat sink is fastened to the cooling unit, a first fluid connection can be made between the coolant feed section of the heat sink and the first fluid port of the cooling unit, and a second fluid connection can be made between the coolant discharge section of the heat sink and the second fluid port of the cooling unit. Furthermore, the heat sink is configured such that when the heat sink is fastened to the cooling unit, a fluid-tight seal is simultaneously created between the first fluid connection and the second fluid connection. The heatsink is further configured to be mechanically connected to the unit to be cooled, which is connected to the circuit board by one, or more precisely, several, connections. In this way, the unit to be cooled can be cooled very efficiently by the heatsink. Therefore, when the circuit board is removed together with the unit to be cooled, for example, when it is separated from the cooling unit, the heatsink can remain on the unit to be cooled. This allows for more efficient and reliable heat conduction between the unit to be cooled and the heatsink.

[0014] A cooling unit can be designed, for example, to supply coolant to a single heatsink, or it can be designed to supply coolant to multiple heatsinks and then discharge the coolant after it has flowed through the heatsinks. In this way, a cooling system is created that allows access to the cooling unit as needed.

[0015] Furthermore, the development involves a cooling device comprising a cooling unit as described above and a heatsink removably connected to the cooling unit as described above.

[0016] The development further relates to power converters for industrial process assemblies, preferably plasma process assemblies, or heating assemblies. - Heat sinks as described above and below, - Circuit board, - The unit to be cooled, particularly an electrical unit, preferably a semiconductor assembly, preferably one having power semiconductor components, -Having further electronic components, Further electronic components and units to be cooled are located on or on the circuit board and connected to electrical contacts. The unit to be cooled has a fixed, particularly physically bonded, connection to the heatsink, and the unit to be cooled is simultaneously fixedly connected to the circuit board by several connections, particularly by soldering.

[0017] In one embodiment, the power converter has a cooling unit as described herein.

[0018] In one embodiment, the power converter has a cooling device as described herein.

[0019] In one embodiment, the power converter has one or more of the heatsinks described herein as further heatsinks.

[0020] In one embodiment, the power converter has one or more of the electronic assemblies described herein as further electronic assemblies.

[0021] A desirable outcome of the development is to fabricate the connection between the unit to be cooled and the heat sink as thin as possible, using little to no additional material. Through the studies, simulations, and experiments conducted for this development, it became clear that this is particularly possible when the heat sink, through which the fluid flows, is fixedly connected to the unit to be cooled, especially by a physical joint. This can be achieved, for example, by soldering, sintering, pressurization, or direct copper bonding (DCB). In this specification, the term “fixedly” may mean “removable only by destructive means,” i.e., using a connection that cannot be removed with tools without damaging any component of either the unit to be cooled or the heat sink, or both.

[0022] The development further relates to a heat sink for dissipating heat from a unit to be cooled, particularly an electrical unit, preferably a semiconductor assembly, and a method for assembling a cooling device starting with the cooling unit. The heat sink has a cooling channel, a coolant feed section fluidly connected to the cooling channel, and a coolant discharge section fluidly connected to the cooling channel. The cooling unit comprises a first fluid port and a second fluid port. The method includes the step of releasably fastening the heat sink to the cooling unit, and as the heat sink is fastened to the cooling unit, a first fluid connection is made between the coolant feed section of the heat sink and the first fluid port of the cooling unit, and a second fluid connection is made between the coolant discharge section of the heat sink and the second fluid port of the cooling unit. As the heat sink is fastened to the cooling unit, a fluid-tight seal is simultaneously created between the first fluid connection and the second fluid connection.

[0023] Advantageous embodiments and developments that can be used individually or in combination are the subject of the dependent claims and the following description.

[0024] The coolant feed portion and coolant discharge portion of the heat sink are preferably arranged on a side portion of the heat sink that faces away from the unit to be cooled. This enables, for example, fluidic connection to the heat sink at the side portion of the heat sink that faces away from the unit to be cooled.

[0025] In one aspect, the heat sink can be releasably clamped to the cooling unit by at least one clamping means, preferably at least one screw. The at least one clamping means can preferably be configured to establish a fluid connection between the heat sink and the cooling unit such that a fluid-tight seal is achieved. The clamping means can preferably be a clamping means that can be easily removed with or without a tool.

[0026] The connection between the heat sink and the cooling unit can particularly easily be disconnected than the connection between the heat sink and the unit to be cooled.

[0027] The connection between the heat sink and the cooling unit can particularly be established in a single step involving sealing of the fluid ports.

[0028] It is advantageous if the fluid-tight sealing between the first fluid connection and the second fluid connection can be achieved by at least one clamping means accessible from a side portion of the first cooling wall. The fact that the at least one clamping means is accessible from the side portion of the first cooling wall makes it easier to handle the heat sink when inserting and removing the heat sink relative to the cooling unit.

[0029] In one embodiment, the heatsink can be pressed against the cooling unit by at least one clamping means so as to enable the creation of fluid-tight fluid connections between the first fluid port of the cooling unit and the coolant feed portion of the heatsink, and between the second fluid port of the cooling unit and the coolant discharge portion of the heatsink. For example, at least one clamping means can be configured to generate a contact force that presses the first and second fluid ports of the cooling unit against the coolant feed portion and the coolant discharge portion of the heatsink when the heatsink is clamped to the cooling unit.

[0030] It is advantageous for a cooling device to include a first sealing element designed to create a fluid-tight first fluid connection when the heatsink is tightened to a cooling unit. For example, when the heatsink is tightened to a cooling unit, the first sealing element can create a fluid-tight first fluid connection. For example, when the heatsink is pressed against the cooling unit, it can be deformed so that the connection between the first cooling port and the coolant feed section is sealed. The first sealing element is preferably a first sealing ring surrounding the first fluid port.

[0031] In one embodiment, the cooling device includes a second sealing element designed to create a fluid-tight second fluid connection when the heatsink is tightened to the cooling unit. For example, when the heatsink is tightened to the cooling unit, the second sealing element can create a fluid-tight second fluid connection. The second sealing element is preferably a second sealing ring surrounding a second fluid port.

[0032] In one embodiment, the heatsink is configured such that, when the heatsink is fastened to a cooling unit, a cooling flow is generated from a first fluid port to a coolant feed section, and then through a cooling passage and a coolant discharge section to a second fluid port. In this way, the heatsink can be supplied with coolant from, for example, a cooling unit.

[0033] In one embodiment, the heat sink is made of a metal, preferably copper. The high thermal conductivity of copper allows for heat dissipation from the unit being cooled.

[0034] In one embodiment, the unit to be cooled is mechanically and thermally connected to a heatsink. The electronic assembly constructed in this manner has a heatsink having one or more of the features described herein. The unit to be cooled, mechanically and fixedly connected to the heatsink, is also designed to be connected to a circuit board, particularly by soldering, and particularly by several connections.

[0035] In one embodiment, the unit to be cooled is connected to the heatsink by at least one of at least one soldered connection, at least one welded connection, or sintering. For example, if the heatsink is fixedly soldered to the unit to be cooled, the soldering allows for improved thermal bonding. Improved thermal bonding between the heatsink and the unit to be cooled can also be achieved, for example, by a welded connection or sintering.

[0036] In one embodiment, the unit to be cooled is connected to the heatsink by a layer of thermal paste. In this case as well, the ability to remove the heatsink from the cooling unit as needed can be advantageous.

[0037] In one embodiment, the electronic assembly described above has a circuit board to which the unit to be cooled is fixedly and mechanically connected. This fixed mechanical connection can be achieved, for example, by soldering the electrical terminals of the unit to be cooled to the circuit board. In this embodiment, the circuit board, the unit to be cooled, and the heat sink form a structural unit, which can, for example, be inserted as a whole into the cooling unit.

[0038] In one embodiment, the electronic assembly comprises a plurality of units to be cooled having fixed mechanical connections to a circuit board, and a plurality of heat sinks. The electronic assembly having the plurality of heat sinks can be inserted as a whole into a cooling unit. The cooling unit preferably has a plurality of containers designed to house the plurality of heat sinks. The fact that the electronic assembly can be removed from the cooling unit facilitates maintenance, for example.

[0039] In one embodiment, the cooling unit has at least one receiving device for at least one clamping means.

[0040] In one embodiment, the heatsink can be fastened by at least one fastening means that engage with at least one receiving device accessible from the side of a first cooling wall. If at least one fastening means engages with at least one receiving device on the side of a cooling unit, the heatsink can be fastened to, for example, a cooling unit.

[0041] In one embodiment, a fluid-tight seal between the first fluid connection and the second fluid connection can be achieved using at least one clamping means accessible from the side of the unit to be cooled. When at least one clamping means is accessible from the side of the unit to be cooled, the heat sink can be easily inserted into and removed from the cooling unit.

[0042] It is advantageous if the cooling unit has a container for the heatsink into which the heatsink can be inserted. This allows, for example, to securely fit the heatsink into the cooling unit.

[0043] In one embodiment, the cooling unit is configured to supply a coolant to multiple heat sinks and to remove the coolant from the multiple heat sinks.

[0044] In one embodiment, the cooling unit has multiple containers into which multiple heat sinks can be inserted. As a result, an electronic assembly having multiple heat sinks can be inserted entirely into the containers of the cooling unit.

[0045] In one embodiment, the cooling unit is made entirely or partially of metal, or entirely or partially of plastic material.

[0046] In one embodiment, a groove capable of pressing a pipe is provided within the cooling unit. The pipe may include, for example, a first passage for supplying a coolant and a second passage for discharging the coolant.

[0047] In one embodiment, the pipe wall is made of a material having high thermal conductivity, preferably copper, in whole or in large part, compared to other areas of the cooling unit. The high thermal conductivity of the pipe wall can further improve, for example, heat dissipation from the unit being cooled.

[0048] In one embodiment, the cooling unit comprises a dispersion unit having a first fluid port and a second fluid port. The dispersion unit is preferably configured to supply coolant to at least one heat sink and to discharge the returning coolant.

[0049] It is advantageous for the distribution unit to be configured as a cooling insert made of a material having high thermal conductivity compared to other areas of the cooling unit, preferably copper. For example, the cooling insert can be in thermal contact with the heat sink so that heat dissipation from the heat sink is improved by thermal contact with the cooling insert. This reduces costs and weight because the entire conveying unit does not need to be made from a more expensive and typically heavier material such as copper.

[0050] In one embodiment, the cooling unit includes a transport unit. The distribution unit can be inserted into the transport unit.

[0051] In one embodiment, the transport unit is made entirely or partially of copper, preferably aluminum.

[0052] In one embodiment, a cooling flow can be generated within the cooling device from a first fluid port to a coolant feed section, and then through a cooling passage and a coolant discharge section to a second fluid port. This cooling flow can be used, for example, to remove heat generated by the unit being cooled.

[0053] In one embodiment, the cooling unit is designed to supply a coolant, particularly a coolant, preferably coolant water, to a heat sink through a first fluid port and to discharge it from the heat sink through a second fluid port.

[0054] Further advantageous configurations are described in more detail below with reference to some exemplary embodiments shown in the drawings, but development thereon is not limited. Each case is schematically shown in the drawings. [Brief explanation of the drawing]

[0055] [Figure 1] This shows a longitudinal section passing through the unit to be cooled, the heatsink, and the cooling unit that supplies coolant to the heatsink. [Figure 2] The diagram shows a circuit board on which two cooling units are arranged, and the circuit board is removably mounted to the cooling units. [Figure 3] This shows an industrial process assembly having a heat sink, preferably a plasma process assembly or a heating assembly. [Figure 4a] A cross-sectional view of the circuit board on which the units to be cooled are located is shown together with the transport unit. [Figure 4b] This diagram shows the entire transport unit with the circuit boards arranged inside. [Figure 5] Another diagram of the transport unit is shown in a longitudinal section. [Figure 6]The image shows a cross-sectional view of the transport unit from a diagonal angle from below, revealing the cooling insert and the pipes for supplying the cooling insert fluid inside. [Figure 7] The image shows a cross-sectional view of the entire transport unit from a diagonal angle from below, allowing you to see the cooling insert, piping, and coolant connections inside.

[0056] In the following description of preferred embodiments of this development, the same reference numerals indicate the same or corresponding components.

[0057] Figure 1 shows a cross-sectional view of the cooling device. The cooling device includes a heatsink 5 configured to cool a unit 10 to be cooled, which is attached to the heatsink 5. The unit 10 to be cooled can be an electrical unit, preferably a semiconductor assembly.

[0058] The heatsink 5 is removably connected to the cooling unit 22. In the example shown in the drawings, the cooling unit 22 includes a distribution unit 20 designed to supply coolant to the heatsink 5. Furthermore, the cooling unit 22 includes a transport unit 21 into which the distribution unit 20 is inserted. The cooling unit 22 has a container 23 into which the heatsink 5 can be removably inserted. The heatsink 5 is then fastened to the cooling unit 22 by at least one fastening means 15, preferably by one or more screws. The cooling unit 22 has at least one receiving device 16 for at least one fastening means 15. To separate the heatsink 5 from the cooling unit 22, at least one fastening means 15 is first removed. The heatsink 5 can then be removed from the container 23 of the cooling unit 22 together with the unit 10 to be cooled to which it is attached.

[0059] The unit to be cooled 10 is preferably connected to the heatsink 5 mechanically and thermally. The unit to be cooled 10 can be connected to the heatsink 5 by, for example, one or more soldering connections. Another possibility is to connect the unit to be cooled 10 to the heatsink 5 by, for example, sintering. Alternatively, the unit to be cooled 10 can be soldered to the heatsink 5. As another alternative, though less advantageous, the unit to be cooled 10 can also be connected to the heatsink 5 by a layer of thermal paste. However, the result of this development is to make the connection between the unit to be cooled 10 and the heatsink 5 as thin as possible and with little additional material. In the course of the studies, simulations, and experiments for this development it became clear that this is particularly possible when the heatsink through which the fluid flows is fixedly connected to the unit to be cooled 10, especially by a material bond. This can be achieved, for example, by soldering, sintering, pressurization, or direct copper bonding (DCB). In this specification, the term “fixed” can mean “removable only destructively,” that is, using a connection means that cannot be removed even with tools without damaging any component of the unit 10 to be cooled or the heatsink 5, or both. It has been further recognized that such a solution is only feasible if a new solution can be found for the compatibility between the component circuit board 75 and the electronic components, in particular with the cooling unit 10 to which it is fastened. This is achieved using the proposed heatsink 5.

[0060] The heatsink 5 and the unit to be cooled 10, which is mechanically and fixedly connected to the heatsink 5, together form an electronic assembly 24. This electronic assembly 24 can be inserted into and removed from the container 23 of the cooling unit 22.

[0061] The cooling unit 22 is designed to supply a coolant to a heat sink 5 attached to the cooling unit 22, and to discharge the coolant after it has flowed through the heat sink 5. A first flow path 25 through which the coolant can be supplied to the heat sink 5 can be seen inside the cooling unit 22. A second flow path 30 through which the coolant can be discharged can be seen inside the cooling unit 22. The heat sink 5 has a cooling passage 35 through which the coolant can flow. A coolant feed section 40 is provided at the first end of the cooling passage 35, and a coolant discharge section 45 is provided at the second end of the cooling passage 35 opposite to the first end. The coolant feed section 40 and the coolant discharge section 45 are fluidically connected to the cooling passage 35.

[0062] The cooling unit 22 includes a first fluid port 41 fluidically connected to a first flow path 25 and a second fluid port 46 fluidically connected to a second flow path 30. When the heat sink 5 is inserted into the container 23 and subsequently tightened, a first fluid connection is made between the first fluid port 41 and the coolant feed section 40, and a second fluid connection is made between the second fluid port 46 and the coolant discharge section 45.

[0063] To seal the first fluidic connection, a first seal ring 42 is positioned in the groove 43 between the cooling unit 22 and the heat sink 5, and the seal ring 42 completely surrounds the first fluid port 41. A second seal ring 44, which completely surrounds the second fluid port 46, is similarly provided on the second fluid port 46 and positioned in the groove 43 between the cooling unit 22 and the heat sink 5. When at least one fastening means 15 is tightened, for example, when at least one screw is tightened, the heat sink 5 is pressed against the first fluid port 41 and the first seal ring 42, and the second fluid port 46 and the second seal ring 44. This pressure application creates a fluid-tight first fluidic connection and a fluid-tight second fluidic connection between the cooling unit 22 and the heat sink 5.

[0064] As shown in Figure 1, a cooling flow 36 can be created within the cooling device. The coolant flows from the first flow path 25 into the cooling passage 35 via the first fluid port 41 and the coolant feed section 40. The coolant flows through the cooling passage 35 and is discharged again via the coolant discharge section 45, the second fluid port 46, and the second flow path 30.

[0065] The heat sink 5 has a first cooling wall 50 on the side facing the unit 10 to be cooled. On the side of the heat sink 5 that is away from the unit 10 to be cooled, a cooling passage 35 is demarcated by a second cooling wall 55 on the opposite side from the first cooling wall 50. Preferably, the second cooling wall 55 is configured parallel to the first cooling wall 50.

[0066] In the example shown in Figure 1, the unit 10 to be cooled includes an arrangement of transistors 60. The heat generated during the operation of the transistors 60 is dissipated through a coolant flowing through the cooling passage 35.

[0067] To improve heat exchange between the coolant flowing through the cooling passage 35 and the heat sink 5, a plurality of cooling pins 65 extending into the cooling passage 35 from the first cooling wall 50 and / or the second cooling wall 55 can be placed within the cooling passage 35. The cooling pins 65 allow the coolant to flow around them, ensuring improved thermal coupling between the heat sink 5 and the coolant.

[0068] As can be seen in Figure 1, the unit 10 to be cooled is also located within the first recess 70 of the circuit board 75, together with the heat sink 5 positioned below it.

[0069] The arrangement of the unit to be cooled 10 within the first recess 70 of the circuit board 75 can be clearly seen in Figure 2. Figure 2 shows the circuit board 75 arranged in the cooling unit 22. The unit to be cooled 10 is shown in a longitudinal section together with the associated heat sink 5 within the first recess 70 of the circuit board 75. The heat sink 5 is inserted into the container 23 of the cooling unit 22.

[0070] In addition to the unit 10 to be cooled, another unit 80 to be cooled can be seen in Figure 2, along with an additional heatsink 85 positioned beneath it. The additional unit 80 to be cooled is located in an additional recess 90 provided in the circuit board 75, and the associated additional heatsink 85 is inserted into an additional container 92 of the cooling unit 22. The additional heatsink 85 has additional cooling passages 95 through which the coolant flows. Electrical connection terminals 105 provided for making an electrical connection between the additional unit 80 to be cooled and the circuit board 75 can be seen further on the additional unit 80 to be cooled. The unit 10 to be cooled also has electrical connection terminals for connection to the circuit board 75, but these are not shown in Figure 2.

[0071] The cooling unit 22 shown in Figure 2 is designed to supply coolant to multiple heatsinks and then discharge the coolant after it has flowed through the heatsinks. In the example in Figure 2, the cooling unit 22 is designed to supply coolant to both heatsink 5 and an additional heatsink 85, and then discharge it from both heatsink 5 and the additional heatsink 85. The cooling unit 22 is specifically designed to distribute the coolant uniformly among the various heatsinks.

[0072] The additional heatsink 85 is also fluidly connected to the cooling unit 22 when it is clamped into the additional container 92. In the cross-sectional view of Figure 2, it can be seen that the additional cooling passage 95 is connected to the second flow path 30 via an additional coolant discharge section 100 and an additional second fluid port 102, through which the coolant is discharged.

[0073] Figure 1 shows that a plurality of cooling pins 65 extending from the first cooling wall 50 into the cooling passage 35 can be arranged within the cooling passage 35 or in part of the cooling passage 35.

[0074] Figure 1 also shows that the plurality of cooling pins 65 may comprise at least one cooling pin of a first category, oriented in a first inclination direction that is oblique to a perpendicular to the first cooling wall 50.

[0075] Figure 1 also shows that the cooling pins among the multiple cooling pins 65 can be arranged such that one cooling pin among the multiple cooling pins 65 does not intersect with another cooling pin among the multiple cooling pins 65.

[0076] Figure 1 also shows that the plurality of cooling pins 65 may comprise at least one cooling pin of a second category oriented in a second inclination direction different from the first inclination direction, which is inclined obliquely with respect to a perpendicular to the first cooling wall. In this embodiment, the plurality of pins 65 comprises a first category of cooling pins oriented in the first inclination direction and a second category of cooling pins oriented in the second inclination direction. The different orientations of the cooling pins create flow patterns in the cooling passage 35 that have been found to be advantageous for efficient heat dissipation.

[0077] Figure 1 also shows that a plurality of cooling pins 65 can be arranged such that cooling pins of a first category overlap with cooling pins of a second category in a viewing angle parallel to the cooling wall, particularly in a viewing angle in the direction of coolant flow. In this specification, “overlapping” means that at least one cooling pin of the first category covers another cooling pin of the second category at least partially in a given viewing direction. Such an arrangement can improve the turbulence of the coolant in the cooling pins, and as a result, can improve heat transfer from the cooling pins to the coolant.

[0078] Figure 1 also shows that a plurality of cooling pins 65 can be arranged such that cooling pins of a first category mix with two cooling pins of a second category in a viewing angle parallel to the cooling wall, particularly in a viewing angle in the direction of coolant flow. In this specification, the term “mixed” means that at least one first cooling pin of the first category at least partially covers a second cooling pin of the second category in a given viewing direction, and that the first cooling pin itself is also at least partially covered by further cooling pins of the second category in a given viewing direction. Such an arrangement can further improve turbulence of the coolant in the cooling pins and, as a result, heat transfer from the cooling pins to the coolant.

[0079] The circuit board 75 shown in Figure 2, together with the units 10 and 80 to be cooled and the heat sinks 5 and 85 fastened to the circuit board 75, forms a structural unit that can be installed in and removed from the cooling unit 22, and is therefore releasably connected to the cooling unit 22. When this structural unit is installed in the cooling unit 22, the heat sinks 5 and 85 attached to the units 10 and 80 to be cooled are inserted into the corresponding containers 23 and 92 of the cooling unit 22. Subsequently, the heat sinks 5 and 85 are fastened to the cooling unit 22 by at least one fastening means 15, and once the heat sinks 5 and 85 are fastened to the cooling unit 22, a fluid connection is created between each heat sink 5 and 85 and the cooling unit 22 for supplying and discharging coolant. The cooling unit 22 is designed to uniformly supply coolant to all the heat sinks 5 and 85 of the structural unit and to discharge the coolant after it has flowed through the heat sinks 5 and 85.

[0080] Figure 3 shows an industrial process assembly 1, preferably a plasma process assembly or a heating assembly.

[0081] Industrial process assembly 1 is -Power converter 4, -The load 2, preferably a plasma process or heating process, for example, an induction or microwave heating process, is electrically connected to the power converter 4 so that the power converter 4 can supply the necessary power to the load 2. -Optionally, it has an additional adaptive unit 3 connected between the power converter 4 and the load 2.

[0082] The power converter 4 is - Heatsink 5 as described above and below, -A cooling unit 22 having one or more distribution units 20 and transport units 21, as described above and below. -Circuit board 75, - The unit to be cooled 10, in particular an electrical unit, preferably a semiconductor assembly, preferably one having power semiconductor components, -Having further electronic components 8a, 8b, 8c, Further electronic components 8a, 8b, 8c and the unit 10 to be cooled are located on or on the circuit board 75 and connected to electrical contacts. The unit 10 to be cooled is fixedly attached to the heatsink 5, particularly by a physical bond.

[0083] Figure 4a shows another view of the circuit board 75 from an upward oblique angle, allowing a portion of the transport unit 21 to be seen. Furthermore, the cross-sectional view in Figure 4a shows that the pipe 110 is housed in a groove 115 provided for this purpose on the underside of the transport unit 21.

[0084] The heat sinks 5 and 85 are preferably made of metal, more preferably of copper. Alternatively, the heat sinks 5 and 85 may be made of, for example, stainless steel, nickel, or molybdenum. The transport unit 21 may be made of, for example, metal, either entirely or partially, but the transport unit may also be made of plastic material, either entirely or partially. The transport unit 21 is preferably made of aluminum, either entirely or partially. The walls of the pipe 110 are preferably made of copper.

[0085] Figures 4b and 5 show the entire transport unit 21, with the circuit board 75 visible together with units 10 and 80. The transport unit 21 is provided with a first coolant connection 120 for supplying coolant and a second coolant connection 122 for discharging coolant. A longitudinal section through the unit 10 to be cooled, shown in Figure 5, also shows the heat sink 5, the first flow path 25, and the second flow path 30. Furthermore, some of the pipes 110 located on the underside of the transport unit 21 can be seen in the cross-sectional view of Figure 5.

[0086] Figures 6 and 7 show two perspective views of the transport unit 21 viewed from below. Figure 6 shows the units 10 and 80 to be cooled and the heat sinks 5 and 85. Figures 6 and 7 show that the dispersion unit is shaped like a cooling insert 132, which is preferably made of a metal with high thermal conductivity, preferably copper. The cooling insert 132 is inserted into the transport unit 21.

[0087] The container 23 for the heatsink 5 and the further container 92 for the further heatsink 85 are part of the cooling insertion 132. The heatsink 5 is fastened to the cooling insertion 132 by at least one fastening means 15. The heatsink 5 is preferably tightly screwed to the cooling insertion 132. Using the copper cooling insertion 132 in the areas where the heatsinks 5 and 85 are positioned allows for improved heat dissipation from the heatsinks 5 and 85.

[0088] When a cooling insert 132 made of copper is used, the structure provided for fluid contact with the heat sinks 5 and 85 is located within the cooling insert 132. In this regard, a first flow path 25, a first fluid port 41, a second flow path 30, a second fluid port 46, and a further second fluid port 102 are formed within the cooling insert 132. A pipe 110 pressed against a groove 115 provided for this purpose on the underside of the transport unit 21 can be seen further in Figures 6 and 7. The pipe wall of the pipe 110 is preferably made of a metal with high thermal conductivity, preferably copper. The pipe 110 is more preferably connected to the cooling insert 132 and is designed to supply cold coolant to the cooling insert 132 and discharge heated coolant.

[0089] Figure 7 shows the entire transport unit 21 as viewed from below. In addition to the cooling insertion 132 and the pipe 110 pressed into the groove 115, Figure 7 also shows the coolant connections 120 and 122 for supplying and discharging the coolant.

[0090] The features disclosed in the above description, claims, and drawings may be important both individually and in any combination to implement various configurations of the development.

Claims

1. A heat sink (5) for dissipating heat from a unit (10) to be cooled, particularly an electrical unit, preferably a semiconductor assembly, wherein the heat sink (5) - cooling path (35), - A first cooling wall (50) is positioned on the side of the cooling passage (35) facing the unit (10) to be cooled. - It has a coolant feed section (40) and a coolant discharge section (45), and both the coolant feed section (40) and the coolant discharge section (45) are fluidly connected to the cooling passage (35) to supply and discharge a coolant, particularly a coolant, preferably a coolant water. The heat sink (5) is - The unit (10) to be cooled can be connected to the first cooling wall (50) mechanically and thermally. - The heat sink (5) can be releasably fastened to a cooling unit (22) having a first fluid port (41) and a second fluid port (46), - When the heat sink (5) is fastened to the cooling unit (22), a first fluid connection can be made between the coolant feed portion (40) of the heat sink (5) and the first fluid port (41) of the cooling unit (22), and a second fluid connection can be made between the coolant discharge portion (45) of the heat sink (5) and the second fluid port (46) of the cooling unit (22), - When the heat sink (5) is tightened to the cooling unit (22), a fluid-tight seal is simultaneously created between the first fluid connection and the second fluid connection. - The heat sink (5) is designed to be mechanically fixed to the unit to be cooled (10), which is fixedly connected to the circuit board (75) via a connection.

2. The heat sink (5) according to claim 1, characterized in that the heat sink (5) can be removably fastened to the cooling unit (22) by at least one fastening means (15), preferably by at least one screw.

3. The heat sink (5) according to claim 1 or 2, characterized in that the fluid-tight sealing of the first fluid connection and the second fluid connection can be manufactured using at least one clamping means (15) accessible from the side of the first cooling wall (50).

4. The heat sink (5) is configured such that when the heat sink (5) is fastened to the cooling unit (22), a cooling flow (36) can be generated from the first fluid port (41) to the coolant feed section (40), and then through the cooling passage (35) and the coolant discharge section (45) to the second fluid port (46), as described in any one of claims 1 to 3.

5. The heat sink (5) according to any one of claims 1 to 4, characterized in that the heat sink (5) is made of a metal, preferably copper.

6. An electronic assembly (24) comprising a heat sink (5) according to any one of claims 1 to 5, and a unit to be cooled (10) which is mechanically and fixedly connected to the heat sink (5) and at the same time designed to be fixedly connected to a circuit board (75) by connection, particularly by soldering.

7. The electronic assembly (24) according to claim 6, characterized in that the unit (10) to be cooled is connected to the heat sink (5) by at least one of at least one soldering connection, at least one welding connection, or sintering.

8. The electronic assembly (24) according to claim 6 or 7, further comprising a circuit board (75) to which the unit (10) to be cooled is mechanically and fixedly connected.

9. A cooling unit (22) for supplying a coolant, particularly a coolant liquid, preferably coolant water, to a heat sink (5) having a coolant feed section (40) and a coolant discharge section (45), wherein the cooling unit (22) - First channel (25) and second channel (30), - A first fluid port (41) fluidically connected to the first flow path (25), - Having a second fluid port (46) that is fluidly connected to the second flow path (30), The cooling unit (22) is - The heat sink (5) can be releasably fastened to the cooling unit (22), - When the heat sink (5) is fastened to the cooling unit (22), a first fluid connection can be made between the coolant feed portion (40) of the heat sink (5) and the first fluid port (41) of the cooling unit (22), and a second fluid connection can be made between the coolant discharge portion (45) of the heat sink (5) and the second fluid port (46) of the cooling unit (22), - When the heat sink (5) is tightened to the cooling unit (22), a fluid-tight seal is simultaneously created between the first fluid connection and the second fluid connection. - The cooling unit (22) is designed so that the heat sink (5) can be mechanically fixed to the cooling unit (10) which is fixedly connected to the circuit board (75) via a connection.

10. The cooling unit (22) according to claim 9, characterized in that it is configured to supply a coolant to a plurality of cooling elements (5) and to discharge the coolant from the plurality of cooling elements (5).

11. - The cooling unit (22) according to claim 9 or 10, comprising a distribution unit (20) having the first fluid port (41) and the second fluid port (46).

12. The cooling unit (22) according to claim 11, characterized in that the distribution unit (20) is configured as a cooling insert (132) made of a material having high thermal conductivity compared to other areas of the cooling unit (22), preferably copper.

13. - A cooling unit (22) according to any one of claims 9 to 12, comprising a transport unit (21).

14. A cooling device, - Measuring device (22) according to any one of claims 9 to 13, A cooling device comprising a heat sink (5) releasably fastened to a cooling unit (22) according to any one of claims 1 to 5.

15. A power converter (4) for an industrial process assembly (1), preferably a plasma process assembly, or a heating assembly, - Heat sink (5) according to any one of claims 1 to 5, - Circuit board (75), - The unit to be cooled (10), in particular an electrical unit, preferably a semiconductor assembly, preferably one having power semiconductor components, - Having further electronic components (8a, 8b, 8c), The further electronic components (8a, 8b, 8c) and the unit to be cooled (10) are located on or on the circuit board (75) and connected to electrical contacts. The unit to be cooled (10) has a fixed, particularly physically bonded, connection to the heat sink (5), and the unit to be cooled (10) is simultaneously fixedly connected to the circuit board (75) by several connections, particularly by soldering, to the power converter (4).

16. A power converter (4) according to claim 15, having a cooling unit (22) according to any one of claims 9 to 13.

17. A power converter (4) according to claim 16, having the cooling device according to claim 14.

18. A power converter (4) according to any one of claims 15 to 17, further comprising a heat sink (85) having the features of the heat sink (5) according to any one of claims 1 to 5.

19. A further electronic assembly having the features of the electronic assembly (24) according to any one of claims 6 to 8, the power converter (4) according to any one of claims 15 to 18.

20. A method for assembling a cooling device, - A heat sink (5, 85) for dissipating heat from a unit to be cooled (10, 80), particularly an electrical unit, preferably a semiconductor assembly, comprising a cooling passage (35, 95), a coolant feed section (40) fluidly connected to the cooling passage (35, 95), and a coolant discharge section (45) fluidly connected to the cooling passage (35, 95), - Starting with a cooling unit (22) having a first fluid port (41) and a second fluid port (46), The aforementioned method, A method comprising: releasably fastening the heat sink (5, 85) to the cooling unit (22), wherein when the heat sink (5, 85) is fastened to the cooling unit (22), a first fluid connection is created between the coolant feed portion (40) of the heat sink (5, 85) and the first fluid port (41) of the cooling unit (22), and a second fluid connection is created between the coolant discharge portion (45) of the heat sink (5, 85) and the second fluid port (46) of the cooling unit (22), and when the heat sink (5, 85) is fastened to the cooling unit (22), a fluid tightness is simultaneously created between the first fluid connection and the second fluid connection.

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