MEMS probe

Abstract

The MEMS probe according to the present invention comprises a head, a base, and a cantilever arm. The head comprises a contact portion that contacts the electrode terminals of the product to be inspected, and an identification portion for CCD identification provided on one side of the contact portion, the identification portion being provided on the cantilever arm side. The cantilever arm is formed extending horizontally from the base and comprises a cantilever beam connected to the contact portion, with a height difference between the connection fixing point between the cantilever beam and the contact portion and the connection fixing point between the cantilever beam and the base, and the cantilever arm and the base are integrated. The beneficial effect of the present invention is that the probe of the present invention improves the accuracy and precision of CCD identification, and effectively controls the contact surface with the PAD, thereby reducing the probability of damaging the semiconductor circuit to be inspected.

Description

[Technical Field]

[0001] The present invention belongs to the technical field of semiconductors, and specifically relates to MEMS probes. [Background Art]

[0002] With the advancement of semiconductor technology, integrated circuit chips are continuously developing toward higher speed and higher integration. Accordingly, requirements for wafer test systems, such as high frequency, fine pitch, and parallel testing, are increasing. Probes are indispensable components for packaging testing of integrated circuit chips, and probes using MEMS technology have been developed to improve the efficiency of testing before packaging of integrated circuit products. The grip of such probes can greatly increase the number of probes, thereby improving the efficiency of packaging testing for integrated circuit chips. The basic principle of a MEMS probe structure is that MEMS technology is employed to fabricate micron-sized movable probes. Through interaction between the probes and an object to be inspected, inspection, positioning, and identification of the object to be inspected are performed. Existing MEMS probes are usually provided with a head that contacts the product to be inspected, and an identification portion for CCD identification is attached to one side of the head. However, in actual use, it has been found that the identification accuracy of CCD with respect to the identification portion is low. [Summary of the Invention] [Problem to be Solved by the Invention]

[0003] The present invention provides a MEMS probe capable of improving inspection accuracy and reducing the probability of damaging a semiconductor circuit to be inspected. [Means for Solving the Problem]

[0004] The object of the present invention is achieved by the following technical solution.

[0005] The MEMS probe according to the present invention includes a head, a base, and a cantilever arm, The head comprises a contact portion that contacts the electrode terminals of the product to be inspected, and an identification portion for CCD identification provided on one side of the contact portion, the identification portion is provided with identification protrusions having different spacings, and the contact portion and the surface of the product to be inspected are provided with an angled cross section. The base is used to attach the MEMS probe so as to be fixed to the MEMS probe substrate. The cantilever arm portion connects the head portion and the base portion, and is formed extending horizontally from the base portion and includes a cantilever beam connected to the contact portion. There is a difference in height between the connection and fixing point between the cantilever beam and the contact portion and the connection and fixing point between the cantilever beam and the base portion, and the cantilever arm portion and the base portion are integrated.

[0006] Preferably, the cross-sectional size of the identification protrusions is the same.

[0007] Preferably, the identification projection comprises an inclined portion that slopes toward the contact portion and a vertical identification head positioned above the inclined portion.

[0008] Preferably, at least three of the identification protrusions are provided and are arranged in a linear fashion.

[0009] Preferably, the cross-sectional area of ​​the contact portion gradually increases from top to bottom and includes a first surface provided at an angle to the product contact surface and a second surface provided at an angle to the product contact surface, the first surface and the second surface are provided on both sides of the product contact surface, the second surface is provided at the proximal end of the identification projection, and the surface of the second surface is arc-shaped.

[0010] Preferably, the angle between the first surface and the vertical product contact surface is in the range of -5° to 10°, and the angle between the second surface and the vertical product contact surface is in the range of 5° to 45°. [Effects of the Invention]

[0011] The beneficial effect of the present invention is that the probe improves the accuracy and precision of CCD identification, and effectively controls the contact surface with the PAD, thereby reducing the probability of damaging the semiconductor circuit being inspected. [Brief explanation of the drawing]

[0012] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used to describe the embodiments are briefly introduced below. Obviously, the drawings described below represent only a few embodiments of the present invention. Those skilled in the art can obtain other drawings based on these without any creative effort.

[0013] [Figure 1] This is a structural diagram according to the present invention. [Figure 2] This is an enlarged structural diagram of the head according to the present invention. [Figure 3] This is a structural diagram that better illustrates the cantilever beam according to the present invention. [Modes for carrying out the invention]

[0014] To further clarify the object, technical concept and advantages of the present invention, the invention will be described in more detail below with reference to the attached Figures 1 to 3 and embodiments. It should be understood that the specific embodiments described herein are used solely for the purpose of interpreting the invention and are not intended to limit it.

[0015] The MEMS probe according to the present invention comprises a head, a base 2, and a cantilever arm connecting the head and the base.

[0016] The head portion comprises a contact portion 11 that contacts the electrode terminals of the product to be inspected, and an identification portion 12 for CCD identification provided on one side of the contact portion 11, the identification portion being provided on the cantilever arm portion side. The base portion 3 is used to attach the MEMS wafer test probe so as to fix the MEMS wafer test probe to the probe substrate. The cantilever arm portion comprises a cantilever beam formed to extend horizontally from the base portion and connected to the contact portion. There is a difference in height between the connection fixing point between the cantilever beam and the contact portion 11 and the connection fixing point between the cantilever beam and the base portion, and the cantilever arm portion and the base portion are integrated.

[0017] The identification unit is composed of identification protrusions having different spacings. Specifically, at least three of the identification protrusions are provided and are arranged in a straight line. The cross-sectional size of the identification protrusions is the same. The identification protrusion includes an inclined portion 121 that slopes toward the contact portion and a vertical identification head 122 positioned above the inclined portion 121. The cross-sectional size of the identification head 122 is uniform, and there is a difference in spacing between adjacent identification heads 122. As shown in Figure 2, the spacing C between the first identification head and the second identification head is different from the spacing D between the second identification head and the third identification head. In this embodiment, the spacing C is larger than the spacing D. By using identification heads with a uniform cross-sectional size, errors due to differences in shape and size can be reduced, and the different spacings between the identification heads make CCD identification and judgment easier, and unnecessary misrecognition with the probe contact portion can be avoided.

[0018] The contact portion 11 has an angled cross-section with respect to the surface of the product to be inspected. The cross-sectional area of ​​the contact portion gradually increases from top to bottom and includes a first surface 111 that is angled with respect to the product contact surface and a second surface 112 that is angled with respect to the product contact surface. The first surface 111 and the second surface 112 are each installed on both sides of the product contact surface A, and the second surface 112 is installed at the proximal end of the identification projection, and the surface of the second surface is gently curved, that is, the tip of the contact portion is R-shaped. The angle between the first surface 111 and the vertical surface B of the product contact is in the range of -5° to 10°, and the angle between the second surface 112 and the vertical surface B of the product contact is in the range of 5° to 45°.

[0019] In the present invention, the cantilever beam includes a first cantilever beam 31, a second cantilever beam 32, and a third cantilever beam 33. Each cantilever beam is provided with a minimum cross-sectional area, which is located between the base connection fixing point and the end connection fixing point. Here, the first cantilever beam 31 is provided in an arc shape with a certain arc angle, and the height of the location where the end connection fixing point 312 between the first cantilever arm and the contact head is located is lower than the height of the location where the base connection fixing point 311 between the first cantilever arm and the base is located. The second cantilever beam 32 and the third cantilever beam 33 are S-shaped. The heights of the locations where the connection fixing points with the contact heads of the second cantilever beam 32 and the third cantilever beam 33 are located are both higher than the heights of the locations where the connection fixing points with the bases of the second cantilever beam 32 and the third cantilever beam 33 are located. The end connection fixing point 322 of the second cantilever arm is higher than the base connection fixing point 321 of the second cantilever arm, and the end connection fixing point 332 of the third cantilever arm is higher than the base connection fixing point 331 of the third cantilever arm.

[0020] An extending inclination angle E at the position where the base fixing point of said second cantilever beam 32 is located is smaller than an extending inclination angle F at the position where the base fixing point of the third cantilever beam 33 is located. The inclination angle refers to the angle formed between a connecting line from the base as the starting point to the contact head as the end and a horizontal line. In the cantilever beam of the present invention, as the probe contact portion continuously wears during the inspection process, the cantilever is caused to tilt toward the cantilever arm side. At the same time, in combination with the structural characteristics of the contact portion, the risk that the contact portion deviates from the PAD region is further reduced, and the possibility of damaging the semiconductor circuit to be inspected is also reduced.

[0021] Finally, it should be explained that the directional or positional relationships indicated by terms such as "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" are the directional or positional relationships shown based on the drawings, which are only used to describe the present invention and simplify the description, and do not indicate or imply that the illustrated device or element must have a specific orientation and be constructed and operated in a specific orientation, therefore, they shall not be construed as a limitation to the present invention. In addition, the terms "first", "second" and "third" are used for descriptive purposes only, and shall not be construed as indicating or implying relative importance.

[0022] It should be noted that the above embodiments are not intended as limitations, but are only used to describe the technical solution of the present disclosure. The present disclosure has been described in detail with reference to the above embodiments, but those skilled in the art should understand that it is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent substitutions on some of the technical features, and such modifications or substitutions do not make the essence of the corresponding technical solutions depart from the concept and scope of the embodiments of the present invention.

Claims

1. A MEMS probe comprising a head, a base, and a cantilever arm, The head comprises a contact portion that contacts the electrode terminals of the product to be inspected, and an identification portion for CCD identification provided on one side of the contact portion, the identification portion is provided with identification protrusions having different spacings, and the contact portion and the surface of the product to be inspected are provided with an angled cross section. The base is used to attach the MEMS probe so as to be fixed to the MEMS probe substrate. The MEMS probe is characterized in that the cantilever arm portion connects the head portion and the base portion, is formed extending horizontally from the base portion and includes a cantilever beam connected to the contact portion, there is a height difference between the connection fixing point between the cantilever beam and the contact portion and the connection fixing point between the cantilever beam and the base portion, and the cantilever arm portion and the base portion are integrated.

2. The MEMS probe according to claim 1, characterized in that the cross-sectional size of the identification protrusions is the same.

3. The MEMS probe according to claim 2, characterized in that the identification projection comprises an inclined portion that slopes toward the contact portion and a vertical identification head positioned above the inclined portion.

4. The MEMS probe according to claim 3, characterized in that at least three of the aforementioned identification protrusions are provided and are arranged in a linear manner.

5. The MEMS probe according to claim 4, characterized in that the cross-sectional area of ​​the contact portion gradually increases from top to bottom and includes a first surface provided at an angle to the product contact surface and a second surface provided at an angle to the product contact surface, the first surface and the second surface are each provided on both sides of the product contact surface, the second surface is provided at the proximal end of the identification projection, and the surface of the second surface is arc-shaped.

6. The MEMS probe according to claim 5, characterized in that the angle between the first surface and the vertical product contact surface is in the range of -5° to 10°, and the angle between the second surface and the vertical product contact surface is in the range of 5° to 45°.

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