Gas flow valve and its operating method

Abstract

Specific embodiments of this disclosure relate to a gas flow valve. The gas flow valve includes a housing configured to receive a flow of gas. The gas flow valve further includes a plunger configured to move between a closed position and one or more open positions within the housing. The gas flow valve further includes a position sensor configured to measure a distance relating to the difference in the position of the plunger between the closed position and one or more open positions. The gas flow valve further includes a force sensor coupled to the plunger and configured to measure the force exerted by the plunger on a sealing surface in the sealed position.

Description

Technical Field

[0001]

[0001] Embodiments of the present disclosure generally relate to valves for controlling gas flow. Background Art

[0002]

[0002] Various manufacturing systems (e.g., manufacturing systems for semiconductor applications) may include gas flow valves for controlling the amount of gas flowed into a processing chamber, for example. The gas flow valve may be actuated based on a controller input. A controller may use sensor data, such as flow sensor data, to actuate the gas flow valve to meet a target flow rate. In some manufacturing systems, process gas (e.g., gas used during semiconductor manufacturing processes) and / or cleaning gas (e.g., gas used to clean chambers used in manufacturing manufactured devices and / or electronic devices) may require not only an accurate delivery target including a high mass flow rate, but also the ability to accurately control low flow rates. Furthermore, gas flow valves suffer from wear and leakage caused by particles carried in the gas flow. These particles can damage the valve and other downstream components. Summary of the Invention

[0003]

[0003] Certain embodiments of the present disclosure relate to a gas flow valve including a housing configured to receive a gas flow. The gas flow valve further includes a plunger configured to move within the housing between a closed position and one or more open positions. The gas flow valve further includes a position sensor configured to measure a distance associated with a difference in position of the plunger between the closed position and the one or more open positions. The gas flow valve further includes a force sensor coupled to the plunger and configured to measure a force exerted by the plunger on a sealing surface in a closed position.

[0004]

[0004] In another aspect of the present disclosure, a gas flow assembly includes a valve including a housing configured to receive a flow of gas. The valve further includes a plunger configured to move between a closed position and one or more open positions within the housing. The valve further includes a position sensor configured to measure a distance relating to the difference in the position of the plunger between the closed position and one or more open positions. The valve further includes a force sensor coupled to the plunger and configured to measure the force exerted by the plunger on a sealing surface in the sealed position. The gas flow assembly further includes a particle trap forming a chamber configured to separate particles from the gas flow. The gas flow assembly further includes a processing device configured to actuate the valve to control the gas flow based on sensor data from one or more of the position sensors or force sensors.

[0005]

[0005] In another aspect of the present disclosure, the method includes receiving position data from a position sensor configured to measure a distance relating to the difference in position of a plunger of a gas valve configured to move between a closed position and one or more open positions. The method further includes receiving force data from a force sensor coupled to the plunger and configured to measure the force exerted by the plunger on a sealing surface in the closed position. The method further includes driving the plunger between the closed position and one or more open positions based on one or more of the position data or force data.

[0006]

[0006] The present disclosure is illustrated, not limited, in the drawings of the accompanying drawings, and similar reference numerals in the accompanying drawings indicate similar elements. Different references to “an” or “one” embodiment in the present disclosure do not necessarily refer to the same embodiment, and such references mean at least one. [Brief explanation of the drawing]

[0007] [Figure 1]

[0007] An exemplary system according to an embodiment of the present disclosure, including a processing chamber, a gas source, and a flow control device, is shown. [Figure 2A]

[0008] This is a schematic diagram of a gas stick assembly according to an embodiment of the present disclosure. [Figure 2B]

[0009] This is a perspective view of a gas stick assembly according to an embodiment of the present disclosure. [Figure 3A]

[0010] This is a cross-sectional side view of a gas flow valve assembly according to an embodiment of the present disclosure. [Figure 3B] This is a side cross-sectional view of a gas flow valve assembly according to an embodiment of the present disclosure. [Figure 4]

[0011] Figures A and B show side cross-sectional views of a gas flow valve according to an embodiment of the present disclosure. [Figure 5A]

[0012] This is a flow diagram of a method for controlling a gas flow valve according to an embodiment of the present disclosure. [Figure 5B] This is a flow diagram of a method for controlling a gas flow valve according to an embodiment of the present disclosure. [Figure 6]

[0013] A computer system for use in accordance with the embodiments of this disclosure is shown in the following diagram. [Modes for carrying out the invention]

[0008]

[0014] Embodiments described herein relate to gas flow valves (also known as gas flow control valves, proportional gas flow control valves, etc.), gas flow systems incorporating such gas flow valves, and methods for controlling gas flow valves. Generally, proportional control of gas flow into systems such as substrate manufacturing systems is advantageous. Conventional gas flow control valves are passive devices that operate based on control inputs (e.g., from a controller). The control inputs are typically based on target gas flow and flow sensor data. However, conventional gas flow control valves can suffer from low accuracy, insufficient repeatability, reliability, and poor cleanability.

[0009]

[0015] Gas flow control valves often wear out over time with continuous use. For example, the sealing surfaces inside the valve can deteriorate and / or erode, leading to mechanical or electrical hysteresis within the valve. This hysteresis causes valve performance to drift, resulting in incorrect or unexpected gas flow rates passing through the valve in response to controller operation. Furthermore, deterioration of the valve's sealing surfaces can cause gas leaks. These leaks worsen over time, not only further damaging the valve but also potentially introducing gas into the manufacturing process when the gas valve should be closed. In addition, deterioration of conventional gas flow control valves can generate particles. These particles are carried by the gas flow and can further damage the valve, cause valve reliability issues, or damage downstream manufacturing processes and / or related components, and / or contaminate substrates during processing. Conventional gas flow control valves lack internal sensors that can detect valve wear and / or particles, so the effects of valve wear and / or particles are not adequately compensated for by conventional control algorithms. Therefore, conventional gas flow control valves can suffer from inaccuracies, particularly as the integrity of their internal components deteriorates or wears down over time. Compensating for valve wear and performance degradation over time would be advantageous.

[0010]

[0016] Aspects and embodiments of the present disclosure address the aforementioned and other drawbacks of conventional gas flow valves by providing a gas flow control valve having one or more sensors and / or actuators. In some embodiments, the gas flow control valve includes a housing. The housing may have one or more internal passages for receiving a gas flow. The gas may be a process gas such as nitrogen or argon. The gas may be a corrosive gas, for example, a gas used in a substrate etching process. In some embodiments, the flow control valve housing includes movable mechanical components such as a plunger assembly and one or more sensors for measuring one or more metrics related to the valve. In some embodiments, the housing includes one or more actuators that remove particles from the valve by vibrating one or more valve components to shake off particles. In some embodiments, the housing includes a particle trap for trapping particles. In some embodiments, the housing further includes one or more sealing surfaces that stop the gas flow (e.g., when the valve is closed). In some embodiments, one or more sealing surfaces include an elastomer seal that is contacted by the plunger assembly when the valve is closed (e.g., when the plunger assembly is in the closed position).

[0011]

[0017] In some embodiments, a plunger assembly (e.g., a plunger) is configured to move within the housing between a closed position (e.g., when the valve is closed) and one or more open positions (e.g., when the valve is open). While in the closed position, the bottom surface of the plunger contacts the sealing surface of the gas flow valve, blocking the flow of gas through the housing. The plunger can be moved to one or more open positions to allow gas to flow. In some embodiments, increasing the distance from the sealing surface to the bottom surface of the plunger can increase the gas flow rate through the valve. In some embodiments, the plunger is moved by an actuator (e.g., an electric actuator or a pneumatic actuator). In some embodiments, an electromagnetic coil coupled to the housing is energized to move the plunger. In some embodiments, the electromagnetic coil induces an electromagnetic force on the plunger to overcome the spring force that holds the plunger in a normally closed or normally open position. In some embodiments, a controller opens and closes the plunger to proportionally control the flow of gas through the valve.

[0012]

[0018] In some embodiments, the position sensor is configured to measure the position of the plunger. In some embodiments, the position sensor measures the position of the plunger relative to the position sensor. For example, the position sensor may measure the distance between the position sensor and the surface of the plunger. In some embodiments, the position sensor is a capacitive displacement sensor located within a housing. The position sensor is located within a housing above the plunger (e.g., opposite the sealing surface) and may measure the distance between the sensor and the top of the plunger. Sensor data from the position sensor may be transmitted to a controller. Since the distance between the top and bottom of the plunger (e.g., the length or height of the plunger) is known, the controller can determine the distance between the bottom of the plunger and the sealing surface of the gas flow control valve. Thus, the controller can determine how much the valve is "open" based on the position sensor data.

[0013]

[0019] In some embodiments, a force sensor is coupled to the bottom of the plunger. In some embodiments, the force sensor can measure the force exerted by the plunger on the sealing surface in the closed position. In some embodiments, the force sensor is a piezoelectric module that outputs an electrical signal corresponding to the sensed force. In some embodiments, the force sensor is coupled to the bottom of the plunger. When the plunger is in the closed position, the force sensor can contact the sealing surface of the valve to stop the gas flow. In some embodiments, the force sensor can be induced to vibrate by supplying an electric current to the sensor. For example, a piezoelectric module can vibrate when an electric current is supplied. In some embodiments, the vibration of the force sensor can shake off particles on the sealing surface. The shaken-off particles can be carried away by the gas flow. In this case, the force sensor acts as an actuator, actively removing particles from the valve by vibrating the valve components.

[0014]

[0020] In some embodiments, the integrity of the sealing surface can be determined based on force sensor data and position sensor data (e.g., by a controller). In some embodiments, the controller can use the force data and position data to calculate a stress-strain curve of the sealing surface. The calculated stress-strain curve can be compared to a stress-strain curve of a good-condition sealing surface. In some embodiments, if the calculated stress-strain curve does not meet a threshold criterion (e.g., the calculated stress-strain curve is substantially different from a known good-condition stress-strain curve), the controller can determine that the sealing surface has deteriorated beyond the threshold condition. In some examples, the controller can determine that an elastomer sealing surface (e.g., an O-ring seal) is worn or deteriorated when the stress-strain curve calculated using force data and position data does not meet a threshold condition.

[0015]

[0021] In some embodiments, the controller may determine that the valve is leaking based on force sensor data. In some embodiments, when a leak occurs between the sealing surface and the plunger, the force sensor detects a variation in the applied force. The controller may identify these force variations as a leak. In some embodiments, the controller closes the plunger with a greater force to stop the leak (e.g., drives it to the closed position).

[0016]

[0022] In some embodiments, the particle trap is coupled to the outlet of a gas flow valve. The particle trap may have a chamber for inducing a cyclone flow within the chamber. In some embodiments, centrifugal force may cause particles to move outward on the outer radius side of the chamber and come into contact with the chamber wall. The chamber wall may be rough so that particles adhere to it. In some embodiments, the particles are collected in a removable (e.g., detachable) receptacle, which can be periodically removed to dispose of the collected particles. A substantially particle-free gas may flow through a collection tube in the chamber of the particle trap and be discharged from the system.

[0017]

[0023] Embodiments of this disclosure offer advantages over the conventional systems described above. Specifically, several embodiments described herein provide gas flow control valves that can be operated based on sensor data collected from an integrated sensor. For example, the plunger of a valve described herein can be driven to open to a target position based on position data received from a position sensor. In another embodiment, the plunger can be closed more firmly based on force data received from a force sensor. In several embodiments described herein, the gas flow control valve can monitor the integrity of the sealing surface using one or more of the position sensors or force sensors by comparing a calculated stress-strain curve to a threshold criterion (e.g., a known good value), which can be advantageous in avoiding unplanned downtime for replacing valve components. In several embodiments described herein, the gas flow valve can detect leaks and perform appropriate actions to improve leaks, such as applying greater force to close the valve. In several embodiments described herein, the gas flow valve includes an in-situ particle cleaning function for shaking off particles, making the valve cleaner than conventional gas flow valves. In some embodiments, the gas flow valve includes a particle trap for collecting particles in the gas flow, supplying a cleaner gas with fewer particles compared to conventional gas flow valves. In some embodiments, due to the advantages of the gas flow valves described herein, the manufacturing system can process substrates more accurately with fewer errors and less scrap, resulting in improved overall system throughput. The gas flow control valves described in at least some embodiments herein can provide improved precision, improved repeatability, improved reliability, and / or improved cleanliness compared to conventional gas flow control valves. For example, the gas flow control valves described in some embodiments herein can avoid mechanical and / or electrical hysteresis, reduce component wear, and / or reduce the accumulation of contaminants. As a result, one or more of the aforementioned improvements over conventional flow control valves may be achieved.

[0018]

[0024] FIG. 1 illustrates a system 100 including a processing chamber 101, a gas source 160, and a flow control device (e.g., a gas stick assembly 200) according to an embodiment of the present disclosure. The processing chamber 101 may be used for processes where a corrosive plasma environment is provided. For example, the processing chamber 101 may be a chamber for a plasma etching apparatus or plasma etching reactor, a plasma cleaner, or the like. In alternative embodiments, other processing chambers, which may or may not be exposed to a corrosive plasma environment, may be used. Some examples of chamber components include chemical vapor deposition (CVD) chambers, physical vapor deposition (PVD) chambers, ALD chambers, IAD chambers, etching chambers, and other types of processing chambers. In some embodiments, the processing chamber 101 may be any chamber used in electronic device manufacturing systems.

[0019]

[0025] In one embodiment, the processing chamber 101 includes a chamber body 102 and a showerhead 130 that encloses an interior space 106. The showerhead 130 includes a showerhead base and a showerhead gas distribution plate (GDP), and may have a plurality of gas supply holes 132 (also referred to herein as channels) distributed across the GDP. Alternatively, the showerhead 130 may be replaced with a lid and nozzles in some embodiments, or with a plurality of pie-shaped showerhead segments and a plasma generation unit in other embodiments. The chamber body 102 may be fabricated from aluminum, stainless steel, titanium, or other suitable materials. The chamber body 102 generally includes a sidewall 108 and a bottom 110.

[0020]

[0026] To protect the chamber body 102, an outer liner 116 may be disposed adjacent to the sidewall 108. The outer liner 116 may be fabricated to include one or more apertures. In one embodiment, the outer liner 116 is fabricated from aluminum oxide.

[0021]

[0027] The exhaust port 126 is defined within the chamber body 102, and can couple the internal space 106 to a pump system 128. The pump system 128 may include one or more pumps and throttle valves used for exhausting the internal space 106 of the processing chamber 101 and adjusting the pressure within the internal space 106.

[0022]

[0028] A gas source 160 is coupled to the processing chamber 101, and can supply process gas and / or cleaning gas into the internal space 106 through the showerhead 130 via a supply line 112. A flow controller may be coupled to the gas source 160 and the processing chamber 101. The flow controller may be used to measure and control the flow of gas from the gas source 160 into the internal space 106. Exemplary flow controllers are described in further detail below with reference to FIGS. 2A-2B. In some embodiments, the flow controller includes the gas flow valve described herein. In some embodiments, one or more gas panels 160 may be coupled to the processing chamber 101 to supply gas into the internal space 106. In such embodiments, one or more flow control systems may be coupled to each gas source 160 and the processing chamber 101. In other embodiments, a single flow controller may be coupled to one or more gas panels 160. In some embodiments, the flow controller may include a flow ratio controller for controlling gas flow into the processing chamber 101 (e.g., through one or more supply lines 112) or into another processing chamber.

[0023]

[0029] In some embodiments, a separate flow controller is used for each gas supplied to the processing chamber. In embodiments, each flow controller is or includes a gas stick assembly, as described and illustrated below with respect to FIGS. 2A-2B.

[0024]

[0030] The shower head 130 may be supported on the side wall 108 of the chamber body 102. The shower head 130 (or lid) may be open to allow access to the internal space 106 of the processing chamber 101, and may seal the processing chamber 101 when closed. A gas source 160 may be coupled to the processing chamber 101 to supply process gas and / or cleaning gas to the internal space 106 through the shower head 130 or the lid and nozzle (e.g., through openings in the shower head or the lid and nozzle).

[0025]

[0031] In some embodiments, one or more sensor assemblies 170 may be located within the internal space 106. For example, one or more sensor assemblies 170 may be located near the shower head 130 (e.g., within 10 cm of the shower head 130). In another example, one or more sensor devices may be located near the substrate 144 (e.g., within 10 cm of the substrate 144) and used to monitor conditions near the reaction site.

[0026]

[0032] In one embodiment, the substrate support assembly 148 includes a pedestal 152 supporting an electrostatic chuck 150. The electrostatic chuck 150 further includes a thermally conductive base and an electrostatic pack coupled to the thermally conductive base by a coupling (which may be a silicone coupling in one embodiment). The thermally conductive base and / or electrostatic pack of the electrostatic chuck 150 may include one or more optional embedded heating elements, embedded insulation, and / or conduits to control the lateral temperature profile of the substrate support assembly 148. The electrostatic pack may further include a plurality of gas passages, such as grooves, mesas, and other surface features that may be formed on the upper surface of the electrostatic pack. The gas passages may be in fluid communication with a heat transfer (or backside) gas supply source, such as helium, through holes opened in the electrostatic pack. During operation, backside gas may be supplied into the gas passages at a controlled pressure to enhance heat transfer between the electrostatic pack and the support substrate 144. The electrostatic chuck 150 may include at least one clamp electrode controlled by a chuck power supply.

[0027]

[0033] Figure 2A shows a schematic diagram of a gas stick assembly according to an embodiment of the present disclosure. Multiple gas stick assemblies may receive gas from multiple gas sources. For example, a processing device may include different gas stick assemblies for each type of gas supplied into the processing chamber. As shown, the gas flows from left to right through the gas stick assemblies. In some embodiments, the gas stick assembly 200 includes a hybrid valve 201, which may be a first component of the gas stick assembly 200. The hybrid valve may include a manual valve and an automatically actuated valve (e.g., a pneumatic valve, an electric valve, etc.). The hybrid valve 201 may receive gas from a gas source (not shown). The hybrid valve 201 may direct the gas to a purge valve 202 through one or more passages. The purge valve 202 may be configured to purge the gas stick assembly 200. In some embodiments, the gas stick assembly 200 includes a regulator 203. The regulator 203 may receive gas from the purge valve 202. The regulator 203 can regulate the flow of gas through the gas stick assembly 200. In some embodiments, a filter 204 is coupled downstream of the regulator 203 and receives the gas flow from the regulator 203. In some embodiments, an upstream valve 205 can receive gas from the regulator 203 and direct the gas flow to a mass flow controller 206. The mass flow controller 206 can control the flow of gas through the gas stick assembly 200. In some embodiments, a downstream valve 207 receives gas from the mass flow controller or other upstream components. The downstream valve 207 can direct the gas toward a gas supply destination (e.g., a processing chamber (not shown)). In some embodiments, one or more of the hybrid valve 201, the upstream valve 205, or the downstream valve 207 include one or more integrated sensors, such as force sensors and / or position sensors as described herein.In some embodiments, one or more of the hybrid valve 201, the upstream valve 205, or the downstream valve 207 are actuated based on force sensor data and / or position sensor data as described herein. In some embodiments, one or more of the hybrid valve 201, the upstream valve 205, or the downstream valve 207 include a particle trap configured to trap particles in the gas flow.

[0028]

[0034] Figure 2B shows a perspective view of a gas stick assembly 200 according to an embodiment of the present disclosure. Multiple gas stick assemblies may receive gas from multiple gas sources. For example, a processing device may include different gas stick assemblies for each type of gas supplied into the processing chamber. As shown, the gas flows through the gas stick assemblies from left to right.

[0029]

[0035] In some embodiments, the gas stick assembly 200 includes a base 209. The gas stick assembly 200 can receive gas (e.g., from a gas source) via a gas coupling 208. In some embodiments, the gas stick assembly 200 includes a hybrid valve 201, a purge valve 202, a regulator 203, a filter 204, an upstream valve 205, a mass flow controller 206, and / or a downstream valve 207. In some embodiments, each of the hybrid valve 201, purge valve 202, regulator 203, filter 204, upstream valve 205, mass flow controller 206, and / or downstream valve 207 is coupled to the gas stick assembly base 209.

[0030]

[0036] Figure 3A shows a cross-sectional side view of a gas flow valve assembly 300A according to an embodiment of the present disclosure. In some embodiments, the gas flow valve assembly includes a housing 302 that accommodates various mechanical and / or sensor components. In some embodiments, a plunger 304 is located within the housing 302. The plunger 304 may be made of iron. In some embodiments, the plunger 304 is a magnetized iron or steel rod. The housing 302 may include a base 312 having one or more internal passages through which gas can flow. In some embodiments, the base 312 is constructed of stainless steel. In some embodiments, the base 312 is welded to the housing 302. In some embodiments, gas enters through a gas inlet 362 and exits through a gas outlet 364. When the plunger 304 is in one or more open positions (e.g., as shown), gas can flow through a sealing surface 314. In some embodiments, the sealing surface 314 is made of an elastomer seal, such as an O-ring seal. In some embodiments, the elastomer seal is bonded to a groove formed in the base 312.

[0031]

[0037] In some embodiments, the electromagnetic coil 308 may induce an electromagnetic force to move the plunger 304 against a spring force. In some embodiments, the electromagnetic coil 308 may be excited by an electric current and / or voltage. In some embodiments, the spring 306 holds the plunger 304 in the normally closed position. In some embodiments, the spring 306 holds the plunger 304 in the normally open position. The spring 306 may include one or more springs. In some embodiments, the spring 306 is a coil spring that presses against the upper surface of the plunger 304. In some embodiments, the spring 306 is made from a substantially corrosion-resistant metal such as stainless steel.

[0032]

[0038] In some embodiments, the bellows 310A is configured to separate a first internal portion of the housing 302 from a second internal portion of the housing 302. In some embodiments, the bellows 310A separates the gas flow portion of the valve assembly 300A from the sealed portion of the valve assembly 300A. In some embodiments, the bellows 310A flexes as the plunger 304 moves between a closed position and one or more open positions. For example, the flexing of the bellows 310 is shown in Figures 4A and 4B. Figure 4A shows a side section view of a gas flow valve 400A according to an embodiment of the present disclosure. Figure 4B shows a side section view of a gas flow valve 400B according to an embodiment of the present disclosure. Figure 4A shows the plunger 304 in the open position, while Figure 4B shows the plunger 304 in the closed position. In some embodiments, the bellows 310A is compressed when the plunger 304 is in the open position, as shown in Figure 4A. In some embodiments, the bellows 310A is in an extended state when the plunger 304 is in the closed position, as shown in Figure 4B. When the plunger 304 is in the closed position, the flow of gas through the valve may be stopped. The plunger 304 and / or force sensor 332 form a seal with the sealing surface 314 when in the closed position, stopping the flow of gas. In some embodiments, the bellows 310A is a metal bellows. The bellows 310A may be substantially corrosion-resistant. In some embodiments, the bellows 310A may be made from stainless steel. In some embodiments, the bellows 310A is coupled to a part of the housing 302. In some embodiments, the bellows 310A is welded to the housing 302.

[0033]

[0039] Referring to Figure 3B, a cross-sectional side view of a gas flow valve assembly 300B according to an embodiment of the present disclosure is shown. In some embodiments, a diaphragm 310B separates the gas flow portion of the valve assembly 300B from the sealed portion of the valve assembly 300B. In some embodiments, the diaphragm 310B flexes as the plunger 304 moves between a closed position and one or more open positions. In some embodiments, the diaphragm 310B is a metal diaphragm. The diaphragm 310B may be substantially corrosion-resistant. In some embodiments, the diaphragm 310B may be made of stainless steel. In some embodiments, the diaphragm 310B is coupled to a base 312. In some embodiments, the diaphragm 310B is coupled between the base 312 and a housing 302. In some embodiments, the diaphragm 310B is welded to the housing 302 and / or base 312.

[0034]

[0040] Referring again to Figure 3A, in some embodiments, the position sensor 334 is coupled to the bottom of the cap 303 at the top of the housing 302. In some embodiments, the position sensor 334 is bonded by one or more mechanical fasteners and / or adhesive or binder. In some embodiments, the position sensor 334 is screwed onto the cap 303. In some embodiments, the position sensor 334 measures the position of the plunger 304. In some embodiments, the position sensor 334 is a capacitive displacement sensor. In some embodiments, the capacitive displacement sensor is a non-contact measuring device that can measure the position and / or change in position of a conductive target. In some embodiments, the position data collected by the position sensor 334 is transmitted to the controller 340 (e.g., via wired, wireless, etc.). In some embodiments, the controller 340 determines the position of the plunger 304 based on the position data. In some embodiments, the controller 340 moves the plunger based on the position data. In some examples, the controller 340 provides an output signal to the electromagnetic coil 308 to move the plunger 304. The controller may receive position data (e.g., from position sensor 334) indicating that the plunger 304 is in a non-target position. The controller may determine a new output signal to the electromagnetic coil (e.g., based on the received position data) and move the plunger 304 to the target position. In some embodiments, the controller 340 may determine the distance between the sealing surface 314 and the bottom surface of the plunger 304 (e.g., the bottom surface of the force sensor 332 coupled to the bottom surface of the plunger 304). For example, the controller 340 may use the position data and a known height (e.g., length) of the plunger 304 to estimate the gap between the bottom surface of the plunger 304 and the sealing surface 314. The controller 340 may move the plunger 304 (e.g., by providing an output signal to the electromagnetic coil 308) to increase or decrease the size of the gap.

[0035]

[0041] In some embodiments, the force sensor 332 is coupled to the bottom of the plunger 304. In some embodiments, the force sensor 332 is coupled to a second end opposite the first end of the plunger, where a spring 306 applies force to the first end of the plunger 304. In some embodiments, the force sensor 332 is coupled to the bottom of the plunger 304 by an epoxy layer 352. The epoxy layer 352 may be an adhesive layer for coupling the force sensor 332 to the plunger 304. In some embodiments, the force sensor 332 is coupled to the plunger 304 by one or more mechanical fasteners. In some embodiments, the force sensor 332 is a piezoelectric module. In some embodiments, the piezoelectric module includes one or more crystals configured to convert mechanical energy into electrical energy. In some embodiments, the piezoelectric module is configured to sense an applied force.

[0036]

[0042] In some embodiments, the force sensor 332 is configured to measure the force applied by the plunger 304. In some embodiments, the force sensor 332 senses the amount of force applied by the plunger 304 to the sealing surface 314 when the plunger 304 is in the closed position, as shown in Figure 4B. In some embodiments, when the plunger 304 is in the closed position, the force sensor 332 contacts the sealing surface 314 to block the flow of gas through the valve. In some embodiments, an electrical signal indicating the magnitude of the force applied to the sealing surface 314 is sent to the controller 340. In some embodiments, one or more wires passing through the plunger 304 via the through-hole 305 electrically connect the force sensor 332 to the controller 340.

[0037]

[0043] In some embodiments, the controller 340 may determine whether there is a leak at the sealing surface 314 when the plunger 304 is in the closed position. A gas leak (e.g., a gas leak through the sealing surface 314 when the plunger 304 is in the closed position) may induce vibrations that are sensed by the force sensor 332. These vibrations may be supported by small fluctuations in the applied force, which are sensed by the force sensor 332. In some embodiments, if the controller 340 determines that there is a gas leak, the controller 340 may cause the plunger 304 to increase the force it exerts on the sealing surface. The controller 340 may also cause the plunger to exert a greater force on the sealing surface 314 (e.g., via the force sensor 332) by sending a signal to the electromagnetic coil 308 to increase the current and / or voltage applied to the electromagnetic coil 308, or by decreasing the current and / or voltage applied to the electromagnetic coil 308.

[0038]

[0044] In some embodiments, the controller 340 may determine the integrity of the seal surface 314 using force data from the force sensor 332 and position data from the position sensor 334. In some embodiments, the controller 340 calculates a stress-strain curve for the seal surface 314. In some embodiments, the controller 340 may sense the displacement (e.g., strain) of the seal surface 314 as the force (e.g., stress) applied on the seal surface 314 increases as the plunger 304 moves to the closed position. To calculate the stress-strain curve, the controller 340 may correlate the strain indicated by the position data (e.g., position data from the position sensor 334) with the stress indicated by the force data (e.g., force data from the force sensor 332). In some embodiments, the controller 340 compares the calculated stress-strain curve with a known healthy stress-strain curve for the seal surface 314. A known healthy stress-strain curve may correspond to the stress-strain curve of a seal surface 314 in good condition, such as when it is new or unused. The known healthy stress-strain curve may be associated with a threshold criterion for comparison with the calculated stress-strain curve. As the seal surface 314 deteriorates over time and / or with use, the stress-strain curve may drift and / or change. In some embodiments, the controller 340 may determine the health of the seal surface 314 based on the drift and / or change in the stress-strain curve. In some embodiments, the controller may determine that the seal surface 314 is unhealthy in response to determining that the calculated stress-strain curve exceeds a threshold condition. When the seal surface is unhealthy, the controller 340 may output a notification (e.g., to a technician) that the seal surface 314 should be maintained or replaced.

[0039]

[0045] In some embodiments, the controller 340 may determine the health of the spring 306 using force data from the force sensor 332. In some embodiments, the spring 306 provides a force that moves the plunger 304 to the closed position. The spring force (e.g., the spring force from the spring 306) can hold the plunger 304 closed to stop the flow of gas. The force sensor 332 may sense the spring force applied by the spring 306 to hold the plunger 304 in the closed position. As the spring 306 wears down with use, the spring force applied by the spring 306 may decrease over time. The force data may indicate this decrease in spring force. In some embodiments, the controller 340 may determine the state of the spring 306 based on the force data indicating the spring force. The controller 340 may determine that the spring 306 is in an unhealthy state if the force indicated by the force data (e.g., from the force sensor 332) falls below a threshold. In some embodiments, the controller 340 may output a notification that the spring 306 should be serviced or replaced when the spring is in an unhealthy state.

[0040]

[0046] In some embodiments, the controller 340 may initiate a self-cleaning procedure to shake off particles from the sealing surface 314. In some embodiments, the controller may generate vibrations in the force sensor 332 and send a command (e.g., an electronic signal) to shake off particles from the sealing surface 314. For example, if the force sensor 332 is a piezoelectric module, the controller may send an electrical signal to the piezoelectric module to excite a piezoelectric crystal and generate vibrations. The vibrations may shake off particles that have accumulated on the sealing surface 314. The gas flow through the valve may carry away the shaken-off particles from the sealing surface 314. In some embodiments, the plunger 304 is opened so that particles are shaken off, thereby allowing the force sensor 332 to contact the sealing surface 314 but not forming a seal to stop the gas flow. The vibrations generated in the force sensor 332 shake off the particles, and the flowing gas may carry away the shaken-off particles.

[0041]

[0047] In some embodiments, the particle trap 320 is coupled to the base 312. In some embodiments, a gas containing particles flows into the particle trap 320 through an inlet and enters the separator module 322. The particles are separated from the flowing gas and can be collected in a removable receptacle 324. The substantially particle-free gas can flow upward through a collection tube 326 and be discharged from a gas outlet 364. In some embodiments, a cyclone or vortex is induced in the gas flow within the separator module 322. In some embodiments, a cyclone flow is induced within the separator module 322 by introducing the gas flow into the module tangentially. The cyclone flow in the gas flow can cause particles to be pressed against the walls of the separator module 322 by centrifugal force. In some embodiments, the walls of the separator module 322 are rough so that particles adhere to the walls. In some embodiments, the particles descend the walls of the separator module 322 and fall into the removable receptacle 324. The removable receptacle 324 may be configured to be removed periodically for cleaning. In some embodiments, the removable receptacle 324 can be removed from the separator module 322, and the collected particles can be emptied from the removable receptacle 324. In some embodiments, the removable receptacle 324 is coupled to the separator module 322 by one or more mechanical fasteners. In some embodiments, a seal, such as an O-ring seal, seals the interface between the separator module 322 and the removable receptacle 324. In some embodiments, the separator module 322 is coupled to the top of the particle trap 320 by one or more mechanical fasteners. In some embodiments, a seal (e.g., an O-ring seal, an elastomer seal, etc.) seals the interface between the separator module 322 and the top of the particle trap 320. In some embodiments, the top of the particle trap 320 couples the particle trap 320 to the base 312.In some embodiments, the separator module 322, the detachable receptacle 324, the top of the particle trap 320, and / or the collection tube 326 are made from a substantially corrosion-resistant metal such as stainless steel.

[0042]

[0048] Figures 5A and 5B are flowcharts of a method for controlling a gas flow valve according to embodiments of the present disclosure. Figure 5A is a flowchart of a method 500A for controlling a gas flow valve, such as a gas flow valve assembly 300A, 300B or a flow valve 400A or 400B, according to embodiments of the present disclosure. In some embodiments, method 500A is performed by processing logic including hardware (e.g., circuits, dedicated logic, programmable logic, microcode, processing devices, etc.), software (e.g., instructions executed on a processing device, a general-purpose computer system, or a dedicated machine), firmware, microcode, or a combination thereof. In some embodiments, method 500A is performed at least in part by a controller of the gas flow valve assembly (e.g., controller 340).

[0043]

[0049] For the sake of simplicity, Method 500A is illustrated and described as a series of steps. However, the steps according to this disclosure may be performed in various orders and / or simultaneously and in conjunction with other steps not presented and described herein. Furthermore, in some embodiments, not all illustrated steps are performed in order to carry out Methods 500A-D according to the disclosed subject matter. Furthermore, those skilled in the art will understand and recognize that Method 500A may alternatively be represented as a series of interrelated states or events via a state diagram.

[0044]

[0050] In some embodiments, in block 502, the processing logic receives position data from a position sensor. The position sensor may be configured to measure a distance related to the difference in position of a gas flow valve plunger configured to move between a closed position and one or more open positions. In some embodiments, the position sensor is a static capacitive displacement sensor. In some embodiments, the position data indicates the position of the plunger relative to the sensor.

[0045]

[0051] In some embodiments, in block 504, the processing logic receives force data from a force sensor. In some embodiments, the force sensor is coupled to a plunger. The force sensor can measure the force exerted on the sealing surface by the plunger in the closed position. In some embodiments, the force sensor is a piezoelectric module that outputs an electrical signal in response to sensing the applied force.

[0046]

[0052] In some embodiments, in block 506, the processing logic drives the plunger between a closed position and one or more open positions based on one or more position data or force data. In some embodiments, the processing logic opens the plunger to a more open or less open position based on the position data. In some embodiments, the processing logic closes the plunger based on position data indicating that it is in an open position. In some embodiments, the processing logic causes the plunger to exert a greater force on the sealing surface in response to force data indicating a gas leak or insufficient sealing force.

[0047]

[0053] Figure 5B is a flowchart of a method 500B for controlling a gas flow valve, such as a gas flow valve assembly 300A, 300B or a flow valve 400A or 400B, according to embodiments of the present disclosure. In some embodiments, method 500B is performed by processing logic including hardware (e.g., circuits, dedicated logic, programmable logic, microcode, processing devices, etc.), software (e.g., instructions executed by a processing device, a general-purpose computer system, or a dedicated machine), firmware, microcode, or a combination thereof. In some embodiments, method 500B is performed at least in part by a controller of the gas flow valve assembly (e.g., controller 340).

[0048]

[0054] For the sake of simplicity, Method 500B is illustrated and described as a series of steps. However, the steps according to this disclosure may be performed in various orders and / or simultaneously, and in conjunction with other steps not presented and described herein. Furthermore, in some embodiments, not all illustrated steps are performed in order to carry out Method 500B in accordance with the disclosed subject matter. Furthermore, those skilled in the art will understand and recognize that Method 500B may alternatively be represented as a series of interrelated states or events via a state diagram.

[0049]

[0055] In some embodiments, in block 512, the processing logic, in response to receiving position data indicating that the plunger is located in a non-target position, drives the plunger of the gas valve substantially to the target position. In some embodiments, the processing logic determines (for example, based on position data received in block 502) that the plunger position does not coincide with the target plunger position. The processing logic may drive the plunger so that the plunger position substantially coincides with the target plunger position.

[0050]

[0056] In some embodiments, in block 514, the processing logic drives the plunger in response to receiving force data indicating a gas leak, increasing the force exerted on the seal surface. In some embodiments, the processing logic determines that gas is leaking beyond the seal surface (for example, based on force data received in block 504). The processing logic may determine that a leak is present based on force data that reflects variations in the force exerted by the plunger on the seal surface. To stop the leak, the processing logic may cause the plunger to exert a greater force on the seal surface.

[0051]

[0057] In some embodiments, in block 516, the processing logic determines the state of the elastomer seal on the sealing surface based on a stress-strain curve calculated using position data and force data. In some embodiments, when the plunger is driven to the closed position, the processing logic calculates the stress-strain curve using position data and / or force data received from the position sensor and / or force sensor. In some embodiments, the processing logic compares the calculated stress-strain curve to a baseline stress-strain curve (e.g., a known healthy stress-strain curve, a threshold criterion, etc.) to determine the state of the elastomer seal. In some embodiments, the processing logic outputs a notification indicating the state of the elastomer seal (e.g., to a technician). This notification may be output if the calculated stress-strain curve does not meet the threshold criterion.

[0052]

[0058] In some embodiments, in block 518, the processing logic vibrates a piezoelectric module to shake off particles from the sealing surface. In some embodiments, the piezoelectric module is a force sensor. In some embodiments, the vibration of the piezoelectric module shakes off particles from the sealing surface. The shaken-off particles may be carried away by the gas flow. The piezoelectric module may be vibrated when force data and / or position data indicate to the processing logic that there are excess particles on the sealing surface. The shaken-off particles may be collected in a particle trap.

[0053]

[0059] Figure 6 shows a schematic representation of a machine in an exemplary form of computer system 600 in which a set of instructions (for example, to cause the machine to perform one or more of the methods discussed herein) may be executed. In alternative embodiments, the machine may be connected to other machines in a LAN, WAN, intranet, extranet, or the Internet (e.g., network connection). The machine may operate as a server or client machine in a client-server network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. The machine may be a personal computer (PC), tablet PC, PDA, mobile phone, web appliance, server, network router, switch or bridge, or any machine capable of executing (sequentially or otherwise) a set of instructions specifying the actions to be taken by that machine. Furthermore, although only a single machine is shown, the term “machine” should also be understood to include any collection of machines that independently or jointly execute one or more sets of instructions in order to perform one or more of the methods described herein. Some or all components of computer system 600 may be utilized or exemplified by any of the electronic components described herein.

[0054]

[0060] An exemplary computer system 600 includes a processing device (processor) 602, main memory 604 (e.g., ROM, flash memory, dynamic random access memory (DRAM) (synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM))), static memory 606 (e.g., flash memory, static random access memory (SRAM)), and data storage device 620, which communicate with each other via a bus 610.

[0055]

[0061] Processor 602 represents one or more general-purpose processing devices, such as a microprocessor or a central processing device. More specifically, processor 602 may be a composite instruction set arithmetic (CISC) microprocessor, a reduced instruction set arithmetic (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a processor implementing other instruction sets, or a processor implementing a combination of instruction sets. Processor 602 may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), or a network processor. Processor 602 is configured to execute instruction 640 for performing the operations described herein.

[0056]

[0062] The computer system 600 may further include a network interface device 608. The computer system 600 may also include a video display unit 612 (e.g., a liquid crystal display (LCD), a cathode ray tube (CRT), or a touchscreen), an alphanumeric input device 614 (e.g., a keyboard), a cursor control device 616 (e.g., a mouse), and a signal generating device 622 (e.g., a speaker).

[0057]

[0063] The power device 618 may monitor the power level of a battery used to power the computer system 600 or one or more of its components. The power device 618 may provide one or more interfaces to provide a power level display, a time window remaining before one or more of the computer system 600 or its components are shut down, a power consumption rate, an indicator of whether the computer system is using an external power source or battery power, and other power-related information. In some embodiments, the display associated with the power device 618 may be remotely accessible (e.g., accessible via a remote backup management module over a network connection). In some embodiments, the battery utilized by the power device 618 may be a local or remote uninterruptible power supply (UPS) for the computer system 600. In such embodiments, the power device 618 may provide information regarding the power level of the UPS.

[0058]

[0064] The data storage device 620 may include a computer-readable storage medium 624 (e.g., a non-transient computer-readable storage medium) that stores one or more sets of instructions 640 (e.g., software) that embody any one or more of the methods or functions described herein. These instructions 640 may also reside, all or at least partially, in the main memory 604 and / or the processor 602 during their execution by the computer system 600. The main memory 604 and the processor 602 also constitute a computer-readable storage medium. The instructions 640 may further be transmitted or received over the network 630 via the network interface device 608. Although the computer-readable storage medium 624 is shown as a single medium in the exemplary embodiments, it should be understood that the computer-readable storage medium 624 may include a single medium or multiple mediums (e.g., a centralized or distributed database, and / or associated caches and servers) that store one or more instruction sets 640.

[0059]

[0065] Numerous details are specified in the preceding description. However, it will be apparent to a person skilled in the art who has benefited from this disclosure that the disclosure can be implemented without these specific details. While specific embodiments have been described herein, it should be understood that these are illustrative and not limiting. The scope and area of ​​this application should not be limited by any of the embodiments described herein, but should be defined solely by the following claims and any subsequent claims and their equivalents. Indeed, from the above description and accompanying drawings, a person skilled in the art will see various other embodiments and modifications of this disclosure in addition to those described herein. Therefore, such other embodiments and modifications are intended to be within the scope of this disclosure.

[0060]

[0066] This specification has been partially referenced to the accompanying drawings, which illustrate specific embodiments for illustrative purposes. While these disclosed embodiments are described in sufficient detail to enable those skilled in the art to carry them out, it should be understood that these examples are not limiting, allowing for the use of other embodiments and modifications to the disclosed embodiments without departing from their spirit and scope. For example, blocks of the methods shown and described herein may not be performed in the order shown in some other embodiments. In addition, in some other embodiments, the disclosed methods may include more or fewer blocks than described. As another example, some blocks described herein as separate blocks may be combined in some other embodiments. Conversely, what may be described herein as a single block may be implemented in multiple blocks in some other embodiments. Furthermore, the conjunction “or” is intended to have an inclusive meaning where appropriate, unless otherwise indicated. That is, the expression “A, B, or C” is intended to include the possibilities of “A,” “B,” “C,” “A and B,” “B and C,” “A and C,” and “A, B, and C.”

[0061]

[0067] In this specification, the terms “example” or “exemplary” are used to mean an example, instance, or illustration. A configuration or design described herein as “example” or “exemplary” is not necessarily construed as being preferable or more advantageous than other configurations or designs. Rather, the terms “example” or “exemplary” are intended to illustrate a concept concretely. Where the terms “about / approximately” or “approximately” are used herein, this means that the presented nominal values ​​are accurate to within ±10%.

[0062]

[0068] Furthermore, the article “a / an” as used herein and in the appended claims should generally be interpreted as meaning “one or more” unless otherwise specified or unless the context makes it clear that it refers to a singular form. Throughout this specification, references to “an embodiment / one embodiment,” “some embodiments,” or “certain embodiments” indicate that a particular feature, structure, or characteristic described in relation to an embodiment is included in at least one embodiment. Thus, while the phrases “one embodiment,” “some embodiments,” or “certain embodiments” appear in various places throughout this specification, they do not necessarily all refer to the same embodiment.

[0063]

[0069] Some parts of the detailed description may be expressed in terms of algorithms and representations of operations on data bits in computer memory. Descriptions and representations of these algorithms are methods used by those skilled in the field of data processing to most effectively convey the content of the invention to others skilled in the art. An algorithm, as used herein, is generally understood to be a consistent set of steps that produce a desired result. Such operations require the physical manipulation of physical quantities. While not always the case, these quantities typically take the form of electrical or magnetic signals that can be stored, transferred, combined, compared, and otherwise manipulated. These signals have proven convenient, primarily for reasons of common use, to be represented as bits, values, elements, symbols, characters, terms, numbers, etc.

[0064]

[0070] However, it should be noted that all of these terms and similar terms should be associated with appropriate physical quantities and are merely convenient labels applied to those physical quantities. As is evident from the following descriptions, unless otherwise specified, throughout this specification, the terms "receiving," "retrieving," "transmitting," "computing," "generating," "processing," "reprocessing," "adding," "subtracting," "multiplying," "dividing," "optimizing," "calibrating," "detecting," "performing," and "analyzing" are used. Descriptions using terms such as "determining," "enabling," "identifying," "modifying," "transforming," "applying," "causing," "storing," and "comparing" are understood to refer to the operations and processes of a computer system or similar electronic computing device that manipulate data represented as physical quantities (such as electron quantities) in the registers and memory of a computer system to convert it into other data similarly represented as physical quantities in the memory or registers of a computer system, or other such information storage, transmission device, or display device.

[0065]

[0071] Furthermore, although this disclosure is described herein in the context of specific embodiments in specific environments for specific purposes, those skilled in the art will recognize that its usefulness is not limited thereto, and that this disclosure can, advantageously, be carried out for any number of purposes in any number of environments. Accordingly, the claims described below should be interpreted in light of the entire scope and spirit of this disclosure as described herein, and the entire scope of equivalents to which such claims are entitled.

Claims

1. It is a gas flow valve, A housing configured to accept the flow of gas, A plunger configured to move between a closed position and one or more open positions within the housing, A position sensor configured to measure a distance related to the difference in the position of the plunger between the closed position and one or more open positions, A force sensor coupled to the plunger and configured to measure the force exerted on the sealing surface by the plunger in the closed position, A gas flow valve equipped with a gas flow valve.

2. A particle trap forming a chamber configured to separate particles from the gas flow, wherein at least a portion of the particle trap is configured to be removed for cleaning. The gas flow valve according to claim 1, further comprising:

3. The gas flow valve according to claim 2, wherein the particle trap is configured to guide a cyclone into the gas flow within the chamber in order to separate the particles from the gas flow by centrifugal force.

4. The gas flow valve according to claim 1, wherein the force sensor is coupled to a first end of the plunger and is configured to contact the elastomer seal of the sealing surface when the plunger is in the closed position, and the distance includes the distance between the position sensor and a second end of the plunger opposite to the first end.

5. A spring within the housing is configured to hold the plunger in the closed position or in one of the one or more open positions, An electromagnetic coil configured to drive the plunger between the closed position and one or more open positions in response to being excited by an electric current, The gas flow valve according to claim 1, further comprising:

6. One or more metal bellows or metal diaphragms configured to separate a first portion of the housing from a second portion of the housing, wherein the plunger is positioned within the first portion of the housing and gas flows through the second portion of the housing. The gas flow valve according to claim 1, further comprising:

7. The force sensor, When the plunger is in the closed position, it contacts the sealing surface and measures the force exerted on the sealing surface by the plunger, To shake off particles from the sealing surface, vibrations are generated on the sealing surface in response to excitation. A gas flow valve according to claim 1, which is a piezoelectric module configured to perform the following:

8. The gas flow valve according to claim 1, wherein the position sensor is a static capacitive displacement sensor disposed within the housing.

9. A gas flow assembly, It is a valve, A housing configured to accept the flow of gas, A plunger configured to move between a closed position and one or more open positions within the housing, A position sensor configured to measure a distance related to the difference in the position of the plunger between the closed position and the one or more open positions, and A force sensor coupled to the plunger and configured to measure the force exerted on the sealing surface by the plunger in the closed position. A valve equipped with, A particle trap forming a chamber configured to separate particles from the gas flow, A processing device configured to drive the valve and control the gas flow based on sensor data from one or more of the position sensors or force sensors, A gas flow assembly equipped with a gas flow assembly.

10. The gas flow assembly according to claim 9, wherein the particle trap is configured to guide a cyclone into the gas flow within the chamber in order to separate the particles from the gas flow by centrifugal force.

11. The gas flow assembly according to claim 9, wherein the force sensor is coupled to a first end of the plunger and is configured to contact an elastomer seal on the sealing surface when the plunger is in the closed position, and the distance includes the distance between the position sensor and a second end of the plunger opposite to the first end.

12. The aforementioned valve, One or more metal bellows or metal diaphragms configured to separate a first portion of the housing from a second portion of the housing, wherein the plunger is positioned within the first portion of the housing and gas flows through the second portion of the housing. The gas flow assembly according to claim 9, further comprising:

13. The force sensor, When the plunger is in the closed position, it contacts the sealing surface and measures the force exerted on the sealing surface by the plunger, The piezoelectric module is excited to generate vibrations on the sealing surface in response to a command from the processing device to shake off particles from the sealing surface. The gas flow assembly according to claim 9, which is a piezoelectric module configured to perform the following:

14. The gas flow assembly according to claim 9, wherein the position sensor is a static capacitive displacement sensor disposed within the housing.

15. The gas flow assembly according to claim 9, wherein the processing device is further configured to drive the plunger substantially to a target position in response to receiving position data from the position sensor indicating that the plunger is located at a non-target position.

16. The gas flow assembly according to claim 9, wherein the processing device is further configured to drive the plunger in response to receiving force data from the force sensor indicating a gas leak, thereby increasing the force exerted on the sealing surface.

17. The gas flow assembly according to claim 9, wherein the processing device is further configured to determine the state of the elastomer seal on the sealing surface based on a stress-strain curve calculated using sensor data received from the position sensor and the force sensor.

18. The gas flow assembly according to claim 9, further configured to prepare one or more notifications of a gas leak or deterioration of the condition of the elastomer seal on the sealing surface beyond a threshold condition, based on sensor data received from one or more of the position sensors or force sensors.

19. It is a method, Receiving position data from a position sensor configured to measure the distance related to the difference in position of a plunger of a gas valve configured to move between a closed position and one or more open positions, The system receives force data from a force sensor that is coupled to the plunger and configured to measure the force exerted on the sealing surface by the plunger in the closed position. The plunger is driven between the closed position and one or more open positions based on one or more of the position data or the force data. Methods that include...

20. In response to receiving position data indicating that the plunger is located at a non-target position, the plunger is driven substantially to the target position. In response to receiving force data indicating a gas leak, the plunger is driven to increase the force applied to the sealing surface, The state of the elastomer seal on the sealing surface is determined based on the stress-strain curve calculated using the position data and force data. To shake off particles from the sealing surface, the piezoelectric module including the force sensor is vibrated. The method according to claim 19, further comprising:

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